Handler for testing electronic components and picker device thereof

Abstract

The present invention relates to a handler for testing electronic components. The handler for testing electronic components according to the present invention comprises: a test table on which electronic components to be tested are loaded; and a relocation mechanism for relocating the electronic components in a temporary zone of the test table to a designated position zone. The test table has a first unit region and a second unit region on which the electronic components are loaded. The first unit region corresponds to a first test region of a tester, the second unit region corresponds to a second test region of the tester, and the distance between the first unit region and the second unit region is greater than the distance between the electronic components loaded on the first unit region or the second unit region. When the present invention is applied, electrical connections between the electronic components and the test can be made accurately even when thermal expansion occurs.

Description

Handler for testing electronic components and its picker device

[0001] The present invention relates to a handler for supporting testing of electronic components by electrically connecting the electronic components and a tester.

[0002] An electronic component test handler is a piece of equipment that handles electronic components in order to electrically connect them to a tester.

[0003] As the integration of electronic components, such as semiconductors, increases, circuit line widths are becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] For example, while in the past it was possible to achieve proper electrical connection between electronic components and testers even with a tolerance of 20㎛, now the tolerance is required to be within a tolerance of 10㎛ or even several ㎛.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units in a wafer state.

[0006] The die can be packaged or stacked for HBM (High Bandwidth Memory) production and then packaged to form the final product.

[0007] Testing of the die is required to perform post-die operations.

[0008] Electronic components in die state can be tested by electrically connecting the contact pads to a tester.

[0009] Because the contact pads of a die are very thin and have minute gaps between them, making them susceptible to breakage or chipping, no test method has been proposed to adequately support testing of electronic components in die or HBM mode. In response, the applicant has proposed Republic of Korea Patent Publication No. 10-2021-0088373 (hereinafter referred to as "prior art").

[0010] Prior art proposes a technique for aligning the positions of electronic components by rearranging the electronic components before connecting them to a tester.

[0011] Prior art uses a camera to scan electronic components on a test table (called a "chuck" in the prior art) to determine their current positions, and then readjust the positions of the electronic components to reduce the margin of error.

[0012] According to the prior art, various types of electronic components can be mounted on the test table, and the camera is fixed.

[0013] In general, electronic components must be able to operate at extreme temperatures.

[0014] Testing electronic components requires extremely high or low temperatures. Consequently, the test table may experience thermal contraction or expansion, making it difficult to align the electronic components with the tester's test pins.

[0015] The amount of variation in the position of electronic components due to thermal contraction or expansion increases the farther away they are from the center of the test table. This limits the ability to increase the tester's processing capacity.

[0016] For example, let's compare test table A, which can hold 256 electronic components, with test table B, which can hold 516 electronic components.

[0017] Assuming the sizes of the electronic components to be loaded are the same, the upper surface area of ​​Test Table B must be wider than that of Test Table A. The positional variation due to thermal deformation of the electronic components at the outermost edge of Test Table B is greater than the positional variation due to thermal deformation of the electronic components at the outermost edge of Test Table A. Therefore, the electronic component test handler according to the prior art is inevitably limited to a certain level of processing capacity.

[0018] [Prior Art Literature]

[0019] [Patent Document]

[0020] (Patent Document 1) Republic of Korea Publication No. 10-2021-0088373

[0021] A technology must be developed that can increase processing capacity while maintaining fine precision.

[0022] According to a first aspect of the present invention, a handler for testing electronic components comprises: a transport shuttle having a transport table capable of transporting electronic components by being moved while the electronic components are loaded; a first hand for loading electronic components onto a transport table in a first area by operation of the transport shuttle; a second hand for unloading electronic components from a transport table moved from the first area to a second area by operation of the transport shuttle; a test table on which electronic components unloaded from the transport table by the second hand are loaded; a rearrangement mechanism for rearranging and aligning electronic components loaded onto the test table in a rearrangement space by the second hand; a moving mechanism for moving the test table between the rearrangement space and a test space where electronic components are tested by a tester, and for electrically connecting or disconnecting electronic components loaded onto the test table to the tester by elevating the test table; And a controller for controlling the operation of the transport shuttle, the first hand, the second hand, the repositioning mechanism, and the moving mechanism; wherein the test table has a first unit area and a second unit area in which electronic components are loaded, the first unit area corresponds to a first test area of ​​the tester, the second unit area corresponds to a second test area of ​​the tester, and a gap between the first unit area and the second unit area is wider than a gap between electronic components loaded in the first unit area or the second unit area.

[0023] The above rearrangement spaces are provided in pairs, and one pair of the above rearrangement spaces is placed on both sides of the test space with the test space in between.

[0024] The above moving mechanism includes an elevator that electrically connects or disconnects electronic components loaded on the test table to or from the tester by elevating the test table; and a first moving plate on which the elevator is installed and is installed to move in a first direction; a first moving device that moves the first moving plate in the first direction; a second moving plate on which the first moving plate and the first moving device are installed and is installed to move in a second direction orthogonal to the first direction; and a second moving device that moves the second moving plate in the second direction.

[0025] The test table includes a first table having the first unit area; and a second table spaced apart from the first table and having the second unit area; wherein the positions of the first table and the second table can be changed relative to each other.

[0026] The above moving mechanism includes a first moving element that moves the first table in the second direction; and a second moving element that moves the second table in the first direction.

[0027] The position of the first table is fixed in the first direction, and the position of the second table is fixed in the second direction.

[0028] The elevator includes a first elevating element that individually elevates the first table; and a second elevating element that individually elevates the second table.

[0029] The first moving plate is provided in two pieces, and the first moving mechanism is also provided in two pieces to move the first table and the second table independently in the first direction.

[0030] The above second moving plate is provided in multiple units.

[0031] The elevator includes a height adjuster to which the test table is coupled; and an elevator motor that operates the height adjuster to elevate the test table.

[0032] The above elevator further includes a transmission member that transmits the power of the above elevator motor to the height adjuster.

[0033] According to a second aspect of the present invention, a handler for testing electronic components comprises: a transport shuttle having a transport table capable of transporting electronic components by being moved while the electronic components are loaded; a first hand for loading electronic components onto a transport table in a first area by operation of the transport shuttle; a second hand for unloading electronic components from a transport table moved from the first area to a second area by operation of the transport shuttle; a plurality of test tables on which electronic components unloaded from the transport table by the second hand are loaded; a plurality of relocation mechanisms for aligning and relocating electronic components loaded onto the plurality of test tables in a relocation space by the second hand; a plurality of moving mechanisms for moving the plurality of test tables between the relocation space and a test space where the electronic components are tested by a tester, respectively, and for electrically connecting or disconnecting the electronic components loaded onto the test tables to the tester by elevating the test tables; And a controller for controlling the operation of the transport shuttle, the first hand, the second hand, the plurality of repositioning mechanisms, and the plurality of moving mechanisms; wherein the plurality of test tables have a first unit area and a second unit area in which electronic components are loaded, the first unit area corresponding to the first test area of ​​the tester, and the second unit area corresponding to the second test area of ​​the tester.

[0034] The above rearrangement spaces are formed in pairs on both sides with the test space in between, and the plurality of test tables are provided in pairs so that they can be placed in each of the pair of rearrangement spaces.

[0035] The above controller can control the operation of the plurality of moving mechanisms so that a test table moved from one of the relocation spaces corresponds to the first test area, and a test table moved from the other of the relocation spaces corresponds to the second test area, so that testing of electronic components can be performed.

[0036] The number of electronic components loaded in the first unit area and the number of electronic components loaded in the second unit area are the same.

[0037] The first hand or the second hand includes a plurality of pickers for holding electronic components; and a moving element for horizontally moving a movable picker, excluding a fixed picker, among the plurality of pickers.

[0038] The above repositioning mechanism further includes a rotating element for rotating the movable picker.

[0039] A picker device of a handler for testing electronic components according to the present invention comprises: a fixed picker that is installed in a fixed position so that the position of the electronic component to be picked up is fixed; a rotary picker that is paired with the fixed picker and is installed so as to be rotatable so that the angular coordinates of the electronic component to be picked up can be varied; a variable element for rotating the rotary picker; and a main body on which the fixed picker, the rotary picker, and the rotary element are installed.

[0040] The above variable element allows the horizontal coordinates of the electronic component placed on the rotating picker to be changed relative to the fixed picker by moving the rotating picker in the horizontal axis direction.

[0041] According to the present invention, by providing a plurality of unit areas in which precision can be guaranteed on a test table, the precision of each unit area can be guaranteed despite thermal deformation of the test table, thereby significantly improving the processing capacity.

[0042] According to the present invention, the precision of each unit area can be secured by adjusting the spacing between the unit areas of the test table, thereby significantly improving the processing capacity.

[0043] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to a first embodiment of the present invention.

[0044] Figure 2 is a schematic plan view of a transport table applied to the electronic component test handler of Figure 1.

[0045] FIG. 3 is a schematic perspective view of a first hand applied to the electronic component test handler of FIG. 1.

[0046] Fig. 4 is a schematic perspective view of a test table applied to the electronic component test handler of Fig. 1.

[0047] Figure 5 is a plan view of the test table of Figure 4.

[0048] Figures 6 to 15 are reference drawings for explaining the handler for testing electronic components of Figure 1.

[0049] Figures 16 and 17 are reference drawings for explaining a second embodiment of the present invention.

[0050] Figure 18 is a reference diagram for explaining a third embodiment of the present invention.

[0051] Figures 19 and 20 are reference drawings for explaining the fourth embodiment of the present invention.

[0052] Figure 21 is a reference diagram for explaining the fifth embodiment of the present invention.

[0053] Figures 22 to 24 are reference drawings for explaining the sixth embodiment of the present invention.

[0054] Figures 25 and 26 are reference drawings for explaining an improved picker device according to the present invention.

[0055] Preferred embodiments according to the present invention are described for each embodiment with reference to the attached drawings. However, for the sake of brevity of explanation, descriptions of well-known or duplicated configurations are omitted or compressed as much as possible.

[0056] <First Embodiment>

[0057] FIG. 1 is a conceptual plan view of a handler for testing electronic components (TH, hereinafter abbreviated as “handler”) according to the present invention.

[0058] The handler (TH) according to the present invention can be divided into a moving part (MP), an unloading part (LU), a repositioning part (RP), and a connecting part (CP), and includes a transport shuttle (100), a first hand (210), a second hand (220), a test table (300), a vacuum (400), a repositioning mechanism (500), a moving mechanism (600), and a controller (800).

[0059] In the moving section (MF), electronic components can be moved between the unloading section (LU) and the relocation section (RP) to exchange them. To this end, a transport shuttle (100) for transporting electronic components is installed in the moving section (MP).

[0060] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0061] The transport shuttle (100) has a movable transport table (110).

[0062] The transport shuttle (100) may have at least one transport table (110).

[0063] The transport table (110) can move back and forth in one direction.

[0064] The transport table (110) can move back and forth in the X-axis direction.

[0065] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented so that they can move back and forth in the X-axis direction independently of each other.

[0066] The transport table (110) can move between the first area (A1) on the unloading section (LU) side and the second area (A2) on the relocation section (RP) side.

[0067] Electronic components can be loaded on the transport table (110).

[0068] The transport table (110) is not a pocket structure with a mounting groove in which electronic components can be mounted, but rather a vacuum structure that fixes electronic components mounted on a flat surface by vacuum pressure.

[0069] As shown in the schematic plan view of Fig. 2, vacuum holes (VH) and vacuum grooves (VG) for vacuum-absorbing electronic components are formed on the transport table (110).

[0070] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0071] The vacuum pressure coming through the vacuum hole (VH) is evenly distributed through the vacuum groove (VG) and acts on the electronic components.

[0072] Since the electronic components can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic components occurs during the process of being loaded onto the transport table (110) and moving in the X-axis direction. Therefore, if the electronic components are precisely placed on the transport table (110), the tolerance for misalignment of the electronic components, which has been a problem, can be minimized.

[0073] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix, but the loading capacity of the transport table (110) can be increased or decreased as desired.

[0074] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0075] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are retrieved from the handler (TH) through the unloading section.

[0076] Electronic components can be supplied to or retrieved from the handler (TH) on customer trays such as Jedec Tray, Ring Frame or other types.

[0077] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and tested electronic components loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). For this purpose, a first hand (210) is provided in the unloading section (LU).

[0078] The first hand (210) is provided to load electronic components onto or remove them from the transport table (110).

[0079] In order to perform unloading work using the first hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0080] The first hand (210) loads electronic components to be tested onto the transport table (110) in the first area (A1), or unloads electronic components that have been tested from the transport table (110) in the first area (A1).

[0081] The first hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components using vacuum pressure.

[0082] Preferably, four pickers may be installed in pairs on the first hand (210) to improve processing capacity.

[0083] For example, as in the schematic diagram of Fig. 3, the first hand (210) may have four pickers (P) arranged in a 2x2 matrix form. Of course, the number of pickers (P) provided in the first hand (210) may be increased or decreased depending on the implementation.

[0084] The first hand (210) may further include a camera (C).

[0085] The first hand (210) is controlled by the controller (800) to grasp an electronic component whose position is accurately calculated from an image captured by the camera (C) before grasping the electronic component from the customer tray.

[0086] The first hand (210) is controlled so that the center of the electronic component is aligned with the vacuum hole (VH) whose location is accurately calculated from an image captured by the camera (C) by the controller (800) before the electronic component is placed on the transport tray (110).

[0087] Therefore, the picker (P) can pick up or release electronic components at more precise locations, enabling more precise positioning of the electronic components.

[0088] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated. For this purpose, a relocation space (RS) is formed in the relocation section (RP) for relocating the electronic components.

[0089] According to this embodiment, the repositioning portion (RP) is placed on one side of the connecting portion (CP) in the X-axis direction.

[0090] The relocation section (RP) is equipped with a second hand (220).

[0091] The second hand (220) removes the electronic component (ED) to be tested from the transport table (110) or loads the electronic component (ED) for which testing has been completed onto the transport table (110).

[0092] In order to perform unloading work using the second hand (220), the transport table (110) must be moved toward the relocation section (RP) and placed in the second area (A2).

[0093] The second hand (220) carries electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0094] The second hand (220) may be configured in the same manner as the first hand (210). Of course, the number of pickers (P) provided in the first hand (210) and the number of pickers (P) provided in the second hand (220) may be different.

[0095] The second hand (220) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation section (RP).

[0096] The second hand (220) loads the tested electronic components loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0097] The test table (300) is provided to load electronic components (ED) that are transferred from the transport table (110) by the second hand (220).

[0098] As shown in the schematic excerpt of Fig. 4, the test table (300) is a rectangular shape with a length in the X-axis direction shorter than the length in the Y-axis direction, and the upper surface is flat.

[0099] Electronic components are loaded onto the test table (300) in a form that is placed on the flat upper surface of the test table (300).

[0100] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0101] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the rotation axis.

[0102] Typically, when electronic components (ED) are moved to a test table (300), shock or inertia associated with the movement occurs. Such shock or inertia may disturb the position of electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where electronic components are loaded on the test table (300).

[0103] When an electronic component is placed on the test table (300) by the second hand (220), the electronic component can be fixed in the position it was placed in by vacuum pressure. When the second hand (220) releases the grip on the electronic component in that state, the electronic component is fixed in the position it was placed in without any distortion of its position.

[0104] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0105] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0106] The vacuum holes (h) can be implemented to be selectively opened and closed according to the control of the vacuum circuit. The electronic components (ED) can be selectively fixed to the test table (300) or detached from the test table (300).

[0107] The features of the present invention will be further examined with reference to Fig. 5, which is a schematic plan view of a test table (300).

[0108] In the handler (TH) according to the present invention, the test table (300) has a first unit area (US1) and a second unit area (US2) arranged side by side in the Y direction.

[0109] The first unit area (US1) and the second unit area (US2) are areas where electronic components are loaded, so vacuum holes (h) are formed.

[0110] The first unit area (US1) and the second unit area (US2) are set to an area that ensures precision in electrical connection between electronic components and the tester despite thermal deformation of the test table (300).

[0111] The tester has test pins that make electrical contact with electronic components, and these test pins are installed on a test board that constitutes the tester. The test board is described later.

[0112] The precision currently required lies within the area where electronic components are arranged in a 16x16 matrix. Therefore, the first unit area (US1) and the second unit area (US2) are each set to have the same area where 256 electronic components can be arranged.

[0113] If greater precision is required, the areas of the first unit area (US1) and the second unit area (US2) may be reduced, and the number of arranged electronic components may also be reduced. For example, if a higher degree of precision is required, the areas of the first unit area (US1) and the second unit area (US2) may be set to allow electronic components to be loaded in an 8x8 matrix.

[0114] Different types of electronic components may be tested in a single handler (TH). In this case, even if the areas of the first unit area (US1) and the second unit area (US2) are identical, the number of electronic components that can be loaded may differ.

[0115] Even when the same type of electronic components are loaded in the first unit area (US1) and the second unit area (US2), the areas of the first unit area (US1) and the second unit area (US2) may be set differently depending on various situations.

[0116] Figure 6 shows the arrangement for electrically connecting electronic components on a test table (300) to test pins of a test board (TB1, TB2).

[0117] A first test area (TS1) is set on the first test board (TB1), and a second test area (TS2) is set on the second test board (TB2).

[0118] Test pins are installed in the first test area (TS1) and the second test area (TS2).

[0119] The first test area (TS1) corresponds to the first unit area (US1), and the second test area (TS2) corresponds to the second unit area (US2).

[0120] At least one of the test boards (TB1, TB2) can have its horizontal movement finely adjusted. Accordingly, even if the test table (300) shrinks or expands due to thermal deformation, the first test area (TS1) can be aligned with the first unit area (US1), and the second test area (TS2) can be aligned with the second unit area (US2) by adjusting the positions of the test boards (TB1, TB2). Accordingly, the test pins of the test boards (TB1, TB2) and the electronic components of the test table (300) can be precisely electrically connected.

[0121] Referring again to Figure 5, since position adjustment of the test boards (TB1, TB2) is required, a certain setting gap (G) is required between the first unit area (US1) and the second unit area (US2) considering the hardware structure and heat shrinkage of the test boards (TB1, TB2).

[0122] The setting gap (G) must be at least wider than the gap (g) between adjacent electronic components loaded in the first unit area (US1) or the second unit area (US2).

[0123] According to the present invention, electronic components to be tested loaded on the test table (300) are precisely rearranged in the rearrangement section (RP).

[0124] The relocation mechanism (500) precisely relocates the positions of electronic components loaded on the test table (300) in the relocation space (RS). The relocation mechanism (500) will be described in detail later.

[0125] At the connection part (CP), an electrical connection is made between the electronic components loaded on the test table (300) that have been moved to the connection part (CP) and the test pins of the test board (TB1, TB2).

[0126] The test board (TB) is connected to the handler (TH) at the connection point (CP).

[0127] Here, we will briefly look at the test board (TB: TB1, TB2).

[0128] The test board (TB) may be equipped with a probe card structure or another type of interface board structure having a test socket.

[0129] As shown in the bottom view of Fig. 7, test zones (TZs) each corresponding to one electronic component are arranged on the test board (TB). The test zones (TZs) correspond one-to-one with the electronic components loaded on the test table (300).

[0130] One test zone (TZ) is equipped with test pins (t) for electrical connection to one electronic component.

[0131] Test pins (t) in one test zone (TZ) form a single group to form a test zone (TZ) and are electrically connected to an electronic component (ED).

[0132] The test zone (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) and the coordinates of the test zone (TZ) on the XY plane do not match, a fault occurs in the electrical connection between the electronic component (ED) and the tester.

[0133] In particular, as in the conceptual example of Fig. 8, if an electronic component (ED) on a test table (300) is at an angular position having a twisted rotation angle (Θ1) in the Θ-axis direction with respect to a test zone (TZ), a fault occurs in the electrical connection between the electronic component (ED) and the tester. Therefore, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0134] A relocation mechanism (500) is provided to achieve alignment between the test zone (TZ) and the electronic component (ED).

[0135] According to this embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second hand (220). During this process, an error may occur in the position of the electronic component (ED) due to an operating error or operating shock of the second hand (220).

[0136] The positions or angular positions of the electronic components (ED) loaded onto the test table (300) by the second hand (220) on the XY plane may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not match each other.

[0137] This is acceptable as long as the tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, packaged semiconductor devices require precision within 30㎛, and dyna HBM requires precision within 5㎛.

[0138] In the present invention, when the second hand (220) moves electronic components from the transport table (110) to the test table (300), the electronic components are loaded into temporary areas and then rearranged from the temporary areas to fixed position areas.

[0139] The temporary area is not a set location, but an arbitrary location where the electronic component (ED) is placed on the test table (300) by the second hand (220).

[0140] The temporary zone is not set or fixed by the controller (800), but is a location arbitrarily determined by the second hand (220). For example, when the second hand (220) places an electronic component (ED) on the test table (300), the zone where the electronic component (ED) is placed becomes the temporary zone (BZ).

[0141] Exaggerated Figure 9 shows an example of a temporary zone (BZ) on a test table (300).

[0142] The position zone (RZ) refers to the location where the electronic component and the test zone (TZ) are aligned. Exaggerated Fig. 10 shows the relationship between the temporary zone (BZ) and the position zone (RZ) on the test table (300).

[0143] The test zones (RZ) may be preset, but may also be set to match the positions and arrangements of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0144] In Fig. 10, the temporary zone (BZ) has errors in the X-axis direction, Y-axis direction, and Θ-axis direction with respect to the fixed location zone (RZ).

[0145] The relocation mechanism (500) is provided to relocate the position of the electronic component (ED) loaded on the test table (300) by the second hand (220) from the temporary zone (BZ) to the fixed position zone (RZ).

[0146] According to this embodiment, the second hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into the temporary zone (BZ). Then, the repositioning mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the fixed position zone (RZ).

[0147] As shown in the schematic diagram of Fig. 11, the repositioning mechanism (500) includes a repositioning picker (510) and a repositioning camera (520).

[0148] The repositioning mechanism (500) has a fixed position. For example, the repositioning mechanism (500) may be fixedly mounted on a frame forming the skeleton of the handler (TH).

[0149] The repositioning picker (510) can grip or release electronic components (ED). The repositioning picker (510) can grip electronic components (ED) by vacuum pressure.

[0150] The repositioning picker (510) is fixed in position in the horizontal direction, i.e., the X-axis and Y-axis directions.

[0151] The relocation camera (520) is placed apart from the relocation picker (510).

[0152] The relocation camera (520) is provided to photograph electronic components (ED).

[0153] As in the example of Fig. 12, the relocation camera (520) photographs identification marks (M: M1, M2) on an electronic component (ED). The identification marks (M) may be arranged diagonally from each other.

[0154] However, the object captured by the relocation camera (520) for relocating the electronic component (ED) need not be limited to the identification mark (M). The object captured by the relocation camera (520) may be replaced with a corner of the electronic component (ED), an identification pad or identification pattern of the electronic component (ED), etc.

[0155] The relocation picker (510) and the relocation camera (520) are combined and combined into a single module. Therefore, the mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0156] The moving mechanism (600) can move the test table (300) in the horizontal direction along the X-axis and Y-axis.

[0157] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0158] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0159] As shown in the schematic excerpt of FIG. 13, the moving mechanism (600) includes a rotator (610), an elevator (620), a first moving plate (630), a first moving device (640), a second moving plate (650), and a second moving device (660).

[0160] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0161] The angular position of the electronic component (ED) can be adjusted by rotating the test table (300) by the rotator (610).

[0162] The elevator (620) elevates the test table (300).

[0163] The test table (300) is connected to the elevator (620) via a rotator (610).

[0164] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), and the electronic components (ED) are electrically connected to the tester (TESTER). When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) is able to move horizontally.

[0165] Fig. 14 is a schematic example of an elevator (620).

[0166] The elevator (620) may include a height adjuster (621), an elevator motor (622), and a transmission member (623).

[0167] The height adjuster (621) includes a rotating member (621a) and an elevating member (621b).

[0168] The rotating member (621a) and the lifting member (621b) are connected to each other with a screw structure.

[0169] The rotating member (621a) rotates forward and backward by the power of the lifting motor (622).

[0170] The lifting member (621b) moves up and down in conjunction with the forward and reverse rotation of the rotating member (621a). The rotating movement of the lifting member (621b) is prohibited by a restriction member (not shown).

[0171] A test table (300) is connected to the lifting member (621b) by means of a rotating mechanism (610). Accordingly, the test table (300) is raised and lowered together with the lifting member (621b).

[0172] The lifting motor (622) operates the height adjuster (621) to raise and lower the test table (300).

[0173] The power generated by the lifting motor (622) causes the rotating member (621a) to rotate, causing the lifting member (621b) to rise and fall.

[0174] The transmission member (623) transmits the power of the lifting motor (622) to the height adjuster (621). More specifically, the power of the lifting motor (622) is transmitted to the rotating member (621a) of the height adjuster (621).

[0175] The transmission member (623) may be provided as a rotating belt.

[0176] According to an example such as Fig. 14, since it is possible to place the lifting motor (622) that is large in size and requires a high height in an area outside the area between the test table (300) and the first moving plate (630), there is an advantage in that the gap between the test table (300) and the first moving plate (630) can be reduced.

[0177] Fig. 15 shows an example of the arrangement of an elevator (620).

[0178] Figure 15 (a) shows an example of a single configuration in which an elevator (620) applies an elevating force near the center of a test table (300).

[0179] Figure 15 (b) shows an example in which the elevator (620) is divided into a first elevating element (620A) that applies an elevating force near the center of the first unit area (US1) of the test table (300) and a second elevating element (620B) that applies an elevating force near the center of the second unit area (US2) of the test table (300).

[0180] The first moving plate (630) moves in the Y-axis direction, which is the first direction.

[0181] An elevator (620) is installed on the first moving plate (630). Accordingly, the rotator (610), the elevator (620), and the test table (300) combined with the elevator (620) move in the Y-axis direction together with the first moving plate (630).

[0182] The first moving device (640) moves the first moving plate (630) in the Y-axis direction.

[0183] The second moving plate (650) moves in the second direction, the X-axis direction.

[0184] The second moving plate (650) can be installed movably in a form that is rail-coupled to the base plate (BS) forming the skeleton of the handler (TH).

[0185] The first moving plate (630) is installed on the second moving plate (650) so as to be movable in the Y-axis direction. Accordingly, the first moving plate (630), the elevator (620), and the test table (300) are moved in the X-axis direction together with the second moving plate (650).

[0186] Depending on the implementation, it can be implemented to move the first moving plate (630) in the X-axis direction and the second moving plate (650) in the Y-axis direction.

[0187] The second moving device (660) moves the second moving plate (650) in the X-axis direction.

[0188] By moving the test table (300) in the X-axis direction by the second mover (660), the test table (300) can be selectively positioned in the rearrangement space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the test section (RP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester (TESTER) by the elevation of the test table (300).

[0189] The above moving device (600) has three functions.

[0190] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0191] The second function is to electrically connect or disconnect the electronic component (ED) to the tester (TESTER).

[0192] The third function is for rearranging electronic components (ED) in the rearrangement space (RS). Since the rearrangement picker (510) is fixed, the test table (300) moves in the X-axis, Y-axis, and Z-axis directions to adjust the position of the electronic components (ED).

[0193] Here, the operation of the electronic components (ED) during relocation is described.

[0194] As shown in Fig. 10, the temporary zone (BZ) of the electronic component (ED) may have differences from the fixed location zone (RZ) in the X-axis direction, Y-axis direction, and Θ-axis direction.

[0195] The relocation camera (520) photographs the electronic components (ED) on the test table (300) and confirms the temporary zone (BZ) through the location of the identification mark (M).

[0196] When the temporary zone (BZ) is confirmed, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (620) operates to raise the test table (300).

[0197] When the relocation picker (510) suctions and grips the electronic component (ED) of the elevated test table (300) with vacuum pressure, the elevator (620) operates to lower the test table (300). Thereafter, the first mover (640) and the second mover (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) gripped by the relocation picker (510), and the rotator (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the elevator (620) operates to raise the test table (300), thereby causing the electronic component (ED) gripped by the relocation picker (510) to settle in the positioning zone (RZ).

[0198] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is settled in the fixed position zone (RZ), the relocation picker (510) releases the grip of the electronic component (ED). Then, the test table (300) descends and begins relocation of the next electronic component (ED).

[0199] The controller (800) controls the components necessary for proper operation of the handler (TH), such as the transport shuttle (100), the first hand (210), the second hand (220), the vacuum (400), the repositioning mechanism (500), and the moving mechanism (600).

[0200] The operation of the handler (TH) above will be explained further.

[0201] The gap between the first test board (TB1) and the second test board (TB2) is pre-adjusted to take thermal deformation into account.

[0202] In the unloading section (LU), the first hand (210) loads electronic components (ED) to be tested onto the transport table (110) in the first area (A1).

[0203] When all electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and the transport table (110) moves to the second area (A2).

[0204] The second hand (220) moves electronic components (ED) from the transport table (110) in the second area (A2) to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second hand (220) are temporary zones (BZ).

[0205] When all electronic components (ED) to be tested are loaded on the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from temporary zones (BZ) to fixed zones (RZ).

[0206] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test area (TS). Accordingly, the first unit area (US1) of the test table (300) is placed at a position aligned with the first test area (TS1), and the second unit area (US2) is placed at a position aligned with the second test area (TS2).

[0207] After this, the connector (700) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester (TESTER).

[0208] When the test on the electronic components (ED) is completed, the test table (300) is moved to the rearrangement section (RP) by the moving mechanism (600). Then, the second hand (220) moves the tested electronic components (ED) to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the tested electronic components (ED) is moved to the first area (A1). Then, the first hand (210) unloads the tested electronic components (ED) from the transport table (110) and loads them onto an empty customer tray.

[0209] <Second Embodiment>

[0210] The second embodiment can be applied to a test board (TB) as referenced in FIG. 16.

[0211] According to the example of Fig. 16, the first test area (TS1) and the second test area (TS2) are set on a single test board (TB). Therefore, the positions of the first test area (TS1) and the second test area (TS2) are fixed relative to each other.

[0212] The test table (300) is divided into a first table (310) and a second table (320).

[0213] A first unit area (US1) is set in the first table (310), and a second unit area (US2) is set in the second table (320).

[0214] The rotating device (610) of the moving device (600) is divided into a first rotating element (610A) and a second rotating element (610B), and the elevator (620) is divided into a first lifting element (620A) and a second lifting element (620B).

[0215] The first rotating element (610A) and the first lifting element (620A) rotate or lift the first table (310).

[0216] The second rotating element (610B) and the second lifting element (620B) rotate or lift the second table (320).

[0217] And as referenced in FIG. 17, the moving mechanism (600) further includes a third moving plate (671), a fourth moving plate (672), a first moving element (680), and a second moving element (690).

[0218] The third moving plate (671), the fourth moving plate (672), the first moving element (680), and the second moving element (690) are installed on the first moving plate (630).

[0219] The third moving plate (671) is installed so as to be able to move in the Y-axis direction.

[0220] The third moving plate (671) is equipped with a first table (310), a first rotating element (610A), and a first lifting element (620A). Accordingly, the first table (310), the first rotating element (610A), and the first lifting element (620A) move in the Y-axis direction together with the third moving plate (671).

[0221] The fourth moving plate (672) is installed so as to be able to move in the X-axis direction.

[0222] The fourth moving plate (672) is equipped with a second table (320), a second rotating element (610B), and a second lifting element (620B). Accordingly, the second table (320), the second rotating element (610B), and the second lifting element (620B) move in the X-axis direction together with the fourth moving plate (672).

[0223] The third moving plate (671) is fixed in position in the X-axis direction. Accordingly, the first table (310), the first rotating element (610A), and the first lifting element (620A) are also fixed in position in the X-axis direction.

[0224] The fourth moving plate (672) is fixed in position in the Y-axis direction. Accordingly, the second table (320), the second rotating element (610B), and the second lifting element (620B) are also fixed in position in the X-axis direction.

[0225] Naturally, like the moving mechanism (600) in the first embodiment, the moving mechanism (600) in the second embodiment also has a first moving member (640), a second moving plate (650), and a second moving member (660).

[0226] According to the second embodiment, instead of the first test area (TS1) and the second test area (TS2) being fixed, the first table (310) and the second table (320) move.

[0227] The gap between the first table (310) and the second table (320) can be adjusted by moving the first table (310) in the Y-axis direction by the operation of the first moving element (680).

[0228] When thermal deformation occurs, the first moving element (680) operates to move the first table (310) in the Y-axis direction. Accordingly, the gap between the first unit area (US1) and the second unit area (US2) becomes the same as the gap between the first test area (TS1) and the second test area (TS2). In this state, the first moving device (640) and the second moving device (660) operate to move the first table (310) to a position where the first unit area (US1) can be aligned with the first test area (TS1). Then, the second moving element (690) operates to move the second table (320) in the X-axis direction to a position where the second unit area (US2) can be aligned with the second test area (TS2).

[0229] The second embodiment may have various modifications.

[0230] For example, the first moving element (680) and the second moving element (690) can be modified to implement a method of fixing the position of the first table (310) and allowing the second table (320) to move in both the X-axis direction and the Y-axis direction.

[0231] For example, by providing two first moving elements (680) and two second moving elements (690), both the first table (310) and the second table (320) can be implemented to move in the X-axis direction or the Y-axis direction.

[0232] However, in order to minimize the number of added parts and simplify the movement design, the examples referring to Figs. 16 and 17 are most preferable.

[0233] <Third Embodiment>

[0234] The third embodiment is implemented so that one first moving plate (630) is movably installed on a plurality of second moving plates (650), as referenced in FIG. 18.

[0235] According to the example of Fig. 18, the movement of the first moving plate (630) in the Y-axis direction is guided by guide means installed on a plurality of second moving plates (650). Accordingly, the first moving plate (630) performs a balanced Y-axis movement with the misalignment between the two ends in the Y-axis direction minimized.

[0236] <Fourth Embodiment>

[0237] The fourth embodiment is provided with a pair of rearrangement spaces (RS) as referenced in Fig. 19.

[0238] A pair of relocation spaces (RS) are arranged in the X-axis direction with a test space (TS) in between.

[0239] Of course, in the fourth embodiment, test tables (300) are also provided in pairs. Accordingly, different test tables (300) are positioned in each rearrangement space (RS).

[0240] Referring to Fig. 20, when testing of electronic components (ED) is performed while the test table (300) on one side is positioned in the test area (TS), the electronic components (ED) can be rearranged on the test table (300) in the rearrangement space (RS) on the other side.

[0241] According to the fourth implementation, the tester's downtime is significantly reduced, thereby improving processing capacity.

[0242] <Example 5>

[0243] The fifth embodiment can be seen in Fig. 21.

[0244] In the fifth embodiment, two first moving plates (630) are arranged in the Y-axis direction in the rearrangement space (RS).

[0245] The first moving plates (630) can move independently in the Y-axis direction. For this purpose, two first moving units (640) are also provided.

[0246] The first table (310) and the second table (320) are each installed on two first moving plates (630).

[0247] The first table (310) is positioned on the first moving plate (630) in the -Y direction, and the second table (320) is positioned on the second moving plate (630) in the +Y direction.

[0248] Accordingly, the first table (310) and the second table (320) can also be moved independently in the Y-axis direction.

[0249] In the fifth embodiment, a transport shuttle (100) may be provided at each end in the Y-axis direction to further increase the processing capacity.

[0250] <Example 6>

[0251] The sixth embodiment is a combination of the fourth and fifth embodiments, as shown in Fig. 22.

[0252] In the sixth embodiment, the four test tables (300) can be divided into two each and positioned in the rearrangement space (RS) on both sides of the test space (TS).

[0253] The four test tables (300) can be moved independently in the X-axis and Y-axis directions.

[0254] According to the sixth embodiment, various changes are possible in the position of the test table (300) for rearrangement and testing of electronic components (ED).

[0255] As shown in Fig. 23, a pair of test tables (300) in which electronic components are rearranged in a rearrangement space (RS) on one side can be positioned together in a test space (TS) to perform a test on electronic components (ED).

[0256] In addition, as shown in Fig. 24, a test table (300) in which electronic components are rearranged in a rearrangement space (RS) on one side and a test table (300) in which electronic components are rearranged in a rearrangement space (RS) on the other side are positioned together in a test space (TS) so that a test on an electronic component (ED) can be performed.

[0257] According to the sixth embodiment, the processing capacity can be further expanded through the arrangement of the situation-specific test table (300).

[0258] <Notes on the picker device>

[0259] According to the present invention, a first hand (210) and a second hand (220) are provided as two types of picker devices for moving electronic components (ED).

[0260] As in the example of FIG. 3, each picker device may have multiple pickers that are paired with each other.

[0261] Figure 23 shows an example of an improved picker device (PA).

[0262] The picker device (PA) includes four pickers (Pf, Pr), three variable elements (TE) and a main body.

[0263] One of the four pickers (Pf, Pr) is equipped as a fixed picker (Pf).

[0264] The fixed picker (Pf) is installed in a fixed position relative to the main body (B). Therefore, the position of the electronic component (ED) picked up by the fixed picker (Pf) is fixed relative to the main body (B).

[0265] Among the four pickers (Pf, Pr), the remaining ones are equipped with rotary pickers (Pr).

[0266] As shown in the conceptual bottom view of Fig. 26, the variable element (TE) rotates the rotary picker (Pr) in the Θ-axis direction.

[0267] The electronic component (ED) picked up by the rotary picker (Pr) can have its angular coordinates changed as it rotates along with the rotation of the rotary picker (Pr).

[0268] Additionally, the variable element (TE) moves the rotary picker (Pr) in the horizontal axis direction.

[0269] The horizontal axis direction is the X-axis direction and the Y-axis direction.

[0270] The horizontal coordinates of an electronic component (ED) held on a rotary picker (Pr) by a variable element (TE) can be changed relative to a fixed picker (Pf).

[0271] An improved picker device (PA) enables precise gripping of electronic components (ED). To achieve this, the location of the electronic component (ED) must be confirmed with a camera (C) before gripping it with the picker device (PA).

[0272] The camera (C) may be installed on a picker device (PA) as in Fig. 25, or may be provided on the upper side of a loading element such as a customer tray carrying electronic components (ED) to be picked up.

[0273] The improved picker device (PA) can correct the gap and rotation angle between electronic components (ED) during the process of moving the electronic components (ED). Therefore, the improved picker device (PA) can accurately place the electronic components (ED) on a loading element such as a transport table (110).

[0274] The above-described embodiments merely illustrate preferred examples of the present invention, and it may have various applications. Therefore, the present invention should not be construed as being limited to the above-described content. Instead, the scope of the present invention should be construed within the scope of the separately described claims and their equivalents.

Claims

1. A transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; A first hand for loading electronic components onto a transport table in the first area by operation of the above transport shuttle; A second hand for transporting electronic components from a transport table moved from the first area to the second area by the operation of the transport shuttle; A test table on which electronic components carried from the transport table by the second hand are loaded; A rearrangement mechanism for rearranging and aligning electronic components loaded on the test table in the rearrangement space by the second hand; A moving mechanism that moves the test table between the relocation space and the test space where electronic components are tested by the tester, and raises the test table to electrically connect or disconnect the electronic components loaded on the test table to the tester; and A controller for controlling the operation of the above transport shuttle, the first hand, the second hand, the repositioning mechanism and the moving mechanism; The above test table has a first unit area and a second unit area where electronic components are loaded. The first unit area corresponds to the first test area of ​​the tester, and the second unit area corresponds to the second test area of ​​the tester. The gap between the first unit area and the second unit area is wider than the gap between electronic components loaded in the first unit area or the second unit area. Handler for testing electronic components.

2. In paragraph 1 The above rearrangement spaces are provided in pairs. A pair of the above relocation spaces are arranged on both sides of the test space with the test space in between. Handler for testing electronic components.

3. In paragraph 1 The above moving mechanism An elevator that electrically connects or disconnects electronic components loaded on the test table to or from the tester by elevating the test table; and The above elevator is installed and a first moving plate is installed to move in a first direction; A first moving device that moves the first moving plate in the first direction; The first moving plate and the first moving device are installed, and the second moving plate is installed to move in a second direction orthogonal to the first direction; and A second moving device that moves the second moving plate in the second direction; Handler for testing electronic components.

4. In paragraph 1 The above test table is A first table having the first unit area; and A second table spaced apart from the first table and including the second unit area; The positions of the first table and the second table can be changed relative to each other. Handler for testing electronic components.

5. In paragraph 4 The above moving mechanism A first moving element that moves the first table in the second direction; and A second moving element that moves the second table in the first direction; Handler for testing electronic components.

6. In Article 5 The above first table has a fixed position in the first direction, The above second table has a fixed position in the second direction. Handler for testing electronic components.

7. In paragraph 4 The above elevator A first lifting element for individually lifting the first table; and A second lifting element for individually lifting the second table; Handler for testing electronic components.

8. In Article 7 The above first moving plate is two in number, In order to move the first table and the second table independently in the first direction, the first moving device is provided with two units. Handler for testing electronic components.

9. In paragraph 3 The above second moving plate is provided in multiple units. Handler for testing electronic components.

10. In paragraph 1 The above elevator A height adjuster to which the above test table is coupled; and A lifting motor that operates the height adjuster to raise and lower the test table; Handler for testing electronic components.

11. In Article 10 A transmission member that transmits the power of the above-mentioned lifting motor to the above-mentioned height controller; Handler for testing electronic components.

12. A transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; A first hand for loading electronic components onto a transport table in the first area by operation of the above transport shuttle; A second hand for transporting electronic components from a transport table moved from the first area to the second area by the operation of the transport shuttle; A plurality of test tables on which electronic components are loaded and transported from the transport table by the second hand; A plurality of rearrangement mechanisms for rearranging and aligning electronic components loaded on the plurality of test tables in the rearrangement space by the second hand; A plurality of moving mechanisms that move the plurality of test tables between the rearrangement space and the test space where electronic components are tested by the tester, and raise and lower the test tables to electrically connect or disconnect the electronic components loaded on the test tables to the tester; and A controller for controlling the operation of the above transport shuttle, the first hand, the second hand, the plurality of repositioning mechanisms and the plurality of moving mechanisms; The above multiple test tables have a first unit area and a second unit area where electronic components are loaded, The above first unit area corresponds to the first test area of ​​the tester, and the above second unit area corresponds to the second test area of ​​the tester. Handler for testing electronic components.

13. In Article 14 The above rearrangement space is formed in pairs on both sides with the above test space in between, and the above multiple test tables are provided in pairs so that they can be placed in each of the pair of rearrangement spaces. Handler for testing electronic components.

14. In Article 13 The above controller can control the operation of the plurality of moving mechanisms so that a test table moved from one of the above relocation spaces corresponds to the first test area, and a test table moved from the other of the above relocation spaces corresponds to the second test area, so that a test on an electronic component can be performed. Handler for testing electronic components.

15. In paragraph 1 or paragraph 12 The number of electronic components loaded in the first unit area and the number of electronic components loaded in the second unit area are the same. Handler for testing electronic components.

16. In paragraph 1 or paragraph 12 The above first hand or the above second hand A plurality of pickers for picking up electronic components; and A moving element that moves a movable picker, excluding a fixed picker among the above-mentioned plurality of pickers, in a horizontal direction; Handler for testing electronic components.

17. In Article 16 The above relocation mechanism Further comprising a rotating element for rotating the above-mentioned movable picker; Handler for testing electronic components.

18. A fixed picker in which the position of the picked electronic component is fixed by being installed in a fixed position; A rotary picker that is paired with the fixed picker and is installed so as to be rotatable, thereby allowing the angular coordinates of the picked electronic component to be varied; A variable element for rotating the above rotary picker; and A main body including the fixed picker, the rotary picker and the rotary element installed therein; Picker device for a handler for testing electronic components.

19. In paragraph 18, The above variable element enables the horizontal coordinates of the electronic component placed on the rotating picker to be changed relative to the fixed picker by moving the rotating picker in the horizontal axis direction. Picker device for a handler for testing electronic components.

Images