Glass substrate module arranged in vehicle
By integrating a transparent antenna and a soft circuit board with multiple layers into the vehicle's glass substrate module, the challenges of antenna interference and efficiency are addressed, maintaining the vehicle's design while improving communication capabilities.
Patent Information
- Application Number
- PCT/KR2023/016986
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-10-30
- Publication Date
- 2025-05-08
AI Technical Summary
The integration of antennas in vehicles is hindered by metal vehicle bodies and loops, leading to reduced antenna efficiency and interference between different antenna frequencies.
A glass substrate module with a transparent antenna and a soft circuit board composed of multiple layers is placed in the vehicle glass, allowing for the placement of antennas in a way that minimizes interference and maintains the vehicle's exterior design.
This configuration reduces interference between antennas, prevents beam-shaped distortion, and enhances antenna efficiency by separating transparent and opaque antennas within the glass substrate module.
Smart Images

Figure KR2023016986_08052025_PF_FP_ABST
Abstract
Description
Glass substrate module placed in a vehicle
[0001] This specification relates to a glass substrate module for use on a vehicle. A particular embodiment relates to a glass substrate module comprising a transparent antenna on a vehicle windshield. Another embodiment relates to a flexible printed circuit board comprising multiple layers that can be placed on a vehicle windshield.
[0002] Vehicles can perform wireless communication services with other vehicles, surrounding objects, infrastructure, or base stations. In this regard, various communication services can be provided through wireless communication systems utilizing LTE or 5G communication technologies. Meanwhile, some LTE frequency bands may be allocated to provide 5G communication services.
[0003] Meanwhile, the vehicle body and roof are made of metal, which poses a problem of radio wave blocking. Therefore, a separate antenna structure can be placed on the upper portion of the vehicle body or roof. Alternatively, if the antenna structure is placed on the lower portion of the vehicle body or roof, the portion of the vehicle body or roof corresponding to the antenna placement area can be formed of a non-metallic material.
[0004] However, from a design perspective, the vehicle body or roof needs to be formed as one piece. In such cases, the exterior of the vehicle body or roof may be formed of metal. Consequently, there is a risk that the vehicle body or roof may significantly reduce antenna efficiency.
[0005] In this regard, transparent antennas can be placed on the glass corresponding to the vehicle's window to increase communication capacity without changing the vehicle's exterior design. However, there is a problem in that the antenna radiation efficiency and impedance bandwidth characteristics deteriorate due to the electrical loss of the transparent material antenna.
[0006] Meanwhile, transparent antennas and other types of antennas may be placed on the vehicle window together with the transparent antenna. In this regard, the transparent antenna may be designed to radiate signals in the 4G / 5G wireless communication frequency bands. The transparent antenna and other types of antennas may be formed as film-based antennas. The film-based antenna may be designed to radiate signals in the Wi-Fi frequency bands (2.4 GHz, 5 GHz, 7 GHz).
[0007] In this regard, the film antenna may be positioned adjacent to the transparent antenna or on the same layer. Interference may occur between the film antenna and the transparent electrode forming the transparent antenna at 2.4 GHz, which has a long wavelength in the Wi-Fi frequency band. This interference between the film antenna and the transparent electrode forming the transparent antenna may cause beam distortion.
[0008] The purpose of this specification is to reduce interference between multiple antennas in a glass substrate module including transparent antennas in a vehicle window.
[0009] The purpose of this specification is to reduce interference between an antenna formed on a flexible printed circuit board comprising multiple layers that can be placed on a vehicle window and a transparent antenna.
[0010] The purpose of this specification is to prevent distortion of beam shape due to interference between a film material antenna and a transparent electrode forming a transparent antenna.
[0011] The purpose of this specification is to provide a transparent antenna and a film material antenna for placement on one or the other side area of a vehicle window.
[0012] According to one aspect of the present specification for achieving the above or other purposes, a glass substrate module includes: a first glass substrate; a second glass substrate; a transparent antenna module disposed between the first glass substrate and the second glass substrate; a control unit for controlling the transparent antenna module; and a connection unit for electrically connecting the transparent antenna module and the control unit. The transparent antenna module includes a first antenna pattern portion and a second antenna pattern portion, and the connection unit configures a flexible printed circuit board and coaxial cables. A first region of the flexible printed circuit board may be connected to the transparent antenna module, and a third antenna pattern portion may be formed in a second region.
[0013] According to an embodiment, the flexible printed circuit board may be formed with a first region positioned between the first glass substrate and the second glass substrate and a second region positioned outside either the first or second glass substrate. A portion of the first region may be electrically connected to the transparent antenna module. A portion of the second region may be electrically connected to the coaxial cable. A third antenna pattern portion may be formed in another portion of the second region.
[0014] A flexible printed circuit board composed of a plurality of layers according to another aspect of the present specification may include a first antenna pattern portion formed on a transparent flexible substrate positioned between a first glass substrate and a second glass substrate, a first antenna connection portion connected to the second antenna pattern portion, and a second antenna connection portion; a first cable connection portion connected to the first antenna connection portion in a first region of the second glass substrate; a second cable connection portion connected to the second antenna connection portion in a second region of the second glass substrate; and a third antenna pattern portion arranged in a third region of the second glass substrate.
[0015] According to an embodiment, the flexible printed circuit board may further include a first connection substrate portion non-electrically connecting the first antenna connection portion and the second antenna connection portion; a second connection substrate portion non-electrically connecting the first antenna connection portion and the third antenna pattern portion; a third connection substrate portion electrically connecting the first antenna connection portion and the first cable connection portion; and a fourth connection substrate portion electrically connecting the second antenna connection portion and the second cable connection portion.
[0016] The technical effects of a glass substrate module including a transparent antenna in a vehicle glass and a flexible circuit substrate including multiple layers are described as follows.
[0017] According to the present specification, interference between a transparent antenna placed in a transparent area and an antenna placed in an opaque area in a glass substrate module of a vehicle glass can be reduced.
[0018] According to the present specification, a Wi-Fi antenna is placed in a specific area on a flexible printed circuit board composed of multiple layers that can be placed on a vehicle window, thereby reducing interference between the Wi-Fi antenna and the transparent antenna.
[0019] According to the present specification, a flexible circuit board can be formed into a folded structure to prevent distortion of a beam shape due to interference between a film material antenna and a transparent electrode forming a transparent antenna.
[0020] According to the present specification, a transparent antenna having a heterogeneous surface resistance transparent electrode structure and an opaque antenna made of a film material can be arranged on one or the other side area of a vehicle glass.
[0021] Further scope of the applicability of this specification will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of this specification will be apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments, are given by way of example only.
[0022] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.
[0023] Figure 2 is a configuration diagram of a vehicle according to an embodiment of the present specification.
[0024] Figure 3 shows a perspective view of a vehicle glass that can be joined or attached to the frame of the vehicle.
[0025] Figure 4 shows a cross-sectional view of the glass of Figure 3 and the frame of the vehicle combined.
[0026] Figure 5 shows an antenna assembly and connector structure arranged in a transparent area and an opaque area of a vehicle's glass.
[0027] Fig. 6 shows the structure of a glass substrate module on which a transparent antenna module formed on a vehicle glass according to the present specification can be placed.
[0028] Fig. 7 shows a structure in which a transparent antenna module is formed on the glass substrate of Fig. 6.
[0029] Fig. 8 shows a cross-sectional view of the glass substrate module of Figs. 6 and 7 and a structure combined with the frame of the vehicle.
[0030] Figure 9 is a drawing dividing the flexible printed circuit board of Figures 6 and 7 into regions.
[0031] Figure 10 shows a structure in which a flexible printed circuit board having a third antenna pattern portion formed thereon is folded.
[0032] Figures 11a and 11b show the radiation patterns of the third antenna pattern portion designed with a folded FPCB structure at 2.4 GHz and 5.7 GHz.
[0033] Figure 12 shows the isolation between the first and second antenna pattern sections and the third antenna pattern section.
[0034] Figure 13 shows a cross-sectional view of a Wi-Fi antenna formed on a glass substrate and a cross-sectional view of a Wi-Fi antenna formed on a flexible printed circuit board.
[0035] Figure 14 compares the radiation patterns of a Wi-Fi antenna formed on a glass substrate and a Wi-Fi antenna formed on a flexible printed circuit board.
[0036] Figures 15 and 16 illustrate a flexible printed circuit board having power supply patterns formed thereon for supplying a transparent antenna module according to the present specification.
[0037] Fig. 17 shows a perspective view and a front view of a structure in which the flexible circuit board of Figs. 15 and 16 is combined with a transparent antenna module.
[0038] Figure 18 shows a structure in which a conductive pattern is removed from an area where a Wi-Fi antenna is placed on a flexible printed circuit board formed with a double-sided structure.
[0039] Figure 19 shows the laminated structure before assembly and the assembled enlarged structure of a glass substrate having a slot layer formed with an under-cut structure, a transparent antenna module and a vehicle frame.
[0040] Figure 20 illustrates glass substrate modules that can be placed in multiple areas of a vehicle's glass substrate.
[0041] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of this specification.
[0042] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.
[0043] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.
[0044] Singular expressions include plural expressions unless the context clearly indicates otherwise.
[0045] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.
[0046] Below, a transparent antenna module according to the present specification and a method for manufacturing the same are described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.
[0047] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).
[0048] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.
[0049] The above antenna may be disposed on the dielectric of the vehicle (1). The above antenna may be disposed on the glass of the vehicle (1). The above antenna may be coupled or attached to a front windshield (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the above antenna may be a transparent antenna.
[0050] FIG. 2 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 2, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations in addition to the above configurations, or may omit some of the above configurations.
[0051] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415), and / or an infrared sensor (416).
[0052] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transceiver unit (426), and / or an ITS communication unit (427).
[0053] The user interface device (431) may be a device for interaction between the vehicle (1) and a user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).
[0054] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the status of the vehicle (1).
[0055] The interface unit (437) can serve as a passageway for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the units of the vehicle (1), control data for controlling the operation of the units, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).
[0056] Meanwhile, the vehicle glass, incorporating the transparent antenna module according to the present specification, can be combined with the vehicle frame. In this regard, Fig. 3 illustrates a perspective view of vehicle glass that can be combined or attached to the vehicle frame. Fig. 4 illustrates a cross-sectional view of the glass of Fig. 3 combined with the vehicle frame.
[0057] Referring to FIGS. 3 and 4, the glass (10, 10') can be coupled or attached to the frame (9) of the vehicle and can cover the opening (9h) of the frame (9). For example, the glass (10, 10') can be glass of the vehicle (1), such as the front windshield (101), door glass (102, 103), quarter glass (104), rear windshield, side mirror, sunroof (105), or lamp glass (106) of FIG. 1.
[0058] The groove (9g) of the frame (9) may extend along the edge of the glass (10, 10') and define the boundary of the opening (9h). For example, the frame (9) may include a metal material, and a sealant (7, sealant) may be filled between the groove (9g) and the glass (10, 10'). The groove (9g) may be formed to have a step with respect to the inner boundary of the frame (9). The glass (10) having an opaque area (12) formed therein may be placed in the groove (9g) formed to have a step with respect to the inner end of the frame (9). As the glass (10) is placed in the groove (9g), the step of the groove (9g) may be regarded as non-existent from the outside of the vehicle.
[0059] The antenna (20) may be positioned on one surface of the glass (10) or inside the glass (10). The antenna (20) may be transparent. The antenna (20) may be flexible.
[0060] A connection module (100) including a connector (100c) can be disposed between an edge of a glass (10, 10') and an antenna (20), and can be located on one surface of the glass (10, 10'). The connector (100c) of the connection module (100) can be electrically connected to the antenna (20) through a substrate (30). An inner cover (8) can be opposite the glass (10) with respect to the frame (9) and can cover the connection module. The inner cover (8) can be referred to as an interior cover (8). The connection module can be referred to as a connector device, a Parkra jack portion, or a connector assembly.
[0061] Meanwhile, a vehicle antenna assembly implementing a transparent antenna module according to the present specification can be placed in transparent and opaque areas of a vehicle's glass. In this regard, FIG. 5 illustrates an antenna assembly and a connector structure placed in the transparent and opaque areas of a vehicle's glass.
[0062] Referring to FIG. 5, the glass (10) may include a transparent region (11) and an opaque region (12). The opaque region (12) may be a black mask region or a frit region. For example, the transparent region (11) may occupy most of the glass (10), and the opaque region (12) may be adjacent to one edge of the glass (10). The transparent region (11) and the opaque region (12) may be formed with the same width (W10), and the height (H11) of the transparent region (11) may be greater than the height (H12) of the opaque region (12).
[0063] The antenna (20) may be positioned on the transparent area (11) adjacent to the boundary between the transparent area (11) and the opaque area (12). A connection module including a connector (100c) may be positioned on the opaque area (12), and the connector (100c) of the connection module may be connected to the antenna (20) through the housing lower plate (111). The housing lower plate (111) may be fastened to the housing upper plate (112) to form a housing (110). The connector (100c) may be accommodated inside the housing (110). The housing (110) in which the connector (100c) is accommodated may be placed in the opaque area (12). Meanwhile, at least a part of the connection module may be positioned in the transparent area (11).
[0064] A glass substrate module having a transparent antenna module formed on vehicle glass according to the present specification can be arranged in a transparent area and an opaque area. In this regard, FIG. 6 illustrates the structure of a glass substrate module having a transparent antenna module formed on vehicle glass according to the present specification. FIG. 7 illustrates a structure in which a transparent antenna module is formed on the glass substrate of FIG. 6. Specifically, FIG. 7 illustrates the structure of a glass substrate module having a transparent antenna module including first to third antenna pattern portions arranged thereon.
[0065] Referring to FIGS. 6 and 7, the glass substrate module (1000) may include a glass substrate (1010) and a transparent antenna module (1100). The transparent antenna module (1100) may include a first antenna pattern portion (1100-1) and a second antenna pattern portion (1100-2). The glass substrate module (1000) may further include a control portion (1400) and a connection portion (1000CL).
[0066] Meanwhile, Fig. 8 shows a cross-sectional view of the glass substrate module of Figs. 6 and 7 and a structure coupled to a vehicle frame. Fig. 8(a) shows a cross-sectional view of the glass substrate module of Figs. 6 and 7. Fig. 8(b) shows a structure in which the glass substrate module of Figs. 6 and 7 is coupled to a vehicle frame.
[0067] Referring to FIG. 8, the glass substrate (1010) may form a double-laminated glass structure. In this regard, the glass substrate (1010) may be formed into a multilayer glass substrate structure including a first glass substrate (1010a) and a second glass substrate (1010b).
[0068] A transparent antenna module (1100) may be placed between a first glass substrate (1010a) and a second glass substrate (1010b). The first glass substrate (1010a) and the second glass substrate (1010b) may be formed of laminated glass, but are not limited thereto and may be changed depending on the application. The first glass substrate (1010a) and the second glass substrate (1010b) may form a double-laminated glass structure bonded by a film layer (1030). The film layer (1030) may be formed of a PVB (Polyvinyl butyral) layer, but are not limited thereto and may be changed depending on the application.
[0069] Referring to FIG. 8(b), a glass substrate module (1000) may be coupled or attached to a frame (9) of a vehicle. The frame (9) of the vehicle may be formed of a metal material. The glass substrate (1010) of the glass substrate module (1000) may be configured to include a first glass substrate (1010a), a second glass substrate (1010b), and a film layer (1030). The glass substrate (1010) may include a transparent region (11) and an opaque region (12). The opaque region (12) may be a black mask region or a frit region.
[0070] An opaque area (12) may be formed on the first glass substrate (1010a). The vehicle frame (9) may extend corresponding to the opaque area (12). In this regard, radio interference may occur between the vehicle frame (9) made of a metal material and the flexible printed circuit board (1200) on which the feeding pattern is formed. A signal applied to the transparent antenna module by the feeding pattern of the flexible printed circuit board (1200) may be subject to radio interference by the vehicle frame (9) made of a metal material. In particular, interference may occur in the low-band (LB) signal by the vehicle frame (9), resulting in deterioration of antenna performance in the low-band (LB).
[0071] To prevent antenna performance degradation, a slot layer (1010s) may be formed so that a flexible printed circuit board (1200) is not disposed in an area where a vehicle frame (9) extends. The flexible printed circuit board (1200) may be disposed to wrap around the back and side surfaces of the second glass substrate (1010b) and may extend to the film layer (1030). The second glass substrate (1010b) and the adhesive layer (1030) may be disposed with a predetermined length of shift so that the second glass substrate (1010b) and the film layer (1030) are not disposed in the slot layer (1010s). Therefore, the slot layer (1010s) where the second glass substrate (1010b) and the film layer (1030) are not disposed may be referred to as an undercut area.
[0072] A flexible printed circuit board (1200) may be connected to transparent electrode portions (1100a, 1100b) forming a transparent antenna module. The flexible printed circuit board (1200) and the first transparent electrode portion (1100a) are connected. A second transparent electrode portion (1100b) having a different transparency from the first transparent electrode portion (1100a) may be formed. A feeding pattern may be formed on the first transparent electrode portion (1100a), and an antenna pattern may be formed on the second transparent electrode portion (1100b). The first transparent electrode portion (1100a) and the second transparent electrode portion (1100b) may be formed of metal mesh grids having different line widths and / or spacings.
[0073] The first transparent electrode portion (1100a) may be configured to have a first transparency and a first surface resistance value. The second transparent electrode portion (1100b) may be configured to have a second transparency and a second surface resistance value. The second transparency of the second transparent electrode portion (1100b) is formed to have a value greater than the first transparency of the first transparent electrode portion (1100a). The second surface resistance value of the second transparent electrode portion (1100b) is formed to have a value smaller than the first surface resistance value of the first transparent electrode portion (1100a). Accordingly, the transparency of the second transparent electrode portion (1100b) on which the antenna pattern is formed is higher than the transparency of the first transparent electrode portion (1100a) on which the feed pattern is formed, thereby improving the invisibility of the antenna pattern. In addition, since the surface resistance value of the second transparent electrode portion (1100b) on which the antenna pattern is formed is lower than the surface resistance value of the first transparent electrode portion (1100a) on which the power supply pattern is formed, it is possible to improve performance such as the radiation efficiency of the antenna.
[0074] Referring to FIGS. 6 to 8, a glass substrate module (1000) according to the present specification will be described. As described above, the glass substrate module (1000) may be configured to include a glass substrate (1010), a transparent antenna module (1100), a control unit (1400), and a connection unit (1000CL). The glass substrate (1010) may be formed as a multilayer glass substrate structure to include a first glass substrate (1010a) and a second glass substrate (1010b). The transparent antenna module (1100) may include a first antenna pattern portion (1100-1) and a second antenna pattern portion (1100-2).
[0075] The control unit (1400) may be configured to control the transparent antenna module (1100). The connection unit (1000CL) may be configured to electrically connect the transparent antenna module (1100) and the control unit (1400). The connection unit (1000CL) may comprise a flexible printed circuit board (FPCB) (1200) and a coaxial cable (610). The transparent antenna module (1100) may include a first antenna pattern unit (1100-1) and a second antenna pattern unit (1100-2).
[0076] Meanwhile, a flexible printed circuit board having power supply patterns for applying signals to a transparent antenna module according to the present specification may be arranged in a folded state, divided into multiple regions. In this regard, FIG. 9 is a drawing dividing the flexible printed circuit board of FIGS. 6 and 7 into regions.
[0077] Referring to FIGS. 6 to 9, the flexible printed circuit board (1200) may be formed of a first region (1200R1) and a second region (1200R2). The first region (1200R1) may be positioned between the first glass substrate (1010a) and the second glass substrate (1010b). The second region (1200R2) may be positioned outside either the first or second glass substrate (1010a, 1010b).
[0078] A portion of the first region (1200R1) may be electrically connected to a transparent antenna module (1100). A portion of the second region (1200R2) may be electrically connected to a coaxial cable (610). A third antenna pattern portion (1100-3) may be formed in another portion of the second region (1200R2).
[0079] The first and second antenna pattern units (1100-1, 1100-2) disposed in the transparent antenna area (TA) may be configured to radiate signals in frequency bands for 4G / 5G wireless communication. In this regard, the first and second antenna pattern units (1100-1, 1100-2) may be configured to radiate signals of a low band (LB), a middle band (MB), a high band (HB), and an ultra-high band (UHB), respectively. The first and second antenna pattern units (1100-1, 1100-2) may radiate signals in a first frequency band of 617 to 960 MHz. The first and second antenna pattern units (1100-1, 1100-2) may radiate signals in a second frequency band of 1520 to 4500 MHz. The first and second antenna pattern units (1100-1, 1100-2) can radiate signals in a second frequency band of 4500 to 6000 MHz.
[0080] The third antenna pattern unit (1100-3) may be configured to radiate a signal in a Wi-Fi frequency band. The third antenna pattern unit (1100-3) may be configured to radiate a signal in a frequency band of 2.4 GHz, 5 GHz, and 7 GHz. The third antenna pattern unit (1100-3) forms a nearly omni-directional radiation pattern in the operating frequency band, so that distortion of the beam pattern does not occur. However, when the first and second antenna pattern units (1100-1, 1100-2) are arranged on the glass substrate (1010), distortion of the beam pattern of the third antenna pattern unit (1100-3) may occur. This is because interference occurs with the first and second antenna pattern units (1100-1, 1100-2) operating in the second frequency band when the third antenna pattern unit (1100-3) operates at 2.4 GHz.
[0081] In this regard, the third antenna pattern portion (1100-3) disposed on the FPCB of the on-glass structure formed integrally with the transparent antenna module (1100) is disposed on the same layer as the transparent antenna module (1100). Accordingly, the third antenna pattern portion (1100-3) is interfered with by the transparent electrode of the transparent antenna module (1100) at 2.4 GHz, which is a frequency band having a long wavelength among the operating frequency bands.
[0082] The radiation pattern formed through the third antenna pattern portion (1100-3) may be reflected by the first and fourth conductive patterns (1110, 1140) arranged adjacent to the third antenna pattern portion (1100-3) in the transparent antenna area (TA). The radiation pattern formed through the third antenna pattern portion (1100-3) may be reflected by the first and fourth conductive patterns (1110, 1140), which may cause distortion of the beam shape. Therefore, the end of the third antenna pattern portion (1100-3) and the ends of the first and fourth conductive patterns (1110, 1140) must be spaced apart from each other by a sufficient distance or more to reduce distortion of the beam shape. For example, the distance between the end of the third antenna pattern portion (1100-3) and the ends of the first and fourth conductive patterns (1110, 1140) must be spaced apart by 0.5 times or more of the operating wavelength. At 2.4 GHz, 0.5 times the operating wavelength corresponds to approximately 4.5 mm.
[0083] Accordingly, in order to reduce the beam pattern distortion phenomenon of the third antenna pattern portion (1100-3), the position where the third antenna pattern portion (1100-3) is arranged can be moved in the XY axis direction or arranged in a different layer in the Z axis direction. In this regard, Fig. 10 shows a structure in which a flexible printed circuit board on which the third antenna pattern portion is formed is folded.
[0084] Referring to FIG. 10, a glass substrate module (1000) includes a transparent antenna area (TA) in which a transparent antenna module can be placed, and a flexible printed circuit board (1200). A third antenna pattern unit (1100-3) operating in a Wi-Fi frequency band can be implemented as a slot antenna in which slot patterns (1100s) are formed in a first axis direction and a second axis direction in a ground area. Signals can be applied to one point of the slot patterns (1100s) through an internal conductor of a third coaxial cable (613) to radiate signals in a Wi-Fi frequency band.
[0085] The slot patterns (1100s) may be configured to include a plurality of slot portions. The slot patterns (1100s) may be configured to include first to fourth slot portions (SL1, SL2, SL3, SL4). Signals may be applied to a point of the signal line (SL) through an inner conductor of the third coaxial cable (613). The signal line (SL) may be arranged so that the third coaxial cable (613) is connected to the flexible circuit board (1200). A first slot portion (SL1) and a second slot portion (SL2) may be formed on one side and the other side of the signal line (SL), respectively. A first width of the first slot portion (SL1) formed on the lower side of the signal line (SL) may be formed narrower than a second width of the first slot portion (SL1) formed on one side of the signal line (SL).
[0086] A first slot portion (SL1) may be connected to a first point on one side of a second slot portion (SL2). A third slot portion (SL3) may be connected to a second point on the other side of the second slot portion (SL2) and may extend in the X-axis direction by a predetermined length. A fourth slot portion (SL4) may be connected to an upper end of the second slot portion (SL2) and may extend in the X-axis direction by a predetermined length. The fourth slot portion (SL4) may be formed to extend in an opposite direction to the third slot portion (SL3).
[0087] The positions of one end and the other end of the area where the third antenna pattern portion (1100-3) is formed must be arranged within the area where the first connection substrate portion (1210b) of the flexible printed circuit board (1200) is formed. The length in the Y-axis direction from the end of the transparent antenna area (TA) to one end of the area where the third antenna pattern portion (1100-3) is formed is L WIFI is expressed as L. The length from one end of the first connecting substrate portion (1210b) to the end of the transparent antenna area (TA) corresponding to the other end of the area where the third antenna pattern portion (1100-3) is formed is L. TAis expressed as T. The side height of the flexible printed circuit board (1200) is top is expressed as L. The distance from the end of the glass substrate (1010) to the frame of the vehicle is L metal is expressed as
[0088] The positions of one end and the other end of the area where the third antenna pattern portion (1100-3) is formed are arranged within the area where the first connection substrate portion (1210b) of the flexible printed circuit board (1200) is formed, so that the length (L) TA ) must satisfy the mathematical expression 1 below.
[0089]
[0090] Referring to FIGS. 6 to 8 and 10, the flexible printed circuit board (1200) may be formed by bending the first and second glass substrates (1010a, 1010b) along one side. The flexible printed circuit board (1200) may be formed by bending along the AA' line. The flexible printed circuit board (1200) may be formed by bending along the BB' line. As the flexible printed circuit board (1200) is formed with a bend structure of a predetermined height, the third antenna pattern portion (1100-3) may be formed on a different layer in the Z-axis direction from the first and second antenna pattern portions (1100-1, 1100-2) of the transparent antenna module, thereby reducing mutual interference.
[0091] Meanwhile, the distance (W) from the end of the area where the third antenna pattern portion (1100-3) is formed to the end of the first and second antenna connection portions (1210, 1220) WIFI ) are formed in a predetermined interval range, so that both mutual interference reduction and miniaturization of the transparent antenna module are possible. In this regard, the distance (W) from the end of the area where the third antenna pattern portion (1100-3) is formed to the end of the first and second antenna connection portions (1210, 1220) WIFI ) can be expressed by the mathematical formula 2 below.
[0092]
[0093] Distance (W) WIFI ) is the required isolation level (λ) between the first and second antenna pattern sections (1100-1, 1100-2) and the third antenna pattern section (1100-3). dist ) can be formed at a distance greater than or equal to the distance corresponding to the antenna pattern portion (1100-1, 1100-2). Therefore, it is possible to reduce mutual interference between the first and second antenna pattern portions (1100-1, 1100-2) and the third antenna pattern portion (1100-3). The distance (W WIFI ) can be formed to be less than half the distance between the center points of the first and second antenna pattern portions (1100-1, 1100-2). Therefore, the distance between the first and second antenna pattern portions (1100-1, 1100-2) and the size of the third antenna pattern portion (1100-3) can be designed to be less than a certain size, thereby enabling miniaturization of the antenna module.
[0094] For example, the length (L) to one end of the area where the third antenna pattern portion (1100-3) is formed TA ) can be set to 82.7355 mm. The distance (W) from the end of the area where the third antenna pattern portion (1100-3) is formed to the end of the first and second antenna connection portions (1210, 1220) WIFI ) can be set to 52.5625. In this regard, FIGS. 11a and 11b show the radiation patterns of the third antenna pattern portion designed with a folded FPCB structure at 2.4 GHz and 5.7 GHz. FIG. 12 shows the isolation diagram between the first and second antenna pattern portions and the third antenna pattern portion.
[0095] Referring to Fig. 11a, the radiation pattern (Rp1) of the third antenna pattern unit at 2.4 GHz hardly causes beam distortion. Referring to Figs. 6 and 11a, the highest value of the radiation pattern (Rp1) of the third antenna pattern unit (1100-3) is formed almost in the Y-axis direction. In addition, the size of the radiation pattern (Rp1) of the third antenna pattern unit (1100-3) has a low value below the threshold in the X-axis direction. Accordingly, it is determined that the mutual interference between the third antenna pattern unit (1100-3) and the first and second antenna pattern units (1100-1, 1100-2) is reduced.
[0096] Referring to FIG. 11b, the radiation pattern (Rp2) of the third antenna pattern unit at 5.7 GHz hardly causes beam distortion. Referring to FIGS. 6 and 11b, the highest value of the radiation pattern (Rp2) of the third antenna pattern unit (1100-3) is formed almost in the Y-axis direction. In addition, the size of the radiation pattern (Rp2) of the third antenna pattern unit (1100-3) has a low value below the threshold in the X-axis direction. Accordingly, it is determined that the mutual interference between the third antenna pattern unit (1100-3) and the first and second antenna pattern units (1100-1, 1100-2) is reduced.
[0097] Referring to FIGS. 6 and 12, the mutual interference (S31) between the first antenna pattern unit (1100-1) and the third antenna pattern unit (1100-3) has a value of -15 dB or less in the entire frequency band. Therefore, it is determined that the mutual interference (S31) between the first antenna pattern unit (1100-1) and the third antenna pattern unit (1100-3) has been reduced. The mutual interference (S32) between the second antenna pattern unit (1100-2) and the third antenna pattern unit (1100-3) has a value of -15 dB or less in the entire frequency band. Therefore, it is determined that the mutual interference (S32) between the second antenna pattern unit (1100-2) and the third antenna pattern unit (1100-3) has been reduced.
[0098] Meanwhile, the flexible printed circuit board (1200) may be divided into multiple regions. The flexible printed circuit board (1200) may be configured to include multiple antenna connection portions and multiple connection substrate portions. The structure and connection relationship of the flexible printed circuit board (1200) divided into multiple regions will be described in detail with reference to FIGS. 6 to 10 .
[0099] A first region (1200R1) of a flexible printed circuit board (1200) may include a first antenna connection portion (1210) and a second antenna connection portion (1220). The first antenna connection portion (1210) may be electrically connected to the first antenna pattern portion (1100-1). The second antenna connection portion (1220) may be electrically connected to the second antenna pattern portion (1100-2).
[0100] A first connection substrate portion (1210b) may be formed on a flexible printed circuit board (1200). A second connection substrate portion (1220b) may further be formed on the flexible printed circuit board (1200). The first connection substrate portion (1210b) may be configured to non-electrically connect a first antenna connection portion (1210) and a second antenna connection portion (1220). The first connection substrate portion (1210b) is disposed between the first antenna connection portion (1210) and the second antenna connection portion (1220). The conductive patterns of the first connection substrate portion (1210b) may be configured not to be directly connected to the conductive patterns of the first antenna connection portion (1210). The conductive patterns of the first connection substrate portion (1210b) may be configured not to be directly connected to the conductive patterns of the first antenna connection portion (1210).
[0101] The second connecting substrate portion (1220b) may be configured to non-electrically connect the first connecting substrate portion (1210b) and the third antenna pattern portion (1100-3). The second connecting substrate portion (1220b) is disposed between the first connecting substrate portion (1210b) and the third antenna pattern portion (1100-3). The conductive patterns of the second connecting substrate portion (1220b) may be configured not to be directly connected to the conductive patterns of the first connecting substrate portion (1210b). The conductive patterns of the second connecting substrate portion (1220b) may be configured not to be directly connected to the conductive patterns of the third antenna pattern portion (1100-3).
[0102] The third antenna pattern portion (1100-3) may be formed at an external location of either the first or second glass substrate (1010a, 1010b) and overlapped with the first connection substrate portion (1210b). The flexible printed circuit board (1200) on which the third antenna pattern portion (1100-3) is formed may be configured to be folded. The lower portion of the third antenna pattern portion (1100-3) may be positioned in an internal region of the first connection substrate portion (1210b).
[0103] Meanwhile, the coaxial cable (610) constituting the glass substrate module (1000) may include first to third coaxial cables (611, 612, 613) connected to first to third antenna pattern portions (1100-1, 1100-2, 1100-3). The third antenna pattern portion (1100-3) operating in a Wi-Fi frequency band may be connected to the third coaxial cable (613). The third antenna pattern portion (1100-3) may have a soldering area (SL) to which the third coaxial cable (613) is connected. The feed line and the ground line of the third coaxial cable (613) may be electrically connected to the soldering area (SL), respectively. The feed line and the ground line of the third coaxial cable (613) may be electrically connected to the first and second soldering areas formed of a metal pattern, respectively.
[0104] As described above, the coaxial cables (610) may include a first coaxial cable (611) and a second coaxial cable (612) connected to the first and second antenna pattern portions (1100-1, 1100-2), respectively. The second region (1200R2) of the flexible printed circuit board (1200) may include a first cable connection portion (1210c) and a second cable connection portion (1220c). The first cable connection portion (1210c) may be electrically connected to the first coaxial cable (611). The second cable connection portion (1220c) may be electrically connected to the second coaxial cable (612).
[0105] The flexible printed circuit board (1200) may further include a third connection substrate portion (1230b) and a fourth connection substrate portion (1240b). The third connection substrate portion (1230b) may electrically connect the first antenna connection portion (1210) and the first cable connection portion (1210c). The fourth connection substrate portion (1240b) may electrically connect the second antenna connection portion (1220) and the second cable connection portion (1220c).
[0106] The first cable connection (1210c) may be positioned outside of either the first or second glass substrate (1010a, 1010b). The first cable connection (1210c) may be positioned in a non-overlapping area with the first antenna connection (1210). The second cable connection (1220c) may be positioned outside of either the first or second glass substrate (1010a, 1010b). The second cable connection (1220c) may be positioned in a non-overlapping area with the second antenna connection (1220).
[0107] Meanwhile, the Wi-Fi antenna according to the present specification may be formed as an on-glass structure disposed on a flexible printed circuit board (FPCB) (1200) or as an on-glass structure disposed on a glass substrate (1010). In this regard, Fig. 13 shows a cross-sectional view of a Wi-Fi antenna formed on a glass substrate and a cross-sectional view of a Wi-Fi antenna formed on a flexible printed circuit board. Fig. 14 compares the radiation patterns of a Wi-Fi antenna formed on a glass substrate and a Wi-Fi antenna formed on a flexible printed circuit board.
[0108] Referring to FIGS. 8 and 13(a), the permittivity of the first and second glass substrates (1010a, 1010b) is 6.5, and the permittivity of the film layer (1030) between the first and second glass substrates (1010a, 1010b) is 3.2. Referring to FIGS. 8, 13(a), and 14(a), the peak area (PA1) of the radiation pattern (RP1) of the third antenna pattern (1100-3a) implemented as the transparent electrode portion (1100a, 1100b) inside the glass substrate (1010) is formed in a limited area. The third antenna pattern (1100-3a) may be formed in an in-glass structure between the first and second glass substrates (1010a, 1010b). As the third antenna pattern (1100-3a) is formed with an in-glass structure, the effective permittivity becomes 6.5, which reduces the antenna efficiency.
[0109] Referring to FIG. 8 and FIG. 13(b), the dielectric constant of the flexible printed circuit board (1200) has a lower value than the dielectric constants of the first and second glass substrates (1010a, 1010b). The effective dielectric constant of the flexible printed circuit board (1200) arranged in the on-glass structure of the glass substrate (1010) has a value between 4.4 and 5.2. The glass substrate (1010) of FIG. 13(b) may be configured to include the first and second glass substrates (1010a, 1010b) of FIG. 13(a) and a film layer (1030).
[0110] Referring to FIG. 8, FIG. 13(b), and FIG. 14(b), the peak area (PA2) of the radiation pattern (RP2) of the third antenna pattern (1100-3) disposed on the glass substrate (1010) is formed over a wide area. As the third antenna pattern (1100-3a) is formed in an on-glass structure, the effective permittivity becomes 4.8, thereby increasing antenna efficiency.
[0111] Meanwhile, the flexible printed circuit board (1200) may be configured to include a plurality of feed patterns and a plurality of ground patterns. The flexible printed circuit board (1200) may be formed of a plurality of layers. The flexible printed circuit board of the glass substrate module according to the present specification may be formed in a folded structure. In this regard, FIGS. 15 and 16 illustrate a flexible printed circuit board having feed patterns formed thereon for feeding a transparent antenna module according to the present specification. FIG. 16(a) illustrates a conductive pattern (feed pattern) formed on a first layer (1200a) of the flexible circuit board (1200). FIG. 16(b) illustrates a conductive pattern (ground pattern) formed on a second layer (1200b) of the flexible circuit board (1200). Fig. 17 shows a perspective view and a front view of a structure in which the flexible circuit board of Figs. 15 and 16 is combined with a transparent antenna module.
[0112] Referring to FIGS. 15 to 17, a flexible printed circuit board of a glass substrate module according to the present specification will be described. The flexible printed circuit board of FIGS. 15 to 17 may include power supply patterns (1210f, 1240f) that apply signals to the first and second antenna pattern portions (1100-1, 1100-2) of FIG. 7.
[0113] Referring to FIG. 7, FIG. 15 to FIG. 17, one end (1211) of the first CPW pattern (1210p) of the first layer (1200a) may be connected to the first antenna pattern portion (1100-1). In this regard, the connection of the first CPW pattern (1210p) to the first antenna pattern portion (1100-1) is not limited. The fourth CPW pattern (1240p) may be connected to the second antenna pattern portion (1100-2). For convenience of explanation below, a structure in which the first CPW pattern (1210p) is connected to the first antenna pattern portion (1100-1) will be described.
[0114] The first CPW pattern (1210p) may be connected to the first antenna pattern portion (1100-1) by applying a low-temperature bonding method. One end of the first feed pattern (1210f) of the first CPW pattern (1210p) may be connected to one end of the first conductive pattern (1110) of the first antenna pattern portion (1100-1). One end of the first ground patterns (1211g, 1212g) of the first feed pattern (1210f) may be connected to one end of the second conductive pattern (1120) and the third conductive pattern (1130) of the first antenna pattern portion (1100-1), respectively.
[0115] The first feed pattern (1210f) may include at least one slit pattern. The slit pattern may refer to a pattern formed by a portion of the edge of the ground pattern being inwardly recessed. As the area of the slit pattern increases, the area of the ground pattern may decrease. The slit pattern may be formed at a predetermined location and in a predetermined shape to increase antenna efficiency.
[0116] The first power supply pattern (1210f) may include a first slit pattern (1211s) formed by recessing a portion of an edge of the first ground pattern (1211g) inwardly. The first slit pattern (1211s) may be formed by recessing a portion of an edge of the first ground pattern (1211g) adjacent to the first antenna pattern portion (1100-1) along the -y-axis direction. The first slit pattern (1211s) may be formed in a rectangular shape.
[0117] The first feed pattern (1210f) may include a second slit pattern (1212s) formed by recessing a portion of an edge of the first ground pattern (1212g) inwardly. The second slit pattern (1212s) may be formed by recessing a portion of an edge adjacent to the first feed pattern (1210f) along the x-axis direction. The second slit pattern (1212s) may be formed in a fan shape.
[0118] The other end (1212) of the first ground patterns (1211g, 1212g) of the first CPW pattern (1210p) may overlap with one end (1231) of the third ground pattern (1230g) of the second layer (1200b) in a predetermined area (1213). The other end (1212) of the first ground patterns (1211g, 1212g) may be electrically connected to one end (1231) of the third ground pattern (1230g) through at least one via.
[0119] The second ground patterns (1221g, 1222g) of the second CPW pattern (1220p) of the first layer (1200a) may overlap the other end (1232) of the third ground pattern (1230g) of the second layer (1200b) in a predetermined area (1233). The other end (1232) of the third ground pattern (1230g) may be formed in a shape corresponding to the second ground patterns (1221g, 1222g). A first slot (1231s) with a pattern removed may be formed at the other end (1232) of the third ground pattern (1230g) corresponding to the shape of the second feed pattern (1220f) of the second CPW pattern (1220p). The area of the first slot (1231s) may be greater than or equal to the area of the second power supply pattern (1220f).
[0120] The third feed pattern (1230f) of the first layer (1200a) may be formed as a microstrip line or CPW pattern. When the third feed pattern (1230f) is formed as a CPW pattern, ground patterns may be arranged on both sides of the third feed pattern (1230f). One end of the third feed pattern (1230f) may be connected to the first feed pattern (1210f) of the first CPW pattern (1210p). The other end of the third feed pattern (1230f) may be connected to the second feed pattern (1220f) of the second CPW pattern (1220p).
[0121] The third feed pattern (1230f) may include a first line portion (1231f), a second line portion (1232f), a third line portion (1233f), and / or an end portion (1234f). The end portion (1234f) of the third feed pattern (1230f) may correspond to the other end of the third feed pattern (1230f).
[0122] A second slot (1232s) with a pattern removed may be formed at the other end (1232) of the third ground pattern (1230g) corresponding to the shape of the end (1234f) of the third power supply pattern (1230f). The area of the second slot (1232s) may be greater than or equal to the area of the end (1234f) of the third power supply pattern (1230f).
[0123] Meanwhile, the flexible printed circuit board (1200) may be formed in a folded structure. The flexible printed circuit board (1200) may be formed in a folded structure in a third connection substrate portion (1230b) on which a third ground pattern (1230g) and a third power supply pattern (1230f) are formed. The flexible printed circuit board (1200) may be formed in a folded structure based on the AA' line and the BB' line.
[0124] A flexible printed circuit board (1200) may have a first cable connection portion (1210c) having a second CPW pattern (1220p) formed thereon and may overlap a first antenna connection portion (1210) having a first CPW pattern (1210p) formed thereon. An overlapping area (1234) may be formed such that the ground pattern is removed so that the ground pattern is not disposed in an upper area of the first feed pattern (1210f) of the first CPW pattern (1210p). Since the third ground pattern (1230g) of the second layer (1220b) does not overlap the first feed pattern (1210f), a reduction in radiation performance of an antenna operating in a wideband can be prevented and antenna efficiency can be improved.
[0125] Meanwhile, the first line portion (1231f) of the third feed pattern (1230f) may extend from one end of the third feed pattern (1230f) in the y-axis direction by a length that avoids the overlapping area (1234). The second line portion (1232f) may extend from the end of the first line portion (1231f) by a predetermined angle that avoids the overlapping area (1234) in the -x-axis direction. The third line portion (1233f) may extend from the end of the second line portion (1232f) in the y-axis direction by a length corresponding to the position of the second feed pattern (1220f) of the second CPW pattern (1220p). The end of the third line portion (1233f) may be connected to the end (1234f) of the third feed pattern (1230f).
[0126] Referring to FIGS. 6 to 17, a flexible printed circuit board (1200) may be configured to include feed patterns in each of a plurality of regions formed thereon. In this regard, the flexible printed circuit board (1200) may include first to third feed patterns (1210f, 1220f, 1230f) and first to third ground patterns (1211g, 1212g, 1221g, 1222g, 1230g). A first antenna connection portion (1210) of the flexible printed circuit board (1200) may include a first feed pattern (1210f) and a plurality of first ground patterns (1211g, 1212g). The first feed pattern (1210f) may be arranged in a first layer among the plurality of layers. And a plurality of first ground patterns (1211g, 1212g) can be arranged on both sides of the first feed pattern (1210f). Accordingly, the first feed pattern (1210f) and the plurality of first ground patterns (1211g, 1212g) can form a co-planar waveguide (CPW) structure.
[0127] A first cable connection portion (1210c) of a flexible printed circuit board (1200) may include a second feed pattern (1220f) and a plurality of second ground patterns (1221g, 1222g). The second feed pattern (1220f) may be arranged in a first layer among the plurality of layers. The plurality of second ground patterns (1221g, 1222g) may be arranged on both sides of the second feed pattern (1220f). Accordingly, the second feed pattern (1220f) and the plurality of second ground patterns (1221g, 1222g) may form a CPW structure.
[0128] A third connection substrate portion (1230b) of a flexible printed circuit board (1200) may include a third power supply pattern (1230f) and a third ground pattern (1230g). The third power supply pattern (1230f) may be disposed on a first layer adjacent to a side of a second glass substrate (1010b) among a plurality of layers. The third ground pattern (1230g) may be disposed on a second layer among a plurality of layers. Both ends of the third ground pattern (1230g) may be electrically connected to the first ground pattern (1211g, 1212g) and the second ground pattern (1221g, 1222g) disposed on the first layer, respectively.
[0129] The flexible printed circuit board (1200) may further include fourth to sixth feed patterns (1240f, 1250f, 1260f) and fourth to sixth ground patterns (1241g, 1242g, 1251g, 1252g, 1260g). The second antenna connection portion (1220) of the flexible printed circuit board (1200) may include a fourth feed pattern (1240f) and a plurality of fourth ground patterns (1241g, 1242g). The fourth feed pattern (1240f) may be arranged in a first layer among the plurality of layers. And the plurality of fourth ground patterns (1241g, 1242g) may be arranged on both sides of the fourth feed pattern (1240f). Accordingly, the fourth power supply pattern (1240f) and a plurality of fourth ground patterns (1241g, 1242g) can form a CPW structure.
[0130] The second cable connection portion (1220b) of the flexible printed circuit board (1200) may include a fifth power supply pattern (1250f) and a plurality of fifth ground patterns (1251g, 1252g). The fifth power supply pattern (1250f) may be arranged in a first layer among the plurality of layers. The plurality of fifth ground patterns (1251g, 1252g) may be arranged on both sides of the fifth power supply pattern (1250f). Accordingly, the fifth power supply pattern (1250f) and the plurality of fifth ground patterns (1251g, 1252g) may form a CPW structure.
[0131] The fourth connection substrate portion (1240b) of the flexible printed circuit board (1200) may include a sixth power supply pattern (1260f) and a sixth ground pattern (1260g). The sixth power supply pattern (1260f) may be arranged in a first layer adjacent to a side of a second glass substrate (1010b) among a plurality of layers. The sixth ground pattern (1260g) may be arranged in a second layer among a plurality of layers. Both ends of the sixth ground pattern (1260g) may be electrically connected to the fourth ground patterns (1241g, 1242g) and the fifth ground patterns (1251g, 1252g) arranged in the first layer, respectively.
[0132] Meanwhile, the flexible printed circuit board (1200) may form a plurality of layers. In this regard, the flexible printed circuit board (1200) may include a layer on which conductive patterns are formed and a layer formed of a dielectric material. The plurality of layers of the flexible printed circuit board (1200) may form first, second, and third layers. The first layer (1200a) may form a pattern for electrical connection at the first antenna connection portion (1210), the second antenna connection portion (1220), the first cable connection portion (1210c), and the second cable connection portion (1220c). The second layer (1200b) may form a pattern for forming a ground. The third layer, which is disposed between the first and second layers (1200a, 1200b), may form a substrate made of a dielectric material. The third antenna pattern portion (1110-3) can be placed in the second layer.
[0133] Meanwhile, the flexible printed circuit board (1200) according to the present specification may be formed in a double-sided structure. In this regard, FIG. 18 illustrates a structure in which a conductive pattern is removed from an area where a Wi-Fi antenna is positioned in a flexible printed circuit board formed in a double-sided structure.
[0134] Referring to FIGS. 9 and 18, conductive patterns may be removed from other layers of the flexible printed circuit board (1200) corresponding to areas including the third antenna pattern portion (1100-3). The area from which the conductive patterns are removed may form a slot area (1200SR). The slot area (1200SR) may include a first slot area (1200SR1) to a third slot area (1200SR3). The slot area (1200SR) from which the conductive patterns are removed may be referred to as a fill-cut area.
[0135] First and second ground regions (1200g1, 1200g2) corresponding to the first and second feed regions may be formed on one side and the other side of the slot region (1200SR) adjacent to the slot region (1200SR). First and second feed regions in which first and second feed patterns are formed may be formed on the first layer of the flexible printed circuit board (1200). First and second ground regions (1200g1, 1200g2) corresponding to the first and second feed regions may be formed on the second layer of the flexible printed circuit board (1200).
[0136] Conductive patterns may be removed from other layers of the flexible printed circuit board (1200) corresponding to the first connecting substrate portion (1210b), the second connecting substrate portion (1220b), and the third antenna pattern portion (1100-3). A first slot region (1200SR1) may be formed corresponding to the first connecting substrate portion (1210b). A second slot region (1200SR2) may be formed corresponding to the second connecting substrate portion (1220b). A third slot region (1200SR3) may be formed corresponding to the third antenna pattern portion (1100-3).
[0137] Accordingly, transmission loss can be reduced in a flexible printed circuit board (1200) formed with a double-sided FCCL structure. In a flexible printed circuit board (1200) formed with a double-sided FCCL structure, the third antenna pattern portion (1100-3) implemented as a Wi-Fi antenna can be formed with a single-layer structure.
[0138] Meanwhile, a flexible printed circuit board (1200) composed of a plurality of layers according to the present specification will be described in detail with reference to the drawings. Referring to FIGS. 6 to 18, the flexible printed circuit board (1200) may include a first antenna connection portion (1210), a second antenna connection portion (1220), a first cable connection portion (1210c), a second cable connection portion (1220c), and a plurality of antenna pattern portions. The plurality of antenna pattern portions may include a first antenna pattern portion (1100-1), a second antenna pattern portion (1100-2), and a third antenna pattern portion (1100-3). The flexible printed circuit board (1200) may further include a plurality of connection substrate portions. The flexible printed circuit board (1200) may further include a first connection substrate portion (1210b), a second connection substrate portion (1220b), a third connection substrate portion (1230b), and a fourth connection substrate portion (1240b).
[0139] The first antenna connection portion (1210) can be connected to the first antenna pattern portion (1100-1) formed on a transparent flexible substrate positioned between the first glass substrate (1010a) and the second glass substrate (1010a). The second antenna connection portion (1220) can be connected to the second antenna pattern portion (1100-2) formed on a transparent flexible substrate positioned between the first glass substrate (1010a) and the second glass substrate (1010a).
[0140] The first cable connection portion (1210c) may be connected to the first antenna connection portion (1210) in the first region of the second glass substrate (1010b). The second cable connection portion (1220c) may be connected to the second antenna connection portion (1220) in the second region of the second glass substrate (1010b). The third antenna pattern portion (1100-3) may be arranged in the second region of the second glass substrate (1010b).
[0141] The first connection substrate portion (1210b) may be formed to non-electrically connect the first antenna connection portion (1210) and the second antenna connection portion (1220). The second connection substrate portion (1220b) may be formed to non-electrically connect the first antenna connection portion (1210) and the third antenna pattern portion (1100-3). The third connection substrate portion (1230b) may be formed to electrically connect the first antenna connection portion (1210) and the first cable connection portion (1210c). The fourth connection substrate portion (1240b) may be formed to electrically connect the second antenna connection portion (1220) and the second cable connection portion (1220c).
[0142] The first cable connection (1210c) may be positioned outside of either the first or second glass substrate (1010a, 1010b). The first cable connection (1210c) may be positioned in a non-overlapping area with the first antenna connection (1210). The second cable connection (1220c) may be positioned outside of either the first or second glass substrate (1010a, 1010b). The second cable connection (1220c) may be positioned in a non-overlapping area with the second antenna connection (1220).
[0143] Meanwhile, the flexible printed circuit board (1200) may be configured to include feed patterns for each of a plurality of areas formed on the flexible printed circuit board (1200). In this regard, the flexible printed circuit board (1200) may include first to third feed patterns (1210f, 1220f, 1230f) and first to third ground patterns (1211g, 1212g, 1221g, 1222g, 1230g). The first antenna connection portion (1210) of the flexible printed circuit board (1200) may include a first feed pattern (1210f) and a plurality of first ground patterns (1211g, 1212g). The first feed pattern (1210f) may be arranged on a first layer among the plurality of layers. And a plurality of first ground patterns (1211g, 1212g) can be arranged on both sides of the first feed pattern (1210f). Accordingly, the first feed pattern (1210f) and the plurality of first ground patterns (1211g, 1212g) can form a co-planar waveguide (CPW) structure.
[0144] A first cable connection portion (1210c) of a flexible printed circuit board (1200) may include a second feed pattern (1220f) and a plurality of second ground patterns (1221g, 1222g). The second feed pattern (1220f) may be arranged in a first layer among the plurality of layers. The plurality of second ground patterns (1221g, 1222g) may be arranged on both sides of the second feed pattern (1220f). Accordingly, the second feed pattern (1220f) and the plurality of second ground patterns (1221g, 1222g) may form a CPW structure.
[0145] A third connection substrate portion (1230b) of a flexible printed circuit board (1200) may include a third power supply pattern (1230f) and a third ground pattern (1230g). The third power supply pattern (1230f) may be disposed on a first layer adjacent to a side of a second glass substrate (1010b) among a plurality of layers. The third ground pattern (1230g) may be disposed on a second layer among a plurality of layers. Both ends of the third ground pattern (1230g) may be electrically connected to the first ground pattern (1211g, 1212g) and the second ground pattern (1221g, 1222g) disposed on the first layer, respectively.
[0146] The flexible printed circuit board (1200) may further include fourth to sixth feed patterns (1240f, 1250f, 1260f) and fourth to sixth ground patterns (1241g, 1242g, 1251g, 1252g, 1260g). The second antenna connection portion (1220) of the flexible printed circuit board (1200) may include a fourth feed pattern (1240f) and a plurality of fourth ground patterns (1241g, 1242g). The fourth feed pattern (1240f) may be arranged in a first layer among the plurality of layers. And the plurality of fourth ground patterns (1241g, 1242g) may be arranged on both sides of the fourth feed pattern (1240f). Accordingly, the fourth power supply pattern (1240f) and a plurality of fourth ground patterns (1241g, 1242g) can form a CPW structure.
[0147] The second cable connection portion (1220b) of the flexible printed circuit board (1200) may include a fifth power supply pattern (1250f) and a plurality of fifth ground patterns (1251g, 1252g). The fifth power supply pattern (1250f) may be arranged in a first layer among the plurality of layers. The plurality of fifth ground patterns (1251g, 1252g) may be arranged on both sides of the fifth power supply pattern (1250f). Accordingly, the fifth power supply pattern (1250f) and the plurality of fifth ground patterns (1251g, 1252g) may form a CPW structure.
[0148] The fourth connection substrate portion (1240b) of the flexible printed circuit board (1200) may include a sixth power supply pattern (1260f) and a sixth ground pattern (1260g). The sixth power supply pattern (1260f) may be arranged in a first layer adjacent to a side of a second glass substrate (1010b) among a plurality of layers. The sixth ground pattern (1260g) may be arranged in a second layer among a plurality of layers. Both ends of the sixth ground pattern (1260g) may be electrically connected to the fourth ground patterns (1241g, 1242g) and the fifth ground patterns (1251g, 1252g) arranged in the first layer, respectively.
[0149] Meanwhile, the flexible printed circuit board (1200) may form a plurality of layers. In this regard, the flexible printed circuit board (1200) may include a layer on which conductive patterns are formed and a layer formed of a dielectric material. The plurality of layers of the flexible printed circuit board (1200) may form first, second, and third layers. The first layer (1200a) may form a pattern for electrical connection at the first antenna connection portion (1210), the second antenna connection portion (1220), the first cable connection portion (1210c), and the second cable connection portion (1220c). The second layer (1200b) may form a pattern for forming a ground. The third layer, which is disposed between the first and second layers (1200a, 1200b), may form a substrate made of a dielectric material. The third antenna pattern portion (1110-3) can be placed in the second layer.
[0150] As described above, in order to reduce the transmission loss of the third antenna pattern portion (1100-3) implemented as a Wi-Fi antenna, a slot region (1200SR) from which conductive patterns are removed may be formed on the flexible printed circuit board (1200). Meanwhile, as shown in FIG. 8(b), the performance of the transparent antenna module in the low band (LB) can be improved through an under-cut structure in which a slot layer (1010s) is formed so that the flexible printed circuit board (1200) is not placed in an area where the frame (9) of the vehicle extends.
[0151] In this regard, FIG. 19 illustrates a laminated structure before assembly of a glass substrate having a slot layer formed with an undercut structure, a transparent antenna module, and a vehicle frame, and an enlarged structure assembled therewith. FIG. 19(a) illustrates the laminated structure before assembly of the glass substrate module (1000). FIG. 19(b) is an enlarged view of the structure in which the glass substrate module (1000) is assembled with the vehicle frame (9).
[0152] Referring to FIGS. 7, 8, and 19, a glass substrate (1000) of a double-laminated glass structure includes a first glass substrate (1010a) and a second glass substrate (1010b) having slot layers (1010s). A film layer (1030) is disposed between the first glass substrate (1010a) and the second glass substrate (1010b). A transparent antenna module (1100) including first and second antenna pattern portions (1100-1, 1100-2) may be disposed on the film layer (1030). The first glass substrate (1010a) having the slot layers (1010s) may be coupled to a frame (9) of a vehicle. Accordingly, interference between the transparent antenna module (1100) radiating low-band (LB) signals and the vehicle frame (9) is reduced, thereby improving the efficiency of the transparent antenna module (1100) in the low-band (LB).
[0153] The width of the slot layer (1010s) can be formed to be about 15 mm. The performance degradation of the transparent antenna module (1100) due to interference with the groove (9g) area of the frame (9) can be prevented by the slot layer (1010s) having a predetermined width. A flexible printed circuit board (1200) can be placed on the opaque area (12) of the glass substrate (10). The first and fourth feed patterns (1210f, 1240) can be formed on the first transparent electrode portion (1100a) of the transparent antenna module (1100). The first and second antenna pattern portions (1100-1, 1100-2) can be formed on the second transparent electrode portion (1100b) of the transparent antenna module (1100). The first and second antenna pattern portions (1100-1, 1100-2) can be spaced apart from the opaque region (12) by a predetermined distance by a first transparent electrode portion (1100a) having a predetermined length. Accordingly, the invisibility of the transparent antenna module (1100) can be improved and the antenna efficiency can be increased.
[0154] The second transparency of the second transparent electrode portion (1100b) may be formed to be higher than the first transparency of the first transparent electrode portion (1100a). The second surface resistance value of the second transparent electrode portion (1100b) may be formed to be lower than the first surface resistance value of the first transparent electrode portion (1100a). The first surface resistance value of the first transparent electrode portion (1100a) may be about 0.5 ohm. The second surface resistance value of the second transparent electrode portion (1100b) may be about 0.1 ohm.
[0155] Meanwhile, a glass substrate module (1000) having a transparent antenna module according to the present specification may be placed in a specific area of a glass substrate (1010) of a vehicle. In this regard, FIG. 20 illustrates glass substrate modules that may be placed in multiple areas of a glass substrate of a vehicle.
[0156] Referring to FIG. 20, glass substrate modules (1000, 1000b, 1000c) may be placed on the glass (10) of a vehicle. The glass substrate modules (1000, 1000b) may be formed on one side or the other side region of the glass (10). The glass substrate module (1000c) may be formed on the lower side region of the glass (10). The glass (10) of the vehicle may include a transparent region (11) and an opaque region (12) formed to surround the transparent region (11). The opaque region (12) formed to surround the transparent region (11) may form a frit region.
[0157] The glass substrate module (1000) may include a first transparent electrode region (11a), a second transparent electrode region (11b), and an FPCB (1200). Meanwhile, the second and third glass substrate modules (1000b, 1000c) may include a first transparent electrode region (11a) and an FPCB (1200).
[0158] The FPCB (1200) of the glass substrate module (1000) can be placed in the opaque area (12b) of one side or the other side of the glass (10). The FPCB (1200) of the second glass substrate module (1000b) can be placed in the opaque area (12b) and the transparent area (11) of one side or the other side of the glass (10). The FPCB (1200) of the third glass substrate module (1000c) can be placed in the opaque area (12a) of the lower side of the glass (10).
[0159] The second and third glass substrate modules (1000b, 1000c) may be implemented as a single transparent electrode antenna by having only a first transparent electrode region (11a). When the single transparent electrode antenna is placed in an opaque region (12b) that is narrowly formed, such as a side surface of the glass (10), the opaque region of the FPCB (1200) is exposed to the visible region, which is the transparent region (11) of the glass (10). The conductive pattern placed on the FPCB (1200) forms the opaque region of the FPCB (1200).
[0160] Meanwhile, the glass substrate module (1000) having the first and second transparent electrode regions (11a, 11b) is designed as a heterogeneous sheet resistance transparent electrode. When designed as a heterogeneous sheet resistance transparent electrode, the portion attached to the visible area, which is the transparent area (11) of the glass (10), is all designed as a transparent electrode. Accordingly, the transparent antenna module can be attached to various locations on the vehicle's glass (10) to improve the mountability while also improving the invisibility of the transparent antenna module.
[0161] In this regard, a glass substrate module (1000) implemented with a heterogeneous surface resistance transparent electrode may include a first transparent electrode region (11a), a second transparent electrode region (11b), and an FPCB (1200). The first transparent electrode region (11a) may be formed with a first metal mesh grid structure including metal mesh lines spaced apart by a first interval. The second transparent electrode region (11b) may be formed with a second metal mesh grid structure including metal mesh lines spaced apart by a second interval that is narrower than the first interval.
[0162] The above describes a glass substrate module that can be placed on a vehicle window and a flexible printed circuit board comprising multiple layers. The technical advantages of the glass substrate module and the flexible printed circuit board comprising multiple layers that can be placed on a vehicle window are as follows.
[0163] According to the present specification, interference between a transparent antenna placed in a transparent area and an antenna placed in an opaque area in a glass substrate module of a vehicle glass can be reduced.
[0164] According to the present specification, a Wi-Fi antenna is placed in a specific area on a flexible printed circuit board composed of multiple layers that can be placed on a vehicle window, thereby reducing interference between the Wi-Fi antenna and the transparent antenna.
[0165] According to the present specification, a flexible circuit board can be formed into a folded structure to prevent distortion of a beam shape due to interference between a film material antenna and a transparent electrode forming a transparent antenna.
[0166] According to the present specification, a transparent antenna having a heterogeneous surface resistance transparent electrode structure and an opaque antenna made of a film material can be arranged on one or the other side area of a vehicle glass.
[0167] Further scope of the applicability of this disclosure will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of this disclosure will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as the preferred embodiments of this disclosure, are given by way of example only. The scope of this disclosure should be determined by a reasonable interpretation of the appended claims, and all changes within the equivalent scope of this disclosure are intended to be embraced therein.
Claims
1. In the glass substrate module, First glass substrate; Second glass substrate; A transparent antenna module disposed between the first glass substrate and the second glass substrate; A control unit for controlling the above transparent antenna module; A connecting portion electrically connecting the transparent antenna and the control unit; The above transparent antenna module has a first antenna pattern portion and a second antenna pattern portion, The above connecting part comprises a flexible printed circuit board and coaxial cables, The above flexible printed circuit board is formed with a first region positioned between the first glass substrate and the second glass substrate and a second region positioned outside of either the first or second glass substrate, The first region is electrically connected in some areas to the transparent antenna module, Some areas of the above second area are electrically connected to the coaxial cable, A glass substrate module having a third antenna pattern formed in another portion of the second region.
2. In paragraph 1, The first region of the flexible printed circuit board has a first antenna connection portion electrically connected to the first antenna pattern portion and a second antenna connection portion electrically connected to the second antenna pattern portion, A glass substrate module in which the flexible printed circuit board forms a first connection substrate portion that non-electrically connects the first antenna connection portion and the second antenna connection portion.
3. In paragraph 1, The above flexible printed circuit board forms a second connection substrate portion that non-electrically connects the first connection substrate portion and the third antenna pattern portion, A glass substrate module, wherein the third antenna pattern portion is formed at a position that overlaps the first connection substrate portion and is disposed on the outside of one of the first or second glass substrates.
4. In paragraph 3, The third antenna pattern portion has a soldering area for connection to a third coaxial cable, A glass substrate module in which the power line and ground line of the third coaxial cable are electrically connected to the soldering area.
5. In paragraph 2, The above coaxial cables include a first coaxial cable and a second coaxial cable, The second region of the flexible printed circuit board has a first cable connection portion electrically connected to the first coaxial cable and a second cable connection portion electrically connected to the second coaxial cable, The above flexible printed circuit board is, A third connecting board electrically connecting the first antenna connecting portion and the first cable connecting portion; and A glass substrate module comprising a fourth connecting substrate electrically connecting the second antenna connecting portion and the second cable connecting portion.
6. In paragraph 5, The first cable connection portion is disposed outside one of the first or second glass substrates and is disposed in a non-overlapping area with the first antenna connection portion, A glass substrate module, wherein the second cable connection portion is disposed outside one of the first or second glass substrates and is disposed in a non-overlapping area with the second antenna connection portion.
7. In paragraph 5, The above flexible printed circuit board forms a plurality of layers, The first antenna connection part of the above flexible printed circuit board is, A first power supply pattern arranged in a first layer among the plurality of layers; and including a plurality of first ground patterns arranged on both sides of the first power supply pattern; The first cable connection part of the above flexible printed circuit board is, A second power supply pattern arranged on the first layer among the plurality of layers; and including a plurality of second ground patterns arranged on both sides of the first power supply pattern; The third connecting substrate portion of the above flexible printed circuit board is, A third power supply pattern is disposed on the first layer adjacent to the side of the second glass substrate among the plurality of layers, and a third ground pattern is disposed on the second layer, A glass substrate module, characterized in that both ends of the third ground pattern are electrically connected to the first ground pattern and the second ground pattern respectively arranged in the first layer.
8. In paragraph 5, The above flexible printed circuit board forms a plurality of layers, The second antenna connection part of the above flexible printed circuit board is, A fourth power supply pattern arranged in the first layer among the plurality of layers; and Including a plurality of fourth ground patterns arranged on both sides of the fourth power supply pattern, The second cable connection part of the above flexible printed circuit board is, A fifth power supply pattern arranged in the first layer among the plurality of layers; and Including a plurality of fifth ground patterns arranged on both sides of the fifth power supply pattern, The fourth connecting substrate portion of the above flexible printed circuit board is, A sixth power supply pattern disposed on the first layer adjacent to the side of the second glass substrate among the plurality of layers and a sixth ground pattern disposed on the second layer, A glass substrate module, characterized in that both ends of the sixth ground pattern are electrically connected to the fourth ground pattern and the fifth ground pattern respectively arranged in the first layer.
9. In paragraph 1, The above flexible printed circuit board forms a plurality of layers, The above multiple layers form the first, second and third layers, The first layer forms a pattern for electrical connection at the first antenna connection portion, the second antenna connection portion, the first cable connection portion, and the second cable connection portion, The second layer forms a pattern to form a ground, A third layer disposed between the first and second layers forms a substrate made of a dielectric material, A glass substrate module, characterized in that the third antenna pattern portion is arranged on the second layer.
10. In a flexible printed circuit board composed of multiple layers, A first antenna connection portion and a second antenna connection portion formed on a transparent flexible substrate positioned between a first glass substrate and a second glass substrate and connected to a first antenna pattern portion and a second antenna pattern portion; A first cable connection portion connected to a first antenna connection portion in a first region of the second glass substrate; A second cable connection portion connected to a second antenna connection portion in a second region of the second glass substrate; A third antenna pattern portion arranged in a third region of the second glass substrate; A first connecting substrate portion that non-electrically connects between the first antenna connecting portion and the second antenna connecting portion; A second connection substrate portion non-electrically connecting the first antenna connection portion and the third antenna pattern portion; A third connecting board portion electrically connecting the first antenna connecting portion and the first cable connecting portion; A flexible printed circuit board including a fourth connection substrate portion electrically connecting the second antenna connection portion and the second cable connection portion.
11. In paragraph 10, The first cable connection portion is disposed outside one of the first or second glass substrates and is disposed in a non-overlapping area with the first antenna connection portion, A flexible printed circuit board, wherein the second cable connection portion is disposed on the outside of one of the first or second glass substrates and is disposed in a non-overlapping area with the second antenna connection portion.
12. In paragraph 10, The above flexible printed circuit board forms a plurality of layers, The first antenna connection part of the above flexible printed circuit board is, A first power supply pattern arranged in a first layer among the plurality of layers; and including a plurality of first ground patterns arranged on both sides of the first power supply pattern; The first cable connection part of the above flexible printed circuit board is, A second power supply pattern arranged on the first layer among the plurality of layers; and including a plurality of second ground patterns arranged on both sides of the first power supply pattern; The third connecting substrate portion of the above flexible printed circuit board is, A third power supply pattern is disposed on the first layer adjacent to the side of the second glass substrate among the plurality of layers, and a third ground pattern is disposed on the second layer, A flexible printed circuit board, characterized in that both ends of the third ground pattern are electrically connected to the first ground pattern and the second ground pattern respectively arranged in the first layer.
13. In paragraph 12, The above flexible printed circuit board forms a plurality of layers, The second antenna connection part of the above flexible printed circuit board is, A fourth power supply pattern arranged in the first layer among the plurality of layers; and Including a plurality of fourth ground patterns arranged on both sides of the fourth power supply pattern, The second cable connection part of the above flexible printed circuit board is, A fifth power supply pattern arranged in the first layer among the plurality of layers; and Including a plurality of fifth ground patterns arranged on both sides of the fifth power supply pattern, The fourth connecting substrate portion of the above flexible printed circuit board is, A sixth power supply pattern disposed on the first layer adjacent to the side of the second glass substrate among the plurality of layers and a sixth ground pattern disposed on the second layer, A flexible printed circuit board, characterized in that both ends of the sixth ground pattern are electrically connected to the fourth ground pattern and the fifth ground pattern respectively arranged in the first layer.
14. In paragraph 10, The above flexible printed circuit board forms a plurality of layers, The above multiple layers form the first, second and third layers, The first layer forms a pattern for electrical connection at the first antenna connection portion, the second antenna connection portion, the first cable connection portion, and the second cable connection portion, The second layer forms a pattern to form a ground, A third layer disposed between the first and second layers forms a substrate made of a dielectric material, A flexible printed circuit board, characterized in that the third antenna pattern is arranged on the second layer.
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