Six-sided light-emitting SMD LED

Abstract

A six-sided light-emitting SMD LED, comprising a substrate (100), an LED chip (200), a packaging body (300), a first wire (400), and a second wire (500). The substrate (100) is a light-transmitting plate body. The first wire (400) comprises a first connecting portion (410) used for connecting to the LED chip (200), and the second wire (500) comprises a second connecting portion (510) for connecting to the LED chip (200). The first wire (400) and the second wire (500) are respectively attached to two opposite ends of the substrate (100), and two electrodes of the LED chip (200) are respectively connected to the first connecting portion (410) and the second connecting portion (510). The packaging body (300) is a light-transmitting colloid. The packaging body (300) packages the LED chip (200), the first connecting portion (410), and the second connecting portion (510) on one side of the substrate (100). After the LED chip (200) is supplied with power, light emitted by the LED chip (200) can be radiated outward by means of the light-transmitting substrate (100) and packaging body (300) to achieve a six-sided light-emitting effect, thereby improving the brightness and aesthetics of the light.

Description

A six-sided emitting SMD LED Technical Field

[0001] The present invention relates to the technical field of LED light sources, in particular to a six-sided luminous patch type LED. Background Art

[0002] SMD LEDs, also known as surface-mounted diodes (SMD) LEDs, are simple lamps that emit light by passing an electric current through a compound semiconductor. Through the combination of electrons and holes, the excess energy is released as light, creating a luminous effect. SMD LEDs are primarily used in lighting systems, decoration, electronic device indicators, backlighting, displays, and other applications. Using SMD packaging, electronic products can be reduced in size by 40%-60% and in weight by 60%-80%. Currently, SMD LEDs emit light in a specific direction, illuminating only one side, leaving room for improvement in lighting performance.

[0003] Summary of the Invention

[0004] Therefore, the main technical problem to be solved by the present invention is to provide a SMD LED that can emit light on six sides.

[0005] To achieve the above-mentioned purpose, the technical solution of the embodiment of the present invention is implemented as follows:

[0006] A six-sided luminous SMD LED comprises a substrate, an LED chip, an encapsulation body, a first wire, and a second wire; the substrate is a light-transmitting plate body, the first wire comprises a first connecting portion for connecting to the LED chip, the second wire comprises a second connecting portion for connecting to the LED chip, the first wire and the second wire are respectively affixed to opposite ends of the substrate, and two electrodes of the LED chip are respectively connected to the first connecting portion and the second connecting portion; the encapsulation body is a light-transmitting colloid, and the encapsulation body encapsulates the LED chip, the first connecting portion, and the second connecting portion on one side of the substrate.

[0007] Preferably, the substrate is a light-transmitting resin plate.

[0008] Preferably, phosphor is added into the substrate, and / or phosphor is added into the package.

[0009] Preferably, the first conductive wire further includes a first solder pad and a first bent portion connecting the first solder pad and the first connecting portion, and the first solder pad and the first connecting portion are respectively located on opposite sides of the substrate; the second conductive wire further includes a second solder pad and a second bent portion connecting the second solder pad and the second connecting portion, and the second solder pad and the second connecting portion are respectively located on opposite sides of the substrate.

[0010] Preferably, it also includes an identification member for indicating the positive and negative poles of the electrode, and the identification member is arranged at one end of the substrate.

[0011] Preferably, the first conductive wire and the second conductive wire are both metal conductive wires.

[0012] Preferably, the LED chip is a front-mounted chip, and the LED chip is disposed on the first connecting portion and electrically connected to the second connecting portion through a wire.

[0013] Preferably, the LED chip is a flip chip, and a first electrode and a second electrode are provided on a side of the LED chip facing the substrate, the first electrode is connected to the first connecting portion, and the second electrode is connected to the second connecting portion.

[0014] In the above-mentioned technical solution of the present application, since the SMD LED includes a substrate, an LED chip, a package, a first wire and a second wire, the first wire and the second wire are respectively attached to the opposite ends of the substrate, and the positive and negative poles of the LED chip are connected through the first connecting part and the second connecting part. The substrate and the package are both made of translucent materials, so that after power is turned on, the light emitted by the LED chip can be diffused outward through the translucent substrate and the translucent package, forming a six-sided luminous effect, thereby improving the brightness and aesthetics of the light. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG1 is a plan view of a SMD LED according to an embodiment of the present application;

[0016] FIG2 is a cross-sectional view taken along line AA of FIG1 ;

[0017] FIG3 is a plan view of a SMD LED in another embodiment of the present application;

[0018] FIG4 is a cross-sectional view taken along line BB in FIG3 .

[0019] Explanation of the accompanying figures: 100-substrate, 110-arc-shaped notch, 200-LED chip, 210-wire, 220-first electrode, 230-second electrode, 300-package, 400-first wire, 410-first connecting portion, 420-first soldering pad, 430-first bending portion, 500-second wire, 510-second connecting portion, 520-second soldering pad, 530-second bending portion 2, 600-identification part. DETAILED DESCRIPTION

[0020] The technical solution of the present invention is further elaborated in detail below in conjunction with the drawings and specific embodiments of the specification. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. In the following description, reference is made to "some embodiments", which describes a subset of all possible embodiments, but it should be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0021] It should also be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "inner," "outer," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0022] The present application provides a six-sided luminous SMD LED, which is applicable to both face-mounted chips and flip-chip chips, and the number of LED chips 200 packaged inside the SMD LED is not limited.

[0023] Please refer to Figures 1 and 2, which illustrate a surface-mounted chip-type LED, comprising a substrate 100, an LED chip 200, a package 300, a first wire 400, and a second wire 500. The substrate 100 is a light-transmissive plate. The first wire 400 includes a first connecting portion 410 for connecting to the LED chip 200, and the second wire 500 includes a second connecting portion 510 for connecting to the LED chip 200. The first wire 400 and the second wire 500 are respectively attached to opposite ends of the substrate 100, and the first connecting portion 410 and the second connecting portion 510 are located on the same side of the substrate 100. The two electrodes (positive and negative) of the LED chip 200 are connected to the first connecting portion 410 and the second connecting portion 510, respectively, to be led out through the first wire 400 and the second wire 500. The encapsulation body 300 is a molded, light-transmitting colloid. It encapsulates the LED chip 200, the first connecting portion 410, and the second connecting portion 510 on one side of the substrate 100, protecting the LED chip 200 from damage. In the embodiment shown in the accompanying drawings, since the LED chip 200 is a face-up chip, it is soldered to the first connecting portion 410 and electrically connected to the second connecting portion 510 via a wire 210 extending from the LED chip 200. When the positive and negative terminals of the LED chip 200 are connected to a power source via the first and second wires 400 and 500, light emitted by the LED chip 200 can be dispersed outward through the light-transmitting substrate 100 and the light-transmitting encapsulation body 300, creating a six-sided light-emitting effect. Depending on the brightness requirements, the number of LED chips 200, first and second wires 400, and 500 encapsulated within the SMD LED can be one or more groups.

[0024] In the above technical solution of the present application, since the SMD LED includes a substrate 100, an LED chip 200, a package 300, a first wire 400 and a second wire 500, the first wire 400 and the second wire 500 are respectively attached to the opposite ends of the substrate 100, and the positive and negative poles of the LED chip 200 are connected through the first connecting part 410 and the second connecting part 510. The substrate 100 and the package 300 are both made of translucent materials, so that after power is turned on, the light emitted by the LED chip 200 can be diffused outward through the translucent substrate 100 and the translucent package 300, forming a six-sided light-emitting effect, thereby improving the brightness and aesthetics of the light.

[0025] As a preferred embodiment of the present invention, substrate 100 can be a translucent resin plate. This plate has excellent light transmission and flame retardancy, and is resistant to yellowing, deformation, and chemical corrosion, while remaining lightweight. Furthermore, phosphors can be added to substrate 100 to create a sparkling, shimmering visual effect when the SMD LED is illuminated. Similarly, phosphors can also be added to package 300 to further enhance the lighting effect.

[0026] Preferably, the first conductive line 400 further includes a first solder pad 420 and a first bent portion 430 connecting the first solder pad 420 and the first connecting portion 410. The first solder pad 420 is used for connecting to an external circuit. The first solder pad 420 and the first connecting portion 410 are located on opposite sides of the substrate 100, with the first connecting portion 410 abutting against one end of the substrate 100. Similarly, the second conductive line 500 further includes a second solder pad 520 and a second bent portion 530 connecting the second solder pad 520 and the second connecting portion 510. The second solder pad 520 is used for connecting to an external circuit. The second solder pad 520 and the second connecting portion 510 are located on opposite sides of the substrate 100, with the second connecting portion 510 abutting against the other end of the substrate 100. In the embodiment shown in the drawings, arc-shaped notches 110 are provided at both ends of the substrate 100. The first and second bent portions 430 and 530 are both curved to accommodate the arc-shaped notches 110, resulting in a more compact structure. The substrate 100 may also be provided with an identification member 600 for indicating the positive and negative poles of the electrodes. The identification member 600 is disposed at one end of the substrate 100. The identification member 600 may be green to indicate the negative pole of the LED chip 200. The first wire 400 and the second wire 500 may both be metal wires, which have excellent uniform conductivity and chemical corrosion resistance.

[0027] Please refer to Figures 3 and 4, which illustrate a flip-chip SMD LED. Compared to a face-mounted SMD LED, the main difference lies in the connection method between the LED chip 200 and the first and second wires 400 and 500. The flip-chip LED chip 200 is provided with a first electrode 220 and a second electrode 230 on the side facing the substrate 100. The first electrode 220 is connected to the first connecting portion 410 via conductive adhesive, and the second electrode 230 is connected to the second connecting portion 510 via conductive adhesive. When the first and second electrodes 220 and 230 of the LED chip 200 are connected to a power source via the first and second wires 400 and 500, respectively, light emitted by the LED chip 200 can be dispersed outward through the transparent substrate 100 and the transparent package 300, creating a six-sided light-emitting effect, enhancing the brightness and aesthetics of the light.

[0028] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. The scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A six-sided emitting SMD LED, characterized in that: The invention comprises a substrate, an LED chip, a packaging body, a first wire and a second wire; the substrate is a light-transmitting plate body, the first wire comprises a first connecting part for connecting the LED chip, the second wire comprises a second connecting part for connecting the LED chip, the first wire and the second wire are respectively attached to opposite ends of the substrate, and two electrodes of the LED chip are respectively connected to the first connecting part and the second connecting part; the packaging body is a light-transmitting colloid, and the packaging body packages the LED chip, the first connecting part and the second connecting part on one side of the substrate.

2. The six-sided light-emitting SMD LED according to claim 1, characterized in that: The substrate is a light-transmitting resin plate.

3. The six-sided light-emitting SMD LED according to claim 2, characterized in that: Phosphor is added in the substrate, and phosphor is added in the package.

4. The six-sided light-emitting SMD LED according to claim 2, characterized in that: Phosphor is added into the substrate, or phosphor is added into the package.

5. The six-sided light-emitting SMD LED according to claim 1, characterized in that: The first conductive wire further includes a first solder pad and a first bending portion connecting the first solder pad and the first connecting portion, and the first solder pad and the first connecting portion are respectively located on opposite sides of the substrate; the second conductive wire further includes a second solder pad and a second bending portion connecting the second solder pad and the second connecting portion, and the second solder pad and the second connecting portion are respectively located on opposite sides of the substrate.

6. The six-sided light-emitting SMD LED according to claim 1, characterized in that: It also includes an identification piece for indicating the positive and negative poles of the electrode, and the identification piece is arranged at one end of the substrate.

7. The six-sided light-emitting SMD LED according to claim 1, characterized in that: The first conductive line and the second conductive line are both metal conductive lines.

8. The six-sided light-emitting SMD LED according to any one of claims 1 to 7, characterized in that: The LED chip is a front-mounted chip, which is disposed on the first connecting portion and is electrically connected to the second connecting portion through a wire.

9. The six-sided light-emitting SMD LED according to any one of claims 1 to 7, characterized in that: The LED chip is a flip chip. A first electrode and a second electrode are provided on a side of the LED chip facing the substrate. The first electrode is connected to the first connecting portion, and the second electrode is connected to the second connecting portion.

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