Mounting device and component presence / absence determination method

Abstract

A mounting device for mounting a component suctioned by a suction member comprises: an imaging unit that images an imaging target including the suction member in a state where the imaging target is illuminated with light from behind; and a determination unit that processes an image captured by the imaging unit to obtain the luminance value of each pixel, and determines the presence or absence of a component suctioned by the suction member, by setting, as pixels of the component, a pixel having a luminance value not greater than a first threshold value and a pixel having a luminance value not less than a second threshold value which is greater than the first threshold value.

Description

Mounting device and component presence determination method

[0001] This specification discloses a mounting apparatus and a component presence / absence determination method.

[0002] Conventionally, a mounting device that mounts components picked up by a nozzle has been proposed that processes an image of the nozzle taken from the side to determine whether or not a component is present (see, for example, Patent Document 1). This mounting device captures an image with light irradiating the component from behind, causing the nozzle and the component to appear as black shadows in the image. Furthermore, the mounting device determines whether or not a component has been taken home based on whether or not a black area corresponding to the component is detected in the image taken after the component has been mounted.

[0003] International Publication No. 2022 / 254696

[0004] Depending on the type of component, for example, if the component is optically transparent and does not block light, the entire component may not appear as a black shadow in the image. In this case, the black area detected in the image will be smaller than the area corresponding to the component, which may result in an erroneous determination of the presence or absence of the component.

[0005] A primary object of the present disclosure is to accurately determine the presence or absence of a component from an image captured under a condition where light is irradiated from behind.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The mounting device of the present disclosure is a mounting device that mounts a component that has been adsorbed by an adsorption member, and comprises: an imaging unit that images an object to be imaged, including the adsorption member, with light irradiated from behind the object; and a determination unit that processes the image captured by the imaging unit to obtain a brightness value of each pixel, and determines whether or not the component has been adsorbed to the adsorption member, using pixels whose brightness value is equal to or less than a first threshold value and pixels whose brightness value is equal to or greater than a second threshold value that is greater than the first threshold value as pixels of the component.

[0008] In the mounting device disclosed herein, the image captured by the imaging unit is processed to obtain the brightness value of each pixel, and pixels with brightness values ​​equal to or less than a first threshold and pixels with brightness values ​​equal to or greater than a second threshold greater than the first threshold are considered to be component pixels, and the presence or absence of a component attached to the attachment member is determined. By including pixels with brightness values ​​equal to or greater than the second threshold as component pixels, components can be properly detected even if at least a portion of the component appears white in the image without blocking the light. Therefore, the presence or absence of a component can be accurately determined from an image captured with light irradiated from behind.

[0009] 1 is a configuration diagram showing an outline of the configuration of a mounting system 1 including a mounting device 10. A configuration diagram showing an outline of the configuration of a mounting head 40. An explanatory diagram showing an outline of the arrangement of nozzles 44 and the configuration of a side camera 80. An explanatory diagram showing the electrical connection relationship of a control device 90. A flowchart showing an example of a component presence / absence determination process. An explanatory diagram showing an example of a side image G of a normal component. An explanatory diagram showing an example of binarization of a processing area A using a first threshold Lref1. An explanatory diagram showing an example of the luminance distribution of a normal component. An explanatory diagram showing an example of a side image G of a specific component. An explanatory diagram showing an example of the luminance distribution of a specific component. An explanatory diagram showing an example of binarization of a processing area A using a first threshold Lref1. An explanatory diagram showing an example of binarization of a processing area A using a second threshold Lref2. An explanatory diagram showing an example of threshold information 93a in which a threshold is defined for each component type.

[0010] An embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a configuration diagram showing an outline of the configuration of a mounting system 1 including a mounting device 10. Fig. 2 is a configuration diagram showing an outline of the configuration of a mounting head 40. Fig. 3 is an explanatory diagram showing an outline of the arrangement of nozzles 44 and the configuration of a side camera 80. Fig. 4 is an explanatory diagram showing the electrical connection relationship of a control device 90. Note that the left-right direction in Fig. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] As shown in Fig. 1, the mounting system 1 includes a mounting device 10 and a management device 100 that manages the mounting device 10. The mounting system 1 includes a mounting line in which a plurality of mounting devices 10 that mount components P on a board 12 are arranged along the transport direction (X-axis direction) of the board 12. For ease of explanation, Fig. 1 shows only one mounting device 10. Note that the mounting system 1 may also include a solder printer, an inspection machine, a reflow oven, etc. on the mounting line.

[0012] As shown in FIG. 1, the mounting device 10 includes a component supply device 20, a substrate transport device 25, an XY robot 30, a mounting head 40, a part camera 28, a mark camera 29, a side camera 80, and a control device 90 (see FIG. 4).

[0013] A plurality of component supply devices 20 are provided in a row in the left-right direction on the front side of the mounting device 10. Each component supply device 20 is configured as a tape feeder that pulls out a tape 22 (see FIG. 3 ), which has components P accommodated in cavities formed at a predetermined pitch, from a reel 21 and feeds it at a predetermined pitch. The components P accommodated on the tape 22 are protected by a film covering the surface of the tape 22, and the film is peeled off just before the component supply position, leaving the components P exposed.

[0014] 1, the substrate transport device 25 includes a pair of conveyor belts 26, 26 (only one of which is shown in FIG. 1) that are spaced apart from each other and span the left-right direction. When the substrate 12 is transported by the conveyor belts 26, 26 and reaches a predetermined position, it is supported by a number of support pins 27 that are erected on the back surface.

[0015] As shown in FIG. 1 , the XY robot 30 includes a pair of left and right Y-axis guide rails 33, 33 arranged along the front-rear direction, and a Y-axis slider 34 suspended between the pair of left and right Y-axis guide rails 33, 33. The XY robot 30 also includes X-axis guide rails 31, 31 arranged along the left-right direction in front of the Y-axis slider 34, and an X-axis slider 32 attached to the X-axis guide rails 31, 31. The X-axis slider 32 moves in the X-axis direction by driving an X-axis motor 36 (see FIG. 4 ). The Y-axis slider 34 moves in the Y-axis direction by driving a Y-axis motor 38 (see FIG. 4 ). A mounting head 40, a mark camera 29, and a side camera 80 are attached to the X-axis slider 32. The mounting head 40, the mark camera 29, and the side camera 80 can be moved to any position on the XY plane by movement of the XY robot 30.

[0016] As shown in FIG. 2 , the mounting head 40 includes a head body 41, a nozzle holder 42, and nozzles 44 (suction members). The head body 41 is a disk-shaped rotating body, and a cylindrical reflector 41a (see FIG. 3 ) capable of reflecting light is attached to the center of its underside. The mounting head 40 is configured as a rotary head, and multiple nozzle holders 42 are provided at predetermined intervals around the circumference of the head body 41. The nozzles 44 are replaceably attached to the tip of each nozzle holder 42 and pick up and hold components P from the component supply device 20. The nozzles 44 suction and hold the components P at their tips (lower ends) when negative pressure is supplied via a pressure adjustment valve 46 (see FIG. 4 ), and release the components P when atmospheric pressure or positive pressure is supplied. Note that FIG. 2 omits the reflector 41a and shows eight nozzle holders 42 and eight nozzles 44, but in this embodiment, as shown in FIG. 3 , the number of nozzles 44 is 12. Therefore, the number of nozzle holders 42 is also 12. The mounting head 40 is equipped with an R-axis drive unit 50, a Q-axis drive unit 60, and Z-axis drive units 70. In Fig. 2, the two nozzle holders 42 that are positioned to engage with the Z-axis drive units 70 are indicated by solid lines, and the other nozzle holders 42 are indicated by dashed lines.

[0017] The R-axis drive device 50 is a mechanism that rotates the head main body 41 to revolve the multiple nozzles 44. It includes an R-axis 51, an R-axis motor 54, and an R-axis position sensor 55 (see FIG. 4 ) that detects the rotational position of the R-axis motor 54. The R-axis 51 extends vertically, and its lower end is attached to the center axis of the head main body 41. The R-axis motor 54 rotates a gear 53 that meshes with an R-axis gear 52 provided at the upper end of the R-axis 51. The R-axis drive device 50 rotates the R-axis 51 by a predetermined angle (e.g., 30 degrees) via the gear 53 and the R-axis gear 52 using the R-axis motor 54, thereby rotating the head main body 41 in the direction of the arrow (clockwise) in FIG. 3 by a predetermined angle. This causes the multiple nozzle holders 42 and the multiple nozzles 44 to revolve (revolve) in the circumferential direction by a predetermined angle.

[0018] On the orbital path of the nozzle 44, there are work positions where the nozzle 44 picks up (sucks up) the component P and where the component P picked up by the nozzle 44 is mounted on the board 12. In this embodiment, two nozzle positions P1 shown in FIG. 3 are the work positions. For each nozzle position P1, the position immediately after (the position immediately after) is called nozzle position P2, and the position immediately before (the position immediately before) is called nozzle position P3 on the orbital path. Each of the nozzle positions P2 and P3 is a position where the side camera 80 can capture an image of at least one of the nozzle 44 and the component P held by the nozzle 44, and is also referred to as an image capture position.

[0019] The Q-axis drive device 60 is a mechanism for synchronously rotating (spinning) the multiple nozzles 44, and includes two stages of Q-axis gears 61 and 62 (upper and lower), gears 63 and 64, a Q-axis motor 65, and a Q-axis position sensor 66 (see FIG. 4) that detects the rotational position of the Q-axis motor 65. The Q-axis gears 61 and 62 are inserted coaxially with and relatively rotatable about the R-shaft 51. The gear 63 is provided at the top of each nozzle holder 42 and meshes with the lower-stage Q-axis gear 61 so as to be slidable in the vertical direction. The Q-axis motor 65 drives and rotates the gear 64 that meshes with the upper-stage Q-axis gear 62. The Q-axis drive device 60 rotates the Q-axis gears 61 and 62 using the Q-axis motor 65, thereby rotating the gear 63 that meshes with the Q-axis gear 61, and causing each nozzle holder 42 (nozzle 44) to rotate (spin) around its central axis in the same direction and by the same amount of rotation (rotation angle).

[0020] The Z-axis drive units 70, 70 are provided at two locations on the orbital path of the nozzle holder 42 and are configured to independently raise and lower the nozzle holder 42 at the two nozzle positions P1 described above. The Z-axis drive unit 70 includes a Z-axis slider 71, a Z-axis motor 73, and a Z-axis position sensor 74 (see FIG. 4 ) that detects the vertical position of the Z-axis slider 71. The Z-axis slider 71 is attached to a ball screw 72 extending vertically so as to be capable of raising and lowering, and includes a clamping portion 71a that clamps an engaging piece 42a extending laterally from the nozzle holder 42. The Z-axis motor 73 raises and lowers the Z-axis slider 71 by rotating the ball screw 72. When the nozzle holder 42 revolves and stops at nozzle position P1, the engaging piece 42a is clamped by the clamping portion 71a of the Z-axis slider 71. Therefore, the Z-axis driving device 70 drives the Z-axis motor 73 to move the Z-axis slider 71 up and down along the ball screw 72, thereby enabling the nozzle holder 42 and the nozzle 44 to move up and down.

[0021] 1, part camera 28 is provided between component supply device 20 and board transport device 25, and captures an image of the component P sucked onto nozzle 44 from below, thereby obtaining an image of the bottom surface of component P. Mark camera 29 is provided on the bottom surface of X-axis slider 32, and captures an image of a reference mark or the like provided on board 12.

[0022] As described above, the side camera 80 captures an image of at least one of the nozzles 44 positioned at the imaging positions (four nozzle positions P2 and P3) and the components P held by the nozzles 44, thereby acquiring a side image. As shown in FIG. 3 , the side camera 80 includes a camera body 82 and a housing 84 having an optical system unit that forms an optical path to the camera body 82. The housing 84 is disposed so as to surround the left, right, and rear sides of the multiple nozzles 44, and first to fourth light inlets 86a to 86d are formed at the left front, left rear, right rear, and right front positions of the head body 41. The first to fourth light inlets 86a to 86d face the nozzle positions P2 and P3, respectively. Furthermore, the housing 84 is provided with multiple light emitters 87 (four in FIG. 3 ) such as LEDs on its outer peripheral surface facing the multiple nozzles 44, which emit light toward the reflector 41a attached to the head body 41. The housing 84 is internally provided with multiple light reflecting mirrors 88a to 88k. The housing 84 may include another optical system, such as a prism, that refracts light instead of or in addition to one or more of the mirrors 88a-88k. The mirrors 88a-88e are disposed on the left side of the housing 84 and form optical paths indicated by dashed lines in the figure, guiding light incident from the first and second light entrances 86a, 86b to the mirror 88k in front of the camera body 82. The mirrors 88f-88j are disposed on the right side of the housing 84 and form optical paths indicated by dashed lines in the figure, guiding light incident from the third and fourth light entrances 86c, 86d to the mirror 88k. The mirror 88k guides the light reaching the first to fourth light entrances 86a-86d to the camera body 82.

[0023] In this way, light from each of the four nozzle positions P2 and P3 reaches different regions of the imaging element of the camera body 82 and forms an image. Therefore, the side camera 80 can acquire a side image in which the nozzles 44 and components P at the four nozzle positions P2 and P3 are captured in a single image with a single imaging operation. The camera body 82 receives light emitted from the light emitter 87 and reflected by the reflector 41a. Therefore, in the side image, the nozzles 44 and components P that block the light usually appear as black shadows, and the other background areas appear white.

[0024] As shown in FIG. 4 , the control device 90 includes a CPU 91, a ROM 92, a HDD 93, a RAM 94, and an input / output interface (I / F) 95. These are electrically connected via a bus 96. Detection signals from the XY robot 30, detection signals from the mounting head 40 (R-axis position sensor 55, Q-axis position sensor 66, and Z-axis position sensors 74, 74), image signals from the part camera 28, mark camera 29, and side camera 80, and the like are input to the control device 90 via the input / output interface 95. Furthermore, the control device 90 outputs control signals to the component supply device 20, the board transport device 25, the XY robot 30 (X-axis motor 36, Y-axis motor 38), the mounting head 40 (R-axis motor 54, Q-axis motor 65, Z-axis motors 73, 73), the pressure adjustment valve 46, the part camera 28, the mark camera 29, and the side camera 80, and the like, via the input / output interface 95. The control device 90 is also connected to the management device 100 so as to be capable of two-way communication, and exchanges data and control signals with each other.

[0025] The management device 100 manages the entire mounting system 1. As shown in FIG. 4 , the management device 100 includes a CPU 101, a ROM 102, a HDD 103, a RAM 104, and an input / output interface (I / F) 105. These components are electrically connected via a bus 106. The management device 100 also includes an input device 107 such as a keyboard or a mouse, and a display 108 such as an LCD. An input signal from the input device 107 is input to the management device 100 via the I / O interface 105. An image signal is output from the management device 100 to the display 108 via the I / O interface 105. The management device 100 transmits and receives information to and from the control device 90 of the mounting device 10 via the I / O interface 105. The HDD 103 stores a production program for the board 12 and various data transmitted from each mounting device 10. The production program includes information on which components P should be mounted in which order at which positions on the board 12 in each mounting device 10, as well as information on how many boards 12 should be produced. The production program also includes information on the size of the components P and whether they are optically transparent.

[0026] Next, the mounting process of the mounting device 10 of the mounting system 1 configured as described above will be described. The mounting process is executed by the control device 90 of the mounting device 10 based on the production program for the board 12. In the mounting process, the CPU 91 of the control device 90 controls the XY robot 30 to move the mounting head 40 above the component supply position, controls the Z-axis motor 73 to lower the nozzle 44 at nozzle position P1, and allows the nozzle 44 to pick up the component P. The CPU 91 repeats the operations of controlling the R-axis motor 54 to rotate the nozzle holder 42 and controlling the Z-axis motor 73 to pick up the component P at the nozzle 44 until the expected number of components P are picked up. The CPU 91 also controls the side camera 80 to capture a side image of the nozzle 44 at nozzle position P2 and the component P, and checks the presence or absence of the component P, the height of the component P, etc. based on the obtained side image. Next, the CPU 91 controls the XY robot 30 to move the mounting head 40 above the part camera 28, and controls the part camera 28 to capture an image of the underside of the component P. Furthermore, the CPU 91 determines the deviation of the pickup position of the component P based on the obtained bottom surface image, and corrects the target mounting position of the component P.

[0027] The CPU 91 then controls the XY robot 30 to move the nozzle 44 above the target mounting position and controls the Z-axis motor 73 to lower the nozzle 44 at nozzle position P1, thereby mounting the component P on the board 12. The CPU 91 repeatedly mounts the component P picked up by each nozzle 44 at its respective target mounting position. Here, an error may occur in which the component P does not separate from the nozzle 44 after mounting the component P, a so-called "take-home error." For this reason, the CPU 91 controls the side camera 80 to capture a side image of the nozzle 44 after mounting the component P, and checks the presence or absence of the component P based on the obtained side image. The following describes the component presence / absence determination process. Note that, although the following illustrates an example of a process for determining a take-home error, the process may also be used to confirm that the component P supplied to the component supply position was successfully picked up.

[0028] FIG. 5 is a flowchart illustrating an example of a component presence / absence determination process. This process is executed by the CPU 91 of the control device 90. In the component presence / absence determination process, the CPU 91 first controls the side camera 80 to capture a side image G of the nozzle 44 after the component P has been mounted (S100), and then performs image processing on the processing area A of the side image G to obtain the brightness value L of each pixel (S110). Next, the CPU 91 determines whether the currently mounted component P is a specific component (S120). As described above, the component P is typically depicted as a black shadow in the side image G. However, depending on the type of component P, such as when the component P has a translucent portion formed from a light-transmitting material, at least a portion of the component P may appear white rather than black. In this embodiment, a component P that appears at least partially white is referred to as a specific component, and a component P that appears normally black is referred to as a normal component. Information as to whether a part P is a specific part or a normal part is registered in association with information such as the type and size of the part P in part information stored in a storage unit such as the HDD 93 .

[0029] When the CPU 91 determines in S120 that the component P is not a specific component but a normal component, it executes a first binarization process to binarize the luminance value L of each pixel using a first threshold value Lref1, and calculates the number of pixels in the region where the luminance value L is equal to or less than the first threshold value Lref1 as a pixel area S1 (S130). The pixel area S1 is the area of ​​the black region.

[0030] FIG. 6 is an explanatory diagram showing an example of a side image G of a normal component. FIG. 7 is an explanatory diagram showing an example of binarizing the processing area A using the first threshold Lref1. The side image G in FIG. 6 is an example of an image in which a component P has been taken home, and shows the nozzle 44 and the component P as a normal component. Note that, as described above, the nozzles 44 and the component P at four nozzle positions P2 and P3 are included in a single image in the side image G. However, for convenience of explanation, an image at one nozzle position P2 after the component P has been mounted is shown. The processing area A is, for example, a rectangular area defined to a predetermined size based on the lower end position of the nozzle 44 in the side image G. FIG. 7 also shows the processing area A of the side image G in FIG. 6 binarized using the first threshold Lref1. If the component P is a normal component, the binarization results in black pixels, and therefore substantially the entire component P has a pixel area S1. Furthermore, the background area other than the component P is white pixels.

[0031] 8 is an explanatory diagram showing an example of the luminance distribution of a normal part. As shown in the figure, in the case of a normal part, the pixels of the part P have a relatively low luminance value, while the pixels of the other background have a high luminance value. The first threshold value Lref1 is set in advance to a predetermined luminance value, such as 50, based on this luminance distribution so that the part P and the background can be appropriately distinguished from each other.

[0032] The CPU 91 then determines whether the pixel area S1 calculated in S130 is equal to or greater than a predetermined area threshold Sref (S140). The area threshold Sref is a value determined by multiplying an area based on the vertical and horizontal sizes of the component P displayed in the side image G by a predetermined coefficient less than 1 to prevent erroneous determination due to the influence of noise, for example. If the CPU 91 determines that the pixel area S1 is equal to or greater than the area threshold Sref, it determines that a component P is present (a take-home error) (S150) and terminates this processing. On the other hand, if the CPU 91 determines that the pixel area S1 is not equal to or greater than the area threshold Sref but is less than the area threshold Sref, it determines that a component P is not present (no take-home) (S160) and terminates this processing. Note that if the CPU 91 determines that a take-home error has occurred, it performs processing such as disposing of the component P in a waste box (not shown).

[0033] On the other hand, if the CPU 91 determines in S120 that the part P is a specific part, it performs a first binarization process to binarize the luminance value L of each pixel using a first threshold value Lref1, as in S130, and calculates the number of pixels in the region where the luminance value L is equal to or less than the first threshold value Lref1 as a pixel area S1 (S170). Next, the CPU 91 performs a second binarization process to binarize the luminance value L using a second threshold value Lref2 that is greater than the first threshold value Lref1, and calculates the number of pixels in the region where the luminance value L is equal to or greater than the second threshold value Lref2 as a pixel area S2 (S180).

[0034] FIG. 9 is an explanatory diagram showing an example of a side image G of a specific component. Because the specific component is optically transparent, light emitted from the light emitter 87 is reflected by the reflector 41a, thereby transmitting at least a portion of the light irradiated from behind. Therefore, as shown in FIG. 9, the component P in the side image G has a partially white region Pw within it. FIG. 10 is also an explanatory diagram showing an example of the luminance distribution of the specific component. In the specific component, the region Pw appears white, resulting in pixels with high luminance values, and the pixel area S1 below the first threshold Lref1 becoming smaller. Therefore, if the presence or absence of the component P is determined solely based on the pixel area S1, as with a normal component, it may be erroneously determined that the component P is absent even when it is actually present.

[0035] Therefore, in this embodiment, first, in a first binarization process in S170, the processing area A is binarized using a first threshold Lref1, and a pixel area S1 of a black area whose luminance value L is equal to or less than the first threshold Lref1 is calculated (see FIG. 11). In the first binarization process, the pixels of the above-mentioned area PW have a value greater than the first threshold Lref, just like the background, and are therefore not included in the pixel area S1. Next, in a second binarization process in S180, the processing area A is binarized using a second threshold Lref2, and a pixel area S2 of a white area whose luminance value L is equal to or greater than the second threshold Lref2 is calculated (see FIG. 12). In the second binarization process, only the pixels of the area PW are extracted to calculate the pixel area S2.

[0036] The CPU 91 then determines whether the sum of the pixel area S1 and the pixel area S2 calculated in S170 and S180 is equal to or greater than a predetermined area threshold Sref (S190). As in S140, the area threshold Sref is a value determined by multiplying the area based on the vertical and horizontal sizes of the specific component displayed in the side image G by a predetermined coefficient. If the CPU 91 determines that the sum of the pixel area S1 and the pixel area S2 is equal to or greater than the area threshold Sref, it determines that a component P is present (a take-home error) (S200) and terminates this process. On the other hand, if the CPU 91 determines that the pixel area S1 is not equal to or greater than the area threshold Sref but is less than the area threshold Sref, it determines that a component P is not present (S160) and terminates this process. As in S150, in S200, the CPU 91 performs processing such as discarding the component P.

[0037] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The side camera 80 of this embodiment corresponds to the imaging unit of the present disclosure, and the control device 90 that executes the component presence determination process corresponds to the determination unit. In this embodiment, the operation of the mounting device 10 (control device 90) is explained, thereby clarifying an example of the component presence determination method of the present disclosure.

[0038] In the mounting device 10 described above, the control device 90 processes the side image G captured by the side camera 80 to obtain the brightness value L of each pixel, and determines whether or not a component P is adsorbed to the nozzle 44 by considering pixels whose brightness value L is equal to or less than a first threshold value Lref1 and pixels whose brightness value L is equal to or greater than a second threshold value Lref2 that is greater than the first threshold value Lref1 as pixels of the component P. By including pixels whose brightness value L is equal to or greater than the second threshold value Lref2 as pixels of the component P, the component P can be properly detected even if at least a portion of the component P appears white in the side image G without blocking the light. Therefore, the presence or absence of the component P can be accurately determined from the side image G captured with light irradiated from behind.

[0039] The control device 90 also executes a first binarization process that binarizes the luminance value L using a first threshold value Lref1 to obtain the number of pixels equal to or less than the first threshold value Lref1, and executes a second binarization process that binarizes the luminance value L using a second threshold value Lref2 to obtain the number of pixels equal to or greater than the second threshold value Lref2. The control device 90 then determines that a component P is present on the nozzle 44 when the pixel area (S1+S2), which is a value based on the sum of the number of pixels equal to or less than the first threshold value Lref1 and the number of pixels equal to or greater than the second threshold value Lref2, is equal to or greater than an area threshold value Sref (determination threshold) based on the area of ​​the component P. This allows for accurate determination of the presence or absence of a component P through a simple process that involves executing the binarization process twice.

[0040] Furthermore, when the component P to be judged is a specific component having at least a portion that is optically transparent, the control device 90 executes the first binarization process and the second binarization process to determine the presence or absence of the component P. On the other hand, when the component P to be judged is a normal component other than the specific component, the control device 90 omits the second binarization process and executes the first binarization process to determine the presence or absence of the component P. Because the second binarization process is not executed on normal components other than the specific component, it is possible to prevent the time required to determine the presence or absence of the component P from being longer than necessary. In other words, the judgment process can be performed more efficiently than in a case where the first binarization process and the second binarization process are executed uniformly to determine the presence or absence of the component P regardless of whether the component P is optically transparent.

[0041] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0042] In the embodiment, the same second threshold Lref2 is used regardless of the type of the part P (specific part) to be judged, but this is not limited to this. Fig. 13 is an explanatory diagram showing an example of threshold information 93a in which thresholds are defined for each part type. This threshold information 93a is stored in a storage unit, such as the HDD 93 of the control device 90. As shown in the figure, the same first threshold Lref1 is defined regardless of the part type, and different second thresholds Lref2 are defined depending on the part type. For example, a second threshold Lref2A is defined for part type A, a second threshold Lref2B different from the second threshold Lref2A is defined for part type B, and a second threshold Lref2C different from the second thresholds Lref2A and Lref2B is defined for part type C.

[0043] Furthermore, the control device 90 may perform the second binarization process using a second threshold value Lref2 determined according to the component type of the component P to be determined. Here, because the shape and degree of light transmission vary depending on the component type, the tendency of the luminance value L of the area Pw that appears partially white within the component P varies. In this modified example, by predetermining the second threshold value Lref2 based on such tendencies for each component type, the control device 90 can appropriately determine the area of ​​the component P that includes the area Pw, thereby more accurately determining the presence or absence of the component P. Note that, if the component types have similar tendencies in the luminance values ​​L, the same second threshold value Lref2 may be used even for different component types. Furthermore, instead of the second threshold value Lref2, a different first threshold value Lref1 may be used depending on the component type.

[0044] In the embodiment, the control device 90 determines the presence or absence of the part P by performing the first binarization process and omitting the second binarization process when the part P is not a specific part but a normal part, but this is not limited to this. The control device 90 may determine the presence or absence of the part P by performing the first binarization process and the second binarization process regardless of whether the part P is a specific part or a normal part, that is, for all parts P. However, in order to perform the determination process efficiently, the method as in the embodiment is preferable.

[0045] In the embodiment, two binarization processes are performed: a first binarization process that binarizes the luminance values ​​using the first threshold Lref1, and a second binarization process that binarizes the luminance values ​​using the second threshold Lref2. However, this is not limited to this. That is, any process may be used as long as it determines whether or not a component P is picked up by the nozzle 44 by defining pixels whose luminance values ​​are equal to or less than the first threshold Lref1 and pixels whose luminance values ​​are equal to or greater than the second threshold Lref2 as component pixels. For example, the control device 90 may create a luminance distribution such as that shown in FIG. 10 , and based on the luminance distribution, calculate the number of pixels whose luminance values ​​are equal to or less than the first threshold Lref1 and the number of pixels whose luminance values ​​are equal to or greater than the second threshold Lref2, and use these as the number of component pixels to determine whether or not a component P is picked up. Alternatively, the control device 90 may calculate, from the luminance distribution, the number of pixels that exceed the first threshold Lref1 and are less than the second threshold Lref2 as the number of background pixels. The control device 90 may then subtract the number of background pixels from the total number of pixels in the processing area A, calculate the result as the sum of the number of pixels below the first threshold Lref1 and the number of pixels whose brightness value is above the second threshold Lref2, and use this total number of pixels as the number of pixels of the part to determine whether or not the part P is present.

[0046] In the embodiment, the present disclosure has been described as being applied to the mounting device 10, but the present disclosure is not limited thereto and may be applied to a component presence / absence determination method. Furthermore, the management device 100 may perform a component presence / absence determination process based on a side image G captured by the side camera 80 of the mounting device 10.

[0047] The present disclosure is applicable to the technical field of mounting components.

[0048] 1 Mounting system, 10 Mounting device, 12 Substrate, 20 Component supply device, 21 Reel, 22 Tape, 25 Substrate transport device, 26 Conveyor belt, 27 Support pin, 28 Parts camera, 29 Mark camera, 30 XY robot, 31 X-axis guide rail, 32 X-axis slider, 33 Y-axis guide rail, 34 Y-axis slider, 36 X-axis motor, 38 Y-axis motor, 40 Mounting head, 41 Head body, 41a Reflector, 42 Nozzle holder, 42a Engagement piece, 44 Nozzle, 44c Nozzle center, 46 Pressure adjustment valve, 50 R-axis drive device, 51 R-axis, 52 R-axis gear, 53 Gear, 54 R-axis motor, 55 R-axis position sensor, 60 Q-axis drive device, 61 Q-axis gear, 62 Q-axis gear, 63, 64 Gear, 65 Q-axis motor, 66 Q-axis position sensor, 70 Z-axis drive device, 71 Z-axis slider, 71a clamping portion, 72 ball screw, 73 Z-axis motor, 74 Z-axis position sensor, 80 side camera, 82 camera body, 84 housing, 86a to 86d first to fourth incident ports, 87 light emitter, 88a to 88k mirror, 90 control device, 91, 101 CPU, 92, 102 ROM, 93, 103 HDD, 93a threshold information, 94, 104 RAM, 95, 105 input / output interface, 96, 106 bus, 100 management device, 107 input device, 108 display, A processing area, G side image, P part, Pw white area, S1 area of ​​black area, S2 area of ​​white area.

Claims

1. A mounting device that mounts a component adsorbed by an attraction member, comprising: an imaging unit that images an object to be imaged including the attraction member while light is irradiated from behind the object; and a determination unit that processes the image captured by the imaging unit to obtain a brightness value of each pixel, and determines whether or not the component has been adsorbed to the attraction member by determining, as pixels of the component, pixels whose brightness values ​​are equal to or less than a first threshold value and pixels whose brightness values ​​are equal to or greater than a second threshold value that is greater than the first threshold value.

2. The mounting device described in claim 1, wherein the judgment unit obtains the number of pixels below the first threshold by performing a first binarization process that binarizes brightness values ​​using the first threshold, and obtains the number of pixels above the second threshold by performing a second binarization process that binarizes brightness values ​​using the second threshold, and judges that the component is adsorbed to the adsorption member when a value based on the sum of the number of pixels below the first threshold and the number of pixels above the second threshold is equal to or greater than a judgment threshold based on the area of ​​the component.

3. The mounting device described in claim 2, wherein the determination unit, when the component to be determined is a specific component having at least a portion thereof that is optically transparent, performs the first binarization process and the second binarization process to determine the presence or absence of the component, and, when the component to be determined is a component other than the specific component, omits the second binarization process and performs the first binarization process to determine the presence or absence of the component.

4. The mounting device according to claim 1 or 2, wherein the determination unit determines the presence or absence of the component using the second threshold value determined according to the type of the component to be determined.

5. A method for determining whether or not a part has been adsorbed by an adsorption member, comprising: (a) a step of imaging an object to be imaged including the adsorption member while light is irradiated from behind the object to be imaged; and (b) a step of processing the image captured in step (a) to obtain a brightness value of each pixel, and determining whether or not the part has been adsorbed to the adsorption member by ...

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