Fan module and electronic device

Abstract

A fan module (600), comprising a housing (610) and a fan blade assembly (620). The housing comprises a first cover plate (611), a side plate (612), and a second cover plate (613). The side plate is arranged on the first cover plate. The second cover plate is arranged on the side of the side plate away from the first cover plate, such that the first cover plate, the side plate, and the second cover plate together form a first air outlet (614) and a second air outlet (615). The first air outlet and the second air outlet are respectively located on two different sides of the first cover plate. The second cover plate is provided with an air inlet (616) communicated with the first air outlet and the second air outlet. The fan blade assembly is rotatably arranged on the first cover plate. The first cover plate is provided with a first notch (617). The first notch is recessed inward from a reference surface where the second air outlet is located, and is connected to the side plate. An electronic device is also provided.

Description

Fan modules and electronic devices Technical Field

[0001] The present invention relates to an air cooling unit and an electronic device comprising the same, in particular to a fan module and an electronic device comprising the same. Background Art

[0002] Compared to traditional desktop computers, laptops are lightweight and portable, making them a widely used electronic device. Generally speaking, to effectively dissipate heat generated by the heat source, most manufacturers install fans inside the laptop. This allows the fan to draw in cool air from the outside, cooling the heat source and other components of the laptop, such as the casing.

[0003] However, in recent years, laptops have become increasingly thinner and lighter in pursuit of portability, resulting in a shrinking internal space. Consequently, the fan inside the laptop often lacks sufficient space to effectively cool the casing. Consequently, when the user operates the keyboard module, the hot casing comes into contact with the user, causing discomfort.

[0004] Summary of the Invention

[0005] The present invention provides a fan module and an electronic device to prevent a user from feeling uncomfortable due to contact with a high-temperature cover when operating a keyboard module.

[0006] The fan module disclosed in one embodiment of the present invention includes a housing and a blade assembly. The housing includes a first cover plate, a side plate and a second cover plate. The side plate is arranged on the first cover plate. The second cover plate is arranged on the side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively located on different sides of the first cover plate. The second cover plate has an air inlet connected to the first air outlet and the second air outlet. The blade assembly is rotatably arranged on the first cover plate. The first cover plate has a first notch. The first notch is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate.

[0007] Another embodiment of the present invention discloses an electronic device comprising a base, a cover, a mainboard, a heat source, a keyboard module, and a fan module. The cover is disposed on one side of the base and together with the base forms a storage space. The mainboard is disposed in the storage space. The heat source is disposed on the mainboard. The keyboard module and the cover are located on the same side of the mainboard. The fan module comprises a housing and a fan assembly. The housing comprises a first cover plate, a side plate, and a second cover plate. The side plate is disposed on the first cover plate. The second cover plate is disposed on a side of the side plate away from the first cover plate, such that the first cover plate, the side plate, and the second cover plate collectively form a first air outlet and a second air outlet. The first air outlet and the second air outlet are located on opposite sides of the first cover plate, respectively. The second cover plate has an air inlet connected to the first air outlet and the second air outlet. The fan assembly is rotatably disposed on the first cover plate. The first cover plate has a first notch. The first notch is recessed inward from a reference plane where the second air outlet is located and is connected to the side plate.

[0008] According to the fan module and electronic device disclosed in the above embodiments, the first notch is recessed inward from the reference plane where the second air outlet is located and is connected to the side panel. Therefore, the heat dissipating airflow guided by the fan blade assembly flows from the second air outlet through the first notch to the space between the cover and the motherboard. This increases the airflow between the cover and the motherboard, effectively dissipating any heat accumulated between the cover and the motherboard. This effectively cools the cover and prevents users from experiencing discomfort due to contact with the hot cover when operating the keyboard module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG1 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention;

[0010] FIG2 is a perspective view of the electronic device in FIG1 omitting the base and the cover;

[0011] FIG3 is a perspective view of a fan module of the electronic device in FIG1 ;

[0012] FIG4 is a partially enlarged top view of the electronic device in FIG1 omitting the base and the cover;

[0013] FIG. 5 is a partial enlarged view of the electronic device in FIG. 1 .

[0014] [Description of the accompanying figures] 10: Electronic device 100: Base 150: Accommodating space 200: Cover 300: Mainboard 301: Top surface 302: Bottom surface 400: Heat source 500: Keyboard module 600: Fan module 610: Housing 611: First cover plate 6110, 6111: Side edge 612: Side plate 6120: Side edge 6121: Side notch 613: Second cover plate 614: First air outlet 615: Second air outlet 616: Air inlet 617: First notch 618: Second notch 620: Fan blade assembly 650: First heat dissipation fin group 660: Second heat dissipation fin group 700, 800: Air guide F: Heat dissipation airflow W: Width P: Reference plane DETAILED DESCRIPTION

[0015] The following detailed description of the features and advantages of the embodiments of the present invention is sufficient to enable those skilled in the art to understand the technical content of the embodiments of the present invention and implement them accordingly. Furthermore, based on the disclosure, scope of protection, and accompanying drawings of this specification, those skilled in the art can easily understand the relevant objectives and advantages of the present invention. The following embodiments further illustrate the concepts of the present invention and are not intended to limit the scope of the present invention in any way.

[0016] Please refer to Figures 1 and 2. Figure 1 is a schematic side cross-sectional view of an electronic device according to one embodiment of the present invention. Figure 2 is a three-dimensional view of the electronic device in Figure 1 omitting the base and cover. In this embodiment, the electronic device 10 is, for example, a laptop computer base, and includes a base 100, a cover 200, a motherboard 300, two heat sources 400, a keyboard module 500, two fan modules 600, two first heat dissipation fin assemblies 650, two second heat dissipation fin assemblies 660, two air guides 700, and two air guides 800.

[0017] The base 100 is, for example, commonly known as a "D piece." The cover 200 is, for example, commonly known as a "C piece." The cover 200 is disposed on one side of the base 100 and together with the base 100 forms a receiving space 150 .

[0018] The motherboard 300 is disposed in the accommodating space 150. In this embodiment, the motherboard 300 has a top surface 301 and a bottom surface 302 facing away from each other. The top surface 301 faces the cover 200. The two heat sources 400 are, for example, a central processing unit (CPU) or a graphics processing unit (GPU). The two heat sources 400 are electrically connected to the motherboard 300 and disposed on the bottom surface 302. The keyboard module 500 is electrically connected to the motherboard 300. The keyboard module 500 and the cover 200 are located on the same side of the motherboard 300.

[0019] The corresponding fan module 600, first heat sink fin assembly 650, second heat sink fin assembly 660, air guide 700, and air guide 800 constitute a heat sink assembly (not numbered). The two heat sink assemblies in this embodiment are respectively used to dissipate heat generated by the two heat sources 400 to the outside of the electronic device 10. Because the two heat sink assemblies have similar structures, only one heat sink assembly will be used as an example in the following description.

[0020] Please refer to Figures 2 and 3, which are three-dimensional views of the fan module of the electronic device in Figure 1. The fan module 600 includes a housing 610 and a fan blade assembly 620. The housing 610 includes a first cover plate 611, a side plate 612, and a second cover plate 613. The side plate 612 is disposed on the first cover plate 611. The second cover plate 613 is disposed on a side of the side plate 612 away from the first cover plate 611, so that the first cover plate 611, the side plate 612, and the second cover plate 613 together form a first air outlet 614 and a second air outlet 615. The first air outlet 614 and the second air outlet 615 are respectively located on different sides of the first cover plate 611. The first cover plate 611 has a first notch 617. The first notch 617 is recessed inward from a reference plane P where the second air outlet 615 is located, and is connected to the side plate 612. The second cover plate 613 has an air inlet 616 connected to the first air outlet 614 and the second air outlet 615. The fan assembly 620 is rotatably disposed on the first cover plate 611.

[0021] In this embodiment, a side edge 6111 of the first cover plate 611 defining the first notch 617 is arc-shaped to facilitate the manufacture of the first cover plate 611. However, the present invention is not limited to the shape of the side edge 6111. In other embodiments, the side edge may also be rectangular.

[0022] In addition, in this embodiment, the first cover plate 611 further has a second notch 618. The second notch 618 is recessed inward from the reference plane P. Two opposite sides of the first notch 617 are connected to the side plate 612 and the second notch 618, respectively. The width W of the second notch 618 is, for example, 37 mm.

[0023] Furthermore, in this embodiment, the side panel 612 has a side edge 6120. The side edge 6120 is connected to the first notch 617. A side notch 6121 is formed between the side edge 6120 and the reference plane P. In this embodiment, the second air outlet 615, the first notch 617, the second notch 618, and the side notch 6121 collectively form a large air outlet.

[0024] The first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed on the mainboard 300. The first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed adjacent to the first air outlet 614 and the second air outlet 615 respectively.

[0025] The air guide 700 is disposed on a side of the first cover plate 611 away from the second cover plate 613 and covers at least a portion of the second notch 618 .

[0026] The air guide 800 is disposed on the bottom surface 302 of the mainboard 300 and is located between the heat source 400 and the fan module 600 .

[0027] 3 to 5 , FIG4 is a partially enlarged top view of the electronic device in FIG1 omitting the base and the cover. FIG5 is a partially enlarged top view of the electronic device in FIG1 .

[0028] As shown in Figure 4, the fan blade assembly 620 is used to guide a heat dissipation airflow F to the first heat dissipation fin group 650 and the second heat dissipation fin group 660 through the first air outlet 614 and the second air outlet 615, respectively. Through the second notch 618, the air volume of the heat dissipation airflow F flowing to the second heat dissipation fin group 660 will increase, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin group 660. In addition, by shielding at least a portion of the second notch 618 with the air guide 700, the heat dissipation airflow F will flow more concentratedly to the second heat dissipation fin group 660, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin group 660. It should be noted that in other embodiments where the heat source has a lower heat generation, the first plate body may not need to have the second notch 618, and the electronic device may not need to include the air guide 700.

[0029] 3 and 4 , in this embodiment, a side edge 6110 of the first cover plate 610 defining the second air outlet 615 contacts the second heat sink fin assembly 660. This prevents the heat dissipating airflow F flowing to the second heat sink fin assembly 660 from further flowing to the pivotal member (not shown), thereby preventing the lubricating oil on the pivotal member from being dried out by the heat dissipating airflow F.

[0030] As shown in Figure 5, the air guide 800 is used to guide the heat dissipation airflow F flowing out of the first notch 617 and the side notch 6121 to between the top surface 301 of the motherboard 300 and the cover 200. In other words, the air guide 800 allows the heat dissipation airflow F to flow more concentratedly to the top surface 301 of the motherboard 300 and the cover 200. However, in other embodiments where the heat generation of the heat source is lower, the electronic device may not include the air guide 800.

[0031] Furthermore, as shown in FIG5 , in this embodiment, the first cover plate 611 is closer to the cover body 200 than the second cover plate 613. Therefore, the heat dissipation airflow F can more easily flow from the second air outlet 615 of the first cover plate 611 to between the top surface 301 of the motherboard 300 and the cover body 200. However, in other embodiments where the heat source generates less heat, the first cover plate may be further away from the cover body than the second cover plate.

[0032] According to the fan module and electronic device disclosed in the above embodiments, the first notch is recessed inward from the reference plane where the second air outlet is located and is connected to the side panel. Therefore, the heat dissipating airflow guided by the fan blade assembly flows from the second air outlet through the first notch to the space between the cover and the motherboard. This increases the airflow between the cover and the motherboard, effectively dissipating any heat accumulated between the cover and the motherboard. This effectively cools the cover and prevents users from experiencing discomfort due to contact with the hot cover when operating the keyboard module.

[0033] Furthermore, according to experimental data, the temperature at the hottest point in the cover 200 is reduced by approximately 7 degrees Celsius through the design of the first notch 617 , the second notch 618 , the side notch 6121 , and the air guide 800 .

Claims

1. A fan module, characterized in that: Include: A housing, comprising a first cover plate, a side plate and a second cover plate, wherein the side plate is disposed on the first cover plate, and the second cover plate is disposed on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet, wherein the first air outlet and the second air outlet are respectively located on different sides of the first cover plate, and the second cover plate has an air inlet connected to the first air outlet and the second air outlet; and A fan blade assembly is rotatably disposed on the first cover plate; The first cover plate has a first notch, which is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate.

2. The fan module according to claim 1, characterized in that: The side plate has a side edge, the side edge is connected to the first notch, and a side notch is formed between the side edge and the reference surface.

3. The fan module according to claim 1, characterized in that: A side edge of the first cover plate defining the first notch is in an arc shape.

4. The fan module according to claim 1, characterized in that: The first cover plate further has a second notch, which is recessed inward from the reference surface. Different two sides of the first notch are respectively connected to the side plate and the second notch.

5. An electronic device, characterized in that: Include: a base; A cover body is disposed on one side of the base and forms a containing space together with the base; A mainboard is disposed in the accommodating space; a heat source, disposed on the main board; a keyboard module, the keyboard module and the cover are located on the same side of the main board; and A fan module, comprising: A housing comprises a first cover plate, a side plate and a second cover plate, wherein the side plate is arranged on the first cover plate, and the second cover plate is arranged on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet, wherein the first air outlet and the second air outlet The first and second air outlets are located at two different sides of the first cover plate, and the second cover plate has an air inlet connected to the first and second air outlets; and A fan blade assembly is rotatably disposed on the first cover plate; The first cover plate has a first notch, which is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate.

6. The electronic device as claimed in claim 5, characterized in that: It further includes a first heat dissipation fin group and a second heat dissipation fin group arranged on the main board, the first cover plate further has a second notch, the second notch is recessed inward from the reference plane, the different sides of the first notch are respectively connected to the side plate and the second notch, the first heat dissipation fin group and the second heat dissipation fin group are respectively adjacent to the first air outlet and the second air outlet, and the fan blade assembly is used to guide a heat dissipation airflow to the first heat dissipation fin group and the second heat dissipation fin group through the first air outlet and the second air outlet respectively.

7. The electronic device according to claim 6, wherein: The invention further comprises an air guide member, which is arranged on a side of the first cover plate away from the second cover plate and covers at least a part of the second notch.

8. The electronic device as claimed in claim 6, characterized in that: A side edge of the first cover plate defining the second air outlet contacts the second heat dissipation fin set.

9. The electronic device as claimed in claim 5, characterized in that: It further includes an air guide member, the mainboard has a top surface and a bottom surface facing each other, the top surface faces the cover body, the heat source is arranged on the bottom surface of the mainboard, the air guide member is arranged on the bottom surface of the mainboard and is between the heat source and the fan module, and the air guide member is used to guide a heat dissipation airflow flowing out of the second air outlet to between the top surface of the mainboard and the cover body.

10. The electronic device as claimed in claim 5, characterized in that: The first cover plate is closer to the cover body than the second cover plate.

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