Hot runner apparatus and manufacturing method for same

Abstract

A hot runner apparatus may comprise: a locator block having a liquid resin injected therein; a manifold receiving the resin from the locator block; and a nozzle block receiving the resin from the manifold and discharging same. The manifold may comprise: a body comprising an inner circumferential surface forming a flow path through which the resin flows, and an outer circumferential surface opposite the inner circumferential surface; and a heater assembled on the body so as to surround the outer circumferential surface of the body. Other various embodiments are possible.

Description

Hot runner device and manufacturing method thereof

[0001] The various embodiments disclosed in this document relate to a hot runner device for an injection mold and a method for manufacturing the same.

[0002] Injection molding equipment injects material into a core cavity, hardens it, and molds and injects the product. Injection molding equipment is advantageous for mass-producing products with consistent shapes, and is used in a variety of industries.

[0003] A hot runner device is a device in which a molten resin flows in an injection device, and the high-temperature liquid resin injected into the hot runner device moves while maintaining a molten state to the cavity injection port of the mold device.

[0004] The hot runner device must be able to maintain the high temperature and high pressure of the molten liquid resin, prevent damage caused by the high temperature and high pressure liquid resin, and block external exposure of the resin.

[0005] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0006] A hot runner device according to one embodiment may include a locator block into which liquid resin is injected, a manifold for receiving the resin from the locator block, and a nozzle block for receiving and discharging the resin from the manifold. In one embodiment, the manifold may include a body including an inner circumferential surface forming a flow path through which the resin flows and an outer circumferential surface opposite to the inner circumferential surface, and a heater surrounding the outer circumferential surface of the body and assembled to the body.

[0007] In addition, a method for manufacturing a hot runner device according to an embodiment of the present document may include an operation of arranging a body of a manifold in which a flow path is formed inside, an operation of connecting a locator block for injecting liquid resin to one side of the body, an operation of connecting a nozzle block for receiving and ejecting the resin to the other side of the body opposite to the locator block, and an operation of assembling a heater to the body so as to surround an outer circumferential surface of the body.

[0008] Figure 1 is a schematic diagram of an injection device according to one embodiment.

[0009] Figure 2 is a perspective view of a hot runner device according to one embodiment.

[0010] Figure 3 is a drawing of the inside of the manifold viewed in the AA' direction shown in Figure 2.

[0011] Figure 4a is a cross-sectional view of a manifold according to one embodiment.

[0012] Figure 4b is a cross-sectional view of a manifold according to one embodiment.

[0013] Figure 4c is a cross-sectional view of a manifold according to one embodiment.

[0014] FIG. 4d is a cross-sectional view of a manifold according to one embodiment.

[0015] Figure 5 is a cross-sectional view of a manifold according to one embodiment.

[0016] FIG. 6A is a perspective view of a hot runner device according to one embodiment.

[0017] FIG. 6b is a cross-sectional view of a hot runner device according to one embodiment.

[0018] FIG. 6c is a side view of a hot runner device according to one embodiment.

[0019] FIG. 6d is a side view of a hot runner device according to one embodiment.

[0020] Figure 7 is a flowchart of a method for manufacturing a hot runner device according to one embodiment.

[0021] Figure 8 is a flowchart of a method for manufacturing a hot runner device according to one embodiment.

[0022] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0023] The various embodiments and terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0024] The term "module" used in various embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0025] Various embodiments may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0026] According to one embodiment, the method according to the various embodiments disclosed in the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0027] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0028] Figure 1 is a schematic diagram of an injection device (1) according to one embodiment.

[0029] Referring to FIG. 1, an injection device (1) according to one embodiment may include at least a portion of an injection device (10), a hot runner device (100), and a core assembly (50).

[0030] In one embodiment, the injection molding device (1) can mold a product to inject a molded product having a desired shape. The injection molding device (1) can inject a product or raw material before molding into a cavity (C) provided inside a core assembly (50), and harden the injected product or raw material to mold a molded product having various shapes (e.g., a three-dimensional shape).

[0031] For example, an injection device (1) can manufacture an injection-molded product having a desired shape by injecting liquid resin into a cavity and hardening the resin within the cavity. Hereinafter, the injection device (1) and hot runner device (100) of various embodiments of the present document will be described based on the injection device (1) using liquid resin, but the present invention is not limited thereto when actually implemented.

[0032] In one embodiment, the injection device (10) can provide a liquid resin to the hot runner device (100). The injection device (10) can include an injection portion (15). The injection portion (15) can be connected to the hot runner device (100). The resin delivered to the hot runner device (100) can pass through the hot runner device (100) and be injected into the core assembly (50) to be delivered to the cavity (C).

[0033] In one embodiment, the resin may be a liquid polymer, or may comprise a larger molecule composed of repeatedly linked relatively small molecules (e.g., monomers).

[0034] For example, the polymer may include at least one of a polymer produced in nature (e.g., natural rubber), a synthetic polymer (e.g., polyethylene, synthetic rubber, or nylon). However, the material used in the injection device (1) is not limited thereto, and materials having various physical properties may be used as raw materials.

[0035] In one embodiment, the hot runner device (100) may include a locator block (110), a manifold (120), and a nozzle block (130). The locator block (110) may include an injection nozzle (115) connected to an injection port (15) of an injection device (10). Resin injected through the injection nozzle (115) may pass through the manifold (120) and be delivered to the nozzle block (130).

[0036] In one embodiment, the manifold (120) can receive resin from the locator block (110) and deliver it to the nozzle block (130). The manifold (120) can be an intermediate member, a connecting member, or a delivery member that includes a path through which the liquid resin passes.

[0037] In one embodiment, the nozzle block (130) may include a spray nozzle (135) connected to the core assembly (50). The spray nozzle (135) may be connected to a cavity (C) of the core assembly (50) to eject resin into the cavity (C).

[0038] In one embodiment, the core assembly (50) may include a first core (51) and a second core (52). Each of the first core (51) and the second core (52) may be an upper core positioned at the top (e.g., in the +Z direction) and a lower core positioned at the bottom (e.g., in the -Z direction). The first core (51) and the second core (52) may be mutually assembled, and a cavity (C) for forming a product may be formed between the first core (51) and the second core (52).

[0039] In one embodiment, the cavity (C) may be a space provided between the first core (51) and the second core (52). The core assembly (50) may mold an injection-molded product by curing liquid resin received from the hot runner device (100) in the cavity (C).

[0040] FIG. 2 is a perspective view of a hot runner device (100) according to one embodiment, and FIG. 3 is a view looking into the inside of a manifold (120) in the direction AA' shown in FIG. 2.

[0041] Referring to FIGS. 2 and 3, a hot runner device (100) according to one embodiment may include a plurality of manifolds (120) and a plurality of nozzle blocks (130).

[0042] Hereinafter, any content that overlaps with the above-described content will be omitted for explanation, and it is to be understood that some components and structures of the hot runner device (100) may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the above-described embodiments may be combined in the hot runner device (100) unless it is technically clearly impossible.

[0043] In one embodiment, the hot runner device (100) is a device for delivering high-temperature resin in a molten state to a cavity (e.g., cavity (C) of FIG. 1), and can form and maintain the temperature of the molten resin at a high temperature. In addition, the hot runner device (100) can form a high-pressure injection pressure for spraying the resin.

[0044] In one embodiment, the locator block (110) can receive liquid resin from an injection device (e.g., the injection device of FIG. 1) or the outside through an injection port (116) of an injection nozzle (115). The resin injected through the injection nozzle (115) can be branched inside the locator block (110) and flow to each of a plurality of manifolds (120).

[0045] In one embodiment, the hot runner device (100) may include a plurality of nozzle blocks (130). The plurality of nozzle blocks (130) may include a first nozzle block (130a), a second nozzle block (130b), a third nozzle block (130c), and a fourth nozzle block (130d). The plurality of nozzle blocks (130) may be spaced apart from each other and may be connected to different connecting portions of a core assembly (e.g., the core assembly (50) of FIG. 1) to discharge resin.

[0046] In one embodiment, a plurality of manifolds (120) may be provided corresponding to a plurality of nozzle blocks (130). The plurality of manifolds (120) may include a first manifold (120a) connected to a first nozzle block (130a), a second manifold (120b) connected to a second nozzle block (130b), a third manifold (120c) connected to a third nozzle block (130c), and a fourth manifold (120d) connected to a fourth nozzle block (130d). The plurality of manifolds (120) may have substantially the same or similar structures and shapes.

[0047] In one embodiment, a single manifold (120) may have a multi-stage structure. For example, a manifold (120) connecting from a locator block (110) to a single nozzle block (130) may be formed by combining multiple sub-manifolds.

[0048] In one embodiment, the manifold (120) may include a body (150) and a heater (160) assembled to the body (150) to heat the body (150).

[0049] In one embodiment, the body (150) may be provided with a flow path (155) for resin to flow therein. The body (150) may be manufactured by seamless extrusion, or may be formed as an integral structure in the shape of a pipe. For example, the body (150) may be formed of a metallic material, and may be formed of an alloy material such as SUS304, SUS316L, SUS420, or SUS430.

[0050] In one embodiment of the present document, the body (150) is formed as a pipe-shaped integral structure with a flow path (155) formed therein, so that the manifold (120) can be formed relatively easily and conveniently compared to a structure in which blocks or cores are combined and the flow path (155) is drilled. In addition, the pipe-shaped body (150) can be relatively easy and economical to implement when the length of the manifold (120) is long.

[0051] In one embodiment, the flow path (155) may be formed by penetrating the interior of the manifold (120). The body (150) may include an inner surface (151) forming the flow path (155) and an outer surface (152) opposite to the inner surface (151). The appearance or shape of the flow path (155) may correspond to the inner surface (151) of the manifold (120).

[0052] In one embodiment, the heater (160) can control the temperature of the body (150). The heater (160) can heat the body (150) and maintain the molten resin passing through the passage (155) inside the body (150) at a high temperature.

[0053] In one embodiment, the heater (160) may be assembled to the body (150) by surrounding the outer surface (152) of the body (150). For example, as illustrated in FIG. 3, the heater (160) may be disposed in close contact with the outer surface (152) of the body (150). The heater (160) may extend together with the body (150) along the direction in which the body (150) extends or the direction in which the flow path (155) extends (e.g., along the X-axis direction).

[0054] In one embodiment of this document, the heater (160) is assembled to the outer surface (152) of the body (150), thereby uniformly heating the temperature of the body (150) of the manifold (120) and reducing the temperature deviation of the body (150) or the flow path (155).

[0055] For example, if the heater (160) is attached only to a portion of the body (150) or if the heater (160) is embedded in the body (150), a temperature difference may occur between a portion of the body (150) adjacent to the heater (160) and another portion of the body (150) relatively distant from the heater (160). If a temperature difference occurs in the body (150), the temperature of the resins passing through the passage (155) may be partially lowered, which may affect the quality of the injection-molded product.

[0056] In one embodiment of the present document, the heater (160) is assembled to the outer surface (152) of the body (150), thereby reducing or preventing temperature deviation of the manifold (120). The hot runner device (100) can uniformly maintain the temperature of the resin passing through the manifold (120), and reduce or prevent quality deterioration of the injection-molded product. In addition, the hot runner device (100), by uniformly maintaining the temperature of the body (150), can reduce position deviation due to thermal expansion with different temperatures, and can prevent damage to the hot runner device (100) due to position deviation.

[0057] In one embodiment, the body (150) may have a pipe-shaped or tube-shaped structure in which a flow path (155) is formed at the inner center. The pipe-shaped or tube-shaped body (150) can omit the gun drilling process for forming the flow path (155) and can form the body (150) relatively easily, compared to a combined structure in which two or more blocks or cores are combined or a perforated structure in which the flow path (155) is formed by punching or drawing a block or core. In addition, this can be advantageous in forming the flow path (155) to be long, and can be advantageous for an injection molding device (e.g., an injection molding device (1) of FIG. 1) for molding a large injection molded product.

[0058] In one embodiment, the inner surface (151) of the body (150) may have a circular cross-sectional structure based on a cross-section (e.g., a cross-section of the YZ plane of FIG. 3) perpendicular to the unfolding direction of the flow path (155) (e.g., the X-axis direction of FIG. 3). Alternatively, the flow path (155) may have a circular cross-sectional structure. The outer surface (152) of the body (150) may have a circular cross-sectional structure based on a cross-section perpendicular to the unfolding direction of the flow path (155).

[0059] In one embodiment of the present document, since the inner surface (151) and the outer surface (152) of the body (150) have a circular cross-sectional structure, the distance (e.g., thickness (d) of FIG. 3) from the heater (160) to the flow path (155) can be uniformly formed. When the thickness (d) is uniform, the temperature inside the flow path (155) can be uniformly controlled by the heater (160) over the entire area. In addition, since the inner surface (151) and the outer surface (152) of the body (150) have a circular structure, the manifold (120) can reduce the temperature deviation of the resin passing through the flow path (155) and maintain the temperature uniformly.

[0060] In one embodiment, the body (150) may have a thickness (d) from the inner surface (151) to the outer surface (152) that is substantially uniform based on a cross-section perpendicular to the direction of expansion of the euro (155).

[0061] However, "substantially" in this document may mean the same level, reflecting tolerances or errors in typical manufacturing processes. Alternatively, "substantially" may refer to a range that includes any of + / -0.1%, + / -0.5%, + / -1%, + / -3%, + / -5%, + / -7%, + / -10%, + / -15%, and + / -20%, based on the literal equivalent 0%.

[0062] In one embodiment, the body (150) has a substantially uniform thickness (d), so that the distance from the heater (160) to the flow path (155) can be formed to be substantially uniform. The heater (160) can uniformly heat the body (150) and the flow path (155), and reduce or minimize the temperature difference between the body (150) and the flow path (155).

[0063] In one embodiment, the body (150) and the flow path (155) are illustrated in the drawing as having a circular cross-sectional structure, but are not limited thereto, and the body (150) and the flow path (155) may have various structures such as an elliptical structure, a curved structure, or a polygonal structure.

[0064] FIGS. 4a, 4b, 4c and 4d are cross-sectional views of a manifold (120) according to one embodiment.

[0065] Referring to FIGS. 4a, 4b, 4c and 4d, the heater of the manifold (120) (e.g., heater (160) of FIG. 3) may be configured with any one of various types of heaters (160a, 160b, 160c, 160d).

[0066] However, the various types of heaters (160a, 160b, 160c, 160d) of FIGS. 4a, 4b, 4c, and 4d are only some implementation examples of the heater (160) according to various embodiments of the present document, and the actual implementation of the heater (160) is not limited to the contents illustrated in the drawings of the present document or described below, and may be implemented in various ways, modified or expanded.

[0067] Hereinafter, any content that overlaps with the above-described content will be omitted for explanation, and it is to be understood that some components and structures of the manifold (120) may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the above-described embodiments may be combined in the manifold (120) unless it is technically clearly impossible.

[0068] As illustrated in FIG. 4a, a heater (160a) according to one embodiment may include a conductive cable (161a) and an insulating member (162a).

[0069] In one embodiment, the conductive cable (161a) may surround the outer surface (152) of the body (150) and extend along the unfolding direction of the flow path (155) (e.g., X-axis direction). For example, as illustrated in FIG. 3 described above, the conductive cable (161a) may extend by wrapping around the outer surface (152) of the body (150) in a direction inclined at a predetermined angle with respect to the unfolding direction of the flow path (155) (e.g., X-axis direction).

[0070] Alternatively, for example, the conductive cable (161a) may be arranged perpendicular to the direction of expansion of the flow path (155), and a plurality of conductive cables (161a) may be arranged spaced apart from each other. Alternatively, the conductive cables (161a) may extend horizontally to the direction of expansion of the flow path (155), and may be arranged spaced apart from each other.

[0071] In one embodiment, the insulating member (162a) may be made of a material having excellent thermal conductivity. The insulating member (162a) may be placed in a spaced apart space between the conductive cables (161a). The insulating member (162a) may insulate between the conductive cables (161a) and / or between the conductive cables (161a) and the body (150).

[0072] In one embodiment, the insulating member (162a) may be partially formed of an insulating material at a portion in contact with the conductive cable (161a). In this case, other portions of the insulating member (162a) may be formed of a metal material with excellent thermal conductivity. Alternatively, the insulating member (162a) may be entirely formed of an insulating material.

[0073] As shown in FIG. 4b, a heater (160b) according to one embodiment may be formed of a tubular heating element having a shape surrounding the outer circumferential surface (152) of the body (150).

[0074] In one embodiment, the heater (160b) can be in close contact with the body (150) to uniformly heat the body (150). Since the heater (160b) directly heats the entire area of ​​the outer surface (152) of the body (150), the temperature of the body (150) can be controlled more uniformly compared to a method in which at least some areas are indirectly heated.

[0075] As illustrated in FIG. 4c, a heater (160c) according to one embodiment may be composed of a first heating member (161c), a second heating member (162c), and a connecting member (163c).

[0076] In one embodiment, the first heating member (161c) may surround a portion of the outer surface (152) of the body (150) (e.g., a portion in the +Z direction or an upper portion). The second heating member (162c) may surround another portion of the outer surface (152) of the body (150) (e.g., a portion in the -Z direction or a lower portion). The first heating member (161c) and the second heating member (162c) may be connected via a connecting member (163c). The connecting member (163c) may secure the first heating member (161c) and the second heating member (162c) to the body (150).

[0077] In one embodiment, each of the first heating element (161c) and the second heating element (162c) may include a heat conducting region (165) facing the outer surface (152) of the body (150) and a heating region (164) disposed outside the heat conducting region (165).

[0078] In one embodiment, the heater (160c) may be relatively easy to assemble and disassemble from the body (150). In the case of a tubular or integral heater (160), it may be difficult to disassemble the heater (160) as the body (150) is heated and expands. According to one embodiment of the present document, the heater (160c) can be easily separated from the body (150) using the connecting member (163c) the first heating member (161c) and the second heating member (162c) when maintenance, repair, or replacement of the body (150) or the heater (160c) is required, and can also be easily assembled to the body (150).

[0079] As illustrated in FIG. 4d, a heater (160d) according to one embodiment may be formed of a thin film-type heating element surrounding the outer surface (152) of the body (150).

[0080] In one embodiment, a heater (160d) made of a thin film can be assembled by being attached to the outer surface (152) of the body (150). An adhesive member (not shown) can be provided between the heater (160d) and the outer surface (152) of the body (150). The heater (160d) made of a thin film can be easily and conveniently attached to the body (150).

[0081] Figure 5 is a cross-sectional view of a manifold (120) according to one embodiment.

[0082] Referring to FIG. 5, the manifold (120) according to one embodiment may further include a coating film (170).

[0083] Hereinafter, any content that overlaps with the above-described content will be omitted for explanation, and it is to be understood that some components and structures of the manifold (120) may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the above-described embodiments may be combined in the manifold (120) unless it is technically clearly impossible.

[0084] In one embodiment, the coating film (170) can surround the inner surface (151) of the body (150). The coating film (170) can be made of a different material from the body (150). The coating film (170) can form the inner surface (151) of the body (150) flat and improve the flowability of the resin flowing in the flow path (155).

[0085] In one embodiment, the coating film (170) can extend from the flow path (155) of the body (150) to the inside of the nozzle block (e.g., nozzle block (130) of FIGS. 1 and 2). The high-temperature resin can flow smoothly through the flow path (155) of the manifold (120) to the nozzle block (130).

[0086] In one embodiment, the coating film (170) may be formed of a silica compound of the SiO2 series or Si-F series. Through the coating film (170), a slip function can be expected through the separation from the body (150), and through the application of nano silica, hardness enhancement and heat resistance and durability of the body (150) can be expected.

[0087] For example, the coating film (170) may be formed of a siloxane-based compound containing 1% to 5% of colloidal silica having a particle size of 50 nm or less. In this case, the hardness of the coating film (170) may be improved.

[0088] Alternatively, for example, the coating film (170) may be made of a compound having a siloxane resin content of 25% to 35% based on a solvent and an alcohol-based solvent such as IPA (isopropanol) or EtOH, and such a material may improve the release properties and slip properties of the coating film (170).

[0089] Alternatively, for example, the coating film (170) may be formed of a compound containing 65% to 85% of an alcohol-based solvent. Such a material may facilitate the formation of the coating film (170) and improve the durability and structural stability of the body (150).

[0090] In one embodiment, the coating film (170) may be formed as a thin film having a thickness of 1 to 5 micrometers. The thin film coating film (170) can reduce or minimize the influence on the flow of the resin and improve durability and contamination resistance.

[0091] In one embodiment, the coefficient of friction of the coating film (170) may be formed to be 0.15 or less, preferably 0.1 or less. By forming the coefficient of friction low, the coating film (170) can reduce or minimize the influence on the flow of the resin.

[0092] FIG. 6a is a perspective view of a hot runner device (100) according to one embodiment, FIG. 6b is a cross-sectional view of a hot runner device (100) according to one embodiment, FIG. 6c is a side view of a hot runner device (100) according to one embodiment, and FIG. 6d is a side view of a hot runner device (100) according to one embodiment.

[0093] Referring to FIGS. 6a, 6b, 6c and 6d, a nozzle block (130) of a hot runner device (100) according to one embodiment may include a first sub-block (131) and a second sub-block (132).

[0094] Hereinafter, any content overlapping with the above-described content will be omitted for explanation, and it is to be understood that some components and structures of the hot runner device (100) may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the above-described embodiments may be combined in the hot runner device (100) unless it is technically clearly impossible.

[0095] In one embodiment, the nozzle block (130) may be formed by connecting a first sub-block (131) and a second sub-block (132) by a connecting member (136). The first sub-block (131) and the second sub-block (132) may be connected to surround the distal end (125) of the manifold (120).

[0096] In one embodiment, the nozzle block (130) may include at least a portion of a buried heater (134), a valve pin (137), and a pin member (138). The buried heater (134) may control the temperature of the nozzle block (130). The buried heater (134) may be installed buried in each of the first sub-block (131) and the second sub-block (132).

[0097] In one embodiment, the valve pin (137) can move the pin member (138) in a vertical direction (e.g., in the Z-axis direction) to open and close the injection nozzle (135). The pin member (138) can be arranged to penetrate the first sub-block (131) and the second sub-block (132).

[0098] In one embodiment, the manifold (120) may be slidably connected to the nozzle block (130) in a direction parallel to the direction of deployment of the euro (155) (e.g., the X-axis direction).

[0099] For example, as illustrated in FIGS. 6c and 6d, the distal end (125) of the manifold (120) can slide through the nozzle block (130). The body (150) of the manifold (120) can be heated and expanded as the high-temperature resin moves and the heater (160) is driven, and the manifold (120) can expand in the direction of expansion of the flow path (155).

[0100] In one embodiment, the nozzle block (130) can slidably support the distal end (125) of the manifold (120), thereby preventing durability degradation and damage to the hot runner device (100) due to thermal expansion.

[0101] For example, the hot runner device (100) may experience a positional deviation with respect to the nozzle block (130) due to thermal expansion of the body (150). The positional deviation may cause the connection between the nozzle block (130) and the manifold (120) to be broken or separated, or the manifold (120) or the nozzle block (130) to be damaged.

[0102] In one embodiment of the present document, the manifold (120) is structurally slidably connected to the nozzle block (130), thereby preventing damage to the hot runner device (100) due to positional deviation.

[0103] In one embodiment, the first sub-block (131) may include a first groove (131a), and the second sub-block (132) may include a second groove (132a). Each of the first groove (131a) and the second groove (132a) may surround a portion of the outer surface (152) of the body (150) (e.g., a region in the +Z direction or an upper region) and another portion of the outer surface (152) of the body (150) (e.g., a region in the -Z direction or a lower region).

[0104] In one embodiment, the first groove (131a) and the second groove (132a) can support the body (150) so that the body (150) can slide. For example, as illustrated in FIG. 6b, the body (150) can be coupled to the nozzle block (130) by penetrating the first groove (131a) and the second groove (132a) along the direction of expansion of the flow path (155).

[0105] In one embodiment, the first groove (131a) and the second groove (132a) may support the body (150) in a certain direction (e.g., in the Z-axis direction and / or the Y-axis direction) without being bonded or coupled to the body (150). Accordingly, even if the body (150) slips a certain distance in the direction of expansion of the flow path (155) (e.g., in the X-axis direction) as shown in FIGS. 6c and 6d, the coupling of the manifold (120) and the nozzle block (130) may be maintained.

[0106] Figure 7 is a flowchart of a manufacturing method (300) of a hot runner device (100) according to one embodiment.

[0107] Referring to FIG. 7, a method (300) for manufacturing a hot runner device (100) according to one embodiment may include at least some of a body (150) placement operation (310) of a manifold (120), a locator block (110) coupling operation (320), a nozzle block (130) coupling operation (330), and a heater (160) assembling operation (340).

[0108] Hereinafter, the overlapping contents with the above-described contents will be omitted and described, and in the manufacturing method (300) of the hot runner device (100), some components and structures may be replaced, added, or omitted within a range that can be easily understood by those skilled in the art with reference to the drawings and descriptions below. In addition, in the manufacturing method (300) of the hot runner device (100), at least one component or feature of the embodiments described above may be combined unless it is technically clearly impossible. In addition, the manufacturing method (300) of the hot runner device (100) may be the hot runner device (100) of the embodiments described above, or is not limited thereto.

[0109] In one embodiment, the body (150) placement operation (310) of the manifold (120) may prepare the body (150) of the manifold (120) in which a flow path (155) is formed inside and place it in a manufacturing space or an assembly space. The body (150) of the manifold (120) may have a pipe-like or tube-like structure in which the flow path (155) is formed in the inner center.

[0110] In one embodiment, the pipe-shaped or tube-shaped body (150) can be formed relatively easily because a separate assembly process can be omitted and gun drilling for forming the flow path (155) can be omitted compared to a combined structure in which two or more blocks or cores are joined or a perforated structure in which a flow path (155) is formed by punching or drawing a block or core.

[0111] In one embodiment, the locator block (110) coupling operation (320) may couple a locator block (110) for injecting liquid resin to one side of the body (150). The nozzle block (130) coupling operation (330) may couple a nozzle block (130) for receiving and injecting resin to the other side of the body (150) opposite to the locator block (110). The locator block (110) coupling operation (320), the nozzle block (130) coupling operation (330), and the heater (160) assembling operation (340) described below may be performed regardless of the order, or at least two operations may be performed simultaneously.

[0112] In one embodiment, the heater (160) assembly operation (340) may assemble the heater (160) to the body (150) so as to surround the outer surface (152) of the body (150). By assembling the heater (160) to the outer surface (152) of the body (150), the temperature of the body (150) of the manifold (120) can be uniformly heated, thereby reducing temperature deviation.

[0113] For example, compared to a case where the heater (160) is embedded in the body (150), the manufacturing method (300) can easily form a manifold (120) by assembling the heater (160) to the outer surface (152) of the body (150). In addition, the heater (160) can be assembled to the outside of the body (150) to reduce or prevent temperature deviation of the body (150).

[0114] In one embodiment, the operation (340) of assembling the heater (160) may be performed by assembling a tubular heater (160) that surrounds the outer surface (152) of the body (150) by pressing it against the outer surface (152) of the body (150). The body (150) thermally expands as high-temperature resin passes through it or as the heater (160) is driven, and thus the body (150) may be pressed against and joined to the tubular heater (160).

[0115] In one embodiment, the operation (340) of assembling the heater (160) may include attaching a thin film heater (160) surrounding the outer surface (152) of the body (150) to the outer surface (152) of the body (150). The thin film heater (160) may have an adhesive material formed on the surface facing the body (150). The thin film heater (160) may be easy and convenient to assemble.

[0116] In one embodiment, the operation (340) of assembling the heater (160) may include applying a paste made of a conductive material to the outer surface (152) of the body (150) and curing the paste. By applying the paste, the heater (160) may be evenly adhered to and bonded to the outer surface (152) of the body (150). In addition, since a separate adhesive material may be omitted, separation of the heater (160) due to a decrease in thermal conductivity or a deterioration in performance of the adhesive material may be prevented.

[0117] FIG. 8 is a flowchart of a manufacturing method (300) of a hot runner device (100) according to one embodiment.

[0118] Referring to FIG. 8, the manufacturing method (300) according to one embodiment may further include a coating solution application operation (350) and a coating film (170) formation operation (355).

[0119] Hereinafter, any content that overlaps with the above-described content will be omitted for explanation, and in the manufacturing method (300) of the hot runner device (100), some configurations and structures may be replaced, added, or omitted within a range that can be easily understood by those skilled in the art with reference to the drawings and descriptions below. In addition, in the manufacturing method (300) of the hot runner device (100), at least one configuration or feature of the embodiments described above may be combined unless it is technically clearly impossible.

[0120] In one embodiment, the coating liquid application operation (350) may apply the coating liquid to the inner surface (151) of the body (150). For example, the coating liquid application operation (350) may use a dipping coating method in which the body (150) is immersed in a coating liquid bath. Alternatively, the coating liquid application operation (350) may use a flow coating method in which the coating liquid is flowed into the body (150). Alternatively, the coating liquid application operation (350) may use a splay coating method in which the coating liquid is sprayed into the body (150).

[0121] In one embodiment, the coating film (170) forming operation (355) may form the coating film (170) by curing the coating liquid. For example, the coating film (170) forming operation (355) may dry the applied coating liquid at 120 to 150 degrees Celsius for 1.5 to 2 hours.

[0122] In one embodiment, the coating film (170) forming operation (355) may be performed regardless of the order of the locator block (110) joining operation (320), the nozzle block (130) joining operation (330), and the heater (160) assembling operation (340).

[0123] In one embodiment, the coating film (170) forming operation (355) may be performed after the heater (160) assembling operation (340). The coating film (170) forming operation (355) may use the heater (160) assembled to the body (150) in the preceding heater (160) assembling operation (340) to cure the coating film (170) without using a separate heating device.

[0124] A hot runner device (100) according to one embodiment may include a locator block (110) into which liquid resin is injected, a manifold (120) for receiving the resin from the locator block (110), and a nozzle block (130) for receiving and discharging the resin from the manifold (120). In one embodiment, the manifold (120) may include a body (150) including an inner surface (151) forming a path (155) through which the resin flows and an outer surface (152) opposite to the inner surface (151), and a heater (160) assembled to the body (150) and surrounding the outer surface (152) of the body (150).

[0125] In one embodiment, the inner surface (151) of the body (150) may have a circular cross-sectional structure based on a cross-section perpendicular to the direction of expansion of the flow path (155).

[0126] In one embodiment, the outer surface (152) of the body (150) may have a circular cross-sectional structure based on a cross-section perpendicular to the direction of expansion of the flow path (155).

[0127] In one embodiment, the body (150) may have a substantially uniform thickness from the inner surface (151) to the outer surface (152) based on a cross-section perpendicular to the direction of expansion of the euro (155).

[0128] In one embodiment, the heater (160a) may include a conductive cable (161a) that surrounds the outer surface (152) of the body (150) and extends along the direction of expansion of the filament (155), and an insulating member (162a) filled between the conductive cable (161a).

[0129] In one embodiment, the heater (160b) may be formed as a tubular heating element having a shape that surrounds the outer surface (152) of the body (150).

[0130] In one embodiment, the heater (160c) may include a first heating member (161c) that surrounds a portion of the outer surface (152) of the body (150), a second heating member (162c) that surrounds another portion of the outer surface (152) of the body (150), and a connecting member (163c) that connects the first heating member (161c) and the second heating member (162c).

[0131] In one embodiment, the heater (160d) may be formed of a thin film-type heating element surrounding the outer surface (152) of the body (150).

[0132] In one embodiment, the manifold (120) may further include a coating film (170) surrounding the inner surface (151) of the body (150) and made of a different material from the body (150).

[0133] In one embodiment, the coating film (170) may be made of a silica compound of the SiO2 series or Si-F series.

[0134] In one embodiment, the coating film (170) may extend from the flow path (155) of the body (150) to the inside of the nozzle block (130).

[0135] In one embodiment, the manifold (120) can be slidably connected to the nozzle block (130) in a direction parallel to the direction of deployment of the euro (155).

[0136] In one embodiment, the nozzle block (130) may include a first sub-block (131) including a first groove (131a) that surrounds a portion of an outer surface (152) of a body (150), a second groove (132a) that surrounds another portion of an outer surface (152) of the body (150), a second sub-block (132) that is coupled to the first sub-block (131) such that the first groove (131a) and the second groove (132a) face each other, and an injection nozzle (135) that is in communication with a passage (155).

[0137] In one embodiment, the first groove (131a) and the second groove (132a) can support the body (150) so that the body (150) can slide.

[0138] In addition, a method (300) for manufacturing a hot runner device (100) according to one embodiment may include an operation (310) of arranging a body (150) of a manifold (120) having a flow path (155) formed therein, an operation (320) of connecting a locator block (110) for injecting liquid resin to one side of the body (150), an operation (330) of connecting a nozzle block (130) for receiving and injecting resin to the other side of the body (150) opposite to the locator block (110), and an operation (340) of assembling a heater (160) to the body (150) so as to surround an outer surface (152) of the body (150).

[0139] In one embodiment, the operation (340) of assembling the heater (160) may cause the tubular heater (160) surrounding the outer surface (152) of the body (150) to be pressed against the outer surface (152) of the body (150).

[0140] In one embodiment, the operation (340) of assembling the heater (160) may cause the thin film heater (160) surrounding the outer surface (152) of the body (150) to be pressed against the outer surface (152) of the body (150).

[0141] In one embodiment, the operation (340) of assembling the heater (160) may include applying a paste made of a conductive material to the outer surface (152) of the body (150) and curing it.

[0142] In one embodiment, the manufacturing method (300) may further include an operation (350) of applying a coating liquid to the inner surface (151) of the body (150).

[0143] In one embodiment, the manufacturing method (300) may further include an operation (355) of curing the coating solution to form a coating film (170).

[0144] Although the preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the scope of the claims. Furthermore, such modifications should not be individually understood from the technical idea or perspective.

Claims

1. In the hot runner device (100), A locator block (110) into which liquid resin is injected; A manifold (120) that receives the resin from the locator block (110); and It includes a nozzle block (130) that receives and discharges the resin from the manifold (120). The above manifold (120) is A body (150) including an inner surface (151) forming a flow path (155) through which the resin flows and an outer surface (152) opposite to the inner surface (151), and A hot runner device (100) comprising a heater (160) that surrounds the outer surface (152) of the body (150) and is assembled to the body (150).

2. In paragraph 1, The inner surface (151) of the above body (150) is A hot runner device (100) having a circular cross-sectional structure based on a cross-section perpendicular to the direction of expansion of the above-mentioned euro (155).

3. In paragraph 1 or 2, The outer surface (152) of the above body (150) is A hot runner device (100) having a circular cross-sectional structure based on a cross-section perpendicular to the direction of expansion of the above-mentioned euro (155).

4. In any one of paragraphs 1 to 3, The above body (150) is, A hot runner device (100) having a substantially uniform thickness from the inner surface (151) to the outer surface (152) based on a cross-section perpendicular to the direction of expansion of the above-mentioned euro (155).

5. In any one of paragraphs 1 to 4, The above heater (160a) is A conductive cable (161a) that surrounds the outer surface (152) of the body (150) and extends along the direction of expansion of the urea (155); and A hot runner device (100) comprising an insulating member (162a) filled between the conductive cables (161a).

6. In any one of paragraphs 1 to 5, The above heater (160b) is A hot runner device (100) comprising a tubular heating element having a shape surrounding the outer surface (152) of the above body (150).

7. In any one of paragraphs 1 to 6, The above heater (160c) is A first heating member (161c) surrounding a portion of the outer surface (152) of the above body (150); A second heating member (162c) surrounding another part of the outer surface (152) of the above body (150), and A hot runner device (100) including a connecting member (163c) connecting the first heating member (161c) and the second heating member (162c).

8. In any one of paragraphs 1 to 7, The above heater (160d) is A hot runner device (100) comprising a thin film-type heating element surrounding the outer surface (152) of the above body (150).

9. In any one of paragraphs 1 to 8, The above manifold (120) is A hot runner device (100) further comprising a coating film (170) made of a different material from the body (150) and surrounding the inner surface (151) of the body (150).

10. In any one of paragraphs 1 to 9, The above coating film (170) is SiO 2 A hot runner device (100) made of a silica compound of the Si-F series or Si-F series.

11. In any one of paragraphs 1 to 10, The above coating film (170) is A hot runner device (100) extending from the filament (155) of the body (150) to the inside of the nozzle block (130).

12. In any one of paragraphs 1 to 11, The above manifold (120) is A hot runner device (100) connected to the nozzle block (130) so as to be slidable in a direction horizontal to the direction of expansion of the above-mentioned euro (155).

13. In any one of paragraphs 1 to 12, The above nozzle block (130) is A first sub-block (131) including a first groove (131a) surrounding a portion of an outer surface (152) of the body (150), A second sub-block (132) including a second groove (132a) that surrounds another portion of the outer surface (152) of the body (150), and is coupled with the first sub-block (131) so that the first groove (131a) and the second groove (132a) face each other, and A hot runner device (100) comprising an injection nozzle (135) communicating with the above-mentioned euro (155).

14. In any one of paragraphs 1 to 13, The above first groove (131a) and the above second groove (132a) are, A hot runner device (100) in which the body (150) supports the body (150) so as to be able to slide.

15. In the manufacturing method (300) of the hot runner device (100), An operation (310) of placing a body (150) of a manifold (120) in which a euro (155) is formed inside; An operation (320) of combining a locator block (110) for injecting liquid resin to one side of the above body (150); An operation (330) of combining a nozzle block (130) that receives and ejects the resin on the other side of the body (150) opposite to the locator block (110); and A manufacturing method (300) including an operation (340) of assembling a heater (160) to the body (150) so as to surround an outer surface (152) of the body (150).

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