Electronic device comprising speaker

Abstract

An electronic device according to an embodiment of the present disclosure comprises: a housing having a seating space; a speaker arranged in the seating space; and a frame disposed on at least part of the speaker, wherein the frame comprises: a first region which is arranged on one surface of the speaker and extends in parallel with the one surface of the speaker; second regions which are disposed at the side surfaces of the speaker, the side surfaces forming the boundary of the speaker, and which extend in parallel with the side surfaces of the speaker; and connection regions which are at least partially bent and connect the first region and the second regions. When an external impact is applied to the electronic device, at least part of the second regions can come into contact with the side walls of the housing surrounding the seating space and can be elastically moved.

Description

Electronic devices containing speakers

[0001] The present disclosure relates to an electronic device including a speaker.

[0002] Electronic devices (e.g., portable electronic devices) may include speakers. Electronic devices including speakers require a resonant space surrounding the speakers to output sound of the desired quality. The electronic devices can secure this resonant space by covering the speakers with a separate structure.

[0003] When an electronic device secures a resonant space around a speaker by covering the speaker with a separate structure, the speaker may be placed between the housing and the supporting member. For example, after the speaker is placed in a designated space (e.g., a seating space) in the housing, it may be covered by the supporting member, thereby forming a resonant space around the speaker.

[0004] When an electronic device is subjected to external impact, the impact can be transmitted directly to the speaker through the sidewalls of the housing surrounding the speaker. If the impact is transmitted to the speaker, it can damage the speaker, allowing water and dust to enter the speaker's interior. Therefore, a structure that can reduce the impact transmitted directly to the speaker may be necessary.

[0005] An electronic device according to one embodiment of the present disclosure may include a housing including a mounting space, a speaker disposed in the mounting space, and a frame disposed on at least a portion of the speaker.

[0006] In one embodiment, the frame may include a first region disposed on one side of the speaker and extending parallel to the one side of the speaker, a second region disposed on a side of the speaker forming a perimeter of the speaker and extending parallel to the side of the speaker, and a connecting region that is curved at least in part and connects the first region and the second region.

[0007] In one embodiment, when an external impact is applied to the electronic device, at least a portion of the second region can be elastically moved by contacting a side wall of a housing surrounding the seating space.

[0008] A speaker device according to one embodiment of the present disclosure includes a speaker and a frame disposed on at least a portion of the speaker, wherein the frame includes a first region disposed on one side of the speaker and extending parallel to the one side of the speaker, a second region disposed on a side of the speaker forming a periphery of the speaker and extending parallel to the side of the speaker, and a connecting region that is bent at least in a portion and connects the first region and the second region, wherein when an external impact is applied to the speaker device, at least a portion of the second region can be elastically moved.

[0009] An electronic device according to one embodiment of the present disclosure can include a frame disposed on a speaker to reduce shock directly transmitted to the speaker when an external shock is applied to the electronic device.

[0010] An electronic device according to one embodiment of the present disclosure can maintain waterproof and dustproof performance of the speaker by preventing the speaker from being damaged due to external impact applied to the electronic device.

[0011] An electronic device according to one embodiment of the present disclosure can improve the sound performance of a speaker in a low-frequency band by additionally securing a resonant space around the speaker.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0013] FIGS. 2A and 2B are perspective views of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 3 is an exploded perspective view showing an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 4 is a perspective view showing a speaker and a frame according to one embodiment of the present disclosure.

[0016] FIG. 5a, FIG. 5b and FIG. 5c are drawings showing a frame according to one embodiment of the present disclosure.

[0017] FIGS. 6A and 6B are drawings showing a speaker and a support member arranged in a housing according to one embodiment of the present disclosure.

[0018] FIG. 7 is a drawing showing a speaker and a frame according to one embodiment of the present disclosure.

[0019] FIG. 8 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0020] FIGS. 9A and 9B are drawings showing a speaker and a frame according to one embodiment of the present disclosure.

[0021] FIG. 10 is a drawing showing a housing according to one embodiment of the present disclosure.

[0022] FIG. 11 is a graph showing the amount of impact measured in a drop test of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 12 is a graph showing the sound pressure level of a speaker of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] FIG. 2A is a perspective view of the front of an electronic device (200) according to one embodiment of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device (200) of FIG. 2A according to one embodiment of the present disclosure.

[0047] The electronic device (200) of FIGS. 2A and 2B may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) of FIG. 1.

[0048] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the back plate (211) and comprises a metal and / or polymer. In some embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0049] In one embodiment, the front plate (202) can include a first region (210D) that extends seamlessly from the first side (210A) toward the back plate (211), on both long edges of the front plate. In the illustrated embodiment (see FIG. 2B), the back plate (211) can include a second region (210E) that extends seamlessly from the second side (210B) toward the front plate, on both long edges of the front plate. In some embodiments, the front plate (202) or the back plate (211) can include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat surface that is arranged parallel to the second side (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0050] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0051] In one embodiment, the display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms a first area (210D) of a first surface (210A) and a side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first area (210D), and / or the second area (210E).

[0052] In one embodiment, the input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0053] In one embodiment, the sensor modules (204, 219) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor modules (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0054] In one embodiment, the camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0055] In one embodiment, the key input device (217) may be positioned on a side surface (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0056] In one embodiment, the indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0057] In one embodiment, the connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an interface connector port module) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0058] In one embodiment, some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0059] FIG. 3 is an exploded perspective view showing an electronic device (300) according to one embodiment of the present disclosure.

[0060] In describing an electronic device (300) according to one embodiment of the present disclosure, the width direction of the electronic device (300) may mean the X-axis direction, and the length direction of the electronic device (300) may mean the Y-axis direction. The height direction of the electronic device (300) may mean the Z-axis direction.

[0061] The electronic device (300) of FIG. 3 may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) of FIG. 1.

[0062] The electronic device (300) of FIG. 3 may refer to the electronic device (200) of FIGS. 2A and 2B, or may include at least some of the components of the electronic device (200) of FIGS. 2A and 2B.

[0063] At least one of the components of the electronic device (300) of FIG. 3 may be substantially identical to at least one of the components of the electronic device (200) of FIGS. 2A and 2B, and redundant descriptions of components that are substantially identical to the components of the electronic device (200) of FIGS. 2A and 2B may be omitted.

[0064] An electronic device (300) according to one embodiment of the present disclosure may include a housing (310), a speaker (320), a frame (330), a printed circuit board (340), a support member (350), a rear cover (360), a battery (370), and / or a support plate (380).

[0065] In one embodiment, the housing (310) may be substantially the same component as the housing (210) of FIGS. 2A and 2B. In one embodiment, the housing (310) may be a component that forms the exterior of the electronic device (300).

[0066] In one embodiment, other components of the electronic device (300), such as a speaker (320), may be placed inside the housing (310). In one embodiment, the housing (310) may include a space in which other components of the electronic device (300) may be placed. For example, the housing (310) may include a mounting space (311) in which the speaker (320) is mounted.

[0067] In one embodiment, the speaker (320) may be substantially the same component as the audio output module (155) of FIG. 1. For example, the speaker (320) may serve to output an audio signal to the outside of the electronic device (300).

[0068] In one embodiment, a frame (330) may be disposed on at least a portion of the speaker (320). The frame (330) may serve to reduce impact applied to the speaker (320).

[0069] In one embodiment, the printed circuit board (340) may be electrically connected to the speaker (320).

[0070] In one embodiment, the printed circuit board (340) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory. According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, and may include, for example, a USB connector, an SD card / MMC connector, or an audio connector.

[0071] In one embodiment, the support member (350) may be positioned to cover the speaker (320), the frame (330), and the printed circuit board (340). For example, the speaker (320), the frame (330), and the printed circuit board (340) may be positioned in the space between the housing (310) and the support member (350).

[0072] In one embodiment, the support member (350) may serve to secure the speaker (320), the frame (330), and the printed circuit board (340) so that they remain in a fixed position. In one embodiment, the support member (350) may serve to support the speaker (320), the frame (330), and the printed circuit board (340).

[0073] In one embodiment, the rear cover (360) may be configured to cover the rear side (e.g., the side facing the negative Z-axis direction) of the housing (310). Internal components of the electronic device (300) may be positioned between the housing (310) and the rear cover (360).

[0074] In one embodiment, the battery (370) is a device for powering at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. In one embodiment, the battery (370) may be disposed in the housing (310).

[0075] In one embodiment, the support plate (380) may be a configuration on which other components of the electronic device (300) (e.g., a printed circuit board, a camera module) are placed. The support plate (380) may serve to support other components of the electronic device (300).

[0076] In one embodiment, the electronic device (300) may be stacked in the following order: a housing (310), a speaker (320), a printed circuit board (340), and a support member (350) based on the height direction (e.g., Z-axis direction). For example, in the electronic device (300) according to one embodiment, the speaker (320) may be placed between the housing (310) and the printed circuit board (340). The frame (330) may be placed on the speaker (320). A portion of the frame (330) according to one embodiment (e.g., the first region (331, see FIG. 5B)) may be placed on a surface of the speaker (320) facing the housing (310). At least a portion of the printed circuit board (340) according to one embodiment may be placed in a direction opposite to a direction in which a portion of the frame (330) (e.g., the first region (331, see FIG. 5B)) is placed based on the speaker (320).

[0077] FIG. 4 is a perspective view showing a speaker (320) and a frame (330) according to one embodiment of the present disclosure.

[0078] In describing a speaker (320) according to one embodiment of the present disclosure, the longitudinal direction of the speaker (320) may mean the X-axis direction, and the width direction of the speaker (320) may mean the Y-axis direction. The height direction of the speaker (320) may mean the Z-axis direction.

[0079] In one embodiment, one side of the speaker (320) may mean a side facing the height direction (e.g., the Z-axis direction) of the speaker (320). For example, one side of the speaker (320) may mean a first side (321) of the speaker (320) or a second side (322) of the speaker (320). The first side (321) of the speaker (320) may mean a side facing the positive Z-axis direction of the speaker (320), and the second side (322) of the speaker (320) may mean a side located opposite the first side (321) and facing the negative Z-axis direction of the speaker (320).

[0080] In one embodiment, the side surface (323) of the speaker (320) may be a surface formed between the first surface (321) and the second surface (322). The side surface (323) of the speaker (320) may be formed to surround a space formed between the first surface (321) and the second surface (322).

[0081] In one embodiment, the side surface (323) of the speaker (320) may be formed substantially perpendicular to the first surface (321) and the second surface (322) of the speaker (320).

[0082] In one embodiment, the side surface (323) of the speaker (320) may include a first side surface (323a), a second side surface (323b), a third side surface (323c), and a fourth side surface (323d). Referring to FIG. 4, at least a portion of the first side surface (323a) may be formed substantially parallel to the third side surface (323c). At least a portion of the second side surface (323b) may be formed substantially perpendicular to the first side surface (323a). At least a portion of the second side surface (323b) may be formed substantially parallel to the fourth side surface (323d).

[0083] In one embodiment, the frame (330) may be disposed on at least a portion of the speaker (320). The frame (330) may be disposed on one side (the first side (321) or the second side (322)) and / or the side (323) of the speaker (320) and may serve to reduce impact applied to the speaker (320).

[0084] In one embodiment, at least a portion of the frame (330) may be elastically movable. When an external impact is applied to the speaker (320) in which the frame (330) is disposed, at least a portion of the frame (330) may elastically move and absorb a portion of the external impact. Since the frame (330) absorbs a portion of the external impact, the impact directly applied to the speaker (320) may be reduced.

[0085] In one embodiment, at least a portion of the frame (330) may be disposed on one side of the speaker (320). For example, a first region (331, see FIG. 5A) of the frame (330) may be disposed on a second side (322) of the speaker (320).

[0086] In one embodiment, at least a portion of the frame (330) may be positioned on a side (323) of the speaker (320). For example, the second region (332) of the frame (330) may be positioned on a side (323) of the speaker (320).

[0087] In one embodiment, the second region (332) of the frame (330) may be disposed on some of the side surfaces (323) of the speaker (320). For example, the second region (332) may be disposed on the first side surface (323a), the second side surface (323b), and the third side surface (323c).

[0088] FIG. 5a, FIG. 5b and FIG. 5c are drawings showing a frame (330) according to one embodiment of the present disclosure.

[0089] Fig. 5a is a perspective view showing a frame (330) that has undergone the first process. Fig. 5b is a perspective view showing a frame (330) that has been manufactured through the first and second processes. Fig. 5c is a plan view showing a frame (330) that has been manufactured.

[0090] In describing a frame (330) according to one embodiment of the present disclosure, the length direction of the frame (330) may mean the X-axis direction, and the width direction of the frame (330) may mean the Y-axis direction. The height direction of the frame (330) may mean the Z-axis direction.

[0091] In one embodiment, the frame (330) may include a first region (331), a second region (332), and / or a connection region (333).

[0092] Referring to FIGS. 5a and 5b, the frame (330) can be manufactured through the first process and the second process.

[0093] In one embodiment, the first process may be a stamping process that forms the first region (331), the second region (332), and the connection region (333) parallel to each other.

[0094] In one embodiment, the second process may be a bending process that bends a portion of the connection region (333) such that the second region (332) is formed substantially perpendicular to the first region (331).

[0095] Referring to FIG. 5A, a frame (330) that has undergone a first process (e.g., a stamping process) may have a first region (331), a second region (332), and a connection region (333) formed parallel to each other. For example, in the frame (330) that has undergone the first process, the first region (331), the second region (332), and the connection region (333) may be formed substantially parallel to a plane parallel to the longitudinal direction (e.g., X-axis direction) and the width direction (e.g., Y-axis direction) of the frame (330), respectively.

[0096] FIG. 5b may be a drawing showing a frame (330) manufactured by applying a second process (e.g., a bending process) to the frame (330) of FIG. 5a. Referring to FIG. 5b, the manufactured frame (330) may have a first region (331) and a second region (332) formed substantially perpendicularly.

[0097] In one embodiment, the first region (331) may be a region disposed on one side of the speaker (320, see FIG. 4). For example, the first region (331) may be a region disposed on the second side (322, see FIG. 4) of the speaker (320, see FIG. 4).

[0098] In one embodiment, the first region (331) may be formed in a shape corresponding to the perimeter of one side of the speaker (320, see FIG. 4). For example, if one side of the speaker (320, see FIG. 4) is formed in a rectangular cross-section, the first region (331) may extend with a rectangular perimeter shape.

[0099] In one embodiment, the frame (330) may include a frame opening (335). In one embodiment, the first region (331) may be formed to surround the frame opening (335). For example, referring to FIGS. 5B and 5C , the first region (331) may extend in a rectangular perimeter shape, and the frame opening (335) may be formed in an inner direction of the first region (331).

[0100] Referring to FIG. 5b, the frame opening (335) is illustrated as being formed in a rectangular shape, but this is exemplary, and the shape of the frame opening (335) may not be limited thereto.

[0101] In one embodiment, the first region (331) may be adhered to one surface of the speaker (320, see FIG. 4) using a separate adhesive material (e.g., double-sided tape, bond). Alternatively, the first region (331) may be arranged in a form in which it is not adhered to one surface of the speaker (320, see FIG. 4) but simply comes into contact with it.

[0102] In one embodiment, the second region (332) may be disposed on a side (323, see FIG. 4) of the speaker (320, see FIG. 4). At least a portion of the second region (332) may be disposed substantially parallel to the side (323, see FIG. 4) of the speaker (320, see FIG. 4).

[0103] In one embodiment, the second region (332) may include a first side region (3321), a second side region (3322), and / or a bend region (3323). Referring to FIG. 5B, the first side region (3321) and the second side region (3322) may be formed substantially perpendicular to the first region (331). The bend region (3323) may be a region that bends and extends between the first side region (3321) and the second side region (3322).

[0104] In one embodiment, the first side region (3321) is connected to the connection region (333) and may be formed parallel to the side surface (323, see FIG. 4) of the speaker (320, see FIG. 4).

[0105] In one embodiment, the first side region (3321) and the second side region (3322) may be formed parallel to each other.

[0106] In one embodiment, the second region (332) may be more advantageous in absorbing external impacts by including a bending region (3323). For example, since the second region (332) is bent and extended at least in part by including the bending region (3323), it may be more advantageous in absorbing external impacts than if the second region (332) were to extend in a straight line and parallel. When the frame (330) receives an external impact, the second region (332) may elastically move at least in part through the bending region (3323) to absorb the external impact.

[0107] In one embodiment, the connecting region (333) may be a region that is bent at least in part and connects the first region (331) and the second region (332). At least a portion of the connecting region (333) may be bent through a second process (e.g., a bending process) during the manufacturing process of the frame (330).

[0108] In one embodiment, at least a portion of the frame (330) can be elastically moved by an external impact applied to the frame (330). For example, when an external impact is applied to the second region (332) and / or the connection region (333) of the frame (330), the frame (330) can be elastically moved by bending and extending at least a portion of the connection region (333). The connection region (333) and the second region (332) can be elastically moved and absorb a portion of the external impact applied toward the speaker (320, see FIG. 4).

[0109] In one embodiment, the frame (330) may include stainless steel (STS). For example, the frame (330) may be formed by processing a stainless steel material through a first process and a second process.

[0110] In one embodiment, the frame (330) may include a material having an elastic material. The frame (330) may include a material having an elastic material to absorb a portion of an external impact applied toward the speaker (320, see FIG. 4).

[0111] In one embodiment, the frame (330) may include a plurality of second regions (332). For example, the frame (330) may include three second regions (332). Referring to FIGS. 5b and 5c, the second regions (332) may include a 2-1 region (332a), a 2-2 region (332b), or a 2-3 region (332c). The 2-1 region (332a) may be a region disposed on a first side (323a) of the speaker (320). The 2-2 region (332b) may be a region disposed on a second side (323b) of the speaker (320). The 2-3 region (332c) may be a region disposed on a third side (323c) of the speaker (320).

[0112] In one embodiment, the second-1 region (332a) and the second-3 region (332c) may extend along the longitudinal direction (e.g., X-axis direction) of the frame (330). The second-2 region (332b) may extend along the width direction (e.g., Y-axis direction) of the frame (330).

[0113] Referring to FIGS. 5B and 5C, although the frame (330) is illustrated as including three second regions (332), this is exemplary and the number of second regions (332) may not be limited thereto. For example, the frame (330) may include four or more second regions (332). Alternatively, the frame (330) may include two or fewer second regions (332).

[0114] Referring to FIGS. 5B and 5C, the second region (332) is illustrated as extending substantially perpendicularly to the connection region (333) in one direction relative to the connection region (333), but this is exemplary, and the form in which the second region (332) extends may not be limited thereto. For example, the second region (332) may extend substantially perpendicularly to the connection region (333) in one direction and in another direction opposite to the one direction relative to the connection region (333). When the second region (332) extends substantially perpendicularly to the connection region (333) in one direction and in the other direction relative to the connection region (333), the second region (332) and the connection region (333) may be formed to include a “T” shape or an inverted “T” shape when looking at the side (323) of the speaker (320).

[0115] FIGS. 6A and 6B are drawings showing a speaker (320) and a support member (350) arranged in a housing (310) according to one embodiment of the present disclosure.

[0116] Fig. 6a is a drawing showing a speaker (320) placed in a housing (310). Fig. 6b is a drawing showing a support member (350) placed in the housing (310) and covering the speaker (320).

[0117] Referring to FIG. 6a, a speaker (320) may be placed in a portion of the housing (310) (e.g., the mounting space (311) of FIG. 3). The mounting space (311, see FIG. 3) may be surrounded by a side wall (313) of the housing (310).

[0118] In one embodiment, a speaker (320) disposed in a housing (310) may be surrounded by a side wall (313) of the housing (310). In one embodiment, a side surface (323) of the speaker (320) may be disposed to face the side wall (313) of the housing (310).

[0119] In one embodiment, the frame (330) may be placed on the speaker (320). The frame (330) may be placed in simple contact with the speaker (320) or may be placed by being adhered to the speaker (320) using a separate adhesive member.

[0120] In one embodiment, at least a portion of the frame (330) may be positioned to be spaced apart from at least a portion of the housing (310). For example, referring to FIG. 6A, the second region (332) of the frame (330) may be positioned to be spaced apart from the side wall (313) of the housing (310). However, the arrangement relationship between the frame (330) and the side wall (313) is not limited thereto, and according to one embodiment, the second region (332) of the frame (330) may be positioned to be in contact with the side wall (313) of the housing (310) in some area.

[0121] When an external impact is applied to the electronic device (300), the speaker (320) may come into contact with the internal mechanism of the electronic device (300) while moving from a predetermined position. The speaker (320) may come into contact with the internal mechanism of the electronic device (300) and may be damaged by receiving the impact. According to one embodiment, the electronic device (300) may reduce the impact directly applied to the speaker (320) since the frame (330) disposed on the speaker (320) absorbs the impact. For example, when an external impact is applied to the electronic device (300), at least a portion of the frame (330) (e.g., the second region (332)) may come into contact with the side wall (313) of the housing (310) and move elastically, thereby absorbing a portion of the impact that may be directly applied to the speaker (320). An electronic device (300) according to one embodiment can reduce the impact directly applied to the speaker (320) to prevent the speaker (320) from being damaged and maintain the waterproof and dustproof performance of the speaker (320).

[0122] Referring to FIGS. 6A and 6B, the support member (350) may be positioned to cover the speaker (320), the frame (330), and the printed circuit board (340). For example, the speaker (320), the frame (330), and the printed circuit board (340) may be positioned between the housing (310) and the support member (350).

[0123] In one embodiment, the support member (350) may serve to secure the speaker (320) and the printed circuit board (340) so that they remain in a fixed position. In one embodiment, the support member (350) may serve to support the speaker (320) and the printed circuit board (340).

[0124] In one embodiment, the support member (350) may be coupled to the housing (310) using a joining member (351). The joining member (351) according to one embodiment may include a bolt and / or a rivet. In one embodiment, the support member (350) may be coupled to the housing (310) using a plurality of joining members (351).

[0125] FIG. 7 is a drawing showing a speaker (320) and a frame (330) according to one embodiment of the present disclosure.

[0126] FIG. 7 may be a drawing showing a frame (330) placed on a speaker (320) in a direction opposite to the arrangement direction of the frame (330) illustrated in FIG. 4. For example, FIG. 7 may be a drawing showing a speaker (320) and a frame (330) when a first area (331) of the frame (330) is placed on a first face (321) of the speaker (320), and FIG. 4 may be a drawing showing a speaker (320) and a frame (330) when a first area (331) of the frame (330) is placed on a second face (322) of the speaker (320).

[0127] In one embodiment, the frame (330) may be disposed at least partially on a first surface (321) of the speaker (320). For example, referring to FIG. 7, the first region (331) of the frame (330) may be disposed on the first surface (321) of the speaker (320). The first surface (321) of the speaker (320) may be a surface facing the negative Z-axis direction of the speaker (321).

[0128] In one embodiment, the second region (332) of the frame (330) may be positioned on a side (323) of the speaker (320). For example, the second region (332) may be positioned on the first side (323a), the second side (323b), and the third side (323c). The second region (332) may not be positioned on the fourth side (323d).

[0129] In one embodiment, the frame (330) may not be disposed on at least one side of the speaker (320). For example, the frame (330) may be disposed on the first side (321) and the side (323) of the speaker (320), and may not be disposed on the second side (322) of the speaker (320).

[0130] FIG. 8 is an exploded perspective view of an electronic device (300) according to one embodiment of the present disclosure.

[0131] Referring to FIG. 8, an electronic device (300) according to one embodiment may include a speaker (320) in which a first area (331) of a frame (330) is disposed on a first surface (321) of the speaker (320).

[0132] In one embodiment, the stacking order of the components of the electronic device (300) may vary based on the arrangement relationship between the speaker (320) and the frame (330). The stacking order of the components of the electronic device (300) may vary based on the surface of the speaker (320) on which the first area (331) of the frame (330) is arranged. For example, in the electronic device (300) of FIG. 8, the first area (331) of the frame (330) is arranged on the first surface (321) of the speaker (320), and in the electronic device (300) of FIG. 3, the first area (331) of the frame (330) is arranged on the second surface (322) of the speaker (320). Therefore, the stacking order of the components of the electronic device (300) of FIG. 8 may be formed differently from that of the electronic device (300) of FIG. 3.

[0133] Referring to FIG. 3, when the first region (331) of the frame (330) is placed on the second surface (322) of the speaker (320), the housing (310), the speaker (320), the printed circuit board (340), and the support member (350) may be stacked in the following order based on the height direction (e.g., Z-axis direction) of the electronic device (300). Referring to FIG. 8, when the first region (331) of the frame (330) is placed on the first surface (321) of the speaker (320), the housing (310), the printed circuit board (340), the speaker (320), and the support member (350) may be stacked in the following order based on the height direction (e.g., Z-axis direction) of the electronic device (300).

[0134] In one embodiment, the printed circuit board (340) may be positioned at least partially in an opposite direction to the direction in which the first region (331) of the frame (330) is positioned relative to the speaker (320). For example, referring to FIG. 8, when the first region (331) of the frame (330) is positioned in the negative Z-axis direction relative to the speaker (320), the printed circuit board (340) may be positioned in the positive Z-axis direction relative to the speaker (320).

[0135] FIG. 9a and FIG. 9b are drawings showing a speaker (320) and a frame (930) according to one embodiment of the present disclosure.

[0136] FIG. 9a is a drawing showing a state before a frame (930) according to one embodiment is placed on a speaker (320). FIG. 9b is a drawing showing a state when a frame (930) according to one embodiment is placed on a speaker (320).

[0137] Referring to FIG. 9A, a frame (930) according to one embodiment may include a first region (931), a second region (932), and / or a connection region (933).

[0138] Referring to FIG. 9A, the first region (931) of the frame (930) according to one embodiment may include a plate shape that is substantially parallel to one side of the speaker (320). For example, referring to FIG. 9B, the first region (931) of the frame (930) may be formed in a plate shape that is formed parallel to the first side (321) of the speaker (320).

[0139] The second region (932) and the connection region (933) of the frame (930) of FIGS. 9a and 9b can be formed substantially identically to the second region (332) and the connection region (333) of the frame (330) of FIG. 5b, respectively.

[0140] Referring to FIG. 9B, the first region (931) of the frame (930) according to one embodiment may be disposed on the first surface (321) of the speaker (320). For example, the first region (931) of the frame (930) may be disposed to cover at least a portion of the first surface (321) of the speaker (320).

[0141] In FIG. 9B, the frame (930) according to one embodiment is illustrated as being positioned such that the first region (931) is positioned on the first face (321) of the speaker (320), but this is merely exemplary, and the direction in which the frame (930) is positioned may not be limited thereto. For example, the frame (930) may also be positioned such that the first region (931) is positioned on the second face (322) of the speaker (320).

[0142] In the case where the first region (931) of the frame (930) according to one embodiment is formed in a plate shape, the first region (931) is in contact with and supported by the entire surface of the speaker (320), so that the frame (930) can be easily fixed and maintained at a set position in the speaker (320).

[0143] FIG. 10 is a drawing showing a housing (310) according to one embodiment of the present disclosure.

[0144] Referring to FIG. 10, an electronic device (300) according to one embodiment can secure an additional resonance space (315) in a housing (310). The additional resonance space (315) may be an area formed by removing a separate guide structure from a portion of a side wall (313) of the housing (310) surrounding the mounting space (311).

[0145] According to one embodiment, the side wall (313) of the housing (310) may be formed in a form in which a guide structure corresponding to the additional resonance space (315) is removed. For example, since the electronic device (300) according to one embodiment includes a frame (330) disposed on the speaker (320), a separate guide structure for supporting the speaker (320) may not be formed on the side wall (313) of the housing (310). Since a separate guide structure is not formed on the side wall (313) of the housing (310), an additional resonance space (315) may be secured in the portion from which the guide structure is removed. In one embodiment, the sum of the additional resonance spaces (315) secured in the portion from which the guide structure is removed may be approximately 0.04 cc.

[0146] An additional resonance space (315) secured by an electronic device (300) according to one embodiment may be formed at a position corresponding to a position where a second region (332, see FIG. 5b) of a frame (330, see FIG. 5b) is arranged. For example, when a part of a second region (332, see FIG. 5b) of a frame (330, see FIG. 5b) is arranged to face a side wall (313) located in the negative Y-axis direction in a mounting space (311), the second region (332, see FIG. 5b) can support the speaker (320, see FIG. 4) instead of an existing guide structure between the speaker (320, see FIG. 4) and the side wall (313), so that the guide structure can be removed from the side wall (313) located in the negative Y-axis direction in the mounting space (311), thereby forming an additional resonance space (315).

[0147] FIG. 11 is a graph (1100) showing the amount of impact measured in a drop test of an electronic device (300) according to one embodiment of the present disclosure.

[0148] In one embodiment, the amount of impact applied to the speaker (320) can be measured through a drop test of the electronic device (300). For example, the amount of impact applied to the speaker (320) can be measured after the electronic device (300) is dropped from a predetermined distance and collides with an external object.

[0149] The horizontal axis (t) of the graph (1100) illustrated in FIG. 11 may represent the elapsed time from the time the electronic device (300) collides with an external object. The vertical axis (Mpa) of the graph (1100) illustrated in FIG. 11 may represent a measurement value of the amount of impact applied to the speaker (320) at a specific time (t).

[0150] The graph (1100) of FIG. 11 may include a first measurement line (1101) and a second measurement line (1102). The first measurement line (1101) may refer to a measurement value of an amount of impact applied to a speaker (320) when a drop test is performed on an electronic device according to an existing structure (e.g., an electronic device that does not include a frame (330). The second measurement line (1102) may refer to a measurement value of an amount of impact applied to a speaker (320) when a drop test is performed on an electronic device (300) that includes a frame (330) according to one embodiment.

[0151] When a drop test is performed on the electronic device (300), an external impact may be applied to the electronic device (300). The first measurement line (1101) and the second measurement line (1102) may include a first high point (1101a, 1102a) and a second high point (1101b, 1102b), respectively. The first high point (1101a, 1102a) may refer to an impact value directly transmitted to the speaker (320) when the electronic device (300) collides with an external object. The second high point (1101b, 1102b) may refer to an impact value transmitted to the speaker (320) when the speaker (320) moves due to an external collision between the electronic device (300) and the speaker and comes into contact with an internal mechanism of the electronic device (300). Referring to FIG. 11, the second high point (1101b, 1102b) can be formed larger than the first high point (1101a, 1102a).

[0152] When an electronic device receives an external impact, the speaker (320) directly transmits the impact to the electronic device according to the existing structure, but in the electronic device (300) according to one embodiment, the frame (330) absorbs some of the impact applied to the speaker (320), so that the amount of impact directly received by the speaker (320) can be reduced. Referring to the first measurement line (1101) and the second measurement line (1102) illustrated in FIG. 11, when a drop test is performed on an electronic device (300) including a frame (330) according to one embodiment, the first peak point (1102a) and the second peak point (1102b) of the impact amount can be formed to be smaller than the first peak point (1101a) and the second peak point (1101b) of the impact amount when a drop test is performed on an electronic device according to the existing structure. For example, an electronic device according to an existing structure may have a second peak (1101b) of impact formed at approximately 120 MPa, but an electronic device (300) including a frame (330) according to one embodiment may have a second peak (1102b) of impact formed at approximately 80 MPa.

[0153] An electronic device (300) according to one embodiment includes a frame (330) disposed on a speaker (320) to reduce impact directly applied to the speaker (320), thereby preventing the speaker (320) from being damaged and maintaining the waterproof and dustproof performance of the speaker (320).

[0154] FIG. 12 is a graph (1200) showing the sound pressure level of a speaker (320) of an electronic device (300) according to one embodiment of the present disclosure.

[0155] In one embodiment, the sound pressure level of a speaker (320) included in an electronic device (300) may be measured. For example, a sound pressure level (SPL) (e.g., decibel (dB)) according to a frequency (e.g., hertz (Hz)) of the speaker (320) may be measured. The sound pressure level of the speaker (320) may be an indicator of the sound performance of the speaker (320).

[0156] The horizontal axis (Hz) of the graph (1200) illustrated in FIG. 12 may represent the frequency of the speaker (320). The vertical axis (dB) of the graph (1200) illustrated in FIG. 12 may represent a measurement value of the sound pressure level of the speaker (320).

[0157] In one embodiment, the resonant space around the speaker (320) may refer to a space formed around the speaker (320) when the speaker (320) is arranged so that it is surrounded by the housing (310) and the support member (350). In one embodiment, the sound pressure level of the speaker (320) may vary based on the size of the resonant space around the speaker (320).

[0158] The graph (1200) illustrated in FIG. 12 may include a third measurement line (1201), a fourth measurement line (1202), and a fifth measurement line (1203). The third measurement line (1201) may refer to a sound pressure level value of a speaker (320) measured in an electronic device (300) in which a resonance space around the speaker (320) is formed relatively small. The fifth measurement line (1203) may refer to a sound pressure level value of a speaker (320) measured in an electronic device (300) in which a resonance space around the speaker (320) is formed relatively large.

[0159] In one embodiment, the fifth measurement line (1203) may represent a sound pressure level value measured in an electronic device (300) having a larger resonance space than that of the electronic device (300) corresponding to the fourth measurement line (1202). The fourth measurement line (1202) may represent a sound pressure level value measured in an electronic device (300) having a larger resonance space than that of the electronic device (300) corresponding to the third measurement line (1201). For example, the fifth measurement line (1203) may represent a sound pressure level value measured in an electronic device (300) having a resonance space of approximately 0.36 cc. The fourth measurement line (1202) may represent a sound pressure level value measured in an electronic device (300) having a resonance space of approximately 0.26 cc. The third measurement line (1201) may represent a sound pressure level value measured in an electronic device (300) in which a resonance space is formed to be approximately 0.23 cc.

[0160] Referring to the graph (1200) illustrated in FIG. 12, the sound pressure level measurement value of the speaker (320) may vary based on the size of the resonance space around the speaker (320). For example, in a low frequency band (e.g., 100 Hz to 400 Hz), the larger the resonance space formed around the speaker (320), the larger the sound pressure level measurement value of the speaker (320). Referring to FIG. 12, the sound pressure level value of the fifth measurement line (1203), which is a case where the resonance space is formed relatively large, may be greater than the sound pressure level values ​​of the fourth measurement line (1202) and the third measurement line (1201).

[0161] An electronic device (300) according to one embodiment can form a relatively large sound pressure level of a speaker (320) in a low frequency band. For example, an electronic device (300) according to one embodiment can secure an additional resonance space (315, see FIG. 10) by including a frame (330) placed on the speaker (320), so that a relatively large sound pressure level of the speaker (320) can be formed in a low frequency band.

[0162] An electronic device (300) according to one embodiment of the present disclosure may include a housing (310) including a mounting space (311), a speaker (320) disposed in the mounting space (311), and a frame (330) disposed on at least a portion of the speaker (320).

[0163] In one embodiment, the frame (330) may include a first region (331) disposed on one side of the speaker (320) and extending parallel to one side (321, 322) of the speaker (320), a second region (332) disposed on a side surface (323) of the speaker (320) forming a perimeter of the speaker (320) and extending parallel to the side surface (323) of the speaker, and a connecting region (333) that is bent at least in part and connects the first region (331) and the second region (332).

[0164] In one embodiment, when an external impact is applied to the electronic device (300), at least a portion of the second region (332) may be elastically moved by coming into contact with the side wall (313) of the housing (310) surrounding the seating space (311).

[0165] In one embodiment, the connecting region (333) may extend from the first region (331), be bent at least in part, and have an end extending parallel to a side surface (323) of the speaker (320).

[0166] In one embodiment, the second region (332) may extend vertically from the end of the connection region (333).

[0167] In one embodiment, the second region (332) may include a first side region (3321) that is connected to the connection region (333) and extends parallel to the side surface (323) of the speaker (320), a bend region (3323) that is bent and extends from the first side region (3321), and a second side region (3322) that is connected to the bend region (3323) and extends parallel to the side surface (323) of the speaker (320).

[0168] In one embodiment, a plurality of second regions (332) and connection regions (333) are formed, and the plurality of second regions (332) can be formed to face different directions.

[0169] In one embodiment, the electronic device (300) may include a printed circuit board (340) electrically connected to a speaker (320) and a support member (350) positioned to cover the speaker (320) and the printed circuit board (340).

[0170] In one embodiment, the speaker (320) and frame (330) may be positioned between the housing (310) and the support member (350).

[0171] In one embodiment, the housing (310), speaker (320), printed circuit board (340), and support member (350) are stacked in the order of the height direction of the electronic device (300), and the first region (331) of the frame (330) can be placed on a surface facing the housing (310) from the speaker (320).

[0172] In one embodiment, the housing (310), the printed circuit board (340), the speaker (320), and the support member (350) are stacked in that order based on the height direction of the electronic device (300), and the first region (331) of the frame (330) can be placed on a surface facing the support member (350) from the speaker (320).

[0173] In one embodiment, the frame (330) may include a frame opening (335) formed in the inner direction of the first region (331).

[0174] In one embodiment, the first region (331) may be formed in a plate shape covering one surface of the speaker (320).

[0175] In one embodiment, the frame (330) may comprise stainless steel.

[0176] In one embodiment, when an external impact is applied to the electronic device (300), at least a portion of the frame (330) can be elastically moved to reduce the impact applied to the speaker (320) along the width direction of the electronic device (300) or the length direction of the electronic device (300).

[0177] In one embodiment, the frame (330) can be manufactured through a first process of forming a first region (331), a second region (332), and a connection region (333) in parallel, and a second process of bending the connection region (333) so that the second region (332) is formed perpendicular to the first region (331).

[0178] A speaker device according to one embodiment of the present disclosure includes a speaker (320) and a frame (330) disposed on at least a portion of the speaker (320), wherein the frame (330) includes a first region (331) disposed on one surface of the speaker (320) and extending parallel to the one surface of the speaker (320), a second region (332) disposed on a side surface (323) of the speaker (320) forming a perimeter of the speaker (320) and extending parallel to the side surface (323) of the speaker (320), and a connecting region (333) that is bent at least in a portion and connects the first region (331) and the second region (332).

[0179] When an external impact is applied to the speaker device, at least a portion of the second region (332) can be elastically moved.

[0180] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0181] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0182] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0183] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0184] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0185] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0186] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (300), A housing (310) including a settling space (311); A speaker (320) placed in the above-mentioned settling space; and A frame (330) is included that is placed on at least a part of the above speaker, The above frame is, A first region (331) arranged on one side of the speaker and extending parallel to the one side of the speaker; A second region (332) is arranged on the side of the speaker forming the perimeter of the speaker and extending parallel to the side of the speaker; and At least part of it is bent and includes a connecting region (333) connecting the first region and the second region, An electronic device in which, when an external impact is applied to the electronic device, at least a part of the second region is elastically moved by coming into contact with the side wall (313) of the housing surrounding the mounting space.

2. In paragraph 1, The above connection area is, An electronic device extending from said first region, bent at least in part, and having an end extending parallel to a side of said speaker.

3. In paragraph 2, The second area above is, An electronic device extending vertically from the end of the above connection area.

4. In paragraph 1, The second area above is, A first side region (3321) connected to the above connection region and extending parallel to the side of the speaker; A bending region (3323) that is bent and extended in the first side region; and An electronic device comprising a second side region (3322) connected to the above bending region and extending parallel to a side surface of the speaker.

5. In paragraph 1, The above second region and the above connection region are formed in multiple numbers, The above plurality of second regions are, Electronic devices formed to face different directions.

6. In paragraph 1, A printed circuit board (340) electrically connected to the above speaker; and It further includes a support member (350) arranged to cover the above speaker and the printed circuit board, The above speaker and the above frame, An electronic device disposed between the housing and the support member.

7. In paragraph 6, Based on the height direction of the above electronic device The housing, the speaker, the printed circuit board, and the support member are laminated in that order. The first region of the above frame is, An electronic device positioned on the surface of the speaker facing the housing.

8. In paragraph 6, Based on the height direction of the above electronic device The housing, the printed circuit board, the speaker, and the support member are laminated in that order. The first region of the above frame is, An electronic device positioned on a surface of the speaker facing the support member.

9. In paragraph 1, The above frame is, An electronic device further comprising a frame opening (335) formed in the inner direction of the first region.

10. In paragraph 1, The above first area is, An electronic device formed in a plate shape covering one side of the above speaker.

11. In paragraph 1, The above frame is, An electronic device comprising stainless steel.

12. In paragraph 1, The above frame is, An electronic device in which, when an external impact is applied to the electronic device, at least a portion thereof is elastically moved to reduce the impact applied to the speaker along the width direction of the electronic device or the length direction of the electronic device.

13. In paragraph 1, The above frame is, A first process for forming the first region, the second region and the connection region in parallel; and An electronic device manufactured through a second process of bending the connecting region so that the second region is formed perpendicular to the first region.

14. In the speaker device, speaker (320); and A frame (330) is included that is placed on at least a part of the above speaker, The above frame is, A first region (331) arranged on one side of the speaker and extending parallel to the one side of the speaker; A second region (332) is arranged on the side of the speaker forming the perimeter of the speaker and extending parallel to the side of the speaker; and At least part of it is bent and includes a connecting region (333) connecting the first region and the second region, A speaker device in which at least a portion of the second region moves elastically when an external impact is applied to the speaker device.

15. In paragraph 14, The above connection area is, A speaker device extending from the first region, being bent at least in part, and having an end extending parallel to a side of the speaker.

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