Camera module, image acquisition method, electronic device, apparatus, and storage medium

Abstract

The present application belongs to the technical field of cameras, and discloses a camera module, an image acquisition method, an electronic device, an apparatus, and a storage medium. The camera module comprises a housing, a grating structure, an image sensor, and a reflective component. The grating structure, the image sensor, and the reflective component are provided within the housing. The image sensor comprises a first photosensitive layer and a second photosensitive layer which are stackedly arranged. The grating structure is arranged above the image sensor. When incident light reaches the grating structure, part of the light penetrates through the grating structure and then reaches the first photosensitive layer of the image sensor, and part of the light is diffracted to the reflective component by means of the grating structure and then the light reaches the second photosensitive layer of the image sensor after being reflected by the reflective component.

Description

Camera module, image acquisition method, electronic equipment, device and storage medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 13, 2023, with application number 202311512311.1 and titled “Camera module, image acquisition method, electronic device, device and storage medium,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the field of camera technology, and specifically relates to a camera module, an image acquisition method, an electronic device, a device and a storage medium. Background Art

[0003] Typically, electronic devices increase the number of pixels in their image sensors to improve image clarity. However, for image sensors of the same size, a larger number of pixels means a smaller single pixel area, which results in reduced sensitivity and dynamic range.

[0004] To avoid these issues and improve the clarity of captured images, electronic devices can use multi-frame synthesis algorithms to produce higher-resolution images. Specifically, when capturing an image, the electronic device can move the image sensor one pixel in each of the four directions, capturing an image with each movement. Generally, four moves are sufficient to increase the number of actual light-sensitive pixels. Multiple frames can then be synthesized to achieve higher resolution.

[0005] While these methods can theoretically improve resolution, they are very difficult to implement in practice. For example, it is very difficult for electronic devices to control the image sensor to move only one pixel at a time. As a result, the clarity of the images captured by electronic devices is still not ideal.

[0006] Summary of the Invention

[0007] The purpose of the embodiments of the present application is to provide a camera module, an image acquisition method, an electronic device, an apparatus and a storage medium, which can improve the clarity of images taken by the electronic device.

[0008] In a first aspect, an embodiment of the present application provides a camera module, which includes: a housing, a grating structure, an image sensor and a reflective component; the grating structure, the image sensor and the reflective component are arranged in the housing; the image sensor includes a first photosensitive layer and a second photosensitive layer that are stacked; the grating structure is arranged above the image sensor, and after the incident light reaches the grating structure, part of the light passes through the grating structure and then reaches the first photosensitive layer of the image sensor, and part of the light is diffracted by the grating structure to the reflective component, and then reflected by the reflective component to reach the second photosensitive layer of the image sensor.

[0009] In a second aspect, an embodiment of the present application provides an electronic device, which includes the camera module as described in the first aspect.

[0010] In a third aspect, an embodiment of the present application provides an image acquisition method, which is executed by the electronic device described in the second aspect. The image acquisition method includes: controlling the grating structure of the camera module to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and acquiring first image data through the image sensor; controlling the grating structure to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and acquiring second image data through the image sensor; and obtaining third image data based on the first image data and the second image data.

[0011] In a fourth aspect, embodiments of the present application provide an image acquisition device, comprising the camera module described in the first aspect, further comprising: an acquisition module and a processing module. The acquisition module is configured to control the camera module's grating structure to diffract a portion of incident light onto the second photosensitive layer of the image sensor and acquire first image data via the image sensor; and to control the grating structure to transmit a portion of incident light onto the first photosensitive layer of the image sensor and acquire second image data via the image sensor. The processing module is configured to acquire the first and second image data based on the acquisition module to obtain third image data.

[0012] In a fifth aspect, an embodiment of the present application provides an electronic device comprising a processor and a memory, wherein the memory stores programs or instructions that can be run on the processor, and when the programs or instructions are executed by the processor, the steps of the method described in the third aspect are implemented.

[0013] In a sixth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the method described in the third aspect are implemented.

[0014] In the seventh aspect, an embodiment of the present application provides a chip, which includes a processor and a communication interface, the communication interface and the processor are coupled, and the processor is used to run programs or instructions to implement the method described in the third aspect.

[0015] In an eighth aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and is executed by at least one processor to implement the method described in the third aspect.

[0016] In an embodiment of the present application, a grating structure is provided in the camera module. By controlling the grating parameters of the grating structure, the grating structure can be made to have both a transmission function and a diffraction function, thereby controlling a portion of the incident light to pass through the grating structure and reach the first photosensitive layer of the image sensor, and also controlling a portion of the incident light to be diffracted to the reflective component and then reflected by the reflective component to reach the second photosensitive layer of the image sensor. Since the image sensor in the embodiment of the present application can be sensitive on both sides, the number of photosensitive pixels is increased without changing the pixel size in the image sensor, thereby greatly improving the photosensitivity of the image sensor and ultimately improving the clarity of the captured image.

[0017] In an embodiment of the present application, when performing image acquisition, the grating structure is controlled to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and the first image data is acquired. The grating structure is controlled to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and the second image data is acquired. Finally, based on the first image data and the second image data, the third image data can be obtained. Since the third image data is a fusion of the first image data and the second image data, the clarity of the final image can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a structural diagram of a camera module according to an embodiment of the present application;

[0019] FIG2A is a schematic diagram of a grating structure according to an embodiment of the present application;

[0020] FIG2B is a second structural schematic diagram of a grating structure provided in an embodiment of the present application;

[0021] FIG2C is a third structural schematic diagram of a grating structure provided in an embodiment of the present application;

[0022] FIG2D is a fourth structural schematic diagram of a grating structure provided in an embodiment of the present application;

[0023] FIG3 is a second structural diagram of a camera module provided in an embodiment of the present application;

[0024] FIG4 is a schematic structural diagram of a photosensitive layer provided in an embodiment of the present application;

[0025] FIG5 is a schematic diagram of a circuit structure of a logic circuit layer provided in an embodiment of the present application;

[0026] FIG6 is a second schematic diagram of a circuit structure of a logic circuit layer provided in an embodiment of the present application;

[0027] FIG7 is a third structural diagram of a camera module provided in an embodiment of the present application;

[0028] FIG8 is a flowchart of an image acquisition method according to an embodiment of the present application;

[0029] FIG9 is a second flowchart of an image acquisition method provided in an embodiment of the present application;

[0030] FIG10 is a schematic diagram of a structure of an image acquisition device according to an embodiment of the present application;

[0031] FIG11 is a schematic diagram of a hardware structure of an electronic device provided in an embodiment of the present application;

[0032] FIG12 is a second schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application. Specific embodiments

[0033] The following will be combined with the accompanying drawings in the embodiments of this application to clearly describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0034] The terms "first," "second," and the like in the specification of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification indicates at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0035] The terms "at least one" and "at least one of" in the specification of this application refer to any one, any two, or a combination of more than two of the objects included. For example, at least one of a, b, and c can be represented by: "a", "b", "c", "a and b", "a and c", "b and c", and "a, b, and c", where a, b, and c can be single or multiple. Similarly, "at least two" means two or more, and its meaning is similar to "at least one".

[0036] The image sensor, image acquisition method, electronic device, apparatus, and storage medium provided in the embodiments of the present application are described in detail below with reference to specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0037] With the advancement of electronic technology, electronic devices are becoming increasingly versatile. For example, electronic devices can capture images using image sensors. Image sensors convert optical images into electronic signals and are widely used in digital cameras and other electronic optical devices. Currently, image sensors are primarily categorized into two types: charge-coupled devices (CCDs) and complementary metal oxide semiconductor (CMOS) active pixel sensors (APSs). CMOS active pixel sensors are a type of active pixel sensor that utilizes CMOS semiconductors. Each photoelectric sensor has circuitry that directly converts light energy into a voltage signal. Unlike CCDs, they do not involve signal charge. An analog-to-digital converter (ADC) may also be required on the motherboard to convert the output signal into a digital signal. CMOS sensor pixels can only sense brightness. To achieve color perception, a color filter array (CFA) must be placed over the pixels. The CFA filters light from other wavelengths, allowing the desired wavelengths to pass through and be converted to photoelectricity by the pixels. This enables the pixels to sense color, but this approach wastes light energy. Moreover, this method has a relatively rough ability to perceive color.

[0038] Competition in the camera market for electronic devices is increasingly fierce, especially in the photography sector. Competition is fierce across various terminals, primarily focused on improving image clarity. Improving clarity requires increasing pixel count, but for sensors of the same size, more pixels means smaller pixel areas, which can lead to a number of negative effects, such as reduced sensor sensitivity and dynamic range. To address these issues, the industry typically uses algorithms such as single-frame interpolation, multi-frame synthesis, and multi-camera fusion to improve clarity.

[0039] Each of the above solutions has its own drawbacks. Single-frame interpolation algorithms can achieve some improvement, but since the number of actual photosensitive pixels hasn't increased, the improvement is limited. Interpolation errors can even occur in very high-frequency scenes (such as those with detailed images). A typical example of a multi-frame algorithm is pixel shifting. This involves moving the sensor one pixel in each of the four directions, capturing an image with each movement. Typically, four shifts are sufficient to increase the number of actual photosensitive pixels. Multiple frames are then synthesized to achieve higher resolution. While this method can theoretically improve resolution, it is extremely difficult to implement in practice. The key issue is that precisely moving the sensor by just one pixel at a time is difficult to control, resulting in suboptimal results. Multi-frame fusion and multi-camera fusion essentially fuse multiple images, extracting the clarity and texture of each image and superimposing the frames to enhance the final image's clarity. However, multi-frame fusion increases camera power consumption. Furthermore, multi-frame capture requires the user to remain motionless, otherwise the fusion effect will be compromised. Overall, this approach has significant drawbacks.

[0040] In the camera module, image acquisition method, electronic device, apparatus and storage medium provided in the present application, a grating structure is set in the camera module. By controlling the grating parameters of the grating structure, the grating structure can have both a transmission function and a diffraction function, so that a part of the incident light can be controlled to pass through the grating structure to reach the first photosensitive layer of the image sensor, and a part of the incident light can be controlled to be diffracted to the reflective component and then reflected by the reflective component to reach the second photosensitive layer of the image sensor. Since the image sensor in the embodiment of the present application can be sensitive on both sides, the number of photosensitive pixels is increased without changing the pixel size in the image sensor, thereby greatly improving the photosensitivity of the image sensor and ultimately improving the clarity of the captured image.

[0041] An embodiment of the present application provides an image sensor. FIG1 shows a schematic structural diagram of a camera module provided in an embodiment of the present application. The camera module 10 includes: a housing 11 , a grating structure 12 , an image sensor 13 and a reflective component 14 .

[0042] Exemplarily, the grating structure 12 , the image sensor 13 and the reflective assembly 14 are arranged in a housing; the image sensor 13 includes a first photosensitive layer 131 and a second photosensitive layer 132 that are stacked.

[0043] For example, the grating structure 12 is arranged above the image sensor 13. After the incident light reaches the grating structure 12, a portion of the light passes through the grating structure 12 and then reaches the first photosensitive layer 131 of the image sensor 13. A portion of the light is diffracted by the grating structure 12 to the reflective component 14, and then reflected by the reflective component 14 to reach the second photosensitive layer 132 of the image sensor 13.

[0044] In some embodiments of the present application, the above-mentioned shell may be a plastic shell or a metal shell.

[0045] In some embodiments of the present application, the grating structure may be a controllable micro-nano structure, which is used to diffract light.

[0046] It can be understood that the controllable micro-nanostructure described above is an optical element with a periodic structure. This period can be the peaks and valleys embossed on the material surface, causing a periodic variation in the material's refractive index n. This period is typically at the micro-nanoscale, on the order of the wavelength of visible light (450-700nm), to effectively control the deflection of light.

[0047] In the embodiment of the present application, the controllable micro-nanostructure can be used to diffract light corresponding to a portion of the wavelength bands in the light.

[0048] Exemplarily, the "spectroscopy" principle of the above-mentioned controllable micro-nanostructure is as follows: assuming that the incident light is green light of a single wavelength, it will be divided into several diffraction orders (diffraction order) by the diffraction grating. Each diffraction order continues to propagate in a different direction, including reflective diffraction (R0, R±1, R±2, ...) and transmissive diffraction (T0, T±1, T±2, ...) light. The diffraction angle (θm, m = ±1, ±2, ...) corresponding to each diffraction order is determined by the incident angle of the light (θ) and the period of the grating (Λ). By designing the parameters of the grating (material refractive index n, grating shape, thickness, duty cycle, etc.), the diffraction efficiency of a certain diffraction order (i.e., a certain direction) can be optimized to the maximum, so that most of the light propagates mainly along this direction after diffraction.

[0049] In some embodiments of the present application, the diffraction angle and diffraction efficiency are controlled by grating parameters. Then, the effect of controlling the light splitting can be achieved by designing a grating with variable parameters. In the following grating equation, mλ=d(sinα+sinβ m) where d is the grating spacing, also known as the grating constant, and m is an integer with values ​​of 0, ±1, etc. The diffraction angle is β m , α is the angle of incidence. λ is the wavelength of light.

[0050] For example, taking light with an incident angle of 30°, a diffraction angle of 31°, and a wavelength of 400 nm as an example, 0.515+0.5=0.4 / d, then d=0.394 μm.

[0051] In some embodiments of the present application, the grating structure includes at least two liquid crystal components, and the thickness of the liquid crystal components is greater than or equal to 1 nm.

[0052] Exemplarily, the size of the grating structure is greater than or equal to the size of the image sensor.

[0053] Illustratively, the material of each of the at least two liquid crystal assemblies is an electrochromic material.

[0054] For example, the camera module can change the structure of the grating structure by adjusting the voltage across the grating structure, thereby diffracting the light to a preset angle.

[0055] Exemplarily, the grating structure may include M liquid crystal components distributed in an array, where M is a positive integer, such as 1, 2, 3, 4, 5, etc.

[0056] Exemplarily, the pixel structure and the grating structure are arranged one to one, and the transmittance of each liquid crystal component is determined by the electrical information applied to the liquid crystal component.

[0057] For example, the camera module controls the electrical information applied to each liquid crystal component to make each electrically controlled liquid crystal component translucent, opaque or semi-translucent.

[0058] The grating structure is described below with an example.

[0059] For example, assuming that a grating structure includes 26 liquid crystal components distributed in a line, by controlling the current applied to the 26 liquid crystal components respectively, when the width value of the liquid crystal component is 10 nm, the grating structure can be controlled to form a series of gratings with grating constants of 10*2P nm, where P is a positive integer.

[0060] For example, the grating structure may constitute a grating with a grating constant of 20 nm as shown in FIG. 2A , or a grating with a grating constant of 40 nm as shown in FIG. 2B , or a grating with a grating constant of 60 nm as shown in FIG. 2C .

[0061] Of course, if a grating is not required, all liquid crystal components can be controlled to remain fully transparent, and the grating structure is just a flat lens, as shown in FIG2D .

[0062] It can be seen that in Figures 2A to 2D, the liquid crystal components shown in the filled areas are not light-transmitting, such as the liquid crystal component shown as 1 in Figure 2A, and the liquid crystal components shown in the non-filled areas are fully light-transmitting, such as the liquid crystal component shown as 2 in Figure 2A.

[0063] For example, taking a liquid crystal component as an example, when no voltage is connected to both ends of the liquid crystal component, the small droplets in the liquid crystal component are in a disordered state. When light is incident, its refractive index is significantly different from the refractive index of the matrix. Light is scattered when passing through, and the grating becomes opaque (that is, the light cannot be incident on the first photosensitive layer); when voltage is connected to both ends, the liquid crystal component can adjust the small droplets in the liquid crystal interlayer according to the size of the voltage, so that the refractive index of the matrix is ​​closer, that is, when light is incident, the light can be incident on the first photosensitive layer, and then the image sensor can capture images through the photosensitive pixels.

[0064] Exemplarily, the voltage may be 0V to 2.8V.

[0065] For example, the electrical information may be voltage or current.

[0066] For example, the transmittance of the liquid crystal component is positively correlated or negatively correlated with the current applied to the liquid crystal component, which can be specifically determined according to the material of the liquid crystal component.

[0067] For example, the width of the liquid crystal assembly along the direction perpendicular to the optical axis can be referred to as the thickness of the electrically controlled liquid crystal assembly. This thickness can be determined based on actual design requirements. For example, the thickness of the electrically controlled liquid crystal assembly can be 10 nm, 8 nm, or any other possible width. In other words, the thickness of the electrically controlled liquid crystal assembly is the length of the short side viewed along the optical axis.

[0068] For example, the liquid crystal components in the grating structure can be arranged in one row or multiple rows, which can be determined according to actual usage requirements.

[0069] In some embodiments of the present application, the image sensor may be any one of the following: a CMOS sensor or a CCD sensor.

[0070] In some embodiments of the present application, the above-mentioned reflective component may be a reflector.

[0071] In some embodiments of the present application, the first photosensitive layer includes a green pixel unit, and the second photosensitive layer includes a red pixel unit and a blue pixel unit.

[0072] In some embodiments of the present application, the first photosensitive layer may be entirely green pixel units, and the second photosensitive layer may only include red pixel units and blue pixel units.

[0073] Illustratively, the first photosensitive layer includes a first filter layer.

[0074] Illustratively, the first filter layer may be a filter array composed of a plurality of filters.

[0075] It can be understood that each of the multiple filters in the above-mentioned first filter layer corresponds to a photosensitive pixel in the first photosensitive layer.

[0076] For example, the first filter layer can be used to retain green light.

[0077] For example, the photosensitive pixels may be photosensitive diodes.

[0078] In some embodiments of the present application, the second photosensitive layer includes a second filter layer.

[0079] Illustratively, the second filter layer may be a filter array composed of a plurality of filters.

[0080] It can be understood that each of the multiple filters in the second filter layer corresponds to a photosensitive pixel in the second photosensitive layer.

[0081] For example, the second filter layer can be used to retain red light and blue light.

[0082] Exemplarily, the filter may be an RGB filter.

[0083] In the camera module provided in the embodiment of the present application, a grating structure is set in the camera module. By controlling the grating parameters of the grating structure, the grating structure can have both a transmission function and a diffraction function, so that a part of the incident light can be controlled to pass through the grating structure to reach the first photosensitive layer of the image sensor, and a part of the incident light can be controlled to be diffracted to the reflective component, and then reflected by the reflective component to reach the second photosensitive layer of the image sensor. Since the image sensor in the embodiment of the present application can be sensitive on both sides, the number of photosensitive pixels is increased without changing the pixel size in the image sensor, thereby greatly improving the photosensitivity of the image sensor and ultimately improving the clarity of the captured image.

[0084] In some embodiments of the present application, in combination with FIG1 , as shown in FIG3 , the photosensitive units in the first photosensitive layer 131 and the photosensitive units in the second photosensitive layer 132 are arranged back to back, and a logic circuit layer 15 is provided between the first photosensitive layer 131 and the second photosensitive layer 132 .

[0085] In the embodiment of the present application, the above-mentioned logic circuit layer is electrically connected to the first photosensitive layer and the second photosensitive layer respectively.

[0086] It can be understood that the photosensitive units in the first photosensitive layer and the photosensitive units in the second photosensitive layer in the above-mentioned image sensor are arranged back to back, that is, the image sensor is a double-sided sensor, which can greatly increase the number of photosensitive units compared to a single-sided image sensor.

[0087] 4 , the first photosensitive layer includes: a microlens 20, a first filter layer 21, a first photosensitive pixel layer 22, and a first metal circuit layer 23. The second photosensitive layer includes: a microlens 30, a second filter layer 31, a second photosensitive pixel layer 32, and a second metal circuit layer 33.

[0088] Illustratively, the metal circuit layer may be a printed circuit board (PCB) or a flexible printed circuit board.

[0089] It should be noted that the first photosensitive layer only receives signals of green light; and the second photosensitive layer only receives signals of red and blue light.

[0090] In the embodiment of the present application, by setting a double-sided photosensitive layer, the electronic device can increase the number of photosensitive pixels in the image sensor while keeping the image sensor size constant, thereby greatly improving the photosensitivity of the image sensor and thus improving the image quality of the images taken by the electronic device.

[0091] In some embodiments of the present application, as shown in FIG5 , the first and second photosensitive layers include a photosensitive diode 16. The logic circuit layer 15 includes a signal output module 151, a first switch C1, a second switch Tx-Dram, and a first capacitor Dram. The output terminal Dout of the photosensitive diode 16 is connected to the signal output module 151, which is in turn connected to the first terminal W10 of the first switch C1. The second terminal W11 of the first switch C1 and the first terminal W20 of the second switch Tx-Dram are respectively connected to the first terminal M1 of the first capacitor Dram. The second terminal M2 of the first capacitor Dram is grounded. The second terminal W21 of the second switch Tx-Dram is connected to the power supply terminal VDD.

[0092] In the embodiment of the present application, the voltage signal output by the signal output module is associated with the voltage signal generated by the photodiode, the states of the first switch and the second switch. That is, the magnitude of the voltage signal output by the signal output module can be controlled by the first switch and the second switch.

[0093] Exemplarily, the signal output module is used to obtain an image electrical signal corresponding to the photodiode, and the first switch, the second switch and the first capacitor are used to amplify the image electrical signal.

[0094] For example, the first switch and the second switch may be transistors or field effect transistors.

[0095] For example, the transistor may be a silicon transistor or a germanium transistor; the field effect transistor may be a junction field effect transistor or an insulated gate field effect transistor. Specific requirements may be determined in practice and are not limited in the present embodiment.

[0096] In some embodiments of the present application, the logic circuit layer includes a first circuit layer and a second circuit layer. The first circuit layer corresponds to the first photosensitive layer. This first circuit layer is a logic circuit layer in related art and is not further described here. The second circuit layer corresponds to the second photosensitive layer, which includes the signal output module, the first switch, the second switch, and the first capacitor. In other words, the optical signal collected by the first photosensitive layer does not need to be amplified.

[0097] In some embodiments of the present application, the first capacitor may be any one of the following: a mica capacitor, a ceramic capacitor, or an electrolytic capacitor, etc. The specific capacitor may be determined based on actual usage and is not limited in the present embodiment.

[0098] In some embodiments of the present application, in combination with Figure 5, as shown in Figure 6, the above-mentioned signal output module 151 includes: a source follower SF, a row selector SET, a first transmission transistor TX1, a second capacitor FD1 and a reset transistor RST; the drain of the source follower SF is connected to the first power supply, the source of the source follower is connected to the drain of the row selector SET, and the gate of the source follower SF is respectively connected to the collector of the first transmission transistor TX1, the source of the reset transistor RST and the first end of the second capacitor FD1; the drain of the row selector SET is used to output the amplified image signal; the emitter of the first transmission transistor TX1 is connected to the cathode of the photosensitive diode PD1, and the anode of the photosensitive diode PD1 is grounded; the second end of the second capacitor FD1 is grounded; the drain of the reset transistor RST is connected to the first power supply.

[0099] Exemplarily, the first power supply and the second power supply may be direct current power supplies.

[0100] The voltage and current of the first power supply and the second power supply can be the same or different. The specific value can be determined according to actual use and is not limited in the embodiment of the present application.

[0101] Exemplarily, the source follower may be a field effect transistor.

[0102] Exemplarily, the row selector may be a field effect transistor.

[0103] In the embodiment of the present application, the first transmission transistor may be a silicon transistor or a germanium transistor.

[0104] In the embodiment of the present application, the second capacitor may be any one of the following: a mica capacitor, a ceramic capacitor, or an electrolytic capacitor, etc. The specific capacitor may be determined according to actual usage and is not limited in the embodiment of the present application.

[0105] The image signal amplifying circuit involved in the embodiment of the present application is explained in detail below, which can be implemented through the following steps 20 to 23.

[0106] Step 20: Clear the pixel circuit. RST and TX1 are turned on simultaneously to clear the electrons in PD1 and FD1. Tx-Dram is also turned on to clear the electrons in DRAM. At this point, all electrons in the pixel circuit are cleared.

[0107] Step 21: Pixel controlled exposure. With Tx-Dram and RST both disconnected, PD1 begins controlled exposure. The electron-hole pairs generated by light irradiation separate due to the electric field of PD1, with electrons moving to the n-region and holes to the p-region. Photoelectrons are generated in PD1.

[0108] Step 22: PD charge transfer. Only TX1 is turned on, completely transferring charge from the photosensitive area to FD1 for readout. This mechanism is similar to charge transfer in a CCD, where the photosensitive electrons in the PD are completely transferred to FD1. If you want to control the charge in FD1, you can briefly turn C1 on and off while TX1 is turned on. By controlling the on and off time of C1, you can control the diversion of the photosensitive electrons.

[0109] For example, if TX1 is turned on for 10μs, the electrons in PD can be completely transferred to FD1, resulting in 1000 electrons. However, if C1 is only turned on for 1μs during the TX1 opening process, 100 electrons will be transferred to D-RAM, while FD1 will only have 900 electrons.

[0110] Of course, some voltage / electrons can also be pre-stored in DRAM through VDD. When the pixel transfers electrons, that is, when Tx1 is turned on, C1 is also turned on, and some electrons can be imported into FD1. The principle is the same and will not be repeated here.

[0111] Step 23: Signal level readout. Next, the voltage signal on FD1 is followed to the Vout output terminal through the SF source follower, and then undergoes analog amplification and ADC conversion to obtain a digital signal.

[0112] For example, assuming the energy of the diffracted red and blue light is 20% of the energy of the original red and blue light, the DRAM needs to be pre-stored with a voltage four times the pixel voltage on the second photosensitive layer. When the pixels on the second photosensitive layer are read, the DRAM switch C1 is also turned on, allowing the image signal output by the second photosensitive layer to be the same as the image signals corresponding to normal red and blue light. This allows for better fusion of the images output by the first and second photosensitive layers, resulting in higher image clarity.

[0113] In the embodiment of the present application, since the second photosensitive layer collects diffracted light signals, the light intensity will inevitably decrease after diffraction, thereby reducing the energy of the captured image and affecting the clarity of the image. Therefore, in the present application, the image signal is amplified by a signal amplification circuit, which can restore the energy of the captured image to the direct intensity, thereby ensuring the clarity of the image captured by the electronic device.

[0114] In some embodiments of the present application, in combination with FIG. 3 , as shown in FIG. 7 , the reflective assembly 14 includes a first reflective member 141 and a second reflective member 142 .

[0115] Exemplarily, the angle between the plane where the first reflective element is located and the plane where the grating structure is located is less than 90°.

[0116] Illustratively, the second reflective member is disposed opposite to the second photosensitive layer.

[0117] For example, the light diffracted by the grating structure is reflected by the first reflector and the second reflector in sequence and then reaches the second photosensitive layer.

[0118] For example, the first reflector and the second reflector may be single-sided reflective glass.

[0119] In an embodiment of the present application, the electronic device can diffract light into the second photosensitive layer through the first reflector and the second reflector. In this way, the shooting module can obtain multiple images based on the double-sided sensor, thereby obtaining a higher-definition image based on the multiple images.

[0120] The image acquisition method provided in the embodiments of the present application may be performed by an image acquisition device, which may be an electronic device or a functional module within the electronic device. The technical solutions provided in the embodiments of the present application are described below using an electronic device as an example. The electronic device includes the camera module described in the above embodiments.

[0121] The present invention provides an image acquisition method, and Figure 8 shows a flowchart of the image acquisition method provided by the present invention. As shown in Figure 8, the image acquisition method provided by the present invention may include the following steps 201 and 202.

[0122] Step 201: The electronic device controls the grating structure of the camera module to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and collects first image data through the image sensor; controls the grating structure to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and collects second image data through the image sensor.

[0123] In an embodiment of the present application, when light is incident on the image sensor, the electronic device diffracts a portion of the light to the second photosensitive layer through the grating structure of the camera module in the electronic device, and collects first image data through the image sensor, and diffracts light into the first photosensitive layer through the grating structure, and collects second image data through the image sensor.

[0124] In the embodiment of the present application, the first image data may include image data corresponding to a red channel and a blue channel, and the second image data may include image data corresponding to a green channel.

[0125] It can be understood that, in conjunction with the above embodiments, the first photosensitive layer is located below the first photosensitive pixel array, and the electronic device can acquire first image data through the first photosensitive pixel array and the first logic circuit layer corresponding to the first photosensitive pixel array, thereby obtaining the first image. The second photosensitive layer is located below the second photosensitive pixel array, and the electronic device can acquire second image data through the second photosensitive pixel array and the second logic circuit layer corresponding to the second photosensitive pixel array, thereby obtaining the second image.

[0126] In an embodiment of the present application, the electronic device can change the grating constant of the grating structure so that a portion of the light is diffracted onto the reflector. After two reflections from the reflector, a portion of the light is projected onto the second photosensitive layer in the image sensor, hereinafter referred to as the B side; and a portion of the light is transmitted through the grating structure to the first photosensitive layer in the image sensor, hereinafter referred to as the A side. In this way, the electronic device can simultaneously obtain two images, namely the first image and the second image mentioned above.

[0127] It should be noted that the image sizes of the first image and the second image are consistent.

[0128] In some embodiments of the present application, in the above step 201, "the electronic device controls the grating structure of the camera module to diffract a portion of the incident light to the second photosensitive layer of the image sensor" can be specifically implemented through the following steps 201a and 201b.

[0129] Step 201a: The electronic device determines a first grating constant according to the wavelength of a portion of the incident light, the incident angle of a portion of the incident light on the grating structure, and the diffraction angle.

[0130] It can be understood that each color of light in natural light corresponds to a wavelength range, and the electronic device can pre-store the relationship between the wavelength range and the light to obtain the wavelength of a portion of the incident light.

[0131] It should be noted that the above light is natural light.

[0132] In the embodiment of the present application, the above-mentioned diffraction angle is a preset angle, and the diffraction angle is related to the positional relationship between the grating structure and the reflective component.

[0133] It should be noted that the process of determining the first grating constant can be found in the above embodiment in detail, and will not be described again here to avoid repetition.

[0134] In step 201b, the electronic device adjusts the grating constant of the grating structure to a first grating constant, so that the grating structure diffracts a portion of the incident light to the second photosensitive layer.

[0135] It should be noted that the specific process of a portion of the incident light of the electronic device being diffracted to the second photosensitive layer can be found in the above embodiments, and will not be described again here to avoid repetition.

[0136] In an embodiment of the present application, the electronic device can diffract a portion of the light through the grating structure, thereby obtaining different image data, and then fuse the different image data to obtain an image with higher clarity, thereby improving the clarity of the image taken by the electronic device.

[0137] Step 202: The electronic device obtains third image data based on the first image data and the second image data.

[0138] In an embodiment of the present application, the electronic device can fuse the first image data and the second image data to obtain third image data.

[0139] In some embodiments of the present application, the first photosensitive layer includes green pixel units, the second photosensitive layer includes red pixel units and blue pixel units; the first image data includes red channel image data and blue channel image data, and the second image data includes green channel image data.

[0140] It's understandable that the dual-sided image sensor used in this application increases the number of pixels in the image sensor. Side A of the image sensor only receives green light, and in actual photography, clarity is primarily determined by green light. Compared to conventional sensors, this increases the number of pixels receiving green light, significantly improving the clarity of Image A output from Side A. Side B, on the other hand, receives light signals from both red and blue light. Compared to conventional sensors, this also increases the number of pixels receiving red and blue light, significantly improving the clarity of the red and blue pixels in the image output from conventional sensors. Therefore, the fusion of the first and second images produces an image with excellent clarity and color.

[0141] Exemplarily, the above step 202 can be specifically implemented through the following step 202a.

[0142] Step 202a: The electronic device fuses the red channel image data, the blue channel image data, and the green channel image data to obtain third image data.

[0143] In the embodiment of the present application, the electronic device can fuse the red channel image data, the blue channel image data, and the green channel image data according to a preset ratio between the three primary colors to obtain third image data.

[0144] In the image acquisition method provided in the embodiment of the present application, when performing image acquisition, the grating structure is controlled to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and the first image data is acquired. The grating structure is controlled to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and the second image data is acquired. Finally, based on the first image data and the second image data, the third image data can be obtained. Since the third image data is a fusion of the first image data and the second image data, the clarity of the final image can be improved.

[0145] In some embodiments of the present application, in combination with FIG8 , as shown in FIG9 , before the above step 202 , the image acquisition method provided in the embodiment of the present application further includes the following step 301 , and the above step 202 can be specifically implemented through the following step 202b .

[0146] Step 301: The electronic device performs image signal amplification processing on the first image data to obtain fourth image data.

[0147] In the embodiment of the present application, the electronic device can perform image signal amplification processing on the first image data through the above-mentioned amplification circuit to obtain a fourth image.

[0148] It should be noted that the specific implementation process can be found in the above embodiments, and will not be described again here to avoid repetition.

[0149] Step 202b: The electronic device fuses the fourth image data and the second image data to obtain a third image.

[0150] In an embodiment of the present application, since the first image data is obtained through diffraction of the grating structure, the electronic device can perform image signal amplification processing on the first image data to avoid poor clarity of the captured image due to insufficient light intensity, thereby ensuring the clarity of the third image obtained by the electronic device.

[0151] It should be noted that the image acquisition method provided in the embodiments of the present application can be executed by an image acquisition device, an electronic device, or a functional module or entity within the electronic device. The embodiments of the present application use an image acquisition device executing the image acquisition method as an example to illustrate the image acquisition device provided in the embodiments of the present application.

[0152] FIG10 shows a possible structural diagram of an image acquisition device involved in an embodiment of the present application. As shown in FIG10 , the image acquisition device 70 may include: an acquisition module 71 and a processing module 72 .

[0153] The acquisition module 71 is configured to control the camera module's grating structure to diffract a portion of incident light onto the second photosensitive layer of the image sensor, thereby capturing first image data through the image sensor; and to control the grating structure to transmit a portion of incident light onto the first photosensitive layer of the image sensor, thereby capturing second image data through the image sensor. The processing module 72 is configured to acquire third image data based on the first and second image data captured by the acquisition module.

[0154] In one possible implementation, the acquisition module 71 is specifically used to determine the first grating constant based on the wavelength of a portion of the incident light, the incident angle and diffraction angle of a portion of the incident light on the grating structure; and adjust the grating constant of the grating structure to the first grating constant so that the grating structure diffracts a portion of the incident light to the second photosensitive layer.

[0155] In one possible implementation, the first photosensitive layer includes green pixel units, the second photosensitive layer includes red pixel units and blue pixel units; the first image data includes red channel image data and blue channel image data, and the second image data includes green channel image data. The processing module 72 is specifically configured to fuse the red channel image data, the blue channel image data, and the green channel image data to generate third image data.

[0156] In one possible implementation, the processing module 72 is further configured to amplify the image signal of the first image data to obtain fourth image data before obtaining the third image data based on the first and second image data. The processing module 72 is specifically configured to obtain the third image data based on the fourth and second image data.

[0157] An embodiment of the present application provides an image acquisition device. When performing image acquisition, the grating structure is controlled to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and first image data is acquired. The grating structure is controlled to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and second image data is acquired. Finally, based on the first image data and the second image data, third image data can be obtained. Since the third image data is a fusion of the first image data and the second image data, the clarity of the final image can be improved.

[0158] The image acquisition device in the embodiment of the present application can be an electronic device or a component in an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other device other than a terminal. For example, the mobile electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It can also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiment of the present application does not specifically limit it.

[0159] The image acquisition device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0160] The image acquisition device provided in the embodiment of the present application can implement each process implemented in the above method embodiment and achieve the same technical effect. To avoid repetition, it will not be described here.

[0161] Optionally, as shown in Figure 11, an embodiment of the present application also provides an electronic device 90, including a processor 91 and a memory 92, and the memory 92 stores a program or instruction that can be run on the processor 91. When the program or instruction is executed by the processor 91, the various steps of the above-mentioned image acquisition method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0162] It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and non-mobile electronic devices mentioned above.

[0163] FIG12 is a schematic diagram of the hardware structure of an electronic device implementing an embodiment of the present application.

[0164] The electronic device 100 includes, but is not limited to, a radio frequency unit 101, a network module 102, an audio output unit 103, an input unit 104, a sensor 105, a display unit 106, a user input unit 107, an interface unit 108, a memory 109, a processor 110, and a camera module. The camera module is the same as that in the above-mentioned embodiment.

[0165] Those skilled in the art will appreciate that the electronic device 100 may further include a power source (such as a battery) for powering various components. The power source may be logically connected to the processor 110 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. The electronic device structure shown in FIG12 does not limit the electronic device. The electronic device may include more or fewer components than shown, or may combine certain components, or have different component arrangements, which will not be described in detail here.

[0166] Among them, the processor 110 is used to control the grating structure of the camera module to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and collect first image data through the image sensor; control the grating structure to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and collect second image data through the image sensor; and obtain third image data based on the first image data and the second image data.

[0167] An embodiment of the present application provides an electronic device that, when performing image acquisition, controls the grating structure to diffract a portion of the incident light to the second photosensitive layer of the image sensor, and acquires first image data; controls the grating structure to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and acquires second image data; finally, based on the first image data and the second image data, third image data can be obtained. Since the third image data is a fusion of the first image data and the second image data, the clarity of the final image can be improved.

[0168] In some embodiments of the present application, the above-mentioned processor 110 is specifically used to determine the first grating constant based on the wavelength of a portion of the incident light, the incident angle and diffraction angle of a portion of the incident light on the grating structure; and adjust the grating constant of the grating structure to the first grating constant so that the grating structure diffracts a portion of the incident light to the second photosensitive layer.

[0169] In some embodiments of the present application, the first photosensitive layer includes green pixel units, the second photosensitive layer includes red pixel units and blue pixel units, the first image data includes red channel image data and blue channel image data, and the second image data includes green channel image data. The processor 110 is specifically configured to fuse the red channel image data, the blue channel image data, and the green channel image data to generate third image data.

[0170] In some embodiments of the present application, the processor 110 is further configured to perform image signal amplification processing on the first image data to obtain fourth image data. The processor 110 is specifically configured to obtain third image data based on the fourth image data and the second image data.

[0171] The electronic device provided in the embodiment of the present application can implement each process implemented in the above method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described here.

[0172] The beneficial effects of various implementations in this embodiment can be specifically referred to the beneficial effects of the corresponding implementations in the above method embodiment. To avoid repetition, they will not be described here.

[0173] It should be understood that in an embodiment of the present application, the input unit 104 may include a graphics processing unit (GPU) 1041 and a microphone 1042, and the graphics processor 1041 processes the image data of a static picture or video obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The display unit 106 may include a display panel 1061, and the display panel 1061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 107 includes a touch panel 1071 and at least one of other input devices 1072. The touch panel 1071 is also called a touch screen. The touch panel 1071 may include two parts: a touch detection device and a touch controller. Other input devices 1072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be repeated here.

[0174] The memory 109 can be used to store software programs and various data. The memory 109 may mainly include a first storage area for storing programs or instructions and a second storage area for storing data, wherein the first storage area may store an operating system, applications or instructions required for at least one function (such as a sound playback function, an image playback function, etc.). In addition, the memory 109 may include a volatile memory or a non-volatile memory, or the memory 109 may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), a static random access memory (SRAM), a dynamic random access memory (DRAM), a synchronous dynamic random access memory (SDRAM), a double data rate synchronous dynamic random access memory (DDRSDRAM), an enhanced synchronous dynamic random access memory (ESDRAM), a synchronous link dynamic random access memory (SLDRAM), and a direct memory bus random access memory (DRRAM). The memory 109 in the embodiment of the present application includes but is not limited to these and any other suitable types of memory.

[0175] Processor 110 may include one or more processing units. Optionally, processor 110 integrates an application processor and a modem processor. The application processor primarily handles operations related to the operating system, user interface, and application programs, while the modem processor primarily processes wireless communication signals, such as a baseband processor. It is understood that the modem processor may not be integrated into processor 110.

[0176] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the various processes of the above-mentioned method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0177] The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0178] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned method embodiment and achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0179] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0180] An embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the above-mentioned image acquisition method embodiment and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0181] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0182] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), including a number of instructions for enabling a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0183] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A camera module, comprising: Housing, grating structure, image sensor and reflective assembly; The grating structure, the image sensor and the reflective component are arranged in the housing; The image sensor includes a first photosensitive layer and a second photosensitive layer stacked in layers; The grating structure is arranged above the image sensor. After the incident light reaches the grating structure, a portion of the light passes through the grating structure and then reaches the first photosensitive layer of the image sensor, and a portion of the light is diffracted by the grating structure to the reflective component and then reflected by the reflective component to reach the second photosensitive layer of the image sensor.

2. The camera module according to claim 1, wherein: The photosensitive units in the first photosensitive layer are arranged opposite to the photosensitive units in the second photosensitive layer, and a logic circuit layer is arranged between the first photosensitive layer and the second photosensitive layer. The logic circuit layer is electrically connected to the first photosensitive layer and the second photosensitive layer respectively.

3. The camera module according to claim 1, wherein: The reflective assembly includes a first reflective member and a second reflective member; The angle between the plane where the first reflector is located and the plane where the grating structure is located is less than 90°; The second reflective member is disposed opposite to the second photosensitive layer; The light diffracted by the grating structure is reflected by the first reflector and the second reflector in sequence and then reaches the second photosensitive layer.

4. The camera module according to claim 1, wherein: The grating structure includes at least two liquid crystal components, and the thickness of the liquid crystal components is greater than or equal to 1 nm; The size of the grating structure is greater than or equal to the size of the image sensor; Wherein, the material of each of the liquid crystal components is an electrochromic material.

5. The camera module according to claim 1, wherein: The first photosensitive layer includes a green pixel unit, and the second photosensitive layer includes a red pixel unit and a blue pixel unit.

6. The camera module according to claim 2, wherein: The first photosensitive layer and the second photosensitive layer include photosensitive diodes; The logic circuit layer includes: a signal output module, a first switch, a second switch and a first capacitor; The output end of the photosensitive diode is connected to the signal output module, and the signal output module is connected to the first end of the first switch; The second end of the first switch and the first end of the second switch are respectively connected to the first end of the first capacitor, the second end of the first capacitor is grounded, and the second end of the second switch is connected to the power supply end; The voltage signal output by the signal output module is associated with the voltage signal generated by the photodiode, and the states of the first switch and the second switch.

7. An electronic device, comprising the camera module according to any one of claims 1 to 6.

8. An image acquisition method, executed by the electronic device according to claim 7, the image acquisition method comprising: Controlling the grating structure of the camera module to diffract a portion of incident light to the second photosensitive layer of the image sensor, and collecting first image data through the image sensor; Controlling the grating structure to transmit a portion of the incident light to the first photosensitive layer of the image sensor, and collecting second image data through the image sensor; Based on the first image data and the second image data, third image data is obtained.

9. The method according to claim 8, wherein: The grating structure of the control camera module diffracts a portion of the incident light to the second photosensitive layer of the image sensor, including: Determining a first grating constant according to the wavelength of the portion of incident light, the incident angle and the diffraction angle of the portion of incident light on the grating structure; The grating constant of the grating structure is adjusted to the first grating constant so that the grating structure diffracts the portion of the incident light to the second photosensitive layer.

10. The method according to claim 8, wherein: The first photosensitive layer includes a green pixel unit, and the second photosensitive layer includes a red pixel unit and a blue pixel unit; the first image data includes a red channel image data and a blue channel image data, and the second image data includes a green channel image data; The obtaining of third image data based on the first image data and the second image data comprises: The red channel image data, the blue channel image data and the green channel image data are fused to obtain the third image data.

11. The method according to claim 8, wherein: Before obtaining the third image data based on the first image data and the second image data, the method further includes: Performing image signal amplification processing on the first image data to obtain fourth image data; The obtaining of third image data based on the first image data and the second image data comprises: The third image data is obtained based on the fourth image data and the second image data.

12. An image acquisition device, comprising the camera module according to any one of claims 1 to 6, the image acquisition device further comprising: Acquisition module and processing module; The acquisition module is used to control the grating structure of the camera module to diffract a part of the incident light to the second photosensitive layer of the image sensor, and collect the first image data through the image sensor; control the grating structure to transmit a part of the incident light to the first photosensitive layer of the image sensor, and collect the second image data through the image sensor; The processing module is used to acquire the first image data and the second image data based on the acquisition module to obtain the third image data.

13. The device according to claim 12, wherein: The acquisition module is specifically used to determine a first grating constant based on the wavelength of the portion of incident light, the incident angle and diffraction angle of the portion of incident light on the grating structure; and adjust the grating constant of the grating structure to the first grating constant so that the grating structure diffracts the portion of incident light to the second photosensitive layer.

14. The device according to claim 12, wherein: The first photosensitive layer includes a green pixel unit, and the second photosensitive layer includes a red pixel unit and a blue pixel unit; the first image data includes a red channel image data and a blue channel image data, and the second image data includes a green channel image data; The processing module is specifically used to fuse the red channel image data, the blue channel image data and the green channel image data to obtain the third image data.

15. The device according to claim 12, wherein: The processing module is also used to perform image signal amplification processing on the first image data to obtain fourth image data before obtaining the third image data based on the first image data and the second image data; the processing module is specifically used to obtain the third image data based on the fourth image data and the second image data.

16. An electronic device comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the image acquisition method as claimed in any one of claims 8 to 11.

17. A readable storage medium storing a program or instruction, wherein the program or instruction, when executed by a processor, implements the steps of the image acquisition method according to any one of claims 8 to 11.

18. A chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the steps of the image acquisition method according to any one of claims 8 to 11.

19. A computer program product, wherein the program product is stored in a storage medium and is executed by at least one processor to implement the steps of the image acquisition method according to any one of claims 8 to 11.

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