Current sampling device, system, and circuit, and vehicle

Abstract

Embodiments of the present application provide a current sampling device, system, and circuit, and a vehicle. The device comprises: a shunt, wherein the shunt comprises a plurality of conductive connecting members and at least one signal conversion member, the plurality of conductive connecting members are arranged in sequence, the at least one signal conversion member is arranged in at least one conductive connecting member group, and the conductive connecting member group comprises two adjacent conductive connecting members; a circuit board, wherein the circuit board is arranged on one side surface of the shunt, and the at least one signal conversion member is connected to the circuit board; and a signal measuring component, wherein the signal measuring component is arranged on any one of the plurality of conductive connecting members, the signal measuring component is connected to the circuit board, the signal measuring component is provided with a positive electrode sampling point and a negative electrode sampling point, and the positive electrode sampling point and the negative electrode sampling point are respectively arranged on the side surface of said conductive connecting member.

Description

Current sampling device, system, circuit and vehicle

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202322442551.0, filed on September 8, 2023, entitled “Current Sampling Device, System, Circuit and Vehicle,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of battery management systems, and in particular to a current sampling device, system, circuit, and vehicle. Background Art

[0004] With the rapid development of the new energy vehicle industry, battery management system testing is becoming increasingly important, particularly in the real-time monitoring of current data while the vehicle is driving and charging. Currently, current detection requires the use of separate components for primary and redundant sampling to ensure accuracy. This results in a large current sampling device, hindering miniaturization.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a current sampling device, system, circuit, and vehicle to address the technical problem that the current sampling device is large in size and difficult to miniaturize.

[0007] In a first aspect, an embodiment of the present application provides a current sampling device, comprising:

[0008] A shunt, the shunt comprising a plurality of conductive connectors and at least one signal converter, the plurality of conductive connectors being arranged in sequence, and the at least one signal converter being disposed in at least one conductive connector group, the conductive connector group comprising two adjacent conductive connectors;

[0009] a circuit board, the circuit board being disposed on a side of the diverter, and the at least one signal conversion component being connected to the circuit board;

[0010] A signal measurement component is provided on any one of the plurality of conductive connectors, and the signal measurement component is connected to the circuit board, and the signal measurement component is provided with a positive sampling point and a negative sampling point, and the positive sampling point and the negative sampling point are respectively provided on the side of the conductive connector.

[0011] In this embodiment, the integrated design of the current divider and signal measurement assembly enables multi-channel sampling while reducing the structural size and facilitating miniaturization. Furthermore, sampling is performed through the signal measurement assembly, eliminating the need for a magnetic core. This not only further reduces the structural size but also avoids the risk of core saturation affecting sampling accuracy.

[0012] In some embodiments, the positive sampling point and the negative sampling point are respectively disposed on two opposite sides of the conductive connector.

[0013] In this embodiment, by arranging the positive sampling point and the negative sampling point on two opposite side surfaces of the conductive connector, current signals in opposite directions can be collected, thereby achieving differential sampling and further improving sampling accuracy.

[0014] In some embodiments, the plurality of conductive connecting elements are spaced apart from each other, and the signal conversion element is located in at least a portion of the space between two adjacent conductive connecting elements.

[0015] In this embodiment, by arranging multiple conductive connectors at intervals from each other and positioning the signal converter within at least a portion of the interval between two adjacent conductive connectors, mutual interference between signals generated on the conductive connectors can be reduced, thereby improving sampling accuracy.

[0016] In some embodiments, the signal conversion component is disposed between each two adjacent conductive connecting components.

[0017] In this embodiment, by arranging the signal conversion component between each two adjacent conductive connectors, that is, a signal conversion component is arranged between each two adjacent conductive connectors, the structure of the diverter module can be made more compact, the structural size is further reduced, and miniaturization is facilitated.

[0018] In some embodiments, the circuit board includes:

[0019] a first sub-circuit board connected to the at least one signal conversion component;

[0020] A second sub-circuit board is electrically connected to the first sub-circuit board and is connected to the signal measuring component.

[0021] In this embodiment, the integrated design of the shunt and the signal measurement component is realized by using different circuit boards, so that the structural arrangement of the current sampling device is more reasonable and more conducive to miniaturization requirements.

[0022] In some embodiments, a notch is formed on at least one side of the conductive connection member on which the signal measuring component is disposed, and the position of the notch corresponds to the position of the signal measuring component.

[0023] In this embodiment, a gap is provided in the conductive connector at a position corresponding to the signal measurement component, so that the magnetic induction current at this position is more concentrated, thereby improving the sampling accuracy of the signal measurement component.

[0024] In some embodiments, the notch covers a projection of the signal measurement component on a side of the conductive connection member where the notch is provided.

[0025] In this embodiment, by providing a notch to cover the projection of the signal measurement component on the side of the conductive connector where the notch is provided, the ability of the notch to gather magnetically induced current can be enhanced, further improving the sampling accuracy of the signal measurement component.

[0026] In some embodiments, the current sampling device further includes:

[0027] At least one temperature sensor is provided corresponding to the at least one signal conversion component, and the at least one temperature sensor is connected to the circuit board.

[0028] In this embodiment, the temperature sensor can collect the temperature of the signal conversion component so as to subsequently compensate for the temperature drift of the signal conversion component, thereby improving the sampling accuracy of the signal conversion component and further improving the current detection accuracy.

[0029] In some embodiments, the current sampling device further includes:

[0030] Calibration mark, the calibration mark is set on the circuit board.

[0031] In this embodiment, the initial resistance of the shunt and the temperature compensation coefficient can be calibrated by the calibration mark to avoid subsequent sampling deviation and improve the current sampling accuracy.

[0032] In some embodiments, a signal transmission component is provided on the circuit board, the signal transmission component is electrically connected to the shunt and the signal measurement component, and the signal transmission component is used to transmit the electrical signals generated by the shunt and the signal measurement component.

[0033] In this embodiment, by arranging a signal transmission component on the circuit board, the electrical signals generated by the shunt and the signal measurement component can be conveniently transmitted.

[0034] In some embodiments, the signal measurement component includes at least one of a Hall effect component, a shunt component, and a magnetoresistive effect component.

[0035] In this embodiment, the signal measurement component can include at least one of a Hall effect component, a shunt component, and a magnetoresistive effect component, thereby making the implementation of the signal measurement component more flexible and diverse, and increasing the application scenarios of the current sampling device.

[0036] In a second aspect, an embodiment of the present application provides a current sampling system, comprising:

[0037] batteries and sampling plates;

[0038] and the current sampling device according to the first aspect;

[0039] The battery and the sampling board are respectively connected to the current sampling device.

[0040] In this embodiment, the current sampling system can include the aforementioned current sampling device. This integrated design of the current shunt and signal measurement component enables multi-channel sampling while reducing structural dimensions and facilitating miniaturization. Furthermore, sampling via the signal measurement component eliminates the need for a magnetic core, further reducing structural dimensions while avoiding the risk of core saturation affecting sampling accuracy.

[0041] In a third aspect, an embodiment of the present application provides a current sampling circuit, comprising:

[0042] At least one shunt sampling module, the shunt sampling module being arranged corresponding to at least one signal conversion component in the current sampling device according to the first aspect;

[0043] A signal sampling module, the signal sampling module corresponds to the signal measurement component in the current sampling device of the first aspect;

[0044] A main control module is used to connect with at least one diverter sampling module and a signal sampling module respectively.

[0045] In this embodiment, the integrated design of the current divider and signal measurement assembly enables multi-channel sampling while reducing the structural size and facilitating miniaturization. Furthermore, sampling is performed through the signal measurement assembly, eliminating the need for a magnetic core. This not only further reduces the structural size but also avoids the risk of core saturation affecting sampling accuracy.

[0046] In some embodiments, the signal sampling module includes a storage submodule, and the storage submodule is used to back up calibration data.

[0047] In this embodiment, the storage module can be used to back up calibration data, further improving the sampling accuracy of the signal measurement component.

[0048] In some embodiments, the signal sampling module further includes a signal modulation submodule, which is used to amplify and shape the voltage signal generated by the signal measurement component.

[0049] In this embodiment, the signal modulation submodule can be used to amplify and shape the voltage signal generated by the signal measurement component, thereby further improving the sampling accuracy of the signal measurement component.

[0050] In some embodiments, the signal sampling module further includes an overcurrent detection submodule, and the overcurrent detection submodule is configured to perform overcurrent detection on the current signal sampled by the signal sampling module.

[0051] In this embodiment, the overcurrent detection submodule can effectively detect whether there is an overcurrent risk, thereby reducing the risk of thermal runaway of the battery pack.

[0052] In a fifth aspect, an embodiment of the present application provides a vehicle, comprising the current sampling system as described in the second aspect or the current sampling circuit as described in the third aspect.

[0053] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without creative work.

[0055] FIG1 is a schematic structural diagram of a current sampling device provided in an embodiment of the present application;

[0056] FIG2 is a schematic structural diagram of a flow divider provided in an embodiment of the present application;

[0057] FIG3 is a cross-sectional schematic diagram of a current sampling device provided in an embodiment of the present application;

[0058] FIG4 is a partial schematic diagram of the signal measurement component in FIG3 ;

[0059] FIG5 is a schematic structural diagram of a current sampling system provided in an embodiment of the present application;

[0060] FIG6 is a schematic structural diagram of a current sampling circuit provided in an embodiment of the present application.

[0061] Figure numerals: 100, current sampling device; 101, battery; 102, sampling board; 1, shunt; 11, conductive connector; 111, notch; 12, signal conversion component; 2, circuit board; 21, signal transmission component; 22, first sub-circuit board; 23, second sub-circuit board; 3, signal measurement component; 4, temperature sensor; 5, calibration mark.

[0062] In the drawings, the drawings are not drawn to scale. DETAILED DESCRIPTION

[0063] The following detailed description of the embodiments of the present application is provided in conjunction with the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present application, but are not intended to limit the scope of the present application, i.e., the present application is not limited to the described embodiments.

[0064] In the description of this application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inside", "outside", etc., indicating directions or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly perpendicular, but is within the allowable error range. "Parallel" is not strictly parallel, but is within the allowable error range.

[0065] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0066] In related technologies, current sampling devices used in current detection typically require the use of a shunt and a Hall effect sensor for primary and redundant sampling. However, the shunt and Hall effect sensor are typically separate structures, resulting in the current sampling device often having a large structural size, which is not conducive to miniaturization. Furthermore, Hall effect sensors typically perform vertical sampling through a magnetic core, which requires different sizes depending on the charge and discharge current. This is particularly true for high currents, where the size requirement is large, making miniaturization more difficult. Furthermore, there is a risk of core saturation, which affects current sampling accuracy.

[0067] Based on the above problems, the applicant has improved the structure of the current sampling device. The technical solution described in the embodiments of this application is applicable to the current sampling device, the current sampling system including the current sampling device, the current sampling circuit applied to the current sampling system, the battery management system including the current sampling device, and the vehicle using the battery management system.

[0068] 1 to 4 , an embodiment of the present application provides a current sampling device 100 , including:

[0069] The shunt 1 includes a plurality of conductive connectors 11 and at least one signal converter 12. The plurality of conductive connectors 11 are arranged in sequence, and at least one signal converter 12 is disposed in at least one conductive connector group. The conductive connector group includes two adjacent conductive connectors 11.

[0070] A circuit board 2 is provided on one side of the diverter 1 , and at least one signal converter 12 is connected to the circuit board 2 ;

[0071] The signal measuring component 3 is arranged on the conductive connecting member 11 and connected to the circuit board 2. The signal measuring component 3 is provided with a positive sampling point and a negative sampling point, which are respectively arranged on two opposite sides of the conductive connecting member 11.

[0072] In this embodiment, the current splitter 1 may include multiple conductive connectors 11 and at least one signal converter 12. The number of signal converters 12 may be one or more. For example, as shown in FIG2 , the current splitter 1 may be composed, from left to right, of a conductive connector 11, a signal converter 12, and a conductive connector 11.

[0073] The plurality of conductive connectors 11 are arranged in sequence, and any two of the plurality of conductive connectors 11 may be at least partially adjacent to each other, or the conductive connectors 11 may be spaced apart from each other.

[0074] The at least one signal converter 12 is arranged between at least one group of conductive connectors. The conductive connectors among the multiple conductive connectors may be adjacent to form at least one conductive connection group, and at least part of the at least one conductive connection group contains at least one signal converter 12.

[0075] For example, assuming that the number of the above-mentioned conductive connectors 11 is 4 and the number of signal converters 12 is 2, the 4 conductive connectors 11 can form 3 conductive connection groups, and the 2 signal converters can be set in 1 conductive connection group, or, can also be set in 2 conductive connection groups.

[0076] The two adjacent conductive connectors 11 may be understood as two conductive connectors 11 being adjacent to each other in terms of their placement. For example, the two conductive connectors 11 may be at least partially adjacent to each other, or the two conductive connectors 11 may have a common gap.

[0077] It should be noted that, when there are two adjacent conductive connectors 11 among the above-mentioned multiple conductive connectors 11, the adjacent conductive connectors 11 can be insulated, and the above-mentioned signal conversion component 12 is arranged between the adjacent conductive connectors 11, and a partial hollow area can be provided between the adjacent conductive connectors 11, and the signal conversion component 12 is embedded in the hollow area.

[0078] The signal converter 12 is disposed between two adjacent conductive connectors 11 . The conductive connector 11 and the signal converter 12 may be fixedly connected and electrically conductive. Specifically, the conductive connector 11 and the signal converter 12 may be welded together by electron beam welding.

[0079] The signal converter 12 can be any component capable of converting the current signal from the battery pack into a voltage signal to facilitate subsequent current sampling. The signal converter 12 can be provided with sampling points. For example, as shown in FIG2 , the signal converter 12 can include a positive sampling electrode S1P and a negative sampling electrode S1N.

[0080] The conductive connector 11 can be any metal member with conductive properties. Specifically, the conductive connector 11 can be a copper busbar, and the copper busbar can be a soft copper busbar or a hard copper busbar. More specifically, the conductive connector 11 can be a copper bar (or, also called a "soft copper bar").

[0081] The size of the conductive connector 11 can be obtained by simulation software based on heat dissipation analysis of different currents of the battery pack, and is not specifically limited here.

[0082] As shown in FIG1 , the current sampling device 100 may further include a circuit board 2 and a signal measurement component 3. The circuit board 2 is disposed on a side of the shunt 1 and may cover at least one signal converter 12 and at least some of the plurality of conductive connectors 11. The circuit board 2, the signal converter 12, and the conductive connectors 11 may be soldered together using vacuum reflow soldering.

[0083] For example, the signal conversion component 12 can be soldered on the circuit board 2 through a surface mounted technology (SMT) to achieve electrical connection and facilitate subsequent signal transmission.

[0084] The circuit board 2 can be any board structure having connecting circuits for transmitting electrical signals. Specifically, the circuit board 2 can be a rigid circuit board or a flexible circuit board. The circuit board 2 can be used to electrically connect the various components of the current sampling device 100, simplifying assembly, reducing wiring, saving space, and reducing structural dimensions, thereby facilitating miniaturization.

[0085] The signal measuring component 3 may be any component capable of measuring the collected electrical signal. For example, the signal measuring component 3 may be a Hall effect component, more specifically, a Hall effect chip.

[0086] The signal measurement component 3 can be disposed on any one of the plurality of conductive connectors 11 and electrically connected to the circuit board 2. As shown in FIG4 , the signal measurement component 3 is provided with a positive sampling point H1P and a negative sampling point H1N, which are disposed on the side of the conductive connector 11.

[0087] The positive sampling point H1P and the negative sampling point H1N are disposed on the side surfaces of the conductive connector 11 , and may be disposed on the same side surface of the conductive connector 11 , or may be disposed on adjacent side surfaces of the conductive connector 11 .

[0088] As can be appreciated, signal measurement component 3 is compact, highly sensitive to magnetic fields parallel to its sides, and easy to integrate. Furthermore, signal measurement component 3 is typically made of amorphous magnetic materials with high permeability and low hysteresis, eliminating the need for a magnetic core and enabling direct measurement of current flowing in the busbars beneath the package or in the traces of circuit board 2. Therefore, using signal measurement component 3 for current sampling further facilitates structural miniaturization.

[0089] It should be noted that the term "connection" as used herein can be understood to mean at least one of a physical connection and an electrical connection. For example, the electrical connection between the signal measurement component 3 and the circuit board 2 can be achieved by fixing the signal measurement component 3 to the circuit board 2 and electrically connecting the signal measurement component 3 to the circuit board 2.

[0090] In this embodiment, the integrated design of the current divider 1 and the signal measurement component 3 enables multi-channel sampling while reducing the structural size and facilitating miniaturization. Furthermore, sampling via the signal measurement component 3 eliminates the need for a magnetic core, further reducing the structural size while avoiding the risk of core saturation affecting sampling accuracy.

[0091] In some embodiments, the positive sampling point H1P and the negative sampling point H1N are respectively disposed on two opposite side surfaces of the conductive connecting member 11 .

[0092] In this embodiment, by arranging the positive sampling point H1P and the negative sampling point H1N on two opposite sides of the conductive connector 11 , current signals in opposite directions can be collected, thereby achieving differential sampling and further improving sampling accuracy.

[0093] In some embodiments, the plurality of conductive connecting elements 11 are spaced apart from each other, and the signal conversion element 12 is located in at least a portion of the space between two adjacent conductive connecting elements 11 .

[0094] In this embodiment, by arranging multiple conductive connectors 11 at intervals from each other and the signal converter 12 being located in at least a portion of the interval between two adjacent conductive connectors 11, mutual interference between signals generated on the conductive connectors 11 can be reduced, thereby improving sampling accuracy.

[0095] The above-mentioned signal converter 12 can be arranged in a partial gap between two adjacent conductive connectors 11, for example, the signal converter 12 occupies 1 / 4, 1 / 2 or 3 / 4 of the gap between two adjacent conductive connectors; or, the above-mentioned signal converter 12 can fill the gap between two adjacent conductive connectors 11.

[0096] In some embodiments, the signal conversion component is disposed between each two adjacent conductive connecting components.

[0097] In this embodiment, by arranging the signal conversion component between each two adjacent conductive connectors, that is, a signal conversion component is arranged between each two adjacent conductive connectors, the structure of the diverter module can be made more compact, the structural size is further reduced, and miniaturization is facilitated.

[0098] The signal conversion component is disposed between each two adjacent conductive connecting components 11 . It can be understood that when the number of the conductive connecting components 11 is N, the number of the signal conversion components 12 is N−1, where N is an integer greater than 1.

[0099] In some embodiments, the circuit board 2 includes:

[0100] A first sub-circuit board 22 , the first sub-circuit board 22 is connected to at least one signal conversion component 12 ;

[0101] The second sub-circuit board 23 is electrically connected to the first sub-circuit board 22 and is also connected to the signal measuring component 3 .

[0102] As shown in FIG3 , the circuit board 2 may include a first sub-circuit board 22 and a second sub-circuit board 23. The first sub-circuit board 22 may be disposed on a side of the diverter 1 and connected to at least one signal converter 12. In other words, the first sub-circuit board 22 may be parallel to the plane in which the plurality of conductive connectors 11 are located.

[0103] As shown in Figure 4 , the second sub-circuit board 23 can be electrically connected to the first sub-circuit board 22 and to the signal measurement component 3. As mentioned above, the signal measurement component 3 generally has a positive sampling point H1P and a negative sampling point H1N located on either side of the conductive connector 11. Based on this, in order to better connect with the signal measurement component 3, the second sub-circuit board can be arranged perpendicular to the plane of the conductive connector 11.

[0104] The first sub-circuit board 22 and the second sub-circuit board 23 may be formed by two areas on an integral circuit board; or, the first sub-circuit board 22 and the second sub-circuit board 23 may also be two independent circuit boards.

[0105] In this embodiment, based on the structural layout of the shunt 1 and the signal measurement component 3, the integrated design of the shunt 1 and the signal measurement component 3 can be realized through different circuit boards 2, so that the structural layout of the current sampling device 100 is more reasonable and more conducive to miniaturization requirements.

[0106] In some embodiments, at least one side surface of the conductive connector 11 on which the signal measuring component 3 is disposed is provided with a notch 111, and the position of the notch 111 corresponds to the position of the signal measuring component 3. Of course, in addition to the conductive connector 11 on which the signal measuring component 3 is disposed having the notch 111, other conductive connectors 11 may also have notches 11, and this is not limited here.

[0107] As shown in Figures 2 and 3, the conductive connector 11 can have a notch 111 on at least one side thereof at the position corresponding to the signal measurement component 3, for example, notches 111 can be provided on both sides, so that the magnetic field here is relatively concentrated, thereby making the magnetic induced current more concentrated, so that the signal measurement component 3 can more accurately collect the current signal.

[0108] The position of the notch 111 corresponds to the position of the signal measuring component 3 , and may be on the side of the conductive connector 11 where the notch 111 is provided, and the projection of the signal measuring component 3 at least partially overlaps with the notch 111 .

[0109] In this embodiment, by providing a notch 111 at a position of the conductive connector 11 corresponding to the signal measurement component 3 , the magnetic induction current at this position is more concentrated, thereby improving the sampling accuracy of the signal measurement component 3 .

[0110] In some embodiments, the notch 111 covers a projection of the signal measuring component 3 on the side of the conductive connecting member 11 where the notch 111 is provided.

[0111] In this embodiment, by providing the notch 111 to cover the projection of the signal measurement component 3 on the side of the conductive connector 11 where the notch 111 is provided, the ability of the notch 111 to gather magnetically induced current can be enhanced, thereby further improving the sampling accuracy of the signal measurement component 3.

[0112] In some embodiments, as shown in FIG2 , the current sampling device 100 further includes:

[0113] At least one temperature sensor 4 is provided corresponding to at least one signal converter 12 , and at least one temperature sensor 4 is connected to the circuit board 2 .

[0114] In this embodiment, the at least one temperature sensor 4 is provided corresponding to at least one signal converter 12. The number of temperature sensors 4 is equal to the number of signal converters 12, that is, one temperature sensor 4 is provided corresponding to one signal converter 12. The temperature sensor 4 can be soldered to the circuit board 2 using a side mount technology (SMT) to achieve electrical connection and facilitate subsequent signal transmission.

[0115] The above-mentioned temperature sensor 4 is arranged corresponding to the signal conversion component 12. It can be understood that the temperature sensor 4 is only used to collect the temperature of the corresponding signal conversion component 12, and the corresponding temperature sensor 4 and the signal conversion component 12 can be associated in the setting position. For example, the temperature sensor 4 can be fixedly connected to the corresponding signal conversion component 12; or, the corresponding temperature sensor 4 and the signal conversion component 12 can also have other associations, such as electrical connection or relative and spaced arrangement, etc.

[0116] As an example, assuming that there is only one signal converter 12 and one temperature sensor 4, as shown in FIG2 , the temperature sensor 4 can be provided corresponding to the signal converter 12 and can be provided with a positive sampling electrode N1P and a negative sampling electrode N1N. The temperature sensor 4 can acquire the temperature of the signal converter 12 and transmit the temperature change of the signal converter 12 to the sampling board 102 via the positive sampling electrode N1P and the negative sampling electrode N1N of the temperature sensor 4, so that the sampling board 102 can compensate for the temperature drift of the signal converter 12.

[0117] In this embodiment, the temperature sensor 4 can collect the temperature of the signal converter 12 to subsequently compensate for the temperature drift of the signal converter 12 , thereby improving the sampling accuracy of the signal converter 12 and further improving the current detection accuracy.

[0118] In some embodiments, the current sampling device 100 further includes:

[0119] The calibration mark 5 is set on the circuit board 2.

[0120] In this embodiment, the current sampling device 100 may further include a calibration mark 5 provided on the circuit board 2. The calibration mark 5 may include a barcode, a QR code, etc. The initial resistance value and the temperature compensation coefficient of the shunt 1 and the signal measurement component 3 may be calibrated for the sampling board 102 by scanning the calibration mark 5.

[0121] In this embodiment, the initial resistance value of the shunt 1 and the temperature compensation coefficient can be calibrated by the calibration mark 5 to avoid subsequent sampling deviation and improve the current sampling accuracy.

[0122] In some embodiments, the material of the N-1 signal conversion components 12 is any one of manganese-copper alloy, iron-chromium-aluminum alloy and nickel-chromium alloy.

[0123] In this embodiment, the material of the signal conversion component 12 is any one of manganese-copper alloy, iron-chromium-aluminum alloy and nickel-chromium alloy. For example, manganese-copper alloy can be used, which has the characteristics of high sensitivity, fast response, good linearity, and small resistance temperature coefficient, and can effectively ensure the current sampling accuracy of the shunt 1.

[0124] In this embodiment, the material of the signal conversion component 12 can be selected from any one of manganese-copper alloy, iron-chromium-aluminum alloy and nickel-chromium alloy according to actual needs. The diverter 1 is very flexible to meet more diverse needs.

[0125] In some embodiments, a signal transmission component 21 is provided on the circuit board 2, and the signal transmission component 21 is electrically connected to the diverter 1 and the signal measuring component 3, and the signal transmission component 21 is used to transmit the electrical signal generated on the diverter 1 and the signal measuring component 3.

[0126] In this embodiment, by providing the signal transmission member 21 on the circuit board 2 , the electrical signals generated by the diverter 1 and the signal measurement component 3 can be conveniently transmitted.

[0127] The signal transmission component 21 can be soldered on the circuit board 2 by SMT. The signal transmission component 21 can be used to transmit the electrical signals generated by the shunt 1 and the signal measurement component 3 to the sampling board 102 through the wiring harness to achieve the purpose of current sampling.

[0128] In some embodiments, the signal measurement component 3 includes at least one of a Hall effect component, a shunt component, and a magnetoresistive effect component.

[0129] In this embodiment, the signal measurement component 3 can include at least one of a Hall effect component, a shunt component and a magnetoresistive effect component, thereby making the implementation of the signal measurement component more flexible and diverse, and increasing the application scenarios of the current sampling device.

[0130] As shown in FIG5 , an embodiment of the present application further provides a current sampling system, including:

[0131] Battery 101 and sampling plate 102;

[0132] and the above-mentioned current sampling device 100;

[0133] The battery 101 and the sampling board 102 are respectively connected to the current sampling device 100 .

[0134] In this embodiment, as shown in FIG5 , the current sampling system may include a battery 101, a sampling board 102, and a current sampling device 100. The battery 101 and the sampling board 102 may be connected to the current sampling device 100, respectively. The shunt 1 and the signal measurement component 3 in the current sampling device 100 may respectively perform multi-channel sampling on the current signal of the battery 101 and transmit the sampling signal to the sampling board 102 for current detection, thereby analyzing the status of the battery 101.

[0135] In this embodiment, the current sampling system may include the aforementioned current sampling device 100. Thus, the integrated design of the current shunt 1 and the signal measurement component 3 enables multi-channel sampling while reducing the structural size and facilitating miniaturization. Furthermore, sampling is performed by the signal measurement component 3 without the need for a magnetic core, further reducing the structural size while avoiding the risk of core saturation affecting sampling accuracy.

[0136] As shown in FIG6 , an embodiment of the present application provides a current sampling circuit, including:

[0137] At least one shunt sampling module, the shunt sampling module being provided corresponding to at least one signal conversion component 12 in the above-mentioned current sampling device;

[0138] A signal sampling module, which corresponds to the signal measurement component 3 in the above-mentioned current sampling device;

[0139] A main control module is used to connect with at least one diverter sampling module and a signal sampling module respectively.

[0140] In this embodiment, the current sampling circuit may include at least one shunt sampling module, wherein at least one shunt sampling module may be provided corresponding to at least one signal converter 12 in the current sampling device. That is, the number of shunt sampling modules is equal to the number of signal converters 12, and each shunt sampling module is electrically connected to its corresponding signal converter 12.

[0141] For example, if the current sampling circuit includes a signal conversion component 12, then the corresponding shunt sampling module is also one. The shunt sampling module can be used for battery pack state description calculation and over-current diagnosis. The battery pack state description (State Of X, SOX) can include the power battery state of charge (State of Charge, SOC) and power battery state of health (State of Health, SOH) and power battery state of power (State of Power, SOP).

[0142] The current sampling circuit may further include a signal sampling module, which may correspond to the signal measurement component 3 in the current sampling device. This signal sampling module may be used for overcurrent diagnosis and verification of the sampled values ​​of the sampling module of the shunt 1. For example, if the signal measurement component 3 includes a Hall effect component, the signal sampling module may include a Hall effect sampling module.

[0143] The main control module may include a central processing unit (CPU), which can be connected to the shunt 1 sampling module and the signal sampling module respectively, and is used to receive the electrical signals collected by the shunt 1 sampling module and the signal sampling module, and analyze and process the electrical signals collected by the shunt 1 sampling module and the signal sampling module to obtain the sampling current corresponding to the shunt 1 sampling module and the signal sampling module.

[0144] It can be understood that the signal sampling module may include an output submodule OUTPUT, an input voltage submodule POWER, and the main control module may also include a voltage regulator LDO, a first analog-to-digital conversion submodule ADC1, and a second analog-to-digital conversion submodule ADC2. Among them, the voltage regulator LDO can output a stable input voltage to the input voltage submodule POWER of the signal sampling module to ensure that the signal measurement component 3 can work normally, wherein the input voltage can be set according to actual needs, for example, the input voltage can be 5V. The electrical signal collected by the signal sampling module can flow to the first analog-to-digital conversion submodule ADC1 through the output submodule OUTPUT, and be received by the CPU after conversion. In addition, the electrical signal collected by the shunt 1 sampling module can flow to the second analog-to-digital conversion submodule ADC2, and be received by the CPU after conversion.

[0145] In this embodiment, the integrated design of the current divider 1 and the signal measurement component 3 enables multi-channel sampling while reducing the structural size and facilitating miniaturization. Furthermore, sampling via the signal measurement component 3 eliminates the need for a magnetic core, further reducing the structural size while avoiding the risk of core saturation affecting sampling accuracy.

[0146] In some embodiments, the signal sampling module may further include a storage submodule, and the storage submodule is used to back up the calibration data.

[0147] In this embodiment, the storage submodule can be used to back up calibration data. In other words, the calibration data corresponding to the signal measurement component 3 can be pre-configured and stored in the storage submodule. Thus, when using the signal measurement component 3 for current sampling, the signal measurement component 3 can be calibrated and sampled directly based on the calibration data in the storage submodule, further improving the sampling accuracy of the signal measurement component 3.

[0148] The storage submodule may be any structure having a data storage function. Specifically, the storage submodule may be an Electrically Erasable Programmable Read-Only Memory (EEPROM).

[0149] In some embodiments, the signal sampling module may further include a signal modulation submodule, which is used to amplify and shape the voltage signal generated by the signal measurement component 3 .

[0150] In this embodiment, the signal modulation submodule can be used to amplify and shape the voltage signal generated by the signal measurement component 3. The amplified and shaped voltage signal is transmitted to the main control module so that the main control module can obtain a more accurate voltage signal, and then analyze and process the voltage signal to more accurately obtain the sampling current corresponding to the signal measurement component 3, thereby further improving the sampling accuracy of the signal measurement component 3.

[0151] In some embodiments, the signal sampling module may further include an overcurrent detection (OCD) submodule, and the OCD submodule is used to detect whether the current signal sampled by the signal sampling module is overcurrent.

[0152] In this embodiment, the OCD sub-module can effectively detect whether there is an overcurrent risk. For example, the main control module can also include a general-purpose input / output port (GPIO). When the sampling current corresponding to the signal measurement component 3 is greater than the current threshold, the OCD is triggered. At this time, the OCD pin can output a low-level signal to the general-purpose input / output port (GPIO) so that the CPU can receive the low-level signal to serve an alarm purpose.

[0153] The current of the battery 101 is jointly detected through the overcurrent diagnosis of the shunt 1, the overcurrent diagnosis of the signal measurement component 3, and the OCD alarm inside the signal measurement component 3, thereby improving the robustness of the entire current detection, reducing the risk of missed alarms and false alarms, and thus reducing the risk of thermal runaway of the battery pack.

[0154] An embodiment of the present application provides a vehicle, comprising the above-mentioned current sampling system or the above-mentioned current sampling circuit.

[0155] The present application also provides a vehicle that can include the above-mentioned current sampling system or circuit. This improves the reliability of the vehicle's charging and discharging process and reduces the risk of battery failure, as the battery management system's current detection is more accurate and reliable.

[0156] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and components may be substituted with equivalents without departing from the scope of the present application. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A current sampling device, comprising: A shunt, the shunt comprising a plurality of conductive connecting members and at least one signal conversion member, the plurality of conductive connecting members are arranged in sequence, and the at least one signal conversion member is disposed in at least one group of conductive connecting members, the conductive connecting member group comprising two adjacent conductive connecting members; A circuit board, the circuit board is arranged on a side of the diverter, and the at least one signal conversion component is connected to the circuit board; A signal measuring component, wherein the signal measuring component is arranged on any one of the plurality of conductive connecting members, and the signal measuring component is connected to the circuit board, and the signal measuring component is provided with a positive sampling point and a negative sampling point, and the positive sampling point and the negative sampling point are respectively arranged on the sides of the conductive connecting member.

2. The current sampling device according to claim 1, wherein: The positive electrode sampling point and the negative electrode sampling point are respectively arranged on two opposite side surfaces of the conductive connecting member.

3. The current sampling device according to claim 1, wherein: The plurality of conductive connecting members are arranged at intervals from each other, and the signal conversion member is located in at least a portion of the interval between two adjacent conductive connecting members.

4. The current sampling device according to claim 1, wherein: The signal conversion component is arranged between each two adjacent conductive connecting components.

5. The current sampling device according to any one of claims 1 to 4, wherein: The circuit board comprises: a first sub-circuit board, wherein the first sub-circuit board is connected to the at least one signal conversion component; A second sub-circuit board is electrically connected to the first sub-circuit board and is connected to the signal measuring component.

6. The current sampling device according to any one of claims 1 to 4, wherein: At least one side surface of the conductive connecting member on which the signal measuring component is disposed is provided with a notch, and the position of the notch corresponds to the position of the signal measuring component.

7. The current sampling device according to claim 6, wherein: The notch covers a projection of the signal measuring component on a side of the conductive connecting member where the notch is provided.

8. The current sampling device according to any one of claims 1 to 4, further comprising: At least one temperature sensor is disposed corresponding to the at least one signal conversion component, and the at least one temperature sensor is connected to the circuit board.

9. The current sampling device according to any one of claims 1 to 4, wherein: A signal transmission component is arranged on the circuit board, the signal transmission component is electrically connected to the shunt and the signal measurement component, and the signal transmission component is used to transmit the electrical signal generated by the shunt and the signal measurement component.

10. The current sampling device according to any one of claims 1 to 4, further comprising: A calibration mark is arranged on the circuit board.

11. The current sampling device according to any one of claims 1 to 4, wherein: The signal measurement component includes at least one of a Hall effect component, a shunt component and a magnetoresistive effect component.

12. A current sampling system, comprising: Batteries and sampling plates; And a current sampling device according to any one of claims 1 to 11; Wherein, the battery and the sampling plate are respectively connected to the current sampling device.

13. A current sampling circuit, comprising: at least one shunt sampling module, wherein the shunt sampling module is arranged corresponding to at least one signal conversion component in the current sampling device according to any one of claims 1 to 11; A signal sampling module, wherein the signal sampling module corresponds to the signal measurement component in the current sampling device according to any one of claims 1 to 11; A main control module, the main control module is used to be connected to the at least one splitter sampling module and the signal sampling module respectively.

14. The current sampling circuit according to claim 13, wherein: The signal sampling module includes a storage submodule, and the storage submodule is used to back up calibration data.

15. The current sampling circuit according to claim 13, wherein: The signal sampling module further includes a signal modulation submodule, and the signal modulation submodule is used to amplify and shape the voltage signal generated by the signal measurement component.

16. The current sampling circuit according to any one of claims 13 to 15, wherein: The signal sampling module further includes an overcurrent detection submodule, and the overcurrent detection submodule is used to perform overcurrent detection on the current signal sampled by the signal sampling module. 17 . A vehicle, comprising the current sampling system according to claim 12 or the current sampling circuit according to claim 13 .

Images