Circuit board, electronic module, electronic device, and signal transmission method therefor

Abstract

The present application provides a circuit board, an electronic module, an electronic device, and a signal transmission method. The circuit board comprises a gold finger connector, wherein the gold finger connector is an OSFP-XD gold finger connector. The gold finger connector comprises a first row of gold fingers and a second row of gold fingers which are arranged on a first surface, and a third row of gold fingers and a fourth row of gold fingers which are arranged on a second surface. The first row of gold fingers comprises a first control gold finger and a second control gold finger, wherein the first control gold finger is used for transmitting a serial data signal, and the second control gold finger is used for transmitting an interrupt request signal or a reset control signal. The third row of gold fingers comprises a third control gold finger and a fourth control gold finger, wherein the third control gold finger is used for transmitting a clock signal, and the fourth control gold finger is used for transmitting a low-power-consumption control signal or a module presence display signal or a reset control signal. The thickness of the circuit board is 0.9 mm to 1.1 mm. The compatibility of the system is improved, and the cost can be reduced.

Description

Circuit board, electronic module, electronic equipment and signal transmission method thereof

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on October 31, 2023, with application number 202311442818.4 and invention name "Circuit board, electronic module, electronic device and its signal transmission method", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic equipment, and in particular to a circuit board, an electronic module, an electronic device, and a signal transmission method thereof. Background Art

[0004] With the increasing application of 5G communications and artificial intelligence technologies, network data traffic is increasing, and the required optical communication bandwidth is increasing. To meet the bandwidth requirements of optical communication networks, the high-speed signal rate of each optical and electrical channel of optical modules is getting higher and higher, and the requirements for optical module capacity are also increasing.

[0005] Optical module capacity = number of high-speed signal channels x rate per channel. Optical channels can utilize very high-density optical interface technology or employ wavelength combination / demultiplexing technology to combine multiple channels of light with different wavelengths into a single transmission channel, eliminating density issues. Regarding electrical channels, due to the pluggable nature of optical modules, the electrical channels in common and widely used optical modules are represented by the gold fingers on a gold finger connector. This connector mates with the female connector on the system board to transmit electrical signals. Therefore, one approach to increasing optical module capacity is to increase the number of electrical channels, and therefore the number of gold fingers on the gold finger connector. This increase in the number of gold fingers on a gold finger connector makes it difficult for the female connector compatible with the newer generation of gold finger connectors to be compatible with the previous generation. This makes it difficult for system upgrades to be compatible with the previous generation of gold finger connectors, rendering modules with the previous generation of gold finger connectors unusable, resulting in wasted resources, increased upgrade costs, and potential financial losses for users. Therefore, improving the compatibility of the female connector compatible with the newer generation of gold finger connectors is a key development direction.

[0006] Summary of the Invention

[0007] The present application provides a circuit board, an electronic module, an electronic device and a signal transmission method thereof to improve the compatibility of a female connector connected to a gold finger, or to improve system compatibility to reduce the cost of users upgrading their systems.

[0008] In a first aspect, the present application provides a circuit board comprising a gold finger connector, which may specifically be an OSFP-XD gold finger connector. The gold finger connector is located at an edge of the circuit board and includes a plurality of gold fingers. The circuit board comprises a first surface and a second surface, which are opposed to each other. The gold finger connector comprises a first row and a second row of gold fingers disposed on the first surface, and a third row and a fourth row of gold fingers disposed on the second surface. The first and second rows of gold fingers are arranged along the insertion and removal direction of the gold finger connector, while the third and fourth rows of gold fingers are arranged along the insertion and removal direction of the gold finger connector.

[0009] In a specific technical solution, the first row of gold fingers includes a first control gold finger, a second control gold finger, and two first power gold fingers. The first control gold finger is used to transmit serial data signals, the second control gold finger is used to transmit interrupt request signals or reset control signals, and the two first power gold fingers are arranged between the first and second control gold fingers. The third row of gold fingers includes a third control gold finger, a fourth control gold finger, and two second power gold fingers. The third control gold finger is used to transmit clock signals, and the fourth control gold finger is used to transmit low-power control signals, module presence indication signals, or reset control signals; the two second power gold fingers are arranged between the third and fourth control gold fingers. This ensures that the female connector adapted to the OSFP-XD gold finger connector is compatible with the OSFP gold finger connector in terms of pin definition and transmission signal type.

[0010] Furthermore, the thickness of the aforementioned circuit board is 0.9 mm to 1.1 mm. The thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is relatively close to that of the circuit board of the OSFP gold finger connector 4. Therefore, from a physical structural perspective, the opening dimensions of the female connector used to connect to the OSFP-XD gold finger connector 1' are also compatible with the gold finger connector of the OSFP gold finger connector 4. This allows the female connector adapted for the OSFP-XD gold finger connector 1' to also be compatible with OSFP in terms of physical dimensions.

[0011] Therefore, the OSFP-XD gold finger connector 1' and the OSFP gold finger connector 4 can share the same female connector 110, thereby improving the compatibility of the female connector 110 and thus improving the compatibility of the system. Users can update or replace the electronic module 200 as needed without having to update the system's single board. This solution is conducive to reducing costs.

[0012] In a further technical solution, the first and third rows of gold fingers, in addition to the aforementioned control and power gold fingers, also include other gold fingers, such as data signal gold fingers. Specifically, the first row of gold fingers includes four pairs of gold fingers for transmitting data signals and four pairs of gold fingers for receiving data signals. The four pairs of gold fingers for transmitting data signals in the first row are sequentially arranged on the side of the first control gold finger away from the second control gold finger, and the four pairs of gold fingers for receiving data signals in the first row are sequentially arranged on the side of the second control gold finger away from the first control gold finger. The second row of gold fingers also includes four pairs of gold fingers for transmitting data signals and four pairs of gold fingers for receiving data signals. The four pairs of gold fingers for transmitting data signals in the second row are sequentially arranged on the side of the third control gold finger away from the fourth control gold finger, and the four pairs of gold fingers for receiving data signals in the first row are sequentially arranged on the side of the fourth control gold finger away from the third control gold finger.

[0013] In one technical solution, the two ends of the above-mentioned gold finger connector along the plug-in and pull-out direction are respectively a first end and a second end. The first end is used to insert into the female connector, and the second end is used to connect to the circuit board body. The first and second rows of gold fingers are arranged in sequence from the first end to the second end, and the third and fourth rows of gold fingers are arranged in sequence from the first end to the second end. The first and second rows of gold fingers are arranged in sequence along the insertion direction, and the third and fourth rows of gold fingers are arranged along the insertion direction. When inserting the gold finger connector into the female connector, the second and fourth rows of gold fingers of the gold finger connector are inserted into the female connector first, and then the first and third rows of gold fingers are inserted into the female connector. In this solution, the length of the OSFP gold finger connector inserted into the female connector compatible with the OSFP-XD gold finger connector is the same as, or similar to, the length of the insertion into the female connector corresponding to the OSFP module. The length of the circuit board for the OSFP gold finger connector does not need to be changed, which can improve system compatibility.

[0014] In one technical solution, the first and second rows of gold fingers are arranged sequentially from the second end toward the first end, i.e., in the direction of removal; the third and fourth rows of gold fingers are arranged sequentially from the second end toward the first end, i.e., in the direction of removal. The OSFP gold finger connector can be inserted into the bottom of the female connector, facilitating alignment of the OSFP gold finger connector's gold fingers with the first set of pins on the female connector, thereby improving connection reliability between the OSFP gold finger connector and the female connector.

[0015] Specifically, the thickness of the circuit board of the OSFP-XD gold finger connector can be set to 1 mm, which is the same as the thickness of the circuit board of the OSFP gold finger connector in the prior art.

[0016] When implementing the circuit board for the OSFP-XD gold finger connector, the circuit board comprises a conductive layer and a dielectric layer, with a dielectric layer located between any two adjacent conductive layers. Specifically, the circuit board comprises 12 conductive layers. All 12 conductive layers can be used to create trace patterns. The conductive layers used for trace patterns have a larger area, providing more space for traces. Consequently, fewer traces can be created on the conductive layers on both sides of the circuit board, leaving more space for device layout, simplifying the electronic module manufacturing process.

[0017] Each layer of the circuit board can be made thinner, for example, the thickness of the conductive layer is 10um to 40um, and the thickness of the dielectric layer is 20um to 40um. This solution can achieve more signal transmission on a thinner circuit board.

[0018] In addition, the conductive layer includes wiring. In order to arrange more wirings on the conductive layer, the width of the wirings can be made narrower. For example, the width of the wirings ranges from 20 um to 40 um.

[0019] In a second aspect, the present application further provides an electronic module. The electronic module includes a housing and the circuit board provided in the first aspect, wherein the circuit board is mounted on the housing. The electronic module may be an optical module, for example, including an optical transmitter and / or an optical receiver.

[0020] In a third aspect, the present application further provides an electronic device. The electronic device includes an electronic component and the electronic module provided in the second aspect. The electronic component includes a female connector, and the gold finger connector of the electronic module is plugged into the female connector. The female connector of the electronic component has good compatibility and is compatible with both OSFP-XD gold finger connectors and OSFP gold finger connectors. In other words, the female connector of the electronic component is compatible with both OSFP-XD modules and OSFP modules. After upgrading, the electronic device can also be connected to the previous generation of OSFP modules, thereby reducing waste and helping to reduce the upgrade cost of the electronic device.

[0021] In a fourth aspect, the present application also provides a signal transmission method for the electronic device provided in the third aspect. Specifically, the pins in the female connector of the electronic device include a first control pin, a second control pin, a point control pin, a fourth control pin, a first power pin, and a second power pin, and the pins are respectively connected to the gold fingers of the gold finger connector. The above-mentioned signal transmission method specifically includes: the first control gold finger and the first control pin transmit a serial data signal; the second control gold finger and the second control pin transmit an interrupt request signal or a reset control signal; the third control gold finger and the third control pin transmit a clock signal; the fourth control gold finger and the fourth control pin transmit a low power control signal or a module presence display signal or a reset control signal; the first power gold finger and the first power pin transmit a power signal; the second power gold finger and the second power pin also transmit a power signal. This signal transmission method can be used to transmit signals of OSFP-XD modules, and can also be used to transmit signals of OSFP modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0023] FIG2 is a schematic diagram of the connection structure between the electronic module and the electronic assembly in an embodiment of the present application;

[0024] FIG3 is a schematic structural diagram of a communication network system according to an embodiment of the present application;

[0025] FIG4 is a schematic structural diagram of a circuit board in an embodiment of the present application;

[0026] FIG5 is a schematic structural diagram of a circuit board in an embodiment of the present application;

[0027] FIG6 is a schematic diagram of an expanded OSFP-XD gold finger connector according to an embodiment of the present application;

[0028] FIG7 is a schematic structural diagram of a circuit board with an OSFP gold finger connector;

[0029] FIG8 is a schematic diagram of an expanded OSFP gold finger connector;

[0030] FIG9 is a cross-sectional schematic diagram of the connection between the gold finger connector and the female connector according to an embodiment of the present application;

[0031] FIG10 is a cross-sectional schematic diagram of the connection between the gold finger connector and the female connector according to an embodiment of the present application;

[0032] FIG11 is a schematic diagram of an expanded OSFP-XD gold finger connector according to an embodiment of the present application;

[0033] FIG12 is a cross-sectional schematic diagram of the connection between the gold finger connector and the female connector according to an embodiment of the present application;

[0034] FIG13 is a cross-sectional schematic diagram of the connection between the gold finger connector and the female connector according to an embodiment of the present application;

[0035] FIG14 is a schematic diagram of a cross-sectional structure of a circuit board of an OSFP-XD gold finger connector according to an embodiment of the present application;

[0036] FIG15 is a schematic diagram of a process flow for preparing an OSFP-XD gold finger connector according to an embodiment of the present application.

[0037] Reference numerals: 100-electronic component; 110-female connector; 200-electronic module; 200'-OSFP-XD module; 210-housing; 220-circuit board; 300-OSFP module; 1-gold finger connector; 1'-OSFP-XD gold finger connector; 111-first surface; 112-second surface; 113-conductive layer; 114-dielectric layer; 1141-adjusting dielectric layer; 115-conductive hole; 116-photosensitive film layer; 12-gold finger; 121-first row of gold fingers; 1211-first control gold finger; 1212-second control gold finger; 1213-first power gold finger; 122-third row of gold fingers; 1221-third control gold finger; 1222-fourth control gold finger; 1223-second power gold finger; 21-sending data signal gold finger; 22-receiving data signal gold finger; 23-grounding gold finger; 123-second row of gold fingers; 124-fourth row of gold fingers; 13-first end; 14-second end;15 - OSFP-XD gold finger connector board edge; 3 - electronic components; 4 - OSFP gold finger connector; 41 - third surface; 42 - fourth surface; 43 - fifth row of gold fingers; 44 - sixth row of gold fingers; 45 - OSFP gold finger connector board edge; 5 - first group of pins; 6 - second group of pins; 7 - connector; X - first direction; Y - plug-in direction; Y1 - insertion direction; Y2 - removal direction. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0039] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0040] References in this specification to "one embodiment" or "a specific embodiment" mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. The terms "including," "comprising," "having," and their variations all mean "including but not limited to," unless otherwise specifically stated.

[0041] To facilitate understanding of the circuit board, electronic module, electronic device, and signal transmission method thereof provided in the embodiments of the present application, the following first introduces their main application scenarios. With the development of communication technology, communication bandwidth is getting larger and larger. Due to the advantages of optical signals such as fast signal transmission rate and low loss, the application of optical signals to achieve signal transmission has become more and more extensive. For example, optical module products are used in fields such as Passive Optical Network (PON), wireless network, and Internet Protocol (IP). During the signal transmission process, conversion between optical signals and electrical signals is required. Therefore, the optical module needs to have an electrical signal transmission interface. A more commonly used electrical signal transmission interface is a gold finger connector. The gold finger connector provided in this application is a double-8 channel small form-factor pluggable X double (OSFP-XD) gold finger connector. By improving the OSFP-XD gold finger connector, the compatibility of the female connector adapted to the OSFP-XD gold finger connector is improved, thereby reducing the upgrade cost of electronic modules and electronic devices.

[0042] Figure 1 is a schematic diagram of the structure of an electronic device in an embodiment of the present application, and Figure 2 is a schematic diagram of the connection structure of the electronic module and the electronic assembly in an embodiment of the present application. As shown in Figures 1 and 2, the electronic device in the embodiment of the present application includes an electronic assembly 100 and an electronic module 200. Among them, the electronic module 200 can be an OSFP-XD module 200'. The electronic module 200 includes a housing 210 and a circuit board 220, and the circuit board 220 includes a gold finger connector 1. The above-mentioned electronic assembly 100 includes a female connector 110, and the above-mentioned gold finger connector 1 is plugged into the above-mentioned female connector 110 to achieve electrical connection between the electronic module 200 and the electronic assembly 100.

[0043] FIG3 is a schematic structural diagram of a communication network system according to an embodiment of the present application. As shown in FIG3 , the communication network system includes multiple electronic devices described above, which are connected via an electronic module 200. In the embodiment shown in FIG3 , the communication network system includes a master system and a slave system, both of which include electronic devices. The electronic module 200 in the embodiment of the present application is an OSFP-XD module 200′, and the female connector 110 for plugging into the gold finger connector 1 of the OSFP-XD module 200′ is also compatible with the gold finger connector of an octal small form-factor pluggable (OSFP) module 300. Specifically, the female connector 110 of the electronic device can be connected to the OSFP-XD module 200′ or the OSFP module 300 according to actual needs. In this solution, the electronic device used to connect to the gold finger connector 1 of the OSFP-XD module 200' can also be used to connect to the gold finger connector of the OSFP module 300. The upgraded electronic device can also be connected to the non-upgraded OSFP module 300, which is beneficial to improving the flexibility of system networking, protecting existing investments, and reducing costs.

[0044] The electronic module 200 may include an optical device, such as an optical transmitter or an optical receiver. In this case, the electronic module 200 may be an optical module. In addition, the electronic module 200 may not include an optical device and may only be used to transmit electrical signals.

[0045] The electronic device may be a communication device, such as a switch, a router, a wavelength division multiplexing device, a server, or a supercomputer, etc. In addition, it may be any electronic device that needs to utilize the OSFP-XD gold finger connector 1 ′ to transmit signals.

[0046] FIG4 is a schematic diagram of the structure of a circuit board in an embodiment of the present application. As shown in FIG4 , the circuit board 220 in the embodiment of the present application includes a gold finger connector 1, which is located at the edge of the circuit board 220. Specifically, the gold finger connector 1 has a plurality of gold fingers 12, and the gold fingers 12 are formed on the surface of the circuit board 220. Specifically, the circuit board 220 may further include a circuit, which can electrically connect the circuit of the circuit board 220 with the gold fingers 12 so that the circuit of the circuit board 220 can be connected to other electronic components through the gold finger connector. An electronic device 3 may also be provided on the circuit board 220, which is connected to the circuit of the circuit board 220 and can be electrically connected to the gold fingers 12 of the gold finger connector 1. When the gold finger connector is connected to other electronic components, the electronic device on the circuit board 220 can be connected to the other electronic components to achieve signal transmission.

[0047] FIG5 is a schematic diagram of the structure of a circuit board in an embodiment of the present application, and FIG6 is a schematic diagram of the expansion of the gold finger connector in an embodiment of the present application. As shown in FIG6 , the bold dashed line in the figure indicates the direction of the gold finger connector board edge 15, or in other words, FIG6 is a schematic diagram of the expansion with the gold finger connector board edge 15 as the fold line. The board edge is the edge of the gold finger connector at the insertion end. As shown in FIG5 and FIG6 , the gold finger connector 1 in the embodiment of the present application can be an OSFP-XD gold finger connector 1'. Specifically, the circuit board 220 of the gold finger connector 1 in the embodiment of the present application includes a first surface 111 and a second surface 112 that are separated from each other, and the gold fingers 12 of the gold finger connector 1 include a first row of gold fingers 121, a second row of gold fingers 123, a third row of gold fingers 122, and a fourth row of gold fingers 124. The first row of gold fingers 121 and the third row of gold fingers 122 are disposed on the first surface 111 of the circuit board 220, and the first row of gold fingers 121 and the second row of gold fingers 123 are arranged along the plugging and unplugging direction of the gold finger connector. The third row of gold fingers 122 and the fourth row of gold fingers 124 are disposed on the second surface 112 of the circuit board 220, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged along the plugging and unplugging direction of the gold finger connector. The first row of gold fingers 121 and the second row of gold fingers 123 are disposed in different rows, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are disposed in different rows. This ensures that the pins of the female connector 110 connected to the first row of gold fingers 121 and the pins connected to the second row of gold fingers 123 are located in different rows along the plugging and unplugging direction, reducing mutual interference. The pins of the female connector 110 connected to the third row of gold fingers 122 and the pins connected to the fourth row of gold fingers 124 are located in different rows along the plugging and unplugging direction, reducing mutual interference. The gold finger connector provided in the present application includes a large number of gold fingers, and can transmit a large number and density of signals, which is conducive to adapting to the current development trend of high-density electronic equipment.

[0048] In a specific embodiment, the orthographic projection of the first row of gold fingers 121 on the circuit board 220 at least partially overlaps with the orthographic projection of the third row of gold fingers 122 on the circuit board 220. It is understandable that the first row of gold fingers 121 and the third row of gold fingers 122 are located in the same row or approximately in the same row.

[0049] Specifically, the first row of gold fingers 121 includes a plurality of gold fingers 12, and the plurality of gold fingers 12 in the first row of gold fingers 121 are sequentially spaced apart on the first surface 111 along the first direction X. The plurality of gold fingers 12 in the first row of gold fingers 121 are arranged in a row, and the row of the first row of gold fingers 121 extends along the first direction X. The second row of gold fingers 123 includes a plurality of gold fingers 12, and the plurality of gold fingers 12 in the second row of gold fingers 123 are sequentially spaced apart on the first surface 111 along the first direction X. The plurality of gold fingers 12 in the second row of gold fingers 123 are arranged in a row, and the row of the second row of gold fingers 123 extends along the first direction X. Similarly, the third row of gold fingers 122 also includes a plurality of gold fingers 12, and the plurality of gold fingers 12 in the third row of gold fingers 122 are sequentially spaced apart on the second surface 112 along the first direction X. The plurality of gold fingers 12 in the third row of gold fingers 122 are arranged in a row, and the row of the third row of gold fingers 122 extends along the first direction X. The fourth row of gold fingers 124 includes a plurality of gold fingers 12, and the plurality of gold fingers 12 in the fourth row of gold fingers 124 are sequentially spaced apart on the second surface 112 along the first direction X. The plurality of gold fingers 12 in the fourth row of gold fingers 124 are arranged in a row, and the row of the fourth row of gold fingers 124 extends along the first direction X. In a specific embodiment, the first direction X is perpendicular to the insertion and removal direction Y of the gold finger connector.

[0050] Referring to Figure 6 , the first row of gold fingers 121 includes a first control gold finger 1211, a second control gold finger 1212, and two first power gold fingers 1213. The first control gold finger 1211 is used to transmit a serial data signal (SDA), the second control gold finger 1212 is used to transmit an interrupt request signal or a reset control signal (INT / RSTn), and the two first power gold fingers 1213 are disposed between the first control gold finger 1211 and the second control gold finger 1212. The third row of gold fingers 122 includes a third control gold finger 1221, a fourth control gold finger 1222, and two second power gold fingers 1223. The third control gold finger 1221 is used to transmit a clock signal (SCL), and the fourth control gold finger 1222 is used to transmit a low-power control signal, a module presence signal, or a reset control signal (LPWn / PRSn / ePPS). The two second power gold fingers 1223 are disposed between the third control gold finger 1221 and the fourth control gold finger 1222.

[0051] The previous generation connector of the OSFP-XD gold finger connector 1' is the OSFP gold finger connector 4. Figure 7 is a schematic diagram of the structure of a circuit board with an OSFP gold finger connector, and Figure 8 is a schematic diagram of the expanded OSFP gold finger connector. As shown in Figure 8, the bold dashed line in the figure indicates the direction of the OSFP gold finger connector board edge 45, or in other words, Figure 8 is a schematic diagram of the OSFP gold finger connector expanded with the board edge 45 of the OSFP gold finger connector as the fold line. The board edge is the edge of the gold finger connector at the insertion end. As shown in Figures 7 and 8, the opposing surfaces of the OSFP gold finger connector 4 are the third surface 41 and the fourth surface 42, respectively. The third surface 41 of the OSFP gold finger connector 4 includes a fifth row of gold fingers 43, which includes a plurality of gold fingers arranged in sequence along the first direction X. The fourth surface 42 includes a sixth row of gold fingers 44, which also includes a plurality of gold fingers arranged in sequence along the first direction X. Specifically, the multiple gold fingers in the fifth row 43 of the OSFP gold finger connector 4 meet certain definitions and orderings, and the multiple gold fingers in the sixth row 44 of the fourth surface 42 of the OSFP gold finger connector 4 also meet certain definitions and orderings.

[0052] As shown in Figures 6 and 8 , the control signals transmitted and sequenced by the first control finger 1211, second control finger 1212, and first power finger 1213 of the first row of fingers 121 of the OSFP-XD connector 1' are identical to those transmitted by the control and power fingers in the fifth row of fingers 43 of the OSFP connector 4. The control signals transmitted and sequenced by the third control finger 1221, fourth control finger 1222, and second power finger 1223 of the third row of fingers 122 are identical to those transmitted by the control and power fingers in the sixth row of fingers 44 of the OSFP connector 4. The remaining fingers are used for data transmission and grounding. This ensures that the female connector adapted to the OSFP-XD connector 1' is compatible with the OSFP connector in terms of pinout and signal transmission types.

[0053] In addition, the thickness of the circuit board 220 of the gold finger connector provided in the present application is 0.9mm to 1.1mm. The thickness of the circuit board of the OSFP gold finger connector 4 in the prior art is 1mm. The thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is relatively close to the thickness of the circuit board of the OSFP gold finger connector 4. Therefore, from the perspective of physical structure, the opening size of the female connector used to connect the OSFP-XD gold finger connector 1' can also be compatible with the gold finger connector of the OSFP gold finger connector 4. This makes the female connector adapted to the OSFP-XD gold finger connector 1' also compatible with OSFP in terms of physical size.

[0054] Therefore, the OSFP-XD gold finger connector 1' and the OSFP gold finger connector 4 can share the same female connector 110, thereby improving the compatibility of the female connector 110 and thus improving the compatibility of the system. Users can update or replace the electronic module 200 as needed without having to update the system's single board. This solution is conducive to reducing costs.

[0055] Continuing with reference to Figure 6, the gold finger connector provided in this application includes, in addition to the aforementioned control gold fingers and power gold fingers, data signal gold fingers and ground gold fingers 23. Specifically, the aforementioned first row of gold fingers 121 includes four pairs of transmit data signal gold fingers 21 (TX) and four pairs of receive data signal gold fingers 22 (RX). The four pairs of transmit data signal gold fingers 21 of the first row of gold fingers 121 are sequentially arranged on the side of the first control gold finger 1211 away from the second control gold finger 1212, and the four pairs of receive data signal gold fingers 22 of the first row of gold fingers 121 are sequentially arranged on the side of the second control gold finger 1212 away from the first control gold finger 1211. Similarly, the second row of gold fingers 123 also includes four pairs of gold fingers 21 for sending data signals and four pairs of gold fingers 22 for receiving data signals. The four pairs of gold fingers 21 for sending data signals of the second row of gold fingers 123 are sequentially arranged on the side of the third control gold finger 1221 away from the fourth control gold finger 1222, and the four pairs of gold fingers 22 for receiving data signals of the first row of gold fingers 121 are sequentially arranged on the side of the fourth control gold finger 1222 away from the third control gold finger 1221.

[0056] In addition, the first row of gold fingers 121 may also include ten grounding gold fingers 23. Each pair of transmitting data signal gold fingers 21 or each pair of receiving data signal gold fingers 22 has a grounding gold finger 23 at both ends. Two adjacent pairs of transmitting data signal gold fingers 21 share one grounding gold finger 23, and two adjacent pairs of receiving data signal gold fingers 22 share one grounding gold finger 23.

[0057] In a specific embodiment, a pair of transmit data signal gold fingers 21 may include two transmit data signal gold fingers 21 arranged along a first direction X, for transmitting a differential signal pair; similarly, a pair of receive data signal gold fingers 22 may include two receive data signal gold fingers 22 arranged along the first direction X, for transmitting a differential signal pair. Furthermore, the data signal gold fingers are arranged as shown in FIG6 , further improving the compatibility of the female connector adapted to the OSFP-XD gold finger connector 1 ' and simplifying the control process.

[0058] As shown in Figures 6 and 8 , the definition and ordering of the multiple gold fingers 12 in the first row 121 of the OSFP-XD gold finger connector 1' are the same as the definition and ordering of the multiple gold fingers 12 in the fifth row 43 of the OSFP gold finger connector 4; the definition and ordering of the multiple gold fingers 12 in the third row 122 of the OSFP-XD gold finger connector 1' are the same as the definition and ordering of the multiple gold fingers 12 in the sixth row 44 of the OSFP gold finger connector 4. For example, Figure 6 shows one definition and ordering of the multiple gold fingers 12 in the first row 121, and one definition and ordering of the multiple gold fingers 12 in the third row 122. The definition and ordering of the two rows of gold fingers 12 in the OSFP-XD gold finger connector 1' in the embodiment of the present application are the same as the definition and ordering of the two rows of gold fingers in the OSFP gold finger connector 4.

[0059] Specifically, the female connector 110 adapted to the OSFP-XD gold finger connector 1' includes pins for connecting to the first row of gold fingers 121 and the third row of gold fingers 122 of the OSFP-XD gold finger connector 1'. The above pins can also be used to connect to the gold fingers of the OSFP gold finger connector 4, so that the electronic module 200 with the OSFP-XD gold finger connector 1' and the electronic module with the OSFP gold finger connector 4 can both operate normally.

[0060] It is worth noting that the insertion and removal direction Y is a linear direction, including the insertion direction Y1 and the removal direction Y2. The insertion direction is the direction toward the plug-in end of the gold finger connector on the circuit board 220, and the removal direction Y2 is the direction away from the plug-in end of the gold finger connector on the circuit board 220.

[0061] Continuing with Figures 5 and 6 , in one embodiment, the gold finger connector 1 has two ends along the plugging and unplugging direction, namely a first end 13 and a second end 14. The first end 13 is the end of the gold finger connector 1 along the plugging and unplugging direction, where the OSFP-XD gold finger connector board edge 15 is located. The second end 14 and the first end 13 are arranged sequentially along the insertion direction Y1. The first end 13 is used for insertion into the female connector 110 and is the plugging end. During insertion of the gold finger connector 1 into the female connector 110, the first end 13 of the gold finger connector 1 is inserted into the female connector 110 first, followed by the second end 14, or the second end 14 is not inserted into the female connector 110. The first row of gold fingers 121 and the second row of gold fingers 123 are arranged sequentially from the second end 14 toward the first end 13, or in other words, along the insertion direction Y1. The third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged sequentially from the second end 14 toward the first end 13, or in other words, along the insertion direction Y1. That is, the first row of gold fingers 121 is located on the inner side of the gold finger connector 1, and the first row of gold fingers 121 and the second row of gold fingers 123 are arranged from the inside to the outside. The third row of gold fingers 122 is located on the inner side of the gold finger connector 1, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged from the inside to the outside. When inserting the gold finger connector 1 into the female connector 110, the second row of gold fingers 123 and the fourth row of gold fingers 124 of the gold finger connector 1 are inserted into the female connector 110 first, and then the first row of gold fingers 121 and the third row of gold fingers 122 are inserted into the female connector 110.

[0062] FIG9 is a cross-sectional schematic diagram of a connection between a gold finger connector and a female connector according to an embodiment of the present application. As shown in FIG9 , in one embodiment, the pins of the female connector 110 include a first group of pins 5 and a second group of pins 6. The first group of pins 5 are arranged in a row along a first direction X, and the second group of pins 6 are arranged in a row along the first direction X. The first group of pins 5 and the second group of pins 6 are arranged in a plugging and unplugging direction. Specifically, the first group of pins 5 and the second group of pins 6 are arranged along a pull-out direction Y2. The first group of pins 5 are located within the female connector 110. With respect to the connection port 7 of the female connector 110, the first group of pins 5 are located away from the second group of pins 6. The second group of pins 6 include two opposing rows of pins, the two rows of which are respectively used to connect to the first row of gold fingers 121 and the third row of gold fingers 122. The first group of pins 5 include two opposing rows of pins, the two rows of which are respectively used to connect to the second row of gold fingers 123 and the fourth row of gold fingers 124.

[0063] As shown in Figure 9, when the gold finger connector 1 in the embodiment shown in Figure 6 is inserted into the female connector 110, the second row of gold fingers 123 and the fourth row of gold fingers 124 are inserted into the inner side of the female connector 110 and connected to the first group of pins 5 of the female connector 110; the first row of gold fingers 121 and the third row of gold fingers 122 are inserted into the part of the female connector 110 closer to the connection port 7 and connected to the second group of pins 6 of the female connector 110.

[0064] Figure 10 is a cross-sectional schematic diagram illustrating the connection between a gold finger connector and a female connector according to an embodiment of the present application. As shown in Figure 10 , when an OSFP gold finger connector 4 is inserted into the female connector 110 shown in Figure 9 , the gold fingers on both sides of the OSFP gold finger connector 4 connect with the second set of pins 6 . Therefore, the OSFP gold finger connector 4 does not penetrate the bottom of the female connector 110. No additional structure is required to extend the OSFP gold finger connector 4 toward the circuit board 220 (away from the OSFP gold finger connector board edge 45 ) into the female connector 110. In this solution, the length of the OSFP gold finger connector 4 inserted into the female connector 110 is the same as, or similar to, the length of the OSFP gold finger connector 4 inserted into the female connector 110 corresponding to the OSFP module 300. This eliminates the need to change the length of the circuit board 220 for the OSFP gold finger connector 4, thereby improving system compatibility.

[0065] Figure 11 is a schematic diagram of an expanded OSFP-XD gold finger connector according to an embodiment of the present application. As shown in Figure 11 , the bold dashed line in the figure indicates the direction 15 of the OSFP-XD gold finger connector board. Alternatively, Figure 11 is a schematic diagram of an expanded OSFP-XD gold finger connector board with the direction 15 as the broken line. In one embodiment, the first row of gold fingers 121 and the second row of gold fingers 123 are sequentially arranged along the direction from the first end 13 to the second end 14, i.e., along the removal direction Y2; the third row of gold fingers 122 and the fourth row of gold fingers 124 are sequentially arranged along the direction from the first end 13 to the second end 14, i.e., along the insertion direction Y1. Specifically, the first row of gold fingers 121 is located on the outside of the gold finger connector 1, with the first and second rows of gold fingers 121, 123 arranged from outside to inside; the third row of gold fingers 122 is located on the outside of the gold finger connector 1, with the third and fourth rows of gold fingers 122, 124 arranged from outside to inside. When inserting the gold finger connector 1 into the female connector 110 , the first row of gold fingers 121 and the third row of gold fingers 122 of the gold finger connector 1 are first inserted into the female connector 110 , and then the second row of gold fingers 123 and the fourth row of gold fingers 124 are inserted into the female connector 110 .

[0066] FIG12 is a cross-sectional schematic diagram of a connection between a gold finger connector and a female connector according to an embodiment of the present application. As shown in FIG12 , in one embodiment, the pins of the female connector 110 include a first group of pins 5 and a second group of pins 6. The first group of pins 5 are arranged in a row along a first direction X, and the second group of pins 6 are arranged in a row along the first direction X. The first group of pins 5 and the second group of pins 6 are arranged in a plugging and unplugging direction. Specifically, the first group of pins 5 and the second group of pins 6 are arranged along a pull-out direction Y2. The first group of pins 5 are located within the female connector 110. With respect to the connection port 7 of the female connector 110, the first group of pins 5 are located away from the second group of pins 6. The first group of pins 5 include two opposing rows of pins, each used to connect to the first row of gold fingers 121 and the third row of gold fingers 122, respectively. The second group of pins 6 include two opposing rows of pins, each used to connect to the second row of gold fingers 123 and the fourth row of gold fingers 124, respectively.

[0067] As shown in Figure 12, when the gold finger connector 1 in the embodiment shown in Figure 11 is inserted into the female connector 110, the first row of gold fingers 121 and the third row of gold fingers 122 are inserted into the inner side of the female connector 110 and connected to the first group of pins 5 of the female connector 110; the second row of gold fingers 123 and the fourth row of gold fingers 124 are inserted into the part of the female connector 110 closer to the connection port 7 and connected to the second group of pins 6 of the female connector 110.

[0068] Figure 13 is a cross-sectional schematic diagram of the connection between the gold finger connector and the female connector in an embodiment of the present application. As shown in Figure 13, when the OSFP gold finger connector 4 is inserted into the female connector 110 shown in Figure 12, the gold fingers on both side surfaces of the OSFP gold finger connector 4 are connected to the above-mentioned first group of pins 5. Then, the OSFP gold finger connector 4 can be inserted into the bottom of the female connector 110, which is convenient for positioning the gold fingers of the OSFP gold finger connector 4 and the first group of pins 5 of the female connector 110, which is beneficial to improving the connection reliability of the OSFP gold finger connector 4 and the female connector 110.

[0069] In a further embodiment, the circuit board 220 of the OSFP-XD gold finger connector 1' is 1 mm thick. Currently, the circuit board thickness of the OSFP gold finger connector 4 in the prior art is 1 mm. Therefore, the thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is the same as the thickness of the circuit board of the OSFP gold finger connector 4. This allows the opening height of the female connector 110 that mates with the OSFP-XD gold finger connector 1' to be highly aligned with the thickness of the circuit board of the OSFP gold finger connector 4. This allows the OSFP gold finger connector 4 to be inserted into the female connector 110 that mates with the OSFP-XD gold finger connector 1', thereby improving the connection tightness between the OSFP gold finger connector 4 and the female connector 110, thereby enhancing the signal transmission rate and quality.

[0070] Specifically, the thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is 1 mm, which means that the design value of the thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is 1 mm. In actual products, due to factors such as the manufacturing process, certain tolerances may occur, resulting in the actual thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' being slightly greater than 1 mm or slightly less than 1 mm.

[0071] FIG14 is a schematic diagram of a cross-sectional structure of a circuit board for an OSFP-XD gold finger connector according to an embodiment of the present application. As shown in FIG14 , in a specific embodiment, the circuit board 220 includes a conductive layer 113 and a dielectric layer 114, with a dielectric layer 114 located between any adjacent conductive layers 113. Specifically, the circuit board 220 includes 12 layers of conductive layers 113. Each of these conductive layers 113 can be used to form circuits for the circuit board 220. Because the circuit board 220 includes a large number of conductive layers 113, the conductive layers 113 used to form circuits have a larger area, providing more space for routing, thereby meeting the needs of the OSFP-XD gold finger connector 1′ to transmit a large number of signals. Furthermore, the number of circuits formed on the conductive layers 113 on both sides of the circuit board 220 can be relatively small, thereby leaving more space on both sides of the circuit board 220 for device layout, which helps simplify the manufacturing process of the electronic module 200.

[0072] In the embodiment of the present application, the conductive layer 113 and dielectric layer 114 of the circuit board 220 are both relatively thin. For example, 12 layers of conductive layer 113 can be achieved within a thickness range of 1 mm at a 100 ohm differential impedance. For example, the thickness of the conductive layer 113 can be greater than or equal to 10 μm, for example, the thickness of the conductive layer can be between 10 μm and 40 μm. Specifically, the thickness of the conductive layer 113 can include 12 μm, 15 μm, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, 32 μm, 35 μm, 38 μm, or 42 μm. The thickness of the dielectric layer 114 can be between 20 μm and 40 μm. For example, the thickness of the conductive layer can be between 10 μm and 40 μm. Specifically, the thickness of the dielectric layer 114 can include 12 μm, 15 μm, 18 μm, 20 μm, 23 μm, 25 μm, 27 μm, 30 μm, 33 μm, 35 μm, 38 μm, or 42 μm. The dielectric layer 114 of the circuit board 220 includes at least one adjustable dielectric layer 1141. The thickness of the adjustable dielectric layer 1141 can be adjusted based on the actual manufacturing process to control the overall thickness of the circuit board 220. For example, the thickness of the adjustable dielectric layer 1141 can be increased to 400 μm to increase the strength of the circuit board 220. The conductive layer 113 includes traces, which form the circuits of the circuit board 220. The width of the traces ranges from 20 μm to 40 μm. Specifically, the width of the traces can include 12 μm, 15 μm, 17 μm, 20 μm, 21 μm, 25 μm, 27 μm, 30 μm, 32 μm, 36 μm, 39 μm, or 45 μm. A thinner trace width helps reduce the area occupied by the traces and facilitates impedance control.

[0073] In a specific embodiment, the OSFP-XD gold finger connector 1' provided herein can be manufactured using a more advanced circuit board 220 processing process. For example, an optimized semi-additive process (mSAP) can be used to achieve thinner copper thickness and narrower line width, thereby making the dielectric thinner while maintaining the same impedance. This allows for more traces to be accommodated using a thinner board. FIG15 is a schematic diagram of a manufacturing process flow for an OSFP-XD gold finger connector according to an embodiment of the present application. As shown in FIG15 , in one embodiment, a circuit is first etched on the surface of a circuit board having a double-sided conductive layer. A dielectric layer 114 and a conductive layer 113 are then added to each side and laminated. Holes are drilled on both sides. A conductive layer is flash-plated inside and on the surface of the drilled holes, forming conductive holes 115. A photosensitive film 116 is added to the surface of the conductive layer 113 on both sides and exposed and developed to reveal the pattern to be electroplated. Electroplating is performed to thicken the conductive layer 113. The remaining photosensitive film 116 is removed. Micro-etching is then performed to remove the copper layer beneath the photosensitive film 116, forming a pattern on the surface of the conductive layer 113. Laminating the dielectric layer 114 and the conductive layer 113 on both sides, as well as subsequent steps, are repeated until a circuit board with an OSFP-XD gold finger connector 1' is formed.

[0074] Based on the same inventive concept, the present application also provides a signal transmission method for the above-mentioned electronic device. Specifically, the pins in the female connector of the electronic device include a first control pin, a second control pin, a point control pin, a fourth control pin, a first power pin and a second power pin, and the above-mentioned pins are respectively connected to the gold fingers of the gold finger connector. The above-mentioned signal transmission method specifically includes: the first control gold finger and the first control pin transmit a serial data signal; the second control gold finger and the second control pin transmit an interrupt request signal or a reset control signal; the third control gold finger and the third control pin transmit a clock signal; the fourth control gold finger and the fourth control pin transmit a low-power control signal or a module presence display signal or a reset control signal; the first power gold finger and the first power pin transmit a power signal; the second power gold finger and the second power pin also transmit a power signal. This signal transmission method can be used to transmit signals of OSFP-XD modules, and can also be used to transmit signals of OSFP modules.

[0075] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board, characterized in that: The gold finger connector is located at the edge of the circuit board, and the gold finger connector includes a plurality of gold fingers; The circuit board comprises a first surface and a second surface which are opposite to each other, and the gold finger connector comprises a first row of gold fingers and a second row of gold fingers arranged on the first surface, and a third row of gold fingers and a fourth row of gold fingers arranged on the second surface; wherein the first row of gold fingers and the second row of gold fingers are arranged along the plugging and unplugging direction of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged along the plugging and unplugging direction of the gold finger connector; The first row of gold fingers includes a first control gold finger, a second control gold finger and two first power gold fingers, the first control gold finger is used to transmit a serial data signal, the second control gold finger is used to transmit an interrupt request signal or a reset control signal, and the two first power gold fingers are arranged between the first control gold finger and the second control gold finger; The third row of gold fingers includes a third control gold finger, a fourth control gold finger and two second power gold fingers, the third control gold finger is used to transmit a clock signal, the fourth control gold finger is used to transmit a low power control signal or a module in place display signal or a reset control signal; the two second power gold fingers are arranged between the third control gold finger and the fourth control gold finger; The thickness of the circuit board is 0.9 mm to 1.1 mm.

2. The circuit board according to claim 1, characterized in that The first row of gold fingers includes four pairs of gold fingers for sending data signals and four pairs of gold fingers for receiving data signals, the four pairs of gold fingers for sending data signals of the first row of gold fingers are sequentially arranged on a side of the first control gold finger away from the second control gold finger, and the four pairs of gold fingers for receiving data signals of the first row of gold fingers are sequentially arranged on a side of the second control gold finger away from the first control gold finger; The second row of gold fingers also includes four pairs of gold fingers for sending data signals and four pairs of gold fingers for receiving data signals. The four pairs of gold fingers for sending data signals of the second row of gold fingers are sequentially arranged on a side of the third control gold finger away from the fourth control gold finger, and the four pairs of gold fingers for receiving data signals of the first row of gold fingers are sequentially arranged on a side of the fourth control gold finger away from the third control gold finger.

3. The circuit board according to claim 1 or 2, characterized in that: The first row of gold fingers and the second row of gold fingers are arranged in a direction away from the plugging end of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged in a direction away from the plugging end of the gold finger connector.

4. The circuit board according to claim 1 or 2, characterized in that: The first row of gold fingers and the second row of gold fingers are arranged in a direction close to the plug-in end of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged in a direction close to the plug-in end of the gold finger connector.

5. The circuit board according to any one of claims 1 to 4, characterized in that: The thickness of the circuit board is 1 mm.

6. The circuit board according to any one of claims 1 to 5, characterized in that: The circuit board includes a conductive layer and a dielectric layer, and the dielectric layer is provided between any adjacent conductive layers; the circuit board includes 12 conductive layers.

7. The circuit board according to claim 6, characterized in that: The thickness of the conductive layer is in the range of 10um to 40um.

8. The circuit board according to claim 6 or 7, characterized in that: The conductive layer includes wiring, the wiring forms the circuit, and the width of the wiring is 20um to 40um.

9. The circuit board according to any one of claims 6 to 8, characterized in that: The thickness of the dielectric layer is 20um to 40um.

10. An electronic module, characterized in that: The invention comprises a housing, an electronic device and a circuit board as claimed in any one of claims 1 to 9, wherein the electronic device is arranged on the circuit board and connected to the circuit of the circuit board, and the circuit board is installed on the housing.

11. An electronic device, characterized in that: It comprises an electronic component and the electronic module as claimed in claim 10, wherein the electronic component comprises a female connector, and the gold finger connector of the electronic module is plugged into the female connector.

12. A signal transmission method for an electronic device, characterized in that: Using the electronic device as claimed in claim 11 to transmit a signal, the female connector includes a first control pin, a second control pin, a point control pin, a fourth control pin, a first power pin and a second power pin, and the method specifically includes: The first control golden finger transmits a serial data signal with the first control pin; The second control golden finger transmits an interrupt request signal or a reset control signal to the second control pin; The third control golden finger transmits a clock signal to the third control pin; The fourth control golden finger transmits a low power consumption control signal or a module presence display signal or a reset control signal to the fourth control pin; The first power gold finger and the first power pin transmit a power signal; The second power gold finger and the second power pin also transmit power signals.

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