Substrate clamp and substrate treatment device

Abstract

Disclosed are a substrate clamp and a substrate treatment device. The substrate clamp comprises: a plurality of support components, which are provided on a fixing ring and are sequentially arranged in the circumferential direction of an opening. The support components each comprise a connecting part and a contact which are conductively connected, an insulating layer is provided on the surface of the connecting part, and the contact is used for electrically contacting a substrate. The contact is connected to the fixing ring at a preset distance by means of the connecting part, so that the fixing ring is located above the liquid level of a treatment liquid during a substrate treatment period, and the contact and the substrate on which same are borne are located below the liquid level. According to the present invention, the effect of reducing electrical contact between the substrate clamp and the treatment liquid during the substrate treatment period is achieved.

Description

Substrate fixtures and substrate processing equipment Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and further to a substrate clamp and substrate processing equipment. Background Art

[0002] The wet etching process is a type of etching process. In the wet etching process, due to equipment reasons (such as the control accuracy of etching time or etching solution temperature) or the life of the etching solution itself, the etching amount of the etching solution will change, resulting in an unstable etching rate. As a result, the etching thickness uniformity of the product is poor, and there are defects such as color difference and pitting on the appearance. In addition, the lateral etching amount (undercut) is too large, which seriously affects the quality of the product.

[0003] In the prior art, a technical solution of using a stripping process to replace the wet etching process has been disclosed. For example, the Chinese patent application number 202111140314.8 provides a method for preparing a patterned electrode using a stripping process and a patterned electrode thereof. This method omits the wet etching step, thereby avoiding the various problems caused by wet etching. The principle of the above-mentioned stripping process is: stripping is the reverse process of electroplating. When a substrate electroplated with a metal film is used as a working electrode (anode), the metal part without photoresist protection will lose electrons and become metal ions that dissolve in the electroplating solution. After the surface metal dissolves, the conductive seed layer metal will also lose electrons and be dissolved, while the metal part protected by the photoresist will be retained, thereby achieving the purpose of electrode patterning.

[0004] Substrate stripping equipment has a similar structure to substrate electroplating equipment. However, in some existing electroplating equipment, the substrate holder used for electroplating has a seal that isolates the substrate holder from the plating solution. This prevents current in the plating solution from being directly transferred to the substrate holder without passing through the substrate surface. This results in the current transferred from the plating solution to the substrate surface being less than the theoretical value, thus affecting the actual coating thickness. During the substrate electroplating process, the seal not only prevents the plating solution from directly contacting the substrate holder but also prevents the plating solution from contacting the substrate edges. However, since only one side of the substrate needs to be plated in the substrate electroplating process, and the edges do not need to be plated, the seal does not affect the substrate electroplating process. However, in the substrate stripping process, the entire substrate surface needs to be stripped. Using such a seal would prevent the stripping of the substrate edges. Therefore, such a seal is not suitable for stripping. However, during substrate stripping, if the substrate holder is in direct contact with the plating solution, some of the current in the plating solution will still be directly transferred to the substrate holder, resulting in the current transferred from the plating solution to the substrate surface being less than the theoretical value, reducing the amount of plating removed from the substrate surface and affecting the stripping effect.

[0005] Therefore, the present application aims to provide a substrate clamp for reducing electrical contact between the substrate clamp and the processing liquid during liquid processing of the substrate.

[0006] Summary of the Invention

[0007] In view of the above technical problems, an object of the present invention is to provide a substrate clamp and a substrate processing device, so as to reduce the electrical contact between the substrate clamp and the processing liquid during substrate processing.

[0008] In some embodiments, the above-mentioned substrate clamp is used to fix the substrate in a process chamber, and the process chamber is used to accommodate a processing liquid. The substrate clamp includes: a plurality of supporting members, which are provided on the fixing ring and arranged in sequence along the circumference of the opening, the supporting members including a connecting portion and a contact for conductive connection, an insulating layer is provided on the surface of the connecting portion, and the contact is used to electrically contact the substrate; wherein the contact is connected to the fixing ring at a predetermined distance through the connecting portion, so that during the processing of the substrate, the fixing ring is located above the liquid level of the processing liquid, and the contact and the substrate carried by it are located below the liquid level.

[0009] In some embodiments, the substrate processing apparatus includes a substrate holder, a process chamber, an electrode, and a power supply.

[0010] Compared with the prior art, the present application has the following advantages: the substrate clamp disclosed in the present application includes a fixed ring and a plurality of support members mounted on the fixed ring, the support members serving both to support the substrate and to conduct electricity to the substrate. In addition, the support structure further includes a connecting portion and a contact connected in sequence, the contact maintaining a predetermined distance from the fixed ring via the connecting portion, so that during substrate processing, the fixed ring can be positioned above the liquid level of the processing liquid, while the contact and the substrate it supports are positioned below the liquid level, thereby preventing the fixed ring from contacting the processing liquid and allowing the substrate to be completely immersed in the processing liquid. This reduces electrical contact between the substrate clamp and the processing liquid during substrate processing, thereby improving the accuracy of substrate processing.

[0011] Summary of the Figures

[0012] The preferred embodiments will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0013] FIG1 is a schematic diagram of the overall structure of an embodiment of a substrate clamp of the present invention;

[0014] FIG2 is a schematic diagram of a three-dimensional structure of a fixing ring of an embodiment of a substrate clamp of the present invention;

[0015] FIG3 is a top view of FIG2;

[0016] FIG4 is a schematic structural diagram of a supporting member of an embodiment of a substrate clamp of the present invention;

[0017] FIG5 a is a schematic structural diagram of a supporting member of another embodiment of a substrate clamp of the present invention;

[0018] FIG5b is a schematic diagram of another embodiment of FIG5a;

[0019] FIG6 is a schematic diagram of a guide structure of an embodiment of a substrate clamp of the present invention;

[0020] 7 is a schematic diagram of a pressure plate structure of an embodiment of a substrate clamp of the present invention;

[0021] FIG8 is a bottom view of FIG7;

[0022] 9 is a bottom view of an embodiment of a substrate clamp of the present invention in a substrate loading state;

[0023] FIG10 is a partial enlarged view of area a in FIG9 ;

[0024] 11 is a schematic diagram of the three-dimensional structure of a second pressure column of an embodiment of a substrate clamp of the present invention;

[0025] FIG12 is a schematic diagram of an embodiment of a substrate clamp of the present invention during loading of a substrate;

[0026] 13 is a schematic diagram of an embodiment of a substrate clamp of the present invention during loading of a substrate;

[0027] FIG14 is a schematic diagram of an embodiment of a substrate clamp of the present invention during loading of a substrate;

[0028] FIG. 15 is a schematic diagram of an embodiment of a substrate clamp of the present invention after loading a substrate.

[0029] Preferred embodiments of the present invention

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific embodiments of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings and other embodiments can be obtained based on these drawings without inventive work.

[0031] To simplify the drawings, only portions relevant to the invention are schematically depicted in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one component with the same structure or function is schematically depicted or labeled. In this document, "one" not only means "only one" but also "more than one."

[0032] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0033] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0034] As shown in FIG. 1 to FIG. 3 , the present invention discloses a substrate clamp 200 for fixing a substrate 300 in a process chamber 100 of a substrate processing device. The process chamber 100 is used to accommodate a processing liquid. The substrate clamp 200 includes a fixing ring 210 and a plurality of supporting members 220 .

[0035] Specifically, the fixing ring 210 is configured to have an opening 214 for receiving the substrate 300, with the shape of the opening 214 being substantially consistent with the shape of the substrate 300. The support members 220 are disposed on the fixing ring 210 and are sequentially arranged along the circumference of the opening 214 of the fixing ring 210. The support members 220 further include a connecting portion 226 and a contact 223 for conductive connection.

[0036] The contact 223 is used to make electrical contact with the substrate 300. The contact 223 is connected to the retaining ring 210 at a predetermined distance via a connection portion 226. This ensures that during processing of the substrate 300, the retaining ring 210 is positioned above the processing liquid level 110, while the contact 223 and the substrate 300 it supports are positioned below the liquid level 110. Since only the support member 220 is in contact with the processing liquid, contact between the retaining ring 210 and the processing liquid is avoided, preventing current in the processing liquid from being directly transferred to the retaining ring 210 without passing through the surface of the substrate 300. Furthermore, an insulating layer 224 is provided on the surface of the connection portion 226 to further minimize electrical contact between the substrate holder 200 and the processing liquid.

[0037] In addition, the insulating layer 224 may be a plastic sleeve or a plastic coating, and its material includes but is not limited to PTFE (polytetrafluoroethylene). The connecting portion 226 and the contact 223 are made of a conductive material, such as titanium.

[0038] Preferably, the connecting portion 226 is a bent member with a certain degree of elasticity. Referring to FIG. 2 , in this example, the connecting portion 226 includes a first connecting portion 221 and a second connecting portion 222. One end of the first connecting portion 221 is fixedly connected to the fixing ring 210. The other end of the first connecting portion 221 extends away from the fixing ring 210 by a predetermined length. The second connecting portion 222 extends from the other end of the first connecting portion 221 to within the vertical projection of the opening 214 and connects to the contact 223. The angle between the first connecting portion 221 and the second connecting portion 222 is denoted as θ (referred to as the bending angle θ of the connecting portion 226). When the substrate fixture 200 is not loaded with a substrate 300, the bending angle θ of the connecting portion 226 is 90 degrees or less. When the substrate fixture 200 is loaded with a substrate 300, the contact 223 bends at an increased angle θ under the pressure of the substrate 300, pressing the bottom surface of the substrate 300 against the contact 223.

[0039] As shown in FIG4 , in a preferred embodiment of the present application, the connecting portion 226 is a rod-shaped structure, the contact 223 is a spherical structure, and the diameter of the contact 223 is larger than the cross-sectional diameter of the connecting portion 226. An insulating layer 224 is provided on the surface of the contact 223, except for an area 2231 that electrically contacts the substrate 300 it supports, to minimize direct contact between the contact 223 and the processing liquid.

[0040] As shown in Figure 5a, in a preferred embodiment of the present application, the connecting portion 226 is a rod-shaped structure, and the contact 223 includes a contact housing 2232, a contact body 2233, a sealing ring 2234, and an elastic member 2236. The contact housing 2232 is vertically provided with a receiving groove 2235. One end of the contact body 2233 extends out of the contact housing 2232, and the other end is mounted in the receiving groove 2235 via an elastic member 2236. The sealing ring 2234 surrounds the contact body 2233 and is disposed on the contact housing 2232. The connecting portion 226 and the contact body 2233 are electrically connected. When the substrate holder 200 is not loaded with a substrate 300, the elastic force of the elastic member 2236 causes the end of the contact body 2233 extending from the contact housing 2232 to be higher than the sealing ring 2234. When the substrate holder 200 is loaded with a substrate 300, after the substrate 300 contacts the end of the contact body 2233 extending from the contact housing 2232, the contact body 2233 moves into the receiving groove 2235 under the pressure of the substrate 300 until the substrate 300 is pressed into contact with the sealing ring 2234, thereby isolating the contact body 2233 from the treatment fluid. Preferably, an insulating layer 224 is provided on the surface of the contact housing 2232 to minimize direct contact between the contact 223 and the treatment fluid. The elastic member 2236 includes, but is not limited to, a spring.

[0041] Preferably, as shown in FIG5b , the connecting portion 226 includes a wire 225 and a wire housing 227. The wire housing 227 is a hollow rod-shaped structure and is electrically connected to the receiving groove 2235. The wire 225 is disposed within the wire housing 227 and is electrically connected to the contact body 2233. The wire housing 227 serves as the insulating layer 224. It should be noted that in this embodiment, the wire housing 227 is entirely made of an insulating material and serves as the insulating layer 224 (as shown in FIG5b ). In other embodiments, the wire housing 227 may also be made of a non-insulating material. To prevent electrical conductivity between the wire housing 227 and the treatment liquid, an insulating layer 224 is still required on the outside of the wire housing 227.

[0042] Preferably, the support member 220 can be constructed so that the extension direction of the second connection part 222 forms an acute angle with the clamp α of the radius r of the opening 214 (see Figure 3), preferably 45 degrees, so that the length of the second connection part 222 is increased without increasing the distance between the contact 223 and the edge of the substrate 300, and then when the connection part 226 is elastically deformed under the action of external force, the change in the angle θ between the first connection part 221 and the second connection part 222 is increased, so that the substrate clamp 200 increases the friction time between the bottom surface of the substrate 300 and the contact 223 in the process of carrying the substrate 300, so that the contact 223 is fully in contact with the bottom surface of the substrate 300, the conductive performance is increased, and poor contact between the contact 223 and the substrate 300 is prevented.

[0043] As shown in Figures 2, 3, and 6, in a preferred embodiment of the present application, a plurality of guide members 211 are provided at the bottom of the fixing ring 210. The guide members 211 are configured to have a guide surface 212 oriented toward the center of the opening 214. These guide members 211 are used to guide the substrate 300 to a predetermined position during loading of the substrate 300 by the substrate fixture 200. When the substrate 300 is in the predetermined position, the centerline of the substrate 300 and the centerline of the opening 214 coincide.

[0044] Preferably, a limit pin 213 is provided on the guide surface 212. The limit pin 213 extends from the guide surface 212 to within the vertical projection of the opening 214. When the substrate holder 200 is loaded with the substrate 300, the limit pin 213 is no higher than the contact 223 to prevent the substrate 300 from falling directly into the process tank if the support member 220 fails.

[0045] Referring again to FIG. 1 , in a preferred embodiment of the present application, the substrate clamp 200 further includes a pressure plate 230 and a pressure plate drive device 240 . The pressure plate 230 is configured to abut against the back surface of the substrate 300 during processing of the substrate 300 to compress the substrate 300 into contact with the contacts 223 . The pressure plate drive device 240 is configured to drive the pressure plate 230 toward or away from the back surface of the substrate 300 . Furthermore, if a problem occurs with the pressure plate drive device 240 , such as a cylinder, causing the pressure plate 230 to excessively depress the substrate 300, the aforementioned limiting pins 213 can be used to prevent the support member 220 from excessively deforming, causing the substrate 300 to fall and fragment.

[0046] Preferably, the pressure plate 230 has a lower surface 234 in contact with the fixing ring 210, and a buffer pad 235 is provided on the lower surface 234 to reduce the impact of the pressure plate 230 on the fixing ring 210 during the descent of the pressure plate 230, and the above-mentioned buffer pad 235 is preferably an annular gasket arranged in the opening 214 between the pressure plate 230 and the fixing ring 210.

[0047] Preferably, as shown in Figures 7 to 10, the pressure plate 230 includes a plurality of first pressure columns 231 and second pressure columns 232. The first pressure columns 231 are spaced apart at the edge of the side of the pressure plate 230 that abuts the substrate 300, and the first pressure columns 231 correspond one-to-one with the contacts 223 (see Figure 10), and are used to abut the edge area of ​​the substrate 300. Because the corresponding first pressure columns 231 and contacts 223 exert forces on the substrate 300 at the same position on the front and back sides of the substrate 300, the forces on both sides of the substrate are evenly distributed, thereby preventing damage to the front and back sides of the substrate 300 caused by uneven forces. The second pressure columns 232 are spaced apart at the middle of the side of the pressure plate 230 that abuts the substrate 300, and are used to abut the middle area of ​​the substrate 300, thereby making the forces on the surface of the substrate 300 more even. In addition, to prevent residual liquid accumulation, the second pressure columns 232 should be arranged in an interlaced manner with the positions of the suction cups 141 of the manipulator 140 (see Figure 9).

[0048] Preferably, as shown in Figures 10 and 11, a plurality of guide grooves 233 are provided on the side of the first and second pressure columns 231 and 232 that abut against the substrate 300. The guide grooves 233 extend along the radius of the pressure plate 230 so that after the substrate 300 is processed, the processing liquid retained on the surface (upper surface) of the substrate 300 will be removed from the surface of the substrate 300 as the substrate 300 rises with the substrate holder 200 to remove the processing liquid. Furthermore, the guide grooves 233 are provided on the side of the first and second pressure columns 231 and 232 that faces the bottom of the process chamber 100 to reduce the contact area between the bottom of the first and second pressure columns 231 and 232 and the surface of the substrate 300, thereby preventing the bottom of the first and second pressure columns 231 and 232 from adsorbing the substrate 300 as the pressure plate 230 rises after the substrate 300 is processed, causing the substrate 300 to rise with the pressure plate and cause the substrate 300 to fall and be damaged.

[0049] Preferably, referring again to Figures 1 and 8, a cavity structure 236 is constructed on the side of the pressure plate 230 that abuts the substrate 300, with a first pressure column 231 located at the edge of the cavity structure 236 and a second pressure column 232 located in the middle of the cavity structure 236. The interior of the cavity structure 236 has outwardly inclined sidewalls 2361 and an arched top 2362. In addition, during the processing of the substrate 300, the substrate clamp 100 is configured so that the highest point of the top 2362 is above the liquid level 110 of the processing liquid. The above-mentioned cavity structure 236 helps to reduce the contact area between the pressure plate 230 and the processing liquid during substrate processing, preventing the pressure plate 230 from adsorbing the substrate 300 when it rises. In addition, the design of the sidewalls 2361 and top 2362 of the cavity structure 236 helps to prevent the processing liquid from adhering to the interior of the cavity structure 236, reducing corrosion to the pressure plate 230.

[0050] Preferably, in a preferred embodiment of the present application, the substrate clamp 200 further includes a fixing plate 250 and a support column 260. The fixing plate 250 is located above the fixing ring 210, and the two are connected by the support column 260. The pressure plate 230 is located between the fixing plate 250 and the fixing ring 210 and can be raised and lowered. The edge of the pressure plate 230 is provided with a guide hole 237 (see Figures 7 and 8). The support column 260 passes through the guide hole 237 to ensure that the pressure plate 230, the fixing plate 250, and the fixing ring 210 are located on the same center line.

[0051] As shown in FIG. 12 to FIG. 15 , in actual application, the working steps of the substrate clamp 200 are as follows:

[0052] First, as shown in FIG12 , the pressing plate 230 is driven by the pressing plate driving device 240 to move upward and stop above the fixing ring 210 , with a certain distance between the pressing plate 230 and the fixing ring 210 . At this time, the substrate 300 can be moved from the side of the substrate clamp 200 to between the pressing plate 230 and the fixing ring 210 by the robot 140 .

[0053] Next, as shown in FIG13 , the manipulator 140 continues to move the substrate 300 downward. After the substrate 300 passes through the opening 214 of the fixing ring 210 , the substrate 300 is finally placed on the support member 220 . At this time, the contacts 223 of each support member 220 jointly support the substrate 300. The manipulator 140 moves out from between the pressure plate 230 and the fixing ring 210 . At this time, the pressure of the substrate 300 on the contacts 223 is equal to the weight of the substrate 300 .

[0054] Again, as shown in FIG14 , the pressing plate 230 moves downward under the drive of the pressing plate driving device 240 and abuts against the back of the substrate 300 so that the substrate 300 is pressed into contact with the contact 223 . At this time, the pressure of the substrate 300 on the contact 223 is equal to the pressure of the gravity of the substrate 300 applied by the pressing plate 230 on the substrate 300 , so that the support member 220 is elastically deformed, completing the loading of the substrate 300 .

[0055] Finally, as shown in FIG. 15 , the substrate holder 200 loaded with the substrate 300 is moved downward as a whole into the process chamber 100 of the substrate processing equipment to process the substrate 300 .

[0056] The present invention also discloses a substrate processing device. Referring to FIG. 1 , the substrate processing device includes a process chamber 100, an electrode 120, a power supply 130, and a substrate fixture 200 according to any of the above embodiments. The electrode 120 is disposed within the process chamber 100, and the power supply 130 is configured to provide currents of opposite electrical polarity to the substrate fixture 200 and the electrode 120. Preferably, the substrate processing device is a stripping device, and the power supply 130 is configured to provide a positive current to the substrate 300 and a negative current to the electrode 120.

[0057] This embodiment is based on the special structure of the substrate clamp 200, so that during the processing of the substrate 300, only the support member 220 is in contact with the electrical processing liquid, preventing the fixing ring 210 from contacting the processing liquid, and allowing the substrate 300 to be completely immersed in the processing liquid, thereby reducing the electrical contact between the substrate clamp 200 and the processing liquid during the processing of the substrate 300, thereby improving the accuracy of the processing of the substrate 300.

[0058] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. For those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered as the scope of protection of the present invention.

Claims

1. A substrate fixture for fixing a substrate in a process chamber, wherein the process chamber is used to contain a processing liquid, characterized in that: The substrate fixture comprises: a fixing ring configured to have an opening for receiving the substrate; A plurality of supporting members are arranged on the fixing ring and arranged in sequence along the circumference of the opening, wherein the supporting members include a connecting portion and a contact for conductive connection, an insulating layer is provided on the surface of the connecting portion, and the contact is used for electrically contacting the substrate; wherein, The contact is connected to the fixing ring at a predetermined distance through the connecting portion, so that during the substrate processing, the fixing ring is located above the liquid level of the processing liquid, and the contact and the substrate carried by the contact are located below the liquid level.

2. The substrate fixture according to claim 1, characterized in that: The connecting portion is a rod-shaped structure; The contact has a spherical structure, and a diameter of the contact is larger than a cross-sectional diameter of the connecting portion.

3. The substrate clamp according to claim 2, characterized in that: The contact surface is provided with an insulating layer except for the area which is in electrical contact with the substrate supported by the contact surface.

4. The substrate fixture according to claim 1, characterized in that: The contact comprises a contact housing, a contact body, an elastic member and a sealing ring, wherein a receiving groove is arranged in the contact housing, one end of the contact body extends out of the contact housing for electrical contact with the substrate, and the other end of the contact body is resiliently mounted in the receiving groove through the elastic member, and the sealing ring is arranged on the contact housing and surrounds the periphery of the end of the contact body extending out of the contact housing; The connecting portion is electrically connected to the contact body; wherein, When the substrate fixture is not loaded with a substrate, under the elastic force of the elastic member, one end of the contact body extending out of the contact housing is higher than the sealing ring; When the substrate fixture is loading the substrate, the contact body moves into the receiving groove under the pressure of the substrate until the substrate is pressed into contact with the sealing ring, so that the contact body is isolated from the processing liquid.

5. The substrate clamp according to claim 4, characterized in that: The connecting portion includes a wire and a wire housing, wherein the wire housing is a hollow rod-shaped structure and is in electrical communication with the accommodating groove, and the wire is disposed in the wire housing and is electrically connected to the contact body; wherein the wire housing serves as the insulating layer.

6. The substrate fixture according to claim 4, characterized in that: An insulating layer is provided on the surface of the contact housing.

7. The substrate fixture according to claim 1, characterized in that: The material of the contact is titanium.

8. The substrate fixture according to claim 1, characterized in that: The connecting portion includes a first connecting portion and a second connecting portion, one end of the first connecting portion is fixedly connected to the fixing ring, the other end of the first connecting portion extends from the fixing ring to a preset length in a direction away from the fixing ring, and the second connecting portion extends from the other end of the first connecting portion to within the vertical projection range of the opening and is connected to the contact; wherein, An extending direction of the second connection portion forms an acute angle with a radial direction of the opening.

9. The substrate fixture according to claim 1, characterized in that: A plurality of guide members are arranged at the bottom of the fixing ring. The guide members are configured to have a guide sliding surface facing the center of the opening and are used to guide the substrate to a preset position during the process of the substrate clamp loading the substrate.

10. The substrate fixture according to claim 9, characterized in that: The surface of the guide sliding surface is provided with a limit pin, and the limit pin protrudes from the guide sliding surface to within the vertical projection range of the opening, wherein: When the substrate fixture is loaded with the substrate, the limiting pin is not higher than the contact.

11. The substrate fixture according to claim 1, characterized in that: Also includes: A pressing plate, used for pressing against the back side of the substrate to make the substrate and the contact come into compression contact; The pressing plate driving device is used to drive the pressing plate to abut against or away from the back side of the substrate.

12. The substrate fixture according to claim 11, characterized in that: The pressing plate comprises: A plurality of first pressure columns are arranged at intervals on the edge of the side of the pressure plate abutting against the substrate, and the first pressure columns correspond to the contacts one by one and are used to abut against the edge area of ​​the substrate; A plurality of second pressing columns are arranged at intervals in the middle of one side of the pressing plate abutting against the substrate, and are used for abutting against the central area of ​​the substrate.

13. The substrate fixture according to claim 12, characterized in that: A plurality of guide grooves are provided on one side of the first pressure column and / or the second pressure column that abuts against the substrate.

14. The substrate fixture according to claim 12, characterized in that: A buffer pad is arranged between the pressing plate and the fixing ring.

15. The substrate fixture according to claim 12, characterized in that: A cavity structure is constructed on one side of the pressing plate that abuts against the substrate, the first pressing column is located at the edge of the cavity structure, and the second pressing column is located in the middle of the cavity structure; wherein, The cavity structure has an outwardly inclined side wall inside, and / or the cavity structure has an arched top inside.

16. The substrate fixture according to claim 15, characterized in that: During the substrate processing, the substrate holder is configured such that a highest point of the top portion is located above a liquid level of the processing liquid.

17. A substrate processing device, characterized in that: The substrate clamp according to any one of claims 1 to 16 further comprises: Process cavity; An electrode, disposed in the process chamber; A power source is used to provide currents with opposite electrical properties to the substrate and the electrodes.

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