Camera module and camera module manufacturing device

Abstract

The present invention relates to a camera module and a camera module manufacturing device and, more specifically, to a camera module and a camera module manufacturing device, in which a housing and a substrate are joined by a laser solder jetting method at the side surface of a camera module having a solder ring mounted thereto, to quickly and easily assemble the camera module. According to the present invention, compared to other processes using epoxy and the like, the manufacturing process thereof can be simplified so that the manufacturing quality of a camera is improved, and the process time thereof can be significantly shortened.

Description

Camera modules and camera module manufacturing equipment

[0001] The present invention relates to a camera module and a camera module manufacturing device, and more particularly, to a camera module and a camera module manufacturing device that can quickly and easily assemble a camera module by joining a housing and a substrate by a laser solder jetting method on the side of a camera module equipped with a solder ring.

[0002] Recently, mobile devices such as cell phones and laptops are equipped with camera modules equipped with image capture devices such as CCD image sensors or CMOS image sensors.

[0003] A conventional method for manufacturing a camera module includes a substrate, an image sensor disposed on the substrate, a housing assembly coupled to an upper surface of the substrate, a lens accommodated in the housing assembly, and a curable resin disposed between the upper surface of the substrate and the housing assembly, wherein the housing assembly is pressed toward the substrate while being disposed in the curable resin before the curable resin is cured, thereby performing focusing.

[0004] The housing assembly can be actively aligned with the optical axis of the lens and the optical axis of the image sensor during the pressing process toward the substrate.

[0005] At this time, the curable resin uses epoxy that is cured by ultraviolet rays (UV).

[0006] Since epoxy materials require pre-curing and then final curing (thermal curing), a separate oven process is required, which takes a long time. In addition, epoxy management requires frozen storage, which makes it difficult to handle in terms of management.

[0007] The optical axis alignment (focusing) of the lens and image sensor is performed using active alignment equipment, and the housing assembly is pressed toward the substrate so that the lens approaches the image sensor and is focused. However, the conventional camera module manufacturing method performs a process of curing epoxy by irradiating ultraviolet rays after performing active alignment. If there is a slight movement from the time of ultraviolet irradiation to the time when the epoxy is completely cured, the alignment state of the lens and the image sensor may change slightly, and the lens and the image sensor may not be in focus.

[0008] Therefore, research is ongoing on ways to easily and quickly assemble the lens module and substrate to reduce optical axis alignment errors in the camera module.

[0009] The purpose of the present invention is to provide a camera module and a camera module manufacturing device that can quickly and easily assemble a camera module by joining a housing and a substrate using a laser solder jetting method on the side of a camera module equipped with a solder ring.

[0010] A camera module according to the features of the present invention to achieve the above purpose,

[0011] A printed circuit board having one or more soldering fixing holes formed at regular intervals and having solder of a fixed length inserted into each of the soldering fixing holes;

[0012] An image sensor chip mounted on the above printed circuit board;

[0013] A housing having one or more solder pins that are bonded to the upper surface of the printed circuit board and protrude downward by a certain length;

[0014] When inserted into the above soldering hole, the assembly gap, which is the space created on the side; and

[0015] A joint is formed by irradiating a laser into the assembly gap to melt the solder and join the housing and the printed circuit board.

[0016] A camera module manufacturing device according to the features of the present invention,

[0017] A printed circuit board having one or more soldering fixing holes formed at regular intervals and soldering of a fixed length inserted and joined into each of the soldering fixing holes, an image sensor chip mounted on the printed circuit board and detecting light as an electrical signal, and a camera module in which, when each of the solder pins is vertically inserted into each of the soldering holes, an assembly gap is created on the left and right sides of the housing and the printed circuit board, respectively;

[0018] A first laser irradiation device that irradiates a laser into an assembly gap formed on the left side of the camera module to melt the solder and join the housing and the printed circuit board; and

[0019] A second laser irradiation device is included that irradiates a laser into an assembly gap formed on the right side of the camera module to melt the solder and join the housing and the printed circuit board.

[0020] By the above-described configuration, the present invention has the effect of simplifying the manufacturing process compared to other processes such as epoxy, stabilizing the camera manufacturing quality, and greatly shortening the process time.

[0021] FIG. 1 is a drawing showing the overall shape of a camera module equipped with soldering according to an embodiment of the present invention.

[0022] Figure 2 is an exploded perspective view showing the configuration of a camera module equipped with soldering according to an embodiment of the present invention.

[0023] FIG. 3 is a drawing showing a soldering member according to an embodiment of the present invention being fitted into a soldering fixing hole of a printed circuit board.

[0024] Figure 4 is a drawing showing a cross-section of soldering according to an embodiment of the present invention.

[0025] FIG. 5 is a drawing showing an assembled appearance of a camera module equipped with soldering according to an embodiment of the present invention.

[0026] FIG. 6 is a cross-sectional view of a camera module having soldering according to an embodiment of the present invention.

[0027] Fig. 7 is a drawing showing the configuration of a camera module manufacturing device according to an embodiment of the present invention.

[0028] Fig. 8 is a drawing showing the configuration of a laser irradiation device according to an embodiment of the present invention.

[0029] FIG. 9 is a diagram showing the relationship between a control device and a peripheral device connected thereto according to an embodiment of the present invention.

[0030] Figure 10 is a block diagram briefly showing the internal configuration of a control device according to an embodiment of the present invention.

[0031] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing reference numerals, identical or similar components will be assigned the same reference numerals, and redundant descriptions thereof will be omitted. Furthermore, when describing embodiments disclosed in this specification, if a detailed description of a related known technology is judged to obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted.

[0032] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0033] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0034] In this application, each step described may be performed regardless of the listed order, except in cases where a special causal relationship requires that the steps be performed in the listed order.

[0035] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0036]

[0037] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0038] FIG. 1 is a drawing showing the overall shape of a camera module having a soldering according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing the configuration of a camera module having a soldering according to an embodiment of the present invention, FIG. 3 is a drawing showing a state in which a soldering according to an embodiment of the present invention is fitted into a soldering fixing hole of a printed circuit board, FIG. 4 is a drawing showing a cross-section of a soldering according to an embodiment of the present invention, FIG. 5 is a drawing showing an assembled state of a camera module having a soldering according to an embodiment of the present invention, and FIG. 6 is a drawing showing a cross-section of a camera module having a soldering according to an embodiment of the present invention.

[0039] As illustrated in FIGS. 1, 2, and 6, a camera module (100) having a soldering according to an embodiment of the present invention includes a printed circuit board (110) having a circuit pattern formed thereon, an image sensor chip (120) mounted on the printed circuit board (110), a housing (130) mounted on the printed circuit board (110) by metal bonding to seal the image sensor chip (120), a lens barrel (140) coupled to the upper portion of the housing (130) to collect light, a soldering (150) for fixing the housing (130) to the printed circuit board (110), and a camera frame (160) for mounting the printed circuit board (110) and the housing (130) therein.

[0040] The lens barrel (140) is at least one lens and can implement various lenses that can implement a camera.

[0041] The housing (130) has an open top and includes a lens and an IR filter (131) mounted in the internal space, and the lens and the IR filter (131) may be a single optical component assembled into the housing (130).

[0042] The image sensor chip (120) includes a control device that performs active alignment by photographing an inspection chart having a plurality of patterns formed thereon to obtain a chart image, comparing the second center point to determine whether they match, and determining that the optical axis of the lens and the optical axis of the image sensor chip substantially match when the deviation of the second center point falls within a reference range.

[0043] The printed circuit board (110) includes electrode terminals connected to the electrode pads of the image sensor chip (120) by wires outside the area where the image sensor chip (120) is mounted. The electrode pads of the image sensor chip (120) and the electrode terminals of the printed circuit board (110) are bonded by wires.

[0044] On the upper surface of the printed circuit board (110), a plurality of soldering fixing holes (111) are vertically penetrated to the soldering fixing holes (111) at regular intervals.

[0045] As shown in Fig. 3, the printed circuit board (110) is joined by inserting a solder (150) of a certain length into each soldering fixing hole (111).

[0046] The housing (130) has a solder pin (132) of a certain length protruding from one side of the lower surface.

[0047] The solder pin (132) is a member made of metal for mounting the housing (130) to the printed circuit board (110), and is formed with a constant length in the downward direction on one side of the lower end of the housing (130), and the number of solder pins corresponds to the number of soldering (150).

[0048] The solder pin (132) protrudes longer than the lower end of the housing (130).

[0049] The solder ring (150) has a cylindrical flange portion (151), a column portion (152) extending downward from the flange portion (151) and having a diameter smaller than the diameter of the flange portion (151) and having a constant length, and a hole (153) of a constant size is vertically penetrated from the upper surface of the flange portion (151) to the lower surface of the column portion (152).

[0050] As illustrated in FIG. 4, the flange portion (151) may include a first melting portion (151a) formed on the outer side located in the assembly gap (133) and melted by direct contact with the laser, and a second melting portion (151b) formed on the inner side opposite the outer side and melted by transferring heat from the first melting portion (151a).

[0051] Each soldering (150) can be fixed by fitting into each soldering fixing hole (111) of the printed circuit board (110).

[0052] The housing (130) is fixed by inserting the solder pin (132) into the hole (153) of the soldering (150) of the printed circuit board (110).

[0053] As illustrated in FIG. 5, the camera module (100) of the embodiment of the present invention includes a joint portion in which an assembly gap (133), which is a space created on the side of a housing (130) and a printed circuit board (110), is formed when a solder pin (132) is inserted vertically downward into a hole (153) of soldering (150), and a laser is irradiated into the assembly gap (133) to melt the soldering and join the housing and the printed circuit board.

[0054] Soldering (150) is a joining method that uses molten solder with a melting point of less than 450°C to spread the solder across the entire joining interface by utilizing the capillary phenomenon in the assembly gap (133) between two joining metal surfaces without melting the base metal.

[0055] Soldering (150) is a process in which the heat energy of a laser beam is applied to the solder portion in a non-contact manner and the solder is melted due to the absorbed heat energy, thereby forming a joint.

[0056] A key advantage of laser beam soldering (150) is that the laser beam, the heat source, can be precisely aimed at the work target, minimizing heat loss to surrounding components. Furthermore, preheating is not required when working with large components, and rapid heating and cooling enable the creation of precise joint structures with improved mechanical properties.

[0057] Details of the camera module manufacturing device for manufacturing such a camera module (100) will be described in detail later in FIGS. 7 to 10.

[0058] Hereinafter, one embodiment of the present invention will be described with reference to FIG. 7.

[0059] Fig. 7 is a drawing showing the configuration of a camera module manufacturing device according to an embodiment of the present invention.

[0060] A camera module manufacturing device according to an embodiment of the present invention includes a camera module (100) that creates assembly gaps (133) on the left and right sides of a housing (130) and a printed circuit board (110) when each solder pin (132) is inserted vertically downward into a hole (153) of each soldering (150), an active alignment device (200) that performs optical alignment of active alignment (AA) between a lens and an image sensor in the camera module (100), a first laser irradiation device (300) that solders (150) the assembly gap (133) by a laser solder jetting method that sprays a laser onto the soldering (150) from the side of the camera module (100) where the optical alignment of AA is completed, a second laser irradiation device (400), and a control device (500).

[0061] The camera module (100) has one or more solder pins (132) protruding downward at a constant length, and a housing (130) having a lens on the upper side, and when each solder pin (132) is inserted vertically downward into a hole (153) of each soldering (150), an assembly gap (133) can be created on the left and right sides of the housing (130) and the printed circuit board (110), respectively.

[0062] The first laser irradiation device (300) irradiates a laser to the assembly gap (133) formed on the left side of the camera module (100), causing the solder (150) to melt and the housing (130) and the printed circuit board (110) to be joined.

[0063] The second laser irradiation device (400) irradiates a laser to the assembly gap (133) formed on the right side of the camera module (100), causing the solder (150) to melt and the housing (130) and the printed circuit board (110) to be joined.

[0064] The active alignment device (200) includes a height adjustment unit (210), a horizontal adjustment unit (220), and a control device (500).

[0065] The height adjustment unit (210) forms a base body (211) in the shape of a rectangular parallelepiped and includes a stand (212) of a certain height that extends vertically from the base body (211) to a certain length.

[0066] The height adjustment unit (210) is meshed with a second bevel gear (216) in a vertical direction to the first bevel gear (215), and the second bevel gear (216) is coupled to the first rotation shaft (218) of the first driving motor (217).

[0067] The first screw (213) is formed in a straight shape with a constant length, and is formed long in the longitudinal direction so as to penetrate and join the first moving block part (214) of a constant shape.

[0068] The first screw (213) has a screw groove machined along the circumferential direction by a rolling or grinding method.

[0069] The first moving block part (214) forms a nut part (not shown) inside, and the first screw (213) penetrates the center part of the nut part and is coupled thereto.

[0070] The nut portion of the first moving block portion (214) has a through hole formed through the front and rear surfaces so that the first screw (213) can be coupled to the central portion, and a screw thread corresponding to the screw groove formed on the outer surface of the first screw (213) is formed on the inner surface of the through hole.

[0071] The first screw (213) is inserted into the through hole of the nut part of the first moving block part (214) so ​​that the screw groove and the screw thread are screw-connected.

[0072] The first moving block part (214) extends from one side of the front and forms a fixed member (219) of a certain length that fixes the position of the housing (130) of the camera module (100), and forms two first arms (219a) and a second arm (219b) on the left and right sides of the fixed member (219).

[0073] The first arm (219a) and the second arm (219b) mount the lower edge of the housing (130) on the upper surface.

[0074] The first screw (213) rotates according to the driving of the first driving motor (217), and the first moving block part (214), the first arm (219a), and the second arm (219b) can be raised or lowered along the first screw (213).

[0075] The horizontal adjustment part (220) extends forward in the longitudinal direction from the base body (211), forms a first slide rail (221) and a second slide rail (222) spaced apart from each other by a certain distance, and is coupled to the side coupling grooves of the first slide rail (221) and the second slide rail (222) to form a first rail coupling member (223) and a second rail coupling member (224) on the upper portions of the first slide rail (221) and the second slide rail (222).

[0076] A substrate jig (225) on which a printed circuit board (110) is mounted is formed in a portion extending from the upper surface of the first rail coupling member (223) to the upper surface of the second rail coupling member (224).

[0077] The substrate jig (225) is formed in a rectangular shape and has a groove (225a) of a certain size formed on the upper surface so that a printed circuit board (110) can be mounted thereon.

[0078] The substrate jig (225) is connected by a second screw (225b) passing through it in the longitudinal direction, a first gear (226) is connected to one end of the second screw (225b), a second gear (227) is meshed with the first gear (226) in a vertical direction, and the second gear (227) is connected to the second rotation shaft (229) of the second driving motor (228).

[0079] The second screw (225b) is formed in a straight shape with a constant length and is connected by penetrating the substrate jig (225).

[0080] The second screw (225b) has a screw groove machined along the circumferential direction by a rolling or grinding method.

[0081] The substrate jig (225) forms a nut portion (not shown) inside, and a second screw (225b) is coupled by penetrating the center portion of the nut portion.

[0082] The nut portion of the substrate jig (225) has a through hole formed through the front and rear surfaces of the central portion so that a second screw (225b) can be coupled thereto, and a screw thread corresponding to a screw groove formed on the outer surface of the second screw (225b) is formed on the inner surface of the through hole.

[0083] The second screw (225b) is inserted into the through hole of the nut portion of the substrate jig (225) so that the screw groove and the screw thread are screw-connected.

[0084] The second screw (225b) rotates according to the driving of the second driving motor (228), and the substrate jig (225) can reciprocate horizontally along the second screw (225b).

[0085]

[0086] Hereinafter, one embodiment of the present invention will be described with reference to FIG. 8.

[0087] Fig. 8 is a drawing showing the configuration of a laser irradiation device according to an embodiment of the present invention.

[0088] A laser irradiation device according to an embodiment of the present invention includes a first laser irradiation device (300) and a second laser irradiation device (400).

[0089] The first laser irradiation device (300) and the second laser irradiation device (400) are positioned at a certain distance apart from each other on the left and right sides of the camera module (100), and irradiate a laser beam toward the assembly gap (133) between the housing (130) and the printed circuit board (110) to melt and join the flange portion (151) of the soldering (150).

[0090] The first laser irradiation device (300) includes a second laser beam generation unit and a second laser beam irradiation unit.

[0091] Hereinafter, since the first laser irradiation device (300) and the second laser irradiation device (400) are identical components, for the convenience of explanation, the expressions “first” and “second” in the overlapping first laser beam generation unit (310), first laser beam irradiation unit (320), second laser beam generation unit (410), and second laser beam irradiation unit (420) are omitted and are described as laser beam generation unit and laser beam irradiation unit.

[0092] The laser beam generating unit (310, 410) includes a laser diode module (311, 411) that generates a laser beam and a power supply unit (312, 412) for supplying power to the laser diode module (311, 411).

[0093] The laser beam irradiation unit (320, 420) includes a lens assembly (321, 421), a focusing lens (322, 422), and a nozzle unit (323, 423).

[0094] The lens assembly (321, 421) is composed of a plurality of lenses, including a collimation lens that converts a laser beam in the form of a diffuse beam emitted from a laser beam generator (310, 410) into a form of a parallel beam.

[0095] The nozzle section (323, 423) can irradiate the laser beam emitted from the laser beam generating section (310, 410) through the lens assembly (321, 421) and the condenser lens (322, 422) in sequence to the upper housing (130) and the assembly gap (133) of the lower printed circuit board (110) from the side of the camera module (100).

[0096] The laser beam emitted from the laser irradiation device (300, 400) to the solder pin (132) of the housing (130) is focused toward the assembly gap (133) between the housing (130) and the printed circuit board (110) and is accurately irradiated to the flange portion (151) of the soldering (150) to quickly perform the bonding operation.

[0097] When the printed circuit board (110) is mounted vertically downward in the groove of the circuit board jig (225), the nozzle portion (323, 423) is positioned to aim the focus of the laser beam at the flange portion (151) toward the assembly gap (133) between the housing (130) and the printed circuit board (110).

[0098] The lens and image sensor chip (120) constituting the camera module (100) are arranged vertically. More specifically, the upper surface of the first arm (219a) and the upper surface of the second arm (219b) are placed on the edge of the lower surface of the housing (130), and the printed circuit board (110) to which the solder ring (150) is coupled is placed on the groove (225a) of the board jig (225).

[0099]

[0100] Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 9 and 10.

[0101] FIG. 9 is a drawing showing the relationship between a control device according to an embodiment of the present invention and a peripheral device connected thereto, and FIG. 10 is a block diagram briefly showing the internal configuration of a control device according to an embodiment of the present invention.

[0102] A control device (500) according to an embodiment of the present invention includes an active alignment control unit (531) and a laser device control unit (532).

[0103] The communication unit (510) can be electrically connected to the image sensor chip (120), the first driving motor (217), the second driving motor (228), the first laser irradiation device (300), and the second laser irradiation device (400) to provide a communication interface to transmit and receive data communication.

[0104] The active alignment control unit (234) generates a driving signal and transmits it to the first driving motor (217), and controls the first arm (219a) and the second arm (219b) coupled to the first moving block unit (214) to descend by rotating the first screw (213) according to the driving of the first driving motor (217).

[0105] The solder pin (132) of the housing (130) mounted on the first arm (219a) and the second arm (219b) is inserted vertically downward into the hole (153) of the soldering (150) of the printed circuit board (110).

[0106] An inspection chart (not shown) is placed on the upper part of the lens, and the inspection chart forms a pattern for a spatial frequency response (SFR) inspection at the center and each corner. Here, the SFR inspection analyzes the frequency component of the edge part of the pattern and determines the resolution based on the size of the high-frequency component value. Since this SFR inspection is a method that is generally and widely used to inspect the resolution of a camera module (100), a detailed description of this inspection method is omitted.

[0107] The image sensor chip (120) captures an inspection chart on which a plurality of patterns are formed to obtain a chart image.

[0108] The active alignment control unit (531) performs the function of aligning the X, Y, and R axes relative positions of the lens and the image sensor chip (120).

[0109] The active alignment control unit (531) receives a second chart image of an inspection chart from an image sensor chip (120) through a communication unit (510), stores it in a storage unit (520), extracts the second center point of the second chart image and the first center point of the first chart image of a preset inspection chart located above the lens, and compares the second center point with the first center point to determine whether they match.

[0110] The active alignment control unit (531) generates a driving signal and transmits it to the first driving motor (217), and controls the first arm (219a) and the second arm (219b) coupled to the first moving block unit (214) to rise and fall by rotating the first screw (213) according to the driving of the first driving motor (217).

[0111] Accordingly, the active alignment control unit (531) extracts the second center point of the second chart image and the first center point of the first chart image of the preset inspection chart located on the upper part of the lens, compares the second center point with the first center point, periodically determines whether they match, and aligns the X, Y, and R axis positions of the image sensor chip (120) so that the second center point and the first center point match.

[0112] The active alignment control unit (531) determines that the optical axis of the lens and the optical axis of the image sensor substantially coincide when the deviation between the first center point and the second center point falls within the reference range, and performs active alignment of the optical axis of the lens and the optical axis of the image sensor chip (120). The present invention is not limited thereto, and the active alignment control unit (531) may also perform active alignment by driving the second driving motor (228) to move the substrate jig (225) in the horizontal direction.

[0113] After performing active alignment, the laser device control unit (532) generates a power drive signal and transmits it to the second laser beam generating unit (410), and the laser is irradiated into the assembly gap (133) formed on the left side of the camera module (100) so that the soldering (150) melts and the housing (130) and the printed circuit board (110) are joined, and the laser is irradiated into the assembly gap (133) formed on the right side of the camera module (100) so that the soldering (150) melts and the housing (130) and the printed circuit board (110) are joined.

[0114] The camera module (100) can be easily and quickly assembled with a lens module and a substrate by melting solder (150) by irradiating a laser from the side of the camera module (100) to join the housing (130) and the printed circuit board (110), thereby simplifying the process, stabilizing quality, and shortening the time, thereby reducing errors in optical alignment (focusing).

[0115]

[0116] Hereinafter, embodiments of the camera module and camera module manufacturing device of the present invention have been described. The technical features disclosed in each embodiment of the present invention are not limited to that embodiment, and, unless mutually incompatible, the technical features disclosed in each embodiment may be combined and applied to other embodiments.

[0117] Therefore, although each embodiment focuses on its own technical features, each technical feature can be applied in combination with each other as long as they are not mutually incompatible.

[0118] The present invention is not limited to the above-described embodiments and the attached drawings, and various modifications and variations are possible within the scope of those skilled in the art. Therefore, the scope of the present invention should be defined not only by the claims of this specification but also by equivalents thereof.

Claims

1. A printed circuit board in which one or more soldering fixing holes are formed at regular intervals and solder of a certain length is inserted and connected to each of the soldering fixing holes; An image sensor chip mounted on the above printed circuit board; A housing having one or more solder pins that are bonded to the upper surface of the printed circuit board and protrude downward by a certain length; When inserted into the above soldering hole, the assembly gap, which is the space created on the side; and A joint where the solder is melted by irradiating the laser into the assembly gap and the housing and the printed circuit board are joined A camera module including:

2. In paragraph 1, The above soldering forms a cylindrical flange portion, a column portion extending downward from the flange portion and having a diameter smaller than the diameter of the flange portion and having a constant length, and a hole of a constant size is vertically penetrated from the upper surface of the flange portion to the lower surface of the column portion. The flange portion is formed on the outer side located in the assembly gap and is melted by direct contact with the laser, and the second melt portion is formed on the inner side opposite the outer side and is melted by transferring heat from the first melt portion. A camera module including:

3. A printed circuit board having one or more soldering fixing holes formed at regular intervals and having soldering of a fixed length inserted into each of the soldering fixing holes, an image sensor chip mounted on the printed circuit board and detecting light as an electrical signal, and a camera module in which each of the solder pins is vertically inserted into each of the soldering holes, thereby creating assembly gaps on the left and right sides of the housing and the printed circuit board, respectively; A first laser irradiation device that irradiates a laser into an assembly gap formed on the left side of the camera module to melt the solder and join the housing and the printed circuit board; and A second laser irradiation device that irradiates a laser into an assembly gap formed on the right side of the camera module to melt the solder and join the housing and the printed circuit board. A camera module manufacturing device including:

4. In paragraph 3 The image sensor chip is a control device that performs active alignment by photographing an inspection chart having a plurality of patterns formed thereon arranged on the upper portion of the lens to obtain a chart image, receiving a second chart image obtained by photographing the inspection chart from the image sensor chip, comparing the second center point of the received second chart image with the second center point to determine whether they match, and determining that the optical axis of the lens and the optical axis of the image sensor chip substantially match when the deviation of the second center point falls within a reference range. A camera module manufacturing device further comprising:

5. In paragraph 4, The above control device generates a power drive signal and irradiates it into the assembly gap formed on the left side of the camera module, and the second laser irradiation device irradiates the laser into the assembly gap formed on the right side of the camera module. Camera module manufacturing equipment.

6. In paragraph 3, The above soldering forms a cylindrical flange portion and a pillar portion of a fixed length with a diameter smaller than the diameter of the flange portion, and a hole of a fixed size is vertically penetrated from the upper surface to the lower surface of the pillar portion. The flange portion is formed on the outer side located in the assembly gap and is melted by direct contact with the laser, and the second melt portion is formed on the inner side opposite the outer side and is melted by transferring heat from the first melt portion. A camera module manufacturing device including:

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