Silicone composition, and preparation method therefor and use thereof

Abstract

The present invention relates to a silicone composition, and a preparation method therefor and a use thereof. The silicone composition comprises: (A) a silicone gel, which is obtained by carrying out hydrosilylation action on at least one first polyorganosiloxane having Si-H and at least one second polyorganosiloxane having an ethylenically unsaturated group at the molar ratio of less than 1 of Si-H of the first polyorganosiloxane to the ethylenically unsaturated group of the second polyorganosiloxane in the presence of a hydrosilylation catalyst; (B) at least one silicon-containing compound selected from the following: (B-1) third polyorganosiloxane having at least one of Si-H and an alkoxy functional group, and (B-2) alkoxysilane; (C) a thermally conductive filler; and (D) optionally, one or more auxiliary additives.

Description

Silicone composition, preparation method and use thereof Technical Field

[0001] The present invention relates to an organosilicon composition, a method for preparing the same, and a thermal interface material, device, and method for dissipating heat from a substrate using the same. In particular, the organosilicon composition of the present invention uses an organosilicon gel and a silane or siloxane having Si—H and / or alkoxy functional groups, enabling the resulting thermal interface material to withstand long-term high temperature conditions and repeated thermal shocks, thereby providing excellent long-term reliability. Background Art

[0002] In modern electronic devices, thermal interface materials are often used to fill the interface between heat-generating components and heat sinks to improve heat dissipation. Curable thermally conductive silicones and non-curable thermally conductive greases are commonly used as such thermal interface materials. Thermally conductive silicones typically consist of vinyl-functional polysiloxanes, polysiloxanes with Si-H bonds, noble metal catalysts, and thermally conductive fillers. While thermally conductive silicones do not present issues such as pumping out and migration, their thermal conductivity is lower than that of thermally conductive greases and they typically require heat curing, limiting their use. Thermally conductive greases typically consist of thermally conductive fillers with varying size distributions, a filler treatment agent, and an organopolysiloxane. However, the inherent properties of thermally conductive silicone greases make them susceptible to pumping out, cracking after drying out, and vertical slippage after prolonged exposure to high temperatures (e.g., temperatures above 150°C) or repeated exposure to thermal shock (e.g., drastic temperature fluctuations from -40°C to 150°C). This can lead to material migration, contamination of electronic devices, or even short circuits.

[0003] Therefore, there remains a need for thermal interface materials that do not require heat curing and can withstand long-term high temperature conditions and repeated thermal shocks with long-term reliability.

[0004] Summary of the Invention

[0005] In one aspect, the present invention provides a silicone composition comprising: (A) a silicone gel prepared by subjecting at least one first polyorganosiloxane having Si—H to a hydrosilylation reaction with at least one second polyorganosiloxane having ethylenically unsaturated groups in the presence of a hydrosilylation catalyst at a molar ratio of Si—H of the first polyorganosiloxane to the ethylenically unsaturated groups of the second polyorganosiloxane of less than 1; (B) at least one silicon-containing compound selected from the group consisting of: (B-1) a third polyorganosiloxane having at least one of Si—H and an alkoxy functional group, and (B-2) an alkoxysilane; (C) a thermally conductive filler; and (D) optionally, one or more auxiliary additives.

[0006] In another aspect, the present invention provides a method for preparing the silicone composition, comprising: (a) subjecting the first polyorganosiloxane and the second polyorganosiloxane to a hydrosilylation reaction in the presence of a hydrosilylation catalyst at a molar ratio of Si—H groups of the first polyorganosiloxane to ethylenically unsaturated groups of the second polyorganosiloxane of less than 1 to prepare a silicone gel (A); and (b) directly blending the prepared silicone gel (A) with component (B), component (C), and optionally component (D) to prepare the silicone composition.

[0007] In yet another aspect, the present invention provides a thermal interface material comprising the silicone composition according to the above aspect.

[0008] In another aspect, the present invention provides a device comprising a first substrate, a second substrate, and a thermal interface material bridging an interface between the first substrate and the second substrate, the thermal interface material being the thermal interface material according to the above aspect.

[0009] In yet another aspect, the present invention provides a method for preparing the device, comprising applying the silicone composition to at least one of the first substrate and the second substrate.

[0010] In another aspect, the present invention provides a method for removing heat from a substrate comprising contacting the thermal interface material with the substrate.

[0011] The organic silicone composition according to the present invention is a thermally conductive silicone grease in a fluid state, and is therefore easy to fill in the gaps between different substrates to become an excellent thermal interface material. After being applied to the surface of a heat-generating component that needs to dissipate heat, the organic silicone composition can exert its heat dissipation effect without the need for thermal curing. At the same time, the organic silicone composition applied on the surface of the heat-generating component undergoes cross-linking and / or condensation reactions under the action of the heat released by the heat-generating component, so that the thermal interface material prepared therefrom can withstand long-term high temperature conditions and repeated thermal shocks, thereby providing excellent long-term reliability. In some preferred embodiments, the thermal interface material prepared using the organic silicone composition according to the present invention can withstand a high temperature of 150°C for more than 1,000 hours. In other preferred embodiments, the thermal interface material can withstand at least 500 times, or even more than 1,000 times, of thermal cycling shocks from -40°C to 150°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 shows the results of accelerated aging evaluation of Example samples EX1, EX2, and EX3. In Figure 1 and the subsequent figures, the top row of graphs shows the results after the samples were subjected to a temperature of 150°C for 1000 hours, while the bottom row of graphs shows the results after the samples were subjected to a thermal cycle shock from -40°C to 150°C for 1000 cycles.

[0013] FIG. 2 is a graph showing the results of accelerated aging evaluation of Example samples EX4, EX5, and EX6.

[0014] FIG. 3 is a graph showing the results of accelerated aging evaluation of Example samples EX7, EX8, and EX9.

[0015] FIG. 4 is a graph showing the results of accelerated aging evaluation of Comparative Example samples CE1 and CE2.

[0016] FIG. 5 is a graph showing the results of accelerated aging evaluation of Comparative Example samples CE3, CE4, and CE5.

[0017] FIG. 6 is a graph showing the results of accelerated aging evaluation of Example samples EX10 and EX11.

[0018] FIG. 7 is a graph showing the results of accelerated aging evaluation of Comparative Example samples CE6, CE7, and CE8. Specific implementation plan

[0019] In the specification and claims herein, the following terms and expressions are to be interpreted in the manner indicated.

[0020] The singular forms "a," "an," and "the" include plural referents, and a reference to a specific value includes at least that specific value unless the context clearly dictates otherwise.

[0021] The use of any and all examples, or exemplary language (eg, "such as") provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed.

[0022] No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.

[0023] The terms "comprising," "including," "containing," and their grammatical equivalents are inclusive or open-ended terms that do not exclude additional, unrecited elements or method steps, but will also be understood to encompass the more restrictive terms "consisting of" and "consisting essentially of."

[0024] Except in the working examples, or where otherwise indicated, all numbers expressing amounts of material, temperatures, durations, quantitative properties of materials, and so forth set forth in the specification and claims are to be understood as being modified in all instances by the term "about", whether or not the term "about" is employed in the expression.

[0025] It will be understood that any numerical range recited herein includes all subranges within that range and any combination of the different endpoints of such ranges or subranges.

[0026] It will also be understood that any compound, material or substance disclosed explicitly or implicitly in the specification and / or recited in the claims as belonging to a group of structurally, compositionally and / or functionally related compounds, materials or substances includes individual representatives of the group and all combinations thereof.

[0027] The term "hydrocarbon group" means any hydrocarbon (saturated or unsaturated, aliphatic or aromatic, acyclic or cyclic) from which one or more hydrogen atoms have been removed; and refers to any of an alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, aralkyl, and alkaryl group that may optionally contain one or more heteroatoms. In one embodiment, the hydrocarbon group may contain up to about 20 carbon atoms, and in another embodiment up to about 16 carbon atoms.

[0028] The term "alkyl" means any monovalent saturated straight, branched or cyclic hydrocarbon group. Examples of alkyl groups include methyl, ethyl, propyl, butyl and cyclohexyl. The term "alkenyl" means any monovalent straight, branched or cyclic hydrocarbon group containing one or more carbon-carbon double bonds, wherein the attachment site of the group may be at the carbon-carbon double bond or other positions therein. Examples of alkenyl groups include vinyl, propenyl, allyl, methallyl and cyclohexylvinyl. The term "alkynyl" means any monovalent straight, branched or cyclic hydrocarbon group containing one or more carbon-carbon triple bonds and optionally one or more carbon-carbon double bonds, wherein the attachment site of the group may be at the carbon-carbon triple bond, carbon-carbon double bond or other positions therein. Examples of alkynyl groups include ethynyl, propargyl and methylethynyl.

[0029] As used herein, the term "aryl" means any monovalent aromatic hydrocarbon group having from about 6 to about 30 carbon atoms, preferably from about 6 to about 20 carbon atoms, and more preferably from about 6 to about 18 carbon atoms. Examples of aryl groups include phenyl and naphthyl. The term "aralkyl" means any alkyl group (as defined herein) in which one or more hydrogen atoms have been replaced by the same number of similar and / or different aryl groups (as defined herein). Examples of aralkyl groups include benzyl and phenethyl. The term "alkaryl" means any aryl group (as defined herein) in which one or more hydrogen atoms have been replaced by the same number of similar and / or different alkyl groups (as defined herein). Examples of alkaryl groups include tolyl and xylyl.

[0030] The term "heteroatom" means any element of Groups 13 to 17 other than carbon, and includes, for example, oxygen, nitrogen, silicon, sulfur, phosphorus, fluorine, chlorine, bromine, and iodine. In some embodiments, the heteroatom is a halogen atom selected from fluorine, chlorine, bromine, and iodine. In some embodiments, the heteroatom is oxygen, nitrogen, or sulfur.

[0031] Usable monovalent hydrocarbon groups include: straight-chain or branched-chain alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, hexyl groups such as n-hexyl, heptyl groups such as n-heptyl, octyl groups such as n-octyl, isooctyl and 2,2,4-trimethylpentyl, nonyl groups such as n-nonyl, decyl groups such as n-decyl, and cycloalkyl groups such as cyclopentyl, cyclohexyl, cycloheptyl and methylcyclohexyl; alkenyl groups such as straight-chain or branched-chain alkenyl groups such as vinyl, propenyl, allyl and methylallyl, and cyclic alkenyl groups such as cyclohexenyl; alkynyl groups such as ethynyl, propargyl and methylethynyl; aryl groups such as phenyl, naphthyl; alkaryl groups such as o-, m- and p-tolyl, xylyl; and aralkyl groups such as phenethyl and benzyl.

[0032] Available divalent hydrocarbon groups include: alkylene, alkenylene, alkynylene, arylene or any combination of both or more thereof, which may optionally contain one or more heteroatoms, such as oxygen, nitrogen, sulphur atom or halogen atom. In some embodiments, the divalent hydrocarbon group may optionally contain one or more functional groups, which may include, for example, hydroxyl, sulfhydryl, ether, ester, amine, amide or carboxyl groups. The divalent hydrocarbon group may contain 1 to approximately 20 carbon atoms, such as 1 to approximately 16 carbon atoms, preferably 1 to approximately 12 carbon atoms, and more preferably from approximately 3 to approximately 10 carbon atoms.

[0033] In one aspect, the present invention provides a silicone composition comprising: (A) a silicone gel prepared by subjecting at least one first polyorganosiloxane having Si—H groups to a hydrosilylation reaction with at least one second polyorganosiloxane having ethylenically unsaturated groups in the presence of a hydrosilylation catalyst at a molar ratio of Si—H groups of the first polyorganosiloxane to the ethylenically unsaturated groups of the second polyorganosiloxane of less than 1; (B) at least one silicon-containing compound selected from the group consisting of (B-1) a third polyorganosiloxane having at least one of Si—H and an alkoxy functional group, and (B-2) an alkoxysilane; (C) a thermally conductive filler; and (D) optionally, one or more auxiliary additives.

[0034] The silicone gel according to the present invention is a pre-cured silicone gel with a low cross-linking density prepared under conditions where the ethylenically unsaturated groups are in molar excess relative to Si-H, and its cross-linking density is such that its storage modulus (G') at room temperature is typically less than about 500 Pa. In one embodiment, its storage modulus is less than 300 Pa, for example, from about 10 to about 200 Pa, in particular from about 50 to about 100 Pa. The pre-cured silicone gel has a residual ethylenically unsaturated group content and can further undergo a cross-linking reaction. The silicone composition of the present invention uses the silicone gel having a residual ethylenically unsaturated group content in combination with a silane or siloxane having Si-H and / or alkoxy functional groups, so that the thermal interface material prepared therefrom can undergo cross-linking and / or condensation reactions and increase viscosity under the action of heat released by a heat-generating component that needs to dissipate heat. As a result, the thermal interface material according to the present invention can withstand long-term high temperature conditions and repeated thermal shocks.

[0035] Examples of ethylenically unsaturated groups in the silicone gel include, but are not limited to, alkenyl and alkynyl groups. Illustrative examples of alkenyl groups include, but are not limited to, vinyl, propenyl, allyl, methylallyl, and cyclohexylvinyl. Illustrative examples of alkynyl groups include, but are not limited to, ethynyl, propargyl, and methylethynyl. In one embodiment, the ethylenically unsaturated group is vinyl.

[0036] In a preferred embodiment, the first polyorganosiloxane has the structure of formula (I): M 1 a M H b D 1 c D H d T 1 e T H f Q g General formula (I)

[0037] Among them, M 1 =R 11 R 12 R 13 SiO 1 / 2 ; M H =R 14 R 15 HSiO 1 / 2 ; D 1 =R 16 R 17 SiO 2 / 2 ; D H =R 18 HSiO 2 / 2 ; T 1=R 19 SiO 3 / 2 ; T H =HSiO 3 / 2 ; Q=SiO 4 / 2

[0038] where R 11 、R 12 、R 13 、R 14 、R 15 、R 16 、R 17 、R 18 and R 19 Each is independently an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably a monovalent hydrocarbon group of 1-30 carbon atoms, more preferably an alkyl group of 1-12 carbon atoms; the subscripts a, b, c, d, e, f and g satisfy: 0≤a≤50, 0≤b≤50, 0≤c≤500, 0≤d≤500, 0≤e≤100, 0≤f≤100, 0≤g≤30, b+d+f≥2, and a+b+c+d+e+f+g≤1000.

[0039] In a preferred embodiment, the first polyorganosiloxane is selected from the following general formula (I): wherein R 11 、R 12 、R 13 、R 14 、R 15 、R 16 、R 17 、R 18 and R 19 Each is independently an alkyl group of 1 to 6 carbon atoms, e, f and g are 0, a+b=2, 10≤c≤200, and 10≤d≤100.

[0040] In a particularly preferred embodiment, the first polyorganosiloxane is selected from the following general formula (I): wherein R 11 、R 12 、R 13 、R 14 、R 15 、R 16 、R 17 、R 18 and R 19 Each is independently an alkyl group of 1 to 4 carbon atoms, e, f and g are 0, a+b=2, 10≤c≤100, and 10≤d≤50.

[0041] In a preferred embodiment, the second polyorganosiloxane has the following general formula (II): M 2 h MV i D 2 j D V k T 2 l T V m Q n General formula (II)

[0042] Among them, M 2 =R 21 R 22 R 23 SiO 1 / 2 ; M V =R 24 R 25 R V SiO 1 / 2 ; D 2 =R 26 R 27 SiO 2 / 2 ; D V =R 28 R V SiO 2 / 2 ; T 2 =R 29 SiO 3 / 2 ; T V =R V SiO 3 / 2 ; Q=SiO 4 / 2

[0043] in

[0044] where R 21 、R 22 、R 23 、R 24 、R 25 、R 26 、R 27 、R 28 and R 29 Each is independently an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably a monovalent hydrocarbon group of 1 to 30 carbon atoms, more preferably an alkyl group of 1 to 12 carbon atoms; R V Each is independently an ethylenically unsaturated group of 2 to 30 carbon atoms, preferably an alkenyl group or alkynyl group of 2 to 20 carbon atoms, more preferably an alkenyl group of 2 to 8 carbon atoms; the subscripts h, i, j, k, l, m and n satisfy: 0≤h≤50, 0≤i≤50, 0≤j≤1000, 0≤k≤1000, 0≤l≤100, 0≤m≤100, 0≤n≤30, i+k+m≥2, and h+i+j+k+l+m+n≤2000.

[0045] In a preferred embodiment, the second polyorganosiloxane is selected from the following general formula (II): wherein R 21 、R 22 、R 23 、R 24 、R 25 、R 26 、R 27 、R 28 and R 29 Each is independently an alkyl group of 1 to 6 carbon atoms; R V Each is independently an alkenyl group or an alkynyl group of 2 to 20 carbon atoms; l, m and n are 0, h+i=2, 0≤k≤20, and 10≤j≤800.

[0046] In a particularly preferred embodiment, the second polyorganosiloxane is selected from the following general formula (II): wherein R 21 、R 22 、R 23 、R 24 、R 25 、R 26 、R 27 、R 28 and R 29 Each is independently an alkyl group of 1 to 4 carbon atoms; R V Each is independently an alkenyl group of 2 to 8 carbon atoms; k, l, m and n are 0, i=2, and 100≤j≤500.

[0047] In one embodiment, the molar ratio of Si—H groups of the first polyorganosiloxane to the ethylenically unsaturated groups of the second polyorganosiloxane used to prepare the silicone gel is from about 0.05:1 to about 0.9:1, preferably from about 0.1:1 to about 0.8:1, more preferably from about 0.15:1 to about 0.7:1, and particularly from about 0.2:1 to about 0.5:1, for example, about 0.3:1.

[0048] The hydrosilylation catalysts used in preparing silicone gels via hydrosilylation reactions are well known in the art. Illustrative examples of hydrosilylation catalysts include, but are not limited to, noble metal-based catalysts, particularly platinum-based catalysts, such as Karstedt's catalyst. The prepared silicone gel can be used directly in the formulation of thermal interface materials without purification.

[0049] In the prepared silicone gel, the amount of ethylenically unsaturated groups is about 0.01 to about 0.30 mmol per 1 g of gel, preferably about 0.02 to about 0.25 mmol per 1 g of gel, and more preferably about 0.05 to about 0.20 mmol per 1 g of gel, particularly about 0.08 to about 0.15 mmol per 1 g of gel.

[0050] In an embodiment, the silicone gel (A) is generally used in an amount of about 0.5 to 10 parts by weight based on 100 parts by weight of the silicone composition. For example, the silicone gel (A) can be used in an amount of about 0.8 to about 8 parts by weight, specifically about 1 to about 5 parts by weight, such as about 2 parts by weight, about 3 parts by weight, about 4 parts by weight, or about 4.5 parts by weight based on 100 parts by weight of the silicone composition.

[0051] In a preferred embodiment, the third polyorganosiloxane has the structure of formula (III): M 3 o M H p M AO q D 3 r D H s D AO t T 3 u T H v T AO w Q x General formula (III)

[0052] Among them, M 3 =R 31 R 32 R 33 SiO 1 / 2 ; M AO =R 34 R 35 R AO SiO 1 / 2 ; D 3 =R 36 R 37 SiO 2 / 2 ; D AO =R 38 R AO SiO 2 / 2 ; T 1 =R 39 SiO 3 / 2 ; T AO =R AO SiO 3 / 2; Q=SiO 4 / 2

[0053] M H 、D H and T H Same as the definition above for general formula (I),

[0054] where R 14 、R 15 、R 18 、R 31 、R 32 、R 33 、R 36 、R 37 and R 39 Each is independently an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably a monovalent hydrocarbon group of 1 to 30 carbon atoms, more preferably an alkyl group of 1 to 12 carbon atoms; R 34 、R 35 and R 38 Each independently is R AO or an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably R AO or a monovalent hydrocarbon group of 1 to 30 carbon atoms, more preferably R AO or an alkyl group of 1 to 12 carbon atoms; R AO Each is independently an alkoxy group having 1 to 12 carbon atoms, preferably an alkoxy group having 1 to 6 carbon atoms, more preferably an alkoxy group having 1 to 4 carbon atoms; the subscripts o, p, q, r, s, t, u, v, w and x satisfy the following conditions: 0≤o≤50, 0≤p≤50, 0≤q≤50, 0≤r≤500, 0≤s≤500, 0≤t≤500, 0≤u≤100, 0≤v≤100, 0≤w≤100, 0≤x≤30, p+s+v+q+t+w≥2, and o+p+q+r+s+t+u+v+w+x≤1000.

[0055] In a preferred embodiment, the third polyorganosiloxane is a polyorganosiloxane having Si—H, which has, for example, the following general formula (III): wherein R 14 、R 15 、R 18 、R 31 、R 32 、R 33 、R 34 、R 35 、R 36 、R 37 、R 38 and R 39Each is independently an alkyl group of 1 to 6 carbon atoms, q, t, u, v, w and x are 0, o+p=2, 10≤r≤200, and 10≤s≤100. In one example according to this embodiment, R 14 、R 15 、R 18 、R 31 、R 32 、R 33 、R 34 、R 35 、R 36 、R 37 、R 38 and R 39 is a methyl group, q, t, u, v, w and x are 0, o+p=2, 10≤r≤100, and 10≤s≤50.

[0056] In another preferred embodiment, the third polyorganosiloxane is a polyorganosiloxane having an alkoxy functional group, which has, for example, the following general formula (III): wherein R 14 、R 15 、R 18 、R 31 、R 32 、R 33 、R 34 、R 36 、R 37 、R 38 and R 39 Each independently represents an alkyl group of 1 to 6 carbon atoms, R 35 and R AO is an alkoxy group of 1 to 4 carbon atoms, o, p, s, t, u, v, w and x are 0, q=2, and 10≤r≤200. In one example according to this embodiment, R 14 、R 15 、R 18 、R 31 、R 32 、R 33 、R 34 、R 36 、R 37 、R 38 and R 39 is methyl, o, p, s, t, u, v, w and x are 0, q=2, and 10≤r≤100.

[0057] In a particularly preferred embodiment, the third polyorganosiloxane is selected from the following general formula (III): wherein R 14 、R 15 、R 18 、R 31 、R 32 、R33 、R 34 、R 35 、R 36 、R 37 、R 38 and R 39 Each is independently an alkyl group of 1 to 4 carbon atoms, such as methyl, q, t, u, v, w and x are 0, o+p=2, 10≤r≤100, and 10≤s≤50.

[0058] The third polyorganosiloxane is generally used in an amount of about 0.01 to 5 parts by weight based on 100 parts by weight of the organosilicon composition. For example, the third polyorganosiloxane can be used in an amount of about 0.05 to 4 parts by weight, specifically about 0.08 to 3 parts by weight, such as about 0.1 part by weight, about 0.5 part by weight, about 1 part by weight, about 1.5 parts by weight, about 2 parts by weight, about 2.5 parts by weight, or about 3 parts by weight, based on 100 parts by weight of the organosilicon composition.

[0059] In a preferred embodiment, the alkoxysilane has the following general formula (IV): (XR 41 ) y Si(R 42 ) z (OR 43 ) 4-(y+z) Formula (IV)

[0060] Wherein, X is an organic functional group;

[0061] R 41 are each independently a divalent hydrocarbon group of 1 to 12 carbon atoms, optionally containing one or more heteroatoms;

[0062] R 42 each independently an alkyl group having 1 to 16 carbon atoms;

[0063] R 43 each independently an alkyl group having 1 to 6 carbon atoms;

[0064] Subscript y is 0 or 1, subscript z is 0, 1 or 2 and y+z is 0, 1 or 2.

[0065] In a preferred embodiment, the alkoxysilane is selected from the following general formula (IV): wherein X is selected from glycidyloxy, epoxy, amino, amide, acyloxy and urea, and R 41 is an alkylene group having 3 to 12 carbon atoms, R 42 is an alkyl group having 1 to 12 carbon atoms, R 43 Each is independently an alkyl group having 1 to 4 carbon atoms, subscript y is 1, and subscript z is 0 or 1.

[0066] In a particularly preferred embodiment, the alkoxysilane is selected from the following general formula (IV): wherein X is selected from the group consisting of glycidyloxy, epoxy, amino and amide groups, and R 41 is an alkylene group having 3 to 6 carbon atoms, R 43 Each is independently methoxy, ethoxy or propoxy, subscript y is 1, and subscript z is 0.

[0067] Illustrative examples of alkoxysilanes include, but are not limited to, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltripropoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, n-propyltripropoxysilane, n-propyltributoxysilane, n-butyltrimethoxysilane, isobutyltrimethoxysilane, n-pentyltrimethoxysilane, n-hexyltrimethoxysilane, isooctyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, octyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, oligomers thereof, and mixtures thereof. Among them, glycidoxypropyltrimethoxysilane is particularly advantageous.

[0068] The alkoxysilane is generally used in an amount of about 0.01 to 5 parts by weight based on 100 parts by weight of the silicone composition. For example, the alkoxysilane can be used in an amount of about 0.05 to about 4 parts by weight, specifically about 0.08 to 3 parts by weight, such as about 0.1 part by weight, about 0.5 part by weight, about 1 part by weight, about 1.5 parts by weight, about 2 parts by weight, about 2.5 parts by weight, or about 3 parts by weight, based on 100 parts by weight of the silicone composition.

[0069] In one embodiment, the thermally conductive filler is selected from aluminum oxide, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, silicon carbide, and silicon dioxide. In a preferred embodiment, the filler comprises at least one selected from aluminum oxide and zinc oxide. In an example according to this embodiment, the filler comprises both aluminum oxide and zinc oxide.

[0070] In a preferred embodiment, the thermally conductive filler comprises aluminum oxide of different particle sizes, for example, aluminum oxide having two or more different particle sizes. In an illustrative example, the filler comprises a first aluminum oxide having a first particle size, a second aluminum oxide having a second particle size, and a third aluminum oxide having a third particle size. The first particle size may range from about 0.01 to less than about 0.5 μm; the second particle size may range from about 0.5 μm to less than about 8 μm; and the third particle size may range from about 8 μm to about 100 μm. In an example according to this preferred embodiment, the filler further comprises zinc oxide, for example, nano zinc oxide.

[0071] In a preferred embodiment, the thermally conductive filler is a filler that has been surface-treated to impart hydroxyl groups. Without being limited by theory, it is believed that the hydroxyl groups on the filler's surface can undergo a condensation reaction with the alkoxy functional groups in component (B) under the influence of heat released by the heat-generating component to be dissipated, thereby further enhancing the thermal interface material's ability to withstand long-term high-temperature conditions and repeated thermal shock.

[0072] The thermally conductive filler is generally used in an amount of about 50-95 parts by weight based on 100 parts by weight of the silicone composition. For example, the filler can be used in an amount of about 55-90 parts by weight, particularly about 60-85 parts by weight, such as about 63 parts by weight, about 65 parts by weight, about 68 parts by weight, about 70 parts by weight, about 75 parts by weight, about 80 parts by weight, or about 85 parts by weight, based on 100 parts by weight of the silicone composition.

[0073] The organosilicon composition may further comprise one or more auxiliary additives as needed. Examples of the auxiliary additives include, but are not limited to, viscosity modifiers, hydrosilylation reaction inhibitors, wetting agents, pigments, and combinations thereof.

[0074] In one embodiment, the viscosity modifier is selected from silicone oils having a viscosity of about 20 to about 1000 cp at 25°C. The silicone oil may have a viscosity of about 30 to about 800 cp, such as about 50 to about 500 cp. Illustrative examples include, but are not limited to, dimethyl silicone oil, diphenyl silicone oil, methylphenyl silicone oil, and methylhydroxy silicone oil. Preferably, the viscosity modifier is present in an amount of about 1 to about 10 parts by weight, such as about 2 to about 8 parts by weight, and particularly about 3 to about 7 parts by weight, based on 100 parts by weight of the total weight of the silicone composition.

[0075] In one embodiment, the hydrosilylation reaction inhibitor is used in combination with component (B-1) having Si—H to improve the storage stability of the organosilicon composition. Illustrative examples of the hydrosilylation reaction inhibitor include, but are not limited to, isocyanurates and acetylenic alcohols. Preferably, the reaction inhibitor is present in an amount of about 0.01 to about 2 parts by weight, for example, about 0.02 to about 1 part by weight, and particularly about 0.03 to about 0.8 parts by weight, based on 100 parts by weight of the total weight of the composition.

[0076] In one embodiment, the wetting agent is selected from a hydrolyzable polysiloxane compound having a terminal trialkoxysilyl group connected to a Si atom via an alkylene group of about 2 to about 20 carbon atoms at one end. Illustrative examples of such wetting agents are described in PCT patent application WO2022187569A1, which is incorporated herein by reference in its entirety. Preferably, the wetting agent is present in an amount of about 0.5 to about 5 parts by weight, for example, about 0.8 to about 3 parts by weight, and particularly about 1 to about 2 parts by weight, based on 100 parts by weight of the total weight of the composition.

[0077] In one embodiment of the silicone composition, based on 100 parts by weight of the composition, the amount of component (A) is 0.5-10 parts by weight, preferably 0.8-8 parts by weight, more preferably 1-5 parts by weight; the amount of component (B) is 0.01-5 parts by weight, preferably 0.05-4 parts by weight, more preferably 0.08-3 parts by weight; the amount of component (C) is 50-95 parts by weight, preferably 55-90 parts by weight, more preferably 60-85 parts by weight; and the amount of component (D) is 0-10 parts by weight, preferably 0.01-8 parts by weight, more preferably 0.1-5 parts by weight.

[0078] In another aspect, the present invention provides a method for preparing the silicone composition, comprising: (a) hydrosilylating the first polyorganosiloxane and the second polyorganosiloxane in the presence of a hydrosilylation catalyst at a molar ratio of Si—H groups of the first polyorganosiloxane to ethylenically unsaturated groups of the second polyorganosiloxane to less than 1, thereby preparing a silicone gel (A); and (b) directly blending the prepared silicone gel (A) with component (B), component (C), and optionally component (D) to prepare the silicone composition. The reaction conditions for the hydrosilylation reaction are not particularly limited and can be appropriately selected based on the polyorganosiloxanes used and their amounts, as long as the molar ratio of Si—H groups of the first polyorganosiloxane to ethylenically unsaturated groups of the second polyorganosiloxane is less than 1, thereby providing residual ethylenically unsaturated groups.

[0079] On the other hand, the present invention provides a thermal interface material comprising a silicone composition according to the present invention. In one embodiment, the thermal interface material has a thermal conductivity of at least 3 W / mK, for example, a thermal conductivity of 3 W / mK to 10 W / mK. The thermal conductivity of the thermal interface material may be, for example, about 3 W / mK, about 4 W / mK, about 5 W / mK, about 6 W / mK, about 7 W / mK, about 8 W / mK, about 9 W / mK or about 10 W / mK. The thermal interface material according to the present invention can withstand long-term high temperature conditions and repeated thermal shocks, thereby providing excellent long-term reliability. In some preferred embodiments, the thermal interface material according to the present invention can withstand a high temperature of 150°C for more than 1000 hours. In other preferred embodiments, the thermal interface material can withstand at least 500 times, or even more than 1000 times, of thermal cycling shocks from -40°C to 150°C.

[0080] In yet another aspect, the present invention provides a device comprising a first substrate, a second substrate, and a thermal interface material according to the present invention that bridges the interface between the first substrate and the second substrate. Illustrative examples of such devices include, but are not limited to, devices requiring heat dissipation, particularly electronic devices. Illustrative examples of such electronic devices include, but are not limited to, power amplifiers, transistors, electron tubes, and CPUs.

[0081] In yet another aspect, the present invention provides a method for dissipating heat from a substrate, comprising contacting a thermal interface material according to the present invention with the substrate. Illustrative examples of substrates include, but are not limited to, metal substrates, such as aluminum substrates, copper substrates; plastic substrates, such as polycarbonate substrates, polyesters such as polyethylene terephthalate and polybutylene terephthalate substrates, polyamide substrates, polyimide substrates, acrylonitrile-styrene copolymer substrates, styrene-acrylonitrile-butadiene terpolymer substrates, polyvinyl chloride-based substrates, polyethylene, substrates, and any other suitable substrates, such as glass substrates.

[0082] Example

[0083] The present invention will be described in more detail with reference to Examples, but these Examples should not be construed as limiting the scope of the present invention. In the following description, unless otherwise specified, "parts" means "parts by weight," and viscosity is measured using a Brookfield viscometer at a temperature of 25°C.

[0084] Preparation of silicone gel

[0085] 67.5 parts of vinyl terminated silicone oil M Vi D 140 M Vi and 31.8 parts of vinyl terminated silicone oil M Vi D 339 M ViMixed with 0.20 parts of inhibitor triallyl isocyanurate (TAIC) and 0.02 parts of Karstedt catalyst at room temperature. The resulting mixture was heated to 50°C and 0.52 parts of MD H 33 D 23 M, the reactants were allowed to continue reacting under vacuum for 1 hour. Subsequently, the temperature was raised to 90°C and the reaction was continued until no Si-H was detected. The resulting organosilicon gel was set aside.

[0086] Preparation of thermal interface materials

[0087] The prepared silicone gel was mixed with a filler, a wetting agent, an alkoxysilane or polysiloxane, and / or an SiH-functional polysiloxane in the amounts shown in Tables 1 and 2 to prepare thermal interface materials for Examples 1-11 (EX1 to EX11) and Comparative Examples 1-5 (CE1 to CE5). The prepared samples for each example were in a paste-like state and had a viscosity sufficient for easy application to a surface. The viscosities shown in Tables 1 and 2 were measured using a Brookfield viscometer with a #7 spindle at 2 rpm and 20 rpm, respectively, at 25°C.

[0088] Table 1 (unit: parts)

[0089] Table 2 (unit: parts)

[0090] 1) Polydimethylsiloxane with a viscosity of ~100 cP, obtained from Momentive Performance Materials Inc.

[0091] 2) Silicone polymer with a trimethoxysilyl group connected to the Si atom via an ethylene group at one end of the chain, obtained from Momentive Performance Materials Inc.

[0092] 3) Al2O3 with a particle size of 7-10μm

[0093] 4) Al2O3 with particle size of 0.5μm-5μm

[0094] 5) Al2O3 with a particle size of 0.2-0.4μm

[0095] 6) Nano zinc oxide with a particle size of 80nm-120nm

[0096] 7)γ-Glycidoxypropyltrimethoxysilane

[0097] 8) Black masterbatch, composed of 50wt% carbon black and 50wt% polydimethylsiloxane with a viscosity of 3000cP

[0098] 9) Linear polysiloxane with pendant Si-H, SiH content of 2.8 mmol / g, viscosity of 100 cP

[0099] 10)γ-Glycidoxypropyltriethoxysilane

[0100] 11) Polydimethylsiloxane end-capped with dimethoxymethylsilyl groups at both ends with a viscosity of ∼100 cP, obtained from Momentive Performance Materials Inc.

[0101] Preparation of comparative thermal interface materials CE6 to CE8

[0102] Repeat Examples EX1 to EX3, except that 1.8 parts of the silicone gel is replaced by the raw materials used to prepare the 1.8 parts of the silicone gel, namely, two vinyl-terminated silicone oils, inhibitor TAIC, Karstedt catalyst and MD H 33 D 23 M, to obtain comparative thermal interface materials CE6 to CE8, whose viscosities at 2 rpm were 1168 cp, 1136 cp and 1136 cp, respectively, and their viscosities at 20 rpm were 249.6 cp, 249.6 cp and 244.8 cp, respectively.

[0103] Reliability Evaluation of Thermal Interface Materials

[0104] The thermal interface materials prepared in each embodiment and comparative example were applied between an aluminum plate and a glass plate separated by a distance of 0.1 mm. The samples thus prepared were placed vertically and subjected to the following two accelerated aging tests to evaluate their reliability.

[0105] Reliability evaluation 1: Each prepared sample was placed at 150°C for 1000 hours;

[0106] Reliability evaluation 2: Each of the prepared samples was subjected to a heat shock from -40°C to 150°C 1000 times.

[0107] The evaluation results are shown in FIG1 to FIG7 .

[0108] As shown in the figures, Example samples EX1 to EX11 according to the present invention all exhibited excellent reliability. After prolonged exposure to 150°C or repeated thermal shock, they exhibited no cracking, or even no cracking at all (e.g., Example samples EX1 to EX3), and showed no visible vertical slip. In contrast, Comparative Example samples CE1 to CE5, which lacked (A) the silicone gel and (B) at least one silicon-containing compound selected from polyorganosiloxanes and alkoxysilanes having Si—H and / or alkoxy functional groups, all exhibited unacceptable cracking after accelerated aging that could affect practical use.

[0109] Furthermore, Comparative Example samples CE6 to CE8, prepared using similar raw materials as the example samples, also exhibited unacceptable cracking after accelerated aging, as shown in Figure 7. This indicates that if the raw materials used to prepare the silicone gel are directly used as reactants for preparing the thermal interface material without any pre-curing, the cracking problem during aging cannot be solved.

[0110] Although the present disclosure has been described with reference to preferred embodiments, those skilled in the art will understand that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiments disclosed as the best mode contemplated for carrying out the present disclosure, but that the present disclosure will encompass all embodiments falling within the scope of the appended claims.

Claims

1. An organosilicon composition comprising: (A) a silicone gel obtained by subjecting at least one first polyorganosiloxane having Si—H to a hydrosilylation reaction with at least one second polyorganosiloxane having ethylenically unsaturated groups in the presence of a hydrosilylation catalyst at a molar ratio of Si—H of the first polyorganosiloxane to the ethylenically unsaturated groups of the second polyorganosiloxane of less than 1; (B) at least one silicon-containing compound selected from the group consisting of: (B-1) a third polyorganosiloxane having at least one of Si—H and alkoxy functional groups, and (B-2) an alkoxysilane; (C) thermally conductive fillers; and (D) Optionally, one or more auxiliary additives.

2. The organosilicon composition according to claim 1, wherein the first polyorganosiloxane has a structure of formula (I): M 1 a M H b D 1 c D H d T 1 e T H f Q g General formula (I) in M 1 =R 11 R 12 R 13 SiO 1 / 2 ; M H =R 14 R 15 HSiO 1 / 2 ; D 1 =R 16 R 17 SiO 2 / 2 ; D H =R 18 HSiO 2 / 2 ; T 1 =R 19 SiO 3 / 2 ; T H =HSiO 3 / 2 ; Q=SiO 4 / 2 Where R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 and R 19 Each independently represents an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably a monovalent hydrocarbon group of 1-30 carbon atoms, and more preferably an alkyl group of 1-12 carbon atoms; the subscripts a, b, c, d, e, f and g satisfy: 0≤a≤50, 0≤b≤50, 0≤c≤500, 0≤d≤500, 0≤e≤100, 0≤f≤100, 0≤g≤30, b+d+f≥2, and a+b+c+d+e+f+g≤1000; Preferably, the first polyorganosiloxane is selected from the following general formula (I): wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 and R 19 Each is independently an alkyl group of 1 to 6 carbon atoms, e, f and g are 0, a+b=2, 10≤c≤200, and 10≤d≤100; More preferably, the first polyorganosiloxane is selected from the following general formula (I): wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 and R 19 Each is independently an alkyl group of 1 to 4 carbon atoms, e, f and g are 0, a+b=2, 10≤c≤100, and 10≤d≤50.

3. The organosilicon composition according to claim 1 or 2, wherein the second polyorganosiloxane has the following general formula (II): M 2 h M V i D 2 j D V k T 2 l T V m Q n General formula (II) in M 2 =R 21 R 22 R 23 SiO 1 / 2 ; M V =R 24 R 25 R V SiO 1 / 2 ; D 2 =R 26 R 27 SiO 2 / 2 ; D V =R 28 R V SiO 2 / 2 ; T 2 =R 29 SiO 3 / 2 ; T V =R V SiO 3 / 2 ; Q=SiO 4 / 2 in Where R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 and R 29 Each is independently an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably a monovalent hydrocarbon group of 1 to 30 carbon atoms, more preferably an alkyl group of 1 to 12 carbon atoms; R V Each is independently an ethylenically unsaturated group of 2 to 30 carbon atoms, preferably an alkenyl group or an alkynyl group of 2 to 20 carbon atoms, more preferably an alkenyl group of 2 to 8 carbon atoms; the subscripts h, i, j, k, l, m and n satisfy: 0≤h≤50, 0≤i≤50, 0≤j≤1000, 0≤k≤1000, 0≤l≤100, 0≤m≤100, 0≤n≤30, i+k+m≥2, and h+i+j+k+l+m+n≤2000; Preferably, the second polyorganosiloxane is selected from the following general formula (II): wherein R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 and R 29 Each is independently an alkyl group of 1 to 6 carbon atoms; R V Each is independently an alkenyl group or an alkynyl group of 2 to 20 carbon atoms; l, m and n are 0, h+i=2, 0≤k≤20, and 10≤j≤800; More preferably, the second polyorganosiloxane is selected from the following general formula (II): wherein R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 and R 29 Each is independently an alkyl group of 1 to 4 carbon atoms; R V Each is independently an alkenyl group of 2-8 carbon atoms; k, l, m and n are 0, i=2, and 100≤j≤500.

4. The organosilicon composition according to any one of claims 1 to 3, wherein the third polyorganosiloxane has a structure of formula (III): M 3 o M H p M AO q D 3 r D H s D AO t T 3 u T H v T AO w Q x General formula (III) in M 3 =R 31 R 32 R 33 SiO 1 / 2 ; M AO =R 34 R 35 R AO SiO 1 / 2 ; D 3 =R 36 R 37 SiO 2 / 2 ; D AO =R 38 R AO SiO 2 / 2 ; T 1 =R 39 SiO 3 / 2 ; T AO =R AO SiO 3 / 2 ; Q=SiO 4 / 2 M H , D H and T H Same as the definition above for general formula (I), Where R 14 , R 15 , R 18 , R 31 , R 32 , R 33 , R 36 , R 37 and R 39 Each is independently an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably a monovalent hydrocarbon group of 1 to 30 carbon atoms, more preferably an alkyl group of 1 to 12 carbon atoms; R 34 , R 35 and R 38 Each independently is R AO or an optionally substituted monovalent hydrocarbon group of up to 60 carbon atoms, preferably R AO or a monovalent hydrocarbon group having 1 to 30 carbon atoms, more preferably R AO or an alkyl group of 1 to 12 carbon atoms; R AO Each is independently an alkoxy group having 1 to 12 carbon atoms, preferably an alkoxy group having 1 to 6 carbon atoms, and more preferably an alkoxy group having 1 to 4 carbon atoms; the subscripts o, p, q, r, s, t, u, v, w and x satisfy the following conditions: 0≤o≤50, 0≤p≤50, 0≤q≤50, 0≤r≤500, 0≤s≤500, 0≤t≤500, 0≤u≤100, 0≤v≤100, 0≤w≤100, 0≤x≤30, p+s+v+q+t+w≥2, and o+p+q+r+s+t+u+v+w+x≤1000; Preferably, the third polyorganosiloxane is selected from polyorganosiloxanes having Si—H of the following general formula (III): wherein R 14 , R 15 , R 18 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Each is independently an alkyl group of 1 to 6 carbon atoms, q, t, u, v, w and x are 0, o+p=2, 10≤r≤200, and 10≤s≤100; a polyorganosiloxane having an alkoxy functional group of the following general formula (III): Medium R 14 , R 15 , R 18 , R 31 , R 32 , R 33 , R 34 , R 36 , R 37 , R 38 and R 39 Each is independently an alkyl group of 1 to 6 carbon atoms, R 35 and R AO is an alkoxy group having 1 to 4 carbon atoms, o, p, s, t, u, v, w and x are 0, q=2, and 10≤r≤200; or a combination thereof; More preferably, the third polyorganosiloxane is selected from the following general formula (III): wherein R 14 , R 15 , R 18 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Each is independently an alkyl group of 1 to 4 carbon atoms, q, t, u, v, w and x are 0, o+p=2, 10≤r≤100, and 10≤s≤50.

5. The organic silicon composition according to any one of claims 1 to 4, wherein the alkoxysilane has the following general formula (IV): (XR 41 ) y Si(R 42 ) z (OR 43 ) 4-(y+z) Formula (IV) in, X is an organic functional group; R 41 are each independently a divalent hydrocarbon group of 1 to 12 carbon atoms optionally containing one or more heteroatoms; R 42 Each is independently an alkyl group having 1 to 16 carbon atoms; R 43 Each is independently an alkyl group having 1 to 6 carbon atoms; subscript y is 0 or 1, subscript z is 0, 1 or 2 and y+z is 0, 1 or 2; Preferably, the alkoxysilane is selected from the following general formula (IV): wherein X is selected from the group consisting of glycidyloxy, epoxy, amino, amide, acyloxy and urea, and R 41 is an alkylene group having 3 to 12 carbon atoms, R 42 is an alkyl group having 1 to 12 carbon atoms, R 43 Each is independently an alkyl group of 1 to 4 carbon atoms, subscript y is 1, and subscript z is 0 or 1; More preferably, the alkoxysilane is selected from the following general formula (IV): wherein X is selected from glycidyloxy, epoxy, amino and amide, and R 41 is an alkylene group having 3 to 6 carbon atoms, R 43 Each is independently methoxy, ethoxy or propoxy, subscript y is 1, and subscript z is 0.

6. The organosilicon composition according to any one of claims 1 to 5, wherein the filler is selected from aluminum oxide, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, silicon carbide and silicon dioxide; preferably, the filler is selected from aluminum oxide and zinc oxide.

7. The organosilicon composition according to any one of claims 1 to 6, wherein the auxiliary additive is selected from the group consisting of: a viscosity modifier, a hydrosilylation reaction inhibitor, a wetting agent and a pigment.

8. The organosilicon composition according to claim 7, wherein the viscosity modifier is selected from silicone oils having a viscosity of 20-1000 cp at 25°C; preferably, the viscosity modifier is present in an amount of 1-10 parts by weight, based on 100 parts by weight of the total weight of the composition.

9. The organosilicon composition according to claim 7, wherein the hydrosilylation reaction inhibitor is used in combination with component (B-1) and is selected from isocyanurates and acetylenic alcohols; preferably, the inhibitor is present in an amount of 0.01-2 parts by weight, based on 100 parts by weight of the total weight of the composition.

10. The organosilicon composition according to any one of claims 1 to 9, wherein the molar ratio of Si-H of the first polyorganosiloxane to the ethylenically unsaturated groups of the second polyorganosiloxane is 0.05:1 to 0.9:1, preferably 0.1:1 to 0.8:1, and more preferably 0.15:1 to 0.7:

1.

11. The silicone composition according to any one of claims 1 to 10, wherein the silicone gel has an ethylenically unsaturated group in an amount of 0.01-0.30 mmol per 1 g of gel, preferably 0.02-0.25 mmol per 1 g of gel, and more preferably 0.05-0.20 mmol per 1 g of gel.

12. The organosilicon composition according to any one of claims 1 to 11, wherein based on 100 parts by weight of the composition, component (A) is 0.5-10 parts by weight, preferably 0.8-8 parts by weight, and more preferably 1-5 parts by weight; component (B) is 0.01-5 parts by weight, preferably 0.05-4 parts by weight, and more preferably 0.08-3 parts by weight; component (C) is 50-95 parts by weight, preferably 55-90 parts by weight, and more preferably 60-85 parts by weight; component (D) is 0-10 parts by weight, preferably 0.01-8 parts by weight, and more preferably 0.1-5 parts by weight.

13. A method for preparing the organosilicon composition according to any one of claims 1 to 12, comprising: (a) subjecting the first polyorganosiloxane to a hydrosilylation reaction with the second polyorganosiloxane in the presence of a hydrosilylation catalyst at a molar ratio of Si—H of the first polyorganosiloxane to ethylenically unsaturated groups of the second polyorganosiloxane of less than 1 to prepare a silicone gel (A); and (b) The prepared silicone gel (A) is directly blended with component (B), component (C) and optionally component (D) to prepare the silicone composition.

14. A thermal interface material comprising the organic silicon composition according to any one of claims 1 to 12.

15. A device comprising a first substrate, a second substrate, and the thermal interface material according to claim 14 bridging an interface between the first substrate and the second substrate.

16. A method for preparing the device of claim 15, comprising applying the silicone composition of any one of claims 1 to 12 to at least one of the first substrate and the second substrate.

17. A method for removing heat from a substrate comprising contacting the thermal interface material of claim 14 with the substrate.

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