Circuit board structure coupled through connector and electronic device including same

Abstract

Disclosed is a circuit board structure including a first circuit board and a second circuit board coupled through a first coupling member and a second coupling member. The circuit board structure may include openings which extend between the first circuit board and the second circuit board, and are configured to accommodate the plurality of coupling members. The coupling members may be configured to provide an electrical connection between the first coupling member and the second coupling member.

Description

Circuit board structure joined through a connector and electronic device including the same

[0001] Embodiments disclosed in this document relate to a substrate structure coupled through a connector and an electronic device including the same.

[0002] Electronic devices include various components. Typically, various electronic components may be mounted on a circuit board. For example, the circuit board may include a printed circuit board including a pattern of electrical paths. As electronic devices become smaller, the internal space of the electronic devices may be reduced. To accommodate this reduction in internal space, a laminated circuit board structure may be utilized. For example, the laminated circuit board structure may include a printed board assembly. Typically, the laminated circuit board structure may include an interposer positioned between an upper substrate and a lower substrate and physically connected to the upper substrate and the lower substrate through soldering.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] A circuit board structure according to one embodiment disclosed in the present document may include a first circuit board including a first surface, and a second circuit board including a second surface facing the first surface. The circuit board structure may include a plurality of first coupling members coupled to the first surface and a plurality of second coupling members coupled to the second surface and configured to be physically coupled with the plurality of first coupling members. The circuit board structure may include a frame extending between the first surface and the second surface and including a plurality of openings configured to accommodate the plurality of first coupling members and the plurality of second coupling members. The plurality of first coupling members and the plurality of second coupling members may be configured to provide an electrical connection between the first circuit board and the second circuit board.

[0005] An electronic device according to an embodiment disclosed in this document may include a circuit board structure according to embodiments of the present disclosure.

[0006] FIG. 1A is a front perspective view of an electronic device in an unfolded state according to one embodiment.

[0007] FIG. 1b is a rear view of an electronic device in an unfolded state according to one embodiment.

[0008] FIG. 1c is a perspective view of an electronic device in a folded state according to one embodiment.

[0009] FIG. 1d is an exploded perspective view of an electronic device according to one embodiment.

[0010] FIG. 2a is a front view of a circuit board structure according to one embodiment.

[0011] FIG. 2b is an exploded perspective view of a circuit board structure according to one embodiment.

[0012] FIG. 3A is a front view of a first circuit board according to one embodiment.

[0013] FIG. 3b is a front view of a second circuit board according to one embodiment.

[0014] Figure 4 illustrates a connector according to one embodiment.

[0015] FIG. 5 is a cross-sectional view of a circuit board structure according to one embodiment.

[0016] FIG. 6A is a cross-sectional view of a circuit board structure including a shielding member according to one embodiment.

[0017] Figure 6b illustrates a shielding member according to one embodiment.

[0018] Figure 6c illustrates a shielding member according to one embodiment.

[0019] FIG. 6d illustrates a shielding member according to one embodiment.

[0020] FIG. 7 illustrates a circuit board structure including a connecting member according to one embodiment.

[0021] Figure 8a illustrates a joint structure of a connecting member according to one embodiment.

[0022] Figure 8b illustrates a joint structure of a connecting member according to one embodiment.

[0023] Figure 9 illustrates a frame according to one embodiment.

[0024] Figure 10 is an exploded perspective view of a circuit board structure according to one embodiment.

[0025] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments.

[0026] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0027] Hereinafter, various embodiments of the present invention will be described with reference to the attached drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the present invention encompasses various modifications, equivalents, and / or alternatives of the embodiments.

[0028] FIG. 1A is a front perspective view of an electronic device in an unfolded state according to one embodiment. FIG. 1B is a rear perspective view of an electronic device in an unfolded state according to one embodiment. FIG. 1C is a perspective view of an electronic device in a folded state according to one embodiment.

[0029] Referring to FIGS. 1A, 1B, and 1C, according to one embodiment, an electronic device (100) (e.g., electronic device (1101) of FIG. 11) may be a foldable device in which at least a portion of a housing (110) may be foldable. The electronic device (100) may be folded about a folding axis A. An unfolded state may be referred to as an open state or a flat state. For example, an unfolded state may include a case where an angle between a first side member (111) and a second side member (112) is greater than or equal to a specified angle (e.g., about 120 degrees). A folded state may be referred to as a closed state. For example, a folded state may include a case where an angle between a first side member (111) and a second side member (112) is less than a specified angle (e.g., about 60 degrees).

[0030] Referring to FIGS. 1A and 1B , an electronic device (100) according to an embodiment (e.g., the electronic device (1101) of FIG. 11 ) may include a housing (110) that includes a first side (or front side) (e.g., a side facing the +Z direction), a second side (or rear side) (e.g., a side facing the -Z direction), and a third side (or side side) surrounding a space between the first side and the second side. For example, the housing (110) of the electronic device (100) may include a front plate (115), a side member, and a rear plate. The side member may include a first side member (111) and a second side member (112) that are distinguished based on a folding axis A. The rear plate may include a first rear plate (113) and a second rear plate (114) that are distinguished based on the folding axis A. For example, the housing (110) may include a first housing and a second housing that are distinguished based on the folding axis A. For example, the first housing may include a portion of a front plate (115) (e.g., a front plate (115) positioned in the +Y direction with respect to the folding axis A), a first side member (111), and a first rear plate (113). For example, the second housing may include a portion of a front plate (115) (e.g., a front plate (115) positioned in the -Y direction with respect to the folding axis A), a second side member (112), and a second rear plate (114). A hinge structure (e.g., a hinge structure (180) of FIG. 1D) may be arranged between the first housing and the second housing. The hinge structure may include any structure that allows the housing (110) to be folded or unfolded about the folding axis A.

[0031] The front plate (115) may be disposed on the first display (160) and may form at least a portion of the front of the electronic device (100). For example, the front plate (115) may be referred to as a glass plate, a glass layer, or a polymer plate. The first back plate (113) and the second back plate (114) may form at least a portion of the back of the electronic device. For example, the first back plate (113) and the second back plate (114) may include coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, or any alloy), or a combination of at least two of the foregoing materials. The first side member (111) and the second side member (112) may form at least a portion of the side of the electronic device. For example, the first side member (111) and the second side member (112) may be coupled to the first back plate (113) and the second back plate (114), respectively. For example, the first side member (111) and the second side member (112) may include a metallic material (e.g., a conductive material) and / or a non-conductive material (e.g., a polymer). In one example, the first rear plate (113) and the first side member (111) may be formed integrally, and the second rear plate (114) and the second side member (112) may be formed integrally.

[0032] In one embodiment, the electronic device (100) may include at least one of a first display (160), a second display (165), a camera module (181, 182, 183) (e.g., the camera module (1180) of FIG. 11), a key input device (117) (e.g., the interface (1177) of FIG. 11), a light emitting element (184), a speaker hole (107), a microphone hole (103), a sensor circuit (185), and a connector hole (108) (e.g., the interface (1177) of FIG. 11). For example, the electronic device (100) may omit at least one of the above components or may additionally include another component.

[0033] Referring to FIGS. 1A and 1B , the electronic device (100) may include a first display (160) arranged to face the front side (e.g., the side facing the +Z direction) of the electronic device (100) in an unfolded state. The first display (160) may be visible from the outside through at least a portion of the front plate (115). For example, the first display (160) may be arranged on the back side (e.g., the side facing the -Z direction) of the front plate (115). In one example, the front plate (115) may be included in the first display (160). In one example, the first display (160) may include a touch detection circuit, a pressure sensor, and / or a digitizer. In one example, the first display (160) may include a first display area (161) and a second display area (162) that may be distinguished by a folding axis A or a folding area (FA). The folding area (FA) may be referred to as the display area of ​​the first display (160) adjacent to the folding axis A.

[0034] In one example, at least one of an audio module (not shown), a sensor circuit (185), a first camera module (181), and / or a light-emitting element (not shown) may be arranged on the back of the display (160). The sensor circuit (185) may be configured to detect external information (e.g., illuminance and / or proximity) of the electronic device (100) through an area of ​​the first display (160). The first camera module (181) may be configured to receive light through an area of ​​the display (160) and acquire an image based on the received light.

[0035] The positions and numbers of the microphone holes (103) and speaker holes (107) illustrated in FIGS. 1A and 1C are merely examples, and embodiments of the present disclosure are not limited thereto. In one embodiment, the speaker hole (107) may include a receiver hole (not shown) for calls.

[0036] Referring to FIG. 1C, the electronic device (100) may include a second display (165) arranged to face the front side (e.g., the side facing the +Z direction) of the electronic device (100) in a folded state. The second display (165) may be arranged on at least a portion of the first rear plate (113). In one example, the second display (165) may include a touch sensing circuit, a pressure sensor, and / or a digitizer.

[0037] Referring to FIG. 1C, the electronic device (100) may include a second camera module (182) and / or a third camera module (183) positioned to face the front of the electronic device (100) in a folded state. The second camera module (182) and the third camera module (183) may have, for example, different fields of view (FOV), zoom ratios, or functions. The electronic device (100) may include a light-emitting element (184) positioned to face the front of the electronic device (100) in a folded state. In the examples of FIGS. 1B and 1C, two camera modules are illustrated on the first rear plate (113), but embodiments of the present disclosure are not limited thereto. The electronic device (100) may include one or more camera modules positioned on the first rear plate (113).

[0038] Although not shown in FIGS. 1A to 1C, the electronic device (100) may be configured to have an intermediate state between the folded state and the unfolded state. For example, the intermediate state may be referred to as a flex state. The mode of the electronic device (100) in the intermediate state may be referred to as a table mode or a flex mode. In the intermediate state, the angle between the first side member (111) and the second side member (112) may be within a specified range (e.g., about 60 degrees or more and less than about 120 degrees).

[0039] In the examples of FIGS. 1A, 1B, and 1C, the electronic device (100) is illustrated as an infold device in which the first displays (160) are folded so that they face each other in a folded state. However, embodiments of the present disclosure are not limited thereto. For example, the electronic device (100) may be an outfold device in which the first displays (160) are folded so that they face outward in a folded state.

[0040] FIG. 1d is an exploded perspective view of an electronic device according to one embodiment.

[0041] Referring to FIG. 1D, an electronic device (100) according to an embodiment may include a first display (161), a first side member (111), a second side member (112), a first rear plate (113), and a second rear plate (114). For example, at least a portion of the first display (161), the first side member (111), the second side member (112), the first rear plate (113), and the second rear plate (114) may form an exterior of the electronic device (100).

[0042] In one example, the first side member (111) may be coupled to or include the first support member (141). The first support member (141) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (141) may be coupled to the first side member (111) forming the exterior of the electronic device (100), and may be referred to as at least a portion of the first side member (111) that is not visible from the exterior of the electronic device (100). The first support member (141) may be configured to support components within the electronic device (100). For example, a first display (160) may be coupled to a first surface (e.g., a surface facing the +Z direction) of a first support member (141), and at least one of a first circuit board (151) and a first battery (188) may be disposed on a second surface (e.g., a surface facing the -Z direction) of the first support member (141).

[0043] In one example, the second side member (112) may be coupled to or include the second support member (142). The second support member (142) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. The second support member (142) may be coupled to the second side member (112) forming the exterior of the electronic device (100) and may be referred to as at least a portion of the second side member (112) that is not visible from the exterior of the electronic device (100). The second support member (142) may be configured to support components within the electronic device (100). For example, a first display (160) may be coupled to a first surface (e.g., a surface facing the +Z direction) of a second support member (142), and at least one of a second circuit board (152) and a second battery (189) may be disposed on a second surface (e.g., a surface facing the -Z direction) of a second support member (142).

[0044] The electronic device (100) may include a hinge structure (180). For example, the hinge structure (180) may be physically coupled to a first side member (111) (e.g., a first support member (141)) and a second side member (112) (e.g., a second support member (142)). The hinge structure (180) may be configured to fold about at least one folding axis. For example, the first side member (111) and the second side member (112) may be folded or unfolded about the hinge structure (180).

[0045] The electronic device (100) may include a first printed circuit board (151) and a second printed circuit board (152). The first printed circuit board (151) and the second printed circuit board (152) may be electrically connected via a connecting member (153). In one embodiment, the first printed circuit board (151) and / or the second printed circuit board (152) may be equipped with a processor (e.g., a processor (1120) of FIG. 11), a memory (e.g., a memory (1130) of FIG. 11), and / or an interface. Various components of the electronic device (100) may be mounted on the first printed circuit board (151) or the second printed circuit board (152). For example, at least some of the components of the electronic device (1101) described below with reference to FIG. 11 may be mounted on at least one of the first printed circuit board (151) or the second printed circuit board (152).

[0046] The electronic device (100) may include at least one antenna and / or antenna module for transmitting and receiving wireless signals. For example, the electronic device (100) may include an antenna corresponding to at least a portion of the first side member (111) and / or the second side member (112). For example, the electronic device (100) may include a rear substrate (192). The rear substrate (192) may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the electronic device (100) may include an antenna module (191). The antenna module (191) may be configured to transmit and receive signals in a new radio 2 (NR2) frequency band.

[0047] The electronic device (100) may include at least one battery (e.g., a first battery (188) and / or a second battery (189)). The at least one battery may supply power to at least one component of the electronic device (100). The at least one battery may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The first battery (188) and / or the second battery (189) may be integrally disposed within the electronic device (100), or may be detachably disposed with the electronic device (100).

[0048] FIG. 2a is a front view of a circuit board structure according to one embodiment.

[0049] FIG. 2b is an exploded perspective view of a circuit board structure according to one embodiment.

[0050] Referring to FIGS. 2A and 2B, according to one embodiment, the circuit board structure (200) may include a first circuit board (210) and a second circuit board (220). For example, the second circuit board (220) may be laminated on at least a portion of the first circuit board (210). The first circuit board (210) and the second circuit board (220) may be configured to be detachable.

[0051] For example, the circuit board structure (200) may be referred to as a printed board assembly or a laminated circuit board structure. In one example, the circuit board structure (200) may be included in an electronic device (e.g., the electronic device (100) of FIGS. 1A to 1D). The circuit board structure (200) may correspond to the first printed circuit board (151) or the second printed circuit board (152) of FIG. 1D.

[0052] A first circuit board (210) may include first bonding members (e.g., a first bonding member (330) of FIG. 3A) disposed on a first surface (e.g., a surface facing the -Z direction or a surface facing the second circuit board (220). The first circuit board (210) may include a first frame (230) disposed on the first surface. The first frame (230) may include a plurality of openings (270) configured to accommodate the first bonding members. For example, a first component (250) may be disposed on the first surface of the first circuit board (210). The first component (250) may include any electrical component (e.g., a power management integrated circuit (PMIC), an application processor (AP), a transceiver, a communication processor (CP), memory, and / or at least one chip) electrically connected to the first circuit board (210). The configuration of the first circuit board (210) may be described below with reference to FIG. 3A.

[0053] The second circuit board (220) may include second joining members (not shown) arranged on a second surface (e.g., a surface facing the +Z direction or a surface facing the first circuit board (210). The second circuit board (220) may include a second frame (240) arranged on the second surface. The second frame (240) may include a plurality of openings configured to accommodate the second joining members (not shown). For example, a second component (not shown) may be arranged on the second surface of the second circuit board (220). The second component (not shown) may include any electrical component (e.g., a PMIC, an AP, a transceiver, a CP, a memory, and / or at least one chip) electrically connected to the second circuit board (220). The configuration of the second circuit board (220) may be described below with reference to FIG. 3B.

[0054] In the example of FIG. 2B, the frames (230, 240) and the connecting members are described as separate structures; however, embodiments of the present disclosure are not limited thereto. For example, the frame may include a connecting member. For example, the first frame (230) may be formed integrally with the first connecting member.

[0055] FIG. 3A is a front view of a first circuit board according to one embodiment.

[0056] Referring to FIG. 3A, according to one embodiment, the first circuit board (210) may include a first frame (230) disposed on a first surface. The first frame (230) may include a plurality of openings (270). At least some of the plurality of openings (270) may be configured to receive a first coupling member (330). The plurality of openings (270) may be formed such that the first coupling member (330) is secured to the first surface of the first circuit board (210). For example, when the first surface is viewed from above, each of the plurality of openings (270) may include a wall that surrounds at least a portion of the periphery of the first coupling members (330) and protrudes in a direction perpendicular to the first surface.

[0057] An internal space (300) may be formed in the first circuit board (210). The internal space (300) may be referred to as a space surrounded by the first surface of the first circuit board (210) and the first frame (230). For example, at least a portion of the internal space (300) may be surrounded by an inner wall of the first frame (230) (e.g., a wall of the first frame (230) adjacent to the internal space (300). The first frame (230) may include an inner wall formed along the perimeter of the internal space (300). At least a portion of an outer wall of the first frame (230) (e.g., a surface formed adjacent to the exterior of the first circuit board (210) on the first surface) may be omitted from the first frame (230). The shape of the first frame (230) illustrated in FIG. 3A is an example, and embodiments of the present disclosure are not limited thereto. For example, at least some of the plurality of openings (270) may be omitted from the first frame (230).

[0058] In one example, the first frame (230) may include at least one coupling hole (310). The coupling hole (310) may include a connecting member (311) configured to couple the first frame (230) to the first circuit board (210). For example, the connecting member (311) may physically couple the first frame (230) to the first circuit board (210). The connecting member (311) may include, for example, a screw, a rivet, and / or a coupler.

[0059] In one example, the first frame (230) may be coupled to the first circuit board (210) through soldering. The first frame (230) may be coupled to the first circuit board (210) through, for example, SMD (surface mounting device) soldering. In one example, the first bonding member (330) may be coupled to the first circuit board (210) through SMD soldering. The plurality of first bonding members (330) may be self-aligned on the first circuit board (210) through a reflow process. When the plurality of first bonding members (330) are soldered, a tolerance may be generated in the bonding positions of the plurality of first bonding members (330). In one example, the first frame (230) may be used as a guide for the first bonding members (330). The openings (270) of the first frame (230) can guide the coupling positions of the first coupling members (330) by surrounding at least a portion of the periphery of the first coupling members (330). By using the first frame (230), the tolerance for the coupling positions of the first coupling members (330) can be reduced.

[0060] In one example, the first frame (230) may include first joining members (330). The first frame (230) may be formed integrally with the first joining members (330). Through soldering, the first frame (230) including the first joining members (330) may be joined to the first substrate (210).

[0061] FIG. 3b is a front view of a second circuit board according to one embodiment.

[0062] Referring to FIG. 3B, according to one embodiment, the second circuit board (220) may include a second frame (240) disposed on the second surface. The second frame (240) may include a plurality of openings (280). At least some of the plurality of openings (280) may be configured to receive a second coupling member (340). The plurality of openings (280) may be formed such that the second coupling member (340) is secured to the second surface of the second circuit board (220). For example, when the second surface is viewed from above, each of the plurality of openings (280) may include a wall that surrounds at least a portion of the periphery of the second coupling members (340) and protrudes in a direction perpendicular to the second surface.

[0063] An internal space (300) may be formed in the second circuit board (220). The internal space (300) may be referred to as a space surrounded by the second surface of the second circuit board (220) and the second frame (240). For example, at least a portion of the internal space (300) may be surrounded by an inner wall of the second frame (240) (e.g., a wall of the second frame (240) adjacent to the internal space (300). The second frame (240) may include an inner wall formed along the perimeter of the internal space (300). At least a portion of an outer wall of the second frame (240) (e.g., a surface formed adjacent to the exterior of the second circuit board (220) on the second surface) may be omitted from the second frame (240). The shape of the second frame (240) illustrated in FIG. 3B is an example, and embodiments of the present disclosure are not limited thereto. For example, at least some of the plurality of openings (280) may be omitted from the second frame (240).

[0064] In one example, the second frame (240) may include at least one coupling hole (320). The coupling hole (320) may include a connecting member (e.g., connecting member (311) of FIG. 3A) configured to couple the second frame (240) to the second circuit board (220). For example, the connecting member may physically couple the second frame (240) to the second circuit board (220). The connecting member may include, for example, a screw, a rivet, and / or a coupler.

[0065] In one example, the second frame (240) can be coupled to the second circuit board (220) through soldering. The second frame (240) can be coupled to the second circuit board (220) through, for example, SMD soldering. In one example, the second bonding member (340) can be coupled to the second circuit board (220) through SMD soldering. A plurality of second bonding members (340) can be self-aligned on the second circuit board (220) through a reflow process. In one example, the second frame (240) can be used as a guide for the second bonding members (340). The openings (280) of the second frame (240) can guide the bonding positions for the second bonding members (340) by surrounding at least a portion of the periphery of the second bonding members (340). By using the second frame (240), the tolerance for the joining position of the second joining members (340) can be reduced.

[0066] In one example, the second frame (240) may include second joining members (340). The second frame (240) may be formed integrally with the second joining members (340). Through soldering, the second frame (240) including the second joining members (340) may be joined to the second substrate (220).

[0067] Referring to FIGS. 2A to 3B, according to one embodiment, a first circuit board (210) and a second circuit board (220) may be physically coupled through a first coupling member (330) and a second coupling member (340). The first coupling member (330) and the second coupling member (340) may include connectors (e.g., Board-to-Board connectors) that are configured to be detachable from each other. For example, the first coupling member (330) may include a connector of a first gender, and the second coupling member (340) may include a connector of a second gender. Since the first circuit board (210) and the second circuit board (220) are coupled through the connectors, repair of the circuit board structure (200) may be facilitated. For example, repair and / or replacement of only the first circuit board (210) or only the second circuit board (220) may be performed.

[0068] The first circuit board (210) and the second circuit board (220) may be electrically connected through a first coupling member (330) and a second coupling member (340). The first coupling member (330) may include a plurality of first pins electrically connected to the first circuit board (210). The second coupling member (340) may include a plurality of second pins electrically connected to the second circuit board (220). When the first coupling member (330) and the second coupling member (340) are coupled, the plurality of first pins and the plurality of second pins may be electrically connected.

[0069] When the first circuit board (210) and the second circuit board (220) are joined using the first joining member (330) and the second joining member (340), the first frame (230) and the second frame (240) can be in physical contact. The first frame (230) and the second frame (240) can form, for example, one frame. The frame can extend between the first surface of the first circuit board (210) and the second surface of the second circuit board (220). In one example, the first frame (230) and the second frame (240) can include a guide structure for guiding the joining. The second frame (240) can include, for example, a protrusion formed on a surface facing the first frame (230). The second frame (230) may be formed on a surface facing the second frame (240) and may include a groove set to accommodate a protrusion of the second frame (240).

[0070] In one embodiment, the first frame (230) and the second frame (240) may be configured to provide shielding for an internal space (300). The internal space (300) may be referred to as a space surrounded by a first surface of the first circuit board (210), a second surface of the second circuit board (220), the first frame (230), and the second frame (240). For example, at least a portion of the first frame (230) and the second frame (240) may be formed of a conductive material, and at least a portion of the conductive material may be electrically connected to a ground region of the circuit board structure (200). The first frame (230) and the second frame (240) may be configured to provide electrical and / or magnetic shielding for components (e.g., 250, 260) located in the internal space.

[0071] In one embodiment, the circuit board structure (200) may include a conductive member disposed on at least a portion of a surface facing the internal space (300) of the first frame (230) and the second frame (240). For example, the conductive member may be formed through plating on at least a portion of a surface facing the internal space (300) of the first frame (230) and the second frame (240). At least a portion of the conductive member may be electrically connected to a ground region of the circuit board structure (200). The conductive member may be configured to provide electrical and / or magnetic shielding for components positioned in the internal space (300).

[0072] In one embodiment, as described below with respect to FIGS. 6A-6D , the circuit board structure (200) may further include a separate shielding member. The circuit board structure (200) may include the shielding member disposed adjacent to at least a portion of a surface of the first frame (230) and the second frame (240) facing the interior space (300). For example, at least a portion of the shielding member may be electrically connected to a ground region of the circuit board structure (200). The shielding member may be configured to provide electrical and / or magnetic shielding for components located in the interior space (300).

[0073] Figure 4 illustrates a connector according to one embodiment.

[0074] Referring to FIG. 4, an example of a first coupling member (330) of FIG. 3A and a second coupling member (340) of FIG. 3B may be described. Referring to reference numeral 401, the first coupling member (330) may include a first gender connector including a plurality of pins. The plurality of pins may, for example, have a distance (d) between a first pin (411) and a second pin (412) of the plurality of pins less than a specified distance (about 0.175 mm). Referring to reference numeral 402, the second coupling member (340) may include a second gender connector including a plurality of pins. The shapes and distances (d) of the first coupling member (330) and the second coupling member (340) illustrated in FIG. 4 are examples, and embodiments of the present disclosure are not limited thereto.

[0075] FIG. 5 is a cross-sectional view of a circuit board structure according to one embodiment.

[0076] Referring to FIG. 5, a cross-sectional view of a circuit board structure (200) taken along line A-A' of FIG. 2a is illustrated. As described above, the first circuit board (210) and the second circuit board (220) may be electrically connected via the first coupling member (330) and the second coupling member (340). For example, a component (250) positioned on the first circuit board (210) of the internal space (300) may be electrically connected to a component (560) positioned on the second circuit board. For example, the component (250) and the component (560) may be electrically connected via an electrical path (501). At least a portion of the electrical path (501) may pass through the first coupling member (330) and the second coupling member (340).

[0077] FIG. 6A is a cross-sectional view of a circuit board structure including a shielding member according to one embodiment.

[0078] Referring to FIG. 6A, a cross-sectional view of a circuit board structure (200) taken along line A-A' of FIG. 2A is illustrated. According to one embodiment, the circuit board structure (200) may further include a shielding member (600). For example, the shielding member (600) may include a conductive member configured to provide electrical and / or magnetic shielding for the internal space (300). The shielding member (600) may be electrically connected to a ground region of the circuit board structure (200) at least at one point.

[0079] In one embodiment, the shielding member (600) can be positioned adjacent to an inner wall of a frame (e.g., a first frame (230) and a second frame (240)). In one example, the shielding member (600) can be attached to the inner wall of the frame. The shielding member (600) can include a conductive tape. For example, the shielding member (600) can include a first conductive tape attached to the inner wall of the first frame (230) and a second conductive tape attached to the inner wall of the second frame (240). In one example, the shielding member (600) can be attached to the inner wall of the frame through plating.

[0080] The shape of the shielding member (600) described above with reference to FIG. 6a is exemplary, and embodiments of the present disclosure are not limited thereto. With reference to FIGS. 6b to 6d, various examples of the shielding member (600) may be described.

[0081] Figure 6b illustrates a shielding member according to one embodiment.

[0082] Referring to FIGS. 6A and 6B, the shielding member (600) may include a metallic clip. For example, referring to reference numeral 601, the shielding member (600) may include a clip (610a) and a plate (620a). For example, the clip (610a) may be positioned on the first circuit board (210) of FIG. 2A, and the plate (620a) may be positioned on the second circuit board (220) of FIG. 2A.

[0083] With reference to reference number 602, the clip (610a) may include a holder (611a) configured to apply force in an inward direction of the clip (610a). The holder (611a) may be configured to secure the plate (620a) when the clip (610a) is coupled with the plate (620a).

[0084] Figure 6c illustrates a shielding member according to one embodiment.

[0085] Referring to FIGS. 6A and 6C, the shielding member (600) may include a metallic clip. For example, referring to reference numeral 603, the shielding member (600) may include a clip (610b) and a plate (620b). For example, the clip (610b) may be positioned on the first circuit board (210) of FIG. 2A, and the plate (620b) may be positioned on the second circuit board (220) of FIG. 2A.

[0086] With reference to reference number 604, the clip (610b) may include a protrusion (611b) protruding inwardly of the clip (610b). The protrusion (611b) may be configured to secure the plate (620b) when the clip (610b) is coupled with the plate (620b).

[0087] FIG. 6d illustrates a shielding member according to one embodiment.

[0088] Referring to FIGS. 6A and 6D , the shielding member (600) may include metallic plates. For example, referring to reference numeral 605 , it may include a first plate (610c) and a second plate (620c). For example, the first plate (610c) may be positioned on the first circuit board (210) of FIG. 2A , and the second plate (620c) may be positioned on the second circuit board (220) of FIG. 2A .

[0089] The first plate (610c) may include a first protrusion (611c) formed to protrude in the direction of the second plate (620c) when combined. The second plate (620c) may include a second protrusion (621c) formed to protrude in the direction of the first plate (610c) when combined. The first protrusion (611c) and the second protrusion (621c) may be configured to reduce the probability that the first plate (610c) will detach from the second plate (620c) when combined.

[0090] FIG. 7 illustrates a circuit board structure including a connecting member according to one embodiment.

[0091] According to one embodiment, the circuit board structure (200) may include at least one connecting member. For example, the circuit board structure (200) may include a connecting member (710) connected to an electrical component (711) at one end and connected to a first circuit board (210) or a second circuit board (220) at the other end. The connecting member (710) may include, for example, a flexible printed circuit board (FPCB). The connecting member (710) may include, for example, at least one first electrical path electrically connected between the first circuit board (210) and the second circuit board (220). The connecting member (710) may include, for example, at least one second electrical path electrically connecting the electrical component (711) to the first circuit board (210) and / or the second circuit board (220).

[0092] According to one embodiment, the connecting member (710) may be formed integrally with the joining member. For example, as described below with reference to FIGS. 8A and 8B , the connecting member (710) may include at least one joining member. By including the joining member, the number of connectors for connecting the connecting member (710) may be reduced. In the examples of FIGS. 8A and 8B described below, the frame and shielding member may be omitted for convenience of explanation. One of ordinary skill in the art will appreciate that the circuit board structure (200) may include a frame and / or shielding member, as described above with reference to FIGS. 2A to 6D .

[0093] Figure 8a illustrates a joint structure of a connecting member according to one embodiment.

[0094] Referring to FIGS. 7 and 8A, a cross-sectional view of a circuit board structure (200) taken along line B-B' of FIG. 7 is illustrated. According to one embodiment, a connecting member (710) may be coupled at one end to the circuit board structure (200). At least a portion of one side (e.g., a side facing the +Z direction) of the connecting member (710) may be coupled to a first side (e.g., a side facing the -Z direction) of a first circuit board (210). For example, the connecting member (710) may be coupled to the first circuit board (210) through soldering.

[0095] In one example, the connecting member (710) can include at least one first electrical path (811) positioned between the first circuit board (210) and the first joining member (230). The at least one first electrical path (811) can electrically connect the first circuit board (210) and the first joining member (330) (e.g., a plurality of pins of the first joining member (330). In one example, the at least one first electrical path (811) can include at least one through-hole (e.g., a via) formed through the connecting member (710). The through-hole can be formed through a plurality of layers of the connecting member (710). The at least one first electrical path (811) can be formed by filling the at least one through-hole with a conductive material (e.g., copper). For example, the at least one first electrical path (811) can be formed by plating copper in the at least one through-hole using a laser.

[0096] In one example, the connecting member (710) can include at least one second electrical path (813) that electrically connects the electrical component (711) to the first circuit board (210). For example, the at least one second electrical path (813) can electrically connect the electrical component (711) to an electrical component (850) disposed on the first circuit board (210).

[0097] In the example of FIG. 8A, the first coupling member (330) and the second coupling member (340) can be used for coupling to the first circuit board (210) and the second circuit board (220). A separate connector may not be required for connecting the coupling member (710) to the first circuit board (210) or the second circuit board (220). By directly connecting the coupling member (710) to the first circuit board (210) and forming at least one first electrical path (811) for the first coupling member (330) in the coupling member (710), the size of the circuit board structure (200) can be reduced.

[0098] In the example of FIG. 8A, the electrical component (711) is described as being electrically connected to the electrical component (850) disposed on the first circuit board (210), but embodiments of the present disclosure are not limited thereto. In one embodiment, the electrical component (711) may be electrically connected to an electrical component (not shown) disposed on the second circuit board (220). In one example, the electrical component (711) may be electrically connected to at least one pin of the first coupling member (330). The electrical component (711) may be electrically connected to the second circuit board (220) via the first coupling member (330). In one example, the electrical component (710) may be electrically connected to the first electrical path (811). As described above, the first electrical path (811) can be configured to provide an electrical path between the first circuit board (210) and the second circuit board (220) through the first bonding member (330). Through the first electrical path (811), the electrical component (711) can be connected to the first circuit board (210) and the second circuit board (220).

[0099] Figure 8b illustrates a joint structure of a connecting member according to one embodiment.

[0100] Referring to FIGS. 7 and 8B, a cross-sectional view of a circuit board structure (200) taken along line B-B' of FIG. 7 is illustrated. According to one embodiment, a connecting member (710) may be coupled at one end to the circuit board structure (200). For example, the connecting member (710) may include a third connecting member (330a) and a fourth connecting member (340b) coupled at one end. An electrical element (711) may be coupled to the other end of the connecting member (710).

[0101] The connecting member (710) may have a third connecting member (330a) positioned on one side (e.g., a side facing the +Z direction). A fourth connecting member (340b) may be positioned on the opposite side (e.g., a side facing the -Z direction) of the connecting member (710). For example, the third connecting member (330a) and the fourth connecting member (340b) may be coupled to the connecting member (710) through soldering. The third connecting member (330a) may be configured to be physically and electrically coupled with the first connecting member (330). The fourth connecting member (340b) may be configured to be physically and electrically coupled with the second connecting member (340).

[0102] In one example, the connecting member (710) can include at least one first electrical path (812) positioned between the third connecting member (330a) and the fourth connecting member (340a). The at least one first electrical path (812) can electrically connect the third connecting member (330a) and the fourth connecting member (240a). In one example, the at least one first electrical path (812) can include at least one through-hole (e.g., a via) formed through the connecting member (710). The through-hole can be formed through multiple layers of the connecting member (710). The at least one first electrical path (812) can be formed by filling the at least one through-hole with a conductive material (e.g., copper). For example, the at least one first electrical path (812) can be formed by plating copper in the at least one through-hole using a laser.

[0103] In one example, the connecting member (710) can include at least one second electrical path (814) that electrically connects the electrical component (711) to the third connecting member (330a). The at least one second electrical path (814) illustrated in FIG. 8B is an example, and embodiments of the present disclosure are not limited thereto. For example, the at least one second electrical path (814) can electrically connect the electrical component (711) to the third connecting member (330a) and / or the fourth connecting member (340a). For example, the second electrical path (814) can be electrically connected to the first electrical path (812). Through the first electrical path (812), the second electrical path (814) can be electrically connected to the first circuit board (210) and the second circuit board (220). The electrical component (711) can be electrically connected to the first circuit board (210) and the second circuit board (220) via the second electrical path (814).

[0104] In the example of FIG. 8b, the connecting member (710) can be detachably connected to the first circuit board (210) and the second circuit board (220) via the third connecting member (330a) and the fourth connecting member (340a). Since the connecting member (710) is connected via a connector, the connecting member (710) can be easily replaced. In addition, since the third connecting member (330a) and the fourth connecting member (340a) are positioned on the connecting member (710), the size of the circuit board structure (200) can be reduced.

[0105] Figure 9 illustrates a frame according to one embodiment.

[0106] Referring to FIG. 9, according to one embodiment, the circuit board structure (200) may include a frame of various shapes. In the examples of FIGS. 2A to 3B, the frame is depicted as having an opening shaped to surround the periphery of the bonding member. However, according to one example, the opening of the frame may have a shape that surrounds at least two sides of the bonding member.

[0107] For example, the first frame (230) may include openings configured to receive a first-first coupling member (331) (e.g., the first coupling member (330)) and a first-second coupling member (332) (e.g., the first coupling member (330)). For example, the first frame (230) may include a sidewall formed by protruding from an inner wall of the first frame (230) (e.g., a surface adjacent to the first shielding member (610)). For example, the first frame (230) may include a first sidewall formed by protruding in an outward direction (e.g., in the -Y direction) of the circuit board structure (200) from a first point (P1) of the inner wall, and a second sidewall formed by protruding in an outward direction from a second point (P2) of the inner wall. For example, the first side wall, the inner side wall, and the second side wall may be referenced as openings configured to accommodate the first-first joining member (331).

[0108] Figure 10 is an exploded perspective view of a circuit board structure according to one embodiment.

[0109] Referring to FIG. 10, according to one embodiment, the circuit board structure (200) may include a frame formed integrally with a bonding member. With respect to FIGS. 2A to 9, the frame was described as surrounding an internal space (e.g., the internal space (300) of FIGS. 3A and 3B). Embodiments of the present disclosure are not limited thereto. In the example of FIG. 10, the first frame (230c) (e.g., the first frame (230a) of FIG. 2B) and the second frame (230d) (e.g., the second frame (230b) of FIG. 2B) may include bonding members (e.g., the first bonding member (330) of FIG. 3A and the second bonding member (340) of FIG. 3B). For example, the first frame (230c) may be formed integrally with the first bonding member (330a). At least a portion of the inner wall of the first frame (230c) (e.g., the inner space (300) of FIGS. 3a and 3b) may be formed by a first coupling member (330a) and a second coupling member (not shown) on the second circuit board (220). In the example of FIG. 10, when viewed on the XY plane, a portion of the first frame (230c) may be formed by the first coupling member (330a). Similarly, a portion of the second frame (240d) may be formed by a second coupling member (not shown) configured to be coupled with the first coupling member (330a).

[0110] The first frame (230c) and the second frame (230d) can be joined through a first joining member (330a) and a second joining member (not shown). The first joining member (330a) and the second joining member can be referred to by the description of the first joining member (330) and the second joining member (340) described above with reference to FIGS. 2A to 9, except for the structure of the frame.

[0111] As described above with respect to FIGS. 2a to 9, conductive members and / or shielding members for electrical and / or magnetic shielding may be positioned on the inner walls of the frames (the first frame (230c) and the second frame (240d)).

[0112] In the example of Fig. 10, since the inner wall (e.g., the surface facing the inner space) of the connecting member (e.g., the first connecting member (330a)) is used as the inner wall of the frame, the thickness of the frame can be reduced.

[0113] FIG. 11 is a block diagram of an electronic device (1101) within a network environment (1100) according to various embodiments. Referring to FIG. 11, in the network environment (1100), the electronic device (1101) may communicate with the electronic device (1102) via a first network (1198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1104) or the server (1108) via a second network (1199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1101) may communicate with the electronic device (1104) via the server (1108). According to one embodiment, the electronic device (1101) may include a processor (1120), a memory (1130), an input module (1150), an audio output module (1155), a display module (1160), an audio module (1170), a sensor module (1176), an interface (1177), a connection terminal (1178), a haptic module (1179), a camera module (1180), a power management module (1188), a battery (1189), a communication module (1190), a subscriber identification module (1196), or an antenna module (1197). In some embodiments, the electronic device (1101) may omit at least one of these components (e.g., the connection terminal (1178)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1176), camera module (1180), or antenna module (1197)) may be integrated into a single component (e.g., display module (1160)).

[0114] The processor (1120) may, for example, execute software (e.g., a program (1140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1101) connected to the processor (1120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1120) may store commands or data received from other components (e.g., a sensor module (1176) or a communication module (1190)) in a volatile memory (1132), process the commands or data stored in the volatile memory (1132), and store result data in a non-volatile memory (1134). According to one embodiment, the processor (1120) may include a main processor (1121) (e.g., a central processing unit or an application processor) or an auxiliary processor (1123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1121). For example, when the electronic device (1101) includes the main processor (1121) and the auxiliary processor (1123), the auxiliary processor (1123) may be configured to use less power than the main processor (1121) or to be specialized for a given function. The auxiliary processor (1123) may be implemented separately from the main processor (1121) or as a part thereof.

[0115] The auxiliary processor (1123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (1160), a sensor module (1176), or a communication module (1190)) of the electronic device (1101), for example, on behalf of the main processor (1121) while the main processor (1121) is in an inactive (e.g., sleep) state, or together with the main processor (1121) while the main processor (1121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1180) or a communication module (1190)). In one embodiment, the auxiliary processor (1123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0116] The memory (1130) can store various data used by at least one component (e.g., the processor (1120) or the sensor module (1176)) of the electronic device (1101). The data can include, for example, software (e.g., the program (1140)) and input data or output data for commands related thereto. The memory (1130) can include a volatile memory (1132) or a non-volatile memory (1134).

[0117] The program (1140) may be stored as software in memory (1130) and may include, for example, an operating system (1142), middleware (1144), or an application (1146).

[0118] The input module (1150) can receive commands or data to be used in a component of the electronic device (1101) (e.g., a processor (1120)) from an external source (e.g., a user) of the electronic device (1101). The input module (1150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0119] The audio output module (1155) can output audio signals to the outside of the electronic device (1101). The audio output module (1155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0120] The display module (1160) can visually provide information to an external party (e.g., a user) of the electronic device (1101). The display module (1160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0121] The audio module (1170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1170) can acquire sound through the input module (1150), output sound through the sound output module (1155), or an external electronic device (e.g., electronic device (1102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1101).

[0122] The sensor module (1176) can detect the operating status (e.g., power or temperature) of the electronic device (1101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0123] The interface (1177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1101) with an external electronic device (e.g., the electronic device (1102)). In one embodiment, the interface (1177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0124] The connection terminal (1178) may include a connector through which the electronic device (1101) may be physically connected to an external electronic device (e.g., the electronic device (1102)). In one embodiment, the connection terminal (1178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0125] The haptic module (1179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1179) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0126] The camera module (1180) can capture still images and videos. In one embodiment, the camera module (1180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0127] The power management module (1188) can manage the power supplied to the electronic device (1101). According to one embodiment, the power management module (1188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0128] A battery (1189) may power at least one component of the electronic device (1101). In one embodiment, the battery (1189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0129] The communication module (1190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1101) and an external electronic device (e.g., electronic device (1102), electronic device (1104), or server (1108)), and the performance of communication through the established communication channel. The communication module (1190) may operate independently from the processor (1120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1190) may include a wireless communication module (1192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1104) via a first network (1198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1196) to verify or authenticate the electronic device (1101) within a communication network such as the first network (1198) or the second network (1199).

[0130] The wireless communication module (1192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1192) may support various requirements specified in the electronic device (1101), an external electronic device (e.g., the electronic device (1104)), or a network system (e.g., the second network (1199)). According to one embodiment, the wireless communication module (1192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0131] The antenna module (1197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1198) or the second network (1199), may be selected from the plurality of antennas by, for example, the communication module (1190). A signal or power may be transmitted or received between the communication module (1190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1197).

[0132] According to various embodiments, the antenna module (1197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0133] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0134] According to one embodiment, commands or data may be transmitted or received between the electronic device (1101) and an external electronic device (1104) via a server (1108) connected to a second network (1199). Each of the external electronic devices (1102 or 1104) may be the same or a different type of device as the electronic device (1101). According to one embodiment, all or part of the operations executed in the electronic device (1101) may be executed in one or more of the external electronic devices (1102, 1104, or 1108). For example, when the electronic device (1101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1101). The electronic device (1101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1104) may include an Internet of Things (IoT) device. The server (1108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1104) or server (1108) may be included within the second network (1199). The electronic device (1101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0135] In one embodiment, the electronic device (1001) may include at least one printed circuit board (e.g., the first circuit board (151) and / or the second circuit board (152) of FIG. 1D). For example, the printed circuit board may include a printed circuit structure.

[0136] According to one embodiment, a circuit board structure (e.g., circuit board structure (200) of FIGS. 2A and 2B) may include a first circuit board (e.g., first circuit board (210) of FIG. 2A) including a first surface, a second circuit board (e.g., second circuit board (220) of FIG. 2A) including a second surface facing the first surface. The circuit board structure may include a plurality of first coupling members (e.g., first coupling members (330) of FIG. 3A) coupled to the first surface, and a plurality of second coupling members (e.g., second coupling members (340) of FIG. 3B) coupled to the second surface and configured to be physically coupled with the plurality of first coupling members. The circuit board structure may include a frame (e.g., a first frame (230) of FIG. 3A and a second frame (240) of FIG. 3B) extending between the first surface and the second surface and including a plurality of openings (e.g., openings (270) of FIG. 3A and openings (280) of FIG. 3B) configured to accommodate the plurality of first coupling members and the plurality of second coupling members. The plurality of first coupling members and the plurality of second coupling members may be configured to provide an electrical connection between the first circuit board and the second circuit board.

[0137] For example, the first side, the second side, and the frame may be configured to form at least a portion of an internal space of the circuit board structure (e.g., the internal space (300) of FIGS. 3A and 3B). The frame may include an inner wall facing the internal space. The inner wall may be positioned between a joining member including the plurality of first joining members and the plurality of second joining members and the internal space. The plurality of openings may include a first opening configured to receive a first joining member among the plurality of first joining members and a second joining member among the plurality of second joining members. The first opening may be formed by an inner wall of the frame located in a peripheral area of ​​the first joining member and the second joining member adjacent to the inner space, a first side wall extending from the inner space toward the outside of the circuit board structure at a first point (P1) of the inner wall, and a second side wall extending from the inner space toward the outside of the circuit board structure at a second point (P2) of the inner wall. The first opening may be formed to surround the periphery of the first joining member and the second joining member when viewed from above the first circuit board toward the second circuit board.

[0138] In one example, the circuit board structure may further include a shielding member (e.g., 600, 610a, 610b, 610c, 620a, 620b, 620c of FIGS. 6A to 6D ) positioned adjacent to the inner wall and configured to provide electromagnetic shielding for the inner space. For example, the shielding member may be attached to the inner wall. For example, the shielding member may include a first shielding member coupled to the first surface and a second shielding member coupled to the second surface, and the first shielding member may be configured to couple with the second shielding member.

[0139] In one example, the circuit board structure may further include a first end disposed between a first bonding member among the plurality of first bonding members and the first circuit board, and a second end electrically connecting a bonding member (e.g., a bonding member (710) of FIG. 7) to an electrical component (e.g., an electrical component (711) of FIG. 7). The bonding member may include a plurality of vias (e.g., a first electrical path (811) of FIG. 8A) configured to electrically connect the first bonding member to the first circuit board, and a plurality of conductive paths (e.g., a second electrical path (813) of FIG. 8A) electrically connecting the electrical component to the first circuit board.

[0140] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0141] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0142] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0143] Various embodiments of the present document may be implemented as software (e.g., a program (1140)) including one or more instructions stored in a storage medium (e.g., an internal memory (1136) or an external memory (1138)) readable by a machine (e.g., an electronic device (1101)). For example, a processor (e.g., a processor (1120)) of the machine (e.g., an electronic device (1101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0144] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0145] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the circuit board structure (200), A first circuit board (210) including a first surface; A second circuit board (220) including a second surface facing the first surface; A plurality of first coupling members (330) coupled to the first surface; A plurality of second coupling members (340) coupled to the second surface and configured to be physically coupled with the plurality of first coupling members; and A frame (230, 240) extending between the first side and the second side and including a plurality of openings (270, 280) configured to accommodate the plurality of first joining members and the plurality of second joining members, A circuit board structure, wherein the plurality of first bonding members and the plurality of second bonding members are set to provide an electrical connection between the first circuit board and the second circuit board.

2. In paragraph 1, A circuit board structure, wherein the first side, the second side, and the frame are set to form at least a portion of an internal space (300) of the circuit board structure.

3. In paragraph 2, The above frame includes an inner wall facing the interior space, A circuit board structure, wherein the inner wall is positioned between a bonding member including the plurality of first bonding members and the plurality of second bonding members and the inner space.

4. In paragraph 3, A circuit board structure further comprising a shielding member (600, 610a, 610b, 610c, 620a, 620b, 620c) positioned adjacent to the inner wall and configured to provide electromagnetic shielding for the inner space.

5. In paragraph 4, The above shielding member is a circuit board structure attached to the inner wall.

6. In paragraph 4, The shielding member comprises a first shielding member coupled to the first surface and a second shielding member coupled to the second surface, A circuit board structure, wherein the first shielding member is set to be coupled with the second shielding member.

7. In paragraph 2, The above plurality of openings include a first opening configured to receive a first joining member among the plurality of first joining members and a second joining member among the plurality of second joining members, The above first opening: The inner wall of the frame positioned in the peripheral area of ​​the first joining member and the second joining member adjacent to the inner space; A first side wall extending from the inner space toward the exterior of the circuit board structure at a first point (P1) of the inner side wall; and A circuit board structure formed by a second side wall extending from the inner space toward the exterior of the circuit board structure at a second point (P2) of the inner side wall.

8. In paragraph 7, A circuit board structure, wherein the first opening is formed to surround the periphery of the first bonding member and the second bonding member when viewed from above the first circuit board toward the second circuit board.

9. In paragraph 1, A first end is arranged between a first end of the plurality of first connecting members and the first circuit board, and a second end further includes an electrical component (711) and an electrically connecting member (710). The above connecting member is: a plurality of vias configured to electrically connect said first bonding member to said first circuit board; and A circuit board structure comprising a plurality of conductive paths electrically connecting said electrical configuration to said first circuit board.

10. In an electronic device including a circuit board structure (200), the circuit board structure: A first circuit board (210) including a first surface; A second circuit board (220) including a second surface facing the first surface; A plurality of first coupling members (330) coupled to the first surface; A plurality of second coupling members (340) coupled to the second surface and configured to be physically coupled with the plurality of first coupling members; and A frame (230, 240) extending between the first side and the second side and including a plurality of openings (270, 280) configured to accommodate the plurality of first joining members and the plurality of second joining members, An electronic device, wherein the plurality of first bonding members and the plurality of second bonding members are configured to provide an electrical connection between the first circuit board and the second circuit board.

11. In Article 10, An electronic device, wherein the first side, the second side, and the frame are set to form at least a portion of an internal space (300) of the circuit board structure.

12. In paragraph 11, The above frame includes an inner wall facing the interior space, An electronic device wherein the inner wall is positioned between a joining member including the plurality of first joining members and the plurality of second joining members and the inner space.

13. In paragraph 12, An electronic device further comprising a shielding member (600, 610a, 610b, 610c, 620a, 620b, 620c) positioned adjacent to the inner wall and configured to provide electromagnetic shielding for the inner space.

14. In paragraph 13, The above shielding member is an electronic device attached to the inner wall.

15. In paragraph 13, The shielding member comprises a first shielding member coupled to the first surface and a second shielding member coupled to the second surface, An electronic device, wherein the first shielding member is configured to be coupled with the second shielding member.

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