Sound production device and preparation method therefor, and display apparatus

Abstract

The present application relates to the technical field of acoustics, and provides a sound production device and a preparation method therefor, and a display apparatus. The sound production device comprises a first substrate, a first conductive layer, a first protective layer, an organic layer, a plurality of support part sets arranged in an array, and a sound production vibration layer, wherein the first conductive layer is located on a side of the first substrate, the first protective layer covers the first conductive layer, the organic layer is located on the side of the first protective layer away from the first conductive layer, each support part set comprises at least one support part, the support part is located on the side of the organic layer away from the first protective layer, and the sound production vibration layer is located on the side of the support part set away from the first substrate; the support part set is located in a cavity structure formed by the first protective layer and the sound production vibration layer; and the area of an orthographic projection of the organic layer on the first substrate is greater than the sum of the areas of orthographic projections of all of the support parts on the first substrate, and at least a partial region of each support part is in direct contact with the organic layer. The present application is applicable to a display apparatus having a surface sound production function.

Description

Sound-generating device, manufacturing method thereof, and display device Technical Field

[0001] The present application relates to the field of acoustic technology, and in particular to a sound-generating device, a preparation method thereof, and a display device. Background Art

[0002] With the increase in audio-visual scenes, directional sound technology has come into being. Directional sound technology modulates audio signals with ultrasonic carrier signals to concentrate the energy of emitted sound waves, forming audible sound waves with strong directionality, breaking the law of sound propagation in all directions, and creating an independent audio space that does not interfere with the surrounding environment.

[0003] Summary of the Invention

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a sound-generating device, comprising:

[0006] first base;

[0007] a first conductive layer, located on one side of the first substrate;

[0008] a first protective layer, covering the first conductive layer;

[0009] an organic layer, located on a side of the first protective layer away from the first conductive layer;

[0010] a plurality of support portion groups arranged in an array, each of the support portion groups comprising at least one support portion, the support portion being located on a side of the organic layer away from the first protective layer;

[0011] a sound-generating vibration layer, located on a side of the support portion group away from the first substrate; the support portion group is located in a cavity structure formed by the first protective layer and the sound-generating vibration layer;

[0012] The area of ​​the orthographic projection of the organic layer on the first substrate is larger than the sum of the areas of the orthographic projections of all the supporting portions on the first substrate, and at least a partial area of ​​each supporting portion is in direct contact with the organic layer.

[0013] In at least one embodiment of the present application, the sound-emitting device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area, the orthographic projection of the organic layer on the first substrate covers the portion of the first substrate located in the light-transmitting area, the supporting portion is arranged on the organic layer, and the supporting portion and the organic layer are of the same category of materials.

[0014] In at least one embodiment of the present application, the organic layer includes a plurality of raised portions arranged in an array, a groove is provided between two adjacent raised portions, and the number of the raised portions is the same as the number of the support portion groups;

[0015] The orthographic projection of the support portion group on the first substrate is located within the orthographic projection of the raised portion on the first substrate, and at least a portion of the support portion in the support portion group is in direct contact with the raised portion.

[0016] In at least one embodiment of the present application, the orthographic projections of the elevated portions on the first substrate have the same size; and the orthographic projection area of ​​the elevated portions on the first substrate is at least 50% greater than the orthographic projection area of ​​the support portion group on the first substrate.

[0017] In at least one embodiment of the present application, the support portion includes a first surface, at least a portion of the first surface is in direct contact with the elevated portion, and the area of ​​the contact surface between the support portion and the elevated portion is at least greater than 50% of the area of ​​the first surface.

[0018] In at least one embodiment of the present application, the support portion group includes at least two support portions, and the orthographic projection of each support portion in the same support portion group on the first substrate is located within the orthographic projection of the same raised portion on the first substrate; there is a gap between two adjacent support portions in the same support portion group, or, two adjacent support portions in the same support portion group are connected.

[0019] In at least one embodiment of the present application, the sound-emitting device further comprises an inorganic layer, wherein the inorganic layer is located on a side of the organic layer away from the first substrate, the inorganic layer at least covers the side surfaces of the raised portion and extends to cover the bottom of the groove, and the portion of the inorganic layer located at the bottom of the groove is in direct contact with the first protective layer.

[0020] In at least one embodiment of the present application, the inorganic layer has a plurality of openings, the area enclosed by the orthographic projection of the outer contour of the opening on the first substrate is located within the orthographic projection of the raised portion on the first substrate, and at least part of the area of ​​the support portion is located within the opening.

[0021] In at least one embodiment of the present application, the size of the area enclosed by the outer contour of the same support portion group is smaller than or equal to the size of the area enclosed by the outer contour of the opening, and the support portion is arranged in the opening and in direct contact with the raised portion.

[0022] In at least one embodiment of the present application, the size of the area enclosed by the outer contour of the same support portion group is larger than the size of the area enclosed by the outer contour of the opening; a partial area of ​​the support portion is arranged in the opening, and the support portion also covers a portion of the inorganic layer.

[0023] In at least one embodiment of the present application, a material of the support portion is the same as a material of the organic layer.

[0024] In at least one embodiment of the present application, the material of the inorganic layer is the same as the material of the first protective layer.

[0025] In at least one embodiment of the present application, a geometric center of an orthographic projection of the support portion group on the first substrate substantially overlaps with a geometric center of an orthographic projection of the elevation portion on the first substrate.

[0026] In at least one embodiment of the present application, when the support portion group includes one support portion, the distance between the edge of the orthographic projection figure of the support portion on the first substrate and the edge of the orthographic projection figure of the elevated portion on the first substrate is approximately equal along any direction parallel to the plane where the first substrate is located.

[0027] In at least one embodiment of the present application, along any direction parallel to the plane where the first substrate is located, the size of the groove is larger than the size of the raised portion.

[0028] In at least one embodiment of the present application, the distance between any two adjacent raised portions ranges from 0.5 mm to 5 mm.

[0029] In at least one embodiment of the present application, the support portions in the same support portion group have the same height along a direction perpendicular to the first substrate.

[0030] In at least one embodiment of the present application, the support portion group includes a first support portion and a second support portion, each of the first support portions has the same height along a direction perpendicular to the first substrate, each of the second support portions has the same height along a direction perpendicular to the first substrate, and the height of the first support portion along a direction perpendicular to the first substrate is greater than the height of the second support portion along a direction perpendicular to the first substrate.

[0031] In at least one embodiment of the present application, the sound-emitting vibration layer includes a second substrate and a second conductive layer located between the second substrate and the support portion group, and the cavity structure is formed between the first protective layer and the second conductive layer;

[0032] The height of each of the support portions in a direction perpendicular to the plane where the first substrate is located is smaller than the minimum distance between the surface of the support portion close to the first substrate and the second conductive layer.

[0033] In at least one embodiment of the present application, the sound-emitting device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area, and the support portion group is provided in the light-transmitting area;

[0034] The non-light-transmitting area includes a first peripheral trace, a second peripheral trace, a second protective layer, and a bonding portion, wherein the first peripheral trace is located between the first conductive layer and the first protective layer, and the first peripheral trace is electrically connected to the first conductive layer; the second peripheral trace is arranged on a side of the second conductive layer close to the first substrate, the second protective layer covers a side of the second peripheral trace away from the second conductive layer, and the second peripheral trace is electrically connected to the second conductive layer; at least a portion of the bonding portion is arranged between the inorganic layer and the second protective layer;

[0035] Along a direction perpendicular to the plane where the first substrate is located, a height of the bonding portion is greater than a sum of heights of the supporting portion and the raised portion.

[0036] In at least one embodiment of the present application, along the first direction or the second direction, the distance between any two adjacent raised portions is substantially equal;

[0037] Along the first direction or the second direction, for the elevated portion having the smallest distance to the boundary between the non-light-transmitting area and the light-transmitting area, the distance between the elevated portion and the boundary is approximately equal to the distance between any other two adjacent elevated portions, and the first direction is perpendicular to the second direction.

[0038] In at least one embodiment of the present application, the sum of the heights of the support portion and the elevated portion is in a range of 4 μm to 15 μm.

[0039] In at least one embodiment of the present application, the ratio of the height of the supporting portion to the height of the elevated portion is approximately 5:3.

[0040] In at least one embodiment of the present application, shapes of the orthographic projections of the supporting portion and the elevated portion on the first substrate are both arc-shaped.

[0041] In a second aspect, an embodiment of the present application provides a display device comprising a sound-emitting device as described in any one of the first aspects, and also comprising a display panel; the sound-emitting device is arranged on the light-emitting side of the display panel or inside the display panel; the orthographic projection of the light-transmitting area of ​​the sound-emitting device on the display panel overlaps with the display area of ​​the display panel.

[0042] In at least one embodiment of the present application, the display panel includes a liquid crystal display panel; the sound-emitting device is disposed on a light-emitting side of the display panel;

[0043] An orthographic projection of at least a portion of the support portion on the liquid crystal display panel overlaps with a spacer in the liquid crystal display panel.

[0044] In at least one embodiment of the present application, the display panel includes an organic light emitting diode display panel, and the sound-emitting device is disposed on a light-emitting side of the display panel or inside the display panel.

[0045] In a third aspect, an embodiment of the present application provides a method for preparing a sound-generating device, which is applied to prepare the sound-generating device as described in any one of the first aspects, the method comprising:

[0046] providing a first substrate;

[0047] forming a first conductive layer, a first protective layer and an organic layer on the first substrate respectively;

[0048] A plurality of support portion groups are formed in an array arrangement; each of the support portion groups includes at least one support portion, and the support portion is located on a side of the organic layer away from the first protective layer; wherein the area of ​​the orthographic projection of the organic layer on the first substrate is greater than the sum of the areas of the orthographic projections of all the support portions on the first substrate, and at least a portion of the area of ​​each support portion is in direct contact with the organic layer.

[0049] In at least one embodiment of the present application, the organic layer includes a plurality of raised portions arranged in an array, a groove is provided between two adjacent raised portions, and the number of the raised portions is the same as the number of the support portion groups; after forming the organic layer and before forming the plurality of support portion groups arranged in an array, the method further includes:

[0050] An inorganic layer is formed on the organic layer; the inorganic layer has a plurality of openings, and an area enclosed by the orthographic projection of the outer contour of the opening on the first substrate is located within the orthographic projection of the raised portion on the first substrate; at least a portion of the support portion is in direct contact with the raised portion through the opening.

[0051] In at least one embodiment of the present application, after forming the inorganic layer on the organic layer and after forming the support portion group, the method further includes:

[0052] providing a second substrate;

[0053] forming a second conductive layer on the second substrate;

[0054] An adhesive layer is provided on a portion of the inorganic layer located in a non-light-transmitting area of ​​the sound-emitting device, and the inorganic layer and the second protective layer are bonded together through the adhesive layer.

[0055] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0057] FIG1 is a schematic diagram of a partial structure of a sound-generating device in a related art provided by an embodiment of the present application;

[0058] FIG2 is a scanning electron microscope image of the sound-generating device shown in FIG1 before the support pillar falls off;

[0059] FIG3 is a scanning electron microscope image of the sound-generating device shown in FIG1 after the supporting pillar falls off;

[0060] 4 to 12 are schematic cross-sectional views of nine sound-generating devices according to embodiments of the present application;

[0061] FIG13 and FIG16 are schematic top views of partial structures of two sound-generating devices provided in embodiments of the present application;

[0062] FIG14 is a schematic diagram of the cross-sectional structure of FIG16 along the M1M2 direction;

[0063] FIG15 is a schematic diagram of the cross-sectional structure of FIG13 along the M3M4 direction;

[0064] 17 to 19 are schematic cross-sectional views of three display devices provided in embodiments of the present application;

[0065] 20 to 22 are schematic diagrams of three intermediate structures of a sound-generating device during the preparation process according to an embodiment of the present application;

[0066] 23 to 25 are schematic diagrams of intermediate structures of a display device during the preparation process according to an embodiment of the present application;

[0067] FIG26 is a schematic diagram of the cross-sectional structure of another sound-generating device provided in an embodiment of the present application. Specific embodiments

[0068] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0069] In the embodiments of the present application, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with basically the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present application, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0070] In the embodiments of the present application, the terms "upper" and "lower" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0071] Throughout the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present application. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0072] In the embodiments of the present application, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0073] The features "parallel," "perpendicular," and "identical" used in the embodiments of the present application include features such as "parallel," "perpendicular," and "identical" in the strict sense, as well as "approximately parallel," "approximately perpendicular," and "approximately identical" that include certain tolerances, taking into account the measurement and tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), and represent within an acceptable range of deviation for a particular value determined by a person of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the stated value.

[0074] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, that is, meaning "including, but not limited to."

[0075] In the embodiments of this application, "same layer" refers to the relationship between multiple film layers formed from the same material after the same step (e.g., a one-step patterning process). "Same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same. Polygons in this specification are not strictly defined and can be approximate triangles, parallelograms, trapezoids, pentagons, or hexagons, etc., and some small deformations due to tolerances may exist.

[0076] With the increase in audio-visual scenes, directional sound technology has come into being. Directional sound technology modulates audio signals with ultrasonic carrier signals and utilizes the directional characteristics of ultrasonic waves to concentrate the energy of the emitted sound waves, forming audible sound waves with strong directionality, breaking the law of sound propagation in all directions and creating an independent audio space that does not interfere with the surrounding environment.

[0077] In the related art, a directional sound-emitting device is generally provided with a first electrode, a second electrode, and a support column 4 located between the first electrode and the second electrode, a cavity is formed between the first electrode and the second electrode, the support column is arranged on the first electrode, the second electrode can vibrate, and the support column is used to control the direction of the sound wave of the sound-emitting device. However, as shown in FIG1 , the sound-emitting device includes a first electrode 3-2 and an electrode protective layer 3-3 sequentially arranged on a substrate 3-1, and the support column 4 is arranged on the electrode protective layer 3-3; in combination with the SEM (Scanning Electron Microscope) images shown in FIG2 and FIG3 , during the vibration of the directional sound-emitting device, the support column 4 is very likely to fall off, wherein FIG2 is an SEM image of the support column 4 before falling off, and FIG3 is an SEM image of the support column 4 after falling off; thus, on the one hand, after falling off, the support column 4 falls on other areas of the sound-emitting device, causing uneven transmittance of the sound-emitting device, which may reduce the aesthetic appearance; on the other hand, the falling off of the support column 4 changes the direction of the directional sound, which is very likely to cause sound leakage, thereby reducing the effect of the directional sound. When the sound-generating device is applied to a display device, the falling off of the supporting pillar 4 is very likely to cause uneven brightness in the display area of ​​the display device, thereby reducing the display effect.

[0078] Based on this, an embodiment of the present application provides a sound-emitting device, a preparation method thereof, and a display device, wherein the sound-emitting device includes a first substrate, a first conductive layer, a first protective layer, an organic layer, a plurality of support part groups arranged in an array, and a sound-emitting vibration layer; wherein the first conductive layer is located on one side of the first substrate, the first protective layer covers the first conductive layer, the organic layer is located on the side of the first protective layer away from the first conductive layer, each support part group includes at least one support part, the support part is located on the side of the organic layer away from the first protective layer, and the sound-emitting vibration layer is located on the side of the support part group away from the first substrate; the support part group is located in a cavity structure formed by the first protective layer and the sound-emitting vibration layer; the area of ​​the orthographic projection of the organic layer on the first substrate is greater than the sum of the areas of the orthographic projections of all support parts on the first substrate, and at least part of the area of ​​each support part is in direct contact with the organic layer.

[0079] In an embodiment of the present application, an organic layer is arranged between the first protective layer and the multiple support part groups, and the area of ​​the orthographic projection of the organic layer on the first substrate is larger than the sum of the areas of the orthographic projections of all the support parts on the first substrate, and at least a partial area of ​​each support part is in direct contact with the organic layer; in this way, the organic layer can increase the force between the support part group and the first protective layer, and the organic layer can buffer the energy generated by the vibration. During the vibration of the sound-emitting device, the risk of the support part falling off is greatly reduced, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0080] The following will specifically introduce and illustrate the sound-generating device and its preparation method, and the display device provided in the embodiments of the present application with reference to the accompanying drawings.

[0081] An embodiment of the present application provides a sound-generating device, as shown in FIG4 to FIG12 , which includes:

[0082] a first substrate 1;

[0083] A first conductive layer 2 is located on one side of the first substrate 1;

[0084] a first protective layer 3 covering the first conductive layer 2;

[0085] The organic layer 4 is located on a side of the first protective layer 3 away from the first conductive layer 2;

[0086] A plurality of support portion groups 5G arranged in an array, each support portion group 5G including at least one support portion 5, the support portion 5 being located on a side of the organic layer 4 away from the first protective layer 3;

[0087] The sound-generating vibration layer 6 is located on the side of the support portion group 5G away from the first substrate 1; the support portion group 5G is located in the cavity structure Q formed by the first protective layer 3 and the sound-generating vibration layer 6;

[0088] The orthographic projection area of ​​the organic layer 4 on the first substrate 1 is larger than the sum of the orthographic projection areas of all the support portions 5 on the first substrate 1 , and at least a portion of each support portion 5 is in direct contact with the organic layer 4 .

[0089] The material of the first substrate 1 is not limited here.

[0090] In some examples, the material of the first substrate 1 can be made of one or more materials selected from the group consisting of glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes but is not limited to these.

[0091] In some examples, the first substrate 1 may be a rigid substrate or a flexible substrate;

[0092] When the first substrate 1 is a flexible substrate, the first substrate 1 may include a single layer of flexible material; or the first substrate 1 may include a first flexible material layer, a first inorganic non-metallic material layer, a second flexible material layer, and a second inorganic non-metallic material layer stacked in sequence. The first flexible material layer and the second flexible material layer are made of polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The first inorganic non-metallic material layer and the second inorganic non-metallic material layer are made of silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the first substrate 1. The first inorganic non-metallic material layer and the second inorganic non-metallic material layer are also referred to as barrier layers. This can improve the reliability of the sound-generating device and increase its service life.

[0093] When the first substrate 1 is a rigid substrate, the first substrate 1 may include a glass substrate.

[0094] It should be noted that when the sound-generating device is used in a display device, the first substrate may preferably be a flexible substrate to reduce the thickness of the sound-generating device, thereby reducing the volume of the display device, making the display device thinner and lighter, and expanding its application scenarios.

[0095] The material of the first conductive layer 2 is not limited here.

[0096] In some examples, the material of the first conductive layer 2 is a light-transmitting conductive material;

[0097] Exemplarily, the material of the first conductive layer 2 is metal. In this case, in order to achieve light transmittance, the metal film layer has a relatively small thickness. For example, the thickness of the metal film layer is nanometer level.

[0098] Exemplarily, the material of the first conductive layer 2 is metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0099] It should be noted that the sound-emitting device can be a directional sound-emitting device, and is applied to a display panel to form a display device with a directional sound-emitting function, wherein the sound-emitting device is usually arranged on the light-emitting side of the display panel. Therefore, most areas of the sound-emitting device are required to have good light transmittance.

[0100] In an exemplary embodiment, the first protective layer 3 and the support portion 5 are made of different materials. For example, the first protective layer 3 is made of an inorganic material, and the support portion 5 is made of an organic material.

[0101] In an exemplary embodiment, the support portion 5 is made of a light-transmitting material.

[0102] In an exemplary embodiment, the material of the above-mentioned first protective layer 3 is an insulating material, which is used to isolate the first conductive layer 2 from other conductive materials to prevent short circuits in the circuit; in addition, the first protective layer 3 can also protect the first conductive layer 2 to prevent the first conductive layer 2 from being corroded or damaged by factors such as water vapor in the external environment during use.

[0103] Exemplarily, the material of the first protective layer 3 may be an inorganic insulating material;

[0104] For example, the inorganic insulating material may be silicon nitride, silicon oxide, or a combination of one or more of silicon oxynitride.

[0105] In an exemplary embodiment, as shown in FIG. 4 , the organic layer 4 is a continuous structure covering the entire surface. The organic layer 4 covers most of the first protective layer 3 , and the support portion group 5G is evenly distributed on the organic layer 4 .

[0106] In an exemplary embodiment, as shown in Figure 5 or Figure 6, the organic layer 4 includes a plurality of discontinuous (or spaced apart) raised portions 41, a groove C is provided between any two adjacent raised portions 41, and the support portions 5 in the same support portion group 5G are all provided on the same raised portion 41.

[0107] The direct contact between at least a portion of each support portion 5 and the organic layer 4 includes but is not limited to the following situations:

[0108] First, as shown in FIG4 to FIG7, FIG9, FIG10 and FIG12, the entire bottom surface of each support portion 5 is in direct contact with the organic layer 4;

[0109] Second, as shown in FIG. 8 and FIG. 11 , a portion of the bottom surface of each support portion 5 is in direct contact with the organic layer 4 .

[0110] In actual applications, the larger the area of ​​the region where the bottom surface of the support part 5 is in direct contact with the organic layer 4, the more conducive it is to improving the interface adhesion between the support part 5 and the organic layer 4, thereby improving the vibration stability of the support part 5 during the vibration of the sound-emitting device, reducing the probability of it falling off, improving the quality of the sound-emitting device, and ensuring the directional sound effect of the sound-emitting device.

[0111] Here, there is no limitation on whether the organic layer 4 and the support portion 5 are made of the same material.

[0112] In an exemplary embodiment, the organic layer 4 and the support portion 5 are made of the same material, for example, both are organic materials, which may include organic polymer materials. Materials of the same type have good adhesion.

[0113] The specific material of the organic layer 4 is not limited here. For example, the organic material can be synthetic resin, rubber, a composite material of resin and fiber, a composite material of rubber and fiber, etc.

[0114] Exemplarily, the materials of the organic layer 4 and the support portion 5 can both be synthetic resins. For example, the materials of the organic layer 4 and the support portion 5 can both be one of polymethyl methacrylate (PMMA), polystyrene (PS), polycarbonate (PC), allyl diglycol carbonate (CR-39), polyimide (PI), polyethylene terephthalate (PET) or epoxy optical plastic.

[0115] Among the multiple support part groups 5G arranged in the above array, the number of support parts 5 included in each support part group 5G is the same, the structure of each support part group 5G is the same, and the size of each support part group 5G is the same; to ensure that each support part group 5G is evenly arranged in the sound-emitting device, thereby improving the directional sound effect of the sound-emitting device and the uniformity of sound wave propagation.

[0116] Here, the number of support portions 5 included in each support portion group 5G is not limited.

[0117] For example, in order to simplify the design, each support portion group 5G may include only one support portion 5, so that all support portions 5 in the sound-generating device have the same structure and size.

[0118] Among them, the structure of the above-mentioned supporting portion 5 includes the shape of the plane figure of the supporting portion 5 and the cross-sectional figure of the supporting portion 5. The dimensions of the above-mentioned supporting portion 5 include height, plane dimension and cross-sectional dimension. The plane dimension is the dimension of the plane figure of the positive projection of the supporting portion 5 on the first substrate 1, and the cross-sectional dimension is the dimension of the cross-sectional figure of the supporting portion 5 along the direction perpendicular to the first substrate 1.

[0119] For example, in some embodiments, in order to improve the product reliability of the sound-generating device and reduce the risk of the support part 5 falling off during the sound-generating vibration process, each support part group 5G can be set to include two or more support parts 5. In this way, the more support parts 5 there are, the smaller the vibration energy each support part 5 is subjected to under the same vibration energy, thereby greatly reducing the risk of the support part 5 falling off.

[0120] When each support portion group 5G includes two or more support portions 5, whether the structures and sizes of the multiple (two or more) support portions 5 in the same support portion group 5G are the same is not limited. For example, each support portion group 5G includes two support portions 5 (a first support portion and a second support portion), which may include but is not limited to the following situations:

[0121] The first and second supporting parts have the same structure and size.

[0122] Second, the first supporting portion and the second supporting portion have the same structure, but different sizes, that is, one or two of the height, plane size and cross-sectional size are different.

[0123] For example, the first support portion and the second support portion have different heights;

[0124] For example, the first support portion and the second support portion have different planar dimensions;

[0125] For example, the first support portion and the second support portion have different cross-sectional dimensions.

[0126] Third, the structures of the first supporting portion and the second supporting portion are different.

[0127] For example, the plane shapes of the first support portion and the second support portion are different. Specifically, the plane shape of the first support portion may be an arc, or a combination of an arc and a polygon.

[0128] Among them, the arc shape may include a circle, an ellipse, a semicircle, a semi-ellipse, a fan shape, etc., and the polygonal shape may include a triangle, a quadrilateral, a pentagon, a hexagon, etc.

[0129] In some embodiments, the first conductive layer 2 can be called an ultrasonic electrode, which is configured to generate an ultrasonic signal under the control of an electrical signal. Each supporting part 5 can play a role in regulating the directional transmission of ultrasonic waves, and the sound-emitting vibration layer 6 vibrates after receiving the ultrasonic signal.

[0130] In an exemplary embodiment, the support part group 5G is located in the cavity structure Q formed by the first protective layer 3 and the sound-emitting vibration layer 6, and there is a gap between the support part 5 in the support part group 5G and the sound-emitting vibration layer 6, that is, the support part 5 is not in contact with the sound-emitting vibration layer 6.

[0131] In a direction perpendicular to the plane where the first substrate 1 is located, the depth of the cavity structure Q is greater than the height of the support portion 5 .

[0132] In the embodiments of the present application, as shown in Figures 4 to 12, an organic layer 4 is provided between the first protective layer 3 and the plurality of support portion groups 5G, and the area of ​​the orthographic projection of the organic layer 4 on the first substrate 1 is larger than the sum of the areas of the orthographic projections of all the support portions 5 on the first substrate 1, and at least a portion of each support portion 5 is in direct contact with the organic layer 4; in this way, the organic layer 4 can increase the force between the support portion group 5G and the first protective layer 3, and during the vibration of the sound-emitting device, the risk of the support portion 5 falling off is greatly reduced, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0133] In at least one embodiment of the present application, as shown in Figure 4, the sound-emitting device includes a light-transmitting area T and a non-light-transmitting area FT surrounding the light-transmitting area T, the orthographic projection of the organic layer 4 on the first substrate 1 covers the portion of the first substrate 1 located in the light-transmitting area T, and the support portion 5 is arranged on the organic layer 4.

[0134] In some examples, the support portion 5 and the organic layer 4 are made of the same type of material.

[0135] In an embodiment of the present application, a whole-surface continuous organic layer 4 is provided in the light-transmitting area T of the sound-emitting device, and the support portion 5 is provided on the organic layer 4. The organic layer 4 (being an organic material) can buffer the energy of the vibration. In addition, since the support portion 5 and the organic layer 4 are made of the same type of material, the adhesion between the support portion 5 and the organic layer 4 can be greatly improved. During the vibration of the sound-emitting device, the risk of the support portion 5 falling off is greatly reduced, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0136] In at least one embodiment of the present application, as shown in FIG5 or FIG6 , the organic layer 4 includes a plurality of raised portions 41 arranged in an array, with a groove C between two adjacent raised portions 41 , and the number of the raised portions 41 is the same as the number of the support portion group 5G;

[0137] 5 as an example, the orthographic projection S1 of the support portion group 5G on the first substrate 1 is located within the orthographic projection S2 of the elevated portion 41 on the first substrate 1 , and at least a portion of the support portion 5 in the support portion group 5G is in direct contact with the elevated portion 41 .

[0138] In an exemplary embodiment, the planar dimensions of the elevated portion 41 are larger than the planar dimensions of the support portion group 5G. Thus, when the sound-generating device vibrates, since the organic layer 4 is made of an organic material, the elevated portion 41 of the organic layer 4 can buffer the vibration energy. The greater the size difference between the elevated portion 41 and the planar dimensions of the support portion group 5G, the greater the buffering effect. Of course, the greater the size difference between the elevated portion 41 and the planar dimensions of the support portion group 5G, the greater the energy consumption and the power consumption of the sound-generating device. In actual applications, a balance must be struck between the two based on the product's performance requirements.

[0139] There is no limitation on whether the support portion 5 and the raised portion 41 are made of the same material. In some examples, the support portion 5 and the raised portion 41 may be made of different materials. In practice, to improve adhesion between the support portion 5 and the raised portion 41 and further reduce the risk of the support portion 5 falling off, the support portion 5 and the raised portion 41 may be made of the same material, or even the same material.

[0140] The direct contact between at least a portion of the support portion 5 in the support portion group 5G and the raised portion 41 includes but is not limited to the following situations:

[0141] For example, as shown in FIG5 , FIG6 , FIG7 , FIG9 , FIG10 and FIG12 , the entire bottom area of ​​the support portion 5 in the support portion group 5G is in direct contact with the raised portion 41 ;

[0142] For another example, as shown in FIG8 and FIG11 , a portion of the bottom portion of the support portion 5 in the support portion group 5G is in direct contact with the raised portion 41 .

[0143] In an embodiment of the present application, the organic layer 4 is provided with a plurality of raised portions 41 arranged in an array, and the support portion 5 is provided on the raised portions 41. During the vibration of the sound-emitting device, the raised portions 41 can buffer the energy of the vibration, thereby greatly reducing the risk of the support portion 5 falling off, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0144] In at least one embodiment of the present application, as shown in Figures 5 to 12, the dimensions of the orthographic projections of the elevated portions 41 on the first substrate 1 are the same; the orthographic projection area of ​​the elevated portions 41 on the first substrate 1 is at least greater than 50% of the orthographic projection area of ​​the support portion group 5G on the first substrate 1.

[0145] Illustratively, the orthographic projection area of ​​the raised portion 41 on the first substrate 1 is larger than 50%, 55%, 60%, 65% or 68% of the orthographic projection area of ​​the support portion group 5G on the first substrate 1 .

[0146] In an embodiment of the present application, by setting the area of ​​the orthographic projection of the raised portion 41 on the first substrate 1 to be at least larger than 50% of the area of ​​the orthographic projection of the support portion group 5G on the first substrate 1, during the vibration of the sound-emitting device, the raised portion 41 can play a good buffering role on the energy of the vibration, thereby greatly reducing the risk of the support portion 5 falling off, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0147] In at least one embodiment of the present application, as shown in Figures 5 to 12, the support portion 5 includes a first surface (for example, the surface marked B1 in Figure 5, i.e., the bottom surface of the support portion 5), at least a portion of the first surface B1 is in direct contact with the elevated portion 41, and the area of ​​the contact surface between the support portion 5 and the elevated portion 41 is at least greater than 50% of the area of ​​the first surface B1.

[0148] That is to say, for each support part 5, more than 50% of the area of ​​its first surface B1 is in direct contact with the raised part 41. In this way, good adhesion is ensured between the raised part 41 and the support part 5, so that the support part 5 has a good force with the first protective layer 3 through the raised part 41, avoiding the support part 5 from falling off during the vibration of the sound-emitting device, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0149] In at least one embodiment of the present application, as shown in FIG6 and FIG9 to FIG12 , the support portion group 5G includes at least two support portions 5 , and the orthographic projections of the support portions 5 in the same support portion group 5G on the first substrate 1 are located within the orthographic projection of the same raised portion 41 on the first substrate 1 ;

[0150] As shown in FIG6 , FIG9 , FIG10 and FIG11 , there is a gap X between two adjacent support portions 5 in the same support portion group 5G, or, as shown in FIG12 , two adjacent support portions 5 in the same support portion group 5G are connected.

[0151] The size of the gap is not limited here and can be determined based on the design space and process accuracy of the actual product.

[0152] It should be noted that, in some embodiments, a gap X may be provided between two adjacent support portions 5 in each support portion group 5G in the same sound-emitting device; in other embodiments, two adjacent support portions 5 in each support portion group 5G in the same sound-emitting device may be connected; in still other embodiments, a gap X may be provided between two adjacent support portions 5 in each support portion group 5G in a partial area of ​​a sound-emitting device, and two adjacent support portions 5 in each support portion group 5G in another partial area may be connected.

[0153] In at least one embodiment of the present application, as shown in Figures 7 to 12, the sound-emitting device further includes an inorganic layer 9, which is located on the side of the organic layer 4 away from the first substrate 1. The inorganic layer 9 at least covers the side of the raised portion 41 and extends to cover the bottom of the groove C. The portion of the inorganic layer 9 located at the bottom of the groove C is in direct contact with the first protective layer 3.

[0154] In some embodiments, the material of the inorganic layer 9 and the material of the first protective layer 3 are both inorganic materials.

[0155] Exemplarily, the material of the inorganic layer 9 is one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0156] Exemplarily, the material of the inorganic layer 9 is the same as that of the first protective layer 3 .

[0157] In an exemplary embodiment, as shown in Figures 7 to 12, the inorganic layer 9 can also extend from the side of the raised portion 41 to the surface of the raised portion 41 away from the first substrate 1, thereby increasing the contact surface area between the inorganic layer 9 and the raised portion 41, thereby increasing the adhesion between the inorganic layer 9 and the raised portion 41, and reducing the probability of the inorganic layer 9 and the raised portion 41 falling off during the vibration of the sound-emitting device.

[0158] In an embodiment of the present application, an inorganic layer 9 is provided in the sound-emitting device, and the inorganic layer 9 at least covers the side surfaces of the raised portion 41 and extends to cover the bottom of the groove C. The portion of the inorganic layer 9 located at the bottom of the groove C is in direct contact with the first protective layer 3. In this way, the inorganic layer 9 can improve the adhesion between the raised portion 41 and the first protective layer 3, thereby preventing the supporting portion 5 and the raised portion 41 from falling off as a whole during the vibration of the sound-emitting device, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0159] In at least one embodiment of the present application, as shown in Figures 7 to 12, the inorganic layer 9 has a plurality of openings K (such as the openings K marked in Figure 8), and the area enclosed by the orthographic projection of the outer contour of the openings K on the first substrate 1 is located within the orthographic projection of the raised portion 41 on the first substrate 1, and at least part of the area of ​​the support portion 5 is located within the openings K.

[0160] In an exemplary embodiment, as shown in FIG. 7 , FIG. 9 , and FIG. 10 , the bottom of the support portion 5 (ie, the bottom surface, or referred to as the first surface B1 ) is located in the opening K. In the exemplary embodiment, as shown in FIG.

[0161] In an exemplary embodiment, as shown in Figures 8 and 11, a partial area of ​​the bottom of the support portion 5 (i.e., the bottom surface, or referred to as the first surface B1) is located in the opening K, and a partial area is arranged on the side of the inorganic layer 9 away from the first substrate 1 (i.e., arranged on the inorganic layer 9).

[0162] In an exemplary embodiment, when two or more supporting parts 5 are provided on the same elevated part 41 , the number of the openings K provided in the portion of the organic layer 9 located on the same elevated part 41 is not limited.

[0163] In some embodiments, as shown in FIG9 , FIG11 or FIG12 , an opening K may be provided on a raised portion 41 so that at least a portion of each support portion 5 in a same support portion group 5G is disposed in the same opening K;

[0164] In other embodiments, as shown in FIG10 , two or more openings K may be provided on a single elevated portion 41 , with at least a portion of a support portion 5 disposed within each opening K. In this case, as shown by the rectangular area in FIG10 , the organic layer 4 is disposed in the area between two adjacent support portions 5 on the same elevated portion 41 .

[0165] In practical applications, an opening K may be provided on a raised portion 41 so that at least a portion of each support portion 5 in the same support portion group 5G is disposed in the same opening K, thereby simplifying the design and reducing the difficulty of the manufacturing process.

[0166] In at least one embodiment of the present application, as shown in Figure 7 or Figure 9, the size of the area enclosed by the outer contour of the same support portion group 5G is less than or equal to the size of the area enclosed by the outer contour of the opening K, and the support portion 5 is arranged in the opening K and is in direct contact with the raised portion 41.

[0167] In an exemplary embodiment, as shown in Figure 7 or Figure 9, the size of the plane figure of the area enclosed by the outer contour of the same support portion group 5G (for example, area S3) and the size of the plane figure of the area enclosed by the outer contour of the opening K (for example, area) are approximately the same. At this time, a partial area of ​​the side surface of the support portion 5 in the same support portion group 5G can be in direct contact with the inorganic layer 9.

[0168] In an exemplary embodiment, the size (e.g., area) of the plane figure of the area enclosed by the outer contour of the same support portion group 5G is smaller than the size (e.g., area) of the plane figure of the area enclosed by the outer contour of the opening K. At this time, there is a gap between a partial area of ​​the side surface of the support portion 5 and the inorganic layer 9 in the same support portion group 5G.

[0169] It should be noted that the area enclosed by the outer contour of the same support portion group 5G includes the area where all the support portions 5 in the same support portion group 5G are located, and also includes the area occupied by the gaps between the support portions 5 in the same support portion group 5G.

[0170] In at least one embodiment of the present application, as shown in Figure 8 or Figure 11, the size of the area enclosed by the outer contour of the same support portion group 5G is larger than the size of the area enclosed by the outer contour of the opening K; a partial area of ​​the support portion 5 is arranged in the opening K, and the support portion 5 also covers a portion of the inorganic layer 9.

[0171] In an exemplary embodiment, as shown in Figure 8 or Figure 11, the area of ​​the plane figure of the area enclosed by the outer contour of the same support portion group 5G is smaller than the area of ​​the plane figure of the area enclosed by the outer contour of the opening K, so that a partial area of ​​the support portion 5 is set on the inorganic layer 9.

[0172] It should be noted that, for the situation shown in FIG. 8 or FIG. 11 , the area of ​​the region where each support portion 5 in the same support portion group 5G directly contacts the raised portion 41 is larger than the area where each support portion 5 in the same support portion group 5G contacts the inorganic layer 9 .

[0173] In some embodiments, the structure of the left part in the same support portion group 5G is completely set in the opening, and the structure of the right part has a local area set on the inorganic layer 9; of course, the structure of the right part in the same support portion group 5G can also be completely set in the opening, and the structure of the left part has a local area set on the inorganic layer 9.

[0174] In at least one embodiment of the present application, the material of the support portion 5 is the same as that of the organic layer 4 .

[0175] In an embodiment of the present application, when the material of the support portion 5 is the same as that of the organic layer 4, the interfacial adhesion between the support portion 5 and the organic layer 4 can be greatly improved, thereby preventing the support portion 5 from falling off during the vibration of the sound-emitting device, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0176] In at least one embodiment of the present application, the material of the inorganic layer 9 is the same as that of the first protective layer 3. When the portion of the inorganic layer 9 located at the bottom of the groove C is in direct contact with the first protective layer 3, since the inorganic layer 9 is made of the same material as the first protective layer 3, the interfacial adhesion between the two is relatively large. In this way, the inorganic layer 9 can improve the adhesion between the raised portion 41 and the first protective layer 3, preventing the support portion 5 and the raised portion 41 from falling off as a whole during vibration of the sound-emitting device, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0177] In at least one embodiment of the present application, as shown in FIG. 13 and FIG. 16 , the geometric center of the orthographic projection of the support portion group 5G on the first substrate 1 roughly overlaps with the geometric center of the orthographic projection of the elevation portion 5 on the first substrate 1 .

[0178] For example, taking the structural diagram shown in Figure 13 as an example, when the support portion group 5G includes two support portions 5, the geometric center of the orthographic projection figure of the support portion group 5G on the first substrate 1 is located in the area between the orthographic projection figures of the two support portions 5 on the first substrate 1, and the geometric center of the orthographic projection figure of the raised portion 5 on the first substrate 1 and the geometric center of the orthographic projection figure of the support portion group 5G on the first substrate 1 roughly overlap.

[0179] Exemplarily, taking the structural diagram shown in FIG16 as an example, when the support portion group 5G includes one support portion 5, the geometric center of the orthographic projection figure of the support portion 5 on the first substrate 1 roughly overlaps with the geometric center of the orthographic projection figure of the elevation portion 5 on the first substrate 1.

[0180] In an embodiment of the present application, by setting the geometric center of the orthographic projection figure of the support part group 5G on the first substrate 1 to roughly overlap with the geometric center of the orthographic projection figure of the raised part 5 on the first substrate 1, the support part group 5G is distributed as close to the center of the raised part 5 as possible. In this way, during the vibration of the sound-emitting device, the energy generated by the vibration can be evenly transmitted to the raised part 5 and each support part 5 in the support part group 5G, so that the vibration energy received by each support part 5 is as consistent as possible, thereby reducing the problem of support parts 5 in the same support part group 5G falling off due to excessive vibration energy, thereby improving the quality of the sound-emitting device, and improving the directional sound effect of the sound-emitting device and the uniformity of sound wave propagation.

[0181] In at least one embodiment of the present application, when the support portion group 5G includes one support portion 5, the distance between the edge of the orthographic projection figure of the support portion 5 on the first substrate 1 and the edge of the orthographic projection figure of the raised portion 41 on the first substrate 1 is approximately equal along any direction parallel to the plane where the first substrate 1 is located.

[0182] In some embodiments, as shown in Figure 16, the shape of the orthographic projection figure of the supporting portion 5 on the first substrate 1 is the same as the shape of the orthographic projection figure of the raising portion 41 on the first substrate 1, and the geometric centers of the two are roughly overlapping. In this way, in any direction parallel to the plane where the first substrate 1 is located, the distance between the edge of the orthographic projection figure of the supporting portion 5 on the first substrate 1 and the edge of the orthographic projection figure of the raising portion 41 on the first substrate 1 is roughly equal.

[0183] Exemplarily, as shown in Figure 16, the shape of the orthographic projection figure of the supporting portion 5 on the first substrate 1 is the same as the shape of the orthographic projection figure of the raising portion 41 on the first substrate 1, and both are circular or elliptical, and the geometric centers of the two roughly overlap; in a first direction parallel to the plane where the first substrate 1 is located, the distance between the edge of the orthographic projection figure of the supporting portion 5 on the first substrate 1 and the edge of the orthographic projection figure of the raising portion 41 on the first substrate 1 is d1; in a second direction parallel to the plane where the first substrate 1 is located, the distance between the edge of the orthographic projection figure of the supporting portion 5 on the first substrate 1 and the edge of the orthographic projection figure of the raising portion 41 on the first substrate 1 is d2, and d1 is roughly equal to d2; wherein, the first direction can be a vertical direction, and the second direction can be a horizontal direction.

[0184] In an embodiment of the present application, when the support portion group 5G includes one support portion 5, by setting the distance between the edge of the orthographic projection figure of the support portion 5 on the first substrate 1 and the edge of the orthographic projection figure of the raised portion 41 on the first substrate 1 in any direction parallel to the plane where the first substrate 1 is located to be approximately equal, so that one support portion 5 can be distributed in the middle position of the raised portion 41. In the process of vibration of the sound-emitting device, the energy generated by the vibration can be evenly transmitted to the raised portion 5 and the support portion 5, so that the vibration energy received by the support portion 5 from different directions is as consistent as possible, thereby reducing the peeling problem caused by excessive vibration energy in local areas of the support portion 5, thereby improving the quality of the sound-emitting device, and improving the directional sound effect of the sound-emitting device and the uniformity of sound wave propagation.

[0185] In at least one embodiment of the present application, along any direction parallel to the plane where the first substrate 1 is located, the size of the groove C is larger than the size of the raised portion 41 .

[0186] In an exemplary embodiment, as shown in FIG. 13 or FIG. 16 , along a first direction (eg, horizontal direction) parallel to the plane where the first substrate 1 is located, a dimension L of the groove C is greater than a dimension d3 of the raised portion 41 .

[0187] In an exemplary embodiment, as shown in FIG. 13 or FIG. 16 , along a second direction (eg, a vertical direction) parallel to the plane where the first substrate 1 is located, a dimension L′ of the groove C is greater than a dimension d4 of the raised portion 41 .

[0188] In some embodiments, a dimension d3 of the raised portion 41 along a first direction (eg, horizontal direction) parallel to the plane of the first substrate 1 is substantially equal to a dimension d4 of the raised portion 41 along a second direction (eg, vertical direction) parallel to the plane of the first substrate 1 .

[0189] In some embodiments, a dimension L of the groove C along a first direction (eg, horizontal direction) parallel to the plane of the first substrate 1 is substantially equal to a dimension L' of the groove C along a second direction (eg, vertical direction) parallel to the plane of the first substrate 1 .

[0190] In at least one embodiment of the present application, the distance between any two adjacent raised portions 41 ranges from 0.5 mm to 5 mm.

[0191] Exemplarily, the distance between any two adjacent raised portions 41 may be 0.8 mm, 1.0 mm, 1.3 mm, 1.5 mm, 1.8 mm, 2.0 mm, 2.3 mm, 2.5 mm, 2.8 mm, 3.0 mm, 3.3 mm, 3.5 mm, 3.8 mm, 4.0 mm, 4.3 mm, 4.5 mm, 4.8 mm or 5 mm.

[0192] In an exemplary embodiment, the distance between any two adjacent raised portions 41 can be approximately equal along the first direction (for example, the horizontal direction) or the second direction (for example, the vertical direction). Since the support portion group 5G is arranged on the raised portion 41, the distance between any two adjacent raised portions 41 along the first direction (for example, the horizontal direction) or the second direction (for example, the vertical direction) is approximately equal, which helps the support portion group 5G to be evenly distributed on the first substrate 1, thereby facilitating the support portion group 5G to directionally propagate ultrasonic signals, adjust the directional sound transmission effect, and improve the uniformity of the directional sound transmission, thereby improving the quality of the sound-emitting device and ensuring the directional sound transmission effect of the sound-emitting device.

[0193] In at least one embodiment of the present application, as shown in FIG. 4 to FIG. 12 , the support portions 5 in the same support portion group 5G have the same (substantially the same) height in a direction perpendicular to the first substrate 1 .

[0194] For example, as shown in FIG6 and FIG9 to FIG12 , when the same support portion group 5G includes two support portions 5 , the support portions 5 in the same support portion group 5G have the same (substantially the same) height in a direction perpendicular to the first substrate 1 .

[0195] In at least one embodiment of the present application, the heights of the support portions 5 in the same support portion group 5G along a direction perpendicular to the first substrate 1 are at least partially different.

[0196] In at least one embodiment of the present application, as shown in Figure 26, the support portion group 5G includes a first support portion 51 and a second support portion 52, the height d5 of each first support portion 51 along the direction perpendicular to the first substrate 1 is the same, the height d6 of each second support portion 52 along the direction perpendicular to the first substrate 1 is the same, and the height d5 of the first support portion 51 along the direction perpendicular to the first substrate 1 is greater than the height d6 of the second support portion 52 along the direction perpendicular to the first substrate 1.

[0197] In at least one embodiment of the present application, as shown in FIG. 4 to FIG. 12 , the sound-emitting vibration layer 6 includes a second substrate 62 and a second conductive layer 61 located between the second substrate 62 and the support portion group 5G. A cavity structure Q is formed between the first protective layer 3 and the second conductive layer 61, and the support portion group 5G is located within the cavity structure Q.

[0198] Taking the mark shown in FIG. 4 as an example, the height H3 of each support portion 5 in the direction perpendicular to the plane of the first substrate 1 is smaller than the minimum distance H4 between the surface of the support portion 5 close to the first substrate 1 and the second conductive layer 61 .

[0199] In an exemplary embodiment, the second substrate 62 is made of a flexible material to vibrate when the sound generating device generates sound.

[0200] In some examples, the material of the second substrate 62 may be made of one or more materials selected from the group consisting of polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes but is not limited thereto.

[0201] In some examples, the second substrate 62 may include a single layer of flexible material to avoid reducing the vibration efficiency due to a large number of membrane layers or a large thickness.

[0202] The material of the second conductive layer 61 is not limited here.

[0203] In some examples, the material of the second conductive layer 61 is a light-transmitting conductive material;

[0204] Exemplarily, the material of the second conductive layer 61 is metal. In this case, in order to achieve light transmittance, the metal film layer has a relatively small thickness. For example, the thickness of the metal film layer is nanometer level.

[0205] Exemplarily, the material of the second conductive layer 61 is metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0206] Here, there is no limitation on the size of the difference between the height H3 of each support part 5 in the direction perpendicular to the plane of the first substrate 1 and the minimum distance H4 between the surface of the support part 5 close to the first substrate 1 and the second conductive layer 61. The design can be based on the size of the sound-emitting device, the material of the sound-emitting vibration layer 6, the thickness of the sound-emitting vibration layer 6 and the sound power of the sound-emitting device.

[0207] In the embodiment of the present application, in a static state, each supporting portion 5 is not in contact with the sound-emitting vibration layer 6 .

[0208] In some embodiments, when the sound-generating device is in a sound-generating state, at least a portion of the support portion 5 is not in contact with the sound-generating vibration layer 6 .

[0209] Compared with the related art in which the height H3 of each support part 5 in the direction perpendicular to the plane where the first substrate 1 is located is roughly equal to the minimum distance H4 between the surface of the support part 5 close to the first substrate 1 and the second conductive layer 61, in the embodiment of the present application, by setting the height H3 of each support part 5 in the direction perpendicular to the plane where the first substrate 1 is located less than the minimum distance H4 between the surface of the support part 5 close to the first substrate 1 and the second conductive layer 61, there is a certain space between each support part 5 and the sound-emitting vibration layer 6. In actual applications, the sound-emitting vibration layer 6 can have a larger amplitude, and the vibration of the sound-emitting vibration layer 6 causes less damage to the support part 5, which can extend the service life of the sound-emitting device. In addition, while it is beneficial for the support part group 5G to play a role in directional propagation of ultrasonic signals and adjustment of directional sound transmission effects, the uniformity of directional sound transmission is improved, thereby improving the quality of the sound-emitting device and ensuring the directional sound transmission effect of the sound-emitting device.

[0210] In at least one embodiment of the present application, as shown in FIG. 4 to FIG. 12 and FIG. 26 , the sound-emitting device includes a light-transmitting area T and a non-light-transmitting area FT surrounding the light-transmitting area T, and the support portion group 5G is disposed in the light-transmitting area T;

[0211] The non-transparent area FT includes a first peripheral trace Z1, a second peripheral trace Z2, a second protective layer 7 and a bonding portion 8. The first peripheral trace Z1 is located between the first conductive layer 2 and the first protective layer 3, and the first peripheral trace Z1 is electrically connected to the first conductive layer 2; the second peripheral trace Z2 is arranged on the side of the second conductive layer 61 close to the first substrate 1, the second protective layer 7 covers the side of the second peripheral trace Z2 away from the second conductive layer 61, and the second peripheral trace Z2 is electrically connected to the second conductive layer 61; at least part of the bonding portion 8 is arranged between the inorganic layer 9 and the second protective layer 7; wherein, along the direction perpendicular to the plane where the first substrate 1 is located, the height of the bonding portion 7 is greater than the sum of the heights of the supporting portion 5 and the raised portion 41.

[0212] In an exemplary embodiment, the first peripheral trace Z1 and the second peripheral trace Z2 are both disposed around the light-transmitting area T.

[0213] The specific materials of the first peripheral trace Z1 and the second peripheral trace Z2 are not limited here.

[0214] Exemplarily, the first peripheral trace Z1 and the second peripheral trace Z2 include metal or metal oxide, for example, the metal may include a combination of one or more of gold (Au), silver (Ag), copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti), for example, the metal oxide may include indium tin oxide (ITO) or indium zinc oxide (IZO).

[0215] There is no limitation on whether the materials and line widths of the first peripheral trace Z1 and the second peripheral trace Z2 are the same, and the specific details can be determined according to product design.

[0216] In some embodiments, in order to simplify the design and reduce the difficulty of the manufacturing process, the first peripheral trace Z1 and the second peripheral trace Z2 may be designed to be made of the same material.

[0217] In an exemplary embodiment, the second protective layer 7 is made of an inorganic material.

[0218] In an exemplary embodiment, the material of the above-mentioned second protective layer 7 is an insulating material, which is used to isolate the second peripheral trace Z2 from other conductive materials to prevent the circuit from short circuiting; in addition, the second protective layer 7 can also protect the second peripheral trace Z2 to prevent the second peripheral trace Z2 from being corroded or damaged due to factors such as water vapor in the external environment during use.

[0219] Exemplarily, the material of the second protective layer 7 may be an inorganic insulating material;

[0220] For example, the inorganic insulating material may be silicon nitride, silicon oxide, or a combination of one or more of silicon oxynitride.

[0221] In an exemplary embodiment, the material of the bonding portion 8 may include any one of glue, adhesive material, tape, adhesive, and sealant.

[0222] The bonding portion 8 is disposed in the non-light-transmitting area FT. The orthographic projection of the bonding portion 8 on the first substrate 1 is in the shape of a ring, wherein the width of the ring is less than or equal to the width of the non-light-transmitting area FT.

[0223] The fact that at least part of the bonding portion 8 is disposed between the inorganic layer 9 and the second protective layer 7 includes but is not limited to the following:

[0224] First, as shown in FIG. 4 to FIG. 12 and FIG. 26 , part of the adhesive portion 8 is disposed between the inorganic layer 9 and the second protective layer 7 , and part of the adhesive portion 8 is disposed between the second conductive layer 62 and the inorganic layer 9 .

[0225] Second, the entire area of ​​the bonding portion 8 is disposed between the inorganic layer 9 and the second protective layer 7 , that is, the bonding portion 8 is completely disposed between the inorganic layer 9 and the second protective layer 7 .

[0226] In addition, in some embodiments, the height of the bonding portion 7 in a direction perpendicular to the plane of the first substrate 1 can be set to be greater than the sum of the heights of the supporting portion 5 and the raised portion 41. In this way, the bonding layer 7 can support the sound-emitting vibration layer 6 to be set away from the supporting portion 5, so that in a static state, each supporting portion 5 does not contact the sound-emitting vibration layer 6.

[0227] Compared with the related art that each support part 5 is in contact with the sound-emitting vibration layer 6 in a static state, in the embodiment of the present application, by setting the height of the bonding part 7 in a direction perpendicular to the plane of the first substrate 1 to be greater than the sum of the heights of the support part 5 and the raised part 41, there is a certain space between each support part 5 and the sound-emitting vibration layer 6. In actual application, the sound-emitting vibration layer 6 can have a larger amplitude, and the vibration of the sound-emitting vibration layer 6 causes less damage to the support part 5, which can extend the service life of the sound-emitting device. In addition, while it is beneficial for the support part group 5G to play a role in directional propagation of ultrasonic signals and adjustment of directional sound transmission effects, it improves the uniformity of directional sound transmission, thereby improving the quality of the sound-emitting device and ensuring the directional sound transmission effect of the sound-emitting device.

[0228] In at least one embodiment of the present application, as shown in FIG. 13 or FIG. 16 , along the first direction (e.g., horizontal direction) or the second direction (e.g., vertical direction), the distance L between any two adjacent raised portions 41 is substantially equal;

[0229] Along the first direction (for example, the horizontal direction) or the second direction (for example, the vertical direction), for the raised portion 41 with the smallest distance to the boundary between the non-transparent area FT and the transparent area T, the distance L0 between it and the boundary is roughly equal to the distance L between any other two adjacent raised portions 41, and the first direction (for example, the horizontal direction) and the second direction (for example, the vertical direction) are perpendicular.

[0230] In an embodiment of the present application, by arranging a raised portion 41 with the smallest distance to the boundary position between the non-light-transmitting area FT and the light-transmitting area T along a first direction (for example, a horizontal direction) or a second direction (for example, a vertical direction), the distance L0 between the raised portion 41 and the boundary position is roughly equal to the distance L between any other two adjacent raised portions 41, so that the raised portions 41 in the area where the sound-emitting device is close to the non-light-transmitting area FT can be evenly arranged. Since the support portion group 5G is arranged on the raised portion 41, the distance L0 between the raised portion 41 and the boundary position between the non-light-transmitting area FT and the light-transmitting area T is roughly equal to the distance L between any other two adjacent raised portions 41, which helps the support portion group 5G to be evenly distributed on the first substrate 1, thereby facilitating the support portion group 5G to directional propagate ultrasonic signals, adjust the directional sound transmission effect, and improve the uniformity of directional sound transmission, thereby improving the quality of the sound-emitting device and ensuring the directional sound transmission effect of the sound-emitting device.

[0231] In at least one embodiment of the present application, as shown in FIG. 14 or FIG. 15 , the sum H of the heights of the support portion 5 and the raised portion 41 ranges from 4 μm to 15 μm.

[0232] Among them, Figure 14 is a schematic diagram of the cross-sectional structure along the M1M2 direction in Figure 16, and Figure 15 is a schematic diagram of the cross-sectional structure along the M3M4 direction in Figure 13. It should be noted that, for the sake of clarity and simplicity of the drawings, the sum H of the heights of the support part 5 and the raised part 41 is marked in Figure 15.

[0233] In an exemplary embodiment, the sum H of the heights of the support portion 5 and the raised portion 41 may be 4.5 μm, 5 μm, 5.5 μm, 6.0 μm, 6.5 μm, 7.0 μm, 7.5 μm, 8.0 μm, 8.5 μm, 9.0 μm, 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.5 μm, 12 μm, 12.5 μm, 13 μm, 13.5 μm, 14 μm or 14.5 μm.

[0234] It should be noted that, for the support portion 5 corresponding to the same position on each elevated portion 41 whose projections overlap, the sum H of the heights of the support portion 5 and the elevated portion 41 is equal.

[0235] In at least one embodiment of the present application, as shown in FIG. 15 , a height ratio H1:H2 of the support portion 5 and the elevated portion 41 is approximately 5:3.

[0236] In actual application, the supporting portion 5 mainly plays the role of directionally transmitting sound waves, and the raised portion 41 mainly plays the role of improving the adhesion of the supporting portion 5 and preventing the supporting portion 5 from falling off. The thicker the raised portion 41, the better the effect of improving the adhesion, but it may have a negative impact on the effect of the supporting portion 5 in directionally transmitting sound waves; the thinner the raised portion 41, the general effect of improving the adhesion, and the better the effect of the supporting portion 5 in directionally transmitting sound waves. By setting the height ratio H1:H2 of the supporting portion 5 and the raised portion 41 to approximately 5:3, a balance can be achieved between the two, so that the effects of improving adhesion and directionally transmitting sound waves can be taken into account, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device.

[0237] In at least one embodiment of the present application, as shown in FIG. 13 and FIG. 16 , the orthographic projection shapes of the support portion 5 and the raised portion 41 on the first substrate 1 are both arc-shaped.

[0238] For example, the arc shape may include a circle, an ellipse, a semicircle, a semi-ellipse, a sector, a rounded polygon, and the like.

[0239] In the embodiment of the present application, by arranging the shapes of the positive projection figures of the support portion 5 and the raised portion 41 on the first substrate 1 to be arc-shaped, the vibration energy received by the support portion 5 and the raised portion 41 in various directions can be as consistent as possible during the vibration of the sound-emitting device, thereby reducing the problem of falling off of the local area of ​​the support portion 5 due to excessive vibration energy, thereby improving the quality of the sound-emitting device, and improving the directional sound effect of the sound-emitting device and the uniformity of sound wave propagation.

[0240] An embodiment of the present application provides a display device, as shown in Figures 17, 18 and 19, including the sound-emitting device 100 as described above, and also including a display panel 200 (in Figure 19, 200 includes 201 and 202); the sound-emitting device 100 is arranged on the light-emitting side of the display panel 200 or inside the display panel 200; the orthographic projection of the light-transmitting area T of the sound-emitting device 100 on the display panel 200 overlaps with the display area AA of the display panel 200.

[0241] The above-mentioned display device can be an organic light-emitting diode (OLED) display device, a Micro LED (Micro light Emitting Diode) display device, a Mini LED (Mini light Emitting Diode) display device or an LCD (Liquid Crystal Display) display device.

[0242] The display device may include any device or product with a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc.

[0243] In an exemplary embodiment, as shown in FIG. 17 and FIG. 18 , the sound-emitting device 100 is disposed on the light-emitting side of the display panel 200 .

[0244] Exemplarily, when the display panel 200 is one of an OLED display panel, a Micro LED display panel, a Mini LED display panel, and an LCD display panel, the sound-emitting device 100 can be set on the light-emitting side of the display panel 200 .

[0245] In an exemplary embodiment, as shown in FIG. 19 , the sound generating device 100 is disposed inside the display panel 200 .

[0246] Exemplarily, when the display panel 200 is one of an OLED display panel, a Micro LED display panel, and a Mini LED display panel, the sound-emitting device 100 can be disposed inside the display panel 200 .

[0247] In which, regardless of the type of display panel, the orthographic projection of the light-transmitting area T of the sound-emitting device 100 on the display panel 200 overlaps with the display area AA of the display panel 200, and the orthographic projection of the non-light-transmitting area FT of the sound-emitting device 100 on the display panel 200 overlaps with the peripheral area BB of the display panel 200.

[0248] In the display device provided in the embodiment of the present application, an organic layer 4 is arranged between the first protective layer 3 and the multiple support part groups 5G, and the area of ​​the orthographic projection of the organic layer 4 on the first substrate 1 is larger than the sum of the areas of the orthographic projections of all the support parts 5 on the first substrate 1, and at least a part of the area of ​​each support part 5 is in direct contact with the organic layer 4; in this way, the organic layer 4 can increase the force between the support part group 5G and the first protective layer 3, and during the vibration of the sound-emitting device 100, the risk of the support part 5 falling off is greatly reduced, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device 100, so that a display device with a surface sound-emitting function can be prepared.

[0249] In at least one embodiment of the present application, the display panel 200 includes a liquid crystal display panel; the sound-emitting device 100 is disposed on the light-emitting side of the display panel 200;

[0250] At least a portion of the orthographic projection of the supporting portion 5 on the liquid crystal display panel overlaps with the spacer PS in the liquid crystal display panel.

[0251] In an exemplary embodiment, a portion of the orthographic projection of the supporting portion 5 on the liquid crystal display panel overlaps with the spacer PS in the liquid crystal display panel.

[0252] In an exemplary embodiment, the orthographic projection of each supporting portion 5 on the liquid crystal display panel overlaps with the corresponding spacer PS in the liquid crystal display panel.

[0253] The distribution density of the spacers PS in the liquid crystal display panel is greater than the distribution density of the support parts 5 in the sound-generating device 100 .

[0254] In the display device provided in the embodiment of the present application, since the sound-emitting device 100 is arranged on the light-emitting side of the display panel 200, by arranging that the orthographic projection of at least part of the supporting portion 5 on the liquid crystal display panel and the spacer PS in the liquid crystal display panel overlap, the interference of the supporting portion 5 on the display light can be greatly reduced, thereby improving the light-emitting efficiency of the display device and enhancing the display effect.

[0255] In at least one embodiment of the present application, the display panel 200 includes an organic light emitting diode display panel (OLED), and the sound device 100 is disposed on the light emitting side of the display panel 200 or inside the display panel.

[0256] For example, when the sound-emitting device 100 is disposed inside the display panel 200 , since the OLED display panel 200 may include a light-emitting substrate 202 and a cover plate (or packaging substrate) 201 , the sound-emitting device 100 may be disposed between the light-emitting substrate 202 and the cover plate (or packaging substrate) 201 .

[0257] In some embodiments, when the sound-emitting device 100 is arranged between the light-emitting substrate 202 and the cover plate (or packaging substrate) 201, the first base 1 can be shared with the packaging layer or organic film layer in the light-emitting substrate 202, thereby further reducing the thickness of the display device and improving the application flexibility of the display device.

[0258] In an exemplary embodiment, as shown in FIG. 17 , a ring-shaped connecting portion 300 may be provided to fix the sound generating device 100 and the display panel 200 together.

[0259] In an exemplary embodiment, as shown in FIG. 18 , a connecting portion 300 may be provided on a whole surface to fix the sound device 100 and the display panel 200 together.

[0260] The material of the connection portion 300 may include sealant.

[0261] An embodiment of the present application provides a method for preparing a sound-generating device, which is applied to prepare the sound-generating device as described above, and the method comprises:

[0262] S01, providing a first substrate 1 as shown in FIG20;

[0263] The material of the first substrate 1 is not limited here.

[0264] In some examples, the first substrate 1 may be a rigid substrate or a flexible substrate.

[0265] In some examples, the material of the first substrate 1 can be made of one or more materials selected from the group consisting of glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes but is not limited to these.

[0266] It should be noted that when the sound-generating device is used in a display device, the first substrate may preferably be a flexible substrate to reduce the thickness of the sound-generating device, thereby reducing the volume of the display device, making the display device thinner and lighter, and expanding its application scenarios.

[0267] S02, as shown in FIG20 , forming a first conductive layer 2, a first protective layer 3 and an organic layer 4 on the first substrate 1 respectively;

[0268] In some examples, the material of the first conductive layer 2 is a light-transmitting conductive material;

[0269] Exemplarily, the material of the first conductive layer 2 is metal. In this case, in order to achieve light transmittance, the metal film layer has a relatively small thickness. For example, the thickness of the metal film layer is nanometer level.

[0270] Exemplarily, the material of the first conductive layer 2 is metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0271] In an exemplary embodiment, the material of the above-mentioned first protective layer 3 is an insulating material, which is used to isolate the first conductive layer 2 from other conductive materials to prevent short circuits in the circuit; in addition, the first protective layer 3 can also protect the first conductive layer 2 to prevent the first conductive layer 2 from being corroded or damaged by factors such as water vapor in the external environment during use.

[0272] Exemplarily, the material of the first protective layer 3 may be an inorganic insulating material;

[0273] For example, the inorganic insulating material may be silicon nitride, silicon oxide, or a combination of one or more of silicon oxynitride.

[0274] In an exemplary embodiment, as shown in FIG. 4 , the organic layer 4 is a continuous structure covering the entire surface. The organic layer 4 covers most of the first protective layer 3 , and the support portion group 5G is evenly distributed on the organic layer 4 .

[0275] In an exemplary embodiment, as shown in Figure 5 or Figure 6, the organic layer 4 includes a plurality of discontinuous (or spaced apart) raised portions 41, a groove C is provided between any two adjacent raised portions 41, and the support portions 5 in the same support portion group 5G are all provided on the same raised portion 41.

[0276] S03. As shown in FIG22 , a plurality of support portion groups 5G are formed in an array arrangement; each support portion group 5G includes at least one support portion 5, and the support portion 5 is located on the side of the organic layer 4 away from the first protective layer 3; wherein the area of ​​the orthographic projection of the organic layer 4 on the first substrate 1 is greater than the sum of the areas of the orthographic projections of all the support portions 5 on the first substrate 1, and at least a partial area of ​​each support portion 5 is in direct contact with the organic layer 4.

[0277] In an exemplary embodiment, the first protective layer 3 and the support portion 5 are made of different materials. For example, the first protective layer 3 is made of an inorganic material, and the support portion 5 is made of an organic material.

[0278] In an exemplary embodiment, the support portion 5 is made of a light-transmitting material.

[0279] In actual applications, the larger the area of ​​the region where the bottom surface of the support part 5 is in direct contact with the organic layer 4, the more conducive it is to improving the interface adhesion between the support part 5 and the organic layer 4, thereby improving the vibration stability of the support part 5 during the vibration of the sound-emitting device, reducing the probability of it falling off, improving the quality of the sound-emitting device, and ensuring the directional sound effect of the sound-emitting device.

[0280] Here, there is no limitation on whether the organic layer 4 and the support portion 5 are made of the same material.

[0281] In an exemplary embodiment, the organic layer 4 and the support portion 5 are made of the same material, for example, both are organic materials, which may include organic polymer materials. Materials of the same type have good adhesion.

[0282] In the sound-emitting device prepared by the preparation method provided in the embodiment of the present application, an organic layer 4 is arranged between the first protective layer 3 and the multiple support part groups 5G, and the area of ​​the orthographic projection of the organic layer 4 on the first substrate 1 is larger than the sum of the areas of the orthographic projections of all the support parts 5 on the first substrate 1, and at least a part of the area of ​​each support part 5 is in direct contact with the organic layer 4; in this way, the organic layer 4 can increase the force between the support part group 5G and the first protective layer 3, and during the vibration of the sound-emitting device 100, the risk of the support part 5 falling off is greatly reduced, thereby improving the quality of the sound-emitting device and ensuring the directional sound effect of the sound-emitting device 100.

[0283] In at least one embodiment of the present application, as shown in FIG5 or FIG6 , the organic layer 4 includes a plurality of raised portions 41 arranged in an array, with a groove C between two adjacent raised portions 41 , and the number of the raised portions 41 is the same as the number of the support portion group 5G;

[0284] After forming the organic layer in step S02 and before forming a plurality of support member groups arranged in an array in step S03, the method further includes:

[0285] Step S04, as shown in Figure 21, an inorganic layer 9 is formed on the organic layer 4; a plurality of openings K are provided on the inorganic layer 9, and the area enclosed by the orthographic projection of the outer contour of the opening K on the first substrate 1 is located within the orthographic projection of the raised portion 41 on the first substrate 1; as shown in Figure 22, at least a portion of the support portion 5 is in direct contact with the raised portion 41 through the opening K.

[0286] In some embodiments, as shown in FIG9 , FIG11 or FIG12 , an opening K may be provided on a raised portion 41 so that at least a portion of each support portion 5 in a same support portion group 5G is disposed in the same opening K;

[0287] In other embodiments, as shown in FIG10 , two or more openings K may be provided on a single elevated portion 41 , with at least a portion of a support portion 5 disposed within each opening K. In this case, as shown by the rectangular area in FIG10 , the organic layer 4 is disposed in the area between two adjacent support portions 5 on the same elevated portion 41 .

[0288] In practical applications, an opening K may be provided on a raised portion 41 so that at least a portion of each support portion 5 in the same support portion group 5G is disposed in the same opening K, thereby simplifying the design and reducing the difficulty of the manufacturing process.

[0289] In at least one embodiment of the present application, after forming the inorganic layer on the organic layer 4 in step S04 and after forming the support portion group 5G, the method further includes:

[0290] S05, as shown in FIG24 , providing a second substrate 62;

[0291] S06, as shown in FIG24 , forming a second conductive layer 61 on the second substrate 62;

[0292] S07 , providing an adhesive layer 8 on the portion of the inorganic layer 9 located in the non-light-transmitting area FT of the sound-emitting device 100 , and bonding the inorganic layer 9 and the second protective layer 7 together through the adhesive layer 8 .

[0293] In an exemplary embodiment, step S07, providing an adhesive layer 8 on the portion of the inorganic layer 9 located in the non-light-transmitting region FT of the sound-emitting device 100, and bonding the inorganic layer 9 and the second protective layer 7 together through the adhesive layer 8, specifically includes:

[0294] Sub-step 1: applying glue to the portion of the inorganic layer 9 located in the non-light-transmitting area FT of the sound-emitting device 100 using a glue dispensing process;

[0295] Sub-step 2: Align and bond the intermediate structure shown in FIG. 22 (referred to as the first substrate) to the intermediate structure shown in FIG. 24 (referred to as the second substrate);

[0296] Sub-step 3: perform light curing treatment.

[0297] An embodiment of the present application further provides a method for manufacturing a display device, wherein the method comprises:

[0298] 1. Provide a display panel 200 as shown in FIG23 ;

[0299] 2. As shown in FIG23 , the intermediate structure shown in FIG22 (referred to as the first substrate) is fixed to the display panel 200 via the connecting portion 300 ;

[0300] 3. Fix the intermediate structure (called the second substrate) shown in FIG. 24 together through the adhesive layer 8 to obtain the display device shown in FIG. 25 .

[0301] It should be noted that FIG23 and FIG25 are both drawn using the display panel 200 as an example of an LCD display panel. The display panel 200 includes an array substrate 203, a liquid crystal layer (including liquid crystals LC), a color filter layer CF, a color filter substrate 204, and a seal. Of course, other structures and components may also be included. For details, please refer to the description in the relevant art and will not be repeated here.

[0302] It should be noted that only the preparation process of the structure related to the invention point is introduced here. The introduction of the specific components and materials of the above-mentioned sound-emitting device and display device can be referred to the description in the previous text and will not be repeated here.

[0303] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A sound-generating device, wherein: include: first base; A first conductive layer, located on one side of the first substrate; a first protective layer, covering the first conductive layer; an organic layer, located on a side of the first protective layer away from the first conductive layer; A plurality of support portion groups arranged in an array, each of the support portion groups comprising at least one support portion, and the support portion is located on a side of the organic layer away from the first protective layer; The sound-generating vibration layer is located on a side of the support group away from the first substrate; the support group is located in a cavity structure formed by the first protective layer and the sound-generating vibration layer; The area of ​​the orthographic projection of the organic layer on the first substrate is larger than the sum of the areas of the orthographic projections of all the supporting parts on the first substrate, and at least a partial area of ​​each of the supporting parts is in direct contact with the organic layer.

2. The sound-generating device according to claim 1, wherein: The sound-emitting device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area. The orthographic projection of the organic layer on the first substrate covers the portion of the first substrate located in the light-transmitting area. The supporting portion is arranged on the organic layer, and the supporting portion and the organic layer are made of the same type of material.

3. The sound-generating device according to claim 1, wherein: The organic layer includes a plurality of raised portions arranged in an array, a groove is provided between two adjacent raised portions, and the number of the raised portions is the same as the number of the supporting portion groups; The orthographic projection of the support portion group on the first substrate is located within the orthographic projection of the elevated portion on the first substrate, and at least a partial area of ​​the support portion in the support portion group is in direct contact with the elevated portion.

4. The sound-generating device according to claim 3, wherein: The orthographic projection figures of the elevation portions on the first substrate have the same size; An area of ​​an orthographic projection of the raised portion on the first substrate is at least greater than 50% of an area of ​​an orthographic projection of the support portion group on the first substrate.

5. The sound-generating device according to claim 3, wherein: The support portion includes a first surface, at least a portion of the first surface is in direct contact with the elevated portion, and an area of ​​a contact surface between the support portion and the elevated portion is at least greater than 50% of an area of ​​the first surface.

6. The sound generating device according to claim 3, wherein: The support portion group includes at least two support portions, and the orthographic projections of the support portions in the same support portion group on the first substrate are located within the orthographic projection of the same raised portion on the first substrate; There is a gap between two adjacent support parts in the same support part group, or two adjacent support parts in the same support part group are connected to each other.

7. The sound-generating device according to any one of claims 3 to 6, wherein: The sound-generating device also includes an inorganic layer, which is located on a side of the organic layer away from the first substrate. The inorganic layer at least covers the side of the raised portion and extends to cover the bottom of the groove. The portion of the inorganic layer located at the bottom of the groove is in direct contact with the first protective layer.

8. The sound generating device according to claim 7, wherein: The inorganic layer has a plurality of openings, the area enclosed by the orthographic projection of the outer contour of the opening on the first substrate is located within the orthographic projection of the raised portion on the first substrate, and at least a portion of the support portion is located within the opening.

9. The sound-generating device according to claim 8, wherein: The size of the area enclosed by the outer contour of the same support portion group is smaller than or equal to the size of the area enclosed by the outer contour of the opening, and the support portion is arranged in the opening and in direct contact with the raised portion.

10. The sound generating device according to claim 8, wherein: The size of the area enclosed by the outer contour of the same support portion group is larger than the size of the area enclosed by the outer contour of the opening; a partial area of ​​the support portion is arranged in the opening, and the support portion also covers a portion of the inorganic layer.

11. The sound generating device according to claim 7, wherein: The material of the support portion is the same as that of the organic layer.

12. The sound generating device according to claim 11, wherein: The material of the inorganic layer is the same as that of the first protective layer.

13. The sound generating device according to claim 7, wherein: A geometric center of an orthographic projection of the support portion group on the first substrate substantially overlaps with a geometric center of an orthographic projection of the elevation portion on the first substrate.

14. The sound generating device according to claim 7, wherein: In the case where the support portion group includes one support portion, along any direction parallel to the plane where the first substrate is located, the distance between the edge of the orthographic projection figure of the support portion on the first substrate and the edge of the orthographic projection figure of the elevation portion on the first substrate is approximately equal.

15. The sound generating device according to claim 7, wherein: Along any direction parallel to the plane where the first substrate is located, the size of the groove is larger than the size of the raised portion.

16. The sound generating device according to claim 15, wherein: The distance between any two adjacent raised portions ranges from 0.5 mm to 5 mm.

17. The sound generating device according to claim 7, wherein: The support portions in the same support portion group have the same height along a direction perpendicular to the first substrate.

18. The sound generating device according to claim 7, wherein: The support portion group includes a first support portion and a second support portion, each of the first support portions has the same height along a direction perpendicular to the first substrate, each of the second support portions has the same height along a direction perpendicular to the first substrate, and the height of the first support portion along the direction perpendicular to the first substrate is greater than the height of the second support portion along the direction perpendicular to the first substrate.

19. The sound generating device according to claim 7, wherein: The sound-generating vibration layer includes a second substrate and a second conductive layer located between the second substrate and the support portion group, and the cavity structure is formed between the first protective layer and the second conductive layer; The height of each of the support portions in a direction perpendicular to the plane where the first substrate is located is smaller than the minimum distance between the surface of the support portion close to the first substrate and the second conductive layer.

20. The sound generating device according to claim 19, wherein: The sound-generating device comprises a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area, and the supporting part group is arranged in the light-transmitting area; The non-light-transmitting area includes a first peripheral routing, a second peripheral routing, a second protective layer and a bonding portion, wherein the first peripheral routing is located between the first conductive layer and the first protective layer, and the first peripheral routing is electrically connected to the first conductive layer; the second peripheral routing is arranged on a side of the second conductive layer close to the first substrate, the second protective layer covers a side of the second peripheral routing away from the second conductive layer, and the second peripheral routing is electrically connected to the second conductive layer; at least a portion of the bonding portion is arranged between the inorganic layer and the Between the second protective layers; Along a direction perpendicular to the plane where the first substrate is located, a height of the bonding portion is greater than a sum of heights of the supporting portion and the raised portion.

21. The sound-generating device according to claim 20, wherein: Along the first direction or the second direction, the distance between any two adjacent raised portions is substantially equal; Along the first direction or the second direction, for the elevated portion having the smallest distance to the boundary between the non-light-transmitting area and the light-transmitting area, the distance to the boundary is substantially equal to the distance between any other two adjacent elevated portions, and the first direction is perpendicular to the second direction.

22. The sound-generating device according to claim 20, wherein: The sum of the heights of the support portion and the raised portion is in a range of 4 μm to 15 μm.

23. The sound-generating device according to claim 22, wherein: The ratio of the height of the supporting portion to the height of the elevated portion is approximately 5:

3.

24. The sound-generating device according to claim 7, wherein: The shapes of the orthographic projections of the supporting portion and the elevated portion on the first substrate are both arc-shaped.

25. A display device, wherein: It comprises a sound-emitting device as described in any one of claims 1 to 24, and also comprises a display panel; the sound-emitting device is arranged on the light-emitting side of the display panel or inside the display panel; the orthographic projection of the light-transmitting area of ​​the sound-emitting device on the display panel overlaps with the display area of ​​the display panel.

26. The display device according to claim 25, wherein: The display panel includes a liquid crystal display panel; the sound-emitting device is arranged on the light-emitting side of the display panel; An orthographic projection of at least a portion of the support portion on the liquid crystal display panel overlaps with a spacer in the liquid crystal display panel.

27. The display device according to claim 25, wherein: The display panel includes an organic light emitting diode display panel, and the sound generating device is arranged on a light emitting side of the display panel or inside the display panel.

28. A method for preparing a sound-generating device, used for preparing the sound-generating device according to any one of claims 7 to 24, the method comprising: providing a first substrate; forming a first conductive layer, a first protective layer and an organic layer on the first substrate respectively; A plurality of support portion groups are formed in an array arrangement; each of the support portion groups includes at least one support portion, and the support portion is located on a side of the organic layer away from the first protective layer; wherein an area of ​​an orthographic projection of the organic layer on the first substrate is larger than a sum of areas of the orthographic projections of all the support portions on the first substrate, and at least a partial area of ​​each of the support portions is in direct contact with the organic layer.

29. The preparation method according to claim 28, wherein The organic layer includes a plurality of raised portions arranged in an array, a groove is provided between two adjacent raised portions, and the number of the raised portions is the same as the number of the supporting portion groups; After forming the organic layer and before forming a plurality of support member groups arranged in an array, the method further includes: An inorganic layer is formed on the organic layer; the inorganic layer has a plurality of openings, and an area enclosed by the orthographic projection of the outer contour of the opening on the first substrate is located within the orthographic projection of the elevated portion on the first substrate; at least a portion of the support portion is in direct contact with the elevated portion through the opening.

30. The preparation method according to claim 29, wherein: After forming the inorganic layer on the organic layer and after forming the supporting portion group, the method further includes: providing a second substrate; forming a second conductive layer on the second substrate; wherein the sound-generating vibration layer includes the second substrate and the second conductive layer; An adhesive layer is provided on a portion of the inorganic layer located in a non-light-transmitting area of ​​the sound-emitting device, and the inorganic layer and the second protective layer are bonded together through the adhesive layer.

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