Display device and method for manufacturing display device

Abstract

Disclosed in one embodiment of the present invention is a display device comprising: a substrate; a pixel driving circuit unit arranged on the substrate; an organic insulating layer arranged on the pixel driving circuit unit and defining a first opening; a first conductive organic film accommodated in the first opening so as to be electrically connected to the pixel driving circuit unit; and an inorganic light-emitting diode arranged on the organic insulating layer and including a first electrode, wherein at least a portion of the first electrode is accommodated in the first conductive organic film.

Description

Display device and method for manufacturing the display device

[0001] Embodiments of the present invention relate to a display device and a method for manufacturing the display device, for example, a stretchable display device and a method for manufacturing the stretchable display device.

[0002] As display devices that visually display electrical signals evolve, a variety of display devices with superior characteristics, such as thinness, lightness, and low power consumption, are being introduced. For example, flexible display devices that can be folded or rolled are being introduced. Recently, active research and development is underway on stretchable display devices capable of transforming into various forms.

[0003] Embodiments of the present invention provide a display device, for example, a stretchable display device.

[0004] One embodiment of the present invention discloses a display device including: a substrate; a pixel driving circuit disposed on the substrate; an organic insulating layer disposed on the pixel driving circuit and defining a first opening; a first conductive organic film accommodated in the first opening so as to be electrically connected to the pixel driving circuit; and an inorganic light-emitting diode disposed on the organic insulating layer and including a first electrode, wherein at least a portion of the first electrode is accommodated in the first conductive organic film.

[0005] The upper surface of the first conductive organic film may be sunken from the upper surface of the organic insulating layer.

[0006] The thickness of the first electrode may be thicker than the height difference between the upper surface of the first conductive organic film and the upper surface of the organic insulating layer.

[0007] The above first conductive organic film may include a carbon black material.

[0008] It may further include a first connection electrode disposed between the pixel driving circuit unit and the first conductive organic film, electrically connecting the pixel driving circuit unit and the first conductive organic film.

[0009] The first connecting electrode may include at least one material selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0010] The second conductive organic film is further defined to be spaced apart from the first conductive organic film; the organic insulating layer further includes a second opening, which is spaced apart from the first opening and accommodates the second conductive organic film; and the inorganic light-emitting diode may further include a second electrode, which is spaced apart from the first electrode and at least a portion of which is accommodated in the second conductive organic film.

[0011] The upper surface of the second conductive organic film may be sunken from the upper surface of the organic insulating layer.

[0012] The thickness of the second electrode may be thicker than the height difference between the upper surface of the second conductive organic film and the upper surface of the organic insulating layer.

[0013] The above second conductive organic film may include a carbon black material.

[0014] It may further include a second connection electrode disposed between the pixel driving circuit and the second conductive organic film and connected to the second conductive organic film.

[0015] The second connecting electrode may include at least one material selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0016] The inorganic light-emitting diode may further include a counter electrode disposed on the inorganic light-emitting diode, and the inorganic light-emitting diode may further include a second electrode disposed to be spaced apart from the first electrode and electrically connected to the counter electrode.

[0017] It may further include a conductive organic film layer disposed on the organic insulating layer to cover the organic insulating layer in a non-display area.

[0018] Another embodiment of the present invention discloses a method for manufacturing a display device, comprising: arranging a pixel driver circuit unit on a substrate; arranging an organic insulating layer on the pixel driver circuit unit; etching the organic insulating layer to form a first opening; arranging a first conductive organic film in the first opening to be electrically connected to the pixel driver circuit unit; and arranging an inorganic light-emitting diode on the organic insulating layer; wherein the arranging of the inorganic light-emitting diode includes a step of accommodating at least a portion of a first electrode of the inorganic light-emitting diode in the first conductive organic film.

[0019] The step of etching the organic insulating layer to form the first opening may include a step of dry etching the organic insulating layer with an etching gas.

[0020] The step of disposing the first conductive organic film may include a step of disposing a conductive organic film material on the organic insulating layer; a step of soft baking the conductive organic film material; and a step of developing the conductive organic film material.

[0021] The step of accommodating at least a portion of the first electrode in the first conductive organic film may include the step of pressing the first electrode against the first conductive organic film; and the step of heating the first conductive organic film.

[0022] The step of heating the first conductive organic film may include a step of heating the first conductive organic film to a temperature of 120 degrees Celsius or higher and 140 degrees Celsius or lower.

[0023] The above first conductive organic film may include a carbon black material.

[0024] The method further includes a step of etching the organic insulating layer so as to form a second opening spaced apart from the first opening; and a step of arranging a second conductive organic film in the second opening; and the step of arranging the inorganic light-emitting diode may further include a step of accommodating at least a portion of a second electrode spaced apart from the first electrode of the inorganic light-emitting diode in the second conductive organic film.

[0025] The step of etching the organic insulating layer to form the first opening and the step of etching the organic insulating layer to form the second opening can be performed simultaneously.

[0026] The step of placing a first conductive organic film in the first opening and the step of placing a second conductive organic film in the second opening can be performed simultaneously.

[0027] The step of accommodating at least a portion of the first electrode in the first conductive organic film and the step of accommodating at least a portion of the second electrode in the second conductive organic film can be performed simultaneously.

[0028] The method further includes a step of arranging a counter electrode on the inorganic light-emitting diode, and the step of arranging the inorganic light-emitting diode may further include a step of electrically connecting a second electrode of the inorganic light-emitting diode, which is spaced apart from the first electrode, to the counter electrode.

[0029] Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims and detailed description of the invention.

[0030] According to one embodiment of the present invention, a display device capable of effectively preventing damage due to concentration of stress and being stretchable in various directions can be provided.

[0031] According to one embodiment of the present invention, fine patterning of a conductive organic film electrically connected to a pixel driving circuit unit is possible, and an inorganic light-emitting diode can be connected to the conductive organic film even at low temperature and low pressure.

[0032] These effects are exemplary and the scope of the present invention is not limited by the above-described effects.

[0033] FIG. 1 is a perspective view schematically illustrating a stretchable display device according to one embodiment of the present invention.

[0034] FIG. 2a and FIG. 2b are perspective views showing the stretchable display device of FIG. 1 stretched in the first direction.

[0035] Fig. 2c is a perspective view showing the stretchable display device of Fig. 1 stretched in the second direction.

[0036] FIG. 2d is a perspective view showing the stretchable display device of FIG. 1 stretched in the first direction and the second direction.

[0037] FIG. 2e is a perspective view showing the stretchable display device of FIG. 1 stretched in a third direction.

[0038] FIG. 3 is a schematic plan view of a stretchable display device according to one embodiment of the present invention.

[0039] FIG. 4A is an enlarged plan view of part IV of FIG. 3 as part of a stretchable display device according to one embodiment of the present invention.

[0040] FIG. 4b is an enlarged plan view of part IV of FIG. 3 as part of a stretchable display device according to one embodiment of the present invention.

[0041] FIG. 4c is an enlarged plan view of part IV of FIG. 3 as part of a stretchable display device according to one embodiment of the present invention.

[0042] FIG. 5 is a cross-sectional view schematically showing a first island portion and a first bridge portion arranged in a display area of ​​a stretchable display device according to one embodiment of the present invention.

[0043] FIGS. 6A to 6C are equivalent circuit diagrams of subpixels of a stretchable display device according to one embodiment of the present invention, respectively.

[0044] FIG. 7 is a schematic cross-sectional view of a portion of a display device according to one embodiment of the present invention.

[0045] FIG. 8 is an enlarged view of area A of FIG. 7 according to one embodiment of the present invention. FIG. 9 is an enlarged view of area B of FIG. 7 according to one embodiment of the present invention. FIG. 10 is a schematic cross-sectional view of a portion of a display device according to another embodiment of the present invention.

[0046] FIGS. 11A to 11H are schematic cross-sectional views of a method for manufacturing a display device according to one embodiment of the present invention.

[0047] FIG. 12 is a schematic cross-sectional view of a portion of a display device according to another embodiment of the present invention.

[0048] FIGS. 13A to 13H are schematic cross-sectional views of a method for manufacturing a display device according to another embodiment of the present invention.

[0049] FIGS. 14A to 14G are perspective views schematically illustrating embodiments of an electronic device including a stretchable display device according to one embodiment of the present invention, respectively.

[0050] The present invention is capable of various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms.

[0051] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0052] In the examples below, the terms first, second, etc. are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0053] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0054] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0055] In the following examples, when a part such as a film, region, component, etc. is said to be on or above another part, it includes not only a case where it is directly on top of the other part, but also a case where another film, region, component, etc. is interposed in between.

[0056] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0057] In the following examples, the x-axis, y-axis, and z-axis are not limited to three axes on an orthogonal coordinate system, and can be interpreted in a broad sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

[0058] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0059] Fig. 1 is a perspective view schematically illustrating a display device (1) according to one embodiment of the present invention. Figs. 2a and 2b are perspective views illustrating a state in which the display device (1) of Fig. 1 is extended in a first direction. Fig. 2c is a perspective view illustrating a state in which the display device (1) of Fig. 1 is extended in a second direction. Fig. 2d is a perspective view illustrating a state in which the display device of Fig. 1 is extended in the first and second directions. Fig. 2e is a perspective view illustrating a state in which the display device (1) of Fig. 1 is extended in a third direction (e.g., the y direction and / or the -y direction).

[0060] Referring to FIG. 1, a display device (1) may include a display area (DA) and a non-display area (NDA). The display area (DA) may include a plurality of pixels. The display device (1) may provide a predetermined image using light emitted from the plurality of pixels. The non-display area (NDA) may be arranged outside the display area (DA). The non-display area (NDA) may entirely surround the display area (DA).

[0061] The display device (1) can be extended or contracted in various directions. The display device (1) can be extended in a first direction (e.g., the x direction and / or the -x direction) by an external force applied by an external object or a user. In one embodiment, as illustrated in FIGS. 2A and 2B, the display area (DA) and / or the non-display area (NDA) of the display device (1) can be extended in the first direction (e.g., the x direction and / or the -x direction). For example, as illustrated in FIG. 2A, the display device (1) can be extended along the x direction and the -x direction, or as illustrated in FIG. 2B, one side of the display device (1) can be fixed and the display device (1) can be extended along the x direction.

[0062] The display device (1) can be stretched in a second direction (e.g., the y direction and / or the -y direction) by an external force applied by an external object or a user. In one embodiment, as illustrated in FIG. 2c, the display area (DA) and / or the non-display area (NDA) of the display device (1) can be stretched in the y direction and the -y direction. In another embodiment, one side of the display device (1) can be fixed while being stretched in the y direction or the -y direction.

[0063] The display device (1) can be extended in a plurality of directions, for example, a first direction (e.g., the x direction and / or the -x direction) and a second direction (e.g., the y direction and / or the -y direction) by an external force applied by an external object or a part of a human body. As illustrated in Fig. 2d, the display area (DA) and / or the non-display area (NDA) of the display device (1) can be extended in the ±x direction and the ±y direction.

[0064] The display device (1) can be elongated in a third direction (e.g., the z direction or the -z direction) by an external force applied by an external object or a part of a human body. In one embodiment, FIG. 2e illustrates that a part of the display device (1), for example, a part of the display area (DA), protrudes in the z direction. In another embodiment, a part of the display device (1), for example, a part of the display area (DA), can protrude along the -z direction (or be sunken along the z direction).

[0065] Although FIGS. 2A to 2E illustrate the display device (1) extending in the first, second, and / or third directions, the present invention is not limited thereto. In other embodiments, the display device (1) may be variously deformed into an irregular shape, such as being bent or twisted along two or more axes.

[0066] Fig. 3 is a schematic plan view of a display device (1) according to one embodiment of the present invention. Here, the plan view is viewed in the thickness direction (e.g., -z direction) of the substrate (100).

[0067] A plurality of pixels may be arranged in a display area (DA) of a display device (1). Each pixel may include subpixels that emit light of different colors. A light-emitting element corresponding to each subpixel may be arranged in the display area (DA). A circuit for providing electrical signals to the light-emitting elements arranged in the display area (DA) and to transistors electrically connected to the light-emitting elements may be located in a non-display area (NDA) surrounding the display area (DA). A gate driving circuit (GDC) may be arranged in a first non-display area (NDA1) and a second non-display area (NDA2) arranged on both sides of the display area (DA). The gate driving circuit (GDC) may include drivers for providing electrical signals to the gate electrodes of each of the transistors electrically connected to the light-emitting elements. FIG. 3 illustrates that the gate driving circuit (GDC) is arranged in each of the first non-display area (NDA1) and the second non-display area (NDA2), but the present invention is not limited thereto. In another embodiment, the gate drive circuit (GDC) may be placed in either the first non-display area (NDA1) or the second non-display area (NDA2).

[0068] The data drive circuit (DDC) may be disposed in a third non-display area (NDA3) and / or a fourth non-display area (NDA4) connecting the first non-display area (NDA1) and the second non-display area (NDA2). In one embodiment, FIG. 3 illustrates that the data drive circuit (DDC) is disposed in the fourth non-display area (NDA4). In another embodiment, the data drive circuit (DDC) may be disposed in each of the third non-display area (NDA3) and the fourth non-display area (NDA4).

[0069] Although Fig. 3 illustrates that the data drive circuit (DDC) is arranged in the fourth non-display area (NDA4) of the display device (1), the present invention is not limited thereto. In another embodiment, the display device (1) may further include a flexible circuit board (not shown) electrically connected through a terminal portion (not shown) arranged in the fourth non-display area (NDA4), and the data drive circuit (DDC) may be arranged on the aforementioned flexible circuit board.

[0070] In some embodiments, the elongation rate of the non-display area (NDA) may be equal to or less than the elongation rate of the display area (DA). In one embodiment, the elongation rates of the non-display areas (NDAs) may be different for each area. For example, the first non-display area (NDA1), the second non-display area (NDA2), and the third non-display area (NDA3) may have substantially the same elongation rates, but the elongation rate of the fourth non-display area (NDA4) may be less than the elongation rates of each of the first non-display area (NDA1), the second non-display area (NDA2), and the third non-display area (NDA3).

[0071] FIG. 4a is an enlarged plan view of part IV of FIG. 3 as part of a display device (1) according to one embodiment of the present invention.

[0072] Referring to FIG. 4a, the display device (1) may include first island portions (11) spaced apart from each other along a first direction (e.g., x direction or -x direction) and a second direction (e.g., y direction or -y direction) in a display area (DA), and first bridge portions (12) connecting adjacent first island portions (11).

[0073] Each first island portion (11) may be connected to a plurality of first bridge portions (12). For example, each first island portion (11) may be connected to four first bridge portions (12). Two first bridge portions (12) may be arranged on both sides of the first island portion (11) along a first direction (e.g., x direction or -x direction), and the remaining two first bridge portions (12) may be arranged on both sides of the first island portion (11) along a second direction (e.g., y direction or -y direction). In one embodiment, four first bridge portions (12) may be connected to four side edges of the first island portion (11), respectively. Each of the four first bridge portions (12) may be adjacent to each corner of the first island portion (11).

[0074] The first bridge portions (12) may be spaced apart from each other by first openings (CS1) positioned between the first bridge portions (12). In one embodiment, the first openings (CS1) having an approximately H shape and the first openings (CS1) having an approximately I shape obtained by rotating the aforementioned H shape by 90 degrees may be alternately and repeatedly arranged along the first direction (e.g., the x direction or the -x direction) and the second direction (e.g., the y direction or the -y direction). The two ends of each first bridge portion (12) are connected to each of the adjacent first island portions (11), and one side of each first bridge portion (12) may be spaced apart from one side of the adjacent first island portion (11) and / or one side of another first bridge portion (12) by the first openings (CS1).

[0075] The display device (1) may include second island portions (21) spaced apart from each other in a non-display area, for example, the first non-display area (NDA1) illustrated in FIG. 4a, and second bridge portions (22) connecting adjacent second island portions (21).

[0076] Each second island portion (21) may extend along a first direction (e.g., the x direction or the -x direction). The second island portions (21) may be spaced apart from each other along a second direction (e.g., the y direction or the -y direction) intersecting the first direction (e.g., the x direction or the -x direction). Each second island portion (21) may include drivers of a gate drive circuit (GDC, FIG. 2) described with reference to FIG. 3.

[0077] The second bridge portion (22) may have a serpentine shape. The length of the second bridge portion (22) may be greater than the shortest distance between adjacent second island portions (21) along the second direction (e.g., the y direction or the -y direction). In one embodiment, the second bridge portion (22) may have a shape of approximately omega (Ω) that is convex toward the first direction (e.g., the x direction or the -x direction). The second bridge portions (22) may be arranged between adjacent second island portions (21), but may be spaced apart from each other.

[0078] The second bridge portions (22) between adjacent second island portions (21) can be spaced apart from each other by the second opening portions (CS2). Between the adjacent second island portions (21), the second opening portions (CS2) and the second bridge portions (22) can be alternately arranged along the first direction (e.g., the x direction or the -x direction). The second opening portions (CS2) can have the same shape. Both ends of each second bridge portion (22) are connected to the adjacent second island portions (21), but one side of each second bridge portion (22) can be spaced apart from the side of the adjacent second island portion (21) and / or one side of another second bridge portion (22) by the second opening portion (CS2).

[0079] Any one of the second island portions (21) arranged in the first non-display area (NDA1) may correspond to the first island portions (11) of a plurality of rows arranged in the display area (DA). For example, any one of the second island portions (21) arranged in the first non-display area (NDA1) may correspond to the first island portions (11) arranged in the (i)th row and the first island portions (11) arranged in the (i+1)th row in the display area (DA) (wherein, i is a positive number greater than 0). Although FIG. 4A illustrates that one second island portion (21) corresponds to two rows of the first island portions (11), the present invention is not limited thereto. In another embodiment, any one of the second island portions (21) arranged in the first non-display area (NDA1) may correspond to n rows of the first island portions (11) arranged in the display area (DA) (where n is a positive integer greater than or equal to 3).

[0080] A non-display area, for example, a first non-display area (NDA1), may include a first sub-non-display area (SNDA1) in which the aforementioned second island portions (21) and second bridge portions (22) are arranged, and a second sub-non-display area (SNDA2) between the first sub-non-display area (SNDA1) and the display area (DA). Third bridge portions (23) may be arranged in the second sub-non-display area (SNDA2) to connect the display area (DA) and the first sub-non-display area (SNDA1). One end of the third bridge portion (23) may be connected to the second island portion (21) and / or the second bridge portion (22), and the other end of the third bridge portion (23) may be connected to the first island portion (11) and / or the first bridge portion (12).

[0081] The third bridge portion (23) may have a serpentine shape. In one embodiment, the shape of the third bridge portion (23) may be different from the shapes of each of the first bridge portion (12) and the second bridge portion (22). In one embodiment, as illustrated in FIG. 4A, the third bridge portion (23) may have a shape of approximately omega (Ω) that is convex in the second direction (e.g., the y direction or the -y direction). Among adjacent third bridge portions (23) arranged along the second direction (e.g., the y direction or the -y direction), one may have a structure that is symmetrical to each other, such as being convex in the y direction and the other being convex in the -y direction. Between the third bridge portions (23), the third opening portions (CS3) and the fourth opening portions (CS4) of different shapes may have a structure in which they are repeated. The width of the third bridge portion (23) may be different from the width of the first bridge portion (12) and the width of the second bridge portion (22). In one embodiment, the width of the third bridge portion (23) may be larger than the width of the first bridge portion (12) and smaller than the width of the second bridge portion (22).

[0082] FIG. 4a shows that the second island portion (21) and the second bridge portion (22) of the non-display area, for example, the first non-display area (NDA1), have different shapes from the first island portion (11) and the first bridge portion (12) of the display area (DA), respectively. In another embodiment of the present invention, the second island portion (21) and the second bridge portion (22) of the non-display area may have the same shapes as the first island portion (11) and the first bridge portion (12) of the display area (DA), respectively.

[0083] FIG. 4b is an enlarged plan view of part IV of FIG. 3 as part of a display device (1) according to one embodiment of the present invention.

[0084] Referring to Fig. 4b, the display device (1) includes first island portions (11) that are spaced apart from each other in the display area (DA) and first bridge portions (12) that connect adjacent first island portions (11) that are spaced apart from each other by a first opening (CS1). The structure of the display area (DA) of Fig. 4b may be the same as the structure of the display area (DA) described above with reference to Fig. 4a.

[0085] The display device (1) may include second island portions (21) and second bridge portions (22) arranged in a non-display area, for example, a first non-display area (NDA1). In one embodiment, the second island portions (21) and the second bridge portions (22) may have substantially the same shape as the first island portions (11) and the first bridge portion (12), respectively.

[0086] The second island portions (21) can be spaced apart from each other in a first direction (e.g., x direction or -x direction) and a second direction (e.g., y direction or -y direction) in a non-display area, for example, a first non-display area (NDA1). Each of the second bridge portions (22) can connect adjacent second island portions (21). The second bridge portions (22) can be spaced apart from each other by a second opening (CS2) located between the second bridge portions (22).

[0087] The second opening (CS2) may have substantially the same shape as the first opening (CS1). For example, the second opening (CS2) having an approximately H shape and the second opening (CS2) having an approximately I shape may be alternately and repeatedly arranged in a non-display area, for example, the first non-display area (NDA1). The two ends of each second bridge portion (22) are connected to each of the adjacent second island portions (21), and one side of each second bridge portion (2) may be spaced apart from one side of the adjacent second island portion (21) and / or one side of another second bridge portion (22) by the second opening (CS2).

[0088] Each second island section (21) can be connected to four second bridge sections (22). Each second island section (21) can include drivers of the gate drive circuit (GDC, FIG. 2) described with reference to FIG. 3.

[0089] The second island portions (21) of any one row arranged in the first non-display area (NDA1) may correspond to the first island portions (11) of any one row arranged in the display area (DA). For example, the second island portions (21) arranged in the (i)th row along the first direction (e.g., the x direction or the -x direction) in the first non-display area (NDA1) may correspond to the first island portions (11) arranged in the same row, e.g., the (i)th row, in the display area (DA) (wherein, i is a positive number greater than 0).

[0090] The display device (1) may include third bridge units (23) arranged in a second sub-non-display area (SNDA2) for connecting a display area (DA) and a first sub-non-display area (SNDA1). The non-display area, for example, the first non-display area (NDA1), may include a first sub-non-display area (SNDA1) in which second island units (21) and second bridge units (22) are arranged, and a second sub-non-display area (SNDA2) including third bridge units (23) and positioned between the first sub-non-display area (SNDA1) and the display area (DA). The third bridge unit (23) may be substantially the same as the first bridge unit (12) and the second bridge unit (22). For example, the width of the third bridge unit (23) may be the same as the width of the first bridge unit (12) and the width of the second bridge unit (22).

[0091] FIG. 4c is an enlarged plan view of part IV of FIG. 3 as part of a display device according to one embodiment of the present invention.

[0092] Referring to FIG. 4c, the display device (1) may include first island portions (11) spaced apart from each other in a first direction (e.g., x direction or -x direction) and a second direction (e.g., y direction or -y direction) in the display area (DA), and first bridge portions (12) connecting adjacent first island portions (11).

[0093] The first bridge portions (12) may be arranged to be spaced apart from each other by a first opening (CS1) located between the first bridge portions (12). The first bridge portion (12) may have a winding shape. For example, as illustrated in Fig. 4c, the first bridge portion (12) may have a shape roughly like the letter 'S'.

[0094] Each first island portion (11) may be connected to a plurality of first bridge portions (12). For example, each first island portion (11) may be connected to four first bridge portions (12). Two first bridge portions (12) may be arranged on both sides of the first island portion (11) along a first direction (e.g., x direction or -x direction), and the remaining two first bridge portions (12) may be arranged on both sides of the first island portion (11) along a second direction (e.g., y direction or -y direction). The four first bridge portions (12) may be connected to four side edges of the first island portion (11), respectively. Each of the four first bridge portions (12) may be adjacent to each corner of the first island portion (11).

[0095] The display device (1) may include second island portions (21) spaced apart from each other in a first direction (e.g., x direction or -x direction) and a second direction (e.g., y direction or -y direction) in a non-display area, for example, a first non-display area (NDA1) illustrated in FIG. 4c, and second bridge portions (22) connecting adjacent second island portions (21).

[0096] The second bridge portions (22) may be spaced apart from each other by a second opening (CS2) located between the second bridge portions (22). The second bridge portion (22) may have a winding shape. For example, as illustrated in FIG. 4C, the second bridge portion (22) may have a shape roughly like the letter 'S'. The size and / or width of the second bridge portion (22) may be different from the size and / or width of the first bridge portion (12). For example, the size and / or width of the second bridge portion (22) may be larger than the size and / or width of the first bridge portion (12). The radius of curvature of the rounded portion of the second bridge portion (22) may be different from the radius of curvature of the rounded portion of the first bridge portion (12). For example, the radius of curvature of the rounded portion of the second bridge portion (22) may be greater than the radius of curvature of the rounded portion of the first bridge portion (12).

[0097] Each second island portion (21) can be connected to a plurality of second bridge portions (22). Each second island portion (21) can be connected to four second bridge portions (22). Two second bridge portions (22) can be arranged on both sides of the second island portion (21) along a first direction (e.g., x direction or -x direction), and the remaining two second bridge portions (22) can be arranged on both sides of the second island portion (21) along a second direction (e.g., y direction or -y direction). In one embodiment, four second bridge portions (22) can be respectively connected to four side edges of the second island portion (21). Each second bridge portion (22) can be connected to a central portion of each side edge of the second island portion (21).

[0098] The second island portions (21) of any one row arranged in the first non-display area (NDA1) may correspond to the first island portions (11) of a plurality of rows arranged in the display area (DA). For example, the second island portions (21) of any one row arranged in the first non-display area (NDA1) may correspond to the first island portions (11) arranged in the (i)-th row of the display area (DA) and the first island portions (11) arranged in the (i+1)-th row (here, i is a positive integer greater than 0). In another embodiment, the second island portions (21) of any one row may correspond to n rows of the first island portions (11) (here, n is a positive integer greater than 3).

[0099] A non-display area, for example, a first non-display area (NDA1), may include a first sub-non-display area (SNDA1) in which the aforementioned second island portions (21) and second bridge portions (22) are arranged, and a second sub-non-display area (SNDA2) between the first sub-non-display area (SNDA1) and the display area (DA). Third bridge portions (23) may be arranged in the second sub-non-display area (SNDA2) to connect the display area (DA) and the first sub-non-display area (SNDA1). One end of the third bridge portion (23) may be connected to the second island portion (21), and the other end of the third bridge portion (23) may be connected to the first island portion (11). For example, one end of the third bridge portion (23) may be connected to the central portion of one side of the second island portion (21), and the other end of the third bridge portion (23) may be connected to the central portion of one side of the first island portion (11).

[0100] The third bridge portion (23) may have a winding shape. In one embodiment, the shape of the third bridge portion (23) may be different from the shapes of the first bridge portion (12) and the second bridge portion (22). The width of the third bridge portion (23) may be different from the width of the first bridge portion (12) and the width of the second bridge portion (22). The width of the third bridge portion (23) may be larger than the width of the first bridge portion (12) and smaller than the width of the second bridge portion (22). Third openings (CS3) and fourth openings (CS4) of different shapes may be alternately arranged between the third bridge portions (23) in the second direction (e.g., the y direction or the -y direction).

[0101] FIG. 5 is a cross-sectional view schematically showing a first island portion (11) and a first bridge portion (12) arranged in a display area (DA) of a display device (1) according to one embodiment of the present invention.

[0102] Referring to Fig. 5, the first island portion (11) and the first bridge portion (12) arranged in the display area (DA) may be spaced apart from each other with the first opening (CS1) therebetween. The first island portion (11) includes light-emitting elements (LEDs) and a circuit for driving the light-emitting elements electrically connected thereto, for example, a pixel driving circuit portion (PC), and the first bridge portion (12) may include wiring (WL) electrically connected to pixel driving circuit portions (PC) arranged in each of the adjacent first island portions (11).

[0103] Looking at the first island portion (11), a buffer layer (111) including an inorganic insulator is disposed on a substrate (100), and a pixel driver circuit (PC) may be disposed on the buffer layer (111). An insulating layer (IL) including an inorganic insulator and / or an organic insulator may be disposed between the pixel driver circuit (PC) and the light emitting element (LED). The light emitting element (LED) is disposed on the insulating layer (IL) and may be electrically connected to a corresponding pixel driver circuit (PC). The light emitting elements (LED) may emit light of different colors or the same color. In one embodiment, the light emitting elements (LED) may emit red, green, and blue light, respectively. In some embodiments, the light emitting elements (LED) may emit white light. In another embodiment, the light emitting elements (LED) may emit red, green, blue, and white light, respectively.

[0104] The substrate (100) may include a polymer resin such as polyethersulfone, polyarylate, polyether imide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. In one embodiment, the substrate (100) may be a single layer including the aforementioned polymer resin. In another embodiment, the substrate (100) may be a multilayer structure including a base layer including the aforementioned polymer resin and a barrier layer including an inorganic insulating material. The substrate (100) including the polymer resin may have flexible, rollable, and bendable properties.

[0105] In one embodiment, FIG. 5 illustrates three pixel driver circuits (PCs) arranged in each first island portion (11) and three light-emitting elements (LEDs) connected to each pixel driver circuit portion (PC), but the present invention is not limited thereto. In another embodiment, the number of pixel driver circuits (PCs) and light-emitting elements (LEDs) arranged in the first island portion (11) may be one, two, four or more.

[0106] The encapsulation layer (300) may be disposed on a light-emitting element (LED) and may protect the light-emitting element (LED) from external force and / or moisture permeation. The encapsulation layer (300) may include an inorganic encapsulation layer and / or an organic encapsulation layer. In some embodiments, the encapsulation layer (300) may include a structure in which an inorganic encapsulation layer including an inorganic insulating material, an organic encapsulation layer including an organic insulating material, and an inorganic encapsulation layer including an inorganic insulating material are laminated. In other embodiments, the encapsulation layer (300) may include an organic material such as a resin. In some embodiments, the encapsulation layer (300) may include urethane epoxy acrylate. The encapsulation layer (300) may include a photosensitive material, for example, a material such as a photoresist.

[0107] Looking at the first bridge portion (12), an insulating layer (IL) including an organic insulating material may be placed on the substrate (100). When the display device (1) is stretched, the first bridge portion (12), which is relatively subject to a large amount of deformation, may not have a layer including an inorganic insulating material that is prone to cracking, unlike the first island portion (11).

[0108] In one embodiment, the substrate (100) corresponding to the first bridge portion (12) may have the same laminated structure as the substrate (100) corresponding to the first island portion (11). In one embodiment, the substrate (100) corresponding to the first bridge portion (12) and the substrate (100) corresponding to the first island portion (11) may be polymer resin layers formed together in the same process. In another embodiment, the substrate (100) corresponding to the first bridge portion (12) may have a different laminated structure from the substrate (100) corresponding to the first island portion (11). In some embodiments, the substrate (100) corresponding to the first bridge portion (12) may have a multilayer structure including a base layer including a polymer resin and a barrier layer including an inorganic insulating material, and the substrate (100) corresponding to the first bridge portion (12) may have a structure of a polymer resin layer without a layer including an inorganic insulating material.

[0109] The wirings (WL) of the first bridge unit (12) may be signal lines (e.g., gate lines, data lines, etc.) for providing electrical signals to transistors included in the pixel driving circuit unit (PC) of the first island unit (11), as described above, or voltage lines (e.g., driving voltage lines, initialization voltage lines, etc.) for providing voltage. An encapsulation layer (300) may also be arranged in the first bridge unit (12). In another embodiment, the encapsulation layer (300) may not be present in the first bridge unit (12).

[0110] Referring to FIGS. 4A to 4C and FIG. 5, the substrate (100) corresponding to the first island portion (11) and the substrate (100) corresponding to the first bridge portion (12) may be connected to each other. In other words, the plan views illustrated in FIGS. 4A to 4C may be substantially the same as the plan view of the substrate (100) of FIG. 5. In other words, the substrate (100) may include an area corresponding to the first island portion (11), an area corresponding to the first bridge portion (12), and an opening (100OP1) having the same shape as the first opening (CS1).

[0111] Similarly, the sealing layer (300) corresponding to the first island portion (11) and the sealing layer (300) corresponding to the first bridge portion (12) may be connected to each other. For example, the plan views illustrated in FIGS. 4A to 4C above may be substantially identical to the plan views of the sealing layer (300). In other words, the sealing layer (300) may include an area corresponding to the first island portion (11), an area corresponding to the first bridge portion (12), and an opening (300OP1) having the same shape as the first opening portion (CS1).

[0112] The circuit-light-emitting element layer (200) between the substrate (100) and the encapsulation layer (300) may include a buffer layer (111), a pixel driving circuit (PC), a wiring (WL), an insulating layer (IL), and a light-emitting element (LED). Similar to the substrate (100), the plan views illustrated in FIGS. 4A to 4C may be substantially the same as the plan views of the circuit-light-emitting element layer (200). In other words, the circuit-light-emitting element layer (200) may include an opening (200OP1) having the same shape as the first opening (CS1).

[0113] Figures 6a to 6c are equivalent circuit diagrams of subpixels of a display device (1) according to one embodiment of the present invention, respectively.

[0114] Referring to FIG. 6a, a light emitting element (LED) corresponding to a subpixel is electrically connected to a pixel driver circuit (PC), and the pixel driver circuit (PC) may include a first transistor (T1), a second transistor (T2), and a storage capacitor (Cst). The pixel driver circuit (PC) may be electrically connected to a signal line and a voltage line. The signal line may include a gate line such as a first scan line (SL1) and a data line (DL), and the voltage line may include a first voltage line (VDDL).

[0115] The second transistor (T2) can be electrically connected to the first scan line (SL1) and the data line (DL). The first scan line (SL1) can provide a first scan signal (GW1) to a gate electrode of the second transistor (T2). The second transistor (T2) can transmit a data signal (Dm) input from the data line (DL) to the first transistor (T1) according to the first scan signal (GW1) input from the first scan line (SL1).

[0116] The storage capacitor (Cst) is electrically connected to the second transistor (T2) and the first voltage line (VDDL), and can store a voltage corresponding to the difference between the voltage received from the second transistor (T2) and the first power voltage (VDD) supplied by the first voltage line (VDDL).

[0117] The first transistor (T1) is a driving transistor and can control a driving current flowing through a light-emitting element (LED). The first transistor (T1) can be connected to a first voltage line (VDDL) and a storage capacitor (Cst). The first transistor (T1) can control a driving current flowing through the light-emitting element (LED) from the first voltage line (VDDL) in response to a voltage value stored in the storage capacitor (Cst). The light-emitting element (LED) can emit light having a predetermined brightness by the driving current. A first electrode of the light-emitting element (LED) can be electrically connected to the first transistor (T1), and a second electrode can be electrically connected to a second voltage line (VSSL) that supplies a second power voltage (VSS).

[0118] Although FIG. 6a illustrates that the pixel driver circuit (PC) includes two transistors and one storage capacitor, in other embodiments, the pixel driver circuit (PC) may include three or more transistors.

[0119] Referring to FIG. 6b, the pixel driving circuit unit (PC) may include a first transistor (T1), a second transistor (T2), a third transistor (T3), a fourth transistor (T4), a fifth transistor (T5), a sixth transistor (T6), a seventh transistor (T7), and a storage capacitor (Cst).

[0120] The pixel driver circuit (PC) is electrically connected to signal lines and voltage lines. The signal lines may include gate lines such as a first scan line (SL1), a second scan line (SL2), a third scan line (SL3), a fourth scan line (SL4), and an emission control line (EML), and a data line (DL). The voltage lines may include first and second initialization voltage lines (VIL1, VIL2) and a first voltage line (VDDL).

[0121] The first voltage line (VDDL) can transmit the first power voltage (VDD) to the first transistor (T1). The first initialization voltage line (VIL1) can transmit the first initialization voltage (Vint) that initializes the first transistor (T1) to the pixel driver circuit (PC). The second initialization voltage line (VIL2) can transmit the second initialization voltage (Vaint) that initializes the first electrode of the light-emitting element (LED) to the pixel driver circuit (PC).

[0122] The first transistor (T1) may be electrically connected to the first voltage line (VDDL) via the fifth transistor (T5) and may be electrically connected to the light-emitting element (LED) via the sixth transistor (T6). The first transistor (T1) functions as a driving transistor, and receives a data signal (Dm) according to the switching operation of the second transistor (T2) to supply a driving current to the light-emitting element (LED).

[0123] The second transistor (T2) is a data writing transistor and is electrically connected to the first scan line (SL1) and the data line (DL). The second transistor (T2) is electrically connected to the first voltage line (VDDL) via the fifth transistor (T5). The second transistor (T2) is turned on in response to the first scan signal (GW) received through the first scan line (SL1) and performs a switching operation to transmit the data signal (Dm) transmitted to the data line (DL) to the first node (N1).

[0124] The third transistor (T3) is electrically connected to the first scan line (SL1) and is electrically connected to the light-emitting element (LED) via the sixth transistor (T6). The third transistor (T3) can be turned on in response to the first scan signal (GW) received through the first scan line (SL1) to diode-connect the first transistor (T1).

[0125] The fourth transistor (T4) is a first initialization transistor and is electrically connected to the third scan line (SL3) and the first initialization voltage line (VIL1). The fourth transistor (T4) is turned on according to the third scan signal (GI) received through the third scan line (SL3) and transmits the first initialization voltage (Vint) from the first initialization voltage line (VIL1) to the gate electrode of the first transistor (T1) to initialize the voltage of the gate electrode of the first transistor (T1). The third scan signal (GI) may correspond to the first scan signal of another pixel driver circuit unit arranged in the previous row of the corresponding pixel driver circuit unit (PC).

[0126] The fifth transistor (T5) may be a motion control transistor, and the sixth transistor (T6) may be a light emission control transistor. The fifth transistor (T5) and the sixth transistor (T6) are electrically connected to the light emission control line (EML), and are turned on simultaneously according to the light emission control signal (EM) transmitted through the light emission control line (EML), thereby forming a current path so that a driving current can flow from the first voltage line (VDDL) in the direction of the light emitting element (LED).

[0127] The seventh transistor (T7) is a second initialization transistor and can be electrically connected to the second scan line (SL2), the second initialization voltage line (VIL2), and the sixth transistor (T6). The seventh transistor (T7) is turned on according to the second scan signal (GB) transmitted through the second scan line (SL2), and can transmit the second initialization voltage (Vaint) from the second initialization voltage line (VIL2) to the first electrode of the light-emitting element (LED) to initialize the first electrode of the light-emitting element (LED).

[0128] A storage capacitor (Cst) includes a first electrode (CE1) and a second electrode (CE2). The first electrode (CE1) is electrically connected to the gate electrode of the first transistor (T1), and the second electrode (CE2) is electrically connected to the first voltage line (VDDL). The storage capacitor (Cst) can maintain a voltage applied to the gate electrode of the first transistor (T1) by storing and maintaining a voltage corresponding to a difference between the voltages at both ends of the first voltage line (VDDL) and the gate electrode of the first transistor (T1).

[0129] Referring to FIG. 6c, the pixel driving circuit unit (PC) may include a first transistor (T1), a second transistor (T2), a third transistor (T3), a fourth transistor (T4), a fifth transistor (T5), a sixth transistor (T6), a seventh transistor (T7), an eighth transistor (T8), a ninth transistor (T9), a storage capacitor (Cst), and an auxiliary capacitor (Ca).

[0130] The pixel driver circuit (PC) is electrically connected to signal lines and voltage lines. The signal lines may include gate lines such as a first scan line (SL1), a second scan line (SL2), a third scan line (SL3), a fourth scan line (SL4), and an emission control line (EML), and a data line (DL). The voltage lines may include first and second initialization voltage lines (VIL1, VIL2), a sustain voltage line (VSL), and a first voltage line (VDDL).

[0131] The first voltage line (VDDL) can transmit a first power voltage (VDD) to the first transistor (T1). The first initialization voltage line (VIL1) can transmit a first initialization voltage (Vint) for initializing the first transistor (T1) to the pixel driver circuit (PC). The second initialization voltage line (VIL2) can transmit a second initialization voltage (Vaint) for initializing the first electrode of the light-emitting element (LED) to the pixel driver circuit (PC). The sustain voltage line (VSL) can provide a sustain voltage (VSUS) to the second node (N2), for example, the second electrode (CE2) of the storage capacitor (Cst), during the initialization period and the data writing period.

[0132] The first transistor (T1) may be electrically connected to the first voltage line (VDDL) via the fifth transistor (T5) and the eighth transistor (T8), and may be electrically connected to the light-emitting element (LED) via the sixth transistor (T6). The first transistor (T1) functions as a driving transistor, and may receive a data signal (Dm) according to the switching operation of the second transistor (T2) to supply a driving current to the light-emitting element (LED).

[0133] The second transistor (T2) is electrically connected to the first scan line (SL1) and the data line (DL), and is electrically connected to the first voltage line (VDDL) via the fifth transistor (T5) and the eighth transistor (T8). The second transistor (T2) is turned on in response to the first scan signal (GW) received through the first scan line (SL1) and performs a switching operation to transmit the data signal (Dm) transmitted to the data line (DL) to the first node (N1).

[0134] The third transistor (T3) is electrically connected to the first scan line (SL1) and is electrically connected to the light-emitting element (LED) via the sixth transistor (T6). The third transistor (T3) is turned on in response to the first scan signal (GW) received through the first scan line (SL1), thereby diode-connecting the first transistor (T1), thereby compensating for the threshold voltage of the first transistor (T1).

[0135] The fourth transistor (T4) is electrically connected to the third scan line (SL3) and the first initialization voltage line (VIL1), and is turned on in response to the third scan signal (GI) transmitted through the third scan line (SL3) to transmit the first initialization voltage (Vint) from the first initialization voltage line (VIL1) to the gate electrode of the first transistor (T1) to initialize the voltage of the gate electrode of the first transistor (T1). The third scan signal (GI) may correspond to the first scan signal of another pixel driving circuit unit arranged in the previous row of the corresponding pixel driving circuit unit (PC).

[0136] The fifth transistor (T5), the sixth transistor (T6), and the eighth transistor (T8) are electrically connected to the light emission control line (EML), and are simultaneously turned on in response to the light emission control signal (EM) transmitted through the light emission control line (EML), thereby forming a current path so that a driving current can flow from the first voltage line (VDDL) in the direction of the light emitting element (LED).

[0137] The seventh transistor (T7) is a second initialization transistor and can be electrically connected to the second scan line (SL2), the second initialization voltage line (VIL2), and the sixth transistor (T6). The seventh transistor (T7) is turned on in response to the second scan signal (GB) received through the second scan line (SL2) and transmits the second initialization voltage (Vaint) from the second initialization voltage line (VIL2) to the first electrode of the light-emitting element (LED) to initialize the first electrode of the light-emitting element (LED).

[0138] The ninth transistor (T9) can be electrically connected to the second scan line (SL2), the second electrode (CE2) of the storage capacitor (Cst), and the sustain voltage line (VSL). The ninth transistor (T9) is turned on according to the second scan signal (GB) transmitted through the second scan line (SL2), and can transmit the sustain voltage (VSUS) to the second node (N2), for example, the second electrode (CE2) of the storage capacitor (Cst), during the initialization section and the data writing section.

[0139] The eighth transistor (T8) and the ninth transistor (T9) may be electrically connected to a second node (N2), for example, a second electrode (CE2) of a storage capacitor (Cst), respectively. In some embodiments, the eighth transistor (T8) may be turned off and the ninth transistor (T9) may be turned on in an initialization period and a data writing period, and the eighth transistor (T8) may be turned on and the ninth transistor (T9) may be turned off in an emission period. Since the sustain voltage (VSUS) is transmitted to the second node (N2) in the initialization period and the data writing period, the uniformity of the luminance (e.g., LRU, Long Range Uniformity) of the display device according to the voltage drop of the first voltage line (VDDL) may be improved.

[0140] The storage capacitor (Cst) includes a first electrode (CE1) and a second electrode (CE2). The first electrode (CE1) is electrically connected to the gate electrode of the first transistor (T1), and the second electrode (CE2) is electrically connected to the eighth transistor (T8) and the ninth transistor (T9).

[0141] The auxiliary capacitor (Ca) can be electrically connected to the sixth transistor (T6), the sustain voltage line (VSL), and the first electrode of the light-emitting element (LED). The auxiliary capacitor (Ca) stores and maintains a voltage corresponding to the voltage difference between the first electrode of the light-emitting element (LED) and the sustain voltage line (VSL) while the seventh transistor (T7) and the ninth transistor (T9) are turned on, thereby preventing the problem of the black luminance increasing when the sixth transistor (T6) is turned off.

[0142] Figure 7 is a schematic cross-sectional view of a part of a display device (1) according to one embodiment of the present invention.

[0143] Fig. 7 may correspond to the display area (DA, see Fig. 1) described above in Figs. 1, 2a to 2e, 3, 4a to 4c, and 5. Specifically, Fig. 7 may correspond to the first island portion (11, see 4a) described above in Figs. 4a to 4c, and 5.

[0144] Referring to FIG. 7, a display device (1) of one embodiment of the present invention may include a substrate (100), a buffer layer (201), a pixel driving circuit (PC), an inorganic insulating layer (IIL), an organic insulating layer (OIL), a first connection electrode (CM1), a second connection electrode (CM2), a first conductive organic film (215), a second conductive organic film (217), an inorganic light-emitting diode (mLED), a bank layer (BKL), an encapsulation layer (300), and a filter panel (400).

[0145] The substrate (100) may include various materials. Specifically, the substrate (100) may be formed of glass, metal, or other organic materials. As an optional embodiment, the substrate (100) may be formed of a flexible material. For example, the substrate (100) may be formed of a material that can be bent, curved, folded, or rolled. The flexible material forming the substrate (100) may be ultra-thin glass, metal, or plastic. When the substrate (100) includes plastic, the substrate (100) may contain polyimide (PI). As another example, the substrate (100) may contain another type of plastic material. The substrate (100) described with reference to FIG. 7 may correspond to the substrate (100, see FIG. 5) described above with reference to FIG. 5.

[0146] A buffer layer (201) may be disposed on a substrate (100). The buffer layer (201) may prevent impurities from penetrating into the semiconductor layer of a thin film transistor. The buffer layer (201) described with reference to FIG. 7 may correspond to the buffer layer (111, see FIG. 5) described above in FIG. 5.

[0147] The inorganic insulating layer (IIL) may be disposed on the buffer layer (201). That is, the inorganic insulating layer (IIL) may be disposed on the substrate (100). The inorganic insulating layer (IIL) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, or hafnium oxide. The inorganic insulating layer (IIL) may be a single layer or multiple layers including the aforementioned materials.

[0148] The inorganic insulating layer (IIL) may include a gate insulating layer (203), a first interlayer insulating layer (205), and a second interlayer insulating layer (207). The first interlayer insulating layer (205) may be disposed on the gate insulating layer (203), and the second interlayer insulating layer (207) may be disposed on the first interlayer insulating layer (205). That is, the gate insulating layer (203), the first interlayer insulating layer (205), and the second interlayer insulating layer (207) may be sequentially disposed along a third direction (e.g., z direction) away from the substrate (100).

[0149] The pixel driving circuit (PC) may be disposed on the buffer layer (201). That is, the pixel driving circuit (PC) may be disposed on the substrate (100). The pixel driving circuit (PC) may include a thin film transistor (TFT) and a storage capacitor (Cst).

[0150] A thin film transistor (TFT) may include a semiconductor layer (Act), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). In the present embodiment, a top gate type is illustrated in which the gate electrode (GE) is disposed on the semiconductor layer (Act) with a gate insulating layer (203) in the middle. However, according to another embodiment, the thin film transistor (TFT) may be a bottom gate type.

[0151] The semiconductor layer (Act) may include polysilicon. Alternatively, the semiconductor layer (Act) may include amorphous silicon, an oxide semiconductor, an organic semiconductor, or the like. The gate electrode (GE) may include a low-resistance metal material. The gate electrode (GE) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may be formed as a multilayer or single layer including the above materials.

[0152] The source electrode (SE) and the drain electrode (DE) may include a material having good conductivity. The source electrode (SE) and the drain electrode (DE) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may be formed as a multilayer or single layer including the above materials. In one embodiment, the source electrode (SE) and the drain electrode (DE) may be formed as a multilayer of Ti / Al / Ti.

[0153] On a plane, the storage capacitor (Cst) may include a lower electrode (CE1) and an upper electrode (CE2) that overlap with a first interlayer insulating layer (205) therebetween. On a plane, the storage capacitor (Cst) may overlap with a thin film transistor (TFT). In this regard, FIG. 7 illustrates that the gate electrode (GE) of the thin film transistor (TFT) is the lower electrode (CE1) of the storage capacitor (Cst). In another embodiment, on a plane, the storage capacitor (Cst) may not overlap with the thin film transistor (TFT). The storage capacitor (Cst) may be covered with a second interlayer insulating layer (207).

[0154] The pixel driving circuit unit (PC) described with reference to FIG. 7 may correspond to the pixel driving circuit unit (PC, see FIG. 5) described above in FIG. 5.

[0155] An organic insulating layer (OIL) may be disposed on the inorganic insulating layer (IIL). The organic insulating layer (OIL) may cover the pixel driving circuit (PC). The organic insulating layer (OIL) may include an organic insulator, such as a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystylene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorinated polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof.

[0156] The organic insulating layer (OIL) may include a first organic insulating layer (209), a second organic insulating layer (211), and a third organic insulating layer (213). The first organic insulating layer (209) covers the pixel driving circuit (PC), the second organic insulating layer (211) is disposed on the first organic insulating layer (209), and the third organic insulating layer (213) may be disposed on the second organic insulating layer (211). That is, the first organic insulating layer (209), the second organic insulating layer (211), and the third organic insulating layer (213) may be sequentially disposed along a third direction (e.g., z direction) away from the substrate (100). The first organic insulating layer (209), the second organic insulating layer (211), and the third organic insulating layer (213) can be formed of the same material or can be formed of different materials, and various modifications are possible.

[0157] In order to form the first organic insulating layer (209), the second organic insulating layer (211), and the third organic insulating layer (213), a liquid organic material may be applied, and then a mask process and a development process may be performed so that a contact hole is formed. In this way, the first organic insulating layer (209), the second organic insulating layer (211), and the third organic insulating layer (213) are formed by curing the liquid organic material, so that the upper surfaces thereof can be formed to be approximately flat.

[0158] The inorganic insulating layer (IIL) and organic insulating layer (OIL) described with reference to FIG. 7 may correspond to the insulating layer (IL, see FIG. 5) described above in FIG. 5.

[0159] The first connection electrode (CM1) is disposed on an organic insulating layer (OIL) and can be electrically connected to a pixel driver circuit (PC). The first connection electrode (CM1) can be electrically connected to the first voltage line (VDDL, see FIG. 6a) described above with reference to FIGS. 6a to 6c.

[0160] The first connection electrode (CM1) may include a first-first connection electrode (CM1-1) and a first-second connection electrode (CM1-2). The first-first connection electrode (CM1-1) may be interposed between the first organic insulating layer (209) and the second organic insulating layer (211) and may be in contact with the pixel driving circuit (PC). The first-second connection electrode (CM1-2) may be disposed on the first-first connection electrode (CM1-1). The first-second connection electrode (CM1-2) may be interposed between the second organic insulating layer (211) and the third organic insulating layer (213) and may be in contact with the first-first connection electrode (CM1-1).

[0161] The second connection electrode (CM2) may be disposed on the organic insulating layer (OIL). For example, the second connection electrode (CM2) may be interposed between the second organic insulating layer (211) and the third organic insulating layer (213). The second connection electrode (CM2) may be connected to the second voltage line (VSSL, see FIG. 6A) described above with reference to FIGS. 6A to 6C.

[0162] In Fig. 7, the first-first connection electrode (CM1-1) and the second connection electrode (CM2) are arranged on different layers, and the first-second connection electrode (CM1-2) and the second connection electrode (CM2) are arranged on the same layer. However, this is only an example, and the arrangement of the first connection electrode (CM1) and the second connection electrode (CM2) is not limited to this.

[0163] The organic insulating layer (OIL) can define a first opening (OP1) and a second opening (OP2). The first opening (OP1) and the second opening (OP2) can be arranged to be spaced apart from each other.

[0164] On a plane, the first opening (OP1) may overlap with the first connection electrode (CM1). The first opening (OP1) may penetrate the organic insulating layer (OIL) to be in contact with the first connection electrode (CM1). For example, the first opening (OP1) may penetrate the third organic insulating layer (213). The first opening (OP1) may be surrounded by the organic insulating layer (OIL) and the first connection electrode (CM1).

[0165] On the plane, the second opening (OP2) may overlap the second connection electrode (CM2). The second opening (OP2) may penetrate the organic insulating layer (OIL) to be in contact with the second connection electrode (CM2). For example, the second opening (OP2) may penetrate the third organic insulating layer (213). The second opening (OP2) may be surrounded by the organic insulating layer (OIL) and the second connection electrode (CM2).

[0166] The first conductive organic film (215) can be accommodated in the first opening (OP1) so as to be electrically connected to the pixel driver circuit (PC). For example, the first conductive organic film (215) can be in contact with the first connection electrode (CM1) that is electrically connected to the pixel driver circuit (PC). That is, the first connection electrode (CM1) can be disposed between the pixel driver circuit (PC) and the first conductive organic film (215), thereby connecting the pixel driver circuit (PC) and the first conductive organic film (215).

[0167] The first conductive organic film (215) may include a carbon black material. At this time, the first connection electrode (CM1) may include at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo), which is conductive to the first conductive organic film (215). For example, the upper surface of the first-second connection electrode (CM1-2) may be treated with at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0168] The second conductive organic film (217) can be accommodated in the second opening (OP2) and can be in contact with the second connection electrode (CM2). The second conductive organic film (217) can be arranged in the same layer as the first conductive organic film (215). The second connection electrode (CM2) can be arranged between the pixel driver circuit (PC) and the second conductive organic film (217) and can be connected to the second conductive organic film (217). The second conductive organic film (217) can be electrically connected to the second connection electrode (CM2). Since the second opening (OP2) accommodates the second conductive organic film (217), the second conductive organic film (217) can be arranged to be spaced apart from the first conductive organic film (215).

[0169] The second conductive organic film (217) is formed of the same material as the first conductive organic film (215), and the second connection electrode (CM2) may be formed of the same material as the first connection electrode (CM1). The second conductive organic film (217) may include a carbon black material. In this case, the second connection electrode (CM2) may include at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo), which is conductive to the second conductive organic film (217). For example, the upper surface of the second connection electrode (CM2) may be treated with at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0170] The mLED emits a first light (L1) and may include a first electrode (241), a first semiconductor layer (242), an intermediate layer (243), a second semiconductor layer (244), and a second electrode (245).

[0171] A first semiconductor layer (242) may be disposed on a first electrode (241), an intermediate layer (243) may be disposed on the first semiconductor layer (242), and a second semiconductor layer (244) may be disposed on the intermediate layer (243). That is, the intermediate layer (243) may be interposed between the first semiconductor layer (242) and the second semiconductor layer (244). In addition, the second electrode (245) may be disposed to be spaced apart from the first electrode (241), and the second semiconductor layer (244) may be disposed on the second electrode (245). The first electrode (241), the first semiconductor layer (242), the intermediate layer (243), the second semiconductor layer (244), and the second electrode (245) may be electrically connected to each other.

[0172] At least a portion of the first electrode (241) may be accommodated in the first conductive organic film (215) and electrically connected to the first conductive organic film (215). In addition, at least a portion of the second electrode (245) may be accommodated in the second conductive organic film (217) and electrically connected to the second conductive organic film (217).

[0173] In some embodiments, the first semiconductor layer (242) may include a p-type semiconductor layer. The p-type semiconductor layer may be selected from semiconductor materials having a composition formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc., and may be doped with a p-type dopant such as Mg, Zn, Ca, Sr, or Ba.

[0174] The second semiconductor layer (244) may include, for example, an n-type semiconductor layer. The n-type semiconductor layer may be selected from semiconductor materials having a composition formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc., and may be doped with an n-type dopant such as Si, Ge, or Sn.

[0175] The intermediate layer (243) is a region where electrons and holes recombine, and as the electrons and holes recombine, they transition to a lower energy level and can generate light having a corresponding wavelength. In one embodiment, the intermediate layer (243) may be formed by including, for example, a semiconductor material having a composition formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and may be formed as a single quantum well structure or a multi-quantum well structure (MQW). In addition, it may also include a quantum wire structure or a quantum dot structure.

[0176] Although Fig. 7 illustrates that the first semiconductor layer (242) includes a p-type semiconductor layer and the second semiconductor layer (244) includes an n-type semiconductor layer, the present invention is not limited thereto. In another embodiment, the first semiconductor layer (242) may include an n-type semiconductor layer and the second semiconductor layer (244) may include a p-type semiconductor layer.

[0177] The bank layer (BKL) may be disposed on an organic insulating layer (OIL). The bank layer (BKL) may include an insulating material and define openings exposing a first opening (OP1) and a second opening (OP2). That is, an inorganic light-emitting diode (mLED) may be disposed in an opening disposed in the bank layer (BKL).

[0178] The encapsulation layer (300) may be disposed on an inorganic light-emitting diode (mLED) and a bank layer (BKL). The inorganic light-emitting diode (mLED) may be covered by the encapsulation layer (300). The encapsulation layer (300) may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer (300) may include a first inorganic encapsulation layer (301), an organic encapsulation layer (303), and a second inorganic encapsulation layer (305) that are sequentially stacked.

[0179] The first inorganic sealing layer (301) and the second inorganic sealing layer (305) may each include one or more inorganic insulating materials. The inorganic insulating materials may include aluminum oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride. The organic sealing layer (303) may include a polymer-based material. Examples of polymer-based materials include acrylic resins, epoxy resins, polyimides, and polyethylene. The acrylic resin may include, for example, polymethyl methacrylate and polyacrylic acid.

[0180] The encapsulation layer (300) described with reference to FIG. 7 may correspond to the encapsulation layer (300, see FIG. 5) described above in FIG. 5.

[0181] The filter panel (400) may be placed on the sealing layer (300). That is, the filter panel (400) may be placed on an inorganic light-emitting diode (mLED). The filter panel (400) may include a color conversion unit (401), a color filter (403), and a light-shielding unit (405).

[0182] The color conversion unit (401) can convert the first light (L1) emitted by the inorganic light-emitting diode (mLED) into the second light (L2). The second light (L2) can be light of a different or the same color as the first light (L1). The first light (L1) emitted by the inorganic light-emitting diode (mLED) can be blue light. The color conversion unit (401) can convert the blue first light (L1) into red, green, or blue. The color filter (403) can be disposed on the color conversion unit (401). The color filter (403) can have the same color as the light converted by the color conversion unit (401). Therefore, the second light (L2) converted by the color conversion unit (401) can be emitted to the outside with improved purity as it passes through the color filter (403). The shading portion (405) may surround the color conversion portion (401) and the color filter (403). The shading portion (405) may include a black matrix.

[0183] The color conversion unit (401) may include quantum dots and scattering particles. The quantum dots may have a core-shell structure including a core comprising nanocrystals and a shell surrounding the core. The core of the quantum dot may be selected from a group II-VI compound, a group III-V compound, a group IV-VI compound, a group IV element, a group IV compound, and combinations thereof. The scattering particles may include TiO2.

[0184] Fig. 8 is a schematic cross-sectional view of a portion of a display device (1) according to one embodiment of the present invention. Specifically, Fig. 8 is an enlarged view of area A of Fig. 7.

[0185] Referring to FIGS. 7 and 8, the first conductive organic film (215) may be placed in the first opening (OP1). The first conductive organic film (215) may be in contact with the third organic insulating layer (213), the first-second connection electrode (CM1-2), and the first electrode (241). The shape of the first conductive organic film (215) may correspond to the shape of the first opening (OP1).

[0186] The upper surface (215U) of the first conductive organic film (215) may be recessed from the upper surface (213T) of the organic insulating layer (OIL). A height difference (H1) in a third direction (e.g., +z direction and / or -z direction) may be formed between the upper surface (215U) of the first conductive organic film (215) and the upper surface (213T) of the organic insulating layer (OIL). Here, the “upper surface” means the highest upper surface among the upper surfaces having multiple heights when there are multiple upper surfaces. That is, a step may be formed between the first conductive organic film (215) and the third organic insulating layer (213). In such a structure, the first conductive organic film (215) may not protrude from the organic insulating layer (OIL).

[0187] At least a portion of the first electrode (241) may be accommodated in the first conductive organic film (215). A lower portion of the first electrode (241) may be in contact with the first conductive organic film (215). A lower surface of the first electrode (241) may be immersed in the first conductive organic film (215).

[0188] The thickness (D241) of the first electrode (241) may be thicker than the height difference (H1) in the third direction (e.g., +z direction and / or -z direction) between the upper surface (215U) of the first conductive organic film (215) and the upper surface (213T) of the organic insulating layer (OIL). Accordingly, the first semiconductor layer (242) disposed on the first electrode (241) may be spaced apart from the first conductive organic film (215). That is, only the first electrode (241) among the inorganic light-emitting diodes may be in contact with the first conductive organic film (215).

[0189] FIG. 9 is a schematic cross-sectional view of a portion of a display device (1) according to one embodiment of the present invention. Specifically, FIG. 9 is an enlarged view of area B of FIG. 7.

[0190] Referring to FIGS. 7 and 9, the second conductive organic film (217) may be placed in the second opening (OP2). The second conductive organic film (217) may be in contact with the third organic insulating layer (213), the second connection electrode (CM2), and the second electrode (245). The shape of the second conductive organic film (217) may correspond to the shape of the second opening (OP2).

[0191] The upper surface (217U) of the second conductive organic film (217) may be sunken from the upper surface (213T) of the organic insulating layer (OIL). A height difference (H2) may be formed between the upper surface (217U) of the second conductive organic film (217) and the upper surface (213T) of the organic insulating layer (OIL). That is, a step may be formed between the second conductive organic film (217) and the third organic insulating layer (213). In this structure, the second conductive organic film (217) may not protrude from the organic insulating layer (OIL).

[0192] At least a portion of the second electrode (245) may be accommodated in the second conductive organic film (217). A lower portion of the second electrode (245) may be in contact with the second conductive organic film (217). The lower surface of the second electrode (245) may be immersed in the second conductive organic film (217).

[0193] The thickness (D245) of the second electrode (245) may be thicker than the height difference (H2) between the upper surface (217U) of the second conductive organic film (217) and the upper surface (213T) of the organic insulating layer (OIL). Accordingly, the second semiconductor layer (244) disposed on the second electrode (245) may be spaced apart from the second conductive organic film (217). That is, among the inorganic light-emitting diodes, only the second electrode (245) may be in contact with the second conductive organic film (217).

[0194] Fig. 10 is a schematic cross-sectional view of a part of a display device (1) according to one embodiment of the present invention.

[0195] Fig. 10 may correspond to the display area (DA, see Fig. 1) described above in Figs. 1, 2a to 2e, 3, 4a to 4c, and 5. Specifically, Fig. 10 may correspond to the first island portion (11, see 4a) described above in Figs. 4a to 4c, and 5.

[0196] In Fig. 10, the same reference numerals as in Fig. 7 indicate the same members, and their duplicate descriptions are omitted.

[0197] Referring to FIG. 10, a display device (1) of one embodiment of the present invention may include a substrate (100), a buffer layer (201), a pixel driving circuit (PC), an inorganic insulating layer (IIL), an organic insulating layer (OIL), a first connection electrode (CM1), a second connection electrode (CM2), a first conductive organic film (215), a second conductive organic film (217), an inorganic light-emitting diode (mLED), a bank layer (BKL), an encapsulation layer (300), and a filter panel (400).

[0198] The substrate (100) may include various materials. The substrate (100) may be formed of a flexible material. For example, the substrate (100) may be formed of a material that can be bent, folded, or rolled.

[0199] A buffer layer (201) can be placed on a substrate (100). The buffer layer (201) can prevent impurities from penetrating into a semiconductor layer of a thin film transistor.

[0200] The inorganic insulating layer (IIL) can be disposed on the buffer layer (201). That is, the inorganic insulating layer (IIL) can be disposed on the substrate (100).

[0201] The inorganic insulating layer (IIL) may include a gate insulating layer (203), a first interlayer insulating layer (205), and a second interlayer insulating layer (207). The first interlayer insulating layer (205) may be disposed on the gate insulating layer (203), and the second interlayer insulating layer (207) may be disposed on the first interlayer insulating layer (205).

[0202] The pixel driving circuit (PC) may be disposed on the buffer layer (201). That is, the pixel driving circuit (PC) may be disposed on the substrate (100). The pixel driving circuit (PC) may include a thin film transistor (TFT) and a storage capacitor (Cst).

[0203] A thin film transistor (TFT) may include a semiconductor layer (Act), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). The semiconductor layer (Act) may include polysilicon. The gate electrode (GE) may include a low-resistance metallic material. The source electrode (SE) and drain electrode (DE) may include a material with good conductivity.

[0204] The storage capacitor (Cst) may include a lower electrode (CE1) and an upper electrode (CE2) that overlap each other on a plane with a first interlayer insulating layer (205) therebetween. The storage capacitor (Cst) may overlap a thin film transistor (TFT) on a plane.

[0205] An organic insulating layer (OIL) may be disposed on an inorganic insulating layer (IIL). The organic insulating layer (OIL) may cover a pixel driving circuit unit (PC). The organic insulating layer (OIL) may include a first organic insulating layer (209), a second organic insulating layer (211), and a third organic insulating layer (213). The first organic insulating layer (209) covers the pixel driving circuit unit (PC), the second organic insulating layer (211) is disposed on the first organic insulating layer (209), and the third organic insulating layer (213) is disposed on the second organic insulating layer (211).

[0206] The first connection electrode (CM1) is disposed on an organic insulating layer (OIL) and can be electrically connected to a pixel driver circuit (PC). The first connection electrode (CM1) can be connected to the first voltage line (VDDL, see FIGS. 6A to 6C) described above with reference to FIGS. 6A to 6C.

[0207] The first connection electrode (CM1) may include a first-first connection electrode (CM1-1) and a first-second connection electrode (CM1-2). The first-first connection electrode (CM1-1) may be interposed between the first organic insulating layer (209) and the second organic insulating layer (211) and may be in contact with the pixel driving circuit (PC). The first-second connection electrode (CM1-2) may be disposed on the first-first connection electrode (CM1-1). The first-second connection electrode (CM1-2) may be interposed between the second organic insulating layer (211) and the third organic insulating layer (213) and may be in contact with the first-first connection electrode (CM1-1).

[0208] The second connection electrode (CM2) may be disposed on the organic insulating layer (OIL). For example, the second connection electrode (CM2) may be interposed between the second organic insulating layer (211) and the third organic insulating layer (213). The second connection electrode (CM2) may be connected to the second voltage line (VSSL, see FIGS. 6A to 6C) described above with reference to FIGS. 6A to 6C.

[0209] The organic insulating layer (OIL) can define a first opening (OP1) and a second opening (OP2). The first opening (OP1) and the second opening (OP2) can be arranged to be spaced apart from each other.

[0210] On a plane, the first opening (OP1) may overlap the first connection electrode (CM1). The first opening (OP1) may penetrate the organic insulating layer (OIL) to be in contact with the first connection electrode (CM1). For example, the first opening (OP1) may penetrate the third organic insulating layer (213). The first opening (OP1) may be surrounded by the organic insulating layer (OIL) and the first connection electrode (CM1).

[0211] On the plane, the second opening (OP2) may overlap the second connection electrode (CM2). The second opening (OP2) may penetrate the organic insulating layer (OIL) to be in contact with the second connection electrode (CM2). For example, the second opening (OP2) may penetrate the third organic insulating layer (213). The second opening (OP2) may be surrounded by the organic insulating layer (OIL) and the second connection electrode (CM2).

[0212] The first conductive organic film (215) can be accommodated in the first opening (OP1) so as to be electrically connected to the pixel driver circuit (PC). For example, the first conductive organic film (215) can be in contact with the first connection electrode (CM1) that is electrically connected to the pixel driver circuit. That is, the first connection electrode (CM1) can be disposed between the pixel driver circuit (PC) and the first conductive organic film (215), thereby connecting the pixel driver circuit (PC) and the first conductive organic film (215).

[0213] The first conductive organic film (215) may include a carbon black material. At this time, the first connection electrode (CM1) may include at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo), which is conductive to the first conductive organic film (215).

[0214] The second conductive organic film (217) can be accommodated in the second opening (OP2) and can be in contact with the second connection electrode (CM2). The second conductive organic film (217) can be arranged in the same layer as the first conductive organic film (215). The second connection electrode (CM2) can be arranged between the pixel driver circuit (PC) and the second conductive organic film (217) and can be connected to the second conductive organic film (217). The second conductive organic film (217) can be electrically connected to the second connection electrode (CM2). Since the second opening (OP2) accommodates the second conductive organic film (217), the second conductive organic film (217) can be arranged to be spaced apart from the first conductive organic film (215).

[0215] The second conductive organic film (217) is formed of the same material as the first conductive organic film (215), and the second connection electrode (CM2) may be formed of the same material as the first connection electrode (CM1). The second conductive organic film (217) may include a carbon black material. In this case, the second connection electrode (CM2) may include at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo), which is conductive to the second conductive organic film (217).

[0216] The mLED emits a first light (L1) and may include a first electrode (241), a first semiconductor layer (242), an intermediate layer (243), a second semiconductor layer (244), and a second electrode (245).

[0217] A first semiconductor layer (242) may be disposed on a first electrode (241), an intermediate layer (243) may be disposed on the first semiconductor layer (242), and a second semiconductor layer (244) may be disposed on the intermediate layer (243). That is, the intermediate layer (243) may be interposed between the first semiconductor layer (242) and the second semiconductor layer (244). In addition, the second electrode (245) may be disposed to be spaced apart from the first electrode (241), and the second semiconductor layer (244) may be disposed on the second electrode (245). The first electrode (241), the first semiconductor layer (242), the intermediate layer (243), the second semiconductor layer (244), and the second electrode (245) may be electrically connected to each other.

[0218] At least a portion of the first electrode (241) may be accommodated in the first conductive organic film (215) and electrically connected to the first conductive organic film (215). In addition, at least a portion of the second electrode (245) may be accommodated in the second conductive organic film (217) and electrically connected to the second conductive organic film (217).

[0219] The bank layer (BKL) may be disposed on an organic insulating layer (OIL). The bank layer (BKL) may include an insulating material and may include an opening exposing a first opening (OP1) and a second opening (OP2). That is, an inorganic light-emitting diode (mLED) may be disposed in an opening disposed in the bank layer (BKL).

[0220] The encapsulation layer (300) may be disposed on an inorganic light-emitting diode (mLED) and a bank layer (BKL). The inorganic light-emitting diode (mLED) may be covered by the encapsulation layer (300). The encapsulation layer (300) may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer (300) may include a first inorganic encapsulation layer (301), an organic encapsulation layer (303), and a second inorganic encapsulation layer (305) that are sequentially stacked.

[0221] The filter panel (400) may be placed on the sealing layer (300). That is, the filter panel (400) may be placed on an inorganic light-emitting diode (mLED). The filter panel (400) may include a color filter (403) and a light-shielding portion (405).

[0222] The first light (L1) emitted by the inorganic light-emitting diode (mLED) may be red, green, or blue. The color filter (403) may have the same color as the first light (L1) emitted by the inorganic light-emitting diode (mLED). Therefore, the first light (L1) emitted by the inorganic light-emitting diode (mLED) may be emitted to the outside with improved purity as it passes through the color filter (403). The light-shielding portion (405) may surround the color filter (403). The light-shielding portion (405) may include a black matrix.

[0223] Figures 11a to 11h are schematic cross-sectional views of a display device (1) according to one embodiment of the present invention.

[0224] Referring to FIGS. 11a to 11h, a method for manufacturing a display device (1) can be seen.

[0225] In FIGS. 11a to 11h, the same reference numerals as in FIGS. 7 to 10 refer to the same members, and their redundant descriptions are omitted.

[0226] First, referring to FIGS. 11a to 11e, a method for manufacturing a display device (1) may include a step of arranging a pixel driving circuit unit (PC) on a substrate (100), a step of arranging an organic insulating layer (OIL) on the pixel driving circuit unit (PC), a step of etching the organic insulating layer (OIL) so as to form a first opening (OP1), and a step of etching the organic insulating layer (OIL) so as to form a second opening (OP2) spaced apart from the first opening (OP1).

[0227] A pixel driver circuit (PC) can be placed on a substrate (100) in a display area (DA). An organic insulating layer (OIL) can be placed on the pixel driver circuit (PC). The organic insulating layer (OIL) can be placed on the substrate (100) in the display area (DA) and the non-display area (NDA) to cover the pixel driver circuit (PC). The organic insulating layer (OIL) can be placed on an inorganic insulating layer (IIL) in the display area (DA) and the non-display area (NDA).

[0228] The step of etching the organic insulating layer (OIL) to form the first opening (OP1) and the step of etching the organic insulating layer (OIL) to form the second opening (OP2) may each include a step of dry etching the organic insulating layer (OIL) with an etching gas. Specifically, the step of etching the organic insulating layer (OIL) to form the first opening (OP1) and the step of etching the organic insulating layer (OIL) to form the second opening (OP2) may be performed simultaneously.

[0229] Referring to FIG. 11a, a photoresist material (PRM) can be placed on an organic insulating layer (OIL). Specifically, the photoresist material (PRM) can be placed on both the display area (DA) and the non-display area (NDA) of the display device (1). The photoresist material (PRM) can be a photosensitive material.

[0230] Referring to FIG. 11B, a photomask (PM) can be placed on a photoresist material (PRM). The photomask (PM) includes a mask opening (OPM) and can be placed in both a display area (DA) and a non-display area (NDA) of the display device (1). Light (LT) can be irradiated toward the photoresist material (PRM) on the photomask (PM). That is, the photoresist material (PRM) can be exposed. For example, the light (LT) can be ultraviolet light. A portion of the light (LT) is blocked by the photomask (PM), and the remaining portion of the light (LT) can pass through the mask opening (OPM) to reach the photoresist material (PRM).

[0231] The photoresist material (PRM) disposed in the display area (DA) can be divided into a first portion (PRM1) that is in contact with light (LT) and a second portion (PRM2) that is not in contact with light (LT). The solubility of the first portion (PRM1) of the photoresist material (PRM) can be reduced. That is, the first portion (PRM1) of the photoresist material (PRM) can be cured by light (LT). The photoresist material (PRM) disposed in the non-display area (NDA) may not be in contact with light (LT). That is, the photoresist material (PRM) disposed in the non-display area (NDA) may not be cured by light (LT).

[0232] Referring to Fig. 11c, a photoresist material (PRM, see Fig. 11b) can be developed into a patterned photoresist layer (PRL). In the display area (DA), a cured first portion (PRM1, see Fig. 11b) of the photoresist material (PRM, see Fig. 11b) remains, and an uncured second portion (PRM2, see Fig. 11b) can be removed. Finally, in the display area (DA), the photoresist layer (PRL) can include a photo aperture (OPP). On the other hand, in the non-display area (NDA), the photoresist material (PRM, see Fig. 11b) can be completely removed.

[0233] Referring to FIG. 11d, the organic insulating layer (OIL) overlapping the photo aperture (OPP) of the photoresist layer (PRL) on the plane can be dry-etched by an etching gas. That is, the organic insulating layer (OIL) can be etched only in the display area (DA) of the display device (1). As the organic insulating layer (OIL) is dry-etched, a first opening (OP1) and a second opening (OP2) can be formed in the organic insulating layer (OIL). The first connection electrode (CM1) can be exposed from the organic insulating layer (OIL) through the first opening (OP1), and the second connection electrode (CM2) can be exposed from the organic insulating layer (OIL) through the second opening (OP2).

[0234] Referring to FIG. 11e, the photoresist layer (PRL, see FIG. 11d) can be removed. Finally, a first opening (OP1) and a second opening (OP2) can be formed in the organic insulating layer (OIL).

[0235] In FIGS. 11a to 11e, a negative photoresist material whose solubility decreases upon exposure to light (LT) is described as being used, but this is only an example, and a positive photoresist material whose solubility increases upon exposure to light (LT) may also be used.

[0236] In FIGS. 11a to 11e, since the organic insulating layer (OIL) is etched, dry etching using an etching gas is possible, and thus the shape and size of the first opening (OP1) and the second opening (OP2) can be precisely controlled. That is, in this step, detailed patterning of the organic insulating layer (OIL) exposing the first connection electrode (CM1) and the second connection electrode (CM2) can be possible.

[0237] Referring to FIGS. 11F to 11G, the method for manufacturing the display device (1) may include a step of arranging a first conductive organic film (215) in a first opening (OP1), and a step of arranging a second conductive organic film (217) in a second opening (OP2). Specifically, the step of arranging the first conductive organic film (215) in the first opening (OP1) and the step of arranging the second conductive organic film (217) in the second opening (OP2) may be performed simultaneously.

[0238] First, referring to FIG. 11f, the step of arranging a first conductive organic film (215) in the first opening (OP1) and the step of arranging a second conductive organic film (217) in the second opening (OP2) may each include a step of arranging a conductive organic film material (219) on an organic insulating layer (OIL), a step of soft baking the conductive organic film material (219), and a step of drying the conductive organic film material (219).

[0239] A conductive organic film material (219) can be disposed over the entire display area (DA) and non-display area (NDA) of the display device (1). The conductive organic film material (219) can include a carbon black material. The conductive organic film material (219) disposed in the display area (DA) can be accommodated in the first opening (OP1) and the second opening (OP2) and come into contact with the first connection electrode (CM1) and the second connection electrode (CM2).

[0240] The soft bake step and the drying step can be performed on the entire display area (DA) and non-display area (NDA) of the display device (1). In the soft bake step, the photoresist material (PRM) can be hardened by heat. In the drying step, the photoresist material (PRM) can be dried in a vacuum chamber. Therefore, the solvent in the photoresist material (PRM) can be evaporated and removed in the drying step.

[0241] Referring to FIG. 11g, the step of arranging a first conductive organic film (215) in the first opening (OP1) and the step of arranging a second conductive organic film (217) in the second opening (OP2) may each include a step of developing a conductive organic film material (219).

[0242] As the conductive organic film material (219) is developed, the conductive organic film material (219) can be removed from the display area (DA) of the display device (1), except for the first conductive organic film (215) disposed in the first opening (OP1) and the second conductive organic film (217) disposed in the second opening (OP2).

[0243] In addition, in the non-display area (NDA) of the display device (1), the conductive organic film material (219) may not be removed or may be removed to a lesser extent compared to the display area (DA). The extent to which the conductive organic film material (219) is removed in the non-display area (NDA) may be determined by the soft bake step and the drying step described with reference to FIG. 11F. Accordingly, in the non-display area (NDA), a conductive organic film layer (221) covering the organic insulating layer (OIL) may be formed on the organic insulating layer (OIL).

[0244] The conductive organic film layer (221) can perform a light-blocking function in the non-display area (NDA). In the process of arranging the first conductive organic film (215) and the second conductive organic film (217) in the display area (DA), the conductive organic film layer (221) performing a light-blocking function is simultaneously arranged in the non-display area (NDA), so that the manufacturing process of the display device (1) can be simplified.

[0245] Referring to FIG. 11h, the method for manufacturing a display device (1) may include a step of arranging an inorganic light-emitting diode (mLED) on an organic insulating layer (OIL).

[0246] The step of arranging a weapon light-emitting diode (mLED) may include a step of accommodating at least a portion of a first electrode (241) in a first conductive organic film (215), and a step of accommodating at least a portion of a second electrode (245) spaced apart from the first electrode (241) in a second conductive organic film (217).

[0247] Specifically, the step of accommodating at least a portion of the first electrode (241) in the first conductive organic film (215) and the step of accommodating at least a portion of the second electrode (245) in the second conductive organic film (217) can be performed simultaneously.

[0248] The step of accommodating at least a portion of the first electrode (241) into the first conductive organic film (215) may include the step of pressing the first electrode (241) against the first conductive organic film (215) and the step of heating the first conductive organic film (215). The step of accommodating at least a portion of the second electrode (245) into the second conductive organic film (217) may include the step of pressing the second electrode (245) against the second conductive organic film (217) and the step of heating the second conductive organic film (217).

[0249] Specifically, the step of pressing the first electrode (241) onto the first conductive organic film (215) and the step of pressing the second electrode (245) onto the second conductive organic film (217) can be performed simultaneously. In addition, the step of heating the first conductive organic film (215) and the step of heating the second conductive organic film (217) can be performed simultaneously.

[0250] The step of heating the first conductive organic film (215) may include a step of heating the first conductive organic film (215) to a temperature of 120 degrees Celsius or higher and 120 degrees Celsius or lower. In addition, the step of heating the second conductive organic film (217) may include a step of heating the second conductive organic film (217) to a temperature of 120 degrees Celsius or higher and 120 degrees Celsius or lower. That is, the first conductive organic film (215) and the second conductive organic film (217) may be heated to the same temperature.

[0251] As the first electrode (241) is attached to the first conductive organic film (215) and the second electrode (245) is attached to the second conductive organic film (217), the temperature and pressure applied to the display device (1) can be reduced. In other words, since the first electrode (241) and the second electrode (245) are each pressed against an organic material including carbon black rather than an inorganic material, the temperature and pressure required to attach the first electrode (241) and the second electrode (245) can be reduced. Accordingly, the phenomenon in which at least one of the substrate (100), the inorganic insulating layer (IIL), the organic insulating layer (OIL), and the inorganic light-emitting diode (mLED) is thermally deformed or damaged due to high temperature can be reduced.

[0252] Due to the height difference between the upper surface (213T) of the organic insulating layer (OIL) and the first conductive organic film (215), the phenomenon of the first conductive organic film (215) overflowing from the first opening (OP1) can be reduced in the process of accommodating at least a portion of the first electrode (241) into the first conductive organic film (215). In addition, due to the height difference between the upper surface (213T) of the organic insulating layer (OIL) and the second conductive organic film (217), the phenomenon of the second conductive organic film (217) overflowing from the second opening (OP2) can be reduced in the process of accommodating at least a portion of the second electrode (245) into the second conductive organic film (217).

[0253] The manufacturing method of the display device (1) may include a step of arranging an encapsulating layer (300, see FIG. 7) on an inorganic light-emitting diode (mLED), and a step of arranging a filter panel (400, see FIG. 7) on the encapsulating layer (300, see FIG. 7). Since this has been described above with reference to FIGS. 7 and 9, a detailed description thereof will be omitted.

[0254] Fig. 12 is a schematic cross-sectional view of a part of a display device (1) according to one embodiment of the present invention.

[0255] Fig. 12 may correspond to the display area (DA, see Fig. 1) described above in Figs. 1, 2a to 2e, 3, 4a to 4c, and 5. Specifically, Fig. 12 may correspond to the first island portion (11, see 4a) described above in Figs. 4a to 4c, and 5.

[0256] In Fig. 12, the same reference numerals as in Fig. 7 and Fig. 10 refer to the same members, and their duplicate descriptions are omitted.

[0257] Referring to FIG. 12, a display device (1) of one embodiment of the present invention may include a substrate (100), a buffer layer (201), a pixel driving circuit (PC), an inorganic insulating layer (IIL), an organic insulating layer (OIL), a first connection electrode (CM1), a first conductive organic film (215), an inorganic light-emitting diode (mLED), a bank layer (BKL), and a counter electrode (223).

[0258] The substrate (100) may include various materials. The substrate (100) may be formed of a flexible material. For example, the substrate (100) may be formed of a material that can be bent, folded, or rolled.

[0259] A buffer layer (201) can be placed on a substrate (100). The buffer layer (201) can prevent impurities from penetrating into a semiconductor layer of a thin film transistor.

[0260] The inorganic insulating layer (IIL) can be disposed on the buffer layer (201). That is, the inorganic insulating layer (IIL) can be disposed on the substrate (100).

[0261] The inorganic insulating layer (IIL) may include a gate insulating layer (203), a first interlayer insulating layer (205), and a second interlayer insulating layer (207). The first interlayer insulating layer (205) may be disposed on the gate insulating layer (203), and the second interlayer insulating layer (207) may be disposed on the first interlayer insulating layer (205).

[0262] The pixel driving circuit (PC) may be disposed on the buffer layer (201). That is, the pixel driving circuit (PC) may be disposed on the substrate (100). The pixel driving circuit (PC) may include a thin film transistor (TFT) and a storage capacitor (Cst).

[0263] A thin film transistor (TFT) may include a semiconductor layer (Act), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). The semiconductor layer (Act) may include polysilicon. The gate electrode (GE) may include a low-resistance metallic material. The source electrode (SE) and drain electrode (DE) may include a material with good conductivity.

[0264] The storage capacitor (Cst) may include a lower electrode (CE1) and an upper electrode (CE2) that overlap each other on a plane with a first interlayer insulating layer (205) therebetween. The storage capacitor (Cst) may overlap a thin film transistor (TFT) on a plane.

[0265] An organic insulating layer (OIL) may be disposed on an inorganic insulating layer (IIL). The organic insulating layer (OIL) may cover a pixel driving circuit unit (PC). The organic insulating layer (OIL) may include a first organic insulating layer (209), a second organic insulating layer (211), and a third organic insulating layer (213). The first organic insulating layer (209) covers the pixel driving circuit unit (PC), the second organic insulating layer (211) is disposed on the first organic insulating layer (209), and the third organic insulating layer (213) is disposed on the second organic insulating layer (211).

[0266] The first connection electrode (CM1) is disposed on an organic insulating layer (OIL) and can be electrically connected to a pixel driver circuit (PC). The first connection electrode (CM1) can be connected to the first voltage line (VDDL, see FIGS. 6A to 6C) described above with reference to FIGS. 6A to 6C.

[0267] The first connection electrode (CM1) may include a first-first connection electrode (CM1-1) and a first-second connection electrode (CM1-2). The first-first connection electrode (CM1-1) may be interposed between the first organic insulating layer (209) and the second organic insulating layer (211) and may be in contact with the pixel driving circuit (PC). The first-second connection electrode (CM1-2) may be disposed on the first-first connection electrode (CM1-1). The first-second connection electrode (CM1-2) may be interposed between the second organic insulating layer (211) and the third organic insulating layer (213) and may be in contact with the first-first connection electrode (CM1-1).

[0268] The organic insulating layer (OIL) may include a first opening (OP1). On a plane, the first opening (OP1) may overlap the first connection electrode (CM1). The first opening (OP1) may penetrate the organic insulating layer (OIL) so as to be in contact with the first connection electrode (CM1). For example, the first opening (OP1) may penetrate the third organic insulating layer (213). The first opening (OP1) may be surrounded by the organic insulating layer (OIL) and the first connection electrode (CM1).

[0269] The first conductive organic film (215) can be accommodated in the first opening (OP1) so as to be electrically connected to the pixel driver circuit (PC). For example, the first conductive organic film (215) can be in contact with the first connection electrode (CM1) that is electrically connected to the pixel driver circuit. That is, the first connection electrode (CM1) can be disposed between the pixel driver circuit (PC) and the first conductive organic film (215), thereby connecting the pixel driver circuit (PC) and the first conductive organic film (215).

[0270] The first conductive organic film (215) may include a carbon black material. At this time, the first connection electrode (CM1) may include at least one material among indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo), which is conductive to the first conductive organic film (215).

[0271] The mLED may include a first electrode (241), a first semiconductor layer (242), an intermediate layer (243), a second semiconductor layer (244), and a second electrode (245).

[0272] A first semiconductor layer (242) may be disposed on a first electrode (241), an intermediate layer (243) may be disposed on the first semiconductor layer (242), a second semiconductor layer (244) may be disposed on the intermediate layer (243), and a second electrode (245) may be disposed on the second semiconductor layer (244). That is, the intermediate layer (243) may be interposed between the first semiconductor layer (242) and the second semiconductor layer (244). The first electrode (241), the first semiconductor layer (242), the intermediate layer (243), the second semiconductor layer (244), and the second electrode (245) may be electrically connected to each other.

[0273] At least a portion of the first electrode (241) may be accommodated in the first conductive organic film (215) and may be electrically connected to the first conductive organic film (215). The bank layer (BKL) may be disposed on the organic insulating layer (OIL). The bank layer (BKL) may include an insulating material and may include an opening exposing the first opening (OP1). That is, the inorganic light-emitting diode (mLED) may be disposed in the opening disposed in the bank layer (BKL).

[0274] The counter electrode (223) may be placed on an inorganic light-emitting diode (mLED). The counter electrode (223) is supported by a bank layer (BKL) and may be electrically connected to a second electrode (245) of the inorganic light-emitting diode (mLED). The counter electrode (223) may be electrically connected to a second voltage line (VSSL, see FIG. 6a) that supplies the second power voltage (VSS, see FIG. 6a) described above in FIGS. 6a to 6c.

[0275] A sealing layer (300, see Fig. 7) may be placed on the counter electrode (223), and a filter panel (400, see Fig. 7) may be placed on the sealing layer (300, see Fig. 7). Since this has been described above with reference to Figs. 7 and 9, a detailed description thereof will be omitted.

[0276] Figures 13a to 13h are schematic cross-sectional views of a display device (1) according to one embodiment of the present invention.

[0277] Referring to FIGS. 13a to 13h, a method for manufacturing a display device (1) can be seen.

[0278] In FIGS. 13a to 13h, the same reference numerals as in FIGS. 7 to 12 refer to the same members, and their redundant descriptions are omitted.

[0279] First, referring to FIG. 13a, a method for manufacturing a display device (1) may include a step of arranging a pixel driver circuit unit (PC) on a substrate (100), a step of arranging an organic insulating layer (OIL) on the pixel driver circuit unit (PC), and a step of etching the organic insulating layer (OIL) so as to form a first opening (OP1). The step of etching the organic insulating layer (OIL) so as to form the first opening (OP1) may include a step of dry etching the organic insulating layer (OIL) with an etching gas.

[0280] Referring to FIG. 13b, the method for manufacturing the display device (1) may include a step of arranging a first conductive organic film (215) in a first opening (OP1). The first conductive organic film (215) may include a carbon black material. The first conductive organic film (215) may be accommodated in the first opening (OP1) and may be in contact with the first connection electrode (CM1).

[0281] Referring to FIG. 13c, the method for manufacturing a display device (1) may include a step of arranging an inorganic light-emitting diode (mLED) on an organic insulating layer (OIL), and a step of arranging a counter electrode (223) on the inorganic light-emitting diode (mLED).

[0282] The step of arranging the mLED may include the step of accommodating at least a portion of the first electrode (241) in the first conductive organic film (215). The step of accommodating at least a portion of the first electrode (241) in the first conductive organic film (215) may include the step of pressing the first electrode (241) against the first conductive organic film (215) and the step of heating the first conductive organic film (215).

[0283] As the counter electrode (223) is placed on the inorganic light-emitting diode (mLED), the second electrode (245) of the inorganic light-emitting diode (mLED) can be electrically connected to the counter electrode (223). At this time, the counter electrode (223) can be supported by the bank layer (BKL).

[0284] The manufacturing method of the display device (1) may include a step of placing a sealing layer (300, see FIG. 7) on a counter electrode (223), and a step of placing a filter panel (400, see FIG. 7) on the sealing layer (300, see FIG. 7). Since this has been described above with reference to FIGS. 7 and 9, a detailed description thereof will be omitted.

[0285] In addition, although the display area (DA) of the display device (1) is described in FIGS. 13a to 13c, the process described above in FIGS. 11a to 11h may be performed in the non-display area (NDA) of the display device (1). That is, finally, in the non-display area (NDA), a conductive organic film layer (221) performing a light-blocking role may be disposed on the organic insulating layer (OIL).

[0286] The display device (1) according to the above-described embodiments can be used in various electronic devices capable of providing images. Here, the term "electronic device" refers to a device that uses electricity and can provide a predetermined image.

[0287] FIGS. 14A to 14G are perspective views schematically illustrating embodiments of an electronic device including a display device according to one embodiment of the present invention, respectively.

[0288] Referring to FIG. 14A, a display device according to an embodiment of the present invention may be utilized in a wearable electronic device (3100) that can be worn on a part of a user's body. The wearable electronic device (3100) may include a body portion (3110) and a display portion (3120) provided on the body portion (3110). The display device according to embodiments of the present invention may be utilized as the display portion (3120) of the wearable electronic device (3100). As illustrated in FIG. 14A, the wearable electronic device (3100) may be transformable. In one embodiment, it may be utilized as a smart watch or a smartphone, depending on the user's selection.

[0289] FIG. 14B illustrates a medical electronic device (3200). In one embodiment, the medical electronic device (3200) may include a body portion (3210) and a light-emitting portion (3220). A display device according to embodiments of the present invention may be used as the light-emitting portion (3220) of the medical electronic device (3200). The light-emitting portion (3220) may emit light of a certain wavelength band (e.g., infrared, visible light, etc.) to the patient's body. In one embodiment, the body portion (3210) may have a stretchable fiber material and may have a structure that allows the light-emitting portion to be worn on the body of a user.

[0290] FIG. 14C illustrates an educational electronic device (3300). In one embodiment, the educational electronic device may include a display unit (3320) provided within a frame (3310). The display unit (3320) may utilize a display device according to embodiments of the present invention. The display unit (3320) may provide an image such as a sea with crashing waves, a snow-covered mountain, or a volcano with flowing lava, wherein the display unit (3320) may expand in the height direction (e.g., the z direction) to reflect the height of the wave, mountain, or volcano. In some embodiments, a portion of the display unit (3320) may sequentially vary in height along the direction of flowing lava to display the movement of lava in three dimensions. The educational electronic device (3300) may include a plurality of pins (or stroke units, 3330) arranged on the back surface of the display unit (3320) so that the display unit (3320) expands in the height direction. The pins (3330) can be implemented to move along a third direction (e.g., the z direction or the -z direction) so that the image displayed on the display unit (3320) has a three-dimensional height. Fig. 14c describes an educational electronic device (3300), but its use is not limited to providing certain image information.

[0291] While the electronic devices illustrated in FIGS. 14A to 14C are described as electronic devices whose shapes can be varied, the present invention is not limited thereto. As described in the embodiments below, display devices according to embodiments of the present invention can be used in electronic devices in which a portion capable of displaying an image (e.g., a screen) is fixed.

[0292] FIG. 14D illustrates a robot (3400) as another electronic device according to one embodiment of the present invention. The robot (3400) can recognize movement or objects using a camera unit (3440) and display a predetermined image to a user through a display unit (3420, 3430). In some embodiments, since the display devices according to one embodiment of the present invention can extend in various directions as described above, they can be assembled into a body frame having a hemispherical shape, and thus the robot (3400) can include a hemispherical display unit (3420, 3430).

[0293] FIG. 14E illustrates a vehicle display device (3500) as another electronic device according to one embodiment of the present invention. The vehicle display device (3500) may include a cluster (3510), a center information display (CID) (3520), and / or a co-driver display. Since the display device according to the embodiment of the present invention can be extended in various directions, it may be used in the cluster (3510), the center information display (CID) (3520), and / or the co-driver display regardless of the shape of the internal frame of the vehicle.

[0294] Although FIG. 14e illustrates that the cluster (3510), the Center Information Display (CID) (3520), and / or the co-driver display are each separate, the present invention is not limited thereto. In another embodiment, two or more selected from the cluster (3510), the Center Information Display (CID) (3520), and the co-driver display may be connected as one unit.

[0295] In some embodiments, a vehicle display device (3500) may include a button (3540) capable of displaying a predetermined image. Referring to the enlarged view of FIG. 14E, the hemispherical button (3540) may include an object (3542) that provides a user experience of the button while moving in the z-direction or -z-direction, and a display device positioned on the object (3542). In some embodiments, when the object (3542) has a three-dimensionally rounded surface, the display device may also have a three-dimensionally rounded surface.

[0296] FIG. 14F illustrates an electronic device according to one embodiment of the present invention, which is an electronic device (3600) for advertising or display purposes. In some embodiments, the electronic device (3600) for advertising or display purposes may be installed on a fixed structure (3610), such as a wall or a pillar. If the structure (3610) includes a recessed surface as illustrated in FIG. 14F, the electronic device (3600) for advertising or display purposes may also be positioned along the recessed surface of the structure (3610). In some embodiments, the electronic device (3600) for advertising or display purposes may be installed on the structure (3610) using a heat shrink film or the like.

[0297] FIG. 14G illustrates an electronic device according to one embodiment of the present invention as a controller (3700). The controller (3700) may include an image-type button. For example, the controller (3700) may include first to third button areas (3720, 3730, 3740) in which a portion of the display unit (3710) protrudes in the z direction or protrudes in the -z direction (or is sunken in the z direction). In some embodiments, the first and third button areas (3720, 3740) may protrude in the z direction, and the second button area (3730) may protrude in the -z direction (or is sunken in the z direction).

[0298] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will appreciate that various modifications and variations of the embodiments are possible. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

Claims

1. Substrate; A pixel driving circuit unit disposed on the above substrate; An organic insulating layer disposed on the above pixel driving circuit portion and defining a first opening; A first conductive organic film accommodated in the first opening so as to be electrically connected to the pixel driving circuit unit; and An inorganic light-emitting diode disposed on the organic insulating layer and including a first electrode; A display device, wherein at least a portion of the first electrode is accommodated in the first conductive organic film.

2. In paragraph 1, A display device, wherein the upper surface of the first conductive organic film is sunken from the upper surface of the organic insulating layer.

3. In paragraph 2, The thickness of the above first electrode is, A display device, thicker than the height difference between the upper surface of the first conductive organic film and the upper surface of the organic insulating layer.

4. In paragraph 1, A display device, wherein the first conductive organic film comprises a carbon black material.

5. In paragraph 1, A display device further comprising a first connection electrode disposed between the pixel driving circuit unit and the first conductive organic film, electrically connecting the pixel driving circuit unit and the first conductive organic film.

6. In paragraph 5, A display device, wherein the first connecting electrode includes at least one material selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

7. In paragraph 1, Further comprising a second conductive organic film arranged to be spaced apart from the first conductive organic film; The above organic insulating layer is, Further defining a second opening, spaced apart from the first opening and accommodating the second conductive organic film; The above light-emitting diode is, A display device further comprising a second electrode arranged to be spaced apart from the first electrode and at least a portion of which is accommodated in the second conductive organic film.

8. In paragraph 7, A display device, wherein the upper surface of the second conductive organic film is sunken from the upper surface of the organic insulating layer.

9. In paragraph 8, The thickness of the second electrode is A display device thicker than the height difference between the upper surface of the second challenging organic film and the upper surface of the organic insulating layer.

10. In paragraph 7, A display device wherein the second challenging organic film comprises a carbon black material.

11. In paragraph 7, A display device further comprising a second connection electrode disposed between the pixel driving circuit and the second conductive organic film and connected to the second conductive organic film.

12. In paragraph 11, A display device wherein the second connecting electrode includes at least one material selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

13. In paragraph 1, Further comprising a counter electrode disposed on the above-mentioned light-emitting diode; The above light-emitting diode is, A display device further comprising a second electrode disposed to be spaced apart from the first electrode and electrically connected to the counter electrode.

14. In paragraph 1, A display device further comprising a conductive organic film layer disposed on the organic insulating layer so as to cover the organic insulating layer in a non-display area.

15. A step of arranging a pixel driving circuit on a substrate; A step of arranging an organic insulating layer on the above pixel driving circuit part; A step of etching the organic insulating layer so as to form a first opening; A step of arranging a first conductive organic film in the first opening so as to be electrically connected to the pixel driving circuit unit; and A step of arranging an inorganic light-emitting diode on the organic insulating layer; The step of arranging the above-mentioned light-emitting diode is: A method for manufacturing a display device, comprising: a step of accommodating at least a part of a first electrode of the above-mentioned inorganic light-emitting diode in the first conductive organic film.

16. In paragraph 15, The step of etching the organic insulating layer so that the first opening is formed is: A method for manufacturing a display device, comprising: a step of dry etching the organic insulating layer with an etching gas.

17. In paragraph 15, The step of placing the first challenging organic film is: A step of placing a conductive organic film material on the organic insulating layer; A step of soft baking the above-mentioned challenging organic film material; and A method for manufacturing a display device, comprising: a step of developing the above-mentioned conductive organic film material.

18. In paragraph 15, The step of accommodating at least a portion of the first electrode in the first conductive organic film is: A step of applying pressure to the first electrode on the first conductive organic film; and A method for manufacturing a display device, comprising: a step of heating the first conductive organic film.

19. In Article 18, The step of heating the first challenging organic film is: A method for manufacturing a display device, comprising: a step of heating the first conductive organic film to a temperature of 120 degrees Celsius or higher and 140 degrees Celsius or lower.

20. In paragraph 15, The above first challenging organic film is, A method for manufacturing a display device comprising a carbon black material.

21. In paragraph 15, A step of etching the organic insulating layer so that a second opening spaced apart from the first opening is formed; and Further comprising a step of arranging a second conductive organic film in the second opening; The step of arranging the above-mentioned light-emitting diode is: A method for manufacturing a display device, further comprising: a step of accommodating at least a portion of a second electrode spaced apart from the first electrode of the above-described inorganic light-emitting diode in the second conductive organic film.

22. In paragraph 21, A method for manufacturing a display device, wherein the step of etching the organic insulating layer to form the first opening and the step of etching the organic insulating layer to form the second opening are performed simultaneously.

23. In paragraph 21, A method for manufacturing a display device, wherein the step of arranging a first conductive organic film in the first opening and the step of arranging a second conductive organic film in the second opening are performed simultaneously.

24. In paragraph 21, A method for manufacturing a display device, wherein the step of accommodating at least a portion of the first electrode in the first conductive organic film and the step of accommodating at least a portion of the second electrode in the second conductive organic film are performed simultaneously.

25. In paragraph 15, Further comprising a step of arranging a counter electrode on the above-mentioned inorganic light-emitting diode; The step of arranging the above-mentioned light-emitting diode is: A method for manufacturing a display device, further comprising: a step of electrically connecting a second electrode spaced apart from the first electrode of the light-emitting diode to the counter electrode.

Images