Coating thickness control method, device, coating system and medium

Abstract

Provided are a coating thickness control method, a device, a coating system and a medium. The method comprises: acquiring a measurement thickness of a coating film layer of a base material; on the basis of the deviation value between the measurement thickness and a target thickness, adjusting the coating control parameters to obtain parameter values of the coating control parameters, wherein the coating control parameters comprise at least one of the wire feeding speed for conveying a metal wire, the movement speed of a moving assembly driving the base material to move, and the operating power of an evaporation assembly; and coating the base material by using the parameter values of the coating control parameters.

Description

Coating thickness control method, device, coating system and medium

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202311277694.9, filed on September 28, 2023, entitled “Coating Thickness Control Method, Device, Coating System and Medium,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of film coating technology, and in particular to a method, device, film coating system and medium for controlling film thickness. Background Art

[0004] In the production of thin-film conductive materials, a metal wire is typically fed at a constant speed through a wire feed assembly under vacuum conditions onto a ceramic material. The ceramic section is then connected to a metal electrode and powered. Industrial ceramics typically withstand temperatures up to 2600°C. This temperature melts and evaporates the wire, converting the solid metal into metal vapor. A main hub rotates at a constant speed, continuously passing the substrate over the ceramic evaporation device. A bias voltage applied to the main hub promotes the deposition of metal vapor onto the substrate, forming a film on the substrate surface.

[0005] The thickness of the film layer significantly affects the performance of the substrate. In actual production, factors affecting the film layer thickness need to be adjusted to adjust the film layer thickness to an ideal value. Currently, the film layer thickness is controlled manually by the operator, which has a significant impact on the human factor and low control efficiency.

[0006] Summary of the Invention

[0007] The present application provides a coating thickness control method, device, coating system and medium to solve the problem of low control efficiency during manual control.

[0008] In a first aspect, the present application provides a coating thickness control method, which is applied to a processor of a coating device, wherein the coating device includes a wire feeding assembly, an evaporation assembly, and a moving assembly for moving a substrate, wherein the substrate and the evaporation assembly are arranged opposite to each other, and the wire feeding assembly conveys a metal wire to the evaporation assembly, and the evaporation assembly converts the metal wire into gaseous metal, so that the gaseous metal is deposited on the surface of the substrate to form the film layer, comprising:

[0009] Obtain the measured thickness of the coating layer on the substrate;

[0010] adjusting a coating control parameter according to a deviation between the measured thickness and the target thickness to obtain a parameter value of the coating control parameter, wherein the coating control parameter includes at least one of a wire feeding speed for feeding the metal wire, a moving speed of the moving component for moving the substrate, and an operating power of the evaporation component;

[0011] The substrate is coated according to the parameter value of the coating control parameter.

[0012] In an embodiment of the present application, the coating control parameters are adjusted by the processor of the coating equipment based on the obtained measured film thickness and target thickness to adjust the film thickness of the subsequent coating so that the film thickness is closer to the target thickness. Compared with manual adjustment, the use of a processor for adjustment can improve the adjustment efficiency.

[0013] In one embodiment of the present application, adjusting the coating control parameter according to the deviation between the measured thickness and the target thickness to obtain the parameter value of the coating control parameter includes:

[0014] Obtaining a deviation value between the measured thickness and the target thickness;

[0015] Determining the adjusted coating control parameter according to the deviation value and a preset threshold;

[0016] The parameter value of the coating control parameter is determined according to the deviation value.

[0017] In an embodiment of the present application, the coating control parameter to be adjusted is determined by the size relationship between the deviation value and the preset threshold, and the parameter value of the coating control parameter is determined based on the deviation value. The thickness of the coated layer can be accurately controlled to reduce the deviation between the film thickness and the target thickness.

[0018] In one embodiment of the present application, the parameter value includes a first speed corresponding to the moving speed;

[0019] Determining the adjusted coating control parameter according to the deviation value and a preset threshold value includes:

[0020] When the deviation value is greater than or equal to the preset threshold, determining to adjust the moving speed;

[0021] Determining the parameter value of the coating control parameter according to the deviation value includes:

[0022] Performing proportional, integral, and differential (PID) control calculation according to the deviation value to obtain the first speed;

[0023] Coating the substrate according to the parameter value of the coating control parameter, comprising:

[0024] The moving speed is adjusted from the second speed to the first speed, and the substrate is coated with a film at the moving speed of the first speed.

[0025] In an embodiment of the present application, when the deviation value is greater than or equal to the preset threshold, the adjusted coating control parameter is determined to be the moving speed, so that the film thickness of the subsequent coating can quickly approach the target thickness.

[0026] In one embodiment of the present application, if the measured thickness is less than the target thickness, the first speed is less than the second speed;

[0027] If the measured thickness is greater than the target thickness, the first speed is greater than the second speed.

[0028] In an embodiment of the present application, if the measured thickness is less than the target thickness, the first speed is less than the second speed, that is, the thickness of the coated layer is increased by reducing the speed of the substrate movement; if the measured thickness is greater than the target thickness, the first speed is greater than the second speed, that is, the thickness of the coated layer is reduced by increasing the speed of the substrate movement.

[0029] In one embodiment of the present application, the parameter value includes at least one of a third speed corresponding to the wire feeding speed and a first power corresponding to the operating power;

[0030] Determining the adjusted coating control parameter according to the deviation value and a preset threshold value includes:

[0031] When the deviation value is less than a preset threshold, determining to adjust at least one of the wire feeding speed and the operating power;

[0032] Determining the parameter value of the coating control parameter according to the deviation value includes:

[0033] When the deviation value is less than a preset threshold, performing PID calculation according to the deviation value to obtain at least one of the third speed and the first power;

[0034] Coating the substrate according to the parameter value of the coating control parameter includes at least one of the following:

[0035] adjusting the wire feeding speed from the fourth speed to the third speed, and coating the substrate with the wire feeding speed of the third speed;

[0036] The working power is adjusted from the second power to the first power, and the substrate is coated with a film using the working power of the first power.

[0037] In an embodiment of the present application, when the deviation value is less than a preset threshold value, the thickness of the coated film layer can be fine-tuned by adjusting at least one of the wire feeding speed and the operating power of the evaporation component, so that the film thickness is close to the target value, thereby improving the adjustment accuracy.

[0038] In one embodiment of the present application, if the measured thickness is less than the target thickness, the third speed is greater than the fourth speed;

[0039] If the measured thickness is greater than the target thickness, the third speed is less than the fourth speed.

[0040] In an embodiment of the present application, if the measured thickness is less than the target thickness, the third speed is greater than the fourth speed, that is, the thickness of the coated layer is increased by increasing the wire feeding speed; if the measured thickness is greater than the target thickness, the third speed is less than the fourth speed, that is, the thickness of the coated layer is reduced by reducing the wire feeding speed.

[0041] In one embodiment of the present application, if the measured thickness is less than the target thickness, the first power is greater than the second power;

[0042] If the measured thickness is greater than the target thickness, the first power is less than the second power.

[0043] In an embodiment of the present application, if the measured thickness is less than the target thickness, the first power is greater than the second power, that is, the thickness of the deposited layer is increased by increasing the working power of the evaporation component; if the measured thickness is greater than the target thickness, the first power is less than the second power, that is, the thickness of the deposited layer is reduced by reducing the working power of the evaporation component.

[0044] In one embodiment of the present application, obtaining the measured thickness of the film layer coated on the substrate includes:

[0045] measuring the sheet resistance of the film layer;

[0046] The measured thickness is obtained according to the sheet resistance and the resistivity of the film layer.

[0047] In the embodiment of the present application, the square resistance is obtained by measurement, and the thickness of the film layer is calculated based on the square resistance and the resistivity of the film layer. This indirect measurement method can reduce the difficulty of obtaining the thickness of the film layer.

[0048] In one embodiment of the present application, the number of the wire feeding assemblies is M, the number of the evaporation assemblies is M, the M wire feeding assemblies correspond one-to-one to the M evaporation assemblies, and M is an integer greater than 1;

[0049] Obtain the measured thickness of the coating layer on the substrate, including:

[0050] Obtaining N measured thicknesses of N locations of the film layer coated on the substrate, where N is an integer greater than 1;

[0051] Adjusting the coating control parameter according to the deviation between the measured thickness and the target thickness to obtain the parameter value of the coating control parameter includes:

[0052] If the N measured thicknesses are all smaller than the target thickness, or if the N measured thicknesses are all larger than the target thickness, determining to adjust the moving speed;

[0053] determining a total deviation value according to the deviation value between each of the measured thicknesses and the target thickness;

[0054] Calculation is performed based on the total deviation value to determine the parameter value of the moving speed.

[0055] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are all less than or greater than the target thickness, the film thickness at each position can be adjusted by adjusting the moving speed of the substrate to improve the efficiency of film thickness adjustment.

[0056] In one embodiment of the present application, the N measured thicknesses include a first measured thickness and a second measured thickness;

[0057] Adjusting the coating control parameter according to the deviation between the measured thickness and the target thickness to obtain the parameter value of the coating control parameter includes:

[0058] If some of the N measured thicknesses are smaller than the target thickness and some are larger than the target thickness, then it is determined to adjust at least one of the following:

[0059] M wire feeding speeds of the wire feeding assemblies;

[0060] The operating power of the M evaporation components;

[0061] For any of the measured thicknesses, at least one of the following is determined based on a deviation between the measured thickness and the target thickness:

[0062] The wire feeding speed of the wire feeding assembly corresponding to the thickness measurement position;

[0063] The operating power of the evaporation component corresponding to the position where the thickness is measured.

[0064] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are partially less than or partially greater than the target thickness, the wire feeding speed of the wire feeding assembly corresponding to each measured thickness position can be adjusted, and the working power of the evaporation assembly corresponding to each measured thickness position can also be adjusted to adjust the film layer thickness at each position respectively and improve the adjustment effect.

[0065] In a second aspect, an embodiment of the present application provides a coating thickness control device, which is applied to a processor of a coating device, wherein the coating device includes a wire feeding assembly, an evaporation assembly, and a moving assembly for moving a substrate, wherein the substrate is arranged opposite to the evaporation assembly, and the wire feeding assembly conveys a metal wire to the evaporation assembly, which converts the metal wire into gaseous metal, so that the gaseous metal is deposited on the surface of the substrate to form the film layer. The device includes:

[0066] An acquisition module, used for acquiring the measured thickness of the coating layer on the substrate;

[0067] an adjustment module, configured to adjust a coating control parameter according to a deviation between the measured thickness and a target thickness to obtain a parameter value of the coating control parameter, wherein the coating control parameter includes at least one of a wire feeding speed for feeding the metal wire, a moving speed of the moving component for moving the substrate, and an operating power of the evaporation component;

[0068] A coating module is used to coat the substrate according to the parameter value of the coating control parameter.

[0069] In an embodiment of the present application, the coating control parameters are adjusted by the processor of the coating equipment based on the obtained measured film thickness and target thickness to adjust the film thickness of the subsequent coating so that the film thickness is closer to the target thickness. Compared with manual adjustment, the use of a processor for adjustment can improve the adjustment efficiency.

[0070] In one embodiment of the present application, the adjustment module includes:

[0071] A first acquisition submodule is used to obtain a deviation value between the measured thickness and the target thickness;

[0072] a parameter determination submodule, configured to determine the adjusted coating control parameter according to the deviation value and a preset threshold;

[0073] The parameter value determination submodule is used to determine the parameter value of the coating control parameter according to the deviation value.

[0074] In an embodiment of the present application, the coating control parameter to be adjusted is determined by the size relationship between the deviation value and the preset threshold, and the parameter value of the coating control parameter is determined based on the deviation value. The thickness of the coated layer can be accurately controlled to reduce the deviation between the film thickness and the target thickness.

[0075] In one embodiment of the present application, the parameter value includes a first speed corresponding to the moving speed;

[0076] Parameter determination submodule, used to:

[0077] When the deviation value is greater than or equal to the preset threshold, determining to adjust the moving speed;

[0078] Parameter value determination submodule, used to:

[0079] Performing PID calculation according to the deviation value to obtain the first speed;

[0080] The coating module is used to adjust the moving speed from the second speed to the first speed, and coat the substrate with the moving speed of the first speed.

[0081] In an embodiment of the present application, when the deviation value is greater than or equal to the preset threshold, the adjusted coating control parameter is determined to be the moving speed, so that the film thickness of the subsequent coating can quickly approach the target thickness.

[0082] In one embodiment of the present application, if the measured thickness is less than the target thickness, the first speed is less than the second speed;

[0083] If the measured thickness is greater than the target thickness, the first speed is greater than the second speed.

[0084] In an embodiment of the present application, if the measured thickness is less than the target thickness, the first speed is less than the second speed, that is, the thickness of the coated layer is increased by reducing the speed of the substrate movement; if the measured thickness is greater than the target thickness, the first speed is greater than the second speed, that is, the thickness of the coated layer is reduced by speeding up the speed of the substrate movement.

[0085] In one embodiment of the present application, the parameter value includes at least one of a third speed corresponding to the wire feeding speed and a first power corresponding to the operating power;

[0086] Parameter determination submodule, used to:

[0087] When the deviation value is less than a preset threshold, determining to adjust at least one of the wire feeding speed and the operating power;

[0088] Parameter value determination submodule, used to:

[0089] When the deviation value is less than a preset threshold, performing PID calculation according to the deviation value to obtain at least one of the third speed and the first power;

[0090] The coating module is configured to perform at least one of the following:

[0091] adjusting the wire feeding speed from the fourth speed to the third speed, and coating the substrate with the wire feeding speed of the third speed;

[0092] The working power is adjusted from the second power to the first power, and the substrate is coated with a film using the working power of the first power.

[0093] In an embodiment of the present application, when the deviation value is less than a preset threshold value, the thickness of the coated film layer can be fine-tuned by adjusting at least one of the wire feeding speed and the operating power of the evaporation component, so that the film thickness is close to the target value, thereby improving the adjustment accuracy.

[0094] In one embodiment of the present application, if the measured thickness is less than the target thickness, the third speed is greater than the fourth speed;

[0095] If the measured thickness is greater than the target thickness, the third speed is less than the fourth speed.

[0096] In an embodiment of the present application, if the measured thickness is less than the target thickness, the third speed is greater than the fourth speed, that is, the thickness of the coated layer is increased by increasing the wire feeding speed; if the measured thickness is greater than the target thickness, the third speed is less than the fourth speed, that is, the thickness of the coated layer is reduced by reducing the wire feeding speed.

[0097] In one embodiment of the present application, if the measured thickness is less than the target thickness, the first power is greater than the second power;

[0098] If the measured thickness is greater than the target thickness, the first power is less than the second power.

[0099] In an embodiment of the present application, if the measured thickness is less than the target thickness, the first power is greater than the second power, that is, the thickness of the deposited layer is increased by increasing the working power of the evaporation component; if the measured thickness is greater than the target thickness, the first power is less than the second power, that is, the thickness of the deposited layer is reduced by reducing the working power of the evaporation component.

[0100] In one embodiment of the present application, the acquisition module includes:

[0101] A measuring submodule, configured to measure the sheet resistance of the film layer;

[0102] The second acquisition submodule is configured to obtain the measured thickness according to the sheet resistance and the resistivity of the film layer.

[0103] In the embodiment of the present application, the square resistance is obtained by measurement, and the thickness of the film layer is calculated based on the square resistance and the resistivity of the film layer. This indirect measurement method can reduce the difficulty of obtaining the thickness of the film layer.

[0104] In one embodiment of the present application, the number of the wire feeding assemblies is M, the number of the evaporation assemblies is M, the M wire feeding assemblies correspond one-to-one to the M evaporation assemblies, and M is an integer greater than 1;

[0105] Get modules, including:

[0106] A third acquisition submodule is used to obtain N measured thicknesses of N positions of the film layer coated on the substrate, where N is an integer greater than 1;

[0107] Adjustment modules, including:

[0108] A first determining submodule, configured to determine to adjust the moving speed if the N measured thicknesses are all smaller than the target thickness, or if the N measured thicknesses are all larger than the target thickness;

[0109] a second determining submodule, configured to determine a total deviation value based on the deviation value between each measured thickness and the target thickness;

[0110] The third determining submodule is configured to perform calculations based on the total deviation value to determine a parameter value of the moving speed.

[0111] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are all less than or greater than the target thickness, the film thickness at each position can be adjusted by adjusting the moving speed of the substrate to improve the efficiency of film thickness adjustment.

[0112] In one embodiment of the present application, the N measured thicknesses include a first measured thickness and a second measured thickness;

[0113] Adjustment modules, including:

[0114] The fourth determining submodule is configured to determine and adjust at least one of the following if some of the N measured thicknesses are smaller than the target thickness and some are larger than the target thickness:

[0115] M wire feeding speeds of the wire feeding assemblies;

[0116] The operating power of the M evaporation components;

[0117] a fifth determination submodule, configured to determine, for any of the measured thicknesses, at least one of the following based on a deviation between the measured thickness and the target thickness:

[0118] The wire feeding speed of the wire feeding assembly corresponding to the thickness measurement position;

[0119] The operating power of the evaporation component corresponding to the position where the thickness is measured.

[0120] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are partially less than or partially greater than the target thickness, the wire feeding speed of the wire feeding assembly corresponding to each measured thickness position can be adjusted, and the working power of the evaporation assembly corresponding to each measured thickness position can also be adjusted to adjust the film layer thickness at each position respectively and improve the adjustment effect.

[0121] In a third aspect, an embodiment of the present application provides a coating system, comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the coating thickness control method as described in the first aspect.

[0122] In a fourth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the coating thickness control method as described in the first aspect are implemented.

[0123] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0124] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0125] FIG1 is a schematic flow chart of a coating thickness control method according to an embodiment of the present application;

[0126] FIG2 is a schematic structural diagram of a coating device provided in an embodiment of the present application;

[0127] FIG3 is a schematic diagram of a square provided in an embodiment of the present application;

[0128] FIG4 is a schematic structural diagram of a coating thickness control device provided in an embodiment of the present application;

[0129] FIG5 is a schematic diagram of the hardware structure of the coating system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0130] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0131] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first" and "second" in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary-secondary relationship.

[0132] The coating thickness control method, device, coating system and medium provided in the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0133] FIG1 is a flow chart of a coating thickness control method provided in one embodiment of the present application. The method is applied to a processor of a coating device. The coating device, as shown in FIG2 , includes a wire feed assembly 1, an evaporation assembly 2, and a moving assembly 3 for moving a substrate 4. The substrate 4 is disposed opposite the evaporation assembly 2. The wire feed assembly 1 delivers a metal wire 5 to the evaporation assembly 2, which converts the metal wire 5 into gaseous metal 6. The gaseous metal 6 is deposited on the surface of the substrate to form the film layer. In the above description, the evaporation assembly 2 can be an evaporation boat.

[0134] In the actual production of thin-film conductive materials, a metal wire is typically fed at a constant speed through a wire feed assembly 1 to a ceramic material in an evaporation assembly 2 under vacuum conditions. The ceramic material is then connected to a metal electrode and powered. Industrial ceramics typically have a temperature resistance of up to 2600°C, which can melt and evaporate the wire, converting the solid metal into metal vapor. The moving assembly 3, which can be a main hub, rotates at a constant speed, allowing the substrate to continuously pass over the evaporation assembly 2. Applying a certain bias voltage to the main hub promotes the deposition of metal vapor onto the substrate. The bias voltage acts to create an ion bombardment effect, which, while beneficial, results in low-energy particle bombardment, also causes additional heating, which can affect film performance. Furthermore, the bias voltage applied during pre-bombardment before coating can remove gases and contaminants adsorbed on the substrate surface, improving film-substrate bonding.

[0135] As shown in FIG1 , the coating thickness control method provided in an embodiment of the present application includes steps 101 to 103 , wherein:

[0136] Step 101: Obtain the measured thickness of the coating layer on the substrate.

[0137] The film layer coated on the substrate surface is very thin, and it is difficult to measure the thickness directly. In this step, the film thickness can be obtained by indirect measurement.

[0138] Exemplarily, this step may include: measuring the sheet resistance of the film layer; and obtaining the measured thickness according to the sheet resistance and the resistivity of the film layer.

[0139] Sheet resistance, or sheet resistance, refers to the edge-to-edge resistance of a square thin-film conductive material, as shown in Figure 3, representing the resistance from edge B to edge C. Sheet resistance has a characteristic: the edge-to-edge resistance of a square of any size is the same, regardless of whether the side length is 1 meter or 0.1 meter. Therefore, the sheet resistance is solely dependent on factors such as the thickness of the thin-film conductive material.

[0140] Sheet resistance is defined as follows: Sheet resistance R = (ρ / d), where ρ is the resistivity of the thin film conductive material and d is the film thickness. Once the coating material is determined, ρ can be determined. Sheet resistance R is inversely proportional to the film thickness d, meaning that the size of the sheet resistance represents the thickness of the film: the greater the sheet resistance, the thinner the film. Sheet resistance can be measured, and the film thickness can be calculated using the formula for calculating sheet resistance and film thickness. This indirect measurement method can reduce the difficulty of obtaining film thickness.

[0141] Step 102: Adjust the coating control parameters according to the deviation between the measured thickness and the target thickness to obtain parameter values ​​of the coating control parameters, wherein the coating control parameters include at least one of the wire feeding speed of the metal wire, the moving speed of the moving component driving the substrate to move, and the operating power of the evaporation component.

[0142] Factors that affect coating thickness include: substrate movement speed, wire feed speed, and evaporation module operating power. The slower the substrate movement speed, the faster the wire feed speed, and the higher the evaporation module operating power, the thicker the metal film will be.

[0143] When there is a deviation between the measured thickness and the target thickness, the thickness of the coated layer can be adjusted by adjusting the parameter value of the coating control parameter. The coating control parameter can be at least one of the wire feeding speed, the moving speed and the working power.

[0144] The parameter value may include one value or multiple values, depending on whether the coating control parameter includes one parameter or multiple parameters. For example, if the coating control parameter includes the moving speed, the parameter value includes the speed value corresponding to the moving speed; if the coating control parameter includes the wire feeding speed and the working power, the parameter value includes the speed value corresponding to the wire feeding speed and the power value corresponding to the working power.

[0145] Step 103 : coating the substrate according to the parameter values ​​of the coating control parameters.

[0146] It should be noted that if only some of the wire feed speed, movement speed, and operating power parameters are adjusted, the remaining parameters remain unchanged. For example, if the movement speed of the coating control parameter is adjusted, only the movement speed can be adjusted to the first speed without adjusting the wire feed speed and operating power values.

[0147] In an embodiment of the present application, the measured thickness of a film layer coated on a substrate is obtained; based on the deviation between the measured thickness and a target thickness, a coating control parameter is adjusted to obtain a parameter value of the coating control parameter, wherein the coating control parameter includes at least one of a wire feed speed for conveying the metal wire, a moving speed of the moving component for moving the substrate, and an operating power of the evaporation component; and the substrate is coated according to the parameter value of the coating control parameter. In the above, the coating control parameter is adjusted by a processor of the coating device based on the obtained measured film thickness and the target thickness to adjust the film thickness of the subsequent coating so that the film thickness is closer to the target thickness. Compared with manual adjustment, the use of a processor for adjustment can improve adjustment efficiency.

[0148] In one embodiment of the present application, adjusting the coating control parameter according to the deviation between the measured thickness and the target thickness to obtain the parameter value of the coating control parameter includes:

[0149] Obtaining a deviation value between the measured thickness and the target thickness;

[0150] Determining the adjusted coating control parameter according to the deviation value and a preset threshold;

[0151] The parameter value of the coating control parameter is determined according to the deviation value.

[0152] In the above description, the preset threshold value can be set according to actual conditions and is not limited here. For example, the preset threshold value can be determined based on the target thickness, for example, the preset threshold value is 5% of the target thickness. In this embodiment, the deviation value refers to the absolute value of the difference between the measured thickness and the target thickness.

[0153] According to the difference between the deviation value and the preset threshold value, at least one of the wire feeding speed, moving speed and working power of the coating control parameters to be adjusted is determined.

[0154] Exemplarily, when the deviation value is greater than or equal to the preset threshold, determining to adjust the moving speed;

[0155] Accordingly, a PID calculation is performed according to the deviation value to obtain a first speed corresponding to the moving speed, and the parameter value includes the first speed;

[0156] The moving speed is adjusted from the second speed to the first speed, and the substrate is coated with a film at the moving speed of the first speed.

[0157] Specifically, the influence of travel speed, wire feed speed, and evaporation module operating power on film thickness varies. If the influence of travel speed on film thickness is a, the influence of evaporation module operating power on film thickness is b, and the influence of wire feed speed on film thickness is c, then the influence factors a > b > c. In other words, travel speed has the most significant impact on film thickness, followed by operating power, while wire feed speed has a minimal impact on film thickness.

[0158] When the deviation value is greater than or equal to the preset threshold, the adjusted coating control parameter is determined to be the moving speed, so that the film thickness of the subsequent coating can quickly approach the target thickness.

[0159] In the PID control logic, the target value is R (i.e., the square resistance corresponding to the target thickness), and the actual measured value is R(t) (i.e., the square resistance corresponding to the measured thickness). The difference between R(t) and R is used to obtain the deviation value e(t). The deviation value is calculated using proportional (P), integral (I), and differential (D) calculations to obtain an output U(t). U(t) can be understood as a parameter value. U(t) is used for feedback adjustment, for example, to adjust the moving speed, wire feeding speed, or the working power of the evaporation component. When the film thickness changes, the square resistance value R(t) will also change, thereby achieving the purpose of adjusting the film thickness.

[0160] In the above, the first speed is the value of the moving speed. The deviation value is subjected to PID calculation to obtain the first speed. The first speed is used to coat the substrate, so that the thickness of the subsequent coating layer can quickly approach the target thickness.

[0161] If the measured thickness is less than the target thickness, the first speed is less than the second speed, that is, the thickness of the coated layer is increased by reducing the speed of the substrate movement; if the measured thickness is greater than the target thickness, the first speed is greater than the second speed, that is, the thickness of the coated layer is reduced by increasing the speed of the substrate movement.

[0162] It should be noted that when adjusting the movement speed, it is necessary to adjust it within a certain range of the first preset speed, for example, within ±20% of the first preset speed. If the first speed is within the range of ±20% of the first preset speed, the first speed can be used to adjust the film thickness. If the first speed exceeds the range of ±20% of the first preset speed, the coating equipment needs to be shut down for maintenance. The first preset speed can be set according to actual conditions and is not limited here.

[0163] In yet another embodiment of the present application, the parameter value includes at least one of a third speed corresponding to the wire feeding speed and a first power corresponding to the operating power;

[0164] Determining the adjusted coating control parameter according to the deviation value and a preset threshold value includes:

[0165] When the deviation value is less than a preset threshold, determining to adjust at least one of the wire feeding speed and the operating power;

[0166] Determining the parameter value of the coating control parameter according to the deviation value includes:

[0167] When the deviation value is less than a preset threshold, performing PID calculation according to the deviation value to obtain at least one of the third speed and the first power;

[0168] Coating the substrate according to the parameter value of the coating control parameter includes at least one of the following:

[0169] adjusting the wire feeding speed from the fourth speed to the third speed, and coating the substrate with the wire feeding speed of the third speed;

[0170] The working power is adjusted from the second power to the first power, and the substrate is coated with a film using the working power of the first power.

[0171] In the above, when the deviation value is less than the preset threshold, adjusting the moving speed is likely to cause a large adjustment, and fine-tuning should be performed, that is, adjusting the wire feeding speed or the working power of the evaporation component, or adjusting the wire feeding speed and the working power of the evaporation component.

[0172] After determining the adjustment parameter, PID calculation can be used to determine the parameter value. For example, if the adjustment is determined to be the wire feed speed, PID calculation is performed based on the deviation value to obtain the third speed corresponding to the wire feed speed; if the adjustment is determined to be the operating power of the evaporation component, PID calculation is performed based on the deviation value to obtain the first power corresponding to the operating power.

[0173] It should be noted that, generally speaking, adjusting only the evaporator's operating power without changing the wire feed speed can easily cause aluminum overflow or dry burning of the evaporator. Therefore, these two factors need to be adjusted simultaneously. Increasing the operating power requires increasing the wire feed speed, otherwise, the evaporator will dry burn. Similarly, decreasing the operating power requires decreasing the wire feed speed, otherwise, aluminum overflow can occur. There is a corresponding relationship between the evaporator's operating power and wire feed speed, which can be pre-calibrated, for example, through experiments, and is not limited here.

[0174] In the corresponding relationship, the power value corresponding to one operating power corresponds to a wire feed speed value. When the operating power of the evaporation component needs to be adjusted, the wire feed speed is also adjusted synchronously, and vice versa. For example, after calculating the first power through PID, the wire feed speed corresponding to the first power can be obtained by searching the corresponding relationship. Or, after calculating the third speed through PID, the operating power value corresponding to the third speed can be obtained by searching the corresponding relationship.

[0175] If the measured thickness is less than the target thickness, the third speed is greater than the fourth speed, that is, the thickness of the coated layer is increased by increasing the wire feeding speed; if the measured thickness is greater than the target thickness, the third speed is less than the fourth speed, that is, the thickness of the coated layer is reduced by reducing the wire feeding speed.

[0176] If the measured thickness is less than the target thickness, the first power is greater than the second power, that is, the thickness of the deposited layer is increased by increasing the working power of the evaporation component; if the measured thickness is greater than the target thickness, the first power is less than the second power, that is, the thickness of the deposited layer is reduced by reducing the working power of the evaporation component.

[0177] It should be noted that when adjusting the wire feed speed, it must be adjusted within a certain range of the second preset speed, for example, within ±15% of the second preset speed. If the third speed is within ±15% of the second preset speed, the third speed can be used to adjust the film thickness. If the third speed exceeds ±15% of the second preset speed, the coating equipment needs to be shut down for maintenance. The second preset speed can be set according to actual conditions and is not limited here.

[0178] In this embodiment, when the deviation value is less than a preset threshold, the thickness of the coated film layer can be fine-tuned by adjusting at least one of the wire feeding speed and the operating power of the evaporation component, so that the film thickness is close to the target value, thereby improving the adjustment accuracy.

[0179] In another embodiment of the present application, the number of the wire feeding assemblies is M, the number of the evaporation assemblies is M, the M wire feeding assemblies correspond one-to-one to the M evaporation assemblies, and M is an integer greater than 1;

[0180] Obtain the measured thickness of the coating layer on the substrate, including:

[0181] Obtaining N measured thicknesses of N locations of the film layer coated on the substrate, where N is an integer greater than 1;

[0182] Adjusting the coating control parameter according to the deviation between the measured thickness and the target thickness to obtain the parameter value of the coating control parameter includes:

[0183] If the N measured thicknesses are all smaller than the target thickness, or if the N measured thicknesses are all larger than the target thickness, determining to adjust the moving speed;

[0184] determining a total deviation value according to the deviation value between each of the measured thicknesses and the target thickness;

[0185] Calculation is performed based on the total deviation value to determine the parameter value of the moving speed.

[0186] In the above description, the total deviation value may be the maximum value, minimum value or average value of the deviation values ​​between the N measured thicknesses and the target thickness, which is not limited here.

[0187] After obtaining the total deviation value, when calculating the parameter value of the moving speed based on the total deviation value, the total deviation value can be used as the deviation value. Referring to the aforementioned embodiment, the PID calculation is performed based on the deviation value to obtain the parameter value corresponding to the moving speed, which will not be elaborated here.

[0188] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are all less than or greater than the target thickness, the film thickness at each position can be adjusted by adjusting the moving speed of the substrate to improve the efficiency of film thickness adjustment.

[0189] In yet another embodiment of the present application, the N measured thicknesses include a first measured thickness and a second measured thickness;

[0190] Adjusting the coating control parameter according to the deviation between the measured thickness and the target thickness to obtain the parameter value of the coating control parameter includes:

[0191] If some of the N measured thicknesses are smaller than the target thickness and some are larger than the target thickness, then it is determined to adjust at least one of the following:

[0192] M wire feeding speeds of the wire feeding assemblies;

[0193] The operating power of the M evaporation components;

[0194] For any of the measured thicknesses, at least one of the following is determined based on a deviation between the measured thickness and the target thickness:

[0195] The wire feeding speed of the wire feeding assembly corresponding to the thickness measurement position;

[0196] The operating power of the evaporation component corresponding to the position where the thickness is measured.

[0197] In this embodiment, when some of the N measured thicknesses are smaller than the target thickness and some are larger than the target thickness, at least one of the wire feeding speed of the wire feeding assembly and the working power of the evaporation assembly corresponding to each measuring position can be adjusted.

[0198] The wire feeding assembly and evaporation assembly corresponding to the position where the thickness is measured can be predetermined. For example, the first position corresponds to the first wire feeding assembly and the first evaporation assembly, and the second position corresponds to the second wire feeding assembly and the second evaporation assembly. The first measured thickness at the first position is less than the target thickness, and the second measured thickness at the second position is greater than the target thickness.

[0199] When the film thickness at the first position needs to be adjusted, the first wire feeding assembly and the first evaporation assembly can be adjusted accordingly. When the film thickness at the second position needs to be adjusted, the second wire feeding assembly and the second evaporation assembly can be adjusted accordingly.

[0200] Regarding the manner of adjusting at least one of the first wire feeding assembly and the first evaporation assembly according to the first measured thickness, specific reference may be made to the description in the above embodiment in which, when the deviation value is less than a preset threshold value, PID calculation is performed according to the deviation value to obtain at least one of the third speed and the first power, which will not be elaborated here.

[0201] It should be noted that, for the measured thickness obtained at each position, adjusting at least one of the corresponding wire feeding assembly and evaporation assembly based on the measured thickness may specifically include: obtaining a deviation between the measured thickness and the target thickness; determining the adjusted coating control parameter based on the deviation and a preset threshold; and determining a parameter value for the coating control parameter based on the deviation. For details, please refer to the description in the above embodiment and will not be repeated here.

[0202] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are partially less than or partially greater than the target thickness, the wire feeding speed of the wire feeding assembly corresponding to each measured thickness position can be adjusted, and the working power of the evaporation assembly corresponding to each measured thickness position can also be adjusted to adjust the film layer thickness at each position respectively and improve the adjustment effect.

[0203] Please refer to FIG4 , which is a schematic structural diagram of a coating thickness control device provided in an embodiment of the present application. As shown in FIG4 , the coating thickness control device 400 is applied to a processor of a coating device. The coating device includes a wire feeding assembly, an evaporation assembly, and a moving assembly for moving a substrate. The substrate and the evaporation assembly are arranged opposite each other. The wire feeding assembly conveys a metal wire to the evaporation assembly, which converts the metal wire into gaseous metal, so that the gaseous metal is deposited on the surface of the substrate to form the film layer. The device includes:

[0204] An acquisition module 401 is used to obtain the measured thickness of the film layer coated on the substrate;

[0205] an adjustment module 402, configured to adjust a coating control parameter according to a deviation between the measured thickness and a target thickness to obtain a parameter value of the coating control parameter, wherein the coating control parameter includes at least one of a wire feeding speed for feeding the metal wire, a moving speed of the moving assembly for moving the substrate, and an operating power of the evaporation assembly;

[0206] The coating module 403 is used to coat the substrate according to the parameter value of the coating control parameter.

[0207] In an embodiment of the present application, the coating control parameters are adjusted by the processor of the coating equipment based on the obtained measured film thickness and target thickness to adjust the film thickness of the subsequent coating so that the film thickness is closer to the target thickness. Compared with manual adjustment, the use of a processor for adjustment can improve the adjustment efficiency.

[0208] In one embodiment of the present application, the adjustment module 402 includes:

[0209] A first acquisition submodule is used to obtain a deviation value between the measured thickness and the target thickness;

[0210] a parameter determination submodule, configured to determine the adjusted coating control parameter according to the deviation value and a preset threshold;

[0211] The parameter value determination submodule is used to determine the parameter value of the coating control parameter according to the deviation value.

[0212] In an embodiment of the present application, the coating control parameter to be adjusted is determined by the size relationship between the deviation value and the preset threshold, and the parameter value of the coating control parameter is determined based on the deviation value. The thickness of the coated layer can be accurately controlled to reduce the deviation between the film thickness and the target thickness.

[0213] In one embodiment of the present application, the parameter value includes a first speed corresponding to the moving speed;

[0214] Parameter determination submodule, used to:

[0215] When the deviation value is greater than or equal to the preset threshold, determining to adjust the moving speed;

[0216] Parameter value determination submodule, used to:

[0217] Performing PID calculation according to the deviation value to obtain the first speed;

[0218] The coating module 403 is configured to adjust the moving speed from the second speed to the first speed, and coat the substrate with the moving speed of the first speed.

[0219] In an embodiment of the present application, when the deviation value is greater than or equal to the preset threshold, the adjusted coating control parameter is determined to be the moving speed, so that the film thickness of the subsequent coating can quickly approach the target thickness.

[0220] In one embodiment of the present application, if the measured thickness is less than the target thickness, the first speed is less than the second speed;

[0221] If the measured thickness is greater than the target thickness, the first speed is greater than the second speed.

[0222] In an embodiment of the present application, if the measured thickness is less than the target thickness, the first speed is less than the second speed, that is, the thickness of the coated layer is increased by reducing the speed of the substrate movement; if the measured thickness is greater than the target thickness, the first speed is greater than the second speed, that is, the thickness of the coated layer is reduced by increasing the speed of the substrate movement.

[0223] In one embodiment of the present application, the parameter value includes at least one of a third speed corresponding to the wire feeding speed and a first power corresponding to the operating power;

[0224] Parameter determination submodule, used to:

[0225] When the deviation value is less than a preset threshold, determining to adjust at least one of the wire feeding speed and the operating power;

[0226] Parameter value determination submodule, used to:

[0227] When the deviation value is less than a preset threshold, performing PID calculation according to the deviation value to obtain at least one of the third speed and the first power;

[0228] The coating module 403 is configured to perform at least one of the following:

[0229] adjusting the wire feeding speed from the fourth speed to the third speed, and coating the substrate with the wire feeding speed of the third speed;

[0230] The working power is adjusted from the second power to the first power, and the substrate is coated with a film using the working power of the first power.

[0231] In an embodiment of the present application, when the deviation value is less than a preset threshold value, the thickness of the coated film layer can be fine-tuned by adjusting at least one of the wire feeding speed and the operating power of the evaporation component, so that the film thickness is close to the target value, thereby improving the adjustment accuracy.

[0232] In one embodiment of the present application, if the measured thickness is less than the target thickness, the third speed is greater than the fourth speed;

[0233] If the measured thickness is greater than the target thickness, the third speed is less than the fourth speed.

[0234] In an embodiment of the present application, if the measured thickness is less than the target thickness, the third speed is greater than the fourth speed, that is, the thickness of the coated layer is increased by increasing the wire feeding speed; if the measured thickness is greater than the target thickness, the third speed is less than the fourth speed, that is, the thickness of the coated layer is reduced by reducing the wire feeding speed.

[0235] In one embodiment of the present application, if the measured thickness is less than the target thickness, the first power is greater than the second power;

[0236] If the measured thickness is greater than the target thickness, the first power is less than the second power.

[0237] In an embodiment of the present application, if the measured thickness is less than the target thickness, the first power is greater than the second power, that is, the thickness of the deposited layer is increased by increasing the working power of the evaporation component; if the measured thickness is greater than the target thickness, the first power is less than the second power, that is, the thickness of the deposited layer is reduced by reducing the working power of the evaporation component.

[0238] In one embodiment of the present application, the acquisition module 401 includes:

[0239] A measuring submodule, configured to measure the sheet resistance of the film layer;

[0240] The second acquisition submodule is configured to obtain the measured thickness according to the sheet resistance and the resistivity of the film layer.

[0241] In the embodiment of the present application, the square resistance is obtained by measurement, and the thickness of the film layer is calculated based on the square resistance and the resistivity of the film layer. This indirect measurement method can reduce the difficulty of obtaining the thickness of the film layer.

[0242] In one embodiment of the present application, the number of the wire feeding assemblies is M, the number of the evaporation assemblies is M, the M wire feeding assemblies correspond one-to-one to the M evaporation assemblies, and M is an integer greater than 1;

[0243] Acquisition module 401 includes:

[0244] A third acquisition submodule is used to obtain N measured thicknesses of N positions of the film layer coated on the substrate, where N is an integer greater than 1;

[0245] The adjustment module 402 includes:

[0246] A first determining submodule, configured to determine to adjust the moving speed if the N measured thicknesses are all smaller than the target thickness, or if the N measured thicknesses are all larger than the target thickness;

[0247] a second determining submodule, configured to determine a total deviation value based on the deviation value between each measured thickness and the target thickness;

[0248] The third determining submodule is configured to perform calculations based on the total deviation value to determine a parameter value of the moving speed.

[0249] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are all less than or greater than the target thickness, the film thickness at each position can be adjusted by adjusting the moving speed of the substrate to improve the efficiency of film thickness adjustment.

[0250] In one embodiment of the present application, the N measured thicknesses include a first measured thickness and a second measured thickness;

[0251] The adjustment module 402 includes:

[0252] The fourth determining submodule is configured to determine and adjust at least one of the following if some of the N measured thicknesses are smaller than the target thickness and some are larger than the target thickness:

[0253] M wire feeding speeds of the wire feeding assemblies;

[0254] The operating power of the M evaporation components;

[0255] a fifth determination submodule, configured to determine, for any of the measured thicknesses, at least one of the following based on a deviation between the measured thickness and the target thickness:

[0256] The wire feeding speed of the wire feeding assembly corresponding to the thickness measurement position;

[0257] The operating power of the evaporation component corresponding to the position where the thickness is measured.

[0258] In an embodiment of the present application, when the N measured thicknesses at N positions on the film layer are partially less than or partially greater than the target thickness, the wire feeding speed of the wire feeding assembly corresponding to each measured thickness position can be adjusted, and the working power of the evaporation assembly corresponding to each measured thickness position can also be adjusted to adjust the film layer thickness at each position respectively and improve the adjustment effect.

[0259] The coating thickness control device 400 provided in the embodiment of the present application can implement each process implemented in the aforementioned method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described here.

[0260] FIG5 shows a schematic diagram of the hardware structure of the coating system provided in an embodiment of the present application.

[0261] The coating system may include a processor 501 and a memory 502 storing computer program instructions.

[0262] Specifically, the processor 501 may include a central processing unit (CPU) or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0263] Memory 502 may include a large capacity memory for data or instructions. By way of example and not limitation, memory 502 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. In some instances, memory 402 may include removable or non-removable (or fixed) media, or memory 502 may be a non-volatile solid-state memory. In some embodiments, memory 502 may be internal or external to a battery device.

[0264] In some examples, the memory 502 may be a read-only memory (ROM). In one example, the ROM may be a mask-programmable ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0265] The memory 502 may include read-only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical or other physical / tangible memory storage devices. Thus, generally, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present disclosure.

[0266] The processor 501 implements the method in the embodiment shown in Figure 1 by reading and executing the computer program instructions stored in the memory 502, and achieves the corresponding technical effects achieved by executing the method / steps of the example shown in Figure 1. For the sake of brevity, they are not repeated here.

[0267] In addition, the embodiments of the present application may be implemented by providing a computer storage medium having computer program instructions stored thereon; when the computer program instructions are executed by a processor, any one of the coating thickness control methods in the above embodiments is implemented.

[0268] It should be understood that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated. Those skilled in the art can make various changes, modifications, and additions, or change the order of the steps after understanding the spirit of the present application.

[0269] The functional blocks shown in the above block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link via a data signal carried in a carrier wave. "Machine-readable medium" can include any medium that can store or transmit information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0270] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps. In other words, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0271] Aspects of the present disclosure have been described above with reference to the flowcharts and / or block diagrams of the methods, devices, equipment, and computer program products according to the embodiments of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It can also be understood that each box in the block diagram and / or flowchart and the combination of boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0272] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A coating thickness control method, applied to a processor of a coating device, wherein the coating device comprises a wire feeding assembly, an evaporation assembly, and a moving assembly for driving a substrate to move, wherein the substrate and the evaporation assembly are arranged opposite to each other, the wire feeding assembly conveys a metal wire to the evaporation assembly, and the evaporation assembly converts the metal wire into a gaseous metal, and the gaseous metal is deposited on the surface of the substrate to form a film layer, wherein the method comprises: Obtain the measured thickness of the coating layer on the substrate; According to the deviation value between the measured thickness and the target thickness, the coating control parameter is adjusted to obtain the parameter value of the coating control parameter, wherein the coating control parameter includes at least one of the wire feeding speed of the metal wire, the moving speed of the substrate driven by the moving component, and the working power of the evaporation component; The substrate is coated according to the parameter value of the coating control parameter.

2. The coating thickness control method according to claim 1, wherein: According to the deviation value between the measured thickness and the target thickness, the coating control parameter is adjusted to obtain the parameter value of the coating control parameter, including: Obtaining a deviation value between the measured thickness and the target thickness; Determining the coating control parameter to be adjusted according to the deviation value and a preset threshold value; According to the deviation value, the parameter value of the coating control parameter is determined.

3. The coating thickness control method according to claim 2, wherein: The parameter value includes a first speed corresponding to the moving speed; According to the deviation value and the preset threshold, determining the adjusted coating control parameter includes: When the deviation value is greater than or equal to the preset threshold, determining to adjust the moving speed; Determining the parameter value of the coating control parameter according to the deviation value includes: Perform proportional-integral-differential (PID) calculation according to the deviation value to obtain the first speed; The method of coating the substrate according to the parameter value of the coating control parameter comprises: The moving speed is adjusted from the second speed to the first speed, and the substrate is coated with a film at the moving speed of the first speed.

4. The coating thickness control method according to claim 3, wherein: If the measured thickness is less than the target thickness, the first speed is less than the second speed; If the measured thickness is greater than the target thickness, the first speed is greater than the second speed.

5. The coating thickness control method according to claim 2, wherein: The parameter value includes at least one of a third speed corresponding to the wire feeding speed and a first power corresponding to the working power; Determining the adjusted coating control parameter according to the deviation value and the preset threshold value includes: When the deviation value is less than the preset threshold value, determining to adjust at least one of the wire feeding speed and the operating power; Determining the parameter value of the coating control parameter according to the deviation value includes: When the deviation value is less than a preset threshold, performing PID calculation according to the deviation value to obtain at least one of the third speed and the first power; The substrate is coated according to the parameter value of the coating control parameter, comprising at least one of the following: adjusting the wire feeding speed from the fourth speed to the third speed, and coating the substrate with the wire feeding speed of the third speed; The working power is adjusted from the second power to the first power, and the substrate is coated with a film using the working power of the first power.

6. The coating thickness control method according to claim 5, wherein: If the measured thickness is less than the target thickness, the third speed is greater than the fourth speed; If the measured thickness is greater than the target thickness, the third speed is less than the fourth speed.

7. The coating thickness control method according to claim 5, wherein: If the measured thickness is less than the target thickness, the first power is greater than the second power; If the measured thickness is greater than the target thickness, the first power is less than the second power.

8. The coating thickness control method according to any one of claims 1 to 7, wherein: Obtain the measured thickness of coatings applied to substrates, including: measuring the sheet resistance of the film layer; The measured thickness is obtained according to the sheet resistance and the resistivity of the film layer.

9. The coating thickness control method according to claim 1, wherein: The number of the wire feeding assemblies is M, the number of the evaporation assemblies is M, the M wire feeding assemblies correspond one to one with the M evaporation assemblies, and M is an integer greater than 1; Obtain the measured thickness of coatings applied to substrates, including: Obtaining N measured thicknesses at N positions of the coating layer on the substrate, where N is an integer greater than 1; According to the deviation value between the measured thickness and the target thickness, the coating control parameter is adjusted to obtain the parameter value of the coating control parameter, including: If the N measured thicknesses are all smaller than the target thickness, or the N measured thicknesses are all larger than the target thickness, determining to adjust the moving speed; Determining a total deviation value according to the deviation value between each measured thickness and the target thickness; Calculation is performed based on the total deviation value to determine the parameter value of the moving speed.

10. The coating thickness control method according to claim 9, wherein: The N measured thicknesses include a first measured thickness and a second measured thickness; According to the deviation value between the measured thickness and the target thickness, the coating control parameter is adjusted to obtain the parameter value of the coating control parameter, including: If some of the N measured thicknesses are smaller than the target thickness, and some of the measured thicknesses are larger than the target thickness, it is determined to adjust at least one of the following: The wire feeding speed of the M wire feeding assemblies; The working power of the M evaporation components; For any of the measured thicknesses, at least one of the following is determined according to a deviation between the measured thickness and the target thickness: The wire feeding speed of the wire feeding assembly corresponding to the position where the thickness is measured; The working power of the evaporation component corresponding to the position where the thickness is measured.

11. A coating thickness control device, applied to a processor of a coating device, the coating device comprising a wire feeding assembly, an evaporation assembly and a moving assembly for driving a substrate to move, the substrate and the evaporation assembly are arranged opposite to each other, the wire feeding assembly conveys a metal wire to the evaporation assembly, the evaporation assembly converts the metal wire into gaseous metal, the gaseous metal is deposited on the surface of the substrate to form a film layer, the device comprising: An acquisition module, used for acquiring the measured thickness of the coating layer on the substrate; an adjustment module, configured to adjust a coating control parameter according to a deviation between the measured thickness and the target thickness to obtain a parameter value of the coating control parameter, wherein the coating control parameter includes at least one of a wire feeding speed for conveying the metal wire, a moving speed of the moving component driving the substrate to move, and a working power of the evaporation component; The coating module is used to coat the substrate according to the parameter value of the coating control parameter.

12. A coating system, comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the coating thickness control method as described in any one of claims 1 to 10.

13. A readable storage medium storing a program or instruction, wherein the program or instruction, when executed by a processor, implements the steps of the coating thickness control method as claimed in any one of claims 1 to 10.

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