Organic light-emitting display device

Abstract

This organic light-emitting display device may comprise: a plurality of anode electrodes in a plurality of subpixels; a plurality of organic light-emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light-emitting layers; a plurality of first banks between the plurality of subpixels in a second direction crossing a first direction; a plurality of first power wires under the plurality of first banks in the first direction; a plurality of connection structures arranged in a plurality of first recesses of some of the plurality of first banks; and a plurality of undercut structures under some of the first banks in contact with the plurality of first recesses. The organic light-emitting layers and the cathode electrodes are arranged to cross over some of the first banks, and the connection structures can electrically connect the cathode electrodes to the first power wires in the undercut structures.

Description

organic light emitting display device

[0001] The embodiment relates to an organic light emitting display device.

[0002] As demand for portable information media grows, efforts are expanding to apply organic light-emitting diode (OLED) displays to a variety of lightweight and thin information electronic devices. Recently, OLED displays are increasingly being applied to product groups such as mobile PCs and automobiles, rather than TVs or mobile phones. Because OLED displays used in mobile PCs and automobiles display still images for extended periods of time, long lifespan is essential. To achieve long lifespan, light extraction from the OLEDs in the OLED display must be maximized. Furthermore, to reduce costs, technology must be expanded to enable the production of OLEDs on substrates of not only 8.5th-generation (2200 x 2500 mm) but also 10.5th-generation (3370 x 2940 mm). To produce long-lasting OLEDs, each subpixel must have a top-emitting structure and a side-by-side structure, with at least two stacks of OLEDs.

[0003] The structure of these organic light-emitting devices can be obtained through deposition equipment using a fine metal mask (FMM, hereinafter referred to as FMM). However, the deposition method using FMM has the problem of low productivity because the production logistics must be produced only in a cluster manner rather than an inline method. In addition, there is a problem of low pixel position accuracy (PPA) at the subpixel level between the FMM and the substrate. Accordingly, the emission area ratio (EAR) is small, which limits the product lifespan. Here, EAR is the value obtained by dividing the emission area of ​​a subpixel by the total area of ​​the subpixel.

[0004] Therefore, it is very urgent to develop an organic light-emitting display device having a new deposition method and a new organic light-emitting element structure using the new deposition method to solve the aforementioned problems.

[0005] The present invention aims to solve the above-mentioned and other problems.

[0006] Another object of the embodiment is to provide an organic light emitting display device having a novel structure.

[0007] Another object of the present invention is to provide an organic light emitting display device capable of improving lifespan.

[0008] Another object of the present invention is to provide an organic light-emitting display device capable of improving productivity and yield.

[0009] Another object of the present invention is to provide an organic light-emitting display device capable of improving image quality.

[0010] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0011] According to one aspect of the embodiment to achieve the above or other objects, an organic light-emitting display device includes: a plurality of subpixels having different colors along a first direction and having the same color along a second direction crossing the first direction; a plurality of anode electrodes on the plurality of subpixels; a plurality of organic light-emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light-emitting layers; a plurality of first banks between the plurality of subpixels in the second direction; a plurality of first power wires along the first direction below the plurality of first banks; and a plurality of connection structures arranged in a plurality of first grooves of some of the first banks; and a plurality of undercut structures on lower sides of some of the first banks in contact with the plurality of first grooves; wherein the organic light-emitting layers and the cathode electrodes are arranged across the some of the first banks, and the connection structures electrically connect the cathode electrodes to the first power wires in the undercut structures.

[0012] The organic light emitting display device further includes an intermediate insulating layer under the bank, and the undercut structure can be formed such that a side of the interlayer insulating layer in contact with the first groove is inserted from the inner side of the first bank toward the outer side.

[0013] The above connection structure includes an auxiliary electrode extending from the first power wire, and the organic light-emitting layer is disconnected by the undercut structure so that a portion of the auxiliary electrode is exposed, and the cathode electrode can contact a portion of the exposed auxiliary electrode in the undercut structure.

[0014] The organic light-emitting display device may include a plurality of inorganic insulating layers on the plurality of cathode electrodes; a plurality of second banks having second grooves arranged long along the second direction between the plurality of subpixels in the first direction; and a plurality of waterproof structures on each of the plurality of second banks.

[0015] The above plurality of waterproof structures may include a first waterproof structure on the second bank; a second waterproof structure on the first side of the second groove of the second bank; and a third waterproof structure on the second side of the second groove of the second bank.

[0016] The above first waterproof structure may be configured such that at least two or more inorganic insulating layers among the plurality of inorganic insulating layers are overlapped on the second bank.

[0017] The second waterproof structure is configured such that one of the plurality of inorganic insulating layers is formed in a curved shape by a first undercut structure, and the third waterproof structure is configured such that another of the plurality of inorganic insulating layers is formed in a curved shape by a second undercut structure, and the first undercut structure and the second undercut structure can be formed on the lower side of the second bank in contact with the second groove of the second bank.

[0018] The above waterproof structure can surround at least one subpixel among a plurality of subpixels in the second direction.

[0019] The organic light-emitting display device further includes a plurality of second power wires along the second direction in the plurality of second grooves of the plurality of second banks, and the at least two or more inorganic insulating layers can be disposed on the second power wires.

[0020] The above plurality of undercut structures may be positioned differently from each other in the above plurality of first grooves.

[0021] The cathode electrode may include a first conductive layer; and a second conductive layer on the first conductive layer.

[0022] The organic light-emitting display device further includes a blocking structure in an edge region of at least one bank among the first bank and the second bank, and a hole injection layer or a charge generation layer of the organic light-emitting layer can be disconnected by the blocking structure.

[0023] The organic light-emitting display device may further include a plurality of dummy subpixels having a stripe shape along the first direction in a non-display area; and a plurality of waterproof structures between the plurality of dummy subpixels in the second direction.

[0024] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0025] According to at least one of the embodiments, the process may be simplified and the process cost may be reduced by eliminating the need to use FMM.

[0026] According to at least one of the embodiments, the EAR within a subpixel may be increased without the need for FMM, thereby improving the lifetime.

[0027] According to at least one of the embodiments, an organic light-emitting device can be deposited on a large-area substrate in an inline deposition system, thereby improving productivity, yield, and material utilization efficiency.

[0028] According to at least one of the embodiments, as illustrated in FIGS. 1 and 2, a connection structure (130) may be arranged in a first groove (131-1) of a plurality of first banks (111-1) between a plurality of subpixels (SPr, SPg, SPb) having the same color along the second direction (Y). Accordingly, electrical connection between the cathode electrodes (123r, 123g) of the plurality of subpixels (SPr, SPg, SPb) and the first power wire (PL1) is facilitated, and a short circuit defect is prevented, so that a malfunction or a light emission defect of the subpixels (SPr, SPg, SPb) is prevented, thereby improving reliability.

[0029] According to at least one of the embodiments, as illustrated in FIGS. 1 to 4, a plurality of waterproof structures (143 to 145) may be arranged in each of a plurality of first banks (111-1) and / or a plurality of second banks (111-2). Accordingly, moisture, oxygen, etc. penetrating along the second direction (Y) may not penetrate into the plurality of subpixels (SPr, SPg, SPb), thereby preventing malfunctions in operation or light emission of the subpixels (SPr, SPg, SPb), thereby improving reliability.

[0030] According to at least one of the embodiments, as illustrated in FIGS. 2 and 3, the hole injection layer, charge generation layer, etc. of each of the plurality of subpixels (SPr, SPg, SPb) are disconnected by the blocking structure (134-1, 134-2), so that leakage current flowing to the hole injection layer, charge generation layer, etc. is blocked, thereby preventing poor image quality.

[0031] According to at least one of the embodiments, in a plurality of connection structures (130) on a plurality of row lines along the second direction (Y), as illustrated in FIGS. 7 to 9, a plurality of undercut structures (138) may be formed to be positioned differently from each other in a plurality of first banks (111-1) and / or a first groove (104, 131-1) of an interlayer insulating layer (103). Accordingly, cathode electrodes may be formed on a plurality of auxiliary electrodes (132) through a plurality of undercut structures (138) formed at different positions from each other.

[0032] As illustrated in FIGS. 7 to 9, four connection structures (130) may be provided through undercuts (138) formed at different locations. Among the four sides of the first groove (104, 131-1), the undercut structures (138) may be formed on two sides, and the undercut structures (138) may not be formed on the remaining two sides.

[0033] The organic light-emitting material evaporated in a certain direction and at a certain angle in the deposition device may not be deposited in some areas of the auxiliary electrode (132) due to the shadow effect in the undercut structure (138), so that the said some areas may be exposed. Thereafter, when the green cathode electrode material is deposited, the green cathode electrode material may be continuously and without interruption in the area where the undercut structure (138) is not formed, and may contact the auxiliary electrode (132) through the exposed some areas.

[0034] Depending on the direction of progression of the substrate (110) during deposition and the angle and position of the evaporation source, at least one of the four connection structures (130) is electrically connected to the green cathode electrode (123g) and the auxiliary electrode (132) of the connection structure (130), thereby increasing reliability.

[0035] Therefore, electrical connection failure between the cathode electrode and the first power wire (PL1) through the connection structure (130) can be prevented, thereby preventing light emission failure or operation failure, thereby improving reliability.

[0036] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0037] FIG. 1 is a schematic plan view of an organic light-emitting display device according to a first embodiment.

[0038] FIG. 2 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0039] Fig. 3 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0040] Fig. 4 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0041] FIGS. 5A to 5K illustrate a manufacturing process of an organic light-emitting display device along line A-A' of FIG. 1.

[0042] FIGS. 6A to 6K illustrate a manufacturing process of an organic light-emitting display device along line D-D' of FIG. 1.

[0043] Figure 7 illustrates how the grooves of the photosensitive pattern are positioned differently with respect to the grooves of the interlayer insulating layer along the second direction (Y).

[0044] Figure 8 shows the arrangement position relationship of the grooves of the interlayer insulating layer and the grooves of the photosensitive pattern.

[0045] Figure 9 illustrates a photosensitive pattern groove arranged on different sides of the groove of the interlayer insulating layer.

[0046] Fig. 10 is a cross-sectional view illustrating an organic light-emitting display device according to the fourth embodiment.

[0047] Fig. 11 illustrates a waterproof structure according to the first embodiment.

[0048] Fig. 12 illustrates a waterproof structure according to the second embodiment.

[0049] Fig. 13 illustrates a waterproof structure according to the third embodiment.

[0050] Fig. 14 is a plan view schematically illustrating an organic light-emitting display device according to a second embodiment.

[0051] Fig. 15 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0052] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0053] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0054] Hereinafter, an organic light-emitting display device having a side-by-side structure manufactured using a photolithography process is disclosed. This structure is referred to as a side-by-side structure by photolithography (Ph-SbS). By using a photolithography process, the use of an FMM is eliminated, simplifying the process and reducing the process cost. In addition, the EAR within a subpixel is increased, thereby improving the lifespan. In addition, since an organic light-emitting element is deposited on a large-area substrate in an inline deposition system, productivity, yield, and material utilization efficiency can be improved.

[0055] Hereinafter, the red subpixel may be referred to as the first subpixel, the green subpixel may be referred to as the second subpixel, and the blue subpixel may be referred to as the third subpixel. In addition, the red organic light-emitting element may be referred to as the first organic light-emitting element, the green organic light-emitting element may be referred to as the second organic light-emitting element, and the blue organic light-emitting element may be referred to as the third organic light-emitting element.

[0056] Hereinafter, the organic light-emitting display device is a top-emitting type that displays an image by emitting light in the upper direction of the substrate, but a bottom-emitting type that displays an image by emitting light in the lower direction of the substrate may also be included in the technical concept of the present invention.

[0057] FIG. 1 is a plan view schematically illustrating an organic light-emitting display device according to a first embodiment.

[0058] As illustrated in FIG. 1, the organic light-emitting display device according to the first embodiment may include a plurality of pixels (P) arranged in a matrix. The plurality of pixels (P) may be arranged in a display area (AA). An area other than the display area (AA) may be defined as a non-display area (NAA).

[0059] The plurality of pixels (P) may include, for example, a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), a plurality of blue subpixels (SPb), etc. The plurality of subpixels (SPr, SPg, SPb) may have different colors along a first direction (X) and may have the same color along a second direction (Y) intersecting the first direction (X), but this is not limited thereto. That is, the plurality of subpixels (SPr, SPg, SPb) may have the same color along the second direction (Y) and may have a long stripe pattern.

[0060] As will be explained later, the organic light-emitting layer and the cathode electrode of each of the plurality of organic light-emitting elements (120r, 120g, 120b) may have a stripe pattern having the same color and being arranged elongated along the second direction (Y). For example, a plurality of red subpixels (SPr) emitting red light may be arranged in a stripe shape along the second direction (Y). For example, a plurality of green subpixels (SPg) emitting green light may be arranged in a stripe shape along the second direction (Y). For example, a plurality of blue subpixels (SPb) emitting blue light may be arranged in a stripe shape along the second direction (Y).

[0061] A side-by-side organic light-emitting display device can be implemented by alternately arranging red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) in units of columns along a first direction (X). For example, the red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) can be alternately arranged in the order of the first direction (X), but this is not limited thereto.

[0062] For example, a red organic light-emitting element (120r) may be placed in a red subpixel (SPr), a green organic light-emitting element (120g) may be placed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be placed in a blue subpixel (SPb).

[0063] For example, the light emission efficiency of the blue organic light emitting element (120b) in the blue subpixel (SPb) may be lower than the light emission efficiency of the red organic light emitting element (120r) in the red subpixel (SPr) or the green organic light emitting element (120g) in the green subpixel (SPg). In this case, by designing the area of ​​the blue subpixel (SPb) to be larger than the area of ​​the red subpixel (SPr) or the area of ​​the green subpixel (SPg), the light emission efficiency among the plurality of subpixels (SPr, SPg, SPb) can be made uniform, thereby improving the image quality.

[0064] Each of the plurality of subpixels (SPr, SPg, SPb) may include an emitting area (EA) and a non-emitting area (NEA). The emitting area (EA) is an area where the organic light-emitting elements (120r, 120g, 120b) are arranged, and the non-emitting area (NEA) may be defined as an area excluding the emitting area (EA).

[0065] The red organic light-emitting device (120r), the green organic light-emitting device (120g), and the blue organic light-emitting device (120b) may each include an anode electrode, an organic light-emitting layer, a cathode electrode, etc. The organic light-emitting layer may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, a charge generation layer, etc. The red organic light-emitting device (120r), the green organic light-emitting device (120g), and the blue organic light-emitting device (120b) may each include at least two stack structures. Each stack structure may include an organic light-emitting layer that emits light.

[0066] The organic light-emitting layer and the cathode electrode may be disposed only in each of the plurality of subpixels (SPr, SPg, SPb) along the first direction (X). That is, the organic light-emitting layer and the cathode electrode may not be disposed continuously along the first direction (X) but may be separated from each other. Alternatively, as described above, the organic light-emitting layer and the cathode electrode of each of the plurality of organic light-emitting elements (120r, 120g, 120b) may have a stripe pattern having the same color and being disposed long along the second direction (Y). That is, the organic light-emitting layer and the cathode electrode may be disposed across the plurality of subpixels (SPr, SPg, SPb) along the second direction (Y). That is, the organic light-emitting layer and the cathode electrode may be disposed so as to extend not only across the plurality of subpixels (SPr, SPg, SPb) but also between the plurality of subpixels (SPr, SPg, SPb) along the second direction (Y).

[0067] Although not shown, the organic light-emitting layer and the cathode electrode may be separated into at least two subpixel units or two or more row-line units along the second direction (Y).

[0068] The anode electrode may be disposed only within the plurality of subpixels (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). That is, the anode electrode may not be disposed between the plurality of subpixels (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). Accordingly, the light-emitting areas (EA) of each of the plurality of subpixels (SPr, SPg, SPb) may be distinguished by the anode electrodes individually provided in the plurality of subpixels (SPr, SPg, SPb).

[0069] Meanwhile, a plurality of power lines (PL1 to PL3) may be provided to supply power to a plurality of subpixels (SPr, SPg, SPb). The power terminal (101) may be electrically connected to the third power line (PL3) and may receive a first potential voltage from a power supply unit (not shown).

[0070] A plurality of power wires (PL1 to PL3) may be arranged in a non-display area (NAA) and a display area (AA). The first and second power wires (PL1, PL2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the display area (AA) and may be electrically connected to the plurality of subpixels (SPr, SPg, SPb). The first and second power wires (PL1, PL2) may be electrically connected to a plurality of cathode electrodes of a plurality of organic light-emitting elements (120r, 120g, 120b) provided in the plurality of subpixels (SPr, SPg, SPb).

[0071] A plurality of first power wires (PL1) and a plurality of second power wires (PL2) may intersect and be connected to each other. The plurality of first power wires (PL1) and the plurality of second power wires (PL2) may have a matrix structure.

[0072] The third power wire (PL3) is positioned in the non-display area (NAA) and can be electrically connected to, for example, a plurality of second power wires (PL2).

[0073] Although not shown, another power line may be provided to supply a second potential voltage greater than the first potential voltage. Another power line may be electrically connected to the driving transistor of each subpixel (SPr, SPg, SPb), but is not limited thereto.

[0074] Each of the plurality of subpixels (SPr, SPg, SPb) may include a driving circuit including a driving transistor, etc.

[0075] When a specific subpixel is selected by a scan transistor responding to a scan signal, light having a brightness corresponding to a current flowing in the driving transistor can be emitted from the specific subpixel using the first potential voltage of the first and second power wires (PL1, PL2) and the second potential voltage of another power wire.

[0076] Meanwhile, a plurality of connection structures (130), a plurality of waterproof structures, a plurality of blocking structures, etc. may be arranged between a plurality of subpixels (SPr, SPg, SPb).

[0077] A plurality of connection structures (130) can be arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y).

[0078] The connection structure (130) can electrically connect a second power wire (PL2) arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) to a plurality of cathode electrodes of a plurality of organic light-emitting elements (120r, 120g, 120b) of a plurality of subpixels (SPr, SPg, SPb).

[0079] A plurality of blocking structures may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X) and / or the second direction (Y).

[0080] The blocking structure may be a structure that separates layers including low-resistance organic light-emitting materials of each organic light-emitting element (120r, 120g, 120b), such as a hole injection layer and a charge generation layer, to prevent electrical shorts between the anode electrode and the cathode electrode and reduce leakage current between sub-pixels.

[0081] As will be explained later, lateral leakage current or longitudinal leakage current between a plurality of subpixels (SPr, SPg, SPb) can be prevented by the blocking structure. The lateral leakage current may be a leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along a first direction (X), and the longitudinal leakage current may be a leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along a second direction (Y). In addition, an electrical short between an anode electrode and a cathode electrode in the corresponding subpixels (SPr, SPg, SPb) can be prevented by the blocking structure. Therefore, by using the blocking structure, color spotting caused by leakage current can be improved and luminous efficiency and brightness can be significantly improved.

[0082] A plurality of waterproof structures may be arranged in the non-display area (NAA) and the display area (AA). For example, the plurality of waterproof structures may be arranged between the plurality of subpixels (SPr, SPg, SPb) in the first direction (X) and / or the second direction (Y) in the non-display area (NAA) and the display area (AA). The plurality of waterproof structures may be arranged in the non-emission area (NEA) of each of the plurality of subpixels (SPr, SPg, SPb) in the first direction (X) and / or the second direction (Y).

[0083] Meanwhile, organic light-emitting layers, etc. are vulnerable to moisture, oxygen, etc., and if the organic light-emitting layers, etc. are damaged by moisture, oxygen, etc., the corresponding subpixels (SPr, SPg, SPb) may not operate, resulting in light-emitting defects. If many subpixels (SPr, SPg, SPb) do not operate due to moisture, oxygen, etc., display defects such as point light-emitting defects or area light-emitting defects may occur, which may lower product reliability.

[0084] However, a plurality of waterproof structures such as the embodiment can prevent moisture, oxygen, etc. from penetrating into the non-display area (NAA) or the display area (AA), thereby preventing malfunctions or light emission failures of the plurality of subpixels (SPr, SPg, SPb). Accordingly, the organic light-emitting layer of each subpixel (SPr, SPg, SPb) is not affected by moisture, oxygen, etc., so reliability can be dramatically improved.

[0085] Fig. 2 is a cross-sectional view illustrating an organic light-emitting display device according to a first embodiment. Fig. 3 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment. Fig. 4 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment. Figs. 2 to 4 are cross-sectional views taken along lines A-A', B-B', and C-C' of Fig. 1, respectively.

[0086] Referring to FIGS. 1 to 4, an organic light-emitting display device according to an embodiment may include a plurality of banks (111-1, 111-2), a plurality of power wires (PL1 to PL3), a plurality of organic light-emitting elements (120r, 120g), a plurality of connection structures (130), etc.

[0087] A plurality of banks (111-1, 111-2), a plurality of power wires (PL1 to PL3), a plurality of organic light-emitting elements (120r, 120g) and a plurality of connection structures (130) can be arranged on a substrate (110).

[0088] An interlayer insulating layer (103) is disposed on a substrate (110), and a plurality of banks (111-1, 111-2), a plurality of organic light-emitting elements (120r, 120g), and a plurality of connection structures (130) can be disposed on the interlayer insulating layer (103).

[0089] A plurality of driving circuits may be formed on the substrate (110). The plurality of driving circuits may be provided in each of the plurality of subpixels (SPr, SPg, SPb). The plurality of driving circuits may include a plurality of transistors, at least one capacitor, etc. The plurality of transistors may include a scan transistor, a driving transistor, a sensing transistor, etc.

[0090] The interlayer insulating layer (103) may be placed on a plurality of driving circuits. The interlayer insulating layer (103) may be a planarizing layer having a flat upper surface.

[0091] Meanwhile, a plurality of power wires (PL1 to PL3) may be arranged on the substrate (110). The plurality of power wires may include a plurality of first power wires (PL1), a plurality of second power wires (PL2), a third power wire (PL3), etc.

[0092] The third power wire (PL3) can be electrically connected to the power terminal (101). The first power wire (PL1) and the second power wire (PL2) can electrically connect the third power wire (PL3) to a plurality of subpixels (SPr, SPg, SPb) on the display area (AA).

[0093] The third power wiring (PL3) is arranged on a different layer from the first and second power wirings (PL1, PL2), and the first and second power wirings (PL1, PL2) may be arranged on the same layer, but this is not limited thereto.

[0094] The first and second power lines (PL1, PL2) may be electrically connected to a third power line (PL3) using a contact pad. For example, the second power line (PL2) may be arranged to extend from the display area (AA) to the non-display area (NAA), and may be electrically connected to the third power line (PL3) using a contact pad in the non-display area (NAA). The contact pad may be arranged in the non-display area (NAA), but is not limited thereto.

[0095] For example, the first and second power wires (PL1, PL2) can be formed together with the source electrode and the drain electrode of the driving transistor. That is, the source electrode and the drain electrode of the driving transistor and the first and second power wires (PL1, PL2) can be formed on the same layer using the same material using the same process.

[0096] For example, the third power wire (PL3) can be formed together with the cathode electrode. That is, the cathode electrode and the third power wire (PL3) can be formed on the same layer using the same material using the same process.

[0097] Meanwhile, a plurality of first power wires (PL1) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y), and a plurality of second power wires (PL2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). The plurality of first power wires (PL1) may be arranged long along the first direction (X) between the plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). The plurality of second power wires (PL2) may be arranged long along the second direction (Y) between the plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0098] The plurality of banks may include a plurality of first banks (111-1) and a plurality of second banks (111-2). The first banks (111-1) and the second banks (111-2) may intersect and be connected to each other. The plurality of first banks (111-1) and the plurality of second banks (111-2) may have a matrix structure.

[0099] A plurality of first banks (111-1) may be arranged to correspond to a plurality of first power wires (PL1), and a plurality of second banks (111-2) may be arranged to correspond to a plurality of second power wires (PL2). That is, a plurality of first banks (111-1) may be arranged on a plurality of first power wires (PL1), and a plurality of second banks (111-2) may be arranged on a plurality of second power wires (PL2).

[0100] A plurality of first banks (111-1) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in a second direction (Y), and a plurality of second banks (111-2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in a first direction (X). The plurality of first banks (111-1) may be arranged long along the first direction (X) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). The plurality of second banks (111-2) may be arranged long along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0101] Each of the multiple subpixels (SPr, SPg, SPb) may include an emitting area (EA) and a non-emitting area (NEA).

[0102] For example, the light-emitting area (EA) may be separated by a first bank (111-1) and a second bank (111-2). The light-emitting area (EA) may be surrounded by the first bank (111-1) and the second bank (111-2).

[0103] As another example, the light emitting area (EA) can be separated by an anode electrode (121r, 121g) individually provided in each of the subpixels (SPr, SPg, SPb).

[0104] As another example, the light emitting area (EA) can be defined by the organic light emitting layers (122r, 122g) exposed by the first bank (111-1) and the second bank (111-2).

[0105] Meanwhile, the areas corresponding to each of the first and second banks (111-1, 111-2) may be defined as non-emissive areas (NEAs). In this case, the first and second banks (111-1, 111-2) may be shared by adjacent subpixels. That is, a portion of the first and second banks (111-1, 111-2) may be included in one subpixel, and another portion of the first and second banks (111-1, 111-2) may be included in another subpixel adjacent to one subpixel.

[0106] A plurality of organic light-emitting elements (120r, 120g) may be arranged in a plurality of subpixels (SPr, SPg, SPb). The plurality of organic light-emitting elements (120r, 120g) may include a plurality of anode electrodes (121r, 121g), a plurality of organic light-emitting layers (122r, 122g), and a plurality of cathode electrodes (123r, 123g).

[0107] The anode electrodes (121r, 121g) may be disposed only in each subpixel (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). The red anode electrode (121r) may be disposed only in a plurality of red subpixels (SPr) along the second direction (Y), and the green anode electrode (121g) may be disposed only in a plurality of green subpixels (SPg) along the second direction (Y). Although not shown, the blue anode electrode may be disposed only in a plurality of blue subpixels (SPb) along the second direction (Y).

[0108] The organic light-emitting layers (122r, 122g) may be separated from each other along the first direction (X) but may be arranged along the second direction (Y). The red organic light-emitting layer (122r) may be arranged in a plurality of red subpixels (SPr) as well as a plurality of first banks (111-1) along the second direction (Y). The green organic light-emitting layer (122g) may be arranged in a plurality of green subpixels (SPg) as well as a plurality of first banks (111-1) along the second direction (Y). The blue organic light-emitting layer (not shown) may be arranged in a plurality of subpixels (SPr, SPg, SPb) as well as a plurality of first banks (111-1) along the second direction (Y). The red organic light-emitting layer (122r), the green organic light-emitting layer (122g), and the blue organic light-emitting layer may be referred to as a first organic light-emitting layer, a second organic light-emitting layer, and a third organic light-emitting layer, respectively.

[0109] The cathode electrodes (123r, 123g) may be separated from each other along the first direction (X) but may be arranged along the second direction (Y). The red cathode electrode (123r) may be arranged in a plurality of first banks (111-1) as well as a plurality of subpixels (SPr, SPg, SPb) along the second direction (Y). The green cathode electrode (123g) may be arranged in a plurality of first banks (111-1) as well as a plurality of green subpixels (SPg) along the second direction (Y). Although not shown, the blue cathode electrode may be arranged in a plurality of first banks (111-1) as well as a plurality of subpixels (SPr, SPg, SPb) along the second direction (Y). The red cathode electrode (123r), the green cathode electrode (123g), and the blue cathode electrode may be referred to as the first cathode electrode, the second cathode electrode, and the third cathode electrode, respectively.

[0110] A plurality of connection structures (130) may be arranged in a plurality of first banks (111-1). Although the drawing illustrates that the connection structures (130) are arranged in all of the plurality of first banks (111-1), they may not be arranged in all of the plurality of first banks (111-1). That is, the connection structures (130) may be arranged in some of the first banks (111-1) among the plurality of first banks (111-1).

[0111] A plurality of first banks (111-1) may have a plurality of first grooves (131-1). The first grooves (131-1) may be locally formed only in a portion of the first bank (111-1) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). That is, the first grooves (131-1) may have a dot shape. The first grooves (131-1) may have a circular or rectangular shape when viewed from above, but are not limited thereto. The first grooves (131-1) may be formed by penetrating from the upper surface to the lower surface of the first bank (111-1), but are not limited thereto.

[0112] As illustrated in FIG. 2, the connection structure (130) can be placed in the first groove (131-1) of the first bank (111-1). The connection structure (130) can electrically connect the green cathode electrode (123g) to the first power wire (PL1) in the first groove (131-1) of the first bank (111-1).

[0113] The green organic light-emitting layer (122g) and the green cathode electrode (123g) may be arranged across the first bank (111-1) along the second direction (Y). In this case, the green organic light-emitting layer (122g) and the green cathode electrode (123g) may be separated from the first groove (131-1) of the first bank (111-1), respectively. That is, the green organic light-emitting layer (122g) on ​​the upper side of the first bank (111-1) and the green organic light-emitting layer (122g) in the first groove (131-1) may be separated from each other. The green cathode electrode (123g) on ​​the upper side of the first bank (111-1) and the green cathode electrode (123g) in the first groove (131-1) may be separated from each other. In this case, the green cathode electrode (123g) can be electrically connected to the connection structure (130) through the green organic light-emitting layer (122g) separated from the first groove (131-1).

[0114] Although not shown, the red cathode electrode (123r) and the blue cathode electrode may each be electrically connected to the connection structure (130) in the first groove (131-1).

[0115] The undercut structure (138) may be formed on the lower side of the first bank (111-1) that contacts the first groove (131-1). For example, the undercut structure (138) may be formed such that the side of the interlayer insulating layer (103) that contacts the first groove (131-1) extends from the inner side of the first bank (111-1) toward the outer side.

[0116] The connection structure (130) may include an auxiliary electrode (132) extending from a first power wire (PL1). Among the first power wires (PL1) arranged lengthwise along the first direction (X), a first power wire (PL1) corresponding to a first groove (131-1) of a first bank (111-1) may be formed as an auxiliary electrode (132). Accordingly, the auxiliary electrode (132) may be a part of the first power wire (PL1). The width of the auxiliary electrode (132) may be greater than the width of the first power wire (PL1), but is not limited thereto.

[0117] Although FIG. 2 illustrates a plurality of connection structures (130) arranged between a plurality of green subpixels (SPg) in the second direction (Y), a plurality of connection structures (130) arranged between a plurality of red subpixels (SPr) in the second direction (Y) and a plurality of connection structures (130) arranged between a plurality of blue subpixels (SPb) in the second direction (Y) may also be the same as a plurality of connection structures (130) arranged between a plurality of green subpixels (SPg).

[0118] Since the green organic light-emitting layer (122g) is cut off by the undercut structure (138), a portion of the auxiliary electrode (132) may be exposed. Accordingly, the green cathode electrode (123g) may contact a portion of the exposed auxiliary electrode (132) in the undercut structure (138). In other words, the green cathode electrode (123g) may be electrically connected to the first power wire (PL1) through the connection structure (130).

[0119] Since the undercut structure (138) disconnects the green organic light-emitting layer (122g) and brings the green cathode electrode (123g) into contact with the auxiliary electrode (132), the undercut structure (138) may also be included in the connection structure (130), but is not limited thereto.

[0120] The interlayer insulating layer (103) may have a first groove (104) corresponding to the first groove (131-1) of the first bank (111-1). The first groove (104) of the interlayer insulating layer (103) may be formed between a plurality of green subpixels (SPg) in the second direction (Y) to correspond to the first groove (131-) of the first bank (111-1).

[0121] The undercut structure (138) can be in contact with the first layer (131-1) of the first bank (111-1) and the first groove (104) of the interlayer insulating layer (103). In this case, the auxiliary electrode (132) of the connection structure (130) is exposed in the undercut structure (138), and the green cathode electrode (123g) can be in contact with a portion of the exposed auxiliary electrode (132).

[0122] Meanwhile, as illustrated in FIG. 4, a plurality of second banks (111-2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). The plurality of second banks (111-2) may be arranged lengthwise along the second direction (Y) between the plurality of subpixels (SPr, SPg, SPb) in the first direction (X). A plurality of second grooves (131-2) may be formed in the plurality of second banks (111-2). The plurality of second grooves (131-2) may be arranged lengthwise along the second direction (Y) between the plurality of subpixels (SPr, SPg, SPb) in the first direction (X), but is not limited thereto. The second grooves (131-2) may be formed to penetrate from the upper surface to the lower surface of the second bank (111-2), but is not limited thereto.

[0123] The interlayer insulating layer (103) may have a second groove (105) corresponding to the second groove (131-2) of the second bank (111-2). The second groove (105) of the interlayer insulating layer (103) may be formed between the red subpixel (SPr) and the green subpixel (SPg), corresponding to the second groove (131-2) of the second bank (11-2).

[0124] Meanwhile, referring to FIGS. 1 to 4, the organic light-emitting display device according to the embodiment may include a plurality of inorganic insulating layers (135-1, 135-2, 135-4), an organic insulating layer (141-4), a plurality of waterproof structures (143 to 145), etc.

[0125] The plurality of inorganic insulating layers may include a first inorganic insulating layer (135-1), a second inorganic insulating layer (135-2), a third inorganic insulating layer (135-3), and a fourth inorganic insulating layer (135-4). The first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), the third inorganic insulating layer (135-3), and the fourth inorganic insulating layer (135-4) may each include at least one inorganic insulating film.

[0126] The first inorganic insulating layer (135-1) may be disposed on the green cathode electrode (123g) of the green organic light-emitting element (120g) in the green subpixel (SPg), and the second inorganic insulating layer (135-2) may be disposed on the red cathode electrode (123r) of the red organic light-emitting element (120r) in the red subpixel (SPr). Although not shown, the third inorganic insulating layer (135-3) may be disposed on the blue cathode electrode of the blue organic light-emitting element (120b) in the blue subpixel (SPb).

[0127] The first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) may be formed as a double layer including a silicon oxide layer and a silicon nitride layer. The silicon nitride layer may be disposed on the silicon oxide layer. For example, the silicon oxide layer may be formed using an atomic layer deposition (ALD) process, and the silicon nitride layer may be formed using a chemical vapor deposition (CVD) process.

[0128] When each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) is formed as a double layer, each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) can be formed without interruption on the lower side of the second bank (111-2), the side of the interlayer insulating layer (103), and the upper side of the second power wiring (PL2) in the first undercut structure (151) and the second undercut structure (152).

[0129] The first waterproof structure (143) can be formed by overlapping two or more inorganic insulating layers among the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) in the second groove (131-2) of the second bank (111-2). Not only are the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) each formed as a double layer, but also two or more inorganic insulating layers among the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) are overlapping, thereby enhancing the waterproof performance of the first waterproof structure (143).

[0130] Each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) can be formed in a curved shape in the first undercut structure (151) and the second undercut structure (152).

[0131] The second waterproof structure (144) can be formed by the curved shape of the first inorganic insulating layer (135-1) formed on the first undercut structure (151). The third waterproof structure (145) can be formed by the curved shape of the second inorganic insulating layer (135-2) formed on the second undercut structure (152). Since the penetration path of moisture, oxygen, etc. is further increased by the curved shape of the first inorganic insulating layer (135-1) or the curved shape of the second inorganic insulating layer (135-2), the waterproof performance of each of the second waterproof structure (144) and the third waterproof structure (145) can be enhanced. Accordingly, the penetration of moisture, oxygen, etc. is prevented by the second waterproof structure (144) and the third waterproof structure (145), so that the organic light-emitting layers (122r, 122g) and the cathode electrodes (123r, 123g) can be protected from moisture, oxygen, etc. Therefore, malfunction or emission failure of the red subpixel (SPr) and green subpixel (SPg) can be prevented, thereby improving reliability.

[0132] Although not shown, malfunction or emission failure of the blue subpixel (SPb) can be prevented by the waterproof structure formed by the third weapon insulating layer (135-3).

[0133] The fourth inorganic insulating layer (135-4) may be disposed over the entire area of ​​the substrate (110). The fourth inorganic insulating layer (135-4) may include at least one inorganic insulating film.

[0134] Accordingly, by arranging multiple inorganic insulating layers (135-1, 135-2, 135-4) in each of multiple subpixels (SPr, SPg, SPb) or over the entire area of ​​the substrate (110), penetration of moisture, oxygen, etc. can be completely blocked.

[0135] Meanwhile, as illustrated in FIG. 4, a plurality of waterproof structures (143 to 145) may be arranged in the second groove (131-2) of the second bank (111-2) between the red subpixel (SPr) and the green subpixel (SPg).

[0136] By arranging a plurality of waterproof structures, i.e., a first waterproof structure (143), a second waterproof structure, and a third waterproof structure (145) in the second groove (131-2) of the second bank (111-2), penetration of moisture, oxygen, etc. can be completely blocked.

[0137] The first waterproof structure (143) may be configured such that two or more inorganic insulating layers among a plurality of inorganic insulating layers (135-1, 135-2) are overlapped on the second bank (111-2).

[0138] As illustrated in FIG. 4, a first inorganic insulating layer (135-1), a second inorganic insulating layer (135-2), and a third inorganic insulating layer (135-3) may be overlapped in a second groove (131-2) of a second bank (111-2) disposed between a red subpixel (SPr) and a green subpixel (SPg), thereby forming a first waterproof structure (143). For example, the second inorganic insulating layer (135-2) may be disposed on the first inorganic insulating layer (135-1), and the third inorganic insulating layer (135-3) may be disposed on the second inorganic insulating layer (135-2). The third inorganic insulating layer (135-3), which is the uppermost layer, may be an island insulating pattern. The island insulating pattern is part of a third inorganic insulating layer (135-3) disposed on the blue cathode electrode of the blue subpixel (SPb), and may be spaced apart from the third inorganic insulating layer (135-3). Since the island insulating pattern is included in the first waterproof structure (143), the waterproof performance can be further improved.

[0139] Although not shown, a plurality of waterproof structures (143 to 145) may be arranged in the second groove (131-2) of the second bank (111-2) disposed between the blue subpixel (SPb) and the red subpixel (SPr). In addition, a plurality of waterproof structures (143 to 145) may be arranged in the second groove (131-2) of the second bank (111-2) disposed between the green subpixel (SPg) and the blue subpixel (SPb).

[0140] Meanwhile, as illustrated in FIG. 4, the second waterproof structure and the third waterproof structure (145) may be configured by forming one of the plurality of inorganic insulating layers (135-1, 135-2) in a curved shape by the first undercut structure (151) and the second undercut structure (152). The first undercut structure (151) and the second undercut structure (152) may be formed on the lower side of the second bank (111-2) that contacts the second groove (131-2) of the second bank (111-2). The first undercut structure (151) and the second undercut structure (152) may be formed by removing the interlayer insulating layer (103) located on the lower side of the second bank (111-2) that contacts the second groove (131-2) of the second bank (111-2). That is, the side of the interlayer insulating layer (103) may be moved from the inner side of the second bank (111-2) in contact with the second groove (131-2) of the second bank (111-2) in an outward direction, thereby forming the first undercut structure (151) and the second undercut structure (152). The second waterproof structure and the third waterproof structure (145) may be arranged on the second power wire (PL2) located in the second groove (131-2) of the second bank (111-2).

[0141] Meanwhile, a plurality of second power lines (PL2) may be arranged under a plurality of second banks (111-2). The plurality of second power lines (PL2) may be exposed by a plurality of second grooves (131-2) of the plurality of second banks (111-2). In this case, a first waterproof structure (143) in which at least two or more inorganic insulating layers among a plurality of inorganic insulating layers (135-1, 135-2) are overlapped may be positioned on the plurality of second power lines (PL2). The first waterproof structure (143) composed of at least two or more inorganic insulating layers may be arranged on the second power lines (PL2) located in the second grooves (131-2) of the second banks (111-2). At this time, the second power lines (PL2) may be omitted. If the second power wire (PL2) is omitted, at least one first power wiring (PL1) among the plurality of first power wires (PL1) can be extended to the non-display area (NAA) and electrically connected to the power terminal (101).

[0142] According to an embodiment, a connection structure (130) is arranged between a plurality of subpixels (SPr, SPg, SPb) having the same color along the second direction (Y), so that power supply is smooth and supply failures such as voltage drops are prevented, thereby improving image quality and increasing reliability.

[0143] According to an embodiment, by arranging at least two waterproof structures in the first bank (111-1), moisture, oxygen, etc. penetrating along the second direction (Y) do not penetrate into the plurality of subpixels (SPr, SPg, SPb), thereby preventing malfunctions in operation or light emission of the subpixels, and thus improving reliability.

[0144] Meanwhile, referring to FIGS. 1 to 3, the organic light-emitting display device according to the embodiment may include a blocking structure (134-1, 134-2). The blocking structure (134-1, 134-2) may have an undercut structure (115, 116) formed in an edge area of ​​the first bank (111-1). For example, the blocking structure (134-1, 134-2) may be arranged in an edge area on the lower side of each of the plurality of banks (111-1, 111-2), but is not limited thereto.

[0145] The blocking structure (134-1, 134-2) may include at least one blocking layer (113) for forming an undercut structure (115, 116) that extends inward from the side of the first bank (111-1). A first undercut structure (151) and a second undercut structure (152) may be formed in the edge region of the first bank (111-1) by the blocking layer (113). The blocking layer (113) may include a silicon-based inorganic material, a metal, or the like. Aluminum (Al), molybdenum (Mo), a molybdenum alloy, or the like may be used as the metal, but is not limited thereto.

[0146] Although not shown in FIG. 4, the blocking structure (134-1, 134-2) may be placed in the edge area of ​​the second bank (111-2), but may also be omitted.

[0147] Hereinafter, with reference to FIGS. 5A to 5K and FIGS. 6A to 6K, a process for sequentially manufacturing a green organic light-emitting element (120g) and a red organic light-emitting element (120r) will be described. Although not shown, a blue organic light-emitting element (120b) may be manufactured after the red organic light-emitting element (120r) is manufactured.

[0148] FIGS. 5A to 5K illustrate a manufacturing process of an organic light-emitting display device along line A-A' of FIG. 1. FIGS. 6A to 6K illustrate a manufacturing process of an organic light-emitting display device along line D-D' of FIG. 1. A green organic light-emitting element (120g) can be manufactured through the manufacturing processes illustrated in FIGS. 5A to 5K, and a red organic light-emitting element (120r) can be manufactured through the manufacturing processes illustrated in FIGS. 6A to 6K. The manufacturing process of the blue organic light-emitting element (120b) can be easily understood through the manufacturing process of the red organic light-emitting element (120r) illustrated in FIGS. 6A to 6K.

[0149] Although FIGS. 5a to 5k and 6a to 6k illustrate that the green organic light-emitting element (120g), the red organic light-emitting element (120r), and the blue organic light-emitting element (120b) are manufactured in that order, the order can also be changed.

[0150] As shown in FIG. 1, FIG. 5a, and FIG. 6a, a driving circuit, a first power wire (PL1), a second power wire (PL2), an auxiliary electrode (132), and an interlayer insulating layer (103) can be formed on a substrate (110).

[0151] The substrate (110) may include a material with excellent insulating performance. For example, the substrate (110) may include a plastic material, a resin material, glass, etc. The substrate (110) may include a rigid material or a flexible material.

[0152] The driving circuit may include a plurality of transistors including a driving transistor, at least one capacitor, and the like. The driving circuit may be formed on a substrate (110) using a semiconductor process. Each of the plurality of transistors may include a gate electrode, a source electrode, and a drain electrode.

[0153] The first power wire (PL1), the second power wire (PL2) and the auxiliary electrode (132) can be formed of the same material as the source electrode and the drain electrode.

[0154] The auxiliary electrode (132) is formed by extending from the first power wire (PL1) and may constitute a part of the first power wire (PL1). The auxiliary electrode (132) may be formed between a plurality of green subpixels (SPg) in the second direction (Y). Although not shown, the auxiliary electrode (132) may be formed between a plurality of red subpixels (SPr) in the second direction (Y) and / or between a plurality of blue subpixels (SPb) in the second direction (Y).

[0155] An interlayer insulating layer (103) may be formed on the first power wire (PL1), the second power wire (PL2), and the auxiliary electrode (132). Thereafter, the interlayer insulating layer (103) may be removed to expose the auxiliary electrode (132), thereby forming a first groove (104) in the interlayer insulating layer (103).

[0156] The interlayer insulating layer (103) may be a single organic insulating film or may include multiple insulating films including organic insulating films and inorganic insulating films.

[0157] A first groove (104) may be formed by removing an interlayer insulating layer (103) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) through an etching process. The upper surface of the auxiliary electrode (132) may be exposed by the first groove (104). A connection structure (130) may be formed by the auxiliary electrode (132).

[0158] As illustrated in FIGS. 5b and 6b, a green anode electrode (121g) and a red anode electrode (121r) may be formed on the interlayer insulating layer (103). The red anode electrode (121r) may be formed in the red subpixel (SPr), and the green anode electrode (121g) may be formed in the green subpixel (SPg). Although not illustrated, a blue anode electrode may be formed in the blue subpixel (SPb).

[0159] A blocking layer (113) can be formed on the green anode electrode (121g) and the red anode electrode (121r).

[0160] For example, a conductive film and a blocking film may be formed and patterned on a substrate, so that a green anode electrode (121g), a red anode electrode (121r), and a blocking layer (113) may be formed. When the conductive film and the blocking film are etched using the same photosensitive pattern, the side of the patterned green anode electrode (121g) and the side of the patterned blocking layer (113) may be positioned on the same vertical line or diagonal line, and the side of the patterned red anode electrode (121r) and the side of the patterned blocking layer (113) may be positioned on the same vertical line or diagonal line.

[0161] As shown in FIGS. 5c and 6c, an inorganic film (111a) can be formed on the interlayer insulating layer (103).

[0162] As shown in FIG. 5d and FIG. 6d, a first photosensitive pattern (210) and a second photosensitive pattern (212) can be formed on an inorganic film (111a).

[0163] The first photosensitive pattern (210) may have a groove (215) on the auxiliary electrode (132) between a plurality of green subpixels (SPg) in the second direction (Y). The upper surface of the inorganic film (111a) may be exposed by the groove (215).

[0164] The second photosensitive pattern (212) may be formed on a plurality of red subpixels (SPr) in the second direction (Y) as well as on an auxiliary electrode (132) between the plurality of red subpixels (SPr). At this time, the second photosensitive pattern (212) on the auxiliary electrode (132) may be formed as a half mask in which the thickness is thicker than the thickness on the red subpixels (SPr).

[0165] As shown in FIGS. 5e and 6e, a dry etching process can be performed using the first photosensitive pattern (210) and the second photosensitive pattern (212), so that the inorganic film (111a) can be removed.

[0166] The inorganic film (111a) exposed by the first photosensitive pattern (210) may be removed to expose the blocking layer (113) and the auxiliary electrode (132). That is, the inorganic film (111a) on the green anode electrode (121g) may be removed, and the inorganic film (111a) on the auxiliary electrode (132) between the green subpixels (SPg) may be removed. By removing the inorganic film (111a) on the auxiliary electrode (132) between the green subpixels (SPg), a first bank (111-1) having a first groove (131-1) may be formed. The first groove (131-1) may be locally formed only in the first bank (111-1) between adjacent green subpixels (SPg) in the second direction (Y).

[0167] In contrast, since the inorganic film (111a) is protected by the second photosensitive pattern (212), the inorganic film (111a) on the plurality of red subpixels (SPr) and the auxiliary electrode (132) may not be removed.

[0168] Meanwhile, by performing a dry etching process, the second photosensitive pattern (212) on the remaining area except for the periphery of the auxiliary electrode (132) between the plurality of red sub-pixels (SPr) can be removed. By removing the second photosensitive pattern (212) on the remaining area, the upper surface of the inorganic film (111a) can be exposed. By removing the exposed upper surface of the inorganic film (111a) by the dry etching process, the thickness of the inorganic film (111a) may be reduced, but this is not limited thereto.

[0169] Next, a wet etching process can be performed using the first photosensitive pattern (210) and the second photosensitive pattern (212).

[0170] As illustrated in FIG. 5f, the blocking layer (113) in the green subpixel (SPg) can be removed through a wet etching process. As the wet etching process is continuously performed to remove the blocking layer (113) positioned under the first bank (111-1), an undercut structure (115, 116) can be formed. That is, as the side of the blocking layer (113) moves inward from the outer side of the first bank (111-1), a blocking structure (134-1, 134-2) having an undercut structure (115, 116) can be formed.

[0171] Subsequently, another etching process is additionally performed so that the interlayer insulating layer (103) exposed in the first groove (131-1) of the first bank (111-1) is moved outward from the lower side of the first bank (111-1), thereby forming an undercut structure (138). The connection structure (130) may include the undercut structure (138) together with the auxiliary electrode (132), but is not limited thereto.

[0172] In contrast, as illustrated in FIGS. 6e and 6f, the inorganic film (111a) is removed through a wet etching process, thereby exposing the blocking layer (113) in the red subpixel (SPr), and forming a first bank (111-1) having a first groove (131-1). The auxiliary electrode (132) can be exposed by the first groove (131-1).

[0173] As shown in FIGS. 5g and 6g, after the first photosensitive pattern (210) and the second photosensitive pattern (212) are removed, a cleaning process can be performed.

[0174] As shown in FIGS. 5h to 5j and FIG. 6h, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) can be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110).

[0175] First, as illustrated in FIG. 5h, a green organic light-emitting layer (122g) may be deposited on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110). The green organic light-emitting layer (122g) may be deposited on the red subpixel (SPr), the green subpixel (SPg), the blue subpixel (SPb), and the first and second banks (111-1, 111-2).

[0176] The green organic light-emitting layer (122g) may have at least two stack structures. The green organic light-emitting layer (122g) may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, a charge generation layer, etc.

[0177] The green organic light-emitting layer (122g) can be separated by the undercut structure (138). That is, the green organic light-emitting layer (122g) formed in the first groove (131-1) of the first bank (111-1) and the green organic light-emitting layer (122g) formed on the upper side of the first bank (111-1) can be separated from each other by the undercut structure (138).

[0178] By disconnecting some layers of the green organic light-emitting layer (122g), such as the hole injection layer and / or charge generation layer, by the undercut structure (115, 116) of the blocking structure (134-1, 134-2), leakage current flowing to the hole injection layer, charge generation layer, etc. is blocked, and thus poor image quality can be prevented.

[0179] As illustrated in FIG. 5i, a green cathode electrode (123g) may be deposited on a green organic light-emitting layer (122g). The green organic light-emitting layer (122g) and the green cathode electrode (123g) may be deposited using different deposition angles (θ1, θ2). The deposition angle may be defined with respect to a vertical line.

[0180] The deposition angle (θ2) for depositing the green cathode electrode (123g) may be greater than the deposition angle (θ1) for depositing the green organic light-emitting layer (122g). In this case, the green organic light-emitting layer (122g) may be deposited at the entrance of the undercut structure (138). In contrast, the green cathode electrode (123g) may be deposited even inside the undercut structure (138) and may come into contact with a portion of the upper surface of the auxiliary electrode (132) in the undercut structure (138).

[0181] As illustrated in FIG. 5j, a first inorganic insulating layer (135-1) can be formed on a green cathode electrode (123g).

[0182] As illustrated in FIG. 6h, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) may be formed on a red subpixel (SPr). Although not illustrated, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) may also be formed on a blue subpixel (SPb).

[0183] The first inorganic insulating layer (135-1) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0184] As illustrated in FIG. 6i, the green organic light-emitting layer (122g), the green cathode electrode (123g), and the first inorganic insulating layer (135-1) formed on the plurality of red subpixels (SPr) in the second direction (Y) can be removed. That is, the green organic light-emitting layer (122g), the green cathode electrode (123g), and the first inorganic insulating layer (135-1) can be formed only on the plurality of green subpixels (SPg) in the second direction (Y) and the plurality of auxiliary electrodes (130) between the plurality of green subpixels (SPg).

[0185] Accordingly, the blocking layer (113) formed in the red subpixel (SPr) and the auxiliary electrode (132) formed in the first groove (131-1) of the first bank (111-1) can be exposed. Although not shown, the green organic light-emitting layer (122g), the green cathode electrode (123g), and the first inorganic insulating layer (135-1) formed in the blue subpixel (SPb) in the second direction (Y) can be removed. Accordingly, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) are formed only on the auxiliary electrode (132) between the plurality of green subpixels (SPg) in the second direction (Y), so that a plurality of green organic light-emitting elements (120g) are manufactured in the plurality of green subpixels (SPg) in the second direction (Y), and the green cathode electrode (123g) of the green organic light-emitting elements (120g) can be electrically connected to the first power wiring (PL1) through the connection structure (130).

[0186] At the stage where the deposition of the green cathode electrode (123g) is completed (Fig. 5i), the cross-sectional structure of the connection structure (130) of the red subpixel (SPr) can be illustrated in Fig. 6h.

[0187] Comparing the cross-sectional structures of the drawings illustrated in FIG. 5i and FIG. 6h, it can be seen that when the green organic light-emitting element (120g) is formed in the red subpixel (SPr), there is no undercut structure or blocking structure in the red subpixel (SPr).

[0188] Although not shown, at the stage where the manufacturing of the green subpixel (SPg) is completed (Fig. 5k), an organic insulating layer is formed on the red subpixel (SPr) and then removed again (same structure as Fig. 6h), and the first inorganic insulating layer (135-1) and the organic light-emitting elements (122g, 123g) on ​​the green subpixel (SPg) are removed through a dry etching process.

[0189] By performing the above-described process in a state where the undercut structure is not formed (Fig. 6h), residual film that may occur in the undercut structure can be fundamentally blocked.

[0190] Meanwhile, an undercut structure, a blocking structure, etc. may be formed immediately before the red organic light-emitting element (120r) is formed in the red subpixel (Pr) (Fig. 6j).

[0191] After the green organic light-emitting element (120g) is manufactured, a red organic light-emitting element (120r) can be manufactured, as illustrated in FIGS. 6j to 6k. Although not illustrated, after the red organic light-emitting element (120r) is manufactured, a blue organic light-emitting element (120r) can be manufactured. Thereafter, as illustrated in FIG. 5k, an organic insulating layer (141-4) and a fourth inorganic insulating layer (135-4) are formed, thereby manufacturing an organic light-emitting display device according to an embodiment.

[0192] Hereinafter, the manufacturing process of the red organic light-emitting element (120r) will be described with reference to FIGS. 6j to 6k.

[0193] As described above, the final process for completing the patterning of the green subpixel (SPg) is the step of forming a connection structure, a blocking structure, etc. in the red subpixel (SPr). A separate photolithography process may be required to form the connection structure, the blocking structure, etc., but this is not limited thereto.

[0194] As illustrated in FIG. 6j, a photosensitive pattern can be formed on the remaining area excluding the plurality of red subpixels (SPr) in the second direction (Y), that is, on the plurality of green subpixels (SPg) in the second direction (Y) and the plurality of blue subpixels (SPb) in the second direction (Y).

[0195] Thereafter, a wet etching process is performed using a photosensitive pattern, so that the blocking layer (113) exposed to a plurality of red subpixels (SPr) is removed from the blocking layer (113) positioned under the first bank (111-1), thereby forming an undercut structure (115, 116). That is, a side of the blocking layer (113) is moved inward from the outer side of the first bank (111-1), thereby forming a blocking structure (134-1, 134-2) having an undercut structure (115, 116).

[0196] Subsequently, another etching process is additionally performed so that the interlayer insulating layer (103) exposed in the first groove (131-1) of the first bank (111-1) is moved outward from the lower side of the first bank (111-1), thereby forming an undercut structure (138). The connection structure (130) may include the undercut structure (138) together with the auxiliary electrode (132), but is not limited thereto.

[0197] As illustrated in FIG. 6k, the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) may be formed on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110). That is, the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) may be formed on a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), and a plurality of blue subpixels (SPb).

[0198] The second inorganic insulating layer (135-2) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0199] Afterwards, a photosensitive pattern is formed on a plurality of red subpixels (SPr) in the second direction (Y), and then an etching process can be performed using the photosensitive pattern.

[0200] Through an etching process, the remaining areas except for the plurality of red subpixels (SPr), i.e., the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) on the plurality of green subpixels (SPg) and the plurality of blue subpixels (SPb) can be removed. Accordingly, the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) are formed only on the plurality of red subpixels (SPr) in the second direction (Y), thereby manufacturing a plurality of red organic light-emitting elements (120r) on the plurality of green subpixels (SPg) in the second direction (Y).

[0201] Although not shown, a blue organic light-emitting element (120b) can be manufactured through a process similar to the manufacturing process of a plurality of red organic light-emitting elements (120r). That is, a blue-green light-emitting layer, a blue cathode electrode, and a third inorganic insulating layer (135-3) are laminated and patterned to manufacture a blue organic light-emitting element.

[0202] As described above, a green organic light-emitting element (120g), a red organic light-emitting element (120r), and a blue organic light-emitting element can be sequentially manufactured.

[0203] Thereafter, as illustrated in FIG. 5k, after the blue organic light-emitting element is manufactured, an organic insulating layer (141-4) may be formed over the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110), and a fourth inorganic insulating layer (135-4) may be formed on the organic insulating layer (141-4).

[0204] Although not shown, at least one inorganic insulating film may be formed beneath the organic insulating layer (141-4).

[0205] The organic insulating layer (141-4) may be formed using an inkjet process, but is not limited thereto. The fourth inorganic insulating layer (135-4) may be formed using a PECVD process using an inorganic material such as silicon nitride (SiNx), but is not limited thereto.

[0206] Fig. 7 illustrates a state in which the grooves of the photosensitive pattern are differently positioned relative to the grooves of the interlayer insulating layer along the second direction (Y). Fig. 8 illustrates a positional relationship between the grooves of the interlayer insulating layer and the grooves of the photosensitive pattern. Fig. 9 illustrates a state in which the grooves of the photosensitive pattern are positioned on different sides of the grooves of the interlayer insulating layer.

[0207] The plurality of undercut structures (138) may be positioned differently from each other in the plurality of first grooves (131-1) of the plurality of first banks (111-1).

[0208] As shown in FIGS. 7 to 9, the arrangement positions of the plurality of undercut structures (138) may vary depending on the position of the groove of the first photosensitive pattern (210) with respect to the first groove (104) of the interlayer insulating layer (103).

[0209] For example, the first groove (104) of the interlayer insulating layer (103) and the groove of the first photosensitive pattern (210) may each have a square shape when viewed from above, but this is not limited thereto.

[0210] As illustrated in FIG. 7, in the connection structure (130) on the m-th row line, the groove of the first photosensitive pattern (210) may be formed to deviate to the right and rear side with respect to the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) may be formed under the first bank (111-1) on the right and rear side of the first groove (104).

[0211] In the connection structure (130) on the (m+1)th row line, the groove of the first photosensitive pattern (210) may be formed to deviate from the rear and left side of the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) may be formed under the first bank (111-1) on the rear and left side of the first groove (104).

[0212] In the connection structure (130) on the (m+2)th row line, the groove of the first photosensitive pattern (210) may be formed to deviate to the left and front side with respect to the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) may be formed under the first bank (111-1) on the left and front side of the first groove (104).

[0213] In the connection structure (130) on the (m+3)th row line, the groove of the first photosensitive pattern (210) may be formed to deviate from the front side and the right side with respect to the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) may be formed under the first bank (111-1) on the front side and the right side of the first groove (104).

[0214] The four connection structures illustrated on the left side of Fig. 7 are described in detail. For example, as illustrated in Figs. 7 to 9, among the four sides of the first groove (104, 131-1), two sides may have an undercut structure (138) formed thereon, and the remaining two sides may not have an undercut structure (138) formed thereon.

[0215] In the deposition device, the organic light-emitting material can be evaporated in a certain direction and at a certain angle (Fig. 5i) by the angle limiting plate. In the area where the undercut structure (138) is formed, the organic light-emitting material may not be deposited in some parts of the undercut structure due to the shadow effect, thereby exposing some areas of the auxiliary electrode (132). In addition, in the area where the undercut structure (138) is not formed, the organic light-emitting material can be continuously and without interruption.

[0216] Accordingly, the organic light-emitting material can be deposited within the same first groove (104, 131-1) so that a portion of the auxiliary electrode (132) remains exposed. Thereafter, in the next deposition unit, the cathode electrode material can be deposited so as to contact a portion of the exposed auxiliary electrode (132) in the undercut structure (138), and can be continuously and seamlessly connected in an area where the undercut structure (138) is not formed.

[0217] Depending on the direction of progression of the substrate (110) during deposition and the angle and position of the evaporation source, at least one of the four connection structures (130) is electrically connected to the green cathode electrode (123g) and the auxiliary electrode (132) of the connection structure (130), thereby increasing reliability.

[0218] As illustrated in FIG. 5i, the green cathode electrode (123g) can be electrically connected to the auxiliary electrode (132) of the connection structure (130) in the undercut structure (138).

[0219] In this way, undercut structures (138) can be arranged differently from each other in a plurality of connection structures (130) on a plurality of row lines in the second direction (Y). Accordingly, green cathode electrodes (123g) arranged across a plurality of green subpixels (SPg) along the second direction (Y) can be electrically connected to different regions of a plurality of auxiliary electrodes (132) in a plurality of connection structures (130) on a plurality of row lines in the second direction (Y).

[0220] For example, a green cathode electrode (123g) may be electrically connected to an auxiliary electrode (132) on the right and rear sides of the first groove (104, 131-1) of the interlayer insulating layer (103) and the first bank (111-1) through an undercut structure (138) in a connection structure (130) on the m-th row line. For example, a green cathode electrode (123g) may be electrically connected to an auxiliary electrode (132) on the right and rear sides of the first groove (104, 131-1) of the interlayer insulating layer (103) through an undercut structure (138) in a connection structure (130) on the (m+1)-th row line. For example, a green cathode electrode (123g) may be electrically connected to an auxiliary electrode (132) through an undercut structure (138) in a connection structure (130) on the (m+2)th row line and on the left and front sides of the first groove (104, 131-1) of the interlayer insulating layer (103). For example, a green cathode electrode (123g) may be electrically connected to an auxiliary electrode (132) through an undercut structure (138) in a connection structure (130) on the (m+3)th row line and on the front and right sides of the first groove (104, 131-1) of the interlayer insulating layer (103).

[0221] Meanwhile, the groove of the first photosensitive pattern (210) may be deviated to at least one side with respect to the first groove (104) of the interlayer insulating layer (103). For example, as illustrated in FIG. 9a, the groove of the first photosensitive pattern (210) may be formed deviating only to the left with respect to the first groove (104) of the interlayer insulating layer (103). For example, as illustrated in FIG. 9b, the groove of the first photosensitive pattern (210) may be formed deviating to the right and rear with respect to the first groove (104) of the interlayer insulating layer (103). As illustrated in FIG. 9c, the groove of the first photosensitive pattern (210) may be formed deviating to the front, right, and rear with respect to the first groove (104) of the interlayer insulating layer (103).

[0222] According to an embodiment, in a plurality of connection structures (130) on a plurality of row lines along the second direction (Y), a plurality of undercut structures (138) are formed to be positioned differently from each other in a plurality of first banks (111-1) and a first groove (104, 131-1) of an interlayer insulating layer (103), so that cathode electrodes can be formed on a plurality of auxiliary electrodes (132) of the plurality of connection structures (130) through the plurality of undercut structures (138) formed at different positions. Accordingly, electrical connection failure between the cathode electrode and the first power wire (PL1) through the connection structure (130) can be prevented, thereby preventing light emission failure or operation failure, and improving reliability.

[0223] Fig. 10 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment. The fourth embodiment is identical to the first embodiment (Fig. 2) except for the green cathode electrode (123g) formed of a double layer. In the fourth embodiment, components having the same shape, structure, and / or function as those in the first embodiment (Fig. 2) are given the same drawing reference numerals, and detailed descriptions thereof are omitted.

[0224] Although the drawing illustrates a plurality of green cathode electrodes (123g) of a plurality of green subpixels (SPg) in the second direction (Y), the same may be applied to a plurality of red cathode electrodes (123r) of a plurality of red subpixels (SPr) in the second direction (Y) and / or a plurality of blue cathode electrodes of a plurality of blue subpixels (SPb) in the second direction (Y).

[0225] Referring to FIGS. 1 and 10, an organic light-emitting display device according to an embodiment may include a first bank (111-1), a green organic light-emitting element (120g), a connection structure (130), etc.

[0226] The first bank (111-1) may be positioned between adjacent green subpixels (SPg). A first groove (131-1) may be formed in the first bank (111-1), and an undercut structure (138) may be formed on the lower side of the first bank (111-1) in contact with the first groove (131-1).

[0227] The green organic light-emitting device (120g) may include a green anode electrode (121g), a green organic light-emitting layer (122g), and a green cathode electrode (123g).

[0228] The green cathode electrode (123g) can be electrically connected to the first power wire (PL1) via a connection structure (130). For example, the green cathode electrode (123g) can contact the upper surface of the auxiliary electrode (132) of the connection structure (130) in the undercut structure (138).

[0229] In an embodiment, the green cathode electrode (123g) may include a first conductive layer (123-1) and a second conductive layer (123-2). The second conductive layer (123-2) may be disposed on the first conductive layer (123-1).

[0230] The first conductive layer (123-1) may include a material having excellent electrical conductivity, such as Mg:Ag. The first conductive layer (123-1) including Mg:Ag may not have good step coverage. When the first conductive layer (123-1) is deposited on the substrate (110), the first conductive layer (123-1) in the first groove (131-1) and the first conductive layer (123-1) on the upper side of the first bank (111-1) may not be connected to each other but may be separated. In addition, the first conductive layer (123-1) in the first groove (131-1) may not be in contact with the upper surface of the auxiliary electrode (132) in the undercut structure (138). In this case, since the first power wire (PL1) is disconnected from the green cathode electrode (123g) on ​​the green subpixel (SPg) through the connection structure (130), the green organic light-emitting element (120g) on ​​the green subpixel (SPg) may not operate or emit light, which may lower the reliability of the product. In addition, when the first conductive layer (123-1) is formed with a very thin thickness of approximately 10 nm, the step coverage may not be good, which may result in increased resistance or disconnection.

[0231] To solve this problem, a second conductive layer (123-2) having excellent step coverage may be formed on the first conductive layer (123-1), thereby forming a green cathode electrode (123g) composed of the first conductive layer (123-1) and the second conductive layer (123-2). The second conductive layer (123-2) may include a conductive oxide material having excellent step coverage, such as ITO.

[0232] Since the second conductive layer (123-2) has excellent step coverage, the second conductive layer (123-2) in the first groove (131-1) and the second conductive layer (123-2) on the upper side of the first bank (111-1) can be formed to be connected to each other without being disconnected. Since the second conductive layer (123-2) is formed in the undercut structure (138), the second conductive layer (123-2) can contact the upper surface of the auxiliary electrode (132) in the undercut structure (138).

[0233] According to an embodiment, a green cathode electrode (123g) including a second conductive layer (123-2) with excellent step coverage as well as a first conductive layer (123-1) is provided, thereby preventing poor connection between the green cathode electrode (123g) and the connection structure (130), thereby increasing reliability.

[0234] Fig. 11 illustrates a waterproof structure according to the first embodiment. Fig. 12 illustrates a waterproof structure according to the second embodiment. Fig. 13 illustrates a waterproof structure according to the third embodiment. Fig. 14 is a schematic plan view of an organic light-emitting display device according to the second embodiment.

[0235] As illustrated in FIGS. 11 to 13, the waterproof structure can surround at least one subpixel among a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). Accordingly, the organic light-emitting element of at least one subpixel surrounded by the waterproof structure is not permeated by moisture, oxygen, etc., thereby preventing malfunction of the subpixel and enhancing reliability.

[0236] For example, a connection structure (130) and a waterproof structure may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). For example, the waterproof structure may be arranged lengthwise along the first direction (X) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y), and the connection structure (130) may be locally arranged in an area between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). For example, a waterproof structure may also be formed in an area where a connection structure (130) is formed, but this is not limited thereto.

[0237] For example, the waterproof structure can surround each of a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) (Fig. 11).

[0238] As another example, a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) may be grouped into two subpixel units, thereby defining a plurality of subpixel groups (SPr, SPg, SPb). In this case, a waterproof structure may surround each of the plurality of subpixel groups (SPr, SPg, SPb) (Fig. 12).

[0239] As another example, a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) may be grouped into four subpixel units, thereby defining a plurality of subpixel groups (SPr, SPg, SPb). In this case, a waterproof structure may surround each of the plurality of subpixel groups (SPr, SPg, SPb) (Fig. 13).

[0240] Fig. 14 is a plan view schematically illustrating an organic light-emitting display device according to a second embodiment.

[0241] As illustrated in FIG. 14, a plurality of subpixels (SPr, SPg, SPb) may be arranged in a stripe shape along a second direction (Y) on a display area (AA), and a plurality of dummy subpixels (SPrd, SPgd, SPbd) may be arranged in a stripe shape along a first direction (X) on a non-display area (NAA). The non-display area (NAA) may include a bezel area.

[0242] A plurality of waterproof structures (146-1 to 146-3) may be arranged between a plurality of dummy subpixels (SPrd, SPgd, SPbd) in the second direction (Y).

[0243] Meanwhile, since the non-display area (NAA) or the bezel area is an area where an image is not displayed, the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) may not be arranged. For example, as illustrated in FIG. 15, the red organic light-emitting element (120r) may not be arranged in the red dummy subpixel (SPrd), and the green organic light-emitting element (120g) may not be arranged in the green dummy subpixel (SPgd). That is, at least one or more of the anode electrode, the organic light-emitting layer, and the cathode electrode constituting the red organic light-emitting element (120r) or the green organic light-emitting element (120g) may not be arranged in the green dummy subpixel (SPgd) or the red dummy subpixel (SPrd).

[0244] Although not shown, a blue organic light-emitting element (120b) may not be placed in a blue dummy subpixel (SPbd).

[0245] A third bank (111-3) may be arranged between red dummy subpixels (SPrd) and red dummy subpixels (SPrd), and a third groove (131-3) may be formed in the third bank (111-3). A plurality of undercut structures (153, 154) may be formed on the lower side of the third bank (111-3) that contacts the third groove (131-3).

[0246] Each of the plurality of waterproof structures (146-1 to 146-3) may include two or more waterproof structures (144-4, 145-4).

[0247] For example, a first waterproof structure (144-4) may be formed by the curved shape of a first inorganic insulating layer (135-1) disposed in a first undercut structure (153), and a second waterproof structure (145-4) may be formed by the curved shape of a second inorganic insulating layer (135-2) disposed in a second undercut structure (154).

[0248] The waterproof structure (144-4, 145-4) may be the same as the second waterproof structure (144) and the third waterproof structure (145) illustrated in the third embodiment (Fig. 4).

[0249] In this way, by forming a plurality of waterproof structures (146-1 to 146-3) between a plurality of dummy subpixels (SPrd, SPgd, SPbd) on the non-display area (NAA), moisture, oxygen, etc. can be blocked from penetrating into the display area (AA) from the non-display area (NAA). Even if moisture, oxygen, etc. penetrate into the display area (AA) from the non-display area (NAA), moisture, oxygen, etc. are blocked by the plurality of waterproof structures (143 to 145 in FIG. 4) formed long along the second direction (Y) between the plurality of subpixels (SPr, SPg, SPb) in the first direction (X) in the display area (AA), so that the moisture, oxygen, etc. do not penetrate into the plurality of organic light-emitting elements (120r, 120g, 120b) of the plurality of subpixels (SPr, SPg, SPb). Accordingly, the performance of blocking penetration of moisture, oxygen, etc. is dramatically improved, and malfunctions or light emission failures of subpixels (SPr, SPg, SPb) are prevented, thereby increasing reliability.

[0250] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalency range of the embodiments are intended to be included within the scope of the embodiments.

Claims

1. A plurality of subpixels having different colors along a first direction and having the same color along a second direction intersecting the first direction; A plurality of anode electrodes for the plurality of subpixels; A plurality of organic light-emitting layers on the plurality of anode electrodes; A plurality of cathode electrodes on the plurality of organic light-emitting layers; A plurality of first banks between a plurality of subpixels in the second direction; a plurality of first power wires along the first direction under the plurality of first banks; and A plurality of connection structures arranged in a plurality of first grooves of some first banks among the plurality of first banks; and A plurality of undercut structures are included on the lower side of the first bank in contact with the plurality of first grooves; The organic light-emitting layer and the cathode electrode are arranged across the first bank, The above connection structure electrically connects the cathode electrode to the first power wiring in the above undercut structure. Organic light emitting display device.

2. In paragraph 1, further comprising an intermediate insulating layer below the above bank; The above undercut structure is formed such that the side of the interlayer insulation layer in contact with the first groove is inserted from the inner side of the first bank in an outward direction. Organic light emitting display device.

3. In paragraph 1, The above connecting structure includes an auxiliary electrode extending from the first power wire, The organic light-emitting layer is disconnected by the undercut structure, and a portion of the auxiliary electrode is exposed. The cathode electrode is in contact with a portion of the exposed auxiliary electrode in the undercut structure. Organic light emitting display device.

4. In paragraph 1, A plurality of inorganic insulating layers on the plurality of cathode electrodes; A plurality of second banks having second grooves arranged long along the second direction between the plurality of subpixels in the first direction; and A plurality of waterproof structures, each of which is included in the plurality of second banks; Organic light emitting display device.

5. In paragraph 4, The above multiple waterproof structures are, A first waterproof structure on the second bank; A second waterproof structure on the first side of the second home of the second bank; and a third waterproof structure on the second side of the second home of the second bank; Organic light emitting display device.

6. In paragraph 5, The above first waterproof structure is configured such that at least two or more inorganic insulating layers among the plurality of inorganic insulating layers are overlapped on the second bank. Organic light emitting display device.

7. In paragraph 6, The above second waterproof structure is configured such that one of the plurality of inorganic insulating layers is formed in a curved shape by the first undercut structure, The third waterproof structure is configured such that another inorganic insulating layer among the plurality of inorganic insulating layers is formed in a curved shape by the second undercut structure, The first undercut structure and the second undercut structure are formed on the lower side of the second bank in contact with the second groove of the second bank. Organic light emitting display device.

8. In paragraph 4, The above waterproof structure surrounds at least one subpixel among the plurality of subpixels in the second direction. Organic light emitting display device.

9. In paragraph 1, Further comprising a plurality of second power wires along the second direction in the plurality of second grooves of the plurality of second banks; At least two or more of the above inorganic insulating layers are disposed on the second power wiring, Organic light emitting display device.

10. In paragraph 1, The above plurality of undercut structures are positioned differently from each other in the plurality of first grooves. Organic light emitting display device.

11. In paragraph 1, The above cathode electrode is, 1st challenge layer; and A second conductive layer on the first conductive layer; Organic light emitting display device.

12. In paragraph 1, Further comprising a blocking structure in the edge area of ​​at least one bank among the first bank and the second bank; The hole injection layer or charge generation layer of the organic light-emitting layer is disconnected by the blocking structure. Organic light emitting display device.

13. In paragraph 1, A plurality of dummy subpixels having a stripe shape along the first direction in the non-display area; and Further comprising a plurality of waterproof structures between a plurality of dummy subpixels in the second direction; Organic light emitting display device.

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