Thermoelectric module and refrigerator including same

Abstract

This thermoelectric module has a first heat dissipation plate and a second heat dissipation plate in opposite directions, and includes a Peltier element between and contacting the first heat dissipation plate and the second heat dissipation plate. The first heat dissipation plate and the second heat dissipation plate include, on the surfaces thereof, a heat-radiating coating layer for radiation cooling. The heat-radiating coating layer includes a heat-radiating material containing oxide particles and a high-emissivity polymer compound. The surface of the heat-radiating coating layer may include a structure in which the heat-radiating material surrounds the oxide particles through self-assembly.

Description

Thermoelectric module and refrigerator including the same

[0001] The present disclosure relates to a thermoelectric module and a refrigerator including the same, and more particularly, to a thermoelectric module including a heat-radiating coating layer and a refrigerator including the same.

[0002] As refrigerators become more direct and smaller, technologies that can efficiently dissipate heat generated within the device to the outside are becoming increasingly necessary. Accumulating internal heat can reduce the efficiency and durability of the refrigerator, potentially negatively impacting its overall lifespan. Therefore, dissipating internal heat to the outside is crucial, and there are three methods for doing so: conduction, convection, and radiation.

[0003] The present invention relates to a thermoelectric module including a coating layer having a property of radiating heat in a form of radiation and an improved surface area to provide an effective cooling effect, and a refrigerator including the same.

[0004] One aspect of the present disclosure may provide a thermoelectric module and a refrigerator including the same.

[0005] The problems to be solved by the present invention are not limited to the problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0006] A thermoelectric module according to one aspect of the present disclosure comprises a first heat sink and a second heat sink in opposite directions, and a Peltier element in contact between the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink include a heat-radiating coating layer for radiant cooling on their surfaces, wherein the heat-radiating coating layer includes a heat-radiating material including oxide particles and a high-emissivity polymer compound, and the surface of the heat-radiating coating layer may include a structure in which the heat-radiating material surrounds the oxide particles by self-assembly.

[0007] A refrigerator according to one aspect of the present disclosure includes a main body having a storage compartment, the main body including a heat sink, and a heat dissipative coating layer for radiant cooling on a surface of the heat sink, the heat dissipative coating layer including a heat dissipative material including oxide particles and a high-emissivity polymer compound, and a surface of the heat dissipative coating layer may include a structure in which the heat dissipative material surrounds the oxide particles by self-assembly.

[0008] According to the idea of ​​the present disclosure, a thermoelectric module comprises a first heat sink and a second heat sink in opposite directions, and a Peltier element in contact between the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink include a heat-radiating coating layer for radiant cooling on their surfaces, wherein the heat-radiating coating layer includes a heat-radiating material containing oxide particles and a high-emissivity polymer compound, and the surface of the heat-radiating coating layer may include a structure in which the heat-radiating material surrounds the oxide particles by self-assembly. In this way, by forming a heat-radiating coating layer containing oxide particles and a high-emissivity polymer compound on the surface of the heat sink, the direction of heat release is controlled, and the difference in density between the oxide particles and the heat-radiating material is controlled so that the heat-radiating coating layer has a large surface area by self-assembly, thereby improving the radiant cooling efficiency of the thermoelectric module.

[0009] In addition, according to the idea of ​​the present disclosure, a refrigerator includes a main body having a storage compartment, the main body includes a heat sink, and includes a heat dissipative coating layer for radiant cooling on a surface of the heat sink, the heat dissipative coating layer includes a heat dissipative material containing oxide particles and a high-emissivity polymer compound, and a surface of the heat dissipative coating layer may include a structure in which the heat dissipative material surrounds the oxide particles by self-assembly. In this way, by forming a heat dissipative coating layer containing oxide particles and a high-emissivity polymer compound on the heat sink of the refrigerator main body, the direction of heat release is controlled, and the density difference between the oxide particles and the heat dissipative material is controlled so that the heat dissipative coating layer has a large surface area by self-assembly, thereby improving the radiant cooling efficiency of the refrigerator. Therefore, the problem of cooling efficiency being affected by changes in the characteristics of the medium for conduction and convection in cooling refrigerator heat generation can be solved, and the power device for forced convection, which was necessary to supplement the cooling performance of the heat sink with a very low thermal emissivity and thus a heat dissipation ability in the form of radiation, can be omitted.

[0010] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0011] Figure 1 is a drawing showing a cooling method of the surface of a refrigerator body according to a conventional refrigerator.

[0012] FIG. 2 is a drawing showing an enlarged view of the surface of a refrigerator body in which a heat-radiating coating layer including a high-emissivity heat-radiating material and oxide particles is applied to the surface of a heat sink according to one embodiment of the present invention, and a cooling method of the refrigerator surface.

[0013] FIG. 3 is a cross-sectional view showing a thermal radiation coating layer including a high-emissivity thermal radiation material and oxide particles applied to a thermoelectric element and a refrigerator according to one embodiment of the present invention.

[0014] Figure 4 is a graph showing the thermal emissivity by measuring the thermal absorption rate of a thermal radiation material according to an embodiment of the present invention by FT-IR.

[0015] FIG. 5 is a graph showing the temperature over time of a Peltier element to which one embodiment of the present disclosure and a comparative example are applied.

[0016] It should be understood that the various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

[0017] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0018] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0019] In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0020] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0021] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0022] In addition, terms such as 'front', 'rear', 'top', 'bottom', 'side', 'left', 'right', 'upper', and 'lower' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0023] Terms such as "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the present disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0024] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0025] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0026] A refrigerator according to one embodiment may include a body.

[0027] The "body" may include an inner case, an outer case disposed on the outside of the inner case, and an insulating material provided between the inner case and the outer case.

[0028] The "inner case" may include at least one of a case, a plate, a panel, or a liner forming a storage compartment. The inner case may be formed as a single body, or may be formed by assembling a plurality of plates. The "outer case" may form the outer appearance of the main body, and may be joined to the outer side of the inner case so that insulation is placed between the inner case and the outer case.

[0029] "Insulation" can insulate the interior and exterior of a storage room so that the temperature inside the storage room can be maintained at a set temperature without being affected by the external environment. In one embodiment, the insulation can include foam insulation. The foam insulation can be formed by injecting and foaming urethane foam, a mixture of polyurethane and a foaming agent, between the inner and outer layers.

[0030] In one embodiment, the insulation may include a vacuum insulation material in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation material instead of the foam insulation. The vacuum insulation material may include a core material and an outer shell material that accommodates the core material and seals the interior under a vacuum or near-vacuum pressure. However, the insulation material is not limited to the foam insulation or vacuum insulation material described above, and may include various materials that can be used for insulation.

[0031] A "storage room" may include a space defined by an interior wall. The storage room may further include an interior wall defining a corresponding space. The storage room may store various items, such as food, medicine, and cosmetics, and the storage room may be configured to be open on at least one side for the entry and exit of items.

[0032] A refrigerator may include one or more storage compartments. When a refrigerator includes two or more storage compartments, each compartment may have a different purpose and be maintained at different temperatures. To achieve this, each storage compartment may be separated from the others by a partition wall containing insulation.

[0033] The storage room may be designed to maintain an appropriate temperature range depending on its intended use, and may include a "refrigerator," a "freezer," or a "variable temperature room," which are distinguished by their intended use and / or temperature range. A refrigerator may be maintained at a temperature appropriate for refrigerating items, and a freezer may be maintained at a temperature appropriate for freezing items. "Refrigeration" may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius. "Freezing" may mean cooling items to freeze them or keep them frozen, and for example, a freezer may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. A variable temperature room may be used as either a refrigerator or a freezer, at the user's option or not.

[0034] In addition to names such as "refrigerator," "freezer," and "variable temperature room," a storage room may also be called by various other names such as "vegetable room," "fresh room," "cooling room," and "ice room." The terms "refrigerator," "freezer," and "variable temperature room" used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.

[0035] In one embodiment, the refrigerator may include at least one door configured to open and close an open side of a storage compartment. The door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments. The door may be installed on the front of the main body in a pivotal or sliding manner.

[0036] The "door" may be configured to seal the storage compartment when the door is closed. The door may include insulation, similar to the body, to insulate the storage compartment when the door is closed.

[0037] According to one embodiment, the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.

[0038] The door inner panel may be provided with a gasket that seals the storage compartment by contacting the front of the body when the door is closed. The door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.

[0039] In one embodiment, the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door. The door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.

[0040] Depending on the arrangement of the door and storage compartment, refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.

[0041] According to one embodiment, the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.

[0042] A "cold air supply device" may include a system of machines, devices, electronic devices and / or combinations thereof that can generate cold air and guide the cold air to cool a storage room.

[0043] In one embodiment, the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant. To this end, the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle. In one embodiment, the cold air supply device can include a semiconductor, such as a thermoelectric element. The thermoelectric element can cool a storage compartment by generating heat and cooling through the Peltier effect.

[0044] According to one embodiment, the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.

[0045] The "machine room" may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room. The interior of the machine room may be configured to be in communication with the exterior of the main body to dissipate heat from components placed within the machine room.

[0046] In one embodiment, the refrigerator may include a dispenser provided on the door to provide water and / or ice. The dispenser may be provided on the door so that it is accessible to a user without having to open the door.

[0047] In one embodiment, a refrigerator may include an ice-making device configured to produce ice. The ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.

[0048] According to one embodiment, the refrigerator may include a control unit for controlling the refrigerator.

[0049] The "control unit" may include a memory that stores or memorizes a program and / or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and / or data memorized in the memory.

[0050] Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator. Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator. Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.

[0051] The processor controls the overall operation of the refrigerator. The processor can control the components of the refrigerator by executing programs stored in memory. The processor may include a separate NPU that performs the operations of an artificial intelligence model. The processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like. The processor may generate control signals to control the operation of the cooling system. For example, the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.

[0052] Additionally, the processor may process user input of the user interface and control the operation of the user interface based on programs and / or data stored / stored in the memory. The user interface may be provided using an input interface and an output interface. The processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.

[0053] The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one subprocessor. The memory may include one or more memories.

[0054] In one embodiment, a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator. For example, the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor. Additionally, the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.

[0055] The communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.

[0056] The input interface may include keys, a touchscreen, a microphone, etc. The input interface may receive user input and transmit it to the processor.

[0057] The output interface may include a display, a speaker, etc. The output interface may output various notifications, messages, information, etc. generated by the processor.

[0058] Referring to the attached drawings below, a thermoelectric module and a refrigerator including the same are described in detail.

[0059] A thermoelectric module according to one embodiment of the present disclosure comprises a first heat sink and a second heat sink in opposite directions, and a Peltier element in contact between the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink include a heat-radiating coating layer for radiant cooling on their surfaces, wherein the heat-radiating coating layer includes a heat-radiating material including oxide particles and a high-emissivity polymer compound, and a surface of the heat-radiating coating layer may include a structure in which the heat-radiating material surrounds the oxide particles by self-assembly.

[0060] In the present invention, a thermoelectric module means an electronic component that generates the so-called Peltier effect, in which one end of each element is cooled and the other end is heated, by connecting a P-type element and an N-type element in series and applying a direct current to both ends, whereby the carriers of each element absorb heat at one end and transfer the absorbed heat to the other end. Such a thermoelectric module has the advantages of being highly reliable, not generating noise or vibration, and enabling local cooling, and can be applied to local cooling of electronic devices such as infrared sensors, laser diodes, and CCD elements, or IC products, and can be used in various fields such as scientific measuring equipment, medical equipment, refrigerators, air conditioners, and heat exchangers.

[0061] In general, in the case of a thermoelectric element that constitutes a thermoelectric module (TEM), i.e. a Peltier element, a temperature difference occurs on both sides when voltage is applied. At this time, cooling is performed using the cold air in the low-temperature part, but if the temperature in the high-temperature part continues to rise, the heat is transferred back to the low-temperature part, which reduces efficiency. The present invention can solve the problem of reduced cooling efficiency as described above by applying a heat dissipation coating layer for radiant cooling to the surface of a heat sink in a thermoelectric module, i.e. a heat sink in a high-temperature or low-temperature part. Here, the heat sink can be used with the same meaning as a heat sink plate, a heat sink member, a cooling plate, a heating plate, a heat sink sheet, a heat sink, or a heat exchange plate, and the low-temperature part of the thermoelectric module to which the first heat sink in the present invention can be applied can be used with the same meaning as a heat absorption surface, a heat absorption part, a heat absorption area, or a cold side, and the high-temperature part of the thermoelectric module to which the second heat sink can be applied can be used with the same meaning as a heat generation surface, a heat generation part, a heat generation area, or a hot side.

[0062] FIG. 1 is a drawing showing a cooling method of a refrigerator body surface according to a conventional refrigerator, FIG. 2 is an enlarged view of the refrigerator body surface in which a heat dissipative coating layer including a high-emissivity heat dissipative material and oxide particles is applied to a heat sink surface according to an embodiment of the present invention, and a drawing showing a cooling method of the refrigerator body surface, and FIG. 3 is a cross-sectional view showing a heat dissipative coating layer including a high-emissivity heat dissipative material and oxide particles applied to a thermoelectric element and a refrigerator according to an embodiment of the present invention.

[0063] Referring to Figure 1, in the case of a conventional refrigerator, when heat is generated inside the refrigerator, the heat is transferred to the refrigerator body and heat sink through conduction, and since the refrigerator body uses a material with low thermal emissivity, such as aluminum, as a heat sink, it can be seen that the surface of the refrigerator is mostly cooled through convection, and heat release through radiation is relatively small.

[0064] Referring to FIG. 2, in one embodiment of the present invention, a heat sink made of a material with low thermal emissivity is applied to the main body of the refrigerator, and oxide particles and a heat-radiating material with high thermal emissivity are applied to the surface of the heat sink, thereby maximizing the difference in thermal emissivity between the heat sink and the heat-radiating material and controlling the directionality of heat release to release heat into the external atmosphere. In addition, after applying oxide particles and a heat-radiating material with high thermal emissivity to the surface of the heat sink, phase separation is induced due to the difference in density, so that the heat-radiating material has a structure in which the oxide particles are surrounded by self-assembly, thereby increasing the surface area of ​​the oxide particles and the heat-radiating material by more than twice that before coating, thereby maximizing the cooling radiation effect and efficiently cooling the surface of the refrigerator. Here, the thermal radiation material can be used with the same meaning as a thermal radiation material, a heat dissipation material, a heat dissipation material or a thermal radiation material, and the structure in which the thermal radiation material surrounds the oxide particle means a form in which the thermal radiation material covers the surface of the oxide particle, and may include a core-shell form. In addition, in the present invention, the oxide is a general term for a binary compound of oxygen and another element, and in the case of the oxide particle in the present invention, it can be used to mean a very small object that constitutes a material including such an oxygen compound. It can be used to mean an encompassing particle, atom, molecule, colloid, etc., and can be used with the same meaning as an oxygen compound, oxide or oxidant. In the case of the heat dissipation coating including the heat sink and oxide particles and the heat dissipation material applied according to the embodiment shown in Fig. 2, the application is not necessarily limited to the embodiment disclosed in the present invention, and can be applied without limitation to electronic devices or parts such as thermoelectric modules, air conditioners, TVs, mobile phones, washing machines, and computers that require heat dissipation or cooling.

[0065] Referring to FIG. 3, in one embodiment of the present invention, a heat sink made of a material having a low thermal emissivity is applied to the heat sink of the main body of the refrigerator and the first and second heat sinks of the thermoelectric module provided in the main body of the refrigerator, and by applying oxide particles and a heat-radiating material having a high thermal emissivity to the surface of the heat sink, the difference in thermal emissivity between the heat sink and the heat-radiating material is maximized, thereby controlling the directionality of heat release and maximizing the cooling efficiency of heat generated within the refrigerator.

[0066] According to one embodiment of the present invention, a thermoelectric module may include a polymer compound including at least one bond selected from the group consisting of a carbon-oxygen single bond, a carbon-nitrogen single bond, a carbon-hydrogen single bond, a sulfur-oxygen double bond, a carbon-oxygen-carbon single bond, an oxygen-silicon-oxygen single bond, and an oxygen-hydrogen single bond, and the heat-radiating material may be poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, MXene, graphene, single-walled carbon nanotube, multi-walled carbon nanotube, polyvinylidene fluoride, and polydimethylsiloxane. It may include one or more selected from the military.

[0067] Table 1 below shows the wavelength of the unique thermal energy emitted by phononic vibration according to the type of molecular bond.

[0068] Wavelength of coupled emission heat energy Carbon-oxygen single bond (CO) 7.7 - 10 (㎛) Carbon-nitrogen single bond (CN) 8.2 - 9.8 (㎛) Carbon-hydrogen single bond (CH) 7.8 - 14.5 (㎛) Sulfur-oxygen double bond (S=O) 9.4 - 9.8 (㎛) Carbon-oxygen-carbon single bond (COC) 8 - 13 (㎛) Oxygen-silicon-oxygen single bond (O-Si-O) 8.8 - 10 (㎛) Oxygen-hydrogen single bond (OH) 8 - 13 (㎛)

[0069] In the case of the heat-radiating material of the present invention, one or more of the bonds disclosed in Table 1 may be included in the molecular structure, and each bond has its own wavelength range of emitted heat energy due to the phononic vibration phenomenon. Here, phononic vibration refers to a vibration phenomenon according to the characteristic of absorbing and emitting a wavelength range of heat energy unique to each functional group bonding structure. The present invention can secure high heat emissivity characteristics by selecting a bonding structure having such a unique wavelength range of heat energy and applying it to the material of the present invention. Figure 4 is a graph showing the heat emissivity by measuring the heat absorption rate of a heat-radiating material according to an embodiment of the present invention by FT-IR. Thermal emissivity refers to the efficiency of energy emission from the surface of an object during heat radiation. Thermal radiation is electromagnetic radiation and includes both visible light visible to the human eye and invisible infrared radiation. Quantitatively, thermal emissivity is the ratio of the heat radiated by a material to the heat radiated by an ideal blackbody surface at the same temperature, according to the Stefan-Boltzmann law. The ratio varies from 0 to 1, and the surface of a blackbody emits 448 W of thermal radiation per square meter at room temperature (25℃, 298.15K). Real objects with thermal emissivities less than 1 emit radiation at a lower rate. Kirchhoff's Law states that the amount of thermal radiation absorbed by an object is equal to the amount of thermal radiation emitted by the same object. According to Kirchhoff's Law, thermal emissivity can be defined as the ratio of thermal emissivity (emissivity) to absorptivity (absorptivity), as shown on the y-axis in Figure 4.

[0070] Referring to FIG. 4, it can be confirmed that in the case of a heat-radiating material including the bonds disclosed in Table 1 in its molecule, the heat-radiating material exhibits a thermal emissivity of 0.9 or more and less than 1 in a wavelength range of heat energy of 2.5 ㎛ or more and 25.0 ㎛ or less. When the polymer compound included in the heat-radiating material of the present invention includes the bonds disclosed in Table 1 in its molecular structure, the heat-radiating material has a high thermal emissivity of 0.9 or more in a wavelength range of heat energy of 2.5 to 25.0 ㎛, which is a region emitted by objects having a temperature of 300 K to 400 K, as well as in a wavelength range of infrared heat energy of sunlight and atmospheric radiation of 8 to 13 ㎛, which is an atmospheric window that cannot be absorbed by atmospheric layers including greenhouse gases, thereby ensuring excellent cooling efficiency in thermoelectric modules used in indoor environments and refrigerators including the same.

[0071] In the present invention, a polymer compound means a compound having a molecular weight of 10,000 or more, and ceramics, carbon compounds, etc. may correspond to polymer compounds, but are not necessarily limited to these examples, and any compound that can include a bond in Table 1 in its molecule and has a molecular weight of 10,000 or more may correspond to a polymer compound of the present invention.

[0072] According to one embodiment of the present disclosure, a thermoelectric module may include at least one selected from the group consisting of silica, alumina, copper oxide, antimony tin oxide, zinc oxide, and titanium oxide, and the density of the oxide particles may be 1 kg / m higher than the density of the heat-radiating material. 3 It can have a large value.

[0073] Material role density (g / cm) 3)PEDOT, PEDOT:PSS heat-radiating material 1Mxene~3Graphene2.3SWCNT, MWCNT1~2PVDF1.8PDMS1SiO2oxide2.6Alumina3.6~3.9Copper oxide6.3Antimony tin oxide6.8Zinc oxide5.6Titanium oxide4.2

[0074] In the case of the present invention, the density of the oxide particles in the thermal radiation material and oxide of Table 2 is 1 kg / m higher than the density of the thermal radiation material. 3By selecting a material to have a large ideal value, self-assembly of the heat-radiating material and oxide particles on the surface of the heat-radiating coating layer can be induced, thereby maximizing the surface area of ​​the heat-radiating coating layer. Specifically, the heat-radiating material and oxide particles having a higher density than the heat-radiating material are dissolved or dispersed in a hydrophilic solvent such as water, methanol, ethanol, isopropanol, acetone, acetonitrile, dimethylformamide, and dimethyl sulfoxide, and then the mixed composition is applied to the surface of the heat sink. The application process can be performed by a method such as spray, bar, dip, comma, slot die, gravure, micro-gravure, and flow. Thereafter, a heat-radiating coating layer can be formed on the surface of the heat sink through a process of drying the solvent by heat treatment at a temperature of 60°C to 200°C, and different or more types of materials can be arranged on the upper and lower portions of the heat-radiating coating layer by self-assembly by utilizing the difference in density between the heat-radiating material and the oxide particles. At this time, the solvent and the coating method in the above process are not limited to the listed examples, and may be performed by a hydrophilic solvent and coating method that can exhibit the effects of the present invention. In the thermoelectric module according to one embodiment of the present disclosure, the diameter of the oxide particles may be 50 nm or more and 500 μm or less. When the diameter of the oxide particles is less than 50 nm, the oxide particles do not form a particle structure having a sufficient volume, so that the surface area of ​​the coating layer targeted by the present invention cannot be secured, and when the diameter of the oxide particles exceeds 500 μm, the number of particle structures having a volume decreases, so that the surface area of ​​the coating layer targeted by the present invention cannot be secured. Therefore, the diameter of the oxide particles is preferably 50 nm or more and 500 μm or less.

[0075] Referring to FIG. 2, it can be confirmed that when oxide particles satisfying the oxide particle diameter of the present invention are applied to the surface of a heat sink, the oxide particles form a particle structure having a sufficient volume, thereby securing the surface area of ​​the coating layer, and thereby improving the radiation cooling efficiency of the coating layer.

[0076] According to one embodiment of the present disclosure, in a thermoelectric module, in a wavelength range of thermal energy of 2.5 ㎛ to 25.0 ㎛, the thermal emissivity of the heat sink may be greater than 0 and less than 0.1, and the thermal emissivity of the heat-radiating material may be greater than 0.85 and less than 1, preferably greater than 0.9 and less than 1. Referring to FIG. 2, it can be confirmed that the difference in thermal emissivity between the heat sink and the heat-radiating material can be maximized to control the heat release direction to the outside of the refrigerator body. In addition, referring to FIG. 4, it can be confirmed that a heat-radiating material having a thermal emissivity greater than 0.9 can be secured in a wavelength range of 2.5 ㎛ to 25.0 ㎛, which is the standard of 300 K to 400 K radiant heat energy as described above.

[0077] According to one embodiment of the present disclosure, a thermoelectric module may have a surface thermal emissivity after applying the thermal radiation coating layer that is 17 times or more greater than the surface thermal emissivity before applying the thermal radiation coating layer, and a surface thermal emissivity after applying the thermal radiation coating layer that is 2 times or more greater than the surface area before applying the thermal radiation coating layer.

[0078] Equation (1):

[0079] (Here, : Total cooling performance, A: Surface area, : Surface thermal emissivity, σ: Stefan-Boltzmann constant (5.67×10 -8 W / m 2 K -4 ),Tc: surface temperature,Tamb: ambient temperature,U: total thermal conductivity coefficient)

[0080] The thermal emissivity of an aluminum heat sink that is not coated with a heat-radiating material such as the present invention is 0.05, and the thermal emissivity of the heat-radiating material of the present invention exceeds 0.9, so it can be seen that the surface thermal emissivity after applying the heat-radiating coating layer according to the embodiment of the present invention is improved by more than 17 times compared to the surface thermal emissivity before application. In addition, by including oxide particles in the coating layer to form a particle structure having volume and increasing the roughness of the surface, a surface area more than twice that of the surface area before applying the heat-radiating material can be secured.

[0081] According to the above formula (1), in the case of the embodiment of the present invention, not only can the surface heat emissivity be secured to be 17 times or more than before application of the heat-radiating coating layer, but also the surface area can be secured to be twice or more, thereby improving the cooling efficiency of the heat generated in the refrigerator.

[0082] According to one embodiment of the present disclosure, the thermoelectric module may have a heat-radiating coating layer having a thickness of 100 nm or more and 500 nm or less. If the heat-radiating coating layer has a thickness of less than 100 nm, the thermal radiation performance desired by the present invention cannot be secured, and if the heat-radiating coating layer has a thickness exceeding 100 nm, the thermal conductivity decreases, thereby reducing the overall cooling efficiency. Therefore, the thickness of the heat-radiating coating layer is preferably 100 nm or more and 500 nm or less.

[0083] According to one embodiment of the present disclosure, the thermoelectric module may include a heat sink made of aluminum or copper, but is not necessarily limited to these examples, and any material that can be applied to the thermoelectric module and has a thermal emissivity of more than 0 and less than 0.1 at a wavelength of heat energy of 2.5 ㎛ or more and 25.0 ㎛ or less may correspond to the heat sink of the present invention.

[0084] According to one embodiment of the present disclosure, a refrigerator includes a main body having a storage compartment, the main body includes a heat sink, and a heat dissipative coating layer for radiant cooling on a surface of the heat sink, the heat dissipative coating layer includes a heat dissipative material including oxide particles and a high-emissivity polymer compound, and a surface of the heat dissipative coating layer may include a structure in which the heat dissipative material surrounds the oxide particles by self-assembly. As shown in Fig. 3 and the above, by applying a heat dissipative coating layer for radiant cooling to the heat sink of the main body of the refrigerator, heat generated in the refrigerator can be efficiently radiantly cooled.

[0085] According to one embodiment of the present disclosure, a refrigerator includes a thermoelectric module in which the main body further has a hole and a Peltier element is arranged to be mounted on the edge of the hole, and the thermoelectric module includes a first heat sink arranged to face the inside of a storage compartment and a second heat sink arranged to face the outside of the storage compartment, and the first heat sink and the second heat sink may include the heat dissipation coating layer on their surfaces. In this way, by applying the heat dissipation coating layer to the heat sink of the thermoelectric module as well as the heat sink of the refrigerator main body, the radiant cooling efficiency of the refrigerator can be maximized.

[0086] According to one embodiment of the present disclosure, a refrigerator may include a heat-radiating material including at least one selected from the group consisting of poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, MXene, graphene, single-walled carbon nanotubes, multi-walled carbon nanotubes, polyvinylidene fluoride, and polydimethylsiloxane, and the oxide particles may include at least one selected from the group consisting of silica, alumina, copper oxide, antimony tin oxide, zinc oxide, and titanium oxide. There is. As described above, a coating solution containing a mixture of heat-radiating material and oxide particles is applied to the first and second heat-radiating plates of the heat-radiating plates and thermoelectric modules applied to the refrigerator body, thereby forming a coating layer with a surface area more than twice as large through self-assembly, thereby ensuring improved radiation cooling efficiency compared to conventional refrigerators.

[0087] Hereinafter, the present invention will be described in detail through examples.

[0088] <Example>

[0089] The comparative example is a Peltier element having an aluminum heat sink attached to the surface, and the exemplary embodiment is a Peltier element having an aluminum heat sink attached to the surface, and a composition containing graphene, poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, and alumina in a 1:1:1 weight ratio, respectively, dispersed in a solvent containing water and acetone in a 1:1 weight ratio, and then mixed, and then the mixed composition was sprayed onto the surface of the heat sink and heat-treated at 100°C for 30 minutes.

[0090] A voltage of 20 V was applied to each Peltier element corresponding to the comparative example and the embodiment for 30 minutes, and the temperature changes of the hot side and the cold side over time were measured with a thermometer, and are shown in Table 2. Here, the hot side refers to the center of the heat sink where the temperature increases due to the heat generated by the Seebeck effect of the Peltier element being transferred, and the cold side refers to the center of the element located opposite the hot side where the temperature decreases.

[0091] Time (minutes) Temperature (℃) Preliminary comparison High temperature part Low temperature part High temperature part Low temperature part 0 2 5 2 5 2 5 5 7 5 1 2 7 7 8 1 0 9 0 2 4 9 3 2 2 1 5 9 7 3 2 1 0 2 3 2 2 0 1 0 4 4 1 1 1 2 4 3 2 5 1 0 8 4 5 1 1 7 4 9 3 0 1 1 0 5 0 1 2 2 5 6

[0092] Referring to Table 3 and FIG. 5, in the case of the high-temperature part of the Peltier element according to the embodiment of the present invention, heat generation of the element progressed due to the voltage application, reaching 90°C after 10 minutes of voltage application, but cooling occurred due to the material of the present invention, and it was confirmed that the final temperature converged to 110°C after 30 minutes of voltage application. On the other hand, in the case of the comparative example, a higher temperature was shown than in the embodiment at all times after the voltage application, and the final temperature of the high-temperature part was 122°C after 30 minutes of voltage application, which was 12°C higher than in the embodiment, and unlike in the embodiment of the present invention, the temperature of the high-temperature part tended to rise even after 30 minutes. Similarly, in the case of the low-temperature part of the Peltier element according to the embodiment of the present invention, heat generation of the element progressed due to the voltage application, reaching 32°C after 15 minutes of voltage application, but cooling occurred due to the material of the present invention, and it was confirmed that the final temperature of the low-temperature part of the element converged to 50°C after 30 minutes of voltage application.

[0093] However, in the case of the low-temperature part of the comparative example, it reached 32°C after 15 minutes of voltage application, and maintained a higher temperature than the example throughout the time thereafter, and after 30 minutes, the low-temperature part showed a final temperature of 56°C, which was 6°C higher than the example of the present invention, confirming that the thermal emissivity characteristics were improved in the case of the example according to the present invention.

[0094] According to one embodiment, a thermoelectric module includes a first heat sink and a second heat sink in opposite directions, and a Peltier element in contact between the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink include a heat-radiating coating layer for radiant cooling on a surface thereof, wherein the heat-radiating coating layer includes a heat-radiating material including oxide particles and a high-emissivity polymer compound, and a surface of the heat-radiating coating layer may include a structure in which the heat-radiating material surrounds the oxide particles by self-assembly.

[0095] The thermoelectric module may include a polymer compound in which the heat-radiating material includes at least one bond selected from the group consisting of a carbon-oxygen single bond, a carbon-nitrogen single bond, a carbon-hydrogen single bond, a sulfur-oxygen double bond, a carbon-oxygen-carbon single bond, an oxygen-silicon-oxygen single bond, and an oxygen-hydrogen single bond.

[0096] The thermoelectric module may include at least one selected from the group consisting of poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, MXene, graphene, single-walled carbon nanotube, multi-walled carbon nanotube, polyvinylidene fluoride, and polydimethylsiloxane.

[0097] The above thermoelectric module may include at least one selected from the group consisting of silica, alumina, copper oxide, antimony tin oxide, zinc oxide, and titanium oxide.

[0098] The above thermoelectric module has a density of the oxide particles that is 1 kg / m higher than the density of the heat-radiating material. 3 It can have a large value.

[0099] The above thermoelectric module may have an oxide particle diameter of 50 nm or more and 500 μm or less.

[0100] The above thermoelectric module may have a thermal emissivity of the heat sink of greater than 0 and less than 0.1 in a wavelength range of thermal energy of 2.5 ㎛ or more and 25.0 ㎛ or less, and a thermal emissivity of the thermal radiation material of greater than 0.85 and less than 1.

[0101] The above thermoelectric module may have a thermal emissivity of the heat sink of greater than 0 and less than 0.1 in a wavelength range of thermal energy of 2.5 ㎛ or more and 25.0 ㎛ or less, and a thermal emissivity of the heat radiation material of greater than 0.9 and less than 1.

[0102] The above thermoelectric module may have a surface thermal emissivity after applying the thermal radiation coating layer that is 17 times or more higher than the surface thermal emissivity before applying the thermal radiation coating layer.

[0103] The above thermoelectric module may have a surface area after applying the heat radiation coating layer that is at least twice the surface area before applying the heat radiation coating layer.

[0104] The above thermoelectric module may have a thickness of the heat radiation coating layer of 100 nm or more and 500 nm or less.

[0105] The above thermoelectric module may include a heat sink made of aluminum.

[0106] According to one embodiment, a refrigerator includes a body having a storage compartment, the body including a heat sink, and a heat-radiating coating layer for radiant cooling on a surface of the heat sink, the heat-radiating coating layer including a heat-radiating material including oxide particles and a high-emissivity polymer compound, and a surface of the heat-radiating coating layer may include a structure in which the heat-radiating material surrounds the oxide particles by self-assembly. In this way, the heat-radiating material includes a structure in which the oxide particles are covered, thereby increasing the surface area of ​​the coating layer, thereby maximizing not only the cooling effect due to conduction but also the cooling effect due to radiation, thereby ensuring the efficiency of cooling heat generated within the refrigerator without a medium or additional power, which is advantageous in terms of economy and energy efficiency.

[0107] The refrigerator includes a thermoelectric module in which the main body further has a hole and a Peltier element is arranged to be mounted on the edge of the hole, and the thermoelectric module includes a first heat sink arranged to face the inside of the storage compartment and a second heat sink arranged to face the outside of the storage compartment, and the first heat sink and the second heat sink may include the heat-radiating coating layer on their surfaces.

[0108] The refrigerator may include at least one selected from the group consisting of the heat-radiating material, poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, MXene, graphene, single-walled carbon nanotubes, multi-walled carbon nanotubes, polyvinylidene fluoride, and polydimethylsiloxane, and the oxide particles may include at least one selected from the group consisting of silica, alumina, copper oxide, antimony tin oxide, zinc oxide, and titanium oxide.

[0109] Above, a thermoelectric module according to one embodiment and a refrigerator including the same have been described.

[0110] Although the embodiments of the invention disclosed above have been illustrated and described, the disclosed invention is not limited to the specific embodiments described above, and various modifications may be implemented by a person having ordinary skill in the art to which the disclosed invention pertains without departing from the gist claimed in the claims.

Claims

1. The first heat sink and the second heat sink are provided in opposite directions, A Peltier element is included so as to be in contact between the first heat sink and the second heat sink, The first heat sink and the second heat sink include a heat-radiating coating layer for radiant cooling on their surfaces, The above heat-radiating coating layer includes a heat-radiating material containing oxide particles and a high-emissivity polymer compound, A thermoelectric module having a surface of the heat-radiating coating layer including a structure in which the heat-radiating material surrounds the oxide particles through self-assembly.

2. In claim 1, The above-mentioned heat-radiating material is a thermoelectric module including a polymer compound including at least one bond selected from the group consisting of a carbon-oxygen single bond, a carbon-nitrogen single bond, a carbon-hydrogen single bond, a sulfur-oxygen double bond, a carbon-oxygen-carbon single bond, an oxygen-silicon-oxygen single bond, and an oxygen-hydrogen single bond.

3. In claim 1, A thermoelectric module comprising at least one selected from the group consisting of the above heat-radiating material, poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, MXene, graphene, single-walled carbon nanotubes, multi-walled carbon nanotubes, polyvinylidene fluoride, and polydimethylsiloxane.

4. In claim 1, A thermoelectric module wherein the oxide particles include at least one selected from the group consisting of silica, alumina, copper oxide, antimony tin oxide, zinc oxide, and titanium oxide.

5. In claim 1, The density of the above oxide particles is 1 kg / m higher than the density of the heat-radiating material. 3 Thermoelectric module with a large ideal value.

6. In claim 1, A thermoelectric module wherein the diameter of the oxide particles is 50 nm or more and 500 μm or less.

7. In claim 1, A thermoelectric module in which the heat sink has a thermal emissivity of more than 0 and less than 0.1 in a wavelength range of thermal energy of 2.5 ㎛ or more and 25.0 ㎛ or less, and the heat radiation material has a thermal emissivity of more than 0.85 and less than 1.

8. In claim 1, A thermoelectric module in which the heat sink has a thermal emissivity of more than 0 and less than 0.1 in a wavelength range of thermal energy of 2.5 ㎛ or more and 25.0 ㎛ or less, and the heat radiation material has a thermal emissivity of more than 0.9 and less than 1.

9. In claim 1, A thermoelectric module having a surface thermal emissivity after applying the above-mentioned thermal radiation coating layer that is 17 times or more the surface thermal emissivity before application.

10. In claim 1, A thermoelectric module having a surface area after applying the above heat-radiating coating layer that is at least twice the surface area before application.

11. In claim 1, A thermoelectric module having a thickness of the heat-radiating coating layer of 100 nm or more and 500 nm or less.

12. In claim 1, The above heat sink is a thermoelectric module containing aluminum.

13. Includes a main body having a storage room, The above body includes a heat sink, It includes a heat radiation coating layer for radiant cooling on the surface of the above heat sink, The above heat-radiating coating layer includes a heat-radiating material containing oxide particles and a high-emissivity polymer compound, A refrigerator wherein the surface of the heat-radiating coating layer includes a structure in which the heat-radiating material surrounds the oxide particles by self-assembly.

14. In claim 13, The above body further has a hole, A thermoelectric module is provided in which a Peltier element is mounted on the edge of the above hole, The above thermoelectric module includes a first heat sink arranged to face the inside of the storage room and a second heat sink arranged to face the outside of the storage room. A refrigerator wherein the first heat sink and the second heat sink include the heat-radiating coating layer on their surfaces.

15. In claim 13 or claim 14, The above heat-radiating material comprises at least one selected from the group consisting of poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, MXene, graphene, single-walled carbon nanotube, multi-walled carbon nanotube, polyvinylidene fluoride, and polydimethylsiloxane. A refrigerator wherein the oxide particles include at least one selected from the group consisting of silica, alumina, copper oxide, antimony tin oxide, zinc oxide, and titanium oxide.

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