Electronic device comprising housing having protruding area

Abstract

This electronic device may comprise: a housing having an annular structure made of a conductive material; and a substrate arranged to face the inner circumferential surface of the housing to be spaced apart from the inner circumferential surface of the housing. In an embodiment, the housing may include a protruding area which is formed to protrude toward the substrate and is electrically connected to the substrate. Various other embodiments are possible.

Description

An electronic device comprising a housing having a protruding area.

[0001] Various embodiments disclosed in this document relate to an electronic device including a housing having a protruding area.

[0002] With the advancement of wireless communication technology, electronic devices utilizing wireless communication are becoming more widespread. Since the commercialization of communication systems for wireless communication devices, wireless communication technology has been utilized and developed in a variety of fields. Wireless communication devices can be portable electronic devices, such as smartphones, or wearable devices worn by users.

[0003] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0004] An electronic device according to one embodiment may include a housing having an annular structure made of a conductive material and a substrate spaced apart from and facing an inner surface of the housing. In one embodiment, the housing may include a protruding region formed to protrude toward the substrate and electrically connected to the substrate.

[0005] Additionally, an electronic device according to one embodiment of the present document may include a housing made of a conductive material, a substrate disposed spaced apart from the housing, and a molding member filled between the housing and the substrate. In one embodiment, the housing may include a protruding region formed to protrude toward the substrate through the molding member and electrically connected to the substrate.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] Figure 2 is a block diagram of an antenna module of an electronic device according to various embodiments.

[0008] FIG. 3A is a perspective view of an electronic device according to one embodiment.

[0009] FIG. 3b is a perspective view of an electronic device according to one embodiment.

[0010] FIG. 3c is a schematic diagram of a cross-section of an electronic device according to one embodiment.

[0011] FIG. 4A is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 4b is a cross-sectional view of an electronic device according to one embodiment.

[0013] FIG. 5A is an exploded perspective view of an electronic device according to one embodiment.

[0014] FIG. 5b is a cross-sectional view of an electronic device according to one embodiment.

[0015] FIG. 6A is a perspective view of an electronic device according to one embodiment.

[0016] FIG. 6b is a cross-sectional view of an electronic device according to one embodiment.

[0017] FIG. 7A is an exploded perspective view of an electronic device according to one embodiment.

[0018] FIG. 7b is a cross-sectional view of an electronic device according to one embodiment.

[0019] FIG. 8A is an exploded perspective view of an electronic device according to one embodiment.

[0020] FIG. 8b is a cross-sectional view of an electronic device according to one embodiment.

[0021] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0022] The various embodiments and terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0023] The term "module" used in various embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0024] Various embodiments may be implemented as software (e.g., a program (120)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device). For example, a processor of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0025] According to one embodiment, the method according to the various embodiments disclosed in the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0026] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0027] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) and the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0028] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0029] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0030] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0035] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0036] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0040] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0045] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first mixing surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second mixing surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0050] FIG. 2 is a block diagram (200) of a wireless communication module (192), a power management module (188), and an antenna module (197) of an electronic device according to various embodiments.

[0051] Referring to FIG. 2, the wireless communication module (192) may include an MST communication module (210) or an NFC communication module (230), and the power management module (188) may include a wireless charging module (250). In this case, the antenna module (197) may include a plurality of antennas, including an MST antenna (297-1) connected to the MST communication module (210), an NFC antenna (297-3) connected to the NFC communication module (230), and a wireless charging antenna (297-5) connected to the wireless charging module (250). For convenience of explanation, components overlapping with those in FIG. 1 are omitted or briefly described.

[0052] The MST communication module (210) can receive a signal including control information or payment information such as card information from the processor (120), generate a magnetic signal corresponding to the received signal through the MST antenna (297-1), and then transmit the generated magnetic signal to an external electronic device (102) (e.g., a POS device). In order to generate the magnetic signal, according to one embodiment, the MST communication module (210) includes a switching module (not shown) including one or more switches connected to the MST antenna (297-1), and can control the switching module to change the direction of a voltage or current supplied to the MST antenna (297-1) according to the received signal. The change in the direction of the voltage or current enables the direction of the magnetic signal (e.g., a magnetic field) transmitted through the MST antenna (297-1) to change accordingly. A magnetic signal in a state of changing direction, when detected by an external electronic device (102), may cause an effect (e.g., waveform) similar to a magnetic field generated when a magnetic card corresponding to the received signal (e.g., card information) is read (swiped) by a card reader of the electronic device (102). According to one embodiment, payment-related information and control signals received in the form of the magnetic signal by the electronic device (102) may be transmitted to an external server (108) (e.g., payment server) via, for example, a second network (199).

[0053] The NFC communication module (230) can obtain a signal including control information or payment information such as card information from the processor (120) and transmit the obtained signal to an external electronic device (102) via the NFC antenna (297-3). According to one embodiment, the NFC communication module (230) can receive such a signal transmitted from an external electronic device (102) via the NFC antenna (297-3).

[0054] The wireless charging module (250) can wirelessly transmit power to an external electronic device (102) (e.g., a mobile phone or a wearable device) via a wireless charging antenna (297-5), or wirelessly receive power from an external electronic device (102) (e.g., a wireless charging device). The wireless charging module (250) can support one or more of various wireless charging methods, including, for example, a magnetic resonance method or a magnetic induction method.

[0055] In one embodiment, some of the MST antenna (297-1), the NFC antenna (297-3), or the wireless charging antenna (297-5) may share at least a portion of a radiating portion with each other. For example, the radiating portion of the MST antenna (297-1) may be used as the radiating portion of the NFC antenna (297-3) or the wireless charging antenna (297-5), or vice versa. In this case, the antenna module (297) may include a switching circuit (not shown) configured to selectively connect (e.g., close) or disconnect (e.g., open) at least a portion of the antennas (297-1, 297-3, or 297-3) under the control of the wireless communication module (192) (e.g., the MST communication module (210) or the NFC communication module (230)) or the power management module (188) (e.g., the wireless charging module (250)). For example, when the electronic device (101) uses a wireless charging function, the NFC communication module (230) or the wireless charging module (250) can temporarily separate at least a portion of the radiation portion shared by the NFC antenna (297-3) and the wireless charging antenna (297-5) from the NFC antenna (297-3) and connect it to the wireless charging antenna (297-5) by controlling the switching circuit.

[0056] According to one embodiment, at least one function of the MST communication module (210), the NFC communication module (230), or the wireless charging module (250) may be controlled by an external processor (e.g., the processor (120)). According to one embodiment, designated functions (e.g., a payment function) of the MST communication module (210) or the NFC communication module (230) may be performed in a trusted execution environment (TEE). The trusted execution environment (TEE) according to various embodiments may form an execution environment in which at least a portion of a designated area of ​​the memory (130) is allocated to perform a function requiring a relatively high level of security (e.g., a financial transaction or a personal information-related function). In this case, access to the designated area may be permitted in a restricted manner, for example, depending on the subject accessing it or the application running in the trusted execution environment.

[0057] FIG. 3a is a perspective view of an electronic device (300) according to one embodiment, FIG. 3b is a perspective view of an electronic device (300) according to one embodiment, and FIG. 3c is a schematic diagram of a cross-section of an electronic device (300) according to one embodiment.

[0058] Specifically, FIG. 3b is a perspective view of the electronic device (300) of FIG. 3a without the molding member (330), and FIG. 3c is a drawing illustrating a schematic structure of the electronic device (300) according to one embodiment.

[0059] Referring to FIGS. 3A, 3B, and 3C, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include at least a portion of a housing (310), a molding member (330), a battery (340), and a substrate (350).

[0060] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (300), some components and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the embodiments described above may be combined in the electronic device (300) unless it is technically clearly impossible.

[0061] In one embodiment, the electronic device (300) may be a wearable device that can be worn on the user's body. For example, the electronic device (300) may be wearable on the user's finger, wrist, or arm. The electronic device (300) may be a smart ring, a smart bracelet, or a smart armlet.

[0062] Hereinafter, an electronic device (300) according to various embodiments of the present document will be described, using as an example an electronic device (300) that is a smart ring wearable on a user's finger. However, this is merely an exemplary description, and the actual implementation of the electronic device (300) is not limited thereto. For example, the electronic device (300) may be a wireless communication device such as a smartphone, or may be a tablet PC, a notebook PC, a display device, an HMD (head-mounted display), a wireless headset, or an electronic device for home appliances.

[0063] In one embodiment, the housing (310) may form the exterior of the electronic device (300). Alternatively, the housing (310) may house and protect components of the electronic device (300) therein. The housing (310) may have various shapes and structures depending on the purpose and function of the electronic device (300).

[0064] In one embodiment, the housing (310) may have a ring-shaped structure. For example, in an electronic device (300) that is a smart ring, the housing (310) may have a ring-shaped shape that can be detachably attached to a user's finger.

[0065] In one embodiment, the housing (310) may include an inner surface (311) facing the inner center (C) and an outer surface (312) opposite the inner surface (311). A molding member (330) may be coupled to the inner surface (311) of the housing (310).

[0066] In one embodiment, the molding member (330) may be a component made of a different material from the housing (310) that is coupled to the housing (310). For example, in an electronic device (300) that is a wearable device, the molding member (330) may be an element that comes into contact with the user's body.

[0067] In one embodiment, components of the electronic device (300) may be placed between the housing (310) and the molding member (330). The molding member (330) may support or protect the internal components. The molding member (330) may function as an inner case or inner cover of the electronic device (300).

[0068] In one embodiment, the molding member (330) may be formed by being filled between the housing (310) and the substrate (350). For example, when components such as the substrate (350) and the battery (340) are placed in the housing (310), the molding member (330) may be filled in the housing (310) and cured. The molding member (330) may support the housing (310) and other components, and protect the components of the electronic device (300) from external impact. However, this is merely an example, and the molding member (330) may be formed by being coupled to the housing (310).

[0069] In one embodiment, the substrate (350) may be disposed facing the inner surface (311) of the housing (310). The substrate (350) may be disposed in a receiving groove (315) of the housing (310). The receiving groove (315) may be formed in the inner surface (311) of the housing (310) to receive the substrate (350). The substrate (350) may be disposed at a predetermined distance from the housing (310).

[0070] In one embodiment, the substrate (350) can control the operation of the electronic device (300). A plurality of electrical components (355) can be arranged on the substrate (350). For example, the electrical components (355) of the substrate (350) can include at least a portion of a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), and a communication module (e.g., a communication module (190) of FIG. 1) of the electronic device (300).

[0071] In one embodiment, a battery (340) (e.g., battery (189) of FIG. 1) may provide power for driving an electronic device (300). The battery (340) may be disposed in the housing (310) facing the substrate (350). The battery (340) may be connected to the substrate (350) via a battery terminal (341) so as to supply power to an electrical component (355) of the substrate (350).

[0072] In one embodiment, the housing (310) may be formed of a conductive material. For example, the housing (310) may be formed of a single continuous conductive material. Alternatively, the housing (310) may be formed by combining two or more materials, at least one of which may be a conductive material.

[0073] In one embodiment, the housing (310) can transmit and receive wireless communication signals from the outside. The housing (310) can be electrically or communicatively connected to the substrate (350) through the protruding area (320).

[0074] In one embodiment, the housing (310) may include a protruding region (320). The protruding region (320) may be electrically connected to the substrate (350). The protruding region (320) may be a protrusion formed to protrude from the inner surface (311) of the housing (310) toward the substrate (350).

[0075] In one embodiment, the protruding region (320) can be electrically connected to the substrate (350) by a bonding member (365). The bonding member (365) can be a shouldering member and can connect and secure the substrate (350) and the protruding region (320).

[0076] For example, as illustrated in FIG. 3c, a conductive member (357) formed of a conductive pattern may be provided on the substrate (350). Alternatively, the protruding region (320) may be connected to at least one of the electrical elements (355) of the substrate (350) by the bonding member (365) and / or the conductive member (357).

[0077] In one embodiment, the molding member (330) can be filled between the substrate (350) and the housing (310), and the protruding region (320) can penetrate the molding member (330) and be connected to the substrate (350). The protruding region (320) can provide connection stability between the substrate (350) and the housing (310).

[0078] In one embodiment, the housing (310) may function as an antenna receiving unit and / or transmitting unit of the electronic device (300). The electronic device (300) may include a wireless communication module (e.g., the wireless communication module (192) of FIG. 1 or the wireless communication module (192) of FIG. 2) and may transmit and receive wireless communication through the antenna module (e.g., the antenna module (197) of FIG. 1 or the antenna module (197) of FIG. 2). The housing (310) may be a part of the antenna module (197).

[0079] In one embodiment, a housing (310) made of a conductive material is electrically connected to a wireless communication module of a substrate (350) and can function as a part of an antenna module by transmitting and receiving wireless communication signals from the outside.

[0080] For example, if the electronic device (300) is a small or portable device, the electronic device (300) may have limitations in the spatial arrangement of the antenna module, and the communication performance or communication distance of the electronic device (300) may be limited. When the RF (radio-frequency) intensity of the electronic device (300) is increased to improve the communication performance and communication distance, the consumption of the battery (340) may increase and the usage time of the electronic device (300) may be reduced.

[0081] In one embodiment of the present document, the electronic device (300) can improve the communication performance and communication distance of the electronic device (300) and provide efficiency in the spatial design of the electronic device (300) by utilizing a housing (310) made of a conductive material as an antenna module (197) of the electronic device (300).

[0082] In one embodiment, the housing (310) may include a plurality of protruding regions (320). The plurality of protruding regions (320) may include a first protruding region (321) and a second protruding region (322).

[0083] In one embodiment, the first protruding area (321) can be utilized as a feeding terminal, and the second protruding area (322) can be utilized as a ground terminal. However, the present invention is not limited thereto, and the first protruding area (321) and the second protruding area (322) can be utilized as various terminals. For example, the first protruding area (321) can be utilized as a ground terminal, and the second protruding area (322) can be utilized as a feeding terminal. Alternatively, the first protruding area (321) and the second protruding area (322) can be utilized as ground terminals. Alternatively, the first protruding area (321) and the second protruding area (322) can be utilized as feeding terminals.

[0084] In one embodiment, the first protruding area (321) and the second protruding area (322) may be provided spaced apart from each other, and the characteristics of the communication signal transmitted and received by the housing (310) may be set through the distance or path from the first protruding area (321) to the second protruding area (322).

[0085] In one embodiment, the plurality of protruding regions (320) may include at least one of the first protruding region (321) and the second protruding region (322) in multiple numbers. For example, the electronic device (300) may include a plurality of first protruding regions (321) that are power supply terminals, and through the plurality of power supply terminals, the electronic device (300) may improve the receivable communication range.

[0086] Hereinafter, based on the description of the electronic device (300) described above, an electronic device (300) including a protruding region (320) and structures and configurations associated therewith according to various embodiments will be described. In illustrating the electronic device (300), some components of the electronic device (300) (e.g., a molding member (330)) are omitted, and these may also be omitted in an actual implementation.

[0087] In addition, the embodiments described below are merely examples, and the actual implementation of the electronic device (300) is not limited thereto, and at least some components of the multiple embodiments may be omitted or added, components of the multiple embodiments may be replaced, or multiple embodiments may be implemented by merging.

[0088] FIG. 4a is an exploded perspective view of an electronic device (300) according to one embodiment, and FIG. 4b is a cross-sectional view of an electronic device (300) according to one embodiment.

[0089] Specifically, FIG. 4a is an exploded perspective view showing the housing (310) and the substrate (350) separated by omitting the joining member (365a), and FIG. 4b is a cross-sectional view showing the substrate (350) coupled to the housing (310).

[0090] Referring to FIGS. 4A and 4B, an electronic device (300) according to one embodiment may include at least a portion of a protruding region (320a) (e.g., protruding region (320) of FIGS. 3B and 3C), an opening (360a), and a bonding member (365a) (e.g., bonding member (365) of FIG. 3B).

[0091] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (300) including the housing (310) in which the protruding area (320a) is provided, some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined with the electronic device (300) including the housing (310) in which the protruding area (320a) is provided, unless it is technically clearly impossible.

[0092] In one embodiment, the receiving groove (315) of the housing (310) may include a bottom surface (316) and a side surface (317). The bottom surface (316) may be a surface facing the inner center of the annular structure of the housing (310) (e.g., the inner center (C) of FIGS. 3A, 3B, and 3C). The side surface (317) may be at least one surface extending from the bottom surface (316) toward the inner center (C) of the housing (310). The substrate (350) may be received in the receiving groove (315) by being surrounded by the bottom surface (316) and the side surface (317).

[0093] In one embodiment, the protruding region (320a) may be provided on the bottom surface (316) of the receiving groove (315). For example, as illustrated in FIG. 4A, the protruding region (320a) may be formed to protrude from the bottom surface (316) of the receiving groove (315) in a direction facing the substrate (350).

[0094] In one embodiment of the present document, since the protruding area (320a) is formed to protrude from the bottom surface (316), the connection between the housing (310) and the substrate (350) can be made easy and simple in the manufacturing process of the electronic device (300), and the electronic device (300) can provide connection stability between the housing (310) and the substrate (350).

[0095] In one embodiment, the protruding region (320a) may be formed integrally with the housing (310). The protruding region (320a) may be formed during the molding or injection molding process of the housing (310). Alternatively, the protruding region (320a) may be formed on the inner surface (311) of the housing (310) through cutting processing.

[0096] In one embodiment of the present document, the protruding area (320a) is formed integrally with the housing (310) by protruding from the bottom surface (316), so that a separate connection terminal (not shown) for connecting the housing (310) and the substrate (350) can be omitted, and the housing (310) and the substrate (350) can be stably connected.

[0097] In one embodiment, the substrate (350) may include a first side (351) facing the inner center of the housing (310) (e.g., the inner center (C) of FIGS. 3A, 3B, and 3C) and a second side (352) opposite the first side (351). Although not shown in FIG. 4A, a field element (355) may be disposed on the first side (351) and / or the second side (352) of the substrate (350), as shown in FIG. 4B.

[0098] In one embodiment, the substrate (350) may include an opening (360a) for accommodating a protruding region (320a). The opening (360a) may be formed to penetrate from the first surface (351) toward the second surface (352). The protruding region (320a) may be positioned to penetrate the opening (360a) of the substrate (350). The protruding region (320a) may be shoulder-bonded to the substrate (350) by a bonding member (365a).

[0099] In one embodiment, the substrate (350) may include a substrate terminal (361). The substrate terminal (361) may be electrically connected to the protruding region (320a) via a bonding member (365a). The substrate terminal (361) may surround the opening (360a) or be positioned adjacent to the opening (360a).

[0100] In one embodiment, the substrate (350) may include a connection line (362). The connection line (362) may be electrically connected to the substrate terminal (361) and the electrical element (355). Through the connection line (362), the electrical element (355) may be electrically connected to the protruding region (320a).

[0101] In one embodiment, when the protruding areas (320a) are formed in multiple numbers, the substrate (350) may include multiple openings (360a). Each of the multiple openings (360a) may accommodate each of the multiple protruding areas (320a).

[0102] In one embodiment of the present document, the protruding region (320a) and the opening (360a) can provide connection stability between the housing (310) and the substrate (350). In addition, in the manufacturing process of the electronic device (300), the protruding region (320a) is positioned in the opening (360a) so that the housing (310) and the substrate (350) are assembled, thereby providing convenience in manufacturing the electronic device (300) and improving the yield.

[0103] FIG. 5a is an exploded perspective view of an electronic device (300) according to one embodiment, and FIG. 5b is a cross-sectional view of an electronic device (300) according to one embodiment.

[0104] Specifically, FIG. 5a is an exploded perspective view showing the housing (310) and the substrate (350) separated by omitting the joining member (365a), and FIG. 5b is a cross-sectional view showing the substrate (350) coupled to the housing (310).

[0105] Referring to FIGS. 5A and 5B, an electronic device (300) according to one embodiment may include at least a portion of a protruding region (320b) (e.g., protruding region (320) of FIGS. 3B and 3C), a connecting member (353b), an opening (360b) (e.g., opening (360a) of FIGS. 4A and 4B), and a bonding member (365b) (e.g., bonding member (365) of FIGS. 3B and 3C).

[0106] Hereinafter, any content that overlaps with the above-described content will be omitted for explanation, and it will be understood that some configurations and structures may be replaced, added, or omitted within a range that can be easily understood by those skilled in the art by referring to the drawings and descriptions below in the electronic device (300) including the housing (310) in which the protruding area (320b) is provided. In addition, at least one configuration or feature of the embodiments described above may be combined with the electronic device (300) including the housing (310) in which the protruding area (320b) is provided, unless it is technically clearly impossible.

[0107] In one embodiment, the protruding region (320b) may be coupled to the housing (310) and electrically connected to the housing (310). The protruding region (320b) may be a 'protruding member' or 'connecting terminal' formed as a separate body from the housing (310). The protruding region (320b) may have a protrusion shape extending from the inner surface (311) of the housing (310) toward the substrate (350).

[0108] In one embodiment, the protruding region (320b) may be coupled to the housing (310) by a connecting member (353b). The connecting member (353b) may include an adhesive material to bond the protruding region (320b) to the housing (310). Alternatively, the connecting member (353b) may be structurally coupled to the housing (310) to secure the protruding region (320b) to the housing (310).

[0109] In one embodiment, the substrate (350) may include a first side (351) facing the inner center of the housing (310) (e.g., the inner center (C) of FIGS. 3A, 3B, and 3C) and a second side (352) opposite the first side (351). Although not shown in FIG. 5A, a field element (355) may be disposed on the first side (351) and / or the second side (352) of the substrate (350), as shown in FIG. 5B.

[0110] In one embodiment, the substrate (350) may include an opening (360b) for accommodating a protruding region (320b). The opening (360b) may be formed to penetrate from the first surface (351) toward the second surface (352). The protruding region (320b) may be positioned to penetrate the opening (360b) of the substrate (350). The protruding region (320b) may be shoulder-bonded to the substrate (350) by a bonding member (365b).

[0111] In one embodiment, the substrate (350) may include a substrate terminal (361). The substrate terminal (361) may be electrically connected to the protruding region (320b) via a bonding member (365b). The substrate terminal (361) may surround the opening (360b) or be positioned adjacent to the opening (360b).

[0112] In one embodiment, the substrate (350) may include a connection line (362). The connection line (362) may be electrically connected to the substrate terminal (361) and the electrical element (355). Through the connection line (362), the electrical element (355) may be electrically connected to the protruding region (320b).

[0113] In one embodiment, the protruding region (320b) may be formed of a different material from the housing (310). For example, the housing (310) may be formed of a material that is difficult to shoulder-join (e.g., titanium). Alternatively, since the housing (310) is exposed to the outside, the housing (310) may be formed of a material that is highly corrosion-resistant and durable or has low electrical conductivity.

[0114] In one embodiment of this document, the protruding area (320b) is made of a different material from the housing (310), so that the housing (310) includes a functional material, and electrical connection between the substrate (350) and the housing (310) can be implemented through the protruding area (320b) made of a different material.

[0115] In the drawing, the protruding area (320b) is depicted as being arranged on the bottom surface (316) of the receiving groove (315), but in actual implementation, it is not limited to this, and the protruding area (320b) may be provided on the side surface (317) of the receiving groove (315) or outside the receiving groove (315). The description of the protruding area (320b) made of a different material from the housing (310) may also be applied to the protruding area (320) of various embodiments of the present document described above or described later.

[0116] FIG. 6a is a perspective view of an electronic device (300) according to one embodiment, and FIG. 6b is a cross-sectional view of the electronic device (300) according to one embodiment.

[0117] Specifically, FIG. 6a is a perspective view showing the housing (310) and the substrate (350) with the joint member (365c) omitted, and FIG. 6b is a cross-sectional view showing the substrate (350) coupled to the housing (310).

[0118] Referring to FIGS. 6A and 6B, an electronic device (300) according to one embodiment may include at least a portion of a protruding region (320c) (e.g., protruding region (320) of FIGS. 3B and 3C) and a bonding member (365c) (e.g., bonding member (365) of FIG. 3B).

[0119] Hereinafter, any overlapping content with the above-described content will be omitted for explanation, and it is to be understood that some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below in the electronic device (300) including the housing (310) in which the protruding area (320c) is provided. In addition, at least one configuration or feature of the above-described embodiments may be combined with the electronic device (300) including the housing (310) in which the protruding area (320c) is provided, unless it is technically clearly impossible.

[0120] In one embodiment, the receiving groove (315) of the housing (310) may include a bottom surface (316) and a side surface (317). The bottom surface (316) may be a surface facing the inner center of the annular structure of the housing (310) (e.g., the inner center (C) of FIGS. 3A, 3B, and 3C). The side surface (317) may be at least one surface extending from the bottom surface (316) toward the inner center (C) of the housing (310). The substrate (350) may be received in the receiving groove (315) by being surrounded by the bottom surface (316) and the side surface (317).

[0121] In one embodiment, the protruding region (320c) may be provided on the side surface (317) of the receiving groove (315). For example, as illustrated in FIG. 6A, the protruding region (320c) may be formed to protrude from the side surface (317) of the receiving groove (315) in a direction facing the substrate (350).

[0122] In one embodiment, the substrate (350) may include a first side (351) facing the inner center (C) of the housing (310) and a second side (352) opposite the first side (351). Although not shown in FIG. 6A, a field element (355) may be disposed on the first side (351) and / or the second side (352) of the substrate (350), as shown in FIG. 6B.

[0123] In one embodiment, the substrate (350) may include a connection line (362). The connection line (362) may be electrically connected to the bonding member (365c) and the electrical element (355). Through the connection line (362), the electrical element (355) may be electrically connected to the protruding region (320c).

[0124] In one embodiment, the protruding region (320c) may be positioned to face the first surface (351) of the substrate (350). The protruding region (320c) may be shoulder-bonded to the first surface (351) of the substrate (350) by a bonding member (365c).

[0125] In one embodiment of the present document, since the protruding region (320c) is formed by protruding from the side surface (317), the opening of the substrate (350) (e.g., the opening (360a) of FIGS. 4A and 4B) can be omitted, and space efficiency in the design of the substrate (350) can be provided. In addition, in the manufacturing process of the electronic device (300), the connection between the housing (310) and the substrate (350) can be made easy and simple, and the electronic device (300) can provide connection stability between the housing (310) and the substrate (350).

[0126] In one embodiment, the protruding region (320c) may be formed integrally with the housing (310). The protruding region (320c) may be formed during the molding or injection molding process of the housing (310). Alternatively, the protruding region (320c) may be formed on the inner surface (311) of the housing (310) through cutting processing.

[0127] In one embodiment of the present document, the protruding area (320c) is formed integrally with the housing (310) by protruding from the side surface (317), so that a separate connection terminal (not shown) for connecting the housing (310) and the substrate (350) can be omitted, and the housing (310) and the substrate (350) can be stably connected. However, the present invention is not limited thereto, and the protruding area (320c) can be formed of a different material from the housing (310) and can be coupled to the housing (310) and electrically connected to the housing (310).

[0128] FIG. 7a is an exploded perspective view of an electronic device (300) according to one embodiment, and FIG. 7b is a cross-sectional view of an electronic device (300) according to one embodiment.

[0129] Specifically, FIG. 7a is an exploded perspective view showing the housing (310) and the substrate (350) separated by omitting the joining member (365), and FIG. 7b is a cross-sectional view showing the substrate (350) coupled to the housing (310).

[0130] Referring to FIGS. 7A and 7B, an electronic device (300) according to one embodiment may include at least a portion of a protruding area (320d) (e.g., protruding area (320) of FIGS. 3B and 3C), a connecting groove (360d), and a bonding member (365d) (e.g., bonding member (365) of FIG. 3B).

[0131] Hereinafter, any overlapping content with the above-described content will be omitted for explanation, and it is to be understood that, in the electronic device (300) including the housing (310) in which the protruding area (320d) is provided, some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the above-described embodiments may be combined with the electronic device (300) including the housing (310) in which the protruding area (320d) is provided, unless it is technically clearly impossible.

[0132] In one embodiment, the receiving groove (315) of the housing (310) may include a bottom surface (316) and a side surface (317). The bottom surface (316) may be a surface facing the inner center of the annular structure of the housing (310) (e.g., the inner center (C) of FIGS. 3A, 3B, and 3C). The side surface (317) may be at least one surface extending from the bottom surface (316) toward the inner center (C) of the housing (310). The substrate (350) may be received in the receiving groove (315) by being surrounded by the bottom surface (316) and the side surface (317).

[0133] In one embodiment, the protruding region (320d) may be provided on the bottom surface (316) and the side surface (317) of the receiving groove (315). For example, as illustrated in FIG. 7A, the protruding region (320d) may be formed to protrude from the bottom surface (316) and the side surface (317) of the receiving groove (315) in a direction facing the substrate (350).

[0134] In one embodiment of the present document, the protruding area (320d) is formed by protruding from the bottom surface (316) and the side surface (317), so that the connection between the housing (310) and the substrate (350) can be made easy and simple in the manufacturing process of the electronic device (300), and the electronic device (300) can provide connection stability between the housing (310) and the substrate (350).

[0135] In one embodiment, the protruding region (320d) may be formed integrally with the housing (310). The protruding region (320d) may be formed during the molding or injection molding process of the housing (310). Alternatively, the protruding region (320d) may be formed on the inner surface (311) of the housing (310) through cutting processing.

[0136] In one embodiment of the present document, the protruding area (320d) is formed integrally with the housing (310) by protruding from the bottom surface (316) and the side surface (317), so that a separate connection terminal (not shown) for connecting the housing (310) and the substrate (350) can be omitted, and the housing (310) and the substrate (350) can be stably connected. However, the present invention is not limited thereto, and the protruding area (320d) can be formed of a different material from the housing (310) and can be coupled to the housing (310) and electrically connected to the housing (310).

[0137] In one embodiment, the substrate (350) may include a first side (351) facing the inner center (C) of the housing (310) and a second side (352) opposite the first side (351). Although not shown in FIG. 7A, a field element (355) may be disposed on the first side (351) and / or the second side (352) of the substrate (350), as shown in FIG. 7B.

[0138] In one embodiment, the substrate (350) may include a connecting groove (360d) that is grooved inwardly of the substrate (350) corresponding to the protruding area (320d). For example, the connecting groove (360d) may have a shape that is grooved from an edge surface (or a surface facing the side surface (317) of the receiving groove (315)) connecting the first surface (351) and the second surface (352) of the substrate (350) toward the center of the substrate (350).

[0139] In one embodiment, the substrate (350) may include a substrate terminal (361). The substrate terminal (361) may be electrically connected to the protruding region (320d) via a bonding member (365d). The substrate terminal (361) may surround the connection groove (360d) or may be positioned adjacent to the connection groove (360d).

[0140] In one embodiment, the substrate (350) may include a connection line (362). The connection line (362) may be connected to the substrate terminal (361) and the electrical element (355). Through the connection line (362), the electrical element (355) may be electrically connected to the protruding region (320d).

[0141] In one embodiment, the protruding region (320d) may be positioned in the connecting groove (360d) of the substrate (350) and may be shoulder-bonded to the substrate (350). For example, the protruding region (320d) may be positioned so as to penetrate the connecting groove (360d) of the substrate (350) and may be shoulder-bonded to the substrate (350) by a bonding member (365d).

[0142] In one embodiment of the present document, a protruding region (320d) is formed by protruding from the bottom surface (316) and the side surface (317), so that the substrate (350) and the protruding region (320d) can be connected through a connecting groove (360d) provided in an edge region of the substrate (350). By virtue of the connecting groove (360d), an opening in the substrate (350) (e.g., the opening (360a) of FIGS. 4A and 4B) can be omitted, and space efficiency in the design of the substrate (350) can be provided.

[0143] In one embodiment, when a plurality of protruding areas (320d) are formed, the substrate (350) may include a plurality of connecting grooves (360d). Each of the plurality of connecting grooves (360d) may accommodate a respective one of the plurality of protruding areas (320d).

[0144] In one embodiment of the present document, the protruding area (320d) and the connecting groove (360d) can provide connection stability of the housing (310) and the substrate (350). In addition, in the manufacturing process of the electronic device (300), the protruding area (320d) is arranged in the connecting groove (360d) so that the housing (310) and the substrate (350) are assembled, thereby providing convenience in manufacturing the electronic device (300) and improving the yield.

[0145] FIG. 8a is an exploded perspective view of an electronic device (300) according to one embodiment, and FIG. 8b is a cross-sectional view of an electronic device (300) according to one embodiment.

[0146] Specifically, FIG. 8a is an exploded perspective view showing the housing (310), the substrate (350), and the fixing member (365e) separated, and FIG. 8b is a cross-sectional view showing the substrate (350) coupled to the housing (310).

[0147] Referring to FIGS. 8A and 8B, an electronic device (300) according to one embodiment may include at least a portion of a protruding region (320e) (e.g., the protruding region (320) of FIGS. 3B and 3C), a fastening member (360e), and a fixing member (365e).

[0148] Hereinafter, the overlapping content with the above-described content will be omitted and described, and it is to be understood that some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below in the electronic device (300) including the housing (310) in which the protruding area (320e) is provided. In addition, at least one configuration or feature of the above-described embodiments may be combined in the electronic device (300) including the housing (310) in which the protruding area (320e) is provided, unless it is technically clearly impossible.

[0149] In one embodiment, the receiving groove (315) of the housing (310) may include a bottom surface (316) and a side surface (317). The bottom surface (316) may be a surface facing the inner center of the annular structure of the housing (310) (e.g., the inner center (C) of FIGS. 3A, 3B, and 3C). The side surface (317) may be at least one surface extending from the bottom surface (316) toward the inner center (C) of the housing (310). The substrate (350) may be received in the receiving groove (315) by being surrounded by the bottom surface (316) and the side surface (317).

[0150] In one embodiment, the protruding region (320e) may be provided on the outside of the receiving groove (315). For example, as illustrated in FIG. 8A, the protruding region (320e) may be formed to protrude from the inner peripheral surface (311) of the housing (310) or the outer boundary of the receiving groove (315) of the housing (310) toward the inner center (C) of the housing (310).

[0151] In one embodiment of the present document, the protruding area (320e) is formed to protrude from the outside of the receiving groove (315) of the housing (310), so that the connection between the housing (310) and the substrate (350) can be made easy and simple in the manufacturing process of the electronic device (300), and the electronic device (300) can provide connection stability between the housing (310) and the substrate (350).

[0152] In one embodiment, the protruding region (320e) may be formed integrally with the housing (310). The protruding region (320e) may be formed during the molding or injection molding process of the housing (310). Alternatively, the protruding region (320e) may be formed on the inner surface (311) of the housing (310) through cutting processing.

[0153] In one embodiment of the present document, since the protruding area (320e) is formed to protrude integrally with the housing (310), a separate connection terminal (not shown) for connecting the housing (310) and the substrate (350) can be omitted, and the housing (310) and the substrate (350) can be stably connected. However, the present invention is not limited thereto, and the protruding area (320e) can be formed of a different material from the housing (310), and can be coupled to the housing (310) and electrically connected to the housing (310).

[0154] In one embodiment, the substrate (350) may include a first side (351) facing the inner center (C) of the housing (310) and a second side (352) opposite the first side (351). Although not shown in FIG. 8A, a field element (355) may be disposed on the first side (351) and / or the second side (352) of the substrate (350), as shown in FIG. 8B.

[0155] In one embodiment, the fastening member (360e) can be coupled to the first surface (351) of the substrate (350) and electrically connected to the substrate (350). The fastening member (360e) can be a part of the substrate (350) or a part of the substrate (350). Since the protruding region (320e) extends from the housing (310) in a direction facing the fastening member (360e), the protruding region (320e) can protrude and extend toward the substrate (350).

[0156] In one embodiment, the fastening member (360e) may be formed to extend from the substrate (350) to face the protruding region (320e). For example, the fastening member (360e) may extend from the first surface (351) of the substrate (350) toward the inner center (C) to face the protruding region (320e).

[0157] In one embodiment, the protruding region (320e) may include a first fastening hole (323e). The fastening member (360e) may include a second fastening hole (363e). The first fastening hole (323e) and the second fastening hole (363e) may be arranged to face each other when the substrate (350) is secured to the housing (310).

[0158] In one embodiment, the fixing member (365e) can fix the fastening member (360e) and the protruding region (320e). The fixing member (365e) can be positioned to simultaneously penetrate the first fastening hole (323e) and the second fastening hole (363e) to fix the protruding region (320e) and the fastening member (360e). The fixing member (365e) can be made of a conductive material and can electrically connect the protruding region (320e) and the fastening member (360e).

[0159] However, the present invention is not limited thereto, and the fixing member (365e) may be implemented as a joining member (e.g., the joining member (365) of FIG. 3b). The fixing member (365e) may be shoulder-joined to the protruding region (320e) and the fastening member (360e), thereby mutually fixing and electrically connecting the protruding region (320e) and the fastening member (360e). At least some of the first fastening hole (323e) and the second fastening hole (363e) may be omitted.

[0160] In one embodiment, the protruding region (320e) may be positioned in the connecting groove (360d) of the substrate (350) and may be shoulder-bonded to the substrate (350). For example, the protruding region (320e) may be positioned so as to penetrate the connecting groove (360d) of the substrate (350) and may be shoulder-bonded to the substrate (350) by a bonding member (365).

[0161] In one embodiment, the substrate (350) may include a connecting line (362). The connecting line (362) may be connected to the fastening member (360e) and the electrical element (355). Through the connecting line (362), the electrical element (355) may be electrically connected to the protruding region (320e).

[0162] In one embodiment of the present document, the electronic device (300) can connect the protruding region (320e) to the substrate (350) through the fastening member (360e) and the fixing member (365e). An opening (e.g., the opening (360a) of FIGS. 4A and 4B) or a connecting groove (e.g., the connecting groove (360d) of FIGS. 7A and 7B) of the substrate (350) can be omitted, and space efficiency in the design of the substrate (350) can be provided. In addition, since the fastening member (360e) can be connected to the substrate (350) through a post-process after the substrate (350) is manufactured, the electronic device (300) can be applied to substrates (350) of various shapes and structures.

[0163] In one embodiment, when a plurality of protruding areas (320e) are formed, the electronic device (300) may include a plurality of fastening members (360e) and fixing members (365e). Each of the plurality of fastening members (360e) and the plurality of fixing members (365e) may be connected to each of the plurality of protruding areas (320e).

[0164] In one embodiment of the present document, the protruding region (320e), the fastening member (360e), and the fixing member (365e) can provide connection stability between the housing (310) and the substrate (350). In addition, in the manufacturing process of the electronic device (300), since the protruding region (320e) and the fastening member (360e) are fixed by the fixing member (365e) while the substrate (350) is placed in the receiving groove (315) of the housing (310), the convenience of manufacturing the electronic device (300) can be provided, and the yield can be improved.

[0165] An electronic device (300) according to one embodiment may include a housing (310) having a circular structure made of a conductive material and a substrate (350) spaced apart from and facing an inner surface (311) of the housing (310). In one embodiment, the housing (310) may include a protruding region (320, 320a, 320b, 320c, 320d, 320e) formed to protrude toward the substrate (350) and electrically connected to the substrate (350).

[0166] In one embodiment, the electronic device (300) may further include a molding member (330) filled between the housing (310) and the substrate (350). In one embodiment, the protruding regions (320, 320a, 320b, 320c, 320d, 320e) may penetrate the molding member (330) and be connected to the substrate (350).

[0167] In one embodiment, the housing (310) may include a receiving groove (315) that receives a substrate (350). In one embodiment, the receiving groove (315) may include a bottom surface (316) facing the inner center (C) of the annular housing (310) and a side surface (317) extending from the bottom surface (316) toward the inner center (C) of the housing (310).

[0168] In one embodiment, the protruding area (320a, 320b) may be provided on the bottom surface (316) of the receiving groove (315) of the housing (310).

[0169] In one embodiment, the substrate (350) may include an opening (360a, 360b) for accommodating a protruding region (320a, 320b). In one embodiment, the protruding region (320a, 320b) may be positioned to penetrate the opening (360a, 360b) of the substrate (350) and be shoulder-bonded to the substrate (350).

[0170] In one embodiment, the protruding area (320c) may be provided on the side (317) of the receiving groove (315) of the housing (310).

[0171] In one embodiment, the protruding region (320c) may be positioned to face one side (351) of the substrate (350) facing the inner center (C) of the annular housing (310) and connected to the substrate (350).

[0172] In one embodiment, the substrate (350) may include a connecting groove (360d) that is grooved inwardly of the substrate (350) corresponding to the protruding area (320d).

[0173] In one embodiment, the protruding region (320d) may be positioned in the connecting groove (360d) of the substrate (350) and may be shoulder-bonded with the substrate (350).

[0174] In one embodiment, the protruding area (320e) may be provided outside the receiving groove (315).

[0175] In one embodiment, the electronic device (300) may further include a fastening member (360e) formed to extend from the substrate (350) so as to face the protruding area (320e), and a fixing member (365e) that fixes the fastening member (360e) and the protruding area (320e).

[0176] In one embodiment, the housing (310) may include a plurality of protruding regions (320, 320a, 320b, 320c, 320d, 320e). In one embodiment, the plurality of protruding regions (320, 320a, 320b, 320c, 320d, 320e) may include a first protruding region (321) that transmits and receives a wireless communication signal to and from a substrate (350) and a second protruding region (322) that is grounded with the substrate (350). In one embodiment, the plurality of protruding regions (320, 320a, 320b, 320c, 320d, 320e) may include at least one of the first protruding region (321) and the second protruding region (322).

[0177] In one embodiment, the substrate (350) may include a plurality of openings (360a, 360b) for accommodating a plurality of protruding regions (320a, 320b), respectively.

[0178] In one embodiment, the protruding areas (320, 320a, 320c, 320d, 320e) may be formed integrally with the housing (310).

[0179] In one embodiment, the protruding region (320b) is made of a different material from the housing (310) and can be joined to the housing (310) and electrically connected to the housing (310).

[0180] In addition, an electronic device (300) according to an embodiment of the present document may include a housing (310) made of a conductive material, a substrate (350) disposed spaced apart from the housing (310), and a molding member (330) filled between the housing (310) and the substrate (350). In one embodiment, the housing (310) may include a protruding region (320, 320a, 320b, 320c, 320d, 320e) that is formed to protrude toward the substrate (350) through the molding member (330) and is electrically connected to the substrate (350).

[0181] In one embodiment, the substrate (350) may include an opening (360a, 360b) for accommodating a protruding region (320a, 320b). In one embodiment, the protruding region (320a, 320b) may be positioned to penetrate the opening (360a, 360b) of the substrate (350) and be shoulder-bonded to the substrate (350).

[0182] In one embodiment, the housing (310) may include a plurality of protruding regions (320, 320a, 320b, 320c, 320d, 320e). In one embodiment, the plurality of protruding regions (320, 320a, 320b, 320c, 320d, 320e) may include a first protruding region (321) that transmits and receives a wireless communication signal to and from a substrate (350) and a second protruding region (322) that is grounded with the substrate (350).

[0183] In one embodiment, the protruding areas (320, 320a, 320c, 320d, 320e) may be formed integrally with the housing (310).

[0184] In one embodiment, the protruding region (320b) is made of a different material from the housing (310) and can be joined to the housing (310) and electrically connected to the housing (310).

[0185] Although the preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the scope of the claims. Furthermore, such modifications should not be individually understood from the technical idea or perspective.

Claims

1. In an electronic device (300), A housing (310) of an annular structure made of a challenging material and It includes a substrate (350) spaced apart from and facing the inner surface (311) of the housing (310). The above housing (310) is An electronic device (300) including a protruding region (320, 320a, 320b, 320c, 320d, 320e) formed to protrude toward the substrate (350) and electrically connected to the substrate (350).

2. In paragraph 1, The electronic device (300) further includes a molding member (330) filled between the housing (310) and the substrate (350). The above protruding area (320, 320a, 320b, 320c, 320d, 320e) is an electronic device (300) that penetrates the molding member (330) and is connected to the substrate (350).

3. In paragraph 1 or 2, The above housing (310) includes a receiving groove (315) for receiving the substrate (350), The above-mentioned receiving home (315) is The bottom surface (316) facing the inner center (C) of the housing (310) of the above-mentioned annular structure and An electronic device (300) comprising a side surface (317) extending from the bottom surface (316) toward the inner center (C) of the housing (310).

4. In any one of paragraphs 1 to 3, The above protruding area (320a, 320b) is An electronic device (300) provided on the bottom surface (316) of the receiving groove (315) of the above housing (310).

5. In any one of paragraphs 1 to 4, The above substrate (350) includes an opening (360a, 360b) for accommodating the protruding area (320a, 320b), An electronic device (300), wherein the protruding region (320a, 320b) is positioned to penetrate the opening (360a, 360b) of the substrate (350) and is shoulder-bonded with the substrate (350).

6. In any one of paragraphs 1 to 5, The above protruding area (320c) is An electronic device (300) provided on a side (317) of a receiving groove (315) of the above housing (310).

7. In any one of paragraphs 1 to 6, The above protruding area (320c) is An electronic device (300) that is positioned so as to face one side (351) of the substrate (350) facing the inner center (C) of the housing (310) of the annular structure and is connected to the substrate (350).

8. In any one of paragraphs 1 to 7, The above substrate (350) includes a connecting groove (360d) that is grooved inwardly of the substrate (350) corresponding to the protruding area (320d). The above protruding area (320d) is positioned in the connecting groove (360d) of the substrate (350) and is shoulder-joined with the substrate (350), an electronic device (300).

9. In any one of paragraphs 1 to 8, The above protruding area (320e) is An electronic device (300) provided outside the above-mentioned receiving home (315).

10. In any one of paragraphs 1 to 9, The above electronic device (300) A fastening member (360e) formed by extending from the substrate (350) so as to face the protruding area (320e) and An electronic device (300) further comprising a fixing member (365e) that fixes the fastening member (360e) and the protruding region (320e).

11. In any one of paragraphs 1 to 10, The above housing (310) includes a plurality of protruding areas (320, 320a, 320b, 320c, 320d, 320e), Multiple protruding areas (320, 320a, 320b, 320c, 320d, 320e) are An electronic device (300) comprising a first protruding area (321) for transmitting and receiving a wireless communication signal to and from the substrate (350) and a second protruding area (322) grounded with the substrate (350).

12. In any one of paragraphs 1 to 11, The above multiple protruding areas (320, 320a, 320b, 320c, 320d, 320e) are An electronic device (300) comprising at least one of the first protruding area (321) and the second protruding area (322).

13. In any one of paragraphs 1 to 12, The above substrate (350) is An electronic device (300) comprising a plurality of openings (360a, 360b) for accommodating the plurality of protruding areas (320a, 320b), respectively.

14. In any one of paragraphs 1 to 13, The above protruding areas (320, 320a, 320c, 320d, 320e) are An electronic device (300) formed integrally with the above housing (310).

15. In any one of paragraphs 1 to 14, The above protruding area (320b) is An electronic device (300) made of a different material from the housing (310) and coupled to the housing (310) and electrically connected to the housing (310).

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