Vibration audio module and bone conduction earphone

Abstract

The present application discloses a vibration audio module, comprising a housing. A magnetic circuit structure is provided in the housing; by means of an elastic piece, a first end of the magnetic circuit structure is vibratably suspended in the housing; the magnetic circuit structure is provided with a magnetic field gap; a coil is provided in the magnetic field gap; when a varying current passes through the coil, the magnetic circuit structure is enabled to vibrate relative to the housing along a direction perpendicular to the first end of the magnetic circuit structure; a second end opposite to the first end of the magnetic circuit structure is connected to the housing by means of a rubber film; the rubber film and the housing form a first space for accommodating the magnetic circuit structure; and the rubber film is provided with a communication structure communicated with the first space. The present application further discloses a bone conduction earphone using the vibration audio module. The present application has the advantages of good sound quality, high power and long service life.

Description

Vibration audio module and bone conduction headphones Technical Field

[0001] The present application relates to the field of audio technology, and in particular to a vibration audio module and a bone conduction earphone using the module. Background Art

[0002] Existing bone conduction headphones use shrapnel to suspend the magnetic circuit structure in the shell, which can produce better sound effects. Technical issues

[0003] However, when the earphones are more powerful or the product is used for a long time, the magnetic circuit structure will produce radial disturbances in addition to effective axial vibrations. This radial disturbance will cause the shrapnel to bend, thereby affecting its service life. Secondly, it will cause the coil to collide with the inner wall of the magnetic field gap in the magnetic circuit structure, resulting in energy loss and noise. Technical Solutions

[0004] The purpose of this application is to provide a vibration audio module and bone conduction headphones with good sound quality, high power and long service life.

[0005] The present application discloses a vibration audio module, comprising a shell, in which a magnetic circuit structure is arranged, a first end of the magnetic circuit structure is suspended in the shell by a spring to enable it to vibrate, the magnetic circuit structure is provided with a magnetic field gap, a coil is provided in the magnetic field gap, when a changing current passes through the coil, the magnetic circuit structure is vibrated relative to the shell in a direction perpendicular to the first end of the magnetic circuit structure; a second end opposite to the first end of the magnetic circuit structure is connected to the shell by a film, the film and the shell form a first space for accommodating the magnetic circuit structure, and a connecting structure connected to the first space is provided on the film.

[0006] Optionally, the adhesive film is provided with an opening communicating with the first space.

[0007] Optionally, the diameter of the opening is greater than 0.4 mm.

[0008] Optionally, there are two to eight openings symmetrically arranged.

[0009] Optionally, the elastic sheet is connected to the housing via a vibration transmitting body.

[0010] Optionally, a shell cover is provided above the shell, the adhesive film is provided between the shell opening and the shell cover, the adhesive film separates the space inside the shell into a first space and a second space, and a connecting structure connecting the first space and the second space is provided on the adhesive film.

[0011] Optionally, the adhesive film is provided with at least one folding ring.

[0012] Optionally, the spring is symmetrically provided with a plurality of vibration plate feet, the number of the openings is the same as the vibration plate feet, and the projections of the openings are correspondingly provided on the vibration plate feet.

[0013] Optionally, the adhesive film is a sheet-like element having a radial elastic modulus smaller than an axial elastic modulus.

[0014] Optionally, the adhesive film is made of silicone, polyurethane or fiber materials.

[0015] Optionally, it includes an earphone housing, in which any vibration audio module as described above is arranged. Beneficial effects

[0016] The vibration audio module of the present application has an adhesive film added above the magnetic circuit structure. This prevents the coil from colliding with the sidewalls of the magnetic field gap in the magnetic circuit structure during operation, thereby generating noise. It also prevents the spring fragment from breaking due to long-term operation of the product, making the entire product design more compact. At the same time, the design of a certain size and number of connecting structures on the adhesive film significantly improves the sound quality, thereby improving the sound quality of the module while miniaturizing the product. The vibration module of the present application is also conducive to the development of new products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0018] FIG1 is an exploded schematic diagram of a vibration audio module according to an embodiment of the present application;

[0019] FIG2 is a cross-sectional view of a vibration audio module according to an embodiment of the present application;

[0020] FIG3 is a schematic structural diagram of the adhesive film according to an embodiment of the present application;

[0021] FIG4 is a frequency response curve of the adhesive film without holes in the embodiment of the present application;

[0022] FIG5 is a frequency response curve of the film with holes of different sizes punched in the embodiment of the present application;

[0023] FIG6 is a frequency response curve of the film with different numbers of holes punched in the embodiment of the present application;

[0024] FIG7 is an exploded schematic diagram of a vibration audio module according to a second embodiment of the present application;

[0025] FIG8 is a cross-sectional view of a vibration audio module according to a second embodiment of the present application;

[0026] FIG9 is a structural diagram of the vibration audio module according to the second embodiment of the present application. Best Mode for Carrying Out the Invention

[0027] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative. However, the present application can be implemented in many alternative forms and should not be construed as being limited to the embodiments described herein.

[0028] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0029] FIG1 shows a schematic diagram of the decomposed structure of the first embodiment of the vibration audio module of the present application, and FIG2 is a cross-sectional view of the first embodiment of the vibration audio module of the invention, which includes a shell 1, a magnetic circuit structure is arranged in the shell 1, and the magnetic circuit structure is composed of a U-cup magnetic conductive element 3, a magnet 4, and a washer 5. There is a magnetic field gap between the U-cup magnetic conductive element 3 and the washer 5. The outer side of the U-cup magnetic conductive element 3 in the magnetic circuit structure is suspended in the shell 1 by a spring clip 9 using a spring clip bracket 8. In other embodiments, the spring clip 9 is also directly or through other structures provided at the bottom of the shell 1. A coil 6 is movably provided in the magnetic field gap. When When a changing current passes through the coil 6, the magnetic circuit structure vibrates relative to the shell 1 in a direction perpendicular to the magnetic field in the magnetic gap under electromagnetic induction; the bottom of the U-cup magnetic conductive element 3 in the magnetic circuit structure passes through the adhesive film 2, and silicone is used in this embodiment; in other experiments, the sound effect produced by using a plastic film with a radial elastic modulus much smaller than the axial elastic modulus is better, such as polyurethane TPU and other materials; the adhesive film 2 covers the opening of the shell 1, so that the adhesive film 2 and the shell 1 form a first space for accommodating the magnetic circuit structure, and the adhesive film 2 is provided with an opening 201 connected to the first space from the outside.

[0030] In other embodiments, a crack structure can also be used to connect the outside world and the first space. When the pressure difference between the first space and the outside world is greater than a certain value, the crack structure connects the first space and the outside world. Normally, the crack structure seals and isolates the first space from the outside world to prevent water and foreign matter from entering the first space.

[0031] The vibration audio module in this embodiment has an additional adhesive film 2 above the magnetic circuit structure. This can prevent the coil of the magnetic circuit structure from colliding with the inner wall of the magnetic field gap in the magnetic circuit structure during operation and generating noise. However, the sound generated by this structure has a large attenuation at low frequencies, affecting the sound quality. Referring to Figure 4, through the inventor's creative changes, a certain size and number of openings 201 are made on the adhesive film 2. Referring to Figures 5 and 6, the sound quality is greatly improved, so that the sound quality of the module can be improved while the product is miniaturized. The additional adhesive film on the top can limit the radial movement of the magnetic circuit structure, thereby avoiding the problem of short product service life caused by the shrapnel being broken due to long-term operation.

[0032] Referring to FIG. 5 , in our experiments, we found that the sound effect is better when the diameter of the opening 201 is greater than 0.4 mm.

[0033] 6 , in our experiments, we found that the sound quality is better when the number of openings 201 is symmetrically arranged between two and eight, especially when the number of openings 201 is the same as the number of the shrapnel 9 and the projections of the openings 201 are arranged correspondingly on the shrapnel feet.

[0034] In this embodiment, the elastic piece 9 is rigidly connected to the housing 2 via the vibration transmitting body 10 .

[0035] In this embodiment, to increase the axial elastic modulus of the film 2, a fold 203 is provided on the film 2, and a thickened platform 202 is provided in the middle of the film 2 for connection to the bottom of the U-cup magnetic conductive element 3. This can be achieved by gluing. The inventors have discovered that using structural adhesive can securely bond the two while maintaining the module's sound quality.

[0036] Existing vibration audio modules are generally integrated with the earphone housing. When developing new products, it is necessary to design and test the modules according to the different sizes, shapes and requirements of the earphones. The development cycle of new products is long and the quality is uncertain. Traditional modules are first packaged and then used in the design and development of new products. However, due to their large size, they affect the design space. The vibration audio module provided in the second embodiment of the present application, with reference to Figures 7 and 8, is provided with a shell cover 11 above the shell 1 on the basis of the previous embodiment, and a film 2 is provided between the opening of the shell 1 and the shell cover 11. The film 2 separates the space inside the shell into a first space and a second space. The film 2 is provided with an opening 201 connecting the first space and the second space. Thus, a vibration audio module as shown in Figure 9 is formed. This vibration audio module is compact in size while ensuring sound quality, is suitable for application in new product development of various types of earphones, and can effectively shorten the development cycle of new products.

[0037] This application also protects the processing and various headphones using the vibration audio module in the above embodiment, which includes a headphone shell, and the above vibration audio module is arranged in the headphone shell.

[0038] The above content is a further detailed description of the present application in conjunction with specific optional implementation methods, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, they can make several simple deductions or substitutions without departing from the concept of the present application, which should be considered to fall within the scope of protection of the present application.

Claims

1. A vibration audio module, characterized in that: It includes a shell, in which a magnetic circuit structure is arranged, a first end of the magnetic circuit structure is suspended in the shell by a spring to make it vibrate, the magnetic circuit structure is provided with a magnetic field gap, a coil is provided in the magnetic field gap, when a changing current passes through the coil, the magnetic circuit structure is vibrated relative to the shell in a direction perpendicular to the first end of the magnetic circuit structure; a second end opposite to the first end of the magnetic circuit structure is connected to the shell through a film, the film and the shell form a first space for accommodating the magnetic circuit structure, and a connecting structure connected to the first space is provided on the film.

2. The vibration audio module according to claim 1, characterized in that: The adhesive film is provided with an opening connected to the first space.

3. The vibration audio module according to claim 2, characterized in that: The diameter of the opening is greater than 0.4 mm.

4. The vibration audio module according to claim 2, characterized in that: The number of the openings is two to eight and they are symmetrically arranged.

5. The vibration audio module according to claim 1, characterized in that: A shell cover is arranged above the shell, the adhesive film is arranged between the shell opening and the shell cover, the adhesive film divides the space in the shell into a first space and a second space, and a connecting structure connecting the first space and the second space is arranged on the adhesive film.

6. The vibration audio module according to claim 1, characterized in that: The adhesive film is provided with at least one folding ring.

7. The vibration audio module according to claim 2, characterized in that: The spring sheet is symmetrically provided with a plurality of vibration plate feet, the number of the openings is the same as the vibration plate feet, and the projections of the openings are correspondingly provided on the vibration plate feet.

8. The vibration audio module according to claim 1, characterized in that: The adhesive film is a sheet-like element whose radial elastic modulus is smaller than its axial elastic modulus.

9. The vibration audio module according to claim 1, characterized in that: The adhesive film is made of silica gel, polyurethane or fiber materials.

10. A bone conduction headset, characterized in that: It comprises an earphone shell, in which any vibration audio module as described in claims 1 to 9 is arranged.

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