Electronic device comprising antenna

Abstract

This electronic device comprises: a printed circuit board including a conductive part, a first ground path, a second ground path, and a feed path; and a wireless communication circuit on the printed circuit board. The conductive part includes a feed point, a first ground point, and a second ground point. The first ground part is connected to the ground of the electronic device through the first ground path. The second ground point is connected to the ground through the second ground path. The feed point is electrically connected to the wireless communication circuit through the feed path. The printed circuit board includes a conductive pattern connected between the feed path and the first ground path. The wireless communication circuit supplies a signal to the conductive part and the conductive pattern through the feed path. The signal is radiated through the conductive part and the conductive pattern.

Description

Electronic device including an antenna

[0001] The present disclosure relates to an electronic device including an antenna.

[0002] Electronic devices, such as smartphones, may include antennas that enable wireless communication. Antennas in electronic devices may operate at various frequencies to support various communication standards, such as 4G, 5G, and Wi-Fi.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] According to an aspect of the present disclosure, an electronic device may include a housing including a conductive portion forming a portion of a side surface of the electronic device, a printed circuit board including a first ground path, a second ground path, and a power supply path, and a wireless communication circuit disposed on the printed circuit board. The conductive portion may include a feed point, a first ground point, and a second ground point. The first ground point may be connected to a ground of the electronic device via the first ground path. The second ground point may be connected to the ground via the second ground path. The feed point may be electrically connected to the wireless communication circuit via the power supply path. The printed circuit board may include a conductive pattern connected between the feed path and the first ground path. The wireless communication circuit may be configured to supply a signal to the conductive portion and the conductive pattern via the power supply path. The signal may be radiated through the conductive portion and the conductive pattern.

[0005] According to an aspect of the present disclosure, an electronic device may include a printed circuit board including a conductive portion forming a portion of a side surface of the electronic device, a conductive pattern, and a wireless communication circuit on the printed circuit board, the printed circuit board including a feeding point, a first ground point, a second ground point, and a third ground point, which are sequentially positioned, and a feeding point, a first ground point, a second ground point, and a third ground point, and the feeding point may be connected to a ground of the electronic device via a feeding path of the printed circuit board. Each of the first ground point, the second ground point, and the third ground point of the conductive portion may be connected to a ground of the electronic device. The first ground point may be connected to the ground via a first ground path of the printed circuit board. The second ground point may be connected to the ground via a second ground path of the printed circuit board. The conductive pattern of the printed circuit board may include a first conductive pattern connected between the power supply path and the first ground path, a second conductive pattern connected between the first ground path and the second ground path, and a stub pattern extending from the first ground path such that an end thereof faces the power supply path. The wireless communication circuit may be configured to supply a signal to the conductive portion and the conductive pattern through the power supply path. The signal may be radiated through the conductive portion and the conductive pattern.

[0006] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 illustrates an electronic device within a network environment according to various embodiments.

[0008] FIG. 2A illustrates an exemplary electronic device according to one embodiment.

[0009] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0010] FIG. 3 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0011] FIG. 4 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0012] FIG. 5 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0013] FIG. 6 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0014] FIG. 7 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0015] FIG. 8 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0016] FIG. 9 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0017] FIG. 10 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0018] FIG. 11 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0019] FIG. 12 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0020] FIG. 13 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0021] FIG. 14 illustrates an antenna structure of an exemplary electronic device according to one embodiment.

[0022] FIG. 15a illustrates examples of antenna structures of an electronic device according to one embodiment.

[0023] FIG. 15b shows the radiation efficiency according to an example of an antenna structure of an electronic device according to one embodiment.

[0024] FIG. 16a illustrates examples of antenna structures of an electronic device according to one embodiment.

[0025] FIG. 16b shows the radiation efficiency according to an example of an antenna structure of an electronic device, according to one embodiment.

[0026] FIG. 16c shows an electric field of an antenna structure of an electronic device according to one embodiment.

[0027] FIG. 17a illustrates examples of antenna structures of an electronic device according to one embodiment.

[0028] FIG. 17b shows the radiation efficiency according to an example of an antenna structure of an electronic device, according to one embodiment.

[0029] FIG. 18a illustrates examples of antenna structures of an electronic device according to one embodiment.

[0030] FIG. 18b shows the radiation efficiency according to an example of an antenna structure of an electronic device, according to one embodiment.

[0031] FIG. 19a illustrates examples of antenna structures of an electronic device according to one embodiment.

[0032] FIG. 19b shows the radiation efficiency according to an example of an antenna structure of an electronic device, according to one embodiment.

[0033] FIG. 20A illustrates examples of antenna structures of an electronic device according to one embodiment.

[0034] FIG. 20b shows the radiation efficiency according to an example of an antenna structure of an electronic device, according to one embodiment.

[0035] FIG. 1 illustrates an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] FIG. 2A illustrates an exemplary electronic device according to one embodiment.

[0058] Referring to FIG. 2A, an electronic device (200) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B). In an embodiment, the housing (210) may also refer to a structure (e.g., a frame structure (240) of FIG. 2B) forming at least a portion of the first side (200A), the second side (200B), and / or the third side (200C).

[0059] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0060] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of the second surface (200B). In one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials.

[0061] According to one embodiment, an electronic device (200) may include a side bezel structure (or side member) (218) (e.g., a side wall (241) of a frame structure (240) of FIG. 2B). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third side (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third side (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third side (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0062] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0063] In one embodiment, the electronic device (200) may include at least one of a display (201) (e.g., a display module (160) of FIG. 1), microphone holes (203, 204), a speaker hole (207), a sensor module (e.g., a sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., a camera module (180) of FIG. 1), a key input device (217), a light-emitting element, and / or a connector hole (208).

[0064] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first side (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0065] In one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). In one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0066] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. In another embodiment, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front plate (202)).

[0067] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In another embodiment, the sensing area (201B) may be formed in the key input device (217).

[0068] In one embodiment, the display (201) may include an area where a first camera module (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In another embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0069] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0070] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and a second microphone hole (204) formed in a portion of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones so as to detect the direction of the sound.

[0071] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0072] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole. The external speaker hole (207) may be formed on a part of the third surface (200C) of the electronic device (200). In another embodiment, the external speaker hole (207) may be implemented as a single hole with the first microphone hole (203). The call receiver hole may be formed on another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower portion of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper portion of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed in a location other than the third surface (200C). For example, the call receiver hole may be formed by a space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0073] In one embodiment, the electronic device (200) may include at least one speaker (e.g., an audio output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole.

[0074] In one embodiment, a sensor module (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0075] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) arranged to face a first side (200A) of the electronic device (200), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0076] In one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0077] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0078] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In another embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0079] In one embodiment, the key input device (217) (e.g., the input module (150) of FIG. 1) may be disposed on the third side (200C) of the electronic device (200). In another embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (201).

[0080] In one embodiment, a connector hole (208) may be formed on the third side (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0081] In one embodiment, the electronic device (200) may include a light-emitting element. For example, the light-emitting element may be disposed on a first surface (200A) of the housing (210). The light-emitting element may provide status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element may include an LED, an IR LED, and / or a xenon lamp.

[0082] Figure 2b is an exploded perspective view of an exemplary electronic device according to one embodiment. Throughout this document, identical components are designated by the same reference numerals. Descriptions of components with the same reference numerals may be applied equally even across different drawings, unless otherwise specified. Duplicate descriptions of components with the same reference numerals will be omitted.

[0083] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., battery (189) of FIG. 1).

[0084] In one embodiment, the frame structure (240) may include a side wall (241) forming an exterior of the electronic device (200) (e.g., the third side (200C) of FIG. 2A) and a support portion (243) extending inwardly from the side wall (241). In one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). In one embodiment, the side wall (241) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support portion (243) of the frame structure (240) may extend from the side wall (241) within the space.

[0085] In one embodiment, the frame structure (240) may include a conductive portion formed of a conductive material (e.g., metal). For example, the side wall (241) may include a conductive portion (e.g., the conductive portion (340) of FIG. 3) that acts as an antenna radiator. For example, the support portion (243) may include a conductive portion. The conductive portion of the side wall (241) may be connected to the conductive portion of the support portion (243).

[0086] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (200). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) can each be mounted in a recess defined by a side wall (241) and / or a support portion (243) of the frame structure (240).

[0087] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be coupled to the frame structure (240). For example, but not limited to, the first printed circuit board (250) and the second printed circuit board (252) may be secured to the frame structure (240) via a fastening member, such as a screw. For example, but not limited to, the battery (270) may be secured to the frame structure (240) via an adhesive member, such as a double-sided tape.

[0088] In one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). In one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -z direction. In one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z axis. In one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). In this way, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent a connector coupled to the first printed circuit board (250) from being detached.

[0089] In one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0090] In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -z direction).

[0091] In one embodiment, the front plate (202) may be coupled with the display (201). For example, the front plate (202) and the display (201) may be bonded to each other via an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0092] In one embodiment, the front plate (202) may be coupled to a frame structure (240). For example, but not limited to, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side wall (241)).

[0093] In one embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0094] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0095] An electronic device (200) according to one embodiment may include an antenna module (e.g., antenna module (197) of FIG. 1). In one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may be used, for example, to communicate with an external device over a short distance or to wirelessly transmit and receive power with an external device.

[0096] In one embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support portion (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0097] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0098] In one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a substantially continuous plane on the surface of the rear plate (211).

[0099] In one embodiment, the housing (210) of the electronic device (200) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0100] Although a bar-type electronic device (200) has been described with reference to FIGS. 2A and 2B, the shape of the electronic device (200) is not limited thereto. For example, the electronic device (200) may be implemented as a foldable device that includes a plurality of housings that are coupled to be foldable or unfoldable based on at least one axis. For example, the electronic device (200) may be implemented as a slidable device that includes a plurality of housings that are coupled to be slidable with respect to each other.

[0101] FIG. 3 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 3, an electronic device according to an embodiment (e.g., the electronic device (200) of FIG. 2B) may include a conductive portion (340) and a printed circuit board (350) (e.g., the first printed circuit board (250) or the second printed circuit board (252) of FIG. 2B). In an embodiment, the printed circuit board (350) may include a ground area (GA) and a fill-cut area (FA) formed of a conductive material. The fill-cut area may be a non-conductive area or a non-conductive portion of the printed circuit board (350). For example, the fill-cut area may be an area (or portion) of the printed circuit board (350) from which a conductive material is removed. The above fill cut area may be an area where the conductive material fill (e.g., copper fill) of the printed circuit board (350) is not applied or is removed.

[0102] In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on a substrate of a printed circuit board (350). In one embodiment, the conductive portion (340) may form a part of an exterior of the electronic device (e.g., a side surface (100C) of FIG. 2A). For example, an outer surface (340c) of the conductive portion (340) may be exposed to the outside to form the exterior of the electronic device. In one embodiment, the conductive portion (340) may include a first feed point (351), a first ground point (352), and a second ground point (353). In one embodiment, the conductive portion (340) may further include a third ground point (354).

[0103] In one embodiment, the first feed point (351) may be electrically connected to the wireless communication circuit. For example, the first feed point (351) may be electrically connected to the wireless communication circuit via a first feed path (310) of a printed circuit board (350). For non-limiting example, the first feed path (310) may include a line (312) formed of a conductive material (e.g., copper) on a substrate of the printed circuit board (350) and a connector (314) connected to the line (312). The connector (314) may be connected to the conductive portion (340) by contacting the first feed point (351). For non-limiting example, the connector (314) may include a C-clip or a pogo pin.

[0104] In one embodiment, the first ground point (352) may be electrically connected to the ground (G) of the electronic device. For example, the first ground point (352) may be electrically connected to the ground (G) via a first ground path (320) of a printed circuit board (350). For non-limiting example, the first ground path (320) may include a line (322) formed of a conductive material (e.g., copper) and a connector (324) connected to the line (322). In one embodiment, when the printed circuit board (350) is formed as a multilayer board, the line (322) may be formed on an outer layer (e.g., a top layer or a bottom layer) and / or an inner layer of the multilayer board. The connector (324) may be connected to the conductive portion (340) by making contact with the first ground point (352). For non-limiting examples, the connector (324) may include a C-clip or a pogo pin.

[0105] In one embodiment, the second ground point (353) may be electrically connected to the ground (G) of the electronic device. For example, the second ground point (353) may be electrically connected to the ground (G) via a second ground path (330) of a printed circuit board (350). For non-limiting examples, the second ground path (330) may include a line (332) formed of a conductive material (e.g., copper) and a connector (334) connected to the line (332). In one embodiment, the line (332) may be formed on the outer layer and / or the inner layer of the printed circuit board (350). The connector (334) may be connected to the conductive portion (340) by contacting the second ground point (353). For non-limiting examples, the connector (334) may include a C-clip or a pogo pin.

[0106] In one embodiment, the ground (G) may include at least one conductive member of the electronic device. For example, but not limited to, the conductive members providing the ground (G) may include a ground plane (e.g., a ground area (GA)) of a printed circuit board (350) formed of a conductive material (e.g., copper) and / or a conductive portion of a support member (e.g., a support portion (241) of FIG. 2B). For example, when the conductive members providing the ground (G) include both the ground plane of the printed circuit board (350) and the conductive portion of the support member, they may be electrically connected to each other. For example, but not limited to, the ground plane of the printed circuit board (350) and the conductive portion of the support member may be electrically connected to each other via a conductive connecting member (355), such as a screw.

[0107] According to one embodiment, the electronic device may include a connecting portion (345) extending from a conductive portion (340). For example, the connecting portion (345) may extend from a region of the conductive portion (340) that includes a third ground point (354). In one embodiment, the connecting portion (345) may be formed of a conductive material (e.g., metal). For example, but not limited to, the connecting portion (345) may be formed of substantially the same material as the conductive portion (340). For example, but not limited to, the connecting portion (345) may be formed integrally with the conductive portion (340).

[0108] In one embodiment, the connecting portion (345) can electrically connect the conductive portion (340) (or the third ground point (354)) to the ground (G) of the electronic device. For example, but not limited to, the connecting portion (345) can extend from the conductive portion (340) to the support member that provides the ground (G), thereby electrically connecting the conductive portion (340) to the ground (G). The third ground point (354) illustrated in FIG. 3 represents any location between the conductive portion (340) and the connecting portion (345), and the location of the third ground point (354) is not limited by the illustrated example. For example, the connecting portion (345) can be referred to as a 'third ground path' that connects the third ground point (354) of the conductive portion (340) to the ground (G).

[0109] In one embodiment, the first feed point (351), the first ground point (352), the second ground point (353), and the third ground point (354) may be located (e.g., in that order) in the conductive portion (340). For example, the first ground point (352) may be located between the first feed point (351) and the second ground point (353), and the second ground point (353) may be located between the first ground point (352) and the third ground point (354).

[0110] In one embodiment, the conductive portion (340) may include a side portion (346), a first protruding portion (341), a second protruding portion (342), and / or a third protruding portion (343). The side portion (346) may form an outer surface (340c) of the conductive portion (340). The side portion (346) may be a portion of a housing (e.g., side wall (241) of FIG. 2B) that forms a side surface (e.g., side surface (100C) of FIG. 2A) of the electronic device. In one embodiment, the first protruding portion (341) may extend from the side portion (346). For example, the first protruding portion (341) may extend from the side portion (346) in a direction opposite to the direction in which the outer surface (340c) faces (e.g., toward the inside of the electronic device). The first protruding portion (341) may be referred to as a first flange protruding from the side portion (346). In one embodiment, the second protruding portion (342) may extend from the side portion (346). For example, the second protruding portion (342) may extend from the side portion (346) in a direction opposite to the direction in which the outer surface (340c) faces (e.g., toward the inside of the electronic device). In one embodiment, the second protruding portion (342) may be referred to as a second flange protruding from the side portion (346). In one embodiment, the third protruding portion (343) may extend from the side portion (346). For example, the third protruding portion (343) may extend from the side portion (346) in a direction opposite to the direction in which the outer surface (340c) faces (e.g., toward the inside of the electronic device). In one embodiment, the third protruding portion (343) may be referred to as a third flange protruding from the side portion (346).

[0111] In one embodiment, the second protruding portion (342) may be positioned between the first protruding portion (341) and the third protruding portion (343). The third protruding portion (343) may be positioned between the second protruding portion (342) and the connecting portion (345). In one embodiment, the first feeding point (351) may be positioned at an end of the first protruding portion (341), the first grounding point (352) may be positioned at an end of the second protruding portion (342), and the second grounding point (353) may be positioned at an end of the third protruding portion (343).

[0112] Alternatively or optionally, the conductive portion (340) may not include at least one of the first protruding portion (341), the second protruding portion (342), and / or the third protruding portion (343). In such a case, at least one of the first feeding point (351), the first grounding point (352), and / or the second grounding point (353) may be located at a side portion (346) of the conductive portion (340).

[0113] In one embodiment, the electronic device (or printed circuit board (350)) may include a first conductive pattern (302) formed of a conductive material (e.g., copper). In one embodiment, the first conductive pattern (302) may be formed on the printed circuit board (350). For example, but not limited to, at least a portion of the first conductive pattern (302) may be formed on a surface of a substrate of the printed circuit board (350). In another example, at least a portion of the first conductive pattern (302) may be formed inside the printed circuit board (350). In one embodiment, the first conductive pattern (302) may be formed on (and / or within) a fill-cut area (FA) of the printed circuit board (350).

[0114] In one embodiment, the first conductive pattern (302) may be connected between the first power supply path (310) and the first ground path (320). For example, the first conductive pattern (302) may extend from a point on the first power supply path (310) to a point on the first ground path (320). For non-limiting example, the first conductive pattern (302) may extend from a connector (314) of the first power supply path (310) (or a conductive pad on a substrate of a printed circuit board (350) on which the connector (314) is disposed) to a connector (324) of the first ground path (320) (or a conductive pad on a substrate of a printed circuit board (350) on which the connector (324) is disposed). For another example, unlike the city, the first conductive pattern (302) may extend from the connector (314) of the first power path (310) to the line (322) of the first ground path (320). For another example, unlike the city, the first conductive pattern (302) may extend from the line (312) of the first power path (310) to the connector (324) of the first ground path (320).

[0115] According to one embodiment, the electronic device may further include a first matching circuit (326) and / or a second matching circuit (336). In one embodiment, the first matching circuit (326) may be located or included in the first ground path (320). For example, the first matching circuit (326) may be connected between the first conductive pattern (302) and the ground (G). In one embodiment, the second matching circuit (336) may be located or included in the second ground path (330). In one embodiment, the first matching circuit (326) and / or the second matching circuit (336) may be configured to adjust a resonance characteristic of an antenna including the conductive portion (340) and the first conductive pattern (302).

[0116] In one embodiment, the wireless communication circuit can supply a signal (F) to the conductive portion (340) and the first conductive pattern (302) via the first power path (310), and the signal (F) can be radiated through the conductive portion (340) and the first conductive pattern (302).

[0117] FIGS. 4, 5, and 6 illustrate antenna structures of exemplary electronic devices according to one embodiment.

[0118] Referring to FIGS. 4, 5, and 6, in one embodiment, the first conductive pattern (302) may extend from the first power supply path (310) to the first ground path (320). For example, as shown in FIG. 4, the first conductive pattern (302) may extend from the connector (314) of the first power supply path (310) to the connector (324) of the first ground path (320). For example, as shown in FIG. 5, the first conductive pattern (302) may extend from the line (312) of the first power supply path (310) to the line (322) of the first ground path (320).

[0119] According to one embodiment, the electronic device (or printed circuit board (350)) may include a second conductive pattern (304) formed of a conductive material (e.g., copper). In one embodiment, the second conductive pattern (304) may be formed on the printed circuit board (350). For example, but not limited to, at least a portion of the second conductive pattern (304) may be formed on a surface of a substrate of the printed circuit board (350). In another example, at least a portion of the second conductive pattern (304) may be formed inside the printed circuit board (350). In one embodiment, the second conductive pattern (304) may be formed on (and / or within) a fill-cut area of ​​the printed circuit board (350).

[0120] In one embodiment, the second conductive pattern (304) may be connected between the first ground path (320) and the second ground path (330). For example, the second conductive pattern (304) may extend from a point of the first ground path (320) to a point of the second ground path (330). For example, as shown in FIG. 4, the second conductive pattern (304) may extend from a line (322) of the first ground path (320) to a line (332) of the second ground path (330). In another example, unlike the illustration, the second conductive pattern (304) may extend from a line (322) of the first ground path (320) to a connector (334) of the second ground path (330). For example, as shown in FIG. 5, the second conductive pattern (304) may extend from the connector (324) of the first ground path (320) (or a conductive pad on the substrate of the printed circuit board (350) on which the connector (324) is disposed) to the connector (334) of the second ground path (330) (or a conductive pad on the substrate of the printed circuit board (350) on which the connector (334) is disposed). In another example, unlike the illustration, the second conductive pattern (304) may also extend from the connector (324) of the first ground path (320) to the line (332) of the second ground path (330).

[0121] In one embodiment, the first matching circuit (326) positioned in the first ground path (320) may be positioned between the second conductive pattern (304) and the ground (G). In one embodiment, the second matching circuit (336) positioned in the second ground path (330) may be positioned between the second conductive pattern (304) and the ground (G). In one embodiment, the first matching circuit (326) and / or the second matching circuit (336) may be configured to adjust radiation characteristics and / or resonance characteristics of an antenna including the conductive portion (340), the first conductive pattern (302), and the second conductive pattern (304).

[0122] In one embodiment, the first conductive pattern (302) and the second conductive pattern (304) may be spaced apart from the conductive portion (340). For example, the distances at which the first conductive pattern (302) and the second conductive pattern (304) are spaced apart from the conductive portion (340) may be different from each other or may be substantially the same.

[0123] For example, referring to FIG. 4, the first conductive pattern (302) may be spaced apart from the side portion (346) of the conductive portion (340) by a first distance (d1), and the second conductive pattern (304) may be spaced apart from the side portion (346) of the conductive portion (340) by a second distance (d2). In one embodiment, the second distance (d2) may be greater than the first distance (d1). For a non-limiting example, the first distance (d1) may be about 0.7 mm or greater. For a non-limiting example, the first distance (d1) may be about 0.7 mm to about 2.1 mm. For a non-limiting example, the second distance (d2) may be about 1.0 mm or greater. For a non-limiting example, the second distance (d2) may be about 1.0 mm to about 3.0 mm. In one embodiment, the point at which the first conductive pattern (302) is connected to the first ground path (320) may be located closer to the first ground point (352) than the point at which the second conductive pattern (304) is connected to the first ground path (320).

[0124] For example, referring to FIG. 5, the first conductive pattern (302) may be spaced apart from the side portion (346) of the conductive portion (340) by a third distance (d3), and the second conductive pattern (304) may be spaced apart from the side portion (346) of the conductive portion (340) by a fourth distance (d4). In one embodiment, the third distance (d3) may be greater than the fourth distance (d4). For a non-limiting example, the third distance (d3) may be greater than or equal to about 1.0 mm. For a non-limiting example, the third distance (d3) may be from about 1.0 mm to about 3.0 mm. For a non-limiting example, the fourth distance (d4) may be greater than or equal to about 0.7 mm. For a non-limiting example, the fourth distance (d4) may be from about 0.7 mm to about 2.1 mm. In one embodiment, the point at which the first conductive pattern (302) is connected to the first ground path (320) may be located further from the first ground point (352) than the point at which the second conductive pattern (304) is connected to the first ground path (320).

[0125] For example, referring to FIG. 6, the first conductive pattern (302) and the second conductive pattern (304) can be spaced apart from the conductive portion (340) by substantially the same distance from each other. For a non-limiting example, the first conductive pattern (302) and the second conductive pattern (304) can extend substantially parallel to each other. For a non-limiting example, the first conductive pattern (302) and the second conductive pattern (304) can be substantially parallel to the side portion (346) (or outer surface (340c)) of the conductive portion (340). In one embodiment, the first conductive pattern (302) and the second conductive pattern (304) can be connected to the same point of the first ground path (320).

[0126] In one embodiment, the wireless communication circuit can supply a signal (F) to the conductive portion (340), the first conductive pattern (302), and the second conductive pattern (304) via the first power path (310). The signal (F) can be radiated through the conductive portion (340), the first conductive pattern (302), and the second conductive pattern (304).

[0127] FIG. 7 is a diagram illustrating an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 7, the electronic device (or printed circuit board (350)) according to an embodiment may include at least one of a first stub pattern (712), a second stub pattern (714), and / or a third stub pattern (716).

[0128] In one embodiment, the first stub pattern (712) may extend from the first ground path (320) toward the first power supply path (310). An end of the first stub pattern (712) may be spaced apart from the first power supply path (310). The first stub pattern (712) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board (350). In one embodiment, the first conductive pattern (302) may be positioned between the first stub pattern (712) and the conductive portion (340), but is not limited thereto. For example, unlike the illustration, the first stub pattern (712) may be positioned between the first conductive pattern (302) and the conductive portion (340). In one embodiment, a first matching circuit (326) located in the first ground path (320) may be located between the first stub pattern (712) and the ground (G).

[0129] In one embodiment, the second stub pattern (714) may extend from the first ground path (320) toward the second ground path (330). An end of the second stub pattern (714) may be spaced apart from the second ground path (330). The second stub pattern (714) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board (350). In one embodiment, the second stub pattern (714) may be positioned between the second conductive pattern (304) and the conductive portion (340), but is not limited thereto. For example, unlike the illustration, the second conductive pattern (304) may be positioned between the second stub pattern (714) and the conductive portion (340). In this case, the second matching circuit (336) located in the second ground path (330) may be located between the second stub pattern (714) and the ground (G).

[0130] In one embodiment, the third stub pattern (716) may extend from the second ground path (330) toward the third ground path (e.g., the connecting portion (345) or the conductive connecting member (355)). An end of the third stub pattern (716) may be spaced apart from the third ground path. Alternatively, an end of the third stub pattern (716) may be connected to the third ground path (e.g., the third conductive pattern (906) of FIG. 9). In one embodiment, the third stub pattern (716) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board (350).

[0131] In some embodiments, optionally, the electronic device (or printed circuit board (350)) according to one embodiment may include a stub pattern extending from the second ground path (330) toward the first ground path (320).

[0132] FIG. 8 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 8, the electronic device according to an embodiment may further include a first tuning circuit (882) and / or a second tuning circuit (884). In an embodiment, the first tuning circuit (882) may include a matching circuit and / or a switching circuit. In an embodiment, the second tuning circuit (884) may include a matching circuit and / or a switching circuit. The matching circuit may be configured to adjust an impedance characteristic. The switching circuit may be configured to open and close a circuit to control the flow of current. For example, the first tuning circuit (882) and / or the second tuning circuit (884) may adjust the resonant frequency and impedance matching by varying the electrical length through electrical connections and various lumped elements.

[0133] In one embodiment, the first tuning circuit (882) and the second tuning circuit (884) may be disposed on a substrate of a printed circuit board (350). The first tuning circuit (882) may be connected to the first conductive pattern (302), and the second tuning circuit (884) may be connected to the second conductive pattern (304).

[0134] FIG. 9 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 9, the electronic device (or printed circuit board (350)) according to an embodiment may further include a third conductive pattern (906). In an embodiment, the third conductive pattern (906) may be formed of a conductive material (e.g., copper). In an embodiment, the third conductive pattern (906) may be formed on the printed circuit board (350). For example, but not limited to, at least a portion of the third conductive pattern (906) may be formed on a surface of a substrate of the printed circuit board (350). In another example, at least a portion of the third conductive pattern (906) may be formed inside the printed circuit board (350). In an embodiment, the third conductive pattern (906) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board (350).

[0135] In one embodiment, the third conductive pattern (906) can be connected between the second ground path (330) and the third ground path. For example, the third conductive pattern (906) can extend from a point of the second ground path (330) to the third ground path. For a non-limiting example, the third conductive pattern (906) can extend to the conductive connecting member (355) so as to be connected to the conductive connecting member (355). In this way, the second ground path (330) can be connected to the third ground path.

[0136] In one embodiment, the second conductive pattern (304) and the third conductive pattern (906) may be connected to the same point of the second ground path (330), but are not limited thereto.

[0137] In one embodiment, the third conductive pattern (906) may extend from, but is not limited to, the line (332) of the second ground path (330). For example, the third conductive pattern (906) may extend from the connector (334) of the second ground path (330).

[0138] In some embodiments, additionally or alternatively, the electronic device according to one embodiment may include a third tuning circuit (e.g., a first tuning circuit (882)) connected to the third conductive pattern (906). The third tuning circuit may be disposed on a substrate of the printed circuit board (350). The third tuning circuit may include the matching circuit and / or the switching circuit.

[0139] Fig. 10 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to Fig. 10, the electronic device according to an embodiment may not include the third grounding point (354) and connection portion (345) of Fig. 9.

[0140] FIG. 11 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 11, the electronic device (or printed circuit board (350)) according to an embodiment may include a fourth conductive pattern (1102) formed of a conductive material (e.g., copper). In an embodiment, the fourth conductive pattern (1102) may be formed on (and / or within) a fill-cut area of ​​the printed circuit board (350).

[0141] In one embodiment, the fourth conductive pattern (1102) may be connected between the first power supply path (310) and the second ground path (330). For example, the fourth conductive pattern (1102) may extend from a point of the first power supply path (310) to a point of the second ground path (330). For example, the fourth conductive pattern (1102) may extend from a line (312) of the first power supply path (310) to a line (332) of the second ground path (330), but is not limited thereto. For example, the fourth conductive pattern (1102) may extend from the connector (314) of the first power path (310) (or a conductive pad on the substrate of the printed circuit board (350) on which the connector (314) is disposed) to the line (332) or connector (334) of the second ground path (330) (or a conductive pad on the substrate of the printed circuit board (350) on which the connector (334) is disposed).

[0142] In one embodiment, the fourth conductive pattern (1102) may be formed at least partially within the printed circuit board (350). For example, the fourth conductive pattern (1102) may include sections (a, c) formed on the substrate of the printed circuit board (350) and sections (b) formed within the printed circuit board (350). Section (b) may be formed at least partially on a different layer from the first ground path (320) so as not to be connected to the first ground path (320). In some embodiments, the fourth conductive pattern (1102) may include conductive vias for routing section (b) and sections (a, c) located on a different layer from section (b). Contrary to the illustration, the entirety of the fourth conductive pattern (1102) may be formed within the printed circuit board (350).

[0143] In one embodiment, the fourth conductive pattern (1102) may replace the first conductive pattern (302) described above, or may be provided in addition to the first conductive pattern (302).

[0144] FIG. 12 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 12, a conductive portion (340) according to an embodiment may include a fourth protruding portion (1247). In an embodiment, the fourth protruding portion (1247) may extend from a side portion (346). For example, the fourth protruding portion (1247) may extend from the side portion (346) in a direction opposite to a direction in which the outer surface (340c) faces (e.g., toward the inside of the electronic device). The fourth protruding portion (1247) may be referred to as a fourth flange protruding from the side portion (346).

[0145] In one embodiment, a third protrusion portion (343) may be positioned between the fourth protrusion portion (1247) and the second protrusion portion (342). In one embodiment, the conductive portion (340) may include a fourth grounding point (1254) positioned at an end of the fourth protrusion portion (1247). Alternatively or optionally, the conductive portion (340) may not include the fourth protrusion portion (1247). In such a case, the fourth grounding point (1254) may be positioned at a side portion (346) of the conductive portion (340).

[0146] In one embodiment, the fourth protruding portion (1247) and the fourth grounding point (1254) may replace the aforementioned connecting portion (345) and the third grounding point (354), or may be additionally provided to the connecting portion (345) and the third grounding point (354). When the fourth protruding portion (1247) is additionally provided to the connecting portion (345), the fourth protruding portion (1247) may be positioned between the third protruding portion (343) and the connecting portion (345), or alternatively, the connecting portion (345) may be positioned between the third protruding portion (343) and the fourth protruding portion (1247).

[0147] In one embodiment, the fourth ground point (1254) may be electrically connected to a ground of the electronic device (e.g., ground (G) of FIG. 10). For example, the fourth ground point (1254) may be electrically connected to the ground via a fourth ground path (1240) of the printed circuit board (350). For non-limiting example, the fourth ground path (1240) may include a line (1242) formed of a conductive material (e.g., copper) and a connector (1244) connected to the line (1242). In one embodiment, the line (1242) of the fourth ground path (1240) may be formed on the outer layer and / or the inner layer of the printed circuit board (350). In one embodiment, the connector (1244) may be connected to the conductive portion (340) by contacting the fourth ground point (1254) of the fourth protruding portion (1247). For non-limiting examples, the connector (1244) may include a C-clip or a pogo pin.

[0148] In one embodiment, the electronic device (or printed circuit board (350)) may include a fifth conductive pattern (1206) formed of a conductive material (e.g., copper). In one embodiment, the fifth conductive pattern (1206) may be formed at least partially on a surface of a substrate of the printed circuit board (350). For example, but not limited to, the entire fifth conductive pattern (1206) may be formed on the surface of the substrate of the printed circuit board (350). In another example, a portion of the fifth conductive pattern (1206) may be formed within the printed circuit board (350). In one embodiment, the fifth conductive pattern (1206) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board (350).

[0149] In one embodiment, the fifth conductive pattern (1206) may be connected between the second ground path (330) and the fourth ground path (1240). For example, the fifth conductive pattern (1206) may extend from a point of the second ground path (330) to a point of the fourth ground path (1240). In one embodiment, the fifth conductive pattern (1206) may extend from a line (332) of the second ground path (330) to a line (1242) of the fourth ground path (1240), but is not limited thereto. For example, the fifth conductive pattern (1206) may extend from the connector (334) of the second ground path (330) (or a conductive pad on the substrate of the printed circuit board (350) on which the connector (334) is disposed) to the line (1242) or connector (1244) of the fourth ground path (1240) (or a conductive pad on the substrate of the printed circuit board (350) on which the connector (1244) is disposed). For example, the fifth conductive pattern (1206) may extend from the line (332) of the second ground path (330) to the connector (1244) of the fourth ground path (1240).

[0150] The electronic device according to one embodiment may further include a third matching circuit (1246). In one embodiment, the third matching circuit (1246) may be located in the fourth ground path (1240). For example, the third matching circuit (1246) may be connected between the fifth conductive pattern (1206) and the ground. The third matching circuit (1246) may be configured to adjust a resonance characteristic of an antenna including the conductive portion (340), the first conductive pattern (302), and the fifth conductive pattern (1206).

[0151] In some embodiments, additionally or alternatively, the electronic device according to one embodiment may further include a fourth tuning circuit (e.g., the first tuning circuit (882)) connected to the fifth conductive pattern (1206). The fourth tuning circuit may be disposed on a substrate of the printed circuit board (350). The fourth tuning circuit may include the matching circuit and / or the switching circuit.

[0152] In one embodiment, the wireless communication circuit can supply a signal (F) to the conductive portion (340), the first conductive pattern (302), and the fifth conductive pattern (1206) via the first power path (310). The signal (F) can be radiated through the conductive portion (340), the first conductive pattern (302), and the fifth conductive pattern (1206).

[0153] Although not shown, the electronic device according to one embodiment may further include at least one of the second conductive pattern (304), the third conductive pattern (906), the fourth conductive pattern (1102), the first stub pattern (712), the second stub pattern (714), the third stub pattern (716), the first tuning circuit (882), the second tuning circuit (884) and / or the third tuning circuit.

[0154] FIG. 13 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 13, according to an embodiment, the conductive portion (340) may include a second feed point (1356).

[0155] In one embodiment, the second feed point (1356) may be electrically connected to the wireless communication circuit. For example, the second feed point (1356) may be electrically connected to the wireless communication circuit via a second feed path (1310) of the printed circuit board (350). For non-limiting example, the second feed path (1310) may include a line formed of a conductive material on the substrate of the printed circuit board (350), similar to the first feed path (310) described above, and / or a connector connected to the line (e.g., the connector (314) of FIG. 3). The connector may be connected to the conductive portion (340) by contacting the second feed point (1356).

[0156] In one embodiment, the second feed point (1356) may be adjacent to the first feed point (351) and the third grounding point (354) among the grounding points (352, 353, 354). For example, the third grounding point (354) may be located between the second feed point (1356) and the second grounding point (353). In one embodiment, the second feed point (1356) may be formed at the end of a protruding portion (or flange) (1341) extending from the side portion (346), such as the first protruding portion (341) described above.

[0157] Unlike the city, the connection portion (345) connecting the third ground point (354) to the ground (G) may be replaced with the fourth ground path (1240) of Fig. 12. In this case, additionally or alternatively, the electronic device may include a conductive pattern (e.g., the first conductive pattern (302)) provided by a printed circuit board (e.g., the printed circuit board (350) of Fig. 12) and extending from the second power supply path (1310) to the fourth ground path (1240).

[0158] In one embodiment, the wireless communication circuit can supply a signal (F') to the conductive portion (340) via the second power path (1310), and the signal (F') can be radiated through the conductive portion (340).

[0159] FIG. 14 illustrates an antenna structure of an exemplary electronic device according to an embodiment. Referring to FIG. 14 , according to an embodiment, the conductive portion (340) may further include a fifth grounding point (1457). In an embodiment, the fifth grounding point (1457) may be formed at an end of a protruding portion (or flange) (1455) extending from the side portion (346). In an embodiment, the fifth grounding point (1457) may be located between the second feed point (1356) and the fourth grounding point (1254). In an embodiment, the first feed point (351), the first grounding point (352), the second grounding point (353), the fourth grounding point (1254), the fifth grounding point (1457), and the second feed point (1356) may be located in the conductive portion (340) (e.g., in that order).

[0160] In one embodiment, the fifth ground point (1457) may be electrically connected to the ground (G) of the electronic device. For example, the fifth ground point (1457) may be electrically connected to the ground (G) via a fifth ground path (1420) of a printed circuit board (e.g., printed circuit board (350) of FIG. 12) of the electronic device. For a non-limiting example, the fifth ground path (1420) may include a line (e.g., line (1242) of FIG. 12) formed of a conductive material (e.g., copper) and / or a connector (e.g., connector (1244) of FIG. 12) connected to the line, similar to the fourth ground path (1240).

[0161] In one embodiment, the electronic device may include a sixth conductive pattern (1402) and / or a seventh conductive pattern (1404). The sixth conductive pattern (1402) and the seventh conductive pattern (1404) may be formed of a conductive material (e.g., copper). The sixth conductive pattern (1402) and the seventh conductive pattern (1404) may be formed on the printed circuit board of the electronic device. For example, the sixth conductive pattern (1402) and the seventh conductive pattern (1404) may be formed at least partially on a surface of a substrate of the printed circuit board. In one embodiment, the sixth conductive pattern (1402) and the seventh conductive pattern (1404) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board.

[0162] In one embodiment, the sixth conductive pattern (1402) may be connected between the second power supply path (1310) and the fifth ground path (1420). For example, the sixth conductive pattern (1402) may extend from a point on the second power supply path (1310) to a point on the fifth ground path (1420).

[0163] In one embodiment, the seventh conductive pattern (1404) may be connected between the fourth ground path (1240) and the fifth ground path (1420). For example, the seventh conductive pattern (1404) may extend from a point on the fourth ground path (1240) to a point on the fifth ground path (1420).

[0164] The electronic device according to one embodiment may further include a fourth matching circuit (1426) disposed on the printed circuit board. In one embodiment, the fourth matching circuit (1426) may be located in the fifth ground path (1420). For example, the fourth matching circuit (1426) may be connected between the seventh conductive pattern (1404) and the ground (G).

[0165] In one embodiment, a third matching circuit (1246) located in the fourth ground path (1240) may be connected between the seventh conductive pattern (1404) and the ground (G). In one embodiment, the third matching circuit (1246) and the fourth matching circuit (1426) may be configured to adjust resonance characteristics of an antenna including the conductive portion (340), the sixth conductive pattern (1402), and the seventh conductive pattern (1404).

[0166] In one embodiment, the wireless communication circuit can supply a signal (F') to the conductive portion (340), the sixth conductive pattern (1402), and the seventh conductive pattern (1404) via the second power path (1310). The signal (F') can be radiated through the conductive portion (340), the sixth conductive pattern (1402), and the seventh conductive pattern (1404).

[0167] Additionally, the electronic device according to one embodiment may include a fourth stub pattern (1412). In one embodiment, the fourth stub pattern (1412) may extend from the fifth ground path (1420) toward the second power supply path (1310). An end of the fourth stub pattern (1412) may be spaced apart from the second power supply path (1310). The fourth stub pattern (1412) may be formed on (and / or within) the fill-cut area of ​​the printed circuit board. In one embodiment, a sixth conductive pattern (1402) may be positioned between the fourth stub pattern (1412) and the conductive portion (340), but is not limited thereto. For example, unlike the illustration, the fourth stub pattern (1412) may be positioned between the sixth conductive pattern (1402) and the conductive portion (340). In one embodiment, a fourth matching circuit (1426) connected to the fifth ground path (1420) may be positioned between the fourth stub pattern (1412) and the ground (G).

[0168] Fig. 15a shows examples of antenna structures of electronic devices. Fig. 15b shows radiation efficiency according to examples of antenna structures of electronic devices.

[0169] Referring to FIG. 15A, in the first example (1502), the conductive portion (340) can be connected to ground (e.g., ground (G0)) at one point. In the second example (1504), the conductive portion (340) can be connected to ground (e.g., grounds (G0, G1)) at two points. In the third example (1506), the conductive portion (340) can be connected to ground (e.g., grounds (G0, G1, G3)) at three points. The conductive portions (340) of the examples (1502, 1504, 1506) can radiate the supplied signal (F).

[0170] Referring to FIG. 15b together with FIG. 15a, as the conductive portion (340) is connected to the ground (e.g., the ground (G) of FIG. 3) at multiple points (e.g., the first ground point (352), the second ground point (353), and the third ground point (354) of FIG. 3), the resonant frequency can be shifted and the radiation efficiency can be improved (e.g., a band of about 5 GHz or more).

[0171] FIG. 16A illustrates examples of antenna structures of an electronic device according to an embodiment. FIG. 16B illustrates radiation efficiency according to an example of an antenna structure of an electronic device according to an embodiment. FIG. 16C illustrates an electric field of an antenna structure of an electronic device according to an embodiment. FIG. 16C may be an antenna structure of the third example (1606) of FIG. 16A.

[0172] Referring to FIG. 16A, in the first example (1602), the conductive portion (340) is connected to the ground (G) via the first ground path (320), the second ground path (330), and the third ground path, and the first power supply path (310) and the first ground path (320) may be connected via the first conductive pattern (302). The first example (1602) may further include the first conductive pattern (302) compared to the third example (1506) of FIG. 15A. The first example (1602) may be an embodiment described with reference to FIG. 3.

[0173] The second example (1604) may further include a second conductive pattern (304) connecting the first ground path (320) and the second ground path (330) compared to the first example (1602). The second example (1604) may be an embodiment described with reference to FIG. 4.

[0174] The third example (1606) may further include a first stub pattern (712) connected to the first ground path (320) compared to the second example (1604). The third example (1606) may be an embodiment in which the second stub pattern (714) and the third stub pattern (716) are omitted from the embodiment described with reference to FIG. 7.

[0175] Comparing the first example (1502) of FIG. 15b with the first example (1602) of FIG. 16b, the efficiency can be improved by adding the first conductive pattern (302). Comparing the first example (1602) of FIG. 16b with the second example (1604) of FIG. 16b, the efficiency can be improved by adding the second conductive pattern (304). Comparing the second example (1604) of FIG. 16b with the third example (1606) of FIG. 16b, the efficiency can be improved by adding the first stub pattern (712). This may be because, as illustrated in FIG. 16c, a strong current is induced in the first conductive pattern (302), the second conductive pattern (304), and the first stub pattern (712). This allows not only improved efficiency but also an overall wider bandwidth of operating frequencies (e.g., a bandwidth of about 5.5 GHz and a bandwidth of about 5 GHz or more).

[0176] According to one embodiment, an antenna structure having wideband characteristics supporting various operating frequencies can be implemented through a conductive portion (340) and a printed circuit board embedded antenna (PEA) (e.g., a first conductive pattern (302), a second conductive pattern (304), and a first stub pattern (712)) without adding a number of antennas. The antenna structure can operate, for example, in a legacy frequency band (e.g., an LTE frequency band) as well as a sub-6 frequency band of 5G (e.g., a Frequency Range 1 band defined in the 3GPP NR standard) without interference of the legacy band.

[0177] Advances in communication technology are leading to the addition of new service bands, such as mmWave and 5G NR (new radio). Furthermore, as the performance of electronic devices improves, the size and quantity of internal components are increasing. Consequently, even as the space required for antenna implementation shrinks, more antennas are required to support new service bands. As described above, an electronic device according to one embodiment can maximize space utilization by supporting various frequency bands without adding antennas.

[0178] FIG. 17a illustrates examples of antenna structures of an electronic device according to an embodiment. FIG. 17b illustrates radiation efficiency according to examples of antenna structures of an electronic device according to an embodiment.

[0179] Referring to FIG. 17A, the first example (1702) may include a first conductive pattern (302), like the first example (1602) of FIG. 16A. The first example (1702) may be an embodiment described with reference to FIG. 3.

[0180] The second example (1704) may further include a second conductive pattern (304) compared to the first example (1702). The second example (1704) may be an embodiment described with reference to FIG. 4. For example, the second conductive pattern (304) of the second example (1704) may be positioned further from the side portion (346) of the conductive portion (340) than the first conductive pattern (302). For example, the first conductive pattern (302) of the second example (1704) may be spaced apart from the side portion (346) of the conductive portion (340) by a first distance (e.g., the first distance (d1) of FIG. 4), and the second conductive pattern (304) may be spaced apart from the side portion (346) by a second distance (e.g., the second distance (d2) of FIG. 4) that is greater than the first distance.

[0181] In the third example (1706), unlike the second example (1704), the first conductive pattern (302) and the second conductive pattern (304) may be positioned at substantially the same distance from the side portion (346) of the conductive portion (340). The third example (1706) may be an embodiment described with reference to FIG. 6.

[0182] Referring to FIGS. 17A and 17B, the resonance frequency can be adjusted through various combinations of the first conductive pattern (302) and the second conductive pattern (304). For example, as the combination of the first conductive pattern (302) and the second conductive pattern (304) changes in the order of the first example (1702), the third example (1706), and the second example (1704), the resonance frequency band of about 5.0 GHz can be upwardly shifted.

[0183] FIG. 18a illustrates examples of antenna structures of an electronic device according to an embodiment. FIG. 18b illustrates radiation efficiency according to examples of antenna structures of an electronic device according to an embodiment.

[0184] Referring to FIG. 18a, the first example (1802) may include a first conductive pattern (302) connecting a first power supply path (310) and a first ground path (320) and a second conductive pattern (304) connecting the first ground path (320) and a second ground path (330). The first example (1802) may further include the second conductive pattern (304) compared to the first example (1702) of FIG. 17a. The first example (1802) may be an embodiment described with reference to FIG. 4.

[0185] In the second example (1804), the first conductive pattern (302) may be positioned further from the conductive portion (340) than in the first example (1802) so that the first conductive pattern (302) and the second conductive pattern (304) are aligned parallel to each other.

[0186] The third example (1806) may further include a third conductive pattern (906) compared to the second example (1804). The third example (1806) may be an embodiment described with reference to FIG. 9.

[0187] Referring to FIG. 18B along with FIG. 18A, the first example (1802), the second example (1804), and the third example (1806) can form a resonant frequency of about 5.0 GHz or higher. Such antenna structures can operate in the 6th generation (6G) frequency band of about 5.0 GHz or higher, as well as the legacy frequency band. This allows for a single antenna structure that can operate for the legacy network, the 5G network, as well as the next-generation network such as the 6G network, without increasing the number of antennas. Accordingly, the space required to implement antennas that support various frequencies according to various networks can be saved.

[0188] FIG. 19a illustrates examples of antenna structures of an electronic device according to one embodiment. FIG. 19b illustrates radiation efficiency according to examples of antenna structures of an electronic device according to one embodiment.

[0189] Referring to FIG. 19A, a first example (1902) may include a first conductive pattern (302), a second conductive pattern (304), and a first stub pattern (712). The first example (1902) may be an embodiment in which the second stub pattern (714) and the third stub pattern (716) are omitted from the embodiment described with reference to FIG. 7. The second example (1904) may further include a third conductive pattern (906) compared to the first example (1902).

[0190] Referring to FIG. 19b together with FIG. 19a, the first example (1902) can form a resonant frequency of about 6.0 GHz or more, and the second example (1904) can form a resonant frequency of about 7.0 GHz or more. This may be because the length of the electrical path is shortened as the third conductive pattern (906) is added.

[0191] FIG. 20A illustrates examples of antenna structures of an electronic device according to an embodiment. FIG. 20B illustrates radiation efficiency according to examples of antenna structures of an electronic device according to an embodiment.

[0192] Referring to FIG. 20A, the electronic device according to one embodiment may include at least one of the patterns (A, A', B, B', C). In one embodiment, the patterns (A, A') may be substantially identical to the first conductive pattern (302) described above. For example, when the electronic device includes both patterns (A, A'), the electronic device may be understood to include two first conductive patterns (302) spaced apart from each other.

[0193] In one embodiment, the patterns (B, B') may be substantially identical to the second conductive pattern (304) described above. For example, if the electronic device includes both patterns (B, B'), the electronic device may be understood to include two second conductive patterns (304) spaced apart from each other.

[0194] In one embodiment, the pattern (C) may be substantially identical to the third conductive pattern (906) described above.

[0195] In one embodiment, a first example (2002) may include patterns (A, B). In one embodiment, a second example (2004) may include patterns (A, B'). In one embodiment, a third example (2006) may include patterns (A', B). In one embodiment, a fourth example (2008) may include patterns (A', B'). In one embodiment, a fifth example (2010) may include patterns (A, B, C). In one embodiment, a sixth example (2012) may include patterns (A, B', C). In one embodiment, a seventh example (2014) may include patterns (A', B, C). In one embodiment, an eighth example (2016) may include patterns (A', B', C). In one embodiment, the ninth example (2018) may include patterns (A, A', B, B', C).

[0196] In one embodiment, the resonant frequency of the antenna structure may be adjusted through various combinations of the patterns (A, A', B, B', C). For example, referring to FIGS. 20A and 20B , as the combination of the conductive patterns (A, A', B, B', C) is changed in the order of the sixth example (2012), the fifth example (2010), and the seventh example (2014), the resonant frequency may be shifted upward at a frequency of about 5.0 GHz.

[0197] An electronic device (e.g., the electronic device (100) of FIG. 1) according to an embodiment may include a housing (e.g., the housing (110) of FIG. 2A) including a conductive portion (e.g., the conductive portion (340) of FIG. 3) forming a portion of a side surface (e.g., the side surface (100C) of FIG. 1) of the electronic device, a printed circuit board (e.g., the printed circuit board (350) of FIG. 3), and a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) disposed on the printed circuit board. The conductive portion may include a feed point (e.g., the feed point (351) of FIG. 3), a first ground point (e.g., the first ground point (352) of FIG. 3), and a second ground point (e.g., the second ground point (353) of FIG. 3). The first ground point may be connected to the ground of the electronic device (e.g., the ground (G) of FIG. 3) via a first ground path of the printed circuit board (e.g., the first ground path (320) of FIG. 3). The second ground point may be connected to the ground via a second ground path of the printed circuit board (e.g., the second ground path (330) of FIG. 3). The feed point may be electrically connected to the wireless communication circuit via a feed path of the printed circuit board (e.g., the feed path (310) of FIG. 3). The printed circuit board may include a conductive pattern (e.g., the first conductive pattern (302) of FIG. 3) connected between the feed path and the first ground path. The wireless communication circuit may be configured to supply a signal (e.g., a signal (F) of FIG. 3) to the conductive portion and the conductive pattern via the feed path. The above signal can be radiated through the conductive portion and the conductive pattern.

[0198] In one embodiment, the conductive pattern is a first conductive pattern, and the printed circuit board may include a second conductive pattern (e.g., the second conductive pattern (304) of FIG. 4) connected between the first ground path and the second ground path.

[0199] In one embodiment, the point at which the first conductive pattern is connected to the first ground path may be closer to the first ground point than the point at which the second conductive pattern is connected to the first ground path.

[0200] In one embodiment, the point at which the first conductive pattern is connected to the first ground path may be further from the first ground point than the point at which the second conductive pattern is connected to the first ground path.

[0201] In one embodiment, the first conductive pattern and the second conductive pattern may be connected to a point of the first ground path.

[0202] The electronic device according to one embodiment may include at least one of a first switch (e.g., a first tuning circuit (882) of FIG. 8) connected to the first conductive pattern and a second switch (e.g., a second tuning circuit (884) of FIG. 8) connected to the second conductive pattern.

[0203] According to one embodiment, the electronic device may include a first matching circuit (e.g., the first matching circuit (326) of FIG. 3) connected to the first ground path and a second matching circuit (e.g., the second matching circuit (336) of FIG. 3) connected to the second ground path.

[0204] According to one embodiment, the electronic device may include at least one of a first stub extending from the first ground path toward the power supply path (e.g., the first stub pattern (712) of FIG. 7) and a second stub extending from the first ground path toward the second ground path (e.g., the second stub pattern (714) of FIG. 7).

[0205] In one embodiment, the first conductive pattern may be positioned between the conductive portion and the first stub. The second stub may be positioned between the conductive portion and the second conductive pattern.

[0206] In one embodiment, the first stub may be positioned between the conductive portion and the first conductive pattern. The second conductive pattern may be positioned between the conductive portion and the second stub.

[0207] In one embodiment, the first grounding point may be located between the feed point and the second grounding point.

[0208] In one embodiment, the conductive portion may include a third ground point (e.g., the third ground point (354) of FIG. 3) connected to the ground via a third ground path. The feed point, the first ground point, the second ground point, and the third ground point may be located (e.g., in that order) in the conductive portion.

[0209] In one embodiment, the printed circuit board may include a third conductive pattern (e.g., the third stub pattern (716) of FIG. 7 or the third conductive pattern (906) of FIG. 9) extending from the second ground path toward the third ground path.

[0210] In one embodiment, the end of the third conductive pattern may be spaced apart from the third ground path or connected to the third ground path.

[0211] In one embodiment, the feed point may be a first feed point, and the conductive portion may include a second feed point (e.g., the second feed point (1356) of FIG. 13) connected to the wireless communication circuit.

[0212] In one embodiment, the first grounding point and the second grounding point may be located between the first power supply point and the second power supply point.

[0213] In one embodiment, the second feed point may be connected to the wireless communication circuitry via another feed path of the printed circuit board (e.g., the second feed path (1310) of FIG. 13). The printed circuit board may include another conductive pattern (e.g., the sixth conductive pattern (1402) of FIG. 14) connected between the other feed path and a ground path adjacent to the other feed path.

[0214] According to one embodiment, an electronic device (e.g., an electronic device (100) of FIG. 1) may include a feeding point (e.g., a first feeding point (351) of FIG. 7), a first grounding point (e.g., a first grounding point (352) of FIG. 7), a second grounding point (e.g., a second grounding point (353) of FIG. 7), and a third grounding point (e.g., a third grounding point (354) of FIG. 7) positioned in sequence, a conductive portion (e.g., a conductive portion (340) of FIG. 7) forming a part of a side surface (e.g., a side surface (100C) of FIG. 1) of the electronic device, a printed circuit board (e.g., a printed circuit board (350) of FIG. 7) including a conductive pattern, and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the printed circuit board and connected to the feeding point via a feeding path (e.g., a first feeding path (310) of FIG. 7) of the printed circuit board. There are. Each of the first ground point, the second ground point, and the third ground point of the conductive portion may be connected to a ground of the electronic device (e.g., ground (G) of FIG. 7). The first ground point may be connected to the ground through a first ground path of the printed circuit board (e.g., first ground path (320) of FIG. 7). The second ground point may be connected to the ground through a second ground path of the printed circuit board (e.g., second ground path (330) of FIG. 7). The conductive pattern of the printed circuit board may include a first conductive pattern (e.g., the first conductive pattern (302) of FIG. 7) positioned between the power supply path and the first ground path, a second conductive pattern (e.g., the second conductive pattern (304) of FIG. 7) positioned between the first ground path and the second ground path, and a stub pattern (e.g., the first stub pattern (712) of FIG. 7) extending from the first ground path so that an end thereof faces the power supply path.The wireless communication circuit may be configured to supply a signal (e.g., signal (F) of FIG. 7) to the conductive portion and the conductive pattern through the power supply path. The signal may be radiated through the conductive portion and the conductive pattern.

[0215] In one embodiment, the conductive portion may include a segment (e.g., a side portion (346) of FIG. 7) where the feed point, the first ground point, and the second ground point are located. The segment may include a surface forming the side surface of the electronic device (e.g., an outer surface (340c) of FIG. 7). The stub pattern may be located further from the surface than the first conductive pattern.

[0216] In one embodiment, the second conductive pattern may be positioned further from the surface than the first conductive pattern.

[0217] Electronic devices according to one or more embodiments may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the aforementioned devices.

[0218] The description of one or more embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0219] The term "module" as used in one or more embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0220] One or more embodiments may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0221] A method according to one or more embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0222] According to one or more embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A housing comprising a conductive portion forming a portion of a side surface of said electronic device; A printed circuit board including a first ground path, a second ground path, and a power supply path; and Including a wireless communication circuit arranged on the above printed circuit board, The above-mentioned challenging portion includes a power supply point, a first ground point, and a second ground point, The above first ground point is connected to the ground of the electronic device through the first ground path, The second ground point is connected to the ground through the second ground path, The above-mentioned power supply point is electrically connected to the wireless communication circuit through the above-mentioned power supply path, The printed circuit board includes a conductive pattern connected between the power supply path and the first ground path, The above wireless communication circuit is configured to supply a signal to the conductive portion and the conductive pattern through the power supply path, The above signal is radiated through the conductive portion and the conductive pattern. Electronic devices.

2. In claim 1, The above challenge pattern is a first challenge pattern, The printed circuit board includes a second conductive pattern connected between the first ground path and the second ground path. Electronic devices.

3. In claim 2, The first point at which the first conductive pattern is connected to the first ground path is closer to the first ground point than the second point at which the second conductive pattern is connected to the first ground path. Electronic devices.

4. In claim 2, The first point at which the first conductive pattern is connected to the first ground path is further from the first ground point than the second point at which the second conductive pattern is connected to the first ground path. Electronic devices.

5. In claim 2, The first conductive pattern and the second conductive pattern are connected to one point of the first ground path. Electronic devices.

6. In any one of claims 2 to 5, Further comprising at least one of a first switch connected to the first conductive pattern and a second switch connected to the second conductive pattern. Electronic devices.

7. In any one of claims 1 to 6, a first matching circuit located in the first ground path; and Further comprising a second matching circuit positioned in the second ground path; Electronic devices.

8. In any one of claims 2 to 6, Further comprising at least one of a first stub extending from the first ground path toward the power supply path and a second stub extending from the first ground path toward the second ground path. Electronic devices.

9. In claim 8, The first conductive pattern is positioned between the conductive portion and the first stub, The second stub is positioned between the conductive portion and the second conductive pattern. Electronic devices.

10. In claim 8, The first stub is positioned between the conductive portion and the first conductive pattern, The second conductive pattern is located between the conductive portion and the second stub. Electronic devices.

11. In any one of claims 1 to 10, The above first grounding point is located between the above feeding point and the above second grounding point, Electronic devices.

12. In any one of claims 1 to 11, The above-mentioned challenging portion includes a third ground point connected to the ground via a third ground path, The above-mentioned power supply point, the first grounding point, the second grounding point, and the third grounding point are located in the conductive portion in that order. Electronic devices.

13. In claim 12, The printed circuit board includes a third conductive pattern extending from the second ground path toward the third ground path. Electronic devices.

14. In claim 13, The end of the third challenge pattern is: or separated from the above third ground path, or Connected to the above third ground path, Electronic devices.

15. In any one of claims 1 to 14, The above-mentioned feed point is the first feed point, The above-mentioned challenging portion comprises a second feed point connected to the wireless communication circuit; Electronic devices.

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