Electronic device

Abstract

The present application belongs to the technical field of communications. Disclosed is an electronic device. The electronic device comprises a housing; a key, which is provided on the housing, wherein the key is provided with a temperature compensation resistor; and a charging circuit, wherein the charging circuit acquires temperature information of the temperature compensation resistor, and adjusts a charging power on the basis of the temperature information of the temperature compensation resistor.

Description

electronic devices

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on September 11, 2023, with application number 202311173250.0 and invention name “Electronic Device”. The entire contents of the Chinese patent application are incorporated herein by reference. Technical Field

[0003] The present application belongs to the field of communication technology, and specifically relates to an electronic device. Background Art

[0004] Currently, most electronic devices have a fast charging function, which can fully charge the electronic devices in a short time, greatly saving users' charging time and improving their usage experience.

[0005] While fast charging can quickly charge the device, it also brings about a relatively large temperature rise problem. That is, as the charging current increases, the temperature of the entire electronic device will also rise. Excessive temperature will bring a bad user experience.

[0006] Currently, this is usually achieved by monitoring the temperature detected by the temperature detection circuit on the electronic device motherboard, and temperature rise control is performed based on the temperature reported by the temperature detection circuit. However, this method has the problem of low temperature rise control accuracy.

[0007] Summary of the Invention

[0008] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of low accuracy in fast charging temperature rise control.

[0009] In a first aspect, an embodiment of the present application provides an electronic device, comprising: a housing; a button arranged on the housing, the button being provided with a temperature compensation resistor; a charging circuit, the charging circuit obtaining temperature information of the temperature compensation resistor and adjusting the charging power according to the temperature information of the temperature compensation resistor.

[0010] In an embodiment of the present application, the charging power is adjusted by the temperature information of the temperature compensation resistor set by the button of the electronic device shell. Compared with the mainboard temperature as the standard for judging the temperature rise of the whole machine, the temperature of the temperature compensation resistor, that is, the temperature of the shell is used as the standard for judging the temperature rise of the whole machine to adjust the charging power, which is more in line with the user's actual perception needs. The time required for the shell temperature to rise to the same mainboard temperature will be longer. This time difference can allow the electronic device to maintain high-power charging for a longer time, thereby improving the accuracy of temperature rise control. Even if the user uses the electronic device during charging, he will not feel the heat of the electronic device and the charging time will be greatly shortened, which is conducive to improving charging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

[0012] FIG2 is a schematic diagram of the circuit structure of a key according to an embodiment of the present application.

[0013] FIG3 a is a schematic diagram of the circuit structure of a pressure-sensitive resistor according to an embodiment of the present application.

[0014] FIG3 b is a schematic diagram of the circuit structure of the temperature compensation resistor according to an embodiment of the present application.

[0015] FIG4 is a schematic structural diagram of a charging circuit according to an embodiment of the present application.

[0016] FIG5 is a schematic diagram of mapping voltage change-temperature change according to an embodiment of the present application.

[0017] FIG6 is a schematic structural diagram of a charging circuit according to another embodiment of the present application. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0019] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0020] The electronic device provided in the embodiments of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0021] FIG1 is a schematic diagram of the structure of an electronic device according to an embodiment of the present application, and FIG2 is a schematic diagram of the circuit structure of a pressure-sensitive button according to an embodiment of the present application.

[0022] As shown in Figures 1 and 2, the electronic device 100 of an embodiment of the present application includes a shell 10; a button 20 arranged on the shell 10, and the button 20 is provided with a temperature compensation resistor 2020; a charging circuit 110, and the charging circuit 110 obtains temperature information of the temperature compensation resistor 2020 and adjusts the charging power according to the temperature information of the temperature compensation resistor 2020.

[0023] Optionally, the button includes a power button or a volume button. The temperature compensation resistor provided on the shell button is the temperature compensation resistor of the pressure-sensitive bridge in the pressure-sensitive button circuit. Here, the circuit of the pressure-sensitive button 20 is a component originally possessed by the electronic device 100. In this embodiment, the temperature compensation resistor in the pressure-sensitive button 20 circuit of the electronic device 100 is reused to obtain the temperature information of the temperature compensation resistor, thereby obtaining the temperature of the shell 10 of the electronic device 100. In the case of temperature changes on the button, the temperature compensation resistor generates a voltage change based on the real-time temperature change to compensate the pressure-sensitive bridge. After obtaining the real-time temperature change, the real-time temperature information can be obtained according to the voltage-temperature change curve of the temperature compensation resistor.

[0024] The pressure-sensing function of the pressure-sensitive button 20 circuit can realize a more convenient, quick, flexible and diversified touch-pressing operation experience on the electronic device 100 . Most electronic devices 100 are provided with a pressure-sensitive button 20 .

[0025] As shown in FIG1 , for example, a button 20 is provided on a housing 10 on the side of an electronic device 100. Referring to FIG2 , the button is further provided with a pressure-sensing resistor 2020′. The pressure-sensing resistor 2020′ is provided along a first direction A of the button 20, and the temperature-compensating resistor 2020 is provided along a second direction B of the button 20. The second direction A is perpendicular to the first direction B, and the pressure-sensing resistor 2020′ and the temperature-compensating resistor 2020 are spaced apart. The pressure-sensing resistor 2020′ is used to obtain a first voltage change based on a pressure change of the button; the temperature-compensating resistor 2020 is used to obtain a second voltage change based on a temperature change of the button and compensate for the first voltage change when the temperature of the button changes.

[0026] The first direction A of the key 20 is the long side of the key 20, and the second direction B of the key 20 is the short side of the key 20. The pressure-sensing resistor 2020' is disposed on the housing 10 below the key 20, along the long side of the key 20. The temperature-compensating resistor 2020 is disposed on the housing 10 below the key 20, along the short side of the key 20. Furthermore, the pressure-sensing resistor 2020' and the temperature-compensating resistor 2020 are spaced apart.

[0027] The circuitry of the pressure-sensitive button 20 includes a pressure-sensing resistor 2020' and a temperature-compensating resistor 2020. The pressure-sensing resistor 2020' uses the piezoresistive effect to detect the pressure applied to the button 20 by generating a voltage change based on the pressure applied to the button. The temperature-compensating resistor 2020 is positioned perpendicular to the pressure-sensing resistor 2020'. Therefore, when pressure is applied to the button 20, the temperature-compensating resistor 2020 is unaffected by the pressure and does not generate pressure due to the piezoresistive effect. However, when the temperature of the temperature-compensating resistor 2020 changes, the resistor deforms, generating a voltage change.

[0028] The temperature compensating resistor 2020 and the pressure sensing resistor 2020' are made of the same material. In this case, similarly, when the temperature of the pressure sensing resistor 2020' changes, the resistance will deform and generate a voltage change. This voltage change caused by the temperature change will affect the voltage change obtained by the pressure sensing resistor 2020' when sensing the pressure of the button 20. That is, the voltage detected by the pressure sensing resistor 2020' includes not only the voltage generated by the pressure, but also the voltage generated by the temperature change. Through the temperature compensating resistor 2020, when there is a temperature change in the button 20, the voltage detected by the pressure sensing resistor 2020' can be compensated based on the voltage obtained by the temperature compensating resistor 2020 when the temperature changes.

[0029] Specifically, the pressure-sensing resistor includes: a first pressure-sensing resistor module arranged on a first surface close to the key, and a second pressure-sensing resistor module arranged on a second surface away from the key, and the first surface is parallel to the second surface and spaced apart; the temperature-compensating resistor includes: a first temperature-compensating resistor module arranged on the first surface, and a second temperature-compensating resistor module arranged on the second surface.

[0030] As shown in FIG2 , the first pressure-sensing resistor module includes a second pressure-sensing resistor R2′ and a third pressure-sensing resistor R3′. The second pressure-sensing resistor R2′ and the third pressure-sensing resistor R3′ are disposed on the first plane 12 and spaced parallel to each other along the first direction A. The second pressure-sensing resistor module includes a first pressure-sensing resistor R1′ and a fourth pressure-sensing resistor R4′. The first pressure-sensing resistor R1′ and the fourth pressure-sensing resistor R4′ correspond one-to-one with the vertical projections of the second pressure-sensing resistor R2′ and the third pressure-sensing resistor R3′ on the second surface 22. That is, the first pressure-sensing resistor R1′ and the fourth pressure-sensing resistor R4′ are disposed on the second plane 22 and spaced parallel to each other along the first direction A.

[0031] The first temperature-compensating resistor module includes a second temperature-compensating resistor R2 and a third temperature-compensating resistor R3. The second temperature-compensating resistor R2 and the third temperature-compensating resistor R3 are arranged on the first plane 12 and are spaced parallel to each other along the second direction B. The second temperature-compensating resistor R2 and the third temperature-compensating resistor R3 are spaced apart from the second pressure-sensing resistor R2' and the third pressure-sensing resistor R3', respectively.

[0032] The second temperature-compensating resistor module includes a first temperature-compensating resistor R1 and a fourth temperature-compensating resistor R4. The first temperature-compensating resistor R1 and the fourth temperature-compensating resistor R4 overlap with the vertical projections of the second temperature-compensating resistor R2 and the third temperature-compensating resistor R3 on the second surface, respectively, in a one-to-one correspondence. That is, the first temperature-compensating resistor R1 and the fourth temperature-compensating resistor R4 are disposed on the second plane 22 and are spaced parallel to each other along the second direction B.

[0033] The pressure-sensing resistor 2020' is a Wheatstone bridge structure, for example, including a first pressure-sensing resistor R1', a second pressure-sensing resistor R2', a third pressure-sensing resistor R3' and a fourth pressure-sensing resistor R4'. When the user presses the button 20, deformation will occur under the action of pressure, causing the resistance value of the pressure-sensing resistor 2020' to change. The resistance change is converted into a voltage change through the corresponding structure of the pressure-sensing resistor 2020'. The electrical signal corresponding to the voltage change is converted into a digital signal through analog-to-digital conversion and processed, thereby identifying and responding to the touch press operation.

[0034] Referring to Figure 3a, specifically, the first end of the first pressure-sensing resistor R1' and the first end of the third pressure-sensing resistor R3' are respectively connected to the power supply voltage Vs; the second end of the first pressure-sensing resistor R1' and the first end of the second pressure-sensing resistor R2' are connected at a first node; the second end of the second pressure-sensing resistor R2' and the second end of the fourth pressure-sensing resistor R4' are respectively grounded GND; the second end of the third pressure-sensing resistor R3' and the first end of the fourth pressure-sensing resistor R4' are connected at a second node.

[0035] The voltage change of the pressure-sensing resistor 2020' based on the pressure change detection can be obtained by the differential voltage Vp1 obtained from the first node and the differential voltage Vn1 obtained from the second node. When the key 20 is affected by temperature, the detected differential voltage also includes the voltage change caused by the temperature change.

[0036] Referring to Figure 3b, specifically, the first end of the first temperature-compensating resistor R1 and the first end of the third temperature-compensating resistor R3 are respectively connected to the power supply voltage Vs; the second end of the first temperature-compensating resistor R1 and the first end of the second temperature-compensating resistor R2 are connected at a third node; the second end of the second temperature-compensating resistor R2 and the second end of the fourth temperature-compensating resistor R4 are respectively grounded GND; the second end of the third temperature-compensating resistor R3 and the first end of the fourth temperature-compensating resistor R4 are connected at a fourth node; the charging circuit obtains a first differential voltage Vp2 from the third node, and obtains a second differential voltage Vn2 from the fourth node.

[0037] The differential voltage Vp2 obtained from the third node and the differential voltage Vn2 obtained from the fourth node can be used to determine the voltage change detected by the temperature compensation resistor 2020 based on the temperature change. When the temperature of the key 20 changes, the differential voltage detected by the temperature compensation resistor 2020 can be used to compensate and correct the voltage change detected by the pressure sensing resistor 2020'.

[0038] Temperature compensation resistor 2020 has a Wheatstone bridge structure. The bridge of temperature compensation resistor 2020 is very sensitive to temperature changes and can detect voltage changes in the microvolt range due to temperature. It can accurately detect changes in the housing temperature and, based on the detected temperature changes, compensate for the temperature effects of voltage changes detected by pressure-sensing resistor 2020.

[0039] The four temperature compensation resistors 2020 individually form a Wheatstone bridge. Through the arrangement of Figure 2, it is only sensitive to temperature changes. When the temperature changes, the resistance value of each resistor will change, which in turn causes the voltage to change, generating a voltage change.

[0040] In an embodiment of the present application, the charging circuit obtains the temperature information of the temperature compensation resistor 2020 by obtaining the first differential voltage Vp2 and the second differential voltage Vn2 from the temperature compensation resistor 2020 set in the button 20, thereby detecting the temperature of the shell 10 by reusing the temperature compensation resistor 2020 in the button 20 circuit set on the shell 10.

[0041] Specifically, obtaining the temperature information of the temperature-compensating resistor includes: monitoring the voltage change output by the temperature-compensating resistor based on the temperature change of the shell through the obtained first differential voltage and the second differential voltage; converting the voltage change into a corresponding temperature change according to a preset voltage change-temperature change mapping relationship; and obtaining the temperature information of the temperature-compensating resistor based on the temperature change and the initial temperature of the temperature-compensating resistor.

[0042] The first differential voltage signal Vp2 between the connection nodes of the corresponding ends of the first temperature compensation resistor R1 and the second temperature compensation resistor R2, and the second differential voltage signal Vn2 between the connection nodes of the corresponding ends of the third temperature compensation resistor R3 and the fourth temperature compensation resistor R4 are collected and provided to the charging circuit. Then, the voltage change △V corresponding to the temperature change can be calculated based on the following formula (1), so that the corresponding voltage change when the temperature of the shell 10 changes can be monitored through the temperature compensation resistor 2020.

[0043] In order to obtain the temperature change ΔT of the housing 10 based on the voltage change ΔV monitored by the temperature compensation resistor, it is necessary to fit the relationship between different temperature changes ΔT and voltage changes ΔV in advance, that is, the mapping relationship between voltage change and temperature change.

[0044] Optionally, the mapping relationship is ΔT=k*ΔV, where ΔT represents temperature change, k is a constant, and ΔV represents voltage change.

[0045] In one embodiment, the corresponding relationship between the changes in temperature and voltage signals can be collected in a constant temperature box. For example, the mapping relationship between the two can be expressed by a linear formula ΔT = k * ΔV, or a formula representing the mapping relationship between the two can be obtained by multivariate function fitting regression.

[0046] For example, FIG5 shows a mapping relationship between voltage change and temperature change according to an embodiment of the present application.

[0047] Therefore, when the voltage change caused by the temperature change of the housing 10 detected by the temperature compensation resistor 2020 is monitored, the voltage change can be converted into a corresponding temperature change based on a preset voltage change-temperature change mapping relationship.

[0048] To determine the current temperature of the housing 10, the temperature change ΔT, determined based on the mapping relationship, must be summed with the initial temperature T0 of the housing 10 before the current temperature change. The current temperature of the housing 10 is calculated as T = T0 + ΔT. The initial temperature of the housing 10 before the current temperature change may be the temperature when the electronic device is initially plugged into a fast-charging charger, or it may be the accumulated temperature calculated from temperature changes at different stages during the fast-charging process.

[0049] In this way, when the temperature compensation resistor 2020 is affected by temperature and deformed, the temperature information of the temperature compensation resistor can be directly presented in the form of temperature change △T, that is, the current temperature T of the shell 10. The charging circuit controls and adjusts the fast charging power (or charging current) based on the current temperature T.

[0050] Optionally, the charging circuit adjusts the charging power according to the temperature information of the temperature compensation resistor, including: when the temperature information of the temperature compensation resistor is not less than a preset temperature threshold, adjusting the first preset charging current for charging the electronic device to a second preset charging current, and the second preset charging current is less than the first preset charging current.

[0051] When fast charging begins, for example, when the electronic device is initially plugged into a fast charger, fast charging is performed with a higher charging current. The first preset charging current can be a preset charging current for initial fast charging, or it can be a preset charging current corresponding to the housing temperature of the electronic device during fast charging. The higher the temperature of the electronic device housing, the lower the first preset charging current.

[0052] In the embodiment of the present application, the temperature of the housing 10 of the electronic device 100 is detected by the temperature information of the temperature compensation resistor 2020 set by the button 20, so as to be used for temperature control when the temperature rises due to subsequent fast charging.

[0053] By detecting the temperature information of the temperature compensation resistor 2020, when the temperature information of the temperature compensation resistor 2020 rises to the preset temperature threshold, in order to avoid the high temperature causing a bad user experience, the current larger first preset charging current is adjusted to a smaller second preset charging current to reduce the shell temperature during fast charging.

[0054] The first preset charging current and the second preset charging current correspond to different preset temperature thresholds respectively. The larger the charging current is, the smaller the corresponding preset temperature threshold is.

[0055] Similarly, during fast charging with the second preset charging current, the above steps are repeated, using the second preset charging current as the first preset charging current, and continuously detecting the temperature information of the temperature compensation resistor 2020. If the temperature information of the temperature compensation resistor 2020 is not less than the preset temperature threshold corresponding to the first preset charging current, the first preset charging current is further adjusted to the second preset charging current. In other words, the above fast charging temperature rise control method can also be applied to the case of step fast charging.

[0056] Optionally, adjusting the charging power according to the temperature information of the temperature compensation resistor further includes: when the temperature information of the temperature compensation resistor is less than the preset temperature threshold, maintaining charging the electronic device with the first preset charging current.

[0057] When the temperature information of the temperature compensation resistor 2020 is less than the preset temperature threshold corresponding to the first preset charging current, that is, when the temperature rise does not reach the temperature corresponding to the need to reduce the charging current, fast charging is maintained at the first preset charging current.

[0058] The housing of an electronic device is the component that the user directly contacts when using the electronic device. The temperature of the housing of the electronic device affects the user's final experience.

[0059] If the temperature detection circuit on the electronic device's motherboard can only detect the motherboard temperature, due to the temperature delay effect, there is a certain time difference between the motherboard temperature and the casing temperature. Thermal design simulation shows that the temperature difference between the motherboard and the casing is quite significant, with the maximum temperature difference reaching over 5°C. Although the difference is only a few degrees, the time difference caused by the temperature difference can extend the time the electronic device can maintain a relatively high charging current. Taking a 200W (20V / 10A) fast charging solution as an example, assuming a battery capacity of 3000mAh, the time difference caused by the temperature difference is 5min = 5 / 60h. During this time, charging is performed at 10A (10,000mA). During this time difference, 10,000*(5 / 60) = 833mAh can be charged. This is very beneficial for improving the charging perception of 100W charging.

[0060] In the embodiment of the present application, the charging power of the electronic device is adjusted by detecting the temperature of the temperature compensation resistor set on the shell button, that is, the shell temperature is used as the standard for judging the temperature rise of the entire device. Compared with the motherboard temperature, it takes longer for the shell temperature to rise to the same temperature. This time difference allows the electronic device to maintain high-power charging for a longer time, thereby significantly improving the charging perception of the 100-watt level. Therefore, the charging power of the electronic device can be adjusted more accurately, improving the accuracy of fast charging temperature rise control.

[0061] The temperature information of the temperature compensation resistor 2020 is compared with the preset temperature threshold to determine whether the current temperature of the shell 10 rises to the preset temperature threshold during the process of fast charging the electronic device with the first preset charging current, so as to decide whether to adjust the first preset charging current to the second preset charging current, or continue to maintain fast charging with the first preset charging current.

[0062] 4 , the control logic of the charging circuit 110 for adjusting the charging power based on the temperature information of the temperature compensation resistor in the present application to perform temperature rise control will be described.

[0063] As shown in FIG4 , a button 20 is provided at a corresponding position on the housing 10 of the electronic device 100. A pressure sensor 50 is connected to the button 20 and is configured to receive voltage changes generated by a pressure-sensitive resistor 2020′ and a temperature-compensating resistor 2020 of the button 20. When the temperature of the housing 10 changes, the pressure sensor 50 collects a first differential voltage signal Vp2 and a second differential voltage signal Vn2 output by the temperature-compensating resistor 2020.

[0064] In one embodiment, the pressure sensor 50 can be directly connected to the central processing unit (CPU) of the charging circuit 110 , thereby transmitting the first differential voltage signal Vp2 and the second differential voltage signal Vn2 to the CPU. The CPU then calculates the voltage change ΔV based on the first differential voltage signal Vp2 and the second differential voltage signal Vn2 , and calculates the temperature change based on a preset voltage change-temperature change mapping relationship, thereby determining the temperature information of the temperature compensation resistor 2020 , i.e., the current temperature T of the housing 10 . The CPU sets the current charging current I by comparing the current temperature T with a preset temperature threshold.

[0065] In another embodiment, as shown in FIG4 , the pressure sensor 50 can be connected to a temperature detection circuit 40 for the button 20 . The temperature detection circuit 40 is provided in the charging management module 30 and is connected to the pressure sensor 50. Thus, the temperature detection circuit 40 can calculate the voltage change ΔV based on the first differential voltage signal Vp2 and the second differential voltage signal Vn2 detected by the pressure sensor 50, and calculate the temperature change ΔT based on a preset voltage change-temperature change mapping relationship. The initial temperature T0 of the housing 10 before each temperature change is stored and updated, and the temperature information of the temperature compensation resistor 2020, i.e., the current temperature T of the housing 10, is calculated based on the temperature change ΔT and the initial temperature T0.

[0066] The central processing unit (CPU) communicates with the integrated circuit bus (I2C) via the clock signal line (SCL) and the serial data signal line (SDA), and also communicates with the power / charging management circuit 60 via the reset signal (RSR) and the interrupt signal (INT). An external power source (VBUS) is connected to the charging management module 30 to provide the charging current for fast charging.

[0067] The temperature detection circuit 40 can feed back the temperature information of the temperature compensation resistor 2020 to the central processing unit CPU through the charging management module 30, so that the processor CPU compares the temperature information of the temperature compensation resistor 2020 with the preset temperature threshold, thereby setting the current charging current I, and providing it to the charging management module 60 via the integrated circuit bus I2C to fast charge the electronic device 100 through the external power supply VBUS.

[0068] In this embodiment, by reusing the temperature compensation resistor 2020 of the button 20 set on the shell 10, the temperature of the shell can be obtained more accurately, which is more in line with the user's actual perception needs. This temperature is fed back to the central processing unit CPU, which can be used to accurately control the charging power of fast charging. The high-power charging of the first preset charging current is maintained before the preset temperature threshold is reached. This can improve the accuracy of temperature rise control. Even if the user uses the electronic device during the charging process, the electronic device will not feel the heat and the charging time will be greatly shortened, which is conducive to improving charging efficiency.

[0069] In addition, the temperature compensation resistor 2020 of the multiplexed button 20 does not need to be equipped with an additional circuit design for shell temperature detection, which greatly saves material costs and layout space of the electronic device printed circuit board PCB.

[0070] In one embodiment, the electronic device 100 further includes: a mainboard and a temperature detection circuit provided on the mainboard; the charging circuit further obtains temperature information of the temperature detection circuit and calibrates the temperature information of the temperature compensation resistor according to the temperature information of the temperature detection circuit.

[0071] The temperature detection circuit is provided with a negative temperature coefficient NTC module.

[0072] In this embodiment, the temperature of the housing 10 of the electronic device 100 is detected by a temperature detection circuit provided on the mainboard of the electronic device 100 .

[0073] Here, the temperature detection circuit may be a component originally provided on the mainboard of the electronic device. In this embodiment, the housing temperature is acquired by reusing the temperature detection circuit on the mainboard of the electronic device 100 .

[0074] The temperature detection circuit on the motherboard mainly detects the motherboard temperature through a negative temperature coefficient (NTC) module. Electronic devices with NTC modules installed inside include but are not limited to gyroscopes, barometers, or positioning chip components. Optionally, the following takes the temperature detection circuit as an example of an NTC module installed inside a gyroscope.

[0075] The gyroscope is equipped with an internal temperature detection circuit, which includes an NTC module. Gyroscopes are commonly used in scenarios such as optical image stabilization (OIS) adjustment for cameras. The internal NTC module is primarily used to detect the ambient temperature and ensure that the gyroscope operates within the appropriate temperature range. Of course, other circuits within electronic devices that have temperature detection capabilities can also be used as the temperature detection circuit for detecting the housing temperature of the electronic device in this application.

[0076] Specifically, the temperature information of the temperature compensation resistor is calibrated according to the temperature information of the temperature detection circuit, including: converting the temperature information of the temperature detection circuit into the temperature information of the shell according to a preset mapping relationship between the mainboard temperature and the shell temperature; comparing the temperature information of the temperature compensation resistor and the temperature information of the shell; when the temperature information of the shell is greater than the temperature information of the temperature compensation resistor, updating the temperature information of the temperature compensation resistor to the temperature information of the shell. In this embodiment, the temperature detection circuit on the mainboard of the electronic device 100 can be reused, and the current temperature information can be directly detected and output through the temperature detection circuit. Of course, the current temperature information is directly related to the mainboard position where the NTC module is set. Different temperature detection circuits set at different positions on the mainboard may detect different temperature information.

[0077] To determine the temperature of the housing 10 based on the motherboard temperature monitored by the temperature detection circuit, it is necessary to first fit the relationship between different motherboard temperatures and housing temperatures, namely, the motherboard temperature-housing temperature mapping relationship. By matching the temperature detected by the NTC module with the temperature of a certain point on the housing, the housing temperature can be detected.

[0078] Considering that the areas where human hands most frequently contact the housing of electronic devices are typically the keypad areas, such as the power button or volume rocker area, the housing temperature in these areas can significantly impact the user's experience. Therefore, it's possible to map the housing temperature at the power button or volume rocker area to the motherboard temperature detected by a temperature detection circuit on the motherboard, such as the gyroscope's NTC module.

[0079] In one embodiment, the temperature information T1 detected by the temperature detection circuit in a common scenario, that is, the motherboard temperature, and the temperature T2 at the target position of the shell are measured, and then a multivariate function fitting regression method is used to obtain a formula representing the mapping relationship between the two, such as T2 = a*T1. 2 +b*T1+c, where a, b, and c are constants.

[0080] Therefore, when the temperature information T1 detected by the temperature detection circuit is monitored during actual use, the temperature information can be converted into the corresponding housing temperature based on the preset mapping relationship between the mainboard temperature and the housing temperature.

[0081] In this way, when the temperature detection circuit detects the current temperature information T1, the central processing unit CPU can map the current shell temperature T2 based on the current temperature information T1 and control the fast charging current according to the current shell temperature.

[0082] The current temperature T of the shell 10 detected by the temperature information of the temperature compensation resistor is compared with the current shell temperature T2 detected by the temperature information of the temperature detection circuit. When the shell temperature T2 is greater than the current temperature T of the shell 10, the temperature information of the temperature compensation resistor is updated to the shell temperature T2.

[0083] Then, the temperature information of the updated temperature compensation resistor is compared with the preset temperature threshold to determine whether the current temperature of the shell 10 rises to the preset temperature threshold during the process of fast charging the electronic device with the first preset charging current, so as to decide whether to adjust the first preset charging current to the second preset charging current, or continue to maintain fast charging with the first preset charging current.

[0084] 6 , the following describes how the charging circuit 110 calibrates the temperature information of the temperature compensation resistor based on the temperature information of the temperature detection circuit described above.

[0085] In one embodiment, as shown in FIG6 , the charging management module 30 can also be connected to a temperature detection circuit on the mainboard to obtain current temperature information T1 detected by the temperature detection circuit. Furthermore, the charging management module 30 is provided with a temperature detection circuit 40. Thus, the temperature detection circuit 40 can also calculate the current housing temperature T2 based on the current temperature information T1 detected by the temperature detection circuit and a preset mapping relationship between the mainboard temperature and the housing temperature.

[0086] Temperature detection circuit 40 is also connected to the central processing unit (CPU) to directly transmit the current housing temperature T2 to the CPU. The CPU compares the current housing temperature T2 with the temperature information of temperature compensation resistor 2020 (Figure 4), i.e., the current housing temperature T = T0 + ΔT. If housing temperature T2 is greater than the current housing temperature T, the temperature information of the temperature compensation resistor is updated to the current housing temperature T2.

[0087] Then, the updated temperature information of the temperature compensation resistor is compared with the preset temperature threshold to set the current charging current I, and is provided to the charging management module 60 via the integrated circuit bus I2C to fast charge the electronic device 100 through the external power supply VBUS.

[0088] In another embodiment, the temperature detection circuit on the mainboard can transmit the detected temperature information T1 directly to the central processing unit CPU, so that the central processing unit CPU can calculate the current shell temperature T2 based on the current temperature information T1 and the preset mainboard temperature-shell temperature mapping relationship, and update the temperature information of the temperature compensation resistor 2020 by comparing the current shell temperature T2 with the temperature information of the temperature compensation resistor 2020, thereby adjusting the charging power according to the updated temperature information of the temperature compensation resistor and setting the current charging current I.

[0089] In this embodiment, by reusing the temperature detection circuit set on the main board, the temperature information detected by the temperature detection circuit is mapped to the shell temperature, and fed back to the central processing unit CPU for calibrating the temperature information of the temperature compensation resistor, so that the charging power is adjusted based on the temperature information of the temperature compensation resistor more accurately and more in line with the user's actual perception needs. When the temperature information detected by the temperature detection circuit is not less than the temperature information of the temperature compensation resistor, the temperature information of the temperature compensation resistor is used to adjust the charging power; when the temperature information detected by the temperature detection circuit is greater than the temperature information of the temperature compensation resistor, the higher temperature information detected by the temperature detection circuit is used to adjust the charging power. This can improve the accuracy of temperature rise control. Even if the user uses the electronic device during charging, he will not feel the heat of the electronic device and the charging time will be greatly shortened, which is conducive to improving charging efficiency.

[0090] Furthermore, reusing the temperature detection circuit on the motherboard offers greater universality and eliminates the need for additional circuitry for housing temperature detection, significantly saving material costs and PCB layout space. Furthermore, obtaining housing temperature through multivariate regression fitting is more accurate.

[0091] In an embodiment of the present application, the charging power is adjusted by the temperature information of the temperature compensation resistor set by the button of the electronic device shell. Compared with the mainboard temperature as the standard for judging the temperature rise of the whole machine, the temperature of the temperature compensation resistor, that is, the temperature of the shell is used as the standard for judging the temperature rise of the whole machine to adjust the charging power, which is more in line with the user's actual perception needs. The time required for the shell temperature to rise to the same mainboard temperature will be longer. This time difference can allow the electronic device to maintain high-power charging for a longer time, thereby improving the accuracy of temperature rise control. Even if the user uses the electronic device during charging, he will not feel the heat of the electronic device and the charging time will be greatly shortened, which is conducive to improving charging efficiency.

[0092] The electronic device in the embodiments of the present application may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a personal computer (PC), etc., and the embodiments of the present application are not specifically limited.

[0093] The electronic device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0094] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0095] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), including a number of instructions for enabling a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0096] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. An electronic device, wherein: include: case; A button arranged on the housing, wherein the button is provided with a temperature compensation resistor; A charging circuit, wherein the charging circuit obtains temperature information of the temperature compensation resistor and adjusts the charging power according to the temperature information of the temperature compensation resistor.

2. The electronic device according to claim 1, wherein: The button is further provided with a pressure-sensitive resistor, the pressure-sensitive resistor is arranged along a first direction of the button, the temperature-compensating resistor is arranged along a second direction of the button, the second direction is perpendicular to the first direction, and the pressure-sensitive resistor and the temperature-compensating resistor are arranged at intervals; The pressure-sensing resistor is used to obtain a first voltage change based on the pressure change of the key; the temperature-compensating resistor is used to obtain a second voltage change based on the temperature change and compensate for the first voltage change when there is a temperature change of the key.

3. The electronic device according to claim 2, wherein: The pressure-sensitive resistor comprises: a first pressure-sensitive resistor module arranged on a first surface close to the key, and a second pressure-sensitive resistor module arranged on a second surface away from the key, wherein the first surface is parallel to and spaced from the second surface; The temperature compensation resistor includes: a first temperature compensation resistor module arranged on the first surface, and a second temperature compensation resistor module arranged on the second surface.

4. The electronic device according to claim 3, wherein: The first pressure-sensitive resistor module includes a second pressure-sensitive resistor and a third pressure-sensitive resistor, wherein the second pressure-sensitive resistor and the third pressure-sensitive resistor are arranged on the first plane and are parallel and spaced along the first direction; The second pressure-sensitive resistor module includes a first pressure-sensitive resistor and a fourth pressure-sensitive resistor, and the first pressure-sensitive resistor and the fourth pressure-sensitive resistor overlap with vertical projections of the second pressure-sensitive resistor and the third pressure-sensitive resistor on the second surface in a one-to-one correspondence; The first temperature-compensating resistor module includes a second temperature-compensating resistor and a third temperature-compensating resistor, the second temperature-compensating resistor and the third temperature-compensating resistor are arranged on the first plane and are spaced in parallel along the second direction, and the second temperature-compensating resistor and the third temperature-compensating resistor are spaced apart from the second pressure-sensitive resistor and the third pressure-sensitive resistor respectively; The second temperature-compensating resistor module includes a first temperature-compensating resistor and a fourth temperature-compensating resistor, and the first temperature-compensating resistor and the fourth temperature-compensating resistor overlap with vertical projections of the second temperature-compensating resistor and the third temperature-compensating resistor on the second surface in a one-to-one correspondence.

5. The electronic device according to claim 4, wherein: The first end of the first piezoresistor and the first end of the third piezoresistor are respectively connected to a power supply voltage; The second end of the first pressure-sensing resistor and the first end of the second pressure-sensing resistor are connected at a first node; The second end of the second piezoresistor and the second end of the fourth piezoresistor are grounded respectively; The second end of the third piezoresistor is connected to the first end of the fourth piezoresistor at a second node; The first end of the first temperature compensation resistor and the first end of the third temperature compensation resistor are respectively connected to the power supply voltage; The second end of the first temperature compensating resistor and the first end of the second temperature compensating resistor are connected at a third node; The second end of the second temperature compensation resistor and the second end of the fourth temperature compensation resistor are grounded respectively; The second end of the third temperature-compensating resistor is connected to the first end of the fourth temperature-compensating resistor at a fourth node; The charging circuit obtains a first differential voltage from the third node and obtains a second differential voltage from the fourth node.

6. The electronic device according to any one of claims 1 to 5, wherein: Also includes: Motherboard; A temperature detection circuit provided on the mainboard; The charging circuit also obtains temperature information of the temperature detection circuit, and calibrates the temperature information of the temperature compensation resistor according to the temperature information of the temperature detection circuit.

7. The electronic device according to claim 6, wherein: The temperature detection circuit is provided with a negative temperature coefficient NTC module.

8. The electronic device according to claim 7, wherein: The temperature detection circuit is an NTC module arranged inside the gyroscope.

9. The electronic device according to claim 5, wherein: Obtaining temperature information of the temperature compensation resistor includes: Monitoring a voltage change output by the temperature compensation resistor based on a temperature change of the housing by using the first differential voltage and the second differential voltage obtained; According to a preset voltage change-temperature change mapping relationship, converting the voltage change into a corresponding temperature change; The temperature information of the temperature compensation resistor is acquired according to the temperature change and the initial temperature of the temperature compensation resistor.

10. The electronic device according to claim 9, wherein: The mapping relationship is △T=k*△V, Among them, △T represents temperature change, k is a constant, and △V represents voltage change.

11. The electronic device according to claim 6, wherein: Calibrating the temperature information of the temperature compensation resistor according to the temperature information of the temperature detection circuit includes: According to a preset mapping relationship between the mainboard temperature and the housing temperature, the temperature information of the temperature detection circuit is converted into the temperature information of the housing; Comparing the temperature information of the temperature compensation resistor with the temperature information of the housing; When the temperature information of the housing is greater than the temperature information of the temperature compensation resistor, the temperature information of the temperature compensation resistor is updated to the temperature information of the housing.

12. The electronic device according to claim 11, wherein: The mapping relationship is T2=a*T1 2 +b*T1+c, Among them, T1 represents the mainboard temperature, T2 represents the shell temperature, and a, b, and c are constants.

13. The electronic device according to claim 1, wherein: Adjusting the charging power according to the temperature information of the temperature compensation resistor includes: When the temperature information of the temperature compensation resistor is not less than a preset temperature threshold, the first preset charging current for charging the electronic device is adjusted to a second preset charging current, and the second preset charging current is less than the first preset charging current.

14. The electronic device according to claim 13, wherein: Adjusting the charging power according to the temperature information of the temperature compensation resistor also includes: When the temperature information of the temperature compensation resistor is less than the preset temperature threshold, the electronic device is charged with the first preset charging current.

15. The electronic device according to claim 1, wherein: The button includes a power button or a volume button.

Images