Isolated electrophoretic solution temperature control device and WB-method-based wet transfer instrument

Abstract

A small-sized isolated electrophoretic solution temperature control device and a WB-method-based wet transfer instrument. The temperature control device comprises a housing (11), a semiconductor refrigeration sheet (12), a water-cooling head (13), a heat sink (14), a cooling fan (15), a water pump (16) and a liquid pipe (17), wherein the water-cooling head (13) is arranged on a refrigeration face of the semiconductor refrigeration sheet (12) by means of an insulating heat-conducting material, the heat sink (14) is arranged on a heat dissipation face of the semiconductor refrigeration sheet (12) by means of the insulating heat-conducting material, the water pump (16) pumps an electrophoretic solution (40) to the water-cooling head (13), and the water-cooling head (13) cools the electrophoretic solution (40). Cold energy generated by the semiconductor refrigeration sheet (12) is transferred to the water-cooling head (13), without the provision of a heat pipe and a circulation pipe, so that a heat conduction path can be shortened, thereby improving the heat exchange efficiency and reducing the power; and the semiconductor refrigeration sheet (12) is connected to the water-cooling head (13) and the heat sink (14) by using the insulating heat-conducting material, so that the water-cooling head (13) is not electrically conductive with the semiconductor refrigeration sheet (12), and the heat sink (14) is not electrically conductive with the cooling fan (15), thereby achieving good electrical isolation, and improving the safety. The present invention has the advantages of the overall structure being simple, the assembly being easy, costs being low and usage being convenient.

Description

An isolated electrophoresis liquid temperature control device and WB wet transfer instrument Technical Field

[0001] The present application relates to the technical field of detection equipment, and in particular to a small-volume isolated electrophoresis liquid temperature control device and a WB wet transfer instrument. Background Art

[0002] Western blot (protein immunoblotting, abbreviated as WB) is a commonly used method for protein analysis. Under the influence of an electric field, proteins are transferred to a nitrocellulose or PVDF membrane, followed by analysis using antibodies. Electrotransfer is one of the most important steps. Common transfer methods include wet transfer and semi-dry transfer. Wet transfer is the current mainstream method due to its versatility and excellent transfer results. However, the wet transfer process generates a significant amount of heat, necessitating refrigeration. Traditional refrigeration methods rely primarily on buried ice or ice box stirring, which are ineffective and prone to electrical leakage.

[0003] In two Chinese utility model patents with announcement numbers CN113416996A and CN215757694U, a technical solution using semiconductor refrigeration sheets and heat pipes for refrigeration is disclosed, which achieves the goal of continuous refrigeration for a long time without ice, but it also has some shortcomings in application. During transfer, the temperature of the electrophoretic fluid is generally controlled at 20-30°C, and the heat transfer efficiency of ordinary heat pipes is relatively low within this temperature range. The guide plate must also be immersed in the electrophoretic fluid, and its volume is large. It is easy to bump and damage during use and storage. The entire system is metal, so the heat sink, heat conductive block, heat pipe, screws, etc. are all charged, which can easily lead to electric shock accidents. If they are all wrapped with insulating materials, the heat dissipation will be degraded, which needs to be improved.

[0004] Utility Model Content

[0005] In order to solve the technical problems of the existing WB method wet transfer instrument such as large size, poor cooling effect, and easy electric shock accidents caused by electricity, the utility model provides a small-volume isolated electrophoresis liquid temperature control device and a WB method wet transfer instrument.

[0006] On the one hand, the present application provides the following technical solutions: a small-volume isolated electrophoretic fluid temperature control device, comprising a shell, a semiconductor refrigeration plate, a water-cooling head, a heat sink, a cooling fan, a water pump and a liquid pipe, wherein the water-cooling head is arranged on the cooling surface of the semiconductor refrigeration plate through an insulating heat-conductive material, and the heat sink is arranged on the heat dissipation surface of the semiconductor refrigeration plate through an insulating heat-conductive material. The cooling fan is used to air-cool the heat sink, and the water pump is connected to the liquid pipe to draw the electrophoretic fluid to the water-cooling head to realize the circulation of the electrophoretic fluid, and the water-cooling head is used to cool the electrophoretic fluid.

[0007] The present application utilizes a water pump and a liquid pipe to circulate the electrophoretic liquid, and the electrophoretic liquid continuously enters and flows out of the water-cooled head. The cold energy generated by the semiconductor refrigeration plate is transferred to the water-cooled head, and the water-cooled head can cool the electrophoretic liquid flowing through it. There is no need to set up a heat pipe and a circulation pipe, which can shorten the heat conduction path, improve the heat exchange efficiency, and reduce power. The electrophoretic liquid is used as a circulating cooling medium, and there is no need to immerse the water-cooled head in the electrophoretic liquid, thereby reducing the size of the equipment. The generated heat is transferred to the heat sink, which is then cooled by the cooling fan and quickly dissipated into the environment. The heat dissipation effect is high, and a smaller heat sink is used. The heat dissipation requirements can be met; the semiconductor refrigeration plate is connected to the water-cooled head and the heat sink with insulating heat-conducting materials, so that the electrophoretic liquid will not be conductive upward through the water-cooled head. The water-cooled head and the semiconductor refrigeration plate, the heat sink and the cooling fan are all non-conductive, and the heat sink and the cooling fan are not charged, thus achieving good electrical isolation and greatly improving safety; since no heat pipe is provided, there is no optimal operating temperature problem, and the system can operate normally within the operating temperature range of the semiconductor refrigeration plate; the water pump is flexibly connected to the water-cooled head through a soft liquid pipe, which is easy to store and not easily damaged by bumps. The present application also has the advantages of simple overall structure, easy assembly, low cost and convenient use.

[0008] Preferably, the water cooling head is fixed on the semiconductor refrigeration plate through thermal conductive silica gel.

[0009] Preferably, the heat sink is fixed on the semiconductor refrigeration chip through thermal conductive silica gel.

[0010] By adopting the above technical solution, high-viscosity thermal conductive silicone is used for bonding. After bonding, the mechanical strength is very high, but it is non-conductive. Therefore, the semiconductor refrigeration plate, heat sink, cooling fan, water pump and other components are insulated from the water cooling head to form electrical isolation, which is not easy to cause electric shock, thereby improving safety.

[0011] Preferably, the semiconductor refrigeration plate, water cooling head, heat sink and cooling fan are all arranged in the shell.

[0012] By adopting the above technical solution, the semiconductor refrigeration plate, the water cooling head and the heat sink can be well protected, and can be taken in and out as a whole, making it easy to take them out.

[0013] Preferably, the semiconductor refrigeration plate, water cooling head, heat sink and cooling fan are arranged horizontally and in parallel, and an air inlet and an air outlet are provided on the side of the shell.

[0014] By adopting the above technical solution, the height and center of gravity of the entire temperature control equipment can be lowered, and air inlets and outlets can be set to better form an air cooling cycle and ensure heat dissipation efficiency.

[0015] On the other hand, the present application also provides the following technical solutions: a WB wet transfer instrument, comprising a transfer instrument body, an electrophoresis tank and the above-mentioned small-volume isolated electrophoresis fluid temperature control device, wherein the transfer instrument body is arranged in the electrophoresis tank, the small-volume isolated electrophoresis fluid temperature control device is arranged above the electrophoresis tank, and the electrophoresis fluid flows out from the water cooling head and falls into the electrophoresis tank.

[0016] Preferably, the water pump is a submersible pump, which is placed at the bottom of the electrophoresis tank, and the upper end of the liquid pipe is connected to the water cooling head.

[0017] By adopting the above technical solution, the water pump starts working after being powered on, and continuously injects the electrophoresis liquid into the water cooling head, and after cooling, it naturally falls back into the electrophoresis tank to achieve circulation.

[0018] Preferably, the water pump is arranged on the housing, the liquid pipe extends into the electrophoresis tank, and the water outlet of the water pump is connected to the water cooling head.

[0019] By adopting the above technical solution, only one soft liquid tube is used to absorb the electrophoresis liquid, which further avoids the problem of collision.

[0020] Preferably, the housing is further provided with a cover plate serving as a tank cover of the electrophoresis tank.

[0021] By adopting the above technical solution, the electrophoresis liquid temperature control device can be directly placed on the electrophoresis tank, and is very easy to take and place, and convenient to use.

[0022] Preferably, a positioning post is provided at the upper end of the electrophoresis tank, and a positioning hole is correspondingly provided on the cover plate, and the positioning post is inserted into the positioning hole to confine the electrophoresis liquid temperature control device on the electrophoresis tank.

[0023] By adopting the above technical solution, the electrophoresis liquid temperature control device can be directly placed on the electrophoresis tank, and is very easy to take and place, and convenient to use.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. This application has the advantages of simple overall structure, easy assembly, low cost and convenient use;

[0026] 2. The cooling energy generated by the semiconductor refrigeration chip is transferred to the water cooling head, which can cool the electrophoretic liquid flowing through it. There is no need to set up heat pipes and circulation pipes, which can shorten the heat conduction path, improve heat exchange efficiency and reduce power;

[0027] 3. The semiconductor refrigeration chip, water cooling head and heat sink are connected by insulating thermal conductive materials. The water cooling head and semiconductor refrigeration chip, heat sink and cooling fan are non-conductive. The heat sink and cooling fan are not charged, which achieves good electrical isolation and greatly improves safety.

[0028] 4. High-viscosity thermal conductive silicone is used for bonding. After bonding, the mechanical strength is very high, but it is non-conductive. Therefore, the semiconductor refrigeration plate, heat sink, cooling fan, water pump and other components are insulated from the water cooling head, forming electrical isolation, not easy to get an electric shock, thereby improving safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a perspective view of a WB wet transfer apparatus according to Example 1 of the present application;

[0030] FIG2 is a perspective view of the WB wet transfer apparatus described in Example 1 of the present application from another angle;

[0031] FIG3 is a schematic diagram showing the exploded structure of the WB wet transfer apparatus according to Example 1 of the present application;

[0032] FIG4 illustrates a schematic diagram of the exploded structure of the temperature control device according to the first embodiment of the present application;

[0033] FIG5 is a schematic diagram of the exploded structure of the temperature control device according to the first embodiment of the present application from another angle;

[0034] FIG6 illustrates a further exploded structural diagram of the temperature control device according to Example 1 of the present application;

[0035] FIG7 illustrates a schematic diagram of the further decomposed structure of the temperature control device according to the first embodiment of the present application from another angle;

[0036] FIG8 is a schematic diagram illustrating the coordination relationship among the semiconductor refrigeration plate, the water cooling head, the heat sink, and the cooling fan according to the first embodiment of the present application;

[0037] FIG9 illustrates a schematic diagram of the WB wet transfer apparatus according to Example 1 of the present application;

[0038] FIG10 illustrates a schematic diagram of the WB wet transfer apparatus according to the second embodiment of the present application.

[0039] Explanation of the accompanying reference numerals: 10. Temperature control device; 11. Housing; 111. Air inlet; 112. Air outlet; 113. Cover; 114. Positioning hole; 12. Semiconductor refrigeration plate; 13. Water cooling head; 14. Heat sink; 15. Cooling fan; 16. Water pump; 17. Liquid pipe; 18. Thermal conductive silica gel; 20. Transfer instrument body; 30. Electrophoresis tank; 31. Positioning column; 40. Electrophoresis liquid. DETAILED DESCRIPTION

[0040] The present application is further described in detail below with reference to Figures 1-10.

[0041] Example 1:

[0042] 1 to 3 , this embodiment discloses a WB wet transfer apparatus, comprising a transfer apparatus body 20 , an electrophoresis tank 30 , and a small-volume isolated electrophoresis fluid temperature control device 10 . The transfer apparatus body 20 is disposed in the electrophoresis tank 30 , and the electrophoresis fluid temperature control device 10 is disposed above the electrophoresis tank 30 and can be removed when not in use.

[0043] 4 and 5 , the small-volume isolated electrophoretic fluid temperature control device 10 includes a housing 11, a semiconductor refrigeration sheet 12, a water-cooled head 13, a heat sink 14, a cooling fan 15, a water pump 16, and a liquid pipe 17. The water-cooled head 13 is arranged on the cooling surface of the semiconductor refrigeration sheet 12 through an insulating heat-conductive material. The heat sink 14 is arranged on the heat dissipation surface of the semiconductor refrigeration sheet 12 through an insulating heat-conductive material. The cooling fan 15 is used to air-cool the heat sink 14. The water pump 16 is connected to the liquid pipe 17 and is used to draw the electrophoretic fluid 40 to the water-cooled head 13. The electrophoretic fluid 40 flows out of the water-cooled head 13 and falls into the electrophoretic tank 30 to realize the circulation of the electrophoretic fluid 40. The water-cooled head 13 is used to cool the electrophoretic fluid 40.

[0044] Referring to Figure 3 , the housing 11 is also provided with a cover plate 113, which serves as the tank cover for the electrophoretic tank 30. The cooling fan 15, heat sink 14, semiconductor cooling plate 12, and water cooling head 13 are all located above the cover plate 113. Positioning posts 31 are provided at the top of the electrophoretic tank 30, and corresponding positioning holes 114 are provided on the cover plate 113. These posts 31 are inserted into the positioning holes 114 to secure the electrophoretic fluid temperature control device 10 to the electrophoretic tank 30. This allows the electrophoretic fluid temperature control device 10 to be placed directly on the electrophoretic tank 30, making it easy to remove and place, making it convenient to use.

[0045] Referring to Figure 8, the water-cooled head 13 is fixedly arranged on the semiconductor refrigeration sheet 12 by means of thermally conductive silicone 18; the heat sink 14 is fixedly arranged on the semiconductor refrigeration sheet 12 by means of thermally conductive silicone 18. This application no longer uses traditional grease-like thermally conductive silicone grease for heat conduction, nor does it use conductive parts such as metal screws to fix the water-cooled head 13 and the heat sink 14. Instead, it uses highly viscous thermally conductive silicone 18 for bonding. After bonding, the mechanical strength is very high, but it is non-conductive. Therefore, the semiconductor refrigeration sheet 12, the heat sink 14, the cooling fan 15, the water pump 16 and other components are all insulated from the water-cooled head 13, forming electrical isolation, which is not easy to cause electric shock, thereby improving safety. Therefore, the heat sink 14 can be exposed without worrying about the risk of electric shock, and the heat dissipation efficiency can be further improved.

[0046] 4 and 5 , the semiconductor cooling fins 12 , water cooling head 13 , heat sink 14 , and cooling fan 15 are all disposed within the housing 11 , protecting the semiconductor cooling fins 12 , water cooling head 13 , and heat sink 14 , thereby allowing for easy access as a whole. The semiconductor cooling fins 12 , water cooling head 13 , heat sink 14 , and cooling fan 15 are arranged horizontally and side by side, reducing the height and center of gravity of the entire temperature control device 10 . The side of the housing 11 is provided with an air inlet 111 and an air outlet 112 , which better form an air cooling cycle and ensure heat dissipation efficiency.

[0047] 5 and 9 , the water pump 16 is a submersible pump placed at the bottom of the electrophoresis tank 30. The upper end of the liquid pipe 17 is connected to the water cooling head 13. Once powered on, the water pump 16 begins to operate, continuously injecting the electrophoresis fluid 40 into the water cooling head 13. After cooling, the fluid naturally falls back into the electrophoresis tank 30, completing the circulation process.

[0048] The working principle of the present application is as follows: the present application utilizes a water pump 16 and a liquid pipe 17 to circulate the electrophoretic liquid 40, and the electrophoretic liquid 40 continuously enters and flows out of the water-cooled head 13. The cold energy generated by the semiconductor refrigeration plate 12 is transferred to the water-cooled head 13, and the water-cooled head 13 can cool the electrophoretic liquid 40 flowing through it, so there is no need to set up a heat pipe and a circulation pipe, thereby shortening the heat conduction path, improving the heat exchange efficiency, and reducing power. The electrophoretic liquid 40 is used as a circulating cooling medium, and there is no need to immerse the water-cooled head 13 in the electrophoretic liquid 40, thereby reducing the size of the equipment. The generated heat is transferred to the heat sink 14, and then air-cooled by the cooling fan 15, and quickly dissipated into the environment, with a high heat dissipation effect. A smaller heat sink 14 can meet the heat dissipation requirements. The semiconductor refrigeration plate 12 is connected to the water-cooled head 13 and the heat sink 14 by an insulating heat-conducting material (high-viscosity heat-conducting silicone), so that the electrophoretic liquid 40 will not be conductive upward through the water-cooled head 13. There is no electrical conductivity between the water-cooled head 13 and the semiconductor refrigeration plate 12, the heat sink 14 and the cooling fan 15. The heat sink 14 and the cooling fan 15 are not electrically charged, thus achieving good electrical isolation and greatly improving safety. Since no heat pipe is provided, there is no optimal operating temperature problem, and the system can operate normally within the operating temperature range of the semiconductor refrigeration plate 12. The water pump 16 is flexibly connected to the water-cooled head 13 through a soft liquid pipe 17, which is easy to store and not easily damaged by bumps. The present application also has the advantages of simple overall structure, easy assembly, low cost and easy use.

[0049] Example 2:

[0050] 10 , the difference from the first embodiment is that the water pump 16 is provided on the housing 11 , the liquid pipe 17 extends deep into the electrophoresis tank 30 , the water outlet of the water pump 16 is connected to the water cooling head 13 , and there is only one soft liquid pipe 17 to absorb the electrophoresis liquid 40 , which further avoids the problem of collision. The other structures and beneficial effects are consistent with those of the first embodiment and will not be described again here.

[0051] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An isolated electrophoresis liquid temperature control device, characterized in that: The invention comprises a shell (11), a semiconductor refrigeration sheet (12), a water cooling head (13), a heat sink (14), a cooling fan (15), a water pump (16) and a liquid pipe (17); the water cooling head (13) is arranged on the cooling surface of the semiconductor refrigeration sheet (12) through an insulating heat conductive material; the heat sink (14) is arranged on the heat dissipation surface of the semiconductor refrigeration sheet (12) through an insulating heat conductive material; the cooling fan (15) is used for air cooling the heat sink (14); the water pump (16) is connected to the liquid pipe (17) and is used for extracting the electrophoretic liquid (40) to the water cooling head (13) to realize the circulation of the electrophoretic liquid (40); and the water cooling head (13) is used for cooling the electrophoretic liquid (40).

2. The isolated electrophoresis liquid temperature control device according to claim 1, characterized in that: The water cooling head (13) is fixedly arranged on the semiconductor cooling sheet (12) via a heat-conducting silica gel (18).

3. The isolated electrophoresis liquid temperature control device according to claim 1, characterized in that: The heat sink (14) is fixedly arranged on the semiconductor cooling sheet (12) via a heat-conducting silica gel (18).

4. The isolated electrophoresis liquid temperature control device according to claim 1, characterized in that: The semiconductor refrigeration sheet (12), the water cooling head (13), the heat sink (14) and the heat dissipation fan (15) are all arranged in the housing (11).

5. The isolated electrophoresis liquid temperature control device according to claim 4, characterized in that: The semiconductor refrigeration sheet (12), the water cooling head (13), the heat sink (14) and the heat dissipation fan (15) are arranged horizontally in parallel, and an air inlet (111) and an air outlet (112) are provided on the side of the housing (11).

6. A WB wet transfer apparatus, characterized in that: The invention comprises a transfer apparatus body (20), an electrophoresis tank (30) and an isolated electrophoresis fluid temperature control device (10) according to any one of claims 1 to 5, wherein the transfer apparatus body (20) is arranged in the electrophoresis tank (30), the isolated electrophoresis fluid temperature control device (10) is arranged above the electrophoresis tank (30), and the electrophoresis fluid (40) flows out from a water cooling head (13) and falls into the electrophoresis tank (30).

7. The WB wet transfer apparatus according to claim 6, characterized in that: The water pump (16) is a submersible pump (16) placed at the bottom of the electrophoresis tank (30), and the upper end of the liquid pipe (17) is connected to the water cooling head (13).

8. The WB wet transfer apparatus according to claim 6, characterized in that: The water pump (16) is arranged on the housing (11), the liquid pipe (17) extends into the electrophoresis tank (30), and the water outlet of the water pump (16) is connected to the water cooling head (13).

9. The WB wet transfer apparatus according to claim 6, characterized in that: The housing (11) is also provided with a cover plate (113) which serves as a tank cover of the electrophoresis tank (30).

10. The WB wet transfer apparatus according to claim 9, characterized in that: A positioning column (31) is provided at the upper end of the electrophoresis tank (30), and a positioning hole (114) is correspondingly provided on the cover plate (113). The positioning column (31) is inserted into the positioning hole (114) to restrict the electrophoresis liquid temperature control device (10) on the electrophoresis tank (30).

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