Superconducting wire material manufacturing method and manufacturing device

Abstract

This superconducting wire material manufacturing method comprises: a step for preparing a superconducting wire material for cutting that has a first main surface and a second main surface which is the surface opposite from the first main surface; and a step for conveying the superconducting wire material for cutting, along the length direction of the superconducting wire material for cutting, using a first conveyance mechanism and a second conveyance mechanism that are positioned at a distance from each other. The superconducting wire material for cutting is supported at the first main surface by a pulley that is positioned between the first conveyance mechanism and the second conveyance mechanism. This superconducting wire material manufacturing method further comprises a step for cutting the superconducting wire material for cutting, by using a laser to irradiate the second main surface in a section of the superconducting wire material for cutting, said section being supported by the pulley when the superconducting wire material for cutting is being conveyed.

Description

Superconducting wire manufacturing method and manufacturing device

[0001] The present disclosure relates to a method and apparatus for manufacturing a superconducting wire. This application claims priority to Japanese Patent Application No. 2023-130200, filed on August 9, 2023. The entire contents of this Japanese patent application are incorporated herein by reference.

[0002] For example, Japanese Patent Laid-Open Publication No. 2013-55061 (Patent Document 1) describes a superconducting wire. The superconducting wire described in Patent Document 1 has a textured metal substrate, an intermediate layer disposed on the textured metal substrate, and an oxide superconducting layer disposed on the intermediate layer. The superconducting wire described in Patent Document 1 is wide (for example, has a width of 2 cm or more).

[0003] For example, Japanese Patent Laid-Open Publication No. 2017-91679 (Patent Document 2) describes a method for cutting a superconducting wire. In the method for cutting a superconducting wire described in Patent Document 2, the superconducting wire is cut by irradiating it with a laser.

[0004] JP 2013-55061 A JP 2017-91679 A

[0005] A method for manufacturing a superconducting wire according to the present disclosure includes the steps of preparing a superconducting wire to be cut, the superconducting wire having a first main surface and a second main surface opposite the first main surface, and transporting the superconducting wire along a longitudinal direction of the superconducting wire by a first transport mechanism and a second transport mechanism spaced apart from each other. The superconducting wire to be cut is supported at its first main surface by pulleys arranged between the first transport mechanism and the second transport mechanism. The method for manufacturing a superconducting wire further includes the step of cutting the superconducting wire by irradiating a laser onto a portion of the second main surface of the superconducting wire supported by the pulleys while the superconducting wire to be cut is being transported.

[0006] FIG. 1 is a plan view of superconducting wire 10. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 . FIG. 3 is a schematic diagram of manufacturing apparatus 100. FIG. 4 is a perspective view of pulley 40. FIG. 5 is a front view of pulley 40. FIG. 6 is a partially enlarged front view of pulley 40. FIG. 7A is a schematic diagram showing a first irradiation mode of laser L. FIG. 7B is a schematic diagram showing a second irradiation mode of laser L. FIG. 8 is a cross-sectional view of superconducting wire 10 according to Modification 1. FIG. 9 is a schematic cross-sectional view of pulley 40 according to Modification 3. FIG. 10 is a schematic diagram of laser light source 50 according to Modification 4. FIG. 11 is a schematic diagram showing an irradiation mode of laser L when laser L is branched into multiple beams. FIG. 12 is a schematic diagram showing an irradiation mode of laser L according to Modification 4. FIG. 13 is a plan view of superconducting wire 10 according to Modification 6 after scribing.

[0007] [Problem to be Solved by the Present Disclosure] Wide superconducting wires, such as the superconducting wire described in Patent Document 1, are subject to warping in the width direction. Therefore, when attempting to cut a wide superconducting wire with a laser, as in the method for cutting a superconducting wire described in Patent Document 2, the warping causes the laser to become misfocused. The greater the misfocus, the more the laser processing becomes thermal processing rather than ablation processing.

[0008] The present disclosure addresses the above-described problems of the conventional techniques, and more specifically, the present disclosure provides a method for manufacturing a superconducting wire that can suppress laser focus shifts caused by warpage of the superconducting wire to be cut.

[0009] Effect of the Present Disclosure According to the method for manufacturing a superconducting wire of the present disclosure, it is possible to suppress deviation of the laser focus caused by warpage of the superconducting wire to be cut.

[0010] [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be listed and described.

[0011] (1) A method for manufacturing a superconducting wire according to an embodiment includes the steps of preparing a superconducting wire to be cut, the superconducting wire having a first main surface and a second main surface opposite the first main surface, and transporting the superconducting wire along a longitudinal direction of the superconducting wire by a first transport mechanism and a second transport mechanism that are spaced apart from each other. The superconducting wire to be cut is supported at its first main surface by pulleys that are arranged between the first transport mechanism and the second transport mechanism. The method for manufacturing a superconducting wire further includes the step of cutting the superconducting wire to be cut by irradiating a laser onto a portion of the second main surface of the superconducting wire that is supported by the pulleys while the superconducting wire to be cut is being transported.

[0012] According to the method for manufacturing a superconducting wire described above in (1), it is possible to suppress deviation of the laser focus caused by warping of the superconducting wire to be cut.

[0013] (2) In the method for manufacturing a superconducting wire according to (1) above, the laser irradiation position on the second main surface may be scanned by a galvanometer scanner.

[0014] According to the method for manufacturing a superconducting wire described above in (2), it is possible to reduce the thermal influence on the superconducting wire caused by laser irradiation.

[0015] (3) In the method for producing a superconducting wire according to (1) or (2), the first transport mechanism may be located upstream of the second transport mechanism in the transport direction of the superconducting wire to be cut. The first transport mechanism may have a plurality of rollers arranged in a staggered pattern.

[0016] According to the method for manufacturing a superconducting wire described above in (3), it is possible to further suppress deviation of the laser focus caused by warpage of the superconducting wire to be cut.

[0017] (4) In the method for manufacturing a superconducting wire according to any one of (1) to (3), the pulley may have an outer circumferential surface in contact with the first main surface, and a groove may be formed in the outer circumferential surface, extending in a circumferential direction of the pulley.

[0018] According to the method for manufacturing a superconducting wire described above in (4), it is possible to prevent debris from being generated on the pulley after the laser penetrates the superconducting wire to be cut.

[0019] (5) In the method for manufacturing a superconducting wire according to (4), a flow path may be formed inside the pulley. The flow path may be open at a bottom surface of the groove. When the superconducting wire to be cut is supported by the pulley, the superconducting wire to be cut may be sucked through the flow path.

[0020] According to the method for manufacturing a superconducting wire described above in (5), debris generated after the laser penetrates the superconducting wire to be cut can be removed from the laser irradiated area.

[0021] (6) In the method for manufacturing a superconducting wire according to any one of (1) to (5) above, the superconducting wire to be cut may further include a substrate, an intermediate layer disposed on the substrate, and a superconducting layer disposed on the intermediate layer. The substrate may constitute the second main surface.

[0022] According to the method for manufacturing a superconducting wire described above in (6), it is possible to further suppress deviation of the laser focus caused by warpage of the superconducting wire to be cut.

[0023] (7) In the method for manufacturing a superconducting wire according to any one of (1) to (5) above, the superconducting wire to be cut may further include a substrate, an intermediate layer disposed on the substrate, and a superconducting layer disposed on the intermediate layer. The substrate may constitute the first main surface.

[0024] According to the method for manufacturing a superconducting wire described above in (7), it is possible to suppress the performance degradation of the superconducting wire due to cutting.

[0025] (8) In the method for producing a superconducting wire according to (6) or (7), the superconducting wire to be cut may further have a protective layer. The protective layer may be disposed on the superconducting layer.

[0026] (9) In the method for producing a superconducting wire according to (8), the superconducting wire to be cut may further include a stabilizing layer. The stabilizing layer may be disposed on the protective layer.

[0027] (10) In the above methods for manufacturing a superconducting wire according to (1) to (9), the wavelength of the laser may be in the green band, the ultraviolet band, or the infrared band.

[0028] According to the method for manufacturing a superconducting wire described above in (10), it is possible to reduce the thermal influence on the superconducting wire caused by laser irradiation.

[0029] (11) In the method for manufacturing a superconducting wire according to any one of (1) to (10) above, an assist gas may be supplied to the laser irradiation location.

[0030] According to the method for manufacturing a superconducting wire described above in (11), it is possible to remove debris generated from the superconducting wire to be cut in the vicinity of the position where the laser is irradiated as a result of the laser irradiation.

[0031] (12) In the method for producing a superconducting wire according to (1), a laser may be split into a plurality of beams by a diffractive optical element, and each of the irradiation positions of the plurality of beams may be scanned by a galvanometer scanner.

[0032] According to the method for manufacturing a superconducting wire described above in (12), the processing efficiency of the superconducting wire to be cut is improved.

[0033] (13) In the method for manufacturing a superconducting wire according to (1) above, the laser irradiation position on the second main surface may be offset along the longitudinal direction of the superconducting wire to be cut.

[0034] According to the method for manufacturing a superconducting wire described in (13) above, the thermal influence on the superconducting layer is reduced and processing efficiency is improved.

[0035] (14) A manufacturing apparatus according to an embodiment includes a first conveying mechanism, a second conveying mechanism, a pulley, and a laser light source. The first conveying mechanism and the second conveying mechanism are spaced apart from each other and convey the superconducting wire to be cut along the longitudinal direction of the superconducting wire to be cut. The pulley is located between the first conveying mechanism and the second conveying mechanism and supports a first main surface of the superconducting wire to be cut. The laser light source irradiates a laser onto a second main surface of a portion of the superconducting wire to be cut that is supported by the pulley.

[0036] According to the manufacturing apparatus of (14) above, it is possible to suppress deviation of the laser focus caused by warping of the superconducting wire to be cut.

[0037] (15) In the manufacturing apparatus of (14) above, the laser light source may have a galvanometer scanner that scans the laser irradiation position.

[0038] According to the manufacturing apparatus of (15) above, it is possible to reduce the thermal influence on the superconducting wire caused by the laser irradiation.

[0039] (16) In the manufacturing apparatus of (14) or (15), the laser light source may further include a diffractive optical element that splits the laser into multiple beams. According to the manufacturing apparatus of (16), the processing efficiency of the superconducting wire to be cut is improved.

[0040] (17) In the manufacturing apparatus of (14) to (16) above, the first conveying mechanism may be located upstream of the second conveying mechanism in the conveying direction of the superconducting wire to be cut. The first conveying mechanism may have a plurality of rollers arranged in a staggered pattern. The manufacturing apparatus of (17) above can further suppress deviation of the laser focus due to warping of the superconducting wire to be cut.

[0041] (18) In the manufacturing apparatus of (14) to (17) above, the pulley may have an outer peripheral surface that contacts the first main surface. The outer peripheral surface may have a groove that extends along the circumferential direction of the pulley. The manufacturing apparatus of (18) above can prevent debris from being generated on the pulley after the laser penetrates the superconducting wire to be cut.

[0042] (19) In the manufacturing apparatus of (18) above, a flow path may be formed inside the pulley. The flow path may be open at a bottom surface of the groove. When the superconducting wire to be cut is supported by the pulley, the superconducting wire to be cut may be sucked through the flow path. According to the manufacturing apparatus of (19) above, debris generated after the laser penetrates the superconducting wire to be cut can be removed from the laser irradiation location.

[0043] [Details of the embodiment of the present disclosure] Details of the embodiment of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description will not be repeated.

[0044] (Configuration of Superconducting Wire 10) The following describes the configuration of the superconducting wire 10. The superconducting wire 10 is a superconducting wire to be cut.

[0045] As shown in Figures 1 and 2, superconducting wire 10 has a substrate 11, an intermediate layer 12, a superconducting layer 13, and a protective layer 14. Superconducting wire 10 has a main surface 10a and a main surface 10b. Main surface 10a and main surface 10b are end surfaces in the thickness direction of superconducting wire 10. Main surface 10b is the surface opposite main surface 10a. Main surface 10a is made of substrate 11. Main surface 10b is made of protective layer 14.

[0046] The width of the superconducting wire 10 is defined as width W. Width W is the width in the width direction of the superconducting wire 10. The width direction of the superconducting wire 10 is a direction perpendicular to both the longitudinal direction of the superconducting wire 10 and the thickness direction of the superconducting wire 10. Width W is, for example, 10 mm or more. Width W may be 15 mm or more, 20 mm or more, 30 mm or more, 50 mm or more, or 100 mm or more. Width W may be 300 mm or less, 250 mm or less, or 200 mm or less.

[0047] The substrate 11 has a principal surface 11a and a principal surface 11b. The principal surface 11a and the principal surface 11b are end surfaces of the substrate 11 in the thickness direction. The principal surface 11a forms the principal surface 10a. The principal surface 11b is the surface opposite to the principal surface 11a. The substrate 11 is, for example, a clad material including a tape member made of stainless steel, a copper (Cu) layer disposed on the principal surface of the tape member, and a nickel (Ni) layer disposed on the copper layer. Copper crystals are oriented in the copper layer. Since the copper crystals are oriented in the copper layer, nickel crystals are also oriented in the nickel layer. The tape member and the nickel layer constitute the principal surface 11a and the principal surface 11b, respectively. The substrate 11 may be a tape member made of a metal material such as Hastelloy (registered trademark) or stainless steel. In this case, the crystals of the tape member do not need to be oriented. The thickness of the substrate 11 is, for example, 130 μm or less. The thickness of the substrate 11 may be 100 μm or less, or may be 50 μm or less. The thickness of the substrate 11 is, for example, 30 μm or more.

[0048] The intermediate layer 12 is disposed on the substrate 11. More specifically, the intermediate layer 12 is disposed on the main surface 11b. The intermediate layer 12 is made of, for example, yttria-stabilized zirconium oxide (YSZ), CeO ２ (cerium oxide), magnesium oxide (MgO), aluminum oxide (Al ２ O ３ ), yttrium oxide (Y ２ O ３ ), lanthanum manganate (LaMnO ３ ), gadolinium zirconate (Gd ２ Zr ２ O ７ ) and strontium titanate (SrTiO ３ ) In the case where the substrate 11 has a tape member made of stainless steel, a copper layer, and a nickel layer, the intermediate layer 12 is formed by laminating, for example, an yttrium oxide layer, an yttria-stabilized zirconium oxide layer, and a cerium oxide layer. Since the crystals of the constituent materials are oriented in the nickel layer, the crystals of the constituent materials are also oriented in these layers.

[0049] When the substrate 11 is a tape member such as Hastelloy, the intermediate layer 12 may be composed of a base layer, an IBAD (Ion Beam Assisted Deposition) layer disposed on the base layer, and a surface layer disposed on the IBAD layer. The base layer is composed, for example, of a laminated aluminum oxide layer and a laminated yttrium oxide layer. The IBAD layer is, for example, a magnesium oxide layer. The IBAD layer is formed by the IBAD method, and the crystals of the constituent materials in the IBAD layer are oriented. The surface layer is composed, for example, of a laminated magnesium oxide layer and a laminated lanthanum manganate layer. Since the crystals of the constituent materials in the IBAD layer are oriented, the crystals of the constituent materials in the surface layer are also oriented. Note that the constituent materials of the intermediate layer 12 are not limited to those described above.

[0050] The superconducting layer 13 is disposed on the intermediate layer 12. The constituent material of the superconducting layer 13 is an oxide superconductor. A specific example of the oxide superconductor is REBa. ２ Cu ３ O ｘ RE is a rare earth element. Examples of rare earth elements include gadolinium (Gd), yttrium (Y), europium (Eu), holmium (Ho), ytterbium (Yb), samarium (Sm), dysprosium (Dy), and neodymium (Nd). However, rare earth elements are not limited to these. As described above, the crystals of the constituent materials in the intermediate layer 12 are oriented, and therefore the crystals of the constituent materials in the superconducting layer 13 are also oriented. More specifically, in the superconducting layer 13, the c-axes of the crystals of the constituent materials are oriented along the normal direction to the main surface 11b.

[0051] The protective layer 14 is disposed on the superconducting layer 13. The material of the protective layer 14 is, for example, silver (Ag) or a silver alloy.

[0052] (Method of Manufacturing Superconducting Wire Using Superconducting Wire 10) A method of cutting superconducting wire 10, that is, a method of manufacturing superconducting wire using superconducting wire 10, will be described below.

[0053] 3 , the superconducting wire 10 is cut using a manufacturing apparatus 100. The manufacturing apparatus 100 includes a reel 20, a plurality of reels 21, a transport mechanism 30, a transport mechanism 31, a pulley 40, a laser light source 50, and a gas supply mechanism 60.

[0054] Superconducting wire 10 is wound around reel 20. Superconducting wire obtained by cutting superconducting wire 10, i.e., superconducting wire having a width smaller than width W of superconducting wire 10, is wound around each of reels 21. The number of reels 21 is equal to the number of superconducting wires obtained by cutting, for example. Fig. 3 shows an example in which reels 21 are arranged so that the rotation axes of each reel 21 are not coaxial but are offset from each other, but reels 21 may be arranged so that the rotation axes are coaxial.

[0055] The transport mechanism 30 and the transport mechanism 31 are spaced apart from each other. The transport mechanism 30 mainly includes a reel 20 and a drive source such as a motor for rotating the reel 20. The transport mechanism 31 mainly includes a reel 21 and a drive source such as a motor for rotating the reel 21. The transport mechanism 30 is located upstream of the transport mechanism 31 in the transport direction of the superconducting wire 10. The radii of the reels 20 and 21 are equal to or greater than the allowable bending radius of the superconducting wire 10. The transport mechanism 30 may further include, for example, a plurality of rollers 30a. The plurality of rollers 30a are arranged, for example, in a staggered pattern. That is, the rollers 30a in contact with the main surface 10a and the rollers 30a in contact with the main surface 10b are arranged adjacent to each other in the longitudinal direction of the superconducting wire 10 and at different positions in the normal direction of the main surface 10a. The transport mechanism 31 may further include, for example, a plurality of rollers 31a. The rollers 31a may be arranged, for example, in a staggered pattern. The radius of the rollers 30a and 31a is equal to or greater than the allowable bending radius of the superconducting wire 10. The diameter of the rollers 30a and 31a is smaller than the diameter of the reels 20 and 21. The diameter of the rollers 30a and 31a may be larger than the diameter of the reels 20 and 21.

[0056] The transport mechanisms 30 and 31 transport the superconducting wire 10 along its longitudinal direction by winding the superconducting wire 10 fed from the reel 20 onto the reel 21 and continuously unwinding it with the rollers 30a and 31a. When the superconducting wire 10 is being transported, tension is applied to the superconducting wire 10 mainly by the reels 20 and 21. The rollers 30a and 31a are driven rollers that rotate due to friction with the superconducting wire 10, and feed the superconducting wire 10 from the reel 20 toward the reel 21. At least one of the rollers 30a or at least one of the rollers 31a may be rotated by a drive source such as a motor. This makes it possible to adjust the tension applied to the superconducting wire 10 between the reel 20 and the reel 21.

[0057] In the illustrated example, the number of rollers 30a and the number of rollers 31a are three, but the number of rollers 30a and the number of rollers 31a are not limited to three and can be changed. Furthermore, the transport mechanism 31 does not have to have multiple rollers 31a.

[0058] Pulley 40 is disposed between reel 20 and reel 21, and further disposed between transport mechanism 30 and transport mechanism 31. Superconducting wire 10 is supported by pulley 40, for example, at main surface 10b. Pulley 40 rotates while supporting superconducting wire 10. Superconducting wire 10 may be pushed up in a direction from main surface 10b toward main surface 10a at a portion of superconducting wire 10 in contact with pulley 40. As shown in FIG. 3 , for example, by disposing pulley 40 so that the rotation axis of pulley 40 is closer to laser light source 50 than a plane passing through the rotation axis of reel 20 and the rotation axis of reel 21 closest to pulley 40, superconducting wire 10 is pushed up. Furthermore, the diameter of pulley 40 may be made larger than the diameter of reel 20 and the diameter of reel 21 to push up superconducting wire 10, or a drive mechanism for pushing up pulley 40 so that superconducting wire 10 approaches laser light source 50 may be attached to pulley 40. In addition, by arranging pulley 40 so that superconducting wire 10, which is tensioned by reel 20 and reel 21, is pushed up in the direction of approaching laser light source 50, warpage of superconducting wire 10 is corrected.

[0059] As shown in Figures 4 to 6, pulley 40 has an outer peripheral surface 41. Outer peripheral surface 41 contacts main surface 10b. A plurality of grooves 42 are formed in outer peripheral surface 41. The spacing between adjacent grooves 42 is set according to the width of the superconducting wire obtained by cutting. Grooves 42 extend along the circumferential direction of pulley 40. The spacing between adjacent grooves 42 may be smaller than the width of the superconducting wire obtained from superconducting wire 10 by cutting, for example.

[0060] Laser light source 50 generates laser light L. Laser light L is irradiated onto main surface 10a of superconducting wire 10 at a portion supported by pulley 40 while superconducting wire 10 is being transported. The wavelength of laser light L is, for example, in the green band or the ultraviolet band. The green band is a band with a wavelength of 490 nm or more and 550 nm or less. The ultraviolet band is a band with a wavelength of 380 nm or less.

[0061] 7A , a fixed optical system may be used to fix the irradiation position of laser L on main surface 10 a. In this case, cutting of superconducting wire 10 progresses as superconducting wire 10 is transported (see solid arrows in the figure).

[0062] As shown in FIG. 7B , a galvanometer scanner may be used to scan the irradiation position of the laser beam L on the main surface 10 a. When a galvanometer scanner is used, the scanning of the irradiation position of the laser beam L can be performed either along the longitudinal direction of the superconducting wire 10 or along the width direction of the superconducting wire 10. The scanning of the irradiation position of the laser beam L is performed, for example, along the longitudinal direction of the superconducting wire 10 (see the dotted arrow in the figure). In this case, the superconducting wire 10 is not cut by a single scan (i.e., the laser beam L does not penetrate the superconducting wire 10 by a single scan). From another perspective, the superconducting wire 10 is cut by scanning the laser beam L multiple times. The scanning of the irradiation position of the laser beam L along the longitudinal direction of the superconducting wire 10 may be performed by changing the irradiation position of the laser beam L in the width direction of the superconducting wire 10 every predetermined number of scans (see the dotted arrow in the figure).

[0063] 3, when the laser beam L is irradiated onto the main surface 10a, an assist gas AG may be supplied from a gas supply mechanism 60 to the vicinity of the irradiation position of the laser beam L. The assist gas AG is, for example, air. The assist gas AG may also be an inert gas such as nitrogen.

[0064] Although the above describes an example in which there are a plurality of reels 21, the number of reels 21 may be one. When the number of reels 21 is one, superconducting wire 10 is wound around reel 21 while leaving an uncut portion at an end in the longitudinal direction, and the uncut portion is then removed separately. In the example shown in FIG. 3 , there are two reels 21. However, when there are two reels 21, one reel 21 may be wound with a superconducting wire having a predetermined width obtained by cutting superconducting wire 10, and the other reel 21 may be wound with the remaining portion of superconducting wire 10 excluding the superconducting wire obtained by cutting. Although the above describes an example in which superconducting wire 10 is supported by pulley 40 at main surface 10 b, superconducting wire 10 may be supported by pulley 40 at main surface 10 a. In this case, the superconducting wire 10 is pushed up in the direction from the main surface 10a toward the main surface 10b at the point of contact with the pulley 40, and the laser L is irradiated onto the main surface 10b at the part of the superconducting wire 10 supported by the pulley 40.

[0065] (Effects of the method for manufacturing a superconducting wire using the superconducting wire 10) The effects of the method for manufacturing a superconducting wire using the superconducting wire 10 will be described below.

[0066] There is a difference in thermal expansion coefficient between the constituent material of substrate 11 and the constituent materials of intermediate layer 12 and superconducting layer 13. Due to such a difference in thermal expansion coefficient, superconducting wire 10 may warp in the width direction.

[0067] When warpage occurs in the superconducting wire 10 in the width direction, the position of the laser L shifts in the thickness direction of the superconducting wire 10 from the set position set when the superconducting wire 10 is not warped. Due to the shift in the focal position of the laser L, the processing mode by the laser L changes from ablation processing to thermal processing, and the thermal effect of the cut portion increases.

[0068] However, in the method for manufacturing a superconducting wire using the superconducting wire 10, the superconducting wire 10 is supported by the pulley 40, and therefore the warpage described above is corrected by contact with the pulley 40. Therefore, in the method for manufacturing a superconducting wire using the superconducting wire 10, it is possible to suppress deviation of the focus of the laser L caused by the warpage of the superconducting wire 10, and it is also possible to reduce the thermal effect on the cut portion.

[0069] If the superconducting wire 10 is not supported by the pulley 40, the superconducting wire 10 will be shaken by the spraying of the assist gas AG. Such shaking of the superconducting wire 10 also causes a shift in the focal position of the laser L. However, according to the method for manufacturing a superconducting wire using the superconducting wire 10, it is possible to suppress such a shift in the focal position of the laser L caused by the spraying of the assist gas AG. Furthermore, even if the superconducting wire 10 is held down from above with a jig or the like to correct the warpage of the superconducting wire 10, debris accumulates in the jig. In this case, the superconducting wire 10 is covered with the jig or the like, which prevents the supply of the assist gas AG to the area irradiated with the laser L.

[0070] When the irradiation position of the laser L is scanned by a galvano scanner, the irradiation position of the laser L changes before the thermal effect of the irradiation of the laser L becomes large, so that the thermal effect of the cut portion can be further reduced.

[0071] When the transport mechanism 30 has a plurality of rollers 30 a arranged in a staggered pattern, the superconducting wire 10 passes between the plurality of rollers 30 a during transport, and thereby the warpage of the superconducting wire 10 is corrected by a so-called leveler effect. Therefore, in this case, it is possible to further suppress the deviation of the focus of the laser L caused by the warpage of the superconducting wire 10.

[0072] In the superconducting wire 10, warpage occurs in which the main surface 10a shrinks and the main surface 10b expands (i.e., a downwardly convex warpage, assuming that the main surface 10b faces downward). Therefore, when the superconducting wire 10 is supported by the pulley 40 at the main surface 10b (i.e., at the surface formed by the protective layer 14), the convex surface comes into contact with the outer peripheral surface 41, making it easier to correct the warpage more effectively. In this case, the tact time (cutting efficiency) is also improved.

[0073] When superconducting wire 10 is supported by pulley 40 on main surface 10 a (i.e., on the surface formed by substrate 11), cutting by irradiation with laser L proceeds from protective layer 14 toward substrate 11. That is, in this case, superconducting layer 13 is cut before substrate 11. As a result, even if the cutting is incomplete, cutting of superconducting layer 13 is completed, and only substrate 11 remains uncut. Therefore, even if superconducting wire 10 is subsequently physically cut, superconducting layer 13 is unlikely to be subjected to a load. Therefore, when superconducting wire 10 is supported on main surface 10 a, it is possible to suppress performance degradation of superconducting wire 10 due to cutting.

[0074] As the wavelength of the laser L becomes shorter, the area subjected to ablation processing by the laser L becomes larger than the area subjected to thermal processing by the laser L. Therefore, when the wavelength of the laser L is in the ultraviolet or green band, the superconducting wire 10 is cut mainly by ablation processing. When the wavelength of the laser L is in the green band, the absorptance of the protective layer 14 is greater than when the wavelength of the laser L is in the ultraviolet band.

[0075] When grooves 42 are formed in outer peripheral surface 41, it is possible to suppress seizure between outer peripheral surface 41 and superconducting wire 10. In this case, laser beam L is not irradiated onto pulley 40 until it penetrates superconducting wire 10 and reaches the bottom surface of groove 42. Therefore, laser beam L is defocused when it is irradiated onto pulley 40, and irradiation of laser beam L does not easily generate debris from pulley 40. When assist gas AG is sprayed near the irradiation position of laser beam L, debris generated from superconducting wire 10 is easily removed by assist gas AG.

[0076] <Modification 1> Fig. 8 is a cross-sectional view of superconducting wire 10 according to Modification 1. As shown in Fig. 8, superconducting wire 10 may further include stabilization layer 15. Stabilization layer 15 is disposed on protective layer 14. The constituent material of stabilization layer 15 is, for example, copper or a copper alloy. That is, stabilization layer 15 may be formed before superconducting wire 10 is cut.

[0077] <Modification 2> In the above example, the case where the wavelength of the laser L is in the green band or the ultraviolet band has been described, but the wavelength of the laser L may be in the infrared band. The infrared band is a band with a wavelength of 780 nm or more.

[0078] <Modification 3> Fig. 9 is a schematic cross-sectional view of pulley 40 according to Modification 3. As shown in Fig. 9, a flow path 43 is formed inside pulley 40. Pulley 40 has a side surface 44, and a rotary joint 45 is attached to side surface 44. One end of flow path 43 opens at the bottom surface of groove 42, and the other end is connected to flow path 45a in rotary joint 45. When pulley 40 supports superconducting wire 10, superconducting wire 10 is sucked through flow path 43. When superconducting wire 10 is cut by laser L, debris is generated from superconducting wire 10. This debris is sucked through the opening of flow path 43 formed at the bottom surface of groove 42.

[0079] <Modification 4> Fig. 10 is a schematic diagram of a laser light source 50 according to Modification 4. As shown in Fig. 10 , the laser light source 50 may split a single laser L beam into multiple beams. More specifically, the laser light source 50 may include a diffractive optical element (DOE) 51 and a condenser lens 52. In the example shown in Fig. 10 , the diffractive optical element 51 is disposed upstream of the condenser lens 52 on the optical path of the laser L, but the condenser lens 52 may also be disposed upstream of the diffractive optical element 51 on the optical path of the laser L.

[0080] 11 is a schematic diagram showing an irradiation mode of the laser L when the laser L is branched into multiple beams. As shown in FIG. 11 , the irradiation positions of the multiple beams of the laser L are spaced apart along the width direction of the superconducting wire 10. In this case, the irradiation positions of the multiple beams of the laser L are scanned along the longitudinal direction of the superconducting wire 10 by, for example, a galvanometer scanner. This allows multiple superconducting wires to be cut simultaneously from the superconducting wire 10, thereby improving processing efficiency. In this case, too, in order to reduce the thermal effect on the superconducting layer 13, the superconducting wire 10 (superconducting layer 13) is not cut by, for example, a single scan (it is cut by multiple scans).

[0081] <Modification 5> Fig. 12 is a schematic diagram showing an irradiation mode of a laser L according to Modification 4. As shown in Fig. 12, the irradiation position of the laser L in the longitudinal direction of the superconducting wire 10 may be offset from the portion of the superconducting wire 10 supported by the pulley 40. When the irradiation position of the laser L in the longitudinal direction of the superconducting wire 10 is offset from the portion of the superconducting wire 10 supported by the pulley 40, the laser L is irradiated onto the superconducting wire 10 in a defocused state. When the laser L is irradiated onto the superconducting wire 10 in a defocused state, the processing mode of the superconducting wire 10 changes from ablation processing to thermal processing, and the processing speed is improved. For example, by irradiating the laser L without defocusing when processing the superconducting layer 13 and irradiating the laser L with a defocused laser when processing the substrate 11, it is possible to achieve both a reduction in the thermal effect on the superconducting layer 13 and an improvement in the processing speed. Note that switching between ablation processing and thermal processing in processing superconducting wire 10 is not limited to offsetting the irradiation position of laser L. For example, the processing mode can also be switched by changing the pulse width or the pulse frequency of laser L when processing superconducting layer 13 and when processing substrate 11.

[0082] <Modification 6> In the above, the processing of cutting superconducting wire 10 to extract a plurality of superconducting wires has been described, but superconducting wire 10 may be processed by scribing. Fig. 13 is a plan view of superconducting wire 10 according to Modification 6 after scribing. As shown in Fig. 13, superconducting layer 13 is cut by irradiation with laser L, but substrate 11 does not have to be cut. In this case, superconducting layer 13 is divided into a plurality of portions along the width direction of superconducting wire 10, making it possible to suppress eddy currents from flowing in superconducting layer 13.

[0083] The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The scope of the present invention is defined by the claims, not by the above-described embodiments, and is intended to include all modifications within the meaning and scope of the claims.

[0084] 10 Superconducting wire, 10a Main surface, 10b Main surface, 11 Base material, 11a Main surface, 11b Main surface, 12 Intermediate layer, 13 Superconducting layer, 14 Protective layer, 15 Stabilizing layer, 20, 21 Reel, 30 Transport mechanism, 30a Roller, 31 Transport mechanism, 31a Roller, 40 Pulley, 41 Outer circumferential surface, 42 Groove, 43 Flow path, 44 Side, 45 Rotary joint, 50 Laser light source, 51 Diffractive optical element, 52 Condenser lens, 60 Gas supply mechanism, 100 Manufacturing apparatus, L Laser, W Width.

Claims

1. A method for manufacturing a superconducting wire, comprising: a step of preparing a superconducting wire to be cut, the superconducting wire having a first main surface and a second main surface opposite to the first main surface; a step of transporting the superconducting wire to be cut along the longitudinal direction of the superconducting wire to be cut by a first transport mechanism and a second transport mechanism arranged spaced apart from each other, the superconducting wire to be cut being supported at the first main surface by a pulley arranged between the first transport mechanism and the second transport mechanism; and a step of cutting the superconducting wire to be cut by irradiating a laser onto the second main surface at a portion of the superconducting wire to be cut that is supported by the pulley while the superconducting wire to be cut is being transported.

2. A method for producing a superconducting wire as set forth in claim 1, wherein the laser irradiation position on the second principal surface is scanned by a galvanometer scanner.

3. A method for manufacturing a superconducting wire as described in claim 1 or claim 2, wherein the first conveying mechanism is located upstream of the second conveying mechanism in the conveying direction of the superconducting wire to be cut, and the first conveying mechanism has a plurality of rollers arranged in a staggered pattern.

4. A method for manufacturing superconducting wire as described in any one of claims 1 to 3, wherein the pulley has an outer peripheral surface in contact with the first main surface, and a groove is formed on the outer peripheral surface extending along the circumferential direction of the pulley.

5. A method for manufacturing a superconducting wire as described in claim 4, wherein a flow path is formed inside the pulley, the flow path is open at a bottom surface of the groove, and when the superconducting wire to be cut is supported by the pulley, the superconducting wire to be cut is sucked through the flow path.

6. A method for manufacturing a superconducting wire as described in any one of claims 1 to 5, wherein the superconducting wire to be cut further has a substrate, an intermediate layer disposed on the substrate, and a superconducting layer disposed on the intermediate layer, and the substrate constitutes the second main surface.

7. A method for manufacturing a superconducting wire as described in any one of claims 1 to 5, wherein the superconducting wire to be cut further has a substrate, an intermediate layer disposed on the substrate, and a superconducting layer disposed on the intermediate layer, and the substrate constitutes the first main surface.

8. A method for manufacturing a superconducting wire as described in claim 6 or claim 7, wherein the superconducting wire to be cut further has a protective layer, and the protective layer is disposed on the superconducting layer.

9. The method for producing a superconducting wire as set forth in claim 8, wherein the superconducting wire to be cut further has a stabilization layer, the stabilization layer being disposed on the protective layer.

10. A method for manufacturing a superconducting wire as claimed in any one of claims 1 to 9, wherein the wavelength of the laser is in the green band, the ultraviolet band or the infrared band.

11. A method for producing a superconducting wire according to any one of claims 1 to 10, wherein an assist gas is supplied to the location irradiated with the laser.

12. A method for producing a superconducting wire as set forth in claim 1, wherein the laser is split into a plurality of beams by a diffractive optical element, and the irradiation position of each of the plurality of beams is scanned by a galvano scanner.

13. A method for manufacturing a superconducting wire as described in claim 1, wherein the laser irradiation position on the second main surface is offset along the longitudinal direction of the superconducting wire to be cut.

14. A manufacturing apparatus comprising: a first conveying mechanism and a second conveying mechanism; a pulley; and a laser light source, wherein the first conveying mechanism and the second conveying mechanism are arranged so as to be spaced apart from each other and convey the superconducting wire to be cut along the longitudinal direction of the superconducting wire to be cut; the pulley is arranged between the first conveying mechanism and the second conveying mechanism and supports a first main surface of the superconducting wire to be cut; and the laser light source irradiates a laser onto the second main surface of a portion of the superconducting wire to be cut that is supported by the pulley.

15. The manufacturing apparatus according to claim 14, wherein the laser light source has a galvanometer scanner that scans the irradiation position of the laser.

16. The manufacturing apparatus according to claim 15, wherein the laser light source further comprises a diffractive optical element that splits the laser into a plurality of beams.

17. A manufacturing apparatus as described in any one of claims 14 to 16, wherein the first conveying mechanism is located upstream of the second conveying mechanism in the conveying direction of the superconducting wire to be cut, and the first conveying mechanism has a plurality of rollers arranged in a staggered manner.

18. A manufacturing apparatus as claimed in any one of claims 14 to 17, wherein the pulley has an outer peripheral surface in contact with the first main surface, and a groove is formed on the outer peripheral surface extending along the circumferential direction of the pulley.

19. The manufacturing apparatus of claim 18, wherein a flow path is formed inside the pulley, the flow path opens at a bottom surface of the groove, and when the superconducting wire to be cut is supported by the pulley, the superconducting wire to be cut is sucked through the flow path.

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