Ring device having micro optical pattern and manufacturing method thereof

Abstract

This housing component may comprise a housing part having a curved outer surface and micro groove patterns formed on the curved outer surface. The micro groove patterns may be formed integrally with the curved outer surface during injection molding of the housing component. Various embodiments are possible.

Description

Ring device having a micro-optical pattern and method for manufacturing the same

[0001] The following descriptions relate to a ring device having an optical pattern and a method for manufacturing the same.

[0002] A variety of electronic products, such as smartphones and wearable devices, are being developed. To meet consumer purchasing criteria, the importance of emotional appeal through the external design of electronic products is growing, in addition to their functional aspects. To appeal to consumers on this emotional level, CMF technologies, such as various colors, materials, and finishes, are being applied to products.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] According to one embodiment, a housing component may include a housing part having a curved outer surface and micro groove patterns formed on the curved outer surface. The micro groove patterns may be integrally formed on the curved outer surface during injection molding of the housing part.

[0005] According to one embodiment, a method for manufacturing a housing part may include a step of attaching a pattern sheet having a pattern corresponding to a micro-optical pattern formed thereon to cores of a mold. The method may include a step of injecting a plastic material into a cavity of the mold to manufacture the housing part having a curved outer surface and the micro-optical pattern formed on the curved outer surface.

[0006] According to one embodiment, an electronic device may include a housing including a first portion and a second portion on the first portion. The second portion may include a surface facing the exterior of the electronic device. The surface may include a first region and a second region separated by a parting line. A micro-optical pattern may be formed in the first region and the second region. The first region may be formed of the same material as the second region.

[0007] An accessory cover for an electronic device according to one embodiment may include a first portion and a second portion on the first portion. The second portion may include a surface facing the exterior of the accessory cover. The surface may include a first region and a second region separated by a parting line. A micro-optical pattern may be formed in the first region and the second region. The first portion may be formed of the same material as the second portion.

[0008] FIG. 1A is a diagram illustrating an exemplary ring device according to one embodiment.

[0009] FIG. 1b is an exploded view of an exemplary ring device according to one embodiment.

[0010] FIG. 2A is a drawing showing a housing having an exemplary micro-optical pattern according to one embodiment.

[0011] FIG. 2b is a drawing showing a housing having an exemplary micro-optical pattern according to one embodiment.

[0012] FIG. 3A is a drawing showing a surface of an exemplary housing according to one embodiment.

[0013] FIG. 3b is a drawing showing a surface of an exemplary housing according to one embodiment.

[0014] FIG. 3c is a drawing showing a surface of an exemplary housing according to one embodiment.

[0015] FIG. 4 is a drawing for explaining a method for manufacturing an exemplary pattern sheet according to one embodiment.

[0016] FIG. 5 is a flowchart illustrating a method for forming an exemplary pattern sheet according to one embodiment.

[0017] FIG. 6a is a drawing exemplarily showing a mold in a closed state according to one embodiment.

[0018] FIG. 6b is a drawing exemplarily showing a mold for forming a mold according to one embodiment.

[0019] FIG. 6c is a flowchart illustrating a method for manufacturing an exemplary housing according to one embodiment.

[0020] Figure 7 is a drawing showing an exemplary mold according to one embodiment.

[0021] FIG. 8 is an exemplary drawing showing a pattern sheet attached to a core according to one embodiment.

[0022] Figure 9a is a laser microscope image of an optical pattern according to a comparative example.

[0023] Figure 9b is a graph showing the profile of an optical pattern according to a comparative example.

[0024] FIG. 10A is a laser microscope image of a micro-optical pattern according to one embodiment.

[0025] FIG. 10b is a graph showing the profile of a micro-optical pattern according to one embodiment.

[0026] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments.

[0027] In this document, the same reference numerals are given to the same components, and duplicate descriptions of components with the same reference numerals may be omitted.

[0028] FIG. 1A is a diagram illustrating an exemplary ring device according to an embodiment. Referring to FIG. 1A, a ring device (100) according to an embodiment (e.g., an electronic device (1101) of FIG. 11) may include a housing (110) forming its exterior. The housing (110) may include a first side (100A) of the ring device (100), a second side (100B) opposite to the first side (100A), and a third side (100C) extending from an edge of the first side (100A) to an edge of the second side (100B). The ring device (100) may have a ring shape so that a user may wear it on a finger, as illustrated. The second side (100B) may be a side that comes into contact with a finger of a user wearing the ring device (100).

[0029] In one embodiment, the housing (110) may include a first member (120) and a second member (130) coupled to the first member (120). The first member (120) may form a first side (100A) of the ring device (100) and a portion of a third side (100C) extending from the first side (100A). The second member (130) may form a second side (100B) of the ring device (100) and a remaining portion of the third side (100C) extending from the second side (100B). As another example, the entire third side (100C) may be formed by the first member (120) or the second member (130). The first member (120) forming the outer surface (e.g., the first surface (100A)) of the ring device (100) may be referred to as an outer ring, and the second member (130) forming the inner surface (e.g., the second surface (100B)) of the ring device (100) may be referred to as an inner ring.

[0030] In one embodiment, the ring device (100) is described as a wearable device worn by a user on a finger, but is not limited thereto. The various embodiments disclosed in this document may be applied to various types of electronic devices, such as portable communication devices such as smartphones, computer devices, portable multimedia devices, portable medical devices, cameras, or home appliances. Furthermore, the various embodiments disclosed in this document may be applied to external devices, such as accessory covers, in which electronic devices are stored.

[0031] FIG. 1B is an exploded view of an exemplary ring device according to an embodiment. Referring to FIG. 1B, a ring device (100) according to an embodiment may include a substrate assembly (140) and a battery (150). The substrate assembly (140) and the battery (150) may be disposed within a housing (110). For example, the substrate assembly (140) and the battery (150) may be disposed between a first member (120) and a second member (130). The substrate assembly (140) and the battery (150) may be secured within the housing (110) by being surrounded by the first member (120) and the second member (130). The substrate assembly (140) and the battery (150) may be provided in a bent shape, at least partially, to correspond to the shape of the ring device (100).

[0032] In one embodiment, the substrate assembly (140) may include at least one substrate on which various components of the ring device (100) are arranged. The substrate may include, for example, a printed circuit board. When the at least one substrate is composed of multiple substrates, the substrate assembly (140) may include a connecting substrate that interconnects the multiple substrates. The connecting substrate may include, for example, a flexible printed circuit board. The at least one substrate may include, for example, a processor for controlling the overall operation of the ring device (100) (e.g., the processor (1120) of FIG. 11) and a communication circuit for the ring device (100) to communicate with an external device (e.g., a user's mobile terminal) (e.g., the wireless communication module (1192) of FIG. 11).

[0033] FIG. 2A is a diagram illustrating a housing having an exemplary micro-optical pattern, according to one embodiment. Referring to FIG. 2A, a housing (200) according to one embodiment (e.g., the first member (120) or the second member (130) of FIG. 1B) may include a first portion (210) and a second portion (220) on the first portion (210). The second portion (220) may include a surface (200A) facing the exterior of the housing (200) (e.g., the first side (100A), the second side (100B), or the third side (100C) of FIG. 1A). As illustrated in FIG. 2A, a micro-optical pattern (250) may be formed on the surface (200A). The micro-optical pattern (250) may provide a visual effect utilizing properties of light (e.g., reflection, refraction, scattering, or diffraction). For example, but not limited to, the micro-optical pattern (250) can provide visual effects such as gloss, metallic texture, holographic effect, and gradation effect to the surface (200A). In one embodiment, the micro-optical pattern (250) can include a plurality of grooves having a microscopic size to provide the visual effects described above. For example, but not limited to, the micro-optical pattern (250) can include a Fresnel pattern.

[0034] In one embodiment, the ring device (100) may include an optical sensor (e.g., a sensor module (1176) of FIG. 11). The optical sensor may receive or transmit light through a micro-optical pattern (250). The micro-optical pattern (250) may be configured to improve the light-emission efficiency of the optical sensor.

[0035] In one embodiment, the second portion (220) on which the micro-optical pattern (250) is formed may be formed of substantially the same material as the first portion (210). For example, the first portion (210) and the second portion (220) may include a plastic formed of various resin materials.

[0036] FIG. 2B is a diagram illustrating a housing having an exemplary micro-optical pattern according to one embodiment. Referring to FIG. 2B, a second portion (220) of a housing (200) according to one embodiment may include a surface (200A) facing the exterior of the housing (200). A micro-optical pattern (250) may be formed on the surface (200A). The micro-optical pattern (250) may provide a visual effect utilizing the properties of light.

[0037] According to one embodiment, the housing (200) may further include at least one layer formed on the surface (200A) of the second portion (220). The at least one layer may include, for example, a reflective layer (230) and / or a protective layer (240). When the at least one layer includes both the reflective layer (230) and the protective layer (240), the reflective layer (230) may be formed on the surface (200A), and the protective layer (240) may be formed on the reflective layer (230) and be exposed to the outside of the housing (200). The protective layer (240) may improve mechanical properties (e.g., surface hardness) of the housing (200). The reflective layer (230) may improve an optical effect by causing reflection of light by micro-optical patterns (250) formed on the surface (200A). For non-limiting example, the reflective layer (230) may include a metal deposition layer. For example, but not limitation, the protective layer (240) may include a hard coating layer.

[0038] FIG. 3A is a drawing illustrating a surface of an exemplary housing according to one embodiment. Referring to FIG. 3A, in one embodiment, the housing (200) may include an outwardly facing surface (200A). The surface (200A) may include a first region (310), a second region (320), and a parting line (330) between the first region (310) and the second region (320). The first region (310) and the second region (320) may be separated by the parting line (330). In one embodiment, a micro-optical pattern (e.g., the micro-optical pattern (250) of FIG. 2A) may be formed in the first region (310) and the second region (320). In one embodiment, the micro-optical patterns of the first region (310) and the second region (320) may have substantially the same or different patterns from each other. In one embodiment, the parting line (330) may be a boundary line between mold cores used in injection molding the housing (200).

[0039] FIG. 3B is a drawing illustrating a surface of an exemplary housing according to one embodiment. Referring to FIG. 3B, in one embodiment, the housing (200) may include an outwardly facing surface (200A). The surface (200A) may include a first region (310), a second region (320), and a parting line (330) between the first region (310) and the second region (320). The first region (310) and the second region (320) may be separated by the parting line (330). In one embodiment, a micro-optical pattern (e.g., the micro-optical pattern (250) of FIG. 2A) may be formed in the first region (310) and the second region (320).

[0040] In one embodiment, the housing (200) may further include a concave portion (332) formed on the surface (200A). The concave portion (332) may be positioned between the first region (310) and the second region (320). The first region (310) and the second region (320) may be separated by the concave portion (332). The concave portion (332) may extend along the parting line (330). For example, the parting line (330) may be included in the concave portion (332). For example, the parting line (330) may be formed on the concave portion (332).

[0041] FIG. 3C is a drawing illustrating a surface of an exemplary housing according to one embodiment. Referring to FIG. 3C, in one embodiment, the housing (200) may include an outwardly facing surface (200A). The surface (200A) may include a first region (310), a second region (320), and a parting line (330) between the first region (310) and the second region (320). The first region (310) and the second region (320) may be separated by the parting line (330). In one embodiment, a micro-optical pattern (e.g., the micro-optical pattern (250) of FIG. 2A) may be formed in the first region (310) and the second region (320).

[0042] In one embodiment, the housing (200) may further include a relief portion (334) formed on the surface (200A). The relief portion (334) may be positioned between the first region (310) and the second region (320). The first region (310) and the second region (320) may be separated by the relief portion (334). The relief portion (334) may extend along a parting line (330). For example, the parting line (330) may be included in the relief portion (334). For example, the parting line (330) may be formed on the relief portion (334).

[0043] FIG. 4 is a drawing for explaining a method for manufacturing an exemplary pattern sheet according to one embodiment.

[0044] Referring to FIG. 4, in step S410, a molding liquid (414) may be applied onto a mold (412). A pattern corresponding to a micro-optical pattern (e.g., a micro-optical pattern (250) of FIG. 2A) may be formed on the mold (412). For example, the pattern of the mold (412) may be processed onto the mold (412), which is a 2D flat plate, after modeling an optical pattern to be applied to a product. For a non-limiting example, the molding liquid (414) may include a material capable of implementing various refractive indices through a polymerization reaction using a photoinitiator, such as an acrylate or unsaturated polyester-based resin.

[0045] In step (S420), the substrate (422) may be placed on the mold (412) so that the molding liquid (414) is pressurized. For example, the substrate (422) may be placed on the molding liquid (414) applied to the mold (412), and the substrate (422) may be pressed by a press roller (424) so ​​that the molding liquid (414) is distributed on the mold (412). For example, the substrate (422) may include a resin film or a metal sheet. For example, the material of the substrate (422) may be selected according to the molding temperature of the resin used during injection molding. For example, when a resin having a molding temperature of high temperature (e.g., late 200 degrees) is used, the substrate (422) may be formed of a material having high heat resistance. For example, when high temperature and high pressure injection molding are required, the substrate (422) made of a metal material may be used.

[0046] In step (S430), the molding liquid (414) can be cured using an ultraviolet lamp (432). Through this, the molding liquid (414) can be cured in the shape of the pattern of the mold (412) and bonded onto the substrate (422).

[0047] In step (S440), the pattern sheet (442), which is a substrate (422) to which the hardened molding liquid (414) is combined, can be peeled from the mold (412).

[0048] FIG. 5 is a flowchart illustrating a method for forming an exemplary pattern sheet according to one embodiment.

[0049] Referring to FIG. 5, in step (S510), a pattern sheet (442) can be positioned between an upper member (520) and a lower member (510) to which a shape to be formed is applied.

[0050] In step (S520), the upper member (520) and the lower member (510) can be relatively moved. The pattern sheet (442) can be plastically deformed by being pressed by the upper member (520) and the lower member (510). Additionally, step (S520) may be performed in an environment of high temperature (e.g., about 150 degrees Celsius to 200 degrees Celsius) (e.g., hot press forming).

[0051] The pattern sheet (442) formed in step (S530) can be taken out from the molding machine. The UV molding pattern of the pattern sheet (442) may not be damaged by high temperature and high pressure.

[0052] The shape of the pattern sheet (442) illustrated in FIG. 5 is exemplary, and various shapes may be possible. In addition, although the pattern sheet (442) is described as being formed through a mold such as the lower member (510) and the upper member (520), it is not limited thereto, and various methods may be utilized.

[0053] Fig. 6a is a drawing showing an example of a mold for mold closure according to one embodiment. Fig. 6b is a drawing showing an example of a mold for mold opening according to one embodiment. The mold (600) of Figs. 6a and 6b may be a mold for manufacturing a housing (e.g., a first member (120) or a second member (130) of Fig. 1b) of a ring device (e.g., a ring device (100) of Fig. 1a). As described above, since the ring device can be replaced with various types of devices, the mold for manufacturing housings of various types may also have various types.

[0054] Referring to FIGS. 6A and 6B , a mold (600) according to one embodiment may include a mold base (630) and cores. The cores may include, for example, an outer core (610) and an inner core (620). The cores may be movably coupled to the mold base (630) to facilitate removal of a product after injection molding. The cores may define a cavity (650), and the mold base (630) may provide a path through which a material is injected into the cavity (650).

[0055] In one embodiment, the pattern sheet (442) may be attached to the inner surface of the cavity (650) in which a micro-optical pattern (e.g., the micro-optical pattern (250) of FIG. 2A) is to be implemented. For example, the pattern sheet (442) may be attached to the inner surface (610A) of the outer core (610) and the inner surface (610B) of the inner core (620). For example, the pattern sheet (442) may be attached to the inner surfaces of the first core (612), the second core (614), the third core (616), and the fourth core (618) constituting the outer core (610), respectively. Although not shown, the inner core (620), like the outer core (610), may be composed of a plurality of cores. The plurality of cores of the inner core (620) may be configured such that the diameter of the mold opening is smaller than the diameter of the mold closing, thereby enabling the ejection of the injected product. The pattern sheet (442) can be attached to each of the plurality of cores of the inner core (620).

[0056] In one embodiment, the pattern sheet (442) may be attached to the cores of the mold (600) via an adhesive or a mechanical assembly structure. For example, but not limited to, the adhesive may include a heat-resistant double-sided tape. For example, but not limited to, the mechanical assembly structure may include a bolt-joint structure.

[0057] In one embodiment, the shape of the inner surface (610A) of the outer core (610) may be substantially the same as the shape of one side of the housing (e.g., the first side (100A) of FIG. 1A). The shape of the inner surface (610B) of the inner core (620) may be substantially the same as the shape of another side of the housing (e.g., the second side (100B) of FIG. 1A).

[0058] The inner surface (610A) of the outer core (610) and the inner surface (610B) of the inner core (620) can be formed into a curved surface. The pattern sheet (442) can be easily attached to the surface of the cavity (650) formed into a curved surface by being formed as a thin film or sheet so as to be bendable and / or being pre-molded to correspond to the shape of the surface to be attached (e.g., steps (S510-530) of FIG. 5). However, the surface to which the pattern sheet (442) is attached is not limited to a relatively simple curved surface as illustrated. For example, since the pattern sheet (442) can be pre-molded to correspond to the shape of the surface to be attached, it can be easily attached to the surface of the cavity (650) having a complex shape such as a multi-dimensional curved surface, unlike the illustration.

[0059] In one embodiment, a housing (e.g., the first member (120) or the second member (130) of FIG. 1B) having a pattern of the pattern sheet (442) (e.g., the micro-optical pattern (250) of FIG. 3A) can be manufactured by injecting molten resin into a cavity (650) of a mold (600) to which a pattern sheet (442) is attached. In addition, a parting line (e.g., the parting line (330) of FIG. 3A), which is a boundary line between cores of the mold (600), can be formed on an outer surface of the housing.

[0060] In comparative examples, processes such as CNC (Computer Numerical Control) machining, electric discharge etching, sandblasting, chemical etching, MDP (micro diamond pattern), and DLPC (direct laser pattern cover) can be performed on the surface of a mold core to implement patterns on the product exterior. However, these processes have the problem that the depth of the pattern and the spacing between patterns cannot be controlled at the micro level. CNC machining is difficult to apply to the surface of a core with a 3D shape (e.g., a curved surface) because the penetration of the cutting tool is limited, and micro-level pattern processing is impossible due to the limitations of the tool itself. Chemical etching cannot uniformly form micro-level patterns within a set tolerance due to the nature of the process. Electric discharge machining and sandblasting can also be applied to the surface of a core with a 3D shape, but they can only express specific textures and have limited optical effects that can be implemented. MDP processing using a grinder can only be applied to 2D shapes, and since depth control by the processing tool is not possible, optical effects (e.g., gradation) according to depth differences cannot be implemented. Laser processing such as DLPC can implement nano-level micro-patterns, but is limited to specific holographic effects, and has the problem that the roughness of the processed surface decreases as the pattern depth increases. In addition, the laser processing has the problem that if stains or foreign substances occur within the micro-pattern on the core surface, it can be difficult to remove them, and a separate surface coating must be necessarily accompanied to prevent this.

[0061] In contrast, according to one embodiment, the pattern sheet (442) can be applied to the surface of a mold (600) having a 3D shape, and can implement various optical effects through micro-optical patterns.

[0062] In other comparative examples, methods for implementing a product's appearance by inserting a patterned film into an injection mold can be applied. For example, the in-mold decoration (IMD) process involves inserting a disposable film into a mold cavity and then injecting it, thereby transferring the film's pattern to the injection molded product, after which the film is removed from the molded product. The in-mold labeling (IML) process involves insert-molding a patterned film to laminate the film and the pattern to the product. Since these processes require one patterned film per product, variations occur depending on the process and manufacturing costs also increase.

[0063] In contrast, according to one embodiment, the pattern sheet (442) can be attached once to the surface of the mold (600) and then multiple injections can be performed, thereby reducing manufacturing costs and increasing yield.

[0064] FIG. 6c is a flowchart illustrating a method for manufacturing an exemplary housing according to one embodiment.

[0065] Referring to FIG. 6c, in step S610, a pattern sheet can be formed. For example, as described with reference to FIG. 5a, the pattern sheet (442) can be formed to correspond to the shape of the surface of the housing (e.g., the surface (200A) of FIG. 2a). Step S610 may be omitted depending on the shape of the attachment surface of the pattern sheet (442). For example, when the pattern sheet (442) is attached to the inner surface of a substantially flat core (e.g., the inner surface (810A) of FIG. 8) or to a relatively simple curved surface, step S610 may be omitted.

[0066] In step (S620), a pattern sheet may be attached to the core of the mold. For example, as described with reference to FIGS. 6A and 6B , a pattern sheet (442) may be attached to the surface of the cores (e.g., inner surfaces (610A, 610B)). The pattern sheet (442) may have a pattern corresponding to a micro-optical pattern (e.g., the micro-optical pattern (250) of FIG. 2A).

[0067] In step (S630), injection may be performed. For example, molten resin may be injected into a cavity (650) of a mold to which a pattern sheet (442) is attached. Referring also to FIG. 2A, through step (S630), a first portion (210) and a second portion (220) of the same material may be manufactured, and a micro-optical pattern (250) may be formed on a surface (200A) of the second portion (220).

[0068] Fig. 7 is a drawing illustrating an exemplary mold according to one embodiment. Fig. 7 may be an enlarged view of an area (660) of Fig. 6b. Referring to Fig. 7, a relief portion (730) may be formed at the boundary of the cores of the mold (600). For example, a first core (612) may include a portion (710) of the relief portion (730), and a second core (614) may include the remaining portion (720) of the relief portion (730). In a mold-closed state, the portion (710) and the remaining portion (720) may contact each other so that a boundary line (715) is defined.

[0069] In one embodiment, the relief portion (730) formed by the first core (612) and the second core (614) may form a negative portion of the injection-molded product (e.g., the negative portion (332) of FIG. 3b). Although not shown, alternatively, the relief portion (730) may be formed as a negative portion, and the negative portion may form a positive portion of the injection-molded product (e.g., the positive portion (334) of FIG. 3c).

[0070] In one embodiment, the boundary line (715) between the first core (612) and the second core (614) may form a parting line of the injected product (e.g., parting line (330) of FIG. 3A).

[0071] FIG. 8 is an exemplary drawing illustrating a pattern sheet attached to a core according to one embodiment. Referring to FIGS. 6A and 6B , the pattern sheet (442) is described as being attached to the surface of a cavity (650) formed into a curved surface; however, as shown in FIG. 8 , the pattern sheet (842) may also be attached to the inner surface (810A) of the core (810) formed to be substantially flat.

[0072] Fig. 9a is a laser microscope image of an optical pattern according to a comparative example. Fig. 9b is a graph showing a profile of an optical pattern according to a comparative example. Fig. 10a is a laser microscope image of a micro-optical pattern according to an embodiment. Fig. 10b is a graph showing a profile of a micro-optical pattern according to an embodiment. In Figs. 9b and 10b, the height (y-axis) according to the measurement point (x-axis) is shown.

[0073] Comparative examples of FIGS. 9A and 9B illustrate the surface of an injected product after a pattern is directly processed onto the surface of a mold. In the comparative example, when processing is performed directly onto the surface of the mold, burrs may form at the edges of the pattern. Such pattern defects are directly transferred to the surface of the injected product, as illustrated in FIGS. 9A and 9B, and degrade the optical effect of the product surface. When the pattern is processed to have a depth of approximately 3 μm, burrs of approximately 0.1 μm to 0.5 μm may be generated.

[0074] In contrast, according to one embodiment, the micro-optical pattern may have a clean shape without defects such as burrs at the edges, as illustrated in FIGS. 10A and 10B. Referring to FIG. 10B, for example, the depth (d) of the grooves of the micro-optical pattern may be about 0.1 μm or more and about 30 μm or less. For example, the pitch (p) of the grooves of the micro-optical pattern may be about 10 μm to 100 μm. However, the depth (d) and pitch (p) of the micro-optical pattern are not limited to the above-described example, and may vary depending on the optical pattern to be implemented.

[0075] According to one embodiment, an electronic device (e.g., a ring device (100) of FIG. 1A) may include a housing (e.g., a housing (200) of FIG. 2A) including a first portion (e.g., a first portion (210) of FIG. 2A) and a second portion (e.g., a second portion (220) of FIG. 2A) on the first portion. The second portion may include a surface facing the exterior of the electronic device (e.g., a surface (200A) of FIG. 2A). The surface may include a first region (e.g., a first region (310) of FIG. 3A) and a second region (e.g., a second region (320) of FIG. 3A) separated by a parting line (e.g., a parting line (330) of FIG. 3A). A micro-optical pattern (e.g., a micro-optical pattern (250) of FIG. 2A) may be formed in the first region and the second region. The first part may be formed of the same material as the second part.

[0076] In one embodiment, the second portion may include at least one layer formed on the surface. In one embodiment, the at least one layer may include a reflective layer formed on the surface (e.g., reflective layer (230) of FIG. 2B), and a protective layer formed on the reflective layer (e.g., protective layer (240) of FIG. 2B).

[0077] In one embodiment, the reflective layer may include a metal deposition layer. The protective layer may include a hard coating layer.

[0078] In one embodiment, the micro-optical pattern may include a plurality of grooves.

[0079] In one embodiment, the pitch between the plurality of grooves may be greater than or equal to 10 μm and less than or equal to 100 μm.

[0080] In one embodiment, the depth of each of the plurality of grooves may be greater than or equal to 0.1 μm and less than or equal to 30 μm.

[0081] In one embodiment, the micro-optical pattern may include a Fresnel pattern.

[0082] In one embodiment, the surface may include a raised portion (e.g., raised portion (334) of FIG. 3c) or a negative portion (e.g., negative portion (332) of FIG. 3b) positioned between the first region and the second region. The parting line may be formed in the raised portion or the negative portion.

[0083] In one embodiment, the circuit board may include a circuit board (e.g., the board assembly (140) of FIG. 1B) at least partially surrounded by the first portion.

[0084] In one embodiment, the electronic device may be a wearable device worn on a user's body.

[0085] In one embodiment, the electronic device may be formed in a ring shape. The housing may include a first surface (e.g., the first surface (100A) of FIG. 1A) and a second surface (e.g., the second surface (100B) of FIG. 1A) opposite the first surface and contacting a finger of the user wearing the electronic device. The surface of the second portion may at least partially include the first surface and the second surface.

[0086] A method for manufacturing a housing of an electronic device according to one embodiment may include a step of attaching a pattern sheet (e.g., a pattern sheet (442) of FIG. 4) having a pattern corresponding to the micro-optical pattern formed thereon to cores (e.g., cores (610, 620) of FIG. 6A) of a mold (e.g., a mold (600) of FIG. 6A) (e.g., step S620 of FIG. 6C), and a step of injecting the same material of the first part and the second part into a cavity of the mold (e.g., step S630 of FIG. 6C).

[0087] In one embodiment, prior to attachment of the pattern sheet, a step of shaping the pattern sheet to correspond to the shape of the surface of the housing may be included (e.g., step (610) of FIG. 6c).

[0088] In one embodiment, the forming step may include press forming or hot press forming.

[0089] In one embodiment, the method for manufacturing the pattern sheet may include a step of applying a molding liquid (e.g., a molding liquid (414) of FIG. 4) onto a pattern mold (e.g., a mold (412) of FIG. 4) having a pattern corresponding to a pattern of the pattern sheet (e.g., a step (410) of FIG. 4), a step of placing a substrate (e.g., a substrate (422) of FIG. 4) on the molding liquid applied to the pattern mold and pressing the substrate so that the molding liquid is dispersed (e.g., a step (420) of FIG. 4), a step of curing the molding liquid pressed by the substrate using ultraviolet rays (e.g., a step (430) of FIG. 4), and a step of peeling the substrate to which the cured molding liquid is attached from the pattern mold (e.g., a step (440) of FIG. 4).

[0090] In one embodiment, the substrate may include a sheet formed of metal or a film formed of resin.

[0091] An accessory cover of an electronic device according to one embodiment may include a first portion (e.g., a first portion (210) of FIG. 2A) and a second portion (e.g., a second portion (220) of FIG. 2A) on the first portion. The second portion may include a surface facing the outside of the accessory cover (e.g., a surface (200A) of FIG. 2A). The surface may include a first region (e.g., a first region (310) of FIG. 3A) and a second region (e.g., a second region (320) of FIG. 3A) divided by a parting line (e.g., a parting line (330) of FIG. 3A). A micro-optical pattern (250) may be formed in the first region and the second region. The first portion may be formed of the same material as the second portion.

[0092] In one embodiment, the second portion may include a metal deposition layer (e.g., a reflective layer (230) of FIG. 3b) formed on the surface thereof and a hard coating layer (e.g., a protective layer (240) of FIG. 3b) formed on the metal deposition layer.

[0093] In one embodiment, the surface may include a raised portion (e.g., raised portion (334) of FIG. 3c) or a negative portion (e.g., negative portion (332) of FIG. 3b) positioned between the first region and the second region. The parting line may be formed in the raised portion or the negative portion.

[0094] According to one embodiment, a housing component (e.g., a housing (110) of FIG. 1A or a component at least partially constituting a housing (110)) may include a housing part having a curved outer surface and micro groove patterns (e.g., a micro optical pattern (250) of FIG. 2A) formed on the curved outer surface. The micro groove patterns may be integrally formed on the curved outer surface during injection molding of the housing part.

[0095] In one embodiment, the curved outer surface may include at least one parting line (e.g., parting line (330) of FIG. 3A).

[0096] In one embodiment, a reflective layer (e.g., reflective layer (230) of FIG. 2b) may be formed on the micro-groove pattern, and a protective layer (e.g., protective layer (240) of FIG. 2b) may be formed on the reflective layer.

[0097] In one embodiment, the micro-groove pattern may include a plurality of grooves. The pitch between two adjacent grooves may be greater than or equal to 10 μm and less than or equal to 100 μm. The depth of each of the plurality of grooves may be greater than or equal to 0.1 μm and less than or equal to 30 μm.

[0098] According to one embodiment, a ring-shaped electronic apparatus (e.g., a ring device (100) of FIG. 1A) may include a ring-shaped housing that is worn on a user's finger. The curved outer surface of the housing component may correspond to an outer exterior side of the ring-shaped housing.

[0099] According to one embodiment, a method for manufacturing a housing part (e.g., housing (110) of FIG. 1a) may include a step (e.g., step S620 of FIG. 6c) of attaching a pattern sheet (e.g., pattern sheet (442) of FIG. 6a) having a pattern formed corresponding to a micro-optical pattern (e.g., micro-optical pattern (250) of FIG. 2a) to cores (e.g., cores (610, 620) of FIG. 6a) of a mold (e.g., mold (600) of FIG. 6a). The manufacturing method may include a step (e.g., step S630 of FIG. 6c) of manufacturing the housing part by injecting a plastic material into a cavity (e.g., cavity (650) of FIG. 6a) of the mold, thereby having a curved outer surface and the micro-optical pattern formed on the curved outer surface.

[0100] FIG. 11 is a block diagram of an electronic device (1101) within a network environment according to various embodiments. Referring to FIG. 11, in a network environment, an electronic device (1101) may communicate with an electronic device (1102) via a network (1198) (e.g., a short-range wireless communication network).

[0101] According to one embodiment, the electronic device (1101) may include a processor (1120), a memory (1130), a sensor module (1176), a haptic module (1179), a power management module (1188), a battery (1189), a wireless communication module (1192), or an antenna module (1197).

[0102] The processor (1120) may control at least one other component (e.g., a hardware or software component) of the electronic device (1101) connected to the processor (1120) by executing, for example, software (e.g., a program (1140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (1120) may store a command or data received from another component (e.g., a sensor module (1176) or a wireless communication module (1192)) in a volatile memory (1132), process the command or data stored in the volatile memory (1132), and store the resulting data in a non-volatile memory (1134). According to one embodiment, the processor (1120) may include a main processor (1121) (e.g., a central processing unit or an application processor) or a secondary processor (1123) (e.g., a communication processor) that may operate independently or together therewith. For example, if the electronic device (1101) includes a main processor (1121) and a secondary processor (1123), the secondary processor (1123) may be configured to use less power than the main processor (1121) or to be specialized for a given function. The secondary processor (1123) may be implemented separately from the main processor (1121) or as a part thereof.

[0103] The auxiliary processor (1123) may control at least a portion of functions or states associated with at least one component (e.g., a sensor module (1176) or a wireless communication module (1192)) of the electronic device (1101), for example, on behalf of the main processor (1121) while the main processor (1121) is in an inactive (e.g., sleep) state, or together with the main processor (1121) while the main processor (1121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a wireless communication module (1192)).

[0104] The memory (1130) can store various data used by at least one component (e.g., the processor (1120) or the sensor module (1176)) of the electronic device (1101). The data can include, for example, software (e.g., the program (1140)) and input data or output data for commands related thereto. The memory (1130) can include a volatile memory (1132) or a non-volatile memory (1134).

[0105] The program (1140) may be stored as software in memory (1130) and may include, for example, an operating system (1142), middleware (1144), or an application (1146).

[0106] The sensor module (1176) can detect the operating status (e.g., power or temperature) of the electronic device (1101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1176) can include, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. For example, the sensor module (1176) can detect biometric data such as the user's heart rate and saturation of percutaneous oxygen (SpO2), and fitness data such as the number of steps and sleep patterns. The electronic device (1101) can transmit data acquired using the sensor module (1176) to an external electronic device (1102) (e.g., a user's smart phone) in real time or in batches.

[0107] The haptic module (1179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0108] The power management module (1188) can manage power supplied to the electronic device (1101). According to one embodiment, the power management module (1188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0109] A battery (1189) may power at least one component of the electronic device (1101). In one embodiment, the battery (1189) may include, for example, a rechargeable secondary battery or a fuel cell.

[0110] The wireless communication module (1192) may support the establishment of a wireless communication channel between the electronic device (1101) and an external electronic device (e.g., the electronic device (1102)), and the performance of communication through the established communication channel. The wireless communication module (1192) may operate independently from the processor (1120) (e.g., an application processor) and may include one or more communication processors that support wireless communication. According to one embodiment, the wireless communication module (1192) may include a short-range wireless communication module or a global navigation satellite system (GNSS) communication module. Among these communication modules, a corresponding communication module may communicate with an electronic device (1102) external to the network (1198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)). These various types of communication modules may be integrated into one component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips).

[0111] The antenna module (1197) can transmit or receive signals or power to or from an external source (e.g., an external electronic device). In one embodiment, the antenna module (1197) can include an antenna comprising a radiator made of a conductor or a conductive pattern (e.g., a conductive pattern provided by a substrate (e.g., a PCB)).

[0112] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0113] According to one embodiment, the command or data may be transmitted or received through an external electronic device (1102) connected to a network (e.g., a cellular network) or a server other than the network (1198). The external electronic device (1102) may be a device of the same or a different type (e.g., a smart phone) as the electronic device (1101). According to one embodiment, all or part of the operations executed in the electronic device (1101) may be executed in one or more external electronic devices among the external electronic device (1102) or a server connected to the external electronic device. For example, when the electronic device (1101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1101). The electronic device (1101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be utilized, for example.

[0114] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0115] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0116] Various embodiments of the present document may be implemented as software (e.g., a program (1140)) including one or more instructions stored in a storage medium (e.g., an internal memory (1136) or an external memory (1138)) readable by a machine (e.g., an electronic device (1101)). For example, a processor (e.g., a processor (1120)) of the machine (e.g., an electronic device (1101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0117] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0118] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In housing components, A housing part having a curved outer surface and micro groove patterns formed on the curved outer surface, The above micro-groove pattern is integrally formed on the curved outer surface during injection molding of the housing component. Housing parts.

2. In claim 1, the curved outer surface includes at least one parting line. Housing parts.

3. In claim 1, A reflective layer is formed on the above micro-groove pattern, and a protective layer is formed on the reflective layer. Housing parts.

4. In claim 1, The above micro-groove pattern includes a plurality of grooves, The spacing (pitch) between two adjacent grooves is 10 μm or more and 100 μm or less, The depth of each of the above plurality of grooves is 0.1 μm or more and 30 μm or less, Housing parts.

5. In a ring electronic apparatus, It comprises a ring-shaped housing that is worn on the user's finger, The curved outer surface of the housing component of any one of claims 1 to 4 corresponds to the outer exterior side of the ring-shaped housing. Ring-shaped electronic device.

6. In a method for manufacturing a housing part, Step (S620) of attaching a pattern sheet having a pattern corresponding to a micro-optical pattern formed thereon to cores of a mold; A step (S630) of manufacturing the housing part having a curved outer surface and the micro-optical pattern formed on the curved outer surface by injecting a plastic material into the cavity of the mold. Manufacturing method.

7. In electronic devices, A housing comprising a first portion and a second portion on the first portion, The second portion includes a surface (200A) facing the outside of the electronic device, The above surface (200A) includes a first region and a second region divided by a parting line, In the first and second regions, micro-optical patterns are formed, The first part is formed of the same material as the second part, Electronic devices.

8. In claim 7, At least one layer formed on the surface (200A) of the second portion, Electronic devices.

9. In claim 8, At least one layer above, A reflective layer formed on the surface (200A); and Comprising a protective layer formed on the above reflective layer, Electronic devices.

10. In claim 9, The above reflective layer comprises a metal deposition layer, The above protective layer comprises a hard coating layer, Electronic devices.

11. In any one of claims 7 to 10, The above micro-optical pattern includes a Fresnel pattern. Electronic devices.

12. In any one of claims 7 to 11, The above surface (200A) includes a positive or negative portion located between the first region and the second region, The above parting line is formed in the positive or negative portion, Electronic devices.

13. In any one of claims 7 to 12, comprising a circuit board at least partially surrounded by the first portion; Electronic devices.

14. In any one of claims 7 to 13, The above electronic device is formed in a ring shape, The housing comprises a first side (100A) and a second side (100B) opposite to the first side (100A) and in contact with a finger of a user wearing the electronic device, The surface (200A) of the second portion at least partially includes the first surface (100A) and the second surface (100B). Electronic devices.

15. In a method for manufacturing the housing according to any one of claims 7 to 14, A step (S620) of attaching a pattern sheet having a pattern corresponding to the above micro-optical pattern formed thereon to the cores of the mold; Including a step (S630) of injecting the same material of the first part and the second part into the cavity of the mold. Manufacturing method.

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