Directional sound production device and manufacturing process therefor

Abstract

Disclosed in the present invention are a directional sound production device and a manufacturing process therefor. The device comprises a substrate layer, a plurality of supporting structures, and a vibration layer, wherein the supporting structures are located between the substrate layer and the vibration layer, such that an air gap required for vibration of the vibration layer is formed between the substrate layer and the vibration layer; the upper and lower ends of the supporting structures are respectively fixed to the vibration layer and the substrate layer; the substrate layer, the supporting structures, and the vibration layer are combined to form a plurality of vibration units; the vibration layer of each vibration unit vibrates under the action of an applied alternating-current voltage to emit ultrasonic waves, and the ultrasonic waves are self-demodulated in the air to form audible sound. The present invention reduces sound distortion and driving power of the whole directional sound production device.

Description

Directional sound-generating device and manufacturing process thereof Technical Field

[0001] The present invention relates to the technical field of directional loudspeakers, and in particular to a directional sound-emitting device and a manufacturing process thereof. Background Art

[0002] With the trend toward ultra-thin electronic devices like mobile phones and computers, the bulk of traditional speakers has limited their potential for further reduction in size. Screen sound devices, which generate sound through screen vibrations, are facilitating further miniaturization. Furthermore, directional screen sound devices can further direct the sound emitted by the screen toward a specific area, further protecting the privacy of electronic device users and preventing the sound from disturbing others.

[0003] The screen directional sound-emitting device includes a vibration layer, a supporting structure and a substrate layer. The vibration layer and the substrate layer are bonded to each other, and the supporting structure is supported between the vibration layer and the substrate layer. At least one electrode layer is provided on each of the vibration layer and the substrate layer to be connected to an external driving circuit. The external circuit supplies power and applies a voltage signal to the substrate layer and the vibration layer to drive the vibration layer to vibrate up and down to emit an ultrasonic signal. The ultrasonic signal is self-demodulated by the air to produce audible sound.

[0004] After the existing vibration layer and the substrate layer are bonded together, the end of the supporting structure is not fixed to the vibration layer or the substrate layer. During the upward vibration of the vibration layer, the vibration layer and the supporting structure may separate or the supporting structure may separate from the substrate layer. The vibration distance formed by the separation is an invalid vibration distance, and the invalid vibration distance will cause the distortion of the sound emitted by the entire directional sound-emitting device to increase, and will also cause the driving power of the device to increase.

[0005] Therefore, it is necessary to solve the problems of high sound distortion and high power in existing directional sound-emitting devices.

[0006] Summary of the invention:

[0007] The object of the present invention is to provide a directional sound-emitting device and a manufacturing process thereof which eliminates invalid vibration distance and reduces sound distortion and power.

[0008] To achieve the above-mentioned objectives, on the one hand, the present invention proposes a directional sound-emitting device, which includes a substrate layer, multiple supporting structures and a vibration layer, wherein the supporting structure is located between the substrate layer and the vibration layer, so that an air gap required for the vibration of the vibration layer is formed between the substrate layer and the vibration layer, one end of the supporting structure is formed on the surface of the substrate layer close to the vibration layer, and the other end is fixed to the surface of the vibration layer close to the substrate layer, or one end of the supporting structure is formed on the surface of the vibration layer close to the substrate layer, and the other end is fixed to the surface of the substrate layer close to the vibration layer; the substrate layer, the supporting structure and the vibration layer are combined to form multiple vibration units, and the vibration layer of each vibration unit vibrates under the action of the loaded AC voltage to emit ultrasonic waves, and the ultrasonic waves are self-demodulated in the air to form audible sounds.

[0009] In a preferred embodiment, the device further includes a fixing point, each of the supporting structures corresponds to one fixing point, and the supporting structure is fixed to the surface of the substrate layer or the surface of the vibration layer via the fixing point.

[0010] In a preferred embodiment, one end of the supporting structure is formed on the surface of the substrate layer close to the vibration layer, and when the other end is fixed to the surface of the vibration layer close to the substrate layer, the fixing point is formed on the end portion of the supporting structure fixed to the surface of the vibration layer or formed on the surface of the vibration layer close to the substrate layer; one end of the supporting structure is formed on the surface of the vibration layer close to the substrate layer, and when the other end is fixed to the surface of the substrate layer close to the vibration layer, the fixing point is formed on the end portion of the supporting structure fixed to the surface of the substrate layer or formed on the surface of the substrate layer close to the vibration layer.

[0011] In a preferred embodiment, the device further comprises a fixing layer located between the substrate layer and the vibration layer, and the supporting structure is fixed to the surface of the substrate layer or the surface of the vibration layer via the fixing layer.

[0012] In a preferred embodiment, one end of the supporting structure is formed on the surface of the substrate layer close to the vibration layer, and when the other end is fixed to the surface of the vibration layer close to the substrate layer, the entire surface of the fixed layer is formed on the surface of the vibration layer close to the substrate layer; one end of the supporting structure is formed on the surface of the vibration layer close to the substrate layer, and when the other end is fixed to the surface of the substrate layer close to the vibration layer, the entire surface of the fixed layer is formed on the surface of the substrate layer close to the vibration layer.

[0013] In a preferred embodiment, an end portion of the supporting structure is inserted into the fixing layer and contacts the surface of the base material layer or the surface of the vibration layer.

[0014] On the other hand, the present invention provides a manufacturing process for a directional sound-emitting device, wherein the manufacturing process adopts the first process or the second process, and the first process includes:

[0015] S1, forming a support structure on the surface of the base material layer close to the vibration layer;

[0016] S2, laminating the substrate layer and the vibration layer to form a frame, and simultaneously fixing the support structure and the surface of the vibration layer close to the substrate layer;

[0017] The second process comprises:

[0018] S11, forming a support structure on a surface of the vibration layer close to the substrate layer;

[0019] S21, laminating the substrate layer and the vibration layer together as a frame, and simultaneously fixing the support structure to the surface of the substrate layer close to the vibration layer.

[0020] In a preferred embodiment, the first process includes:

[0021] S1a, forming the support structure on the substrate layer, and then forming a fixing point on the end of each support structure fixed to the surface of the vibration layer;

[0022] S2a, laminating the substrate layer and the vibration layer to form a frame, and simultaneously fixing the support structure to the surface of the vibration layer close to the substrate layer through the fixing points;

[0023] Or the first process includes:

[0024] In S1b, the support structure is formed on the substrate layer, and fixed points are formed on the surface of the vibration layer close to the substrate layer, with each support structure corresponding to one fixed point;

[0025] S2b, laminating the substrate layer and the vibration layer to form a frame, and simultaneously fixing the support structure to the surface of the vibration layer close to the substrate layer through the fixing points;

[0026] Or the first process includes:

[0027] In S1c, the support structure is formed on the substrate layer, and a fixing layer is formed on the entire surface of the vibration layer close to the substrate layer;

[0028] In the step S2c, the base material layer and the vibration layer are bonded together as a frame, and at the same time, the support structure is fixed to the surface of the vibration layer close to the base material layer through the fixing layer.

[0029] In a preferred embodiment, the second process comprises:

[0030] S11a, forming the support structure on the vibration layer, and then forming a fixing point on the end of each support structure fixed to the surface of the substrate layer;

[0031] S21a, laminating the substrate layer and the vibration layer to form a frame, and simultaneously fixing the support structure to the surface of the substrate layer close to the vibration layer through the fixing points;

[0032] Or the second process includes:

[0033] S11b, forming the support structure on the vibration layer, and forming fixed points on the surface of the substrate layer close to the vibration layer, with each support structure corresponding to one fixed point;

[0034] S21b, laminating the substrate layer and the vibration layer to form a frame, and simultaneously fixing the support structure to the surface of the substrate layer close to the vibration layer through the fixing points;

[0035] Or the second process includes:

[0036] S11c, forming the support structure on the vibration layer, and forming a fixing layer on the entire surface of the base material layer close to the vibration layer;

[0037] S21c, laminating the substrate layer and the vibration layer together as a frame, and at the same time, fixing the support structure to the surface of the substrate layer close to the vibration layer through the fixing layer.

[0038] In a preferred embodiment, the fixed point or fixed layer is realized by any one of silk screen printing, exposure and development, transfer, rotary spraying, UV printing, three-dimensional spraying, and character printing processes, and the substrate layer is bonded to the vibration layer before the fixed point or fixed layer is solidified.

[0039] Compared with the prior art, the present invention has the following beneficial effects: while the present invention is bonding the substrate layer and the vibration layer as frames, the upper and lower ends of the supporting structure are fixed together with the vibration layer and the substrate layer respectively, so that after the substrate layer and the vibration layer are bonded, stable vibration units can be formed. In this way, the vibration layer will not separate from the supporting structure when vibrating up and down, thereby eliminating the invalid vibration distance of the vibration layer, which can not only reduce the sound distortion of the entire directional sound-emitting device, but also reduce the driving power of the entire device. Description of the drawings:

[0040] FIG1 is a schematic structural diagram of a directional sound-emitting device according to the present invention;

[0041] FIG2 is a schematic structural diagram of a directional sound-emitting device according to Example 1 of the present invention;

[0042] FIG3 is a schematic structural diagram of a directional sound emission device according to Example 2 of the present invention;

[0043] FIG4 is a schematic structural diagram of a directional sound emission device according to Example 3 of the present invention;

[0044] FIG5 is a schematic structural diagram of a directional sound emission device according to Example 4 of the present invention;

[0045] FIG6 is a schematic structural diagram of a directional sound emission device according to Example 5 of the present invention;

[0046] FIG7 is a schematic structural diagram of a directional sound-emitting device according to Example 6 of the present invention;

[0047] FIG8 is a schematic structural diagram of a conventional directional sound-emitting device in which the vibration layer is separated from the supporting structure during vibration;

[0048] FIG9 is a schematic diagram of the structure of the directional sound-emitting device of the present invention in which the vibration layer is fixed to the support structure during vibration;

[0049] FIG10 is a schematic diagram of a curve showing the displacement of the vibration layer of the present invention and the prior art changing with time when a sinusoidal voltage with a frequency of 100 kHz is applied;

[0050] FIG11 is a schematic flow chart of the first process of the manufacturing process of the directional sound-emitting device of the present invention;

[0051] FIG12 is a schematic flow chart of the second process of the manufacturing process of the directional sound-emitting device of the present invention.

[0052] The figures are marked as: 1. Base material layer, 11. Base layer, 12. First conductive layer, 13. Lower edge routing layer, 14. Lower insulating layer, 2. Support structure, 3. Vibration layer, 31. Vibration base layer, 32. Second conductive layer, 33. Upper edge routing layer, 34. Upper insulating layer, 4. Air gap, 5. Fixed point, 6. Fixed layer. Specific implementation method:

[0053] The specific embodiments of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0054] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0055] As shown in Figures 1 to 7 , the present invention discloses a directional sound-emitting device comprising a substrate layer 1, multiple support structures 2, and a vibration layer 3. The support structures 2 are located between the substrate layer 1 and the vibration layer 3 to provide the air gap 4 required for the vibration layer 3 to vibrate up and down. In practice, the support structures 2 can be formed on the surface of the substrate layer 1 near the vibration layer 3, or on the surface of the vibration layer 3 near the substrate layer 1. Preferably, they are formed on the substrate layer 1 for ease of processing.

[0056] During implementation, the substrate layer 1 may specifically include a base layer 11, a first conductive layer 12, a lower edge routing layer 13, and a lower insulating layer 14, wherein the base layer 11 is preferably made of a transparent material, such as glass. The first conductive layer 12 is formed on the surface of the base layer 11 close to the vibration layer 3. During implementation, a metal conductive layer is preferably used, such as nanosilver, METAL MESH (metal mesh), graphene, carbon nanotubes, ITO (indium tin oxide) conductive layer, etc. The lower the square resistance, the better, and the higher the efficiency; the lower edge routing layer 13 is formed on the edge of the surface of the first conductive layer 12 close to the vibration layer 3. During implementation, it can use conductive silver paste to enhance the conductivity of the first conductive layer 12, and if the conductivity of the first conductive layer 12 is sufficient, it can be omitted. The lower insulating layer 14 is formed on the surface of the first conductive layer 12 close to the vibration layer 3 and covers the lower edge routing layer 13. During implementation, the lower insulating layer 14 can use insulating ink. Of course, the present invention is not limited to the specific structure of the substrate layer 1. As long as it has the necessary base layer 11 and the first conductive layer 12, other restrictions are not imposed. The structure and material of the base layer 11 and the first conductive layer 12 are also not limited to those defined herein. Other base layers 11 that can provide support and conductive first conductive layers 12 are applicable to the present invention.

[0057] During implementation, the vibration layer 3 can specifically include a vibration base layer 31, a second conductive layer 32, an upper edge routing layer 33 and an upper insulating layer 34, wherein the vibration base layer 31 can be implemented using any one of PET (polyethylene terephthalate), CPI (transparent polyimide), COP (epoxy-polypropylene copolymer), UTG (ultra-thin flexible glass cover), etc. The second conductive layer 32 is formed on the surface of the vibration base layer 31 close to the substrate layer 1. During implementation, it is also preferred to use a metal conductive layer, such as nanosilver, METAL MESH (metal mesh), graphene, carbon nanotubes, ITO (indium tin oxide) conductive layer, etc. The lower the square resistance, the better, and the higher the efficiency; the upper edge routing layer 33 is formed on the edge of the surface of the second conductive layer 32 close to the substrate layer 1. During implementation, it can also use conductive silver paste to enhance the conductivity of the second conductive layer 32, and if the conductivity of the second conductive layer 32 is sufficient, it can be omitted. The entire upper insulating layer 34 is formed on the surface of the second conductive layer 32 close to the substrate layer 1 and covers the upper edge wiring layer 33. During implementation, the upper insulating layer 34 can also be made of insulating ink. Of course, the present invention is not limited to the specific structure of the vibration layer 3. As long as it has the necessary vibration base layer 31 and the second conductive layer 32, there are no other restrictions. The structure and material of the vibration base layer 31 and the second conductive layer 32 are not limited to those defined here. Other vibration base layers 31 that can provide vibration and conductive second conductive layers 32 are applicable to the present invention. During implementation, only one insulating layer can be set between the substrate layer 1 and the vibration layer 3. The location of the insulating layer is also not limited, as long as it can insulate and isolate the first conductive layer 12 of the substrate layer 1 and the second conductive layer 32 of the vibration layer 3. The overall thickness of the vibration layer 3 can range from 20um to 250um, and preferably uses 25um, 50um, 75um, 100um, 125um, 150um, and 188um.

[0058] The support structure 2 is arranged between the substrate layer 1 and the vibration layer 3. During implementation, one end thereof can be formed on the surface of the lower insulating layer 14 of the substrate layer 1 close to the vibration layer 3, or one end thereof can be formed on the surface of the upper insulating layer 34 of the vibration layer 3 close to the substrate layer 1. It is preferably formed on the lower insulating layer 14. During implementation, the support structure 2 can also be made of insulating ink material. And during implementation, the support structure 2 can also be an insulating bump. After the vibration layer 3 and the substrate layer 1 are frame-bonded, due to the existence of the support structure 2, an air gap 4 is formed between the two for the vibration layer 3 to vibrate up and down. And after bonding, the vibration layer 3, multiple support structures 2 and the substrate layer 1 form multiple vibration units, and the vibration units are preferably arranged in an array to form a parametric array loudspeaker.

[0059] The directional sound-emitting device of the present invention is preferably an electrostatic ultrasonic speaker. Its principle is briefly described as follows: a DC bias voltage is first loaded on the first conductive layer 12 of the substrate layer 1 and the second conductive layer 32 of the vibration layer 3, so that the vibration layer 3 bends and adsorbs toward the direction close to the substrate layer 1, and then an AC voltage is loaded on the two conductive layers. Under the action of the AC voltage, the vibration layer 3 vibrates up and down to emit ultrasonic waves, and the ultrasonic waves are self-demodulated in the air to form audible sounds.

[0060] After the vibration layer 3 and the substrate layer 1 are manufactured, the vibration layer 3 and the substrate layer 1 are directly frame-fitted together. After the vibration layer 3 and the substrate layer 1 are frame-fitted together, the existing support structure 2 is not fixed to the lower insulating layer 14 of the substrate layer 1 or to the upper insulating layer 34 of the vibration layer 3. As shown in FIG8 , when the existing directional sound-emitting device is working, when each vibration unit vibrates, the support structure 2 and the substrate layer 1 or the vibration layer 3 will separate. The reason is that at this time, the rebound force of the vibration layer 3 is greater than the downward electrostatic force, so the entire vibration layer 3 will separate from the substrate layer 1 and vibrate upward for an invalid vibration distance of B. If it is assumed that the total upper and lower vibration distance of the vibration layer 3 is A, then the effective vibration distance of the vibration layer 3 is AB. The invalid vibration will increase the distortion of the sound emitted by the directional sound-emitting device and will also increase the power of the device.

[0061] Preferably, in combination with what is shown in FIG9 , the present invention fixes the support structure 2 to the vibration layer 3 or the substrate layer 1. Specifically, if the support structure 2 is formed on the lower insulating layer 14 of the substrate layer 1, then the end thereof in contact with the upper insulating layer 34 of the vibration layer 3 is fixed to the upper insulating layer 34; if the support structure 2 is formed on the upper insulating layer 34 of the vibration layer 3, then the end thereof in contact with the lower insulating layer 14 of the substrate layer 1 is fixed to the lower insulating layer 14, that is, the upper and lower ends of the support structure 2 are respectively fixed to the vibration layer 3 and the substrate layer 1, so that stable vibration units are formed between the substrate layer 1, the support structure 2 and the vibration layer 3. During implementation, the support structure 2 can be fixed to the vibration layer 3 or the substrate layer 1 through a variety of structures or processes. In a specific embodiment, the support structure 2 can be fixed to the surface of the substrate layer 1 or the surface of the vibration layer 3 through a fixing point 5. For example, a fixing point 5 can be formed on the end of each support structure 2, and the support structure 2 is fixed to the lower insulating layer 14 of the substrate layer 1 or the upper insulating layer 34 of the vibration layer 3 through this fixing point 5. Of course, in other alternative embodiments, the fixing point 5 can be set on the lower insulating layer 14 of the substrate layer 1 or the upper insulating layer 34 of the vibration layer 3, as long as each support structure 2 corresponds to a fixing point 5. In another specific embodiment, the support structure 2 can also be fixed to the surface of the substrate layer 1 or the surface of the vibration layer 3 through a fixing layer 6. For example, an insulating fixing layer 6 can be formed on the lower insulating layer 14 of the substrate layer 1 or the upper insulating layer 34 of the vibration layer 3, and the support structure 2 is fixed to the lower insulating layer 14 of the substrate layer 1 or the upper insulating layer 34 of the vibration layer 3 through this fixing layer 6. During implementation, the above-mentioned support structure 2, fixing points 5, and fixing layer 6 can all be realized using insulating ink and can be manufactured using any of the processes such as silk screen printing, exposure and development, transfer printing, spin spraying, UV printing, stereo spraying, and character printing.

[0062] In one embodiment: the fixed point 5 and the fixed layer 6 are generally made of silk screen ink, and the process curing conditions are preferably lower than the curing ink with a temperature of 100°, or the UV curing uses ink with an energy of less than 3000MJ. This curing condition is suitable for the module that combines the directional sound device of the present invention with the screen, that is, the module is integrated with the screen. Under this curing condition, the display or touch effect of the module integration combined with the screen can be guaranteed, and the problem of yellowing and aging of the components causing a certain degree of display or touch performance degradation can also be avoided. Of course, if the directional sound device of the present invention is used independently, a curing material with a higher temperature (such as a temperature above 200 degrees) or higher energy can also be selected to improve the overall reliability of the directional sound device.

[0063] Furthermore, the anchor points 5 and the anchoring layer 6 are preferably made of dielectric materials with a low number of polar groups, high molecular weight, and high crystallinity to achieve high system stability and insulation. Furthermore, the better the optical properties of the anchor points 5 and the anchoring layer 6, the better the visualization effect: preferably, materials with a transmittance greater than 90%.

[0064] The structure of the directional sound emitting device of the present invention is described below with reference to several specific embodiments.

[0065] Example 1

[0066] As shown in FIG2 , a directional sound-emitting device disclosed in Example 1 of the present invention includes a substrate layer 1, a support structure 2, a fixing point 5 and a vibration layer 3. The specific structures of the substrate layer 1 and the vibration layer 3 can be referred to the above description and will not be repeated here.

[0067] The support structure 2 of this embodiment 1 is printed on the lower insulating layer 14 of the substrate layer 1. After printing, the support structure 2 is cured, preferably by UV curing. After the support structure 2 is cured, a fixed point 5 is formed at the end of the support structure 2. This can be achieved by printing technology, preferably by using a high-precision screen printing machine to ensure that the support structure 2 and the fixed point 5 are accurately aligned. After printing the fixed point 5, the substrate layer 1 and the vibration layer 3 are aligned and the frame is fitted. Then, a DC bias voltage is applied between the first conductive layer 12 of the substrate layer 1 and the second conductive layer 32 of the vibration layer 3 to adsorb the vibration layer 3 downward, so that the end of the support structure 2 is in contact with the upper insulating layer 34 of the vibration layer 3 and fixed through the fixed point 5; then the fixed point 5 is cured, preferably by UV curing. After curing, the shape of the fixed point 5 is fixed. That is to say, when the fixed point 5 is not cured and fixed, the end of the support structure 2 is fixed in contact with the upper insulating layer 34 of the vibration layer 3 through the fixed point 5, and then the fixed point 5 is cured and fixed. In addition, before the fixing point 5 is solidified and fixed, the supporting structure 2 is in contact with the upper insulating layer 34 of the vibration layer 3. After the vibration layer 3 is energized and adsorbed downward, the fixing point 5 is pressed down to be basically flush with the upper end of the supporting structure 2, so the impact on the overall thickness of the sound-emitting device can be almost ignored.

[0068] Example 2

[0069] As shown in Figure 3, a directional sound-emitting device disclosed in Example 2 of the present invention includes a substrate layer 1, a support structure 2, a fixing point 5 and a vibration layer 3. The specific structures of the substrate layer 1 and the vibration layer 3 can be referred to the above description and will not be repeated here.

[0070] Unlike Example 1, the fixed points 5 of this Example 2 are formed on the surface of the upper insulating layer 34 of the vibration layer 3 close to the substrate layer 1, and each supporting structure 2 corresponds to a fixed point 5 on the vibration layer 3. That is, after the upper insulating layer 34 of the vibration layer 3 is formed, the fixed points 5 are processed on the surface of the upper insulating layer 34. During processing, the fixed points 5 can also be formed on the upper insulating layer 34 of the vibration layer 3 using printing technology. After printing the fixed points 5, the substrate layer 1 and the vibration layer 3 are aligned to ensure that the supporting structure 2 and the fixed points 5 are accurately aligned, and the frame is bonded after alignment. The other structures and processing steps are the same as those in Example 1 and will not be repeated here.

[0071] Example 3

[0072] As shown in Figure 4, a directional sound-emitting device disclosed in Example 3 of the present invention includes a substrate layer 1, a support structure 2, a fixing layer 6 and a vibration layer 3. The specific structures of the substrate layer 1 and the vibration layer 3 can be referred to the above description and will not be repeated here.

[0073] Unlike Example 1, this embodiment uses a fixing layer 6 to fix the support structure 2 to the substrate layer 1 or the vibration layer 3. In this embodiment, the fixing layer 6 is formed on the surface of the upper insulating layer 34 of the vibration layer 3 close to the substrate layer 1, that is, another fixing layer 6 is formed on the upper insulating layer 34. The fixing layer 6 can be specifically realized by a silk screen printing process. After printing, before the fixing layer 6 is cured, the vibration layer 3 and the substrate layer 1 are aligned and bonded. After bonding, they are electrically adsorbed, and then the fixing layer 6 is cured. How to electrically adsorb after bonding can be referred to the description in Example 1 and will not be elaborated here. The fixing layer 6 can be thermosetting or UV curing, and UV curing is preferably used for ease of operation.

[0074] Preferably, because the support structure 2 is fixed to the vibration layer 3 through the fixing layer 6 before the solidifying layer 6 is solidified, when fixed, the end of the support structure 2 will be inserted into the fixing layer 6 and contact the surface of the vibration layer 3, so after the fixing layer 6 is solidified, the effective height of the support structure 2 will be reduced. In order to ensure the height of the support structure 2, it is necessary to take the thickness of the fixing layer 6 into consideration during production. Specifically, the height of the existing support structure 2 is added to the thickness of the fixing layer 6 to obtain the height of the support structure 2 that needs to be set in the present invention. Moreover, due to the addition of the fixing layer 6, in order not to affect the overall thickness of the vibration layer 3, the sum of the thickness of the fixing layer 6 and the thickness of the upper insulating layer 34 of the present invention is set to be equal to the entire thickness of the existing upper insulating layer 34. For example, in the preferred case, for vibration layers 3 with thicknesses of 50um, 100um, and 125um, the thickness of the existing upper insulating layer 34 is generally controlled to be between 11um and 12um, and the height of the support structure 2 is between 11um and 12um. The thickness of the fixed layer 6 produced by silk-screen printing in the present invention is 3 to 4 μm, so the height of the upper insulating layer 34 should be controlled at 7 to 8 μm. During lamination, since the fixed layer 6 has not yet cured, the end of the support structure 2 will penetrate the fixed layer 6 and contact the surface of the upper insulating layer 34. Therefore, the effective height of the support structure 2 will be reduced by 3 to 4 μm after curing. To ensure the effective height of the support structure 2 is 11 to 12 μm, the effective height of the support structure 2 should be controlled at 14 to 16 μm during production.

[0075] Example 4

[0076] As shown in Figure 5, a directional sound-emitting device disclosed in Example 4 of the present invention includes a substrate layer 1, a support structure 2, a fixed point 5 and a vibration layer 3. The specific structures of the substrate layer 1 and the vibration layer 3 can be referred to the above description and will not be repeated here.

[0077] Different from Example 1, the support structure 2 of this Example 4 is formed on the upper insulating layer 34 of the vibration layer 3, which can be printed. Correspondingly, the fixing point 5 is formed at the end of the support structure 2 close to the lower insulating layer 14.

[0078] Similarly, the support structure 2 of this embodiment 4 is printed on the upper insulating layer 34 of the vibration layer 3. After printing, the support structure 2 is cured, preferably using UV curing. After the support structure 2 is cured, a fixing point 5 is formed at the end of the support structure 2. This can be achieved using printing technology, preferably using a high-precision screen printer to ensure precise alignment of the support structure 2 and the fixing point 5. After printing the fixing point 5, the substrate layer 1 and the vibration layer 3 are aligned and frame-bonded. Then, a DC bias voltage is applied between the first conductive layer 12 of the substrate layer 1 and the second conductive layer 32 of the vibration layer 3, causing the vibration layer 3 to be attracted downward, so that the end of the support structure 2 contacts the lower insulating layer 14 of the substrate layer 1 and is fixed via the fixing point 5. The fixing point 5 is then cured, also preferably using UV curing. After curing, the shape of the fixing point 5 is fixed. In other words, when the fixing point 5 is not cured and fixed, the end of the support structure 2 is fixed to the lower insulating layer 14 of the substrate layer 1 via the fixing point 5, and then the fixing point 5 is cured and fixed. In addition, before the fixing point 5 is solidified and fixed, the supporting structure 2 is brought into contact with the lower insulating layer 14 of the substrate layer 1. After the vibration layer 3 is energized and adsorbed downward, the fixing point 5 is pressed down to be basically flush with the end of the supporting structure 2, so the impact on the overall thickness of the sound-emitting device can be almost ignored.

[0079] Example 5

[0080] As shown in Figure 6, a directional sound-emitting device disclosed in Example 5 of the present invention includes a substrate layer 1, a support structure 2, a fixing point 5 and a vibration layer 3, wherein the specific structures of the substrate layer 1 and the vibration layer 3 can refer to the above description and will not be repeated here.

[0081] Unlike Example 4, the fixing points 5 of this Example 5 are formed on the surface of the lower insulating layer 14 of the substrate layer 1 close to the vibration layer 3, and each supporting structure 2 corresponds to a fixing point 5 on the substrate layer 1. That is, after the lower insulating layer 14 of the substrate layer 1 is formed, the fixing points 5 are further processed on the surface of the lower insulating layer 14. During processing, the fixing points 5 can also be formed on the lower insulating layer 14 of the substrate layer 1 using printing technology. After printing the fixing points 5, the substrate layer 1 and the vibration layer 3 are aligned to ensure that the supporting structure 2 and the fixing points 5 are accurately aligned. After alignment, the frame is bonded. The other structures and processing steps are the same as those in Example 4 and will not be repeated here.

[0082] Example 6

[0083] As shown in Figure 7, a directional sound-emitting device disclosed in Example 6 of the present invention includes a substrate layer 1, a support structure 2, a fixing layer 6 and a vibration layer 3. The specific structures of the substrate layer 1 and the vibration layer 3 can be referred to the above description and will not be repeated here.

[0084] Unlike Example 4, this embodiment uses a fixing layer 6 to fix the support structure 2 to the substrate layer 1 or the vibration layer 3. In this embodiment, the fixing layer 6 is formed on the surface of the lower insulating layer 14 of the substrate layer 1 close to the vibration layer 3, that is, another fixing layer 6 is formed on the lower insulating layer 14. The fixing layer 6 can be specifically realized by a silk screen printing process. After printing, before the fixing layer 6 is cured, the vibration layer 3 and the substrate layer 1 are aligned and bonded. After bonding, they are electrically adsorbed, and then the fixing layer 6 is cured. How to electrically adsorb after bonding can be referred to the description in Example 4 and will not be repeated here. The fixing layer 6 can be thermosetting or UV curing, preferably UV curing, which is easy to operate.

[0085] Preferably, because the support structure 2 is fixed to the substrate layer 1 through the fixing layer 6 before the solidifying layer 6 is solidified, when fixed, the end of the support structure 2 will be inserted into the fixing layer 6 and contact the surface of the substrate layer 1, so after the fixing layer 6 is solidified, the effective height of the support structure 2 will be reduced. In order to ensure the height of the support structure 2, it is necessary to take the thickness of the fixing layer 6 into consideration during production. Specifically, the height of the existing support structure 2 is added to the thickness of the fixing layer 6 to obtain the height of the support structure 2 that needs to be set in the present invention. Moreover, due to the addition of the fixing layer 6, in order not to affect the overall thickness of the substrate layer 1, the sum of the thickness of the fixing layer 6 and the thickness of the lower insulating layer 14 of the present invention is set to be equal to the entire thickness of the existing lower insulating layer 14. For example, in the preferred case, for the vibration layer 3 with a thickness of 50um, 100um, and 125um, the thickness of the existing lower insulating layer 14 is generally controlled to be between 11um and 12um, and the height of the support structure 2 is between 11um and 12um. The thickness of the fixed layer 6 produced by silk screen printing in the present invention is 3um to 4um, so the height of the lower insulating layer 14 should be controlled at 7um to 8um. During lamination, since the fixed layer 6 has not yet solidified, the end of the support structure 2 will be inserted into the fixed layer 6 and contact the surface of the lower insulating layer 14, so the effective height of the support structure 2 will be reduced by 3um to 4um after solidification. In order to ensure that the effective height of the support structure 2 is 11um to 12um, the effective height of the support structure 2 should be controlled at 14um to 16um during production.

[0086] The present invention fixes the support structure 2 to the vibration layer 3 or the base material layer 1 so that the base material layer 1 and the vibration layer 3 are bonded together, thereby forming stable vibration units, so that the vibration layer 3 will not separate from the support structure 2 when vibrating up and down, thereby eliminating the invalid vibration distance of the vibration layer 3, which can not only reduce the sound distortion of the entire directional sound-emitting device, but also reduce the driving power of the entire device. As shown in Figure 10, it is a curve of the displacement of the vibration layer 3 changing with time when excited by a sinusoidal voltage with a frequency of 100kHz. Compare the two situations in which the vibration layer 3 of the present invention is fixed to the support structure 2 and the existing vibration layer 3 is separated from the support structure 2. It can be seen from the figure that when the vibration layer 3 is separated from the support structure 2, the vibration of the vibration layer 3 cannot form a complete sine wave, thereby causing harmonic distortion. On the contrary, the vibration of the vibration layer 3 of the present invention can form a complete sine wave.

[0087] In addition, the present invention fixes the vibration layer 3 and the support structure 2 together, so that each vibration unit is independent of each other. When under certain reliability conditions (such as power on at a high temperature of 75°C and storage at a high temperature of 60°C and a humidity of 90RH%), the existing vibration layer 3 is not fixed to the support structure 2, and the vibration layer 3 is slightly relaxed, the entire surface of the sound-emitting device will be wrinkled and fail. The present invention fixes the vibration layer 3 and the support structure 2 together. When the vibration layer 3 is slightly relaxed, the relaxation will be evenly distributed on each vibration unit, and the amount distributed to each vibration unit will be very small, so that wrinkles will not be caused.

[0088] The present invention also discloses a manufacturing process for a directional sound-emitting device, which can be implemented using a first process or a second process. As shown in FIG11 , the first process includes:

[0089] S1, forming a support structure 2 on the surface of the substrate layer 1 close to the vibration layer 3;

[0090] S2, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 and the vibration layer 3 are fixed close to the surface of the base material layer 1.

[0091] The process can be implemented in three ways, namely, the first process includes:

[0092] In the above-mentioned S1a, a support structure 2 is formed on the substrate layer 1, and then a fixing point 5 is formed on the end of each support structure 2 fixed to the surface of the vibration layer 3;

[0093] In step S2a, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the vibration layer 3 close to the base material layer 1 through the fixing point 5;

[0094] Or the first process includes:

[0095] In the above-mentioned S1b, a support structure 2 is formed on the substrate layer 1, and fixed points 5 are formed on the surface of the vibration layer 3 close to the substrate layer 1, with each support structure 2 corresponding to one fixed point 5;

[0096] In step S2b, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the vibration layer 3 close to the base material layer 1 through the fixing point 5;

[0097] Or the first process includes:

[0098] In the step S1c, a support structure 2 is formed on the substrate layer 1, and a fixing layer 6 is formed on the entire surface of the vibration layer 3 close to the substrate layer 1;

[0099] In the step S2c, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the vibration layer 3 close to the base material layer 1 through the fixing layer 6.

[0100] As shown in FIG12 , the second process includes:

[0101] S11, forming a support structure 2 on the surface of the vibration layer 3 close to the substrate layer 1;

[0102] S21 , the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the base material layer 1 close to the vibration layer 3 .

[0103] Similarly, this process can also be implemented in three ways:

[0104] The second process comprises:

[0105] S11a, forming a support structure 2 on the vibration layer 3, and then forming a fixing point 5 on the end of each support structure 2 fixed to the surface of the substrate layer 1;

[0106] S21a, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the base material layer 1 close to the vibration layer 3 through the fixing point 5;

[0107] Or the second process includes:

[0108] S11b, forming a support structure 2 on the vibration layer 3, and forming fixing points 5 on the surface of the substrate layer 1 close to the vibration layer 3, with each support structure 2 corresponding to one fixing point 5;

[0109] S21b, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the base material layer 1 close to the vibration layer 3 through the fixing point 5;

[0110] Or the second process includes:

[0111] S11c, forming a support structure 2 on the vibration layer 3, and forming a fixing layer 6 on the entire surface of the base material layer 1 close to the vibration layer 3;

[0112] S21c, the base material layer 1 and the vibration layer 3 are bonded together as a frame, and at the same time, the support structure 2 is fixed to the surface of the base material layer 1 close to the vibration layer 3 through the fixing layer 6.

[0113] The specific implementation process of each step can refer to the description in the above embodiments 1 to 6 respectively, and will not be repeated here.

[0114] The advantage of the present invention is that while the substrate layer 1 and the vibration layer 3 are bonded together as a frame, the support structure 2 is fixed to the vibration layer 3 or the substrate layer 1, so that after the substrate layer 1 and the vibration layer 3 are bonded, stable vibration units can be formed, so that the vibration layer 3 will not separate from the support structure 2 when vibrating up and down, thereby eliminating the invalid vibration distance of the vibration layer 3, which can not only reduce the sound distortion of the entire directional sound-emitting device, but also reduce the driving power of the entire device.

[0115] The foregoing descriptions of specific exemplary embodiments of the present invention are for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many variations and modifications are possible in light of the foregoing teachings. The exemplary embodiments have been selected and described for the purpose of explaining the specific principles of the invention and their practical application, thereby enabling those skilled in the art to realize and utilize a variety of exemplary embodiments of the invention and various options and modifications. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A directional sound device, characterized in that: The device includes a substrate layer, a plurality of supporting structures and a vibration layer, wherein the supporting structure is located between the substrate layer and the vibration layer so that an air gap required for the vibration of the vibration layer is formed between the substrate layer and the vibration layer, one end of the supporting structure is formed on the surface of the substrate layer close to the vibration layer, and the other end is fixed to the surface of the vibration layer close to the substrate layer, or one end of the supporting structure is formed on the surface of the vibration layer close to the substrate layer, and the other end is fixed to the surface of the substrate layer close to the vibration layer; the substrate layer, the supporting structure and the vibration layer are combined to form a plurality of vibration units, and the vibration layer of each vibration unit vibrates under the action of a loaded alternating voltage to emit ultrasonic waves, and the ultrasonic waves are self-demodulated in the air to form audible sounds.

2. The directional sound emitting device according to claim 1, characterized in that: The device further comprises a fixing point, each of the supporting structures corresponds to one fixing point, and the supporting structure is fixed to the surface of the substrate layer or the surface of the vibration layer via the fixing point.

3. The directional sound emitting device according to claim 2, characterized in that: When one end of the supporting structure is formed on the surface of the substrate layer close to the vibration layer and the other end is fixed to the surface of the vibration layer close to the substrate layer, the fixing point is formed on the end portion where the supporting structure is fixed to the surface of the vibration layer or on the surface of the vibration layer close to the substrate layer; when one end of the supporting structure is formed on the surface of the vibration layer close to the substrate layer and the other end is fixed to the surface of the substrate layer close to the vibration layer, the fixing point is formed on the end portion where the supporting structure is fixed to the surface of the substrate layer or on the surface of the substrate layer close to the vibration layer.

4. The directional sound emitting device according to claim 1, characterized in that: The device further comprises a fixing layer located between the substrate layer and the vibration layer, and the supporting structure is fixed to the surface of the substrate layer or the surface of the vibration layer through the fixing layer.

5. The directional sound emitting device according to claim 4, characterized in that: One end of the supporting structure is formed on the surface of the substrate layer close to the vibration layer, and when the other end is fixed to the surface of the vibration layer close to the substrate layer, the entire surface of the fixed layer is formed on the surface of the vibration layer close to the substrate layer; one end of the supporting structure is formed on the surface of the vibration layer close to the substrate layer, and when the other end is fixed to the surface of the substrate layer close to the vibration layer, the entire surface of the fixed layer is formed on the surface of the substrate layer close to the vibration layer.

6. The directional sound emitting device according to claim 5, characterized in that: An end portion of the support structure is inserted into the fixing layer and contacts a surface of the base material layer or a surface of the vibration layer.

7. A manufacturing process of a directional sound-emitting device according to any one of claims 1 to 6, characterized in that: The process adopts the first process or the second process, and the first process includes: S1, forming a support structure on a surface of the substrate layer close to the vibration layer; S2, laminating the substrate layer and the vibration layer with a frame, and fixing the support structure and the surface of the vibration layer close to the substrate layer at the same time; The second process comprises: S11, forming a support structure on a surface of the vibration layer close to the substrate layer; S21, laminating the substrate layer and the vibration layer with a frame, and fixing the support structure to the surface of the substrate layer close to the vibration layer while laminating.

8. The manufacturing process of the directional sound-emitting device according to claim 7, characterized in that: The first process comprises: S1a, forming the support structure on the substrate layer, and then forming a fixing point on the end of each support structure fixed to the surface of the vibration layer; S2a, laminating the substrate layer and the vibration layer with a frame, and at the same time, fixing the support structure to the surface of the vibration layer close to the substrate layer through the fixing point; Or the first process includes: S1b, forming the support structure on the substrate layer, and forming fixed points on the surface of the vibration layer close to the substrate layer, each support structure corresponds to one fixed point; S2b, laminating the substrate layer and the vibration layer with a frame, and at the same time, fixing the support structure to the surface of the vibration layer close to the substrate layer through the fixing point; Or the first process includes: S1c, forming the support structure on the substrate layer, and forming a fixing layer on the entire surface of the vibration layer close to the substrate layer; S2c, the base material layer and the vibration layer are bonded together as a frame, and at the same time, the support structure is fixed to the surface of the vibration layer close to the base material layer through the fixing layer.

9. The manufacturing process of the directional sound-emitting device according to claim 7, characterized in that: The second process comprises: S11a, forming the support structure on the vibration layer, and then forming a fixing point on the end of each support structure fixed to the surface of the substrate layer; S21a, bonding the substrate layer and the vibration layer together as a frame, and fixing the support structure to the surface of the substrate layer close to the vibration layer through the fixing points while bonding; Or the second process includes: S11b, forming the support structure on the vibration layer, and forming fixed points on the surface of the substrate layer close to the vibration layer, each support structure corresponds to one fixed point; S21b, laminating the substrate layer and the vibration layer with a frame, and at the same time, fixing the support structure to the surface of the substrate layer close to the vibration layer through the fixing point; Or the second process includes: S11c, forming the support structure on the vibration layer, and forming a fixing layer on the entire surface of the substrate layer close to the vibration layer; S21c, bonding the substrate layer and the vibration layer together as a frame, and at the same time fixing the support structure to the surface of the substrate layer close to the vibration layer through the fixing layer.

10. The manufacturing process of the directional sound-emitting device according to claim 8 or 9, characterized in that: The fixed point or fixed layer is realized by any one of silk screen printing, exposure and development, transfer, rotary spraying, UV printing, three-dimensional spraying, and character printing processes, and the substrate layer is bonded to the vibration layer before the fixed point or fixed layer is solidified.

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