Sealing structure and electronic device including same

Abstract

According to an embodiment of the present disclosure, an electronic device may comprise a housing, a sound housing, a sound output module, or a sealing structure. The housing may include at least one sound hole. The sound housing may include a conduit. The sound output module may be configured to output sound to the outside of the electronic device through the conduit and the at least one sound hole. The sealing structure may include an elastic member, a mesh member, or an adhesive member. The mesh member may be integrally formed with the elastic member. The adhesive member may be configured to bond the elastic member and the housing. The elastic member may include a body portion or at least one first opening. Various other embodiments may be possible.

Description

Sealing structure and electronic device including same

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, to a sealing structure and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may include a housing, an acoustic housing, an acoustic output module, or a sealing structure. The housing may include at least one acoustic hole. The acoustic housing may be disposed within the housing. The acoustic housing may include a conduit. The acoustic output module may be disposed within the acoustic housing. The acoustic output module may be configured to output sound to the outside of the electronic device through the conduit and the at least one acoustic hole. The sealing structure may be disposed between the conduit and the at least one acoustic hole. The sealing structure may include an elastic member, a mesh member, or an adhesive member. The mesh member may be formed integrally with the elastic member. The adhesive member may be configured to adhere the elastic member to the housing. The elastic member may include a body portion or at least one first opening. The at least one first opening may be formed in the body portion. The size of at least one of the first openings may be expanded in a direction away from the mesh member.

[0006] According to one embodiment of the present disclosure, a sealing structure of an electronic device may include an elastic member or a mesh member. The elastic member may include a body portion, at least one first opening, or a protruding portion. The at least one first opening may be formed in the body portion. The protruding portion may protrude from the body portion. The mesh member may be formed integrally with the elastic member. At least a portion of the mesh member may be surrounded by the body portion. The remaining portion of the mesh member may be positioned on the at least one first opening.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a perspective view showing an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a cross-sectional view taken along line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0012] FIG. 6 is an enlarged view of portion B of FIG. 5 according to one embodiment of the present disclosure.

[0013] FIG. 7 is a perspective view of a sealing structure according to one embodiment of the present disclosure.

[0014] FIG. 8 is a cross-sectional view of a sealing structure taken along line CC' of FIG. 7 according to one embodiment of the present disclosure.

[0015] FIG. 9 is a cross-sectional view of a sealing structure according to one embodiment of the present disclosure.

[0016] FIG. 10 is a cross-sectional view of a sealing structure according to one embodiment of the present disclosure.

[0017] FIG. 11 is a cross-sectional view of a sealing structure according to one embodiment of the present disclosure.

[0018] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0034] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0042] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0043] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0044] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0045] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0046] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0047] FIG. 2 is a diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0048] FIG. 3 is a perspective view showing an electronic device according to one embodiment of the present disclosure.

[0049] The embodiments of FIGS. 2 and 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 11. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0050] Referring to FIGS. 2 and 3, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a display (201), a front plate (202), and a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and the display (201). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C).

[0051] In one embodiment, the front plate (202) may form at least a portion of the first surface (210A). In one embodiment, the front plate (202) may be a glass plate or a polymer plate, at least a portion of which is substantially transparent, and may include various coating layers. The front plate (202) may be referred to, for example, as a window plate (e.g., window plate (221) of FIG. 4)) and may form an exterior of the electronic device (101) together with the housing (210). In one embodiment, a display panel (e.g., display panel (223) of FIG. 4) may be disposed on an inner surface of the front plate (202), and, depending on the embodiment, the front plate (202) itself and / or the combination of the front plate (202) and the display panel (e.g., display panel (223) of FIG. 4) may be referred to as a 'display'.

[0052] According to one embodiment, the second side (or back) (210B) of the electronic device (101) may be formed by a back plate (212) provided as part of the housing (210) (e.g., the back plate (212) of FIG. 4). The back plate (212) may be formed by a substantially opaque material, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0053] In one embodiment, the side surface (210C) of the electronic device (101) may be formed by a side structure (211) (or “bezel structure”) that at least partially surrounds a space between the front plate (202) and the back plate (212). For example, the front plate (202) may be coupled to the side structure (211) and positioned to face the back plate (212) with a predetermined gap therebetween. In one embodiment, the side structure (211) may be provided as a separate component from the back plate (212) and may be coupled to the back plate (212) through a separate assembly process to form the housing (210). In one embodiment, the side structure (211) may be manufactured or formed integrally with the back plate (212) and may comprise the same material (e.g., a metal material such as aluminum). In one embodiment, the back plate (212) and / or the side structure (211) may at least partially comprise an electrically conductive material, a metal material, and / or a polymer material. When the back plate (212) and / or the side structure (211) include an electrically conductive material, the housing (210) can function at least partially as a radiating conductor of an antenna that transmits and receives wireless signals, and / or can function as a ground or electromagnetic shielding structure of the electronic device (101).

[0054] In the illustrated embodiment, the front plate (202) and / or the back plate (212) are substantially flat plate-shaped, but it should be noted that the embodiments disclosed herein are not limited thereto. For example, the front plate (202) and / or the back plate (212) may have a generally flat plate-shaped shape, but at least a portion of an edge may have a curved shape, and a side structure (211) connecting the edge of the front plate (202) and the back plate (212) may have a curved shape. In one embodiment, the thickness of the electronic device (101) at the center of the front plate (202), for example, the thickness measured along the Z-axis direction, may be greater than the thickness measured at the edge of the front plate (202). For example, the thickness of the electronic device (101) may gradually decrease as it approaches the edge on the first surface (210A). When the front plate (202), the rear plate (212) and / or the side structure (211) of the electronic device (101) have a curved shape, a comfortable grip can be provided to the user.

[0055] According to one embodiment, the electronic device (101) may include a display (201) (e.g., the display module (160) of FIG. 1 or the display (220) of FIG. 4), an audio module (e.g., the audio module (170) of FIG. 1), and / or a key input device (218), and may include at least one of a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1), a light-emitting element, and a connector hole (e.g., the connection terminal (178) of FIG. 1), which are not illustrated. In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (218) or the light-emitting element) or may additionally include other components.

[0056] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical in order to expand the area over which the display (201) is visually exposed.

[0057] According to one embodiment, the display (201) may include, for example, a display panel (e.g., display panel (223) of FIG. 4) disposed on the inside of the front plate (202) and may output visual information such as characters, images, and / or videos through a significant portion of the front plate (202). In one embodiment, substantially the entire area of ​​the front plate (202) may be set as an area for outputting a screen. The area for outputting a screen may be formed to have a shape substantially identical to an edge of the front plate (202). In one embodiment (not shown), the gap between the area for outputting a screen and the outer edge of the front plate (202) may be formed to be substantially identical, thereby increasing the ratio of the area for outputting a screen to the area provided by the front plate (202).

[0058] In one embodiment, a recess or opening is formed in a portion of a screen display area of ​​the display (201), and the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element aligned with the recess or opening. In one embodiment, the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, a fingerprint sensor, and a light-emitting element arranged to face in a direction opposite to a screen output direction of the display (201). In one embodiment, the electronic device may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element arranged inside the screen display area of ​​the display (201) while facing in the same direction as the screen output direction. For example, the camera module may be arranged to overlap the screen display area and may not be visually exposed to the outside, and may include a hidden under-display camera (UDC).

[0059] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, at least a portion of the sensor module and / or at least a portion of the key input device may be disposed inside the display.

[0060] In one embodiment, the display (201) may include a display (e.g., a flexible display) that is arranged to slide on the housing (210) to provide a screen (e.g., a screen display area). For example, the screen display area of ​​the electronic device (101) is an area that is visually exposed and capable of outputting an image, and the electronic device (101) may reduce or expand the screen display area according to the movement of a sliding plate (not shown) or the movement of the display (201). For example, the electronic device (101) may include a rollable electronic device in which at least a portion (e.g., the housing) is configured to selectively expand the screen display area by at least partially sliding. For example, the display (201) may also be referred to as a slide-out display or an expandable display.

[0061] According to one embodiment, an audio module (e.g., audio module (170) of FIG. 1) may include an audio hole (213). In one embodiment, the audio hole (213) may include a microphone hole and a speaker hole (e.g., sound hole (313) of FIG. 5). A microphone may be disposed inside the microphone hole to capture external sounds, and in one embodiment, multiple microphones may be disposed to detect the direction of sounds. The speaker hole may include an external speaker hole and a receiver hole for calls. In one embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezo speaker). In the illustrated embodiment, the audio hole (213) is illustrated as a hole that penetrates a side surface (210C) of the electronic device, for example, a side structure (211) (e.g., a side structure (211) of FIG. 4), but it should be noted that one embodiment disclosed in this document is not limited thereto. For example, when providing a voice call function, the electronic device (101) may further include an audio hole (not shown) in the form of a hole penetrating the front plate (202). The number and location of the audio holes may be varied in consideration of the shape, function, and / or actual usage environment of the electronic device (101).

[0062] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include sensors that detect the operating environment of the electronic device (101), such as a proximity sensor, an illuminance sensor, and a temperature / barometric pressure sensor, and may include sensors that obtain a user's biometric information, such as a fingerprint sensor or an HRM sensor. In addition, various other types of sensors, such as a gesture sensor, a gyro sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, or a humidity sensor, may be mounted on the electronic device (101). The arrangement of these sensor modules may be appropriately selected in consideration of the actual usage environment of the electronic device and the functions mounted on the electronic device.

[0063] According to one embodiment, the camera module may be arranged on at least one of the first surface (210A), which is the front surface, and the second surface (210B), which is the rear surface, of the electronic device (101), and, depending on the embodiment, a plurality of camera modules may be arranged to face the same direction. In one embodiment, the camera module may include a flash that provides illumination toward a subject. The camera module may include, for example, one or more lenses, an image sensor, and / or an image signal processor. The flash may include, for example, a light-emitting diode or a xenon lamp.

[0064] According to one embodiment, the key input device (218) may be disposed on a side surface (210C) of the electronic device (101) and / or the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (218), and the key input devices (218) that are not included may be implemented in other forms, such as soft keys, on the display (201). The number or location of the key input devices (218) is not limited to the illustrated embodiment, and may be additionally installed on the first side (210A) or the second side (210B) of the electronic device and / or on a side surface (210C) that is not illustrated. In one embodiment, some of the key input devices (218) of FIG. 2 may be replaced with slots or connector holes. For example, the electronic device (101) can accommodate a user identification module card or a memory card through a slot formed to penetrate the side structure (211), and can transmit and receive power, sound signals, and / or data to and from an external electronic device through a connector hole.

[0065] According to one embodiment, the light-emitting element may be disposed on the first side (210A) and / or the second side (210B) of the electronic device (101). The light-emitting element may, for example, provide status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element may, for example, provide a light source that is linked to the operation of a camera module. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0067] The embodiment of FIG. 4 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 11.

[0068] Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIG. 1, or the electronic device (101) of FIGS. 2 to 3) may include a housing (210) (e.g., the housing (210) of FIGS. 2 and / or 3), a display (220) (e.g., the display (201) of FIG. 3), a printed circuit board (203) (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (204), a speaker module (251) (e.g., an audio output module (155) of FIG. 1), and an antenna (253). In one embodiment, the electronic device (101) may omit at least one of the components or may additionally include another component (e.g., a bracket that supports or protects the display (220). According to one embodiment, the electronic device (101) may have a structure in which housings divided into a plurality of regions are folded, including at least one hinge structure. For example, depending on a change in the state of the hinge structure (e.g., a folded state, an intermediate state, or an unfolded state), the state of a display operatively connected to the housing may change. For example, a first display corresponding to a first housing and a second display corresponding to a second housing may change to a state in which they face each other or are spaced apart from each other. According to one embodiment, at least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and a redundant description thereof will be omitted below.

[0069] According to one embodiment, the housing (210) may include a back plate (212) (e.g., the back plate (212) of FIGS. 2 to 3) and a side structure (211) (e.g., the side structure (211) of FIGS. 2 to 3) extending from the back plate (212) in a thickness direction (e.g., the Z-axis direction). In one embodiment, the side structure (211) may be manufactured as a separate component from the back plate (212) and may be combined with the back plate (212) to form the housing (210). In one embodiment, the side structure (211) and the back plate (212) may be manufactured and formed as an integral component. Although not shown, the housing (210) may further include a support member (not shown) that isolates the display (220) (e.g., display panel (223)) from the space in which the printed circuit board (203) or the battery (204) is accommodated, and the support member may be in the form of a flat plate formed integrally with the side structure (211). In the embodiments described below, the rear plate (212) of FIG. 4 and the rear plate (212) of FIG. 3 may be interpreted as being substantially the same.

[0070] According to one embodiment, the back plate (212) and / or the side structure (211) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. For example, the housing (210) may at least partially include an electrically conductive material. In one embodiment, when the back plate (212) includes an electrically conductive material, the housing (210) may be utilized as a structure that provides an electromagnetic shielding structure at least partially. In one embodiment, when the side structure (211) includes an electrically conductive material, at least a portion of the side structure (211) may be utilized as a radiating conductor for transmitting and receiving wireless radio waves. In one embodiment, when a support member (not shown) is disposed between the printed circuit board (203) and the display panel (223), and the support member includes an electrically conductive material, the support member may provide a ground conductor or an electromagnetic shielding structure of the electronic device (101).

[0071] According to one embodiment, a display (220) (e.g., a display module (160) of FIG. 1, or a display (201) of FIGS. 2 to 3) may include a window plate (221) (e.g., a front plate (202) of FIG. 2 or 3) and a display panel (223). The display panel (223) is disposed on an inner surface of the window plate (221) and may output visual information by utilizing substantially the entire area of ​​the window plate (221).

[0072] According to one embodiment, the electronic device (101) may include an audio hole (213) (e.g., the audio hole (213) of FIGS. 2 and 3) and a key input device (218) (e.g., the key input device (218) of FIGS. 2 and 3) disposed in the side structure (211). The electronic device (101) may include a plurality of through holes (213, 218) formed through at least a portion of the side structure (211).

[0073] According to one embodiment, a printed circuit board (203) disposed as a first circuit board or a main circuit board may have disposed thereon a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), and / or an interface (e.g., an interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor or the communication module may be mounted on an electronic component (255), such as an integrated circuit chip, and disposed on the printed circuit board (203). For example, the electronic component (255) may be disposed on the printed circuit board (203) through a surface mount process and may perform wireless communication using an antenna (253) and / or a portion of a side structure (211). According to one embodiment, the electronic device (101) may include a storage device (e.g., memory) such as a hard disk drive (HDD) or a solid state drive (SSD).

[0074] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0075] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0076] According to one embodiment, a battery (204) (e.g., battery (189) of FIG. 1) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (204) may be disposed substantially on the same plane as, for example, a printed circuit board (203). The battery (204) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0077] According to one embodiment, the antenna (253) (e.g., the antenna module (197) of FIG. 1) may be disposed within the housing (210) adjacent to an edge, for example, a side structure (211). In one embodiment, a plurality of antennas (253) may be arranged at appropriate locations along the edge within the housing (210). In one embodiment, the illustrated antenna (253) may perform millimeter wave (mmWave) communication using a frequency of several tens of GHz or more. In one embodiment, although not illustrated, the electronic device (101) may further include a flat antenna disposed between the back plate (212) and the battery (204). The flat antenna may include wires or printed circuit patterns arranged in a plane to form a loop structure and may function as, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, a flat antenna can communicate with external devices over short distances or wirelessly transmit and receive power needed for charging.

[0078] According to one embodiment, the speaker module (251) may be disposed inside the electronic device (101). The speaker module (251) may be disposed adjacent to an audio hole (213) formed in the side structure (211). The speaker module (251) may include an audio output module disposed in the speaker module (251) (e.g., the audio output module (155) of FIG. 1, or the audio output module (352) of FIG. 5). The audio output module may output audio or an audio signal to the outside of the electronic device (101) through a conduit (e.g., the conduit (354) of FIG. 5) and an audio hole (e.g., the audio hole (313) of FIG. 5) of the speaker module (251).

[0079] FIG. 5 is a cross-sectional view taken along line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0080] FIG. 6 is an enlarged view of portion B of FIG. 5 according to one embodiment of the present disclosure.

[0081] FIG. 7 is a perspective view of a sealing structure according to one embodiment of the present disclosure.

[0082] FIG. 8 is a cross-sectional view of a sealing structure taken along line CC' of FIG. 7 according to one embodiment of the present disclosure.

[0083] The embodiments of FIGS. 5 to 8 may be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 9 to 11.

[0084] Referring to FIGS. 5 to 8, an electronic device (101) (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIGS. 2 to 3, or the electronic device (101) of FIG. 4) may include a housing (310) (e.g., the housing (310) of FIG. 4), a display (320) (e.g., the display (220) of FIG. 4), a speaker module (350), an adhesive member (380), or a sealing structure (400).

[0085] According to one embodiment, the housing (310) may include a side structure (311) (e.g., the side structure (211) of FIG. 4) or a back plate (312) (e.g., the back plate (212) of FIG. 4). The side structure (311) and / or the back plate (312) may include a metallic material and / or a non-metallic material (e.g., a polymer). For example, the housing (310) may include a non-metallic region (314) including a non-metallic material. The non-metallic region (314) may be defined and / or referred to as an injection-molded region formed in the side structure (311) and / or the back plate (312) through an injection-molding process.

[0086] According to one embodiment, the display (320) may include a window plate (321) (e.g., the window plate (221) of FIG. 4) or a display panel (323) (e.g., the display panel (223) of FIG. 4). The window plate (321) may be defined as a part of the housing (310) and may be referred to as a front plate of the housing (310).

[0087] According to one embodiment, the adhesive member (380) can adhere the window plate (321) to the housing (310) (e.g., the side structure (311)). The adhesive member (380) can include a double-sided tape, an adhesive, or a bond.

[0088] According to one embodiment, the internal space of the electronic device (101) may be defined as a space surrounded by the window plate (321), the side structure (311), and / or the rear plate (312). Various electrical / electronic components of the electronic device (101) may be arranged in the internal space of the electronic device (101).

[0089] According to one embodiment, the housing (310) may further include an audio hole (313) formed in the side structure (311) (e.g., the audio hole (213) of FIG. 4). The audio hole (313) may include a hole formed through the side structure (311). The audio hole (313) may form a passage through which an audio signal provided from the speaker module (350) is output to the outside of the electronic device (101). The audio hole (313) may be connected to a conduit (354) of the speaker module (350). A plurality of audio holes (313) may be provided.

[0090] According to one embodiment, a speaker module (350) (e.g., speaker module (251) of FIG. 4) may be disposed inside a housing (310). The speaker module (350) may be disposed adjacent to an acoustic hole (313). The speaker module (350) may include an acoustic housing (351) forming an exterior of the speaker module (350), or an acoustic output module (352) (e.g., acoustic output module (155) of FIG. 1) disposed inside the acoustic housing (351).

[0091] According to one embodiment, the audio output module (352) may be configured to output audio or audio signals. The audio output module (352) may include a speaker. Audio output from the audio output module (352) may be output to the outside of the electronic device (101) through the conduit (354) and the audio hole (313).

[0092] According to one embodiment, the acoustic housing (351) may include a first acoustic housing (351a) and a second acoustic housing (351b) coupled with the first acoustic housing (351a). The first acoustic housing (351a) may include a non-metallic material (e.g., polymer). The second acoustic housing (351b) may include a metallic material. The first acoustic housing (351a) and the second acoustic housing (351b) may be formed integrally. The second acoustic housing (351b) may be configured to block electromagnetic noise from being transmitted between electrical / electronic components within the acoustic output module (352) and the electronic device (101) by including a metallic material. For example, the second acoustic housing (351b) may be referred to as a shielding housing.

[0093] According to one embodiment, the acoustic housing (351) may include a conduit (354) for transmitting an acoustic signal provided from an acoustic output module (352) to an acoustic hole (313). The conduit (354) may face the acoustic hole (313) with a mesh member (420) therebetween. The conduit (354) may be formed inside the acoustic housing (351) and may extend from the acoustic output module (352) to the acoustic hole (313). The conduit (354) may provide a passage for outputting an acoustic signal.

[0094] According to one embodiment, the speaker module (350) may further include a resonance space (353). The resonance space (353) may be a space formed between the first acoustic housing (351a) and the second acoustic housing (351b). The resonance space (353) may provide a space in which sound generated from the acoustic output module (352) can resonate.

[0095] According to one embodiment, the sealing structure (400) may be disposed inside the housing (310). The sealing structure (400) may be positioned between at least a portion of the housing (310) and the speaker module (350). For example, the sealing structure (400) may be positioned between the sound hole (313) and the speaker module (350). The sealing structure (400) may be referred to as a sealing member (400). The sealing structure (400) may be applied to an electronic device (101), such as a tablet PC as illustrated in FIGS. 2 to 5 , but is not limited thereto. For example, the sealing structure (400) may be applied to a smartphone, a foldable electronic device, a rollable electronic device, or various other electronic devices.

[0096] According to one embodiment, the sealing structure (400) may be configured to block external foreign substances and / or moisture from entering the interior of the electronic device (101).

[0097] According to one embodiment, the sealing structure (400) may include an elastic member (410), a mesh member (420), or an adhesive member (430).

[0098] According to one embodiment, the elastic member (410) may be positioned to cover the acoustic hole (313). For example, the elastic member (410) may be positioned between the acoustic hole (313) and the conduit (354). The elastic member (410) may be in close contact with at least a portion of the housing (310) and the acoustic housing (351).

[0099] According to one embodiment, the elastic member (410) may include a rubber material or a silicone material. The elastic member (410) may be positioned between the acoustic hole (313) and the conduit (354) and may be compressed by the acoustic housing (351). The elastic member (410) may be configured to cover at least a portion of the mesh member (420).

[0100] According to one embodiment, the elastic member (410) may include a body portion (411), at least one first opening (413), or a protruding portion (415).

[0101] According to one embodiment, the body portion (411) may be formed in a rectangular shape to cover the acoustic hole (313). The body portion (411) may include a first surface (e.g., the first surface (411a) of FIG. 9) that is in close contact with the acoustic housing (351), and a second surface (e.g., the second surface (411b) of FIG. 9) that is in close contact with at least a portion of the housing (310).

[0102] According to one embodiment, the body portion (411) may be formed with at least one first opening (413). The at least one opening (413) may include a hole formed through a first surface (411a) to a second surface (411b) of the body portion (411). The at least one first opening (413) may be positioned corresponding to the sound hole (313) and the conduit (354). For example, when the at least one first opening (413) is positioned between the sound hole (313) and the conduit (354), sound output from the sound output module (352) may be output to the outside of the electronic device (101) through the conduit (354), the at least one first opening (413), and the sound hole (313). At least one first opening (413) may be interpreted as being defined or formed by the body portion (411) and the connecting portion (412). According to one embodiment, the at least one first opening (413) may have an overall rectangular cross-sectional shape (see FIG. 7). The cross-sectional shape of the at least one first opening (413) is not limited thereto, and may have a triangle, circle, oval, various polygons, or various other shapes.

[0103] According to one embodiment, the elastic member (410) may further include a connecting portion (412). The connecting portion (412) may be arranged to separate (or partition) a plurality of openings (413) when at least one first opening (413) is provided in multiple numbers. The connecting portion (412) may be configured to connect facing long sides of the body portion (411). The connecting portion (412) may limit or reduce excessive deformation of the shape of the body portion (411) when the sealing structure (400) is coupled or installed in the electronic device (101).

[0104] According to one embodiment, the protruding portion (415) may protrude from the first surface (411a) of the body portion (411). The protruding portion (415) may have a rectangular shape extending along the outer surface (or edge) of the body portion (411). The protruding portion (415) may have a loop shape. The protruding portion (415) may be brought into close contact with the outer surface of the acoustic housing (351) when the sealing structure (400) is coupled or installed in the electronic device (101). The protruding portion (415) may be at least partially compressed by being pressed by the acoustic housing (351). As the protruding portion (415) is brought into close contact with the outer surface of the acoustic housing (351), a space between the acoustic housing (351) and the sealing structure (400) may be sealed.

[0105] In one embodiment, the mesh member (420) may include a mesh made of a breathable material. In one embodiment, the mesh member (420) may limit liquid and / or foreign substances from flowing into the conduit (354) of the acoustic housing (351). For example, the mesh member (420) may limit or reduce liquid and / or foreign substances from outside the electronic device (101) from flowing into the conduit (354) of the acoustic housing (351) through the acoustic hole (313). The mesh member (420) may include a mesh that allows the inflow of liquid and does not allow the inflow of foreign substances. For example, the mesh member (420) may allow liquid to flow into the interior of the acoustic housing (351) and may not allow liquid to flow into the interior of the acoustic housing (351). For example, liquid that has flowed into the interior of the acoustic housing (351) can be prevented from flowing into the interior of the electronic device (101) through the space between the acoustic housing (351) and the protruding portion (415) as the acoustic housing (351) and the protruding portion (415) are in close contact with each other.

[0106] In one embodiment, the elastic member (410) and the mesh member (420) may be formed integrally. For example, the elastic member (410) may be formed into the mesh member (420) through an insert injection process. The elastic member (410) may be configured to cover at least a portion of the mesh member (420).

[0107] According to one embodiment, at least a portion (420a) of the mesh member (420) may be positioned or inserted into the interior of the body portion (411). For example, at least a portion (420a) of the mesh member (420) may be surrounded by the body portion (411). At least a portion (420a) of the mesh member (420) positioned or inserted into the interior of the body portion (411) may be impregnated with at least a portion of the elastic member (410). For example, the mesh member (420) may include a lattice structure, and at least a portion of the lattice structure positioned in at least a portion (420a) of the mesh member (420) may be impregnated with at least a portion of the elastic member (410) made of a rubber material or a silicone material.

[0108] According to one embodiment, the remaining portion (420b) of the mesh member (420) can be positioned in at least one first opening (413). The remaining portion (420b) of the mesh member (420) can be positioned between the conduit (354) and the acoustic hole (313).

[0109] According to one embodiment, the adhesive member (430) may be disposed between at least a portion of the housing (310) and the elastic member (410). The adhesive member (430) may include a double-sided tape, an adhesive, or a bond. The adhesive member (430) may adhere the elastic member (410) to at least a portion of the housing (310). For example, the adhesive member (430) may adhere the elastic member (410) to at least a portion of an inner surface of the housing (310) (e.g., a surface facing the inside of the electronic device (101).

[0110] According to one embodiment, the adhesive member (430) may include at least one second opening (433). The at least one second opening (433) may be formed or positioned to correspond to at least one first opening (413) of the elastic member (410). The at least one second opening (433) may include a hole formed through at least a portion of the adhesive member (430). The number of the at least one second opening (433) may be provided equal to the number of the at least one first opening (413). The at least one second opening (433) may be aligned with the at least one first opening (413).

[0111] According to one embodiment, the elastic member (410) may further include a cutting portion (414). The cutting portion (414) may be configured to expand the size of at least one first opening (413). For example, the size of the at least one first opening (413) may expand in a direction away from the mesh member (420). For example, the size of the at least one first opening (413) may be expanded by the cutting portion (414) in a direction from the mesh member (420) toward the conduit (354).

[0112] According to one embodiment, the body portion (411) may include an inner surface (411c) defining at least one first opening (413). The inner surface (411c) may surround the at least one first opening (413). One edge of the inner surface (411c) may be connected to an edge of the first surface (411a). The other edge of the inner surface (411c) may be connected to an edge of the second surface (411b). The inner surface (411c) may be defined and / or referred to as a third surface of the body portion (411).

[0113] According to one embodiment, the cutting portion (414) may be formed on at least a portion of the body portion (411). The cutting portion (414) may be formed on an edge of the inner surface (411c). The cutting portion (414) may be formed on an inner edge of the first surface (411a). For example, the cutting portion (414) may be formed on an edge connecting the inner surface (411c) and the first surface (411a). For example, the cutting portion (414) may be formed by cutting off at least a portion of an edge (or corner) connecting the inner surface (411c) and the first surface (411a), which defines at least one first opening (413). The cutting portion (414) may include an inclined surface that is inclined with respect to the first surface (411a) and / or the inner surface (411c). As the cutting portion (414) is provided, the size of at least one first opening (413) can be varied in a direction from the mesh member (420) toward the acoustic housing (351). For example, the size of at least one first opening (413) can gradually increase in a direction from the mesh member (420) toward the acoustic housing (351). For example, the size (S1) of at least one first opening (413) located on the exposed portion (420b) of the mesh member (420) can be smaller than the size (S2) of at least one first opening (413) located on the cutting portion (414). Sound passing through the at least one first opening (413) from the conduit (354) can be free from interference by the edge of the body portion (411) as the cutting portion (414) is provided. Accordingly, the performance of sound output to the outside of the electronic device (101) can be improved. For example, as the cutting portion (414) is provided, the frequency response characteristics of the sound output from the sound output module (352) can be improved.

[0114] According to one embodiment, the body portion (411) may have a first thickness (T1) in a first direction (e.g., the T-axis direction of FIG. 8). The first direction may be a direction from the first surface (411a) toward the second surface (411b), or a direction from the second surface (411b) toward the first surface (411a). The first direction may be defined and / or referred to as a thickness direction of the sealing structure (400). The first thickness (T1) may be about 0.44 mm to about 0.54 mm (millimeter). For example, the first thickness (T1) may be about 0.49 mm.

[0115] According to one embodiment, the adhesive member (430) may have a second thickness (T2) in the first direction. The second thickness (T2) may be less than the first thickness (T1). The second thickness (T2) may be about 0.18 mm to about 0.22 mm. For example, the second thickness (T2) may be about 0.20 mm.

[0116] According to one embodiment, the overall thickness of the sealing structure (400) may be a third thickness (T3) that is the sum of the first thickness (T2) and the second thickness (T2). The third thickness (T3) may be about 0.62 mm to about 0.76 mm. For example, the third thickness (T3) may be about 0.69 mm.

[0117] According to one embodiment, since the elastic member (410) and the mesh member (420) are formed integrally, the thickness (T3) of the assembly of the mesh member (420) and the body portion (411) in the first direction may be the first thickness (T1). For example, since the mesh member (420) is provided integrally with the elastic member (410), the overall size or thickness of the elastic member (410) and the mesh member (420) may be reduced. For example, if the mesh member is bonded to the elastic member (or the body portion) through a separate adhesive member, the thickness of the mesh member may be formed to be separate from the thickness of the elastic member, so that the thickness of the assembly of the mesh member and the elastic member may be formed to be excessively large. In this case, since two adhesive members are required, namely, an adhesive member for bonding the mesh member and the elastic member, and an adhesive member for bonding the assembly of the mesh member and the elastic member to the housing, the overall thickness of the sealing structure may be formed to be excessively large.

[0118] According to one embodiment, since the mesh member (420) is formed integrally with the elastic member (410), an adhesive member for bonding the mesh member (420) to the elastic member (410) may not be required. In addition, since the mesh member (420) is formed integrally with the elastic member (410), the thickness of the assembly of the mesh member (420) and the elastic member (410) may be reduced. Accordingly, additional space for mounting other electrical / electronic components may be secured within the electronic device (101).

[0119] In one embodiment, the mesh member (420) is formed integrally with the elastic member (410), such that at least a portion (4111) of the elastic member (410) (or body portion (411)) can be positioned between the mesh member (420) and the adhesive member (430).

[0120] FIG. 9 is a cross-sectional view of a sealing structure according to one embodiment of the present disclosure.

[0121] FIG. 10 is a cross-sectional view of a sealing structure according to one embodiment of the present disclosure.

[0122] FIG. 11 is a cross-sectional view of a sealing structure according to one embodiment of the present disclosure.

[0123] The embodiments of FIGS. 9 to 11 may be combined with the embodiments of FIGS. 1 to 8.

[0124] Referring to FIGS. 9 to 11, the sealing structure (400) (e.g., the sealing structure (400) of FIGS. 5 to 8) may include an elastic member (410) (e.g., the elastic member (410) of FIGS. 7 to 8) or a mesh member (420) (e.g., the mesh member (420) of FIGS. 7 to 8).

[0125] According to one embodiment, the elastic member (410) may include a body portion (411) (e.g., the body portion (411) of FIGS. 7-8), at least one first opening (413) (e.g., the at least one first opening (413) of FIGS. 7-8), or a protruding portion (415) (e.g., the protruding portion (415) of FIGS. 7-8). The body portion (411) may include a first side (411a) (e.g., the first side (411a) of FIGS. 7-8), a second side (411b) (e.g., the second side (411b) of FIGS. 7-8), or an inner side (411c) (e.g., the inner side (411c) of FIGS. 7-8).

[0126] According to one embodiment, the elastic member (410) may include cutting portions (4141, 4142, 4143) (e.g., cutting portion (414) of FIGS. 7 to 8).

[0127] Referring to FIG. 9, a cutting portion (4141) may be formed at an edge connecting the first surface (411a) and the inner surface (411c). The cutting portion (4141) may be configured to expand the size of at least one first opening (413). For example, the size of at least one first opening (413) may expand in a direction away from the mesh member (420). For example, the size of at least one first opening (413) may be expanded by the cutting portion (4141) in a direction from the mesh member (420) toward a conduit (e.g., conduit (354) of FIGS. 6 to 7). The cutting portion (4141) may include a curved surface with respect to the inner surface (411c) and / or the first surface (411a).

[0128] Referring to FIG. 10, a cutting portion (4142) may be formed at an edge connecting the first surface (411a) and the inner surface (411c). The cutting portion (4141) may be configured to expand the size of at least one first opening (413). For example, the size of at least one first opening (413) may expand in a direction away from the mesh member (420). For example, the size of at least one first opening (413) may be expanded by the cutting portion (4142) in a direction from the mesh member (420) toward a conduit (e.g., conduit (354) of FIGS. 6 to 7). The cutting portion (4142) may include a stepped surface with respect to the inner surface (411c) and / or the first surface (411a).

[0129] Referring to FIG. 11, a cutting portion (4142) may be formed at an edge connecting the second surface (411b) and the inner surface (411c). The cutting portion (4143) may be configured to expand the size of at least one first opening (413). For example, the size of at least one first opening (413) may expand in a direction away from the mesh member (420). For example, the size of at least one first opening (413) may be expanded by the cutting portion (4143) in a direction from the mesh member (420) toward an acoustic hole (e.g., an acoustic hole (313) of FIGS. 6 to 7). The cutting portion (4143) may include a stepped surface with respect to the inner surface (411c) and / or the second surface (411b).

[0130] The positions or shapes of the cutting portions (414, 4141, 4142, 4143) illustrated in FIGS. 8 to 11 are exemplary, and the positions or shapes of the cutting portions of the present disclosure are not limited thereto. The positions or shapes of the cutting portions of the present disclosure may have various positions or shapes that can improve the performance of sound output from an audio output module (e.g., the audio output module (352) of FIGS. 5 to 6).

[0131] An electronic device may include an audio output module capable of outputting an audio signal to the outside of the electronic device. In order for the audio signal to be output to the outside of the electronic device, an audio penetration hole may be formed in a portion of a housing forming the exterior of the electronic device.

[0132] Additionally, electronic devices may include various components to provide various functions to users. Electronic devices may require a waterproof structure to limit (or prevent) the ingress of foreign substances and / or liquids into these various components.

[0133] As the integration of electronic devices increases, it may become difficult to secure sufficient internal space to mount the components of the electronic devices, as the electronic devices include various components and waterproof structures.

[0134] According to one embodiment of the present disclosure, an electronic device can be provided in which a space for mounting components of the electronic device can be secured by providing a miniaturized sealing structure.

[0135] According to one embodiment of the present disclosure, a sealing structure that blocks external foreign substances and / or moisture from entering electrical / electronic components of an electronic device and an electronic device including the same can be provided.

[0136] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0137] According to one embodiment of the present disclosure, an electronic device having improved acoustic performance can be provided by extending the path of sound output from an acoustic output module by a cut portion of a sealing structure.

[0138] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0139] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (310), an acoustic housing (351), an acoustic output module (352), or a sealing structure (400). The housing (310) may include at least one acoustic hole (313). The acoustic housing (351) may be disposed within the housing (310). The acoustic housing (351) may include a conduit (354). The acoustic output module (352) may be disposed within the acoustic housing (351). The acoustic output module (352) may be configured to output sound to the outside of the electronic device (101) through the conduit (354) and the at least one acoustic hole (313). The sealing structure (400) may be disposed between the conduit (354) and the at least one acoustic hole (313). The sealing structure (400) may include an elastic member (410), a mesh member (420), or an adhesive member (430). The mesh member (420) may be formed integrally with the elastic member (410). The adhesive member (430) may be configured to adhere the elastic member (410) and the housing (310). The elastic member (410) may include a body portion (411), or at least one first opening (413). The at least one first opening (413) may be formed in the body portion (411). The size of the at least one first opening (413) may expand in a direction away from the mesh member (420).

[0140] According to one embodiment, the elastic member (410) may be configured to cover at least a portion of the mesh member (420). At least a portion (4111) of the elastic member (410) may be positioned between the mesh member (420) and the adhesive member (430).

[0141] According to one embodiment, the body portion (411) may include a first side (411a) or a second side (411b). The second side (411b) may face opposite to the first side (411a). The elastic member (410) may further include a protruding part (415). The protruding part (415) may protrude from the first side (411a).

[0142] According to one embodiment, the protruding portion (415) can be in close contact with the acoustic housing (351).

[0143] According to one embodiment, the body portion (411) may further include an inner surface (411c). The inner surface (411c) may define at least one first opening (413). The elastic member (410) may further include a cutting portion (414). The cutting portion (414) may be formed at a corner of the inner surface (411c). The size of the at least one first opening (413) may be expanded in a direction away from the mesh member (420) by the cutting portion (414).

[0144] According to one embodiment, the cutting portion (414) may be formed at the corner defined by the inner surface (411c) and the first surface (411a).

[0145] According to one embodiment, the cutting portion (4143) may be formed at the corner defined by the inner surface (411c) and the second surface (411b).

[0146] According to one embodiment, the cutting portion (414) may include an inclined surface inclined with respect to the inner surface (411c).

[0147] According to one embodiment, the cutting portion (4141) may include a curved surface with respect to the inner surface (411c).

[0148] According to one embodiment, the cutting portion (4142, 4143) may include a stepped surface with respect to the inner surface (411c).

[0149] According to one embodiment, the body portion (411) may have a first thickness (T1) in a direction from the first surface (411a) toward the second surface (411b). The adhesive member (430) may have a second thickness (T2) in the direction. The second thickness (T2) may be smaller than the first thickness (T1).

[0150] According to one embodiment, the adhesive member (430) may include at least one second opening (433). The at least one second opening (433) may be positioned corresponding to the at least one first opening (413).

[0151] According to one embodiment, the electronic device (101) may further include a display (320). The display (320) may be disposed in the housing (310).

[0152] According to one embodiment, at least a portion (420a) of the mesh member (420) may be surrounded by the body portion (411). The remaining portion (420b) of the mesh member (420) may be positioned on the at least one first opening (413).

[0153] According to one embodiment, the conduit (354) may extend from the sound output module (352) to the at least one first opening (413).

[0154] According to one embodiment of the present disclosure, the sealing structure (400) of the electronic device (101) may include an elastic member (410) or a mesh member (420). The elastic member (410) may include a body portion (411), at least one first opening (413), or a protruding portion (415). The at least one first opening (413) may be formed in the body portion (411). The protruding portion (415) may protrude from the body portion (411). The mesh member (420) may be formed integrally with the elastic member (410). At least a portion (420a) of the mesh member (420) may be surrounded by the body portion (411). The remaining portion (420b) of the mesh member (420) may be positioned on the at least one first opening (413).

[0155] According to one embodiment, the body portion (411) may include a first side (411a), a second side (411b), or an inner side (411c). The second side (411b) may face opposite to the first side (411a). The inner side (411c) may define at least one first opening (413). The protruding portion (415) may protrude from the first side (411a). The size of the at least one first opening (413) may expand in a direction away from the mesh member (420).

[0156] According to one embodiment, the elastic member (410) may further include a cutting portion (414). The cutting portion (414) may be formed at a corner of the inner surface (411c).

[0157] According to one embodiment, the cutting portion (414) may be formed at the corner defined by the inner surface (411c) and the first surface (411a).

[0158] According to one embodiment, the cutting portion (4143) may be formed at the corner defined by the inner surface (411c) and the second surface (411b).

[0159] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), A housing (310) including at least one acoustic hole (313); An acoustic housing (351) disposed within the above housing (310), the acoustic housing (351) including a conduit (354); An acoustic output module (352) arranged within the acoustic housing (351), configured to output sound to the outside of the electronic device (101) through the conduit (354) and the at least one acoustic hole (313); and A sealing structure (400) disposed between the above conduit (354) and the at least one sound hole (313), comprising a sealing structure (400) including an elastic member (410), a mesh member (420) formed integrally with the elastic member (410), and an adhesive member (430) configured to adhere the elastic member (410) and the housing (310), The above elastic member (410) is Body part (411); and comprising at least one first opening (413) formed in the above body portion (411); The size of at least one of the first openings (413) is: An electronic device extending in a direction away from the above mesh member (420).

2. In paragraph 1, The above elastic member (410) is configured to cover at least a portion of the mesh member (420), At least a portion (4111) of the elastic member (410) An electronic device positioned between the mesh member (420) and the adhesive member (430).

3. In any one of paragraphs 1 to 2, The above body part (411) is It includes a first side (411a) and a second side (411b) facing opposite to the first side (411a), The above elastic member (410) is An electronic device further comprising a protruding portion (415) protruding from the first surface (411a).

4. In any one of paragraphs 1 to 3, The above protruding portion (415) is an electronic device that is in close contact with the acoustic housing (351).

5. In any one of paragraphs 1 to 4, The above body portion (411) further includes an inner surface (411c) defining at least one first opening (413), The above elastic member (410) further includes a cutting portion (414) formed at the edge of the inner surface (411c), An electronic device in which the size of at least one first opening (413) is extended in a direction away from the mesh member (420) by the cutting portion (414).

6. In any one of paragraphs 1 to 5, The above-mentioned cutting portion (414) is an electronic device formed at the edge defined by the inner surface (411c) and the first surface (411a).

7. In any one of paragraphs 1 to 5, The above-mentioned cutting portion (4143) is an electronic device formed at the corner defined by the inner surface (411c) and the second surface (411b).

8. In any one of paragraphs 1 to 7, An electronic device in which the above-mentioned cutting portion (414) includes an inclined surface inclined with respect to the inner surface (411c).

9. In any one of paragraphs 1 to 7, The above-mentioned cutting portion (4141) is an electronic device including a curved surface with respect to the inner surface (411c).

10. In any one of paragraphs 1 to 7, An electronic device in which the above-mentioned cutting portion (4142, 4143) includes a stepped surface with respect to the inner surface (411c).

11. In any one of paragraphs 1 to 10, The above body part (411) has a first thickness (T1) in the direction from the first surface (411a) toward the second surface (411b), The above adhesive member (430) has a second thickness (T2) in the above direction, An electronic device wherein the second thickness (T2) is smaller than the first thickness (T1).

12. In any one of paragraphs 1 to 11, The above adhesive member (430) includes at least one second opening (433), An electronic device wherein at least one second opening (433) is positioned correspondingly to the at least one first opening (413).

13. In any one of paragraphs 1 to 12, An electronic device further comprising a display (320) disposed in the housing (310).

14. In any one of paragraphs 1 to 13, At least a portion (420a) of the above mesh member (420) is surrounded by the body portion (411), The remaining portion (420b) of the above mesh member (420) is an electronic device positioned on at least one first opening (413).

15. In any one of paragraphs 1 to 14, The above conduit (354) is an electronic device extending from the sound output module (352) to the at least one first opening (413).

Images