Organic light-emitting display device

Abstract

This organic light-emitting display device may comprise: a plurality of anode electrodes in a plurality of subpixels; a plurality of organic light-emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light-emitting layers; a plurality of first banks between the plurality of subpixels in a second direction crossing a first direction; a plurality of first power wires under the plurality of first banks in the first direction; and a plurality of connection structures arranged in a plurality of first recesses of some of the plurality of first banks. The organic light-emitting layers and the cathode electrodes are arranged to cross over some of the first banks, and the connection structures can electrically connect the cathode electrodes to the first power wires in the first recesses of some of the first banks.

Description

organic light emitting display device

[0001] The embodiment relates to an organic light emitting display device.

[0002] As demand for portable information media grows, efforts are expanding to apply organic light-emitting diodes (OLEDs) to a variety of lightweight and thin information electronic devices. Recently, OLEDs are increasingly being applied to product groups such as mobile PCs and automobiles, rather than TVs or mobile phones. Because OLEDs used in mobile PCs and automobiles operate with still images for extended periods of time, long lifespans are required. To achieve long lifespans, light extraction from the OLEDs in OLED displays must be maximized. Furthermore, to reduce costs, technology must be expanded to enable the production of OLEDs on substrates of not only 8.5th-generation (2200 x 2500 mm) but also 10.5th-generation (3370 x 2940 mm) sizes. To produce long-lasting OLEDs, each subpixel must have a top-emitting structure and a side-by-side structure, with at least two stacks of OLEDs.

[0003] The structure of these organic light-emitting devices can be obtained through deposition equipment using a fine metal mask (FMM, hereinafter referred to as FMM). However, the deposition method using FMM has the problem of low productivity because the production logistics must be produced only in a cluster manner rather than an inline method. In addition, there is a problem of low pixel position accuracy (PPA) at the subpixel level between the FMM and the substrate. Accordingly, the emission area ratio (EAR) is small, which limits the product lifespan. Here, EAR is the value obtained by dividing the emission area of ​​a subpixel by the total area of ​​the subpixel.

[0004] Therefore, it is very urgent to develop an organic light-emitting display device having a new deposition method and a new organic light-emitting element structure using the new deposition method to solve the problems described above.

[0005] The present invention aims to solve the above-mentioned and other problems.

[0006] Another object of the embodiment is to provide an organic light emitting display device having a novel structure.

[0007] Another object of the present invention is to provide an organic light emitting display device capable of improving lifespan.

[0008] Another object of the present invention is to provide an organic light-emitting display device capable of improving productivity and yield.

[0009] Another object of the present invention is to provide an organic light-emitting display device capable of improving image quality.

[0010] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0011] According to one aspect of the embodiment to achieve the above or other objects, an organic light-emitting display device includes: a plurality of subpixels having different colors along a first direction and having the same color along a second direction crossing the first direction; a plurality of anode electrodes on the plurality of subpixels; a plurality of organic light-emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light-emitting layers; a plurality of first banks between the plurality of subpixels in the second direction; a plurality of first power wires along the first direction under the plurality of first banks; and a plurality of connection structures disposed in a plurality of first grooves of some of the first banks; wherein the organic light-emitting layers and the cathode electrodes are disposed across some of the first banks, and the connection structures electrically connect the cathode electrodes in the first grooves of some of the first banks to the first power wires.

[0012] The above connection structure includes a lower electrode extending from the first power wiring; and an upper electrode on the lower electrode; and the cathode electrode can be in contact with an upper surface of the upper electrode.

[0013] The upper electrode may include the same material as the anode electrode.

[0014] The above connection structure includes an auxiliary electrode extending from the first power wire; and a connection portion penetrating the organic light-emitting layer on the auxiliary electrode; and the cathode electrode can contact a portion of the auxiliary electrode through the connection portion.

[0015] The cathode electrode may include a first conductive layer; and a second conductive layer on the first conductive layer; and the connecting portion may include the same material as the first conductive layer.

[0016] The organic light-emitting display device further includes a blocking structure in an edge region of the first bank, and a hole injection layer or a charge generation layer of the organic light-emitting layer can be disconnected by the blocking structure.

[0017] The organic light emitting display device may include a plurality of inorganic insulating layers on the plurality of cathode electrodes; a plurality of second banks arranged lengthwise along the second direction between the plurality of subpixels in the first direction; and a plurality of waterproof structures on each of the plurality of second banks.

[0018] The above plurality of waterproof structures may include a first waterproof structure on the second bank; a second waterproof structure on the first side of the second groove of the second bank; and a third waterproof structure on the second side of the second groove of the second bank.

[0019] The above first waterproof structure may be configured such that at least two or more inorganic insulating layers among the plurality of inorganic insulating layers are overlapped on the second bank.

[0020] Among the above two or more inorganic insulating layers, the uppermost layer may be an island insulating pattern.

[0021] The second waterproof structure is configured such that one of the plurality of inorganic insulating layers is formed in a curved shape by a first undercut structure, and the third waterproof structure is configured such that another of the plurality of inorganic insulating layers is formed in a curved shape by a second undercut structure, and the first undercut structure and the second undercut structure can be formed on the lower side of the second bank in contact with the second groove of the second bank.

[0022] The organic light-emitting display device further includes a plurality of organic insulating layers on the plurality of inorganic insulating layers, and one inorganic insulating layer among the plurality of inorganic insulating layers can be disposed between two organic insulating layers among the plurality of organic insulating layers in the second groove.

[0023] The above one inorganic insulating layer may have a round surface.

[0024] The organic light-emitting display device further includes a plurality of second power wires along the second direction in the plurality of second grooves of the plurality of second banks, the plurality of second power wires being electrically connected to the plurality of first power wires, and the at least two or more inorganic insulating layers may be disposed on the second power wires.

[0025] The organic light-emitting display device may further include a plurality of dummy subpixels having a stripe shape along the first direction (X) in a non-display area; and a plurality of waterproof structures between the plurality of dummy subpixels in the second direction.

[0026] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0027] According to at least one of the embodiments, the process may be simplified and the process cost may be reduced by eliminating the need to use FMM.

[0028] According to at least one of the embodiments, the EAR within a subpixel may be increased without the need for FMM, thereby improving the lifetime.

[0029] According to at least one of the embodiments, an organic light-emitting device can be deposited on a large-area substrate in an inline deposition system, thereby improving productivity, yield, and material utilization efficiency.

[0030] According to at least one of the embodiments, as illustrated in FIGS. 1 and 5, a connection structure (130) is arranged in a first groove (131-1) of a plurality of first banks (111-1) between a plurality of subpixels (SPr, SPg, SPb) having the same color along the second direction (Y), thereby facilitating electrical connection between the cathode electrodes (123r, 123g, 123b) of the plurality of subpixels (SPr, SPg, SPb) and the first power wire (PL1) and preventing a short circuit defect, thereby preventing a malfunction or a light emission defect of the subpixels (SPr, SPg, SPb), and thus improving reliability. In particular, by grouping a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) and arranging a connection structure (130) between the grouped subpixels, the number of shots of the laser beam can be drastically reduced when using the laser ablation process to be described later, thereby reducing the process time or process cost.

[0031] According to at least one of the embodiments, as illustrated in FIGS. 1 to 4, a plurality of waterproof structures (143, 144-1 to 144-3, 145-1 to 145-3) are arranged in each of a plurality of second banks (111-2), so that moisture, oxygen, etc. penetrating along the second direction (Y) do not penetrate into the plurality of subpixels (SPr, SPg, SPb), thereby preventing malfunctions in operation or light emission of the subpixels (SPr, SPg, SPb), and thus improving reliability.

[0032] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0033] FIG. 1 is a schematic plan view of an organic light-emitting display device according to a first embodiment.

[0034] FIG. 2 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0035] Fig. 3 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0036] Fig. 4 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0037] Fig. 5 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment.

[0038] Fig. 6 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0039] FIGS. 7A to 7R illustrate a manufacturing process of an organic light-emitting display device along line A-A' of FIG. 1.

[0040] FIGS. 8A to 8R illustrate a manufacturing process of an organic light-emitting display device along line D-D' of FIG. 1.

[0041] Fig. 9 is a cross-sectional view illustrating an organic light-emitting display device according to the sixth embodiment.

[0042] FIGS. 10A to 10C illustrate a manufacturing process of an organic light-emitting display device according to a sixth embodiment.

[0043] Fig. 11 is a cross-sectional view illustrating an organic light-emitting display device according to the seventh embodiment.

[0044] Fig. 12 is a cross-sectional view illustrating an organic light-emitting display device according to the eighth embodiment.

[0045] Fig. 13 is a cross-sectional view illustrating an organic light-emitting display device according to the ninth embodiment.

[0046] Fig. 14 is a cross-sectional view illustrating an organic light-emitting display device according to the 10th embodiment.

[0047] Fig. 15 is a plan view schematically illustrating an organic light-emitting display device according to a second embodiment.

[0048] Fig. 16 is a cross-sectional view illustrating an organic light-emitting display device according to the 11th embodiment.

[0049] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0050] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0051] Hereinafter, an organic light-emitting display device having a side-by-side structure manufactured using a photolithography process is disclosed. This structure is referred to as a side-by-side structure by photolithography (Ph-SbS). By using a photolithography process, the use of an FMM is eliminated, simplifying the process and reducing the process cost. In addition, the EAR within a subpixel is increased, thereby improving the lifespan. In addition, since an organic light-emitting element is deposited on a large-area substrate in an inline deposition system, productivity, yield, and material utilization efficiency can be improved.

[0052] Hereinafter, the red subpixel may be referred to as a first subpixel, the green subpixel may be referred to as a second subpixel, and the blue subpixel may be referred to as a third subpixel. Additionally, the red organic light-emitting element may be referred to as a first organic light-emitting element, the green organic light-emitting element may be referred to as a second organic light-emitting element, and the blue organic light-emitting element may be referred to as a third organic light-emitting element.

[0053] Hereinafter, the organic light-emitting display device is a top-emitting type that displays an image by emitting light in the upper direction of the substrate, but a bottom-emitting type that displays an image by emitting light in the lower direction of the substrate may also be included in the technical concept of the present invention.

[0054] FIG. 1 is a plan view schematically illustrating an organic light-emitting display device according to a first embodiment.

[0055] As illustrated in FIG. 1, the organic light-emitting display device according to the first embodiment may include a plurality of pixels (P) arranged in a matrix. The plurality of pixels (P) may be positioned in a display area (AA). An area other than the display area (AA) may be a non-display area (NAA).

[0056] A plurality of subpixels (SPr, SPg, SPb) may have different colors along a first direction (X) and the same color along a second direction (Y) intersecting the first direction (X).

[0057] The plurality of pixels (P) may include, for example, a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), a plurality of blue subpixels (SPb), etc.

[0058] A plurality of red subpixels (SPr), a plurality of green subpixels (SPg), and a plurality of blue subpixels (SPb) can be alternately arranged in a column-line unit along a first direction (X). The red subpixels (SPr), the green subpixels (SPg), and the blue subpixels (SPb) are sequentially positioned along the first direction (X), so that an organic light-emitting display device having a side-by-side structure can be implemented.

[0059] A plurality of red subpixels (SPr) may be arranged in a stripe shape along the second direction (Y). A plurality of green subpixels (SPg) may be arranged in a stripe shape along the second direction (Y). A plurality of blue subpixels (SPb) may be arranged in a stripe shape along the second direction (Y).

[0060] For example, a red organic light-emitting element (120r) may be placed in a red subpixel (SPr), a green organic light-emitting element (120g) may be placed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be placed in a blue subpixel (SPb).

[0061] Although the drawing depicts a pixel (P) as comprising three subpixels (SPr, SPg, SPb), it may comprise more subpixels. The drawing depicts the area of ​​the blue subpixel (SPb) as being larger than the area of ​​the red subpixel (SPr) or the area of ​​the green subpixel (SPg), but other variations are possible.

[0062] Each subpixel (SPr, SPg, SPb) may include an emissive area (EA) and a non-emissive area (NEA). The emissive area (EA) is an area where the organic light-emitting elements (120r, 120g, 120b) of the subpixel (SPr, SPg, SPb) are arranged, and the non-emissive area (NEA) may be an area remaining in each subpixel (SPr, SPg, SPb) excluding the emissive area (EA).

[0063] The red organic light-emitting device (120r), the green organic light-emitting device (120g), and the blue organic light-emitting device (120b) may each include an anode electrode, an organic light-emitting layer, and a cathode electrode. The organic light-emitting layer may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, a charge generation layer, and the like. The red organic light-emitting device (120r), the green organic light-emitting device (120g), and the blue organic light-emitting device (120b) may each include at least two stack structures. An organic light-emitting layer that emits light may be included in each stack structure.

[0064] The organic light-emitting layer and the cathode electrode may be arranged across a plurality of red subpixels (SPr) along the second direction (Y), respectively. In other words, the organic light-emitting layer and the cathode electrode may be arranged continuously without being separated along the second direction (Y), respectively.

[0065] In contrast, the anode electrode may be disposed only within the plurality of red subpixels (SPr) along the second direction (Y). That is, the anode electrode may not be disposed between the plurality of red subpixels (SPr) along the second direction (Y). In addition, the organic light-emitting layer and the cathode electrode may be disposed across the plurality of green subpixels (SPg) along the second direction (Y), and the anode electrode may be disposed only within each green subpixel (SPg) along the second direction (Y). The organic light-emitting layer and the cathode electrode may be disposed across the plurality of blue subpixels (SPb) along the second direction (Y), and the anode electrode may be disposed only within each blue subpixel (SPb) along the second direction (Y). Therefore, the light-emitting area (EA) within each subpixel (SPr, SPg, SPb) may be distinguished by the anode electrode provided in each subpixel (SPr, SPg, SPb).

[0066] Although not shown, the organic light-emitting layer and the cathode electrode may each be separated into at least two subpixel units or two or more row-line units.

[0067] Meanwhile, power lines (PL1 to PL3) may be provided to supply power to a plurality of subpixels (SPr, SPg, SPb). A power terminal (101) may be electrically connected to one end of a third power line (PL3). The power terminal (101) may be electrically connected to a power supply unit (not shown) to receive a first potential voltage. Although not shown, another power line may be provided to supply a second potential voltage greater than the first potential voltage.

[0068] Power wires (PL1 to PL3) may be arranged in a non-display area (NAA) and a display area (AA). The first and second power wires (PL1, PL2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the display area (AA) and may be electrically connected to the plurality of subpixels (SPr, SPg, SPb). The first and second power wires (PL1, PL2) may be electrically connected to a plurality of cathode electrodes (123r, 123g, 123b) of a plurality of organic light-emitting elements (120r, 120g, 120b) provided in the plurality of subpixels (SPr, SPg, SPb). The third power wire (PL3) may electrically connect a power terminal (101) and the second power wire (PL2) in the non-display area (NAA).

[0069] Meanwhile, each of the plurality of subpixels (SPr, SPg, SPb) may include a driving circuit, for example, a driving transistor. Another power wire may be electrically connected to the driving transistor of each of the subpixels (SPr, SPg, SPb), but is not limited thereto. Accordingly, when a specific subpixel is selected in response to a scan signal provided through a specific gate line, light having a luminance corresponding to a current flowing in the driving transistor of the specific subpixel may be emitted using the first potential voltage provided to the power wires (PL1 to PL3) and the second potential voltage provided through another power wire.

[0070] Meanwhile, a plurality of connection structures (130), a plurality of waterproof structures, a plurality of blocking structures, etc. may be arranged between a plurality of subpixels (SPr, SPg, SPg).

[0071] The connection structure (130) may be a structure that electrically connects the second power wire (PL2) to the cathode electrode of each organic light-emitting element (120r, 120g, 120b).

[0072] The blocking structure may be a structure that separates layers including low-resistance organic light-emitting materials of each organic light-emitting element (120r, 120g, 120b), such as a hole injection layer and a charge generation layer, to prevent electrical shorts between the anode electrode and the cathode electrode and reduce leakage current between sub-pixels.

[0073] As will be explained later, lateral leakage current or longitudinal leakage current between a plurality of subpixels (SPr, SPg, SPb) can be prevented by the blocking structure. The lateral leakage current may be a leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along a first direction (X), and the longitudinal leakage current may be a leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along a second direction (Y). In addition, an electrical short between an anode electrode and a cathode electrode in the corresponding subpixels (SPr, SPg, SPb) can be prevented by the blocking structure. Therefore, by using the blocking structure, color spotting caused by leakage current can be improved and luminous efficiency and brightness can be significantly improved.

[0074] Meanwhile, a waterproof structure may be positioned in the non-luminous area (NEA). The waterproof structure may prevent moisture, oxygen, etc. from penetrating into the non-indicator area (NAA) or the indicator area (AA).

[0075] As will be explained later, the waterproof structure can be arranged lengthwise along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0076] Since moisture, oxygen, etc. that have entered the display area (AA) from the non-display area (NAA) by the waterproof structure do not penetrate into each subpixel (SPr, SPg, SPb), the organic light-emitting layer of each subpixel (SPr, SPg, SPb) is not affected by moisture, oxygen, etc., and reliability can be dramatically improved. In other words, the organic light-emitting layer is vulnerable to moisture, oxygen, etc., and if the organic light-emitting layer is damaged by moisture, oxygen, etc., the corresponding subpixel (SPr, SPg, SPb) may not operate, resulting in light-emitting defects. If many subpixels (SPr, SPg, SPb) do not operate due to moisture, oxygen, etc., display defects such as point light-emitting defects or area light-emitting defects may occur, which may lower product reliability.

[0077] However, reliability can be improved by blocking moisture, oxygen, and other contaminants from the source through a waterproof structure such as the example.

[0078] Fig. 2 is a cross-sectional view illustrating an organic light emitting display device according to a first embodiment. Fig. 3 is a cross-sectional view illustrating an organic light emitting display device according to a second embodiment. Fig. 4 is a cross-sectional view illustrating an organic light emitting display device according to a third embodiment. Fig. 5 is a cross-sectional view illustrating an organic light emitting display device according to a fourth embodiment. Fig. 6 is a cross-sectional view illustrating an organic light emitting display device according to a fifth embodiment. Figs. 2 to 6 are cross-sectional views taken along lines A-A', B-B', C-C', D-D', and E-E' of Fig. 1, respectively.

[0079] Referring to FIGS. 1 to 6, an organic light-emitting display device according to an embodiment may include a plurality of banks (111-1, 111-2), a plurality of power wires (PL1 to PL3), a plurality of organic light-emitting elements (120r, 120g, 120b), a plurality of connection structures (130), etc.

[0080] A plurality of banks (111-1, 111-2), a plurality of power wires (PL1 to PL3), a plurality of organic light-emitting elements (120r, 120g, 120b), and a plurality of connection structures (130) can be arranged on a substrate (110).

[0081] An interlayer insulating layer (103) may be disposed on a substrate (110), and a plurality of banks (111-1, 111-2), a plurality of organic light-emitting elements (120r, 120g, 120b), and a plurality of connection structures (130) may be disposed on the interlayer insulating layer (103).

[0082] A plurality of driving circuits may be formed on the substrate (110). The plurality of driving circuits may be provided in each of the plurality of subpixels (SPr, SPg, SPb). The plurality of driving circuits may include a plurality of transistors, at least one capacitor, etc. The plurality of transistors may include a scan transistor, a driving transistor, a sensing transistor, etc.

[0083] The interlayer insulating layer (103) may be disposed on a plurality of driving circuits. The interlayer insulating layer (103) may be a planarizing layer. For this purpose, the upper surface of the interlayer insulating layer (103) may have a flat surface.

[0084] Meanwhile, a plurality of power wires (PL1 to PL3) may be arranged on the substrate (110). The plurality of power wires may include a plurality of first power wires (PL1), a plurality of second power wires (PL2), a third power wire (PL3), etc. The plurality of first power wires (PL1) and the plurality of second power wires (PL2) may be arranged on the display area (AA), and the plurality of third power wires (PL3) may be arranged on the non-display area (NAA).

[0085] The third power wire (PL3) can be electrically connected to the power terminal (101). The first power wire (PL1) and the second power wire (PL2) can electrically connect the third power wire (PL3) to a plurality of subpixels (SPr, SPg, SPb) on the display area (AA).

[0086] The third power wire (PL3) may be arranged on a different layer from the first power wire (PL1) and the second power wire (PL2). The first power wire (PL1) and the second power wire (PL2) may be arranged on the same layer, but this is not limited thereto.

[0087] The first power wire (PL1) and the second power wire (PL2) can be electrically connected to the third power wire (PL3) using contact pads. For example, the second power wire (PL2) can be arranged to extend from the display area (AA) to the non-display area (NAA), and can be electrically connected to the third power wire (PL3) using contact pads in the non-display area (NAA). The contact pads can be provided in the display area (AA) or the non-display area (NAA).

[0088] For example, the first power wiring (PL1) and the second power wiring (PL2) can be formed together with the source electrode and the drain electrode of the driving transistor. That is, the source electrode and the drain electrode of the driving transistor and the first power wiring (PL1) and the second power wiring (PL2) can be formed on the same layer using the same material using the same process.

[0089] For example, the third power wire (PL3) can be formed together with the cathode electrodes (123r, 123g, 123b). That is, the cathode electrodes (123r, 123g, 123b) and the third power wire (PL3) can be formed on the same layer using the same material using the same process.

[0090] Meanwhile, a plurality of first power wires (PL1) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y), and a plurality of second power wires (PL2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). The plurality of first power wires (PL1) may be arranged long along the first direction (X) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y), and the plurality of second power wires (PL2) may be arranged long along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0091] A plurality of first power wires (PL1) and a plurality of second power wires (PL2) may intersect and be connected to each other. The plurality of first power wires (PL1) and the plurality of second power wires (PL2) may have a matrix structure.

[0092] The plurality of banks may include a plurality of first banks (111-1) and a plurality of second banks (111-2). The first banks (111-1) and the second banks (111-2) may intersect and be connected to each other. The plurality of first banks (111-1) and the plurality of second banks (111-2) may have a matrix structure.

[0093] A plurality of first banks (111-1) may be arranged to correspond to a plurality of first power wires (PL1), and a plurality of second banks (111-2) may be arranged to correspond to a plurality of second power wires (PL2). That is, a plurality of first banks (111-1) may be arranged on a plurality of first power wires (PL1), and a plurality of second banks (111-2) may be arranged on a plurality of second power wires (PL2).

[0094] A plurality of first banks (111-1) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in a second direction (Y), and a plurality of second banks (111-2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in a first direction (X). A plurality of first banks (111-1) may be arranged long along the first direction (X) between a plurality of subpixels (SPr, SPg, SPb) in a second direction (Y), and a plurality of second banks (111-2) may be arranged long along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0095] For example, a plurality of light-emitting areas (EA) may be separated by a plurality of first banks (111-1) and a plurality of second banks (111-2). The plurality of light-emitting areas (EA) may be surrounded by a plurality of first banks (111-1) and a plurality of second banks (111-2).

[0096] As another example, a plurality of light-emitting areas (EA) can be separated by a plurality of anode electrodes (121r, 121g, 121b) individually provided in a plurality of subpixels (SPr, SPg, SPb). The plurality of anode electrodes (121r, 121g, 121b) are arranged only within the plurality of subpixels (SPr, SPg, SPb) and are not arranged between the plurality of subpixels (SPr, SPg, SPb).

[0097] As another example, the light-emitting area (EA) can be defined by the organic light-emitting layers (122r, 122g, 122b) exposed by the first bank (111-1) and the second bank (111-2). Since light is emitted only in the area of ​​the exposed organic light-emitting layers (122r, 122g, 122b) among the organic light-emitting layers (122r, 122g, 122b), the light-emitting area (EA) can be defined by the area exposed by the first bank (111-1) and the second bank (111-2).

[0098] Each of the subpixels (SPr, SPg, SPb) may include an emitting area (EA) and a non-emitting area (NEA). The area corresponding to the bank (111-1, 111-2) may be defined as the non-emitting area (NEA). In this case, the bank (111-1, 111-2) may be shared by adjacent subpixels (SPr, SPg, SPb). That is, a part of the bank (111-1, 111-2) may be included in one subpixel, and another part of the bank (111-1, 111-2) may be included in another subpixel adjacent to one subpixel.

[0099] A plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged in a plurality of sub-pixels (SPr, SPg, SPb), respectively. The plurality of organic light-emitting elements (120r, 120g, 120b) may include a plurality of anode electrodes (121r, 121g, 121b), a plurality of organic light-emitting layers (122r, 122g, 122b), and a plurality of cathode electrodes (123r, 123g, 123b).

[0100] The anode electrodes (121r, 121g, 121b) may be disposed only in the respective subpixels (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). The red anode electrode (121r) may be disposed only in the plurality of red subpixels (SPr) along the second direction (Y), the green anode electrode (121g) may be disposed only in the plurality of green subpixels (SPg) along the second direction (Y), and the blue anode electrode (121b) may be disposed only in the plurality of blue subpixels (SPb) along the second direction (Y).

[0101] The organic light-emitting layers (122r, 122g, 122b) may be separated from each other along the first direction (X) but may be arranged continuously along the second direction (Y). The red organic light-emitting layer (122r) may be arranged continuously in a plurality of red subpixels (SPr) as well as a plurality of first banks (111-1) along the second direction (Y). The green organic light-emitting layer (122g) may be arranged continuously in a plurality of green subpixels (SPg) as well as a plurality of first banks (111-1) along the second direction (Y). The blue organic light-emitting layer (122b) may be arranged continuously in a plurality of subpixels (SPr, SPg, SPb) as well as a plurality of first banks (111-1) along the second direction (Y). The red organic light-emitting layer (122r), the green organic light-emitting layer (122g), and the blue organic light-emitting layer (122b) may be referred to as the first organic light-emitting layer, the second organic light-emitting layer, and the third organic light-emitting layer, respectively.

[0102] The cathode electrodes (123r, 123g, 123b) may be arranged separately from each other along the first direction (X) but continuously along the second direction (Y). The red cathode electrode (123r) may be arranged continuously in a plurality of subpixels (SPr, SPg, SPb) as well as in a plurality of first banks (111-1) along the second direction (Y). The green cathode electrode (123g) may be arranged continuously in a plurality of green subpixels (SPg) as well as in a plurality of first banks (111-1) along the second direction (Y). The blue cathode electrode (123b) may be arranged continuously in a plurality of subpixels (SPr, SPg, SPb) as well as in a plurality of first banks (111-1) along the second direction (Y). The red cathode electrode (123r), the green cathode electrode (123g), and the blue cathode electrode (123b) may be referred to as the first cathode electrode, the second cathode electrode, and the third cathode electrode, respectively.

[0103] A plurality of connection structures (130) may be arranged in a plurality of first banks (111-1). Although the drawing illustrates that the connection structures (130) are arranged in all of the plurality of first banks (111-1), they may not be arranged in all of the plurality of first banks (111-1). That is, the connection structures (130) may be arranged in some of the first banks (111-1) among the plurality of first banks (111-1).

[0104] A plurality of first banks (111-1) may have a plurality of first grooves (131-1). The first grooves (131-1) may be locally formed in a portion of the first bank (111-1) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). The first grooves (131-1) may have a circular or rectangular shape when viewed from above, but are not limited thereto. The first grooves (131-1) may be formed by penetrating from the upper surface to the lower surface in the center of the first bank (111-1), but are not limited thereto.

[0105] As illustrated in FIG. 5, the connection structure (130) can be placed in the first groove (131-1) of the first bank (111-1). The connection structure (130) can electrically connect the green cathode electrode (123g) to the first power wire (PL1) in the first groove (131-1) of the first bank (111-1).

[0106] The connection structure (130) may include a lower electrode (130-1) and an upper electrode (130-2).

[0107] The lower electrode (130-1) may be formed by extending from the first power wire (PL1). Among the first power wires (PL1) arranged lengthwise along the first direction (X), the first power wire (PL1) corresponding to the first groove (131-1) of the first bank (111-1) may be formed as the lower electrode (130-1). Accordingly, the lower electrode (130-1) may be a part of the first power wire (PL1). The width of the lower electrode (130-1) may be greater than the width of the first power wire (PL1), but is not limited thereto.

[0108] The upper electrode (130-2) may be placed on the lower electrode (130-1). The lower surface of the upper electrode (130-2) may be in contact with the upper surface of the lower electrode (130-1). The upper electrode (130-2) may include the same material as the green anode electrode (121g).

[0109] The green cathode electrode (123g) can be electrically connected to the first power wire (PL1) via a connection structure (130). For this purpose, the green cathode electrode (123g) can be in contact with the upper surface of the upper electrode (130-2) of the connection structure (130).

[0110] A first groove (104) may also be formed in the interlayer insulating layer (103) corresponding to the first groove (131-1) of the first bank (111-1). The lower electrode (130-1) may be exposed by the first groove (104) of the interlayer insulating layer (103), and the upper electrode (130-2) may be disposed on the exposed lower electrode (130-1). In addition, the upper electrode (130-2) may be exposed by the first groove (131-1) of the first bank (111-1), and the green cathode electrode (123g) may be disposed on the exposed upper electrode (130-2).

[0111] After a green organic light-emitting layer (122g) is deposited on the upper electrode (130-2), the green organic light-emitting layer (122g) is removed to expose the upper electrode (130-2), and a green cathode electrode (123g) may be formed on the exposed upper electrode (130-2). If the green organic light-emitting layer (122g) is not completely removed, unremoved particles of the green organic light-emitting layer (122g), i.e., residual particles or lumps, may be disposed on the upper surface of the upper electrode (130-2). In this case, the green cathode electrode (123g) may contact the upper surface of the upper electrode (130-2) of the connection structure (130) through the residual particles or lumps.

[0112] Meanwhile, as illustrated in FIGS. 1 and 6, the first grooves (131-1, 104) are not formed in the remaining area except for the connection structure (130) between the plurality of blue subpixels (SPb) in the second direction. That is, since the first grooves (131-1, 104) are not formed in the interlayer insulating layer (103) and the first bank (111-1), the upper surface of the interlayer insulating layer (103) and the upper surface of the first bank (111-1) can have a flat plane. Accordingly, the green organic light-emitting layer (122g), the green cathode electrode (123g), etc. on the first bank (111-1) can be formed to be seamlessly connected to the adjacent green subpixels (SPg).

[0113] Meanwhile, a plurality of second banks (111-2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). The plurality of second banks (111-2) may be arranged lengthwise along the second direction (Y). A plurality of second grooves (131-2) may be formed in the plurality of second banks (111-2). The plurality of second grooves (131-2) may be formed lengthwise along the second direction (Y). The second grooves (131-2) may be formed to penetrate from the upper surface to the lower surface at the center of the second bank (111-2), but are not limited thereto.

[0114] A second groove (105) may also be formed in the interlayer insulating layer (103) corresponding to the second groove (131-2) of the second bank (111-2). The second power wiring (PL2) may be exposed by the second groove (105) of the interlayer insulating layer (103).

[0115] Meanwhile, as illustrated in FIGS. 2 to 4, the organic light-emitting display device according to the embodiment may include a plurality of inorganic insulating layers (135-1 to 135-5), a plurality of organic insulating layers (141-1 to 141-4), a plurality of waterproof structures (143, 144-1 to 144-3, 145-1 to 145-3), etc.

[0116] The plurality of inorganic insulating layers may include a first inorganic insulating layer (135-1), a second inorganic insulating layer (135-2), a third inorganic insulating layer (135-3), a fourth inorganic insulating layer (135-4), and a fifth inorganic insulating layer (135-5). The first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), the third inorganic insulating layer (135-3), the fourth inorganic insulating layer (135-4), and the fifth inorganic insulating layer (135-5) may each include at least one inorganic insulating film.

[0117] The first inorganic insulating layer (135-1) may be disposed on the green cathode electrode (123g) of the green organic light-emitting element (120g) in the green subpixel (SPg), the second inorganic insulating layer (135-2) may be disposed on the red cathode electrode (123r) of the red organic light-emitting element (120r) in the red subpixel (SPr), and the third inorganic insulating layer (135-3) may be disposed on the blue cathode electrode (123b) of the blue organic light-emitting element (120b) in the blue subpixel (SPb).

[0118] The first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) may each be formed as a double layer including a silicon oxide layer and a silicon nitride layer. The silicon nitride layer may be disposed on the silicon oxide layer. For example, the silicon oxide layer may be formed using an atomic layer deposition (ALD) process, and the silicon nitride layer may be formed using a chemical vapor deposition (CVD) process.

[0119] The fourth inorganic insulating layer (135-4) and the fifth inorganic insulating layer (135-5) may be disposed on the entire area of ​​the substrate (110). The fourth inorganic insulating layer (135-4) and the fifth inorganic insulating layer (135-5) may be formed of a silicon nitride series using a PECVD process, but are not limited thereto. At least one of the fourth inorganic insulating layer (135-4) and the fifth inorganic insulating layer (135-5) may be omitted.

[0120] Accordingly, by arranging multiple inorganic insulating layers (135-1 to 135-5) in each of multiple subpixels (SPr, SPg, SPb) or over the entire area of ​​the substrate (110), penetration of moisture, oxygen, etc. can be completely blocked.

[0121] The plurality of organic insulating layers may include a first organic insulating layer (141-1), a second organic insulating layer (141-2), a third organic insulating layer (141-3), and a fourth organic insulating layer (141-4).

[0122] The first organic insulating layer (141-1) may be disposed on the first inorganic insulating layer (135-1) in the green subpixel (SPg), the second organic insulating layer (141-2) may be disposed on the second inorganic insulating layer (135-2) in the red subpixel (SPr), and the third organic insulating layer (141-3) may be disposed on the third inorganic insulating layer (135-3) in the blue subpixel (SPb).

[0123] The fourth organic insulating layer (141-4) can be placed on the fifth inorganic insulating layer (135-5) formed over the entire area of ​​the substrate (110).

[0124] The first organic insulating layer (141-1), the second organic insulating layer (141-2), and the third organic insulating layer (141-3) can be used as color filter layers. In this case, the first organic insulating layer (141-1), the second organic insulating layer (141-2), and the third organic insulating layer (141-3) can transmit only light of a specific wavelength band from the light emitted from each of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b), respectively.

[0125] The first organic insulating layer (141-1), the second organic insulating layer (141-2), and the third organic insulating layer (141-3) can be used as photosensitive patterns. In this case, there is no need to form separate photosensitive patterns on the first organic insulating layer (141-1), the second organic insulating layer (141-2), and the third organic insulating layer (141-3).

[0126] The first organic insulating layer (141-1), the second organic insulating layer (141-2), and the third organic insulating layer (141-3) may be omitted, or the fourth organic insulating layer (141-4) may be omitted.

[0127] Meanwhile, a plurality of waterproof structures (143, 144-1 to 144-3, 145-1 to 145-3) may be arranged in a second bank (111-2) positioned between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). A plurality of waterproof structures (143, 144-1 to 144-3, 145-1 to 145-3) may be arranged in a second groove (131-2) of the second bank (111-2).

[0128] The plurality of waterproof structures may include a first waterproof structure (143), a second waterproof structure (144-1 to 144-3), a third waterproof structure (145-1 to 145-3), etc.

[0129] By arranging a plurality of waterproof structures, i.e., a first waterproof structure (143), a second waterproof structure (144-1 to 144-3), and a third waterproof structure (145-1 to 145-3) in the second groove (131-2) of the second bank (111-2), penetration of moisture, oxygen, etc. can be completely blocked.

[0130] The first waterproof structure (143) may be configured such that two or more inorganic insulating layers among a plurality of inorganic insulating layers (135-1 to 135-5) are overlapped on the second bank (111-2).

[0131] As illustrated in FIG. 2, a first inorganic insulating layer (135-1), a second inorganic insulating layer (135-2), and a third inorganic insulating layer (135-3) may be overlapped in a second groove (131-2) of a second bank (111-2) disposed between a red subpixel (SPr) and a green subpixel (SPg), thereby forming a first waterproof structure (143). For example, the second inorganic insulating layer (135-2) may be disposed on the first inorganic insulating layer (135-1), and the third inorganic insulating layer (135-3) may be disposed on the second inorganic insulating layer (135-2).

[0132] The third inorganic insulating layer (135-3), which is the uppermost layer, may be an island insulating pattern (135-3a). The island insulating pattern (135-3a) may be a part of the third inorganic insulating layer (135-3) disposed on the blue cathode electrode (123b) of the blue subpixel (SPb), and may be spaced apart from the third inorganic insulating layer (135-3) disposed on the blue subpixel (SPb). Since the island insulating pattern (135-3a) is included in the first waterproof structure (143), the waterproof performance may be further improved.

[0133] The first organic insulating layer (141-1) may be disposed between the second inorganic insulating layer (135-2) and the first inorganic insulating layer (135-1), and the second organic insulating layer (141-2) may be disposed between the third inorganic insulating layer (135-3) and the second inorganic insulating layer (135-2). In this case, the first organic insulating layer (141-1) and the second organic insulating layer (141-2) may each have round surfaces. Accordingly, the second inorganic insulating layer (135-2) and the third inorganic insulating layer (135-3) disposed on the first organic insulating layer (141-1) and the second organic insulating layer (141-2) may each have round surfaces.

[0134] The fourth organic insulating layer (141-4) may be a planarizing layer having a flat upper surface.

[0135] As illustrated in FIG. 3, a second inorganic insulating layer (135-2) and a third inorganic insulating layer (135-3) may be overlapped in a second groove (131-2) of a second bank (111-2) disposed between a blue subpixel (SPb) and a red subpixel (SPr), thereby forming a first waterproof structure (143). The third inorganic insulating layer (135-3) may be disposed on the second inorganic insulating layer (135-2), and the second organic insulating layer (141-2) may be disposed between the third inorganic insulating layer (135-3) and the second inorganic insulating layer (135-2). Since the second organic insulating layer (141-2) has a round surface, the third inorganic insulating layer (135-3) on the second organic insulating layer (141-2) may have a round surface.

[0136] As illustrated in FIG. 4, a first inorganic insulating layer (135-1) and a third inorganic insulating layer (135-3) may be overlapped in a second groove (131-2) of a second bank (111-2) disposed between a green subpixel (SPg) and a blue subpixel (SPb), thereby forming a first waterproof structure (143). The third inorganic insulating layer (135-3) may be disposed on the first inorganic insulating layer (135-1), and the first organic insulating layer (141-1) may be disposed between the third inorganic insulating layer (135-3) and the first inorganic insulating layer (135-1). Since the first organic insulating layer (141-1) has a round surface, the third inorganic insulating layer (135-3) on the first organic insulating layer (141-1) may have a round surface.

[0137] As illustrated in FIGS. 2 to 4, a plurality of second power wires (PL2) may be arranged under a plurality of second banks (111-2). The plurality of second power wires (PL2) may be exposed by a plurality of second grooves (131-2) of the plurality of second banks (111-2). A first waterproof structure (143) in which at least two or more inorganic insulating layers among a plurality of inorganic insulating layers (135-1 to 135-5) are overlapped may be positioned on the plurality of second power wires (PL2).

[0138] The second power wiring (PL2) may be provided to prevent the interlayer insulating layer (103) from being excessively etched when the interlayer insulating layer (103) under the second bank (111-2) is removed to form the first undercut structure (151) and the second undercut structure (152). If there is no concern that the interlayer insulating layer (103) will be excessively etched, the second power wiring (PL2) may be omitted.

[0139] Meanwhile, the second waterproof structure (144-1 to 144-3) may be configured such that one of the plurality of inorganic insulating layers (135-1 to 135-5) is formed in a curved shape by the first undercut structure (151). The third waterproof structure (145-1 to 145-3) may be configured such that another of the plurality of inorganic insulating layers (135-1 to 135-5) is formed in a curved shape by the second undercut structure (152).

[0140] The first undercut structure (151) and the second undercut structure (152) can be formed on the lower side of the second bank (111-2) that is in contact with the second groove (131-2) of the second bank (111-2). The first undercut structure (151) and the second undercut structure (152) can be formed by removing the interlayer insulating layer (103) located on the lower side of the second bank (111-2) that is in contact with the second groove (131-2) of the second bank (111-2). That is, the first undercut structure (151) and the second undercut structure (152) can be formed by the side portion of the interlayer insulating layer (103) entering outward from the inner side of the second bank (111-2) that is in contact with the second groove (131-2) of the second bank (111-2).

[0141] As illustrated in FIG. 2, the first inorganic insulating layer (135-1) may be formed in a curved shape by the first undercut structure (151) to form the second waterproof structure (144-1). The first inorganic insulating layer (135-1) may be disposed on the lower side of the second bank (111-2) in contact with the second groove (131-2) by the first undercut structure (151) and on the side of the interlayer insulating layer (103), thereby forming the second waterproof structure (144-1) in a curved shape. Since the first inorganic insulating layer (135-1) is formed in a curved shape, the penetration path of moisture, oxygen, etc. may be maximized, thereby improving the waterproofing characteristics.

[0142] A third waterproof structure (145-1) can be formed by forming a second inorganic insulating layer (135-2) in a curved shape by the second undercut structure (152) of the second bank (111-2). The second inorganic insulating layer (135-2) is disposed on the lower side of the second bank (111-2) in contact with the second groove (131-2) by the second undercut structure (152) and on the side of the interlayer insulating layer (103), thereby forming a third waterproof structure (145-1) in a curved shape. Since the second inorganic insulating layer (135-2) is formed in a curved shape, the penetration path of moisture, oxygen, etc. can be maximized, thereby improving the waterproofing characteristics.

[0143] As illustrated in FIG. 3, the second inorganic insulating layer (135-2) may be formed in a curved shape by the first undercut structure (151) of the second bank (111-2), so that the second waterproof structure (144-2) may be configured. The second inorganic insulating layer (135-2) may be disposed on the lower side of the second bank (111-2) and the side of the interlayer insulating layer (103) that contacts the second groove (131-2) by the first undercut structure (151), so that the second waterproof structure (144-2) may be formed in a curved shape. Since the second inorganic insulating layer (135-2) is formed in a curved shape, the penetration path of moisture, oxygen, etc. may be maximized, so that the waterproofing characteristics may be improved.

[0144] A third inorganic insulating layer (135-3) may be formed in a curved shape by the second undercut structure (152) of the second bank (111-2), so that a third waterproof structure (145-2) may be configured. The third inorganic insulating layer (135-3) may be disposed on the lower side of the second bank (111-2) and the side of the interlayer insulating layer (103) that contacts the second groove (131-2) by the second undercut structure (152), so that the third waterproof structure (145-2) may be formed in a curved shape. Since the third inorganic insulating layer (135-3) is formed in a curved shape, the penetration path for moisture, oxygen, etc. may be maximized, so that the waterproofing characteristics may be improved.

[0145] As illustrated in FIG. 4, the third inorganic insulating layer (135-3) may be formed in a curved shape by the first undercut structure (151) of the second bank (111-2), so that the second waterproof structure (144-3) may be configured. The third inorganic insulating layer (135-3) may be disposed on the lower side of the second bank (111-2) and the side of the interlayer insulating layer (103) that contacts the second groove (131-2) by the first undercut structure (151), so that the second waterproof structure (144-3) may be formed in a curved shape. Since the third inorganic insulating layer (135-3) is formed in a curved shape, the penetration path of moisture, oxygen, etc. may be maximized, so that the waterproofing characteristics may be improved.

[0146] A third waterproof structure (145-3) can be formed by forming a first inorganic insulating layer (135-1) in a curved shape by a second undercut structure (152) of a second bank (111-2). The first inorganic insulating layer (135-1) is disposed on the lower side of the second bank (111-2) in contact with the second groove (131-2) by the second undercut structure (152) and on the side of the interlayer insulating layer (103), thereby forming a third waterproof structure (145-3) in a curved shape. Since the first inorganic insulating layer (135-1) is formed in a curved shape, the penetration path of moisture, oxygen, etc. can be maximized, thereby improving the waterproofing characteristics.

[0147] According to an embodiment, a connection structure (130) is arranged in the first groove (131-1) of a plurality of first banks (111-1) between a plurality of subpixels (SPr, SPg, SPb) having the same color along the second direction (Y), thereby facilitating electrical connection between the cathode electrodes (123r, 123g, 123b) of the plurality of subpixels (SPr, SPg, SPb) and the first power wiring (PL1), and preventing a short-circuit defect, thereby preventing malfunction or light emission defect of the subpixels (SPr, SPg, SPb), thereby improving reliability. In particular, by grouping a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) and arranging the connection structure (130) between the grouped subpixels, the number of shots of the laser beam can be drastically reduced when using a laser ablation process to be described later, thereby reducing the process time or process cost.

[0148] According to an embodiment, a plurality of waterproof structures (143, 144-1 to 144-3, 145-1 to 145-3) are arranged in each of a plurality of second banks (111-2), so that moisture, oxygen, etc. penetrating along the second direction (Y) do not penetrate into the plurality of subpixels (SPr, SPg, SPb), thereby preventing malfunctions in operation or light emission of the subpixels (SPr, SPg, SPb), and thus improving reliability.

[0149] FIGS. 7A to 7R illustrate a manufacturing process of an organic light-emitting display device along line A-A' of FIG. 1. FIGS. 8A to 8R illustrate a manufacturing process of an organic light-emitting display device along line D-D' of FIG. 1.

[0150] Although FIGS. 7A to 7R and 8A to 8R illustrate that a green organic light-emitting element (120g), a red organic light-emitting element (120r), and a blue organic light-emitting element (120b) are manufactured in that order, the order can also be changed. For example, a green organic light-emitting element (120g) can be manufactured (FIGS. 7A to 7J and FIGS. 8A to 8J), a red organic light-emitting element (120r) can be manufactured (FIGS. 7K to 7N and FIGS. 8K to 8N), and a blue organic light-emitting element (120b) can be manufactured (FIGS. 7O to 7Q and FIGS. 8O to 8Q).

[0151] As shown in FIG. 7a and FIG. 8a, a driving circuit, a first power wire (PL1), a second power wire (PL2), a lower electrode (130-1), and an interlayer insulating layer (103) can be formed on a substrate (110).

[0152] The substrate (110) may include a material with excellent insulating performance. For example, the substrate (110) may include a plastic material, a resin material, glass, etc. The substrate (110) may include a rigid material or a flexible material.

[0153] The driving circuit may include a plurality of transistors including a driving transistor, at least one capacitor, and the like. The driving circuit may be formed on a substrate (110) using a semiconductor process. Each of the plurality of transistors may include a gate electrode, a source electrode, and a drain electrode.

[0154] The first power wire (PL1), the second power wire (PL2) and the lower electrode (130-1) can be formed simultaneously with the same material as the source electrode and the drain electrode.

[0155] The interlayer insulating layer (103) may be a single organic insulating layer or may include multiple insulating layers including an organic insulating layer and an inorganic insulating layer.

[0156] As illustrated in FIG. 8A, the interlayer insulating layer (103) may be etched so that the lower electrode (130-1) is exposed between a plurality of green subpixels (SPg) in the second direction (Y). By etching the interlayer insulating layer (103), a first groove (104) may be formed in the interlayer insulating layer (103). Although not illustrated, a first groove (104) may be formed in the interlayer insulating layer (103) between a plurality of red subpixels (SPr) in the second direction (Y) and between a plurality of blue subpixels (SPb) in the second direction (Y).

[0157] As shown in FIGS. 7b and 8b, a red anode electrode (121r), a green anode electrode (121g), an upper electrode (130-2), etc. can be formed on the interlayer insulating layer (103).

[0158] A red anode electrode (121r) may be formed in a red subpixel (SPr), and a green anode electrode (121g) may be formed in a green subpixel (SPg). Although not shown, a blue anode electrode may be formed in a blue subpixel (SPb).

[0159] The upper electrode (130-2) may be formed between adjacent green subpixels (SPg) and may be formed spaced apart from the green anode electrode (121g) formed in the green subpixel (SPg). The upper electrode (130-2) may be in contact with the upper surface of the lower electrode (130-1) through the interlayer insulating layer (103), thereby forming a connection structure (130). Although not shown, the connection structure (130) may also be formed between a plurality of red subpixels (SPr) in the second direction (Y) or between a plurality of blue subpixels (SPb) in the second direction (Y).

[0160] As shown in FIG. 7c and FIG. 8c, at least one inorganic film (111a) may be formed on the interlayer insulating layer (103), and a photosensitive pattern (210) may be formed on the inorganic film (111a).

[0161] As shown in FIGS. 7d ​​and 8d, a dry etching process can be performed using a photosensitive pattern (210) to remove the inorganic film (111a).

[0162] By removing the inorganic film (111a), a first groove (104, 131-1) can be formed between a plurality of green subpixels (SPg) in the second direction (Y), and a second groove (105, 131-2) can be formed between the red subpixel (SPr) and the green subpixel (SPg). The upper electrode (130-2) of the connection structure (130) can be exposed by the first groove (104, 131-1), and the second power wiring (PL2) can be exposed by the second groove (105, 131-2).

[0163] The first groove ((104, 131-1) may be locally formed only in the first bank (111-1) between adjacent green subpixels (SPg) in the second direction (Y). The second groove (105, 131-2) may be formed long along the second direction (Y) between the red subpixel (SPr) and the green subpixel (SPg).

[0164] The inner side of the second bank (111-2) in contact with the second home (105, 131-2) and the inner side of the interlayer insulation layer (103) can be positioned on the same vertical line or diagonal line.

[0165] Meanwhile, a wet etching process can be performed using a photosensitive pattern (210).

[0166] In this case, as illustrated in FIG. 7e, the inner portion of the interlayer insulating layer (103) below the second bank (111-2) in contact with the second groove (105, 131-2) may be additionally removed to form a first undercut structure (151) and a second undercut structure (152). For example, the first undercut structure (151) may be formed on the lower side of the second bank (111-2) adjacent to the green subpixel (SPg), and the second undercut structure (152) may be formed on the lower side of the second bank (111-2) adjacent to the red subpixel (SPr).

[0167] As illustrated in FIG. 8e, since the interlayer insulating layer (103) is not exposed by the first groove ((104, 131-1)) of the first bank (111-1), the interlayer insulating layer (103) under the first bank (111-1) may not be removed while the inner portion of the interlayer insulating layer (103) under the second bank (111-2) is additionally removed.

[0168] Afterwards, the photosensitive pattern (210) can be removed.

[0169] As illustrated in FIGS. 7f and 8f, a green organic light-emitting layer (122g) may be deposited on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110). The green organic light-emitting layer (122g) may be deposited on a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), a plurality of first banks (111-1), and a plurality of second banks (111-2). Although not illustrated, the green organic light-emitting layer (122g) may be disposed on a plurality of blue subpixels (SPb).

[0170] At least two stack structures may be formed by the green organic light-emitting layer (122g). The green organic light-emitting layer (122g) may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, a charge generation layer, etc.

[0171] As illustrated in FIG. 7f, the green organic light-emitting layer (122g) deposited on the second power wiring (PL2) and the green organic light-emitting layer (122g) deposited on the upper side of the second bank (111-2) can be separated from each other by the first undercut structure (151) and the second undercut structure (152).

[0172] As illustrated in FIG. 8f, a green organic light-emitting layer (122g) can be deposited on adjacent green subpixels (SPg) and the upper and upper electrodes (130-2) of the first bank (111-1) so as to be connected to each other along the second direction (Y).

[0173] As illustrated in FIG. 8g, the green organic light-emitting layer (122g) deposited on the upper electrode (130-2) of the connection structure (130) in the first groove (104, 131-1) can be removed using a laser ablation process. The laser ablation process may be, for example, a vacuum laser ablation process, but is not limited thereto.

[0174] Since the connection structure (130) is exposed using a laser ablation process, the laser beam can be irradiated only on the connection structure (130) among the entire area of ​​the connection substrate (110).

[0175] The green organic light-emitting layer (122g) may be heated, evaporated, or sublimated by the laser beam irradiated on the connection structure (130). Accordingly, the green organic light-emitting layer (122g) on ​​the upper electrode (130-2) may be removed, thereby exposing the upper electrode (130-2) of the connection electrode (130).

[0176] Since the laser beam is locally irradiated only on the upper electrode (130-2), the area irradiated with the laser beam in the green organic light-emitting layer (122g) on ​​the upper electrode (130-2) can be cleanly sublimated and removed.

[0177] The above-described connection structure (130) can solve the problem of darkness in the center of the panel even if more than 5 subpixels are connected per stripe depending on the size of the product. A mobile product having a size of about 7 to 8 inches may not be provided with the above-described connection structure (130). This is because the power can be electrically connected to a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) in both areas of the stripe pattern in the second direction (Y), for example, the upper bezel area and the lower bezel area. The electrical connection in the upper bezel area and the lower bezel area can be possible through an organic cell mask and / or an inorganic cell mask using a deposition process.

[0178] The above-described connection structure (130) may be necessary for products with a size of 8 to 9 inches or larger, to solve problems such as brightness reduction in the central part of the panel due to RC delay of the power supply as the screen gets larger.

[0179] As illustrated in FIGS. 7h and 8h, the green cathode electrode (123g) and the first inorganic insulating layer (135-1) may be formed on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110). The first inorganic insulating layer (135-1) may be formed on the green cathode electrode (123g). The green cathode electrode (123g) and the first inorganic insulating layer (135-1) may be formed on a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), the first bank (111-1), and the second bank (111-2). Although not illustrated, the green cathode electrode (123g) and the first inorganic insulating layer (135-1) may be formed on a plurality of blue subpixels (SPb).

[0180] As illustrated in FIG. 7h, the green cathode electrode (123g) deposited on the second power wiring (PL2) and the green cathode electrode (123g) deposited on the upper side of the second bank (111-2) can be separated from each other by the first undercut structure (151) and the second undercut structure (152). Alternatively, when the green cathode electrode (123g) includes a conductive layer such as ITO having excellent step coverage, the green cathode electrode (123g) deposited on the second power wiring (PL2) and the green cathode electrode (123g) deposited on the upper side of the second bank (111-2) can be formed to be seamlessly connected.

[0181] As illustrated in FIG. 8h, a green cathode electrode (123g) connected to a connection structure (130) may be formed to be connected to an adjacent green subpixel (SPg) via the upper side of the first bank (111-1). The green cathode electrode (123g) of each of a plurality of green subpixels (SPg) in the second direction (Y) may be in contact with the upper surface of the upper electrode (130-2) of the connection structure (130) in the first groove ((104, 131-1)) of the first bank (111-1), thereby being electrically connected to the first power wire (PL1) via the connection structure (130).

[0182] The first inorganic insulating layer (135-1) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0183] When the first inorganic insulating layer (135-1) is formed as a double layer, the first inorganic insulating layer (135-1) can be formed without interruption on the lower side of the second bank (111-2), the side of the interlayer insulating layer (103), and the upper side of the second power wiring (PL2) in the first undercut structure (151) and the second undercut structure (152). Accordingly, the second waterproof structures (144-1 to 144-3) can be formed by the first inorganic insulating layer (135-1) formed in the first undercut structure (151) and the second undercut structure (152). Moisture, oxygen, etc. are blocked by the first inorganic insulating layer (135-1), so that they do not penetrate into the green organic light-emitting layer (122g) or the green cathode electrode (123g) through the lower side of the second bank (111-2) or the side of the interlayer insulating layer (103) in the first undercut structure (151) and the second undercut structure (152), and thus the performance of preventing penetration of moisture, oxygen, etc. can be enhanced by the second waterproof structure (144-1 to 144-3).

[0184] As illustrated in FIGS. 7i and 8i, the first organic insulating layer (141-1) may be formed on a plurality of green subpixels (SPg) in the second direction (Y). In other words, the first organic insulating layer (141-1) may not be formed on a plurality of red subpixels (SPr) or a plurality of blue subpixels (SPb) in the second direction (Y). The first organic insulating layer (141-1) may not be formed on the upper side of the second bank (111-2) adjacent to the red anode electrode (121r) or the blue anode electrode (121b).

[0185] The first organic insulating layer (141-1) may be a color filter layer or a photosensitive pattern.

[0186] As illustrated in FIGS. 7j and 8j, an etching process may be performed to remove the green organic light-emitting layer (122g), the green cathode electrode (123g), and the first inorganic insulating layer (135-1) formed in the remaining area except for the plurality of green subpixels (SPg) in the second direction (Y), i.e., the plurality of red subpixels (SPr) and the plurality of blue subpixels (SPb). Accordingly, a plurality of green organic light-emitting elements (120g) may be formed in the plurality of green subpixels (SPg) in the second direction (Y).

[0187] As shown in FIGS. 7k and 8k, a red organic light-emitting layer (122r) can be deposited on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110).

[0188] As illustrated in FIG. 7k, a red organic light-emitting layer (122r) may be deposited on a red anode electrode (121r) in a red subpixel (SPr). The red organic light-emitting layer (122r) deposited on the upper side of the second bank (111-2) and the red organic light-emitting layer (122r) deposited on the second power wiring (PL2) in the second groove (105, 131-2) may be separated.

[0189] As illustrated in FIG. 8k, a red organic light-emitting layer (122r) can be deposited on the first organic insulating layer (141-1) in the green subpixel (SPg).

[0190] Although not shown, the red organic light-emitting layer (122r) deposited on the connection structure (130) in the first groove ((104, 131-1) of the first bank (111-1) between the red subpixels (SPr) in the second direction (Y) may be removed using a laser ablation process, thereby exposing the upper electrode (130-2) of the connection structure (130).

[0191] As shown in FIGS. 7l and 8l, a red cathode electrode (123r) and two inorganic insulating layers (135-2) can be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110).

[0192] As illustrated in FIG. 7l, a red cathode electrode (123r) may be deposited on a red organic light-emitting layer (122r) in a red subpixel (SPr). The red cathode electrode (123r) deposited on the upper side of the second bank (111-2) and the red cathode electrode (123r) deposited on the second power wiring (PL2) in the second groove (105, 131-2) may be separated.

[0193] Although not shown, the red cathode electrode (123r) may be electrically connected to a connection structure (130) formed between a plurality of red subpixels (SPr) in the second direction (Y). The red cathode electrode (123r) of each of the plurality of red subpixels (SPr) in the second direction (Y) may be electrically connected to the first power wire (PL1) through the connection structure (130) by the red cathode electrode (123r) being in contact with the upper surface of the upper electrode (130-2) of the connection structure (130).

[0194] As illustrated in FIG. 8l, the red cathode electrode (123r) may be deposited on the red organic light-emitting layer (122r) in the green subpixel (SPg). Although not illustrated, the red cathode electrode (123r) may be deposited on the red organic light-emitting layer (122r) in the blue subpixel (SPb).

[0195] The second inorganic insulating layer (135-2) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0196] As illustrated in FIGS. 7m and 8m, the second organic insulating layer (141-2) may be formed on a plurality of red subpixels (SPr) in the second direction (Y). In other words, the second organic insulating layer (141-2) may not be formed on a plurality of green subpixels (SPg) or a plurality of blue subpixels (SPb) in the second direction (Y). The second organic insulating layer (141-2) may not be formed on the upper side of the second bank (111-2) adjacent to the green anode electrode (121g) or the blue anode electrode (121b).

[0197] The second organic insulating layer (141-2) may be a color filter layer or a photosensitive pattern.

[0198] As illustrated in FIGS. 7n and 8n, an etching process may be performed to remove the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) formed in the remaining area except for the plurality of red subpixels (SPr) in the second direction (Y), i.e., the plurality of green subpixels (SPg) and the plurality of blue subpixels (SPb). Accordingly, a plurality of red organic light-emitting elements (120r) may be formed in the plurality of red subpixels (SPr) in the second direction (Y).

[0199] As shown in FIGS. 7o and 8o, a blue organic light-emitting layer (122b), a blue cathode electrode (123b), and a third inorganic insulating layer (135-3) can be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110).

[0200] Although not shown, the blue cathode electrode (123b) may be electrically connected to a connection structure (130) formed between a plurality of blue subpixels (SPb) in the second direction (Y). The blue cathode electrode (123b) of each of the plurality of blue subpixels (SPb) in the second direction (Y) may be electrically connected to the first power wire (PL1) through the connection structure (130) by contacting the upper surface of the upper electrode (130-2) of the connection structure (130).

[0201] The third inorganic insulating layer (135-3) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0202] As illustrated in FIGS. 7p and 8p, the third organic insulating layer (141-3) may be formed on a plurality of blue subpixels (SPb) in the second direction (Y). In other words, the third organic insulating layer (141-3) may not be formed on a plurality of red subpixels (SPr) or a plurality of green subpixels (SPg) in the second direction (Y). The third organic insulating layer (141-3) may not be formed on the upper side of the second bank (111-2) adjacent to the red anode electrode (121r) or the green anode electrode (121g).

[0203] The third organic insulating layer (141-3) may be a color filter layer or a photosensitive pattern.

[0204] An etching process may be performed to remove the blue organic light-emitting layer (122b), the blue cathode electrode (123b), and the third inorganic insulating layer (135-3) formed in the remaining area except for the plurality of blue subpixels (SPb) in the second direction (Y), i.e., the plurality of red subpixels (SPr) and the plurality of green subpixels (SPg). Accordingly, a plurality of blue organic light-emitting elements (120b) may be formed in the plurality of blue subpixels (SPb) in the second direction (Y).

[0205] Meanwhile, as illustrated in FIG. 7p, at least one layer among the blue organic light-emitting layer (122b), the blue cathode electrode (123b), the third inorganic insulating layer (135-3), and the third organic insulating layer (141-3) may be formed on the second bank (111-2) between the red subpixel (SPr) and the green subpixel (SPg). The third inorganic insulating layer (135-3) formed on the second bank (111-2) between the red subpixel (SPr) and the green subpixel (SPg) may be an island insulating pattern (135-3a). The island insulating pattern (135-3a) may be formed on the second bank (111-2) between the red subpixel (SPr) and the green subpixel (SPg) and spaced apart from the third inorganic insulating layer (135-3) formed on the plurality of blue subpixels (SPb).

[0206] As illustrated in FIGS. 7Q and 8Q, the fourth inorganic insulating layer (135-4) may be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110). The fourth inorganic insulating layer (135-4) may be formed of an inorganic material such as silicon nitride (SiNx) using a PECVD process, but is not limited thereto. The fourth inorganic insulating layer (135-4) may also be omitted.

[0207] As shown in FIG. 7r and FIG. 8r, a fourth organic insulating layer (141-4) and a fifth inorganic insulating layer (135-5) can be formed on a fourth inorganic insulating layer (135-4).

[0208] The fourth organic insulating layer (141-4) may be formed using an inkjet process, but is not limited thereto. The fifth inorganic insulating layer (135-5) may be formed using a PECVD process using an inorganic material such as silicon nitride (SiNx), but is not limited thereto.

[0209] Fig. 9 is a cross-sectional view illustrating an organic light-emitting display device according to a sixth embodiment. Although Fig. 9 illustrates a green organic light-emitting element (120g), the organic light-emitting display device according to the sixth embodiment can be equally applied to a red organic light-emitting element (120r) or a blue organic light-emitting element (120b).

[0210] The sixth embodiment is identical to the fourth embodiment (Fig. 5) except for the connection structure (130). In the sixth embodiment, components having the same shape, structure, and / or function as those in the fourth embodiment (Fig. 5) are given the same drawing reference numerals, and detailed descriptions are omitted.

[0211] As illustrated in FIG. 9, the connection structure (130) may include an auxiliary electrode (132) and a connection portion (124).

[0212] The auxiliary electrode (132) may extend from the first power wire (PL1). The auxiliary electrode (132) may be the same as the lower electrode (130-1) illustrated in FIG. 5, but is not limited thereto.

[0213] The connecting portion (124) may be placed on the auxiliary electrode (132). The connecting portion (124) may be formed by penetrating the green organic light-emitting layer (122g).

[0214] The green cathode electrode (123g) can be in contact with a portion of the auxiliary electrode (132) through the connection portion (124). The green cathode electrode (123g) can be in contact with a portion of the upper surface of the auxiliary electrode (132) through the connection portion (124).

[0215] The connecting portion (124) may include the same material as the anode electrode (121r, 121g, 121b) or the source electrode and drain electrode of the driving transistor. The source electrode and drain electrode of the driving transistor may be made of, for example, copper (Cu), aluminum (Al), titanium (Ti) or an alloy thereof.

[0216] As will be explained later, the connection (124) can be formed using a laser welding process. Unlike the vacuum ablation process described above, the laser welding process does not sublimate in a vacuum, but rather allows for mutual bonding through melting by instantaneous heating of the metal at atmospheric pressure. The atmosphere of the laser welding process can be a nitrogen (N2) atmosphere at atmospheric pressure or a clean room environment.

[0217] The upper side of the green cathode electrode (123g) is protected by at least an inorganic insulating film, so that the two electrodes can be joined together without generating particles during the laser welding process. For example, if the green cathode electrode (123g) is made of copper (Cu), it can induce the formation of whiskers. Whiskers refer to a phenomenon in which a metal single crystal naturally grows on a metal surface. For example, if the green cathode electrode (123g) is made of aluminum (Al), it can induce the formation of hill-lock.

[0218] Meanwhile, silver (Ag) included in the green cathode electrode (123g) and silver (Ag) included in the green anode electrode (a21g) can serve as a medium for forming a connection (124).

[0219] Meanwhile, the green cathode electrode (123g) may include a first conductive layer (123-1) and a second conductive layer (123-2). The second conductive layer (123-2) may be disposed on the first conductive layer (123-1).

[0220] The first conductive layer (123-1) may include a material with excellent electrical conductivity, such as Mg:Ag. The second conductive layer (123-2) may include a conductive oxide material with excellent step coverage, such as ITO.

[0221] The first conductive layer (123-1) including Mg:Ag, etc. may have poor step coverage. If the first conductive layer (123-1) is formed with a very thin thickness of approximately 10 nm, the poor step coverage may result in increased resistance or disconnection. To solve this problem, a second conductive layer (123-2) including ITO, etc., having excellent step coverage may be formed on the first conductive layer (123-1), thereby reducing resistance and preventing disconnection. That is, the second conductive layer (123-2) may be formed seamlessly on the first bank (111-1) between the plurality of green subpixels (SPg) and the plurality of green subpixels (SPg) along the second direction (Y).

[0222] Meanwhile, a laser welding process may be performed after a red cathode electrode (123r) including a first conductive layer (123-1) and a second conductive layer (123-2) is formed on a green organic light-emitting layer (122g). In this case, the green organic light-emitting layer (122g) may be removed by a laser beam, and the first conductive layer (123-1) may be melted. The melted first conductive layer (123-1) may fill the area where the green organic light-emitting layer (122g) was removed, thereby forming a connecting portion (124). Therefore, the connecting portion (124) may be formed of the same material as the first conductive layer (123-1).

[0223] Since the laser beam passes through the second conductive layer (123-2), the second conductive layer (123-2) is not melted by the laser beam. Even if the green organic light-emitting layer (122g) is removed and the first conductive layer (123-1) is melted, the second conductive layer (123-2) can be stably electrically connected to the auxiliary electrode (132) through the connecting portion (124). In addition, since the second conductive layer (123-2) passes the laser beam and does not melt, it can serve as a support for the connecting structure (130).

[0224] Meanwhile, in the first to fifth embodiments (FIGS. 2 to 6), three laser ablation processes may be performed to sequentially form a plurality of connection structures (130) on the first banks (111-1) between the plurality of green subpixels (SPg) in the second direction (Y), on the plurality of first banks (111-1) between the plurality of red subpixels (SPr) in the second direction (Y), and on the plurality of first banks (111-1) between the plurality of blue subpixels (SPb) in the second direction (Y). For example, after a plurality of green organic light-emitting elements (120g) are formed on the plurality of green subpixels (SPg), one laser ablation process may be performed to sequentially form a plurality of connection structures (130) on the first banks (111-1) between the plurality of green subpixels (SPg) in the second direction (Y). Thereafter, after a plurality of red organic light-emitting elements (120r) are formed in a plurality of red subpixels (SPr), a single laser ablation process may be performed to form a plurality of connection structures (130) on the first bank (111-1) between the plurality of red subpixels (SPr) in the second direction (Y). Thereafter, after a plurality of blue organic light-emitting elements (120b) are formed in a plurality of blue subpixels (SPb), a single laser ablation process may be performed to form a plurality of connection structures (130) on the first bank (111-1) between the plurality of blue subpixels (SPb) in the second direction (Y).

[0225] In contrast, in the sixth embodiment (Fig. 9), only one laser welding process is performed, so that a plurality of connection structures (130) can be formed on a plurality of first banks (111-1) between a plurality of red subpixels (SPr) in the second direction (Y), a plurality of first banks (111-1) between a plurality of green subpixels (SPg) in the second direction (Y), and a plurality of first banks (111-1) between a plurality of blue subpixels (SPb) in the second direction (Y). Therefore, according to the sixth embodiment, by performing a single laser welding process, the process time and manufacturing cost can be drastically reduced.

[0226] Meanwhile, according to the sixth embodiment, a laser welding process may be performed on the non-display area (NAA) of the substrate (110), so that a plurality of contact pads may be formed. The plurality of contact pads may be formed using a single laser welding process together with the connection structure (130) formed on the display area (AA). Accordingly, by simultaneously forming a plurality of contact pads on the non-display area (NAA) and a plurality of connection structures (130) on the display area (AA) using a single laser welding process, the process time and manufacturing cost may be drastically reduced.

[0227] As illustrated in FIG. 1, the third power wire (PL3) connected to the power terminal (101) in the non-display area (NAA) and the first power wire (PL1) and the second power wire (PL2) formed in the display area (AA) may be formed on different layers. For example, the third power wire (PL3) connected to the power terminal (101) may be formed of the same material as the plurality of cathode electrodes (12rr, 123g, 123b).

[0228] In this case, a contact pad can be formed to connect the third power wire (PL3) connected to the power terminal (101) and the first power wire (PL1) and the second power wire (PL2).

[0229] For example, a green organic light-emitting element (120g), a red organic light-emitting element (120r), and a blue organic light-emitting element (120b) may be sequentially formed. In this case, the cathode electrodes (123r, 123b) of the green organic light-emitting element (120g), the red organic light-emitting element (120r), and the blue organic light-emitting element (120b) may be disposed on an auxiliary electrode (132) extending from a first power wire (PL1) and / or a second power wire (PL2) in the display area (AA), and a third power wire (PL3) connected to the corresponding power terminal (101) may be disposed on the first power wire (PL1) and / or the second power wire (PL2) in the non-display area (NAA). Thereafter, a single laser welding process is performed so that the plurality of cathode electrodes (12rr, 123g, 123b) are electrically connected to the auxiliary electrode (132) through the connecting portion (124) formed by melting the plurality of cathode electrodes (12rr, 123g, 123b) in the display area (AA), and the third power wire (PL3) connected to the power terminal (101) in the non-display area (NAA) can be electrically connected to the first power wire (PL1) and / or the second power wire (PL2).

[0230] According to the sixth embodiment, a plurality of connection structures (130) in the display area (AA) and a plurality of contact pads in the non-display area (NAA) are simultaneously formed using a single laser welding process, thereby drastically reducing the process time and manufacturing cost.

[0231] FIGS. 10A to 10C illustrate a manufacturing process of an organic light-emitting display device according to a sixth embodiment.

[0232] As illustrated in FIG. 10a, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) can be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110).

[0233] As illustrated in FIGS. 8a to 8f, a series of processes are performed so that a green organic light-emitting layer (122g) can be deposited on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110). Thereafter, unlike when a laser ablation process is performed (FIG. 8g), a green cathode electrode (123g) and a first inorganic insulating layer (135-1) can be formed on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110) without performing a laser ablation process (FIG. 10a).

[0234] Next, the remaining area except for the plurality of green subpixels (SPg) in the second direction (Y), i.e., the green organic light-emitting layer (122g), the green cathode electrode (123g), and the first inorganic insulating layer (135-1) on the plurality of red subpixels (SPr) and the plurality of blue subpixels (SPb), can be removed. Accordingly, a green organic light-emitting element (120g) can be formed.

[0235] Although not shown, a red organic light-emitting element (120r), a second inorganic insulating layer (135-2), a blue organic light-emitting element (120b), and a third inorganic insulating layer (135-3) can be formed.

[0236] A first organic insulating layer (141-1), a second organic insulating layer (141-2), and a third organic insulating layer (141-3) may be formed on the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3), respectively.

[0237] In the case of a pixel structure having a stripe pattern, a plurality of first power wires (PL1) can be electrically connected to a third power wire (PL3) in a non-display area (NAA) or a bezel area after cathode electrodes (123r, 123g, 123b) are deposited and connected through a deposition process.

[0238] As described above, in small panels of about 7 to 8 inches, the first power wire (PL1) and the cathode electrodes (123r, 123g, 123b) may not be electrically connected in the display area (AA). In panels of 8 inches or larger, the laser welding process may be performed in a connection structure (130) of 5 points or more per line of the stripe pattern to improve brightness reduction in the center of the panel. For example, in panels of 20 inches or larger, the laser welding process may be performed in a connection structure (130) of 20 points or more per line of the stripe pattern.

[0239] Thereafter, as illustrated in FIG. 10b, a single laser welding process may be performed, whereby a plurality of connection structures (130) may be formed on a plurality of first banks (111-1) between a plurality of green subpixels (SPg) in the second direction (Y), a plurality of first banks (111-1) between a plurality of red subpixels (SPr) in the second direction (Y), and a plurality of first banks (111-1) between a plurality of blue subpixels (SPb) in the second direction (Y). At the same time, the cathode electrodes (123r, 23g, 123b) of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) may be electrically connected to the connection structure (130).

[0240] Therefore, a plurality of connection structures (130) on the display area (AA) and a plurality of contact pads on the non-display area (NAA) can be formed simultaneously using a single laser welding process, thereby reducing manufacturing time, dramatically increasing productivity, and reducing manufacturing costs.

[0241] In addition, the laser welding process may be performed after a plurality of inorganic insulating layers (131-1 to 131-3) are formed, after a plurality of organic insulating layers (141-1 to 141-3) are formed, or after the fourth to fifth inorganic insulating layers (135-4, 135-5) are formed, but this is not limited thereto.

[0242] By forming an insulating film (131-1 to 131-5, 141-1 to 141-3) to prevent penetration of moisture, oxygen, etc. before the laser welding process is performed, the laser welding process can be performed in a normal pressure or clean room environment in a nitrogen (N2) atmosphere.

[0243] Therefore, compared to laser ablation, the laser welding process can improve productivity and reduce investment costs. Furthermore, if defects occur during the image quality inspection process, laser welding can be used to repair them, contributing to improved yield and image quality.

[0244] Thereafter, as illustrated in FIG. 10c, the fourth organic insulating layer (141-4) and the fifth inorganic insulating layer (135-5) may be formed on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110). The fifth inorganic insulating layer (135-5) may be formed on the fourth organic insulating layer (141-4).

[0245] Although not shown, after the fourth inorganic insulating layer (135-4 in FIG. 9) is formed, a fourth organic insulating layer (141-4) may be formed on the fourth inorganic insulating layer (135-4).

[0246] Fig. 11 is a cross-sectional view illustrating an organic light-emitting display device according to a seventh embodiment. The seventh embodiment (Fig. 11) may be identical to the second embodiment (Fig. 3) except that the second power wiring (PL2) is omitted.

[0247] As illustrated in FIG. 1, the second power wire (PL2) may not be arranged along the second direction (Y). As illustrated in FIG. 11, the second power wire (PL2) may not be arranged under the second bank (111-2) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). In this case, the red organic light-emitting layer (122r) and the blue organic light-emitting layer (122b) may directly contact the upper surface of the substrate (110) in the second groove (131-2) of the second bank (111-2) or may contact the upper surface of another layer on the substrate (110).

[0248] The second power wire (PL2) intersects the first power wire (PL1) and is connected to the first power wire (PL1), thereby allowing the first potential voltage supplied to the power terminal (101) to be supplied smoothly and uniformly to the plurality of subpixels (SPr, SPg, SPb). In addition, as illustrated in FIG. 8A, the second power wire (PL2) may be arranged in the second groove (131-2) of the second bank (111-2) to prevent the interlayer insulating layer (103) from being excessively etched when the interlayer insulating layer (103) is etched.

[0249] Even if the second power wire (PL2) is omitted, if there is no problem in supplying the first potential voltage and there is no concern that the interlayer insulating layer (103) will be excessively etched, the second power wire (PL2) may not be placed in the second groove (131-2) of the second bank (111-2).

[0250] Fig. 12 is a cross-sectional view illustrating an organic light-emitting display device according to an eighth embodiment. The eighth embodiment (Fig. 12) may be identical to the second embodiment (Fig. 3) except that the second organic insulating layer (141-2) and the third organic insulating layer (141-3) are omitted.

[0251] As shown in Fig. 12, when the second organic insulating layer (141-2) and the third organic insulating layer (141-3) are not used as a color filter layer or a photosensitive pattern, the second organic insulating layer (141-2) and the third organic insulating layer (141-3) may be omitted.

[0252] For example, after a red organic light-emitting layer (122r), a red cathode electrode (123r), and a second inorganic insulating layer (135-2) are formed on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110), a second organic insulating layer (141-2) may be formed on a plurality of red sub-pixels (SPr) in the second direction (Y). An etching process is performed using the second organic insulating layer (141-2) as a photosensitive pattern, so that the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) on a plurality of green sub-pixels (SPg) and a plurality of blue sub-pixels (SPb) are removed, thereby forming a plurality of red organic light-emitting elements (SPr) on a plurality of red sub-pixels (SPr) in the second direction (Y).

[0253] Thereafter, after a blue organic light-emitting layer (122b), a blue cathode electrode (123b), and a third inorganic insulating layer (135-3) are formed on the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110), a third organic insulating layer (141-3) may be formed on a plurality of blue sub-pixels (SPb) in the second direction (Y). An etching process is performed using the third organic insulating layer (141-3) as a photosensitive pattern, so that the blue organic light-emitting layer (122b), the blue cathode electrode (123b), and the third inorganic insulating layer (135-3) on a plurality of red sub-pixels (SPr) and a plurality of green sub-pixels (SPg) are removed, thereby forming a plurality of blue organic light-emitting elements (120b) on a plurality of blue sub-pixels (SPb) in the second direction (Y).

[0254] Although not shown, an etching process may be performed using the first organic insulating layer (141-1) as a photosensitive pattern, so that a plurality of green organic light-emitting elements (120g) may be formed on a plurality of green subpixels (SPg) in the second direction (Y).

[0255] Fig. 13 is a cross-sectional view illustrating an organic light-emitting display device according to the ninth embodiment. Fig. 14 is a cross-sectional view illustrating an organic light-emitting display device according to the tenth embodiment.

[0256] The ninth embodiment (Fig. 13) and the tenth embodiment (Fig. 14) are similar to the fourth embodiment (Fig. 5) and the fifth embodiment (Fig. 6), respectively, except for the blocking structures (133, 134). In the ninth embodiment (Fig. 13) and the tenth embodiment (Fig. 14), components having the same shape, structure, and / or function as those in the fourth embodiment (Fig. 5) and the fifth embodiment (Fig. 6) are given the same drawing reference numerals, and detailed descriptions thereof are omitted.

[0257] As illustrated in FIG. 13, a blocking structure (133, 134) may be formed in an edge region of the first bank (111-1) between a plurality of green subpixels (SPg) in the second direction (Y). As illustrated in FIG. 14, a blocking structure (133, 134) may be formed in an edge region of the first bank (111-1) between a plurality of blue subpixels (SPb) in the second direction (Y). For example, the blocking structure (133, 134) may be formed in an edge region of the lower side of the first bank (111-1), but is not limited thereto.

[0258] The blocking structure (133, 134) may include at least one blocking layer (113) extending inward from the side of the first bank (111-1). A first undercut structure (151) and a second undercut structure (152) may be formed in the edge region of the first bank (111-1) by the blocking layer (113). The blocking layer (113) may include a silicon-based inorganic material, a metal, or the like. Aluminum (Al), molybdenum (Mo), a molybdenum alloy, or the like may be used as the metal, but is not limited thereto.

[0259] Meanwhile, since some organic light-emitting layers of each of the green organic light-emitting layer (122g) and the blue organic light-emitting layer (122b), such as the hole injection layer and the charge generation layer, are made of low-resistance organic light-emitting materials, leakage current is likely to flow through the hole injection layer, the charge generation layer, etc. When leakage current flows through the hole injection layer, the charge generation layer, etc., an electrical short between the green anode electrode (121g) and the green cathode electrode (123g) may cause light not to be emitted from the green subpixel (SPg) or the luminance of the light may be significantly lower than the desired luminance.

[0260] Although not shown, the red organic light-emitting layer (122r) also includes a hole injection layer, a charge generation layer, etc., so the above-described problem may occur.

[0261] In the embodiment, since the hole injection layer, charge generation layer, etc. corresponding to the blocking structure (133, 134) are disconnected by the blocking structure (133, 134), leakage current flowing to the hole injection layer, charge generation layer, etc. is blocked, and image quality deterioration can be prevented.

[0262] Fig. 15 is a plan view schematically illustrating an organic light-emitting display device according to a second embodiment.

[0263] As illustrated in FIG. 15, a plurality of subpixels (SPr, SPg, SPb) may be arranged in a stripe shape along a second direction (Y) on a display area (AA), and a plurality of dummy subpixels (SPrd, SPgd, SPbd) may be arranged in a stripe shape along a first direction (X) on a non-display area (NAA). The non-display area (NAA) may include a bezel area.

[0264] A plurality of waterproof structures (146-1 to 146-3) may be arranged between a plurality of dummy subpixels (SPrd, SPgd, SPbd) in the second direction (Y).

[0265] Meanwhile, since the non-display area (NAA) or the bezel area is an area where an image is not displayed, the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) may not be arranged. For example, as illustrated in FIG. 16, the red organic light-emitting element (120r) may not be arranged in the red dummy subpixel (SPrd), and the green organic light-emitting element (120g) may not be arranged in the green dummy subpixel (SPgd). That is, at least one or more of the anode electrode, the organic light-emitting layer, and the cathode electrode constituting the red organic light-emitting element (120r) or the green organic light-emitting element (120g) may not be arranged in the green dummy subpixel (SPgd) or the red dummy subpixel (SPrd).

[0266] Although not shown, a blue organic light-emitting element (120b) may not be placed in a blue dummy subpixel (SPbd).

[0267] A third bank (111-3) may be positioned between red dummy subpixels (SPrd) and a third groove (131-3) may be formed in the third bank (111-3). A plurality of undercut structures (153, 154) may be formed on the lower side of the third bank (111-3) that contacts the third groove (131-3).

[0268] Each of the plurality of waterproof structures (146-1 to 146-3) may include two or more waterproof structures (144-4, 145-4).

[0269] For example, a first waterproof structure (144-4) may be formed by the curved shape of a first inorganic insulating layer (135-1) disposed in a first undercut structure (153), and a second waterproof structure (145-4) may be formed by the curved shape of a second inorganic insulating layer (135-2) disposed in a second undercut structure (154).

[0270] The waterproof structures (144-4, 145-4) may be the same as the second waterproof structures (144-1 to 144-3) and the third waterproof structures (145-1 to 145-3) illustrated in the first embodiment (Fig. 2) to the third embodiment (Fig. 4).

[0271] In this way, by forming a plurality of waterproof structures (146-1 to 146-3) between a plurality of dummy subpixels (SPrd, SPgd, SPbd) on the non-display area (NAA), moisture, oxygen, etc. can be blocked from penetrating into the display area (AA) from the non-display area (NAA). Even if moisture, oxygen, etc. penetrate into the display area (AA) from the non-display area (NAA), moisture, oxygen, etc. are blocked by the plurality of waterproof structures (143, 144-1 to 144-3, 145-1 to 145-3 in FIGS. 2 to 4) formed long along the second direction (Y) between the plurality of subpixels (SPr, SPg, SPb) in the first direction (X) in the display area (AA), so that the moisture, oxygen, etc. do not penetrate into the plurality of organic light-emitting elements (120r, 120g, 120b) of the plurality of subpixels (SPr, SPg, SPb). Accordingly, the performance of blocking penetration of moisture, oxygen, etc. is dramatically improved, and malfunctions or light emission failures of subpixels (SPr, SPg, SPb) are prevented, thereby increasing reliability.

[0272] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalency range of the embodiments are intended to be included within the scope of the embodiments.

Claims

1. A plurality of subpixels having different colors along a first direction and having the same color along a second direction intersecting the first direction; A plurality of anode electrodes for the plurality of subpixels; A plurality of organic light-emitting layers on the plurality of anode electrodes; A plurality of cathode electrodes on the plurality of organic light-emitting layers; A plurality of first banks between a plurality of subpixels in the second direction; a plurality of first power wires along the first direction under the plurality of first banks; and A plurality of connection structures arranged in a plurality of first grooves of some first banks among the plurality of first banks; The organic light-emitting layer and the cathode electrode are arranged across the first bank, The above connection structure electrically connects the cathode electrode in the first groove of the first bank to the first power wiring. Organic light emitting display device.

2. In paragraph 1, The above connection structure is, a lower electrode extending from the first power wire; and an upper electrode on the lower electrode; The above cathode electrode is in contact with the upper surface of the upper electrode, Organic light emitting display device.

3. In paragraph 2, The upper electrode comprises the same material as the anode electrode, Organic light emitting display device.

4. In paragraph 1, The above connection structure is, an auxiliary electrode extending from the first power wire; and A connecting portion penetrating the organic light-emitting layer on the auxiliary electrode; The cathode electrode is in contact with a portion of the auxiliary electrode through the connecting portion, Organic light emitting display device.

5. In paragraph 4, The above cathode electrode is, 1st challenge layer; and A second conductive layer is included on the first conductive layer; The above connecting portion comprises the same material as the first conductive layer, Organic light emitting display device.

6. In paragraph 1, further comprising a blocking structure in the edge region of the first bank; The hole injection layer or charge generation layer of the organic light-emitting layer is disconnected by the blocking structure. Organic light emitting display device.

7. In paragraph 1, A plurality of inorganic insulating layers on the plurality of cathode electrodes; a plurality of second banks arranged lengthwise along the second direction between the plurality of subpixels in the first direction; and A plurality of waterproof structures, each of which is included in the plurality of second banks; Organic light emitting display device.

8. In paragraph 7, The above multiple waterproof structures are, A first waterproof structure on the second bank; A second waterproof structure on the first side of the second home of the second bank; and a third waterproof structure on the second side of the second home of the second bank; Organic light emitting display device.

9. In paragraph 9, The above first waterproof structure is configured such that at least two or more inorganic insulating layers among the plurality of inorganic insulating layers are overlapped on the second bank. Organic light emitting display device.

10. In paragraph 9, Among the above two or more inorganic insulating layers, the uppermost layer is an island insulating pattern. Organic light emitting display device.

11. In paragraph 8, The above second waterproof structure is configured such that one of the plurality of inorganic insulating layers is formed in a curved shape by the first undercut structure, The third waterproof structure is configured such that another inorganic insulating layer among the plurality of inorganic insulating layers is formed in a curved shape by the second undercut structure, The first undercut structure and the second undercut structure are formed on the lower side of the second bank in contact with the second groove of the second bank. Organic light emitting display device.

12. In paragraph 11, Further comprising a plurality of organic insulating layers on the plurality of inorganic insulating layers; One of the plurality of inorganic insulating layers is disposed between two of the plurality of organic insulating layers in the second groove. Organic light emitting display device.

13. In paragraph 12, The above one inorganic insulating layer has a round surface, Organic light emitting display device.

14. In paragraph 8, Further comprising a plurality of second power wires along the second direction in the plurality of second grooves of the plurality of second banks; The plurality of second power wires are electrically connected to the plurality of first power wires, At least two or more of the above inorganic insulating layers are disposed on the second power wiring, Organic light emitting display device.

15. In paragraph 1, A plurality of dummy subpixels having a stripe shape along the first direction in the non-display area; and Further comprising a plurality of waterproof structures between a plurality of dummy subpixels in the second direction; Organic light emitting display device.

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