Light-emitting element package and display device using same

Abstract

The present invention is applicable to the technical field related to display devices, and for example, relates to a light-emitting element package and a display device using a light-emitting diode (LED). The present invention comprises: a first layer having a light-emitting portion including light-emitting elements forming unit subpixels; a second layer positioned on a first surface of the first layer and including a terminal portion and a plurality of connection electrodes connecting a gap between the terminal portion and the light-emitting elements; a third layer positioned on the second surface of the first layer and through which light emitted from the light-emitting portion passes, wherein the connection electrodes may have a pillar structure having a height corresponding to the gap and an inclination angle with respect to the first surface.

Description

Light-emitting element package and display device using the same

[0001] The present invention is applicable to the technical field related to display devices, and relates to a light-emitting element package and a display device using an LED (Light Emitting Diode), for example.

[0002] In recent years, display devices with superior characteristics, such as thinness and flexibility, have been developed in the field of display technology. Currently, the major commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode).

[0003] Meanwhile, a light-emitting diode (LED) is a semiconductor light-emitting device that is well known for converting electric current into light. Starting with the commercialization of a red LED using GaAsP compound semiconductors in 1962, it has been used as a light source for display images in electronic devices, including information and communication devices, along with green LEDs of the GaP:N series.

[0004] Recently, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micrometer-sized LEDs, which are used as pixels in display devices.

[0005] Compared to other display devices / panels, this type of LED technology boasts low power consumption, high brightness, and high reliability, and can be applied to flexible devices. Therefore, research institutes and companies have been actively researching this technology recently.

[0006] The LED display market is expanding with applications that leverage the high brightness and high reliability of LEDs. Signage displays are leading the market with these characteristics.

[0007] In such displays, LEDs can be manufactured in a package form that can be used as unit pixels. When mini LEDs measuring millimeters are used, these LED packages typically include a support layer, typically comprising a sapphire substrate. This support layer can typically be much thicker than the light-emitting layer containing the LED. A thick support layer can increase the amount of light emitted laterally from the LED package. This light emitted laterally can be considered a loss from the display device's perspective.

[0008] For displays like passive matrix (PM) signage, high-brightness mini LEDs are being mounted and applied using driving methods such as pulse width modulation (PWM). Recently, micro LEDs are being applied to light-emitting element packages (RGB package chips) that can be used as individual pixels, aiming for increased efficiency and cost reduction.

[0009] By using these light-emitting device packages, the cost of chip-on-wafer (CW) provided in a state formed on a wafer, the cost of wiring board mounting, and the cost through simplification of the panel process after LED mounting can be reduced.

[0010] However, when applying micro LEDs to replace mini LEDs in the light-emitting part, it may be difficult to apply micro LEDs smaller than a certain size due to the phenomenon of efficiency deterioration (droop) depending on the current density injected into the LED.

[0011] Moreover, as micro LEDs become smaller in size, preliminary inspection of the chips becomes difficult, and it may be difficult to apply the pick-up and place process that mounts individual chips on a substrate, which is currently being used in mass production technology.

[0012] In addition, solutions are required to address problems that may arise as the chip size decreases.

[0013] The technical problem to be solved by the present invention is to provide a light-emitting device package capable of stably connecting the configuration between each layer forming the light-emitting device package, and a display device using the same.

[0014] In addition, the present invention aims to provide a light-emitting device package and a display device using the same, which can expand the contact area by utilizing the structure of such a connecting electrode and thereby secure a stable electrical connection.

[0015] By utilizing the structure of such a connecting electrode, the thickness of a light-emitting device package having excellent characteristics can be improved, and thus durability can be improved, and a light-emitting device package and a display device using the same are provided.

[0016] Accordingly, the present invention aims to provide a light-emitting device package and a display device using the same, which can improve the reliability of the light-emitting device package with respect to an external environment.

[0017] Furthermore, those skilled in the art will understand from the full intent of the specification and drawings that, according to other embodiments of the present invention, there may be additional technical problems not mentioned herein.

[0018] As a first viewpoint for achieving the above object, the present invention comprises a first layer having a light-emitting portion including light-emitting elements forming a unit subpixel; a second layer positioned on a first surface of the first layer and including a terminal portion and a plurality of connecting electrodes connecting a gap between the terminal portion and the light-emitting elements; and a third layer positioned on the second surface of the first layer and through which light emitted from the light-emitting portion passes, wherein the connecting electrode may have a columnar structure having a height corresponding to the gap and an inclination angle with respect to the first surface.

[0019] As an exemplary embodiment, the connecting electrode may be positioned on the outer surface of a pillar shape provided within the second layer.

[0020] As an exemplary embodiment, the connecting electrode may have an angle of inclination with respect to the pillar shape.

[0021] As an exemplary embodiment, an inclined portion having the above-described inclination angle may be positioned on the outside of the pillar shape.

[0022] As an exemplary embodiment, the connecting electrode may include a first connecting portion connected to the terminal portion; and a second connecting portion connected to the light-emitting element.

[0023] As an exemplary embodiment, a third connector may further be included connected between the first connector and the second connector.

[0024] As an exemplary embodiment, the third connecting portion may have the angle of inclination.

[0025] As an exemplary embodiment, the terminal portion may have a pillar structure corresponding to the connecting electrode.

[0026] As an exemplary embodiment, the light emitting element may further include a driving element positioned on one side of the light emitting element.

[0027] As an exemplary embodiment, a fourth layer containing particulates may be further included between the third layer and the first layer.

[0028] As an exemplary embodiment, the second layer may function as a reflective layer.

[0029] As a second viewpoint for achieving the above object, the present invention comprises: a light-emitting layer having a light-emitting portion including light-emitting elements forming a unit subpixel; a connecting layer positioned on a first surface of the light-emitting layer and including a terminal portion and a plurality of connecting electrodes connected between the terminal portion and the light-emitting elements; and a supporting layer positioned on a second surface of the light-emitting layer and through which light emitted from the light-emitting portion passes, wherein the connecting electrode may have a metal pattern shape positioned on a pillar shape including an inclined portion provided in the connecting layer.

[0030] As an exemplary embodiment, the metal pattern may be positioned on the outer surface of a pillar shape provided within the connecting layer.

[0031] As an exemplary embodiment, a scattering layer containing fine particles may be further included between the light-emitting layer and the support layer.

[0032] As a third aspect for achieving the above object, the present invention provides a display device including a light-emitting element package defining individual pixels, wherein the light-emitting element package includes: a light-emitting layer having a light-emitting portion including light-emitting elements forming unit sub-pixels; a connecting layer located on a first surface of the light-emitting layer and including a terminal portion and a plurality of connecting electrodes connected between the terminal portion and the light-emitting elements; and a supporting layer located on a second surface of the light-emitting layer and through which light emitted from the light-emitting portion passes, wherein the connecting electrode may have a metal pattern shape located on a pillar shape including an inclined portion provided in the connecting layer.

[0033] According to one embodiment of the present invention, the following effects are achieved.

[0034] First, according to an embodiment of the present invention, it is possible to stably connect the configuration between each layer forming the light-emitting element package by using a connecting electrode having a structure having a gentler slope than a via hole structure.

[0035] In addition, by utilizing the structure of these connecting electrodes, the contact area can be expanded, thereby ensuring a stable electrical connection.

[0036] By using the structure of such a connecting electrode, the thickness of a light-emitting device package with excellent characteristics can be improved, and thus durability can be improved.

[0037] Accordingly, the reliability of the light-emitting element package with respect to the external environment can be improved.

[0038] Furthermore, according to another embodiment of the present invention, there are additional technical effects not mentioned herein. Those skilled in the art will understand the full scope of the specification and drawings.

[0039] Fig. 1 is a cross-sectional view showing a light emitting device package according to a first embodiment of the present invention.

[0040] Fig. 2 is a plan view showing a light emitting device package according to the first embodiment of the present invention.

[0041] Figure 3 is an enlarged view showing the pillar shape and slope of the light emitting element package according to the first embodiment of the present invention.

[0042] Fig. 4 is a cross-sectional schematic diagram showing an example of a connecting electrode according to an uphill structure shape of a light emitting element package according to a first embodiment of the present invention.

[0043] Fig. 5 is a cross-sectional view showing a light emitting device package according to a second embodiment of the present invention.

[0044] Fig. 6 is a cross-sectional view showing a light emitting device package according to a third embodiment of the present invention.

[0045] Fig. 7 is a cross-sectional view showing a light emitting element package according to the fourth embodiment of the present invention.

[0046] Fig. 8 is a cross-sectional view showing a light emitting device package according to the fifth embodiment of the present invention.

[0047] FIGS. 9 to 11 are cross-sectional views showing a light-emitting device package according to the sixth embodiment of the present invention and a modified example thereof.

[0048] Fig. 12 is a schematic diagram showing an example in which a connecting electrode according to embodiments of the present invention is used as an alignment key.

[0049] Fig. 13 is a schematic diagram showing an example in which a terminal portion according to embodiments of the present invention is used as an alignment key.

[0050] Fig. 14 is a cross-sectional schematic diagram showing a display device using a light-emitting element package according to the first embodiment of the present invention.

[0051] Figures 15 to 24 are cross-sectional views showing the process of manufacturing a light emitting element package according to the first embodiment.

[0052] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, it should be noted that the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification by the attached drawings.

[0053] Furthermore, although each drawing is described for convenience of explanation, it is also within the scope of the present invention for a person skilled in the art to implement another embodiment by combining at least two drawings.

[0054] Additionally, when an element such as a layer, region or substrate is referred to as existing "on" another element, it will be understood that this may be directly on the other element, or that there may be intermediate elements in between.

[0055] The semiconductor light-emitting device mentioned in the specification includes LEDs, micro LEDs, etc., and may be used interchangeably.

[0056]

[0057] Fig. 1 is a cross-sectional view showing a light-emitting device package according to a first embodiment of the present invention. Fig. 2 is a plan view showing a light-emitting device package according to a first embodiment of the present invention.

[0058] Here, Fig. 1 schematically illustrates a light-emitting device package according to the first embodiment. Therefore, the structures of Figs. 1 and 2 may not be exactly identical. For example, the configuration of the light-emitting unit (250) in Fig. 1 may be schematically illustrated for convenience of explanation.

[0059] Referring to FIGS. 1 and 2, a light-emitting device package (200) according to the first embodiment of the present invention may include a light-emitting layer (210, or first layer) in which a light-emitting portion (250) including light-emitting devices (251, 252, 253) is positioned.

[0060] The light-emitting unit (250) may include a first light-emitting element (251), a second light-emitting element (252), and a third light-emitting element (253). For example, the first light-emitting element may be a red light-emitting element (R), the second light-emitting element may be a green light-emitting element (G), and the third light-emitting element may be a blue light-emitting element (B). In some cases, at least one of the first light-emitting element (R), the second light-emitting element (G), and the third light-emitting element (B) may include two or more light-emitting elements.

[0061] When the light-emitting element package (200) is used in a display device, each of the first light-emitting element (251), the second light-emitting element (252), and the third light-emitting element (253) may correspond to an individual subpixel. The first light-emitting element (251), the second light-emitting element (252), and the third light-emitting element (253) may constitute a unit pixel in the display device.

[0062] The light-emitting elements (251, 252, 253) forming the light-emitting unit (250) may be mini LEDs having a size in millimeters or micro LEDs having a size in micrometers.

[0063] A connection layer (220, or second layer) including a terminal portion (280) and a plurality of connection electrodes (270) connected between the terminal portion (280) and the light emitting elements (251, 252, 253) may be positioned on the first surface (211) of the light emitting layer (210).

[0064] A support layer (230, or third layer) through which light emitted from the light emitting portion (250) passes may be positioned on the second surface (212) of the light emitting layer (210). That is, light generated from the light emitting portion (250) may be emitted by passing through the support layer (230). In this way, the light emitting device package illustrated in FIG. 1 may be a bottom emission type light emitting device package in which light is emitted downward of the structure illustrated in FIG. 1.

[0065] At this time, the connecting electrode (270) may have a metal pattern shape (271, 272, 273) positioned on an insulating pillar shape (221) including an inclined portion (222) provided in the connecting layer (220).

[0066] For example, the inclined portion (222) may have an angle of inclination with respect to the main plane of the connecting layer (220). In FIG. 1, an example is shown in which the inclined portion (222) has an angle of inclination (θ) with respect to an imaginary line perpendicular to the main plane of the connecting layer (220).

[0067] In this way, as an exemplary embodiment, the connecting electrode (270) may be positioned on the outer surface of the column shape (221) provided in the connecting layer (or second layer; 220). Accordingly, the connecting electrode (270) may have an inclination angle with respect to the column shape (221).

[0068] Referring to Fig. 1, as an exemplary embodiment, an inclined portion (222) having an inclined angle (θ) may be positioned on the outside of a column shape (221).

[0069] For example, an insulating support shape having an incline can be formed by a columnar shape (221) and an inclined portion (222), and a connecting electrode (270) having a metal pattern shape (271, 272, 273) can be provided along the outer surface of the support shape.

[0070] A connecting electrode (270) having a metal pattern shape (271, 272, 273) like this may have a structure in which the shape of a via electrode formed along a via hole is modified. Hereinafter, for convenience of explanation, a shape corresponding to a via hole like this may be referred to as an uphill structure. In addition, the structure of the connecting electrode (270) formed on this uphill structure may be referred to as an uphill electrode.

[0071] As an exemplary embodiment, the connecting electrode (270) may include a first connecting portion (271) connected to a terminal portion (280) and a second connecting portion (272) connected to a light-emitting element (251, 252, 253).

[0072] Referring to FIGS. 1 and 2, the first connection portion (271) of the connecting electrode (270) can be electrically connected to the terminal portion (280). The second connection portion (272) is schematically illustrated in FIG. 2. For example, the second connection portion (272) may be a common electrode commonly connected to the first light-emitting element (251), the second light-emitting element (252), and the third light-emitting element (253). The second connection portion (272) may be connected to any one of the four terminal portions (280). Meanwhile, for example, a lighting signal may be transmitted to the first light-emitting element (251), the second light-emitting element (252), and the third light-emitting element (253) through the first connection portion (271) which is connected to the remaining three of the four terminal portions (280), respectively. As another example, the light emitting element package (200) may be separately provided with a driving element (260; see FIG. 5) that drives the light emitting unit (250). Accordingly, the first light emitting element (251), the second light emitting element (252), and the third light emitting element (253) may be individually driven through the driving element (260).

[0073] For example, a third connection portion (273) connected between the first connection portion (271) and the second connection portion (272) may be provided. At this time, the third connection portion (273) may have an inclination angle that the inclined portion (222) has. This third connection portion (273) may substantially set the height of the connection electrode (270). For example, the third connection portion (273) may have a height corresponding to the height between the terminal portion (280) and the light-emitting portion (250). This height may correspond to the height of the pillar shape (221).

[0074] A connecting electrode (270) having such an uphill structure can have an increased effective area compared to a through-hole electrode or a columnar electrode formed in the same area. The effects of this connecting electrode (270) structure will be described in detail later.

[0075] As an exemplary embodiment, a fourth layer (240, or scattering layer) including particles (241) may be positioned between the support layer (or third layer; 230) and the light-emitting layer (or first layer; 210).

[0076] These fine particles (241) may have a size in the order of micrometers or nanometers. These fine particles may be light-scattering particles. These fine particles may have a refractive index of 1.3 or greater.

[0077] The particulates may include at least one of a metal oxide, a resin particle, and an inorganic oxide. For example, the particulates may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA.

[0078] For example, the fine particles can be used to improve the viewing angle to prevent color temperature deviation according to the light emission angle of the light emitting portion (250) in the third layer (230).

[0079] As an exemplary embodiment, the light-emitting layer (210) may function as a reflective layer. For example, the light-emitting layer (210) may also include fine particles to function as a reflective layer. In this case, the content of the fine particles included in the light-emitting layer (210) may be greater than the content of the fine particles included in the fourth layer (240, or scattering layer).

[0080] For example, the inclined portion (222) forming the uphill structure may have the same properties as the light-emitting layer (210). That is, the inclined portion (222) may function as a reflective layer, just like the light-emitting layer (210).

[0081] In the case of displays such as PM (passive matrix) signage, high-brightness mini LEDs are mounted and applied according to driving methods such as PWM (pulse width modulation). Recently, with the goal of increasing efficiency and reducing costs, light-emitting element packages (RGB package chips) that can be used as individual pixels by applying micro LEDs, as in the embodiment of the present invention, are being developed.

[0082] By using these light-emitting device packages, the cost of chip-on-wafer (CW) provided in a state formed on a wafer, the cost of wiring board mounting, and the cost through simplification of the panel process after LED mounting can be reduced.

[0083] However, when applying a micro LED instead of a mini LED to the light-emitting part (250), it may be difficult to apply a micro LED smaller than a certain size due to a phenomenon in which efficiency decreases (droop) depending on the current density injected into the LED.

[0084] Moreover, as micro LEDs become smaller in size, preliminary inspection of the chips becomes difficult, and it may be difficult to apply the pick-up and place process that mounts individual chips on a substrate, which is currently being used in mass production technology.

[0085] Accordingly, as in the embodiment of the present invention, a package structure capable of being inspected can be manufactured and applied through an additional wiring process after transferring a micro LED onto a process substrate such as a temporary substrate or a support substrate.

[0086] If the area of ​​the light-emitting device package is sufficiently large, it can have a structure that does not overlap with the micro LED and terminal pillar structures. Therefore, to accommodate as many light-emitting device packages as possible on the process substrate, the size of the light-emitting device package may need to be reduced. Furthermore, the size of the reduced light-emitting device package must be adjusted to match the electrode spacing of the wiring board.

[0087] In the case of driving signage using the AM (active matrix) method or AM / PM composite method that uses a micro IC as a driving element, the size can be smaller than that of the PM-driven micro LED because time-division lighting is not required.

[0088] However, as the transfer space of the micro IC needs to be secured and the circuit complexity increases due to the connection between the micro LED and the driving element, the size of the light-emitting element package may increase to secure the pillar structure connected to the terminal.

[0089] For micro ICs, reducing package size may also be required to reduce process costs and increase productivity.

[0090] For light-emitting element packages of 200 μm or smaller, there may be an area where the terminal portion, the micro LED, and in some cases, the driving element overlap, and an area where the connecting layer including the metal pattern connected to the micro LED faces each other.

[0091] The more gentle the side slope (θ) of the connecting electrode (270), the more reliable it is against external environments such as solder heat treatment / thermal shock / high temperature and high humidity during the subsequent mounting of the light-emitting element package on the wiring board. For example, if the terminal portion is manufactured through a thin film deposition process such as sputtering rather than a plating process, the effect can be enhanced.

[0092] To this end, according to an embodiment of the present invention, as shown in FIGS. 1 and 2, an uphill structure can be applied to the connecting layer (220) connecting the terminal portion (280) and the light-emitting portion (250).

[0093] In this way, the configuration between each layer forming the light-emitting element package (200) can be stably connected by using a connecting electrode (270) having a structure with a gentler slope than a via hole structure.

[0094] In addition, by utilizing the structure of these connecting electrodes (270), the contact area can be expanded, thereby ensuring a stable electrical connection.

[0095] By using the structure of the connecting electrode (270) as described above, the thickness of the light-emitting device package (200) having excellent characteristics can be improved, and thus durability can be improved.

[0096]

[0097] Fig. 3 is an enlarged view showing the pillar shape and slope of a light-emitting device package according to the first embodiment of the present invention. Fig. 4 is a cross-sectional schematic diagram showing an example of a connecting electrode according to the uphill structure shape of a light-emitting device package according to the first embodiment of the present invention.

[0098] As described above, for electrical connection between the terminal portion (280) and the light-emitting portion (250) or between the terminal portion (280) and the third connection portion (273) connected to the light-emitting portion (250), a so-called uphill structure connection electrode (270) having a column shape and a metal pattern shape (271, 272, 273) on the inclined portion can be used.

[0099] Referring to FIG. 3, an insulating pillar structure having a pillar shape (221) and an inclined portion (222) can be positioned on a light-emitting layer (210).

[0100] As an exemplary embodiment, after forming a protruding column shape (221) on the light-emitting layer (210), an inclined portion (222) can be formed on the outside of the column shape (221) using a liquid coating. At this time, the side shape of the inclined portion (222) can be formed gently by controlling the viscosity of the coating liquid, solvent volatilization, gravity, surface tension, etc.

[0101] For example, the pillar shape (221) may use a photoresist (PR) material such as a photoactive compound resin. In this case, the pillar shape (221) may also have an incline that is not perpendicular to the light-emitting layer (210). This incline may be provided depending on the method of forming the pillar shape (221).

[0102] Thereafter, when forming the inclined portion (222), the reflow characteristics of the liquid coating can be utilized depending on the material after the pattern of the columnar shape (221). Accordingly, an inclined portion (222) having various angles (α, β, γ) can be formed.

[0103] As shown in Fig. 4, depending on the shape of the formed inclined structure (221, 223, 224), the angle of inclination of the connecting electrode (270, 274, 275) formed thereon can be adjusted.

[0104] In this way, the connecting electrodes (270, 274, 275) can have different thicknesses depending on the plane and side angle and can have different characteristics in terms of connection stability at the inflection point.

[0105] For example, as shown in Fig. 4(A), when the column shape (221) does not have an incline, a connecting electrode (274) in the form of a through-electrode may be provided along the outer surface of the column shape (221) having such a vertical cross-section.

[0106] Meanwhile, referring to FIG. 4(B), in the case where an inclined portion (222) is provided on the outside of a column shape (221) as in an embodiment of the present invention, a connecting electrode (270) having a side slope may be provided on the outside of the column shape (221) and the inclined portion (222).

[0107] As an exemplary embodiment, referring to FIG. 4(C), the inclined portion (224) may be formed to have a gentler slope than that illustrated in FIG. 4(B). Meanwhile, as an example, the columnar shape (221) and the inclined portion (222) may be formed integrally. In addition, a connecting electrode (275) having such a gentle slope may be formed on the inclined portion (224) formed integrally.

[0108]

[0109] Fig. 5 is a cross-sectional view showing a light emitting device package according to a second embodiment of the present invention.

[0110] Referring to FIG. 5, a light-emitting device package (200) according to a second embodiment of the present invention may include a light-emitting layer (210, or first layer) in which a light-emitting portion (250) including light-emitting devices (251, 252, 253) is positioned. At this time, a driving device (260) may be positioned on one side of the light-emitting portion (250) within the light-emitting layer (210).

[0111] This driving element (driver chip; 260) can be implemented in the form of an integrated circuit (IC). This driving element (260) can drive the light-emitting unit (250). This driving element (260) is connected to the light-emitting unit (250) and can control the light-emitting color / intensity of the light-emitting element package (200). In addition, the driving element (260) can implement AM (Active Matrix) driving when the light-emitting element package (200) is configured as a pixel of a display.

[0112] In this way, when the driving element (260) is provided, the connecting electrode (270) may further include a fourth connecting portion (276) connected to the driving element (260). One side of the fourth connecting portion (276) may be connected to the connecting electrode (270), and the other side of the fourth connecting portion (276) may be connected to the light emitting portion (250).

[0113] As described above, a connecting layer (220, or second layer) including a terminal portion (280) and a plurality of connecting electrodes (270) connected between the terminal portion (280) and the light emitting elements (251, 252, 253) may be positioned on the light emitting layer (210) where the light emitting portion (250) is positioned.

[0114] In addition, a support layer (230, or third layer) through which light emitted from the light emitting portion (250) passes may be positioned on the lower surface of the light emitting layer (210). That is, light generated from the light emitting portion (250) may be emitted by passing through the support layer (230). In this way, the light emitting device package illustrated in FIG. 5 may be a bottom emission type light emitting device package in which light is emitted to the lower side of the structure illustrated in FIG. 5.

[0115] The description of any parts not otherwise described may be identical to the description provided for the first embodiment above. Therefore, any redundant description will be omitted.

[0116]

[0117] Fig. 6 is a cross-sectional view showing a light emitting device package according to a third embodiment of the present invention.

[0118] Referring to FIG. 6, a light-emitting device package (200) according to a third embodiment of the present invention may include a light-emitting layer (210, or first layer) in which a light-emitting portion (250) including light-emitting devices (251, 252, 253) is positioned.

[0119] A connecting layer (220, or second layer) including a terminal portion (280) and a plurality of connecting electrodes (270) connected between the terminal portion (280) and the light emitting elements (251, 252, 253) may be positioned on the light emitting layer (210) where the light emitting portion (250) is positioned.

[0120] In addition, a support layer (230, or third layer) through which light emitted from the light emitting portion (250) passes may be positioned on the lower surface of the light emitting layer (210). That is, light generated from the light emitting portion (250) may be emitted by passing through the support layer (230). In this way, the light emitting device package illustrated in FIG. 6 may be a bottom emission type light emitting device package in which light is emitted to the lower side of the structure illustrated in FIG. 6.

[0121] The connecting electrode (270) may have a metal pattern shape (271, 272, 273) positioned on an insulating pillar shape (221) including an inclined portion (222) provided in the connecting layer (220).

[0122] A connecting electrode (270) having a metal pattern shape (271, 272, 273) like this may have a structure (uphill structure) in which the shape of a via electrode formed along a via hole is modified.

[0123] As an exemplary embodiment, the connecting electrode (270) may include a first connecting portion (271) connected to a terminal portion (280) and a second connecting portion (272) connected to a light-emitting element (251, 252, 253).

[0124] A third connection portion (273) connected between the first connection portion (271) and the second connection portion (272) may be provided. At this time, the third connection portion (273) may have an inclination angle that the inclined portion (222) has. This third connection portion (273) may substantially set the height of the connection electrode (270). For example, the third connection portion (273) may have a height corresponding to the height between the terminal portion (280) and the light-emitting portion (250). This height may correspond to the height of the pillar shape (221).

[0125] A connecting electrode (270) having such an uphill structure can have an increased effective area compared to a through electrode or a columnar electrode formed in the same area.

[0126] As an exemplary embodiment, the terminal portion (280) may have a columnar structure corresponding to the connection electrode (270). For example, the terminal portion (280) may include a fifth connection portion (281) connected to the first connection portion (271) of the connection electrode (270), a terminal layer (282) that serves as a terminal connected to an external electrode pad, and a sixth connection portion (283) that connects the fifth connection portion (281) and the terminal layer (282) to each other.

[0127] As with the third connection portion (273) of the connecting electrode (270), the sixth connection portion (283) of the terminal portion (280) may, for example, have an angle of inclination that is not perpendicular to the terminal layer (282). This third connection portion (273) can substantially set the height of the terminal portion (280).

[0128] The description of any parts not otherwise described may be identical to the description provided for the first embodiment above. Therefore, any redundant description will be omitted.

[0129]

[0130] Fig. 7 is a cross-sectional view showing a light emitting element package according to the fourth embodiment of the present invention.

[0131] Referring to FIG. 7, a light emitting device package (200) according to a fourth embodiment of the present invention shows an embodiment in which a connecting electrode (270) has the function of a terminal portion (280).

[0132] As an exemplary embodiment, the terminal portion (280) may be omitted, and the seventh connection portion (277) of the connecting electrode (270) may perform the function of the terminal portion (280).

[0133] For example, the connecting electrode (270) may be provided with a seventh connecting portion (277) that performs the function of a terminal portion, a second connecting portion (272) that is connected to a light-emitting element (251, 252, 253), and a third connecting portion (273) that is connected between the seventh connecting portion (277) and the second connecting portion (272). At this time, the third connecting portion (273) may have an inclination angle that the inclined portion (222) has.

[0134] Compared to the first embodiment illustrated in FIG. 1, the seventh connecting portion (277) may have an expanded area compared to the first connecting portion (271) of the first embodiment. In this way, the seventh connecting portion (277) having an expanded area may function as a terminal portion (280) connected to an external electrode pad.

[0135] Accordingly, the diameter of the pillar shape (225) can be expanded. That is, referring to FIG. 7, the pillar shape (225) can have a wide cross-sectional area so that it can function as a terminal portion. The area of ​​the seventh connecting portion (277) located at the end of the pillar shape (225) can also have a wide area.

[0136] The description of any parts not otherwise described may be identical to the description provided for the first embodiment above. Therefore, any redundant description will be omitted.

[0137]

[0138] Fig. 8 is a cross-sectional view showing a light emitting device package according to the fifth embodiment of the present invention.

[0139] Referring to FIG. 8, a light-emitting device package (200) according to a fifth embodiment of the present invention may include a light-emitting layer (210, or first layer) in which a light-emitting portion (250) including light-emitting devices (251, 252, 253) is positioned. At this time, a driving device (260) may be positioned on one side of the light-emitting portion (250) within the light-emitting layer (210).

[0140] In this way, when the driving element (260) is provided, the connecting electrode (270) may further include a fourth connecting portion (276) connected to the driving element (260). One side of the fourth connecting portion (276) may be connected to the connecting electrode (270), and the other side of the fourth connecting portion (276) may be connected to the light emitting portion (250).

[0141] For example, the connecting electrode (270) may be provided with a seventh connecting portion (277) that performs the function of a terminal portion, a second connecting portion (272) that is connected to a light-emitting element (251, 252, 253), and a third connecting portion (273) that is connected between the seventh connecting portion (277) and the second connecting portion (272). At this time, the third connecting portion (273) may have an inclination angle that the inclined portion (222) has.

[0142] The seventh connecting portion (277) may have an area that is larger than that of the first connecting portion (271) of the first embodiment. In this way, the seventh connecting portion (277) having an expanded area may function as a terminal portion (280) connected to an external electrode pad.

[0143] Descriptions of any parts not otherwise described may be identical to those described above for the first and fourth embodiments. Therefore, any redundant descriptions will be omitted.

[0144]

[0145] FIGS. 9 to 11 are cross-sectional views showing a light-emitting device package according to the sixth embodiment of the present invention and a modified example thereof.

[0146] Referring to FIGS. 9 to 11, a light-emitting device package (200) according to a sixth embodiment of the present invention may include a light-emitting layer (210, or first layer) in which a light-emitting portion (250) including light-emitting devices (251, 252, 253) is positioned.

[0147] A connecting layer (220, or second layer) including a terminal portion (280) and a plurality of connecting electrodes (278) connected between the terminal portion (280) and the light emitting elements (251, 252, 253) may be positioned on the light emitting layer (210) where the light emitting portion (250) is positioned.

[0148] A support layer (230, or third layer) through which light emitted from the light emitting portion (250) passes may be positioned on the lower surface of the light emitting layer (210). That is, light generated from the light emitting portion (250) may be emitted by passing through the support layer (230). In this way, the light emitting device package illustrated in FIG. 5 may be a bottom emission type light emitting device package in which light is emitted downward of the structure illustrated in FIG. 5.

[0149] A driving element (260) may be positioned on this connecting layer (220). At this time, the driving element (260) is positioned on the light-emitting portion (250), so that the driving element (260) and the light-emitting portion (250) may overlap each other at least partially in the vertical direction.

[0150] For example, the driving element (260) and the light emitting portion (250) may be provided in the same direction with respect to the stacking direction of the light emitting layer (210), the connecting layer (220), and the support layer (230).

[0151] Referring to FIG. 9, for the inclined portion (226), the connecting electrode (270) may have a shape reversed from the first embodiment. For example, in the case of the first embodiment, the connecting electrode (270) may have a shape that is convex upward, but referring to FIG. 9, the connecting electrode (278) may have a shape that is convex downward.

[0152] For example, the inclined portion (226) may have a shape in which the cross-sectional area narrows in the downward direction, and accordingly, the connecting electrode (278) may be provided with a first connecting portion (271) connected to the terminal portion (280), a second connecting portion (272) connected to the light-emitting element (251, 252, 253), and a third connecting portion (273) connected to the second connecting portion (272). At this time, the first connecting portion (271) and the third connecting portion (273) may have an inclination angle that the inclined portion (226) has. In addition, the second connecting portion (272) may be connected to the end sides of the first connecting portion (271) and the third connecting portion (273).

[0153] In this way, when the driving element (260) is provided, the connecting electrode (270) may further include a fourth connecting portion (276) connected to the driving element (260).

[0154] Referring to Fig. 9, one side of the terminal portion (280) may have a flat shape, and the other side of the terminal portion (280) may have a columnar structure corresponding to the connection electrode (270). For example, the terminal portion (280) may include a fifth connection portion (281) connected to the first connection portion (271) of the connection electrode (270), a terminal layer (282) that serves as a terminal connected to an external electrode pad, and a sixth connection portion (283) that connects the fifth connection portion (281) and the terminal layer (282) to each other.

[0155] Meanwhile, referring to FIG. 10, unlike the case of FIG. 9, the connecting electrode (270) may be provided in the same direction as the first embodiment.

[0156] Referring to Fig. 11, the terminal portion (280) may have a flat shape. A separate connection portion (284) may be provided between the terminal portion (280) and the connection electrode (270).

[0157] This connecting portion (284) may have a shape similar to that of the connecting electrode (270). That is, the connecting portion (284) connecting the terminal portion (280) and the connecting electrode (270) may have an eighth connecting portion (285) connected to the terminal portion (280), a ninth connecting portion (286) connected to the connecting electrode (270), and a tenth connecting portion (287) connecting the eighth connecting portion (285) and the ninth connecting portion (286) to each other. At this time, the tenth connecting portion (287) may have an angle of inclination that is not perpendicular to the terminal portion (280).

[0158] In this way, in a structure in which the driving element (260) and the light-emitting portion (250) are stacked, an opening of considerable depth may be required for electrical connection with the light-emitting portion (250) on the lower side due to the thickness of the driving element (260). For stable electrical connection, a thick wiring connection through plating can usually be selected.

[0159] At this time, by forming a connecting electrode (270) and / or terminal portion (280) of a gentle slope using the proposed uphill structure, the driving element (260) can be electrically connected at a similar height to the terminal portion (280), enabling stable connection with thin film wiring.

[0160] In addition, if the uphill structure is formed in a double manner through the connecting electrode (270) and / or the terminal portion (280), the area of ​​the terminal portion (280) can be improved, and at the same time, the thickness of the light-emitting element package (200) can be manufactured thicker.

[0161]

[0162] FIG. 12 is a schematic diagram showing an example in which a connecting electrode according to embodiments of the present invention is used as an alignment key, and FIG. 13 is a schematic diagram showing an example in which a terminal portion according to embodiments of the present invention is used as an alignment key.

[0163] Referring to FIG. 12, an example is shown in which a part of the connecting electrode (270) described above is used as an alignment key.

[0164] For example, the shapes of the first connection portions (271a, 271b) of the connecting electrode (270) can be changed to be used as alignment keys. For example, the first connection portion (271b) of the connecting electrode (270) used as a common electrode can be formed with a different shape from the remaining first connection portions (271b) or can be marked to be distinguished from them.

[0165] In this way, if the state in which each connecting electrode (270) is connected between the internal light-emitting part (250) and the driving element (260) can be intuitively confirmed from the outside, it can be easily matched with the terminal of the wiring board during the mounting process of the light-emitting element package (200).

[0166] Referring to FIG. 13, the terminal portion (288) connected to the common electrode may be displayed to have a different shape or to be distinguished from the remaining terminal portions (280).

[0167] For example, a diagonal shape (289) can be added to the terminal portion (288) connected to the common electrode to distinguish it from the remaining terminal portions (280).

[0168]

[0169] Fig. 14 is a cross-sectional schematic diagram showing a display device using a light-emitting element package according to the first embodiment of the present invention.

[0170] FIG. 14 shows an example of a display device in which a light-emitting element package (200) according to the first embodiment described with reference to FIGS. 1 and 2 is used as a unit pixel.

[0171] Referring to Fig. 14, a light emitting element package (200) may be placed on a wiring substrate (100) including a substrate (110) on which wiring electrodes (120) are formed in a reversed state from Fig. 1 to form a display device (10). At this time, the wiring electrodes (120) may be separated from each other by a gap (121).

[0172] The light emitting element package (200) can be connected to the wiring electrode (120) by an electrical connection (122) such as solder (122).

[0173] A molding layer (130) for embedding the light emitting element package (200) may be provided on the substrate (110). An optical layer (140) may be provided on the molding layer (130).

[0174] In some cases, a black matrix (150) may be provided on the side of each light emitting element package (200).

[0175]

[0176] Figures 15 to 24 are cross-sectional views showing the process of manufacturing a light emitting element package according to the first embodiment.

[0177] Hereinafter, with reference to FIGS. 15 to 24, the manufacturing process of the light emitting element package (200) according to the first embodiment will be described.

[0178] Referring to FIG. 15, first, a support layer (230) can be formed on a process substrate (300). For example, this support layer (230) can be formed by coating on the process substrate (300).

[0179] Referring to Fig. 16, a scattering layer (240) can be formed on a support layer (230). For example, this scattering layer (240) can also be formed by coating on the support layer (230). As described above, the scattering layer (240) can include fine particles (241).

[0180] Referring to Fig. 17, light-emitting elements (251, 252, 253) forming a light-emitting portion (250) can be transferred onto a scattering layer (240).

[0181] Thereafter, referring to FIG. 18, a pillar shape (221) can be formed between each light-emitting portion (250). For example, pillar shapes (221) can be formed at four locations around each light-emitting portion (250). The planar position of the pillar shape (221) can correspond to the position of the first connecting portion (271) illustrated in FIG. 2.

[0182] Referring to Fig. 19, an inclined portion (222) may be formed on the outer side of the columnar shape (221). For example, this inclined portion (222) may be formed continuously with the portion molding the light-emitting portion (250). For example, the inclined portion (222) may be connected to the side surface of the light-emitting portion (250).

[0183] Referring to Fig. 20, a connecting electrode (270) can be formed by patterning along the outer surface of the column shape (221) and the inclined portion (222). This connecting electrode (270) can be electrically connected to the light emitting portion (250).

[0184] Referring to FIG. 21, a connection layer (220) covering a connection electrode (270) can be formed. For example, after forming a layer to cover the entire connection electrode (270), a portion of the layer can be removed to expose the first connection portion (271) of the connection electrode (270), thereby forming the connection layer (220).

[0185] Referring to Fig. 22, a terminal portion (280) electrically connected to the connecting electrode (270) can be formed by patterning.

[0186] Referring to FIG. 23, a trench (T) that can separate individual light emitting device packages (200) can be formed. This trench (T) can remove the intervening portion of the individual light emitting device packages (200), thereby allowing the individual light emitting device packages (200) to be separated.

[0187] Thereafter, referring to FIG. 24, the process substrate (300) can be separated from the support layer (230). In this way, by separating the process substrate (300), a light emitting device package (200) according to the first embodiment as illustrated in FIGS. 1 and 2 can be manufactured.

[0188]

[0189] The above description is merely an example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention.

[0190] Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of ​​the present invention but to explain it, and the scope of the technical idea of ​​the present invention is not limited by these embodiments.

[0191] The scope of protection of the present invention should be interpreted by the claims below, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

[0192] According to the present invention, a light-emitting device package using a light-emitting device and a display device using the same can be provided.

Claims

1. A first layer having a light-emitting portion including light-emitting elements forming unit subpixels; A second layer positioned on the first surface of the first layer and including a terminal portion and a plurality of connecting electrodes connecting the gap between the terminal portion and the light-emitting elements; A third layer is positioned on the second surface of the first layer and includes light emitted from the light emitting portion passing through the third layer, A light emitting device package characterized in that the above connecting electrode has a columnar structure having a height corresponding to the above gap and an inclination angle with respect to the first surface.

2. A light emitting device package according to claim 1, characterized in that the connecting electrode is positioned on the outer surface of a pillar shape provided in the second layer.

3. A light emitting device package according to claim 1, characterized in that the connecting electrode has an angle of inclination with respect to the pillar shape.

4. A light emitting device package characterized in that, in the first paragraph, an inclined portion having the inclined angle is positioned on the outer side of the pillar shape.

5. In the first paragraph, the connecting electrode, A first connection part connected to the terminal part; and A light-emitting element package characterized by including a second connecting portion connected to the light-emitting element.

6. A light emitting device package according to claim 5, further comprising a third connecting portion connected between the first connecting portion and the second connecting portion.

7. A light emitting device package according to claim 6, characterized in that the third connecting portion has the angle of inclination.

8. A light emitting device package according to claim 1, characterized in that the terminal portion has a pillar structure corresponding to the connecting electrode.

9. A light-emitting element package according to claim 1, characterized in that it further includes a driving element located on one side of the light-emitting element.

10. A light emitting device package according to claim 1, characterized in that it further comprises a fourth layer containing scattering particles between the third layer and the first layer.

11. A light emitting device package according to claim 1, characterized in that the second layer functions as a reflective layer.

12. A light-emitting layer having a light-emitting portion including light-emitting elements forming unit subpixels; A connecting layer positioned on the first surface of the light-emitting layer and including a terminal portion and a plurality of connecting electrodes connected between the terminal portion and the light-emitting elements; A support layer positioned on the second surface of the light-emitting layer and through which light emitted from the light-emitting portion passes, A light emitting device package characterized in that the above connecting electrode has a metal pattern shape positioned on a column shape including an inclined portion provided in the connecting layer.

13. A light emitting device package according to claim 12, characterized in that the metal pattern is located on the outer surface of a pillar shape provided in the connecting layer.

14. In the 12th paragraph, the connecting electrode, A first connection part connected to the terminal part; and A light-emitting element package characterized by including a second connecting portion connected to the light-emitting element.

15. A light emitting device package according to claim 14, further comprising a third connecting portion connected between the first connecting portion and the second connecting portion.

16. A light emitting device package according to claim 15, characterized in that the third connecting portion has an inclination of the inclined portion.

17. A light-emitting element package according to claim 12, further comprising a driving element positioned on one side of the light-emitting element.

18. A light-emitting device package according to claim 12, characterized in that it further comprises a scattering layer containing scattering particles between the light-emitting layer and the support layer.

19. A light emitting device package according to claim 12, characterized in that the terminal portion has a pillar structure corresponding to the connecting electrode.

20. A display device including a light-emitting element package defining individual pixels, The above light emitting device package, A light-emitting layer having a light-emitting portion including light-emitting elements forming unit subpixels; A connecting layer located on the first surface of the light-emitting layer and including a terminal portion and a plurality of connecting electrodes connected between the terminal portion and the light-emitting elements; A support layer is located on the second surface of the light-emitting layer and includes a support layer through which light emitted from the light-emitting portion passes, A display device characterized in that the above connecting electrode has a metal pattern shape positioned on a column shape including an inclined portion provided in the connecting layer.

Images