Camera module and electronic device comprising same

Abstract

Disclosed is a camera module comprising: a lens including an optical axis; a lens housing configured to accommodate the lens; an image sensor configured to receive light passing through the lens; a connector configured to receive an electrical signal from the image sensor; and a flexible printed circuit board (FPCB) configured to connect the image sensor and the connector to each other. The FPCB may be configured to change between a first shape in which the FPCB extends substantially linearly between the image sensor and the connector and a second shape in which the FPCB has at least three bending areas, at least two folding areas, and at least two side areas along the circumference of the image sensor.

Description

Camera module and electronic device including same

[0001] The disclosure relates to a camera module, for example, a camera module configured to stabilize an image. The disclosure also relates to an electronic device comprising the camera module.

[0002] Image stabilizers can be used to eliminate the effects of image shake when photographing a subject. For example, image stabilizers can utilize methods such as shifting at least one lens, shifting an optical system (e.g., a prism or mirror), or shifting a module.

[0003] The background technology described above is informational and cannot necessarily be said to be a publicly known technology disclosed to the general public at the time of application of this application.

[0004] According to one aspect of the disclosure, a camera module may be provided, comprising: a lens including an optical axis; a lens housing configured to accommodate the lens; an image sensor configured to receive light passing through the lens; a connector configured to receive an electrical signal from the image sensor; and a flexible printed circuit board (FPCB) configured to connect the image sensor and the connector, wherein the FPCB is configured to change shape between a first configuration in which the FPCB is configured to extend substantially linearly between the image sensor and the connector, and a second configuration in which the FPCB has at least three bending regions, at least two folding regions, and at least two side regions along a perimeter of the image sensor.

[0005] The FPCB comprises a first bending region connected to the image sensor and configured to bend in a first direction with respect to the image sensor, a first folding region configured to fold in a second direction substantially orthogonal to the first direction with respect to the first bending region, a first side region connected to the first folding region and configured to extend in the second direction along the periphery of the image sensor, a second bending region connected to the first side region and configured to bend in a third direction substantially orthogonal to the first direction and the second direction, a second side region connected to the second bending region and configured to extend in the third direction along the periphery of the image sensor, a second folding region connected to the second side region and configured to fold in a fourth direction opposite to the first direction, and a third bending region connected to the second folding region, wherein the third bending region is configured to bend toward the connector and is connected to the connector. The third bending region may be configured to include the third bending region.

[0006] The first side region and the second side region may be on a plane different from a plane of the image sensor.

[0007] The camera module may further include an actuator configured to apply a force to the first side region and / or the second side region.

[0008] The FPCB may further include a fourth bending region connected to the second side region and configured to bend in a fifth direction opposite to the second direction, and a third side region connected to the fourth bending region and the second folding region and configured to extend in the fifth direction along the periphery of the image sensor.

[0009] The above FPCB may include a first FPCB and a second FPCB.

[0010] The first FPCB and the second FPCB may be arranged symmetrically with respect to each other with respect to a plane including the optical axis.

[0011] The FPCB may further include a first base region configured to connect the image sensor and the first bending region, and / or a second base region configured to connect the third bending region and the connector.

[0012] The first folding region may be configured to fold inwardly and / or outwardly, and the second folding region may be configured to fold inwardly and / or outwardly.

[0013] The first folding area and the second folding area may have a curvature configured to be folded without causing cracks in the FPCB.

[0014] The FPCB may further include a reinforcing member provided in at least one bending area among the first bending area, the second bending area, or the third bending area.

[0015] The camera module may further include a camera housing configured to support at least one bending area among the first bending area, the second bending area, or the third bending area.

[0016] The FPCB may further include a cured bonding and / or fixing portion provided in the first folding area and / or the second folding area.

[0017] The camera module further includes a carrier configured to carry the lens housing, wherein the carrier can be provided between the lens housing and the image sensor.

[0018] The FPCB may further include a fourth bending region configured to be connected to the second side region and configured to bend in a fifth direction opposite to the second direction, a third side region configured to be connected to the fourth bending region and configured to extend in the fifth direction along a perimeter of the image sensor, a fifth bending region configured to be connected to the third side region and configured to bend in a sixth direction opposite to the third direction, a fourth side region configured to be connected to the fifth bending region and configured to extend in the sixth direction along a perimeter of the image sensor, a sixth bending region configured to be connected to the fourth side region and configured to bend in the second direction, and a fifth side region configured to be connected to the sixth bending region and the second folding region and configured to extend in the second direction.

[0019] The fifth side region may at least partially overlap the first side region.

[0020] The FPCB may further include a third folding region configured to be connected to the image sensor and the first bending region and configured to be folded in a direction substantially orthogonal to the first direction and the second direction, respectively.

[0021] The above camera module may be included in an electronic device.

[0022] According to one aspect of the disclosure, there is provided a flexible printed circuit board (FPCB) comprising: a lens including an optical axis, a lens housing configured to accommodate the lens, an image sensor configured to receive light passing through the lens, a connector configured to receive an electrical signal from the image sensor, and a flexible printed circuit board (FPCB) configured to connect the image sensor and the connector, wherein the FPCB comprises: a first bending region connected to the image sensor and configured to bend in a first direction relative to the image sensor, a first folding region configured to fold in a second direction substantially orthogonal to the first direction relative to the first bending region, a first side region configured to be connected to the first folding region and configured to extend in the second direction along a periphery of the image sensor, a second bending region configured to be connected to the first side region and configured to bend in a third direction substantially orthogonal to the first direction and the second direction, and a second bending region configured to be connected to the second bending region and configured to extend in the third direction along a periphery of the image sensor. A camera module may be provided comprising a second side region, a second folding region configured to be connected to the second side region and configured to fold in a fourth direction opposite to the first direction, and a third bending region connected to the second folding region, the third bending region being configured to bend toward the connector and configured to be connected to the connector.

[0023] According to one aspect of the disclosure, there is provided a flexible printed circuit board (FPCB) comprising: a lens including an optical axis, a lens housing configured to accommodate the lens, an image sensor configured to receive light passing through the lens, a connector configured to receive an electrical signal from the image sensor, and a flexible printed circuit board (FPCB) configured to connect the image sensor and the connector, wherein the FPCB comprises: a first bending region configured to be connected to the image sensor and configured to bend in a first direction relative to the image sensor, a first folding region configured to be connected to the first bending region and configured to fold in a second direction substantially orthogonal to the first direction, a first side region configured to be connected to the first folding region and configured to extend in the second direction along a periphery of the image sensor, a second bending region configured to be connected to the first side region and configured to bend in a third direction substantially orthogonal to the first direction and the second direction, and a second bending region configured to be connected to the second bending region and configured to bend in the third direction along a periphery of the image sensor. A second side region configured to extend, a third bending region configured to be connected to the second side region and configured to bend in a fourth direction opposite to the second direction, a third side region configured to be connected to the third bending region and configured to extend in the fourth direction along the periphery of the image sensor, a fourth bending region configured to be connected to the third side region and configured to bend in a fifth direction opposite to the third direction, a fourth side region configured to be connected to the fourth bending region and configured to extend in the fifth direction along the periphery of the image sensor, a fifth bending region configured to be connected to the fourth side region and configured to bend in the second direction, a fifth side region configured to be connected to the fifth bending region and configured to extend in the second direction,A camera module may be provided, comprising a second folding region configured to be connected to the fifth side region and configured to fold in a sixth direction opposite to the first direction, and a sixth bending region connected to the second folding region, wherein the sixth bending region is configured to bend toward the connector and is configured to be connected to the connector.

[0024] According to one aspect of the disclosure, there is provided a flexible printed circuit board (FPCB) comprising: a lens including an optical axis, a lens housing configured to accommodate the lens, an image sensor configured to receive light passing through the lens, a connector configured to receive an electrical signal from the image sensor, and a flexible printed circuit board (FPCB) configured to connect the image sensor and the connector, wherein the FPCB comprises: a first folding region configured to be connected to the image sensor and configured to fold in a first direction relative to the image sensor, a first bending region configured to be connected to the first folding region and configured to bend in a second direction substantially orthogonal to the first direction, a second folding region configured to be connected to the first bending region and configured to fold in a third direction substantially orthogonal to the first direction and the second direction, a side region configured to be connected to the second folding region and configured to extend in the third direction along a periphery of the image sensor, and a side region configured to be connected to the side region and configured to be substantially orthogonal to the second direction and the third direction, respectively, and the A camera module may be provided, comprising a second bending region configured to bend in a fourth direction opposite to the first direction, a third folding region configured to be connected to the second bending region and configured to fold in a fifth direction opposite to the second direction, and a third bending region connected to the third folding region, wherein the third bending region is configured to bend toward the connector and the third bending region is configured to be connected to the connector.

[0025] The above and other aspects, features and advantages of one or more embodiments of the present disclosure will become apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0026] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0027] FIG. 2 is a block diagram illustrating a camera module according to one embodiment.

[0028] FIG. 3 is a perspective view of a one-way electronic device according to one embodiment.

[0029] FIG. 4 is a perspective view of an electronic device in another direction according to one embodiment.

[0030] Figure 5 is a perspective view of a camera module according to one embodiment.

[0031] Figure 6 is a plan view of a camera module according to one embodiment.

[0032] Figure 7 is an exploded perspective view of a camera module according to one embodiment.

[0033] Figure 8 is a front perspective view of a connecting assembly according to one embodiment.

[0034] Figure 9 is a rear perspective view of a connecting assembly according to one embodiment.

[0035] FIG. 10 is a drawing showing a bending area of ​​a flexible printed circuit board (FPCB) according to one embodiment.

[0036] Fig. 11 is a drawing showing a folding area of ​​an FPCB according to one embodiment.

[0037] FIG. 12 is a perspective view of a connecting assembly before a portion of an FPCB is bent / folded according to one embodiment.

[0038] FIG. 13 is a perspective view of the connecting assembly of FIG. 12 in which a portion of the FPCB is bent according to one embodiment.

[0039] FIG. 14 is a perspective view of the connecting assembly of FIG. 13 according to one embodiment, with a portion of the FPCB bent / folded.

[0040] FIG. 15 is a plan view of the connecting assembly of FIG. 14 in which a portion of the FPCB is bent according to one embodiment.

[0041] FIG. 16 is a plan view of a connecting assembly showing an FPCB displaced in one direction according to one embodiment.

[0042] FIG. 17 is a plan view of a connecting assembly showing an FPCB displaced in a different direction according to one embodiment.

[0043] Figure 18 is a perspective view of a connecting assembly according to one embodiment.

[0044] FIG. 19 is a perspective view of a camera module according to one embodiment.

[0045] Figure 20 is an exploded perspective view of a camera module according to one embodiment.

[0046] Figure 21 is a perspective view of a connecting assembly according to one embodiment.

[0047] FIG. 22 is a side view of a connecting assembly according to one embodiment.

[0048] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0049] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0050] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0051] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0052] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0053] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0054] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0055] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0056] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0057] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0058] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0060] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0061] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0062] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0063] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0064] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0065] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0066] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0067] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0068] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0069] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0070] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0071] Electronic devices according to one or more embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0072] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0073] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0074] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0075] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0076] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0077] FIG. 2 is a block diagram illustrating a camera module according to one embodiment.

[0078] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0079] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0080] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of the memory (130) or as a separate memory that operates independently therefrom.

[0081] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0082] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0083] Figure 3 is a perspective view of an electronic device in one direction according to one embodiment. Figure 4 is a perspective view of an electronic device in another direction according to one embodiment.

[0084] Referring to FIGS. 3 and 4, an electronic device (301) (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a first side (310A) (e.g., a front side), a second side (310B) (e.g., a back side), and a third side (310C) (e.g., a side side) surrounding a space between the first side (310A) and the second side (310B). The first side (310A) may be formed by a first plate (311A) that is at least partially transparent. For example, the first plate (311A) may include a glass plate or a polymer plate that includes at least one coating layer. The second side (310B) may be formed by a second plate (311B) that is substantially opaque. For example, the second plate (311B) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface (310C) may be formed by a frame (311C) that is joined to the first plate (311A) and the second plate (311B) and includes a metal and / or polymer. The second plate (311B) and the frame (311C) may be formed monolithically. The second plate (311B) and the frame (311C) may be formed of substantially the same material (e.g., aluminum).

[0085] The electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may be disposed on the third surface (310C). The input module (350) may include at least one key input device. For example, the key input device may include one or more mechanical actuators (e.g., buttons), one or more capacitors, and / or one or more inductors.

[0086] The electronic device (301) may include an audio output module (355) (e.g., the audio output module (155) of FIG. 1). The audio output module (355) may be disposed on the third surface (310C). The audio output module (355) may include one or more holes.

[0087] The electronic device (301) may include a display module (361) (e.g., the display module (160) of FIG. 1). The display module (361) may be disposed on the first surface (310A). The display module (361) may be visible through at least a portion of the first plate (311A). The display module (361) may have a shape substantially the same as the shape of the outer edge of the first plate (311A). The edge of the display module (361) may substantially coincide with the outer edge of the first plate (311A). The display module (361) may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. The display module (361) may include a screen display area (361A) that is visually exposed and displays content through pixels. The display area (361A) may include a sensing area (361A-1). The sensing area (361A-1) may overlap with at least a portion of the display area (361A). The sensing area (361A-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1 ). The sensing area (361A-1) may display content similarly to the display area (361A) that does not overlap with the sensing area (361A-1). For example, the sensing area (361A-1) may display content while the sensor module (376) is not operating. At least a portion of the camera area (361A-2) may overlap with the display area (361A). The display area (361A) may include the camera area (361A-2). The camera area (361A-2) may allow transmission of an optical signal associated with a first camera module (380A) (e.g., camera module (180) of FIG. 1 and / or camera module (180) of FIG. 2).At least a portion of the camera area (361A-2) overlapping the screen display area (361A) may display content similarly to the screen display area (361A) that does not overlap the camera area (361A-2). For example, the camera area (361A-2) may display content while the first camera module (380A) is not operating.

[0088] The electronic device (301) may include an audio module (370) (e.g., the audio module (170) of FIG. 1). The audio module (370) may be positioned on the third surface (310C). The audio module (370) may obtain sound through at least one hole.

[0089] The electronic device (301) may include a sensor module (376). The sensor module (376) may be disposed on the first surface (310A). The sensor module (376) may form a sensing area (361A-1) in at least a portion of the screen display area (361A). The sensor module (376) may receive an input signal passing through the sensing area (361A-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). The input signal may include a signal related to a user's biometric information (e.g., a fingerprint).

[0090] The electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). The connection terminal (378) may be positioned on the third surface (310C). For example, when the electronic device (301) is viewed in one direction (e.g., the +Y direction), the connection terminal (378) may be positioned substantially in the center of the third surface (310C), and the audio output module (355) may be positioned on one side (e.g., the right) with respect to the connection terminal (378).

[0091] The electronic device (301) may include a first camera module (380A) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The first camera module (380A) may be disposed on the first surface (310A). At least a portion of the first camera module (380A) may be disposed below the display module (361). The first camera module (380A) may receive an optical signal that passes through the camera area (361A-2).

[0092] The electronic device (301) may include a plurality of second camera modules (380B) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The plurality of second camera modules (380B) may be arranged on the second surface (310B). The plurality of second camera modules (380B) may be arranged in a first row in one direction (e.g., the Y direction) of the second plate (311B). The plurality of second camera modules (380B) may have different fields of view. For example, the plurality of second camera modules (380B) may include an ultra wide-angle camera, a wide-angle camera, and / or a tele camera.

[0093] The electronic device (301) may include an optical module (380C) (e.g., a flash (220) of FIG. 2). The optical module (380C) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B). The optical module (380C) may include one or more light-emitting diodes or xenon lamps. The optical module (380C) may include a sensor configured to detect external light. For example, the sensor may include a flicker sensor.

[0094] The electronic device (301) may include a third camera module (380D). The pixels, magnification, and / or field of view of the third camera module (380D) may be different from the pixels, magnification, and / or field of view of at least one second camera module (380B). The third camera module (380D) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B).

[0095] The electronic device (301) may include a fourth camera module (380E). The fourth camera module (380E), which may also be referred to as a "depth camera" or a "time-of-flight (ToF) camera," may be configured to measure a distance between the fourth camera module (380E) and a subject. For example, the fourth camera module (380E) may be configured to measure the distance using at least one or a combination of ultrasound, infrared, or laser. The fourth camera module (380E) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B).

[0096] Meanwhile, one or more embodiments disclosed in this document may be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 3 and 4.

[0097] In this document, terms such as "substantially," "approximately," "typically," and "about" when referring to a given parameter, property, or condition may include the extent to which a person of ordinary skill in the art would understand the given parameter, property, or condition to be satisfied with a small degree of variance, such as within acceptable manufacturing tolerances. For example, a particular parameter that is substantially satisfied may be satisfied at least 90% of the time, at least 95% of the time, or at least 99% of the time.

[0098] Fig. 5 is a perspective view of a camera module according to one embodiment. Fig. 6 is a plan view of a camera module according to one embodiment. Fig. 7 is an exploded perspective view of a camera module according to one embodiment.

[0099] Referring to FIGS. 5 to 7, a camera module (400) (e.g., the camera module (180) of FIG. 1, and / or the camera module (180) of FIG. 2, and / or the first camera module (380A), the second camera module (380B), and / or the third camera module (380D) of FIGS. 3 and 4) may include a lens assembly (410) (e.g., the lens assembly (210) of FIG. 2). The lens assembly (410) may include at least one lens (411) having an optical axis (OA). The optical axis (OA) may be defined as an imaginary line connecting a center of curvature of one side (e.g., a +Z-direction side) of the lens (411) and a center of curvature of the other side (e.g., a -Z-direction side) of the lens (411). The lens assembly (410) may include a lens housing (412), which may also be referred to as a “lens barrel.” The lens housing (412) can be configured to accommodate at least one lens (411).

[0100] The camera module (400) may include a camera housing (420) configured to at least partially accommodate one or more camera-related components (e.g., a lens assembly (410)). The camera housing (420) may include a base plate (420A) and an enclosure (420B) coupled with the base plate (420A) to form a receiving space. The camera module (400) may include a camera cover (421), which may also be referred to as a “shield can.” The camera cover (421) may, together with the camera housing (420), form a space for accommodating one or more camera-related components. The camera housing (420) may have a reduced dimension in the X direction and a reduced dimension in the Y direction. For example, when viewed in the plan view illustrated in FIG. 6, a margin area of ​​the camera housing (420), excluding an area occupied by the camera cover (421), may be reduced by about 7% to about 20%.

[0101] The camera module (400) may include a connecting assembly (430). The connecting assembly (430) may include an image sensor (431) configured to convert light passing through at least one lens (411) into an electrical signal (e.g., the image sensor (230) of FIG. 2). The connecting assembly (430) may include a connector (432) configured to transmit the electrical signal converted by the image sensor (431) to another component (e.g., the processor (120) of FIG. 1 and / or the image signal processor (260) of FIG. 2). The connecting assembly (430) may include a flexible printed circuit board (433) (FPCB) configured to physically and electrically connect the image sensor (431) and the connector (432). The FPCB (433) may extend at least partially along a perimeter of the image sensor (431). The FPCB (433) can surround the lens housing (412).

[0102] The camera module (400) may include an actuator (440) (e.g., the image stabilizer (240) of FIG. 2). The actuator (440) may change the configuration of the FPCB (433) and displace the image sensor (431) by applying a force to at least a portion of the FPCB (433) (e.g., a + / -X direction portion and / or a + / -Y direction portion).

[0103] The actuator (440) may include a carrier (441) configured to carry the lens housing (412). For example, the carrier (441) may carry the lens housing (412) in the + / -X direction and / or the + / -Y direction. The carrier (441) may be surrounded by an FPCB (433).

[0104] In one embodiment, the carrier (441) can carry the lens housing (412) in a direction along the optical axis (OA) (e.g., + / -Z direction). In one embodiment, the camera module (400) can include an additional actuator configured to drive the lens housing (412) in a direction along the optical axis (OA) (e.g., + / -Z direction). The additional actuator can include an additional carrier distinct from the carrier (441).

[0105] The actuator (440) may include a plurality of magnets (442A, 442B), which may also be referred to as “electromagnetic elements.” For example, a first magnet (442A) may be positioned on the carrier (441) in one direction (e.g., + / - X direction), and a second magnet (442B) may be positioned on the carrier (441) in another direction (e.g., + / - Y direction).

[0106] The actuator (440) may include a plurality of coils (443A, 443B), which may also be referred to as “electromagnetic elements.” For example, a first coil (443A) may be configured to electromagnetically couple with a first magnet (442A), and a second coil (443B) may be configured to electromagnetically couple with a second magnet (442B).

[0107] The actuator (440) may include a yoke (444) configured to allow a plurality of coils (443A, 443B) to be arranged thereon. The yoke (444) may provide an electrical path to the plurality of coils (443A, 443B). A portion of the yoke (444) may be connected to a connector (432). The yoke (444) may be arranged in an enclosure (420B).

[0108] The actuator (440) may include a middle guide (445) configured to guide the carrier (441) in various directions (e.g., + / - X direction and / or + / - Y direction). The carrier (441) may be guided in one direction (e.g., + / - Y direction) by a first ball (446A) at least partially accommodated between a groove formed in one or more areas (e.g., corner areas) of one face (e.g., - Z direction face) of the middle guide (445) and a groove formed in one or more areas (e.g., corner areas) of one face (e.g., + Z direction face) of the carrier (441). The middle guide (445) can be guided in the other direction (e.g., + / -X direction) by a second ball (446B) at least partially accommodated between a groove formed in one or more areas (e.g., corner areas) of the other side (e.g., +Z direction side) of the middle guide (445) and a groove formed in one side (e.g., -Z direction side) of the enclosure (420B).

[0109] In one embodiment, the actuator (440) may include a suspension wire, an elastomer (e.g., a spring), a shape memory alloy actuator, or any other suitable type of actuator.

[0110] Fig. 8 is a front perspective view of a connecting assembly according to one embodiment. Fig. 9 is a rear perspective view of a connecting assembly according to one embodiment.

[0111] Referring to FIGS. 8 and 9, the connecting assembly (430) may include an image sensor (431), a connector (432), and an FPCB (433). The FPCB (433) may at least partially include a plurality of prongs. For example, the FPCB (433) may include a first prong (433A) originating from a portion (e.g., closer to the -Y-direction edge) of one edge (e.g., closer to the -X-direction edge) of the image sensor (431), and a second prong (433B) originating from another portion (e.g., closer to the +Y-direction edge) of one edge (e.g., closer to the -X-direction edge) of the image sensor (431). The first prong (433A) and the second prong (433B) may be integrated into a single prong before being connected to the connector (432). In one embodiment, the first branch (433A) and the second branch (433B) may be integrated into a single branch and connected to the image sensor (431). In this document, the first branch (433A) and the second branch (433B) may be referred to as a “first FPCB” and a “second FPCB,” respectively.

[0112] The first branch (433A) may include a bending region B11 that is bent at a first angle (e.g., about 90 degrees) in the first optical axis direction (e.g., +Z direction) with respect to an image sensor (431) placed on a plane (e.g., XY plane). The bending region B11 may be directly connected to the image sensor (431). In one embodiment, the first branch (433A) may include an additional region between the image sensor (431) and the bending region B11. The additional region may be referred to as a “base region.” The additional region may be substantially on the same plane as the image sensor (431).

[0113] The first branch (433A) may include a side region T11 extending substantially in the first optical axis direction (e.g., +Z direction). The side region T11 may be connected to the bending region B11.

[0114] The first branch (433A) may include a folding region F11 folded in a direction (e.g., a -Y direction) substantially orthogonal to the first optical axis direction (e.g., a +Z direction). The folding region F11 may be a region bent inwardly with respect to the side region T11 at a second angle (e.g., about 45 degrees) that is less than the first angle and folded in a direction (e.g., a -Y direction) at a third angle (e.g., about 180 degrees) that is greater than the first angle. In one embodiment, the folding region F11 may be a region bent outwardly with respect to the side region T11 at a second angle and folded in a direction (e.g., a -Y direction) at a third angle. The folding region F11 may be directly connected to the side region T11. In one embodiment, the folding region F11 may be directly connected to the bending region B11 without the side region T11.

[0115] The first branch (433A) may include a side region T12 extending in one direction (e.g., in the -Y direction). The side region T12 may extend along a portion of the perimeter of the image sensor (431) (e.g., along the -X direction edge). The side region T12 may be connected to the folding region F11.

[0116] The first branch (433A) may include a bending region B12 bent in a direction (e.g., +X direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., -Y direction) of the side region T12. The bending region B12 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T12. At least a portion of the bending region B12 may be substantially aligned with a corner region of the image sensor (431) (e.g., a corner region between a -X direction edge and a -Y direction edge) in the first optical axis direction (e.g., +Z direction). The bending region B12 may be connected to the side region T12.

[0117] The first branch (433A) may include a side region T13 extending in a direction (e.g., +X direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., -Y direction) of the side region T12. The side region T13 may extend along a portion of the periphery of the image sensor (431) (e.g., -Y direction edge). The side region T13 may be connected to the bending region B12.

[0118] The first branch (433A) may include a bending region B13 bent in a direction (e.g., +Y direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +X direction) of the side region T13. The bending region B13 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T13. At least a portion of the bending region B13 may be substantially aligned with a corner region of the image sensor (431) (e.g., a corner region between a -Y direction edge and a +X direction edge) in the first optical axis direction (e.g., +Z direction). The bending region B13 may be connected to the side region T13.

[0119] The first branch (433A) may include a side region T14 that is substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction of the side region T13 (e.g., +X direction) and extends in a direction opposite to the extension direction of the side region T12 (e.g., -Y direction) (e.g., +Y direction). The side region T14 may extend along a portion of the periphery of the image sensor (431) (e.g., +X direction edge). The side region T14 may be connected to the bending region B13. The side region T14 may be arranged opposite to the side region T12.

[0120] The first branch (433A) may include a folding region F12 folded in a second optical axis direction (e.g., -Z direction) opposite to the first optical axis direction (e.g., +Z direction). The folding region F12 may be a region bent outwardly with respect to the side region T14 at a second angle (e.g., about 45 degrees) less than the first angle and folded at a third angle (e.g., about 180 degrees) greater than the first angle in the second optical axis direction (e.g., -Z direction). In one embodiment, the folding region F12 may be a region bent inwardly with respect to the side region T14 at a second angle and folded at a third angle in the second optical axis direction (e.g., -Z direction).

[0121] The first branch (433A) may include a side region T15 extending substantially in the second optical axis direction (e.g., -Z direction). The side region T15 may be connected to the folding region F12.

[0122] The first branch (433A) may include a bending area B14 bent in an outward direction (e.g., +X direction) of the image sensor (431) at a first angle (e.g., about 90 degrees) with respect to the second optical axis direction (e.g., -Z direction). The bending area B14 may be an area bent toward the connector (432).

[0123] The first prong (433A) may include a base region T16 connecting the bend region B14 and the connector (432). The base region T16 may be substantially coplanar with the connector (432). The base region T16 may be connected to a portion of the second prong (433B), such as the bend region B24. In one embodiment, the bend region B14 may be directly connected to the connector (432) without the base region T16.

[0124] The second branch (433B) may include a bending area B21 that is bent at a first angle (e.g., about 90 degrees) in the first optical axis direction (e.g., +Z direction) with respect to the image sensor (431) placed on a plane (e.g., XY plane). The bending area B21 may be directly connected to the image sensor (431). The bending area B21 may be separated from the bending area B11 along an edge (e.g., -X direction edge) of the image sensor (431). In one embodiment, the second branch (433B) may include an additional area between the image sensor (431) and the bending area B21. The additional area may be referred to as a “base area.” The additional area may connect the bending area B11 and the bending area B21. The additional area may be substantially on the same plane as the image sensor (431).

[0125] The second branch (433B) may include a side region T21 extending substantially in the first optical axis direction (e.g., +Z direction). The side region T21 may be connected to the bending region B21.

[0126] The second branch (433B) may include a folding region F21 folded in a direction (e.g., +Y direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction). The folding region F21 may be a region bent inwardly with respect to the side region T21 at a second angle (e.g., about 45 degrees) that is less than the first angle and folded in a direction (e.g., +Y direction) at a third angle (e.g., about 180 degrees) that is greater than the first angle. In one embodiment, the folding region F21 may be a region bent outwardly with respect to the side region T21 at a second angle and folded in a direction (e.g., +Y direction) at a third angle. The folding region F21 may be directly connected to the side region T21. In one embodiment, the folding region F21 may be directly connected to the bending region B21 without the side region T21.

[0127] The second branch (433B) may include a side region T22 extending in one direction (e.g., +Y direction). The side region T22 may extend along a portion of the perimeter of the image sensor (431) (e.g., -X direction edge). The side region T22 may be connected to the folding region F21.

[0128] The second branch (433B) may include a bending region B22 bent in a direction (e.g., +X direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +Y direction) of the side region T22. The bending region B22 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T22. At least a portion of the bending region B22 may be substantially aligned with a corner region of the image sensor (431) (e.g., a corner region between a -X-direction edge and a +Y-direction edge) in the first optical axis direction (e.g., +Z direction). The bending region B22 may be connected to the side region T22.

[0129] The second branch (433B) may include a side region T23 extending in a direction (e.g., +X direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +Y direction) of the side region T22. The side region T23 may extend along a portion of the periphery of the image sensor (431) (e.g., +Y direction edge). The side region T23 may be connected to the bending region B22. The side region T23 may be substantially parallel to the side region T13.

[0130] The second branch (433B) may include a bending region B23 bent in a direction (e.g., -Y direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +X direction) of the side region T23. The bending region B23 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T23. At least a portion of the bending region B23 may be substantially aligned with a corner region of the image sensor (431) (e.g., a corner region between a +Y direction edge and a +X direction edge) in the first optical axis direction (e.g., +Z direction). The bending region B23 may be connected to the side region T23.

[0131] The second branch (433B) may include a side region T24 that is substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction of the side region T23 (e.g., +X direction) and extends in a direction opposite to the extension direction of the side region T22 (e.g., -Y direction). The side region T24 may extend along a portion of the periphery of the image sensor (431) (e.g., +X direction edge). The side region T24 may be connected to the bending region B23. The side region T24 may be arranged opposite to the side region T22.

[0132] The second branch (433B) may include a folding region F22 folded in a second optical axis direction (e.g., -Z direction) opposite to the first optical axis direction (e.g., +Z direction). The folding region F22 may be a region bent outwardly with respect to the side region T24 at a second angle (e.g., about 45 degrees) that is smaller than the first angle and folded at a third angle (e.g., about 180 degrees) that is larger than the first angle in the second optical axis direction (e.g., -Z direction). In one embodiment, the folding region F22 may be a region bent inwardly with respect to the side region T24 at a second angle and folded at a third angle in the second optical axis direction (e.g., -Z direction).

[0133] The second branch (433B) may include a side region T25 extending substantially in the second optical axis direction (e.g., -Z direction). The side region T25 may be connected to the folding region F22.

[0134] The second branch (433B) may include a bending area B24 bent in an outward direction (e.g., +X direction) of the image sensor (431) at a first angle (e.g., about 90 degrees) with respect to the second optical axis direction (e.g., -Z direction). The bending area B24 may be an area bent toward the connector (432).

[0135] The second prong (433B) may include a base region T26 connecting the bend region B24 and the connector (432). The base region T26 may be substantially coplanar with the connector (432). The base region T26 may be a single region integrated with the base region T16. The base region T26 may be connected to a portion of the first prong (433A), such as the bend region B14. In one embodiment, the bend region B24 may be directly connected to the connector (432) without the base region T26. In one embodiment, the base region T16 and the base region T26 may be distinct and separate from each other.

[0136] Folding area F11, folding area F12, folding area F21, and folding area F22 may have a curvature that does not cause cracks. For example, folding area F11, folding area F12, folding area F21, and folding area F22 may have a curvature radius of approximately 1 mm. The curvature radii of the folding areas may vary depending on the shape of the FPCB, the type of camera module, or other design parameters.

[0137] The first branch (433A) and the second branch (433B) may be substantially symmetrical with respect to a plane (e.g., an XZ plane) that includes a first optical axis direction (e.g., a +Z direction) and is substantially orthogonal to a plane (e.g., an XY plane) on which the image sensor (431) is placed. For example, side regions T12 and T22 may extend in opposite directions, side regions T13 and T23 may be substantially parallel to each other, and side regions T14 and T24 may extend in opposite directions.

[0138] The connecting assembly (430) may include an FPCB (433) including various combinations of the first prong (433A) and the second prong (433B). For example, a combination of any one of the inner folding and the outer folding of the folding area F11, any one of the inner folding and the outer folding of the folding area F21, any one of the inner folding and the outer folding of the folding area F12, and any one of the inner folding and the outer folding of the folding area F22 is possible.

[0139] In one embodiment, the FPCB (433) may include only one of the first prong (433A) and the second prong (433B).

[0140] Bending area B11, bending area B21, bending area B14, and bending area B24 can enable a design in which areas of the FPCB (433) that can be moved by receiving force (e.g., side area T12, side area T22, side area T13, side area T23, side area T14, and side area T24) are placed on a different plane from the plane on which the image sensor (431) and / or the connector (432) are placed. This can increase the placement efficiency of the connecting assembly (430), and thus reduce the size of the module (e.g., the camera module (400) of FIGS. 5 to 7).

[0141] Areas of the FPCB (433) that are on a different plane from the plane on which the image sensor (431) and / or the connector (432) are placed (e.g., side area T12, side area T22, side area T13, side area T23, side area T14, and side area T24) can achieve a desired displacement with reduced driving force, which can reduce the power required for driving.

[0142] The FPCB (433) including multiple bending regions has a reduced elastic modulus, which can distribute force across multiple regions of the FPCB (433) to reduce the power required for driving.

[0143] The connecting assembly (430) may include a plurality of reinforcing members (434). Each reinforcing member (434) may make the stiffness of an area of ​​the FPCB (433) to which the reinforcing member (434) is applied greater than the stiffness of an area of ​​the FPCB (433) to which the reinforcing member (434) is not applied. For example, the plurality of reinforcing members (434) may be applied to bending area B11, bending area B21, bending area B12, bending area B23, bending area B14, and bending area B24. A displacement (e.g., a displacement on the XY plane) of at least one area (e.g., a side area T12 and a side area T13) of the FPCB (433) surrounding the bending area (e.g., a bending area B12) of the FPCB (433) to which the reinforcing member (434) is applied may be achieved.

[0144] FIG. 10 is a drawing showing a bending area of ​​a flexible printed circuit board (FPCB) according to one embodiment.

[0145] Referring to FIG. 10, the connecting assembly (430) may include an FPCB (433). The FPCB (433) may include a first side region (T1) extending in a first direction (e.g., + / - Y direction), a second side region (T2) extending in a second direction (e.g., + / - X direction) different from the first direction (e.g., substantially orthogonal), and a bending region (B) connecting the first side region (T1) and the second side region (T2) and being bent relative to the first side region (T1) and the second side region (T2). The first side region (T1), the second side region (T2), and the bending region (B) may be applied to the side regions and the bending region therebetween described with reference to FIGS. 8 and 9.

[0146] The connecting assembly (430) may include a reinforcing member (434). The reinforcing member (434) may increase the rigidity of the bending region (B) to a greater extent than the rigidity of other regions (e.g., the first side region (T1) and / or the second side region (T2)). The reinforcing member (434) may include a material having a rigidity greater than the rigidity of the FPCB (433). The reinforcing member (434) may be secured to the outer surface of the bending region (B) by any suitable bonding means (e.g., double-sided tape). The reinforcing member (434) may allow the shape of the FPCB (433) to change consistently.

[0147] In an embodiment where the FPCB (433) includes a plurality of bending areas (B), the reinforcement (434) may be applied to at least some of the bending areas (B). For example, referring to FIGS. 8 and 9 , the reinforcement (434) may be applied to bending areas B11, B21, B12, and B23. The side areas on both sides of the bending area to which the reinforcement (434) is applied may be displaced or shifted relative to the bending area therebetween. In one embodiment, there may be a greater number of reinforcements (434) that may be applied to the bending areas, as long as they do not affect the tension of the FPCB (433) beyond a desired range.

[0148] In one embodiment, the increase in stiffness of the bending region (B) may also be achieved by other structures without the reinforcement (434). For example, a portion of the housing (420) that contacts the bending region (B) (e.g., an inner corner region of the enclosure (420B)) may guide and support the bending region (B).

[0149] Fig. 11 is a drawing showing a folding area of ​​an FPCB according to one embodiment.

[0150] Referring to FIG. 11, the connecting assembly (430) may include an FPCB (433). The FPCB (433) may include a first side region (T1) extending in a first direction (e.g., + / - Z direction), a second side region (T2) extending in a second direction (e.g., + / - Y direction) different from the first direction (e.g., substantially orthogonal), and a folding region (F) connecting the first side region (T1) and the second side region (T2) and folded relative to the first side region (T1) and the second side region (T2). The folding region (F) may be applied to the folding regions (e.g., F11, F12, F21, and / or F22) described with reference to FIGS. 8 and 9.

[0151] The connecting assembly (430) may include a fixing member (435) configured to maintain the shape of the folding area (F). The fixing member (435) may include a multi-stage shape surrounding the inner and / or outer surfaces of the folding area (F). For example, the fixing member (435) may include a clip.

[0152] In one embodiment, the connecting assembly (430) may include a bonding member. The bonding member may be applied to the inner surface of the folding area (F). The bonding member may be cured to maintain the shape of the folding area (F) while the folding area (F) of the FPCB (433) is secured by any suitable securing means. Once the bonding member is cured, the securing means may be removed.

[0153] Fig. 12 is a perspective view of a connecting assembly before a portion of an FPCB is bent / folded according to an embodiment. Fig. 13 is a perspective view of a connecting assembly of Fig. 12 according to an embodiment, in which a portion of an FPCB is bent. Fig. 14 is a perspective view of a connecting assembly of Fig. 13 according to an embodiment, in which a portion of an FPCB is bent / folded. Fig. 15 is a plan view of a connecting assembly of Fig. 14 according to an embodiment, in which a portion of an FPCB is bent.

[0154] The connecting assembly (430) illustrated in FIG. 12 can be transitioned to the connecting assembly (430) of FIG. 13 by bending (e.g., bending about 90 degrees) side area T12 relative to side area T13 relative to bend area B12 of the FPCB (433), by bending (e.g., bending about 90 degrees) side area T13 relative to side area T13 relative to bend area B13 of the FPCB (433), by bending (e.g., bending about 90 degrees) side area T22 relative to side area T23 relative to bend area B22 of the FPCB (433), and by bending (e.g., bending about 90 degrees) side area T24 relative to side area T23 relative to bend area B23 of the FPCB (433).

[0155] The connecting assembly (430) illustrated in FIG. 13 can be transferred to the connecting assembly (430) of FIG. 14 by folding the side area T12 and the side area T14 inwardly (e.g., bending about 45 degrees and then folding about 180 degrees) based on the folding area F11 and the folding area F12 of the FPCB (433), respectively, and by folding the side area T22 and the side area T24 inwardly (e.g., bending about 45 degrees and then folding about 180 degrees) based on the folding area F21 and the folding area F22 of the FPCB (433), respectively.

[0156] The connecting assembly (430) illustrated in FIG. 14 can be converted to the connecting assembly (430) of FIG. 15 by bending the image sensor (431) (e.g., bending at about 90 degrees) based on the bending area B11 and the bending area B21 of the FPCB (433), and by bending the connector (432) or the base area T16 connected thereto (e.g., bending at about 90 degrees) based on the bending area B14 and the bending area B24 of the FPCB (433).

[0157] FIG. 16 is a plan view of a connecting assembly showing an FPCB displaced in one direction according to one embodiment. FIG. 17 is a plan view of a connecting assembly showing an FPCB displaced in another direction according to one embodiment.

[0158] Referring to FIG. 16, the connector (432) in the connecting assembly (430) can be maintained in a fixed state. When a force in the -X direction is applied to the side regions T12 and / or T22 in the + / -X direction among the side regions of the FPCB (433) (for example, by an external force or an actuator (440) described with reference to FIGS. 5 to 7), the side regions T12 and T13 receive a force that moves in the -X direction, and the side regions T12 and T22 are bent (deflected) with respect to the side regions T13 and T23, respectively, with respect to the bending regions B12 and B22, and the image sensor (431) can be shifted in the -X direction. Similarly, when a force in the +X direction is applied to the side regions T12 and / or T22 in the + / -X direction, the image sensor (431) can be shifted in the +X direction.

[0159] Referring to FIG. 17, the connector (432) in the connecting assembly (430) can be maintained in a fixed state. When a force in the -Y direction is applied to the side regions T13 and / or T23 in the + / -Y direction among the side regions of the FPCB (433) (for example, by an external force or an actuator (440) described with reference to FIGS. 5 to 7), the side regions T13 and T23 receive a force that moves in the -Y direction, and the side regions T13 and T23 are bent with respect to the side regions T14 and T24, respectively, with respect to the bending regions B13 and B23, and the image sensor (431) can be shifted in the -Y direction. Similarly, when a force in the +Y direction is applied to the side regions T13 and / or T23 in the + / -Y direction, the image sensor (431) can be shifted in the +Y direction.

[0160] As described with reference to FIGS. 16 and 17, applying force to the side regions T12, T22, T13 and / or T23 can reduce the repulsive force of the FPCB (433).

[0161] Figure 18 is a perspective view of a connecting assembly according to one embodiment.

[0162] Referring to FIG. 18, a connecting assembly (430-1) (e.g., the connecting assembly (430) of FIGS. 5 to 15) may include an image sensor (431), a connector (432), and an FPCB (433-1) (e.g., the FPCB (433) of FIGS. 5 to 15). The FPCB (433-1) may be formed as a single branch.

[0163] The FPCB (433-1) may include a bending area B1 (e.g., bending area B11 and / or bending area B21 of FIGS. 8 and 9) bent at a first angle (e.g., about 90 degrees) in the first optical axis direction (e.g., +Z direction) with respect to the image sensor (431).

[0164] The FPCB (433-1) may include a folding region F1 (e.g., folding region F11 and / or folding region F21 of FIGS. 8 and 9) folded in a direction (e.g., +Y direction) substantially orthogonal to a first optical axis direction (e.g., +Z direction). The folding region F1 may be a region bent at a second angle (e.g., about 45 degrees) less than the first angle with respect to the bending region B1 and folded at a third angle (e.g., 180 degrees) greater than the first angle in a direction (e.g., +Y direction). The folding region F1 may be a region folded inward in a direction toward the image sensor (431). In one embodiment, the folding region F1 may be a region folded outward in a direction away from the image sensor (431).

[0165] The FPCB (433-1) may include a side region T1 (e.g., side region T12 and / or side region T22 of FIGS. 8 and 9) extending in a direction (e.g., +Y direction) substantially orthogonal to the first optical axis direction (e.g., +Z direction). The side region T1 may extend along a portion of the periphery of the image sensor (431) (e.g., +X direction edge). The side region T1 may be connected to the folding region F1.

[0166] The FPCB (433-1) may include a bending region B2 (e.g., bending region B12 and / or bending region B22 of FIGS. 8 and 9) bent in a direction substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +Y direction) of the side region T1, respectively (e.g., -X direction). The bending region B2 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T1. The bending region B2 may be connected to the side region T1.

[0167] The FPCB (433-1) may include a side region T2 (e.g., side region T13 and / or side region T23 of FIGS. 8 and 9) extending in a direction substantially orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +Y direction) of the side region T1 (e.g., -X direction). The side region T2 may extend along a portion of the periphery of the image sensor (431) (e.g., +Y direction edge). The side region T2 may be connected to the bending region B2.

[0168] The FPCB (433-1) may include a bending region B3 (e.g., bending region B13 and / or bending region B23 of FIGS. 8 and 9) bent in a direction orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., -X direction) of the side region T2 (e.g., -Y direction). The bending region B3 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T2. ​​The bending region B3 may be connected to the side region T2.

[0169] The FPCB (433-1) may include a side region T3 (e.g., side region T14 and / or side region T24 of FIGS. 8 and 9) extending in a direction orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction of the side region T2 (e.g., -X direction) respectively (e.g., -Y direction). The side region T3 may extend in a direction opposite to the extension direction of the side region T1 (e.g., +Y direction) (e.g., -Y direction). The side region T3 may extend along a portion of the periphery of the image sensor (431) (e.g., -X direction edge). The side region T3 may be connected to the bending region B3. The side region T3 may be arranged opposite to the side region T1.

[0170] The FPCB (433-1) may include a bending region B4 bent in a direction (e.g., +X direction) orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., -Y direction) of the side region T3. The bending region B4 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T3. The bending region B4 may be connected to the side region T3.

[0171] The FPCB (433-1) may include a side region T4 extending in a direction (e.g., +X direction) orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., -Y direction) of the side region T3. The side region T4 may extend in a direction (e.g., +X direction) opposite to the extension direction (e.g., -X direction) of the side region T2. ​​The side region T4 may extend along a portion of the periphery (e.g., -Y direction edge) of the image sensor (431). The side region T4 may be connected to the bending region B4.

[0172] The FPCB (433-1) may include a bending region B5 bent in a direction (e.g., +Y direction) orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +X direction) of the side region T4. The bending region B5 may be a region bent at a first angle (e.g., about 90 degrees) with respect to the side region T4. The bending region B5 may be connected to the side region T4.

[0173] The FPCB (433-1) may include a side region T5 extending in a direction (e.g., +Y direction) orthogonal to the first optical axis direction (e.g., +Z direction) and the extension direction (e.g., +X direction) of the side region T4. The side region T5 may extend in a direction (e.g., +Y direction) opposite to the extension direction (e.g., -Y direction) of the side region T3. The side region T5 may extend along a portion of the periphery (e.g., +X direction edge) of the image sensor (431). The side region T5 may be connected to the bending region B5. The side region T5 may at least partially overlap the side region T1 in one direction (e.g., X direction). In one embodiment, the side region T5 may not overlap the side region T1.

[0174] The FPCB (433-1) may include a folding area F2 (e.g., folding area F12 and / or folding area F22 of FIGS. 8 and 9) folded in a second optical axis direction (e.g., -Z direction) opposite to a first optical axis direction (e.g., +Z direction). The folding area F2 may be a region bent at a second angle (e.g., about 45 degrees) that is smaller than the first angle with respect to the side area T5 and folded at a third angle (e.g., 180 degrees) that is larger than the first angle in one direction (e.g., -Y direction). The folding area F2 may be a region folded outward in a direction away from the image sensor (431). In one embodiment, the folding area F2 may be a region folded inward in a direction toward the image sensor (431).

[0175] The FPCB (433-1) may include a bending area B6 (e.g., bending area B14 and / or bending area B24 of FIGS. 8 and 9) bent toward the connector (432) at a first angle (e.g., about 90 degrees) with respect to the second optical axis direction (e.g., -Z direction).

[0176] The image sensor (431) may be on a different plane than the connector (432). In one embodiment, the image sensor (431) may be substantially coplanar with the connector (432).

[0177] The connecting assembly (430-1) may include a plurality of reinforcing members (434). One of the plurality of reinforcing members (434) may be disposed on one side (e.g., the outer side) of the bending area B2, and the other reinforcing member may be disposed on one side (e.g., the outer side) of the bending area B4. Side regions (e.g., T1 and T2 and / or T3 and T4) on both sides of the bending area (e.g., B2 and B4) where the reinforcing members are disposed may be displaced or shifted with respect to the corresponding bending area.

[0178] Fig. 19 is a perspective view of a camera module according to one embodiment. Fig. 20 is an exploded perspective view of a camera module according to one embodiment. Fig. 21 is a perspective view of a connecting assembly according to one embodiment. Fig. 22 is a side view of a connecting assembly according to one embodiment.

[0179] Referring to FIGS. 19 to 22, a camera module (480-2) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the first camera module (380A), the second camera module (380B), and / or the third camera module (380D) of FIGS. 3 and 4, and / or the camera module (400) of FIGS. 5 to 7) may include a lens assembly (410-2) (e.g., the lens assembly (210) of FIG. 2 and / or the lens assembly (410) of FIGS. 5 to 7). The lens assembly (410-2) may include at least one lens (411-2) (e.g., the lens (411) of FIGS. 5 to 7). The lens assembly (410-2) may include a lens housing (412-2) (e.g., the lens housing (412) of FIGS. 5 to 7). The lens assembly (410-2) may include a lens holder (413-2) configured to hold the lens housing (412-2).

[0180] The camera module (480-2) may include a camera housing (420-2) (e.g., the camera housing (420) of FIGS. 5 to 7). The camera housing (420-2) may include a base plate (420A-2) (e.g., the base plate (420A) of FIGS. 5 to 7) and an enclosure (420B-2) (e.g., the enclosure (420B) of FIGS. 5 to 7). The camera module (480-2) may include a camera cover (421-2) (e.g., the camera cover (421) of FIGS. 5 to 7).

[0181] The camera module (480-2) may include a connecting assembly (430-2) (e.g., the connecting assembly (430) of FIGS. 5 to 17 and / or the connecting assembly (430-1) of FIG. 18). The connecting assembly (430-2) may include an image sensor (431-2) (e.g., the image sensor (431) of FIGS. 5 to 17 and / or the image sensor (431) of FIG. 18), a connector (432-2) (e.g., the connector (432) of FIGS. 5 to 17 and / or the connector (432) of FIG. 18), and an FPCB (433-2) (e.g., the FPCB (433) of FIGS. 5 to 17 and / or the FPCB (433-1) of FIG. 18).

[0182] The FPCB (433-2) may include a first branch (433A-2) (e.g., the first branch (433A) of FIGS. 8 and 9) and a second branch (433B-2) (e.g., the second branch (433B) of FIGS. 8 and 9). In one embodiment, the FPCB (433-2) may be configured as a single branch. For example, it may be configured as either one of the first branch (433A-2) and the second branch (433B-2), or may be configured as a single branch, such as the FPCB (433-1) of FIG. 18.

[0183] The first branch (433A-2) may include a base area T111 that is substantially coplanar with the image sensor (431). The base area T111 may be connected to a portion of one edge (e.g., an edge in the -X direction) of the image sensor (431).

[0184] The first branch (433A-2) may include a folding region F111 that is folded in one direction (e.g., in the -Y direction) with respect to the image sensor (431). The folding region F111 may be a region that is bent inward at an angle (e.g., about 45 degrees) with respect to the base region T111 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., in the -Y direction). In one embodiment, the folding region F111 may be a region that is bent outward at an angle (e.g., about 45 degrees) with respect to the base region T111 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., in the -Y direction). The folding region F111 may be connected to the base region T111. In one embodiment, the folding region F111 may be connected to the image sensor (431-2) without the base region T111.

[0185] The first branch (433A-2) may include a bending region B111 that is bent in a direction (e.g., +Z direction) substantially orthogonal to the folding direction (e.g., -Y direction) of the folding region F111. The bending region B111 may be a region that is bent at an angle (e.g., about 90 degrees) with respect to the folding region F111. The bending region B111 may be directly connected to the folding region F111. In one embodiment, there may be an additional base region between the bending region B111 and the folding region F111.

[0186] The first branch (433A-2) may include a folding region F112 folded in a direction (e.g., +X direction) substantially orthogonal to the folding direction (e.g., -Y direction) of the folding region F111 and the bending direction (e.g., +Z direction) of the bending region B111, respectively. The folding region F112 may be a region that is bent outwardly at an angle (e.g., about 45 degrees) with respect to the bending region B111 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., +X direction). In one embodiment, the folding region F112 may be a region that is bent inwardly at an angle (e.g., about 45 degrees) with respect to the bending region B111 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., -X direction). The folding region F112 may be connected to the bending region B111. In one embodiment, there may be an additional side region between the folding region F112 and the bending region B111.

[0187] The first branch (433A-2) may include a side region T112 extending in the folding direction (e.g., +X direction) of the folding region F112. The side region T112 may extend along a portion of the periphery of the image sensor (431) (e.g., -Y direction edge).

[0188] The first branch (433A-2) may include a bending region B112 bent in a direction (e.g., in the +Y direction) substantially orthogonal to the extension direction (e.g., in the +X direction) of the side region T112. The bending region B112 may be a region bent at an angle (e.g., about 90 degrees) with respect to the side region T112.

[0189] The first branch (433A-2) may include a folding region F113 folded in a direction (e.g., -Z direction) substantially orthogonal to the folding direction (e.g., +X direction) of the folding region F112 and the bending direction (e.g., +Y direction) of the bending region B112, respectively. The folding region F113 may be a region that is bent inwardly at an angle (e.g., about 45 degrees) with respect to the bending region B112 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., -Z direction). In one embodiment, the folding region F113 may be a region that is bent outwardly at an angle (e.g., about 45 degrees) with respect to the bending region B112 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., -Z direction). There may be an additional side region between the folding region F113 and the bending region B112.

[0190] The first branch (433A-2) may include a bending region B113 bent toward the connector (432-2). The bending region B113 may be an area bent at an angle (e.g., about 90 degrees) with respect to the folding region F113. The bending region B113 may be connected to the folding region F113 and the connector (432-2).

[0191] The second branch (433B-2) may include a base region T121 that is substantially coplanar with the image sensor (431). The base region T121 may be connected to a portion of one edge (e.g., the -X-direction edge) of the image sensor (431). The base region T121 may be separated from the base region T111 along the edge (e.g., the -X-direction edge) of the image sensor (431). In one embodiment, the base region T121 may be integrated with the base region T111.

[0192] The second branch (433B-2) may include a folding region F121 that is folded in one direction (e.g., +Y direction) with respect to the image sensor (431). The folding region F121 may be a region that is bent inward at an angle (e.g., about 45 degrees) with respect to the base region T121 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., +Y direction). In one embodiment, the folding region F121 may be a region that is bent outward at an angle (e.g., about 45 degrees) with respect to the base region T121 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., +Y direction). The folding region F121 may be connected to the base region T121. In one embodiment, the folding region F121 may be connected to the image sensor (431-2) without the base region T121.

[0193] The second branch (433B-2) may include a bending region B121 that is bent in a direction (e.g., in the +Z direction) substantially orthogonal to the folding direction (e.g., in the +Y direction) of the folding region F121. The bending region B121 may be a region that is bent at an angle (e.g., about 90 degrees) with respect to the folding region F121. The bending region B121 may be directly connected to the folding region F121. In one embodiment, there may be an additional base region between the bending region B121 and the folding region F121.

[0194] The second branch (433B-2) may include a folding region F122 folded in a direction (e.g., +X direction) substantially orthogonal to the folding direction (e.g., +Y direction) of the folding region F121 and the bending direction (e.g., +Z direction) of the bending region B121, respectively. The folding region F122 may be a region that is bent outwardly at an angle (e.g., about 45 degrees) with respect to the bending region B121 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., +X direction). In one embodiment, the folding region F122 may be a region that is bent inwardly at an angle (e.g., about 45 degrees) with respect to the bending region B121 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., +X direction). The folding region F122 may be connected to the bending region B121. In one embodiment, there may be an additional side region between the folding region F122 and the bending region B121.

[0195] The second branch (433B-2) may include a side region T122 extending in the folding direction (e.g., +X direction) of the folding region F122. The side region T122 may extend along a portion of the periphery of the image sensor (431) (e.g., +Y direction edge).

[0196] The second branch (433B-2) may include a bending region B122 bent in a direction (e.g., in the -Y direction) substantially orthogonal to the extension direction (e.g., in the +X direction) of the side region T122. The bending region B122 may be a region bent at an angle (e.g., about 90 degrees) with respect to the side region T122.

[0197] The second branch (433B-2) may include a folding region F123 folded in a direction (e.g., -Z direction) substantially orthogonal to the folding direction (e.g., +X direction) of the folding region F122 and the bending direction (e.g., -Y direction) of the bending region B122, respectively. The folding region F123 may be a region that is bent inwardly at an angle (e.g., about 45 degrees) with respect to the bending region B122 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., -Z direction). In one embodiment, the folding region F123 may be a region that is bent outwardly at an angle (e.g., about 45 degrees) with respect to the bending region B122 and folded at another angle (e.g., about 180 degrees) in one direction (e.g., -Z direction). There may be an additional side region between the folding region F123 and the bending region B122.

[0198] The second prong (433B-2) may include a bending region B123 that is bent toward the connector (432-2). The bending region B123 may be an area that is bent at an angle (e.g., about 90 degrees) with respect to the folding region F123. The bending region B123 may be connected to the folding region F123 and the connector (432-2). The bending region B123 may be separate from the bending region B113. In one embodiment, the bending region B123 may be integrated with the bending region B113 or may be connected to an additional base region connected to the connector (432-2).

[0199] The first branch (433A-2) and the second branch (433B-2) may be substantially symmetrical with respect to a plane (e.g., an XZ plane) substantially orthogonal to a plane (e.g., an XY plane) on which the image sensor (431) is placed.

[0200] The FPCB (433-2) may include at least one reinforcing member (434-2) (e.g., the reinforcing member (434) of FIGS. 8 to 10). The reinforcing member (434-2) may be applied to an outer surface and / or an inner surface of the bending area B112, the bending area B122, the bending area B113, and / or the bending area B123. In one embodiment, alternatively or additionally, the camera housing (420-2) may be configured to guide and support the outer surface and / or the inner surface of the bending area B112, the bending area B122, the bending area B113, and / or the bending area B123.

[0201] The camera module (480-2) may include an actuator (440-2) (e.g., the actuator (440) of FIGS. 5 to 7). The actuator (440-2) may include a carrier (441-2) (e.g., the carrier (441) of FIGS. 5 to 7), at least one first electromagnetic element (442-2) (e.g., the magnet (442) of FIGS. 5 to 7), at least one second electromagnetic element (not shown) (e.g., the coil (443) of FIGS. 5 to 7), and a middle guide (445-2) (e.g., the middle guide (445) of FIGS. 5 to 7).

[0202] The camera module (480-2) may include a reflector (450) configured to reflect light passing through the lens (411-2) toward the image sensor (431-2). For example, the reflector (450) may include, but is not limited to, a rhomboid-shaped prism, and may also be configured as an optical system including a mirror. The optical axis may be defined as a line connecting the center of curvature of one side (e.g., +Z-direction side) of the lens (411-2) and the center of curvature of the other side (e.g., -Z-direction side), passing through the incident surface of the reflector (450), reflected by the reflective surface of the reflector (450), and passing through the exit surface of the reflector (450).

[0203] The reflector (450) may be surrounded by at least a portion of the FPCB (433-2). The base area T111, the base area T121, the folding area F111, and the folding area F121 of the FPCB (433-2) may face the base surface (e.g., the -Z direction surface) of the reflector (450). The folding area F112, the folding area F122, a portion of the side area T112, and a portion of the side area T122 of the FPCB (433-2) may face the side surface (e.g., the + / -Y direction surface) of the reflector (450). The folding area F113 and the folding area F123 of the FPCB (433-2) may face the back surface (e.g., the +X direction surface) of the reflector (450).

[0204] One aspect of the disclosure may provide a camera module including a FPCB that operates at low power. One aspect of the disclosure may provide an electronic device including the camera module.

[0205] A camera module (400; 400-2) may include a lens (411; 411-2) having an optical axis (OA), a lens housing (412; 412-2) configured to accommodate the lens (411; 411-2), an image sensor (431; 431-2) configured to receive light passing through the lens (411; 411-2), a connector (432; 432-2) configured to receive an electrical signal from the image sensor (431; 431-2), and a flexible printed circuit board (433; 433-1; 433-2) (FPCB) configured to connect the image sensor (431; 431-2) and the connector (432; 432-2). The FPCB (433; 433-1; 433-2) may be configured to change shape between a first shape in which the FPCB (433; 433-1; 433-2) extends substantially linearly between the image sensor (431; 431-2) and the connector (432; 432-2), and a second shape in which the FPCB (433; 433-1; 433-2) has at least three bending regions, at least two folding regions, and at least two side regions along the periphery of the image sensor.

[0206] The FPCB (433; 433-1; 433-2) is connected to the image sensor (431; 431-2), and has a first bending region (B11, B21; B1; B111, B121) bent in a first direction (+Z) with respect to the image sensor (431; 431-2), a first folding region (F11, F21; F1; F112, F122) folded in a second direction (-Y, +Y; +Y; +X) substantially orthogonal to the first direction (+Z) with respect to the first bending region (B11, B21; B1; B111, B121), and is connected to the first folding region (F11, F21; F1; F112, F122), and the image sensor (431; A first side region (T12, T22; T1; T112, T122) extending in the second direction (-Y, +Y; +Y; +X) along the perimeter of the image sensor (431; 431-2), a second bending region (B12, B22; B2; B112, B122) connected to the first side region (T12, T22; T1; T112, T122) and bent in a third direction (+X; -X; +Y, -Y) substantially orthogonal to the first direction (+Z) and the second direction (-Y, +Y; +Y; +X), a second bending region (B12, B22; B2; B112, B122) connected to the second bending region (B12, B22; B2; B112, B122) and extending in the third direction (+X; -X; +Y, -Y) may include a second side region (T13, T23; T2) extending in a direction opposite to the first direction (+Z), a second folding region (F12, F22; F2; F113, F123) connected to the second side region (T13, T23; T2) and folded in a fourth direction (-Z) opposite to the first direction (+Z), and a third bending region (B14, B24; B6; B113, B123) connected to the second folding region (F12, F22; F2; F113, F123) and bent toward the connector (432; 432-2) and connected to the connector (432; 432-2).

[0207] The first side region (T12, T22; T1; T112, T122) and the second side region (T13, T23; T2) may be on a different plane from the plane of the image sensor (431; 431-2).

[0208] The camera module (400; 400-2) may include an actuator (440; 440-2) configured to apply force to the first side area (T12, T22; T1; T112, T122) and / or the second side area (T13, T23; T2).

[0209] The FPCB (433; 433-1) may include a fourth bending region (B13, B23; B3) connected to the second side region (T13, T23) and bent in a fifth direction (+Y, -Y; -Y) opposite to the second direction (-Y, +Y; +Y), and a third side region (T14, T24; T3) connected to the fourth bending region (B13, B23; B3) and the second folding region (F12, F22; F2; F113, F123) and extending in the fifth direction (+Y, -Y; -Y) along the periphery of the image sensor (431; 431-2).

[0210] The above FPCB (433; 433-2) may include a first FPCB (433A; 433A-2) and a second FPCB (433B; 433B-2).

[0211] The first FPCB (433A; 433A-2) and the second FPCB (433B; 433B-2) can be arranged symmetrically with respect to each other with respect to a plane (XZ) including the optical axis (OA).

[0212] The FPCB (433; 433-1; 433-2) may include a first base region connecting the image sensor (431; 431-2) and the first bending region (B11, B21; B1; B111, B121). The FPCB (433; 433-1; 433-2) may include a second base region (T16, T26) connecting the third bending region (B14, B24; B6; B113, B123) and the connector (432; 432-2).

[0213] The first folding area (F11, F21; F1; F112, F122) can be folded inward and / or outward, and the second folding area (F12, F22; F2; F113, F123) can be folded inward and / or outward.

[0214] The first folding area (F11, F21; F1; F112, F122) and the second folding area (F12, F22; F2; F113, F123) may have a curvature that enables folding without cracks in the FPCB (433; 433-1; 433-2).

[0215] The above FPCB (433; 433-1; 433-2) may include a reinforcing member (434; 434-2) arranged in at least one bending area among the first bending area (B11, B21; B1; B111, B121), the second bending area (B12, B22; B2; B112, B122), or the third bending area (B14, B24; B6; B113, B123).

[0216] The camera module (400; 400-2) may include a camera housing (420; 420-2) configured to support at least one bending area among the first bending area (B11, B21; B1; B111, B121), the second bending area (B12, B22; B2; B112, B122), or the third bending area (B14, B24; B6; B113, B123).

[0217] The above FPCB (433; 433-1; 433-2) may include a cured bonding and / or fixing portion (435) arranged in the first folding area (F11, F21; F1; F112, F122) and / or the second folding area (F12, F22; F2; F113, F123).

[0218] The camera module (400; 400-2) is configured to carry the lens housing (412; 412-2) and may include a carrier (441; 441-2) disposed between the lens housing (412; 412-2) and the image sensor (431; 431-2).

[0219] The FPCB (433-1) includes a fourth bending region (B3) connected to the second side region (T2) and bent in a fifth direction (-Y) opposite to the second direction (+Y), a third side region (T3) connected to the fourth bending region (B3) and extending in the fifth direction (-Y) along the perimeter of the image sensor (431), a fifth bending region (B4) connected to the third side region (T3) and bent in a sixth direction (+X) opposite to the third direction (-X), a fourth side region (T4) connected to the fifth bending region (B4) and extending in the sixth direction (+X) along the perimeter of the image sensor (431), and a sixth bending region (T4) connected to the fourth side region (T4) and bent in the second direction (+Y). It may include a fifth side region (T5) connected to the region (B5) and the sixth bending region (B5) and the second folding region (F2), and extending in the second direction (+Y).

[0220] The fifth side area (T5) may at least partially overlap with the first side area (T1).

[0221] The FPCB (433-2) may include a third folding area (F111, F121) connected to the image sensor (431-2) and the first bending area (B111, B121), and folded in a direction (-Y, +Y) substantially orthogonal to the first direction (+Z) and the second direction (+X), respectively.

[0222] The electronic device (101; 301) may include the camera module (480; 480-2).

[0223] A camera module (400; 400-2) may include a lens (411; 411-2) having an optical axis (OA), a lens housing (412; 412-2) configured to accommodate the lens (411; 411-2), an image sensor (431; 431-2) configured to receive light passing through the lens (411; 411-2), a connector (432; 432-2) configured to receive an electrical signal from the image sensor (431; 431-2), and a flexible printed circuit board (433; 433-1; 433-2) (FPCB) configured to connect the image sensor (431; 431-2) and the connector (432; 432-2).The FPCB (433; 433-1; 433-2) is connected to the image sensor (431; 431-2), and has a first bending region (B11, B21; B1; B111, B121) bent in a first direction (+Z) with respect to the image sensor (431; 431-2), a first folding region (F11, F21; F1; F112, F122) folded in a second direction (-Y, +Y; +Y; +X) substantially orthogonal to the first direction (+Z) with respect to the first bending region (B11, B21; B1; B111, B121), and is connected to the first folding region (F11, F21; F1; F112, F122), and the image sensor (431; A first side region (T12, T22; T1; T112, T122) extending in the second direction (-Y, +Y; +Y; +X) along the perimeter of the image sensor (431; 431-2), a second bending region (B12, B22; B2; B112, B122) connected to the first side region (T12, T22; T1; T112, T122) and bent in a third direction (+X; -X; +Y, -Y) substantially orthogonal to the first direction (+Z) and the second direction (-Y, +Y; +Y; +X), a second bending region (B12, B22; B2; B112, B122) connected to the second bending region (B12, B22; B2; B112, B122) and extending in the third direction (+X; -X; +Y, -Y) may include a second side region (T13, T23; T2) extending in a direction opposite to the first direction (+Z), a second folding region (F12, F22; F2; F113, F123) connected to the second side region (T13, T23; T2) and folded in a fourth direction (-Z) opposite to the first direction (+Z), and a third bending region (B14, B24; B6; B113, B123) connected to the second folding region (F12, F22; F2; F113, F123) and bent toward the connector (432; 432-2) and connected to the connector (432; 432-2).

[0224] A camera module (480) may include a lens (411) having an optical axis (OA), a lens housing (412) configured to accommodate the lens (411), an image sensor (431) configured to receive light passing through the lens (411), a connector (432) configured to receive an electrical signal from the image sensor (431), and a flexible printed circuit board (433; 433-1) (FPCB) configured to connect the image sensor (431) and the connector (432). The FPCB (433-1) is connected to the image sensor (431) and includes a first bending area (B1) bent in a first direction (+Z) with respect to the image sensor (431), a first folding area (F1) connected to the first bending area (B1) and folded in a second direction (+Y) substantially orthogonal to the first direction (+Z), a first side area (T1) connected to the first folding area (F1) and extending in the second direction (+Y) along the periphery of the image sensor (431), a second bending area (B2) connected to the first side area (T1) and bent in a third direction (-X) substantially orthogonal to the first direction (+Z) and the second direction (+Y), and a second bending area (B2) connected to the second bending area (B2) of the image sensor (431). A second side region (T2) extending along the perimeter in the third direction (-X), a third bending region (B3) connected to the second side region (T2) and bent in a fourth direction (-Y) opposite to the second direction (+Y), a third side region (T3) connected to the third bending region (B3) and extending along the perimeter of the image sensor (431) in the fourth direction (-Y), a fourth bending region (B4) connected to the third side region (T3) and bent in a fifth direction (+X) opposite to the third direction (-X), and connected to the fourth bending region (B4),It may include a fourth side region (T4) extending in the fifth direction (+X) along the periphery of the image sensor (431), a fifth bending region (B5) connected to the fourth side region (T4) and bent in the second direction (+Y), a fifth side region (T5) connected to the fifth bending region (B5) and extending in the second direction (+Y), a second folding region (F2) connected to the fifth side region (T5) and folded in a sixth direction (-Z) opposite to the first direction (+Z), and a sixth bending region (B6) connected to the second folding region (F2), bent toward the connector (432), and connected to the connector (432).

[0225] A camera module (480-2) may include a lens (411-2) having an optical axis (OA), a lens housing (412-2) configured to accommodate the lens (411-2), an image sensor (431-2) configured to receive light passing through the lens (411-2), a connector (432-2) configured to receive an electrical signal from the image sensor (431-2), and a flexible printed circuit board (433-2) (FPCB) configured to connect the image sensor (431-2) and the connector (432-2). The FPCB (433-2) is connected to the image sensor (431-2) and includes a first folding area (F111; F121) folded in a first direction (-Y, +Y) with respect to the image sensor (431-2), a first bending area (B111, B121) connected to the first folding area (F111; F121) and bent in a second direction (+Z) substantially orthogonal to the first direction (-Y, +Y), a second folding area (F112, F122) connected to the first bending area (B111, B121) and folded in a third direction (+X) substantially orthogonal to the first direction (-Y, +Y) and the second direction (+Z), and is connected to the second folding area (F112, F122), and the image It may include a side region (T112, T122) extending along the periphery of the sensor (431-2) in the third direction (+X), a second bending region (B112, B122) connected to the side region (T112, T122) and bent in a fourth direction (+Y, -Y) opposite to the first direction (-Y, +Y), a third folding region (F113, F123) connected to the second bending region (B112, B122) and folded in a fifth direction (-Z) opposite to the second direction (+Z), and a third bending region (B113, B123) connected to the third folding region (F113, F123), bent toward the connector (423-2), and connected to the connector (423-2).

[0226] In one embodiment, the size of the camera module (e.g., X-direction dimension and Y-direction dimension) can be reduced. In one embodiment, the manufacturing cost of the FPCB can be reduced. In one embodiment, the elastic modulus of the FPCB can be reduced, thereby reducing the repulsive force of the FPCB, and as a result, the FPCB can be driven with low power. In one embodiment, the height of the actuator (e.g., Z-direction dimension) can be reduced, and as a result, the size of the camera module (e.g., Z-direction dimension) can be reduced.

[0227] The effects of the camera module and the electronic device including the same according to the embodiments are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description in the specification.

[0228] One or more embodiments of this document are intended to be illustrative and not restrictive. Various modifications may be made to the details of the disclosure, including those contained within the scope of the appended claims and their equivalents. Any of the embodiment(s) described herein may be used in combination with any other embodiment(s) described herein.

Claims

1. A lens (411; 411-2) including an optical axis (OA); A lens housing (412; 412-2) configured to accommodate the above lens (411; 411-2), An image sensor (431; 431-2) configured to receive light passing through the above lens (411; 411-2), a connector (432; 432-2) configured to receive an electrical signal from the image sensor (431; 431-2), and A flexible printed circuit board (433; 433-1; 433-2) (FPCB) configured to connect the image sensor (431; 431-2) and the connector (432; 432-2) Including, A camera module (400; 400-2) wherein the FPCB (433; 433-1; 433-2) is configured to change between a first configuration in which the FPCB (433; 433-1; 433-2) is configured to extend substantially linearly between the image sensor (431; 431-2) and the connector (432; 432-2), and a second configuration in which the FPCB (433; 433-1; 433-2) has at least three bending regions, at least two folding regions, and at least two side regions along the periphery of the image sensor.

2. In paragraph 1, The above FPCB (433; 433-1; 433-2) is A first bending region (B11, B21; B1; B111, B121) connected to the image sensor (431; 431-2) and configured to bend in a first direction (+Z) with respect to the image sensor (431; 431-2), A first folding region (F11, F21; F1; F112, F122) configured to be folded in a second direction (-Y, +Y; +Y; +X) substantially orthogonal to the first direction (+Z) with respect to the first bending region (B11, B21; B1; B111, B121), A first side region (T12, T22; T1; T112, T122) connected to the first folding region (F11, F21; F1; F112, F122) and configured to extend in the second direction (-Y, +Y; +Y; +X) along the perimeter of the image sensor (431; 431-2), A second bending region (B12, B22; B2; B112, B122) connected to the first side region (T12, T22; T1; T112, T122) and configured to bend in a third direction (+X; -X; +Y, -Y) substantially orthogonal to the first direction (+Z) and the second direction (-Y, +Y; +Y; +X), A second side region (T13, T23; T2) connected to the second bending region (B12, B22; B2; B112, B122) and configured to extend in the third direction (+X; -X; +Y, -Y) along the periphery of the image sensor (431; 431-2), A second folding region (F12, F22; F2; F113, F123) connected to the second side region (T13, T23; T2) and configured to fold in a fourth direction (-Z) opposite to the first direction (+Z), and A third bending region (B14, B24; B6; B113, B123) connected to the second folding region (F12, F22; F2; F113, F123), wherein the third bending region (B14, B24; B6; B113, B123) is configured to bend toward the connector (432; 432-2) and is configured to be connected to the connector (432; 432-2). A camera module including:

3. In paragraph 1 or 2, A camera module wherein the first side region (T12, T22; T1; T112, T122) and the second side region (T13, T23; T2) are on a different plane from the plane of the image sensor (431; 431-2).

4. In any one of paragraphs 1 to 3, A camera module further comprising an actuator (440; 440-2) configured to apply force to the first side region (T12, T22; T1; T112, T122) and / or the second side region (T13, T23; T2).

5. In any one of paragraphs 1 to 4, The above FPCB (433; 433-1) is A fourth bending region (B13, B23; B3) connected to the second side region (T13, T23) and configured to bend in a fifth direction (+Y, -Y; -Y) opposite to the second direction (-Y, +Y; +Y), and A third side region (T14, T24; T3) connected to the fourth bending region (B13, B23; B3) and the second folding region (F12, F22; F2; F113, F123) and configured to extend in the fifth direction (+Y, -Y; -Y) along the perimeter of the image sensor (431; 431-2). A camera module further comprising:

6. In any one of paragraphs 1 to 5, The above FPCB (433; 433-2) includes a first FPCB (433A; 433A-2) and a second FPCB (433B; 433B-2), and preferably, the first FPCB (433A; 433A-2) and the second FPCB (433B; 433B-2) are a camera module that is symmetrically arranged with respect to each other with respect to a plane (XZ) that includes the optical axis (OA).

7. In any one of paragraphs 1 to 6, The above FPCB (433; 433-1; 433-2) is a first base region configured to connect the image sensor (431; 431-2) and the first bending region (B11, B21; B1; B111, B121), and / or A second base area (T16, T26) configured to connect the third bending area (B14, B24; B6; B113, B123) and the connector (432; 432-2). A camera module further comprising:

8. In any one of paragraphs 1 to 7, The first folding area (F11, F21; F1; F112, F122) is configured to be folded inwardly and / or outwardly, and the second folding area (F12, F22; F2; F113, F123) is configured to be folded inwardly and / or outwardly, and / or A camera module in which the first folding area (F11, F21; F1; F112, F122) and the second folding area (F12, F22; F2; F113, F123) have a curvature configured to be folded without causing cracks in the FPCB (433; 433-1; 433-2).

9. In any one of paragraphs 1 to 8, A camera module wherein the FPCB (433; 433-1; 433-2) further includes a reinforcing member (434; 434-2) provided in at least one bending area among the first bending area (B11, B21; B1; B111, B121), the second bending area (B12, B22; B2; B112, B122), or the third bending area (B14, B24; B6; B113, B123).

10. In any one of paragraphs 1 to 9, A camera module further comprising a camera housing (420; 420-2) configured to support at least one bending area among the first bending area (B11, B21; B1; B111, B121), the second bending area (B12, B22; B2; B112, B122) or the third bending area (B14, B24; B6; B113, B123).

11. In any one of paragraphs 1 to 10, The camera module wherein the above FPCB (433; 433-1; 433-2) further includes a cured bonding and / or fixing portion (435) provided in the first folding area (F11, F21; F1; F112, F122) and / or the second folding area (F12, F22; F2; F113, F123).

12. In any one of paragraphs 1 to 11, A camera module further comprising a carrier (441; 441-2) configured to carry the lens housing (412; 412-2), wherein the carrier (441; 441-2) is provided between the lens housing (412; 412-2) and the image sensor (431; 431-2).

13. In any one of paragraphs 1 to 12, The above FPCB (433-1) is A fourth bending region (B3) configured to be connected to the second side region (T2) and configured to bend in a fifth direction (-Y) opposite to the second direction (+Y); A third side region (T3) configured to be connected to the fourth bending region (B3) and configured to extend in the fifth direction (-Y) along the periphery of the image sensor (431); A fifth bending region (B4) configured to be connected to the third side region (T3) and configured to bend in a sixth direction (+X) opposite to the third direction (-X); A fourth side region (T4) configured to be connected to the fifth bending region (B4) and configured to extend in the sixth direction (+X) along the perimeter of the image sensor (431); A sixth bending region (B5) configured to be connected to the fourth side region (T4) and configured to bend in the second direction (+Y), and A fifth side region (T5) configured to be connected to the sixth bending region (B5) and the second folding region (F2) and configured to extend in the second direction (+Y). Including more, Preferably, the camera module wherein the fifth side area (T5) at least partially overlaps the first side area (T1).

14. In any one of paragraphs 1 to 13, A camera module wherein the FPCB (433-2) further includes a third folding area (F111, F121) configured to be connected to the image sensor (431-2) and the first bending area (B111, B121) and configured to be folded in a direction (-Y, +Y) substantially orthogonal to the first direction (+Z) and the second direction (+X), respectively.

15. An electronic device (101; 301) comprising a camera module (480; 480-2) according to any one of claims 1 to 14.

Images