Molding die, resin molding device, and method for producing resin molded article

Abstract

To obtain a molding die that allows a positioning pin to be attached to and detached from the main body of the molding die by a simple method.　The molding die includes a first die (10) and a second die disposed facing the first die (10). The first die (10) has a main body (11) provided with an opposing surface (11S) and has a positioning pin (12) that positions an object to be molded (40) held by the first die (10). The positioning pin (12) is provided with a pedestal (13) disposed on the inside of the main body (11) and a tip (14) that can be attached to and detached from the pedestal (13) from the opposing surface (11S) side of the main body (11). The tip (14) has a small-diameter part (14A) that positions the object to be molded (40) by contacting the object to be molded (40). The small-diameter part (14A) has a diameter (D1) smaller than the diameter (D2) of the pedestal (13).

Description

Mold, resin molding device, and method for manufacturing resin molded product

[0001] The present specification relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product.

[0002] In a resin molding apparatus, an object to be molded held in a mold is aligned before the object is resin-molded using the mold. In the apparatus disclosed in Japanese Patent Laid-Open No. 2002-076442 (Patent Document 1), alignment pins (referred to as "substrate pilot pins" in Patent Document 1) are provided on an upper mold, and the alignment pins are used to align the substrate.

[0003] Japanese Patent Application Laid-Open No. 2002-076442

[0004] The alignment pins for aligning the object to be molded are incorporated into the main body of the mold. If the alignment pins are incorporated into the main body of the mold, when replacement is required, the mold must be removed from the resin molding device or disassembled, which takes time and effort to replace the alignment pins.

[0005] The present specification aims to disclose a molding die in which alignment pins can be attached and detached to the main body of the molding die using a simple method, a resin molding device equipped with such a molding die, and a method for manufacturing a resin molded product in which an object to be molded is resin-molded using such a molding die.

[0006] In a first aspect of the present disclosure, a molding die includes a first die and a second die that is arranged opposite the first die and that performs resin molding on an object to be molded while being clamped to the first die, the first die having a main body portion with an opposing surface that faces the second die, and an alignment pin that aligns the object to be molded held in the first die, the alignment pin having a base portion arranged inside the main body portion and a tip portion that is attachable to and detachable from the base portion from the side of the opposing surface of the main body portion, the tip portion having a small diameter portion that aligns the object to be molded by contacting the object to be molded, and the small diameter portion having a diameter smaller than the diameter of the base portion.

[0007] In a second aspect of the present disclosure, a resin molding apparatus includes the molding die according to the first aspect of the present disclosure and a mold clamping mechanism that clamps the molding die.

[0008] In a third aspect of the present disclosure, a method for manufacturing a resin molding device includes a step of resin molding an object to be molded using the molding die according to the first aspect of the present disclosure.

[0009] According to the disclosure of this specification, it is possible to obtain a molding die in which alignment pins can be attached and detached to the main body of the molding die using a simple method, a resin molding device equipped with such a molding die, and a method for manufacturing a resin molded product in which an object to be molded is resin molded using such a molding die.

[0010] 4 is a plan view showing a resin molding apparatus 50; FIG. 5 is a front view showing a molding section 51 provided in the resin molding apparatus 50; FIG. 6 is a cross-sectional view showing a molding die 30 in the molding section 51; FIG. 7 is a view showing an upper die 10 as seen from the direction of arrow IV in FIG. 3; FIG. 8 is a cross-sectional view showing an enlarged view of an alignment pin 12 and its peripheral configuration shown in FIG. 3; FIG. 9 is a perspective view showing an alignment pin 12; FIG. 10 is a cross-sectional view showing a state in which molding dies 30 (upper die 10 and lower die 20) are clamped; FIG. 11 is a perspective view showing a state in which resin 60 adheres to the periphery of a tip portion 14 of the alignment pin 12; FIG. 11 is a cross-sectional view showing a configuration of a modified example 1 that can be employed in a resin molding apparatus; FIG. 12 is a view showing a configuration of a modified example 2 that can be employed in a resin molding apparatus, and corresponds to the view showing an enlarged portion of FIG. 4; FIG. 13 is a view showing another configuration of modified example 2 that can be employed in a resin molding apparatus, and corresponds to the view showing an enlarged portion of FIG. 4; 1 is a perspective view showing an exploded state of an alignment pin (base portion 13) based on a modified example 3 that can be employed in a resin molding apparatus. FIG. 2 is a diagram showing the configuration of a modified example 4 that can be employed in a resin molding apparatus, and corresponds to a diagram showing an enlarged portion of FIG.

[0011] The following describes embodiments. In the embodiments described below, when numbers, quantities, etc. are mentioned, the scope of the present disclosure is not necessarily limited to those numbers, quantities, etc., unless otherwise specified. Each component is not necessarily essential to the present disclosure, unless otherwise specified. The same reference numerals are used for the same and corresponding components, and redundant descriptions may not be repeated.

[0012] 1 is a plan view showing a resin molding apparatus 50. The resin molding apparatus 50 molds a resin into a molding object. The resin molding apparatus 50 includes a supply and storage module 63, a molding module 64, and a material supply module 65 as components.

[0013] (Supply and Storage Module 63) The supply and storage module 63 is provided with a supply section 67 that supplies pre-sealing substrates 66 (molding objects), a storage section 69 that stores sealed substrates 68 (resin molded products), a placement section 70 that transfers the pre-sealing substrates 66 and the sealed substrates 68, and a transport mechanism 71 that transports the pre-sealing substrates 66 and the sealed substrates 68. In Fig. 1, the transport mechanism 71 is disposed at a standby position S1.

[0014] (Molding module 64 and molding section 51) Fig. 2 is a front view showing the molding section 51 provided in the resin molding device 50. Fig. 3 is a cross-sectional view showing the molding die 30 in the molding section 51. The molding module 64 (Fig. 1) is provided with the molding section 51. The molding section 51 (see Fig. 2) has the molding die 30, an upper base 52, a lower base 53, tie bars 54, a lifting platen 55, and a mold clamping mechanism 57.

[0015] The molding die 30 includes an upper die 10 (first die) and a lower die 20 (second die) disposed opposite the upper die 10. The upper die 10 is fixed to an upper base 52, and the lower die 20 is disposed below the upper die 10. The lower die 20 (see FIGS. 2 and 3) includes a peripheral member 22, a bottom member 23, an elastic body 24, and a base member 25, and the base member 25 is fixed to a lifting platen 55. The peripheral member 22 and the bottom member 23 constitute a main body 21 of the lower die 20. The peripheral member 22 and the bottom member 23 are driven up and down together by a mold clamping mechanism 57 (lifting platen 55).

[0016] A cavity 21C is provided in the lower mold 20, and a release film 37 (FIG. 1) and a resin material (not shown) are supplied into the cavity 21C. In this embodiment, the cavity is formed by the peripheral surface member 22 and the bottom surface member 23, but the cavity 21C may be formed integrally. A mold clamping mechanism 57 clamps and opens the upper mold 10 and the lower mold 20, and in the clamped state, the upper mold 10 and the lower mold 20 perform resin molding on the molding object.

[0017] (Material Supply Module 65) The material supply module 65 is provided with a table 72, a supply mechanism 73 that supplies the release film 37 to the table 72, a storage mechanism 74 that stores the resin material, a feeding mechanism 75 that feeds the resin material into the storage mechanism 74, a transport mechanism 76 that transports the release film 37 and the storage mechanism 74, and a cleaning mechanism 77 that cleans the storage mechanism 74. In Fig. 1 , the transport mechanism 76 is disposed at a standby position M1 (a position where the transport mechanism 76 is on standby when not operating).

[0018] (Method of Manufacturing Resin Molded Product) The method of manufacturing a resin molded product performed by the resin molding apparatus 50 is as follows. In the supply and storage module 63 (FIG. 1), the pre-sealing substrate 66 is sent from the supply section 67 to the placement section 70, and the transport mechanism 71 receives the pre-sealing substrate 66 from the placement section 70. The transport mechanism 71 moves to position the pre-sealing substrate 66 at position C1 on the lower mold 20 of the molding module 64. The transport mechanism 71 moves up to set the pre-sealing substrate 66 on the upper mold 10. At this time, alignment pins 12 (FIG. 3) are used. Details of the alignment pins 12 will be described later with reference to FIGS. 3 to 8.

[0019] In the material supply module 65, the release film 37 is placed on the table 72 from the supply mechanism 73. A storage mechanism 74 cleaned by the cleaning mechanism 77 is placed on the release film 37. After the release film 37 and storage mechanism 74 are integrated, the table 72 moves above the resin inlet of the supply mechanism 75, and the resin material is supplied from the supply mechanism 75 to the storage mechanism 74 on the table 72. The transport mechanism 76 then receives the integrated release film 37 and storage mechanism 74 from the table 72. The transport mechanism 76 moves to position C1 above the lower mold 20 via position P1 in the molding module 64, where the release film 37 and the resin material supplied thereon are supplied to the cavity 21C of the lower mold 20. The storage mechanism 74 is transported to the material supply module 65 by the transport mechanism 76.

[0020] In the molding section 51, the clamping mechanism 57 raises the lower mold 20, clamping the upper mold 10 and the lower mold 20 together. With the upper mold 10 and the lower mold 20 clamped together, resin molding is performed on the pre-sealed substrate 66 (molding object). After a predetermined time has passed, the upper mold 10 and the lower mold 20 are opened. The transport mechanism 71 receives the sealed substrate 68 and transfers it to the placement section 70. The sealed substrate 68 is stored from the placement section 70 in the storage section 69. The method for manufacturing a resin molded product performed by the resin molding device 50 is as described above.

[0021] (Main body 11 and alignment pin 12) Figure 4 is a diagram showing the upper mold 10 as viewed from the direction of arrow IV in Figure 3. Figure 5 is a cross-sectional view showing an enlarged view of the alignment pin 12 and its surrounding structure shown in Figure 3. As shown in Figures 3 to 5, the upper mold 10 of the resin molding device 50 has a main body 11 and an alignment pin 12.

[0022] The main body 11 includes plate-shaped portions 11A, 11B, and 11C. The plate-shaped portions 11A, 11B, and 11C are stacked in this order from the side closest to the lower mold 20 to the side furthest from the lower mold 20. The plate-shaped portion 11A has an opposing surface 11S (parting surface) that faces the upper surface 21S of the lower mold 20. As shown in FIG. 5 , a through hole 11M is formed in the plate-shaped portion 11A, and a through hole 11N is formed in the plate-shaped portion 11B. The through holes 11M and 11N extend in a direction parallel to the mold clamping direction (or mold opening direction) and are arranged so that their central axes coincide.

[0023] 6 is a perspective view showing the alignment pin 12. The alignment pin 12 aligns the molding object 40 (corresponding to the pre-sealing substrate 66 in FIG. 1) held by the upper mold 10. The alignment pin 12 is formed in a generally rod-like shape. The alignment pin 12 includes a base portion 13 and a tip portion 14, and is disposed inside the through-holes 11M, 11N ( FIG. 5 ). The base portion 13 is disposed inside the main body portion 11, and the tip portion 14 is detachable from the base portion 13 from the opposing surface 11S side of the main body portion 11 (arrow AR in FIG. 5 ).

[0024] Tip portion 14 is attached to base portion 13 by, for example, screwing (fitting a screw). Tip portion 14 may have a tool hole 14H in its top surface 14T for fitting a tool (such as a hexagonal wrench). The means for attaching tip portion 14 to base portion 13 is not limited to screwing, and tip portion 14 may be attached to base portion 13 by other detachable means such as press-fitting or engagement.

[0025] The tip 14 of the alignment pin 12 has a small diameter portion 14A, a base portion 14B, and a threaded portion 14C. The small diameter portion 14A aligns the object 40 by contacting the object 40 (see FIG. 3). When the upper mold 10 and the lower mold 20 are open, the small diameter portion 14A preferably protrudes from the opposing surface 11S.

[0026] The small diameter portion 14A aligns the object 40 by contacting the outer peripheral surface of the small diameter portion 14A with the side surface 41 of the object 40. The alignment pin 12 functions as a so-called guide pin. If the object 40 has a through-hole, the object 40 may be aligned by inserting the small diameter portion 14A into the through-hole. In this case, the alignment pin 12 functions as a so-called pilot pin.

[0027] The base portion 14B ( FIG. 5 ) is provided between the small diameter portion 14A and the threaded portion 14C. The base portion 14B is attached to the base portion 13 via the threaded portion 14C. When the tip portion 14 is attached to the base portion 13, the base portion 14B of the tip portion 14 is located between the small diameter portion 14A and the base portion 13 (top surface 13T). In FIG. 5 , the tip portion 14 removed from the base portion 13 is illustrated using a dashed line. The small diameter portion 14A has a diameter D1, and the base portion 14B has a diameter D2, with the diameter D1 being smaller than the diameter D2. The diameter D1 of the small diameter portion 14A is set according to the size of the object 40. If the object 40 has a diameter of 300 mm and an outline tolerance of, for example, ±0.5 mm, the diameter D1 is, for example, 2.0 mm to 2.5 mm.

[0028] Base 13 has a shaft portion 13A and a flange portion 13B. Shaft portion 13A has a diameter D3, and diameter D1 of small diameter portion 14A is smaller than diameter D3 of shaft portion 13A. A hole 13H that screws into threaded portion 14C of tip end 14 is provided in top surface 13T of shaft portion 13A of base 13.

[0029] Here, the upper mold 10 further includes an elastic member 15. The elastic member 15 is provided on the side of the base 13 opposite to the side where the tip 14 is attached or detached (i.e., on the flange 13B side). The elastic member 15 applies the force of the lower mold 20 to the base 13. A step 11J is provided on the plate-like portion 11B, and contact between the flange 13B and the step 11J restricts the base 13 from moving further toward the lower mold 20 from the state shown in FIG.

[0030] 7 is a cross-sectional view showing the mold 30 (upper mold 10 and lower mold 20) in a clamped state. When the mold 30 is clamped, a portion of the object 40 to be resin molded (not shown, for example, a semiconductor chip) is housed inside the cavity 21C of the lower mold 20, to which a release film (not shown) and a resin material (not shown) have been supplied. The upper surface 21S of the lower mold 20 (main body 21) moves the alignment pin 12 into the through holes 11M, 11N. Resin molding is performed in this state.

[0031] (Functions and Effects) In a resin molding device, when resin molding is performed on a molding object, the molding object must be aligned with the molding die with high precision. When resin molding is performed on molding objects of different sizes and shapes, or when the alignment pins have deteriorated, the alignment pins are replaced.

[0032] In the resin molding device 50, the alignment pin 12 is composed of two members: a base portion 13 and a tip portion 14. The base portion 13 and the tip portion 14 are separable from each other. For example, several types of tip portions 14 with different diameters D1 of the small diameter portion 14A are prepared, and the tip portion 14 that is adequately suited to the size and shape of the object to be molded is selected and used. The base portion 13 can be used in common regardless of the size and shape of the object to be molded 40.

[0033] In the resin molding apparatus 50, the base portion 13 of the alignment pin 12 is disposed inside the main body portion 11, and the tip portion 14 is attachable to and detachable from the base portion 13 from the opposing surface 11S side of the main body portion 11 (arrow AR in FIG. 5 ). That is, the alignment pin 12 can be attached to and detachable from the main body portion 11 of the upper mold 10 using a simple method. When attaching and detaching the alignment pin 12 to and from the main body portion 11 of the molding die 30 (upper mold 10), there is no particular need to perform tasks such as waiting for the temperature of the molding die 30 to drop low enough to allow attachment and detachment of the molding die 30, removing the molding die 30 from the resin molding apparatus 50, or disassembling the molding die 30. This reduces the time and effort required for attachment and detachment compared to when such tasks are required.

[0034] In particular, when molding object 40 is a large semiconductor wafer or the like, molding die 30 is large in size and weight, and therefore, the work of removing molding die 30 from resin molding apparatus 50 and disassembling molding die 30 involves a heavy load. In contrast, with resin molding apparatus 50, tip portion 14 can be easily attached to and detached from pedestal portion 13 simply by opening molding die 30 (arrow AR in FIG. 5 ) without incurring such a workload.

[0035] 8, after the resin molding is completed, resin 60 may be attached to the periphery of small diameter portion 14A of tip portion 14. Resin 60 can be easily removed by removing tip portion 14 from base portion 13.

[0036] (Variation 1) Figure 9 is a cross-sectional view showing the configuration of Variation 1 that can be employed in a resin molding apparatus. In Variation 1, the main body 11 of the upper mold 10 does not include the elastic member 15 (Figure 5). A fixing member 16 is disposed between the base portion 13 of the alignment pin 12 and the plate-like portion 11C. In Variation 1, the position of the alignment pin 12 does not change before and after mold clamping.

[0037] A recess 26 is formed in the main body 21 of the lower mold 20. The recess 26 is formed to correspond to the position and shape of the tip 14 (small diameter portion 14A) of the alignment pin 12, and the recess 26 accommodates the tip 14 (small diameter portion 14A) of the alignment pin 12 when the mold is closed, and functions as a so-called relief portion. Even with the alignment pin 12 configured in this manner, the tip 14 of the alignment pin 12 can be attached to and detached from the base portion 13 from the opposing surface 11S side of the main body 11 (see arrow AR in FIG. 5 ).

[0038] (Variation 2) Figure 10 is a diagram showing the configuration of Variation 2 that can be employed in a resin molding apparatus, and corresponds to a diagram showing an enlarged portion of Figure 4. In the alignment pin 12 of Variation 2, the small diameter portion 14A is formed in a cylindrical shape and has a central axis 14AX. The base portion 14B is also formed in a cylindrical shape and has a central axis 14BX. The central axes 14AX, 14BX extend in a direction parallel to the mold clamping direction (or mold opening direction).

[0039] On the other hand, the small diameter portion 14A is provided eccentrically with respect to the center of the base portion 14B in a direction perpendicular to the mold clamping direction (or mold opening direction). That is, the central axis 14AX is disposed at a position offset from the central axis 14BX in a direction perpendicular to the mold clamping direction (or mold opening direction).

[0040] When the alignment pin 12 having the above configuration is used, it becomes possible to align workpieces 40 having different sizes (external tolerances) by changing the rotation angle of the tip 14 inside the through hole 11M. For example, Fig. 10 shows the state in which an object 40 having a diameter DS1 is being aligned.

[0041] Fig. 11 shows the state in which the object 40 having a diameter DS2 is being aligned. Compared to the case in Fig. 10, in Fig. 11 the central axis 14AX is positioned closer to the side surface 41 of the object 40 relative to the central axis 14BX. The diameter DS2 of the object 40 is smaller than the diameter DS1 in the case in Fig. 10.

[0042] 12, when changing the rotation angle of tip portion 14 inside through-hole 11M, the following method can be used, for example: In tip portion 14 shown in Fig. 12, an embossed protrusion 14E is provided on end surface 14S of base portion 14B, and a recess 13E corresponding to the shape of protrusion 14E is provided on top surface 13T of shaft portion 13A.

[0043] By preparing multiple types of tip portions 14 with different positions of the protrusions 14E, it becomes possible to set the rotation angle of the tip portion 14 inside the through hole 11M to any value, and ultimately to align molding objects 40 of different sizes. In order to fix the rotation angle of the pedestal portion 13 inside the through hole 11N, a reference surface 13K may be provided on part of the outer periphery of the pedestal portion 13. Rotation of the pedestal portion 13 can be restricted by providing a member that presses the reference surface 13K, for example.

[0044] (Variation 3) As shown in Fig. 13, when changing the rotation angle of tip portion 14 inside through-hole 11M, for example, the following method can be adopted. Shank portion 13A shown in Fig. 13 has spacer portion 13A1 and base portion 13A2. An embossed protrusion 13P is provided on end surface 13X of spacer portion 13A1, and a recess 13Q corresponding to the shape of protrusion 13P is provided on top surface 13Y of base portion 13A2.

[0045] By preparing multiple types of spacer portions 13A1 with different positions of the protrusions 13P, it becomes possible to set the rotation angle of the spacer portion 13A1 inside the through hole 11M to any value, and thus it becomes possible to set the rotation angle of the tip portion 14 to any value, and thus it becomes possible to align molding objects 40 of different sizes.

[0046] (Variation 4) As shown in Fig. 14 , when changing the rotation angle of the tip portion 14 inside the through hole 11M, for example, the following method can be adopted. In the example shown in Fig. 14 , a fastening member 16A is arranged so as to penetrate a part of the upper mold 10 (main body portion 11), and the fastening member 16A is pressed against the outer peripheral surface of the base portion 14B by a fastener 16B. This makes it possible to set the rotation angle of the tip portion 14 inside the through hole 11M to any value, and ultimately makes it possible to align work-pieces 40 of different sizes.

[0047] (Other Modifications) In the resin molding apparatus 50, the upper mold 10 corresponds to the first mold, the lower mold 20 corresponds to the second mold, and the upper mold 10 is provided with the alignment pin 12. This is not a limitation, and the lower mold 20 may be provided with an alignment pin having a configuration similar to that of the alignment pin 12. In this case, the lower mold 20 corresponds to the first mold, and the upper mold 10 corresponds to the second mold.

[0048] In the resin molding apparatus 50, the molding object is, for example, a semiconductor wafer. The molding object may also be a printed circuit board, a ceramic substrate, a lead frame, or the like. The shape of the molding object (in plan view) may be rectangular or square, or may be circular like a semiconductor wafer. The resin molding apparatus 50 uses a compression molding method. The technical concept of the resin molding apparatus 50 disclosed above can also be applied to transfer molding and injection molding.

[0049] In the resin molding apparatus 50, the end side surfaces of the object 40 are not molded with resin, but the end side surfaces of the object may be molded with resin. Also, in the resin molding apparatus 50, a release film is not used on the molding die that holds the object 40, but a release film may be used on the molding die that holds the object. In this case, the alignment pins align the object via the release film.

[0050] Although the embodiments of the present disclosure have been described above, the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the scope of the claims, and it is intended to include all modifications within the meaning and scope of the claims.

[0051] 10 Upper mold, 11, 21 Main body portion, 11A, 11B, 11C Plate-shaped portion, 11J Step portion, 11M, 11N Through hole, 11S Opposing surface, 12 Alignment pin, 13 Pedestal portion, 13A Shaft portion, 13A1 Spacer portion, 13A2 Base portion, 13B Flange portion, 13E, 13Q Recess, 13H Hole, 13K Reference surface, 13P, 14E Protrusion, 13T, 13Y, 14T Top surface, 13X, 14S End surface, 14 Tip portion, 14A Small diameter portion, 14AX, 14BX Central axis, 14B Base portion, 14C Threaded portion, 14H Tool hole, 15 Elastic member, 16 Fixing member, 16A Fastening member, 16B Fastener, 20 Lower mold, 21C cavity, 21S upper surface, 22 peripheral surface member, 23 bottom surface member, 24 elastic body, 25 base member, 26 recess, 30 molding mold, 37 release film, 40 molding target object, 41 side surface, 50 resin molding device, 51 molding section, 52 upper base, 53 lower base, 54 tie bar, 55 lifting plate, 57 mold clamping mechanism, 60 resin, 63 supply storage module, 64 molding module, 65 material supply module, 66 pre-sealed substrate, 67 supply section, 68 sealed substrate, 69 storage section, 70 placement section, 71, 76 conveying mechanism, 72 table, 73 supply mechanism, 74 storage mechanism, 75 input mechanism, 77 cleaning mechanism, AR, IV arrows, C1, P1 Position, D1, D2, D3, DS1, DS2 Diameter, M1, S1 Standby position.

Claims

1. A molding die comprising: a first die; and a second die arranged opposite the first die and configured to perform resin molding on an object to be molded while being clamped to the first die, wherein the first die has: a main body portion with an opposing surface facing the second die; and an alignment pin for aligning the object to be molded held in the first die, wherein the alignment pin has: a base portion arranged inside the main body portion; and a tip portion which is attachable to and detachable from the base portion from the opposing surface side of the main body portion, wherein the tip portion has a small diameter portion which contacts the object to be molded to align the object to be molded, and the small diameter portion has a diameter smaller than the diameter of the base portion.

2. The mold according to claim 1, wherein said tip portion is attached to said base portion by a screw engagement.

3. The mold according to claim 1 or 2, wherein the small diameter portion protrudes from the opposing surface when the first mold and the second mold are in an open state.

4. The mold according to any one of claims 1 to 3, wherein the small diameter portion aligns the object by contacting a side surface of the object.

5. A molding die according to any one of claims 1 to 4, wherein the first die further has an elastic member on the side of the base portion opposite to the side where the tip portion is attached and detached, the elastic member applying a force in a direction that moves the base portion closer to the second die.

6. The mold according to any one of claims 1 to 5, wherein the diameter of the small diameter portion is set according to the size of the object to be molded.

7. A molding die according to any one of claims 1 to 6, wherein the tip portion has a base portion attached to the pedestal portion, the base portion is located between the small diameter portion and the pedestal portion, and the small diameter portion is eccentric with respect to the center of the base portion in a direction perpendicular to the mold clamping direction.

8. A resin molding apparatus for resin molding an object to be molded, comprising: a molding die according to any one of claims 1 to 7; and a clamping mechanism for clamping the molding die.

9. A method for manufacturing a resin molded product, comprising a step of resin molding an object to be molded using the mold according to any one of claims 1 to 7.

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