Optical packaging chip and manufacturing method therefor, and electronic device

Abstract

An optical packaging chip and a manufacturing method therefor, and an electronic device. The optical packaging chip comprises: a packaging substrate; a plurality of dies, provided on one side of the packaging substrate and comprising at least one photosensitive die; a colloidal structure, connected to the packaging substrate and the sides of the plurality of bare chips away from the packaging substrate and comprising a light-transmitting portion covering the at least one photosensitive die; and a light-transmitting shielding plate, connected to the side of the colloidal structure away from the packaging substrate and grounded. According to the optical packaging chip and the manufacturing method therefor, the signal-to-noise ratio of the optical packaging chip can be improved.

Description

Optical packaging chip and manufacturing method thereof, and electronic equipment

[0001] This application claims priority to the Chinese invention patent application with application date of November 3, 2023, application number "202311459858X", and patent name "Optical packaging chip and its manufacturing method, electronic device", all contents of which are hereby incorporated by reference. Technical Field

[0002] The present disclosure relates to the field of chip technology, and in particular to an optical packaging chip, a manufacturing method thereof, and an electronic device. Background Art

[0003] Packaging is the process of assembling integrated circuits into final chip products. Simply put, it is to fix the produced bare chips (also known as bare chips or dies, referring to unpackaged chips) on a packaging substrate and lead out the pins, and then package them into a whole.

[0004] With the development of the consumer electronics industry, the display modules of mobile communication devices have entered the era of full-screen displays. The overall transmittance of the screen is getting lower and lower. The optical packaging chip (optical chip for short) located behind the screen also urgently needs to make continuous design improvements in performance.

[0005] How to improve the signal-to-noise ratio of optical packaging chips is a technical problem that needs to be urgently solved by those skilled in the art.

[0006] Summary of the Invention

[0007] The present disclosure provides an optical packaging chip and a manufacturing method thereof, and an electronic device, so as to improve the signal-to-noise ratio of the optical packaging chip.

[0008] According to one aspect of the present disclosure, an optical packaging chip is provided, comprising: a packaging substrate; a plurality of bare chips, arranged on one side of the packaging substrate, the plurality of bare chips including at least one photosensitive bare chip; a colloid structure, connected to the packaging substrate and a side of the plurality of bare chips facing away from the packaging substrate, the colloid structure including a light-transmitting portion covering at least one photosensitive bare chip; and a light-transmitting shielding plate, connected to a side of the colloid structure facing away from the packaging substrate and grounded.

[0009] In some embodiments, the colloid structure includes a first glue layer and a second glue layer arranged in sequence along a direction away from the packaging substrate, wherein the first glue layer exposes at least one photosensitive bare chip; the second glue layer is a light-transmitting glue layer and serves as a light-transmitting part, and the transmittance of the second glue layer is greater than the transmittance of the first glue layer.

[0010] In some embodiments, the first adhesive layer is a light shielding adhesive layer; and / or, the material of the first adhesive layer includes bottom filling adhesive.

[0011] In some embodiments, the thickness of the light-transmitting shielding plate ranges from 180 micrometers to 220 micrometers, and the thickness of the second adhesive layer ranges from 40 micrometers to 60 micrometers.

[0012] In some embodiments, at least two bare chips among the plurality of bare chips are stacked, wherein the packaging substrate and the adjacent bare chips among the plurality of bare chips, and the adjacent bare chips among the at least two bare chips are connected via a third adhesive layer.

[0013] In some embodiments, the transmittance of the third adhesive layer is less than the transmittance of the second adhesive layer; and / or, the materials of the second adhesive layer and the third adhesive layer include chip bonding adhesive.

[0014] In some embodiments, the optical packaging chip further includes a support structure, which supports and connects between the packaging substrate and the light-transmitting shielding plate.

[0015] In some embodiments, the package substrate is provided with a first ground circuit; the support structure is a conductive support structure, and the light-transmitting shielding plate is electrically connected to the first ground circuit of the package substrate via the conductive support structure.

[0016] In some embodiments, the conductive support structure includes a solder layer, a conductive support layer, and a conductive adhesive layer sequentially arranged in a direction away from the package substrate.

[0017] In some embodiments, the conductive support layer is a printed circuit board; and / or the thickness of the conductive adhesive layer is in a range of 95 micrometers to 105 micrometers.

[0018] In some embodiments, the light-transmitting shielding plate includes a transparent substrate, a transparent conductive layer, and an insulating layer sequentially arranged in a direction close to the packaging substrate, wherein the insulating layer has no overlap with the orthographic projection of the conductive support structure on the packaging substrate.

[0019] In some embodiments, the number of the support structures is at least two and they are distributed at the edge of the package substrate.

[0020] In some embodiments, the packaging substrate is provided with a first ground circuit; at least one bare chip among the multiple bare chips is provided with a second ground circuit electrically connected to the first ground circuit; the optical packaging chip also includes a conductive connection structure, which is provided between one of the at least one bare chip and the light-transmitting shielding plate and electrically connects the light-transmitting shielding plate to the second ground circuit of one of the bare chips.

[0021] In some embodiments, the material of the conductive connection structure includes at least one of conductive foam or conductive silver paste.

[0022] In some embodiments, the optical packaging chip further includes: a plurality of connecting wires electrically connecting the packaging substrate with at least one bare chip among the plurality of bare chips, and / or electrically connecting at least two bare chips among the plurality of bare chips, and the plurality of connecting wires are embedded in the colloid structure.

[0023] In some embodiments, an edge of an orthographic projection of the light-transmitting shielding plate on the packaging substrate is located inside an edge of the packaging substrate and has a distance therebetween from the edge of the packaging substrate.

[0024] In some embodiments, the light-transmitting shielding plate includes a transparent substrate, a transparent conductive layer, and an insulating layer arranged in sequence along a direction close to the packaging substrate, wherein the material of the transparent substrate includes glass or transparent resin; and / or the material of the transparent conductive layer includes at least one of indium tin oxide, indium zinc oxide, or nanosilver.

[0025] According to one aspect of the present disclosure, a method for manufacturing an optical packaging chip is provided, comprising:

[0026] Providing a packaging substrate, and fixing a plurality of bare chips on one side of the packaging substrate, wherein the plurality of bare chips include at least one photosensitive bare chip; and

[0027] A light-transmitting shielding plate is provided, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of multiple bare chips facing away from the packaging substrate through a colloid structure, and the light-transmitting shielding plate is grounded, wherein the colloid structure includes a light-transmitting portion covering at least one photosensitive bare chip.

[0028] In some embodiments, the colloid structure includes a first adhesive layer and a second adhesive layer, wherein the second adhesive layer is a light-transmitting adhesive layer and serves as a light-transmitting portion, and the transmittance of the second adhesive layer is greater than the transmittance of the first adhesive layer. The light-transmitting shielding plate is bonded to the packaging substrate and the sides of the plurality of bare chips facing away from the packaging substrate via the colloid structure, including:

[0029] forming a softened second adhesive layer on a side of the light-transmitting shielding plate facing the packaging substrate and used to cover at least one photosensitive bare chip;

[0030] Aligning the light-transmitting shielding plate with the packaging substrate, and bonding the second adhesive layer to at least one photosensitive bare chip;

[0031] Filling a first adhesive layer between the light-transmitting shielding plate and the packaging substrate; and

[0032] The first adhesive layer and the second adhesive layer are cured.

[0033] In some embodiments, the packaging substrate is provided with a first grounding circuit, and the manufacturing method further includes: before bonding the light-transmitting shielding plate to the packaging substrate and the side of the plurality of bare chips facing away from the packaging substrate through a colloidal structure, forming a conductive support structure on one side of the packaging substrate for electrically connecting the light-transmitting shielding plate to the first grounding circuit.

[0034] In some embodiments, forming a conductive support structure on one side of the package substrate includes: sequentially forming a solder layer, a conductive support layer, and a conductive adhesive layer on one side of the package substrate.

[0035] In some embodiments, the light-transmitting shielding plate is manufactured by the following method:

[0036] Providing a transparent substrate, and sequentially forming a transparent conductive layer and an insulating layer on one side of the transparent substrate, wherein the insulating layer has a window region, and the window region exposes a region of the transparent conductive layer for electrical connection to the conductive support structure; and

[0037] The transparent conductive layer exposed in the window area is surface treated to improve its conductive performance and / or anti-oxidation performance.

[0038] According to one aspect of the present disclosure, an electronic device is provided, comprising the optical packaging chip according to any one of the aforementioned embodiments.

[0039] In some embodiments, the electronic device further includes a display screen, and the optical packaging chip is located on the back side of the display screen.

[0040] According to one or more embodiments of the present disclosure, a light-transmitting shielding plate is bonded to one side of the packaging substrate and multiple bare chips through a colloidal structure. The light-transmitting shielding plate is grounded and can effectively reduce the electromagnetic interference caused by certain sources in the external environment to the optical packaging chip, thereby improving the signal-to-noise ratio of the optical packaging chip and further improving its performance.

[0041] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings illustrate exemplary embodiments and constitute a part of the specification. Together with the description of the specification, they serve to explain exemplary implementation of the embodiments. The illustrated embodiments are for illustrative purposes only and do not limit the scope of the claims. Throughout the drawings, the same reference numerals designate similar, but not necessarily identical, elements.

[0043] FIG1A shows a schematic top view of an optical package chip according to some embodiments of the present disclosure;

[0044] FIG1B shows a schematic cross-sectional structure diagram of an optical package chip according to some embodiments of the present disclosure at the PP position of FIG1A ;

[0045] FIG2 is a schematic diagram showing a top view of an optical package chip according to some embodiments of the present disclosure;

[0046] FIG3A shows a schematic top view of an optical package chip according to some embodiments of the present disclosure;

[0047] FIG3B shows a schematic cross-sectional structure diagram of an optical package chip according to some embodiments of the present disclosure at QQ in FIG3A ;

[0048] FIG4 shows a schematic top view of an optical package chip according to some embodiments of the present disclosure;

[0049] FIG5 is a schematic diagram showing a process of a method for manufacturing an optical package chip according to some embodiments of the present disclosure; and

[0050] FIG6 is a schematic diagram showing a prefabricated conductive support structure on a package substrate sheet in some embodiments of the present disclosure.

[0051] Figure markings: 100-optical packaging chip; 20-packaging substrate; 21-bare chip; 211-photosensitive bare chip; 22-colloid structure; 220-light-transmitting part; 221-first glue layer; 21a-first bare chip; 21b-second bare chip; 21c-third bare chip; 222-second glue layer; 23-light-transmitting shielding plate; 231-transparent substrate; 232-transparent conductive layer; 201-pad area; 233-insulating layer; 230-window area; 24-third glue layer; 25-support structure; 26-conductive connection structure; 250-prefabricated conductive support structure; 251-solder layer; 252-conductive support layer; 253-conductive glue layer; 27-connecting line; 200-packaging substrate sheet; 200c-cutting track; 500-manufacturing method. DETAILED DESCRIPTION

[0052] The following description of exemplary embodiments of the present disclosure is made in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be appreciated by those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0053] In this disclosure, unless otherwise specified, the use of terms such as "first" and "second" to describe various elements is not intended to limit the positional relationship, temporal relationship, or importance relationship of these elements. Such terms are only used to distinguish one element from another. In some examples, the first element and the second element may refer to the same instance of the element, while in some cases, based on the context of the description, they may also refer to different instances.

[0054] The terms used in the descriptions of various examples in this disclosure are for the purpose of describing specific examples only and are not intended to be limiting. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the element may be one or more. In addition, the term "and / or" used in this disclosure encompasses any one and all possible combinations of the listed items.

[0055] In related technologies, the optical packaging chips of some electronic devices have poor performance due to electromagnetic interference from the screen or the external environment. In particular, as the overall transmittance of the screen of electronic devices is designed to be lower and lower due to the needs of energy saving, the performance of the optical packaging chips of electronic devices is facing severe challenges, and their design difficulty and manufacturing cost are constantly increasing.

[0056] How to improve the signal-to-noise ratio (SNR) of optical packaging chips, thereby enhancing their performance, is a technical problem that needs to be urgently addressed by those skilled in the art. In the electronics industry, SNR refers to the ratio of signal to noise in an electronic device or electronic system.

[0057] Based on this, the embodiments of the present disclosure provide an optical packaging chip and a manufacturing method thereof, and an electronic device to improve the signal-to-noise ratio of the optical packaging chip.

[0058] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0059] As shown in Figures 1A and 1B, some embodiments of the present disclosure provide an optical packaging chip 100, comprising a packaging substrate 20, a plurality of bare chips 21, a colloid structure 22, and a light-transmitting shielding plate 23. The plurality of bare chips 21 are disposed on one side of the packaging substrate 20 and include at least one photosensitive bare chip 211. The colloid structure 22 is connected to the packaging substrate 20 and the plurality of bare chips 21 on a side facing away from the packaging substrate 20, and includes a light-transmitting portion 220 covering the at least one photosensitive bare chip 211. The light-transmitting shielding plate 23 is connected to the side of the colloid structure 22 facing away from the packaging substrate 20 and is grounded.

[0060] In the disclosed embodiments, the optical packaging chip 100 has no limitation on the product function type. In some embodiments, the optical packaging chip 100 may have at least one of distance sensing, light intensity sensing, and color temperature sensing, and may also have a logic operation function. Multiple bare chips 21 are used to support the optical packaging chip 100 in achieving the corresponding functions.

[0061] The embodiments of the present disclosure do not specifically limit the number of bare chips 21 included in the optical packaging chip 100, the arrangement of the bare chips 21, and the functions of each bare chip 21. Referring to Figures 1A and 1B, in some embodiments of the present disclosure, the optical packaging chip 100 includes three bare chips 21, namely a first bare chip 21a having a logic operation function, a second bare chip 21b having a distance sensing function, and a third bare chip 21c having a light intensity sensing function and a color temperature sensing function, wherein the second bare chip 21b and the third bare chip 21c are photosensitive bare chips 211, and the first bare chip 21a and the second bare chip 21b are stacked, that is, arranged adjacent to each other along the thickness direction of the optical packaging chip 100.

[0062] Since the light-transmitting shielding plate 23 and the light-transmitting portion 220 of the colloid structure 22 are light-transmitting, light can pass through the light-transmitting shielding plate 23 and the light-transmitting portion 220 and be sensed by the photosensitive bare chip 211 .

[0063] In the embodiment of the present disclosure, the packaging substrate 20 can be a hard packaging substrate or a flexible packaging substrate, which is provided with a circuit structure for supporting the functional implementation of the optical packaging chip 100. In addition, the packaging substrate 20 can also be provided with a first grounding circuit (the grounding circuit is also called a grounding network, not shown in the figure) for providing grounding protection for the optical packaging chip 100.

[0064] The optical packaging chip 100 of the embodiment of the present disclosure has a light-transmitting shielding plate 23 bonded to one side of the packaging substrate 20 and the plurality of bare chips 21 via a colloidal structure 22. The light-transmitting shielding plate 23 is grounded and can effectively reduce electromagnetic interference caused by certain sources in the external environment to the optical packaging chip 100, thereby improving the signal-to-noise ratio of the optical packaging chip 100 and further enhancing its performance. For example, when the optical packaging chip 100 is located on the back side of a display screen, the light-transmitting shielding plate 23 of the optical packaging chip 100 can effectively reduce the electromagnetic interference caused by the display screen to the optical packaging chip 100, thereby improving the signal-to-noise ratio of the optical packaging chip 100. In addition, compared to providing a shielding structure outside the optical packaging chip 100, the design scheme of the embodiment of the present disclosure is also conducive to reducing equipment costs and reducing the difficulty of product performance testing.

[0065] In some embodiments of the present disclosure, the transmittance of the light-transmitting shielding plate may be designed to be greater than 95%.

[0066] As shown in FIG. 1B , in some embodiments of the present disclosure, the structure of the light-transmitting shielding plate 23 may include a transparent substrate 231 , a transparent conductive layer 232 , and an insulating layer 233 sequentially arranged in a direction close to the package substrate 20 .

[0067] The material of the transparent substrate 231 may include, but is not limited to, glass or transparent resin. The material of the transparent conductive layer 232 may include, but is not limited to, at least one of indium tin oxide, indium zinc oxide, or nanosilver. The transparent conductive layer 232 may be formed on the surface of the transparent substrate 231 via a sputtering process. The insulating layer 233 can reduce the risk of short circuits in the transparent conductive layer 232 while also effectively protecting the transparent conductive layer 232 and improving the adhesion and dyne value (dyne value is dynes / cm, which is used to express the magnitude of surface tension) between the light-transmitting shielding plate 23 and the colloidal structure 22.

[0068] As shown in Figures 1A and 1B, in some embodiments of the present disclosure, the optical packaging chip 100 also includes a plurality of connecting wires 27, which electrically connect the packaging substrate 20 with at least one bare chip 21 among the multiple bare chips 21, and / or electrically connect at least two bare chips 21 among the multiple bare chips 21, and the plurality of connecting wires 27 are embedded in the above-mentioned colloidal structure 22.

[0069] The connecting wires 27 are used to establish circuit connections between the package substrate 20 and the plurality of bare chips 21. As shown in Figures 1A and 1B, the ends of some connecting wires 27 can be connected to the bare chips 21 and the package substrate 20 via solder pads, and the ends of some connecting wires 27 can be connected to two bare chips 21 via solder pads. In the disclosed embodiment, the plurality of connecting wires 27 are embedded in the colloid structure 22, thereby being protected by the colloid structure 22 and reducing the possibility of damage.

[0070] In some embodiments of the present disclosure, electrical connections between a bare chip and a package substrate, or between a bare chip and another stacked bare chip, may be achieved through welding or surface mounting processes instead of connecting wires.

[0071] In the embodiments of the present disclosure, the specific structural form of the colloid structure 22 is not limited and can be a single-layer or multi-layer structure. As shown in Figures 1A and 1B, in some embodiments of the present disclosure, the colloid structure 22 includes a first adhesive layer 221 and a second adhesive layer 222 arranged in sequence along a direction away from the packaging substrate 20, wherein the first adhesive layer 221 exposes the at least one photosensitive bare chip 211, and the second adhesive layer 222 is a light-transmitting adhesive layer and covers the at least one photosensitive bare chip 211. The second adhesive layer 222 serves as the light-transmitting portion 220 of the colloid structure 22, and the transmittance of the second adhesive layer 222 is greater than the transmittance of the first adhesive layer 221.

[0072] In this embodiment, since the first adhesive layer 221 exposes the photosensitive bare chip 211, the second adhesive layer 222 is a transparent adhesive layer and covers the photosensitive bare chip 211. The second adhesive layer 222 has a higher transmittance than the first adhesive layer 221. In this way, the photosensitivity of the photosensitive bare chip 211 can be improved, thereby improving the performance of the optical packaging chip 100.

[0073] In some embodiments, the first adhesive layer 221 can be designed as a light-shielding adhesive layer, such as a black light-shielding adhesive layer, so as to effectively block stray light, reduce the impact of stray light on the photosensitive bare chip 211, and further improve the photosensitivity of the photosensitive bare chip 211 in the optical packaging chip 100.

[0074] In some embodiments, the material of first adhesive layer 221 includes underfill glue (also known as underfill glue), which can be formed using underfill technology. Underfill technology uses capillary action to penetrate a filler material, such as epoxy resin, into the bottom of the package, filling the solder gap at the bottom of the package, and finally curing it to form a complete underfill body. Underfill glue protects solder joints and reduces stress damage to the package, significantly improving the mechanical strength of the solder joints and the service life of the package.

[0075] In some embodiments, the material of the second adhesive layer 222 includes die attach film (DAF). Die attach film is a widely used adhesive material in electronic packaging processes. It softens and solidifies, and has excellent thermal conductivity, enabling rapid heat transfer to the surrounding environment and maintaining tight adhesion to components or substrates. In some embodiments, during the fabrication process of the optical packaging chip 100, the softened second adhesive layer 222 can be pre-attached to the surface of the light-transmitting shielding plate 23 facing the packaging substrate 20.

[0076] In some embodiments of the present disclosure, the coverage area of ​​the second adhesive layer 222 can be determined in combination with the lamination tolerance of the second adhesive layer 222 on the light-transmitting shielding plate 23 and the processing tolerance thereof. While ensuring that the second adhesive layer 222 can cover the at least one photosensitive bare chip 211, its coverage area can be minimized, thereby maximizing the distribution area of ​​the first adhesive layer 221. This helps further improve the reliability and performance of the optical packaging chip 100.

[0077] As shown in FIG1B , in some embodiments of the present disclosure, at least two bare chips 21 (such as the first bare chip 21a and the second bare chip 21b) among the multiple bare chips 21 are stacked, wherein the packaging substrate 20 and the adjacent bare chips 21, as well as the adjacent bare chips 21 stacked, are connected by a third adhesive layer 24. The stacking arrangement of some bare chips 21 (such as the first bare chip 21a and the second bare chip 21b) among the multiple bare chips 21 is conducive to thinning the overall thickness of the optical packaging chip 100. It can be understood that when the photosensitive bare chip 211 (such as the second bare chip 21b) is stacked with the non-photosensitive bare chip (such as the first bare chip 21a), in order to support the functional realization of the photosensitive bare chip 211, the photosensitive bare chip 211 is usually arranged at the top layer of the stacking structure.

[0078] In some embodiments, based on the aforementioned advantages and applications of chip adhesive, chip adhesive can also be used for the third adhesive layer 24. Since there is no requirement for the transmittance of the third adhesive layer 24, the transmittance of the third adhesive layer 24 can be designed to be lower than that of the second adhesive layer 222, thereby allowing the use of cheaper materials and reducing production costs.

[0079] In some embodiments of the present disclosure, the thickness of the light-transmitting shielding plate 23 is designed to be in the range of 180 μm to 220 μm, and the thickness of the second adhesive layer 222 is designed to be in the range of 40 μm to 60 μm, or 45 μm to 55 μm. The thickness of the second adhesive layer 222 is designed to be as small as possible, which is beneficial to improving its transmittance and also helps to reduce the overall thickness of the optical package chip 100.

[0080] 1A and 1B , in some embodiments of the present disclosure, the optical package chip 100 further includes a support structure 25 that supports and connects between the package substrate 20 and the light-transmitting shielding plate 23. The support structure 25 facilitates maintaining the spacing between the light-transmitting shielding plate 23 and the package substrate 20 within a target design range.

[0081] The number of support structures 25 can be one or more. As shown in FIG2 , in some embodiments, the number of support structures 25 is at least two (four as shown in the figure) and distributed at the edge of the package substrate 20 to achieve a more stable spacing support effect.

[0082] In some embodiments of the present disclosure, the grounding scheme for the light-transmitting shielding plate 23 is designed as follows: the package substrate 20 is provided with a first grounding circuit (not shown), and the support structure 25 is designed as a conductive support structure. The light-transmitting shielding plate 23 is electrically connected to the first grounding circuit of the package substrate 20 via the conductive support structure. In this way, the conductive support structure not only provides a spacer support effect but also provides a circuit conductive path for grounding the light-transmitting shielding plate 23.

[0083] In some embodiments, the number of the conductive support structures is at least two. This not only provides a more stable spacing support effect, but also enables the grounding of the light-transmitting shielding plate 23 to be more reliable, thereby making the performance of the optical packaging chip 100 more reliable.

[0084] The specific structural form of the conductive support structure is not limited. In some embodiments, the conductive support structure can be made of metal.

[0085] As shown in FIG. 1B , in some embodiments of the present disclosure, the conductive support structure adopts a multi-layer structure design, including a solder layer 251 , a conductive support layer 252 , and a conductive adhesive layer 253 sequentially arranged in a direction away from the package substrate 20 .

[0086] The solder layer 251 may be made of solder paste, which is mainly formed by mixing solder powder, flux, surfactant, thixotropic agent, etc.

[0087] The conductive support layer 252 can be a printed circuit board, and can be formed on the package substrate 20 using surface mount technology (SMT) using a solder layer 251. The conductive structure design of the printed circuit board itself (e.g., copper layers are provided on the upper and lower surfaces of the printed circuit board, and the upper and lower copper layers are electrically connected through a via structure) facilitates the electrical connection between the solder layer 251 and the conductive adhesive layer 253, thereby achieving an electrical connection between the light-transmitting shielding plate 23 and the first ground circuit of the package substrate 20. In some embodiments, the first adhesive layer 221 is made of underfill glue, and the conductive support layer 252 is made of a printed circuit board. Compared with conductive support layers made of other metal materials, the difference in thermal expansion coefficient between the printed circuit board and the underfill glue is smaller, so cracking caused by thermal expansion of the two can be reduced, thereby facilitating improved structural reliability.

[0088] Conductive adhesive layer 253 can be made of conductive silver paste. Conductive silver paste is an adhesive that exhibits certain conductive properties after curing or drying. It is primarily composed of a resin matrix, conductive particles, dispersing additives, and auxiliary agents. In some embodiments of the present disclosure, the thickness of conductive adhesive layer 253 ranges from 95 microns to 105 microns, which can partially absorb the thickness tolerance of the light-transmitting shielding plate 23 and the conductive support layer 252, thereby more easily meeting process precision requirements.

[0089] As shown in Figures 1A and 1B, in some embodiments, a certain distance is provided between the conductive support structure and the adjacent bare chip 21, and between the conductive support structure and the adjacent pad area 201 on the packaging substrate 20. This facilitates the manufacture of the conductive support structure on the packaging substrate 20 and facilitates the binding of the connecting wire 27 to the pad.

[0090] As shown in Figure 1B, in some embodiments of the present disclosure, the light-transmitting shielding plate 23 includes a transparent substrate 231, a transparent conductive layer 232 and an insulating layer 233 arranged in sequence along a direction close to the packaging substrate 20, wherein the insulating layer 233 has no overlap with the positive projection of the conductive support structure on the packaging substrate 20, that is, the insulating layer 233 has a window area 230 exposing the transparent conductive layer 232, so that the transparent conductive layer 232 can be electrically connected to the conductive support structure, and then electrically connected to the first ground circuit of the packaging substrate 20.

[0091] In some embodiments, the transparent conductive layer 232 exposed in the window area 230 can be surface treated to improve its conductivity and / or antioxidant properties. The surface treatment can be, for example, dry treatment, wet treatment, or coating. Dry treatment, for example, involves cleaning the surface of the transparent conductive layer 232 with ionized gas plasma to remove surface contamination and improve its surface morphology. Wet treatment, for example, involves bonding new groups to the surface of the transparent conductive layer 232 with an organic solvent to achieve the purpose of modifying its surface. Coating treatment, for example, involves coating the surface of the transparent conductive layer 232 with a metal film layer having better conductivity.

[0092] In some embodiments of the present disclosure, as shown in Figures 3A and 3B, the grounding scheme of the light-transmitting shielding plate 23 can also be designed as follows: the packaging substrate 20 is provided with a first grounding circuit (not shown in the figure), and at least one bare chip 21 among the multiple bare chips 21 is provided with a second grounding circuit (not shown in the figure) electrically connected to the first grounding circuit. The optical packaging chip 100 also includes a conductive connection structure 26, which is provided between one of the at least one bare chip 21 and the light-transmitting shielding plate 23 and electrically connects the light-transmitting shielding plate 23 to the second grounding circuit of one of the bare chips 21.

[0093] The material of the conductive connection structure 26 is not limited, and for example, may include at least one of conductive foam or conductive silver paste.

[0094] In this embodiment, the light-transmitting shielding plate 23 is electrically connected to the second grounding circuit of the bare chip 21 via the conductive connection structure 26, and further electrically connected to the first grounding circuit of the package substrate 20 via the second grounding circuit. This embodiment provides another design solution for achieving grounding of the light-transmitting shielding plate 23. According to this design solution, the optical package chip 100 may or may not be provided with the aforementioned support structure 25 (such as a conductive support structure).

[0095] The grounding scheme design of the light-transmitting shielding plate 23 disclosed herein is not limited to the above-described embodiment. In some embodiments of the present disclosure, the light-transmitting shielding plate can also be grounded through a structure other than the package substrate. For example, the light-transmitting shielding plate is directly electrically connected to a grounding circuit outside the package substrate via a wire.

[0096] As shown in FIG. 4 , in some embodiments of the present disclosure, the edge of the orthographic projection of the light-transmitting shielding plate 23 on the packaging substrate 20 is located inside the edge of the packaging substrate 20 and has a distance therebetween.

[0097] During production of the optical package chip 100, the structures of the optical package chips 100 are typically batch-fabricated on a single package substrate sheet, and then cut into individual optical package chips 100. In this embodiment, the light-transmitting shielding plate 23 is dimensionally reduced relative to the edge of the package substrate 20. This prevents the light-transmitting shielding plate 23 from being cut during the cutting process, thereby reducing the difficulty of the cutting process and minimizing damage to the light-transmitting shielding plate 23.

[0098] The design of the optical packaging chip 100 in the above-described embodiment of the present disclosure not only achieves the aforementioned effect of improving the signal-to-noise ratio, but also allows the optical packaging chip 100 to have a relatively thin thickness as a whole, thereby making the optical packaging chip 100 applicable to a wider range of application scenarios. For example, when the optical packaging chip 100 adopts the cross-sectional structure shown in FIG. 1B , some design parameters of the optical packaging chip 100 can be referred to as shown in Table 1 below.

[0099] Table 1. Partial design parameters of optical packaging chips disclosed in some embodiments

[0100] As shown in FIG5 , the embodiment of the present disclosure further provides a method 500 for manufacturing an optical packaging chip. The manufacturing method 500 includes the following steps S501 and S502 .

[0101] In step S501 , a packaging substrate is provided, and a plurality of bare chips are fixed on one side of the packaging substrate, wherein the plurality of bare chips include at least one photosensitive bare chip.

[0102] In step S502, a light-transmitting shielding plate is provided, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of the plurality of bare chips facing away from the packaging substrate through a colloidal structure, and the light-transmitting shielding plate is grounded, wherein the colloidal structure includes a light-transmitting portion covering at least one photosensitive bare chip.

[0103] The optical packaging chip manufactured using the method of the embodiment of the present disclosure has a light-transmitting shielding plate that can effectively reduce electromagnetic interference caused by certain sources in the external environment to the optical packaging chip, so that the optical packaging chip has a higher signal-to-noise ratio and better performance.

[0104] In some embodiments of the present disclosure, the colloid structure includes a first adhesive layer and a second adhesive layer, wherein the second adhesive layer is a light-transmitting adhesive layer and serves as the light-transmitting portion of the colloid structure, and the transmittance of the second adhesive layer is greater than the transmittance of the first adhesive layer. In this design, the aforementioned step S502 may include the following sub-steps 1 to 4.

[0105] In sub-step one, a softened second adhesive layer for covering at least one photosensitive bare chip is formed on a side of the light-transmitting shielding plate facing the packaging substrate.

[0106] In sub-step 2, the light-transmitting shielding plate is aligned with the packaging substrate, and the second adhesive layer is bonded to at least one photosensitive bare chip.

[0107] In sub-step three, a first adhesive layer is filled between the light-transmitting shielding plate and the packaging substrate.

[0108] In sub-step 4, the first adhesive layer and the second adhesive layer are cured. Curing methods include but are not limited to light curing or heat curing.

[0109] In some embodiments, the material of the second adhesive layer includes chip bonding glue, and the material of the first adhesive layer includes bottom filling glue. In sub-step one, the softened second adhesive layer can be pre-bonded on the light-transmitting shielding plate, and then in sub-step two, the light-transmitting shielding plate and the packaging substrate are aligned so that the second adhesive layer is bonded to the aforementioned at least one photosensitive bare chip. This not only reduces the difficulty of the process, but also improves the alignment accuracy of the second adhesive layer and the aforementioned at least one photosensitive bare chip. Since the second adhesive layer has a higher transmittance than the first adhesive layer, it is beneficial to improve the photosensitivity of the photosensitive bare chip, thereby improving the performance of the optical packaging chip. In some embodiments, the first adhesive layer adopts a light-shielding adhesive layer to block stray light, thereby reducing the impact of stray light on the photosensitive bare chip and improving the photosensitivity of the photosensitive bare chip.

[0110] In some embodiments of the present disclosure, the packaging substrate is provided with a first grounding circuit. The above-mentioned manufacturing method 500 may further include: before step S502, forming a conductive support structure on one side of the packaging substrate for electrically connecting the light-transmitting shielding plate to the first grounding circuit.

[0111] The conductive support structure not only provides spacing and support between the package substrate and the light-transmitting shielding plate, but also provides a circuit conductive path for grounding the light-transmitting shielding plate. In some embodiments, there are at least two conductive support structures, which not only provides a more stable spacing and support effect, but also ensures more reliable grounding of the light-transmitting shielding plate, thereby enhancing the performance of the optical package chip.

[0112] In some embodiments of the present disclosure, the conductive support structure formed on one side of the package substrate includes: sequentially forming a solder layer, a conductive support layer, and a conductive adhesive layer on one side of the package substrate. The solder layer can be made of solder paste, the conductive support layer can be made of a printed circuit board, and the conductive adhesive layer can be made of conductive silver adhesive. In some embodiments, the material of the first adhesive layer includes an underfill. Since the difference in thermal expansion coefficient between the printed circuit board and the underfill is smaller, cracking caused by thermal expansion of the two can be reduced, thereby improving the reliability of the structure.

[0113] In some embodiments of the present disclosure, the light-transmitting shielding plate may be prefabricated by the following method:

[0114] Providing a transparent substrate, and sequentially forming a transparent conductive layer and an insulating layer on one side of the transparent substrate, wherein the insulating layer has a window region, the window region exposing a region of the transparent conductive layer for electrical connection to the conductive support structure; and

[0115] The transparent conductive layer exposed in the window area is surface treated to improve its conductivity and / or antioxidant properties. This surface treatment can be, for example, dry treatment, wet treatment, or coating. Surface treatment of the transparent conductive layer exposed in the window area helps improve the reliability of the grounding of the light-transmitting shielding plate, thereby further improving the performance of the optical package chip.

[0116] When producing optical packaging chips, multiple optical packaging chip layer structures are usually produced in batches on a packaging substrate sheet (as shown in Figure 6), and then individual optical packaging chips are formed by cutting. In some embodiments of the present disclosure, the production process of the optical packaging chip is as follows:

[0117] Provide a packaging substrate sheet → make solder layers and conductive support layers of conductive support structures corresponding to each optical packaging chip on the packaging substrate sheet → fix multiple bare chips corresponding to each optical packaging chip on the packaging substrate sheet → fix multiple connecting wires corresponding to each optical packaging chip on the packaging substrate sheet → make conductive adhesive layers of conductive support structures corresponding to each optical packaging chip on the packaging substrate sheet, and the conductive adhesive layer is in a softened state in this step → provide a light-transmitting shielding plate sheet, and attach second adhesive layers corresponding to each optical packaging chip on the light-transmitting shielding plate sheet, and the second adhesive layer is in a softened state in this step → align the light-transmitting shielding plate sheet with the packaging substrate sheet, and bond the second adhesive layer to the corresponding photosensitive bare chip → fill the first adhesive layer between the light-transmitting shielding plate sheet and the packaging substrate sheet → cure the first adhesive layer and the second adhesive layer → cut the overall structure that completes the above steps (cutting methods include but are not limited to laser cutting) to obtain multiple optical packaging chips.

[0118] As shown in FIG6 , in some embodiments, during mass production of optical packaging chips, a prefabricated conductive support structure 250 can be fabricated on a packaging substrate 200 for each optical packaging chip fabrication region S. This prefabricated conductive support structure 250 extends beyond the optical packaging chip fabrication region S. When the overall structure comprising the packaging substrate 200 and the light-transmitting shielding plate is cut, the portion of the prefabricated conductive support structure 250 that extends beyond the optical packaging chip fabrication region S is simultaneously removed, as shown in the cutting path 200 c, thereby obtaining the conductive support structure in the final product form. This embodiment facilitates the fabrication of the conductive support structure, improves its fabrication accuracy, and reduces the difficulty of cutting.

[0119] In some embodiments, the optical packaging chip is designed such that the orthographic projection edge of the light-transmitting shielding plate on the packaging substrate is located inboard of the edge of the packaging substrate, with a gap between the edges. If this design is employed for optical packaging chips, mass production can be performed without using the aforementioned light-transmitting shielding plate. Instead, a light-transmitting shielding plate can be provided for each optical packaging chip, each of which is aligned and bonded to a corresponding area on the packaging substrate. This prevents the light-transmitting shielding plate from being cut during the cutting process, thereby simplifying the cutting process and minimizing damage to the light-transmitting shielding plate.

[0120] The present disclosure also provides an electronic device, including the optical packaging chip of any of the aforementioned embodiments. The electronic device may be any type of device, such as a mobile phone, tablet computer, display, smart wearable device, etc.

[0121] Due to the improved signal-to-noise ratio and performance of the optical packaged chip, the electronic devices also have better performance.

[0122] In some embodiments, the electronic device includes a display screen, and the optical package chip is located on the back side of the display screen. The shielding scheme design of the optical package chip can effectively reduce electromagnetic interference from the display screen or other interference sources, thereby improving the performance of the electronic device.

[0123] Although the embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it should be understood that the above-mentioned methods, systems and devices are merely exemplary embodiments or examples, and the scope of the present invention is not limited by these embodiments or examples, but is only limited by the claims after authorization and their equivalents. Various elements in the embodiments or examples may be omitted or replaced by their equivalents. In addition, the steps may be performed in an order different from that described in this disclosure. Further, the various elements in the embodiments or examples may be combined in various ways. It is important that as technology evolves, many of the elements described herein may be replaced by equivalent elements that appear after this disclosure.

Claims

1. An optical packaging chip, characterized in that: The optical packaging chip comprises: Package substrate; A plurality of bare chips are disposed on one side of the packaging substrate, wherein the plurality of bare chips include at least one photosensitive bare chip; a colloid structure connected to the packaging substrate and a side of the plurality of bare chips away from the packaging substrate, the colloid structure comprising a light-transmitting portion covering the at least one photosensitive bare chip; and The light-transmitting shielding plate is connected to a side of the colloid structure away from the packaging substrate and is grounded.

2. The optical packaging chip according to claim 1, characterized in that: The colloid structure includes a first glue layer and a second glue layer sequentially arranged in a direction away from the packaging substrate, wherein: The first adhesive layer exposes the at least one photosensitive bare chip; The second adhesive layer is a light-transmitting adhesive layer and serves as the light-transmitting portion, and the transmittance of the second adhesive layer is greater than the transmittance of the first adhesive layer.

3. The optical packaging chip according to claim 2, characterized in that: The first adhesive layer is a light-shielding adhesive layer; and / or The material of the first adhesive layer includes bottom filling adhesive.

4. The optical packaging chip according to claim 2, characterized in that: The thickness of the light-transmitting shielding plate ranges from 180 micrometers to 220 micrometers; and / or The thickness of the second adhesive layer ranges from 40 micrometers to 60 micrometers.

5. The optical packaging chip according to claim 2, characterized in that: At least two of the plurality of bare chips are stacked, wherein the packaging substrate and the bare chips adjacent to it among the plurality of bare chips, and the bare chips adjacent to each other among the at least two bare chips are connected via a third adhesive layer.

6. The optical packaging chip according to claim 5, characterized in that: The transmittance of the third adhesive layer is less than the transmittance of the second adhesive layer; and / or The materials of the second adhesive layer and the third adhesive layer include chip bonding adhesive.

7. The optical packaging chip according to claim 1, characterized in that: The optical packaging chip further includes a supporting structure, which supports and is connected between the packaging substrate and the light-transmitting shielding plate.

8. The optical packaging chip according to claim 7, characterized in that: The packaging substrate is provided with a first grounding circuit; The support structure is a conductive support structure, and the light-transmitting shielding plate is electrically connected to the first grounding circuit of the packaging substrate through the conductive support structure.

9. The optical packaging chip according to claim 8, characterized in that: The conductive support structure comprises a solder layer, a conductive support layer and a conductive adhesive layer which are sequentially arranged in a direction away from the packaging substrate.

10. The optical packaging chip according to claim 9, characterized in that: The conductive support layer is a printed circuit board; and / or The thickness of the conductive adhesive layer ranges from 95 microns to 105 microns.

11. The optical packaging chip according to claim 8, characterized in that: The light-transmitting shielding plate comprises a transparent substrate, a transparent conductive layer and an insulating layer which are sequentially arranged in a direction close to the packaging substrate, wherein the insulating layer has no overlap with the orthographic projection of the conductive support structure on the packaging substrate.

12. The optical packaging chip according to claim 7, characterized in that: The number of the supporting structures is at least two and they are distributed at the edge of the packaging substrate.

13. The optical packaging chip according to claim 1, characterized in that: The packaging substrate is provided with a first grounding circuit; At least one bare chip among the plurality of bare chips is provided with a second ground circuit electrically connected to the first ground circuit; The optical packaging chip also includes a conductive connection structure, which is provided between one of the at least one bare chip and the light-transmitting shielding plate and electrically connects the light-transmitting shielding plate to the second grounding circuit of the one of the bare chips.

14. The optical packaging chip according to claim 13, characterized in that: The material of the conductive connection structure includes at least one of conductive foam and conductive silver paste.

15. The optical packaging chip according to claim 1, characterized in that: The optical packaging chip also includes: A plurality of connection lines electrically connect the packaging substrate with at least one of the plurality of bare chips and / or electrically connect at least two of the plurality of bare chips, and the plurality of connection lines are embedded in the colloid structure.

16. The optical packaging chip according to claim 1, characterized in that: The edge of the orthographic projection of the light-transmitting shielding plate on the packaging substrate is located inside the edge of the packaging substrate and has a gap between the edge of the packaging substrate and the light-transmitting shielding plate.

17. The optical packaging chip according to any one of claims 1 to 16, characterized in that: The light-transmitting shielding plate comprises a transparent substrate, a transparent conductive layer and an insulating layer which are sequentially arranged in a direction close to the packaging substrate, wherein: The material of the transparent substrate includes glass or transparent resin; and / or The material of the transparent conductive layer includes at least one of indium tin oxide, indium zinc oxide, or nano silver.

18. A method for manufacturing an optical packaging chip, characterized in that: The production method comprises: Providing a packaging substrate, and fixing a plurality of bare chips on one side of the packaging substrate, wherein the plurality of bare chips include at least one photosensitive bare chip; and A light-transmitting shielding plate is provided, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of the multiple bare chips facing away from the packaging substrate through a colloid structure, and the light-transmitting shielding plate is grounded, wherein the colloid structure includes a light-transmitting portion covering the at least one photosensitive bare chip.

19. The manufacturing method according to claim 18, characterized in that: The colloid structure includes a first glue layer and a second glue layer, wherein the second glue layer is a light-transmitting glue layer and serves as the light-transmitting portion, and the transmittance of the second glue layer is greater than the transmittance of the first glue layer, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of the plurality of bare chips away from the packaging substrate through the colloid structure, including: forming a softened second adhesive layer on a side of the light-transmitting shielding plate facing the packaging substrate and used to cover the at least one photosensitive bare chip; Aligning the light-transmitting shielding plate with the packaging substrate, and bonding the second adhesive layer with the at least one photosensitive bare chip; Filling a first adhesive layer between the light-transmitting shielding plate and the packaging substrate; and The first adhesive layer and the second adhesive layer are cured.

20. The manufacturing method according to claim 18, characterized in that: The packaging substrate is provided with a first grounding circuit, and the manufacturing method further includes: Before bonding the light-transmitting shielding plate to the packaging substrate and the plurality of bare chips on a side away from the packaging substrate through a colloid structure, a conductive support structure for electrically connecting the light-transmitting shielding plate to the first grounding circuit is formed on one side of the packaging substrate.

21. The manufacturing method according to claim 20, characterized in that: The conductive support structure is formed on one side of the packaging substrate, comprising: A solder layer, a conductive support layer and a conductive adhesive layer are sequentially formed on one side of the packaging substrate.

22. The method according to claim 20, characterized in that: The light-transmitting shielding plate is manufactured by the following method: Providing a transparent substrate, and sequentially forming a transparent conductive layer and an insulating layer on one side of the transparent substrate, wherein the insulating layer has a window area, and the window area exposes an area of ​​the transparent conductive layer for being electrically connected to the conductive support structure; and The transparent conductive layer exposed in the window area is subjected to surface treatment to improve its conductive property and / or anti-oxidation property.

23. An electronic device, characterized in that: The electronic device comprises: An optical package chip according to any one of claims 1 to 17.

24. The electronic device according to claim 23, characterized in that: The electronic device further comprises a display screen, and the optical packaging chip is located on the back side of the display screen.

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