Apparatus for slitting superconducting wire and slitting method using same

Abstract

The present invention relates to an apparatus for slitting superconducting wire and a slitting method using the apparatus, the apparatus comprising: a supply unit for supplying, onto a substrate, superconducting wire having a buffer layer, a superconducting layer, and a protective layer; and a slitting unit for slitting the superconducting wire supplied from the supply unit, the slitting unit slitting the superconducting wire by means of a slitting laser.

Description

Slitting device for superconducting wire and slitting method using the same

[0001] The present invention relates to a slitting device for superconducting wires and a slitting method using the same, and more particularly, to a slitting device for superconducting wires and a slitting method using the same, which can improve the performance of superconducting wires by reducing damage occurring during slitting of the superconducting wires.

[0002] Superconductors can conduct current without loss of power. For example, superconductors exhibit a property where their resistance becomes zero below a critical temperature. Due to this property, research and development are actively underway to commercialize superconductors in power devices such as cables, transformers, generators, current limiters, nuclear fusion devices, and motors, as well as in medical and biomedical applications such as magnetic resonance imaging (MRI) and nuclear magnetic resonance (NMR).

[0003] In particular, high-temperature superconductor (HTS) materials, which are oxide superconductors, provide a means to transport large amounts of current with extremely low losses at liquid nitrogen temperatures (77 K).

[0004] Superconducting wire is manufactured by forming a buffer layer composed of Al2O3, Y2O3, MgO, and LaMnO3 on a metal substrate made of Hastelloy or STS material, then forming a superconducting film, ReBaCuO layer, forming Ag to cover the entire surface of the wire, and finally plating with Cu.

[0005] In general, slitting of superconducting wires is performed using a mechanical slitting cutter, which may cause plastic deformation on the cut surface of the superconducting wire and cracks may occur inside the cut surface.

[0006] This can cause problems such as deterioration of the mechanical and electrical properties of the superconducting wire, which can ultimately lead to delamination of the superconducting wire and deterioration of the critical current.

[0007] Therefore, there is a need to improve this.

[0008] The background technology of the present invention is published in Korean Patent Publication No. 10-1593101, titled “Ceramic wire, method for manufacturing the same, and device for manufacturing the same.”

[0009] The present invention has been devised to improve the above-mentioned problems, and the purpose of the present invention is to provide a slitting device for superconducting wires and a slitting method using the same, which can improve the performance of superconducting wires by reducing damage occurring during slitting of the superconducting wires.

[0010] A slitting device for a superconducting wire according to the present invention includes a supply unit for supplying a superconducting wire having a buffer layer, a superconducting layer, and a protective layer formed on a substrate, and a slitting unit for slitting the superconducting wire supplied from the supply unit, and the slitting unit can slit the superconducting wire using a slitting laser.

[0011] The above supply unit may include a supply vacuum chamber in a vacuum state and an unwinding roller provided within the supply vacuum chamber and from which the superconducting wire is unwound.

[0012] The above slitting unit may include a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes, and the slitting laser may include a first slitting laser that forms a cutting groove in the superconducting wire and a second slitting laser that slits the superconducting wire within the cutting groove.

[0013] The above slitting unit may include a cooling block that cools the superconducting wire to prevent deformation due to heat generated during slitting of the superconducting wire by the slitting laser.

[0014] The above first slitting laser is formed with an ion beam, and the cutting groove formed by the first slitting laser can have both corners formed in a rounded shape.

[0015] The second slitting laser may be a femtosecond pulse laser that slits the center of the cutting groove formed by the first slitting laser.

[0016] The first slitting laser may be provided inside the slitting vacuum chamber, and the second slitting laser may be provided outside the slitting vacuum chamber.

[0017] The above slitting unit may include a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes, and the slitting laser may be a femtosecond pulse laser.

[0018] It includes a winding unit for winding each of the superconducting wires slit by the slitting unit, and the winding unit may include a winding vacuum chamber and a winding roller arranged vertically within the winding vacuum chamber for winding each of the slit superconducting wires.

[0019] The above-mentioned winding unit may include a coating unit that coats the superconducting wire within the above-mentioned winding vacuum chamber.

[0020] The above coating part can nitrogen coat the cut surface of the superconducting wire by filling the winding vacuum chamber with nitrogen.

[0021] A method for slitting a superconducting wire according to the present invention may include a supply step of supplying a superconducting wire having a buffer layer, a superconducting layer, and a protective layer formed on a substrate, and a slitting step of slitting the supplied superconducting wire using a slitting laser.

[0022] The above slitting step may include a first slitting step of removing the buffer layer and the superconducting layer on the substrate by a first slitting laser to form a cutting groove in the superconducting wire, and a second slitting step of cutting the substrate by a second slitting laser within the cutting groove.

[0023] The above first slitting laser is formed using an ion beam, and the cutting groove formed by the first slitting laser can have both corners formed in a rounded shape.

[0024] The second slitting laser is formed by a femtosecond pulse laser, and the second slitting step can slit the center of the cutting groove formed by the first slitting laser.

[0025] It includes a winding step of winding the superconducting wire slit by the slitting laser, and in the winding step, the slit superconducting wire can be wound on a vertically arranged winding roller.

[0026] The above superconducting wire can be supplied, slit and wound in a vacuum.

[0027] After the above winding step, a coating step of coating the cut surface of the slit superconducting wire can be further performed.

[0028] In the above coating step, after the winding of the superconducting wire is completed, nitrogen is filled into the winding vacuum chamber to coat the cut surface of the superconducting wire with nitrogen.

[0029] As described above, the slitting device for superconducting wire according to the present invention and the slitting method using the same can reduce damage to the superconducting wire and improve the performance of the superconducting wire by slitting the superconducting wire using a slitting laser.

[0030] In particular, by slitting the superconducting layer using a slitting laser, plastic deformation can be prevented, thereby maximizing the effective current transmission area.

[0031] The present invention comprises a first slitting laser formed of an ion beam and a second slitting laser formed of a femtosecond pulse laser, and a cutting groove is formed through melting by the first slitting laser and then slitted by the second slitting laser, thereby preventing the superconducting layer from being cut or only partially removed, thereby improving the performance of the superconducting wire.

[0032] The present invention comprises a supply vacuum chamber, a slitting vacuum chamber, and a winding vacuum chamber, so that all processes of supplying, slitting, and winding of a superconducting wire are performed in a vacuum state, thereby preventing corrosion of the cut surface of the superconducting wire due to moisture adhesion.

[0033] The present invention can maintain a pressure level when vacuum is broken by filling nitrogen from a nitrogen filling section after winding is completed in a winding vacuum chamber, and can prevent corrosion due to moisture adhesion, etc. even when exposed to the atmosphere by forming a nitrogen coating on the cut surface of a superconducting wire.

[0034] FIG. 1 is a drawing for explaining the structure of a superconducting wire according to one embodiment of the present invention.

[0035] FIG. 2 is a drawing for explaining the configuration of a slitting device for a superconducting wire according to one embodiment of the present invention.

[0036] FIG. 3 is a front view showing the formation of a cutting groove by a first slitting laser of a slitting device for a superconducting wire according to one embodiment of the present invention.

[0037] FIG. 4 is a cross-sectional side view showing the formation of a cutting groove by a first slitting laser of a slitting device for a superconducting wire according to one embodiment of the present invention.

[0038] FIG. 5 is a photograph showing a cutting groove by a first slitting laser of a slitting device for a superconducting wire according to one embodiment of the present invention.

[0039] FIG. 6 is a drawing for explaining a cutting process by a slitting unit of a slitting device for a superconducting wire according to one embodiment of the present invention.

[0040] FIG. 7 is a drawing for explaining a modified example of a slitting laser of a superconducting wire slitting device according to one embodiment of the present invention.

[0041] Figure 8 is a flow chart showing a method for slitting a superconducting wire according to one embodiment of the present invention.

[0042] Hereinafter, with reference to the attached drawings, preferred embodiments of a superconducting wire slitting device and a slitting method using the same according to the present invention will be described. In this process, the thickness of lines and the sizes of components depicted in the drawings may be exaggerated for clarity and convenience of explanation.

[0043] Additionally, the terms described below are defined based on their functions within the present invention, and their meanings may vary depending on the intent or custom of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification.

[0044] FIG. 1 is a drawing for explaining the structure of a superconducting wire according to an embodiment of the present invention, FIG. 2 is a drawing for explaining the configuration of a slitting device for a superconducting wire according to an embodiment of the present invention, FIG. 3 is a front view showing the formation of a cutting groove by a first slitting laser of a slitting device for a superconducting wire according to an embodiment of the present invention, FIG. 4 is a side cross-sectional view showing the formation of a cutting groove by a first slitting laser of a slitting device for a superconducting wire according to an embodiment of the present invention, FIG. 5 is a photograph showing the cutting groove by a first slitting laser of a slitting device for a superconducting wire according to an embodiment of the present invention, FIG. 6 is a drawing for explaining a cutting process by a slitting unit of a slitting device for a superconducting wire according to an embodiment of the present invention, FIG. 7 is a drawing for explaining a modified example of a slitting laser of a slitting device for a superconducting wire according to an embodiment of the present invention, and FIG. 8 is a drawing showing a slitting method for a superconducting wire according to an embodiment of the present invention. It's a flow chart.

[0045] Referring to FIGS. 1 to 7, a slitting device (100) for a superconducting wire (10) according to one embodiment of the present invention may include a supply unit (110) and a slitting unit (120).

[0046] The supply section (110) provides a superconducting wire (10), and is composed of a supply vacuum chamber (112) in a vacuum state and an unwinding roller (114) provided in the supply vacuum chamber (112) through which the superconducting wire (10) is unwound. The superconducting wire (10) is wound around the unwinding roller (114), and the superconducting wire (10) is sequentially unwound by the rotation of the unwinding roller (114) and provided to the slitting section (120).

[0047] At this time, the superconducting wire (10) provided from the supply unit (110) is provided with a protective layer (18) formed on both sides.

[0048] In more detail, referring to FIG. 1, a buffer layer (14) and a superconducting layer (16) are formed on a substrate (12), and a protective layer (18) formed so that Ag covers the entire surface can be provided in a state where it is formed only on both sides of a superconducting wire (10).

[0049] Since the supply vacuum chamber (112) is in a vacuum state, it can prevent the superconducting wire (10), which is weak to moisture, from corroding.

[0050] The slitting unit (120) slits the superconducting wire (10) supplied from the supply unit (110), and the superconducting wire (10) can be slit using a slitting laser (124).

[0051] Referring to FIG. 2, the slitting laser (124) may be composed of a first slitting laser (125) that forms a cutting groove (19) in a superconducting wire (10) and a second slitting laser (126) that slits the superconducting wire (10) within the cutting groove (19).

[0052] The first slitting laser (125) can remove the buffer layer (14) and the superconducting layer (16) on the substrate (12) to form a cutting groove (19) in the superconducting wire (10).

[0053] The slitting unit (120) may include a slitting vacuum chamber (122) through which the superconducting wire (10) supplied from the supply unit (110) passes. This allows the slitting of the superconducting wire (10) by the slitting laser (124) to be performed in a vacuum state, thereby protecting the superconducting wire (10) from moisture and preventing corrosion.

[0054] The first slitting laser (125) is formed with an ion beam, and the cutting groove (19) formed by the first slitting laser (125) can be formed with rounded corners on both sides.

[0055] As more specifically illustrated in FIGS. 3 and 4, the first slitting laser (125) includes ion milling, and ion milling can etch a material by accelerating ions of an inert gas (Argon) in the form of a wide beam to the surface of a superconducting wire (10) in a vacuum using a patterning mask (125a) having a slit (S) formed therein. That is, although the penetration depth is very small due to the first slitting laser (125) composed of an ion beam, energy is emitted simultaneously in a small range without scattering, so that the buffer layer (14) and the superconducting layer (16) on the substrate (12) can be rapidly melted, evaporated, and removed.

[0056] Accordingly, as shown in Fig. 5, a reverse shape is formed, and rounds can be formed at both corners.

[0057] A cooling block (125b) is provided at the bottom of the superconducting wire (10) to prevent deformation and damage due to heat generated during slitting by the first slitting laser (125).

[0058] As shown in Fig. 4, the cooling block (125b) is formed in a convex cross-sectional shape at the center when viewed in the direction of travel of the superconducting wire (10), thereby minimizing the contact area with the superconducting wire (10). This is to prevent damage to the superconducting wire (10) caused by the cooling block (125b) due to friction, etc.

[0059] It is preferable that this cooling block (125b) be made of copper material with excellent thermal conductivity.

[0060] The second slitting laser (126) is composed of a femtosecond pulse laser that slits the center of the cutting groove (19) formed by the first slitting laser (125).

[0061] Femtosecond laser technology is a laser system technology that generates pulses with an extremely short time width of one quadrillionth of a second.

[0062] When these femtosecond pulse lasers are used as slitting lasers, distortion caused by shock waves, debris on the surface, deterioration of surrounding materials due to heat, and occurrence of microcracks can be prevented.

[0063] According to the present embodiment, as shown in FIG. 6, a cutting groove (19) is formed by removing the buffer layer (14) and the superconducting layer (16) by the first slitting laser (124), and the substrate (12) is slit within the cutting groove (19) by the second slitting laser (126), so that the superconducting layer (16) is not cut off or only part of it is removed, thereby minimizing the loss of the superconducting layer (16), and thus maximizing the effective current transmission area.

[0064] The first slitting laser (125) is provided inside the slitting vacuum chamber (122), and the second slitting laser (126) is provided outside the slitting vacuum chamber (122). At this time, the slitting vacuum chamber (122) has a laser beam introduction portion (127) formed on one surface so that the laser of the second slitting laser (126) can be transmitted.

[0065] In this embodiment, the first slitting laser (125) is illustrated as ion milling, but it is not limited thereto, and the first slitting laser (125) may be formed as a general laser, provided outside the slitting vacuum chamber (122), and may be transmitted through the glass on the upper surface of the slitting vacuum chamber (122). That is, by reducing the amount of energy of the general laser, the buffer layer (14) and the superconducting layer (16) may be rapidly melted and evaporated to be removed.

[0066] At this time, the laser introduction part (127) of the slitting vacuum chamber (122) has an anti-reflection coating layer formed so that the general laser and the femtosecond pulse laser, which is the second slitting laser (126), can be transmitted into the slitting vacuum chamber (122).

[0067] The first slitting laser (125) and the second slitting laser (126) can be installed in multiple numbers in a direction perpendicular to the direction in which the superconducting wire (10) is traveling.

[0068] Each superconducting wire (10) slit by the slitting section (120) is wound by the winding section (130).

[0069] The winding unit (130) includes a winding vacuum chamber (132) and a winding roller (134) arranged vertically within the winding vacuum chamber (132) and winding each slit superconducting wire (10).

[0070] The slit superconducting wire (10) is wound in a vacuum state within a winding vacuum chamber (132), so it is protected from moisture and can prevent corrosion.

[0071] As described above, in this embodiment, the superconducting wire (10) can be supplied, slitted, and wound in a vacuum, so that it can be protected from moisture.

[0072] The slit superconducting wire (10) can be guided by a plurality of guide rollers.

[0073] The winding unit (130) may include a coating unit (140). The coating unit (140) coats the superconducting wire (10) within the winding vacuum chamber (132), and can coat the cut surface of the superconducting wire (10) with nitrogen by filling the winding vacuum chamber (132). This enables not only pressure leveling during vacuum release by filling nitrogen after winding of the superconducting wire (10) by the winding roller (134) is completed, but also nitrogen coating can be performed at once.

[0074] To explain this in detail, the coating unit (140) performs nitrogen coating by introducing high-purity (99.99% or more) nitrogen gas into the coiling vacuum chamber (132) through an MFC (Mass Flow Controller) for several minutes (5 to 10 minutes). The introduction of nitrogen gas can be repeated several times.

[0075] When nitrogen coating is completed, the vent valve (141) connected to the winding vacuum chamber (132) is opened so that the internal pressure of the winding vacuum chamber (132) matches the atmospheric pressure.

[0076] Due to this, the cut surface of the slit superconducting wire (10) is coated with nitrogen, thereby protecting the superconducting wire (10) from oxidation by oxygen and corrosion due to moisture adhesion when exposed to the atmosphere.

[0077] As illustrated in FIG. 7, in a modification of the slitting laser (124) of the slitting device (100) of a superconducting wire (10) according to one embodiment of the present invention, the slitting laser (124) may be a femtosecond pulse laser. That is, the slitting laser (124) may be configured as a single femtosecond pulse laser provided on the outside of the slitting vacuum chamber (122). As described above, the femtosecond pulse laser may slit the superconducting wire (10) passing through the inside of the slitting vacuum chamber (122) by transmitting the laser through the laser beam introduction portion (127) formed on one surface of the slitting vacuum chamber (122).

[0078] Hereinafter, a slitting method using a slitting device for a superconducting wire according to one embodiment of the present invention will be described.

[0079] Referring to FIG. 8, a slitting method using a slitting device (100) of a superconducting wire (10) according to one embodiment of the present invention includes a supply step (S100) and a slitting step (S200).

[0080] The supply step (S100) provides a superconducting wire (10) from a supply unit (110). The superconducting wire (10) is wound around a winding roller (114), and the superconducting wire (10) is sequentially drawn out and supplied to a slitting unit (120).

[0081] At this time, the superconducting wire (10) can be provided in a state where a buffer layer (14) and a superconducting layer (16) are formed on a rolled substrate (12), and a protective layer (18) formed so that Ag covers the entire surface is formed only on both sides of the superconducting wire (10).

[0082] The buffer layer (14) is formed by sequentially depositing an Al2O3 diffusion barrier layer on a metal substrate (12) made of Hastelloy or STS material after treating the surface using the above-described electrolytic polishing process, depositing a Y2O3 seed layer on top, and depositing MgO and LaMnO3 layers.

[0083] The superconducting layer (16) is formed by depositing a ReBaCuO layer, which is a superconducting film.

[0084] After forming the buffer layer (14) and the superconducting layer (16) on the front surface of the substrate (12) in this way, the first protective layer (18) is formed. The first protective layer (18) can be supplied to the slitting unit (120) in a state in which Ag is deposited to cover both sides of the substrate (12) in order to protect the ReBaCuO superconducting metal oxide containing a rare earth material.

[0085] The discharge roller (114) is provided within the supply vacuum chamber (112). Therefore, since the superconducting wire (10) is supplied in a vacuum state, corrosion of the superconducting wire (10), which is weak to moisture, can be prevented.

[0086] The slitting step (S200) is to slit the superconducting wire (10) supplied from the supply unit (110) by a slitting laser (124), and may be composed of a first slitting step (S210) of removing the buffer layer (14), the superconducting layer (16), and the protective layer (18) on the substrate (12) by a first slitting laser (125) to form a cutting groove (19) in the superconducting wire (10), and a second slitting step (S220) of slitting the substrate (12) within the cutting groove (19) by a second slitting laser (126).

[0087] The first slitting laser (125) is composed of an ion beam, and the second slitting laser (126) is composed of a femtosecond pulse laser. The first slitting laser (125) is provided within the slitting vacuum chamber (122), and the second slitting laser (126) is provided outside the slitting vacuum chamber (122).

[0088] Accordingly, the buffer layer (14) and the superconducting layer (16) can be rapidly melted and evaporated and removed by using a patterning mask (125a) to rapidly melt and evaporate ions of an inert gas (Argon) onto the surface of the superconducting wire (10) in a vacuum state using a first slitting laser (125) composed of an ion beam (S210).

[0089] By means of this first slitting laser (125), both corners can be formed in a rounded shape in a reversed manner as shown in Fig. 5. This minimizes the loss of the superconducting layer (16), prevents sharp edges from forming at the cut edges, and prevents cracks from forming inside, thereby maximizing the effective current transmission area and improving the mechanical and electrical performance of the superconducting wire (10).

[0090] Thereafter, a second slitting laser (126) formed of a femtosecond pulse laser is transmitted into the slitting vacuum chamber (122) through the laser beam introduction portion (127) to slit the center of the cutting groove (19) formed by the first slitting laser (125) (S220).

[0091] By using the second slitting laser (126), distortion caused by shock waves, debris on the surface, deterioration of surrounding materials due to heat, and occurrence of micro-cracks can be prevented, thereby forming a cut surface without plastic deformation.

[0092] This slitting step (S200) is also performed within a slitting vacuum chamber (122), so that the superconducting wire (10) can be protected from moisture in the air, thereby preventing corrosion of the cut surface.

[0093] As a modified example of the present embodiment, as illustrated in FIG. 7, the slitting laser (224) of the slitting step (S200) may be formed by a single slitting laser (224) that transmits a laser beam into the interior through the laser beam introduction portion (127) of the slitting vacuum chamber (122). At this time, the slitting laser (224) is formed by a femtosecond pulse laser, so that the superconducting wire (10) can be slit to a certain size without cracks around the cutting surface.

[0094] Afterwards, a winding step (S300) is performed to wind the superconducting wire (10) slit by the slitting laser (124, 224). The winding step (S300) is performed in which the slit superconducting wire (10) is wound on a vertically arranged winding roller (134), and the superconducting wire (10) supplied in a wide width can be slit into multiple pieces and wound on each of the vertically arranged winding rollers (134).

[0095] At this time, the winding step (S300) is wound in a vacuum state within the winding vacuum chamber (132), so the superconducting wire (10) can be protected from moisture in the air.

[0096] That is, the superconducting wire (10) can be protected from moisture in the air because all processes of supply (S100), slitting (S200), and winding (S300) are carried out in a vacuum.

[0097] After the winding step (S300), a coating step (S400) is further performed to coat the cut surface of the slit superconducting wire (10). The coating step (S400) coats the superconducting wire (10) inside the winding vacuum chamber (132). After the winding of the superconducting wire (10) is completed, nitrogen is filled inside the winding vacuum chamber (132) to coat the cut surface of the superconducting wire (10) with nitrogen.

[0098] This coating step (S400) enables the vacuum pressure level of the vacuum chamber (132) in a vacuum state to be leveled, and coating of the cut surface of the superconducting wire (10) can be performed in one process.

[0099] This coating unit (140) can perform nitrogen coating by introducing high-purity (99.99% or more) nitrogen gas into the coiling vacuum chamber (132) through an MFC (Mass Flow Controller) for several minutes (5 to 10 minutes).

[0100] As a result, the cut surface of the superconducting wire (10) is coated with nitrogen, thereby preventing oxidation by oxygen and corrosion by moisture when exposed to the atmosphere.

[0101] Afterwards, when nitrogen coating is completed, the vent valve (141) connected to the winding vacuum chamber (132) is opened to match the internal pressure of the winding vacuum chamber (132) with the atmospheric pressure.

[0102] As described above, according to the present invention, by slitting the superconducting wire using a slitting laser, plastic deformation of the superconducting wire can be prevented, thereby maintaining the effective current transmission area to the maximum extent possible.

[0103] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

[0104] Therefore, the true technical protection scope of the present invention should be determined by the patent claims.

Claims

1. A supply unit that supplies a superconducting wire having a buffer layer, a superconducting layer, and a protective layer formed on a substrate; It includes a slitting unit that slits the superconducting wire supplied from the supply unit; A slitting device for superconducting wire, characterized in that the above slitting unit slits the superconducting wire using a slitting laser.

2. In paragraph 1, The above supply unit is a supply vacuum chamber in a vacuum state; and A slitting device for a superconducting wire, characterized in that it includes an unwinding roller provided in the supply vacuum chamber and from which the superconducting wire is unwound.

3. In paragraph 1 The above slitting unit includes a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes; The above slitting laser is a first slitting laser that forms a cutting groove in the superconducting wire; and A slitting device for a superconducting wire, characterized in that it includes a second slitting laser that slits the superconducting wire within the cutting groove.

4. In paragraph 1, A slitting device for a superconducting wire, characterized in that the slitting unit includes a cooling block that cools the superconducting wire to prevent deformation due to heat generated during slitting of the superconducting wire by the slitting laser.

5. In paragraph 3, The above first slitting laser is composed of an ion beam, A slitting device for a superconducting wire, characterized in that the cutting groove formed by the first slitting laser has both corners formed in a rounded shape.

6. In paragraph 3, A slitting device for a superconducting wire, characterized in that the second slitting laser is a femtosecond pulse laser that slits the center of the cutting groove formed by the first slitting laser.

7. In paragraph 3, A superconducting wire slitting device characterized in that the first slitting laser is provided inside the slitting vacuum chamber, and the second slitting laser is provided outside the slitting vacuum chamber.

8. In paragraph 1, The above slitting unit includes a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes; A superconducting wire slitting device characterized in that the above slitting laser is a femtosecond pulse laser.

9. In paragraph 1, It includes a winding unit for winding each of the superconducting wires slit by the slitting unit; The above winding part comprises a winding vacuum chamber; and A superconducting wire slitting device characterized by including a winding roller arranged vertically within the above winding vacuum chamber and winding each slit superconducting wire.

10. In paragraph 9, A slitting device for a superconducting wire, characterized in that the winding unit includes a coating unit that coats the superconducting wire within the winding vacuum chamber.

11. In paragraph 10, A slitting device for a superconducting wire, characterized in that the coating unit fills the winding vacuum chamber with nitrogen to nitrogen-coat the cut surface of the superconducting wire.

12. A supply step for supplying a superconducting wire having a buffer layer, a superconducting layer, and a protective layer formed on a substrate; and A superconducting wire slitting method characterized by including a slitting step of slitting the supplied superconducting wire using a slitting laser.

13. In paragraph 12, The above slitting step is a first slitting step of removing the buffer layer and the superconducting layer on the substrate by a first slitting laser to form a cutting groove in the superconducting wire; and A method for slitting a superconducting wire, characterized in that it includes a second slitting step of cutting the substrate by a second slitting laser within the cutting groove.

14. In paragraph 13, The above first slitting laser is composed of an ion beam, A method for slitting a superconducting wire, characterized in that the cutting groove formed by the first slitting laser has both corners formed in a rounded shape.

15. In paragraph 13, The above second slitting laser is composed of a femtosecond pulse laser, A method for slitting a superconducting wire, characterized in that the second slitting step slits the center of the cutting groove formed by the first slitting laser.

16. In paragraph 12, A winding step for winding the superconducting wire slit by the slitting laser is included; A method for slitting a superconducting wire, characterized in that the above-mentioned winding step winds the slit superconducting wire onto a vertically arranged winding roller.

17. In paragraph 16, A method for slitting a superconducting wire, characterized in that the superconducting wire is supplied, slit, and wound in a vacuum state.

18. In paragraph 16, A method for slitting a superconducting wire, characterized in that a coating step of coating the cut surface of the slit superconducting wire is further performed after the above winding step.

19. In paragraph 18, A method for slitting a superconducting wire, characterized in that the above coating step is performed by filling a winding vacuum chamber with nitrogen after winding of the superconducting wire is completed to nitrogen-coat the cut surface of the superconducting wire.

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