Semiconductor device manufacturing system and method

Abstract

This semiconductor device manufacturing system comprises: a curing device for irradiating a semiconductor device including a base layer formed of an energy ray-curable resin composition with an energy ray to cure the base layer; and an ink marking device that applies an ink on the base layer to make an identity determination mark for determining the identity of the semiconductor. The curing device and the ink marking device are in-line.

Description

Semiconductor device manufacturing system and manufacturing method

[0001] The present invention relates to a method and system for manufacturing a semiconductor device.

[0002] In the field of semiconductor devices, the distribution of counterfeit products has become a problem. Therefore, there is a demand for a technology that can determine the identity of a semiconductor device. To determine the identity, it is conceivable to attach a unique mark (hereinafter referred to as an identity determination mark) to the semiconductor device in advance.

[0003] In relation to the above, Patent Document 1 (JP 2007-242973 A) describes a semiconductor device having a structure in which a semiconductor circuit is sealed with a sealing resin, the semiconductor device having a semiconductor circuit and a sealing resin with a mottled pattern on at least the surface that differs for each individual device.

[0004] Japanese Patent Application Laid-Open No. 2007-242973

[0005] Semiconductor devices are typically mass-produced. Therefore, high production efficiency is required. Even when a configuration in which an identity determination mark is attached is adopted, it would be advantageous if production efficiency could be improved. Furthermore, there is a demand in the market for unmanned production processes to address labor shortages and to ensure that semiconductor device production does not stop even when a sufficient number of operators cannot be secured due to a sudden change in social conditions such as an infectious disease outbreak.

[0006] Therefore, an object of the present invention is to provide a technology that can improve productivity by increasing production efficiency for semiconductor devices that have been given identity determination marks, or by contributing to the automation of the production process.

[0007] In one aspect, a semiconductor device manufacturing system according to the present invention includes a curing device that irradiates a semiconductor device including an underlayer formed from an energy ray-curable resin composition with energy rays to cure the underlayer, and an ink marking device that applies an identity determination mark using ink onto the underlayer to determine the identity of the semiconductor device. The curing device and the ink marking device are in-line.

[0008] In another aspect, a method for manufacturing a semiconductor device according to the present invention includes a curing step of irradiating a semiconductor device including an underlayer formed from an energy ray-curable resin composition with energy rays to cure the underlayer, and an ink marking step of applying an identity determination mark, which is used to determine the identity of the semiconductor device, to the underlayer using ink. The curing step and the ink marking step are performed inline.

[0009] According to the present invention, a technology is provided that can improve productivity by increasing production efficiency for semiconductor devices to which identity determination marks are attached or by contributing to the automation of production processes.

[0010] Fig. 1 is a schematic diagram showing a semiconductor device according to an embodiment. Fig. 2 is an enlarged view of an example of an identity determination mark. Fig. 3 is a schematic diagram showing a semiconductor device manufacturing system. Fig. 4 is a schematic diagram showing ink landing positions.

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0012] (1) Semiconductor Device Fig. 1 is a schematic diagram showing a semiconductor device 1 according to this embodiment. The semiconductor device 1 has a semiconductor substrate 2 and an underlayer 3 provided on the semiconductor substrate 2. The underlayer 3 contains a cured resin. An identity determination mark 4 is provided on the underlayer 3.

[0013] FIG. 2 is an enlarged view of an example of an identity determination mark 4. The identity determination mark 4 is a mark made with ink and is used to determine whether the semiconductor device 1 is the same as the genuine product. Marks made with ink have random shapes, at least when observed under magnification. When ink is supplied onto a substrate, the supplied ink wets and spreads to a certain extent on the substrate. This wetting and spreading method is random. Therefore, even if marks have the same shape when viewed visually, when observed under magnification, the shapes of the marks are different for each mark.

[0014] The randomness of this identity determination mark 4 is used to determine identity. For example, during the manufacture of the semiconductor device 1, an enlarged image of the identity determination mark 4 is acquired in advance, and the image is saved. When it is desired to verify whether a semiconductor device 1 distributed in the market is identical to an authentic product, an enlarged image of the identity determination mark 4 of the distributed product is acquired. Then, the image of the distributed product is compared with the pre-stored authentic product data as the product data to be determined. This determines whether the distributed product is identical to the authentic product. Note that the authentic product data and the product data to be determined may be image data itself, but are not necessarily image data itself. For example, the authentic product data and the product data to be determined may be data indicating feature amounts extracted from image data.

[0015] There is no particular limitation on the size of the identity determination mark 4. For example, the dimension (maximum length) of the identity determination mark is 0.3 to 5 mm, and preferably 0.5 to 2.0 mm.

[0016] Furthermore, the identity determination mark 4 may have some information such as a lot number when observed visually, or may not have any meaning. In other words, the identity determination using the identity determination mark 4 is determined not by the identification symbol that the mark constitutes, but by comparing information obtained from the unique image of the mark of the genuine product with information obtained from the image of the mark of the product to be determined.

[0017] (2) Semiconductor Device Manufacturing System, Manufacturing Method, and Identity Determination Method Next, a manufacturing system used to manufacture the above-described semiconductor device 1 will be described. Fig. 3 is a schematic diagram showing an example of a semiconductor device manufacturing system 20 (hereinafter, sometimes simply referred to as the manufacturing system 20) according to this embodiment. As shown in Fig. 3, this manufacturing system 20 includes a conveying device 24, a base layer forming device 21, a curing device 22, an ink marking device 23, an imaging device 25, and a feature amount calculating device 26.

[0018] The transport device 24 is configured to transport the semiconductor substrate 2. The base layer forming device 21 is configured to form a base layer 3 on the transported semiconductor substrate 2. The curing device 22 is configured to harden the base layer 3. The ink marking device 23 is configured to apply an identity determination mark 4 on the base layer 3 with ink. The imaging device 25 is configured to capture an image of the identity determination mark 4. The feature calculation device 26 is configured to extract feature amounts for identifying the identity determination mark 4 from image data of the captured identity determination mark 4.

[0019] Here, at least the curing device 22 and the ink marking device 23 are in-line. In the example shown in Fig. 3, in addition to the curing device 22 and the ink marking device 23, the base layer forming device 21 and the imaging device 25 are also in-line.

[0020] In this specification, "inlined" means that a plurality of devices are configured so that a plurality of processes are automatically and continuously performed by the plurality of devices on a large number of semiconductor substrates 2. Preferably, in each inline device, one process is performed on one semiconductor substrate 2 at a time. In this embodiment, a plurality of processes are continuously performed by the plurality of devices on each semiconductor substrate 2. Furthermore, each device processes a plurality of semiconductor substrates 2 in sequence. Specifically, in this embodiment, a conveying device 24 conveys a plurality of semiconductor substrates 2 in sequence. While being conveyed by the conveying device 24, each semiconductor substrate 2 is continuously processed by the base layer forming device 21, the curing device 22, the ink marking device 23, and the imaging device 25, in that order.

[0021] As described above, the curing device 22 and the ink marking device 23 are in-line, which can improve production efficiency.

[0022] The reason why the curing device 22 and the ink marking device 23 can be configured in-line in this embodiment is that the base layer 3 is formed of an energy ray-curable resin composition. If the resin composition forming the base layer 3 were a thermosetting resin composition, a long period of heat treatment (e.g., 30 minutes or more) would be required to cure the base layer 3. However, because the treatment by the ink marking device 23 is completed within a few minutes, there would be a large gap between the treatment time by the curing device 22 and the treatment time by the ink marking device 23. In this case, if the curing device 22 were configured in-line, the semiconductor device 1 processed by the curing device 22 would have to wait for the long treatment time by the curing device 22 before being transported to the ink marking device 23, which would be impractical. In contrast, if the base layer 3 is formed of an energy ray-curable resin composition, the time required for the curing treatment is short. The energy ray irradiation time required to cure the base layer 3 is, for example, approximately 3 to 90 seconds. Therefore, the gap between the processing time by the curing device 22 and the processing time by the ink marking device 23 can be reduced, and the curing device 22 can be integrated into an in-line system together with the ink marking device 23 and other devices, thereby improving production efficiency.

[0023] Furthermore, by using the above-described manufacturing system 20, the identity determination marks 4 are applied with ink after the underlayer 3 has hardened, so that the randomness of the identity determination marks 4 can be increased.

[0024] Specifically, according to the findings of the present inventors, the contact angle of ink with respect to the underlayer 3 before curing is larger than the contact angle of ink with respect to the underlayer 3 after curing. In other words, if ink is supplied onto the underlayer 3 before curing, the ink will not easily fit onto the surface of the underlayer 3. In other words, the ink will not easily wet and spread on the underlayer 3. In contrast, according to this embodiment, the ink is supplied after the underlayer 3 has cured, so the ink will easily fit onto the surface of the underlayer 3 and will easily wet and spread on the underlayer 3. The ink wets and spreads randomly. Therefore, by performing ink marking after the underlayer 3 has cured, it is possible to obtain an identity determination mark with high randomness, as shown in FIG. 2 .

[0025] The above is an outline of this embodiment. Next, the operation method of the manufacturing system 20 will be explained, and the function and configuration of each device will be described in detail.

[0026] (Step S1) Formation of Underlayer When manufacturing the semiconductor device 1, first, as shown in FIG. 3A, the semiconductor substrate 2 is prepared and transported by the transport device 24. The semiconductor substrate 2 to be processed is, for example, a semiconductor wafer after backside grinding. The backside is the surface of the semiconductor substrate 2 opposite to the circuit-forming surface.

[0027] 3(b), an underlayer forming device 21 forms an underlayer 3 on the semiconductor substrate 2. The underlayer 3 may be any layer that can serve as a base for the identity determination mark 4. In this embodiment, the underlayer 3 is a resin layer (rear surface resin layer) provided on the rear surface of the semiconductor substrate 2.

[0028] As described above, the underlayer 3 is formed from an energy ray-curable resin composition. For example, a film for forming an underlayer (a film for a back surface resin layer) made of the energy ray-curable resin composition is laminated onto the back surface of the semiconductor substrate 2. This allows the underlayer 3 to be formed. That is, the underlayer forming device 21 can be a laminator.

[0029] The detailed composition of the underlayer 3 will be described later with an example.

[0030] (Step S2) Hardening of Underlayer After the underlayer 3 is formed, the underlayer 3 is hardened by a hardening device 22, as shown in Fig. 3(c) . Specifically, the hardening device 22 is configured to irradiate the underlayer 3 with energy rays. This hardens the underlayer 3.

[0031] (Step S3) Ink Marking Next, as shown in Fig. 3(d), an ink marking device 23 is used to apply an identity determination mark 4 onto the base layer 3. The identity determination mark 4 is formed from ink. That is, the identity determination mark 4 is formed by applying ink onto the base layer 3.

[0032] The ink marking device 23 may be, for example, an inkjet device or a gravure coating device.

[0033] However, among these, an inkjet device is preferable. When an inkjet device is used, a plurality of ink droplets are sprayed onto the underlayer 3, as shown in Fig. 3(d).

[0034] FIG. 4 is a schematic diagram showing a preferred example of ink landing positions when an inkjet device is used. As shown in FIG. 4, ink is preferably supplied onto the underlayer 3 so that multiple ink droplets land at positions spaced apart from one another. As described above, the landed ink spreads randomly. As a result, at least one of the supplied ink droplets joins with an adjacent droplet after landing. That is, even if the ink dots are spaced apart from one another as shown in FIG. 4, an identity determination mark 4 having a random shape as shown in FIG. 2 is ultimately obtained. In this embodiment, the ink landing positions are orderly and lack randomness, so it is highly necessary to obtain randomness due to the wetting and spreading of the ink droplets.

[0035] More preferably, the ink is supplied so that the number of ink continua (shapes independent from other inks) contained in the identity determination mark 4 is 0.5 to 50%, preferably 1 to 10%, of the number of ink droplets supplied, which is 100%.

[0036] On the other hand, if all of the ink droplets supplied are continuous, it may be difficult to obtain randomness. Therefore, it is preferable that the number of ink continuum in the identity determination mark 4 is at least two or more.

[0037] Preferably, curable ink is used as the ink. The ink may be a heat-curable ink or an energy ray-curable ink. Preferably, energy ray-curable ink is used as the ink. More preferably, UV-curable ink is used as the ink.

[0038] When curable ink is used, the identity determination mark 4 is preferably cured after the ink is applied. In other words, the ink marking device 23 is preferably also provided with a curing function for curing the applied ink after the ink is applied.

[0039] (Step S4) Imaging Next, as shown in FIG. 3( e), the identity determination mark 4 is imaged by the imaging device 25. The imaging device 25 is equipped with a microscope. That is, the imaging device 25 captures an enlarged image. The size of the imaged area is not particularly limited. Preferably, an area of ​​a size that allows for distinguishing differences in shape resulting from differences in the way the ink spreads when wet is imaged is imaged. For example, the size of the imaged area is a size that includes an area with one side measuring 10 to 1000 μm.

[0040] The microscope included in the imaging device 25 is typically an optical microscope. When an optical microscope is used, the magnification during imaging is, for example, 20 to 500 times.

[0041] (Step S5) Calculation of Feature Amounts Image data of the identity determination mark obtained by the imaging device 25 is sent to the feature amount calculation device 26. That is, the feature amount calculation device 26 is communicably connected to the imaging device 25. The feature amount calculation device 26 is realized by, for example, a computer. The feature amount calculation device 26 is configured to calculate feature amounts from the acquired image data. The calculated feature amount is, for example, a feature amount that reflects differences in the shape of the identity determination mark due to differences in how the ink spreads. The calculated feature amount is stored, for example, in a server (not shown) as authenticity data indicating the identity determination mark of an authentic product.

[0042] (Dicing, etc.) Thereafter, necessary processing is performed to obtain the semiconductor device 1. Although not shown in the drawings, for example, a dicing process is performed on the semiconductor substrate 2. In the dicing process, the semiconductor substrate 2 is placed on a dicing sheet. The semiconductor substrate 2 is attached to the dicing sheet, for example, with the underlayer 3 facing the dicing sheet. In other words, the identity determination mark 4 is attached to the dicing sheet so that it is in contact with the dicing sheet. Then, the semiconductor substrate 2 is diced using a blade. This forms multiple semiconductor chips.

[0043] After dicing, each semiconductor chip (i.e., semiconductor device) is picked up from the dicing sheet.

[0044] After being picked up, reliability tests and the like are carried out as necessary. After undergoing reliability tests and the like, the semiconductor chips are distributed in the market as semiconductor devices.

[0045] After a semiconductor device is distributed in the market, if it is desired to verify whether the distributed semiconductor device is genuine, an image of the identity determination mark of the distributed product (the product to be judged) is taken. The identity determination mark of the distributed product is imaged through a microscope, just like the genuine product. Then, feature amounts are calculated as product data to be judged from data showing an enlarged image of the identity determination mark of the distributed product, and the calculated feature amounts are compared with pre-generated genuine product data, and it is determined whether the distributed product is identical to the genuine product based on the comparison result.

[0046] The above is the operation method of the semiconductor device manufacturing system according to this embodiment. As described above, according to this embodiment, the curing device 22 is inline, which can improve production efficiency and contribute to unmanned production processes. Furthermore, according to this embodiment, the identity determination marks 4 are formed on the cured base layer 3 using ink, which can improve the randomness of the identity determination marks 4.

[0047] (3) Others In the present embodiment, the manufacturing system 20 includes the conveying device 24, and the semiconductor substrate 2 is conveyed by the conveying device 24. However, the semiconductor substrate 2 does not necessarily need to be conveyed by the conveying device 24. For example, the position of the semiconductor substrate 2 may be fixed, and the positions of the devices (the base layer forming device 21, the curing device 22, the ink marking device 23, and the imaging device 25) may be moved. That is, instead of the conveying device 24, the manufacturing system 20 may include a moving device configured to move the base layer forming device 21 to the imaging device 25 in order above the semiconductor substrate 2. Even when such a configuration is adopted, the curing device 22 and other devices can be inlined.

[0048] In this embodiment, steps S1 to S4 are performed in-line, but steps S1 and S4 do not necessarily have to be performed in-line. However, if the curing of the base layer (step S2) is performed offline, it is also impossible to perform the base layer formation (step S1) and the ink marking (step S3) in-line. Therefore, by performing step S2 in-line, steps S1 to S3 can be performed in-line. In other words, the base layer forming device, the curing device, and the ink marking device can be performed in-line, which greatly improves productivity.

[0049] In this embodiment, the ink marking (step S3) is performed after the curing of the base layer (step S2) (see FIG. 3 , etc.). By adopting this order, as described above, an identity determination mark 4 with high randomness can be obtained. However, the order of the curing of the base layer (step S2) and the ink marking (step S3) is not necessarily limited. For example, the ink marking (step S3) may be performed before the curing of the base layer 3 (step S2). That is, the ink marking device 23 may be located upstream of the curing device 22. Even in this case, it is possible to inline the curing device 22 and the ink marking device 23, which has a certain effect in terms of improving productivity. In this case, if step S2 is offline, it is also impossible to inline steps S3 and S4. Therefore, by inline-processing step S2, steps S3, S2, and S4 can be inlined. That is, the ink marking device, the curing device, and the imaging device can be inlined, which significantly improves productivity.

[0050] Note that if the ink marking (step S3) is performed after the hardening of the base layer (step S2), the randomness of the identity determination marks 4 will be increased, but the fixation of the identity determination marks 4 may be reduced. Therefore, the annealing step may be performed at any stage after the ink marking (step S3). By performing the annealing step, the fixation of the identity determination marks 4 can be improved.

[0051] On the other hand, if the ink marking (step S3) is performed before the curing of the underlayer (step S2), sufficient fixation can be obtained without performing the annealing step.

[0052] In this embodiment, the ink landing positions are orderly, while the random wetting and spreading of the ink creates randomness in the shape of the identity determination mark 4. However, it is also possible to create randomness in the shape of the identity determination mark 4 by randomizing the ink landing positions, for example, by using means such as reducing the size of the ink droplets ejected from the inkjet device.

[0053] In this embodiment, as shown in FIG. 3, the manufacturing system 20 has been described as having a feature calculation device 26. That is, the description has been given of a case in which feature values ​​calculated from image data are used when comparing genuine product data with data on the product to be judged. However, feature values ​​do not necessarily need to be used when determining identity. For example, the image data acquired by the imaging device 25 may itself be stored on a server or the like as genuine product data. Then, when determining identity, the image data may be compared to determine whether the product to be judged is identical to the genuine product. In this case, the manufacturing system 20 does not need the feature calculation device 26.

[0054] In this embodiment, the case where the base layer 3 is a back surface resin layer formed on the back surface of the semiconductor substrate 2 has been described. However, the base layer 3 is not limited to a back surface resin layer. For example, the base layer 3 may be an encapsulating resin layer used as a so-called encapsulating resin.

[0055] On the other hand, preferably, the base layer 3 is a back surface resin layer as described in the above embodiment. More preferably, the back surface resin layer is a resin layer formed by laminating a base layer-forming film (back surface resin layer film). Below, the back surface resin layer will be described in detail for the case where the base layer 3 is a back surface resin layer formed from a back surface resin layer film.

[0056] (4) Underlayer (rear surface resin layer) The thickness of the rear surface resin layer is not particularly limited, but is, for example, 1 to 100 μm, preferably 5 to 50 μm.

[0057] The composition of the energy ray-curable resin composition constituting the film for the back surface resin layer is not particularly limited. For example, the energy ray-curable resin composition contains an energy ray-curable component. The energy ray-curable resin composition may further contain a binder polymer component.

[0058] The energy ray-curable component can be, for example, a low molecular weight compound that contains an energy ray-polymerizable group such as an acryloyl group, a methacryloyl group, or a vinyl group and that polymerizes and hardens upon irradiation with energy rays. Examples of the energy ray-curable component include low molecular weight compounds that have at least one polymerizable bond in the molecule. The low molecular weight compound can have a weight average molecular weight of, for example, about 100 to 30,000, and preferably about 300 to 10,000.

[0059] The binder polymer component is blended for the purpose of making it easier to maintain the film shape of the back surface resin layer, etc. Examples of the binder polymer component that can be used include acrylic resin, polyester resin, urethane resin, acrylic urethane resin, silicone resin, and rubber-based polymer.

[0060] The energy ray-curable resin composition may contain other additives as needed, such as a colorant, a photopolymerization initiator, a coupling agent, and an inorganic filler.

[0061] [Addendum] Representative aspects of the present invention are summarized below as appendices.

[0062] (Appendix 1) A semiconductor device manufacturing system comprising: a curing device 22 that irradiates energy rays onto a semiconductor device 1 including an underlayer 3 formed from an energy ray-curable resin composition to cure the underlayer; and an ink marking device 23 that applies an identity determination mark 4 using ink onto the underlayer 3, which is used to determine the identity of the semiconductor device, wherein the curing device 22 and the ink marking device 23 are in-line.

[0063] (Appendix 2) A manufacturing system for a semiconductor device as described in Appendix 1, wherein the identity determination mark 4 is a mark used in an identity determination method, and the identity determination method includes a step of determining whether the product to be determined is identical to the genuine product by comparing information obtained from an image of the identity determination mark of a genuine semiconductor device with information obtained from an image of the identity determination mark of the semiconductor device to be determined.

[0064] (Appendix 3) A manufacturing system for a semiconductor device according to appendix 1 or 2, wherein the semiconductor device 1 further includes a semiconductor substrate 2, and the base layer is formed on the semiconductor substrate 2, and the manufacturing system 20 for a semiconductor device further includes an base layer forming device 21 that forms the base layer 3 on the semiconductor substrate 2, and the base layer forming device 21, the curing device 22, and the ink marking device 23 are inlined.

[0065] (Appendix 4) A semiconductor device manufacturing system according to Appendix 3, wherein the base layer forming device 21 is configured to form the base layer 3 by laminating a base layer forming film made of an energy ray-curable resin composition onto the rear surface of the semiconductor substrate 2.

[0066] (Appendix 5) A semiconductor device manufacturing system according to any one of claims 1 to 4, further comprising an imaging device 25 for imaging the identity determination mark, wherein the ink marking device 23, the curing device 22, and the imaging device 25 are inline.

[0067] (Appendix 6) A semiconductor device manufacturing system according to appendix 1 or 2, further comprising an imaging device 25 that images the identity determination mark, and a feature calculation device 26 that calculates feature amounts from the image captured by the imaging device 25, wherein the curing device 22, the ink marking device 23, the imaging device 25, and the feature calculation device 26 are inlined.

[0068] (Appendix 7) A semiconductor device manufacturing system according to any one of Appendices 1 to 6, wherein the ink marking device 23 is configured to apply an identity determination mark 4 onto the base layer 3 hardened by the curing device 22.

[0069] (Appendix 8) A method for manufacturing a semiconductor device, comprising: a curing step (S2) of irradiating a semiconductor device including an underlayer formed from an energy ray-curable resin composition with energy rays to cure the underlayer; and an ink marking step (S3) of applying an identity determination mark, which is used to determine the identity of the semiconductor device, onto the underlayer using ink, wherein the curing step (S2) and the ink marking step (S3) are performed in-line.

[0070] (Citation by Reference) This application claims priority based on Japanese Patent Application No. 2023-185889 (filing date: October 30, 2023) and Japanese Patent Application No. 2023-185890 (filing date: October 30, 2023), the contents of which are incorporated herein by reference.

[0071] 1... semiconductor device, 2... semiconductor substrate, 3... underlayer, 4... identity determination mark, 20... semiconductor device manufacturing system, 21... underlayer forming device, 22... curing device, 23... ink marking device, 24... conveying device, 25... imaging device, 26... feature amount calculation device

Claims

1. A semiconductor device manufacturing system comprising: a curing device that irradiates a semiconductor device including an underlayer formed from an energy ray curable resin composition with energy rays to cure the underlayer; and an ink marking device that applies an identity determination mark using ink onto the underlayer, the identity being used to determine the identity of the semiconductor device, wherein the curing device and the ink marking device are in-line.

2. A manufacturing system for semiconductor devices as described in claim 1, wherein the identity determination mark is a mark used in an identity determination method, and the identity determination method includes a step of determining whether the product to be judged is identical to the genuine product by comparing information obtained from an image of the identity determination mark of the genuine semiconductor device with information obtained from an image of the identity determination mark of the semiconductor device product to be judged.

3. A manufacturing system for a semiconductor device as claimed in claim 1 or 2, wherein the semiconductor device further includes a semiconductor substrate, and the underlayer is formed on the semiconductor substrate, and the manufacturing system for the semiconductor device further comprises an underlayer forming device that forms the underlayer on the semiconductor substrate, and the underlayer forming device, the curing device and the ink marking device are in-lined.

4. A manufacturing system for a semiconductor device according to claim 3, wherein the base layer forming device is configured to form the base layer by laminating a base layer forming film composed of the energy ray curable resin composition onto the rear surface of the semiconductor substrate.

5. A semiconductor device manufacturing system as claimed in claim 1 or 2, further comprising an imaging device for imaging the identity determination mark, wherein the ink marking device, the curing device and the imaging device are in-lined.

6. A semiconductor device manufacturing system according to claim 1 or 2, further comprising: an imaging device that images the identity determination mark; and a feature calculation device that calculates a feature from the image captured by the imaging device.

7. A semiconductor device manufacturing system according to claim 1 or 2, wherein the ink marking device is configured to apply the identity determination mark onto the base layer hardened by the hardening device.

8. A method for manufacturing a semiconductor device, comprising: a curing step of irradiating a semiconductor device including an underlayer formed from an energy ray-curable resin composition with energy rays to cure the underlayer; and an ink marking step of applying an identity determination mark, which is used to determine the identity of the semiconductor device, onto the underlayer using ink, wherein the curing step and the ink marking step are carried out in-line.

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