Three-dimensional temperature cloud map generation method, and computing device

Abstract

Provided in the present application are a three-dimensional temperature cloud map generation method, and a computing device. In the embodiments, the method comprises: for each component in a target device, determining, on the basis of the temperature of the component, a temperature threshold value of the component and a global alarm threshold value, a weighted temperature value used for indicating whether the temperature of the component is high or low; and generating a three-dimensional temperature cloud map of the target device on the basis of the weighted temperature value and the global alarm threshold value, wherein the three-dimensional temperature cloud map comprises a curved surface, which curved surface comprises a protrusion corresponding to the component of the target device, the protrusion having a vertex, the height of the vertex being determined by means of the weighted temperature value of the corresponding component, and the color of the protrusion being used for indicating whether the weighted temperature value of the component exceeds the global alarm threshold value. By means of a three-dimensional temperature cloud map, the changes in the temperature of different areas inside a target device are shown, and a temperature distribution is displayed more clearly, such that the accuracy of identifying whether to give an alarm on the temperature can be improved, and thus the accuracy of predicting temperature problems is improved.

Description

Three-dimensional temperature cloud map generation method and computing device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 14, 2023, with application number 202311205218.6 and application name “Three-dimensional temperature cloud map generation method and calculation device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of computer technology, and in particular to a method and computing device for generating a three-dimensional temperature cloud map. Background Art

[0003] With the development of web technology, users have increasingly higher requirements for high-quality web content display. In some services that require Web3D presentation, such as displaying scenes inside a server, it is particularly important to accurately display the temperature conditions of each component to facilitate anomaly detection.

[0004] Currently, based on the temperature of server components and the global temperature threshold of the server, an alarm color can be displayed when the temperature exceeds the temperature threshold to draw a two-dimensional temperature graph.

[0005] However, since the temperatures of different components in the server vary, if a unified temperature threshold is adopted for the entire server, the accuracy of the temperature alarms of the components may be reduced.

[0006] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the application and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art.

[0007] Summary of the Invention

[0008] The embodiment of the present application provides a three-dimensional temperature cloud map generation method and computing device, which uses a three-dimensional temperature cloud map to show the temperature changes in different areas inside the target device, and more clearly displays the temperature distribution, thereby improving the accuracy of identifying whether the temperature is an alarm, and further improving the accuracy of predicting temperature problems.

[0009] In the first aspect, an embodiment of the present application provides a method for generating a three-dimensional temperature cloud map, the method comprising: for each component in a target device, determining a weighted temperature value based on the temperature of the component, the temperature threshold value of the component and the global alarm threshold value; the weighted temperature value is used to indicate the high or low temperature of the component; based on the weighted temperature value and the global alarm threshold value, generating a three-dimensional temperature cloud map of the target device in a spatial rectangular coordinate system, the three-dimensional temperature cloud map including a curved surface, the curved surface including protrusions corresponding to the components of the target device; the protrusions have vertices, the height of the vertex is determined by the weighted temperature value of the corresponding component; the color of the protrusions is used to indicate whether the weighted temperature value of the component exceeds the global alarm threshold value.

[0010] In this solution, for each component, the global alarm threshold value is used to fuse the component's real-time temperature and the component's temperature threshold value to obtain a weighted temperature value. The weighted temperature value is used to illustrate the actual temperature of the component relative to the global alarm threshold value. Then, a three-dimensional temperature cloud map of the target device is constructed based on the weighted temperature value of the component and the global alarm threshold value. During the specific construction, the vertex height of the component's bulge is constructed based on the weighted temperature value of the component. The color of the bulge is used to indicate whether an alarm has been issued. Whether an alarm has been issued is determined by comparing the global alarm threshold value and the weighted temperature value. Correspondingly, the three-dimensional temperature cloud map includes bulges in the target device that are used to characterize the operating temperatures of several components. The bulges have colors. In summary, the three-dimensional temperature cloud map can show the temperature changes in the corresponding areas of different components inside the target device and display the temperature distribution more clearly, thereby improving the accuracy of the device temperature display and thus improving the accuracy of predicting temperature problems.

[0011] In addition, by constructing the protrusions of each component on the continuous surface, the temperature changes inside the entire target device can be reflected, which is clearer and more intuitive, and the interface is more user-friendly.

[0012] In one possible implementation, the three-dimensional temperature cloud map also includes a component distribution map of the target device. The component distribution map and the curved surface are set in the same spatial rectangular coordinate system, and the curved surface is located above the component distribution map, and a bulge is generated at the position above the component in the component distribution map.

[0013] In this solution, the component distribution diagram can help users understand the component distribution and the temperature differences between components more clearly and intuitively, and facilitate a more comprehensive understanding of temperature issues.

[0014] In a possible implementation, when different protrusions overlap, the protrusion portion with the largest height in the spatial rectangular coordinate system is retained.

[0015] In this solution, when the protrusions of different components overlap, the point with the largest vertical distance from the plane where the component is located is retained, that is, the overlapping area is deleted, thereby ensuring that the color of the protrusion can accurately reflect whether an alarm is issued.

[0016] In one possible implementation, the three-dimensional temperature cloud map includes an anchor point; the anchor point is configured to display the temperature of the anchor point under user operation; and / or the anchor point is configured to enter an alarm state when the temperature of the anchor point exceeds a temperature threshold value of a component in the area where the anchor point is located.

[0017] In this solution, anchor points are used to facilitate users to view the temperature conditions at key locations, making it easier to analyze whether there are temperature problems.

[0018] In a possible implementation, the global alarm threshold includes a first global alarm threshold and a second global alarm threshold, and the first global alarm threshold is smaller than the second global alarm threshold.

[0019] In an example of this implementation, when the weighted temperature value of the component is lower than the first global alarm threshold, the vertex of the protrusion is lower than the first global alarm threshold, and the color of the first surface of the protrusion is the first color.

[0020] In one example of this implementation, when the weighted temperature value of the component is between the first global alarm threshold value and the second global alarm threshold value, the vertex of the protrusion is greater than the first global alarm threshold value and less than the second global alarm threshold value, and the color of the second surface of the area on the protrusion whose height is greater than the first global alarm threshold value gradually changes from the first color to the second color.

[0021] In this solution, by setting color gradient, the user's viewing experience is improved, and the temperature status can be felt more directly.

[0022] In one example of this implementation, when the weighted temperature value exceeds the second global alarm threshold, the vertex of the protrusion is greater than the second global alarm threshold, and the color of the third surface of the area on the protrusion whose height is greater than the second global alarm threshold gradually changes from the second color to the third color.

[0023] In this solution, by setting color gradient, the user's viewing experience is improved, and the temperature status can be felt more directly.

[0024] In an example of this implementation, the temperature threshold value of the component includes a first threshold value and a second threshold value; the first threshold value is smaller than the second threshold value.

[0025] In one example of this embodiment, determining a weighted temperature value based on a temperature of a component, a temperature threshold of the component, and a global alarm threshold includes:

[0026] When the temperature of the component is less than the second threshold, determining a first weight based on the temperature of the component and the first threshold, and taking the product of the first weight and the first global alarm threshold as the weighted temperature value of the component;

[0027] When the temperature of the component is greater than or equal to the second threshold, a second weight is determined based on the component temperature and the second threshold, and the product of the second weight and the second global alarm threshold is used as the weighted temperature value of the component.

[0028] In this solution, the weight relative to the global alarm threshold is determined by the temperature of the component and the temperature threshold of the component. The product of the weight and the global alarm threshold is used as the weighted temperature value, thereby unifying the temperature alarm thresholds of different components. This allows the three-dimensional temperature cloud map to more clearly and accurately reflect the temperature differences between different components, which is more conducive to discovering temperature problems.

[0029] In a possible implementation, the global alarm threshold value indicates a temperature alarm threshold of the target device.

[0030] In this solution, the global temperature condition is used as the global alarm threshold value, which can reflect the importance of the component in the target device. The three-dimensional temperature cloud map can more clearly and accurately reflect the importance of different components, which is more conducive to discovering temperature problems.

[0031] In a second aspect, embodiments of the present application provide a three-dimensional temperature cloud map generation device. The three-dimensional temperature cloud map generation device includes several modules, each of which is used to perform each step of the three-dimensional temperature cloud map generation method provided in the first aspect of the embodiments of the present application. The division of modules is not limited herein. The specific functions performed by each module of the three-dimensional temperature cloud map generation device and the beneficial effects achieved are referred to the functions of each step of the three-dimensional temperature cloud map generation method provided in the first aspect of the embodiments of the present application, and will not be repeated here.

[0032] For example, the three-dimensional temperature cloud map generating device includes:

[0033] A temperature value determination module is used to determine a weighted temperature value for each component in the target device based on the temperature of the component, the temperature threshold value of the component, and the global alarm threshold value; the weighted temperature value is used to indicate the temperature of the component;

[0034] The cloud map construction module is used to generate a three-dimensional temperature cloud map of the target device in a spatial rectangular coordinate system based on the weighted temperature value and the global alarm threshold value. The three-dimensional temperature cloud map includes a curved surface, and the curved surface includes protrusions corresponding to the components of the target device; the protrusions have vertices, and the heights of the vertices are determined by the weighted temperature values ​​of the corresponding components; the color of the protrusions is used to indicate whether the weighted temperature value of the component exceeds the global alarm threshold value.

[0035] In one possible implementation, the three-dimensional temperature cloud map also includes a component distribution map of the target device. The component distribution map and the curved surface are set in the same spatial rectangular coordinate system, and the curved surface is located above the component distribution map, and a bulge is generated at the position above the component in the component distribution map.

[0036] In a possible implementation, when different protrusions overlap, the protrusion portion with the largest height in the spatial rectangular coordinate system is retained.

[0037] In one possible implementation, the three-dimensional temperature cloud map includes an anchor point; the anchor point is configured to display the temperature of the anchor point under user operation; and / or the anchor point is configured to enter an alarm state when the temperature of the anchor point exceeds a temperature threshold value of a component in the area where the anchor point is located.

[0038] In a possible implementation, the global alarm threshold includes a first global alarm threshold and a second global alarm threshold, and the first global alarm threshold is smaller than the second global alarm threshold.

[0039] In an example of this implementation, when the weighted temperature value of the component is lower than the first global alarm threshold, the vertex of the protrusion is lower than the first global alarm threshold, and the color of the first surface of the protrusion is the first color.

[0040] In one example of this implementation, when the weighted temperature value of the component is between the first global alarm threshold value and the second global alarm threshold value, the vertex of the protrusion is greater than the first global alarm threshold value and less than the second global alarm threshold value, and the color of the second surface of the area on the protrusion whose height is greater than the first global alarm threshold value gradually changes from the first color to the second color.

[0041] In one example of this implementation, when the weighted temperature value exceeds the second global alarm threshold, the vertex of the protrusion is greater than the second global alarm threshold, and the color of the third surface of the area on the protrusion whose height is greater than the second global alarm threshold gradually changes from the second color to the third color.

[0042] In an example of this implementation, the temperature threshold value of the component includes a first threshold value and a second threshold value; the first threshold value is smaller than the second threshold value.

[0043] In one example of this example, the temperature value determination module includes a first calculation unit and a second calculation unit; wherein,

[0044] a first calculating unit, configured to determine a first weight based on the temperature of the component and the first threshold when the temperature of the component is less than the second threshold, and use the product of the first weight and the first global alarm threshold as the weighted temperature value of the component;

[0045] The second calculation unit is used to determine a second weight based on the temperature of the component and the second threshold when the temperature of the component is greater than or equal to the second threshold, and use the product of the second weight and the second global alarm threshold as the weighted temperature value of the component.

[0046] In a possible implementation, the global alarm threshold value indicates a temperature alarm threshold of the target device.

[0047] In a third aspect, an embodiment of the present application provides a three-dimensional temperature generation system, which may include a terminal device and a target device, wherein the terminal device is configured to execute the method provided in the first aspect.

[0048] In a fourth aspect, embodiments of the present application provide a three-dimensional temperature generation system, which may include a management node and a target device. The management node is configured to execute the method provided in the first aspect and display the generated three-dimensional temperature model, or transmit the generated three-dimensional temperature model to a terminal device for display. Exemplarily, the target device is a server.

[0049] In a fifth aspect, an embodiment of the present application provides a three-dimensional temperature generating device, comprising: at least one memory for storing programs; and at least one processor for executing the programs stored in the memory. When the programs stored in the memory are executed, the processor is used to execute the method provided in the first aspect.

[0050] In a sixth aspect, an embodiment of the present application provides a three-dimensional temperature generating device, characterized in that the device runs computer program instructions to execute the method provided in the first aspect. Exemplarily, the device can be a chip or a processor.

[0051] In one example, the apparatus may include a processor, which may be coupled to a memory, read instructions from the memory, and execute the method provided in the first aspect according to the instructions. The memory may be integrated into a chip or processor, or may be independent of the chip or processor.

[0052] In a seventh aspect, an embodiment of the present application provides a computer storage medium, in which instructions are stored. When the instructions are executed on a computer, the computer executes the method provided in the first aspect.

[0053] In an eighth aspect, an embodiment of the present application provides a computer program product comprising instructions, which, when executed on a computer, enables the computer to execute the method provided in the first aspect.

[0054] In a ninth aspect, an embodiment of the present application provides a computing device, characterized by a processor and a memory; wherein,

[0055] The memory is used to store programs; the processor is used to execute the programs stored in the memory, and when the programs stored in the memory are executed, the method of the first aspect is executed. The computing device can be a terminal device or a server. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] FIG1 is a schematic diagram of a two-dimensional temperature map provided by the related art;

[0057] FIG2 is a schematic diagram of the architecture of a three-dimensional temperature cloud map generation system provided in an embodiment of the present application;

[0058] FIG3 is a schematic diagram illustrating a process of a method for generating a three-dimensional temperature cloud map according to an embodiment of the present application;

[0059] FIG4a is a schematic diagram of the side shape of a convex provided in an embodiment of the present application;

[0060] FIG4 b is a schematic diagram of a method for generating a protrusion according to an embodiment of the present application;

[0061] FIG4 c is a first schematic diagram of the color of the convex side surface under the three-dimensional temperature cloud map generation method provided in FIG3 ;

[0062] FIG4 d is a schematic diagram of the addition processing of multiple overlapping protrusions in the three-dimensional temperature cloud map generation method provided in FIG3 ;

[0063] FIG4e is a schematic diagram of a process for deleting multiple overlapping protrusions in the three-dimensional temperature cloud map generation method provided in FIG3;

[0064] FIG4 f is a second schematic diagram of the color of the convex side surface under the three-dimensional temperature cloud map generation method provided in FIG3 ;

[0065] FIG5 is a second flow chart of a method for generating a three-dimensional temperature cloud map according to an embodiment of the present application;

[0066] FIG6 a is a schematic diagram of the color of the side surface of a protrusion under the three-dimensional temperature cloud map generation method provided in FIG5 ;

[0067] FIG6 b is a schematic diagram of a process of deleting overlapping multiple protrusions in the three-dimensional temperature cloud map generation method provided in FIG5 ;

[0068] FIG7 is a schematic diagram of an application of a three-dimensional temperature cloud map generation method provided in the embodiment of FIG5 of the present application;

[0069] FIG8a is a schematic diagram of a login interface provided in an embodiment of the present application;

[0070] FIG8b is a schematic diagram of an interface for displaying a three-dimensional temperature cloud map provided in an embodiment of the present application;

[0071] FIG8c is a first schematic diagram of the interface after operating the anchor point in the three-dimensional temperature cloud map provided in FIG8b;

[0072] FIG8 d is a second schematic diagram of the interface after operating the anchor point in the three-dimensional temperature cloud map provided in FIG8 b ;

[0073] FIG8e is a schematic diagram of the interface after operating the temperature view in the three-dimensional temperature cloud map provided in FIG8b;

[0074] FIG9 is a structural example diagram of a three-dimensional temperature cloud map generating device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0075] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0076] In the description of the embodiments of the present application, words such as "exemplary," "for example," or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary," "for example," or "for example" in the embodiments of the present application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary," "for example," or "for example" is intended to present the relevant concepts in a concrete manner.

[0077] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, B exists alone, and A and B exist at the same time. In addition, unless otherwise specified, the term "plurality" means two or more. For example, "multiple systems" refers to two or more systems, and "multiple terminals" refers to two or more terminals.

[0078] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly identifying the technical features being referred to. Thus, features specified as "first" or "second" may explicitly or implicitly include one or more of such features. The terms "include," "comprising," "having," and their variations all mean "including but not limited to," unless otherwise specifically emphasized.

[0079] The following is an explanation of some of the terms used in this embodiment. It should be noted that these explanations are for the purpose of facilitating understanding by those skilled in the art and are not intended to limit the scope of protection claimed in this application.

[0080] A 3D model is a polygonal representation of an object, typically displayed on a computer or other video device. The displayed object can be real-world or imaginary. Anything that exists in the physical world can be represented by a 3D model.

[0081] 3D temperature model: represents the 3D temperature model.

[0082] Basic Input / Output System (BIOS): The BIOS contains the initialization routines that run when the computer is turned on. The BIOS is stored in a read-only memory (ROM) chip on the motherboard. The contents of this chip are programmed using specialized manufacturing equipment before the computer leaves the factory. Once installed, the BIOS is permanently fixed and generally does not require modification. The BIOS is the first software run by the CPU.

[0083] With the development of web technology, users have increasingly higher requirements for high-quality web content display. In some services that require Web3D presentation, such as displaying the working status of internal server components, it is particularly important to accurately display the temperature of each component to facilitate anomaly detection.

[0084] Currently, a two-dimensional temperature map can be created based on the temperature of server components and the server's global temperature threshold. When the temperature exceeds the threshold, an alarm color is displayed, creating a two-dimensional temperature map. This two-dimensional temperature map is shown in Figure 1. However, this solution has the potential to reduce the accuracy of component temperature alarms if a unified global temperature threshold is applied, as different server components may have varying temperatures. Furthermore, a two-dimensional temperature map cannot clearly identify the correspondence between a component's anchor point and its temperature.

[0085] Based on this, an embodiment of the present application proposes a method for generating a three-dimensional temperature cloud map.

[0086] The method obtains the temperature threshold value of one or more components in the target device. The temperature threshold value of the component can be manually set in advance or the temperature threshold value of the component configured by the manufacturer pre-stored in the target device. The embodiment of the present application is described by taking multiple components as an example. Subsequently, the temperature of each component in the target device can be obtained. For each component, a three-dimensional temperature cloud map of the target device can be constructed in a spatial rectangular coordinate system based on the operating temperature of the component, the temperature threshold value of the component, and the global alarm threshold value. In the specific construction, the height of the component protrusion is constructed based on at least the operating temperature and temperature threshold value of the component described above. The color of the protrusion is used to indicate whether an alarm is triggered. An alarm is triggered when the temperature of the component exceeds the temperature threshold value of the component. Correspondingly, the three-dimensional temperature cloud map includes protrusions in the target device for representing the operating temperature of several components. The protrusions have colors. For example, the three-dimensional temperature cloud map can include a curved surface, and the curved surface includes protrusions corresponding to each component in the target device. In summary, the three-dimensional temperature cloud map can show the temperature changes in different areas inside the target device and more clearly display the temperature distribution, thereby improving the accuracy of identifying whether a temperature alarm is triggered, thereby improving the accuracy of predicting temperature problems.

[0087] It should be noted that in the embodiment of the present application, when different protrusions overlap, the maximum value of the overlapping range is selected as the height, and no color superposition occurs, thereby ensuring that the color of the protrusion can accurately reflect whether an alarm is issued.

[0088] Subsequently, by displaying a three-dimensional temperature cloud map, users can view the temperature distribution, for example, the temperature of a certain anchor point, so that they can make more effective decisions.

[0089] In one example, the operating temperature of the component may be a real-time temperature, and correspondingly, the method provided in the embodiment of the present application can display the real-time temperature alarm status of the target device; in one example, the operating temperature of the component may be a historical temperature, and correspondingly, the method provided in the embodiment of the present application can display the historical temperature alarm status of the target device.

[0090] For example, the target device may be a device capable of monitoring the temperature of its internal components, such as a server. The following embodiments of the present application will describe in detail a method for generating a three-dimensional temperature cloud map provided by the server.

[0091] This is just a brief description of the method. For details about the method, please refer to the description below.

[0092] Next, the three-dimensional temperature cloud map generation system to which the three-dimensional temperature cloud map generation method provided in the embodiment of the present application may be applied is introduced. Figure 2 shows an example diagram of the architecture of a three-dimensional temperature model generation system provided in the embodiment of the present application. The embodiment of the present application provides a three-dimensional temperature cloud map generation method that can be applied to the system architecture diagram shown in Figure 2. As shown in Figure 2, the three-dimensional temperature model generation system includes a terminal device 210, servers 220, and 230. It should be understood that the number of terminal devices 210 and servers in Figure 2 is merely schematic. Depending on the implementation requirements, there can be any number of terminal devices 210 and servers. It should be noted that multiple servers can be located in the same computing device or in different computing devices, and the computing devices can be rack servers, high-density servers, blade servers, or whole cabinet servers.

[0093] Among them, the terminal device 210 can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers and portable wearable devices. Exemplary embodiments of the terminal devices involved in this solution include, but are not limited to, electronic devices equipped with iOS, Android, Windows, Harmony OS or other operating systems. The embodiment of this application does not specifically limit the type of electronic device. The terminal device 210 can be various electronic devices, which can be screen devices or screenless devices. Including but not limited to smart phones, tablet computers, smart speakers, smart TVs, PCs (Personal Computers), wearable devices, etc.

[0094] An embodiment of the present application provides a server 220.

[0095] Exemplarily, the server 220 may be a single-node server, such as a rack server. Exemplarily, as shown in FIG2 , the server 220 may include a power supply 121 and a motherboard 110 , wherein the power supply 121 is electrically connected to the motherboard 110 for supplying power to components on the motherboard 110 .

[0096] Exemplarily, the motherboard 110 includes a central processing unit (CPU) 111 , a memory slot 112 , a programmable logic device (PLD) 113 , a baseboard management controller (BMC) 114 , a PCIE slot 115 , a network card 122 , a hard disk 123 , and a fan 124 .

[0097] Among them, memory slot 112 is inserted into a volatile memory, such as a memory, which is used as an external cache. Exemplarily, the memory can be a random access memory (RAM). By way of example and not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0098] Among them, the PCIE slot 115 is suitable for expanding at least one of a GPU card, a network card, a video capture card, an HBA (Host Bus Adapter) card, a RAID (redundant arrays of independent disks) card, and an SSD (solid state disk or solid state drive), and can also support the expansion of various adapter cards.

[0099] The programmable logic device 113 may be a complex logic device (CPLD, a digital integrated circuit in which users construct logic functions according to their own needs) or a field programmable gate array (FPGA).

[0100] The hard disk 123 may be a hard disk drive (HDD) or a solid state drive (SSD). It should be understood that the hard disk 123 is merely an example of a non-volatile memory and does not constitute a specific limitation. In actual applications, a non-volatile memory may be selected based on actual circumstances.

[0101] It should be noted that FIG2 is merely an example of the server 220 and does not constitute a specific limitation. In actual applications, the server 220 may include more or fewer devices than those shown in FIG2 , such as a single-chip microcomputer (an integrated circuit chip, equivalent to a microcomputer), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, general-purpose processors, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0102] For example, server 220 may be a node in a multi-node server, where a node is the smallest computing unit. The multi-node server may be a blade server, a high-density server, or a rack-mount server. The multi-node server includes a server chassis and several nodes within the server chassis. The structure of a node can be seen in FIG2 , including the motherboard 110 and components disposed on the motherboard 110 , and may include more or fewer components than shown in FIG2 .

[0103] The server 220 includes multiple components, which may include CPU 111, a memory card inserted into the memory slot 112, a programmable logic device, PLD 113, BMC 114, a card inserted into the PCIE slot 115, a network card 122, a hard disk 123, a fan 124, etc. These are merely examples of components and do not constitute a specific limitation. The components can be determined in combination with the specific structure of the server 220.

[0104] Specifically, terminal device 210 can communicate with server 220 via network 1, and server 220 and server 230 can communicate with each other via network 2. Network 1 and network 2 can be wired networks and / or wireless networks. It is understood that network 1 and network 2 can use any known network communication protocol to achieve different communications, and the network communication protocol can be various wired and / or wireless communication protocols. Network 1 and network 2 can use any known network communication protocol to achieve different communications, and the network communication protocol can be various wired communication protocols.

[0105] Next, in conjunction with the aforementioned three-dimensional temperature model generation system, a method for generating a three-dimensional temperature cloud map provided by an embodiment of the present application is described in detail. In specific implementation, the present embodiment provides the following two feasible solutions for generating a three-dimensional temperature cloud map. This embodiment of the present application uses the example of obtaining the real-time temperature of components in server 230. This scenario is provided as an example only and does not constitute a specific limitation.

[0106] For the first feasible implementation method, this method obtains the temperature threshold value of one or more components in the target device. The temperature threshold value of the component can be manually set in advance or the temperature threshold value of the component configured by the manufacturer pre-stored in the target device; the embodiment of the present application is illustrated by taking multiple components as an example; subsequently, the real-time temperature of each of the multiple components in the target device can be obtained; for each component, the operating temperature of the component can be represented by a weighted temperature value; then, based on the weighted temperature value of the component and the temperature threshold value of the component, a three-dimensional temperature cloud map of the target device is constructed in a spatial rectangular coordinate system; during the specific construction, the height of the protrusion of the component is constructed based on the weighted temperature value of the component, and the color of the protrusion is used to indicate whether an alarm is issued, and whether an alarm is issued is determined by comparing the alarm threshold value of the component with the weighted temperature value; correspondingly, the three-dimensional temperature cloud map includes protrusions in the target device for representing the operating temperatures of several components, and the protrusions have colors. Exemplarily, the three-dimensional temperature cloud map can include a curved surface, and the curved surface includes a protrusion corresponding to each component in the target device. In summary, the three-dimensional temperature cloud map can show the temperature changes in different areas inside the target device and display the temperature distribution more clearly, thereby improving the accuracy of identifying whether the temperature is an alarm, and further improving the accuracy of predicting temperature problems.

[0107] FIG3 is a flow chart of a method for generating a three-dimensional temperature cloud map according to an embodiment of the present application. This embodiment can be applied to the system described in FIG2. As shown in FIG3, the method for generating a three-dimensional temperature cloud map according to an embodiment of the present application includes at least the following steps:

[0108] Step 301: The user sets configuration information in the terminal device 210. The configuration information includes a component distribution map of the server. The component distribution map includes the position of each component of the server in the component distribution map. The component distribution map can be used to indicate the position of each component of the server in the server.

[0109] Exemplarily, the component distribution map is constructed in a spatial rectangular coordinate system, and the position of each component in the component distribution map can be represented by the three-dimensional coordinates of each component.

[0110] Optionally, the configuration information may also include temperature threshold values ​​for multiple components, and the temperature threshold value of each component includes a first temperature threshold value and a second temperature threshold value, and the second temperature threshold value is greater than the first temperature threshold value; exemplarily, the second temperature threshold value is a serious alarm temperature threshold value of the component, and the first temperature threshold value is a minor alarm threshold value of the component.

[0111] Users can configure the temperature thresholds of multiple components based on actual conditions or historical experience.

[0112] It should be noted that the temperature thresholds for each of the multiple components are pre-set by the manufacturer and are generally configured in the BIOS. Accordingly, in a specific implementation, a user can control server 230 through terminal device 210 to report the temperature thresholds of each of the multiple components in server 230 to the terminal device. In a specific implementation, server 230 can access the configuration of each component in the BIOS, obtain the temperature thresholds of each of the multiple components in server 230, and report them to terminal device 210.

[0113] For example, the component distribution map may be a three-dimensional model with component locations marked.

[0114] In specific implementation, the user can access the configuration interface through the browser of the terminal device 210, upload the component distribution map in the configuration interface, mark the location of the components in the component distribution map, mark the location of the anchor point, and obtain the temperature threshold values ​​of more than 230 components of the server.

[0115] Step 302 : The terminal device 210 sends a temperature reporting request to the server 230 ; the temperature reporting request includes: requesting to obtain the real-time temperature of each component of the server 230 .

[0116] Step 303 : The server 230 sends the real-time temperature values ​​of the multiple components in the server 230 to the terminal device 210 .

[0117] Optionally, if the user does not configure the temperature threshold value of the component in the terminal device 210 in step 301, the temperature reporting request in step 302 may include: requesting to obtain the real-time temperature value of each component and the temperature threshold value of the component from the server 230.

[0118] In a specific implementation, the server 230 may include multiple sensors, different sensors are used to detect the temperature values ​​of different components in real time (for the sake of ease of description and distinction, they can be called real-time temperature values), and send the real-time temperature values ​​of different components to BMC114, and BMC114 sends the real-time temperature values ​​to the terminal device 210.

[0119] Step 304 : For each component, the terminal device 210 uses the real-time temperature value of the component as the weighted temperature value of the component.

[0120] Step 305 : The terminal device 210 constructs a three-dimensional temperature cloud map of the server 230 based on the component distribution map, the weighted temperature value of each component, and the temperature threshold value of each component.

[0121] In the embodiment of the present application, the three-dimensional temperature cloud map is composed of multiple points, each of which has a three-dimensional coordinate (x, y, z) in a rectangular coordinate system; wherein, in some feasible implementations, the (x, y) coordinates of a point correspond to the position of a component, the z coordinate represents the height of the point, and the z coordinate can also indicate the weighted temperature value of the corresponding component, and the weighted temperature value can indicate the magnitude of the real-time temperature of the component. For example, it can be the actual temperature of the component; in the embodiment of the present application, the higher the actual temperature of the corresponding component, the larger z; in order to enable the temperature cloud map to directly reflect the temperature changes of the internal components of the server 220, the corresponding point (x, y, z) above the position of the component and the multiple points around the point are connected to form a three-dimensional spatial structure with a certain shape, such as a bulge. Correspondingly, the bulges corresponding to all components of the server constitute a three-dimensional temperature cloud map; therefore, the bulge in the embodiment of the present application can be understood as a three-dimensional spatial structure formed by connecting multiple points corresponding to a component inside a server, such as a CPU and its surrounding area, in the three-dimensional temperature cloud map. In addition, in order to allow the three-dimensional temperature cloud map to intuitively reflect the temperature of the internal components of the server 220, each point can be rendered in a suitable color, so that the protrusion has a color, which can reflect whether the component is in alarm. For example, an alarm is issued when the real-time temperature value of the component exceeds the temperature alarm threshold of the component. Among them, the protrusion can be a vector map or a bitmap. The embodiment of the present application does not make specific restrictions on this, and the specific requirements can be determined in combination with actual needs. It should be noted that the surface is set above the component distribution map only as an example and does not constitute a specific limitation. In some possible cases, the surface can be set on the component distribution map.

[0122] It is worth noting that in the implementation of this application, considering that the temperature of a component generally decreases from the highest point (generally above the center point of the component) to the surrounding areas, the embodiment of this application uses a protrusion at or above the position of the component to more realistically reflect the temperature change of the component. In the implementation of this application, the position of the component can be the center point of the component (also known as the geometric center point of the component) or other positions. The embodiment of this application does not intend to limit the position of the component to the center point, but in the scenario where the position of the component is the center point, the position of the component or the vertex of the protrusion above the position and the center point of the component are perpendicular to the plane where the component is located.

[0123] Exemplarily, the three-dimensional temperature cloud map includes a curved surface, which is in the same spatial rectangular coordinate system as the component distribution map. The curved surface includes a protrusion arranged vertically above the component distribution map and corresponding to the position of each component for indicating the temperature information of the component in the server 230, and a curved surface connecting the protrusions corresponding to each component.

[0124] Furthermore, in some possible implementations, a three-dimensional temperature cloud map may include a component distribution map. In the spatial rectangular coordinate system where the component distribution map resides, a protrusion is provided vertically above the position of the component in the component distribution map. The component distribution map allows users to more clearly and intuitively understand the component distribution and the temperature differences between components, facilitating a more comprehensive understanding of temperature issues. The component distribution map is a three-dimensional map, and the heights of the components may vary. In the spatial rectangular coordinate system where the component distribution map resides, an initial plane may be formed above the components in the component distribution map. Then, on the initial plane, a protrusion may be constructed with the corresponding point at each component position, for example, with the point vertically above each component position as the center (the center of the protrusion opening), thereby generating a curved surface including multiple protrusions, which can more realistically reflect the actual temperature changes of the components.

[0125] It should be noted that the shapes of the protrusions on different components in the three-dimensional temperature cloud map can be the same, similar, or different. Generally, because the temperature of a component is evenly distributed across its surface, with the highest temperature at the center, the protrusions are centrally symmetrical. The shape of the protrusion's side surface can be flexibly designed based on actual needs. For example, the protrusion's side surface can be conical, rectangular, or semicircular. For example, the specific shape of the protrusion's side surface can be shown in Figure 4a. In actual applications, the shape of the component's protrusion's side surface can be determined based on the component's operating conditions. For example, if the component has a large surface area, the protrusion's side surface can be semicircular or conical; if the component has a small surface area, the protrusion's side surface can be rectangular. The shape of the protrusion's bottom opening is similar and can be circular, elliptical, rectangular, or diamond-shaped. The specific shape can be determined based on the actual size and shape of the component. For example, if the component has a square surface shape and a large surface area, the protrusion's bottom opening can be circular to cover the component. For another example, if the component has a rectangular surface shape with a large length-to-width difference, the protrusion's bottom opening can be elliptical to cover the component.

[0126] In one possible scenario, assuming that the position of the component indicates the position of the center point of the component (also called the geometric center point), the protrusion of the component has the following characteristic C: the protrusion of the component is composed of multiple points, and the protrusion includes multiple first points in the spatial rectangular coordinate system. The projections of the multiple first points on the plane where the component is located (such as the XY plane) form a straight line, and the projection distance (such as the Z coordinate) of the first point corresponding to the point on the straight line from the plane where the component is located gradually decreases as the distance from the point on the straight line to the center point of the component increases; wherein, the projection distance of the first point (the Z coordinate of the first point) is positively correlated with the weighted temperature value of the component, which can be understood as follows: the larger the weighted temperature value, the larger the projection distance of the first point; in addition, for each first point, the protrusion has multiple second points with the same projection distance as the first point on the plane where the component is located, and each second point has the same projection distance from the plane where the component is located in the spatial rectangular coordinate system. Regarding the protrusion feature C described in this case, the bottom opening of the protrusion can be circular as shown in FIG4a (it can also be designed to be an ellipse, rectangle, or diamond shape according to actual needs), and the side shape of the protrusion can be any of the shapes illustrated in FIG4a. It should be noted that the shapes described in FIG4a are merely examples and do not constitute specific limitations.

[0127] The following is an example of how to generate the bulge of feature C. Assuming that the shape of the bottom opening of the bulge can be a circle as shown in Figure 4a, as shown in Figure 4b, in the same spatial rectangular coordinate system of the component distribution map, assuming that the component distribution map is located in the negative direction of the Z axis, the weighted temperature value is used as the height h2 of the bulge vertex C, and the radius constant r (pre-set value) is determined. With point A at h1 vertically above the center point B of the component as the center point and r as the radius, a circle is formed on the XY plane as the opening of the bulge. Each point between point A and point C is the center point of the circle. The circle faces the center A and is perpendicular to AC, so that its radius continuously decreases until it reaches 0, forming multiple continuous circles parallel to the opening of the bulge. The vertical coordinates of the points on each circle are the same, and the vertical coordinates of the points on the multiple continuous circles in the direction from point A to point C gradually increase until they increase to h2, from The method shown in FIG4a is merely an example and does not constitute a specific limitation. In another feasible method, from point C toward point A, and each point between point A and point C is the center point of a circle, the radius of the circle increases continuously to r in the direction close to the center A to form multiple parallel continuous circles. Subsequently, the protrusions above all components in the server 230 are connected to form the aforementioned curved surface. For any point on the protrusion opening and the point A on the straight line formed, for example, in FIG4b, the vertical coordinate of the point on the line AD (for example, point E) corresponding to the point on the protrusion (for example, point F) decreases as the distance from the point on the line AD to point A increases. The point on the line AD corresponding to the point on the protrusion is located vertically above any point on the line AD and on the surface of the protrusion. In this way, a protrusion with characteristic C can be formed. It should be noted that there are many shapes of the side surface of the protrusion. Therefore, there are many ways to form the protrusion in the spatial rectangular coordinate system of the component. The side shape of the protrusion shown in FIG4a is merely an example and does not constitute a specific limitation.

[0128] In summary, in an embodiment of the present application, a three-dimensional temperature cloud map may include a component distribution map of a server, a projection generated above the component distribution map to indicate component temperature, and a curved surface connecting each projection; the projection has a color that can indicate whether an alarm is issued; specifically, for each component, when the weighted temperature value of the component exceeds the component's temperature threshold, the color of the projection indicates an alarm. The direction of the projection is the direction away from the component's position; the height of the vertex of the projection is determined by the weighted temperature value of the corresponding component, generally the weighted temperature value; specifically, the weighted temperature value can be used to indicate the actual temperature of the component, and the height of the projection can indicate the magnitude of the actual temperature of the component. For example, the higher the height of the projection, the greater the actual temperature of the component; the color of the outer surface of the projection can be used to indicate whether the real-time operating temperature of the component exceeds the component's temperature threshold, providing a warning message to the user. For example, when the color of the projection is yellow, it indicates a minor alarm, and when the color of the projection is red, it indicates a serious alarm.

[0129] In some possible implementations, the temperature threshold value of a component may include one or more threshold values.

[0130] In one example, assuming a component has only one temperature threshold, for each protrusion at the component's location, the first surface color of the area on the protrusion below the component's temperature threshold is the first color; the second surface color of the area on the protrusion above the component's temperature threshold is a gradient from the first color to the second color. The first color and the second color are different, for example, the first color can be green, and the second color can be yellow or red.

[0131] Specifically, assuming that the weighted temperature value of the component is lower than the temperature threshold value of the component, the color of the protrusion is the first color; assuming that the weighted temperature value of the component is greater than the temperature threshold value of the component, the color of the first surface of the area on the protrusion whose height is lower than the temperature threshold value of the component is the first color; the color of the second surface of the area on the protrusion whose height is greater than the temperature threshold value of the component is the first color gradually changing to the second color.

[0132] The following examples illustrate the color of bumps. As shown in Figure 4c, for component 1, if the weighted temperature value of component 1 is greater than the temperature threshold value of component 1, the vertex height of bump 1 is greater than the temperature threshold value of component 1, the first surface color of the area on bump 1 where the height is below the temperature threshold value of component 1 is green, and the second surface color of the area on bump 1 where the height is above the temperature threshold value of component 1 gradually changes from green to yellow. For component 2, if the weighted temperature value of component 2 is less than the temperature threshold value of component 2, the vertex height of bump 2 is less than the temperature threshold value of component 2, and bump 2 is green. It should be noted that the height of a protrusion can be used to describe the distance between a point on the protrusion and the plane of the component distribution diagram. For example, in the spatial rectangular coordinate system of the component distribution diagram, if the plane of the component distribution diagram is in the XY plane, the height of the protrusion can be expressed by the Z-axis coordinate of the spatial rectangular coordinate system. If the plane of the component distribution diagram is in the XZ plane, the height of the protrusion can be expressed by the Y-axis coordinate of the spatial rectangular coordinate system. If the plane of the component distribution diagram is in the YZ plane, the height of the protrusion can be expressed by the Z-axis coordinate of the spatial rectangular coordinate system. In other words, the line connecting the vertex of the protrusion and the center point of its opening is perpendicular to the plane of the component distribution diagram.

[0133] In one example, assuming that a component can have multiple, for example, two, temperature threshold values, which can be referred to as the first threshold value and the second threshold value for ease of description and distinction, with the first threshold value being less than the second threshold value. If the weighted temperature value is used as the vertex height of the protrusion, then for the protrusion at each component location, the color of the first surface of the area on the protrusion where the height is less than the first temperature threshold value of the component is the first color; the color of the second surface of the area on the protrusion where the height is greater than the first temperature threshold value of the component but less than the second temperature threshold value is the first color gradually changing to the second color; the color of the third surface of the area on the protrusion where the height is greater than the second temperature threshold value is the second color gradually changing to the third color. The first color, the second color, and the third color are different. For example, the first color can be green, the second color can be yellow, and the third color can be red.

[0134] Specifically, assuming that the weighted temperature value of the component is lower than the first temperature threshold value of the component, the color of the entire surface of the protrusion is the first color; assuming that the weighted temperature value of the component is greater than the first temperature threshold value of the component and less than the second temperature threshold value, the color of the first surface of the area on the protrusion whose height is lower than the first temperature threshold value of the component is the first color, and the color of the second surface of the area on the protrusion whose height is greater than the first temperature threshold value of the component is the first color gradually changing to the second color; assuming that the weighted temperature value of the component exceeds the second temperature threshold value of the component, the color of the first surface of the area on the protrusion whose height is lower than the first temperature threshold value of the component is the first color, and the color of the second surface of the area on the protrusion whose height is between the first temperature threshold value and the second temperature threshold value is the first color gradually changing to the second color; the color of the third surface of the area on the protrusion whose height exceeds the second temperature threshold value of the component is the second color gradually changing to the third color.

[0135] The following is an example of the color of the protrusion. Assuming that the first threshold value of component 1 is B11 and the second threshold value is B12, and the first threshold value of component 2 is B21 and the second threshold value is B22; then as shown in Figure 4f, for component 1, the weighted temperature value of component 1 is greater than the second threshold value B12 of component 1, then the vertex height of protrusion 1 is greater than the second threshold value B12 of component 1, and the color of the first surface of the area on protrusion 1 whose height is lower than the first threshold value B11 of component 1 is the first color, and the color of the second surface of the area on protrusion 1 whose height is higher than the first threshold value B11 of component 1 and lower than the second threshold value B12 of component 1 gradually changes from the first color to the second color, and the area on protrusion 1 whose height exceeds The color of the third surface of the area corresponding to the second threshold value B12 of component 1 gradually changes from the second color to the third color; for component 2, the weighted temperature value of component 2 is greater than the first threshold value B21 of component 2 and lower than the second threshold value B22 of component 2, then the vertex height of protrusion 2 is greater than the first threshold value B21 of component 2 and lower than the first threshold value B22 of component 2, then the color of the first surface of the area on protrusion 2 whose height is lower than the first threshold value B21 of component 2 is the first color, and the color of the second surface of the area on protrusion 2 whose height is higher than the first threshold value B21 of component 2 and lower than the second threshold value B22 of component 2 gradually changes from the first color to the second color.

[0136] In addition, it should be noted that in the embodiment of the present application, when the protrusions of different components overlap, the point with the largest height is retained, which can be specifically understood as retaining the point with the largest projection distance from the plane where the component is located, or deleting the area of ​​the overlapping part, so as to ensure that the color of the protrusion can accurately reflect whether an alarm is issued.

[0137] It should be noted that in some possible implementations, when multiple protrusions overlap, in related art, the weighted temperature values ​​of the components in the overlapping range are directly added. As shown in Figure 4d, protrusion 3 of component 3 and protrusion 4 of component 4 overlap. The weighted temperature values ​​of components 3 and 4 at the same position in the overlapping range are added to obtain the addition result. As shown in Figure 4d, it can be seen that for some points in the overlapping range of components 3 and 4, before the addition process, these points did not exceed the temperature threshold value of component 3 and no alarm was issued. However, after adding the weighted temperature value of component 4, some areas exceeded the temperature threshold value of component 3 and issued an alarm. In actual scenarios, the superposition effect of temperature does not cause excessive temperature changes. After adding the weighted temperature values ​​of the points in the overlapping range, it may cause the color of the protrusion to be unable to reflect whether an alarm is issued. Therefore, the embodiment of the present application retains the point with the largest distance from the plane where the component distribution map is located (such as the XY plane) within the overlapping range, which can also be understood as deleting the points in the overlapping range.

[0138] For example, in a scenario where there is only one component temperature threshold value, as shown in Figure 4e, the bumps of components 3 and 4 overlap. In this case, the point within the overlapping range with the greatest distance from the component distribution plane is retained, and the points within the overlapping range are deleted. The same process is applied in scenarios where there are multiple component temperature threshold values.

[0139] Furthermore, in some possible implementations, the three-dimensional temperature cloud map may include anchor points set on or around components. The anchor points are configured to display relevant information of the anchor points, such as temperature, temperature threshold values ​​of components (each component to which the plotted point is close), and other information under user operation, so as to facilitate users to view and understand the temperature conditions. In addition, the anchor points can also be configured so that when the temperature of the anchor points exceeds the temperature alarm threshold of the component, the anchor points are set to enter an alarm state. The alarm state can be flashing, highlighted, etc., and the specific design can be based on actual needs. In some possible cases, the anchor points can be set in advance by the user, or they can be any point on the aforementioned surface.

[0140] In this solution, a weighted temperature value is derived from the component's temperature. The height of the component's protrusion is then constructed using this weighted temperature value. The color of the protrusion is determined by comparing the weighted temperature value with the component's temperature threshold, thereby constructing a three-dimensional temperature cloud map. This resulting three-dimensional temperature cloud map can depict temperature variations within different areas of the target device, more clearly displaying temperature distribution. This improves the accuracy of identifying temperature alarms and, in turn, predicting temperature issues. Furthermore, the component distribution map serves as the base, and the protrusions constructed above the component positions in the map can demonstrate the component and temperature distribution within the device.

[0141] It is worth noting that the generation of the three-dimensional temperature cloud map by terminal device 210 is merely an example. In some possible scenarios, where the three-dimensional temperature cloud map requires a significant computational overhead, server 220 may include a management node, which may execute steps 302 to 305. Subsequently, the management node transmits the three-dimensional temperature cloud map to terminal device 220, and terminal device 210 only needs to render the three-dimensional temperature cloud map. This can, to a certain extent, reduce the computational overhead of terminal device 220 and improve the user experience. When using a management node, in step 301, the user can configure information on the management node through terminal device 210. The configuration information includes a component distribution map of server 220 and temperature threshold values ​​for each of the multiple components.

[0142] For the second feasible implementation method, this method obtains the temperature threshold value of one or more components in the target device. The temperature threshold value of the component can be manually set in advance, or it can be the temperature threshold value of the component configured by the manufacturer and pre-stored in the target device; the embodiment of the present application is explained by taking multiple components as an example; subsequently, the real-time temperature of the target device can be obtained; for each component, the real-time temperature of the component and the temperature threshold value of the component are integrated through the global alarm threshold value to obtain a weighted temperature value. The weighted temperature value is used to illustrate the weight relative to the global alarm threshold value determined by the temperature of the component and the temperature threshold value of the component. The weighted temperature value can be This indirectly indicates the actual temperature of the component relative to the global alarm threshold value; then, a three-dimensional temperature cloud map of the target device is constructed based on the weighted temperature value of the component and the global alarm threshold value; during the specific construction, the height of the component's protrusion is constructed based on the weighted temperature value of the component, and the color of the protrusion is used to indicate whether an alarm is issued. An alarm is issued when the weighted temperature value of the component exceeds the global alarm threshold value. It should be noted that the weighted temperature value of the component exceeding the global alarm threshold value can indicate that the actual temperature value of the component exceeds the temperature alarm threshold of the component; correspondingly, the three-dimensional temperature cloud map includes protrusions in the target device that are used to characterize the operating temperatures of several components, and the protrusions have colors. In summary, the three-dimensional temperature cloud map can show the temperature changes in different areas inside the target device and more clearly display the temperature distribution, thereby improving the accuracy of identifying whether the temperature is an alarm, and further improving the accuracy of predicting temperature problems.

[0143] FIG5 is a flow chart of a method for generating a three-dimensional temperature cloud map according to an embodiment of the present application. This embodiment can be applied to the system described in FIG2. As shown in FIG5, the method for generating a three-dimensional temperature cloud map according to an embodiment of the present application includes at least the following steps:

[0144] Step 501: The user sets configuration information in the terminal device 210. The configuration information includes a component distribution map of the server and a global alarm threshold value. The component distribution map includes the position of each component of the server in the component distribution map. The component distribution map can be used to indicate the position of each component of the server in the server.

[0145] The global alarm threshold may include a global minor alarm threshold and a global major alarm threshold, which are respectively used to indicate temperature alarms of different degrees.

[0146] For details, see step 301. In a specific implementation, the user can access the configuration interface through the browser of the terminal device 210, upload the component distribution map, mark the location of the components in the component distribution map, and enter the global alarm threshold value in the configuration interface; illustratively, the component distribution map can be a three-dimensional model or a two-dimensional map.

[0147] Optionally, the user may configure temperature thresholds for various components of the server 220 .

[0148] Step 502 : The terminal device 210 sends a temperature reporting request to the server 220 . The temperature reporting request includes: requesting to obtain the real-time temperature of each component of the server 230 .

[0149] Step 503 : The server 220 sends the real-time temperature values ​​of the multiple components in the server 230 to the terminal device 210 .

[0150] Optionally, if the user does not configure the temperature threshold value of the component in the terminal device 210 in step 501, the temperature reporting request in step 502 may include: requesting to obtain the real-time temperature value of each component and the temperature threshold value of the component from the server 230.

[0151] In a specific implementation, the server 230 may include multiple sensors, different sensors are used to detect the real-time temperature values ​​of different components in real time, and send the real-time temperature values ​​of different components to the BMC114, which then sends the real-time temperature values ​​to the terminal device 210.

[0152] Step 504 : The terminal device 210 determines a weighted temperature value of each component based on the global alarm threshold value, the real-time temperature value of the component, and the temperature threshold value of the component.

[0153] In a specific implementation, a component's weighted temperature value indicates a weight relative to the global alarm threshold value, determined by the component's temperature and its temperature threshold value. For example, the weighted temperature value can be the result of dividing the component's temperature value by its temperature threshold value (referred to as the weight value), multiplied by the global alarm threshold value.

[0154] In some possible implementations, the global alarm threshold value may include one or more threshold values; the component temperature threshold value may include one or more threshold values, and the number of component temperature threshold values ​​is consistent with the number of global alarm threshold values.

[0155] The embodiment of the present application is described by taking the example of two global alarm threshold values. For the convenience of description and distinction, they can be referred to as the first global alarm threshold value A1 and the second global alarm threshold value A2; correspondingly, the temperature threshold value of the component can include two threshold values, as mentioned above, which can be referred to as the first threshold value B1 and the second threshold value B2; the first threshold value B1 is smaller than the second threshold value B2; the first global alarm threshold value A1 can be the global minor alarm threshold value, and the second global alarm threshold value A2 can be the global serious alarm threshold value; the first threshold value B1 can be the minor alarm threshold value of the component, and the second threshold value B2 can be the serious alarm threshold value of the component.

[0156] In a specific implementation, for each component, if the real-time temperature of the component does not exceed the second threshold value B2, the weighted temperature value is calculated using the following formula (1).

[0157] Where y represents the weighted temperature value of the component; T represents the real-time temperature of the component. The result can also be called the first weight.

[0158] For each component, when the temperature of the component exceeds the second threshold value B2, the weighted temperature value is calculated using the following formula (2).

[0159] in, The result can also be called the second weight.

[0160] Step 505 : The server 220 constructs a three-dimensional temperature cloud map of the server 220 based on the component distribution map, the global alarm threshold value, and the weighted temperature value of each component.

[0161] For details about the three-dimensional temperature cloud map, please refer to the description of component 305. The difference is that the actual temperature of each component is unified by the global alarm temperature threshold.

[0162] When the weighted temperature value of a component exceeds the global alarm temperature threshold value, an alarm is issued. Correspondingly, the raised color of the position of the component in the three-dimensional temperature cloud map is used to indicate whether an alarm is issued. It should be noted that when the weighted temperature value of a component exceeds the global alarm threshold value, it can be explained that the actual temperature value of the component exceeds the temperature alarm threshold value of the component. For example, when the weighted temperature value of a component exceeds the global minor alarm threshold value, it can be explained that the actual temperature value of the component exceeds the minor alarm threshold value of the component. When the weighted temperature of a component exceeds the global major alarm threshold value, it can be explained that the actual temperature of the component exceeds the major alarm threshold value of the component. The actual temperature can be the real-time operating temperature of the component.

[0163] It should be noted that the height of the protrusion can indicate the distance between a point on the protrusion and the plane where the component distribution diagram is located. For details, please refer to the description in part c of FIG. 4 .

[0164] Continuing with the description using the example that the global alarm threshold value includes the first global alarm threshold value A1 and the second global alarm threshold value A2, in an embodiment of the present application, for each component of the multiple components in the server 220, when the weighted temperature value of the component is lower than the first global alarm threshold value A1, the vertex height of the protrusion corresponding to the component is less than the first global alarm threshold value A1, and the entire surface color of the protrusion is the first color; when the weighted temperature value of the component is greater than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2, the vertex height of the protrusion corresponding to the component is greater than the first global alarm threshold value A1 and less than the second global alarm threshold value A2, the surface color of the area on the protrusion where the height is lower than the first global alarm threshold value is the first color, and the area on the protrusion where the height is lower than the second global alarm threshold value A2 and greater than the first global alarm threshold value A2 is greater than the first global alarm threshold value A1. The surface color of an area with a global alarm threshold value A1 gradually changes from a first color to a second color; when the weighted temperature value of the component is greater than the second global alarm threshold value A2, the surface color of the area whose vertex height of the protrusion corresponding to the component is greater than the second global alarm threshold value A2, and whose height on the protrusion is lower than the first global alarm threshold value A1, is the first color; the color of the area whose height on the protrusion is greater than the first global alarm threshold value A1 and less than the second global alarm threshold value A2 gradually changes from the first color to the second color, and the color of the area whose height on the protrusion is greater than the second global alarm threshold value A2 gradually changes from the second color to the third color; wherein, the first color, the second color, and the third color are different; the color gradient is only used as an example, mainly to meet the user's visual needs, and in some possible cases, it can also be set to a solid color. For example, the first color can be green, the second color can be yellow, and the third color can be red.

[0165] The following is an example of the color of the protrusion. As shown in Figure 6a, for component 1, the weighted temperature value of component 1 is greater than the second global alarm threshold value A2, then the vertex height of protrusion 1 is greater than the second global alarm threshold value A2, the color of the first surface of the area on protrusion 1 whose height is lower than the first global alarm threshold value A1 is the first color, the color of the second surface of the area on protrusion 1 whose height is higher than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2 gradually changes from the first color to the second color, and the color of the third surface of the area on protrusion 1 corresponding to the height exceeding the second global alarm threshold value A2 is Gradually changes from the second color to the third color; for component 2, the weighted temperature value of component 2 is greater than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2, then the vertex height of protrusion 2 is greater than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2, and the color of the first surface of the area on protrusion 2 whose height is lower than the first global alarm threshold value A1 is the first color, and the color of the second surface of the area on protrusion 2 whose height is higher than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2 gradually changes from the first color to the second color.

[0166] It should be noted that when the protrusions of different components overlap, the point with the largest height is retained. Specifically, it can be understood as retaining the point on the protrusion with the largest distance from the plane where the component distribution map is located, or deleting the overlapping area to ensure that the color of the protrusion can accurately reflect whether an alarm is issued.

[0167] For example, the description continues with the example of the global alarm threshold value including the first global alarm threshold value A1 and the second global alarm threshold value A2. As shown in FIG6b , there is overlap between the protrusions of component 3 and component 4. At this time, it is sufficient to retain the point with the largest projection distance from the component within the overlapping range.

[0168] In this solution, the component's temperature and its temperature threshold are analyzed relative to the alarm threshold to obtain a weighted temperature value. This weighted temperature value is then used to construct a corresponding bump for the component. The color of the bump is determined by comparing the weighted temperature value with the global alarm threshold, thereby constructing a three-dimensional temperature cloud map. This resulting three-dimensional temperature cloud map can demonstrate temperature variations in different areas within the target device, more clearly displaying the temperature distribution. This improves the accuracy of identifying temperature alarms and, in turn, the accuracy of predicting temperature issues. Furthermore, the component distribution map serves as the base, and bumps constructed from corresponding points above the component positions in the component distribution map can demonstrate the component distribution and temperature distribution within the device.

[0169] Based on the three-dimensional temperature cloud map generation method provided above, a specific application of the three-dimensional temperature cloud map generation method described in FIG. 7 is described.

[0170] The temperature layer is drawn using the method described in Figures 6a and 6b. Assuming that the first color is green, the second color is yellow, and the third color is red, the first global alarm temperature threshold A1 is the global minor alarm threshold, the second global alarm temperature threshold A2 is the global major alarm threshold, the first threshold value of the component is the minor alarm threshold, and the second threshold value of the component is the major alarm threshold; as shown in Figure 7, the process of drawing the three-dimensional temperature model by the housekeeper node 220 is as follows:

[0171] 1. Based on the length and width of the server distribution diagram, draw an initial plane at h1 vertically above the component distribution diagram to form an initial plane that does not reflect temperature changes;

[0172] 2. Obtain the server's component list, global minor alarm threshold, global major alarm threshold, and the minor alarm threshold and major alarm threshold for each component in the component list;

[0173] 3. Traverse the parts list;

[0174] 4. Determine whether the current component temperature is greater than or equal to the component's critical alarm threshold. If so, go to step 6. If not, go to step 5.

[0175] 5. Weighted temperature value of a component = current temperature of the component * global minor alarm threshold / minor alarm threshold of the component;

[0176] 6. Weighted temperature value of component = current temperature of component * global severe alarm threshold / severe alarm threshold of component;

[0177] 7. Based on the weighted temperature value of the component, determine the initial center point on the initial plane (for example, point A in Figure 4b) corresponding to the point h1 vertically above the geometric center point of each component on the initial plane, and the vertex of the protrusion corresponding to the initial center point (for example, point C in Figure 4b); wherein, in the spatial rectangular coordinate system where the component distribution diagram is located, if the plane where the component distribution diagram is located is set in the XY plane, then the XY coordinates of the vertex of the protrusion are the same as the XY coordinates of the initial center point, and the vertical coordinate Z of the vertex of the protrusion is the weighted temperature value of the corresponding component.

[0178] 8. Traverse the component list to determine the vertex coordinates (X, Y, Z) of the protrusion corresponding to each component on the initial plane;

[0179] 9. Is the distance between the point on the initial plane and the nearest initial center point ≤ the radius constant r? If so, proceed to step 10; if not, it means that the point on the initial plane is outside the raised area, and these areas are drawn in a non-alarm color.

[0180] 10. Set the Z-axis coordinate (height) of a point on the initial plane, gradually decreasing as the distance from the point to the initial center point of the component increases, to form a protrusion on the initial plane. The protrusion extends in a direction away from the component distribution map, thereby generating a curved surface including multiple protrusions. The Z-axis coordinate (height) of each point on the protrusion at the same distance from the protrusion axis is the same, where the protrusion axis is the line connecting the protrusion vertex and the initial center point. Execute 11.

[0181] 11. If the weighted temperature value is greater than or equal to the global minor alarm threshold, go to 12. If not, go to 13.

[0182] 12. Draw a gradient from green to yellow on the surface of the area where the height of the bump is greater than the global minor alarm threshold and less than the global severe alarm threshold. Go to 14.

[0183] 13. Paint the entire raised area green, and you're done;

[0184] 14. If the weighted temperature value is greater than or equal to the global severe alarm threshold, proceed to 15. If not, exit.

[0185] 15. The surface of the area where the height of the protrusion exceeds the global severe alarm threshold is drawn with a gradient from yellow to red.

[0186] Correspondingly, the user can display the constructed three-dimensional temperature cloud map on the terminal device 210 and perform operations.

[0187] As shown in Figure 8a, the terminal device 210 can display a login page in the browser web page. The user operates the login interface, enters the account number and password, and clicks the login button to enter the 3D temperature map interface as shown in Figure 8b. The interface includes a server component distribution map 211, components 212, anchor points 213, a temperature view (temperature cloud map) 214, and a temperature view button 215; wherein, the temperature view (temperature cloud map) 214 is set above the server component distribution map 211.

[0188] Next, as shown in FIG8c , the user clicks on anchor point 2131 to view relevant information about the anchor point 2131. The 3D temperature graph interface displays display page 216, which displays the anchor point's temperature, the severe alarm temperature value, the minor alarm temperature value, and the color. As shown in FIG8d , the user clicks on anchor point 2132 to view relevant information about the anchor point 2132. The 3D temperature graph interface displays display page 216, which displays the anchor point's temperature, the severe alarm temperature value, the minor alarm temperature value, and the color.

[0189] Subsequently, if the user wants to view the component distribution of the server, as shown in FIG8e , the user can click the icon 215 of the temperature view, and thus the temperature view 215 is no longer displayed.

[0190] Based on the same concept as the embodiment of the method of the present application, the embodiment of the present application also provides a three-dimensional temperature cloud map generation device. The three-dimensional temperature cloud map generation device includes several modules, each of which is used to perform each step in the three-dimensional temperature cloud map generation method provided in the embodiment of the present application. The division of the modules is not limited here. Those skilled in the art will clearly understand that in actual applications, the various steps in the three-dimensional temperature cloud map generation method provided in the embodiment of the present application can be assigned to different modules as needed, that is, the internal structure of the device can be divided into different modules to complete all or part of the functions described above. The modules in the embodiment can be integrated into a processing unit, or each unit can exist physically separately, or two or more modules can be integrated into a unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the modules are only for the convenience of distinguishing each other and are not used to limit the scope of protection of this application. The specific working process of the modules in the above-mentioned device can refer to the corresponding process in the aforementioned method embodiment and will not be repeated here.

[0191] For example, a three-dimensional temperature cloud map generating device is used to execute the three-dimensional temperature cloud map generating method provided in an embodiment of the present application. FIG9 is a schematic structural diagram of the three-dimensional temperature cloud map generating device provided in an embodiment of the present application. As shown in FIG9, the three-dimensional temperature cloud map generating device provided in an embodiment of the present application includes:

[0192] The temperature value determination module 901 is configured to determine a weighted temperature value for each component in the target device based on the temperature of the component, the temperature threshold of the component, and the global alarm threshold; the weighted temperature value is used to indicate the temperature of the component;

[0193] The cloud map construction module 902 is used to generate a three-dimensional temperature cloud map of the target device in a spatial rectangular coordinate system based on the weighted temperature value and the global alarm temperature threshold value. The three-dimensional temperature cloud map includes a component distribution map and a curved surface located above the component distribution map. The curved surface includes a corresponding protrusion above each component; the protrusion extends in a direction away from the component distribution map (or component), and the protrusion has a vertex; the height of the protrusion vertex is determined by the weighted temperature value of the corresponding component; the color of the protrusion is used to indicate whether the weighted temperature value of the component exceeds the global alarm threshold value.

[0194] Based on the same concept as the embodiment of the method of the present application, the embodiment of the present application further provides an electronic device. The electronic device can be a server 220, 230 or a terminal device 210. The structure of the electronic device can be referred to as 220 in FIG. 2 . In addition, when the electronic device is a terminal device 210, it can also include more components than 220 in FIG. 2 , such as a display screen, a microphone, a speaker, a virtual keyboard, a camera, etc.

[0195] In a specific application, the hard disk 123 can store computer programs. When the electronic device is running, the CPU 111 can read the computer programs stored in the hard disk 123 into the memory, and read the computer programs from the memory to implement the steps in the above-mentioned three-dimensional temperature cloud map generation method, such as steps 301 to 305 in Figure 3 and steps 501 to 505 in Figure 5.

[0196] For example, a computer program may be divided into one or more modules / units, each of which may be a series of computer program instruction segments capable of performing specific functions. The one or more modules / units are stored in hard disk 123 and executed by CPU 111 to perform the present application. For example, the computer program may be divided into a temperature value determination module 901 and a cloud map construction module 902. The specific functions of each module are described above.

[0197] In addition to the above-mentioned methods, devices and electronic devices, embodiments of the present application may also provide a computer program product, which includes computer program instructions, which, when executed by a processor, cause the processor to execute the steps of the three-dimensional temperature cloud map generation method of various embodiments of the present application described in the "Method" section above. The computer program product can be written in any combination of one or more programming languages ​​to write computer program code for performing the operations of the embodiments of the present application, and the programming language includes an object-oriented programming language such as Java, C++, etc., and also includes a conventional procedural programming language such as "C" language or a similar programming language. The computer program code can be in source code form, object code form, executable file or some intermediate form, etc. The computer program code can be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0198] In addition, an embodiment of the present application may also provide a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, causes the processor to execute the steps of the method for generating a three-dimensional temperature cloud map according to various embodiments of the present disclosure described in the "Method" section above. The computer-readable storage medium may adopt any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may, for example, include but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. It should be noted that the content contained in the computer-readable medium may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0199] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0200] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0201] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of the present disclosure. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit the present disclosure to necessarily being implemented using the above specific details.

[0202] The block diagrams of the devices, devices, equipment, and systems involved in this disclosure are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0203] It should also be noted that in the apparatus, device, and method of the present disclosure, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present disclosure.

[0204] The above description has been provided for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0205] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

Claims

1. A method for generating a three-dimensional temperature cloud map, characterized in that: include: For each component in the target device, determining a weighted temperature value based on the temperature of the component, the temperature threshold of the component and the global alarm threshold; The weighted temperature value is used to indicate the temperature of the component; Based on the weighted temperature value and the global alarm threshold value, generating a three-dimensional temperature cloud map of the target device in a spatial rectangular coordinate system, wherein the three-dimensional temperature cloud map includes a curved surface, and the curved surface includes protrusions corresponding to components of the target device; The protrusion has a vertex, and the height of the vertex is determined by the weighted temperature value of the corresponding component; the color of the protrusion is used to indicate whether the weighted temperature value of the component exceeds the global alarm threshold value.

2. The method according to claim 1, characterized in that The three-dimensional temperature cloud map also includes a component distribution map of the target device, wherein the component distribution map and the curved surface are arranged in the same spatial rectangular coordinate system, and the curved surface is located above the component distribution map, and the protrusion is generated at a corresponding position above the component in the component distribution map.

3. The method according to claim 1, characterized in that There are multiple protrusions. When different protrusions overlap, the protrusion with the largest height in the spatial rectangular coordinate system is retained.

4. The method according to claim 1, characterized in that The three-dimensional temperature cloud map includes an anchor point; The anchor point is configured to display the temperature of the anchor point under the condition of user operation; and / or the anchor point is configured to enter an alarm state when the temperature of the anchor point exceeds a temperature threshold value of a component in an area where the anchor point is located.

5. The method according to any one of claims 1 to 4, characterized in that: The global alarm threshold value includes a first global alarm threshold value and a second global alarm threshold value, and the first global alarm threshold value is smaller than the second global alarm threshold value.

6. The method according to claim 4, characterized in that When the weighted temperature value of the component is lower than the first global alarm threshold value, the vertex of the protrusion is lower than the first global alarm threshold value, and the color of the first surface of the protrusion is the first color; When the weighted temperature value of the component is between the first global alarm threshold value and the second global alarm threshold value, the vertex of the protrusion is greater than the first global alarm threshold value and less than the second global alarm threshold value, and the color of the second surface of the area on the protrusion whose height is greater than the first global alarm threshold value gradually changes from the first color to the second color; When the weighted temperature value exceeds the second global alarm threshold, the vertex of the protrusion is greater than the second global alarm threshold, and the color of the third surface of the area on the protrusion whose height is greater than the second global alarm threshold gradually changes from the second color to the third color.

7. The method according to claim 4, characterized in that The temperature threshold value of the component includes a first threshold value and a second threshold value; the first threshold value is smaller than the second threshold value.

8. The method according to claim 7, characterized in that The step of determining a weighted temperature value based on the temperature of the component, the temperature threshold of the component and the global alarm threshold includes: When the temperature of the component is less than the second threshold value, determining a first weight based on the temperature of the component and the first threshold value, and taking the product of the first weight and the first global alarm threshold value as the weighted temperature value of the component; When the temperature of the component is greater than or equal to the second threshold value, a second weight is determined based on the temperature of the component and the second threshold value, and the product of the second weight and the second global alarm threshold value is used as the weighted temperature value of the component.

9. The method according to claim 1, characterized in that: The global alarm threshold value indicates a temperature alarm threshold of the target device.

10. A computing device, characterized in that: comprising a processor and a memory; wherein, The memory is used to store programs; The processor is used to execute the program stored in the memory. When the program stored in the memory is executed, the method described in any one of claims 1 to 9 is performed.

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