Array substrate, light-emitting substrate, and display apparatus

Abstract

An array substrate, a light-emitting substrate, and a display apparatus. The array substrate comprises a substrate (10), a protruding portion (20), a first reflective layer (50), a second reflective layer (30), and a conductive layer (40). The substrate comprises a first surface (101) and a second surface (102) opposite each other, the first surface being provided with a groove (11). The protruding portion (20) is located in the groove and is spaced apart from the side surface of the groove; in a direction from the first surface to the second surface, the area of the cross section of the protruding portion (20) parallel to the second surface is gradually increased. The first reflective layer (50) at least covers the side surface of the protruding portion. The second reflective layer (30) is located on the side of the substrate (10) away from the second surface and is provided with an open hole (303), the orthographic projection of one open hole on the second surface being located within the orthographic projection of one groove on the second surface. The conductive layer (40) is located on the side of the second reflective layer (30) facing away from the substrate, the conductive layer comprising a conductive pad (41).

Description

Array substrate, light-emitting substrate, and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a light-emitting substrate, and a display device. Background Art

[0002] With the development of light-emitting diode (LED) technology, light-emitting substrates using submillimeter or even micron-scale light-emitting diodes (LEDs) have become widely used. This allows products such as liquid crystal displays (LCDs) to achieve contrast levels comparable to those of organic light-emitting diode (OLED) displays while retaining the technical advantages of LCDs. This improves display quality and provides users with a superior visual experience.

[0003] Summary of the Invention

[0004] The present application provides an array substrate, a light-emitting substrate, and a display device.

[0005] According to a first aspect of an embodiment of the present application, an array substrate is provided, comprising:

[0006] The substrate comprises a first surface and a second surface opposite to each other; the first surface is provided with a groove;

[0007] a protrusion located in the groove and spaced apart from a side surface of the groove; in a direction from the first surface to the second surface, an area of ​​a cross section of the protrusion parallel to the second surface gradually increases;

[0008] a first reflective layer, covering at least a side surface of the protrusion;

[0009] a second reflective layer, located on a side of the substrate away from the second surface, the second reflective layer being provided with an opening, wherein an orthographic projection of the opening on the second surface is located within an orthographic projection of the groove on the second surface;

[0010] A conductive layer is located on a side of the second reflective layer facing away from the substrate, and the conductive layer includes a conductive pad.

[0011] In one embodiment, the second reflective layer includes a first reflective portion, the orthographic projection of the first reflective portion on the second surface does not overlap with the orthographic projection of the groove on the second surface, and the surface of the first reflective portion facing the substrate is provided with a plurality of array-arranged light-uniform structures.

[0012] In one embodiment, the light uniforming structure includes a plurality of recessed structures arranged in an array, and the array substrate further includes a plurality of supporting portions arranged in an array and located between the second reflective layer and the substrate, and the second reflective layer is in direct contact with the supporting portions.

[0013] In one embodiment, the array substrate further includes an encapsulation layer, and the encapsulation layer is located between the substrate and the conductive layer;

[0014] The second reflective layer is located between the packaging layer and the substrate, and the support portion is located on the side of the second reflective layer facing the substrate; alternatively, the second reflective layer is located on the side of the packaging layer away from the substrate, and the support portion is located between the second reflective layer and the packaging layer.

[0015] In one embodiment, the light homogenization structure includes a plurality of convex structures arranged in an array and facing the substrate, and a first surface of the substrate is provided with a plurality of concave portions arranged in an array, and the convex structures are located in the concave portions.

[0016] In one embodiment, the edge of the orthographic projection of one of the openings on the second surface is located inside the edge of the orthographic projection of one of the grooves on the second surface; the orthographic projection of the second reflective layer on the second surface does not overlap with the orthographic projection of the protrusion on the second surface.

[0017] In one embodiment, the second reflective layer includes a second reflective portion, the orthographic projection of the second reflective portion on the second surface falls within the orthographic projection of the groove on the second surface; the width of the second reflective portion is a first dimension; the longitudinal cross-section of the groove is an arc, and the length of the radius of the circle in which the longitudinal cross-section of the groove lies is a second dimension; the first dimension is equal to the second dimension and equal to the depth of the groove.

[0018] In one embodiment, the longitudinal cross-section of the protrusion is an arc, the length of the radius of the circle where the longitudinal cross-section of the protrusion lies is a third dimension, and the third dimension is equal to the depth of the groove.

[0019] In one embodiment, an orthographic projection of the second reflective layer on the second surface overlaps with an orthographic projection of the first reflective layer on the second surface.

[0020] In one embodiment, the second reflective layer includes a first sub-reflective layer, a second sub-reflective layer located on a side of the first sub-reflective layer away from the substrate, and a third sub-reflective layer located on a side of the second sub-reflective layer away from the substrate.

[0021] The orthographic projection of the first sub-reflecting layer on the second surface does not overlap with the orthographic projection of the groove on the second surface; the reflectivity of the first sub-reflecting layer is greater than the reflectivity of the second sub-reflecting layer;

[0022] The orthographic projection of the second sub-reflection layer on the second surface overlaps with the orthographic projection of the groove on the second surface. The third sub-reflection layer covers the second sub-reflection layer, and the material of the third sub-reflection layer is the same as that of the first reflective layer.

[0023] In one embodiment, a distance from a surface of the protrusion away from the second surface to the second surface is less than or equal to a distance between the first surface and the second surface.

[0024] In one embodiment, in a direction from the first surface to the second surface, an area of ​​a cross section of the groove parallel to the second surface gradually decreases.

[0025] In one embodiment, the bottom surface of the groove at two sides of the protrusion is flat.

[0026] In one embodiment, the outer contours of the orthographic projection of the geometric center of the protrusion on the second surface and the orthographic projection of the geometric center of the groove on the second surface are circular.

[0027] In one embodiment, an outer contour of an orthographic projection of the protrusion on the second surface is circular, and an outer contour of an orthographic projection of the groove on the second surface is circular.

[0028] In one embodiment, a ratio of a radius of an outer contour of an orthographic projection of the protrusion on the second surface to a radius of an outer contour of an orthographic projection of the groove on the second surface is less than 0.5.

[0029] In one embodiment, the material of the protrusion is the same as that of the substrate.

[0030] In one embodiment, the protrusion and the substrate are an integral structure.

[0031] In one embodiment, the array substrate further includes a color conversion structure located in the groove.

[0032] In one embodiment, an orthographic projection of the second reflective layer on the second surface and an orthographic projection of the groove on the second surface have an overlapping area; the array substrate further includes a transparent organic layer located in the groove, and the orthographic projection of the transparent organic layer on the second surface covers the overlapping area.

[0033] In one embodiment, the array substrate further includes an encapsulation layer, which is located between the substrate and the conductive layer; the material of the second reflective layer includes a conductive material; the encapsulation layer includes an inorganic film layer and an organic film layer, and the orthographic projection of the organic film layer on the second surface covers the orthographic projection of the second reflective layer on the second surface.

[0034] In one embodiment, the refractive index of the substrate is greater than the refractive index of air.

[0035] A second aspect of the embodiments of the present application provides a light-emitting substrate, which includes a plurality of light-emitting elements and the above-mentioned array substrate; the light-emitting elements include a plurality of pins, and each of the pins is bound and connected to one of the conductive pads.

[0036] In one embodiment, the light-emitting substrate further includes a third reflective layer, the third reflective layer covers the light-emitting element, and a light exit hole is provided on a side of the third reflective layer facing the array substrate.

[0037] A third aspect of the embodiments of the present application provides a display device, comprising a display panel and the above-mentioned light-emitting substrate; the display panel is located on a side of the substrate away from the light-emitting element.

[0038] In the array substrate, light-emitting substrate, and display device provided by the embodiments of the present application, a groove is provided on the first surface of the substrate. In the direction from the first surface of the substrate to the second surface, the cross-section of the protrusion located within the groove of the substrate gradually increases. Light incident from one side of the first surface of the substrate to the first reflective layer on the side covering the protrusion is reflected by the first reflective layer. The light reflected by the first reflective layer is incident on the second reflective layer and reflected again. A portion of the light emitted by the second reflective layer is directly emitted through the surface of the substrate facing away from the second reflective layer, while another portion of the light is reflected multiple times within the substrate and then emitted through the surface of the substrate facing away from the second reflective layer. This improves the uniformity of the emitted light. In this manner, the array substrate can be provided with no light-uniformity film layer or with a reduced number of light-uniformity film layers, which helps to reduce the thickness of the array substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG1A is a partial cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;

[0040] FIG1B is a partial cross-sectional view of an array substrate provided by another exemplary embodiment of the present application;

[0041] FIG2 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0042] FIG3 is a partial cross-sectional view of an array substrate provided by another exemplary embodiment of the present application;

[0043] FIG4 is a partial cross-sectional view of an array substrate provided by another exemplary embodiment of the present application;

[0044] FIG5 is a top view of an array substrate provided by an exemplary embodiment of the present application;

[0045] FIG6 is a partial enlarged view of the array substrate shown in FIG2 ;

[0046] FIG7 is a partial enlarged view of the array substrate shown in FIG3 ;

[0047] FIG8 is a flow chart of a method for preparing an array substrate provided by an exemplary embodiment of the present application;

[0048] FIG9A is a partial cross-sectional view of a first intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0049] FIG9B is a partial top view of a first intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0050] FIG10 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0051] FIG11 is a partial cross-sectional view of a third intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0052] FIG12 is a partial cross-sectional view of a fourth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0053] FIG13 is a partial cross-sectional view of a fifth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0054] FIG14 is a partial cross-sectional view of a sixth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0055] FIG15 is a partial cross-sectional view of a first intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0056] FIG16 is a partial enlarged view of the first intermediate structure shown in FIG15;

[0057] FIG17 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0058] FIG18 is a partial cross-sectional view of a third intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0059] FIG19 is a partial cross-sectional view of a seventh intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0060] FIG20 is a partial cross-sectional view of a first intermediate structure of an array substrate provided by yet another exemplary embodiment of the present application;

[0061] FIG21 is a partial enlarged view of the first intermediate structure shown in FIG20;

[0062] FIG22 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by yet another exemplary embodiment of the present application;

[0063] FIG23 is a partial cross-sectional view of a third intermediate structure of an array substrate provided by yet another exemplary embodiment of the present application;

[0064] FIG24 is a partial cross-sectional view of a first intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0065] FIG25 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0066] FIG26 is a partial cross-sectional view of an eighth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0067] FIG27 is a partial cross-sectional view of a ninth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0068] FIG28 is a partial cross-sectional view of a tenth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0069] FIG29 is a partial cross-sectional view of an eleventh intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0070] FIG30 is a partial cross-sectional view of a twelfth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0071] FIG31 is a partial cross-sectional view of a thirteenth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0072] FIG32 is a partial cross-sectional view of a light-emitting substrate provided by an exemplary embodiment of the present application;

[0073] FIG33 is a top view of a light-emitting substrate provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0074] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0075] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0076] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0077] The embodiments of the present application provide an array substrate, a light-emitting substrate, and a display device. The array substrate, light-emitting substrate, and display device in the embodiments of the present application are described in detail below with reference to the accompanying drawings. The features of the following embodiments may complement or be combined with each other unless they conflict.

[0078] The present invention provides an array substrate, as shown in FIG. 1A to FIG. 5 , which includes a substrate 10 , a protruding portion 20 , a first reflective layer 50 , a second reflective layer 30 , and a conductive layer 40 .

[0079] The substrate 10 includes a first surface 101 and a second surface 102 facing each other. The first surface 101 is provided with a groove 11. The protrusion 20 is located within the groove 11 and spaced apart from the side surfaces of the groove 11. The cross-sectional area of ​​the protrusion 20 parallel to the second surface 102 gradually increases in the direction from the first surface 101 to the second surface 102. The first reflective layer 50 covers at least the side surfaces of the protrusion 20. The second reflective layer 30 is located on the side of the substrate 10 away from the second surface 102. The second reflective layer 30 is provided with openings 303. The orthographic projection of one of the openings 303 on the second surface 102 of the substrate 10 is located within the orthographic projection of one of the grooves 11 on the second surface 102 of the substrate 10. The conductive layer 40 is located on the side of the second reflective layer 30 facing away from the substrate 10 and includes a conductive pad 41.

[0080] In an array substrate provided by an embodiment of the present application, a groove is provided on the first surface of the substrate. In a direction from the first surface of the substrate to the second surface, the cross-section of a protrusion located within the groove of the substrate gradually increases. Light incident from one side of the first surface of the substrate to the first reflective layer on the side covering the protrusion is reflected by the first reflective layer. The light reflected by the first reflective layer is then incident on the second reflective layer and reflected again. A portion of the light emitted by the second reflective layer is directly emitted through the surface of the substrate facing away from the second reflective layer, while another portion of the light is reflected multiple times within the substrate and then emitted through the surface of the substrate facing away from the second reflective layer. This improves the uniformity of the emitted light. In this manner, the array substrate can be provided without a light-uniformity film layer or with a reduced number of light-uniformity film layers, which is beneficial for reducing the thickness of the array substrate.

[0081] In the embodiment of the present application, the side surface of the groove 11 refers to the continuous part of the inner surface of the groove 11, and the side surface of the groove 11 is opposite to the protrusion 20; the bottom surface of the groove 11 refers to the continuous part of the inner surface of the groove 11, the bottom surface of the groove 11 is not opposite to the protrusion 20, and the bottom surface of the groove 11 is continuous with the bottom surface of the protrusion 20, and the distance from any point on the bottom surface of the groove 11 to the second surface 102 of the substrate 10 is not greater than the distance from any point on the side surface to the second surface 102 of the substrate 10.

[0082] In one embodiment, the refractive index of the substrate 10 is greater than that of air. With this configuration, when light reflected by the second reflective layer 30 strikes the second surface 102 of the substrate 10, some of the light may undergo total internal reflection and re-enter the second reflective layer 30. This further improves the uniformity of the emitted light. In some embodiments, the material of the substrate 10 may be any one of glass, quartz, and polymethyl methacrylate (PMMA).

[0083] In one embodiment, the distance between the surface of the protrusion 20 away from the second surface 102 and the second surface 102 is less than or equal to the distance between the first surface 101 and the second surface 102. In the embodiment shown in Figures 1A and 1B, the distance between the surface of the protrusion 20 away from the second surface 102 and the second surface 102 is less than the distance between the first surface 101 and the second surface 102. In the embodiment shown in Figures 2 to 4, the distance between the surface of the protrusion 20 away from the second surface 102 and the second surface 102 is equal to the distance between the first surface 101 and the second surface 102.

[0084] In one embodiment, the material of the protrusion 20 is the same as or similar to that of the substrate 10 , which can improve the optical consistency of the structures at corresponding positions.

[0085] Furthermore, as shown in Figure 1A, the protrusion 20 is an integral structure with the substrate 10. In another embodiment, as shown in Figure 1B, the protrusion 20 is not integrally formed with the substrate 10.

[0086] In one embodiment, the longitudinal cross-sectional profile of the protrusion 20 includes a shape that is quasi-circular, quasi-straight, or quasi-folded line. "Arc-like" refers to a shape that is generally circular, but is not limited to a standard arc. That is, "arc" here includes not only basic arc shapes but also shapes similar to an arc. For example, some points in the longitudinal cross-section of the protrusion 20 are not aligned with other points on the same circle. "Straight-like" refers to a shape that is generally straight, but is not limited to a standard straight line. That is, "straight" here includes not only basic straight shapes but also shapes similar to a straight line. For example, some points in the longitudinal cross-section of the protrusion 20 are not aligned with other points on a straight line. "Folded line" refers to a shape that is generally folded line, but is not limited to a standard folded line. That is, "folded line" here includes not only basic folded line shapes but also shapes similar to a folded line. For example, a section in the longitudinal cross-section of the protrusion 20 is an arc. The longitudinal direction refers to the direction perpendicular to the second surface 102 of the substrate.

[0087] In one embodiment, as shown in Figures 1A to 5, the substrate 10 is provided with a plurality of grooves 11 arranged at intervals, and the second reflective layer 30 is provided with a plurality of openings 303. The openings 303 may correspond one-to-one with the grooves 11, and the orthographic projection of each opening 303 on the second surface 102 of the substrate 10 is located within the orthographic projection of the corresponding groove 11 on the second surface 102 of the substrate 10. It should be noted that Figure 5 is a schematic diagram, and the number of grooves 11 in an actual array substrate is much greater than the number of grooves 11 shown in Figure 5.

[0088] In one embodiment, in a direction from the first surface 101 to the second surface 102 , the cross-sectional area of ​​the groove 11 parallel to the second surface 102 gradually decreases.

[0089] In one embodiment, as shown in FIG. 1A to FIG. 4 , the area surrounding the protrusion 20 in the bottom surface of the groove 11 is a plane.

[0090] In one embodiment, a line connecting the geometric center of the protrusion 20 and the geometric center of the groove 11 is perpendicular to the second surface 102 of the substrate 10 .

[0091] Furthermore, the center of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 .

[0092] Furthermore, as shown in Figure 5, the outer contour of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 is circular, and the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is circular; the center of the outer contour of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0093] Furthermore, the protrusion 20 includes a vertex, and the orthographic projection of the vertex of the protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 .

[0094] In one embodiment, a ratio of a radius of an outer contour of an orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 to a radius of an outer contour of an orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is less than 0.5.

[0095] In one embodiment, the conductive layer 40 further includes a plurality of signal lines for providing signals to the inorganic light-emitting diodes and / or driver chips. The plurality of signal lines may include a common voltage line, a drive voltage line, a source power line, a source address line, a clock signal line, a data line, etc. In some embodiments, the thickness of the conductive layer 40 may range from 2 μm to 7 μm.

[0096] In one embodiment, as shown in Figures 1A to 4, the array substrate further includes a color conversion structure 70 located within the groove 11. The color conversion structure 70 may cover the first reflective layer 50. When the light emitted by the light-emitting elements of the light-emitting substrate on which the array substrate is located is non-white light, the color conversion structure 70, under the stimulation of the non-white light, converts the light into white light, thereby improving the utilization of light energy. Positioning the color conversion structure 70 within the groove 11 does not increase the thickness of the array substrate, thereby facilitating a thinner and lighter array substrate. In some embodiments, the material of the color conversion structure 70 may include at least one of a quantum dot material and a fluorescent material.

[0097] In one embodiment, the color conversion structure 70 of the array substrate includes quantum dot materials of different colors. For example, when the light-emitting element emits blue light, the color conversion structure 70 of the array substrate may include red quantum dot material, green quantum dot material, and a transparent material, with each color conversion structure 70 containing quantum dot materials of a single color. When blue light passes through the red quantum dot material, it is converted to red light; when blue light passes through the green quantum dot material, it is converted to green light. Blue light can also pass directly through the transparent material. When blue, red, and green light are mixed and superimposed in a certain proportion, they appear as white light.

[0098] In other embodiments, when the light emitted by the light emitting element is white light, the color conversion structure 70 does not need to be filled in the groove 11. In this case, a transparent organic resin can be filled in the groove 11. The transmittance of the transparent organic resin can be greater than or equal to 95%, and the refractive index of the transparent organic resin can be less than the refractive index of the substrate 10.

[0099] In one embodiment, the distance between the surface of the color-converting structure 70 distal from the second surface 102 and the second surface 102 is less than or equal to the distance between the first surface 101 and the second surface 102. In the embodiments shown in Figures 1A to 4, the distance between the surface of the color-converting structure 70 distal from the second surface 102 and the second surface 102 is equal to the distance between the first surface 101 and the second surface 102. In other embodiments, the distance between the surface of the color-converting structure 70 distal from the second surface 102 and the second surface 102 may be less than the distance between the first surface 101 and the second surface 102.

[0100] In one embodiment, as shown in Figures 1A to 4, the array substrate further includes an encapsulation layer 60, which is located between the substrate 10 and the conductive layer 40. The encapsulation layer 60 covers the color conversion structure 70. This configuration protects the color conversion structure 70, thereby reducing the risk of failure of the color conversion structure 70 due to water and oxygen corrosion.

[0101] In one embodiment, the encapsulation layer 60 includes an organic film layer and an inorganic film layer, and the film layer farthest from the substrate 10 is the inorganic film layer. The encapsulation layer 60 may include multiple inorganic film layers, and the material of the inorganic film layer may include at least one of silicon carbonitride and silicon oxide.

[0102] In one embodiment, the encapsulation layer 60 is a continuous, integral film layer that covers each color conversion structure 70 and the gaps between adjacent color conversion structures 70. In some embodiments, the orthographic projection of the encapsulation layer 60 on the second surface 102 of the substrate is equal to the area of ​​the second surface 102. Alternatively, as shown in FIG5 , the array substrate includes a central region 110 and an edge region 120 located on at least one side of the central region 110. All grooves 11 are located in the central region 110 of the substrate 10. The encapsulation layer 60 covers the central region 110 of the substrate 10 but does not cover the edge region 120 of the substrate 10. In the embodiment shown in FIG5 , the edge region 120 surrounds the central region 110.

[0103] In one embodiment, the material of the second reflective layer 30 includes a conductive material. The orthographic projection of the organic film layer of the encapsulation layer 60 on the second surface 102 of the substrate 10 overlaps the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10. The organic film layer is relatively thick, and the orthographic projection of the organic film layer on the second surface 102 of the substrate 10 overlaps the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10, which can reduce the signal interference of the second reflective layer 30 on the conductive layer 40. In some embodiments, the thickness of the organic film layer ranges from 2 μm to 10 μm, the thickness of the inorganic film layer located on the side of the organic film layer away from the substrate ranges from 1000 angstroms to 5000 angstroms, and the total thickness of the inorganic film layers in the encapsulation layer 60 ranges from 0.5 μm to 1 μm. In some embodiments, the thickness of the organic film layer may be, for example, 2 μm, 4 μm, 6 μm, 8 μm, 10 μm, etc.; the thickness range of the inorganic film layer located on the side of the organic film layer away from the substrate may be, for example, 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, etc.; the total thickness of each inorganic film layer in the encapsulation layer 60 may be, for example, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, etc.

[0104] In one embodiment, the reflectivity of the first reflective layer 50 is greater than or equal to 85%. In some embodiments, the material of the first reflective layer 50 may include a metal, such as at least one of aluminum, silver, copper, and platinum. Alternatively, the material of the first reflective layer 50 may include white ink and / or silicone white glue.

[0105] In one embodiment, as shown in Figures 1A to 5, the edge of the orthographic projection of the opening 303 of the second reflective layer 30 on the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of the corresponding groove 11 on the second surface 102 of the substrate 10; the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10. With this arrangement, part of the light reflected by the first reflective layer 50 is incident on the portion of the second reflective layer 30 opposite the groove 11, and ultimately exits from the surface of the substrate 10 away from the second reflective layer 30. This helps improve light efficiency compared to a solution in which the second reflective layer 30 does not include a portion opposite the groove 11. In addition, when forming the groove 11, the second reflective layer 30 can also serve as a mask, which can save cost and time in the process step of forming the groove 11, thereby reducing the preparation cost of the array substrate. Because the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10, the second reflective layer 30 will not hinder the propagation of light emitted by the light-emitting element to the first reflective layer 50.

[0106] In one embodiment, as shown in Figures 1A to 4, the second reflective layer 30 includes a first reflective portion 301 and a second reflective portion 302, the orthographic projection of the first reflective portion 301 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10, and the orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 falls within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0107] In one embodiment, as shown in Figures 1A to 4, the first reflecting portion 301 includes a first sub-reflecting layer 31, a second sub-reflecting layer 32 located on a side of the first sub-reflecting layer 31 away from the substrate 10, and a third sub-reflecting layer 33 located on a side of the second sub-reflecting layer 32 away from the substrate; the second reflecting portion 302 includes a second sub-reflecting layer 32 and a third sub-reflecting layer 33 located on a side of the second sub-reflecting layer 32 away from the substrate; the second sub-reflecting layer 32 of the first reflecting portion 301 is continuous with the second sub-reflecting layer 32 of the second reflecting portion 302, and the third sub-reflecting layer 33 of the first reflecting portion 301 is continuous with the third sub-reflecting layer 33 of the second reflecting portion 302.

[0108] In one embodiment, the orthographic projection of the first sub-reflective layer 31 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10; the reflectivity of the first sub-reflective layer 31 is greater than the reflectivity of the second sub-reflective layer 32. Due to the higher reflectivity of the first sub-reflective layer 31, a larger amount of light reflected by the first reflective layer 50 is reflected by the first sub-reflective layer 31 after entering the first sub-reflective layer 31, thereby improving the light emission efficiency and reducing light loss.

[0109] In some embodiments, the reflectivity of the first sub-reflective layer 31 is greater than or equal to 85%. For example, the material of the first sub-reflective layer 31 may include a metal, such as at least one of aluminum, silver, copper, and platinum. For example, the material of the first sub-reflective layer 31 may include white ink and / or silicone-based white glue.

[0110] In one embodiment, the orthographic projection of the second sub-reflective layer 32 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. With this configuration, the second sub-reflective layer 32 can serve as a mask when forming the groove. In some embodiments, the material of the second sub-reflective layer 32 may include a metal, such as molybdenum. This provides the second sub-reflective layer 32 with good corrosion resistance. During etching of the substrate using an etching solution, the portion of the second sub-reflective layer 32 that extends beyond the first sub-reflective layer 31 is less likely to collapse. Furthermore, the second sub-reflective layer 32 covers the edge of the first sub-reflective layer 31, protecting the first sub-reflective layer 31 during etching of the substrate using the etching solution.

[0111] In one embodiment, the third sub-reflective layer 33 covers the second sub-reflective layer 32, and the material of the third sub-reflective layer 33 is the same as that of the first reflective layer 50. The orthographic projection of the third sub-reflective layer 33 on the second surface 102 of the substrate 10 may overlap with the orthographic projection of the second sub-reflective layer 32 on the second surface 102 of the substrate 10. Because the third sub-reflective layer 33 covers the second sub-reflective layer 32, the thickness and strength of the portion of the second reflective layer 30 facing the groove 11 are increased, which helps prevent the portion of the second reflective layer 30 facing the groove 11 from collapsing before the color conversion structure or transparent organic resin is formed in the groove 11. Because the material of the third sub-reflective layer 33 is the same as that of the first reflective layer 50, the third sub-reflective layer 33 and the first reflective layer 50 can be formed simultaneously, which helps simplify the manufacturing process.

[0112] In one embodiment, the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the first reflective layer 50 on the second surface 102 of the substrate 10. In the embodiments shown in Figures 1A to 4, the edge of the orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 overlaps with the outer edge of the orthographic projection of the first reflective layer 50 on the second surface 102 of the substrate 10. In this configuration, the first reflective layer 50 does not cover the side surfaces of the groove 11, which can reduce the amount of light reflected by the first reflective layer 50 that exits through the opening of the groove 11 and increase the amount of light that exits from the second surface 102 of the substrate 10. In other embodiments, the orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 partially overlaps with the orthographic projection of the first reflective layer 50 on the second surface 102 of the substrate 10, meaning that the first reflective layer 50 covers a portion of the side surfaces of the groove 11.

[0113] In one embodiment, as shown in Figures 2 and 3 , the surface of the first reflective portion 301 facing the substrate 10 is provided with a plurality of spaced-apart light-uniform structures 311. The light-uniform structures 311 can disperse light incident on the second reflective layer 30, scattering it in various directions. Specifically, light reflected by the first reflective layer 50 is dispersed by the light-uniform structures 311 after entering the second reflective layer 30, changing the propagation direction of the light. After being reflected by the second reflective layer 30, the light is emitted through the surface of the substrate away from the second reflective layer 30, thereby improving the brightness uniformity of the light-emitting substrate.

[0114] In one embodiment, the light homogenizing structures 311 are evenly dispersed throughout the surface of the first reflective portion facing the substrate 10, and the distance between the edge of the first sub-reflective layer 31 near the groove 11 and the groove 11 is less than or equal to 5 μm. This configuration prevents a large distance between the edge of the first sub-reflective layer 31 near the groove 11 and the groove 11. As a result, light reflected by the first reflective layer, when incident on the area between the edge of the first sub-reflective layer 31 near the groove 11 and the groove 11, does not contact the light homogenizing structures, resulting in insufficient scattering of this portion of light.

[0115] In one embodiment, as shown in Figures 2 and 6, the light homogenizing structure 311 includes a plurality of recessed structures 312 arranged in an array. The array substrate further includes a plurality of support portions 13 located between the second reflective layer 30 and the substrate 10. The plurality of support portions 13 are arranged in an array. The second reflective layer 30 is in direct contact with the support portions 13. The provision of the support portions 13 facilitates the formation of the recessed structures 312.

[0116] In one embodiment, the material of the support portion 13 can be a transparent resin material. The maximum dimension of the support portion 13 in a cross section parallel to the surface of the substrate 10 ranges from 5 μm to 50 μm. This configuration can achieve a better light uniformity effect for the formed light uniforming structure 311, and the support portion 13 is easy to manufacture. In some embodiments, the maximum dimension of the support portion 13 in a cross section parallel to the surface of the substrate 10 is 5 μm, 15 μm, 25 μm, 35 μm, 45 μm, 50 μm, etc.

[0117] In one embodiment, as shown in FIG. 2 and FIG. 6 , the recessed structure 312 is formed on the surface of the first sub-reflection layer 31 facing the substrate 10 , and recessed structures are also formed in the second sub-reflection layer 32 and the third sub-reflection layer 33 in areas opposite to the recessed structure 312 .

[0118] In one embodiment, the support portion 13 may be roughly in the shape of at least one of a cone, a pyramid, and a spherical segment. "Roughly in the shape of a cone and a pyramid" means that the support portion 13 is generally in the shape of a cone and a pyramid, but is not limited to a standard cone and pyramid. That is, the "cone and pyramid" here include not only basic cone and pyramid shapes, but also shapes similar to cones and pyramids. For example, the top angles of cones and pyramids are curved surfaces. "Roughly in the shape of a spherical segment" means that the support portion 13 is generally in the shape of a spherical segment, but is not limited to a standard spherical segment. That is, the "spherical segment" here includes not only basic spherical segment shapes, but also shapes similar to spherical segments. For example, the upper half of the spherical segment is a standard spherical segment, and the lower half is a cylinder.

[0119] In one embodiment, when the second reflective layer 30 is located between the encapsulation layer 60 and the substrate 10, the support portion 13 is located on the side of the second reflective layer 30 facing the substrate 10. The support portion 13 may be in direct contact with the substrate 10. Alternatively, the second reflective layer 30 is located on the side of the encapsulation layer 60 away from the substrate 10, and the support portion 13 is located between the encapsulation layer 60 and the second reflective layer 30.

[0120] In one embodiment, as shown in Figures 3 and 7, the light homogenization structure 311 includes a plurality of protrusions 313 arranged in an array and facing the substrate 10. The surface of the substrate 10 facing the conductive layer 40 is provided with a plurality of recesses 12 arranged in an array, and the protrusions 313 are located within the recesses 12. The protrusions 313 and the recesses 12 may correspond one to one, with each protrusion 313 located within a corresponding recess 12. Providing the recesses 12 on the surface of the substrate 10 facilitates the formation of the protrusions 313.

[0121] In one embodiment, as shown in FIG3 and FIG7 , the protruding structure 313 is formed on the side of the first sub-reflecting layer 31 facing the substrate 10 , and protruding structures are also formed in the areas of the second sub-reflecting layer 32 and the third sub-reflecting layer 33 opposite to the protruding structure 313 .

[0122] In one embodiment, the protrusion structure may be substantially in the shape of at least one of a cone, a pyramid, and a spherical segment.

[0123] In one embodiment, as shown in FIG4 , the array substrate further includes a transparent organic layer 80 positioned within the groove 11. The orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10, and the orthographic projection of the transparent organic layer 80 on the second surface 102 of the substrate 10 covers the overlapping region. With this configuration, the transparent organic layer 80 supports the second reflective portion 302 of the second reflective layer 30, preventing the second reflective layer 30 from collapsing in the region opposite the groove 11. Furthermore, the transparent organic layer 80 is formed before the first reflective layer 50. This prevents the first reflective layer 50 from extending to the sides of the groove 11, thereby reducing the amount of light reflected by the first reflective layer 50 that exits through the opening of the groove 11 and increasing the amount of light that exits from the second surface 102 of the substrate 10.

[0124] In one embodiment, as shown in FIG4 , the orthographic projection of the transparent organic layer 80 on the second surface 102 of the substrate 10 coincides with the overlapping region. Thus, the transparent organic layer 80 provides better support for the second reflective portion 302. The transmittance of the transparent organic layer can be greater than or equal to 95%, and the refractive index of the transparent organic layer can be less than that of the substrate 10.

[0125] In one embodiment, as shown in FIG. 4 , the color conversion structure 70 is located between the transparent organic layer 80 and the first reflective layer 50 .

[0126] In one embodiment, as shown in Figure 2, the width of the second reflecting portion 302 is a first dimension d1; the longitudinal cross-section of the groove 11 is an arc, and the length of the radius of the circle in which the longitudinal cross-section of the groove 11 lies is a second dimension d2; the first dimension d1 is equal to the second dimension d2, and is equal to the depth h of the groove 11.

[0127] Furthermore, as shown in FIG2 , the longitudinal section of the protrusion 20 is an arc, and the length of the radius of the circle where the longitudinal section of the protrusion 20 is located is a third dimension d3 , and the third dimension d3 is equal to the depth h of the groove 11 .

[0128] The present embodiment further provides a method for preparing an array substrate. As shown in FIG8 , the method includes the following steps 110 and 120 .

[0129] In step 110, a groove is formed on the surface of the substrate, a protrusion is formed in the groove, and a first reflective layer and a second reflective layer are formed. The first reflective layer at least covers the side surface of the protrusion, and the second reflective layer covers the area of ​​the substrate surrounding the groove.

[0130] In one embodiment, step 110 includes the following process:

[0131] First, a mask is placed on a base substrate.

[0132] This step yields the first intermediate structure shown in Figures 9A and 9B . As shown in Figures 9A and 9B , a mask plate 81 is disposed on the first surface of a base substrate 82 . The mask plate 81 includes a first mask portion 811 and a second mask portion 812 . The first mask portion 811 is provided with a through hole, and the second mask portion 812 is located within the through hole of the first mask portion 811 , with a gap between the second mask portion 812 and the first mask portion 811 . The surface of the second mask portion 812 can be circular, and the through hole of the first mask portion 811 can be circular. The center of the surface of the second mask portion 812 can coincide with the center of the through hole of the first mask portion 811 . The diameter of the surface of the second mask portion 812 is D1, and the diameter of the through hole of the first mask portion 811 can be D2. The distance between the edge of the through hole of the first mask portion 811 and the edge of the second mask portion 812 is a, and D2 = D1 + 2a.

[0133] In some embodiments, D1 is ≥ 5 μm. The value of D1 is related to the height of the subsequently formed protrusions; the larger D1 is, the taller the protrusions will be. Setting D1 ≥ 5 μm prevents the protrusions from being too small, which in turn prevents the height of the first reflective layer covering the sides of the protrusions from being too small. This results in a smaller amount of light reflected by the first reflective layer from the light-emitting element, preventing effective improvement in light uniformity.

[0134] In one embodiment, a≥2 μm. This configuration can prevent the distance between the edge of the through hole of the first mask portion 811 and the edge of the second mask portion 812 from being too small, thereby affecting the contact between the etching solution and the substrate.

[0135] In one embodiment, as shown in Figure 9, the first mask portion 811 includes a first sub-reflection layer 31 and a second sub-reflection layer 32 located on the side of the first sub-reflection layer 31 away from the base substrate 82, the distance between the inner edge of the second sub-reflection layer 32 and the second mask portion 812 is smaller than the distance between the inner edge of the first sub-reflection layer 31 and the second mask portion 812, and the second sub-reflection layer 32 covers the edge of the first sub-reflection layer toward the second mask portion 812.

[0136] Subsequently, the substrate is etched using a wet etching process to form a groove, thereby obtaining a substrate including the groove and a protrusion located in the groove.

[0137] In this step, the etching liquid contacts the substrate 82 through the gap between the first mask portion 811 and the second mask portion 812, and etches the substrate 82. Due to the presence of the second mask portion 812, the area of ​​the substrate 82 covered by it is not completely etched away, and the remaining area is the protrusion. This step results in the second intermediate structure shown in Figure 10. As shown in Figure 10, the substrate 10 and the protrusion 20 are both part of the substrate 82, that is, the substrate 10 and the protrusion 20 are integrally formed; a gap exists between the protrusion 20 and the side of the groove 11; the orthographic projection of the second sub-reflective layer 32 of the second mask portion 812 on the surface of the substrate 10 away from the second sub-reflective layer 32 overlaps with the orthographic projection of the groove 11 on the surface of the substrate 10 away from the second sub-reflective layer 32, that is, a portion of the second sub-reflective layer 32 faces the groove 11.

[0138] In this step, the etching solution etches the second mask portion 812 while etching the base substrate 82 . After the etching of the base substrate 82 is completed, the second mask portion 812 may be completely etched away.

[0139] Due to the isotropic nature of the wet etching process, the area on the bottom surface of the groove 11 corresponding to the gap between the first mask portion 811 and the second mask portion 812 is roughly planar, that is, the area on the bottom surface of the groove 11 surrounding the protrusion 20 is roughly planar, and the width of the planar area on the bottom surface of the groove 11 is roughly equal to a; the longitudinal cross-section of the groove 11 is roughly an arc, and the radius of the circle in which the arc lies is roughly equal to the maximum depth of the groove 11; the longitudinal cross-section of the protrusion 20 is roughly an arc, and the radius of the circle in which the arc lies is roughly equal to the maximum depth of the groove 11; the radius of the circle in which the longitudinal cross-section of the groove 11 lies is roughly the same as the width of the portion of the second sub-reflective layer 32 opposite the groove 11.

[0140] In one embodiment, the depth of the groove 11 is greater than or equal to D1 / 2. When the depth of the groove 11 is equal to D1 / 2, the top surface of the protrusion 20 is substantially flush with the surface of the substrate 10 facing the first sub-reflection layer 31.

[0141] Subsequently, a first reflective layer is formed.

[0142] This step can produce a third intermediate structure as shown in FIG11 . As shown in FIG11 , a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed simultaneously with the formation of the first reflective layer 50, resulting in a second reflective layer 30 including the first sub-reflective layer 31, the second sub-reflective layer 32, and the third sub-reflective layer 33.

[0143] In one embodiment, after step 110 , the method for preparing the array substrate further includes the following step: forming a color conversion structure in the groove.

[0144] This step can produce a fourth intermediate structure as shown in Figure 12. As shown in Figure 12, the surface of the color conversion structure 70 facing the second sub-reflective layer 32 can be flush with the surface of the substrate 10 facing the second sub-reflective layer 32. In other embodiments, the surface of the color conversion structure 70 facing the second sub-reflective layer 32 can be lower than the surface of the substrate 10 facing the second sub-reflective layer 32.

[0145] In another embodiment, if the light emitted by the light emitting element is white, after step 110 , the method for preparing the array substrate further includes the following process: forming a transparent organic layer in the groove.

[0146] In one embodiment, after the step of forming the color conversion structure in the groove, the method for preparing the array substrate further comprises the following step: forming an encapsulation layer covering the color conversion structure.

[0147] Through this step, a fifth intermediate structure as shown in FIG13 can be obtained. As shown in FIG13 , the encapsulation layer 60 covers the color conversion structure 70 and the second reflective layer 30 .

[0148] In step 120 , a conductive layer is formed on a side of the second reflective layer away from the substrate, wherein the conductive layer includes a conductive pad.

[0149] Through this step, the array substrate shown in FIG. 1A can be obtained.

[0150] In one embodiment, before step 110 , the method for preparing the array substrate further includes the following step: forming a plurality of supporting portions on the surface of the base substrate.

[0151] This step results in a sixth intermediate structure as shown in Figure 14 . As shown in Figure 14 , multiple support portions 13 are formed on the surface of the base substrate 82. The continuous area on the surface of the base substrate 82 without support portions 13 can be substantially circular. In some embodiments, a resin material can be first coated on the surface of the base substrate 82, and then the resin material can be patterned to form the multiple support portions 13.

[0152] In this embodiment, after forming the mask on the substrate, a first intermediate structure as shown in Figures 15 and 16 can be obtained. As shown in Figures 15 and 16, the first sub-reflective layer 31 has a light homogenizing structure 311 formed in the area of ​​the surface facing the substrate 10 that contacts the support portion 13. The light homogenizing structure 311 is a recessed structure 312. The second sub-reflective layer also has a recessed structure in the area corresponding to the recessed structure 312.

[0153] In this embodiment, after the step of etching the substrate using a wet etching process to form grooves, a second intermediate structure as shown in FIG17 is obtained.

[0154] In this embodiment, after the step of forming the first reflective layer, a third intermediate structure as shown in FIG18 can be obtained. As shown in FIG18 , a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed simultaneously with the formation of the first reflective layer 50. A recessed structure is formed in the area of ​​the third sub-reflective layer 33 corresponding to the recessed structure 312 of the first sub-reflective layer 31.

[0155] In this embodiment, the array substrate finally obtained is shown in FIG2 .

[0156] In one embodiment, before step 110 , the method for preparing the array substrate further includes the following step: forming a plurality of recessed portions on the surface of the base substrate.

[0157] This step yields the seventh intermediate structure shown in Figure 19 . As shown in Figure 19 , the surface of the base substrate 82 is formed with a plurality of spaced-apart recesses 12. The continuous areas on the surface of the base substrate 82 without recesses 12 can be roughly circular. In this step, a mask can be first formed on the surface of the base substrate 82, and then the base substrate can be etched with an etchant to form the recesses. When the base substrate is made of glass, the etchant can include hydrofluoric acid, and the mask can be made of molybdenum. After the recesses are formed, the mask is removed.

[0158] In this embodiment, after the step of forming a mask on the substrate, a first intermediate structure as shown in Figures 20 and 21 can be obtained. As shown in Figures 20 and 21, a plurality of light-homogenizing structures 311 are formed on the surface of the first sub-reflective layer 31 facing the substrate 10. The light-homogenizing structures 311 are protruding structures 313 located within the recessed portion 12. The second sub-reflective layer 32 also forms protruding structures in the areas corresponding to the protruding structures 313.

[0159] In this embodiment, after the step of etching the substrate using a wet etching process to form grooves, a second intermediate structure as shown in FIG. 22 is obtained.

[0160] In this embodiment, after the step of forming the first reflective layer, a third intermediate structure as shown in FIG23 can be obtained. As shown in FIG23, a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed simultaneously with the formation of the first reflective layer 50. A protrusion structure is formed in the area of ​​the third sub-reflective layer 33 corresponding to the protrusion structure 313 of the first sub-reflective layer 31.

[0161] In this embodiment, the array substrate finally obtained is shown in FIG3 .

[0162] In one embodiment, step 110 of forming a groove on the surface of the substrate, forming a protrusion in the groove, and forming a first reflective layer and a second reflective layer, wherein the first reflective layer at least covers the side surfaces of the protrusion and the second reflective layer covers the area of ​​the substrate surrounding the groove, includes the following process:

[0163] First, a mask is formed on the array substrate.

[0164] This step can produce the first intermediate structure shown in FIG24 . The difference between the first intermediate structure shown in FIG24 and the first intermediate structure shown in FIG9 is that the first mask portion 811 and the second mask portion 812 each include only one film layer, and the material of the first mask portion 811 and the second mask portion 812 can be molybdenum.

[0165] Subsequently, the substrate is etched using a wet etching process to form a groove, thereby obtaining a substrate including the groove and a protrusion located in the groove.

[0166] This step can yield the second intermediate structure shown in Figure 25. The difference between the second intermediate structure shown in Figure 25 and the second intermediate structure shown in Figure 10 is that the first mask portion 811 includes only one film layer.

[0167] Subsequently, the first mask portion 811 is removed.

[0168] Through this step, an eighth intermediate structure as shown in Figure 26 can be obtained. In this step, the first mask portion 811 can be removed by using a wet etching process.

[0169] Subsequently, a transparent organic layer is filled in the groove.

[0170] This step can produce the ninth intermediate structure shown in Figure 27. As shown in Figure 27, the transparent organic layer 80 completely fills the groove 11, and the surface of the transparent organic layer 80 is flush with the surface of the substrate 10 on the same side. The material of the transparent organic layer 80 can be an organic resin.

[0171] Subsequently, a mask layer is formed on a surface of the substrate on the same side as the opening of the groove.

[0172] This step yields the tenth intermediate structure shown in Figure 28 . As shown in Figure 28 , mask layer 83 is provided with a through hole. The through hole can be circular, with the center of the circle containing the opening of recess 11 coinciding with the center of the through hole. The diameter of the through hole in mask layer 83 is D3, which can be approximately equal to D2.

[0173] In one embodiment, as shown in FIG28 , the mask layer 83 includes a first sub-reflective layer 31 and a second sub-reflective layer 32 located on a side of the first sub-reflective layer 31 away from the substrate 10. The distance between the edge of the second sub-reflective layer 32 and the groove 11 is smaller than the distance between the inner edge of the first sub-reflective layer 31 and the groove 11. The second sub-reflective layer 32 covers a portion of the transparent organic layer 80, and a gap exists between the first sub-reflective layer 31 and the outer edge of the transparent organic layer 80.

[0174] Subsequently, the transparent organic layer is etched using a wet etching process to remove the area of ​​the transparent organic layer not covered by the mask layer.

[0175] In this step, when the transparent organic layer 80 is made of a transparent organic resin, a dry etching process can be used to etch the transparent organic layer 80. This step results in the eleventh intermediate structure shown in FIG29 . As shown in FIG29 , the area of ​​the transparent organic layer 80 covered by the second sub-reflective layer 32 is retained. The retained transparent organic layer 80 supports the second sub-reflective layer 32 and prevents it from collapsing.

[0176] Subsequently, a first reflective layer is formed.

[0177] This step can produce the twelfth intermediate structure shown in FIG30 . As shown in FIG30 , a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed simultaneously with the formation of the first reflective layer 50, resulting in the second reflective layer 30 including the first sub-reflective layer 31, the second sub-reflective layer 32, and the third sub-reflective layer 33. In this step, since the transparent organic layer 80 covering the side surfaces of the groove 11 is formed within the groove 11, the formed first reflective layer 50 can be prevented from covering the side surfaces of the groove 11.

[0178] Subsequently, a color conversion structure is formed within the groove.

[0179] Through this step, a thirteenth intermediate structure as shown in FIG31 can be obtained. As shown in FIG31 , the color conversion structure 70 is located between the transparent organic layer 80 and the protrusion 20 .

[0180] Subsequently, an encapsulation layer covering color conversion structure 70 is formed.

[0181] In this embodiment, the array substrate finally obtained is shown in FIG4 .

[0182] The embodiment of the method for preparing the array substrate provided in the embodiment of the present application and the embodiment of the array substrate belong to the same inventive concept, and the description of relevant details and beneficial effects can be referred to each other, and will not be repeated here.

[0183] The present application also provides a light-emitting substrate. The light-emitting substrate includes a plurality of light-emitting elements and the array substrate described in any of the above embodiments. The array substrate in the light-emitting substrate shown in FIG32 is the array substrate shown in FIG1A , but is not limited thereto. As shown in FIG32 , the light-emitting element 91 includes a plurality of pins 911 , each of which is bonded to a conductive pad 41 .

[0184] In one embodiment, as shown in FIG32 , the light-emitting element 91 includes a light emitting area 912 . The orthographic projection of one light emitting area 912 on the second surface 102 of the substrate 10 falls within the orthographic projection of one color conversion structure 70 on the second surface 102 of the substrate 10. It should be noted that the light emitting area 912 refers to the area from which the light emitted by the light-emitting element 91 can be emitted during operation. The pins 911 of the light-emitting element 91 are typically made of a metal or alloy material with good conductivity. Light emitted by the light-emitting element 91 can be emitted from all areas except the area where the pins 911 are located. In FIG32 , the light emitting area 912 is located between the pins 911. In practice, the light emitting area 912 is not necessarily a regular area.

[0185] In one embodiment, the edge of the orthographic projection of the light-emitting area of ​​each light-emitting element 91 on the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of an opening 303 in the second reflective layer 30 on the second surface 102 of the substrate 10. This arrangement prevents light emitted by the light-emitting element 91 from being reflected by the surface of the second reflective layer 30 away from the substrate 10, thereby helping to reduce light loss.

[0186] In one embodiment, as shown in FIG32 , the light-emitting substrate further includes a third reflective layer 93, which covers the light-emitting element 91 and has a light exit hole 931 on the side of the third reflective layer 93 facing the array substrate. The orthographic projection of the light-emitting area 912 of the light-emitting element 91 on the second surface 102 of the substrate 10 falls within the orthographic projection of a light exit hole 931 on the second surface 102 of the substrate 10. The third reflective layer 93 can reflect light emitted from the non-light exit area of ​​the light-emitting element 91, thereby improving the utilization efficiency of the light. The third reflective layer 93 can cover the surface of the light-emitting element 91 away from the array substrate, the side of the light-emitting element 91, and a portion of the surface of the light-emitting element 91 facing the array substrate.

[0187] In one embodiment, the material of the third reflective layer 93 includes at least one of white ink and silicone white glue. For example, the material of the third reflective layer 93 can be white ink or silicone white glue.

[0188] In one embodiment, as shown in FIG32 , the light-emitting substrate further includes an insulating protective layer 92. The insulating protective layer 92 covers the pins 911 of the light-emitting element 91 and the conductive pad 41 to protect the pins 911 and the conductive pad 41 of the light-emitting element 91. The insulating protective layer 92 can be made of a transparent resin material, and the light transmittance of the transparent resin material can be greater than 95%.

[0189] In one embodiment, the light emitting element 91 may include a Micro LED and / or a Mini LED. The size (e.g., length) of the Micro LED is less than 50 microns, for example, 10 to 50 microns. The size (e.g., length) of the Mini LED is 50 to 150 microns, for example, 80 to 120 microns.

[0190] In one embodiment, as shown in FIG33 , the light-emitting substrate includes a light-emitting region 130 and a peripheral region 140 . The boundary of the light-emitting region 130 may coincide with the boundary of the central region of the substrate, and the boundary of the peripheral region 140 may coincide with the boundary of the edge region of the substrate. The light-emitting element 91 is disposed in the light-emitting region 130 .

[0191] In one embodiment, the conductive layer 40 includes a plurality of conductive pads 41, which are divided into a plurality of conductive pad groups. Each light-emitting element is bonded to a conductive pad 41 in a conductive pad group. The number of pins 911 included in the light-emitting element 91 is the same as the number of conductive pads 41 included in its corresponding conductive pad group, and each pin 911 is bonded to a conductive pad 41.

[0192] In one embodiment, as shown in FIG33 , the light-emitting substrate further includes a non-luminescent element 94, such as a driver chip or a sensor chip. The orthographic projection of the non-luminescent element 94 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The non-luminescent element 94 includes pins, and each pin of the non-luminescent element 94 is bound and connected to a conductive pad in a conductive pad group. The number of pins included in the non-luminescent element 94 is the same as the number of conductive pads included in its corresponding conductive pad group. The non-luminescent element 94 may be located in the peripheral area 140.

[0193] It should be noted that FIG33 is a schematic diagram, and in practice the number of light-emitting elements 91 included in the light-emitting substrate is much greater than the number of light-emitting elements 91 in FIG33 .

[0194] An embodiment of the present application further provides a display device, comprising a display panel and the above-mentioned light-emitting substrate; the display panel is located on a side of the substrate away from the light-emitting element.

[0195] The display panel may be a liquid crystal display device, and the array substrate serves as a backlight module.

[0196] This application does not impose any specific restrictions on the applicability of display devices. It can be any product or component with flexible display function, such as televisions, laptops, tablets, wearable display devices, mobile phones, car displays, navigation, e-books, digital photo frames, advertising light boxes, etc.

[0197] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0198] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the contents disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0199] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An array substrate, characterized in that: The array substrate comprises: The substrate comprises a first surface and a second surface opposite to each other; the first surface is provided with a groove; a protrusion, located in the groove and spaced apart from the side surface of the groove; in a direction from the first surface to the second surface, an area of ​​a cross section of the protrusion parallel to the second surface gradually increases; A first reflective layer at least covers the side surfaces of the protruding portion; A second reflective layer is located on a side of the substrate away from the second surface, the second reflective layer is provided with an opening, and an orthographic projection of one of the openings on the second surface is located within an orthographic projection of one of the grooves on the second surface; The conductive layer is located on a side of the second reflective layer away from the substrate, and the conductive layer includes a conductive pad.

2. The array substrate according to claim 1, characterized in that: The second reflective layer includes a first reflective portion, an orthographic projection of the first reflective portion on the second surface does not overlap with an orthographic projection of the groove on the second surface, and a surface of the first reflective portion facing the substrate is provided with a plurality of array-arranged light homogenizing structures.

3. The array substrate according to claim 2, characterized in that: The light homogenizing structure includes a plurality of recessed structures arranged in an array, and the array substrate further includes a plurality of supporting portions arranged in an array and located between the second reflective layer and the substrate, and the second reflective layer is in direct contact with the supporting portions.

4. The array substrate according to claim 3, characterized in that: The array substrate further comprises a packaging layer, wherein the packaging layer is located between the substrate and the conductive layer; The second reflective layer is located between the packaging layer and the substrate, and the support portion is located on a side of the second reflective layer facing the substrate; or, the second reflective layer is located on a side of the packaging layer away from the substrate, and the support portion is located between the second reflective layer and the packaging layer.

5. The array substrate according to claim 2, characterized in that: The light homogenizing structure includes a plurality of convex structures arranged in an array and facing the substrate, a plurality of concave portions arranged in an array are provided on the first surface of the substrate, and the convex structures are located in the concave portions.

6. The array substrate according to claim 1, characterized in that: The edge of the orthographic projection of one of the openings on the second surface is located inside the edge of the orthographic projection of one of the grooves on the second surface; the orthographic projection of the second reflective layer on the second surface does not overlap with the orthographic projection of the protrusion on the second surface.

7. The array substrate according to claim 6, characterized in that: The second reflective layer includes a second reflective portion, and the orthographic projection of the second reflective portion on the second surface falls within the orthographic projection of the groove on the second surface; the width of the second reflective portion is a first dimension; the longitudinal cross-section of the groove is an arc, and the length of the radius of the circle where the longitudinal cross-section of the groove lies is a second dimension; the first dimension is equal to the second dimension, and is equal to the depth of the groove.

8. The array substrate according to claim 7, characterized in that: The longitudinal cross section of the protrusion is an arc, the length of the radius of the circle where the longitudinal cross section of the protrusion lies is a third dimension, and the third dimension is equal to the depth of the groove.

9. The array substrate according to claim 1, characterized in that: An orthographic projection of the second reflective layer on the second surface overlaps with an orthographic projection of the first reflective layer on the second surface.

10. The array substrate according to claim 1, characterized in that: The second reflection layer includes a first sub-reflection layer, a second sub-reflection layer located on a side of the first sub-reflection layer away from the substrate, and a third sub-reflection layer located on a side of the second sub-reflection layer away from the substrate; The orthographic projection of the first sub-reflection layer on the second surface does not overlap with the orthographic projection of the groove on the second surface; the reflectivity of the first sub-reflection layer is greater than the reflectivity of the second sub-reflection layer; The orthographic projection of the second sub-reflection layer on the second surface overlaps with the orthographic projection of the groove on the second surface; the third sub-reflection layer covers the second sub-reflection layer, and a material of the third sub-reflection layer is the same as that of the first reflective layer.

11. The array substrate according to claim 1, characterized in that: A distance from a surface of the protrusion away from the second surface to the second surface is less than or equal to a distance between the first surface and the second surface.

12. The array substrate according to claim 1, characterized in that: In a direction from the first surface to the second surface, an area of ​​a cross section of the groove parallel to the second surface gradually decreases.

13. The array substrate according to claim 1, characterized in that: The bottom surface of the groove is located at two sides of the protrusion and is a plane.

14. The array substrate according to claim 1, characterized in that: The orthographic projection of the geometric center of the protrusion on the second surface coincides with the orthographic projection of the geometric center of the groove on the second surface.

15. The array substrate according to claim 14, characterized in that: The outer contour of the orthographic projection of the protrusion on the second surface is circular, and the outer contour of the orthographic projection of the groove on the second surface is circular.

16. The array substrate according to claim 1, characterized in that: A ratio of a radius of an outer contour of an orthographic projection of the protrusion on the second surface to a radius of an outer contour of an orthographic projection of the groove on the second surface is less than 0.

5.

17. The array substrate according to claim 1, characterized in that: The material of the protrusion is the same as that of the substrate.

18. The array substrate according to claim 17, characterized in that: The protrusion and the substrate are an integral structure.

19. The array substrate according to claim 1, characterized in that: The array substrate further includes a color conversion structure located in the groove.

20. The array substrate according to claim 1, characterized in that: There is an overlapping area between the orthographic projection of the second reflective layer on the second surface and the orthographic projection of the groove on the second surface; the array substrate also includes a transparent organic layer located in the groove, and the orthographic projection of the transparent organic layer on the second surface covers the overlapping area.

21. The array substrate according to claim 1, characterized in that: The array substrate also includes a packaging layer, which is located between the substrate and the conductive layer; the material of the second reflective layer includes a conductive material; the packaging layer includes an inorganic film layer and an organic film layer, and the orthographic projection of the organic film layer on the second surface covers the orthographic projection of the second reflective layer on the second surface.

22. The array substrate according to claim 1, characterized in that: The refractive index of the substrate is greater than the refractive index of air.

23. A light-emitting substrate, characterized in that: The light-emitting substrate comprises a plurality of light-emitting elements and the array substrate according to any one of claims 1 to 22; the light-emitting element comprises a plurality of pins, and each of the pins is bound and connected to one of the conductive pads.

24. The light-emitting substrate according to claim 23, characterized in that: The light-emitting substrate further includes a third reflective layer, the third reflective layer covers the light-emitting element, and a light exit hole is provided on a side of the third reflective layer facing the array substrate.

25. A display device, characterized in that: The display device comprises a display panel and the light-emitting substrate according to claim 23 or 24; the display panel is located on a side of the substrate away from the light-emitting element.

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