Capacitive sensor

Abstract

A capacitive sensor according to one aspect of the present invention comprises: a detection area in which a drive electrode and a detection electrode are formed on a substrate; and a non-detection area which is positioned outside the detection area as viewed from the normal direction of the substrate and in which a drive wire connected to the drive electrode and a detection wire connected to the detection electrode are formed. The non-detection area comprises: the drive wire; a dummy lead wire disposed apart from the detection wire; and a corrosion resistant portion which is disposed between at least one of the drive wire or the detection wire and the dummy lead wire and which is in contact with none of the drive wire, the detection wire, and the dummy lead wire. This arrangement can enhance the resistance against the corrosion of the wires.

Description

Capacitive Sensor

[0001] The present invention relates to a capacitance type sensor, and more particularly to a capacitance type sensor used in a touch panel.

[0002] Patent Document 1 discloses a touch panel in which the inter-wiring capacitance between row-directional wiring and column-directional wiring is reduced by providing floating wiring in a wiring pattern provided within a detectable area. In this touch panel, as shown in FIG. 2 of Patent Document 1, dummy lead-out wirings to which a reference potential such as ground is applied are provided between the lead-out wirings of the column-directional wiring arranged outside the detectable area and the lead-out wirings of the row-directional wiring in a portion where the lead-out wirings run parallel to each other. By providing the dummy lead-out wirings in this manner, it is possible to reduce the inter-wiring capacitance (crosstalk capacitance) between the lead-out wirings located on both sides of the dummy lead-out wiring. Crosstalk capacitance acts as a noise source and reduces the detection accuracy of the touch panel, so it is preferable to avoid it as much as possible.

[0003] International Publication No. 2014 / 050306

[0004] When a dummy lead wire is provided as described above, the IC may control the potential applied to the dummy lead wire, thereby particularly reducing crosstalk capacitance. When the IC controls the potential applied to the dummy lead wire, particularly when the potential is controlled dynamically, the potential is set based on the dielectric constant of the insulator located between the lead wire and the dummy lead wire. From the perspective of increasing the versatility of the IC (ensuring a wide operating range), the distance between the dummy lead wire and an adjacent wire may be set to be wider than the distance between two other adjacent wires, in which case the dummy lead wire and the adjacent wire become isolated.

[0005] In capacitance sensors, the lead wiring is located in a non-detection area, and therefore wiring containing highly conductive metal materials is generally used. To prevent corrosion of such wiring containing metal materials, an insulating layer or a protective layer is provided around the wiring. However, applications requiring high reliability, such as industrial machinery and automotive applications, require more severe environmental testing conditions than other applications (e.g., 85°C temperature, 85% humidity, and exposure for 300 to 1000 hours), and conventional wiring corrosion prevention methods may not be sufficient. Specifically, isolated locations of wiring containing metal materials, such as those described above, that are separated from adjacent patterns in the insulating or protective layers, are more susceptible to corrosion concentration due to attack by moisture from the insulating or protective layers and components eluted from the components (e.g., iodine, acrylic acid, etc.) than non-isolated locations, requiring individual countermeasures.

[0006] An object of the present invention is to provide a capacitance type sensor that can improve corrosion resistance of wiring that is in an isolated location.

[0007] A capacitance-type sensor according to one embodiment of the present invention is a capacitance-type sensor comprising: a detection region in which a driving electrode and a detection electrode are formed on a substrate; and a non-detection region located outside the detection region when viewed from the normal direction of the substrate, in which a driving wiring connected to the driving electrode and a detection wiring connected to the detection electrode are formed. The non-detection region comprises a dummy lead-out wiring arranged at a distance from the driving wiring and the detection wiring, and a corrosion prevention section arranged between at least one of the driving wiring and the detection wiring and the dummy lead-out wiring, and not in contact with any of the driving wiring, the detection wiring, and the dummy lead-out wiring.

[0008] With this configuration, the corrosion prevention sections are positioned on both sides of the dummy lead wiring that is given a ground reference potential and has a shielding function, and are arranged alongside the drive wiring and detection wiring that are isolated locations, thereby preventing substances that cause corrosion (corrosion-causing substances) from approaching the wiring from around the isolated wiring.

[0009] In the capacitance-type sensor, the anticorrosion portion may have a portion that is juxtaposed to the drive wiring or the detection wiring along the in-plane direction of the surface of the substrate, thereby providing protection by the anticorrosion portion over a wide range in the direction in which the drive wiring or the detection wiring extends.

[0010] In the capacitance-type sensor, the anticorrosion portion may have a portion that overlaps with the drive wiring or the detection wiring when viewed from the normal direction of the base material, thereby enhancing the corrosion prevention effect on the drive wiring or the detection wiring in the first direction.

[0011] In the capacitance-type sensor, the corrosion protection part may include a part that is made of the same material as the driving electrode or the detecting electrode, whereby the corrosion protection part is formed in the same process as the process of forming the driving electrode or the detecting electrode.

[0012] In the capacitance sensor, the anti-corrosion portion is preferably made of a conductive material and has a floating potential. This prevents the dielectric constant of the region between the drive wiring or detection wiring and the dummy lead wiring from changing even if the anti-corrosion portion is present. Therefore, an IC that controls the potential of the dummy lead wiring to the ground reference potential can function properly even in the presence of the anti-corrosion portion, thereby effectively suppressing crosstalk capacitance between the drive wiring and the detection wiring.

[0013] In the capacitance-type sensor described above, the corrosion protection part may be made of a conductive material, and the corrosion protection part may have an extension part that extends along the extension direction of the drive wiring or the detection wiring, thereby providing a corrosion prevention effect by the corrosion protection part over a wide range in the extension direction of the detection wiring.

[0014] Furthermore, the extension portion may extend discontinuously in the direction of extension of the drive wiring or the detection wiring, thereby reducing the parasitic capacitance generated in the anti-corrosion portion and more stably suppressing crosstalk capacitance between the drive wiring and the detection wiring using dummy lead wiring to which the ground reference potential is applied.

[0015] According to the present invention, it is possible to provide a capacitance type sensor that can improve the corrosion resistance of wiring that is in an isolated location.

[0016] FIG. 1 is a schematic plan view illustrating the capacitance-type sensor according to the first embodiment; FIG. 2 is a schematic cross-sectional view illustrating the capacitance-type sensor according to the first embodiment; FIG. 3 is an enlarged plan view of part A shown in FIG. 1; FIG. 4 is an enlarged plan view showing another example (part 1) of the corrosion protection section; FIG. 5 is an enlarged plan view showing another example (part 2) of the corrosion protection section; FIG. 6 is a schematic plan view illustrating the capacitance-type sensor according to the second embodiment; FIG. 7 is a schematic cross-sectional view illustrating the capacitance-type sensor according to the second embodiment;

[0017] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same components will be designated by the same reference numerals, and the description of components that have already been described will be omitted as appropriate.

[0018] First Embodiment FIG. 1 is a schematic plan view illustrating a capacitance-type sensor according to a first embodiment. FIG. 2 is a schematic cross-sectional view illustrating the capacitance-type sensor according to the first embodiment, showing a cross-sectional view taken along line A1-A1' in FIG. 1. FIG. 3 is an enlarged plan view of portion A shown in FIG. 1. In this specification, the terms "transparent" and "translucent" refer to a state in which the visible light transmittance is 50% or more (preferably 80% or more). Furthermore, it is preferable that the haze value is 6% or less.

[0019] The capacitance-type sensor 1A according to this embodiment is an input device used in, for example, a touch panel. The capacitance-type sensor 1A includes a detection area S1 in which a driving electrode 11 and a detection electrode 12 are formed on a substrate 10, and a non-detection area S2 located outside the detection area S1 when viewed from a first direction (Z1-Z2 direction) that is the normal direction of the substrate 10, and in which a driving wiring 110 connected to the driving electrode 11 and a detection wiring 120 connected to the detection electrode 12 are formed.

[0020] The substrate 10 is translucent and is made of a film-like material such as polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin polymer (COP), polymethyl methacrylate (PMMA), or polyimide (PI).

[0021] The driving electrodes 11 are arranged in a direction (Y1-Y2 direction) along the main surface 10a of the substrate 10. The detecting electrodes 12 are arranged in an X1-X2 direction perpendicular to the Y1-Y2 direction along the main surface 10a of the substrate 10. The driving electrodes 11 and the detecting electrodes 12 are insulated from each other. In this embodiment, a plurality of driving electrodes 11 are arranged at a predetermined pitch in the X1-X2 direction, and a plurality of detecting electrodes 12 are arranged at a predetermined pitch in the Y1-Y2 direction.

[0022] The drive electrode 11 has a plurality of first transparent electrodes 111. In this embodiment, the plurality of first transparent electrodes 111 have a shape close to a rhombus and are arranged side by side in the Y1-Y2 direction. In other words, the plurality of first transparent electrodes 111 are arranged parallel to the Y1-Y2 direction. Two adjacent first transparent electrodes 111, 111 are electrically connected by a connecting portion 112.

[0023] The detection electrode 12 has a plurality of second transparent electrodes 121. The plurality of second transparent electrodes 121 have a shape close to a rhombus and are arranged side by side in the X1-X2 direction. In other words, the plurality of second transparent electrodes 121 are arranged parallel to the X1-X2 direction.

[0024] Each of the first transparent electrode 111 and the second transparent electrode 121 is made of a transparent conductive material having light transmission properties, such as oxide materials such as SnO, ZnO, ITO (indium tin oxide), IZO (indium zinc oxide), GZO (gallium-doped zinc oxide), AZO (aluminum-doped zinc oxide), and FTO (fluorine-doped tin oxide), metal nanowires such as silver nanowires, gold nanowires, and copper nanowires, thin metals formed in a mesh shape, and conductive polymers such as PEDOT / PSS.

[0025] The connecting portion 112 electrically connecting two adjacent first transparent electrodes 111, 111 also has, for example, the above-mentioned transparent conductive material. In this case, the connecting portion 112 may be formed integrally with the two first transparent electrodes 111, 111 electrically connected to the connecting portion 112. When viewed in the normal direction to the main surface 10a, the insulating portion 14 is located between the first transparent electrode 111 and the second transparent electrode 121 and between the connecting portion 112 and the connecting portion 112.

[0026] Two adjacent second transparent electrodes 121, 121 are electrically connected by a bridge wiring portion 31 of the bridge portion 30. The bridge portion 30 has, from the upper layer side, a bridge wiring portion 31 and an insulating layer 32. The constituent material of the bridge wiring portion 31 may include a transparent conductive material, like the transparent electrodes, or may include a metal-based material. The constituent material of the insulating layer 32 is not limited as long as it has appropriate insulating properties. Specific examples of constituent materials of the insulating layer 32 include resin-based materials such as novolac resin and epoxy resin, and inorganic materials such as silicon oxide and alumina. A protective layer 20 (see FIG. 2 ) made of the same insulating material as the insulating layer 32 is provided on the bridge portion 30.

[0027] 1 , a drive wiring 110 extending to a non-detection region S2 outside the detection region S1 is connected to each of the plurality of drive electrodes 11. A detection wiring 120 extending to the non-detection region S2 outside the detection region S1 is connected to each of the plurality of detection electrodes 12. A drive voltage is applied to the drive electrode 11 via the drive wiring 110, and the detection electrode 12 transmits a detection current to an external circuit via the detection wiring 120.

[0028] Each of the drive wirings 110 is drawn from the end of each drive electrode 11 on the Y1 side in the Y1-Y2 direction to the non-detection region S2 and connected to one of the pad electrodes 15 provided at the end of the substrate 10. Each of the detection wirings 120 is drawn from the end of each detection electrode 12 in the X1-X2 direction (the end on the X1 side or the end on the X2 side) to the non-detection region S2 and connected to one of the pad electrodes 15 provided at the end of the substrate 10.

[0029] The constituent materials of the drive wiring 110 and the detection wiring 120 are not limited as long as they have appropriate conductivity. They may be made of the constituent materials of the transparent electrodes described above, or, since light transmission is not required, they may be made of a metallic material with high conductivity. Specific examples of metallic materials include copper, copper alloys, silver, silver alloys, aluminum, and aluminum alloys. By including a metallic material as a constituent material, high conductivity can be achieved even when the wiring width is narrow. When the drive wiring 110 or the detection wiring 120 includes a portion made of a metallic material, high conductivity can be achieved, but in harsh environments such as high-temperature and high-humidity environments, measures to suppress corrosion may be required. In this embodiment, an insulating layer 140 made of the constituent material of the insulating layer 32 used in the detection region S1 is provided as a protective layer for the wiring.

[0030] The drive wiring 110 and the detection wiring 120 may have a laminated structure. Specific examples of the laminated structure include a laminated structure made of a metal-based material such as Cu / Ni / Cu, and a laminated structure made of a metal-based material and a transparent conductive material such as Cu / ITO. In this embodiment, as shown in FIG. 2 , the drive wiring 110 and the detection wiring 120 both have a laminated structure made of a transparent conductive material, which is the material that forms the detection electrode 12, and a metal-based material.

[0031] The method for forming the drive wiring 110 and the detection wiring 120 is not limited, and examples include dry processes such as sputtering and vapor deposition, wet processes such as etching and plating, and printing processes such as screen printing. The first transparent electrode 111, the second transparent electrode 121, the drive wiring 110, and the detection wiring 120 may each be formed from a photosensitive conductive sheet (a sheet having a conductive layer on a so-called dry film resist). The line width of the drive wiring 110 and the detection wiring 120 is set appropriately depending on the material of the wiring, but is, for example, approximately 10 μm.

[0032] In the non-detection region S2, a dummy lead-out line 130 is provided, spaced apart from the drive line 110 and the detection line 120. The dummy lead-out line 130 is set to a lower potential than the drive line 110 and the detection line 120, and functions as a shield line 131 with a shielding function. To properly function as the shield line 131, a ground reference potential is applied to the dummy lead-out line 130. This reference potential may be controlled by an IC (not shown) via a pad electrode 15 connected to one end of the dummy lead-out line 130. The dummy lead-out line 130, with the pad electrode 15 provided at one end, is arranged at a predetermined position in the non-detection region S2 toward the other end. An example of the line width of the dummy lead-out line 130 is approximately five times (e.g., approximately 50 μm) the line width of the drive line 110 and the detection line 120.

[0033] The constituent material of the dummy lead wiring 130 is not limited as long as it has appropriate conductivity. If the dummy lead wiring 130 contains the same material as the drive wiring 110 and the detection wiring 120, the dummy lead wiring 130 can be formed simultaneously in the process of forming these wirings, which is preferable. In this embodiment, as shown in FIG. 2 , the dummy lead wiring 130, like the drive wiring 110 and the detection wiring 120, has a layered structure of a transparent conductive material, which is the constituent material of the detection electrode 12, and a metal-based material.

[0034] When viewed from the Z1-Z2 direction, the dummy lead-out wiring 130 is located between the drive wiring 110 and the detection wiring 120. By providing the dummy lead-out wiring 130 between the drive wiring 110 and the detection wiring 120, the occurrence of crosstalk capacitance between the drive wiring 110 and the detection wiring 120 is suppressed.

[0035] As shown in FIG. 1 and FIG. 3, which is an enlarged plan view of part A thereof, the non-detection region S2 is provided with a corrosion protection section 150A that is disposed between at least one of the drive wiring 110 and the detection wiring 120 and the dummy lead wiring 130, and that is not in contact with any of the drive wiring 110, the detection wiring 120, and the dummy lead wiring 130. In the capacitance-type sensor 1A according to this embodiment, the corrosion protection section 150A has a portion that is juxtaposed to the drive wiring 110 or the detection wiring 120 along the in-plane direction (a direction including a component of the X1-X2 direction or the Y1-Y2 direction) of the main surface 10a of the substrate 10. That is, the corrosion protection section 150A has a portion that is provided parallel to the drive wiring 110 or the detection wiring 120 at a predetermined interval.

[0036] The corrosion prevention section 150A may be provided at a predetermined interval outside the outermost wiring in a group of multiple drive wirings 110 or detection wirings 120 provided in parallel, or may be provided at a predetermined interval adjacent to a drive wiring 110 or detection wiring 120 that is arranged singly (isolatedly). Furthermore, one or more corrosion prevention sections 150A may be arranged in an area adjacent to the drive wiring 110 or detection wiring 120.

[0037] As described above, there may be a non-wire-installed area of ​​about several tens of μm (for example, about 50 μm) between the drive wiring 110 and the dummy lead wiring 130, or between the detection wiring 120 and the dummy lead wiring 130, so that an IC that applies a potential to the dummy lead wiring 130 can be properly driven. In this case, if the corrosion prevention section 150A is not provided, the wiring (drive wiring 110, detection wiring 120) adjacent to this non-wire-installed area will be susceptible to corrosion because it is an isolated location.

[0038] Therefore, by providing the corrosion prevention section 150A in the wiring non-installation region, corrosion of the drive wiring 110 and the detection wiring 120, which are isolated locations, is suppressed. Specifically, the corrosion prevention section 150A, which serves as a sacrifice section, also receives attacks on the isolated locations by corrosion-causing substances consisting of moisture around the drive wiring 110 and the detection wiring 120 and eluted components from the components (such as iodine and acrylic acid), preventing corrosion concentration in the isolated locations of the drive wiring 110 and the detection wiring 120. In other words, the installation of the corrosion prevention section 150A distributes the corroded areas, thereby suppressing corrosion of the isolated locations of the drive wiring 110 and the detection wiring 120.

[0039] Furthermore, in the capacitance type sensor 1A, the corrosion prevention section 150A has a portion that is juxtaposed to the drive wiring 110 or the detection wiring 120, and has an extending portion 151 that extends along the extension direction of the drive wiring 110 or the detection wiring 120, so that protection by the corrosion prevention section 150A is provided over a wide range in the extension direction of the drive wiring 110 or the detection wiring 120.

[0040] As described above, the corrosion protection section 150A is disposed along the drive wiring 110 and the detection wiring 120 to prevent isolation of these wirings and prevent corrosion concentration. Therefore, the material of the corrosion protection section 150A is not limited and may be made of either a conductive or non-conductive material. From the viewpoint of ensuring proper functioning of the IC that applies a potential to the dummy lead wiring 130, it may be preferable for the corrosion protection section 150A to be made of a conductive material rather than a non-conductive material, i.e., a dielectric material. In this embodiment, the corrosion protection section 150A is made of a conductive material and, as described above, has a laminated structure of a transparent conductive material, which is the material of the detection electrode 12, and a metallic material, similar to the drive wiring 110 and the detection wiring 120.

[0041] When the corrosion protection section 150A is made of a conductive material as described above, it is preferable that the potential of the corrosion protection section 150A be floating, which can enhance the corrosion prevention effect of the drive wiring 110 and the detection wiring 120, which are isolated locations, and can more stably suppress the occurrence of crosstalk capacitance between the drive wiring 110 and the detection wiring 120.

[0042] The corrosion prevention portion 150A may be provided adjacent not only to the drive wiring 110 or the detection wiring 120 that is isolated due to being adjacent to the dummy lead wiring 130, but also to the drive wiring 110 or the detection wiring 120 that is isolated for other reasons. As shown in Fig. 1 , in this embodiment, the corrosion prevention portion 150A is provided also in a portion that is isolated because the wiring is not arranged in parallel, a portion that is isolated because it is the outermost wiring in a group of multiple drive wirings 110 or detection wirings 120 that are arranged in parallel, and a portion that is isolated because it is adjacent to the frame wiring 132 that is arranged to surround the detection region S1 and the non-detection region S2.

[0043] (Another example of the corrosion protection section) Fig. 4 is an enlarged plan view showing another example (part 1) of the corrosion protection section. Fig. 4 shows the configuration of the other example (part 1) of the corrosion protection section for the part corresponding to part A shown in Fig. 1.

[0044] The extending portion 151 of the corrosion protection portion 150A shown in FIG. 4 extends discontinuously in the extension direction of the drive wiring 110 or the detection wiring 120. That is, the extending portion 151 has discontinuous portions (gap portions D) provided at predetermined intervals along the extension direction. When the corrosion protection portion 150A is made of a conductive material and is floating, a parasitic capacitance occurs in the corrosion protection portion 150A, and this parasitic capacitance increases as the volume of the corrosion protection portion 150A increases. This parasitic capacitance may affect the capacitance of the wiring (drive wiring 110, detection wiring 120) arranged adjacent to the corrosion protection portion 150A. Therefore, as shown in Figure 4, by extending the corrosion protection section 150A discontinuously, the parasitic capacitance generated in each corrosion protection section 150A is reduced, and the wiring (drive wiring 110, detection wiring 120) that is located in an isolated area adjacent to the corrosion protection section 150A is less susceptible to the parasitic capacitance of the corrosion protection section 150A.

[0045] 5 is an enlarged plan view showing another example (part 2) of the corrosion protection part. In FIG. 5, the configuration of the other example (part 2) of the corrosion protection part is shown for the part corresponding to part A shown in FIG.

[0046] The anticorrosion section 150A shown in FIG. 5 has multiple (e.g., two) parallel extending portions 151-1 and 151-2. Each extending portion 151-1 and 151-2 extends discontinuously in the extension direction of the drive wiring 110 or the detection wiring 120, and the discontinuous portions (gap portions D) are arranged alternately. Specifically, the gap portions D are formed along the main surface 10a (see FIG. 1) between adjacent extending portions 151-1 and 151-1 formed along the main surface 10a, and between adjacent extending portions 151-2 and 151-2. The gap portions D of the extending portions 151-1 and the gap portions D of the extending portions 151-2 do not overlap in a direction (the Y1-Y2 direction in FIG. 5) perpendicular to the extension direction of the drive wiring 110 or the detection wiring 120 (the X1-X2 direction in FIG. 5). Therefore, the creeping distance of moisture and eluted components (iodine, acrylic acid, etc.) from the components that try to infiltrate in this direction (Y1-Y2 direction in Figure 5) toward the drive wiring 110 and the detection wiring 120 becomes longer.

[0047] Therefore, corrosion-causing substances are more reliably prevented from passing through the gaps (gap portions D) in the discontinuously extending corrosion protection portions 150A and approaching isolated wiring portions (drive wiring 110, detection wiring 120). In other words, the configuration shown in Fig. 11 can improve the corrosion resistance of the wiring by providing the corrosion protection portions 150A and prevent a decrease in the detection accuracy of the capacitance sensor due to the discontinuously extending corrosion protection portions 150A.

[0048] Second Embodiment Fig. 6 is a schematic plan view illustrating a capacitance-type sensor according to a second embodiment. Fig. 7 is a schematic cross-sectional view illustrating the capacitance-type sensor according to the second embodiment, taken along line A2-A2' in Fig. 6.

[0049] The capacitance-type sensor 1B of the second embodiment is similar to the capacitance-type sensor 1A in that it comprises a detection area S1 in which a driving electrode 11 and a detection electrode 12 are formed on a substrate 10, a non-detection area S2 located outside the detection area S1 in which a driving wiring 110 connected to the driving electrode 11 and a detection wiring 120 connected to the detection electrode 12 are formed, and a dummy lead wiring 130 provided in the non-detection area S2, but differs in that it comprises a corrosion-resistant part 150B instead of the corrosion-resistant part 150A.

[0050] The corrosion-resistant portion 150B of the capacitance-type sensor 1B is not in contact with any of the drive wiring 110, the detection wiring 120, and the dummy lead wiring 130, and is similar in basic configuration to the corrosion-resistant portion 150A of the capacitance-type sensor 1A. However, the corrosion-resistant portion 150B differs from the corrosion-resistant portion 150A in that the corrosion-resistant portion 150B is made of the same material and has the same structure as the first transparent electrode 111 or the second transparent electrode 121 that constitutes the drive electrode 11 or the detection electrode 12. Because the corrosion-resistant portion 150B has such a structure, the corrosion-resistant portion 150B can be formed in the same process as the drive electrode 11 or the detection electrode 12.

[0051] By arranging such a corrosion-resistant portion 150B, the drive wiring 110 and the detection wiring 120 are prevented from being isolated, and the corrosion-resistant portion 150B functions as a sacrificial portion when a substance that causes corrosion attempts to infiltrate from around the wiring.

[0052] Since the corrosion protection section 150B is made of a conductive material like the corrosion protection section 150A, it is preferable that the potential of the corrosion protection section 150B be floating. This can prevent the drive wiring 110 and the detection wiring 120 from becoming isolated, thereby improving the corrosion prevention effect of the drive wiring 110 and the detection wiring 120, and can more stably prevent the occurrence of crosstalk capacitance between the drive wiring 110 and the detection wiring 120. Note that in the capacitance-type sensor 1B according to this embodiment, as in the capacitance-type sensor 1A according to the first embodiment, the corrosion protection section 150B is also provided in the drive wiring 110 and the detection wiring 120 that are isolated for reasons other than being adjacent to the dummy lead wiring 130.

[0053] Although the present embodiment has been described above, the present invention is not limited to these examples. For example, materials other than those described above for each component can be used as long as they provide the same effects as those of the present invention. Furthermore, those in which a person skilled in the art appropriately adds, deletes, or modifies components of the above-described embodiments, or appropriately combines features of the configuration examples of the embodiments, are also included within the scope of the present invention as long as they include the gist of the present invention.

[0054] For example, because corrosion-causing substances often approach the wiring (drive wiring 110, detection wiring 120) from the operation surface side (Z2 side in the Z1-Z2 direction), the corrosion protection units 150A, 150B may be provided at a distance from the substrate 10, i.e., at a distance closer to the Z2 side in the Z1-Z2 direction than the substrate. Alternatively, a member having corrosion protection function may be provided on the insulating layer 140 provided to cover the wiring (drive wiring 110, detection wiring 120) so as to have an overlapping portion when viewed from the first direction (Z1-Z2 direction). The member may be continuous with the corrosion protection units (corrosion protection units 150A, corrosion protection units 150B). In this case, the corrosion protection units (corrosion protection units 150A, corrosion protection units 150B) will have an overlapping portion with the wiring (drive wiring 110, detection wiring 120) when viewed from the first direction (Z1-Z2 direction).

[0055] DESCRIPTION OF THE SYMBOLS 1A, 1B... Capacitive sensor 10... Substrate 10a... Main surface 11... Drive electrode 12... Detection electrode 14... Insulating portion 15... Pad electrode 20... Protective layer 30... Bridge portion 31... Bridge wiring portion 32... Insulating layer 110... Drive wiring 111... First transparent electrode 112... Connection portion 120... Detection wiring 121... Second transparent electrode 130... Dummy lead wiring 131... Shield wiring 132... Frame wiring 140... Insulating layer 150A, 150B... Corrosion prevention portion 151, 151-1, 151-2... Extension portion D... Gap portion S1... Detection area S2... Non-detection area

Claims

1. A capacitance-type sensor comprising: a detection area in which a driving electrode and a detection electrode are formed on a substrate; and a non-detection area located outside the detection area when viewed from the normal direction of the substrate, in which a driving wiring connected to the driving electrode and a detection wiring connected to the detection electrode are formed, wherein the non-detection area comprises: a dummy lead-out wiring arranged at a distance from the driving wiring and the detection wiring; and a corrosion-resistant portion arranged between the dummy lead-out wiring and at least one of the driving wiring and the detection wiring, and not in contact with any of the driving wiring, the detection wiring, or the dummy lead-out wiring.

2. The capacitance-type sensor according to claim 1, wherein the corrosion prevention portion has a portion that is juxtaposed to the drive wiring or the detection wiring along the in-plane direction of the surface of the base material.

3. The capacitance-type sensor according to claim 1, wherein the corrosion-resistant portion has a portion that overlaps with the drive wiring or the detection wiring when viewed from the normal direction of the base material.

4. The capacitance type sensor according to claim 1, wherein the corrosion-resistant portion includes a portion that is common to the material constituting the driving electrode or the detection electrode.

5. The capacitance type sensor according to claim 1, wherein the corrosion protection section is made of a conductive material and has a floating potential.

6. The capacitance type sensor according to claim 5, wherein the corrosion prevention portion has an extension portion that extends along the extension direction of the drive wiring or the detection wiring.

7. The capacitance type sensor according to claim 6, wherein the extending portion extends discontinuously in the extending direction of the drive wiring or the detection wiring.

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