Photosensitive assembly, camera module and electronic apparatus

Abstract

Provided in the present application are a photosensitive assembly, a camera module and an electronic apparatus. The photosensitive assembly comprises a base, a reed, a main circuit board, an image sensor, a pedestal, a driving assembly and a connecting circuit board, wherein a fixed part of the reed is fixedly connected to the base; the main circuit board comprises a rigid board part and four flexible board parts, the rigid board part being fixed to a movable part of the reed, connecting sections of the flexible board parts being bent relative to first ends and being arranged on the peripheral side of the rigid board part, and the four connecting sections being symmetrical about a first plane and being symmetrical about a second plane; the image sensor is fixedly connected to the rigid board part, and the intersection line of the first plane and the second plane coincides with the central axis of a photosensitive face of the image sensor; the pedestal is fixedly connected to the base; the driving assembly is used for driving the rigid board part to move relative to the pedestal in a plane perpendicular to the central axis; and a main board part of the connecting circuit board is fixed to the side of the pedestal facing away from the base, and second ends of the four flexible board parts are fixedly connected to the main board part. The photosensitive assembly is relatively low in terms of circuit structure processing difficulty, and has a relatively high product yield.

Description

Photosensitive components, camera modules and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on August 30, 2023, with application number 202311112819.2, and priority to the Chinese patent application entitled “Photosensitive component, camera module and electronic device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of camera technology, and in particular to a photosensitive component, a camera module, and an electronic device. Background Art

[0003] As smartphone cameras become increasingly powerful, optical image stabilization (OIS) technology has become a key selling point and competitive advantage. OIS detects and compensates for camera shake within a certain frequency and amplitude range in real time. Compared to using software algorithms to increase gain, OIS minimizes image quality loss, thus ensuring excellent image quality.

[0004] Currently, a camera module may include a lens and a photosensitive component located on the light-emitting side of the lens. The photosensitive component may include an image sensor and an anti-shake motor. The anti-shake motor is used to drive the image sensor shift to achieve optical image stabilization. Among them, since the image sensor is relatively light in weight, the load on the anti-shake motor is relatively small, which is conducive to achieving low power consumption of the camera module. However, since the photosensitive component requires a relatively complex circuit structure to realize the transmission of the electrical signal of the image sensor, and the processing difficulty of this circuit structure is relatively high, the product yield of the photosensitive component and the camera module is low.

[0005] Summary of the Invention

[0006] The purpose of the embodiments of the present application is to provide a photosensitive component, a camera module and an electronic device, wherein the circuit structure of the photosensitive component is less difficult to process and the product yield of the photosensitive component is higher.

[0007] In the first aspect, the embodiment of the present application provides a photosensitive component, which can be used in a camera module. The photosensitive component includes a base, a spring, a main circuit board, an image sensor, a base, a driving component and a connecting circuit board. The spring includes a fixed part, a movable part and a connecting part, the fixed part is fixedly connected to the base, the movable part is located on the inner side of the fixed part, and the connecting part connects the fixed part and the movable part; the main circuit board includes a hard board part and four soft board parts, the hard board part is fixed to the side of the movable part facing away from the base, each soft board part includes a first end, a connecting section and a second end connected in sequence, the first end is connected to the side of the hard board part, the connecting section is bent relative to the first end and arranged on the peripheral side of the hard board part, the second end is bent relative to the connecting section and is located on the side of the hard board part facing away from the base, the connecting sections of the four soft board parts are symmetrical about the first plane and about the second plane The hard board portion is plane-symmetrical; the image sensor is fixedly connected to the hard board portion, and the intersection line of the first plane and the second plane coincides with the central axis of the photosensitive surface of the image sensor; the base includes a main body and a plurality of legs fixed to the main body, the main body is located on the side of the hard board portion facing away from the base, and the plurality of legs are fixedly connected to the base; the driving assembly is used to drive the hard board portion to move relative to the base on a plane perpendicular to the central axis of the photosensitive surface of the image sensor; the connecting circuit board includes a main board portion and an extension portion, the main board portion is fixed to the side of the base facing away from the base, the extension portion is connected to the side of the main board portion, and the second ends of the four soft board portions are fixedly connected to the main board portion.

[0008] In this embodiment, the circuit structure of the photosensitive component divides a circuit board into a main circuit board and a connecting circuit board. The hard board portion of the main circuit board and the main board portion of the connecting circuit board are stacked in the Z-axis direction. The hard board portion is electrically connected to the main board portion via four soft board portions. The electrical signals of the image sensor are transmitted to external components via the hard board portion, four soft board portions, the main board portion, and the extension portion. Because the hard board portion and the main board portion are connected via four soft board portions, the soft board portion adopts a flexible circuit board structure, which is simple, easy to implement, and has low processing difficulty. Therefore, it is conducive to improving the product yield of the photosensitive component and camera module. The soft board portion is also easy to deform and has high reliability.

[0009] In addition, the hard board part of the main circuit board, the main board part of the connecting circuit board, and the second end of the soft board part of the main circuit board are stacked in the Z-axis direction, and the connecting sections of the four soft board parts of the main circuit board are arranged on the surrounding sides of the hard board part, the driving component and the main board part of the connecting circuit board. This arrangement is conducive to reducing the size of the electrical connection structure and the photosensitive component in the XY plane. The soft board part can also reuse the space in the Z-axis direction with other components, so that the size of the electrical connection structure and the photosensitive component in the Z-axis direction is also smaller, which is conducive to the miniaturization of the photosensitive component and the camera module.

[0010] Among them, during the movement of the image sensor and the hard board part, the connecting section of the soft board part is deformed and the force generated acts on the hard board part. Since the connecting sections of the four soft board parts are symmetrical about the first plane and the second plane, and the intersection line of the first plane and the second plane coincides with the photosensitive center of the image sensor, the force applied by the four soft board parts to the hard board part is highly stable, and the force on the hard board part in the X-axis and Y-axis directions is balanced, which helps to reduce crosstalk during the movement of the image sensor, helps to improve the stability of optical image imaging, and thereby improves the imaging quality of the photosensitive component and the camera module.

[0011] In addition, the moving part of the photosensitive component can be suspended by a roughly flat spring, which also has the function of driving the moving part to reset. Therefore, the suspension structure of the photosensitive component is simple, easy to implement, and small in size, and can also reduce the power consumption of the anti-shake drive.

[0012] In a possible implementation, a portion of the connecting segment extends along a first direction, and another portion of the connecting segment extends along a second direction, where the second direction intersects the first direction.

[0013] In this embodiment, in the solution where the connecting section is perpendicular to the hard board portion, when the hard board portion moves in the XY plane, the deformation direction of the connecting section (for example, the X-axis direction and / or the Y-axis direction) is mainly perpendicular to its board surface. Therefore, the deformation of the connecting section is easy to achieve and the risk of damage to the connecting section is low, thereby ensuring the structural reliability of the soft board portion and the reliability of electrical signal transmission.

[0014] In one possible embodiment, the connecting section is perpendicular to the hard plate portion. In this embodiment, on a plane parallel to the hard plate portion, the connecting section occupies a smaller space, which is conducive to the miniaturization design of the photosensitive component and the camera module.

[0015] In one possible embodiment, the photosensitive component also includes two reinforcing plates, which are arranged opposite to each other and respectively fixed on opposite sides of the movable part; the connecting section of each soft board part includes a first part connected to the first end, and the first parts of two of the four soft board parts are fixed to one of the reinforcing plates, and the first parts of the other two soft board parts are fixed to the other reinforcing plate.

[0016] In this embodiment, because the two reinforcing plates are fixed relative to the movable portion, and the first portions of the connecting segments of the four flexible board portions are fixed to the two reinforcing plates, the first ends of the flexible board portions and the first portions of the connecting segments can both move synchronously with the hard board portion without deforming. This reduces the risk of damage to the first ends of the flexible board portions and the first portions of the connecting segments during movement of the image sensor and the hard board portion, and also reduces the motion interference of the flexible board portions on the image sensor, thereby further reducing crosstalk and improving optical image formation stability. It will be appreciated that when the first portions of the connecting segments of the four flexible board portions are fixed relative to the hard board portion, and the second portions of the connecting segments are fixed relative to the base, during movement of the image sensor and the hard board portion, deformation of the flexible board portions can be contained within the connecting segments, thereby improving the accuracy of motion control.

[0017] In one possible embodiment, the photosensitive assembly further includes a reinforcement frame secured to the side of the movable portion facing the base, with two reinforcement plates connected to opposite sides of the reinforcement frame. In this case, the reinforcement frame can increase the structural strength of the movable portion of the spring, thereby reducing the risk of deformation of the movable portion when subjected to force.

[0018] In one possible embodiment, the base of the photosensitive component includes a bottom plate and two fixed plates, which are arranged opposite to each other and fixed on opposite sides of the bottom plate respectively; the connecting section of each soft board part includes a second part connected to the second end, and the second parts of two of the four soft board parts are fixed to one of the fixed plates, and the second parts of the other two soft board parts are fixed to the other fixed plate.

[0019] In this embodiment, since the second parts of the connecting sections of the four soft board parts are fixed to the base, the second ends of the soft board parts and the second parts of the connecting sections are both fixed structures, which can prevent deformation during the movement of the image sensor and the hard board part, thereby reducing the risk of damage to the second ends of the soft board parts and the second parts of the connecting sections, and can also reduce the movement interference of the soft board parts on the image sensor, thereby further reducing crosstalk and improving the stability of optical image imaging.

[0020] In one possible embodiment, the connecting sections of the soft board parts each include a second part connected to the second end, the second parts of two of the four soft board parts are fixed to one side of the main body, and the second parts of the other two soft board parts are fixed to the other side of the main body.

[0021] In this embodiment, the photosensitive component fixes the second part of the connecting section of the four soft board parts through the main body of the base. Therefore, the second end of the soft board part and the second part of the connecting section are fixed structures, which can prevent deformation during the movement of the image sensor and the hard board part, thereby reducing the risk of damage to the second end of the soft board part and the second part of the connecting section, and can also reduce the movement interference of the soft board part on the image sensor, thereby further reducing crosstalk and improving the stability of optical image imaging.

[0022] In a possible embodiment, a plurality of positioning protrusions are provided on a side of the main body of the photosensitive component facing away from the hard board portion, and the second ends of the plurality of soft board portions are clamped with the plurality of positioning protrusions.

[0023] In this embodiment, the connection between the second end of the soft board portion and the main body of the base is more stable and reliable.

[0024] In a possible embodiment, a plurality of windows are provided on the side of the second end of the photosensitive component, the solder pads of the second end are exposed in the windows, and the solder pads of the second end are electrically connected to the connecting circuit board.

[0025] In this embodiment, the connection method of connecting the second end of the flexible board portion and the connection circuit board by spot welding is easy to implement and has a high yield rate.

[0026] In a possible implementation, the connecting portion of the photosensitive component includes four spring wire groups, and the four spring wire groups are symmetrical about the first plane and symmetrical about the second plane.

[0027] In this embodiment, the force applied to the movable part by the four spring wire groups is highly stable, and the movable part is subjected to balanced force in the X-axis and Y-axis directions, which helps to reduce crosstalk during the movement of the image sensor, helps to improve the stability of optical image imaging, and thereby improves the imaging quality of the photosensitive component and the camera module.

[0028] In one possible embodiment, the movable part of the photosensitive component is provided with a first through hole, and the hard plate part is provided with a second through hole, and the second through hole is connected to the first through hole; the photosensitive component also includes a support plate, the support plate is fixed to the side of the movable part facing the base, and the image sensor is fixed to the support plate and is at least partially located in the first through hole and / or the second through hole.

[0029] In this embodiment, the image sensor and the hard board portion of the main circuit board and / or the movable portion of the reed can reuse the Z-axis direction space, which is beneficial to reducing the Z-axis direction height of the photosensitive component and the camera module.

[0030] In one possible embodiment, the driving assembly of the photosensitive component includes a magnet group and a coil group, the magnet group is fixed to the main body, and the coil group is fixed to the side of the hard plate portion facing away from the base and is arranged opposite to the magnet group; the magnet group and the coil group are symmetrical about the first plane and symmetrical about the second plane.

[0031] In this embodiment, the magnet group and the coil group are symmetrical about the first plane and the second plane, and the intersection line of the first plane and the second plane coincides with the photosensitivity center of the image sensor. Therefore, the driving force applied by the driving component to the bracket is highly stable. During the movement of the bracket, the hard plate portion and the image sensor, the bracket is subjected to balanced forces in the X-axis and Y-axis directions, which helps to reduce crosstalk during the movement of the image sensor, thereby improving the optical image imaging stability, making the anti-shake performance of the photosensitive component and the camera module better, and improving the imaging quality of the photosensitive component and the camera module.

[0032] In a possible implementation, the photosensitive component further includes a bracket, the bracket is fixed to a side of the hard plate portion facing away from the base, and the coil assembly is fixed to a side of the bracket facing away from the hard plate portion.

[0033] In this embodiment, a driving component including a coil group and a magnet group is used to drive the bracket and the base to move relative to each other. Since the hard board part is fixed to the bracket and the image sensor is fixed to the hard board part, the driving component can drive the hard board part and the image sensor to move relative to the base, for example, move relative to the base on a plane perpendicular to the photosensitivity center of the image sensor, thereby achieving optical image stabilization through the movement of the image sensor.

[0034] In a possible embodiment, the photosensitive component also includes multiple magnetic parts and multiple balls. The multiple magnetic parts are fixed to the bracket and are arranged one-to-one corresponding to the multiple magnets in the magnet group. The multiple balls are supported between the bracket and the main body; the multiple magnetic parts and the multiple balls are symmetrical about the first plane and symmetrical about the second plane.

[0035] In this embodiment, a magnetic attraction force is formed between the magnetic attraction part and the magnet, so that the bracket tends to approach the main body of the base, and the bracket, the ball bearing and the main body of the base maintain contact. During the anti-shake process of the image sensor, the bracket achieves relative movement with the base through sliding and / or rolling of the ball bearing. The friction force during the movement is small, which can reduce the driving power consumption and improve the stability of the anti-shake system.

[0036] In addition, since the multiple magnets, multiple magnetic members and multiple ball bearings are symmetrical about the first plane and symmetrical about the second plane, the intersection line of the first plane and the second plane coincides with the photosensitivity center of the image sensor. Therefore, during the movement of the bracket, the hard board part and the image sensor, the friction force exerted on the bracket in the X-axis direction and the Y-axis direction is balanced, which helps to reduce the crosstalk during the movement of the image sensor, thereby improving the stability of optical image imaging, making the anti-shake performance of the photosensitive component and the camera module better, and improving the imaging quality of the photosensitive component and the camera module.

[0037] In a possible implementation, the photosensitive component further includes a filter, which is fixed to the bracket and arranged facing the image sensor.

[0038] In this embodiment, the filter can filter out certain wavelengths of light and allow certain wavelengths of light to pass through, thereby reducing some ghost images and stray light, and also providing some protection for the image sensor.

[0039] In a possible implementation, the photosensitive component further includes a filter and a filter holder, the filter holder is fixed to the side of the hard plate portion facing away from the base, and the filter is fixed to the filter holder and arranged facing the image sensor.

[0040] Among them, the filter assembly and the bracket can reuse the Z-axis direction space, which is beneficial to reducing the Z-axis direction height of the photosensitive assembly and the camera module.

[0041] In a possible embodiment, the photosensitive component also includes a top plate and a side plate, the top plate is located on the side of the connecting circuit board facing away from the base, one end of the side plate is fixed to the periphery of the top plate, and the other end of the side plate is fixed to the base; the middle area of ​​the top plate is recessed relative to the peripheral area of ​​the top plate toward the base.

[0042] In this embodiment, the focus motor is sunken relative to the surrounding area of ​​the top plate, making the assembly of the focus motor and photosensitive component more compact, which helps reduce the size of the camera module in the Z-axis direction, thereby achieving a high degree of miniaturization. In addition, because the head of the camera module consists of the focus motor and lens, the structure is simple and the volume is small, which also helps reduce the size of the camera module head in the X-axis and / or Y-axis directions, thereby achieving miniaturization.

[0043] In one possible embodiment, the top plate of the photosensitive component is provided with a first window, the second end is at least partially located in the first window, the top plate is provided with a second window, the connecting circuit board includes a connecting pad, and the connecting pad is exposed in the second window.

[0044] In this embodiment, the focus motor may be provided with exposed solder pads, which may be fixedly and electrically connected to the connection pads on the connection circuit board. In this case, the focus motor is electrically connected to the connection circuit board of the photosensitive component. In this embodiment, multiple components of the camera module can be electrically connected to external components via the connection circuit board, resulting in a highly integrated electrical connection structure.

[0045] In a second aspect, an embodiment of the present application further provides a camera module, which includes a lens and any one of the above-mentioned photosensitive components, and the photosensitive component is located on the light-emitting side of the lens.

[0046] The photosensitive component in the camera module in the embodiment of the present application has a simple circuit structure, is relatively easy to process, and has a high product yield of the photosensitive component and the camera module.

[0047] In a possible implementation, the camera module further includes a focus motor, which is located on the light-incoming side of the photosensitive component. The lens is mounted on the focus motor, and the focus motor is electrically connected to a connection circuit board of the photosensitive component.

[0048] In this embodiment, the focus motor and the lens together constitute the forehead position of the camera module, which has a simple structure and a small size, which is conducive to reducing the size of the head position of the camera module in the X-axis direction and / or Y-axis direction to achieve miniaturization.

[0049] In a third aspect, embodiments of the present application further provide an electronic device comprising an image processor and the aforementioned camera module, the image processor being communicatively connected to the camera module and configured to acquire image data from the camera module and process the image data. The electronic device in embodiments of the present application comprises a camera module and a photosensitive component that are relatively easy to manufacture, resulting in a high product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0051] FIG1 is a schematic structural diagram of an electronic device provided in some embodiments of the present application;

[0052] FIG2 is a schematic diagram of a partially exploded structure of the electronic device shown in FIG1 ;

[0053] FIG3 is a schematic structural diagram of some embodiments of the camera module shown in FIG1 ;

[0054] FIG4 is a partially exploded schematic diagram of some embodiments of the camera module shown in FIG3 ;

[0055] FIG5 is a schematic diagram of the cross-sectional structure of the camera module shown in FIG3 taken along line AA;

[0056] FIG6 is a schematic diagram of the exploded structure of the photosensitive component shown in FIG4 in some embodiments;

[0057] FIG7 is a schematic structural diagram of the base shown in FIG6;

[0058] FIG8 is a schematic structural diagram of some components of the photosensitive assembly shown in FIG6 ;

[0059] FIG9 is a schematic diagram of the assembly structure of the components shown in FIG8;

[0060] FIG10 is a schematic cross-sectional view of the structure shown in FIG9 taken along line BB;

[0061] FIG11 is a schematic structural diagram of the main circuit board shown in FIG6;

[0062] FIG12 is a schematic diagram of a portion of the structure of the main circuit board shown in FIG11;

[0063] FIG13 is a schematic structural diagram of the structure shown in FIG9 and the main circuit board shown in FIG11 after assembly;

[0064] FIG14 is a schematic cross-sectional view of the structure shown in FIG13 taken along CC;

[0065] FIG15 is a schematic structural diagram of another part of the photosensitive assembly shown in FIG6;

[0066] FIG16 is a schematic diagram of the assembly structure of the components shown in FIG15;

[0067] FIG17 is a schematic diagram of the assembly structure of the structure shown in FIG13 , the structure shown in FIG16 , and the filter assembly shown in FIG6 ;

[0068] FIG18 is a schematic cross-sectional view of the structure shown in FIG17 along the cross section at DD;

[0069] FIG19 is a schematic structural diagram of the base shown in FIG6 at another angle;

[0070] FIG20 is a schematic diagram of a partial structure of the base shown in FIG19;

[0071] FIG21 is a schematic diagram of the assembly structure of the base and the magnet group shown in FIG6;

[0072] FIG22 is a schematic diagram of the assembled structure of the structure shown in FIG17 and the structure shown in FIG21;

[0073] FIG23 is a schematic cross-sectional view of the structure shown in FIG22 taken along line EE;

[0074] FIG24 is a schematic cross-sectional view of the structure shown in FIG22 taken along the FF line;

[0075] FIG25 is a schematic diagram of the assembly structure of the connection circuit board shown in FIG6 and the structure shown in FIG22;

[0076] FIG26 is a schematic cross-sectional view of the structure shown in FIG25 taken along GG;

[0077] FIG27 is a schematic structural diagram of the upper shell shown in FIG6;

[0078] FIG28A is a schematic diagram of the assembly structure of the upper shell shown in FIG27 and the structure shown in FIG22;

[0079] FIG28B is a schematic cross-sectional view of the structure shown in FIG28A taken along line HH;

[0080] FIG29 is a schematic structural diagram of the Mylar sheet assembly shown in FIG6 ;

[0081] FIG30 is a schematic structural diagram of the photosensitive component shown in FIG4 ;

[0082] FIG31 is a schematic cross-sectional view of the photosensitive component shown in FIG30 taken along line II;

[0083] FIG32 is a schematic diagram of the internal structure of the photosensitive component shown in FIG4 in some other embodiments;

[0084] FIG33 is a schematic diagram of the internal structure of the camera module shown in FIG2 in other embodiments;

[0085] FIG34 is a schematic cross-sectional view of the camera module shown in FIG33 taken along JJ;

[0086] FIG35 is a schematic diagram of a partially exploded structure of the camera module shown in FIG33 ;

[0087] FIG36 is a schematic diagram of a portion of the structure of the photosensitive assembly shown in FIG35 ;

[0088] FIG37 is a schematic diagram of the exploded structure of the structure shown in FIG36 . DETAILED DESCRIPTION

[0089] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0090] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed" and "connected" should be understood in a broad sense. For example, "connected" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only referenced to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. "Multiple" means at least two. In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of such features.

[0091] In addition, in the embodiments of the present application, the limitations of the relative position relationship mentioned, such as parallel, perpendicular, aligned, etc., are all for the current state of the art, rather than absolutely strict limitations, and a small amount of deviation is allowed, and it is possible to be approximately parallel, approximately perpendicular, approximately aligned, etc. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0092] Please refer to Figures 1 and 2 in combination. Figure 1 is a structural diagram of an electronic device 100 provided in some embodiments of the present application, and Figure 2 is a partial exploded structural diagram of the electronic device 100 shown in Figure 1.

[0093] In some embodiments, the electronic device 100 can be a device with a camera function, such as a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet. In the embodiment of FIG1 , the electronic device 100 is described as a mobile phone. Of course, other types of electronic devices 100 can also adopt similar structures, which will not be described in detail below.

[0094] It will be understood that Figures 1 and 2 only schematically illustrate some components included in the electronic device 100. The actual shape, actual size, actual position and actual structure of these components are not limited by Figures 1 and 2. The electronic device 100 may also include more or fewer components compared to Figures 1 and 2.

[0095] In some embodiments, the electronic device 100 may include a screen 10, a back cover 20, a camera module 30, and a camera decorative part 40. The screen 10 is used to display images, videos, etc. The screen 10 includes a transparent cover 101 and a display screen 102. The transparent cover 101 and the display screen 102 are stacked and fixedly connected. The transparent cover 101 is mainly used to protect the display screen 102 and prevent dust. The material of the transparent cover 101 includes but is not limited to glass. The display screen 102 can be a flexible display screen or a rigid display screen. For example, the display screen 102 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc.

[0096] Exemplarily, the back shell 20 is used to protect the internal electronic components of the electronic device 100. The back shell 20 includes a back cover 201 and a frame 202. The back cover 201 is located on the side of the display screen 102 away from the transparent cover plate 101, and is stacked with the transparent cover plate 101 and the display screen 102. The frame 202 is fixed to the back cover 201. Exemplarily, the frame 202 can be fixed to the back cover 201 by adhesive. The frame 202 can also be an integrally molded structure with the back cover 201, that is, the frame 202 and the back cover 201 are an integral structure. The frame 202 is located between the back cover 201 and the transparent cover plate 101. The transparent cover plate 101 can be fixed to the frame 202 by adhesive. The transparent cover plate 101, the back cover 201 and the frame 202 enclose an internal storage space of the electronic device 100. The internal storage space accommodates the display screen 102.

[0097] For example, the camera module 30 is used to take photos / videos. For example, the camera module 30 can be located in the internal storage space of the electronic device 100. The number of camera modules 30 can be one or more, for example, two are used as an example in this embodiment. The camera module 30 can be used as a rear camera module or a front camera module.

[0098] Illustratively, the light-entering surface of the camera module 30 faces the back cover 201. The back cover 201 is provided with a mounting opening 2011, and the camera decoration 40 covers and is fixed to the mounting opening 2011. The camera decoration 40 is used to protect the camera module 30. In some embodiments, the camera decoration 40 protrudes to the side of the back cover 201 away from the light-transmitting cover 101. This increases the installation space for the camera module 30 in the thickness direction of the electronic device 100. In other embodiments, the camera decoration 40 may be flush with the back cover 201 or recessed into the internal storage space of the electronic device 100. The camera decoration 40 is provided with a light-transmitting window 401. The light-transmitting window 401 allows scene light to enter the light-entering surface of the camera module 30. In this embodiment, the camera module 30 can serve as the rear camera module of the electronic device 100. In other embodiments, the light-entering surface of the camera module 30 faces the light-transmitting cover 101. The display screen 102 is provided with a light path avoidance hole. The light path avoidance hole allows the scene light to pass through the transparent cover plate 101 and then enter the light incident surface of the camera module 30. In this way, the camera module 30 serves as the front camera module of the electronic device 100.

[0099] In some embodiments, as shown in FIG2 , the electronic device 100 further includes a circuit board 50 and an image processor 60, and the circuit board 50 and the image processor 60 are located in the internal accommodation space of the electronic device 100, and the image processor 60 is fixed to the circuit board 50 and electrically connected to the circuit board 50. The image processor 60 is communicatively connected to the camera module 30. The image processor 60 is used to obtain image data from the camera module 30 and process the image data. Among them, the communication connection between the camera module 30 and the image processor 60 may include data transmission through electrical connection methods such as wiring, and data transmission may also be achieved through coupling and other methods. It is understandable that the camera module 30 and the image processor 60 may also achieve communication connection through other methods that can achieve data transmission.

[0100] In some embodiments, the electronic device 100 may further include an analog-to-digital converter (also referred to as an A / D converter, not shown). The analog-to-digital converter is connected between the camera module 30 and the image processor 60. The analog-to-digital converter is used to convert the signal generated by the camera module 30 into a digital image signal and transmit it to the image processor 60. The image processor 60 then processes the digital image signal and ultimately displays the image or video on the screen 10.

[0101] In some embodiments, the electronic device 100 may further include a memory (not shown), which is communicatively connected to the image processor 60. The image processor 60 processes the digital image signal and then transfers the image to the memory, so that the image can be retrieved from the memory and displayed on the screen 10 at any time when the image is needed. In some embodiments, the image processor 60 may also compress the processed digital image signal before storing it in the memory to save memory space.

[0102] In other embodiments, the electronic device 100 may not include the screen 10 and / or the camera decoration 40 .

[0103] It is understood that the installation position of the camera module 30 of the electronic device 100 in the embodiments shown in Figures 1 and 2 is merely illustrative, and this application does not strictly limit the installation position of the camera module 30. In some other embodiments, the camera module 30 may also be installed in other positions of the electronic device 100, for example, the camera module 30 may be installed in the upper middle or upper right corner of the back of the electronic device 100. In some other embodiments, the electronic device 100 may include a terminal body and an auxiliary component that can be rotated, moved, or disassembled relative to the terminal body, and the camera module 30 may also be provided on the auxiliary component.

[0104] Please refer to Figures 3 to 5 in combination. Figure 3 is a structural schematic diagram of some embodiments of the camera module 30 shown in Figure 1, Figure 4 is a partially decomposed schematic diagram of some embodiments of the camera module 30 shown in Figure 3, and Figure 5 is a cross-sectional structural schematic diagram of the camera module 30 shown in Figure 3 taken along AA.

[0105] For ease of description, the camera module 30 is defined as having an X-axis direction, a Y-axis direction, and a Z-axis direction, wherein the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The camera module 30 may also have an XY plane, an XZ plane, and a YZ plane, wherein the XY plane is the plane where the X-axis direction and the Y-axis direction are located, the XZ plane is the plane where the X-axis direction and the Z-axis direction are located, and the YZ plane is the plane where the Y-axis direction and the Z-axis direction are located. The width direction of the camera module 30 may be parallel to the X-axis direction, the length direction of the camera module 30 may be parallel to the Y-axis direction, and the height direction of the camera module 30 may be parallel to the Z-axis direction. When the camera module 30 is installed in the electronic device 100, the height direction of the camera module 30 may be parallel to the thickness direction of the electronic device 100, that is, perpendicular to the screen 10. In other embodiments, the coordinate system setting of the camera module 30 may be flexibly set according to specific actual needs.

[0106] In some embodiments, the camera module 30 may include a lens 1 , a photosensitive component 2 and a focus motor 3 .

[0107] Illustratively, lens 1 is used to image a photographed scene. Lens 1 may include a lens barrel and an optical lens assembly. The optical lens assembly is fixed to the inner side of the lens barrel, which is used to secure and protect the optical lens assembly. The optical lens assembly includes at least one optical lens. When the optical lens assembly includes multiple optical lenses, the multiple optical lenses are stacked along the direction of the optical axis of lens 1. By designing the structure and parameters of the optical lens assembly, a lens 1 with different characteristics such as wide-angle, standard, and telephoto can be obtained. Specifically, the optical axis 11 of lens 1 may be parallel to the Z-axis. The optical axis of the optical lens assembly is the optical axis 11 of lens 1.

[0108] Exemplarily, the photosensitive component 2 is located on the light-emitting side of the lens 1. The photosensitive component 2 includes an image sensor 21, also known as a photosensitive chip or a photosensitive element. The image sensor 21 utilizes the photoelectric conversion function of a photoelectric device to convert the light image on the photosensitive surface into an electrical signal proportional to the light image. In the camera module 30, the lens 1 images the scene being captured onto the photosensitive surface 211 of the image sensor 21, which then converts the light image of the scene into a corresponding electrical signal. Exemplarily, the optical axis 11 of the lens 1 coincides with the central axis 212 of the photosensitive surface 211 of the image sensor 21. The central axis 212 of the photosensitive surface 211 of the image sensor 21 is perpendicular to the photosensitive surface 211 and passes through the center of the photosensitive surface 211. The central axis 212 of the photosensitive surface 211 of the image sensor 21 can be parallel to the Z-axis. For ease of description, the central axis 212 of the photosensitive surface 211 of the image sensor 21 will be referred to as the photosensitive center 212 of the image sensor 21.

[0109] For example, the photosensitive component 2 may further include an anti-shake motor 22, which may be used to drive the image sensor 21 to move in the XY plane or tilt in any direction to achieve optical image stabilization. Thus, when the camera module 30 collects ambient light, if the electronic device 100 experiences jitter in the XY plane due to external forces, the anti-shake motor 22 may be used to control the movement of the image sensor 21 in the XY plane, thereby achieving optical image stabilization (OIS) for the camera module 30 and improving the imaging quality of the camera module 30.

[0110] Exemplarily, the focus motor 3 is located on the light-incoming side of the photosensitive component 2 and can be fixed to the photosensitive component 2. The lens 1 can be mounted on the focus motor 3, which is used to drive the lens 1 to move along the direction of the optical axis 11 of the lens 1, so that the camera module 30 can achieve automatic focusing (AF). The focus motor 3 can be a voice coil motor (VCM) or other motor structure, which is not strictly limited in the embodiments of the present application.

[0111] In some other embodiments, the camera module 30 may not be provided with a focus motor 3, and the lens 1 may be directly fixed to the photosensitive component 2. In some other embodiments, the camera module 30 may also use other types of motors, which are not strictly limited in the present embodiment.

[0112] In some embodiments, the camera module 30 may further include a variable aperture (VA) (not shown in the figure). The variable aperture has an aperture hole, which is located on the light incident side of the lens 1, and the size of the aperture hole is variable. The variable aperture is used to adjust the amount of light entering so that the camera module 30 can maintain a constant shooting quality under various brightness conditions. In a high-brightness environment, the size of the aperture hole can be reduced to allow a relatively small amount of light to enter the lens 1; in a low-brightness environment, the size of the aperture hole can be expanded to allow a relatively large amount of light to enter the lens 1; thereby, the amount of light entering the lens 1 is adjusted, ensuring the shooting quality of the camera module 30. In some embodiments, the variable aperture is fixed to the lens 1 so as to be fixed relative to the lens 1, so that it can move synchronously with the lens 1, so that the relative position of the aperture hole and the lens 1 remains unchanged, thereby ensuring the shooting quality of the camera module 30.

[0113] The following is a brief description of the main structure of the photosensitive component 2 mainly in conjunction with Figure 6.

[0114] Please refer to FIG6 , which is a schematic diagram of the exploded structure of the photosensitive component 2 shown in FIG4 in some embodiments.

[0115] In some embodiments, the anti-shake motor 22 may include a base 221, a bracket 222, and a drive assembly 223, wherein the drive assembly 223 is used to drive the bracket 222 to move relative to the base 221 on the XY plane. Exemplarily, the drive assembly 223 may include a magnet group 2231 and a coil group 2232. In this case, the anti-shake motor 22 is a voice coil motor (VCM). Among them, one of the magnet group 2231 and the coil group 2232 can be fixed to the base 221, and the other can be fixed to the bracket 222. When the coil group 2232 is energized, the coil group 2232 generates a Lorentz force in the magnetic field of the magnet group 2231, and the Lorentz force drives the bracket 222 to move relative to the base 221 on the XY plane.

[0116] For example, the camera module 30 may further include a plurality of magnetic members 231 and a plurality of balls 232. The plurality of magnetic members 231 are used to cooperate with the magnet group 2231 to make the bracket 222 and the base 221 tend to approach each other, and the plurality of balls 232 are supported between the bracket 222 and the base 221.

[0117] For example, the camera module 30 may further include a base 241, an upper shell 242, a main circuit board 25, a support plate 26, a connecting circuit board 27, a spring 28, a reinforcing member 29, a filter assembly 210, and a Mylar assembly 220. The upper shell 242 and the base 241 may cooperate to form a housing for the photosensitive assembly 2, and the space inside the housing may be used to accommodate other components of the photosensitive assembly 2.

[0118] The base 221 of the anti-shake motor 22 can be fixed relative to the base 241, the bracket 222 can be located between the base 221 and the base 241, the main circuit board 25 can be fixedly connected to the bracket 222, and the image sensor 21 can be fixedly connected to the main circuit board 25 via the support plate 26. In this way, the anti-shake motor 22 can drive the bracket 222 to move the main circuit board 25 and the image sensor 21 in the XY plane to achieve optical image stabilization.

[0119] The connecting circuit board 27 can be fixedly connected to the base 221 of the anti-shake motor 22, and the main circuit board 25 can be electrically connected to the connecting circuit board 27. In this way, the electrical signal of the image sensor 21 can be transmitted to the outside of the photosensitive component 2 via the main circuit board 25 and the connecting circuit board 27.

[0120] The spring 28 can be used to securely connect the main circuit board 25 to the base 241. This allows the main circuit board 25, image sensor 21, and the bracket 222 and coil assembly 2232 of the anti-shake motor 22 to be suspended relative to the base 241 via the spring 28. This structure can move relative to the base 241 under the drive of the anti-shake motor 22 and return to its original position under the elastic force of the spring 28.

[0121] The reinforcing piece 29 can partially reinforce the main circuit board 25 and / or the spring 28 .

[0122] The filter assembly 210 may include a filter holder 2101 and a filter 2102. The filter 2102 may be fixedly connected to the filter holder 2101. The filter assembly 210 may be fixedly connected to the main circuit board 25 and located on the photosensitive side of the image sensor 21. The filter 2102 may filter out certain wavelengths of light while allowing certain wavelengths of light to pass through, thereby reducing ghost images and stray light and providing some protection for the image sensor 21. For example, the filter 2102 may be an infrared filter 2102, which may filter out light in the infrared band while allowing light in other bands to pass through.

[0123] The Mylar sheet assembly 220 may include a plurality of Mylar sheets, and the plurality of Mylar sheets may be fixedly connected to the upper shell 242 and a portion of the circuit structure exposed relative to the upper shell 242 to achieve a protective effect.

[0124] The following text continues to describe in detail the main structure of the photosensitive component 2 in combination with other drawings.

[0125] Please refer to FIG. 6 and FIG. 7 . FIG. 7 is a schematic structural diagram of the base 241 shown in FIG. 6 .

[0126] In some embodiments, the base 241 may include a bottom plate 2411 , two fixing plates 2412 and a fixing frame 2413 .

[0127] For example, two fixing plates 2412 are disposed opposite each other and fixed to opposite sides of the base plate 2411. The two fixing plates 2412 may be arranged parallel to the X-axis. The base plate 2411 and the two fixing plates 2412 may be integrally formed components, for example, stamped from a single metal sheet.

[0128] For example, the fixing frame 2413 can be fixed to the peripheral area of ​​one side of the bottom plate 2411, and the fixing frame 2413 is raised relative to the bottom plate 2411. The fixing frame 2413 and the two fixing plates 2412 are located on the same side of the bottom plate 2411, and the two fixing plates 2412 can be located inside the fixing frame 2413.

[0129] For example, the fixing frame 2413 may have two first notches 2414 disposed opposite each other, and the arrangement direction of the two first notches 2414 may be parallel to the Y-axis direction. In this case, the fixing frame 2413 includes two frame portions disposed opposite each other and spaced apart, with the two first notches 2414 formed between the two frame portions. It will be understood that in the drawings of this application, for some structures that are present in multiple numbers, at least one of the multiple structures may be numbered, and the remaining structures may or may not be numbered.

[0130] The fixing frame 2413 and the bottom plate 2411 may be assembled into an integral structure, or may be an integrally formed structural member.

[0131] FIG8 is a schematic structural diagram of some components of the photosensitive assembly 2 shown in FIG6 .

[0132] In some embodiments, as shown in FIG8 , the reed 28 can be generally flat. Exemplarily, the reed 28 includes a fixed portion 281, a movable portion 282, and a connecting portion 283. The movable portion 282 is located inside the fixed portion 281, and the connecting portion 283 connects the fixed portion 281 and the movable portion 282. The reed 28 can be made of an elastic metal material. The movable portion 282 can move relative to the fixed portion 281 by deforming the connecting portion 283.

[0133] The fixed portion 281 may be frame-shaped, and may have two second notches 2811 opposite to each other. The arrangement direction of the two second notches 2811 may be parallel to the Y-axis direction. In this case, the fixed portion 281 includes two frame portions that are opposite to each other and spaced apart, and the two second notches 2811 are formed between the two frame portions. The movable portion 282 may be roughly rectangular, and a first through hole 2821 may be provided in the middle of the movable portion 282. Four first avoidance notches 2822 may be provided at the four corners of the movable portion 282. In some examples, the movable portion 282 may have a symmetrical structure.

[0134] The connecting portion 283 includes four spring wire groups 2831, which can be arranged spaced apart around the movable portion 282. For example, the four spring wire groups 2831 can be located outside the four corners of the movable portion 282. Each spring wire group 2831 can include at least two spring wires 2832, and the at least two spring wires 2832 can be arranged in parallel. The spring wires 2832 can include a first segment and a second segment that intersect and connect, with the first segment connecting the movable portion 282 and the second segment connecting the fixed portion 281. One of the first segment and the second segment can extend parallel to the X-axis, while the other segment can extend parallel to the Y-axis. In this case, the first segment and the second segment can generally form an L-shaped structure. In other embodiments, the spring wire group 2831 can also include a single spring wire 2832. In some examples, the four spring wire groups 2831 can be symmetrical.

[0135] The spring wire assembly 2831 may further include a first connecting block 2833 and a second connecting block 2834. The first connecting block 2833 is connected to the movable portion 282, and the second connecting block 2834 is connected to the fixed portion 281. The first segment of the spring wire 2832 may be connected to the first connecting block 2833, and the second segment of the spring wire 2832 may be connected to the second connecting block 2834. By providing the first connecting block 2833 and the second connecting block 2834, the first and second segments of the spring wire 2832 can be configured as straight segments, extending parallel to the X-axis and Y-axis directions, respectively.

[0136] In some embodiments, as shown in FIG8 , the support plate 26 includes a first plate 261 and a second plate 262. The second plate 262 is protruding from a side surface of the first plate 261. The first plate 261 can be substantially rectangular. The area of ​​the second plate 262 is smaller than that of the first plate 261. The second plate 262 can be substantially rectangular. For example, the shape of the second plate 262 can be the same as that of the image sensor 21. The support plate 26 is a rigid structural member.

[0137] In some embodiments, as shown in FIG8 , the reinforcing member 29 includes a reinforcing frame 291 and two reinforcing plates 292 . The two reinforcing plates 292 are arranged opposite each other and connected to opposite sides of the reinforcing frame 291 . The four corners of the reinforcing frame 291 may be provided with four second avoidance notches 2911 . The two reinforcing plates 292 may be arranged parallel to the Y-axis. The reinforcing member 29 may be an integrally formed structural member, for example, formed by stamping a single metal plate. The metal plate may be, for example, a steel plate.

[0138] Please refer to Figures 7 to 10 in combination. Figure 9 is a schematic diagram of the assembly structure of the components shown in Figure 8, and Figure 10 is a schematic diagram of the cross-sectional structure of the structure shown in Figure 9 taken along line BB.

[0139] In some embodiments, the fixed portion 281 of the reed 28 is fixedly connected to the base 241, for example, it can be fixed to the fixed frame 2413 of the base 241. At this time, the movable portion 282 and the connecting portion 283 of the reed 28 are located above the bottom plate 2411 of the base 241 and are spaced apart from the bottom plate 2411. When the movable portion 282 of the reed 28 moves relative to the fixed portion 281 under the action of an external force, it moves relative to the base 241. Among them, the two second notches 2811 of the fixed portion 281 and the two first notches 2414 of the fixed frame 2413 are arranged in a one-to-one correspondence and are connected to each other. The correspondingly arranged first notches 2414 and second notches 2811 together form an activity space 230. The arrangement direction of the two activity spaces 230 is parallel to the Y-axis direction.

[0140] The two fixed plates 2412 of the base 241 can be located between the fixed portion 281 and the movable portion 282 of the spring 28, and each fixed plate 2412 is located between two adjacent spring wire groups 2831. In this case, the fixed plates 2412 of the base 241 and the spring wire groups 2831 of the spring 28 can reuse space in the X-axis direction and / or the Y-axis direction, resulting in a compact structure and facilitating the miniaturization of the photosensitive component 2 and the camera module 30. The arrangement direction of the two fixed plates 2412 is parallel to the X-axis direction.

[0141] Exemplarily, the image sensor 21 can be fixed to the support plate 26. For example, the image sensor 21 is fixed to the surface of the second plate 262 facing away from the first plate 261. Exemplarily, the support plate 26 is fixed to the side of the movable portion 282 of the reed 28 facing the bottom plate 2411 of the base 241. For example, the support plate 26 is located between the base 241 and the reed 28, and the second plate 262 is fixed to a side surface of the movable portion 282 of the reed 28. In this case, the first plate 261 is at least partially located in the first through hole 2821 of the movable portion 282. The image sensor 21 can be at least partially located in the first through hole 2821, or the image sensor 21 can protrude from the other side surface of the movable portion 282 through the first through hole 2821.

[0142] In this embodiment, the image sensor 21 is indirectly fixed to the movable portion 282 of the connecting spring 28 via the support plate 26 . When the movable portion 282 of the connecting spring 28 is forced to move relative to the base 241 , the image sensor 21 is driven to move synchronously.

[0143] Illustratively, the four spring wire groups 2831 of the spring plate 28 are symmetrical about the first plane 2A and about the second plane 2B, with the first plane 2A and the second plane 2B intersecting. The first plane 2A may be parallel to the XZ plane, and the second plane 2B may be parallel to the YZ plane. The intersection of the first plane 2A and the second plane 2B coincides with the photosensitive center 212 of the image sensor 21.

[0144] In this embodiment, the spring 28 primarily achieves relative movement between the movable portion 282 and the fixed portion 281 through the deformation of the four spring wire groups 2831. During the movement of the image sensor 21 and the movable portion 282, the spring wire groups 2831 deform, generating elastic forces that act on the movable portion 282. Because the four spring wire groups 2831 are symmetrical about the first plane 2A and the second plane 2B, and the intersection of the first plane 2A and the second plane 2B coincides with the photosensitive center 212 of the image sensor 21, the forces applied by the four spring wire groups 2831 to the movable portion 282 are highly stable, resulting in balanced forces on the movable portion 282 in the X- and Y-axis directions. This helps reduce crosstalk during the movement of the image sensor 21, improves optical image stability, and thereby enhances the image quality of the photosensitive assembly 2 and the camera module 30.

[0145] In some embodiments, the reinforcing member 29 is fixedly connected to the movable portion 282 of the spring 28. The reinforcing frame 291 of the reinforcing member 29 can be fixed to the side of the movable portion 282 facing the bottom plate 2411 of the base 241. The reinforcing frame 291 can be arranged around the support plate 26. In this case, the reinforcing frame 291 can increase the structural strength of the movable portion 282 of the spring 28, thereby reducing the risk of deformation of the movable portion 282 when subjected to force. The four second avoidance notches 2911 correspond to and are connected to the four first avoidance notches 2822.

[0146] The two reinforcing plates 292 of the reinforcing member 29 may protrude relative to the movable portion 282 toward a side away from the base 241. The two reinforcing plates 292 are respectively provided corresponding to the two movable spaces 230. At this time, the arrangement direction of the two reinforcing plates 292 is parallel to the Y-axis direction.

[0147] Please refer to FIG. 11 and FIG. 12 . FIG. 11 is a schematic structural diagram of the main circuit board 25 shown in FIG. 6 , and FIG. 12 is a schematic structural diagram of a portion of the main circuit board 25 shown in FIG. 11 .

[0148] In some embodiments, the main circuit board 25 includes a hard board portion 251 and four soft board portions 252. The main circuit board 25 can be a rigid-flex printed circuit board (RFPCB). Among them, the hard board portion 251 can adopt a rigid printed circuit board structure, and the soft board portion 252 can adopt a flexible printed circuit board structure. The flexible printed circuit board is a circuit board made of polyimide or polyamide film as a base material, and has the excellent property of being able to bend and fold freely. In the embodiment of the present application, the flexible and hard printed circuit board can combine the flexible printed circuit board and the rigid printed circuit board through processes such as pressing to form a circuit board that has the characteristics of a flexible printed circuit board and the characteristics of a rigid printed circuit board at the same time, which has the advantages of reducing the overall assembly size, avoiding wiring errors, improving reliability, and realizing three-dimensional assembly under different assembly conditions.

[0149] Among them, the hard board portion 251 can be roughly rectangular. The middle part of the hard board portion 251 can have a second through hole 2511, and the four corners of the hard board portion 251 can have four third avoidance gaps 2512. Exemplarily, the photosensitive component 2 can also include a driving chip 2401, and the driving chip 2401 can be fixed to the hard board portion 251 and electrically connected to the hard board portion 251. Among them, the photosensitive component 2 can also include other electronic components 2402, such as matching elements of the image sensor 21, and the electronic components can be fixed to the hard board portion 251 and electrically connected to the hard board portion 251. The photosensitive component 2 can also include a position detection sensor (not shown in the figure), such as a Hall sensor or a tunnel magneto-resistance (TMR) sensor, etc., and the position detection sensor is fixed to the hard board portion 251 and electrically connected to the hard board portion 251.

[0150] For example, the four flexible board portions 252 can have a symmetrical structure. Each flexible board portion 252 includes a first end 2521, a connecting section 2522, and a second end 2523, which are sequentially connected. The first end 2521 of the flexible board portion 252 is connected to the side of the hard board portion 251. The connecting section 2522 is bent relative to the first end 2521 and arranged around the side of the hard board portion 251. The second end 2523 is bent relative to the connecting section 2522. The second end 2523 can face the hard board portion 251 and be spaced apart from the hard board portion 251.

[0151] The first ends 2521 of two of the four soft board portions 252 can be connected to the first side 251a of the hard board portion 251, and the first ends 2521 of the other two soft board portions 252 can be connected to the third side 251c of the hard board portion 251. The third side 251c is disposed opposite the first side 251a, and the arrangement direction of the third side 251c and the first side 251a is parallel to the Y-axis. The second ends 2523 of two of the four soft board portions 252 can be disposed corresponding to the second side 251b of the hard board portion 251, and the second ends 2523 of the other two soft board portions 252 can be disposed corresponding to the fourth side 251d of the hard board portion 251. The fourth side 251d is disposed opposite the second side 251b, and the arrangement direction of the fourth side 251d and the second side 251b is parallel to the X-axis.

[0152] For example, a portion of the connecting section 2522 of the soft board portion 252 extends along a first direction, and another portion of the connecting section 2522 extends along a second direction, where the second direction intersects the first direction. In this case, the connecting section 2522 can be generally L-shaped, extending from one side of the hard board portion 251 to the other side of the hard board portion 251, thereby fully utilizing the space around the hard board portion 251 for arrangement. For example, the connecting section 2522 of the soft board portion 252 may include a first section 25221 and a second section 25222, one end of the first section 25221 is connected to the first end 2521, the first section 25221 is bent relative to the first end 2521, one end of the second section 25222 is connected to the other end of the first section 25221, the other end of the second section 25222 is connected to the second end 2523, the second section 25222 is bent relative to the first section 25221 and relative to the second end 2523; one of the first section 25221 and the second section 25222 extends along the X-axis direction, and the other extends along the Y-axis direction.

[0153] In some examples, the first direction may be parallel to the Y-axis direction, and the second direction may be parallel to the X-axis direction. In this case, the main circuit board 25 is compactly arranged in the X-axis and Y-axis directions, which is conducive to the miniaturization design of the photosensitive component 2 and the camera module 30.

[0154] For example, the connecting section 2522 of the soft board portion 252 can be perpendicular to the hard board portion 251. In this case, on a plane parallel to the hard board portion 251, such as on the XY plane, the connecting section 2522 occupies less space, which is conducive to the miniaturization design of the photosensitive component 2 and the camera module 30.

[0155] Illustratively, each connecting segment 2522 of the flexible board portion 252 includes a first portion 2522a connected to the first end 2521 and a second portion 2522b connected to the second end 2523. In some examples, the extension path of the flexible board portion 252 is illustrated using the flexible board portion 252 located in the upper left corner of FIG. For example, the extension path of the flexible board portion 252 from the first end 2521 to the second end 2523 is as follows: extending along the Y-axis direction on the XY plane, extending along the Z-axis direction on the XZ plane after a first bend, continuing to extend along the X-axis direction on the XZ plane after a first turn, extending along the Y-axis direction on the YZ plane after a second bend, continuing to extend along the Z-axis direction on the YZ plane after a second turn, and extending along the X-axis direction on the XY plane after a third turn.

[0156] Please refer to Figures 11 to 14. Figure 13 is a schematic structural diagram of the structure shown in Figure 9 after being assembled with the main circuit board 25 shown in Figure 11. Figure 14 is a schematic cross-sectional structural diagram of the structure shown in Figure 13 taken along CC.

[0157] In some embodiments, the rigid board portion 251 of the main circuit board 25 is fixed to the side of the movable portion 282 of the spring 28 facing away from the base 241. The second ends 2523 of the four flexible board portions 252 of the main circuit board 25 are located on the side of the rigid board portion 251 facing away from the base 241. The second ends 2523 of the flexible board portions 252 are used to securely connect to other structural components (the specific structure of which will be described later) to achieve relative fixation with the base 241.

[0158] In this embodiment, the rigid portion 251 of the main circuit board 25 is fixedly connected to the movable portion 282 of the reed 28, allowing the rigid portion 251 of the main circuit board 25, the movable portion 282 of the reed 28, and the image sensor 21 to maintain synchronization during movement. During movement of the image sensor 21 and the rigid portion 251, the first end 2521 of the flexible portion 252 moves with the rigid portion 251, while the second end 2523 of the flexible portion 252 remains fixed, causing the connecting section 2522 of the flexible portion 252 to deform.

[0159] Illustratively, the connecting sections 2522 of the four soft board sections 252 are symmetrical about the first plane 2A and about the second plane 2B. For example, the four soft board sections 252 are respectively a first soft board section, a second soft board section, a third soft board section, and a fourth soft board section. The first soft board section is symmetrical with the second soft board section about the XZ plane, the second soft board section is symmetrical with the third soft board section about the YZ plane, the third soft board section is symmetrical with the fourth soft board section about the XZ plane, and the fourth soft board section is symmetrical with the first soft board section about the YZ plane.

[0160] In this embodiment, during the movement of the image sensor 21 and the hard board portion 251, the connecting section 2522 of the soft board portion 252 is deformed and the force generated acts on the hard board portion 251. Since the connecting sections 2522 of the four soft board portions 252 are symmetrical about the first plane 2A and the second plane 2B, and the intersection line of the first plane 2A and the second plane 2B coincides with the photosensitive center 212 of the image sensor 21, the force applied by the four soft board portions 252 to the hard board portion 251 is highly stable, and the force on the hard board portion 251 in the X-axis and Y-axis directions is balanced, which helps to reduce crosstalk during the movement of the image sensor 21, helps to improve the stability of optical image imaging, and thereby improves the imaging quality of the photosensitive component 2 and the camera module 30.

[0161] It is understood that in other embodiments, during the movement of the hard board portion 251, a small portion of the deformation of the soft board portion 252 may occur at the first end 2521 and / or the second end 2523 of the soft board portion 252. In this case, the deformed portions of the four soft board portions 252 are symmetrical about the first plane 2A and the second plane 2B, thereby reducing crosstalk. In some examples, the four soft board portions 252 are symmetrical about the first plane 2A and the second plane 2B as a whole.

[0162] Exemplarily, the second through hole 2511 of the hard board portion 251 is connected to the first through hole 2821 of the movable portion 282. The image sensor 21 may be at least partially located in the first through hole 2821 of the movable portion 282 and / or the second through hole 2511 of the hard board portion 251. At this time, the image sensor 21 and the hard board portion 251 of the main circuit board 25 and / or the movable portion 282 of the reed 28 can reuse the Z-axis direction space, which is beneficial to reduce the Z-axis direction height of the photosensitive component 2 and the camera module 30. Among them, the image sensor 21 can be electrically connected to the hard board portion 251 of the main circuit board 25 by means of a wire or bonding to realize the transmission of electrical signals between the image sensor 21 and the hard board portion 251.

[0163] Illustratively, the two reinforcing plates 292 of the reinforcing member 29 can be fixed to opposite sides of the movable portion 282 via a reinforcing frame 291, with the two reinforcing plates 292 disposed opposite each other. The first portions 2522a of the connecting segments 2522 of two of the four flexible board portions 252 can be fixed to one of the reinforcing plates 292, while the first portions 2522a of the connecting segments 2522 of the other two flexible board portions 252 can be fixed to another of the reinforcing plates 292.

[0164] In this embodiment, since the two reinforcing plates 292 are fixed relative to the movable part 282, and the first parts 2522a of the connecting sections 2522 of the four soft board parts 252 are fixed to the two reinforcing plates 292, the first ends 2521 of the soft board parts 252 and the first parts 2522a of the connecting sections 2522 can move synchronously with the hard board part 251 without deformation. This can reduce the risk of damage to the first ends 2521 of the soft board parts 252 and the first parts 2522a of the connecting sections 2522 during the movement of the image sensor 21 and the hard board part 251, and can also reduce the interference of the soft board part 252 on the movement of the image sensor 21, thereby further reducing crosstalk and improving the stability of optical image imaging.

[0165] Exemplarily, the second parts 2522b of the connecting sections 2522 of two of the four soft board parts 252 can be fixed to one of the fixed plates 2412 of the base 241, and the second parts 2522b of the connecting sections 2522 of the other two soft board parts 252 can be fixed to another fixed plate 2412 of the base 241.

[0166] In this embodiment, since the second part 2522b of the connecting section 2522 of the four soft board parts 252 is fixed to the base 241, the second end 2523 of the soft board part 252 and the second part 2522b of the connecting section 2522 are both fixed structures, which can prevent deformation during the movement of the image sensor 21 and the hard board part 251, thereby reducing the risk of damage to the second end 2523 of the soft board part 252 and the second part 2522b of the connecting section 2522, and can also reduce the movement interference of the soft board part 252 on the image sensor 21, thereby further reducing crosstalk and improving the stability of optical image imaging.

[0167] It is understood that when the first portion 2522a of the connecting section 2522 of the four soft board portions 252 is fixed relative to the hard board portion 251, and the second portion 2522b of the connecting section 2522 is fixed relative to the base 241, during the movement of the image sensor 21 and the hard board portion 251, the deformation of the soft board portion 252 can be controlled within the connecting section 2522, thereby improving the accuracy of motion control. In addition, in the scheme where the connecting section 2522 is perpendicular to the hard board portion 251, when the hard board portion 251 moves in the XY plane, the deformation direction of the connecting section 2522 (e.g., the X-axis direction and / or the Y-axis direction) is mainly perpendicular to its board surface. Therefore, the deformation of the connecting section 2522 is easy to achieve, and the risk of damage to the connecting section 2522 is low, thereby ensuring the structural reliability of the soft board portion 252 and the reliability of electrical signal transmission.

[0168] Please refer to Figures 15 and 16 in combination. Figure 15 is a structural diagram of another part of the photosensitive component 2 shown in Figure 6, and Figure 16 is a schematic diagram of the assembly structure of the parts shown in Figure 15.

[0169] In some embodiments, as shown in FIG15 , the bracket 222 is substantially rectangular in shape. The bracket 222 has a third through hole 2221 , and four sides 2222 of the bracket 222 surround the third through hole 2221 . Four fourth avoidance notches 2223 may be provided at the four corners of the bracket 222 .

[0170] Exemplarily, the number of magnetic members 231 may be four, and the four magnetic members 231 may be fixed to the four sides 2222 of the bracket 222, respectively. For example, the magnetic member 231 may be embedded in the side 2222 of the bracket 222 or fixed to the surface of the side 2222 of the bracket 222. The four magnetic members 231 and the bracket 222 may be integrally formed structural members, such as those made by insert-molding or the like; or, the four magnetic members 231 and the bracket 222 may also be assembled together by bonding, snapping, or the like. The four magnetic members 231 may be symmetrical structures. The magnetic member 231 may be made of a material that can generate magnetic attraction with a magnet or other magnetic components, such as a ferromagnetic material. The ferromagnetic material may be, for example, a generally used cold-rolled carbon steel sheet and steel strip (SPCC).

[0171] For example, the coil assembly 2232 may include four coils 2232a, each of which is fixed to the four edges 2222 of the bracket 222. For example, the four coils 2232a may be fixed to the sides of the four magnetic members 231 facing away from the bracket 222. In this case, the coils 2232a are fixed to the bracket 222 via the magnetic members 231. The four coils 2232a may have a symmetrical structure.

[0172] For example, the bracket 222 may include four first protrusions 2224, each of which is disposed adjacent to the four fourth avoidance notches 2223. For example, two of the first protrusions 2224 may be located at both ends of one side of the bracket 222, and the other two first protrusions 2224 may be located at both ends of another side of the bracket 222, with the two sides of the bracket 222 being disposed opposite each other.

[0173] The first protrusion 2224 is provided with a groove 2225. In some examples, there may be four balls 232, which are mounted in a one-to-one correspondence within the grooves 2225 of the four first protrusions 2224. The grooves 2225 of the four first protrusions 2224 may be symmetrical, and the four balls 232 may be symmetrical. In other examples, the number of balls 232 may be greater, with the multiple balls 232 divided into four groups, each of which is mounted in the grooves 2225 of the four first protrusions 2224. Each group of balls 232 may include at least two balls 232. The four groups of balls 232 may be symmetrical.

[0174] Please refer to Figures 16 to 18. Figure 17 is a schematic diagram of the assembly structure of the structure shown in Figure 13, the structure shown in Figure 16 and the filter assembly 210 shown in Figure 6. Figure 18 is a schematic diagram of the cross-sectional structure of the structure shown in Figure 17 along the cross-section at DD.

[0175] In some embodiments, the bracket 222 is fixed to the side of the rigid plate portion 251 facing away from the base 241. In this case, the coil assembly 2232 is fixed to the side of the bracket 222 facing away from the rigid plate portion 251. The coil assembly 2232 is indirectly fixed to the side of the rigid plate portion 251 facing away from the base 241 via the bracket 222. The fourth relief notch 2223 of the bracket 222, the third relief notch 2512 of the rigid plate portion 251 of the main circuit board 25, the first relief notch 2822 of the reed 28, and the second relief notch 2911 of the reinforcing member 29 are connected to form a relief space 260.

[0176] Illustratively, the plurality of coils 2232a of the coil assembly 2232 are symmetrical with respect to the first plane 2A and symmetrical with respect to the second plane 2B.

[0177] Exemplarily, the plurality of magnetic members 231 and the plurality of balls 232 are symmetrical with respect to the first plane 2A and symmetrical with respect to the second plane 2B.

[0178] In some embodiments, the filter holder 2101 of the filter assembly 210 is fixed to the side of the hard plate portion 251 facing away from the base 241, and the filter 2102 is fixed to the filter holder 2101 and arranged directly opposite the image sensor 21. The filter assembly 210 is located in the third through hole 2221 of the holder 222. The filter assembly 210 and the holder 222 can reuse the space in the Z-axis direction, thereby facilitating a reduction in the Z-axis height of the photosensitive component 2 and the camera module 30.

[0179] Among them, a gap is formed between the filter bracket 2101 and the bracket 222, and the driving chip 2401 fixed to the hard board part 251 and at least part of the electronic components 2402 can be arranged in the gap to reuse the Z-axis direction space, which is beneficial to reducing the Z-axis direction height of the photosensitive component 2 and the camera module 30.

[0180] Please refer to FIG. 19 , which is a schematic structural diagram of the base 221 shown in FIG. 6 at another angle.

[0181] In some embodiments, the base 221 includes a main body 2211 and a plurality of legs 2212 fixed to the main body 2211. The main body 2211 may be substantially rectangular, and the number of the legs 2212 may be four, and the four legs 2212 are respectively fixed to the four corners of the main body 2211.

[0182] Illustratively, the base 221 may be provided with four mounting slots 2213 , which are respectively located at four sides 2214 of the main body 2211 , and the openings of the mounting slots 2213 are located at one side of the main body 2211 where the plurality of legs 2212 are connected.

[0183] For example, the base 221 may further include four movable slots 2215 located in the main body 2211 and adjacent to the four legs 2212. For example, two of the movable slots 2215 may be located at either end of one side 2214 of the main body 2211, and the other two movable slots 2215 may be located at either end of another side 2214 of the main body 2211, with the two sides 2214 of the main body 2211 being disposed opposite each other. The opening of the movable slot 2215 is located on the side of the main body 2211 that connects to the multiple legs 2212.

[0184] Please refer to FIG. 19 and FIG. 20 . FIG. 20 is a schematic diagram of a partial structure of the base 221 shown in FIG. 19 .

[0185] In some embodiments, the base 221 may include a base body 221a and a reinforcement 221b . The material strength of the reinforcement 221b is higher than that of the base body 221a . The reinforcement 221b is embedded in the base body 221a to increase the structural strength of the base 221 .

[0186] For example, the reinforcement 221b can be roughly frame-shaped. The main body 2211 of the base 221 is formed by a portion of the base body 221a and the reinforcement 221b, and the multiple legs 2212 are formed by another portion of the base body 221a. The reinforcement 221b can be an integrally formed structural member, for example, stamped from a single metal sheet.

[0187] For example, the reinforcement 221b can be made of a magnetic conductive material. The four sides of the reinforcement 221b are located on the four sides 2214 of the main body 2211. The four sides of the reinforcement 221b can be reused as four magnetic conductive members 2216. The four magnetic conductive members 2216 are arranged in a one-to-one correspondence with the four mounting slots 2213. The magnetic conductive members 2216 can partially surround the mounting slots 2213 or be located on one side of the mounting slots 2213. The magnetic conductive material can be, for example, silicon steel sheets or alloys formed by various iron products and rare earth elements.

[0188] Please refer to FIG. 19 and FIG. 21 . FIG. 21 is a schematic diagram of the assembly structure of the base 221 and the magnet group 2231 shown in FIG. 6 .

[0189] In some embodiments, the magnet group 2231 may include multiple magnets 2231a, for example, four magnets 2231a, which are mounted one-to-one in the four mounting slots 2213 of the base 221. In this case, the magnet group 2231 is fixed to the main body 2211 of the base 221. A single magnet 2231a may include one or more magnets, and the embodiments of the present application do not strictly limit the specific structure of the magnet 2231a.

[0190] Please refer to Figures 21 to 24. Figure 22 is a schematic diagram of the assembly structure of the structure shown in Figure 17 and the structure shown in Figure 21. Figure 23 is a schematic diagram of the cross-sectional structure of the structure shown in Figure 22 taken along EE. Figure 24 is a schematic diagram of the cross-sectional structure of the structure shown in Figure 22 taken along FF.

[0191] In some embodiments, the base 221 is fixed to the base 241. For example, the main body 2211 of the base 221 is located on the side of the hard plate portion 251 facing away from the base 241, and the plurality of legs 2212 are fixedly connected to the base 241. For example, the plurality of legs 2212 can extend through the avoidance space 260 to abut the bottom plate 2411 of the base 241.

[0192] Exemplarily, the coil group 2232 is arranged relative to the magnet group 2231. Specifically, the four magnets 2231a of the magnet group 2231 are arranged relative to the four coils 2232a of the coil group 2232 in a one-to-one correspondence. In this embodiment, the drive assembly 223, which includes the coil group 2232 and the magnet group 2231, is used to drive the bracket 222 and the base 221 to move relative to each other. Since the hard plate portion 251 is fixed to the bracket 222 and the image sensor 21 is fixed to the hard plate portion 251, the drive assembly 223 can drive the hard plate portion 251 and the image sensor 21 to move relative to the base 221, for example, relative to the base 221 in a plane perpendicular to the photosensitive center 212 of the image sensor 21, thereby achieving optical image stabilization through the movement of the image sensor 21.

[0193] For example, as shown in FIG24 , the magnets 2231a and coils 2232a arranged relative to each other form a group of drive units, and the drive assembly 223 includes four groups of drive units. The magnets 2231a and coils 2232a of each group of drive units are arranged in the Z-axis direction. When energized, the coils 2232a of the two groups of drive units arranged in the X-axis direction can generate an X-axis force in the magnetic field of the magnets 2231a. When energized, the coils 2232a of the two groups of drive units arranged in the Y-axis direction can generate a Y-axis force in the magnetic field of the magnets 2231a. Through the coordinated operation of the four groups of drive units, the drive assembly 223 can drive the bracket 222, the hard plate portion 251, and the image sensor 21 to move in the XY plane, thereby driving the image sensor 21 to move in a plane parallel to its photosensitive surface 211 to achieve optical image stabilization.

[0194] In addition, since the magnet 2231a and coil 2232a in the driving unit are arranged in the Z-axis direction, the coil 2232a and the bracket 222 move in the XY plane. Therefore, during the movement of the bracket 222 and the image sensor 21, the magnetic gap between the magnet 2231a and the coil 2232a is not affected by the movement of the bracket 222. Therefore, the problem of a rapid decrease in driving force due to an increase in the magnetic gap can be avoided, thereby ensuring that the anti-shake driving force of the driving component 223 is large and the driving force is relatively stable, which is conducive to the large-stroke design of the optical anti-shake function of the anti-shake motor 22, realizing large-angle anti-shake, so as to obtain a better shooting experience.

[0195] In some embodiments, referring to Figures 21 to 24 , the four magnets 2231a of the magnet assembly 2231 are symmetrical about the first plane 2A and the second plane 2B. Also referring to Figure 17 , the four coils 2232a of the coil assembly 2232 are symmetrical about the first plane 2A and the second plane 2B. In this case, the four drive units of the drive assembly 223 are symmetrical about the first plane 2A and the second plane 2B, and the intersection of the first plane 2A and the second plane 2B coincides with the photosensitive center 212 of the image sensor 21. Therefore, the driving force applied by the four drive units to the bracket 222 is highly stable. During the movement of the bracket 222, the hard plate portion 251, and the image sensor 21, the bracket 222 is subjected to balanced forces in the X-axis and Y-axis directions, which helps reduce crosstalk during the movement of the image sensor 21, thereby improving optical image stability, enhancing the anti-shake performance of the photosensitive component 2 and the camera module 30, and improving the image quality of the photosensitive component 2 and the camera module 30.

[0196] In addition, when the driving component 223 drives the bracket 222, the hard plate part 251 and the image sensor 21 to move relative to the base 241, the movable part 282 of the reed 28 moves synchronously. When the image sensor 21 leaves the initial position and moves to the target position, the connecting part 283 of the reed 28 is deformed to generate an elastic force. When the driving component 223 stops driving, the elastic force can drive the movable part 282 to move the hard plate part 251, the bracket 222 and the image sensor 21 back to the initial position, thereby eliminating the need to drive the image sensor 21 to reset through the driving component 223, thereby reducing the power consumption of the photosensitive component 2 and the camera module 30 during the anti-shake process.

[0197] Exemplarily, the magnetic conductive part 2216 is mainly located on the side of the magnet 2231a facing away from the coil 2232a. The magnetic conductive part 2216 is used to constrain and guide the magnetic field of the magnet 2231a, so that the magnet 2231a can provide a more ideal magnetic field for the coil 2232a, thereby improving the driving efficiency of the driving component 223 and reducing the driving power consumption.

[0198] In some embodiments, referring to Figures 23 and 24 , a plurality of magnetic elements 231 are disposed in a one-to-one correspondence with a plurality of magnets 2231a of a magnet assembly 2231. For example, four magnetic elements 231 are disposed in a one-to-one correspondence with four magnets 2231a. A plurality of balls 232 are supported between the bracket 222 and the main body 2211 of the base 221. For example, the four balls 232 are partially located in the groove 2225 of the bracket 222 and partially located in the four movable slots 2215 of the base 221.

[0199] In this embodiment, a magnetic attraction force is formed between the magnetic element 231 and the magnet 2231a, so that the bracket 222 tends to approach the main body 2211 of the base 221, and the bracket 222, the ball 232 and the main body 2211 of the base 221 maintain contact. During the anti-shake process of the image sensor 21, the bracket 222 achieves relative movement with the base 221 through the sliding and / or rolling of the ball 232. The friction force during the movement is small, which can reduce the driving power consumption and improve the stability of the anti-shake system.

[0200] In addition, since the multiple magnets 2231a, the multiple magnetic members 231 and the multiple balls 232 are symmetrical about the first plane 2A and the second plane 2B, the intersection line of the first plane 2A and the second plane 2B coincides with the photosensitive center 212 of the image sensor 21. Therefore, during the movement of the bracket 222, the hard plate portion 251 and the image sensor 21, the friction force exerted on the bracket 222 in the X-axis direction and the Y-axis direction is balanced, which helps to reduce the crosstalk during the movement of the image sensor 21, thereby improving the optical image imaging stability, making the anti-shake performance of the photosensitive component 2 and the camera module 30 better, and improving the imaging quality of the photosensitive component 2 and the camera module 30.

[0201] In some embodiments, during the movement of the image sensor 21, the load of the anti-shake motor 22 includes the bracket 222, the coil group 2232, multiple magnetic parts 231, the hard board part 251 and the device fixed to the hard board part 251, the filter assembly 210, the movable part 282 of the reed 28, the image sensor 21, the support plate 26, the reinforcement part 29, etc. The center of gravity of the load can be designed to coincide with the photosensitive center 212 of the image sensor 21. For example, the relevant structural parts can be symmetrical about the first plane 2A and symmetrical about the second plane 2B to further reduce crosstalk and improve the anti-shake performance of the photosensitive component 2 and the camera module 30.

[0202] Please refer to Figures 6, 25 and 26 in combination. Figure 25 is a schematic diagram of the assembly structure of the connection circuit board 27 shown in Figure 6 and the structure shown in Figure 22, and Figure 26 is a schematic diagram of the cross-sectional structure of the structure shown in Figure 25 taken along GG.

[0203] In some embodiments, the connecting circuit board 27 includes a main board portion 271 and an extension portion 272. The main board portion 271 can be generally frame-shaped, and the extension portion 272 is connected to the side of the main board portion 271. The connecting circuit board 27 can be a rigid-flex printed circuit board (RFPCB). For example, the main board portion 271 can be a rigid board structure; the extension portion 272 can include a rigid board structure and a flexible board structure. The rigid board structure can serve as a connection end for connecting to other components, and the flexible board structure connects the main board portion 271 and the rigid board structure.

[0204] Illustratively, the main board portion 271 is fixed to a side of the base 221 facing away from the pedestal 241, and the second ends 2523 of the four flexible board portions 252 are fixedly connected to the main board portion 271 and electrically connected to the main board portion 271. For example, the second ends 2523 of the flexible board portions 252 can be fixedly connected to a surface of the main board portion 271 facing away from the base 221. The second ends 2523 of the flexible board portions 252 and the main board portion 271 can be welded to achieve structural and electrical connection.

[0205] It is understandable that in some schemes, the circuit structure of the photosensitive component includes an inner circuit board and an outer circuit board arranged in the same plane, the image sensor is fixed to the inner circuit board, the outer circuit board is arranged around the inner circuit board, and the outer circuit board and the inner circuit board are connected by four elastic arm groups, each elastic arm group includes at least three elastic arms arranged at intervals, and the elastic arms are slender strips. The elastic arms must meet the requirements of frequent elastic deformation and the reliability of electrical connections. Therefore, the overall circuit structure of the elastic arm group and the photosensitive component usually requires the use of a specific processing technology, which is difficult to process, resulting in a low product yield of the circuit structure of the photosensitive component. In addition, the distance between the multiple elastic arms in the elastic arm group is small, and they are prone to collision with each other during the anti-shake process of the image sensor, resulting in crosstalk or structural damage.

[0206] In the embodiment of the present application, the circuit structure of the photosensitive component 2 divides a circuit board into a main circuit board 25 and a connecting circuit board 27. The hard board portion 251 of the main circuit board 25 and the main board portion 271 of the connecting circuit board 27 are stacked in the Z-axis direction. The hard board portion 251 is electrically connected to the main board portion 271 through four soft board portions 252. The electrical signal of the image sensor 21 is transmitted to the external components through the hard board portion 251, the four soft board portions 252, the main board portion 271 and the extension portion 272. Since the hard board portion 251 and the main board portion 271 are connected through the four soft board portions 252, the soft board portion 252 adopts a flexible circuit board structure, which is simple in structure, easy to implement, and has low processing difficulty. Therefore, it is conducive to improving the product yield of the photosensitive component 2 and the camera module 30. The soft board portion 252 is also easy to deform and has high reliability.

[0207] In addition, the hard board portion 251 of the main circuit board 25, the main board portion 271 of the connecting circuit board 27, and the second end 2523 of the soft board portion 252 of the main circuit board 25 are stacked in the Z-axis direction, and the connecting sections 2522 of the four soft board portions 252 of the main circuit board 25 are arranged on the surrounding sides of the hard board portion 251, the anti-shake motor 22 and the main board portion 271 of the connecting circuit board 27. This arrangement is conducive to reducing the size of the electrical connection structure and the photosensitive component 2 in the XY plane. The soft board portion 252 can also reuse the space in the Z-axis direction with other components, so that the size of the electrical connection structure and the photosensitive component 2 in the Z-axis direction is also smaller, which is conducive to the miniaturization of the photosensitive component 2 and the camera module 30.

[0208] Please refer to FIG. 27 , which is a schematic structural diagram of the upper shell 242 shown in FIG. 6 .

[0209] In some embodiments, the upper shell 242 may include a top plate 2421 and side plates 2422, with one end of the side plates 2422 fixed to the periphery of the top plate 2421. The upper shell 242 may be an integrally formed structural member, or the top plate 2421 and the side plates 2422 may be assembled to form an integral structure.

[0210] For example, the top plate 2421 may include a central region 2421a and a peripheral region 2421b surrounding the central region 2421a, with the periphery of the top plate 2421 located at an edge of the peripheral region 2421b away from the central region 2421a. The central region 2421a of the top plate 2421 may be recessed relative to the peripheral region 2421b of the top plate 2421.

[0211] Illustratively, the top plate 2421 may be provided with a fourth through hole 2423 , and the fourth through hole 2423 may be located in the middle region 2421 a of the top plate 2421 .

[0212] For example, the top plate 2421 may further include a first window 2424. There may be two first windows 2424, which are disposed opposite each other and located on either side of the fourth through hole 2423. The first window 2424 may extend from the peripheral region 2421b of the top plate 2421 to the central region 2421a of the top plate 2421.

[0213] For example, the top plate 2421 may further include a second window 2425 , wherein the second window 2425 may be located in the middle region 2421 a of the top plate 2421 , and the second window 2425 is located between the two first windows 2424 and on one side of the fourth through hole 2423 .

[0214] Please refer to Figure 28A and Figure 28B in combination. Figure 28A is a schematic diagram of the assembly structure of the upper shell 242 shown in Figure 27 and the structure shown in Figure 22, and Figure 28B is a schematic diagram of the cross-sectional structure of the structure shown in Figure 28A taken along HH.

[0215] In some embodiments, the upper shell 242 is fixedly connected to the base 241. Exemplarily, the top plate 2421 of the upper shell 242 is located on the side of the connection circuit board 27 facing away from the base 241, and the other end of the side plate 2422 of the upper shell 242 is fixed to the base 221. The central region 2421a of the top plate 2421 is recessed relative to the peripheral region 2421b of the top plate 2421 toward the base 221, forming a recessed space on the side of the top plate 2421 facing away from the base 241. In some examples, the central region 2421a of the top plate 2421 may contact the connection circuit board 27, or a small gap may be formed between the central region 2421a and the connection circuit board 27.

[0216] For example, the second end 2523 of the flexible board portion 252 can be at least partially located in the first window 2424. In this case, the second end 2523 of the flexible board portion 252 can reuse the space in the Z-axis direction with the top plate 2421, thereby facilitating the miniaturization of the photosensitive component 2 and the camera module 30. Specifically, the second ends 2523 of two of the four flexible board portions 252 are disposed corresponding to one of the first windows 2424, and the second ends 2523 of the other two flexible board portions 252 are disposed corresponding to another of the first windows 2424.

[0217] The extension portion 272 of the connection circuit board 27 can extend out of the upper shell 242 through one of the first windows 2424 to facilitate connection with other components.

[0218] Exemplarily, the connecting circuit board 27 includes a connecting pad 273, which is exposed at the second opening 2425. The connecting pad 273 can be used to connect other components. Referring again to FIG. 4 , the focus motor 3 can be provided with an exposed pad 31, and the pad 31 of the focus motor 3 can be fixedly connected and electrically connected to the connecting pad 273 of the connecting circuit board 27. At this time, the focus motor 3 is electrically connected to the connecting circuit board 27 of the photosensitive component 2. In this embodiment, multiple components of the camera module 30 can be electrically connected to external components through the connecting circuit board 27, and the electrical connection structure has a high degree of integration.

[0219] Referring again to Figures 5 and 28A , when the focus motor 3 is mounted on the light-incoming side of the photosensitive component 2, the focus motor 3 can be fixedly connected to the top plate 2421, for example, to the central region 2421a of the top plate 2421. In this embodiment, because the central region 2421a of the top plate 2421 is recessed relative to the peripheral region 2421b of the top plate 2421, the focus motor 3 is sunken relative to the peripheral region 2421b of the top plate 2421. This makes the assembly of the focus motor 3 and the photosensitive component 2 more compact, facilitating a reduction in the Z-axis dimension of the camera module 30, thereby achieving a high degree of miniaturization. Furthermore, because the head portion of the camera module 30 is comprised of the focus motor 3 and the lens 1, the structure is simple and compact, thereby also facilitating a reduction in the X-axis and / or Y-axis dimensions of the head portion of the camera module 30, thereby achieving miniaturization.

[0220] Please refer to FIG. 29 , which is a schematic structural diagram of the Mylar sheet assembly 220 shown in FIG. 6 .

[0221] In some embodiments, the Mylar sheet assembly 220 may include a first Mylar sheet 2201 and a second Mylar sheet 2202 .

[0222] For example, the first mylar sheet 2201 may include a first section 2201a, a second section 2201b, a third section 2201c, a fourth section 2201d, and a fifth section 2201e. The first section 2201a, the second section 2201b, and the third section 2201c are sequentially connected, with the first section 2201a and the third section 2201c facing each other and spaced apart. The second section 2201b is located between the first section 2201a and the third section 2201c. The fourth section 2201d and the fifth section 2201e are respectively connected to opposite sides of the third section 2201c. The first mylar sheet 2201 may be an integrally formed structural member.

[0223] For example, the second Mylar sheet 2202 may include a first section 2202a, a second section 2202b, a third section 2202c, a fourth section 2202d, a fifth section 2202e, and a sixth section 2202f. The first section 2202a, the second section 2202b, and the third section 2202c are sequentially connected, with the first section 2202a and the third section 2202c facing each other and spaced apart. The second section 2202b is located between the first section 2202a and the third section 2202c. The fourth section 2202d and the fifth section 2202e are respectively connected to opposite sides of the third section 2202c. The sixth section 2202f and the fourth section 2202d are located on the same side of the third section 2202c and connected to the third section 2202c. The second Mylar sheet 2202 may be an integrally formed structural member.

[0224] Please refer to Figures 30 and 31 in combination. Figure 30 is a structural schematic diagram of the photosensitive component 2 shown in Figure 4, and Figure 31 is a cross-sectional structural schematic diagram of the photosensitive component 2 shown in Figure 30 taken along II.

[0225] In some embodiments, the first mylar sheet 2201 can be fixedly connected to the base 241 and the upper shell 242. For example, the first section 2201a of the first mylar sheet 2201 is fixedly connected to the base 241, the second section 2201b is fixedly connected to the side panel 2422 of the upper shell 242, and the third section 2201c is fixedly connected to the top panel 2421 of the upper shell 242.

[0226] Illustratively, the first Mylar sheet 2201 may also at least partially cover the second ends 2523 of two of the flexible board portions 252 to protect them. For example, portions of the third section 2201c, fourth section 2201d, and fifth section 2201e of the first Mylar sheet 2201 may cover at least portions of the second ends 2523 of two of the flexible board portions 252. In some examples, the fourth section 2201d may also securely connect the second end 2523 of one of the flexible board portions 252 to the top plate 2421, thereby maintaining a more stable connection between the second end 2523 of that flexible board portion 252 and the connection circuit board 27. The fifth section 2201e may also securely connect the second end 2523 of the other flexible board portion 252 to the top plate 2421, thereby maintaining a more stable connection between the second end 2523 of that flexible board portion 252 and the connection circuit board 27.

[0227] In some embodiments, the second mylar sheet 2202 can be fixedly connected to the base 241 and the upper shell 242. For example, the first section 2202a of the second mylar sheet 2202 is fixedly connected to the base 241, the second section 2202b is fixedly connected to the side panel 2422 of the upper shell 242, and the third section 2202c is fixedly connected to the top panel 2421 of the upper shell 242.

[0228] Illustratively, the second Mylar sheet 2202 may also at least partially cover the second ends 2523 of the other two flexible board portions 252 to protect them. For example, portions of the third section 2202c, fourth section 2202d, and fifth section 2202e of the second Mylar sheet 2202 may cover at least portions of the second ends 2523 of the other two flexible board portions 252. In some examples, the fourth section 2202d may also securely connect the second end 2523 of one of the flexible board portions 252 to the top plate 2421, thereby maintaining a more stable connection between the second end 2523 of that flexible board portion 252 and the connection circuit board 27. The fifth section 2202e may also securely connect the second end 2523 of another flexible board portion 252 to the top plate 2421, thereby maintaining a more stable connection between the second end 2523 of that flexible board portion 252 and the connection circuit board 27.

[0229] In some examples, the sixth section 2202f of the second mylar sheet 2202 may also cover a portion of the extension portion 272 of the connection circuit board 27 to protect the extension portion 272. For example, the sixth section 2202f may securely connect the top plate 2421 and the extension portion 272 of the connection circuit board 27.

[0230] In the above-mentioned solution of the present application, the anti-shake motor 22 of the photosensitive component 2 drives the image sensor 21 to move in the XY plane, thereby achieving optical image stabilization. The electrical connection structure of the photosensitive component 2 adopts a combination of a main circuit board 25 and a connecting circuit board 27. The soft board portion 252 of the main circuit board 25 transmits the electrical signal of the image sensor 21 to the connecting circuit board 27 and then transmits it to the outside of the photosensitive component 2. The electrical connection structure realizes electrical signal transmission and bears the deformation requirements through the soft board portion 252. Therefore, the electrical connection structure is easy to implement and has low processing difficulty.

[0231] During the anti-shake process of the image sensor 21, crosstalk problems are easily generated. Crosstalk in the embodiment of the present application refers to the fact that when the image sensor 21 is driven to move in any direction, the image sensor 21 will generate additional displacement in other directions. The crosstalk problem will reduce the accuracy of the anti-shake drive control. In addition, when the image sensor 21 is driven to translate in the X-axis direction and / or the Y-axis direction, the image sensor 21 will generate an additional rotation angle in the XY plane, thereby causing problems such as image rotation and optical image instability. In other words, crosstalk can lead to problems such as low accuracy of anti-shake drive control, image rotation, and optical image instability.

[0232] In the embodiment of the present application, the four soft board portions 252 of the main circuit board 25 are symmetrical about the first plane 2A and about the second plane 2B. The intersection line of the first plane 2A and the second plane 2B coincides with the photosensitive center 212 of the image sensor 21. The four soft board portions 252 adopt a symmetrical design, which makes the anti-shake system more stable, can reduce the crosstalk of the photosensitive component 2 during the anti-shake process, and reduce the driving power consumption.

[0233] Furthermore, other components of the photosensitive assembly 2 may also employ a symmetrical design to reduce crosstalk, including but not limited to: the four drive units of the drive assembly 223 being symmetrical about the first plane 2A and the second plane 2B; the connecting portion 283 of the reed 28 being symmetrical about the first plane 2A and the second plane 2B; the multiple magnetic elements 231 and the multiple ball bearings 232 being symmetrical about the first plane 2A and the second plane 2B; etc. Furthermore, the center of gravity of the drive load of the anti-shake motor 22 may also coincide with the photosensitive center 212 of the image sensor 21 to further reduce crosstalk.

[0234] In addition, the moving part of the photosensitive component 2 is suspended by a roughly flat spring 28, which also has the function of driving the moving part to reset. Therefore, the suspension structure of the photosensitive component 2 is simple, easy to implement, and small in size, and can also reduce the power consumption of the anti-shake drive.

[0235] In the aforementioned embodiment, the coil assembly 2232 of the anti-shake motor 22 is fixed to the bracket 222, which is fixed to the hard board portion 251, so that the coil assembly 2232 can drive the hard board portion 251 and the image sensor 21 to move. In other embodiments, the anti-shake motor 22 may not be provided with a bracket 222, and the coil assembly 2232 may be directly fixed to the hard board portion 251 of the main circuit board 25. This embodiment of the present application is not strictly limited to this.

[0236] In the above embodiment, the image sensor 21 is fixed to the support plate 26, the support plate 26 is fixed to the spring 28, and the spring 28 is fixed to the hard plate portion 251, so that the image sensor 21 is fixed relative to the hard plate portion 251. In some other embodiments, the photosensitive component 2 may not be provided with a support plate 26, and the image sensor 21 may be directly fixed to the hard plate portion 251, or fixed to the hard plate portion 251 through the spring 28. This embodiment of the present application is not strictly limited to this.

[0237] In the above embodiment, the driving component 223 uses the coil 2232a and the magnet 2231a to cooperate with the driving structure. In some other embodiments, the driving component 223 can also use a driving structure such as a shape memory alloy (SMA) driving component.

[0238] Please refer to Figure 32, which is a schematic diagram of the internal structure of the photosensitive component 2 shown in Figure 4 in some other embodiments. Among them, the photosensitive component 2 shown in this embodiment can include most of the technical features of the photosensitive component 2 of the previous embodiment. The following mainly describes the differences between the two, and the same parts between the two will not be repeated.

[0239] In some embodiments, the filter 2102 can be fixed to the bracket 222 and arranged directly opposite the image sensor 21. In this case, the photosensitive component 2 may not be provided with a separate filter bracket; the bracket 222 may be provided with a receiving space 2226, such as a receiving groove and / or receiving hole, for accommodating components such as the driver chip 2401 fixed to the hard board portion 251.

[0240] In some other embodiments, the filter 2102 may also be fixed to the light incident side of the image sensor 21 through other structures, and the embodiment of the present application is not strictly limited to this.

[0241] Please refer to Figures 33 to 35. Figure 33 is a schematic diagram of the internal structure of the camera module 30 shown in Figure 2 in other embodiments. Figure 34 is a schematic diagram of the cross-sectional structure of the camera module 30 shown in Figure 33 taken along line JJ. Figure 35 is a schematic diagram of the partially exploded structure of the camera module 30 shown in Figure 33. The camera module 30 shown in this embodiment can include most of the technical features of the camera module 30 in the previous embodiment. The following mainly describes the differences between the two embodiments, and the common features between the two embodiments will not be repeated.

[0242] In some embodiments, the camera module 30 may include a lens 1, a photosensitive component 2, and a focus motor 3. The focus motor 3 is located on the light-incoming side of the photosensitive component 2 and is fixed to the photosensitive component 2. The lens 1 can be mounted on the focus motor 3, which is used to drive the lens 1 to move along the optical axis 11 of the lens 1, so that the camera module 30 can achieve automatic focus. The optical axis 11 of the lens 1 is parallel to the Z-axis.

[0243] Among them, the photosensitive component 2 includes an image sensor 21 and an anti-shake motor 22. The image sensor 21 is located on the light-emitting side of the lens 1. The anti-shake motor 22 can be used to drive the image sensor 21 to move in the XY plane or tilt in any direction around to achieve optical image stabilization.

[0244] In some embodiments, as shown in FIG35 , the top plate 2421 of the photosensitive assembly 2 may be provided with a window 2426, through which the connection pads 273 of the connection circuit board 27 are exposed. The focus motor 3 may include an extension connector 32, which is exposed to the outside of the focus motor 3. The extension connector 283 may be fixedly connected to the connection pads 273 of the connection circuit board 27 through the window 2426, so that the focus motor 3 is electrically connected to the connection circuit board 27.

[0245] The top plate 2421 may be a flat plate structure or a plate structure with a middle area sunken relative to the surrounding area.

[0246] Among them, the camera module 30 can also include a Mylar sheet 4, which can fixedly connect the top plate 2421 and the focus motor 3, and cover the extended connector 32 of the focus motor 3 and the window 2426 of the top plate 2421 to achieve fixing and protection.

[0247] Please refer to Figures 36 and 37. Figure 36 is a schematic diagram of a portion of the structure of the photosensitive component 2 shown in Figure 35, and Figure 37 is a schematic diagram of the exploded structure of the structure shown in Figure 36. The photosensitive component 2 shown in this embodiment can include most of the technical features of the photosensitive component 2 of the previous embodiment. The following mainly describes the differences between the two, and the same parts between the two will not be repeated.

[0248] In some embodiments, the base 221 may include a main body 2211 and a plurality of legs 2212 fixed to the main body 2211. The main body 2211 may be generally rectangular, and the number of legs 2212 may be four, each of which is fixed to the middle of the four sides of the main body 2211. The legs 2212 of the base 221 are fixedly connected to the base 241, so that the base 221 and the base 241 are relatively fixed.

[0249] The hard board portion 251 of the main circuit board 25 is disposed opposite to the main body 2211 of the base 221 . The four soft board portions 252 of the main circuit board 25 and the four legs 2212 of the base 221 are alternately arranged in the circumferential direction of the hard board portion 251 .

[0250] Illustratively, the second portions 2522b of the connecting sections 2522 of the four flexible board portions 252 are fixed to the side of the main body 2211 of the base 221. For example, the second portions 2522b of the connecting sections 2522 of two of the four flexible board portions 252 can be fixed to one side of the main body 2211, while the second portions 2522b of the connecting sections 2522 of the other two flexible board portions 252 can be fixed to the other side of the main body 2211, with the two sides of the main body 2211 facing each other. In this embodiment, the base 241 can be a flat plate structure, and a fixing plate for fixing the second portions 2522b of the connecting sections 2522 can be omitted.

[0251] In this embodiment, the photosensitive component 2 fixes the second part 2522b of the connecting section 2522 of the four soft board parts 252 through the main body 2211 of the base 221. Therefore, the second end 2523 of the soft board part 252 and the second part 2522b of the connecting section 2522 are both fixed structures, which can prevent deformation during the movement of the image sensor 21 and the hard board part 251, thereby reducing the risk of damage to the second end 2523 of the soft board part 252 and the second part 2522b of the connecting section 2522, and can also reduce the movement interference of the soft board part 252 on the image sensor 21, thereby further reducing crosstalk and improving the stability of optical image imaging.

[0252] Illustratively, the second ends 2523 of the four flexible circuit board portions 252 of the main circuit board 25 are fixed to the main board portion 271 of the connecting circuit board 27. Multiple windows 2523a are provided on the sides of the second ends 2523 of the flexible circuit board portions 252. For example, the second end 2523 may be provided with two sets of windows 2523a, with the two sets of windows 2523a disposed opposite each other on either side of the second end 2523. Solder pads (not shown) on the second ends 2523 are exposed through the windows and are electrically connected to the connecting circuit board 27. For example, spot welding can be performed at the windows 2523a so that the solder pads exposed through the windows 2523a are fixedly connected and electrically connected to the solder pads on the connecting circuit board 27 via solder (not shown). In this embodiment, the method of connecting the second ends 2523 of the flexible circuit board portions 252 to the connecting circuit board 27 via spot welding is easy to implement and has a high yield rate. The window 2523a may be semicircular or in other shapes, and this embodiment of the present application does not impose strict limitations on this.

[0253] For example, a plurality of positioning protrusions 2217 are provided on the side of the main body 2211 of the base 221 facing away from the hard board portion 251. The second ends 2523 of the flexible board portions 252 engage with the plurality of positioning protrusions 2217. This provides a more stable and reliable connection between the second ends 2523 of the flexible board portions 252 and the main body 2211 of the base 221. Furthermore, the main board portion 271 of the connected circuit board 27 also engages with the plurality of positioning protrusions 2217.

[0254] Illustratively, the reinforcement frame 291 of the reinforcement member 29 is fixed relative to the rigid board portion 251 of the main circuit board 25. Each of the two reinforcement plates 292 of the reinforcement member 29 may include two reinforcement portions 2921, which are spaced apart and may be located on either side of the corresponding support leg 2212. In this case, the reinforcement member 29 includes four reinforcement portions 2921, and the four first portions 2522a of the connecting sections 2522 of the four flexible board portions 252 are respectively fixed to the four reinforcement portions 2921.

[0255] In this embodiment, the first end 2521 of the soft board portion 252 and the first part 2522a of the connecting section 2522 can move synchronously with the reinforcement 29 and the hard board portion 251 without deformation, thereby reducing the risk of damage to the first end 2521 of the soft board portion 252 and the first part 2522a of the connecting section 2522 during the movement of the image sensor 21 and the hard board portion 251, and reducing the interference of the soft board portion 252 on the movement of the image sensor 21, thereby further reducing crosstalk and improving the stability of optical image imaging.

[0256] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the scope of protection of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0257] It should be noted that all the above drawings are for illustrative purposes only and do not represent the actual size of the product. Furthermore, the dimensional ratios between the components in the drawings are not intended to limit the actual product of the present application.

[0258] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A photosensitive component (2), characterized in that: include: Base (241); The spring sheet (28) comprises a fixed portion (281), a movable portion (282) and a connecting portion (283), wherein the fixed portion (281) is fixedly connected to the base (241), the movable portion (282) is located on the inner side of the fixed portion (281), and the connecting portion (283) connects the fixed portion (281) and the movable portion (282); A main circuit board (25), comprising a hard board portion (251) and four soft board portions (252), wherein the hard board portion (251) is fixed to a side of the movable portion (282) facing away from the base (241), and each of the soft board portions (252) comprises a first end (2521), a connecting section (2522) and a second end (2523) connected in sequence, wherein the first end (2521) is connected to a side of the hard board portion (251), the connecting section (2522) is bent relative to the first end (2521) and arranged on the peripheral side of the hard board portion (251), and the second end (2523) is bent relative to the connecting section (2522) and is located on a side of the hard board portion (251) facing away from the base (241), and the connecting sections (2522) of the four soft board portions (252) are symmetrical about the first plane (2A) and symmetrical about the second plane (2B); An image sensor (21) is fixedly connected to the hard plate portion (251), wherein an intersection line between the first plane (2A) and the second plane (2B) coincides with a central axis (212) of a photosensitive surface (211) of the image sensor (21); The base (221) comprises a main body (2211) and a plurality of legs (2212) fixed to the main body (2211), wherein the main body (2211) is located on a side of the hard plate portion (251) facing away from the base (241), and the plurality of legs (2212) are fixedly connected to the base (241); a driving assembly (223) for driving the hard plate portion (251) to move relative to the base (221) on a plane perpendicular to the central axis; and The connecting circuit board (27) comprises a main board portion (271) and an extension portion (272), wherein the main board portion (271) is fixed to a side of the base (221) facing away from the pedestal (241), the extension portion (272) is connected to a side of the main board portion (271), and the second ends (2523) of the four soft board portions (252) are fixedly connected to the main board portion (271).

2. The photosensitive component (2) according to claim 1, characterized in that: A portion of the connecting section (2522) extends along a first direction, and another portion of the connecting section (2522) extends along a second direction, wherein the second direction intersects the first direction; And / or, the connecting section (2522) is perpendicular to the hard plate portion (251).

3. The photosensitive component (2) according to claim 1 or 2, characterized in that: The photosensitive component (2) further comprises two reinforcing plates (292), wherein the two reinforcing plates (292) are arranged opposite to each other and are respectively fixed on opposite sides of the movable portion (282); The connecting section (2522) of each soft board portion (252) includes a first portion (2522a) connected to the first end (2521), and the first portions (2522a) of two of the four soft board portions (252) are fixed to one of the reinforcing plates (292), and the first portions (2522a) of the other two soft board portions (252) are fixed to another reinforcing plate (292).

4. The photosensitive component (2) according to claim 3, characterized in that: The photosensitive component (2) further comprises a reinforcement frame (291), wherein the reinforcement frame (291) is fixed to a side of the movable portion (282) facing the base (241), and the two reinforcement plates (292) are respectively connected to opposite sides of the reinforcement frame (291).

5. The photosensitive component (2) according to any one of claims 1 to 4, characterized in that: The base (241) comprises a bottom plate (2411) and two fixing plates (2412), wherein the two fixing plates (2412) are arranged opposite to each other and are respectively fixed on two opposite sides of the bottom plate (2411); The connecting section (2522) of each soft board portion (252) includes a second portion (2522b) connected to the second end (2523); the second portions (2522b) of two of the four soft board portions (252) are fixed to one of the fixed plates (2412), and the second portions (2522b) of the other two soft board portions (252) are fixed to another fixed plate (2412).

6. The photosensitive component (2) according to any one of claims 1 to 4, characterized in that: The connecting section (2522) of each soft board portion (252) includes a second portion (2522b) connected to the second end (2523); the second portions (2522b) of two of the four soft board portions (252) are fixed to one side of the main body (2211), and the second portions (2522b) of the other two soft board portions (252) are fixed to the other side of the main body (2211).

7. The photosensitive component (2) according to any one of claims 1 to 6, characterized in that: A plurality of positioning protrusions (2217) are provided on a side of the main body (2211) facing away from the hard board portion (251), and the second ends (2523) of the plurality of soft board portions (252) are clamped with the plurality of positioning protrusions (2217).

8. The photosensitive component (2) according to any one of claims 1 to 7, characterized in that: A plurality of windows (2523a) are provided on the side of the second end (2523), and the soldering pads of the second end (2523) are exposed in the windows (2523a), and the soldering pads of the second end (2523) are electrically connected to the connecting circuit board (27).

9. The photosensitive component (2) according to any one of claims 1 to 8, characterized in that: The connecting portion (283) includes four spring wire groups (2831), and the four spring wire groups (2831) are symmetrical about the first plane (2A) and symmetrical about the second plane (2B).

10. The photosensitive component (2) according to any one of claims 1 to 9, characterized in that: The movable portion (282) is provided with a first through hole (2821), and the hard plate portion (251) is provided with a second through hole (2511), and the second through hole (2511) is connected to the first through hole (2821); The photosensitive component (2) also includes a support plate (26), wherein the support plate (26) is fixed to a side of the movable portion (282) facing the base (241), and the image sensor (21) is fixed to the support plate (26) and is at least partially located in the first through hole (2821) and / or the second through hole (2511).

11. The photosensitive component (2) according to any one of claims 1 to 9, characterized in that: The driving component (223) comprises a magnet group (2231) and a coil group (2232), wherein the magnet group (2231) is fixed to the main body (2211), and the coil group (2232) is fixed to a side of the hard plate portion (251) facing away from the base (241), and is arranged opposite to the magnet group (2231); The magnet group (2231) and the coil group (2232) are both symmetrical about the first plane (2A) and symmetrical about the second plane (2B).

12. The photosensitive component (2) according to claim 11, characterized in that: The photosensitive component (2) further comprises a bracket (222), wherein the bracket (222) is fixed to a side of the hard plate portion (251) facing away from the base (241), and the coil group (2232) is fixed to a side of the bracket (222) facing away from the hard plate portion (251).

13. The photosensitive component (2) according to claim 12, characterized in that: The photosensitive component (2) further comprises a plurality of magnetic elements (231) and a plurality of rolling balls (232); the plurality of magnetic elements (231) are fixed to the bracket (222) and are arranged in one-to-one correspondence with the plurality of magnets (2231a) of the magnet group (2231); and the plurality of rolling balls (232) are supported between the bracket (222) and the main body (2211); The plurality of magnetic elements (231) and the plurality of rolling balls (232) are symmetrical about the first plane (2A) and symmetrical about the second plane (2B).

14. The photosensitive component (2) according to claim 12 or 13, characterized in that: The photosensitive component (2) further comprises a filter (2102), wherein the filter (2102) is fixed to the bracket (222) and is arranged facing the image sensor (21).

15. The photosensitive component (2) according to any one of claims 1 to 13, characterized in that: The photosensitive component (2) further comprises a filter (2102) and a filter holder (2101), wherein the filter holder (2101) is fixed to a side of the hard plate portion (251) facing away from the base (241), and the filter (2102) is fixed to the filter holder (2101) and arranged facing the image sensor (21).

16. The photosensitive component (2) according to any one of claims 1 to 15, characterized in that: The photosensitive component (2) further comprises a top plate (2421) and a side plate (2422), wherein the top plate (2421) is located on a side of the connecting circuit board (27) facing away from the base (241), one end of the side plate (2422) is fixed to the periphery of the top plate (2421), and the other end of the side plate (2422) is fixed to the base (221); The middle region (2421a) of the top plate (2421) is recessed relative to the peripheral region (2421b) of the top plate (2421) in a direction closer to the base (221).

17. The photosensitive component (2) according to claim 16, characterized in that: The top plate (2421) is provided with a first window (2424), and the second end (2523) is at least partially located in the first window (2424).

18. The photosensitive component (2) according to claim 16 or 17, characterized in that: The top plate (2421) is provided with a second window (2425), and the connecting circuit board (27) includes a connecting pad (273), and the connecting pad (273) is exposed in the second window (2425).

19. A camera module (30), characterized in that: It comprises a lens (1) and a photosensitive component (2) according to any one of claims 1 to 18, wherein the photosensitive component (2) is located on the light-emitting side of the lens (1).

20. The camera module (30) according to claim 19, characterized in that: The camera module (30) further comprises a focus motor (3), wherein the focus motor (3) is located on the light-incoming side of the photosensitive component (2), the lens (1) is mounted on the focus motor (3), and the focus motor (3) is electrically connected to a connecting circuit board (27) of the photosensitive component (2).

21. An electronic device (100), characterized in that: It comprises an image processor (60) and the camera module (30) according to claim 19 or 20, wherein the image processor (60) is communicatively connected to the camera module (30), and the image processor (60) is used to obtain image data from the camera module (30) and process the image data.

Images