Vapor deposition device and production method for display device

Abstract

A vapor deposition device (1) is provided with a touch plate (4) and a touch plate control unit. The touch plate presses a vapor deposition target (X) against a vapor deposition mask (3) from the side opposite to a vapor deposition source (2). The touch plate control unit controls the position of the touch plate in a first direction (D1) from the vapor deposition target to the vapor deposition mask. The touch plate includes a first touch plate (41) that overlaps a first region (X1) of the vapor deposition target, and a second touch plate (42) that overlaps a second region (X2) of the vapor deposition target. The touch plate control unit individually controls the positions of the first touch plate and the second touch plate.

Description

Vapor deposition device and display device manufacturing method

[0001] The present disclosure relates to a vapor deposition apparatus and a method for manufacturing a display device using the vapor deposition apparatus.

[0002] Layers between electrodes of light-emitting elements used in display devices and the like are sometimes formed by a vacuum deposition method using a deposition mask. Here, in vacuum deposition methods using a deposition mask, it is sometimes necessary to bring the deposition target, such as a substrate, and the deposition mask into close contact with each other while reducing deflection of both, in order to reduce color mixing in the deposited film. Patent Document 1 discloses a deposition apparatus that reduces deflection of the substrate and the deposition mask by pressing the substrate and the deposition mask against a holder using an electrostatic chuck.

[0003] Japanese Patent Application Publication No. 2014-65959

[0004] In the deposition apparatus described in Patent Document 1, the substrate and the deposition mask are pressed against a single holder. Therefore, with this mechanism, it is difficult to reduce the difference in the distance or the difference in the deflection between the substrate and the deposition mask depending on the position of the deposition mask in a plan view. Therefore, even with a deposition apparatus equipped with the above mechanism, the deposition accuracy of the deposition film may be reduced on a portion of the substrate.

[0005] A vapor deposition apparatus according to one aspect of the present disclosure includes a vapor deposition source, a vapor deposition mask, a touch plate that presses a vapor deposition target against the vapor deposition mask from the side opposite the vapor deposition source, and a touch plate control unit that controls the position of the touch plate in a first direction from the vapor deposition target to the vapor deposition mask, wherein the touch plate includes a first touch plate that overlaps a first region of the vapor deposition target in the first direction, and a second touch plate that overlaps a second region of the vapor deposition target in the first direction that is different from the first region, and the touch plate control unit individually controls the positions of the first touch plate and the second touch plate in the first direction.

[0006] A method for manufacturing a display device according to one aspect of the present disclosure is a method for manufacturing a display device including a substrate and a plurality of light-emitting elements positioned on the substrate and including a plurality of stacked thin films, the method including depositing at least one layer of the thin film of at least one of the light-emitting elements, the deposition including placing the substrate above a deposition source, aligning the substrate with respect to a deposition mask, pressing the substrate against the deposition mask from the side opposite the deposition source using a first touch plate overlapping a first region of the substrate in a first direction from the substrate to the deposition mask and a second touch plate overlapping a second region of the substrate different from the first region in the first direction, individually aligning the positions of the first touch plate and the second touch plate in the first direction, and releasing a deposition material from the deposition source.

[0007] According to the configuration according to one aspect of the present disclosure, the deposition accuracy of the vapor-deposited film is improved.

[0008] FIG. 1 is a schematic side cross-sectional view of a vapor deposition apparatus according to Embodiment 1. FIG. 2 is a schematic view of a display device according to Embodiment 1. FIG. 3 is a block diagram of a vapor deposition apparatus according to Embodiment 1. FIG. 4 is a schematic plan view of a portion of the vapor deposition apparatus and a substrate according to Embodiment 1. FIG. 5 is an enlarged plan view of a portion of the vapor deposition apparatus and a substrate according to Embodiment 1. FIG. 6 is a flowchart of a portion of a method for manufacturing a display device according to Embodiment 1. FIG. 7 is a side cross-sectional view of a vapor deposition apparatus in a process step in a portion of a method for manufacturing a display device according to Embodiment 1. FIG. 8 is a side cross-sectional view of a vapor deposition apparatus in another process step in a portion of a method for manufacturing a display device according to Embodiment 1. FIG. 9 is a side cross-sectional view of a vapor deposition apparatus in another process step in a portion of a method for manufacturing a display device according to Embodiment 1. FIG. 10 is a side cross-sectional view of a vapor deposition apparatus in another process step in a portion of a method for manufacturing a display device according to Embodiment 1. FIG. 11 is a schematic plan view of a portion of a vapor deposition apparatus and a substrate according to Embodiment 2. FIG. 12 is a schematic plan view of a portion of a vapor deposition apparatus and a substrate according to Embodiment 3. FIG. 13 is a schematic plan view of a portion of a vapor deposition apparatus and a substrate according to Embodiment 4. FIG. 14 is a schematic plan view of a portion of a vapor deposition apparatus and a substrate according to Embodiment 5.

[0009] [Embodiment 1] <Display Device> Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that in each drawing, similar configurations are assigned the same reference numerals, and their description will be omitted. Furthermore, in this disclosure, for simplicity of illustration, components assigned the same reference numerals may be shown at different scales and with different hatching depending on the drawing. However, the components shown in each drawing of the present disclosure are merely examples, and the scales are not limited to those shown in the drawings. Furthermore, in this disclosure, components with different hatching have the same configuration as described above. Furthermore, in each drawing of the present disclosure, when two components have substantially the same shape but different compositions, etc., they may be assigned different reference numerals and the same hatching.

[0010] FIG. 2 is a schematic diagram of a display device DP according to this embodiment. The display device DP is a device that can be used, for example, as a display for a television or a smartphone. The display device DP includes a display unit DA including a plurality of subpixels PX and a driver circuit DR that drives the subpixels PX. Each of the subpixels PX includes a light-emitting element LE formed on a substrate and a pixel circuit PC that drives the light-emitting element LE. Each pixel circuit PC may include a circuit element such as a thin-film transistor (TFT) formed in the substrate of the display device DP. The display device DP displays an image on the display unit DA by controlling the light emission from each of the plurality of light-emitting elements LE formed in the display unit DA via the driver circuit DR and the pixel circuit PC.

[0011] The light-emitting element LE is located on the substrate of the display device DP and includes a plurality of thin films stacked together. The light-emitting element LE may include, for example, an anode, a light-emitting layer, and a cathode, in this order from the substrate side of the display device DP, or these layers may be arranged in reverse order. The light-emitting element LE may also include functional layers such as a hole injection layer, a hole transport layer, and an electron blocking layer between the anode and the light-emitting layer. Furthermore, the light-emitting element LE may also include functional layers such as an electron injection layer, an electron transport layer, and a hole blocking layer between the cathode and the light-emitting layer.

[0012] The light-emitting layer includes a light-emitting material that emits light using the energy of excitons generated by the recombination of holes from the anode and electrons from the cathode. As long as the above configuration is maintained, the light-emitting layer may include various light-emitting materials, including conventionally known light-emitting materials. For example, the light-emitting layer may include an organic light-emitting material; in other words, the light-emitting element LE may be an OLED (organic light-emitting diode) element. Furthermore, the light-emitting layer may include luminescent quantum dots (semiconductor nanoparticles); in other words, the light-emitting element LE may be a QLED (quantum dot light-emitting diode) element.

[0013] In this embodiment, at least one layer of the light-emitting element LE included in the display device DP may be formed by a vapor deposition method using a vapor deposition apparatus described below. In other words, at least one layer of the light-emitting element LE may include a material that can be formed into a film by a vapor deposition method. In other words, the manufacturing method of the display device DP according to this embodiment includes a method of forming at least one layer of at least one light-emitting element LE by vapor deposition.

[0014] <Vapor Deposition Apparatus: Overview> A vapor deposition apparatus used in the manufacturing method of the display device DP according to this embodiment will be described with reference to FIGS. 1 and 3. FIG. 1 is a schematic side cross-sectional view of the vapor deposition apparatus 1 according to this embodiment. FIG. 3 is a block diagram of the vapor deposition apparatus 1 according to this embodiment. Note that for simplicity of illustration, the vapor deposition apparatus 1 shown in FIGS. 1 and 3 includes components that are not shown. FIG. 1 also illustrates a schematic cross-section of the vapor deposition apparatus 1, along with a control unit 7 (described later). Furthermore, FIG. 1 also illustrates a schematic side cross-section of a substrate X of the display device DP, which is placed on a stage 6 (described later) as a vapor deposition target on which a vapor deposition film is formed by the vapor deposition apparatus 1. Note that, as shown in FIG. 1, the substrate X may bend due to its own weight such that the central side not supported by hooks 61 (described later) is positioned lower than the end supported by the hooks 61.

[0015] The vapor deposition apparatus 1 includes a vapor deposition source 2, a vapor deposition mask 3, a touch plate 4, a magnet unit 5, a stage 6, and a control unit 7. Each unit of the vapor deposition apparatus 1 except for the control unit 7 may be housed in a vacuum chamber (not shown).

[0016] <Vapor Deposition Apparatus: Vapor Deposition Source> The vapor deposition source 2 includes, for example, a vapor deposition material 21, a housing 22, a heater 23, and an opening 24. The vapor deposition material 21 includes a material of a vapor deposition film formed by the vapor deposition apparatus 1, and includes, for example, a material that is solid at room temperature and sublimes into a gas when heated. The housing 22 has, for example, a cavity therein for storing the vapor deposition material 21. The heater 23 is, for example, located inside the housing 22 and may include a heating device including a conventionally known heater such as a sheathed heater for heating the inside of the housing 22. The opening 24 has a plurality of openings that communicate between the inside and outside of the housing 22 on the side of the vapor deposition mask 3 (described later) in the housing 22.

[0017] The vapor deposition source 2 heats the vapor deposition material 21 in the housing 22 with a heater 23, thereby discharging the vapor deposition material 21 from the inside of the housing 22 through an opening 24 toward the vapor deposition mask 3. In the schematic side cross-sectional views of the vapor deposition device 1 according to each embodiment of the present disclosure, including FIG. 1 , the direction toward the side where the vapor deposition material 21 is discharged from the vapor deposition source 2 is described as the upward direction, and the direction toward the opposite side from the upward direction is described as the downward direction.

[0018] <Vapor Deposition Apparatus: Vapor Deposition Mask> The vapor deposition mask 3 is located on the vapor deposition source 2 side in the direction in which the vapor deposition material 21 is emitted from the vapor deposition source 2. The vapor deposition mask 3 includes, for example, a mask sheet 31, a mask frame 32, and a mask frame fixing portion 33.

[0019] The mask sheet 31 has, for example, a plurality of openings corresponding to positions on the substrate X placed on the stage 6 (described later) where the vapor-deposited film is to be formed. The mask sheet 31 may be a metal mask containing a metal with a low thermal expansion coefficient, such as Fe-Ni 36%. The mask sheet 31 may contain a ferromagnetic material because it is attracted by a magnet 51 (described later).

[0020] The mask frame 32 is a frame-shaped member to which the mask sheet 31 is fixed, and has, for example, a rectangular outer shape in a plan view as described later. The mask frame 32 according to this embodiment forms the outer shape of the vapor deposition mask 3 in a plan view. The mask frame 32 may have a function not only to fix the position of the mask sheet 31 relative to the vapor deposition source 2, but also to reduce deflection of the mask sheet 31.

[0021] The mask sheet 31 may be fixed to the mask frame 32 by being welded to the mask frame 32. Therefore, the fixation of the mask sheet 31 to the mask frame 32 may be releasable by removing the welded portion between the mask sheet 31 and the mask frame 32. Thereafter, after polishing the welded portion of the mask frame 32, another mask sheet 31 may be welded to the mask frame 32 again to fix the mask sheet 31 to the mask frame 32. In other words, the mask sheet 31 may be detachably attached to the mask frame 32.

[0022] The mask frame fixing portion 33 is a member to which the mask frame 32 is fixed, and may be, for example, integral with the mask frame 32. The mask frame fixing portion 33 only needs to be connected to a part of the mask frame 32; in other words, it does not have to be rectangular in plan view, and further in other words, it does not have to form the outer shape of the deposition mask 3.

[0023] <Vapor Deposition Apparatus: Touch Plate> The touch plate 4 has a function of pressing the substrate X against the vapor deposition mask 3 from the side opposite the vapor deposition source 2 by a method described below. In each embodiment of the present disclosure, the direction from the touch plate 4 of the vapor deposition apparatus 1 to the vapor deposition mask 3 is defined as a first direction D1, and the direction perpendicular to the first direction D1 is defined as a second direction D2. The first direction D1 may be substantially the same as the vertical downward direction, and the second direction D2 may be substantially the same as the horizontal direction. However, in the present disclosure, "the two directions are substantially the same" does not necessarily mean that the two directions are strictly the same, and allows for differences that arise due to, for example, manufacturing errors of the vapor deposition apparatus 1.

[0024] 1, the second direction D2 indicates only the left-right direction as viewed from the paper surface. However, the second direction D2 in the present disclosure may include all directions perpendicular to the first direction D1, including the direction toward the paper surface of the side cross-sectional view of the vapor deposition device 1 in the present disclosure and the direction away from the paper surface.

[0025] The touch plate 4 according to this embodiment is located on the opposite side of the deposition mask 3 with respect to the substrate X placed on a stage 6, which will be described later. The touch plate 4 includes a plurality of divided touch plates, including at least a first touch plate 41 and a second touch plate 42. The second touch plate 42 is separate from the first touch plate 41; in other words, the second touch plate 42 is separate from the first touch plate 41.

[0026] When viewed in the first direction D1, the first touch plate 41 overlaps a first region X1 of the substrate X placed on the stage 6, and the second touch plate 42 overlaps a second region X2 of the substrate X that is different from the first region X1. The first touch plate 41 and the second touch plate 42 may be plate-like members having a predetermined flexibility or elasticity. The touch plate 4 may also include another divided touch plate that is different from both the first touch plate 41 and the second touch plate 42. The other divided touch plate may have the same shape and material as the first touch plate 41 or the second touch plate 42, and may overlap a region of the substrate X placed on the stage 6 that is different from both the first region X1 and the second region X2.

[0027] The vapor deposition apparatus 1 may further include a first touch plate arm 41A and a second touch plate arm 42A. The first touch plate arm 41A and the second touch plate arm 42A are, for example, rod-shaped members extending in substantially the same direction as the first direction D1. The first touch plate arm 41A is connected to the upper surface of the first touch plate 41, and the second touch plate arm 42A is connected to the upper surface of the second touch plate 42.

[0028] The first touch plate arm 41A and the second touch plate arm 42A move along the first direction D1 in a manner described below. The movements of the first touch plate arm 41A and the second touch plate arm 42A along the first direction D1 occur independently between the first touch plate arm 41A and the second touch plate arm 42A. Therefore, the deposition apparatus 1 individually controls the positions of the first touch plate 41 and the second touch plate 42 in the first direction D1 through the movements of the first touch plate arm 41A and the second touch plate arm 42A.

[0029] If the touch plate 4 includes further divided touch plates in addition to the first touch plate 41 and the second touch plate 42, the deposition device 1 may include other arms for individually controlling the positions of the other divided touch plates in the first direction D1.

[0030] Furthermore, the deposition apparatus 1 may include a camera C. For example, the camera C is located inside each of recesses 4R formed on the deposition mask 3 side of the first touch plate 41 and the second touch plate 42. In particular, the entire camera C is accommodated inside the recess 4R; in other words, the lower end of the camera C does not protrude from the lower end of the touch plate 4. Each camera C captures an image of the deposition mask 3 side from the touch plate 4. Data of the image captured by each camera C is transmitted to a control unit (described later) via, for example, a circuit formed inside the first touch plate arm 41A, the second touch plate arm 42A, etc., or a communication unit (not shown).

[0031] When the touch plate 4 includes an additional divided touch plate in addition to the first touch plate 41 and the second touch plate 42, a camera C may also be formed on the additional divided touch plate. Furthermore, some of the divided touch plates included in the touch plate 4 may not be formed with a camera C, or one divided touch plate may be formed with multiple cameras C. The position of the camera C relative to the touch plate 4 is not limited as long as each camera C can capture an image of the side of the deposition mask 3 relative to the touch plate 4 and does not interfere with contact between the deposition mask 3 and the touch plate 4, which will be described later.

[0032] <Deposition Apparatus: Magnet> The magnet unit 5 includes a magnet 51 and a magnet arm 52 .

[0033] The magnet 51 is located on the opposite side of the deposition mask 3 with respect to the first touch plate 41 and the second touch plate 42. In addition, the magnet 51 overlaps with the first touch plate 41 and the second touch plate 42 when viewed in the first direction D1. The magnet 51 may have openings 5H through which the first touch plate arm 41A and the second touch plate arm 42A pass.

[0034] The magnet 51 generates a magnetic field, thereby attracting the deposition mask 3 via the substrate X and the touch plate 4, as will be described later. The magnet 51 may include a member that constantly generates a magnetic field, such as a magnet, or may include a member that generates a magnetic field as needed, such as an electromagnet. The magnet 51 may include, for example, a neodymium magnet.

[0035] The magnet arm 52 is, for example, a rod-shaped member extending in substantially the same direction as the first direction D1. For example, the magnet arm 52 is connected to the upper surface of the magnet 51. The magnet arm 52 moves along the first direction D1 by a method described below, whereby the deposition device 1 controls the position of each of the magnets 51 in the first direction D1.

[0036] <Vapor Deposition Apparatus: Stage> The stage 6 is a member on which a substrate X, which is a vapor deposition target on whose surface a vapor deposition film is formed by the vapor deposition apparatus 1, is placed. The stage 6 includes a hook 61 and a stage arm 62. The stage arm 62 extends, for example, along the first direction D1. The stage 6 may include a plurality of stage arms 62. The hooks 61 are located at the lower ends of the respective stage arms 62 and protrude from the periphery of the vapor deposition mask 3 toward the center.

[0037] The substrate X is placed on the stage 6 by placing the substrate X on the hook 61. The stage arm 62 is movable along a first direction D1 by a method described later, and is also movable in a second direction D2 perpendicular to the first direction D1. Thus, the deposition apparatus 1 can align the position of the substrate X in the first direction D1 and the position in the second direction D2 with respect to the deposition mask 3 by moving the stage arm 62 with the substrate X placed on the hook 61.

[0038] In particular, the stage arm 62 can move the hook 61 along the first direction D1 to a position where the lower surface of the substrate X, on which a vapor deposition film is to be formed, can come into contact with the mask sheet 31, with the substrate X placed on the upper part of the hook 61. In this case, to reduce interference between the stage 6 and the vapor deposition mask 3, the vapor deposition mask 3 may have various shapes as long as they do not affect the formation of a vapor deposition film, as described below, such as a recess in the upper part of the mask frame 32 that corresponds to the shape of the hook 61. For example, when the vapor deposition apparatus 1 lowers the hook 61 toward the vapor deposition mask 3, a part of the hook 61 may enter inside a recess in the upper part of the mask frame 32, thereby reducing interference between the mask frame 32 and the hook 61.

[0039] <Vapor Deposition Apparatus: Control Unit> The control unit 7 controls the operation or movement of each of the other units of the vapor deposition apparatus 1 by exchanging information with the other units using a communication means (not shown). The control unit 7 includes, for example, a storage unit 7M, a processor 7P, a vapor deposition source control unit 72, a touch plate control unit 74, a magnet control unit 75, and a stage control unit 76.

[0040] The storage unit 7M at least temporarily stores data transmitted from each part of the control unit 7, including the processor 7P, the evaporation source control unit 72, the touch plate control unit 74, the magnet control unit 75, and the stage control unit 76. Each part of the control unit 7, including the processor 7P, the evaporation source control unit 72, the touch plate control unit 74, the magnet control unit 75, and the stage control unit 76, may read out the data stored in the storage unit 7M. The storage unit 7M may previously store data related to the control content of each part of the evaporation device 1 that is necessary to form an evaporated film on the substrate X by a method described below.

[0041] The processor 7P processes the received data in accordance with a predetermined algorithm to generate new data. The processor 7P may include various processing devices, including conventionally known processing devices such as a CPU (Central Processing Unit). The processor 7P may directly exchange data with each component of the control unit 7, or may store the data at least temporarily in the memory unit 7M. In this case, the processor 7P may read the data from the memory unit, process the data, and then store the processed data again in the memory unit 7M. The algorithm, including the processing details by the processor 7P, may be stored in advance in the memory unit 7M.

[0042] The deposition source control unit 72 controls the operation of the deposition source 2. Specifically, the deposition source control unit 72 may control the heater 23 of the deposition source 2 based on control contents related to the timing of starting heating of the heater 23, the heating temperature, and the heating time stored in the memory unit 7M, for example. In this way, the deposition source control unit 72 may control the film formation rate of the deposition film formed on the substrate X by a method described later.

[0043] The touch plate control unit 74 controls the position of the touch plate 4 in the first direction D1. In particular, the touch plate control unit 74 individually controls the positions in the first direction D1 of the multiple divided touch plates included in the touch plate 4, including the first touch plate 41 and the second touch plate 42. For example, the touch plate control unit 74 may individually control the movement in the first direction D1 of the first touch plate arm 41A and the second touch plate arm 42A.

[0044] Image data captured by camera C may be transmitted from camera C to touch plate control unit 74. Touch plate control unit 74 may store the image data in memory unit 7M. Next, processor 7P may read the data from memory unit 7M, process the data according to a predetermined algorithm to calculate new data, and store the new data in memory unit 7M. Next, touch plate control unit 74 may read the data calculated by processor 7P and stored in memory unit 7M from memory unit 7M, and control the touch plate 4 based on the data. Note that image data captured by camera C may be transmitted directly to memory unit 7M or processor 7P.

[0045] The magnet control unit 75 controls the position of the magnet 51 in the first direction D1. For example, the magnet control unit 75 may control the position of the magnet 51 in the first direction D1 by controlling the movement of the magnet arm 52 in the first direction D1.

[0046] The stage control unit 76 controls the position of the stage 6 in the first direction D1 and the second direction D2. For example, the stage control unit 76 may control the movement of the stage arm 62 in the first direction D1 and the second direction D2. Thus, through control of the movement, the stage control unit 76 may control the movement of the substrate X placed on the upper part of the hook 61 in the first direction D1 and the second direction D2.

[0047] <Vapor deposition apparatus: alignment sheet> Further details of the configuration of the vapor deposition apparatus 1 and details of a portion of the vapor deposition apparatus 1 will be described in detail with further reference to Fig. 4. Fig. 4 is a schematic plan view of a portion of the vapor deposition apparatus 1 according to this embodiment and a substrate X placed on a stage 6. In particular, it is a plan view of the portion of the vapor deposition apparatus 1 and the substrate X as seen from above, in other words, as seen in a first direction D1.

[0048] 4 shows a part of the deposition mask 3 and a part of the touch plate 4 of the above-described deposition apparatus 1. The schematic plan views in the present disclosure also show an alignment sheet 8 that is further included in the deposition apparatus 1, as will be described later.

[0049] The schematic plan views in this disclosure may show components of the vapor deposition device 1 that are located in the foreground in the first direction D1, and omit the illustration of components that are located further back than those components.

[0050] However, in the schematic plan views in the present disclosure, the boundary between the mask sheet 31 and the mask frame 32 (described later) that is located on the far side of the touch plate 4 in the first direction D1 is indicated by a dotted line. Furthermore, in the schematic plan views in the present disclosure, only the outline of the substrate X is indicated by a dashed line.

[0051] As shown in FIG. 4 , the deposition apparatus 1 further includes an alignment sheet 8. The alignment sheet 8 is located between the deposition mask 3 and the substrate X placed on the stage 6. Two alignment sheets 8 may be formed, sandwiching the mask sheet 31 and the mask frame 32 of the deposition mask 3 in any direction of the second direction D2. Note that, as shown in FIG. 4 , the mask sheet 31 and the mask frame 32 of the deposition mask 3 according to this embodiment and the substrate X all have a rectangular outer shape when viewed in the first direction D1. In this case, the alignment sheet 8 may be formed along one edge of the mask frame 32 of the deposition mask 3 and along an edge opposite to that edge in the second direction D2.

[0052] The position of the alignment sheet 8 is fixed regardless of, for example, the movements of the touch plate 4, the magnet 51, and the stage 6. In particular, the position of the alignment sheet 8 may be fixed relative to, for example, the deposition mask 3. Furthermore, the alignment sheet 8 overlaps at least the edge of the substrate X placed on the stage 6 in the first direction D1.

[0053] <Method for aligning the position of the touch plate> The vapor deposition apparatus 1 according to this embodiment forms a vapor-deposited film on the substrate X while aligning the position of the substrate X, which is the target of vapor deposition, with respect to the vapor deposition mask 3. In particular, as will be described later, the vapor deposition apparatus 1 forms a vapor-deposited film on the substrate X while pressing the substrate X against the mask sheet 31 of the vapor deposition mask 3 with the touch plate 4. This allows the touch plate 4 to press the substrate X against the mask sheet 31 in accordance with the bending even when the mask sheet 31 is bent during vapor deposition, thereby enabling the vapor deposition apparatus 1 to more accurately form a vapor-deposited film on the substrate X.

[0054] Here, if the position of the touch plate 4 is too close to the substrate X, the touch plate 4 may press the substrate X or the mask sheet 31 excessively in the first direction D1. This may cause further bending of the substrate X or the mask sheet 31, or damage to the mask sheet 31 due to the substrate X pressing too hard against the mask sheet 31. On the other hand, if the position of the touch plate 4 is too far from the substrate X in the first direction D1, the touch plate 4 may not press the substrate X against the mask sheet 31 sufficiently, which may reduce the accuracy of the deposition of the deposited film on the substrate X. Therefore, in order to deposit a deposited film accurately using the deposition apparatus 1, it is necessary to properly align the relative position of the touch plate 4 with respect to the substrate X in the first direction D1.

[0055] A method for aligning the positions of the components of the vapor deposition apparatus 1 with respect to the substrate X using the vapor deposition apparatus 1 will be described with reference to Fig. 5. Fig. 5 is an enlarged plan view showing a part of the alignment sheet 8 of the vapor deposition apparatus 1 and a part of the substrate X placed on the stage 6.

[0056] In particular, the enlarged plan view shown in Fig. 5 is an enlarged plan view of the alignment sheet 8 and the substrate X in regions E1 and E2 indicated by dotted lines in Fig. 4. Region E1 in Fig. 5 is an enlarged view of the vicinity of one of the vertices of the substrate X as viewed in the first direction D1, and a portion of the alignment sheet 8 in that vicinity. Region E2 in Fig. 5 is an enlarged view of the substrate X and a portion of the mask frame 32 in the vicinity of a portion of one side of the substrate X that is closer to the center of the substrate X than region E1 in plan view.

[0057] 5, the substrate X has a first alignment mark M1. In particular, the substrate X has the first alignment mark M1 formed on the surface on the deposition mask 3 side. The alignment sheet 8 also has a second alignment mark M2 located near the first alignment mark M1 when viewed in the first direction D1. In particular, the second alignment mark M2 is formed on the surface of the alignment sheet 8 on the touch plate 4 side.

[0058] Here, the above-described camera C may transmit light through the substrate X to capture an image of a portion including the first alignment mark M1 formed on the surface of the substrate X on the deposition mask 3 side. In this case, when the focal point of the camera C and the position of the first alignment mark M1 in the first direction D1 approximately coincide with each other, the outline of the first alignment mark M1 is clearly shown in the image captured by the camera C. On the other hand, when the focal point of the camera C and the position of the first alignment mark M1 do not coincide with each other in the first direction D1, the outline of the first alignment mark M1 is not clearly shown in the image captured by the camera C.

[0059] In this embodiment, when the distance between the substrate X and the touch plate 4 in the first direction D1 is appropriate, the focus of the camera C in the first direction D1 approximately coincides with the position of the first alignment mark M1. In this case, the deposition apparatus 1 can determine whether the distance between the substrate X and the touch plate 4 in the first direction D1 is appropriate by analyzing the clarity of the outline of the first alignment mark M1 in the image captured by the camera C.

[0060] Note that, in the present disclosure, "two positions substantially coincide" does not necessarily mean that the two positions exactly coincide. For example, in the present disclosure, a difference between the focal point of the camera C and the position of the first alignment mark M1 in the first direction D1 is allowed within a range that does not contribute to the occurrence of defects in the deposition film on the substrate X by the deposition apparatus 1. By forming the first alignment mark M1 on the surface of the substrate X facing the deposition mask 3, the distance between the first alignment mark and the deposition mask 3 in the first direction D1 is shortened, enabling more precise position control of the substrate X. However, this is not limited thereto, and the first alignment mark M1 may also be formed on the surface of the substrate X facing the touch plate 4. In this case, even if the substrate X contains a material that does not transmit light, the camera C can capture an image of the first alignment mark M1.

[0061] Furthermore, as shown in region E1 of FIG. 5 , the camera C may capture an image of a portion of the surface of the alignment sheet 8 facing the touch plate 4, including the second alignment mark M2. The camera C may capture the image of the second alignment mark M2 through a transparent substrate X. Furthermore, when the distance between the touch plate 4 and the alignment sheet 8 in the first direction D1 is appropriate, the focus of the camera C in the first direction D1 may approximately coincide with the position of the second alignment mark M2. Note that it is not necessary for all cameras C to capture the second alignment mark M2. For example, as shown in region E2 of FIG. 5 , some cameras C may capture only the first alignment mark M1 of the two types of alignment marks. The alignment sheet 8 may be transparent, in which case the second alignment mark M2 may be formed on the surface of the alignment sheet 8 facing the deposition source 2.

[0062] In this case, the vapor deposition apparatus 1 can determine whether the distance between the touch plate 4 and the alignment sheet 8 in the first direction D1 is appropriate by analyzing the clarity of the outline of the second alignment mark M2 in the image captured by the camera C. Therefore, when the position of the alignment sheet 8 is fixed with respect to the position of the vapor deposition mask 3, the vapor deposition apparatus 1 can determine whether the distance between the touch plate 4 and the vapor deposition mask 3 in the first direction D1 is appropriate by the above-described method.

[0063] By the above-described method, the deposition apparatus 1 uses the camera C to measure the relative position of the touch plate 4 in the first direction D1 with respect to at least one of the deposition mask 3 and the substrate X. In particular, in this embodiment, the camera C includes a first touch plate 41 and a second touch plate 42. A touch sensor is formed on each of the divided touch plates included in the touch plate 4.

[0064] Therefore, the camera C functions as part of a position measurement unit that measures the first relative position of each of the first touch plate 41 and the second touch plate 42 with respect to at least one of the deposition mask 3 and the substrate X in the first direction D1. In other words, the camera C formed on the first touch plate 41 functions as part of a first position measurement unit that measures the first relative position of the first touch plate 41. Furthermore, the camera C formed on the second touch plate 42 functions as part of a second position measurement unit that measures the first relative position of the second touch plate 42. In the present embodiment, when the first direction D1 is substantially the same as the downward vertical direction, the first relative position of each divided touch plate may be considered to correspond to the height of each divided touch plate with respect to at least one of the deposition mask 3 and the substrate X.

[0065] The image data captured by the camera C may be processed by the processor 7P, and the above-mentioned first relative position may be calculated by the processor 7P. Therefore, the processor 7P of the control unit 7 functions as a part of a position measurement unit that measures the first relative positions of the first touch plate 41 and the second touch plate 42.

[0066] The touch plate control unit 74 individually controls the positions of the first touch plate 41 and the second touch plate 42 in the first direction D1 based on the first relative positions of the first touch plate 41 and the second touch plate 42. This enables the deposition apparatus 1 to control the positions of the first touch plate 41 and the second touch plate 42 in order to form a deposition film on the substrate X with greater accuracy.

[0067] Note that a single split touch plate may be formed with multiple cameras C to capture images of multiple regions that are positioned differently from one another within the region that overlaps with a single split touch plate in a plan view. In this case, a touch plate arm may be formed directly above each of the cameras C. This eliminates the need to route wiring used to control the operation of the cameras C or to transmit image data captured by the cameras C from the touch plate arm to the cameras C within the split touch plate.

[0068] Furthermore, the magnification of the images captured by the multiple cameras C may differ. As a result, for example, even if the position of the camera C and the position of any alignment mark are far apart in a plan view, the magnification of the image captured by the camera C may be reduced to allow the camera C to capture a wider range and include the alignment mark in the image.

[0069] <Substrate Position Alignment Method> As described above, the camera C according to this embodiment captures images of both the first alignment mark M1 and the second alignment mark M2. Therefore, the image captured by the camera C includes data on the second relative position of the second alignment mark M2 with respect to the first alignment mark M1 in the second direction D2.

[0070] For example, the data regarding the second relative position may include the distance between the center of the first alignment mark M1 and the center of the second alignment mark M2. Furthermore, the data regarding the second relative position may include the difference between the position of the center of the first alignment mark M1 and the position of the center of the second alignment mark M2 in one of the second directions D2.

[0071] The processor 7P may calculate data related to the second relative position by processing data of the image captured by the camera C. Here, the first alignment mark M1 is formed on the substrate X, and the second alignment mark M2 is formed on the alignment sheet 8. As described above, the position of the alignment sheet 8 is fixed with respect to the position of the deposition mask 3. Therefore, the processor 7P can calculate a third relative position of the substrate X with respect to the deposition mask 3 in the second direction D2 by further processing the data related to the second relative position. In other words, the position measurement unit described above may measure the third relative position of the substrate X with respect to the deposition mask 3 in the second direction D2 based on the second relative position.

[0072] The stage control unit 76 determines the content of control of the position of the stage 6 based on the third relative position measured by the above-described method. Therefore, the stage control unit 76 controls the position of the substrate X in the second direction D2 by controlling the position of the stage 6 in the second direction D2 based on the third relative position. This enables the deposition apparatus 1 to control the position of the substrate X to more accurately form a deposited film on the substrate X.

[0073] <Vapor Deposition Method: Overview> Hereinafter, with reference to FIGS. 6 to 10 , a method for forming a vapor deposition film on a substrate X, which is a deposition target, using a vapor deposition apparatus 1 according to this embodiment will be described by explaining a portion of a manufacturing method for a display device DP according to this embodiment. FIG. 6 is a flowchart of a portion of a manufacturing method for a display device DP according to this embodiment. FIGS. 7 to 10 are each a process side cross-sectional view of the vapor deposition apparatus 1 in a portion of a manufacturing method for a display device DP according to this embodiment. In particular, this embodiment will describe, as an example, a method for forming a vapor deposition film on the surface of a substrate X using the vapor deposition apparatus 1 to form at least a portion of the light-emitting elements LE of the display device DP as part of a manufacturing method for a display device DP. Note that the control unit 7 of the vapor deposition apparatus 1 is omitted from illustration in each of FIGS. 7 to 10 .

[0074] <Vapor Deposition Method: Setting of Substrate> In the method for manufacturing the display device DP according to this embodiment, when forming a vapor-deposited film on the substrate X, first, as shown in Fig. 7 , the substrate X is placed on a hook 61, thereby setting the substrate X on the stage 6 (step S1). In particular, since the hook 61 of the stage 6 is located above the vapor deposition source 2, the substrate X is set above the vapor deposition source 2 in step S1. Note that the substrate X is set on the hook 61 with the surface on which the vapor-deposited film is to be formed facing the vapor deposition source 2. Also in step S1, as shown in Fig. 7 , the substrate X may bend due to its own weight so that the central side not supported by the hook 61 is positioned lower than the end portion supported by the hook 61.

[0075] <Vapor Deposition Method: Aligning the Position of the Substrate> Next, the position of the substrate X with respect to the vapor deposition mask 3 in the second direction D2 is aligned (step S2). In step S2, for example, as described above, the first alignment mark M1 and the second alignment mark M2 may be captured by an imaging device such as the camera C, and the second relative position may be calculated, thereby calculating the third relative position. Furthermore, in step S2, the position of the substrate X may be controlled by controlling the position of the stage 6 in the second direction D2 via the stage control unit 76 based on the calculated third relative position.

[0076] In step S2, the substrate X is positioned above the mask sheet 31. Therefore, the alignment of the position of the substrate X with respect to the mask sheet 31 in step S2 may be approximate.

[0077] Next, the stage 6 is lowered (step S3) to bring the substrate X close to the mask sheet 31. The lowering of the stage 6 may be performed by controlling the position of the stage arm 62 in the first direction D1 by the stage control unit 76. In step S3, the substrate X on the hook 61 of the stage 6 may approach close to the mask sheet 31, as shown in FIG.

[0078] Next, the position of the substrate X in the second direction D2 is aligned again (step S4). Step S4 may be performed by the same method as step S2. In step S4, the position of the substrate X may be aligned more precisely with respect to the mask sheet 31 compared to step S2. This completes the alignment of the substrate X with respect to the deposition mask 3, more specifically, the alignment of the deposition surface of the surface of the substrate X, on which a deposition film is formed, with respect to the deposition mask 3.

[0079] <Vapor Deposition Method: Pressing with Touch Plates> Next, the touch plate 4 is lowered (step S5). As a result, as shown in Fig. 9, the multiple divided touch plates of the touch plate 4, including the first touch plate 41 and the second touch plate 42, press the substrate X against the mask sheet 31 from above. The lowering of the touch plate 4 may be performed by individually controlling the position of each touch plate arm in the first direction D1 using the touch plate control unit 74. Alternatively, the lowering of the touch plate 4 may be performed by uniformly lowering the multiple divided touch plates included in the touch plate 4 by a predetermined distance.

[0080] <Vapor Deposition Method: Alignment of Touch Plate Positions> Next, the positions of the first touch plate 41 and the second touch plate 42 in the first direction D1 are individually aligned (step S6). In particular, in step S6, the relative positions of the first touch plate 41 and the second touch plate 42 in the first direction D1 with respect to at least one of the vapor deposition mask 3 and the substrate X are aligned.

[0081] In step S6, for example, as described above, the first alignment mark M1 may be captured by an imaging device such as the camera C, and the first relative position of each divided touch plate may be calculated. Also, in step S6, the positions of the first touch plate arm 41A and the second touch plate arm 42A in the first direction D1 may be controlled via the touch plate control unit 74 based on the calculated first relative positions. In this way, the vapor deposition apparatus 1 may align the positions of the divided touch plates of the touch plate 4, including the first touch plate 41 and the second touch plate 42.

[0082] In this embodiment, although the mask sheet 31 is fixed to the mask frame 32 by welding or the like, slight bending may occur. In this case, the distance between the substrate X and the mask sheet 31 may vary depending on the position in the first direction D1.

[0083] The vapor deposition device 1 according to this embodiment can individually align the positions of the first touch plate 41 and the second touch plate 42. Therefore, even if the distance between the substrate X and the mask sheet 31 varies depending on the position in the first direction D1, the vapor deposition device 1 can press the substrate X against the mask sheet 31 with higher precision using the touch plate 4.

[0084] Step S6 may be completed when it is confirmed that the positions in the first direction D1 of all divided touch plates included in the touch plate 4 are within a predetermined range from the appropriate position. Alternatively, step S6 may be completed when it is confirmed that the average value of the differences between the actual positions in the first direction D1 of each divided touch plate included in the touch plate 4 and the appropriate position is within a predetermined range.

[0085] <Vapor Deposition Method: Attraction by Magnet> Next, the magnet 51 is lowered (step S7). The lowering of the magnet 51 may be performed by controlling the position of the magnet arm 52 in the first direction D1 using the magnet control unit 75. In step S7, the magnet 51 may be positioned above the upper surfaces of the divided touch plates of the touch plate 4 to reduce tilting of the magnet 51 due to contact between the magnet 51 and the touch plate 4. For example, to further reduce contact between the magnet 51 and each divided touch plate, the magnet 51 may be positioned approximately 10 mm above each divided touch plate.

[0086] At the completion of step S7, the magnet 51 may attract the mask sheet 31 by magnetic force, thereby improving the adhesion between the substrate X and the mask sheet 31 and between the substrate X and the touch plate 4. If the magnet 51 has a mechanism for generating a magnetic field, such as an electromagnet, the magnet 51 may generate a magnetic field at the completion of step S7.

[0087] <Deposition Method: Realignment of Touch Plate Positions> Next, the positions of the first touch plate 41 and the second touch plate 42 in the first direction D1 are realigned (step S8). Step S8 may be performed in the same manner as step S6.

[0088] In step S7, the position of the substrate X in the first direction D1 at each position in a plan view may fluctuate due to the magnet 51 attracting the mask sheet 31 toward the substrate X. In particular, in step S7, the mask sheet 31 may be warped upward due to the magnet 51 attracting the mask sheet 31, and a portion of the substrate X that was aligned with the mask sheet 31 may move upward accordingly. In this case, in step S7, the movement of the substrate X may cause a portion of the deposition surface of the substrate X to separate from the mask sheet 31, particularly the mask sheet 31 on the edge surface side of the substrate X. For this reason, even if the positions of the divided touch plates are appropriate before step S7 is performed, the position of one of the divided touch plates may become inappropriate after step S7 is performed.

[0089] In this embodiment, the alignment of the positions of the first touch plate 41 and the second touch plate 42 in the first direction D1 is performed before and after the magnet 51 attracts the mask sheet 31. This allows the deposition apparatus 1 to accurately control the position of each divided touch plate in the first direction D1 even when the substrate X is deformed as described above in step S7. For example, the touch plate 4 may perform alignment of each divided touch plate in step S8 to reduce deformation of the substrate X in step S7 and improve adhesion between the deposition surface of the substrate X and the mask sheet 31.

[0090] <Vapor deposition method: formation of vapor deposition film> Next, the vapor deposition material 21 is emitted from the vapor deposition source 2 toward the substrate X (step S2). Step S2 may be performed by controlling the heater 23 of the vapor deposition source 2 to heat the vapor deposition material 21 in the housing 22 using the vapor deposition source control unit 72. Of the vapor deposition material 21 emitted from the vapor deposition source 2, only the vapor deposition material 21 that passes through the openings in the mask sheet 31 adheres to the lower surface of the substrate X and becomes solid. As a result, a vapor deposition film corresponding to the pattern of the openings in the mask sheet 31 is formed on the lower surface of the substrate X.

[0091] Next, the magnet 51, the touch plate 4, and the stage 6 are raised (step S10). Step S10 may be performed by controlling the positions of the magnet 51, the touch plate 4, and the stage 6 by the corresponding control units. In order to reduce interference between the magnet 51, the touch plate 4, and the stage 6, the magnet 51, the touch plate 4, and the stage 6 may be raised in this order in step S10.

[0092] <Vapor Deposition Method: Unloading of Substrate> Next, the substrate X is unloaded from the vapor deposition apparatus 1 (step S11). As a result, the substrate X having the vapor-deposited film formed on the lower surface thereof is obtained.

[0093] Thereafter, the substrate X may be placed in another vapor deposition apparatus 1 equipped with a vapor deposition source 2 containing another vapor deposition material 21 and a vapor deposition mask 3 containing another mask sheet 31, and a vapor deposition film may be formed on the substrate X by the method described above. Alternatively, after completion of step S10, a vapor deposition film may be formed again on the substrate X by changing the vapor deposition material 21 and the mask sheet 31 without proceeding to step S11. This allows a vapor deposition film containing another material to be continuously formed at another position on the lower surface of the substrate X. In this case, a new vapor deposition film may be formed on top of a vapor deposition film already formed on the substrate X. As described above, the light-emitting element LE formation process, which is part of the method for manufacturing the display device DP, may be performed by forming each layer of the light-emitting element LE on the substrate X.

[0094] <Improving Accuracy of Deposition of Vapor-Deposited Film by Vapor Deposition Apparatus> In the vapor deposition apparatus 1 according to this embodiment, the touch plate 4 includes a plurality of divided touch plates, including a first touch plate 41 and a second touch plate 42. Furthermore, the vapor deposition apparatus 1 can individually control the distance between each divided touch plate in the first direction D1.

[0095] Therefore, the deposition apparatus 1 can more precisely control the relative positions of each part of the touch plate 4 and each part of the substrate X or the mask sheet 31 during deposition of the deposited film compared to when a single touch plate 4 is used. Therefore, the deposition apparatus 1 according to this embodiment improves the deposition accuracy of the deposited film on the deposition target such as the substrate X.

[0096] In a vapor deposition apparatus equipped with a single touch plate, for example, it is conceivable to repeatedly raise and lower the touch plate until the relative positions of each portion of the touch plate and each portion of the substrate X or each portion of the vapor deposition mask are properly aligned. In contrast, the vapor deposition apparatus 1 according to this embodiment controls the divided touch plates individually in the first direction D1. Therefore, even if the relative position of one of the divided touch plates and the substrate X is incorrect after the touch plate 4 has been brought into contact with the substrate X, the vapor deposition apparatus 1 can align only the position of that divided touch plate. This eliminates the need to separate the entire touch plate 4 from the substrate X even if the relative position of a portion of the touch plate 4 and a portion of the substrate X or a portion of the vapor deposition mask 3 is incorrect. In other words, the vapor deposition apparatus 1 can align the positions of each divided touch plate without repeatedly raising and lowering the touch plate 4. Therefore, compared to a vapor deposition apparatus equipped with a single touch plate, the vapor deposition apparatus 1 according to this embodiment achieves a reduction in takt time or simplification of the vapor deposition film formation process.

[0097] In particular, the deposition apparatus 1 individually controls the positions of the first touch plate 41 and the second touch plate in the first direction D1 based on the first relative positions of the first touch plate 41 and the second touch plate. The deposition apparatus 1 also includes a camera C as a position measurement unit that measures the first relative positions of the first touch plate 41 and the second touch plate. The camera C is formed on each of the first touch plate 41 and the second touch plate. As described above, the deposition apparatus 1 according to this embodiment further improves the accuracy of deposition of the deposited film on the substrate X.

[0098] Furthermore, the camera C captures an image of the second alignment mark M2 together with the first alignment mark M1, allowing the deposition apparatus 1 to measure a second relative position of the second alignment mark M2 with respect to the first alignment mark M1. Furthermore, the deposition apparatus 1 measures a third relative position of the substrate X with respect to the deposition mask 3 in the second direction D2 based on the second relative position. Additionally, the deposition apparatus 1 can control the position of the substrate X in the second direction D2 by controlling the stage 6 based on the third relative position. As described above, the deposition apparatus 1 according to this embodiment improves the positional accuracy of the deposition film formed on the substrate X.

[0099] The deposition apparatus 1 includes a magnet 51, and forms a deposition film on the substrate X while attracting the deposition mask 3 via the touch plate 4 using the magnet 51. Therefore, the magnet 51 improves the adhesion between the deposition mask 3 and the substrate X, while the touch plate 4 including the divided touch plate improves the accuracy of forming the deposition film on the substrate X. In particular, as described above, the deposition apparatus 1 can control the first touch plate 41 and the second touch plate 42 before and after attracting the deposition mask 3 using the magnet 51, thereby further improving the accuracy of forming the deposition film on the substrate X.

[0100] In general, many display devices DP have a rectangular shape in a plan view, and in this embodiment, the substrate X, which is the deposition target, also has a rectangular shape when viewed in the first direction D1 when placed on the stage 6. Accordingly, the mask frames 32 that form each edge of the deposition mask 3 when viewed in the first direction D1 also have a rectangular shape when viewed in the first direction D1. This allows the deposition apparatus 1 to further improve the accuracy of deposition of the deposition film on the substrate X.

[0101] In particular, when the mask frame 32 has a rectangular shape in the first direction D1, stress is likely to concentrate in some parts of the mask sheet 31 fixed to the mask frame 32 by welding or the like. As a result, the mask sheet 31 may be prone to deformation, such as bending, depending on its position in the first direction D1. Therefore, the deposition device 1, which can individually control the positions of the divided touch plates in the first direction D1 depending on their positions in the first direction D1, improves the accuracy of deposition of the deposited film on the substrate X even when deformation, such as bending, occurs in the mask sheet 31.

[0102] <Positional Relationship Between Touch Plate and Vapor Deposition Target> Next, the positional relationship between the touch plate 4 and the substrate X that is the vapor deposition target, particularly the positional relationship between the touch plate 4 and the substrate X as viewed in the first direction D1, will be described again with reference to FIG.

[0103] As shown in Figure 4, the substrate X, which has a rectangular shape when viewed in the first direction D1, has, as part of its end sides, a first side XS1, a second side XS2 opposite to the first side XS1, and a third side XS3 connecting the first side XS1 and the second side XS2.

[0104] 4, the first touch plate 41 and the second touch plate 42 extend along the third side X3 in the first direction D1 and overlap with the first side XS1 and the second side XS2. Therefore, the first touch plate 41 and the second touch plate 42 overlap with the substrate X from the first side XS1 to the second side XS2 in the first direction D1.

[0105] With the above configuration, the first touch plate 41 and the second touch plate 42 can press a larger portion of the substrate X against the deposition mask 3 compared to when the first touch plate 41 and the second touch plate 42 overlap only one of the first side XS1 and the second side XS2 in the first direction D1. Therefore, the deposition apparatus 1 can press a larger portion of the substrate X in the first direction D1 with the touch plate 4 while reducing an increase in the number of divided touch plates. Therefore, the deposition apparatus 1 according to this embodiment improves the accuracy of deposition of a deposition film on the substrate X while simplifying the configuration of the touch plate 4.

[0106] The touch plate 4 may include additional split touch plates in addition to the first touch plate 41 and the second touch plate 42. These additional split touch plates may also extend along the third side X3 in the first direction D1 and overlap with the first side XS1 and the second side XS2. Alternatively, the touch plate 4 may include only the first touch plate 41 and the second touch plate 42 as split touch plates.

[0107] The vapor deposition device 1 reduces the number of divided touch plates included in the touch plate 4, thereby simplifying the configuration of the touch plate 4 and the control of the touch plate 4. On the other hand, the vapor deposition device 1 increases the number of divided touch plates included in the touch plate 4 and whose positions in the first direction D1 can be individually controlled, thereby further improving the accuracy of deposition of the vapor-deposited film on the substrate X.

[0108] [Embodiment 2] <Division of Touch Plate Overlapping with End Side> The vapor deposition device 1 according to this embodiment differs from the vapor deposition device 1 according to the previous embodiment only in the positions of the divided touch plates included in the touch plate 4 as viewed in the first direction D1. The positional relationship between the touch plate 4 and the substrate X placed on the stage 6 as viewed in the first direction D1 in this embodiment will be described with reference to Fig. 11. Fig. 11 is a schematic plan view of a portion of the vapor deposition device 1 according to this embodiment and the substrate X placed on the stage 6.

[0109] 11 , in this embodiment, the first touch plate 41 may be one of the divided touch plates of the touch plate 4 that overlaps only one edge of the substrate X, for example, only the third edge XS3, as viewed in the first direction D1. Alternatively, in this embodiment, the first touch plate 41 may be one of the divided touch plates of the touch plate 4 that overlaps only the first vertex XV1, as viewed in the first direction D1, of the vertices on the outer edge of the substrate X. Note that in the figures from FIG. 11 onwards, multiple divided touch plates of the touch plate 4 may be designated by the component number 41, but in reality, any one of these may be the first touch plate 41.

[0110] Near the outer edge of the substrate X, particularly near the vertex of the substrate X, the position of the deposition mask 3 relative to the substrate X in the first direction D1 may vary significantly depending on the position in the first direction D1. This is because, for example, deformation such as bending of the deposition mask 3 due to concentration of stress between the mask sheet 31 and the mask frame 32 is likely to occur on the periphery of the deposition mask 3 in the first direction D1.

[0111] Therefore, when the first touch plate 41 overlaps only one edge of the substrate X in the first direction D1, the deposition apparatus 1 efficiently improves the deposition accuracy of the deposited film near the outer edge of the substrate X that overlaps with the first touch plate 41 in the first direction D1. Also, when the first touch plate 41 overlaps only the first vertex XV1 of the vertices of the substrate X in the first direction D1, the deposition apparatus 1 efficiently improves the deposition accuracy of the deposited film near the first vertex XV1 of the substrate X.

[0112] Note that deformation such as bending of the deposition mask 3 due to the above-mentioned reasons tends to be smaller toward the center of the deposition mask 3 as viewed in the first direction D1. For this reason, the second touch plate 42 located closer to the center of the substrate X than the first touch plate 41 as viewed in the direction along the first side XS1 may be single. This allows the deposition device 1 to efficiently improve the deposition accuracy of the deposition film near the outer edge of the substrate X while simplifying the configuration of the touch plate 4.

[0113] [Embodiment 3] <Touch Plate That Does Not Overlap Edges> The vapor deposition device 1 according to this embodiment differs from the vapor deposition devices 1 according to the above-described embodiments only in the positions, as viewed in the first direction D1, of the divided touch plates included in the touch plate 4. In this embodiment, the positional relationship, as viewed in the first direction D1, between the touch plate 4 and the substrate X placed on the stage 6 will be described with reference to Fig. 12. Fig. 12 is a schematic plan view of a portion of the vapor deposition device 1 according to this embodiment and the substrate X placed on the stage 6.

[0114] 12 , in this embodiment, the second touch plate 42 may be one of the divided touch plates of the touch plate 4 that overlaps only one of the edge edges of the substrate X in the first direction D1, for example, only the first edge XS1 or the second edge XS2. Alternatively, in this embodiment, the second touch plate 42 may be one of the divided touch plates of the touch plate 4 that overlaps a portion closer to the center than the outer edge of the substrate X in the first direction D1. Note that, although FIG. 12 shows multiple divided touch plates 4 of the touch plate 4 as being designated by the component number 42, in reality, the second touch plate 42 may be any one of them.

[0115] The vapor deposition apparatus 1 according to this embodiment can further subdivide the area of ​​the substrate X that is pressed by the divided touch plates of the touch plate 4. This allows the vapor deposition apparatus 1 to more accurately control the position of each part of the touch plate 4 in the first direction D1 based on the position of the substrate X in the first direction D1. This further improves the deposition accuracy of the vapor deposition film on each part of the substrate X.

[0116] [Embodiment 4] <Touch Plate Overlapping Only with Vertices> The vapor deposition device 1 according to this embodiment differs from the vapor deposition devices 1 according to the above-described embodiments only in the positions of the divided touch plates included in the touch plate 4 as viewed in the first direction D1. The positional relationship between the touch plate 4 and the substrate X placed on the stage 6 as viewed in the first direction D1 in this embodiment will be described with reference to Fig. 13. Fig. 13 is a schematic plan view of a portion of the vapor deposition device 1 according to this embodiment and the substrate X placed on the stage 6.

[0117] The first touch plate 41 of the present embodiment is one of the divided touch plates of the touch plate 4 that overlaps only one of the vertices of the substrate X in the first direction D1. Furthermore, the second touch plate 42 overlaps the periphery of the vertex of the substrate X in the first direction D1. In particular, the second touch plate 42 may overlap any of the edge edges of the substrate X in the first direction D1.

[0118] As described above, in the vicinity of the vertices of the substrate X, the position of the deposition mask 3 relative to the substrate X in the first direction D1 may vary significantly depending on the position in the first direction D1. Therefore, the deposition device 1 equipped with the touch plate 4 including the first touch plate 41 that overlaps one of the vertices of the substrate X in the first direction D1 efficiently improves the deposition accuracy of the deposition film in the vicinity of the vertex of the substrate X.

[0119] Furthermore, the touch plate 4 according to this embodiment includes a second touch plate 42 that overlaps the periphery of the vertex of the substrate X in the first direction D1. Therefore, the vapor deposition apparatus 1 efficiently improves the deposition accuracy of the deposited film near the vertex of the substrate X while simplifying the configuration of the touch plate 4. In particular, because the second touch plate 42 overlaps each edge of the substrate X in the first direction D1, the vapor deposition apparatus 1 more efficiently improves the deposition accuracy of the deposited film.

[0120] [Embodiment 5] <Touch Plate Surrounding Some of the Touch Plates> The vapor deposition device 1 according to this embodiment differs from the vapor deposition devices 1 according to the above-described embodiments only in the positions of the divided touch plates included in the touch plate 4 as viewed in the first direction D1. The positional relationship between the touch plate 4 and the substrate X placed on the stage 6 as viewed in the first direction D1 in this embodiment will be described with reference to Fig. 14. Fig. 14 is a schematic plan view of a portion of the vapor deposition device 1 according to this embodiment and the substrate X placed on the stage 6.

[0121] The touch plate 4 according to this embodiment includes a first touch plate 41 positioned to surround the periphery of the second touch plate 42 when viewed in the first direction D1. For example, the first touch plate 41 overlaps the entire edge of the substrate X when viewed in the first direction D1. The first touch plate 41 also overlaps the edge of the substrate X closer to the center when viewed in the first direction D1.

[0122] For the same reasons as those described above, the vapor deposition apparatus 1 according to this embodiment efficiently improves the deposition accuracy of the deposited film near the edge of the substrate X. Furthermore, the touch plate 4 of the vapor deposition apparatus 1 achieves the above configuration by simply including, as divided touch plates, the second touch plate 42 and the first touch plate 41 located at a position surrounding the periphery of the second touch plate 42 as viewed in the first direction D1. Therefore, the vapor deposition apparatus 1 according to this embodiment efficiently improves the deposition accuracy of the deposited film near the edge of the substrate X, while reducing the number of divided touch plates and simplifying the configuration of the touch plate 4.

[0123] Although various shapes and positions in the first direction D1 of the first touch plate 41 and the second touch plate 42 have been exemplified in the present disclosure, the present disclosure is not limited to these. In particular, the configuration of the touch plate 4 is not particularly limited as long as it includes the first touch plate 41 and the second touch plate 42 whose positions in the first direction D1 are individually controlled.

[0124] For example, the shapes and positions in the first direction D1 of the first touch plate 41 and the second touch plate 42 may be interchanged. Also, the first touch plate 41 and the second touch plate 42 may be formed integrally with another divided touch plate. Alternatively, the first touch plate 41 and the second touch plate 42 may be further divided.

[0125] The present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present disclosure. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

[0126] REFERENCE SIGNS LIST 1 Vapor deposition device 2 Vapor deposition source 3 Vapor deposition mask 4 Touch plate 6 Stage 8 Alignment sheet 31 Mask sheet 32 ​​Mask frame 41 First touch plate 42 Second touch plate 51 Magnet 74 Touch plate control unit 76 Stage control unit D1 First direction D2 Second direction M1 First alignment mark M2 Second alignment mark X1 First region X2 Second region XV1 First vertex DP Display device LE Light-emitting element

Claims

1. A deposition device comprising: a deposition source; a deposition mask; a touch plate that presses a deposition target against the deposition mask from the side opposite the deposition source; and a touch plate control unit that controls a position of the touch plate in a first direction from the deposition target to the deposition mask, wherein the touch plate includes a first touch plate that overlaps a first region of the deposition target in the first direction, and a second touch plate that overlaps a second region of the deposition target in the first direction that is different from the first region, and the touch plate control unit individually controls the positions of the first touch plate and the second touch plate in the first direction.

2. The deposition device of claim 1, further comprising a position measurement unit that measures a first relative position of each of the first touch plate and the second touch plate with respect to at least one of the deposition mask and the deposition target in the first direction, and the touch plate control unit individually controls the positions of the first touch plate and the second touch plate in the first direction based on the first relative positions of each of the first touch plate and the second touch plate measured by the position measurement unit.

3. The deposition apparatus of claim 2, wherein the position measurement unit includes: a first position measurement unit formed on the first touch plate and configured to measure the first relative position of the first touch plate; and a second position measurement unit formed on the second touch plate and configured to measure the first relative position of the second touch plate.

4. The deposition apparatus according to claim 3, wherein at least one of the first position measurement unit and the second position measurement unit has a camera that captures an image of a first alignment mark formed on the deposition target.

5. The deposition apparatus of claim 4, further comprising an alignment sheet positioned between the deposition mask and the deposition target and overlapping an edge of the deposition target in the first direction, the camera capturing an image of both the first alignment mark and a second alignment mark formed on the alignment sheet, and the position measurement unit measuring a third relative position of the deposition target relative to the deposition mask in the second direction based on a second relative position of the second alignment mark relative to the first alignment mark captured by the camera in a second direction intersecting the first direction.

6. The deposition apparatus according to claim 5, comprising: a stage on which the deposition target is placed; and a stage control unit that controls a position of the stage, wherein the stage control unit determines the content of control of the position of the stage based on the third relative position measured by the position measurement unit.

7. The deposition apparatus according to claim 1, further comprising a magnet located on the opposite side of the touch plate from the deposition source and configured to attract the deposition mask via the touch plate.

8. A deposition apparatus according to any one of claims 1 to 7, wherein the deposition mask is rectangular when viewed in the first direction and has a mask frame that forms each end side when viewed in the first direction.

9. The deposition apparatus according to claim 1, wherein the deposition target has a rectangular shape when viewed in the first direction.

10. The deposition apparatus of claim 9, wherein at least one of the first touch plate and the second touch plate extends along one of the end edges of the deposition target when viewed in the first direction and overlaps with a first edge of the deposition target and a second edge opposite the first edge.

11. The deposition apparatus of claim 9 or 10, wherein at least one of the first touch plate and the second touch plate overlaps only one of the edges of the deposition target when viewed in the first direction.

12. A deposition device as described in any one of claims 9 to 11, wherein at least one of the first touch plate and the second touch plate overlaps only a first vertex among the vertices of the outer edge of the deposition target when viewed in the first direction.

13. The deposition apparatus of claim 12, wherein the first touch plate overlaps only a first vertex among the vertices of the outer edge of the deposition target when viewed in the first direction, and the second touch plate overlaps the periphery of the first vertex of the deposition target when viewed in the first direction.

14. A deposition apparatus as described in any one of claims 1 to 9, wherein the first touch plate surrounds the second touch plate when viewed in the first direction.

15. A method for manufacturing a display device including a substrate and a plurality of light-emitting elements located on the substrate and including a plurality of laminated thin films, comprising: deposition of at least one layer of the thin film of at least one of the light-emitting elements, the deposition including: placing the substrate above a deposition source; aligning the substrate with respect to a deposition mask; pressing the substrate against the deposition mask from a side opposite the deposition source using a first touch plate overlapping a first region of the substrate in a first direction from the substrate to the deposition mask and a second touch plate overlapping a second region of the substrate different from the first region in the first direction; aligning the positions of the first touch plate and the second touch plate in the first direction; and releasing a deposition material from the deposition source.

16. The method for manufacturing a display device according to claim 15, wherein the deposition includes attracting the deposition mask via the touch plate by a magnet located on the opposite side of the touch plate from the deposition source, and the alignment is performed both before and after the attraction by the magnet.

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