Display panel and preparation method therefor

Abstract

A display panel (100) and a preparation method therefor. The preparation method comprises: providing an array substrate (10); coating a first electrode pattern layer (13) with an active group material, to form a bonding layer (21); placing the array substrate (10) in a reaction solution (40) containing a light-emitting material, so that the light-emitting material is attached to the bonding layer (21), to form a light-emitting layer (22); and manufacturing a second electrode pattern layer (23) on the light-emitting layer (22). The active group material has a first functional group (21a), and the light-emitting material has a second functional group (22b) and third functional groups (22c). In a reaction stage, the second functional group (22b) and the first functional group (21a) undergo a graft copolymerization reaction, so that the light-emitting material is attached to the bonding layer (21), and a third functional group (22c) and a third functional group (22c) undergo a polymerization reaction, to form a light-emitting layer (22) having a preset thickness (d). According to the preparation method, evaporation is not needed, the production costs can be reduced, and the utilization rate of the light-emitting material is increased.

Description

Display panel and manufacturing method thereof

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority based on Chinese patent application No. 2023111132323 filed on August 31, 2023, and all of its contents are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0004] Compared with liquid crystal display (LCD) panels, organic light emitting diode (OLED) display panels have many advantages such as full solid state, active light emission, high brightness, high contrast, ultra-thin, low power consumption, no viewing angle limitation, and wide operating temperature range, and are increasingly valued.

[0005] In the preparation process of OLED devices, the most critical and expensive process is the deposition of luminescent materials. In the existing technology, a vacuum evaporator is often used in combination with a fine metal mask (FMM) to deposit luminescent materials. However, firstly, the vacuum evaporator is expensive and there are few suppliers, making domestic production difficult to achieve; secondly, FMM is a consumable core component, and a set of masks can only be adapted to one model of display products, and it is currently impossible to mass-produce, and it is difficult to purchase high-end FMM; thirdly, the actual utilization rate of expensive luminescent materials in this process is less than 20%, and it is difficult to recycle, resulting in a large amount of material waste; therefore, there is an urgent need to find alternative solutions for the deposition of luminescent materials on substrates and a method for producing OLED display panels without FMM.

[0006] Summary of the Invention

[0007] The present application provides a display panel and a method for preparing the same, aiming to solve the problems in the prior art of high positioning accuracy requirements, high costs, and low utilization rate of light-emitting materials in the evaporation process.

[0008] In order to solve the above technical problems, the first technical solution provided by this application is to provide a method for manufacturing a display panel. The manufacturing method includes:

[0009] An array substrate is provided; the array substrate comprises a substrate, a driving circuit layer formed on one side of the substrate, and a first electrode pattern layer formed on a side of the driving circuit layer away from the substrate, wherein the first electrode pattern layer comprises first electrodes distributed in an array;

[0010] fabricating a light-emitting layer on the array substrate;

[0011] A second electrode pattern layer is formed on the light-emitting layer; the second electrode pattern layer includes second electrodes corresponding to the first electrodes one by one;

[0012] The step of manufacturing the light-emitting layer on the array substrate includes:

[0013] coating an active group material on the first electrode pattern layer to form a bonding layer;

[0014] placing the array substrate in a reaction solution containing a light-emitting material, so that the light-emitting material adheres to the bonding layer to form a light-emitting layer;

[0015] In which, the active group material has a first functional group, and the luminescent material has a second functional group and a third functional group; in the reaction stage, the second functional group and the first functional group undergo a graft copolymerization reaction, so that the luminescent material is attached to the binding layer, and the third functional group and the third functional group undergo a polymerization reaction to form the luminescent layer with a preset thickness.

[0016] The step of placing the array substrate in a reaction solution containing a light-emitting material so that the light-emitting material adheres to the bonding layer to form the light-emitting layer includes:

[0017] placing the array substrate in a first reaction solution containing a luminescent material, and adjusting a first reaction environment so that the luminescent material adheres to the bonding layer;

[0018] The array substrate is placed in a second reaction solution containing a light-emitting material, and a second reaction environment is adjusted to form the light-emitting layer with a preset thickness.

[0019] Before the step of placing the array substrate in a reaction solution containing a light-emitting material, the method further includes:

[0020] Coating a photoresist on the bonding layer, and performing exposure and development to expose a portion of the bonding layer corresponding to the first electrode;

[0021] After the step of placing the array substrate in a reaction solution containing a light-emitting material so that the light-emitting material adheres to the bonding layer to form a light-emitting layer is completed, the method further includes:

[0022] The photoresist is removed.

[0023] The light-emitting layer includes a first light-emitting layer, a second light-emitting layer and a third light-emitting layer; the preparation method includes: repeating the step of making the light-emitting layer on the array substrate to form the first light-emitting layer, the second light-emitting layer and the third light-emitting layer respectively.

[0024] In which, in repeating the step of making the light-emitting layer on the array substrate, the step of coating the active group material coating on the first electrode pattern layer is only performed once, and the orthographic projection of the bonding layer on the first electrode pattern layer covers the first electrode pattern layer.

[0025] Wherein, the preparation method further comprises:

[0026] forming an encapsulation layer on the second electrode pattern layer, and filling the gap between adjacent light-emitting layers with the encapsulation layer;

[0027] Providing a color filter substrate, wherein the color filter substrate at least includes a black matrix;

[0028] The color filter substrate is bonded to the array substrate.

[0029] In order to solve the above technical problems, the second technical solution provided by this application is to provide a display panel. The display panel includes:

[0030] A driving substrate comprising a substrate, a driving circuit layer disposed on one side of the substrate, and a first electrode pattern layer disposed on a side of the driving circuit layer away from the substrate, wherein the first electrode pattern layer comprises first electrodes distributed in an array;

[0031] a light-emitting layer, disposed on a side of the first electrode pattern layer away from the substrate;

[0032] a second electrode pattern layer, disposed on a side of the light-emitting layer away from the first electrode pattern layer, the second electrode pattern layer comprising a plurality of second electrodes corresponding one-to-one to the first electrodes;

[0033] In which, the display panel also includes a bonding layer, which is arranged between the first electrode pattern layer and the light-emitting layer; in which, the bonding layer includes an active group material, and the active group material has a first functional group; the light-emitting layer includes a light-emitting material, and the light-emitting material has a second functional group and a third functional group; the first functional group is grafted with the second functional group so that the light-emitting layer is attached to the bonding layer; the third functional group is polymerized with the third functional group so that the light-emitting material forms the light-emitting layer with a preset thickness.

[0034] Wherein, the luminescent material is an organic luminescent material and / or an inorganic luminescent material; wherein, the organic luminescent material has the second functional group and the third functional group; wherein, the inorganic luminescent material includes an inorganic core and an organic shell layer wrapped on the inorganic core, and the organic shell layer has the second functional group and the third functional group.

[0035] Among them, the display panel also includes an encapsulation layer and a color filter layer. The encapsulation layer is arranged on the side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers. The color filter layer is arranged on the side of the encapsulation layer away from the second electrode pattern layer.

[0036] In which, the light-emitting layer includes a first light-emitting layer, a second light-emitting layer and a third light-emitting layer of different colors, and the first light-emitting layer, the second light-emitting layer and the third light-emitting layer are arranged in a preset order; the display panel also includes an encapsulation layer, which is arranged on the side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers.

[0037] Beneficial effects of the present application: Different from the prior art, the present application provides a display panel and a preparation method thereof, wherein the preparation method forms a bonding layer by coating an active group material on the first electrode pattern layer of an array substrate, and then adopts a wet process to place the array substrate in a reaction solution containing a light-emitting material so that the light-emitting material adheres to the bonding layer to form a light-emitting layer. The light-emitting material can be formed into a film without using expensive equipment and materials such as a fine metal mask (FMM) and a vacuum evaporator, thereby effectively reducing production costs and improving product competitiveness. Specifically, the active group material has a first functional group, and the light-emitting material has a second functional group and a third functional group. After the array substrate is placed in the reaction solution, the light-emitting material and the active group of the bonding layer undergo a polymerization reaction. In the reaction stage, the second functional group undergoes a graft copolymerization reaction with the first functional group, so that the light-emitting material adheres to the bonding layer. The light-emitting material molecules and the third functional group undergo polymerization reactions, so that the light-emitting material molecules "agglomerate" to form a film layer with a preset thickness, i.e., a light-emitting layer. Moreover, the wet process film formation method greatly improves the utilization rate of the light-emitting material and avoids material waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0039] FIG1 is a schematic flow chart of a method for manufacturing a display panel according to a first embodiment of the present application;

[0040] FIG2 is a schematic structural diagram of a display panel provided in the first embodiment of the present application;

[0041] FIG3 is a schematic flow chart of a method for preparing a light-emitting layer according to an embodiment of the present application;

[0042] FIG4 is a schematic diagram of a process flow for preparing a light-emitting layer according to an embodiment of the present application;

[0043] FIG5 is a schematic structural diagram of a first state of an array substrate provided by an embodiment of the present application placed in a reaction liquid;

[0044] FIG6 is a schematic structural diagram of a second state of an array substrate provided in an embodiment of the present application, wherein the array substrate is placed in a reaction liquid;

[0045] FIG7 is a schematic diagram of a flow chart of step S22 provided in one embodiment of the present application;

[0046] FIG8 is a schematic flow chart of a method for manufacturing a display panel according to a second embodiment of the present application;

[0047] FIG9 is a schematic flow chart of a method for manufacturing a display panel according to a third embodiment of the present application;

[0048] FIG10 is a process flow chart of the preparation method of the light-emitting layer provided in FIG9 ;

[0049] FIG11 is a schematic structural diagram of a display panel manufactured by the manufacturing method provided in FIG9 .

[0050] Reference numerals:

[0051] 100-display panel; 10-array substrate; 11-substrate; 12-driving circuit layer; 13-first electrode pattern layer; 131-first electrode; 20-light-emitting unit; 21-binding layer; 21a-first functional group; 22-light-emitting layer; 221-first light-emitting layer; 222-second light-emitting layer; 223-third light-emitting layer; 22a-inorganic core; 22s-organic shell; 22b-second functional group; 22c-third functional group; 23-second Electrode pattern layer; 231-second electrode; 24-encapsulation layer; 251-first light-emitting unit; 252-second light-emitting unit; 253-third light-emitting unit; 30-color filter substrate; 31-black matrix; 311-pixel opening; 32-color filter layer; 321-first color resist layer; 322-second color resist layer; 323-third color resist layer; 40-reaction solution; 41-first reaction solution; 42-second reaction solution; PR-photoresist; d-preset thickness. DETAILED DESCRIPTION

[0052] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0053] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0054] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0056] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0057] The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0058] Please refer to Figures 1 and 2. Figure 1 is a schematic flow chart of a method for manufacturing a display panel according to a first embodiment of the present application, and Figure 2 is a schematic structural diagram of a display panel according to a first embodiment of the present application. In this embodiment, a method for manufacturing a display panel 100 is provided. The method is specifically used to manufacture an OLED display panel 100. The method specifically includes:

[0059] S10: providing an array substrate 10; the array substrate 10 includes a substrate 11, a driving circuit layer 12 formed on one side of the substrate 11, and a first electrode pattern layer 13 formed on a side of the driving circuit layer 12 away from the substrate 11, the first electrode pattern layer 13 including first electrodes 131 distributed in an array;

[0060] S20: forming a light emitting layer 22 on the array substrate 10;

[0061] S30 : forming a second electrode pattern layer 23 on the light emitting layer 22 ; the second electrode pattern layer 23 includes second electrodes 231 corresponding to the first electrodes 131 on a one-to-one basis.

[0062] As shown in FIG2 , the array substrate 10 provided in step S10 includes a substrate 11, a drive circuit layer 12, and a first electrode pattern layer 13. The drive circuit layer 12 is disposed on one side of the substrate 11 and is used to provide drive signals to the light-emitting units 20. Specifically, the drive circuit layer 12 includes a plurality of pixel drive circuits distributed in an array, each of which is used to provide a drive signal to a corresponding light-emitting unit 20. The first electrode pattern layer 13 includes a plurality of first electrodes 131 distributed in an array. The first electrodes 131 are disposed in a one-to-one correspondence with the pixel drive circuits and are electrically connected.

[0063] In which, through step S20, a light-emitting layer 22 is formed on the first electrode pattern layer 13, and a light-emitting layer 22 is formed on each first electrode 131. Through step S30, a second electrode pattern layer 23 is produced on the light-emitting layer 22. The second electrode pattern layer 23 includes a plurality of second electrodes 231. The second electrodes 231 are arranged in a one-to-one correspondence with the first electrodes 131, so that the light-emitting layer 22 is located between the first electrodes 131 and the second electrodes 231, thereby forming a light-emitting unit 20. The second electrodes 231 are electrically connected to the driving circuit layer 12 so that the light-emitting unit 20 can receive a driving signal and emit light. Specifically, the first electrode 131 and the second electrode 231 are respectively an anode and a cathode. Typically, the first electrode 131 is an anode and the second electrode 231 is a cathode. Alternatively, as needed, the first electrode 131 can also be set as a cathode and the second electrode 231 as an anode.

[0064] Please refer to Figures 3 and 4. Figure 3 is a schematic flow chart of the method for preparing the light-emitting layer 22 provided in one embodiment of the present application, and Figure 4 is a schematic flow chart of the process for preparing the light-emitting layer 22 provided in one embodiment of the present application. Specifically, step S20 uses a wet film forming process to achieve FMM-free production, eliminating the need for expensive equipment and materials such as FMM and vacuum evaporation machines, thereby reducing production costs and improving product competitiveness. Step S20 includes:

[0065] S21: coating an active group material on the first electrode pattern layer 13 to form a bonding layer 21;

[0066] S22 : placing the array substrate 10 in a reaction solution 40 containing a light-emitting material, so that the light-emitting material adheres to the bonding layer 21 to form a light-emitting layer 22 .

[0067] Please refer to Figures 5 and 6. Figure 5 is a schematic diagram of the structure of the array substrate 10 according to one embodiment of the present application, placed in a reaction solution 40 in a first state. Figure 6 is a schematic diagram of the structure of the array substrate 10 according to one embodiment of the present application, placed in a reaction solution 40 in a second state. Specifically, the active group material has a first functional group 21a, i.e., the active group material molecules have the first functional group 21a, and the active group material forms a bonding layer 21 on the first electrode pattern layer 13; the luminescent material has a second functional group 22b and a third functional group 22c, i.e., the luminescent material molecules have the second functional group 22b and the third functional group 22c. Among them, as shown in Figure 5, under a specific chemical environment, a grafting copolymerization reaction can occur between the first functional group 21a and the second functional group 22b of the active group material and the luminescent material, so that the active group molecules and the luminescent material molecules are combined together through the grafting of the first functional group 21a and the second functional group 22b; as shown in Figure 6, under another specific chemical environment, a polymerization reaction can occur between the third functional group 22c and the third functional group 22c between the molecules in the luminescent material molecules, so that the luminescent material molecules are combined together through the polymerization of the third functional group 22c between the molecules.

[0068] Specifically, the active group material can be a chemical group material containing an s-triazine structure. The luminescent material can include an organic luminescent material and / or an inorganic luminescent material; wherein the organic luminescent material has a second functional group 22b and a third functional group 22c. For example, the organic material can be selectively grafted with the second functional group 22b and the third functional group 22c by chemical modification. The second functional group 22b can be a hydroxyl group, an amino group, or other functional group that can undergo graft copolymerization reaction with the first functional group 21a. The third functional group 22c can be a double bond, an acid / alcohol carbonyl group, or other functional group that can undergo polymerization reaction. The specific configuration can be based on actual needs. The above-mentioned functional groups in this application are merely exemplary and can be selected based on actual needs without limitation thereto. The inorganic luminescent material includes an inorganic core 22a and an organic shell 22s wrapped around the inorganic core 22a. The organic shell 22s is grafted with appropriate second functional groups 22b and third functional groups 22c by chemical modification.

[0069] In which, in step S22, the array substrate 10 is placed in a reaction liquid 40 containing a light-emitting material, and the first functional group 21a of the active group material and the second functional group 22b of the light-emitting material are firmly bonded together through a graft copolymerization reaction, so that the light-emitting material can be firmly attached to the binding layer 21; further, the third functional group 22c of the light-emitting material undergoes a polymerization reaction and bonds together, so that the light-emitting materials can be firmly combined together, thereby forming a light-emitting layer 22 with a preset thickness d.

[0070] Through the above-mentioned preparation method, it is first possible to form a film of the luminescent material through a wet chemical reaction method without using FMM, vacuum evaporation machines and other expensive equipment and materials, thereby greatly reducing the production cost, and the light-emitting layer 22 is more firmly bonded to the array substrate 10 and is not easy to fall off; and through this wet film-forming method, it is not necessary to produce the pixel defining layer PDL and the spacer PS on the array substrate 10, which can save the front-end process of PDL and PS, and further reduce the production material cost and process time. At the same time, through the above-mentioned wet film-forming method, the utilization rate of the luminescent material can be greatly improved, and waste can be reduced while also reducing environmental pollution. Furthermore, as the reaction of the reaction liquid 40 containing the luminescent material continues, after the concentration of the reaction liquid 40 decreases, it is only necessary to replenish the luminescent material in a timely manner, without the need to discard the reaction liquid 40 as a whole, further reducing waste and improving the utilization rate of the luminescent material. Moreover, since no vapor deposition is required, the spacing between the first electrodes 131 only needs to meet the machine limit, key dimension deviation and fitting accuracy, which can effectively improve the pixel aperture ratio of the display panel 100 and expand the film forming area of ​​the light-emitting material; it can be understood that the spacing between the light-emitting layers 22 of different colors is no longer limited by the vapor deposition gray area, and the spacing between adjacent first electrodes 131 is reduced, thereby significantly improving the display resolution and enhancing the display effect.

[0071] Please refer to Figure 7, which is a flow chart of step S22 provided in one embodiment of the present application. In this embodiment, the above step S22 specifically includes:

[0072] S221: placing the array substrate 10 in a first reaction solution 41 containing a light-emitting material, and adjusting a first reaction environment so that the light-emitting material adheres to the bonding layer 21;

[0073] S222: placing the array substrate 10 in a second reaction solution 42 containing a light-emitting material, and adjusting a second reaction environment to form a light-emitting layer 22 with a preset thickness d.

[0074] In this embodiment, the array substrate 10 is first placed in a first reaction solution 41 containing a luminescent material. The concentration of the luminescent material in the first reaction solution 41 can be set according to production requirements. The first reaction environment is adjusted to enable the luminescent material to undergo a graft copolymerization reaction with the active group material. After the surface of the bonding layer 21 is evenly covered with a layer of luminescent material, the array substrate 10 is removed and placed in a second reaction solution 42 containing the luminescent material. The concentration of the luminescent material in the second reaction solution 42 is also set according to production requirements. The second reaction environment is adjusted to enable polymerization of the third functional group 22c on the luminescent material. The reaction time is controlled until the film thickness of the luminescent material on the bonding layer 21 reaches a predetermined thickness d. The array substrate 10 is then removed and the next process is carried out. Specifically, the thickness of the luminescent layer 22 can be controlled by controlling the reaction time, and the reaction rate can be controlled by controlling the reaction conditions.

[0075] Specifically, please refer to FIG8 , which is a schematic flow chart of a method for manufacturing a display panel 100 according to a second embodiment of the present application. In this embodiment, the method for manufacturing the display panel 100 specifically includes the following steps:

[0076] S10: providing an array substrate 10;

[0077] S211: coating an active group material on the first electrode pattern layer 13 to form a bonding layer 21;

[0078] S212: coating a photoresist PR on the bonding layer 21, and performing exposure and development to expose a portion of the bonding layer 21 corresponding to the first electrode 131;

[0079] S221: placing the array substrate 10 in a first reaction solution 41 containing a light-emitting material, and adjusting a first reaction environment so that the light-emitting material adheres to the bonding layer 21;

[0080] S222: placing the array substrate 10 in a second reaction solution 42 containing a light-emitting material, and adjusting a second reaction environment to form a light-emitting layer 22 having a preset thickness d;

[0081] S223: removing the photoresist PR;

[0082] S30: forming a second electrode pattern layer 23 on the light-emitting layer 22; the second electrode pattern layer 23 includes second electrodes 231 corresponding to the first electrodes 131 one by one;

[0083] S40: forming an encapsulation layer 24 on the second electrode pattern layer 23 and filling the gap between adjacent light-emitting layers 22 with the encapsulation layer 24;

[0084] S50: providing a color filter substrate 30, wherein the color filter substrate 30 at least includes a black matrix 31;

[0085] S60 : Laminating the color filter substrate 30 to the array substrate 10 .

[0086] Specifically, in this embodiment, after step S211, a photoresist PR is first coated on the bonding layer 21, and is exposed and developed through a mask to expose the portion of the bonding layer 21 corresponding to the first electrode 131; then, steps S221 and S222 are performed to form a light-emitting layer 22 with a preset thickness d on the bonding layer 21 in the area corresponding to the first electrode 131, and then the photoresist PR is removed, and a second electrode pattern layer 23 is formed on the light-emitting layer 22 to form light-emitting units 20 distributed in an array manner on the array substrate 10; in this embodiment, the light-emitting material can be a white light-emitting material, and the light-emitting color of the formed light-emitting units 20 is white; through step S40, an encapsulation layer 24 is formed on the light-emitting units 20, and the encapsulation layer 24 is filled in the gap between adjacent light-emitting units 20, thereby encapsulating the light-emitting units 20 to prevent the intrusion of external water, oxygen, etc. from affecting the light-emitting units 20 and shortening the life of the display panel 100; and the color filter substrate 30 is attached to the encapsulation layer 24 to form the display panel 100. Among them, the color filter substrate 30 includes a black matrix 31 and a color filter layer 32. The black matrix 31 is formed with a plurality of pixel openings 311. The pixel openings 311 are arranged corresponding to the light-emitting units 20. The color filter layer 32 is arranged in the pixel openings 311. The color filter layer 32 includes a first color resist layer 321, a second color resist layer 322 and a third color resist layer 323, thereby realizing color display.

[0087] In this embodiment, the light-emitting layer 22 is formed by a wet film-forming method without the need for evaporation, which not only reduces production costs but also reduces waste of light-emitting materials, greatly improves the utilization rate of light-emitting materials, and eliminates the front-end processes of PDL and PS, greatly reducing the process time, that is, the production material cost. In addition, the spacing between the light-emitting units 20 is no longer affected by the evaporation gray area, so that the spacing is reduced, which can improve the pixel aperture ratio and display resolution.

[0088] Specifically, please refer to Figures 9-11. Figure 9 is a schematic flow chart of a method for manufacturing a display panel 100 according to a third embodiment of the present application. Figure 10 is a process flow chart of preparing a light-emitting layer according to the method shown in Figure 9. Figure 11 is a schematic structural diagram of the display panel 100 manufactured by the method shown in Figure 9. In this embodiment, the method for manufacturing the display panel 100 specifically includes the following steps:

[0089] S10: providing an array substrate 10;

[0090] S211 : coating an active group material on the first electrode pattern layer 13 to form a bonding layer 21 .

[0091] S212: coating a photoresist PR on the bonding layer 21, and performing exposure and development to expose a portion of the bonding layer 21 corresponding to the pixel design area;

[0092] S221: placing the array substrate 10 in a first reaction solution 41 containing a light-emitting material, and adjusting a first reaction environment so that the light-emitting material adheres to the bonding layer 21;

[0093] S222 : placing the array substrate 10 in a second reaction solution 42 containing a light-emitting material, and adjusting a second reaction environment to form a first light-emitting layer 221 with a preset thickness d.

[0094] S223: removing the photoresist PR;

[0095] S224: repeating steps S212, S221, S222 and S223 twice to form a second light emitting layer 222 and a third light emitting layer 223 having a preset thickness d, respectively;

[0096] S30: forming a second electrode pattern layer 23 on the light-emitting layer 22; the second electrode pattern layer 23 includes second electrodes 231 corresponding to the first electrodes 131 one by one;

[0097] S40: forming an encapsulation layer 24 on the second electrode pattern layer 23 and filling the gap between adjacent light-emitting layers 22 with the encapsulation layer 24;

[0098] S50: providing a color filter substrate 30, wherein the color filter substrate 30 at least includes a black matrix 31;

[0099] S60 : Laminating the color filter substrate 30 to the array substrate 10 .

[0100] Unlike the second embodiment, in this embodiment, three wet film-forming processes are performed to form the first, second, and third light-emitting layers 221, 222, and 223 of different colors on the drive substrate. This results in the formation of first, second, and third light-emitting units 251, 252, and 253 of different colors after step S30, enabling color display on the display panel 100. Therefore, in this embodiment, the color filter substrate 30 may include only the black matrix 31, eliminating the need for the color filter layer 32. The black matrix 31 can be used to prevent cross-coloring between adjacent light-emitting units 20, thereby improving the contrast of the display panel 100. Of course, in other embodiments, the black matrix 31 may not be provided; the specific provision can be based on actual needs. Furthermore, in the process of forming the first, second, and third light-emitting layers 221, 222, and 223, only step 211 needs to be performed once, and the orthographic projection of the bonding layer 21 on the first electrode pattern layer 13 covers the first electrode pattern layer 13, thereby connecting the light-emitting material to the first electrode 131.

[0101] It can be understood that in the process of forming the first light-emitting layer 221, in step S212, the photoresist PR is exposed and developed through a mask, exposing the bonding layer 21 in the designed area of ​​the first light-emitting unit 251. Therefore, after steps S221 and S222, the first light-emitting layer 221 is formed in the designed area of ​​the first light-emitting unit 251. The light-emitting material in the first reaction solution 41 and the second reaction solution 42 in steps S221 and S222 is a light-emitting material of the first color. In the process of forming the second light-emitting layer 222, in step S212, the photoresist PR is exposed and developed through a mask, exposing the bonding layer 21 in the designed area of ​​the second light-emitting unit 252. Therefore, after steps S221 and S222, the second light-emitting layer 222 is formed in the designed area of ​​the second light-emitting unit 252. The light-emitting material in the first reaction solution 41 and the second reaction solution 42 in steps S221 and S222 is a light-emitting material of the second color. In the process of forming the third light-emitting layer 223, in step S212, the photoresist PR is exposed and developed through the mask plate, so that the bonding layer 21 of the designed area of ​​the third light-emitting unit 253 is exposed, so that after steps S221 and S222, the second light-emitting layer 222 is formed in the designed area of ​​the third light-emitting unit 253, and the light-emitting materials in the first reaction solution 41 and the second reaction solution 42 in steps S221 and S222 are light-emitting materials of the third color.

[0102] In this embodiment, the display panel 100 is manufactured by a wet film-forming process, and evaporation is not required. Therefore, the spacing between the first electrodes 131 only needs to meet the machine limit, key dimension deviation, and fitting accuracy. This reduces the spacing between the first electrodes 131, thereby increasing the area of ​​the first electrodes 131, and further increasing the area of ​​the light-emitting layer 22, effectively improving the pixel aperture ratio. Moreover, the spacing between different light-emitting layers 22 is no longer limited by the evaporation process, so that the spacing between adjacent light-emitting units 20 is reduced, which can significantly improve the display resolution and enhance the display effect.

[0103] It should be noted that the display panel 100 and its preparation method provided in the above embodiment, the structure of the display panel 100 can be changed, for example, a hole transport layer, an electron blocking layer and other film layers can be added on the first electrode 131, and these film layers can be formed by the above-mentioned wet film forming process; at the same time, the active group material is used to connect the light-emitting material and the underlying material (the first electrode 131), and can be a single layer or a multi-layer structure, as long as the purpose of connecting the light-emitting material and the underlying material is achieved; the polymerization reaction of the light-emitting material is to make the light-emitting layer 22 reach a preset thickness d, whether it is a polymerization reaction or other types of chemical reactions of light-emitting material pieces, such as electrostatic attraction, functional group shrinkage reaction between light-emitting material molecules, etc., as long as the light-emitting material can be polymerized and grown to the preset thickness d. In the above embodiment, the process sequence of the first light-emitting layer 221, the second light-emitting layer 222 and the third light-emitting layer 223 is adjustable, and can be set according to actual production needs.

[0104] The above is only an implementation method of the present application and does not limit the scope of patent protection of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the scope of patent protection of the present application.

Claims

1. A method for preparing a display panel, comprising: Providing an array substrate; The array substrate comprises a substrate, a driving circuit layer formed on one side of the substrate, and a first electrode pattern layer formed on a side of the driving circuit layer away from the substrate, wherein the first electrode pattern layer comprises first electrodes distributed in an array; Manufacturing a light-emitting layer on the array substrate; A second electrode pattern layer is formed on the light-emitting layer; the second electrode pattern layer includes second electrodes corresponding to the first electrodes one by one; Wherein, the step of manufacturing the light-emitting layer on the array substrate comprises: coating an active group material on the first electrode pattern layer to form a bonding layer; Placing the array substrate in a reaction solution containing a light-emitting material so that the light-emitting material adheres to the bonding layer to form a light-emitting layer; Among them, the active group material has a first functional group, and the luminescent material has a second functional group and a third functional group; in the reaction stage, the second functional group and the first functional group undergo a graft copolymerization reaction so that the luminescent material is attached to the binding layer, and the third functional group and the third functional group undergo a polymerization reaction to form the luminescent layer with a preset thickness.

2. The preparation method according to claim 1, wherein The active group material is a chemical group material containing a triazine structure; the second functional group is a hydroxyl group or an amino group; and the third functional group is a double bond or an acid / alcohol carbonyl group.

3. The preparation method according to claim 1, wherein The step of placing the array substrate in a reaction solution containing a light-emitting material so that the light-emitting material adheres to the bonding layer to form a light-emitting layer comprises: Placing the array substrate in a first reaction solution containing a light-emitting material, and adjusting a first reaction environment so that the light-emitting material adheres to the bonding layer; The array substrate is placed in a second reaction solution containing a light-emitting material, and a second reaction environment is adjusted to form the light-emitting layer with a preset thickness.

4. The preparation method according to claim 3, wherein In the step of placing the array substrate in a second reaction solution containing a light-emitting material and adjusting a second reaction environment to form the light-emitting layer with a preset thickness, the thickness of the light-emitting layer is regulated by controlling the reaction time, and the reaction rate is controlled by controlling the reaction condition parameters.

5. The preparation method according to claim 1, wherein Before the step of placing the array substrate in a reaction solution containing a light-emitting material, the method further includes: Coating a photoresist on the bonding layer, and performing exposure and development to expose a portion of the bonding layer corresponding to the first electrode; After the step of placing the array substrate in a reaction solution containing a light-emitting material so that the light-emitting material adheres to the bonding layer to form a light-emitting layer is completed, the method further includes: The photoresist is removed.

6. The preparation method according to claim 1, wherein The light-emitting layer includes a first light-emitting layer, a second light-emitting layer and a third light-emitting layer; the preparation method includes: repeating the step of making the light-emitting layer on the array substrate to form the first light-emitting layer, the second light-emitting layer and the third light-emitting layer respectively.

7. The preparation method according to claim 6, wherein: The first light-emitting layer and the corresponding first electrode and the second electrode constitute a first light-emitting unit; the second light-emitting layer and the corresponding first electrode and the second electrode constitute a second light-emitting unit; the third light-emitting layer and the corresponding first electrode and the second electrode constitute a third light-emitting unit; In the step of forming the first light-emitting layer, a photoresist is coated on the bonding layer, and exposure and development are performed so that the bonding layer in the designed area of ​​the first light-emitting unit is exposed; In the step of forming the second light-emitting layer, a photoresist is coated on the bonding layer, and exposure and development are performed so that the bonding layer in the designed area of ​​the second light-emitting unit is exposed; In the step of forming the third light-emitting layer, a photoresist is coated on the bonding layer, and exposure and development are performed so that the bonding layer in the designed area of ​​the third light-emitting unit is exposed.

8. The preparation method according to claim 6, wherein: In repeating the step of making the light-emitting layer on the array substrate, the step of coating the active group material coating on the first electrode pattern layer is performed only once, and the orthographic projection of the bonding layer on the first electrode pattern layer covers the first electrode pattern layer.

9. The preparation method according to claim 6, wherein: In the step of repeating the step of manufacturing the light-emitting layer on the array substrate to respectively form the first light-emitting layer, the second light-emitting layer and the third light-emitting layer, the order of the step of forming the first light-emitting layer, the step of forming the second light-emitting layer and the step of forming the third light-emitting layer is adjustable.

10. The preparation method according to claim 1, wherein: The preparation method further comprises: Making a packaging layer on the second electrode pattern layer, and filling the packaging layer in the gap between adjacent light-emitting layers; Providing a color filter substrate, wherein the color filter substrate at least includes a black matrix; The color filter substrate is laminated to the array substrate.

11. The preparation method according to claim 1, wherein: In the step of forming the first electrode pattern layer, the spacing between adjacent first electrodes meets the machine limit, critical dimension deviation and fitting accuracy.

12. The preparation method according to claim 1, wherein: The luminescent material also forms the luminescent layer with a preset thickness through molecular electrostatic attraction or functional group shrinkage reaction between molecules.

13. A display panel, comprising: A driving substrate, comprising a substrate, a driving circuit layer arranged on one side of the substrate, and a first electrode pattern layer arranged on a side of the driving circuit layer away from the substrate, wherein the first electrode pattern layer comprises first electrodes distributed in an array; A light-emitting layer is arranged on a side of the first electrode pattern layer away from the substrate; A second electrode pattern layer is arranged on a side of the light-emitting layer away from the first electrode pattern layer, and the second electrode pattern layer includes a plurality of second electrodes corresponding to the first electrodes one by one; Wherein, the display panel also includes a bonding layer, which is arranged between the first electrode pattern layer and the light-emitting layer; wherein the bonding layer includes an active group material, and the active group material has a first functional group; the light-emitting layer includes a light-emitting material, and the light-emitting material has a second functional group and a third functional group; the first functional group is grafted with the second functional group so that the light-emitting layer is attached to the bonding layer; the third functional group is polymerized with the third functional group so that the light-emitting material forms the light-emitting layer with a preset thickness.

14. The display panel according to claim 13, wherein: The luminescent material is an organic luminescent material and / or an inorganic luminescent material; wherein, The organic light-emitting material has the second functional group and the third functional group; The inorganic luminescent material comprises an inorganic core and an organic shell layer wrapped around the inorganic core, and the organic shell layer has the second functional group and the third functional group.

15. The display panel according to claim 13, wherein: The display panel further includes an encapsulation layer and a color filter layer. The encapsulation layer is arranged on a side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers. The color filter layer is arranged on a side of the encapsulation layer away from the second electrode pattern layer.

16. The display panel according to claim 15, wherein: The display panel also includes a color filter substrate adhered to the encapsulation layer, the color filter substrate includes a black matrix and the color filter layer, the black matrix is ​​formed with a plurality of pixel openings, the pixel openings are arranged corresponding to the light-emitting units, and the color filter layer is arranged in the pixel openings; the color filter layer includes a first color resist layer, a second color resist layer and a third color resist layer of different colors.

17. The display panel according to claim 13, wherein: The light-emitting layer includes a first light-emitting layer, a second light-emitting layer and a third light-emitting layer of different colors, and the first light-emitting layer, the second light-emitting layer and the third light-emitting layer are arranged in a preset order; the display panel also includes an encapsulation layer, which is arranged on a side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers.

18. The display panel according to claim 17, wherein: The display panel further includes a color film substrate attached to the encapsulation layer, the color film substrate only includes a black matrix, the black matrix is ​​formed with a plurality of pixel openings, and the pixel openings are arranged corresponding to the light-emitting units.

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