Power supply device, method for forming filter device, and battery system including power supply device

Abstract

The power supply device may comprise: a primary side PCB; a secondary side PCB insulated from the primary side; a filter device including multiple metal plates positioned between the primary side PCB and the secondary side PCB; and a transformer positioned above the filter device, the transformer including a primary side winding connected to the primary side PCB and a secondary side winding connected to the secondary side PCB.

Description

A power supply device, a method for forming a filter device, and a battery system including a power supply device

[0001] Cross-citation with related application(s)

[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0120505, filed September 11, 2023, the entire contents of which are incorporated herein by reference.

[0003] The present disclosure relates to a power supply device, a method of forming a filter device, and a battery system including the power supply device.

[0004] The Battery Management System (BMS), which manages the operation of the battery pack, is connected to each of the low-voltage and high-voltage regions. For example, the BMS is connected to the 12V auxiliary power supply (low-voltage region) of the vehicle to which the battery pack is applied, and receives the power required for operation from the 12V auxiliary power supply. It is also connected to the high-voltage region of the battery pack, and can perform operations such as measuring the voltage of the battery pack and measuring the insulation of the battery pack. Since insulation is required due to the high potential difference between the low-voltage and high-voltage regions, an isolated SMPS (Switching Mode Power Supply), such as a flyback converter, may be included.

[0005] However, there is a problem that EMC (Electromagnetic compatibility) noise frequently occurs during the operation of the flyback converter.

[0006] The present disclosure provides a power supply device capable of reducing EMC noise, a method for forming a filter device, and a battery system including the power supply device.

[0007] A power supply device according to one aspect of the invention may include a primary PCB, a secondary PCB insulated from the primary PCB, a filter device including a plurality of metal plates positioned between the primary PCB and the secondary PCB, and a transformer positioned above the filter device and including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB.

[0008] The filter device further includes a PCB, and a plurality of insulating layers of the PCB may be positioned between the plurality of metal plates. Capacitance may be provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

[0009] The plurality of metal plates may be formed by filling a plurality of via holes extending from one surface of the filter device with metal.

[0010] The above primary side PCB, the filter device, and the secondary side PCB can be implemented as a single PCB.

[0011] The above plurality of metal plates can be arranged and positioned at regular intervals.

[0012] The plurality of metal plates may include a plurality of first metal plates connected to the primary side PCB, and a plurality of second metal plates connected to the secondary side PCB. The plurality of first metal plates and the plurality of second metal plates may be positioned alternately. Alternatively, an insulating region may be positioned between the plurality of first metal plates and the plurality of second metal plates.

[0013] A method for forming a filter device positioned between a primary PCB and a secondary PCB according to another feature of the invention may include a step of forming a plurality of via holes from one surface of the PCB in a direction perpendicular to the one surface, and a step of filling the plurality of via holes with metal to form a plurality of metal plates. A plurality of insulating layers of the PCB may be positioned between the plurality of metal plates.

[0014] A transformer may be positioned opposite the above surface of the above filter device.

[0015] According to another aspect of the invention, a battery system may include a battery pack including a plurality of battery cells, a battery management system for monitoring the battery pack and controlling charging and discharging of the battery pack, and a power supply device for supplying power to the battery management system. The power supply device may include a primary PCB, a secondary PCB insulated from the primary PCB, a filter device including a plurality of metal plates positioned between the primary PCB and the secondary PCB, and a transformer positioned on the filter device, the transformer including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB.

[0016] The filter device further includes a PCB, and a plurality of insulating layers of the PCB may be positioned between the plurality of metal plates. Capacitance may be provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

[0017] The present disclosure provides a power supply device capable of reducing EMC noise, a method for forming a filter device, and a battery system including the power supply device.

[0018] FIG. 1 is a block diagram showing a power supply device according to some embodiments.

[0019] Figure 2 is a circuit diagram of a power supply unit.

[0020] Figure 3 is a drawing showing a conventional primary side PCB and secondary side PCB.

[0021] Figure 4 is a simulation graph showing the capacitance between the conventional primary side PCB and the secondary side PCB.

[0022] FIG. 5 is a drawing showing a primary side PCB, a filter device, and a secondary side PCB according to one embodiment.

[0023] Figure 6 is a simulation graph showing the capacitance between the primary side PCB and the secondary side PCB according to one embodiment.

[0024] FIG. 7 is a drawing showing a primary side PCB, a filter device, and a secondary side PCB according to another embodiment.

[0025] Figure 8 is a simulation graph showing the capacitance between the primary side PCB and the secondary side PCB according to one embodiment.

[0026] FIG. 9 is a drawing showing a primary side PCB, a filter device, and a secondary side PCB according to another embodiment.

[0027] Fig. 10 is a simulation graph showing the capacitance between the primary side PCB and the secondary side PCB according to one embodiment.

[0028] Fig. 11 is a schematic drawing of a filter device according to one embodiment.

[0029] FIG. 12 and FIG. 13 are drawings showing a method for forming a plurality of metal plates according to some embodiments.

[0030] FIG. 14 is a diagram illustrating a battery system including a power supply device according to some embodiments.

[0031] In describing the embodiments disclosed in this specification, detailed descriptions of related known technologies will be omitted if it is determined that such detailed descriptions may obscure the gist of the embodiments disclosed in this specification. In addition, the attached drawings are provided solely to facilitate understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included within the spirit and technical scope of the present invention.

[0032] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0033] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0034] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0035] FIG. 1 is a block diagram showing a power supply device according to some embodiments.

[0036] As illustrated in FIG. 1, the power supply unit (1) may include a primary printed circuit board (PCB) (10), a secondary PCB (20), a transformer (30), and a filter device (12). The primary PCB (10), the filter device (12), and the secondary PCB (20) may be implemented as a single PCB, or may be implemented as separate PCBs and then combined. The primary PCB (10) and the secondary PCB (20) may be implemented as a PCB of two or more layers.

[0037] The transformer (30) may include a primary winding (31) and a secondary winding (32). The primary winding (31) and the secondary winding (32) within the transformer (30) are electrically insulated from each other. In order to explain the electrical connection between the transformer (30) and the primary PCB (10), and between the transformer (30) and the secondary PCB (20), regions located within the transformer (30) of each of the primary winding (31) and the secondary winding (32) are also schematically illustrated in FIG. 1. In reality, the primary winding (31) and the secondary winding (32) may be implemented in various ways, different from those illustrated in FIG. 1.

[0038] The primary PCB (10) may include two connection terminals (T1, T2) electrically connected to one end and the other end of the primary winding (31). The two connection terminals (T1, T2) may be electrically connected to other components through two corresponding via holes in the primary PCB (10). The primary PCB (10) may include two input terminals connected to a low-voltage power supply. For example, two output terminals of a 12 V auxiliary power supply provided in a vehicle may be electrically connected to the two input terminals.

[0039] The secondary PCB (20) may include two connection terminals (T3, T4) electrically connected to one end and the other end of the secondary winding (32). The two connection terminals (T3, T4) may be electrically connected to other components through two corresponding via holes in the secondary PCB (20). The secondary PCB (20) may supply voltage to other circuits operating in a high voltage range. For example, a voltage required for the battery management system to measure the battery pack voltage may be supplied to the battery management system through the secondary PCB (20). A voltage required for the battery management system to measure the insulation resistance of the battery pack may be supplied to the battery management system through the secondary PCB (20).

[0040] The filter device (12) may be positioned between the primary PCB (10) and the secondary PCB (20) in a first direction (x-axis direction in FIG. 1) and may be positioned in a second direction (-z-axis direction in FIG. 1) with respect to the transformer (30). The filter device (12) may include a plurality of metal plates formed in the yz direction and arranged along the first direction between the primary PCB (10) and the secondary PCB (20). The filter device (12) and the transformer (30) may be electrically insulated by an insulator or may be spatially separated and electrically insulated from each other. In FIG. 1, the transformer (30) may be positioned facing the upper surface (41) of the filter device (12).

[0041] In FIG. 1, the filter device (12) and the primary side PCB (10) are shown in contact, but the filter device (12) is made of an insulating material at the surface where the filter device (12) and the primary side PCB (10) are in contact, so the filter device (12) and the primary side PCB (10) are insulated from each other. Similarly, in FIG. 1, the filter device (12) and the secondary side PCB (20) are shown in contact, but the filter device (12) is made of an insulating material at the surface where the filter device (12) and the secondary side PCB (20) are insulated from each other.

[0042] Figure 2 is a circuit diagram of a power supply unit.

[0043] The power supply device illustrated in FIG. 2 can be implemented as a flyback converter that can be applied to any embodiment.

[0044] The power supply (100) may include a primary winding (101), a secondary winding (102), a switching circuit (103), a switching control circuit (104), a rectifier diode (105), an output capacitor (106), and a feedback circuit (107).

[0045] One end of the primary winding (101) is connected to an input terminal (IN1), and the other end of the primary winding (102) is connected to one end of a switching circuit (103). The switching circuit (103) may include a plurality of power transistors. The plurality of power transistors may be n-channel type transistors and may be connected in parallel. The other end of the primary winding (102) may be connected to a drain of the switching circuit (103). The other end of the switching circuit (103) is connected to an input terminal (IN2). An input power source may be connected between the two input terminals (IN1, IN2). For example, the positive pole of a 12V auxiliary battery of a vehicle may be connected to the input terminal (IN1), and the negative pole may be connected to the input terminal (IN2).

[0046] One end of the secondary winding (102) is connected to the anode of a rectifier diode (105), and the other end of the secondary winding (102) is connected to a secondary output terminal (OUT2). The cathode of the rectifier diode (105) is connected to the secondary output terminal (OUT1), and an output capacitor (106) is connected between the secondary output terminal (OUT1) and the secondary output terminal (OUT2), so as to filter out ripples of the output voltage (VOUT) and smooth the output voltage (VOUT).

[0047] The feedback circuit (107) can generate a feedback voltage (VF) according to the output voltage (VOUT) and provide it to the switching control circuit (104). The feedback circuit (107) can include an insulating coupler, for example, an optocoupler, electrically connected to each of the insulated primary side and secondary side.

[0048] The switching control circuit (104) can generate a gate signal (VG) that controls the on-duty ratio of the switching circuit (103) according to the feedback voltage (VF). When the gate signal (VG) is at the on level, the switching circuit (103) can be turned on, and when the gate signal (VG) is at the off level, the switching circuit (103) can be turned off. When the feedback voltage (VF) increases due to a decrease in the output voltage (VOUT) as a result of an increase in the load, the switching control circuit (104) can increase the on-duty ratio of the gate signal (VG). Then, the power provided from the primary side to the secondary side can increase. Conversely, when the feedback voltage (VF) decreases due to an increase in the output voltage (VOUT) as a result of a decrease in the load, the switching control circuit (104) can decrease the on-duty ratio of the gate signal (VG). Then, the power provided from the primary side to the secondary side can decrease. In this way, the switching control circuit (104) can regulate the output voltage (VOUT).

[0049] The primary side configuration of the primary side winding (101), switching circuit (103), switching control circuit (104), and feedback circuit (107) located on the primary side in the power supply (100) illustrated in FIG. 2 can be implemented on the primary side PCB (10) illustrated in FIG. 1. The secondary side configuration of the secondary side winding (101), rectifier diode (105), output capacitor (106), and feedback circuit (107) located on the secondary side in the power supply (100) illustrated in FIG. 2 can be implemented on the secondary side PCB (20) illustrated in FIG. 1.

[0050] Figure 3 is a drawing showing a conventional primary side PCB and secondary side PCB.

[0051] As illustrated in Fig. 3, the primary PCB (41) and the secondary PCB (42) include four metal layers (411 to 414) and three FR4 layers (421 to 423) positioned between the two metal layers. An insulating region (43) composed only of FR4 layers (421 to 423) is positioned between the primary PCB (41) and the secondary PCB (42).

[0052] Figure 4 is a simulation graph showing the capacitance between the conventional primary side PCB and the secondary side PCB.

[0053] In the graph illustrated in FIG. 4, the horizontal axis represents the signal frequency generated between the primary PCB (41) and the secondary PCB (42), and the vertical axis represents the capacitance between the primary PCB and the secondary PCB, and the unit is “fF (femto farad).” As illustrated in FIG. 4, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is 12.74 to 13.40 [fF].

[0054] FIG. 5 is a drawing showing a primary side PCB, a filter device, and a secondary side PCB according to one embodiment.

[0055] Figure 5 shows the connection relationship between the primary side PCB (10) and the filter device (12), the connection relationship between the secondary side PCB (20) and the filter device (12), and the configurations of the filter device (12).

[0056] The filter device (12) includes a plurality of metal plates (501, 502, 511, 512), two connecting electrodes (521, 522), and a plurality of insulating layers (531, 532).

[0057] The primary PCB (10) and the secondary PCB (20) may include four metal layers and an FR4 layer positioned between two adjacent metal layers. The primary PCB (10) may be electrically connected to the insulator (12) through a connection electrode (521). For example, the ground of the primary PCB (10) may be connected to the connection electrode (521). The secondary PCB (20) may be electrically connected to the insulator (12) through a connection electrode (522). For example, the ground of the secondary PCB (20) may be connected to the connection electrode (522).

[0058] A plurality of metal plates (501, 502, 511, 512) may be formed in a plurality of via holes formed in an insulating region (303) illustrated in FIG. 3. The plurality of metal plates (501, 502, 511, 512) extend along the yz plane and are arranged along the x-axis. Some (e.g., 501, 502) of the plurality of metal plates (501, 502, 511, 512) are connected to a connection electrode (521), and other some (e.g., 511, 512) of the plurality of gold plates (501, 502, 511, 512) are connected to a connection electrode (522). The plurality of metal plates connected to the connection electrode (521) and the plurality of metal plates connected to the connection electrode (522) may be alternately positioned, and an insulating layer may be positioned between adjacent metal plates. For example, a plurality of metal plates (501, 511, 502, 512) may be positioned in that order, and an insulating layer (e.g., 531, 532) may be positioned between two adjacent metal plates (e.g., 501 and 511, 511 and 502). In this manner, a capacitance may be formed between the primary PCB (10) and the secondary PCB (20).

[0059] Figure 6 is a simulation graph showing the capacitance between the primary side PCB and the secondary side PCB according to one embodiment.

[0060] In the graph illustrated in FIG. 6, the horizontal axis represents the signal frequency generated between the primary PCB (10) and the secondary PCB (20), and the vertical axis represents the capacitance between the primary PCB (10) and the secondary PCB (20), and the unit is “pF (pico farad).” As illustrated in FIG. 6, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is 23.50 to 25.54 [pF]. FIG. 6 shows that a capacitance that is more than 2000 times greater than the conventional capacitance illustrated in FIG. 4 can be provided.

[0061] The shape and configuration of the filter device are not limited to the preceding embodiment and various modifications are possible.

[0062] FIG. 7 is a drawing showing a primary side PCB, a filter device, and a secondary side PCB according to another embodiment.

[0063] Fig. 7 shows the connection relationship between the primary PCB (10) and the filter device (13), the connection relationship between the secondary PCB (20) and the filter device (13), and the configurations of the filter device (13). The filter device (13) illustrated in Fig. 7 is an embodiment that includes a smaller number of metal plates compared to the filter device (12) illustrated in Fig. 5.

[0064] The filter device (13) includes a plurality of metal plates (701, 702, 711, 712), two connecting electrodes (721, 722), and a plurality of insulating layers (731, 732).

[0065] The primary PCB (10) and the secondary PCB (20) may include four metal layers and an FR4 layer positioned between two adjacent metal layers. The primary PCB (10) may be electrically connected to the insulator (13) via a connection electrode (721). For example, the ground of the primary PCB (10) may be connected to the connection electrode (721). The secondary PCB (20) may be electrically connected to the insulator (13) via a connection electrode (722). For example, the ground of the secondary PCB (20) may be connected to the connection electrode (722).

[0066] A plurality of metal plates (701, 702, 711, 712) can be formed in a plurality of via holes formed in an insulating region (303) illustrated in FIG. 3. The plurality of metal plates (701, 702, 711, 712) extend along the yz plane and are arranged along the x-axis. Some of the plurality of metal plates (701, 702, 711, 712) (e.g., 701, 702) are connected to a connection electrode (721), and other some of the plurality of gold plates (701, 702, 711, 712) (e.g., 711, 712) are connected to a connection electrode (522). An insulating layer (e.g., 731, 732) may be positioned between two adjacent metal plates (e.g., 701 and 702, 711 and 712) among a plurality of metal plates (701, 702, 711, 712). In this manner, capacitance may be formed between the primary PCB (10) and the secondary PCB (20).

[0067] Figure 8 is a simulation graph showing the capacitance between the primary side PCB and the secondary side PCB according to one embodiment.

[0068] In the graph illustrated in FIG. 8, the horizontal axis represents the signal frequency generated between the primary PCB (10) and the secondary PCB (20), and the vertical axis represents the capacitance between the primary PCB (10) and the secondary PCB (20), and the unit is “fF (femto farad).” As illustrated in FIG. 8, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is 136.98 to 137.11 [fF]. FIG. 8 shows that a capacitance that is more than 10 times greater than the conventional capacitance illustrated in FIG. 4 can be provided.

[0069] FIG. 9 is a drawing showing a primary side PCB, a filter device, and a secondary side PCB according to another embodiment.

[0070] Fig. 9 shows the connection relationship between the primary PCB (10) and the filter device (14), the connection relationship between the secondary PCB (20) and the filter device (14), and the configurations of the filter device (14). The filter device (14) illustrated in Fig. 9 has a different shape of the insulating layer than the filter device (13) illustrated in Fig. 5. In Fig. 9, the same reference numerals are used for the same configurations as in Fig. 7, and the description thereof is omitted below.

[0071] The filter device (14) includes a plurality of metal plates (701, 702, 711, 712), two connecting electrodes (721, 722), and a plurality of insulating layers (731, 732, 901). The insulating layer (901) may also be formed of FR4.

[0072] The insulating layer (901) can be implemented as a single layer between the metal plate (703) located farthest from the primary PCB (10) among the plurality of metal plates (701-703) connected to the connection electrode (721) and the metal plate (713) located farthest from the secondary PCB (20) among the plurality of metal plates (711-713) connected to the connection electrode (722). In this way, capacitance can be formed between the primary PCB (10) and the secondary PCB (20).

[0073] Fig. 10 is a simulation graph showing the capacitance between the primary side PCB and the secondary side PCB according to one embodiment.

[0074] In the graph illustrated in FIG. 10, the horizontal axis represents the signal frequency generated between the primary PCB (10) and the secondary PCB (20), and the vertical axis represents the capacitance between the primary PCB (10) and the secondary PCB (20), and the unit is “fF (femto farad).” As illustrated in FIG. 8, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is approximately 207 to 219 [fF]. FIG. 10 shows that a capacitance that is 15 times greater than the conventional capacitance illustrated in FIG. 4 can be provided.

[0075] In this way, the filter device (12, 13, 14) can filter EMC noise of the power supply by providing capacitance between the primary side and the secondary side of the transformer (30). Since the filter device (12, 13, 14) is positioned in an insulated state between the primary side PCB (10) and the secondary side PCB (20), it can filter EMC noise while maintaining insulation between the low voltage area and the high voltage area of ​​the power supply.

[0076] Below, a method for forming a metal plate in a filter device is described.

[0077] Fig. 11 is a schematic drawing of a filter device according to one embodiment.

[0078] For convenience of explanation, a plurality of metal plates (301 to 308) formed inside the filter device (12) are transparently illustrated in FIG. 11. The filter device (12) may include a plurality of metal plates (301 to 308). As illustrated in FIG. 11, each of the plurality of metal plates (301 to 308) is formed to extend in the yz plane direction. Although FIG. 11 illustrates that the number of the plurality of metal plates (301 to 308) is eight, the invention is not limited thereto. Parts of the filter device (12) other than the plurality of metal plates (301 to 308) may be implemented with an insulating material. For example, the filter device (12) may include a plurality of metal plates (301 to 308) arranged at regular intervals inside a PCB. Therefore, parts of the filter device (12) other than the plurality of metal plates (301 to 308) may be formed with an insulating material. That is, an insulating layer may be positioned between two adjacent metal plates among the plurality of metal plates (301 to 308). Specifically, the PCB may be implemented using FR4, a glass fiber reinforced epoxy laminated sheet.

[0079] FIG. 12 and FIG. 13 are drawings showing a method for forming a plurality of metal plates according to some embodiments.

[0080] Figures 12 and 13 show cross-sectional views taken along line a-a' of Figure 12 during the process of forming a plurality of metal plates (301 to 308).

[0081] As illustrated in Fig. 12, a plurality of via holes (401 to 408) may be formed by drilling or lasering a plurality of metal plates (301 to 308) in a vertical direction (-z-axis direction) from the upper surface (corresponding to 310 in Fig. 11) (410) of the FR4 PCB. The plurality of via holes (401 to 408) may be positioned at regular intervals along the first direction (x-axis direction) and may be formed in the yz direction.

[0082] As illustrated in FIG. 13, a plurality of via holes (401 to 408) can be filled with metal using a via fill technique. Then, a plurality of metal plates (301 to 308) can be formed in the plurality of via holes (401 to 408).

[0083] Figures 12 and 13 illustrate examples of a method for forming multiple metal plates (301-308), but the invention is not limited thereto. Various methods may be employed to provide spaces, such as multiple via holes, in which multiple metal plates can be positioned on a PCB. Furthermore, various methods may be employed to fill these spaces with metal.

[0084] As illustrated in FIG. 11, since an insulating layer is positioned between a plurality of metal plates (301 to 308) and between the plurality of metal plates (301 to 308), the filter device (12) can provide a predetermined capacitance. For example, a capacitance can be formed between two adjacent metal plates among the plurality of metal plates (301 to 308). Consequently, a plurality of capacitances can be formed between the plurality of metal plates (301 to 308), and an overall capacitance synthesized from the plurality of capacitances can be provided.

[0085] The filter devices (13, 14) of the embodiments in FIGS. 7 and 9 can be implemented using the methods shown in FIGS. 12 and 13.

[0086] FIG. 14 is a diagram illustrating a battery system including a power supply device according to some embodiments.

[0087] The auxiliary battery (60) can supply power of a constant voltage to the power supply unit (51). Both output terminals of the auxiliary battery (60) are connected to two input terminals (IN1, IN2) of the power supply unit (51). The auxiliary battery (60) can be located in a vehicle equipped with a battery system (50).

[0088] The battery system (50) may include a power supply unit (51), a battery management system (BMS) (52), and a battery pack (53).

[0089] The power supply unit (51) can be implemented according to the embodiment described above. The power supply unit (51) can convert power supplied from the auxiliary battery (60) and supply it to the BMS (53).

[0090] The battery pack (53) may include a plurality of battery cells (CE1 to CEn). In FIG. 5, a plurality of battery cells (CE1 to CEn) are illustrated as being connected in series between two output terminals (P+, P-) of the battery pack (53), but the plurality of battery cells (CE1 to CEn) may be connected in parallel and / or in series.

[0091] The BMS (52) can operate using power supplied from the power supply unit (51). The BMS (52) can monitor the battery pack (53) and control charging and discharging of the battery pack (53). The BMS (52) can measure the cell voltage of each of the plurality of battery cells (CE1 to CEn), measure the current flowing in the battery pack (53), and measure the temperature of the battery pack (53). The BMS (52) can control charging and discharging of the battery pack (53) based on the measured values, and can detect an abnormality and control a protective operation for the battery pack (53).

[0092] Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concept of the present invention defined in the following claims also fall within the scope of the present invention.

Claims

1. 1st side PCB; Secondary side PCB insulated from the primary side; A filter device including a plurality of metal plates positioned between the primary side PCB and the secondary side PCB; and A transformer positioned above the filter device and including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB, Power supply.

2. In paragraph 1, A power supply device, wherein the filter device further includes a PCB, and a plurality of insulating layers of the PCB are positioned between the plurality of metal plates.

3. In paragraph 2, A power supply device in which capacitance is provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

4. In paragraph 1, The above plurality of metal plates, A power supply device, wherein a plurality of via holes extending from one side of the filter device are formed by filling them with metal.

5. In paragraph 1, A power supply device in which the primary side PCB, the filter device, and the secondary side PCB are implemented as a single PCB.

6. In paragraph 1, A power supply device in which the above plurality of metal plates are arranged and positioned at regular intervals.

7. In paragraph 1, The above plurality of metal plates, A plurality of first metal plates connected to the primary side PCB; and A power supply device comprising a plurality of second metal plates connected to the secondary side PCB.

8. In paragraph 7, A power supply device in which the plurality of first metal plates and the plurality of second metal plates are positioned alternately.

9. In paragraph 7, A power supply device, wherein an insulating region is positioned between the plurality of first metal plates and the plurality of second metal plates.

10. A method for forming a filter device located between a primary PCB and a secondary PCB, A step of forming a plurality of via holes in a direction perpendicular to one side of the PCB; and A step of filling the plurality of via holes with metal to form a plurality of metal plates is included. A plurality of insulating layers of the PCB are positioned between the plurality of metal plates, Method for forming a filter device.

11. In paragraph 10, A transformer is positioned opposite to the above surface of the above filter device, Method for forming a filter device.

12. A battery pack comprising a plurality of battery cells; A battery management system that monitors the battery pack and controls charging and discharging of the battery pack; and A power supply unit for supplying power to the above battery management system is included, The above power supply unit, Primary side PCB; Secondary side PCB insulated from the primary side; A filter device including a plurality of metal plates positioned between the primary side PCB and the secondary side PCB; and A transformer positioned above the filter device and including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB, Battery system.

13. In paragraph 12, A battery system, wherein the filter device further includes a PCB, and a plurality of insulating layers of the PCB are positioned between the plurality of metal plates.

14. In paragraph 13, A battery system in which capacitance is provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

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