Electronic assembly and communication device

Abstract

Provided in the present application are an electronic assembly and a communication device. The electronic assembly comprises a first circuit board and a power module. The power module is provided with a first input pad, a first output pad and a first grounding pad. The first circuit board is provided with a second input pad, a second output pad and a second grounding pad. The power module has a first projection region on the first circuit board. A first surface of the first circuit board has a first demetallization region, which is located between the second input pad and the second output pad. A second surface of the first circuit board has a second demetallization region, wherein the projection of the second demetallization region on the first surface is located between the second input pad and the second output pad. The power module and the first circuit board are attached face to face, so that parasitic parameters generated when a power assembly is assembled to the first circuit board can be reduced, thereby improving the performance of the electronic assembly. In addition, the demetallization regions can reduce the influence on a radio-frequency signal path region of a radio-frequency power device.

Description

Electronic component and communication device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on October 24, 2023, with application number 202311388970.9 and invention name "An electronic component and communication device", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of communication equipment, and in particular to an electronic component and a communication device. Background Art

[0004] High-power RF devices are key components in transmitter systems, providing signal amplification. They primarily convert DC energy from a power supply into AC energy. During this conversion process, some of this energy is dissipated as heat. Therefore, the higher the output power of a high-power RF device, the higher its heat dissipation requirements.

[0005] Existing high-power RF devices are typically packaged in a drop-in configuration on the surface of a flange, with the input and output pins extending beyond the package layer. During power module assembly, the circuit board is slotted, the package is then lowered into the slots, and the input and output pins are connected to the circuit board. However, assembly tolerances exist during the assembly of the package and circuit board, and the assembled power module introduces parasitic parameters, resulting in suboptimal performance.

[0006] Summary of the Invention

[0007] The present application provides an electronic component and a communication device to reduce the tolerance and parasitic parameters generated when assembling a power module and a circuit board, thereby improving the performance of the electronic component.

[0008] In a first aspect, the present application provides an electronic component. Specifically, the electronic component includes a power module and a first circuit board. The power module includes a flange, an encapsulation layer, and a radio frequency power device. The encapsulation layer is located on the side of the flange facing the first circuit board and is connected to the flange. The radio frequency power device is disposed within the encapsulation layer. A first input pad, a first output pad, and a first ground pad are provided on the surface of the encapsulation layer facing the first circuit board. The first input pad and the first output pad are respectively conductively connected to the radio frequency power device, and the first ground pad is conductively connected to the flange. A second input pad, a second output pad, and a second ground pad are provided on the first surface of the first circuit board facing the power module. The second input pad is disposed opposite and conductively connected to the first input pad, the second output pad is disposed opposite and conductively connected to the first output pad, and the second ground pad is disposed opposite and conductively connected to the first ground pad. The power module has a first projected area on the first surface perpendicular to the first circuit board. The first surface has a first demetallized area located within the first projected area and between the second input pad and the second output pad. The second surface of the first circuit board facing away from the power module has a second demetallized area. Along the direction perpendicular to the first circuit board, the projection of the second demetallized area on the first surface is located within the first projection area and between the second input pad and the second output pad.

[0009] In the electronic assembly of the present application, the power module and the first circuit board are arranged relative to each other and are bonded to the first circuit board using a surface mount method. This reduces assembly tolerances perpendicular to and parallel to the first circuit board, thereby improving assembly consistency and reducing tolerances and parasitic parameters generated when assembling the power module with the first circuit board, thereby improving the performance of the electronic assembly. Furthermore, the first and second demetallized regions are located between the second input pad and the second output pad, respectively, thereby reducing the impact on the RF signal path area of ​​the RF power device.

[0010] The relative positions of the first demetallized area and the second demetallized area are not limited. In one possible implementation, along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface at least partially overlaps with the first demetallized area.

[0011] In another possible implementation, a projection of the second demetallized region on the first surface may completely overlap with the first demetallized region.

[0012] In another possible implementation, a projection of the second demetallized region on the first surface may not overlap with the first demetallized region.

[0013] When providing the first demetallized region and the second demetallized region, in one possible implementation, an insulating dielectric layer is provided between the first demetallized region and the second demetallized region, and the insulating dielectric layer connects the first demetallized region and the second demetallized region. In other words, by at least partially removing the metal layer within the first demetallized region and the second demetallized region on the first circuit board, the impact on the RF signal path area can be reduced.

[0014] In one possible implementation, the insulating dielectric layer may be provided with slots, with the slot openings located within the first demetallized region or the second demetallized region. In other words, the slot openings may face the power module or face away from the power module. The number of slots is not specifically limited. In another possible implementation, the insulating dielectric layer may be provided with first through-holes, which penetrate the insulating dielectric layer and connect the first demetallized region and the second demetallized region.

[0015] When specifically providing the first demetallized region and the second demetallized region, in another possible implementation, a second through-hole may be provided between the first demetallized region and the second demetallized region, the second through-hole connecting the first demetallized region and the second demetallized region. In other words, by removing all dielectrics (including metallic and non-metallic dielectrics) within the first demetallized region and the second demetallized region on the first circuit board, the impact on the RF signal path area can be reduced.

[0016] In one possible implementation, a first circuit board is provided with a first conductor and a second conductor. The first conductor is located within the first and second demetallized regions and connected to the second input pad. The second conductor is located within the first and second demetallized regions and connected to the second output pad. Therefore, the first and second demetallized regions are respectively located between the first and second conductors. The second input pad is electrically connected to another circuit via the first conductor, and the second output pad is electrically connected to another circuit via the second conductor.

[0017] In one possible implementation, a wiring portion is provided on the second surface, and the second demetallized area is provided in the wiring portion. The first conductor is conductively connected to the second input pad and the third wiring portion, and the second conductor is conductively connected to the second output pad and the third wiring portion.

[0018] In one possible implementation, the first input pad and the first output pad are conductively connected to the RF power device via conductors. Specifically, the packaging layer is provided with a first through-hole and a second through-hole, each of which penetrates the packaging layer. The first through-hole is provided with a third conductor, and the first input pad is conductively connected to the RF power device via the third conductor. The second through-hole is provided with a fourth conductor, and the second input pad is conductively connected to the RF power device via the fourth conductor.

[0019] In one possible implementation, the flange is electrically connected to the first ground pad via a conductor. Specifically, a fifth conductor is provided on a surface of the flange facing the first circuit board, the fifth conductor penetrates the packaging layer and electrically connects the flange to the first ground pad.

[0020] In one possible implementation, the electronic component is a dual-channel module. A third input pad, a third output pad, and a third ground pad are further provided on the surface of the packaging layer facing the first circuit board. The third input pad and the third output pad are respectively conductively connected to the RF power device, and the third ground pad is conductively connected to the flange. The first surface is also provided with a fourth input pad, a fourth output pad, and a fourth ground pad. The fourth input pad is arranged opposite to and conductively connected to the third input pad, the fourth output pad is arranged opposite to and conductively connected to the third output pad, and the fourth ground pad is arranged opposite to and conductively connected to the third ground pad. The first surface also has a third demetallized area, which is located within the first projection area and between the fourth input pad and the fourth output pad. The second surface also has a fourth demetallized area. In a direction perpendicular to the first circuit board, the projection of the fourth demetallized area on the first surface is located within the first projection area and between the fourth input pad and the fourth output pad.

[0021] The first circuit board may also be provided with discrete components. In one possible implementation, a first discrete component, a second discrete component, a third discrete component, and a fourth discrete component are provided on a side of the first circuit board facing away from the power module. The first discrete component and the second discrete component are respectively located on either side of the second demetallized region, and the third discrete component and the fourth discrete component are respectively located on either side of the fourth demetallized region.

[0022] In a possible implementation, the electronic component further includes a first heat sink, which is disposed on a side of the flange facing away from the first circuit board and is used to dissipate heat for the power module.

[0023] In a possible implementation, a first heat-conducting layer is provided between the flange and the first heat sink to increase heat transfer efficiency between the flange and the first heat sink.

[0024] In one possible implementation, the electronic component further includes a second circuit board, which is located on a side of the first circuit board facing the power module and is connected to the first circuit board, and the power module is disposed in the second circuit board.

[0025] In a second aspect, the present application also provides a communication device. The communication device includes the electronic component of the first aspect mentioned above. In the communication device of the present application, the power module and the first circuit board of the electronic component are arranged relative to each other, and the power module and the first circuit board are bonded by surface mounting, so that the assembly tolerance along the perpendicular direction and the parallel direction to the first circuit board can be reduced to improve the assembly consistency, and reduce the tolerance and parasitic parameters generated when the power component is assembled with the first circuit board, thereby improving the performance of the communication device. In addition, the first demetallized area and the second demetallized area are respectively located between the second input pad and the second output pad, thereby reducing the impact on the RF signal path area of ​​the RF power device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic diagram of a communication system provided in an embodiment of the present application;

[0027] FIG2 is a schematic diagram of a communication device provided in an embodiment of the present application;

[0028] FIG3 is a schematic diagram of a transmitter provided in an embodiment of the present application;

[0029] FIG4 is a schematic diagram of an electronic component provided in an embodiment of the present application;

[0030] FIG5 is a schematic diagram of a power module provided in an embodiment of the present application;

[0031] FIG6 is another schematic diagram of a power module provided in an embodiment of the present application;

[0032] FIG7 is another schematic diagram of a power module provided in an embodiment of the present application;

[0033] FIG8 is a schematic diagram of a first circuit board provided in an embodiment of the present application;

[0034] FIG9 is another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0035] FIG10 is another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0036] FIG11 is another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0037] FIG12 is another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0038] FIG13 is another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0039] FIG14 is another schematic diagram of an electronic component provided in an embodiment of the present application;

[0040] FIG15 is another schematic diagram of an electronic component provided in an embodiment of the present application;

[0041] FIG16 is another schematic diagram of an electronic component provided in an embodiment of the present application;

[0042] FIG17 is another schematic diagram of an electronic component provided in an embodiment of the present application;

[0043] FIG18 is another schematic diagram of the electronic component provided in an embodiment of the present application.

[0044] Reference numerals:

[0045] 10-Communication system 11-Communication equipment 12-Terminal equipment

[0046] 30-electronic component 31-power module 32-first circuit board

[0047] 33-discrete device 34-first heat sink 35-first heat conduction layer

[0048] 36-second circuit board 37-second heat sink 38-second heat conducting layer

[0049] 33a - first discrete device 33b - second discrete device 33c - third discrete device

[0050] 33d- fourth discrete device 110- transmitter 311- flange

[0051] 312-RF power device 313-packaging layer 314-first input pad

[0052] 315 - first output pad 316 - first ground pad 317 - conductive circuit

[0053] 318 - third input pad 319 - third output pad 321 - second input pad

[0054] 322 - second output pad 323 - second ground pad 324 - insulating dielectric layer

[0055] 325-slot 326-first through hole 327-metal part

[0056] 328 - second through hole 329 - wiring portion 3111 - conductive column

[0057] 3131-first conductor 3132-second conductor 3211-third conductor

[0058] 3221-Fourth conductor R0-First projection area R1-First demetallized area

[0059] R2-second demetallized area R4-fourth demetallized area S1-first surface

[0060] S2-second surface DETAILED DESCRIPTION

[0061] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0062] To facilitate understanding of the electronic components provided in the embodiments of the present application, the following describes their application scenarios. The electronic components provided in the embodiments of the present application can be applied to various communication systems, including but not limited to: global system of mobile communication (GSM) system, code division multiple access (CDMA) system, wideband code division multiple access (WCDMA) system, general packet radio service (GPRS), long term evolution (LTE) system, LTE frequency division duplex (FDD) system, LTE time division duplex (TDD) system, universal mobile telecommunication system (UMTS), world-wide interoperability for microwave access (WiMAX) communication system, 5G system or new radio (NR), and future sixth generation mobile communication technology system, etc.

[0063] Figure 1 is a schematic diagram of a communication system provided in an embodiment of the present application. As shown in Figure 1 , communication system 10 includes at least one communication device 11. The communication device 11 provided in an embodiment of the present application may refer to a radio access network (RAN) node / device that connects a terminal device to a wireless network. Communication device 11 may also be referred to as an access network device or a wireless access device. For example, communication device 11 may be a base station. Base stations include, but are not limited to, evolutionary node B (eNB or eNodeB) in LTE systems, node B (NB) in WCDMA systems, base transceiver stations (BTS) in GSM or CDMA systems, base stations in future 5G networks, base stations in future evolved PLMN networks, home base stations, new wireless base stations, vehicle-mounted devices, wearable devices, wireless controllers in cloud radio access networks (CRAN) scenarios, relay stations, access points, transmission points (TRP), transmitting points (TP), building base band units (BBU), remote radio units (RRU), AAU, radio heads (RRH), central units (CU), distributed units (DU), positioning nodes, etc. The above-mentioned base stations can be fixed or mobile, and the base stations can support networks with the same or different access technologies. The embodiments of the present application do not limit the specific technology and specific device form adopted by the communication device 11. Of course, the communication device 11 may also be a transmitter, or a radar, or other devices with similar functions.

[0064] The communication system 10 can be used to communicate with at least one terminal device 12, and the at least one terminal device 12 can communicate with the at least one communication device 11. When the communication device 11 communicates with the terminal device 12, one communication device 11 can manage one or more terminal devices 12. The terminal device 12 is a device used to communicate with the communication device 11, including but not limited to: user equipment (UE), access terminal, user unit, user station, mobile station, mobile station (MS), mobile terminal (MT), remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent or user device. For example, the terminal device 12 can be a device that provides voice and / or data connectivity to a user, and can be used to connect people, objects and machines, such as a handheld device with wireless connection function, a vehicle-mounted device, etc. Alternatively, the terminal device 12 may be a mobile phone, a tablet computer, a laptop computer, a PDA, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a wireless terminal in industrial control, a wireless terminal in unmanned driving, a wireless terminal in remote surgery, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc.

[0065] Figure 2 is a schematic diagram of a communication device according to an embodiment of the present application. As shown in Figure 2, communication device 11 includes an electronic component 30. Electronic component 30 is used to boost the power level of signals, thereby expanding the coverage range of transmissions from communication device 11. Optionally, communication device 11 also includes an antenna, which is signal-connected to electronic component 30, so that the signals boosted by electronic component 30 are ultimately transmitted externally via the antenna.

[0066] Figure 3 is a schematic diagram of a transmitter provided in an embodiment of the present application. As shown in Figure 3, in one embodiment, communication device 11 may be transmitter 110. Transmitter 110 may include a modulation module, a frequency conversion module, a power module (e.g., the power amplifier module shown in Figure 3), a filter module, and an antenna. The power module includes at least one electronic component. Each electronic component includes a power module.

[0067] Current power modules typically use submerged packaging technology to package RF power devices and embed them into slots on circuit boards. During the assembly process, the input and output pins of the power module are conductively connected to the circuit board. However, due to processing errors, the plane where the input and output pins are located may not be on the same plane as the wiring layer of the circuit board. Therefore, the input and output pins need to be bent in order to be soldered to the wiring layer of the circuit board, which increases the parasitic parameters of the power module. In addition, the slots of the circuit board may have dimensional deviations due to processing errors, resulting in inconsistencies in the output and / or input ends after the power module is embedded in the slots, which ultimately leads to performance fluctuations of the electronic components and affects the performance of the electronic components.

[0068] Therefore, the present application provides an electronic component and a communication device to reduce the tolerance and parasitic parameters generated when assembling a power module and a circuit board, thereby improving the performance of the electronic component.

[0069] It should be noted that the terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and claims of this application, the singular expressions "a," "an," "said," "above," "the," and "this" are intended to include expressions such as "one or more," unless the context clearly indicates otherwise.

[0070] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0071] Figure 4 is a schematic diagram of an electronic assembly provided in an embodiment of the present application. As shown in Figure 4, electronic assembly 30 includes a power module 31 and a first circuit board 32. Power module 31 and first circuit board 32 are disposed opposite each other and are electrically connected to each other. The power module 31 and first circuit board 32 are described in detail below.

[0072] Figure 5 is a schematic diagram of a power module provided in an embodiment of the present application. As shown in Figure 5, the power module 31 includes a flange 311, an RF power device 312 and an encapsulation layer 313. Specifically, the flange 311 is a metal carrier with thermal and electrical conductivity functions. The encapsulation layer 313 is located on the side of the flange 311 facing the first circuit board 32, and the encapsulation layer 313 is connected to the flange 311. The RF power device 312 is arranged in the encapsulation layer 313. In other words, the encapsulation layer 313 covers the RF power device 312 and encapsulates the RF power device 312. The RF power device 312 may include a tube core (bare die) with an RF power amplification function, as well as other circuit wiring. A first input pad 314, a first output pad 315 and a first ground pad 316 are provided on the surface of the encapsulation layer 313 facing the first circuit board 32. The first input pad 314 is conductively connected to the input end of the RF power device 312 , the first output pad 315 is conductively connected to the output end of the RF power device 312 , and the first ground pad 316 is conductively connected to the flange 311 .

[0073] It should be noted that, in the embodiments of the present application, the conductive connection between A and B may refer to A and B being directly in contact and connected to achieve electrical connection, or it may refer to A and B being connected through a conductor (such as a metal conductive column, a metal wire or a jumper, etc.) to achieve electrical connection.

[0074] Continuing with Figure 5, within the plane of the packaging layer 313 facing the first circuit board 32, the first ground pad 316 can be disposed around the first input pad 314 and the first output pad 315, with the first input pad 314, the first output pad 315, and the first ground pad 316 spaced apart from each other. The shapes of the first input pad 314, the first output pad 315, and the first ground pad 316 are not limited. For example, in one embodiment, the first ground pad 316 can be a first annular ground pad, with the first input pad 314 and the first output pad 315 located within the first annular ground pad 316 and spaced apart from each other. Figure 6 is another schematic diagram of a power module provided in an embodiment of the present application. As shown in Figure 6, in another embodiment, the first ground pad 316 can include multiple first ground pad points, arranged in a ring around the first input pad 314 and the first output pad 315. Figure 7 is another schematic diagram of a power module provided in an embodiment of the present application. As shown in FIG7 , in another embodiment, the first ground pad 316 may include at least one first strip-shaped ground pad. Specifically, in one embodiment, the at least one first strip-shaped ground pad may include one first strip-shaped ground pad on a surface of the packaging layer 313 facing the first circuit board 32. The first strip-shaped ground pad may be located on the side of the first input pad 314 facing away from the first output pad 315, or on the side of the first output pad 315 facing away from the first input pad 314, or on the same side of the first input pad 314 and the first output pad 315. In another embodiment, the at least one first strip-shaped ground pad may include two first strip-shaped ground pads, the two first strip-shaped ground pads being arranged opposite and parallel to each other. The first input pad 314 and the first output pad 315 are located between the two first strip-shaped ground pads.

[0075] As shown in Figure 5, the flange 311 is conductively connected to the first ground pad 316. Specifically, in one embodiment, a conductive column 3111 is provided on the side surface of the flange 311 facing the first circuit board 32, and the conductive column 3111 can pass through the packaging layer 313 and be conductively connected to the first ground pad 316. In an embodiment of the present application, the material of the conductive column 3111 can be different from the material of the flange 311, and the conductive column 3111 and the flange 311 are connected by welding. Of course, the material of the conductive column 3111 can also be the same as the material of the flange 311, and made by an integrated molding process. In some implementations, a plurality of conductive columns 3111 can be provided on the surface of the flange 311, and the aforementioned plurality of conductive columns 3111 can be arranged in an array.

[0076] When the first input pad 314 and the first output pad 315 are specifically provided, the packaging layer 313 may be provided with a first through-hole and a second through-hole. The first through-hole and the second through-hole respectively penetrate the packaging layer 313. A first conductor 3131 is provided in the first through-hole, and the first input pad 314 and the RF power device 312 are electrically connected through the first conductor 3131. A second conductor 3132 is provided in the second through-hole, and the first output pad 315 and the RF power device 312 are electrically connected through the second conductor 3132.

[0077] Furthermore, in one embodiment, the power module 31 may include two RF power devices 312. A conductive circuit 317 is further provided on the surface of the packaging layer 313 facing the first circuit board 32. The conductive circuit 317 is configured to electrically connect the two RF power devices 312. Specifically, the conductive circuit 317 may be connected to the two RF power devices 312 via two conductors, respectively, which will not be further described here.

[0078] Figure 8 is a schematic diagram of a first circuit board provided in an embodiment of the present application. As shown in Figure 8, the first circuit board 32 has a first surface S1 and a second surface S2, which are arranged opposite each other. The first surface S1 faces the power module 31, and the second surface S2 faces away from the power module 31. A second input pad 321, a second output pad 322, and a second ground pad 323 are provided on the first surface S1. The shapes of the second input pad 321, the second output pad 322, and the second ground pad 323 are not limited. The second input pad 321 is arranged opposite and conductively connected to the first input pad 314, the second output pad 322 is arranged opposite and conductively connected to the first output pad 315, and the second ground pad 323 is arranged opposite and conductively connected to the first ground pad 316. This allows the power module 31 to be directly opposite and connected to the first circuit board 32, thereby reducing assembly tolerances. It should be understood that the relative arrangement of A and B means that the projection of A on the first surface S1 and the projection of B on the first surface S1 at least partially overlap in a direction perpendicular to the first circuit board 32. Here, at least partial overlap means that a part of the projection of A on the first surface S1 overlaps with a part of the projection of B on the first surface S1; or, the projection of A on the first surface S1 covers the projection of B on the first surface S1; or, the projection of B on the first surface S1 covers the projection of A on the first surface S1; or, the projection of A on the first surface S1 completely overlaps with the projection of B on the first surface S1.

[0079] Continuing with FIG8 , along a direction perpendicular to the first circuit board 32 (e.g., the vertical direction in FIG8 ), the power module 31 has a first projected area R0 on the first surface S1. The first surface S1 has a first demetallized area R1, which is located within the first projected area R0 and between the second input pad 321 and the second output pad 322. The second surface S2 has a second demetallized area R2, which, along a direction perpendicular to the first circuit board 32, projects onto the first surface S1 within the first projected area R0 and between the second input pad 321 and the second output pad 322. In the embodiment of the present application, when the electronic assembly 30 is in operation, the RF signal of the power module 31 travels from the first input pad 314 to the first output pad 315. Therefore, the RF signal path is located between the first input pad 314 and the first output pad 315. That is, the RF signal path area is located between the second input pad 321 and the second output pad 322. Therefore, the first demetallized area R1 and the second demetallized area R2 can reduce the impact of the first circuit board 32 on the RF signal of the power module 31, avoiding problems such as signal short circuits or cavity effects.

[0080] In one embodiment, the projection of the second demetallized region R2 on the first surface S1 may at least partially overlap with the first demetallized region R1 in a direction perpendicular to the first circuit board 32. As shown in FIG8 , in one specific embodiment, the projection of the second demetallized region R2 on the first surface S1 may completely overlap with the first demetallized region R1. FIG9 is another schematic diagram of the first circuit board provided in an embodiment of the present application. As shown in FIG9 , in another embodiment, the projection of the second demetallized region R2 on the first surface S1 may not overlap with the first demetallized region R1.

[0081] Specifically, the first demetallized region R1 and the second demetallized region R2 can be implemented in different ways. As shown in Figures 8 and 9, in one embodiment, the first demetallized region R1 and the second demetallized region R2 are provided with an insulating dielectric layer 324. The insulating dielectric layer 324 can be the insulating dielectric layer of the first circuit board 32. In this embodiment, when actually manufacturing the first demetallized region R1 and the second demetallized region R2, demetallization can be achieved by directly removing the surface metal traces located in the first demetallized region R1 on the first surface S1 of the first circuit board 32, and demetallization can be achieved by removing the surface metal traces located in the second demetallized region R2 on the second surface S2 of the first circuit board 32. This method is simple and easy to operate, which can reduce the production cost of the first circuit board 32.

[0082] FIG10 is another schematic diagram of the first circuit board provided in an embodiment of the present application. As shown in FIG10 , in another embodiment, the insulating dielectric layer 324 may be provided with a slot 325. Specifically, a slot 325 may be provided in the first demetallized region R1, and the opening of the slot 325 is arranged toward the power module 31. A slot 325 may also be provided in the second demetallized region R2, and the opening of the slot 325 is arranged toward the direction of the power module 31. FIG11 is another schematic diagram of the first circuit board provided in an embodiment of the present application. As shown in FIG11 , in another embodiment, the insulating dielectric layer 324 may be provided with a first through-hole 326. The first through-hole 326 passes through the insulating dielectric layer 324 and connects the first demetallized region R1 and the second demetallized region R2. In other words, the entire first through-hole 326 may form a demetallized region that passes through the first circuit board 32.

[0083] Of course, it is understandable that in actual applications, the first circuit board 32 can be a multi-layer circuit board. The multi-layer circuit board may include at least three stacked metal circuit layers, with two adjacent metal circuit layers being insulated and spaced apart by an insulating dielectric layer 324. Figure 12 is another schematic diagram of the first circuit board provided in an embodiment of the present application. As shown in Figure 12, during demetallization, the metal portion of the metal circuit layer located within the first surface S1 and the second surface S2 is removed, but the metal circuit layer between the two adjacent insulating dielectric layers 324 can be retained, but the metal circuit layer is at least partially demetallized. For example, in one embodiment, a metal portion 327 is also provided in the insulating dielectric layer 324.

[0084] Figure 13 is another schematic diagram of the first circuit board provided in an embodiment of the present application. As shown in Figure 13 , in another embodiment, the first demetallized region R1 and the second demetallized region R2 can be directly connected via the second through-hole 328. In other words, no insulating dielectric layer 324 is provided between the first demetallized region R1 and the second demetallized region R2, or between the second input pad 321 and the second output pad 322.

[0085] 8 , the first circuit board 32 is provided with a third conductor 3211 and a fourth conductor 3221. The third conductor 3211 can be located in the first demetallized region R1 and the second demetallized region R2, and the third conductor 3211 is connected to the second input pad 321. The fourth conductor 3221 can be located in the first demetallized region R1 and the second demetallized region R2 and is connected to the second output pad 322.

[0086] In the above embodiment, a cross-section of the third conductive body 3211 perpendicular to the thickness of the first circuit board 32 has a projection on the first surface S1. The projection of the third conductive body 3211 can fall within the second input pad 321, meaning that the cross-sectional dimensions of the third conductive body 3211 are smaller than the dimensions of the second input pad 321 on the first surface S1. Alternatively, the projection of the third conductive body 3211 can completely overlap the second input pad 321, meaning that the cross-sectional dimensions of the third conductive body 3211 are equal to the dimensions of the second input pad 321 on the first surface S1. Alternatively, the projection of the third conductive body 3211 can cover the second input pad 321, meaning that the cross-sectional dimensions of the third conductive body 3211 are larger than the dimensions of the second input pad 321 on the first surface S1. Similarly, a cross-section of the fourth conductive body 3221 perpendicular to the thickness of the first circuit board 32 has a projection on the first surface S1. The projection of fourth conductive body 3221 may fall within second output pad 322, that is, the cross-sectional dimensions of fourth conductive body 3221 are smaller than the dimensions of second output pad 322 on first surface S1. Alternatively, the projection of fourth conductive body 3221 may completely overlap with second output pad 322, that is, the cross-sectional dimensions of third conductive body 3211 are equal to the dimensions of second output pad 322 on first surface S1. Alternatively, the projection of fourth conductive body 3221 may cover second output pad 322, that is, the cross-sectional dimensions of fourth conductive body 3221 are larger than the dimensions of second output pad 322 on first surface S1.

[0087] As shown in FIG8 , in a specific embodiment, within the first projection area R0, the first demetallized region R1 extends on the first surface S1 to the second input pad 321 and the second output pad 322. The projection of the second demetallized region R2 on the first surface S1 also extends to the second input pad 321 and the second output pad 322. In this embodiment, the area between the first surface S1 and the second surface S2, and between the third conductor 3211 and the fourth conductor 3221, can also be demetallized to form an intermediate demetallized region. This intermediate demetallized region can have an irregular shape. Specifically, along a direction perpendicular to the first circuit board, the first demetallized region R1 and the second demetallized region R2 can completely overlap. The projection of the intermediate demetallized region on the first surface S1 can be smaller than the first demetallized region R1, or can be equal to the first demetallized region R1 (i.e., the projection of the intermediate demetallized region completely overlaps the first demetallized region R1), or can even be larger than the first demetallized region R1.

[0088] In one embodiment, the second surface S2 may be provided with a wiring portion 329, and the second demetallized region R2 is provided within the wiring portion 329. The third conductive body 3211 may be used to conductively connect the second input pad 321 and the third wiring portion 329, and the fourth conductive body 3221 may be used to conductively connect the second output pad 322 and the third wiring portion 329.

[0089] In practical applications, the second surface S2 of the first circuit board 32 may be provided with at least one discrete device 33, which may be conductively connected to the wiring portion 329. In this application, the discrete device 33 includes but is not limited to electronic devices such as resistors, capacitors, or inductors.

[0090] Figure 14 is another schematic diagram of an electronic component provided in an embodiment of the present application. As shown in Figure 14, in one embodiment, the electronic component 30 can be a dual-channel module. Specifically, in the power module 31, the surface of the packaging layer 313 facing the first circuit board 32 is further provided with a third input pad 318, a third output pad 319 and a third ground pad, wherein the third input pad 318 and the third output pad 319 are respectively conductively connected to the RF power device 312, and the third ground pad is conductively connected to the flange 311. The first input pad 314 and the first output pad 315 can form a first channel, and the third input pad 318 and the third output pad 319 can form a second channel. The third ground pad can be an integrally molded structure with the first ground pad 316. Correspondingly, within the first projection area R0 of the first circuit board 32, the first surface S1 is further provided with a fourth input pad, a fourth output pad and a fourth ground pad. The fourth input pad is disposed opposite and conductively connected to the third input pad 318, the fourth output pad is disposed opposite and conductively connected to the third output pad 319, and the fourth ground pad is disposed opposite and conductively connected to the third ground pad. Furthermore, the first surface S1 has a third demetallized region, which is located within the first projection area R0 and between the fourth input pad and the fourth output pad. The second surface S2 also has a fourth demetallized region R4. The projection of the fourth demetallized region R4 on the first surface S1, perpendicular to the first circuit board 32, is located within the first projection area R0 and between the fourth input pad and the fourth output pad.

[0091] In the above embodiment, on the side surface of the packaging layer 313 facing the first circuit board 32, the first input pad 314 and the third input pad 318 can be aligned, and the first output pad 315 and the third output pad 319 can be aligned. That is, the first channel and the second channel have the same centerline (as shown by the dotted line in Figure 14). Figure 15 is another schematic diagram of the electronic assembly provided by an embodiment of the present application. As shown in Figure 15, the first channel and the second channel can also be staggered, that is, the centerline of the first channel and the centerline of the second channel can not overlap. In this embodiment, each channel can be provided with two discrete devices 33. Specifically, the first channel is provided with a first discrete device 33a and a second discrete device 33b, and the first discrete device 33a and the second discrete device 33b are respectively located on either side of the second demetallized region R2. The second channel is provided with a third discrete device 33c and a fourth discrete device 33d, and the third discrete device 33c and the fourth discrete device 33d are respectively located on either side of the fourth demetallized region R4. In this way, the first channel and the second channel are independent of each other, which can reduce the risk of interference between the channel layouts. It is understandable that the electronic component 30 of the present application can also be a three-channel module or a multi-channel module, which is not specifically limited here.

[0092] In the above embodiment, the first distance d1 between the first discrete device 33a and the second demetallized region R2, the second distance d2 between the second discrete device 33b and the second demetallized region R2, the third distance d3 between the third discrete device 33c and the fourth demetallized region R4, and the fourth distance d4 between the fourth discrete device 33d and the fourth demetallized region R4 can be set to equal distances, thereby improving design freedom.

[0093] Figure 16 is another schematic diagram of an electronic assembly provided in an embodiment of the present application. As shown in Figure 16 , the electronic assembly 30 further includes a first heat sink 34. The first heat sink 34 is disposed on the side of the flange 311 facing away from the first circuit board 32 and is used to dissipate heat from the power module 31. The first heat sink 34 can be used solely for heat dissipation and does not require electrical conductivity.

[0094] When the electronic assembly 30 is in operation, the return current path can sequentially pass through the second ground pad 323, the first ground pad 316, the flange 311, the first output pad 315, the second output pad 322, the fourth conductor 3221, and the discrete device 33 from the first circuit board 32. This return current path does not need to pass through the first heat sink 34 and is shorter, thereby improving the consistency of the electronic assembly 30.

[0095] In actual application, in order to improve the heat transfer efficiency of the surface where the flange 311 contacts the first heat sink 34, a first heat conducting layer 35 is provided between the flange 311 and the first heat sink 34. The first heat conducting layer 35 is in close contact with the surfaces of the flange 311 and the first heat sink 34 respectively to improve the heat transfer efficiency.

[0096] Figure 17 is another schematic diagram of an electronic assembly provided in an embodiment of the present application. As shown in Figure 17, in one embodiment, the electronic assembly 30 can be used in a multi-circuit board scenario. Specifically, the electronic assembly 30 also includes a second circuit board 36. The second circuit board 36 is located on the side of the first circuit board 32 facing the power module 31, and the second circuit board 36 is fixedly connected to the first circuit board 32. The power module 31 is disposed within the second circuit board 36.

[0097] FIG18 is another schematic diagram of an electronic component provided in an embodiment of the present application. As shown in FIG18 , in one embodiment, the electronic component 30 further includes a second heat sink 37. The second heat sink 37 is located on the side of the second circuit board 36 facing away from the first circuit board 32, and the second heat sink 37 is located on the side of the first heat sink 34 facing away from the first circuit board 32. The second heat sink 37 can be used to dissipate heat from the power module 31 and the second circuit board 36. In order to improve the heat transfer efficiency of the surface where the second circuit board 36 contacts the second heat sink 37, a second heat-conducting layer 38 is provided between the second circuit board 36 and the second heat sink 37, and the second heat-conducting layer 38 is in close contact with the surfaces of the second circuit board 36 and the second heat sink 37, respectively. In addition, the second heat-conducting layer 38 can also extend between the first heat sink 34 and the second heat sink 37, and the second heat-conducting layer 38 is in close contact with the surfaces of the first heat sink 34 and the second heat sink 37, respectively.

[0098] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic component, characterized in that: It includes a power module and a first circuit board, wherein: The power module comprises a flange, a packaging layer and a radio frequency power device; the packaging layer is located on a side of the flange facing the first circuit board and is connected to the flange, and the radio frequency power device is arranged in the packaging layer; a first input pad, a first output pad and a first ground pad are arranged on a surface of the packaging layer facing the first circuit board, the first input pad and the first output pad are respectively conductively connected to the radio frequency power device, and the first ground pad is conductively connected to the flange; A second input pad, a second output pad and a second ground pad are disposed on a first surface of the first circuit board facing the power module, the second input pad is disposed opposite to and conductively connected to the first input pad, the second output pad is disposed opposite to and conductively connected to the first output pad, and the second ground pad is disposed opposite to and conductively connected to the first ground pad; The power module has a first projection area on the first surface along a direction perpendicular to the first circuit board; the first surface has a first demetallized area, the first demetallized area is located within the first projection area and between the second input pad and the second output pad; the second surface of the first circuit board facing away from the power module has a second demetallized area, and along the direction perpendicular to the first circuit board, the projection of the second demetallized area on the first surface is located within the first projection area and between the second input pad and the second output pad.

2. The electronic component according to claim 1, wherein: Along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface at least partially overlaps with the first demetallized area.

3. The electronic component according to claim 2, wherein: Along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface completely overlaps with the first demetallized area.

4. The electronic component according to claim 1, wherein: Along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface does not overlap with the first demetallized area.

5. The electronic component according to any one of claims 1 to 4, characterized in that: An insulating dielectric layer is disposed between the first demetallized region and the second demetallized region, and the insulating dielectric layer connects the first demetallized region and the second demetallized region.

6. The electronic component according to claim 5, characterized in that The insulating dielectric layer is provided with a groove, and the opening of the groove is located in the first demetallized area or the second demetallized area; Alternatively, the insulating dielectric layer is provided with a first through hole, the first through hole penetrates the insulating dielectric layer and connects the first demetallized region and the second demetallized region.

7. The electronic component according to any one of claims 1 to 4, characterized in that: A second through hole is disposed between the first demetallized region and the second demetallized region, and the second through hole connects the first demetallized region and the second demetallized region.

8. The electronic component according to any one of claims 1 to 7, characterized in that: The first circuit board is provided with a first conductor and a second conductor, the first conductor is located in the first demetallized area and the second demetallized area and connected to the second input pad, and the second conductor is located in the first demetallized area and the second demetallized area and connected to the second output pad.

9. The electronic component according to claim 8, characterized in that The second surface is provided with a wiring portion, and the second demetallized area is provided in the wiring portion; the first conductor is conductively connected to the second input pad and the wiring portion, and the second conductor is conductively connected to the second output pad and the wiring portion.

10. The electronic component according to any one of claims 1 to 9, characterized in that: The packaging layer is provided with a first through-hole and a second through-hole, the first through-hole and the second through-hole respectively penetrate the packaging layer, the first through-hole is provided with a third conductor, the first input pad and the RF power device are conductively connected through the third conductor, the second through-hole is provided with a fourth conductor, the second input pad and the RF power device are conductively connected through the fourth conductor.

11. The electronic component according to any one of claims 1 to 10, characterized in that: A fifth conductor is disposed on a surface of the flange facing the first circuit board. The fifth conductor penetrates the packaging layer and conductively connects the flange and the first ground pad.

12. The electronic component according to any one of claims 1 to 11, characterized in that: The electronic component is a dual-channel module; A third input pad, a third output pad and a third ground pad are also provided on a surface of the packaging layer facing the first circuit board, wherein the third input pad and the third output pad are respectively conductively connected to the RF power device, and the third ground pad is conductively connected to the flange; The first surface is also provided with a fourth input pad, a fourth output pad and a fourth ground pad, the fourth input pad being connected to the first The three input pads are arranged opposite to each other and are conductively connected, the fourth output pad is arranged opposite to the third output pad and is conductively connected, and the fourth ground pad is arranged opposite to the third ground pad and is conductively connected; The first surface also has a third demetallized area, which is located within the first projection area and between the fourth input pad and the fourth output pad; the second surface also has a fourth demetallized area, and along a direction perpendicular to the first circuit board, the projection of the fourth demetallized area on the first surface is located within the first projection area and between the fourth input pad and the fourth output pad.

13. The electronic component according to claim 12, wherein: A first discrete device, a second discrete device, a third discrete device and a fourth discrete device are arranged on a side of the first circuit board facing away from the power module. The first discrete device and the second discrete device are respectively located on both sides of the second demetallized area, and the third discrete device and the fourth discrete device are respectively located on both sides of the fourth demetallized area.

14. The electronic component according to any one of claims 1 to 13, characterized in that: The electronic component further includes a first heat sink, which is disposed on a side of the flange away from the first circuit board and is used to dissipate heat for the power module.

15. The electronic component according to claim 14, wherein: A first heat-conducting layer is arranged between the flange and the first heat sink.

16. The electronic component according to any one of claims 1 to 15, characterized in that: The electronic component further includes a second circuit board, which is located on a side of the first circuit board facing the power module and is connected to the first circuit board. The power module is disposed in the second circuit board.

17. A communication device, characterized in that: Comprising the electronic component as claimed in any one of claims 1 to 16.

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