Optical transmitter

Abstract

The present application belongs to the technical field of lasers. Disclosed is an optical transmitter, the optical transmitter having a first direction. The optical transmitter comprises a TO header, the TO header being provided with a first face and a second face which are arranged opposite to each other in a first direction; a TO cap, the TO cap being arranged opposite to the first face, and the TO cap and the TO header being in sealed connection to each other and defining an accommodating space; a support part, the support part being arranged inside the accommodating space and connected to the first face; a laser assembly, the laser assembly being arranged on the support part; and a multiplexer, the multiplexer being arranged on the support part and coupled to the laser assembly. The present application helps to reduce the overall package size and increase the space utilization rate. In addition, the TO header and the TO cap can be packaged by means of resistance welding, so as to avoid the problem of weak light outputs of the optical transmitter caused by the stress deformation of a package structure.

Description

A light transmitter

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 13, 2023, with application number 202323053352.7 and invention name “A Light Emitter”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the field of lasers, and specifically relates to an optical transmitter. Background Art

[0003] Currently, multi-channel optical transmitters mostly use free-space wavelength division multiplexing BOX packaging. The overall size of the BOX is large, which affects the further increase in the number of channels. In addition, the BOX packaging usually adopts a parallel seam welding process, which easily causes the BOX to deform under stress, thereby causing the light output of the device to weaken. Utility Model Content

[0004] Purpose of the utility model: The embodiment of the present application provides an optical transmitter to solve the above-mentioned problems.

[0005] Technical solution: A light emitter according to an embodiment of the present application has a first direction and includes:

[0006] A TO tube socket, wherein the TO tube socket has a first surface and a second surface arranged opposite to each other in the first direction;

[0007] A TO tube cap, the TO tube cap and the first surface are arranged opposite to each other, and the TO tube cap is sealed and connected to the TO tube base to enclose and form a receiving space;

[0008] a supporting portion, the supporting portion being disposed in the accommodating space and connected to the first surface;

[0009] a laser assembly, wherein the laser assembly is disposed on the support portion;

[0010] A multiplexer is disposed on the support portion and is coupled to the laser assembly.

[0011] In some embodiments, a receiving cavity is provided in the TO cap, and the TO cap has a first end and a second end arranged opposite to each other in the first direction, the first end is connected to the first surface, the first end is provided with an opening, and the opening is connected to the receiving cavity, and the second end is provided with a light window, and a lens is encapsulated on the light window to couple the light output by the multiplexer.

[0012] In some embodiments, the light emitter has a second direction that intersects the first direction;

[0013] The laser assembly includes a plurality of laser emitting elements, and the plurality of laser emitting elements are spaced apart in the second direction;

[0014] The multiplexing element has a third end and a fourth end that are oppositely arranged in the first direction. The third end is provided with a plurality of input waveguide parts at intervals in the second direction. The plurality of input waveguide parts are coupled to the plurality of laser emitting elements and correspond one to one. The fourth end is provided with an output waveguide part.

[0015] In some embodiments, the light emitter further comprises:

[0016] An electrical connector is provided on the TO tube seat, and includes a ceramic component that passes through the first surface and the second surface. The ceramic component is provided with a conductive portion for electrical connection, and the ceramic component is electrically connected to the laser assembly.

[0017] In some embodiments, the laser assembly further comprises a pad, wherein the pad is disposed on the support portion, and the laser emitting element is disposed on a side of the pad facing away from the support portion;

[0018] A side of the pad facing away from the support portion is flush with a side of the ceramic component facing away from the support portion.

[0019] In some embodiments, the light emitter further comprises:

[0020] a refrigeration element, the refrigeration element being connected to the support portion, the refrigeration element having a refrigeration surface, the laser assembly being connected to the refrigeration surface; and / or,

[0021] The multiplexing element is connected to the refrigeration surface.

[0022] In some embodiments, the multiplexing component is configured as a silicon photonic chip and mounted on the supporting portion.

[0023] In some embodiments, the TO tube seat and the supporting portion are integrally formed.

[0024] In some embodiments, the lens is connected to the second end;

[0025] The light emitter also includes a packaging shell, which covers the outside of the lens and is provided with a light port. The light port is opposite to the light window in the first direction. An optical connector is provided at one end of the packaging shell located at the light port away from the light window, and an isolation member is connected between the optical connector and the light port to isolate the light reflected by the optical connector toward the light port.

[0026] In some embodiments, the lens is embedded in the light window, an optical connector is provided at the second end, and an isolation member is connected between the optical connector and the light window to isolate the light reflected by the optical connector toward the light window.

[0027] In some embodiments, the light emitter has a third direction intersecting the first direction;

[0028] The TO tube holder includes:

[0029] a base, the first surface and the second surface being located on the base;

[0030] An extension portion is connected to the first surface, the extension portion has a third surface facing the support portion in the third direction, the support portion is attached to the third surface, and the TO tube cap is arranged on the third surface to enclose the first surface and the third surface to form the accommodating space.

[0031] In some embodiments, the cross-section of the TO tube seat and the TO tube cap along the direction perpendicular to the first direction is rectangular or circular.

[0032] Beneficial effects: The optical transmitter includes a TO tube seat, a TO tube cap, a support part, a laser assembly and a multiplexer, wherein the TO tube seat has a first surface and a second surface arranged opposite to each other in a first direction, the TO tube cap and the first surface are arranged opposite to each other, and the TO tube cap and the TO tube seat are sealed and connected to form a receiving space, and the support part is arranged in the receiving space and connected to the first surface; the laser assembly is arranged on the support part, and by encapsulating the multiplexer in the receiving space and optically coupling it with the laser assembly, it is beneficial to reduce the overall package size and improve space utilization, and the TO tube seat and the TO tube cap can be packaged by resistance welding to avoid the problem of the light output of the optical transmitter becoming weaker due to the deformation of the packaging structure under force. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0034] FIG1 is a schematic diagram of the overall structure of the optical transmitter according to Example 1 of the present application;

[0035] FIG2 is a schematic diagram of the exploded structure of the light emitter according to Example 1 of the present application;

[0036] FIG3 is a schematic diagram of the structure of the light emitter in a top view according to Example 1 of the present application;

[0037] FIG4 is a schematic cross-sectional view of the structure along line AA in FIG3 ;

[0038] FIG5 is a schematic diagram of the packaging structure of a TO cap and a TO socket in Example 1 of the present application;

[0039] FIG6 is a schematic structural diagram of the laser assembly, the multiplexing component, and the refrigeration component in Example 1 of the present application.

[0040] FIG7 is a schematic diagram of the overall structure of the optical transmitter according to Example 2 of the present application;

[0041] FIG8 is a schematic diagram of the exploded structure of the light emitter according to Example 2 of the present application;

[0042] FIG9 is a schematic diagram of the overall structure of the optical transmitter according to Example 3 of the present application;

[0043] FIG10 is a schematic diagram of the exploded structure of the light emitter according to Example 3 of the present application;

[0044] Figure numerals: 1, light emitter; 10, TO tube seat; 100, first surface; 101, second surface; 102, support portion; 103, base; 104, extension portion; 105, third surface; 106, through groove; 107, positioning groove; 20, TO tube cap; 200, accommodation space; 201, accommodation cavity; 202, first end; 203, second end; 204, opening; 205, light window; 206, lens; 207, joint; 30, laser assembly; 300, laser emitting component; 301, pad; 40, Multiplexing component; 400, third end; 401, fourth end; 402, input waveguide; 403, output waveguide; 404, monitoring photodiode; 50, electrical connector; 500, ceramic component; 501, conductive portion; 60, cooling component; 600, cooling surface; 601, thermistor; 70, packaging shell; 700, optical port; 701, first transition ring; 702, second transition ring; 703, cut-out; 80, optical connector; 800, isolation component; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0046] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "multiple" means two or more, and at least one means one, two or more, unless otherwise clearly and specifically defined.

[0047] The applicant notes that currently, most hermetic multi-channel optical transmitters utilize free-space wavelength division multiplexing (WDM) BOX packaging. The BOX itself is relatively expensive, primarily due to the metal shell / sapphire optical window and extensive gold plating. It is primarily used in applications with narrow wavelength spacing, requiring thermal control using a semiconductor thermoelectric cooler (TEC), and a large number of pins. The multi-channel COB process used in commonly used hermetic multi-channel optical transmitters is also complex, costly, and large in overall size, hindering the ability to further increase the number of channels. Furthermore, the traditional free-space Mux / Demux WDM BOX solution can easily cause the BOX to deform under stress during parallel seam welding, leading to light loss.

[0048] In view of this, an embodiment of the present application discloses a light transmitter, which can solve at least one of the above-mentioned defects.

[0049] Example 1:

[0050] 1 and 2 , the optical transmitter 1 has a first direction X, a second direction Y, and a third direction Z that intersect in pairs. The optical transmitter 1 includes a TO tube socket 10 and a TO tube cap 20 arranged sequentially in the first direction X. The TO tube socket 10 has a first surface 100 and a second surface 101 that are oppositely disposed in the first direction X. The TO tube cap 20 is disposed opposite the first surface 100. The TO tube cap 20 is sealedly connected to the TO tube socket 10 and encloses a receiving space 200. A support portion 102 is provided within the receiving space 200, and the support portion 102 is connected to the first surface 100. A laser assembly 30 and a multiplexer 40 are sequentially arranged on the support portion 102 in the first direction X. The multiplexer 40 is located on the side of the laser assembly 30 that faces away from the TO tube socket 10, and the multiplexer 40 is optically coupled to the laser assembly 30.

[0051] By encapsulating the multiplexer 40TO within the accommodating space 200 and directly coupling it to the laser assembly 30, the overall package size is reduced, space utilization is improved, and the number of optical channels can be further increased within a limited space. TO stands for Transistor Outline. The TO base 10 and TO cap 20 can be encapsulated using resistance welding. Compared to the parallel seam welding process of BOX packaging, this avoids the problem of weakened light output from the optical transmitter 1 due to deformation of the package structure under stress.

[0052] Specifically, referring to Figures 1 to 4 , a receiving cavity 201 is defined within the TO cap 20. The TO cap 20 has a first end 202 and a second end 203 that are oppositely disposed in a first direction X. The first end 202 is connected to the first surface 100 and has an opening 204 that communicates with the receiving cavity 201. The second end 203 is provided with a light window 205, which is encapsulated with a lens 206 to couple light output from the multiplexer 40.

[0053] Referring to Figures 1 and 4 , the TO socket 10 is provided with a through-slot 106 extending through the first and second surfaces 100 and 101. An electrical connector 50 is inserted through the through-slot 106, extending from the first and second surfaces 100 and 101 at opposite ends in the first direction X. The electrical connector 50 is electrically connected to the laser assembly 30. In this embodiment, the main body of the electrical connector 50 is a ceramic member 500, which is provided with a conductive portion 501. Specifically, the conductive portion 501 may be a gold-plated layer applied to the surface of the ceramic member 500. In other embodiments, to reduce manufacturing costs, a coating structure such as nickel plating may also be used, as long as it provides electrical connection. It is understood that in some embodiments, a via (not shown) may be provided within the ceramic member 500 to enable high-speed interconnection between components within the housing space 200 and the exterior. Furthermore, the ceramic member 500 may be secured to the TO socket 10 via a silver-copper soldering process to ensure airtightness.

[0054] In this embodiment, the cross-sections of the TO tube cap 20 and the TO tube base 10 in the first direction X are both rectangular, which improves space utilization while reusing TO packaging processes and equipment to reduce manufacturing costs. Specifically, the TO tube base 10 is provided with multiple positioning grooves 107 along the edge on the second surface 101, which facilitates matching with TO automation equipment to complete processes such as patching.

[0055] 4 and 6 , in this embodiment, the laser assembly 30 includes a plurality of laser emitting elements 300 spaced apart in the second direction Y. The multiplexing element 40 has a third end 400 and a fourth end 401 disposed opposite each other in the first direction X. The third end 400 is provided with a plurality of input waveguides 402 spaced apart in the second direction Y. The plurality of input waveguides 402 couple to the plurality of laser emitting elements 300 in a one-to-one correspondence. The fourth end 401 is provided with an output waveguide 403.

[0056] Specifically, in this embodiment, the number of laser emitting elements 300 and the number of input waveguide parts 402 are set to four respectively. In other embodiments, they can also be designed as a single-channel structure or further expanded to eight channels, sixteen channels, etc., which are not detailed here.

[0057] It should be noted that the waveguide mode diameter of the input waveguide portion 402 matches the mode field diameter of the laser emitting element 300, thereby achieving mode spot matching and increasing the coupling efficiency between the two. Furthermore, it should be noted that a pad 301 is provided at the bottom of the laser emitting element 300. The laser emitting element 300 and the pad 301 are assembled into a COC (Chip On Carrier) assembly via gold-tin soldering.

[0058] 4 , in some embodiments, the side of the pad 301 facing away from the support portion 102 is flush with the side of the ceramic member 500 facing away from the support portion 102. This helps shorten the bonding distance for the electrical connection between the pad 301 and the ceramic member 500.

[0059] Referring to Figures 4 and 6 , a cooling element 60 is disposed between the support portion 102 and the laser assembly 30. In this embodiment, the cooling element 60 utilizes a semiconductor cooler (TEC). The side of the cooling element 60 facing away from the support portion 102 serves as a cooling surface 600, and the laser assembly 30 is secured to the cooling surface 600. In some embodiments, the cooling element 60 may not be disposed between the support portion 102 and the laser assembly 30. Instead, a ceramic or metal material with good heat dissipation may be mounted on the support portion 102 to accommodate and dissipate heat from the laser assembly 30. Furthermore, in some embodiments, the support portion 102 may be thickened only in the third direction (Z) to accommodate the required mounting height of components such as the laser assembly 30.

[0060] Furthermore, in some embodiments, the support portion 102 and the TO tube holder 10 are integrally formed, thereby facilitating heat dissipation between the support portion 102 and the TO tube holder 10 and simplifying the overall product process.

[0061] Meanwhile, in this embodiment, the multiplexer 40 is also connected to the cooling surface 600. Furthermore, a thermistor 601 is provided on the cooling surface 600, and the thermistor 601 is electrically connected to the electrical connector 50, thereby facilitating detection of the cooling temperature of the cooling element 60. In some embodiments, the multiplexer 40 can also be directly disposed on the support portion 102.

[0062] It should be noted that the multiplexer 40 and thermistor 601 are passively mounted on the cooling surface 600 of the cooling element 60. Using a COC assembly power supply fixture, the four COC assemblies are coupled to the four input waveguides 402. The optical power of the output waveguide 403 is monitored. Once the power meets the specifications, the COC assemblies are glued to the cooling surface 600 or the multiplexer 40. Finally, gold wire bonding is used to electrically interconnect the laser emitting element 300, ceramic element 500, cooling element 60, and thermistor 601.

[0063] In addition, in this embodiment, the multiplexing element 40 uses a silicon photonic chip to reduce the overall size and space occupation.

[0064] It is understood that a refractive index matching adhesive can be used between the laser emitting element 300 and the input waveguide portion 402 to reduce end face reflection and increase coupling efficiency. In some embodiments, the waveguide of the multiplexer 40 can also be designed to have a certain angle with the side to further reduce the impact of reflection. In some embodiments, the multiplexer 40 can also integrate a monitor photodiode (MPD) for power monitoring. The multiplexer 40 only needs to couple the light waves entering the input waveguide portion 402. The waveguide mode within the multiplexer 40 is stable, and the output waveguide has almost no difference between different wavelengths, which can be approximated as single-channel coupling. This reduces the difficulty of coupling balance at the external lens 206 and optical connector 80, and reduces the risk of output light weakening.

[0065] 2, 3, and 4, in this embodiment, a first transition ring 701 is fixedly mounted on the outer side of the lens 206. The lens 206 is welded to the TO cap 20 via the first transition ring 701 to secure it to the outer side of the light window 205, thereby transmitting light emitted from the light window 205 to the outer side of the TO cap 20. In some embodiments, the lens 206 can be directly integrated with the light window 205 of the TO cap 20, in which case the first transition ring 701 is not required.

[0066] Further, referring to Figures 2 and 4 , it should be noted that in this embodiment, the TO cap 20 is provided with a circumferentially extending joint portion 207 located outside the first end 202. The TO cap 20 is sealedly connected to the first surface 100 via the joint portion 207. Since the lens 206 is located outside the TO cap 20 in this embodiment, an encapsulating shell 70 is provided outside the TO cap 20 to enclose the lens 206 and the first transition ring 701. In this embodiment, the encapsulating shell 70 can be welded to the side of the joint portion 207 facing away from the TO socket 10.

[0067] 2 and 4 , the package shell 70 is provided with an optical port 700 opposite the lens 206. The optical port 700 is opposite the optical window 205 in a first direction X. An optical connector 80 is provided at the end of the package shell 70 located away from the optical window 205. An isolator 800 is connected between the optical connector 80 and the optical port 700 to isolate light reflected from the optical connector 80 toward the optical port 700. Specifically, a second transition ring 702 is welded to the package shell 70 outside the optical port 700. After the isolator 800 is connected to the optical connector 80, it is welded to the inside of the second transition ring 702, thereby ensuring a stable connection between the optical connector 80 and the package shell 70.

[0068] The implementation principle of Example 1 is as follows: by encapsulating the multiplexer 40 in the accommodation space 200 through a TO package and directly coupling the laser assembly 30, it is beneficial to reduce the overall package size and improve space utilization. In addition, the TO tube base 10 and the TO tube cap 20 can be encapsulated by resistance welding, that is, the TO packaging process is reused. Compared with BOX packaging, the problem of the light emitter 1 being weakened due to the deformation of the packaging structure due to stress is avoided.

[0069] Example 2:

[0070] 7 and 8 , the present embodiment differs from the first embodiment in that the cross-sections of the TO cap 20 and the TO base 10 in the first direction X are both circular. It is understandable that in other embodiments, the cross-sections of the TO cap 20 and the TO base 10 in the first direction X may also be other polygonal structures such as triangles, pentagons, etc., which will not be repeated here.

[0071] In this embodiment, a monitoring photodiode 404 (MPD) is mounted on the first surface 100 of the TO tube holder 10 for power monitoring. That is, the monitoring photodiode 404 does not need to be integrated into the multiplexer 40, which helps to reduce the overall area and cost of the multiplexer 40 and improve the manufacturing yield. The monitoring photodiode 404 can be electrically connected to the electrical connector 50 by gold wire welding.

[0072] Furthermore, in this embodiment, the TO cap 20 is integrated with the lens 206 at one end of the optical window 205. This means that the lens 206 and the TO cap 20 are integrally manufactured, eliminating the need for additional parts to secure the lens 206 structure and the need for a housing 70 to protect and encapsulate the lens 206 structure. This simplifies the manufacturing process for the optical transmitter 1. The TO cap 20 is positioned outside the optical window 205 and directly secures the second transition ring 702. After the spacer 800 is connected to the optical connector 80, it is welded to the inside of the second transition ring 702, thereby ensuring a stable connection between the optical connector 80 and the TO cap 20.

[0073] The implementation principle of Example 2 is as follows: by designing the TO cap 20 and the TO base 10 to have a circular cross-section in the first direction X, and integrating the lens 206 at the light window 205 of the TO cap 20, there is no need to reuse the transition ring structure and the packaging shell 70 structure, which is conducive to further reducing the overall structural size of the optical transmitter 1 and improving space utilization. At the same time, the MPD 404 is externally mounted on the TO base 10, reducing the area and manufacturing cost of the multiplexer 40 and improving its manufacturing yield.

[0074] Example 3:

[0075] 9 and 10 , this embodiment differs from Embodiment 1 in that the TO socket 10 includes a base 103 and an extension 104. The first surface 100 and the second surface 101 are located on the base 103. The extension 104 connects to the first surface 100. The base 103 and the extension 104 as a whole have an L-shaped cross-section in the second direction Y. The extension 104 has a third surface 105 facing the support portion 102 in the third direction Z. The bottom surface of the support portion 102 abuts against the third surface 105. The TO cap 20 is disposed on the third surface 105 to enclose the first surface 100 and the third surface 105 to form a receiving space 200.

[0076] Specifically, to adapt to the structure of the TO tube seat 10, the TO tube cap 20 is provided with openings 204 facing the first surface 100 and the third surface 105. The TO tube cap 20 is respectively provided with interconnected joints 207 at the edges of the opening 204 facing the first surface 100 and the edges of the opening 204 facing the third surface 105. The TO tube cap 20 is sealed to the first surface 100 and the third surface 105 through the integral joint 207.

[0077] Furthermore, based on the structure of the TO tube cap 20 and the TO tube base 10, in order to encapsulate the lens 206 and adapt to the structure of the TO tube cap 20 and the TO tube base 10, the packaging shell 70 is grooved, that is, a cutout 703 is provided at the lower portion of the packaging shell 70, so that when the cover is placed on the TO tube cap 20, the packaging shell 70 is in contact with the two coupling portions 207 and the end of the extension portion 104 away from the first surface 100, thereby avoiding blocking the side of the extension portion 104 away from the support portion 102 from direct contact with the external connection for heat exchange.

[0078] The implementation principle of Example 3 is as follows: the extension portion 104 is in direct contact with the support portion 102. After the packaging shell 70 encapsulates the TO tube cap 20 and the lens 206, the side of the extension portion 104 facing away from the support portion 102 can be used as the main heat dissipation surface to directly contact the outside, thereby further effectively improving the heat dissipation effect of the TO packaging structure.

[0079] The above is a detailed introduction to an optical transmitter provided in an embodiment of the present application, and specific examples are used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application; ordinary technicians in this field should understand that: they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. A light transmitter (1), characterized in that: The light emitter (1) has a first direction (X), and the light emitter (1) comprises: A TO tube socket (10), wherein the TO tube socket (10) has a first surface (100) and a second surface (101) arranged opposite to each other in the first direction (X); A TO tube cap (20), the TO tube cap (20) and the first surface (100) are arranged opposite to each other, and the TO tube cap (20) and the TO tube base (10) are sealed and connected to form a receiving space (200); a support portion (102), the support portion (102) being disposed in the accommodating space (200), and the support portion (102) being connected to the first surface (100); A laser component (30), wherein the laser component (30) is arranged on the support portion (102); A multiplexer (40) is disposed on the support portion (102) and is coupled to the laser assembly (30).

2. The optical transmitter (1) according to claim 1, characterized in that The TO tube cap (20) is provided with a receiving cavity (201) therein, and the TO tube cap (20) has a first end (202) and a second end (203) arranged opposite to each other in the first direction (X), the first end (202) being connected to the first surface (100), the first end (202) being provided with an opening (204), and the opening (204) being connected to the receiving cavity (201), and the second end (203) being provided with a light window (205), and a lens (206) being encapsulated on the light window (205) to couple the light output by the multiplexer (40).

3. The optical transmitter (1) according to claim 1, characterized in that The light emitter (1) has a second direction (Y) intersecting the first direction (X); The laser assembly (30) comprises a plurality of laser emitting elements (300), and the plurality of laser emitting elements (300) are arranged at intervals in the second direction (Y); The multiplexing element (40) has a third end (400) and a fourth end (401) arranged opposite to each other in the first direction (X); the third end (400) is provided with a plurality of input waveguide parts (402) at intervals in the second direction (Y); the plurality of input waveguide parts (402) are coupled to a plurality of laser emitting elements (300) and correspond to each other one by one; and the fourth end (401) is provided with an output waveguide part (403).

4. The optical transmitter (1) according to claim 3, characterized in that The optical transmitter (1) further comprises: An electrical connector (50), the electrical connector (50) being arranged on the TO tube seat (10), the electrical connector (50) comprising a ceramic component (500) penetrating the first surface (100) and the second surface (101), the ceramic component (500) being provided with a conductive portion (501) for electrical connection, and the ceramic component (500) being electrically connected to the laser assembly (30).

5. The optical transmitter (1) according to claim 4, characterized in that The laser assembly (30) further comprises a cushion block (301), wherein the cushion block (301) is arranged on the support portion (102), and the laser emitting element (300) is arranged on a side of the cushion block (301) facing away from the support portion (102); A side of the cushion block (301) facing away from the support portion (102) is flush with a side of the ceramic component (500) facing away from the support portion (102).

6. The optical transmitter (1) according to claim 1, characterized in that The optical transmitter (1) further comprises: A refrigeration component (60), the refrigeration component (60) being connected to the support portion (102), and the refrigeration component (60) having a refrigeration surface (600); The laser assembly (30) is connected to the refrigeration surface (600); and / or, The multiplexing element (40) is connected to the refrigeration surface (600).

7. The optical transmitter (1) according to claim 1, characterized in that The multiplexing component (40) is configured as a silicon photonic chip and mounted on the supporting portion (102).

8. The optical transmitter (1) according to claim 1, characterized in that The TO tube seat (10) and the supporting portion (102) are integrally formed.

9. The optical transmitter (1) according to claim 2, characterized in that The lens (206) is connected to the second end (203); The optical transmitter (1) further comprises a packaging shell (70), the packaging shell (70) being arranged to cover the outside of the lens (206), and the packaging shell (70) being provided with an optical port (700), the optical port (700) being opposite to the optical window (205) in the first direction (X), an optical connector (80) being provided at one end of the packaging shell (70) located at the optical port (700) away from the optical window (205), and an isolating member (800) being connected between the optical connector (80) and the optical port (700) to isolate light reflected by the optical connector (80) toward the optical port (700).

10. The optical transmitter (1) according to claim 2, characterized in that The lens (206) is embedded in the light window (205); the second end (203) is provided with an optical connector (80); and an isolation member (800) is connected between the optical connector (80) and the light window (205) to isolate light reflected by the optical connector (80) toward the light window (205).

11. The optical transmitter (1) according to claim 1, characterized in that The light emitter (1) has a third direction (Z) intersecting with the first direction (X); The TO tube holder (10) comprises: A base (103), wherein the first surface (100) and the second surface (101) are located on the base (103); An extension portion (104), the extension portion (104) is connected to the first surface (100), the extension portion (104) has a third surface (105) facing the support portion (102) in the third direction (Z), the support portion (102) is in contact with the third surface (105), and the TO cap (20) is arranged on the third surface (105) to enclose the accommodating space (200) relative to the first surface (100) and the third surface (105).

12. The optical transmitter (1) according to any one of claims 1 to 11, characterized in that The cross-sectional shape of the TO tube seat (10) and the TO tube cap (20) along the direction perpendicular to the first direction (X) is rectangular or circular.

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