Conductive adhesive tape, conductive adhesive tape assembly and solar cell

Abstract

Disclosed in the present invention are a conductive adhesive tape, a conductive adhesive tape assembly and a solar cell. The conductive adhesive tape comprises a conductive functional layer, which comprises a conductive material layer and a conductive adhesive layer, wherein the conductive adhesive layer covers the entire or part of the outer surface of the conductive material layer. The conductive adhesive tape further comprises a surface protection layer, which does not completely cover the outer surface of the conductive functional layer. By means of the exposed conductive adhesive layer, the bonding and electrical connection with other conductive components are achieved, such that the conductive adhesive tape is convenient to be quickly connected to and separated from other conductive components, and with the protection of the surface protection layer, the covered area of the conductive functional layer can be prevented from being corroded or electroplated.

Description

Conductive tape, conductive tape assembly, and solar cell

[0001] This application claims priority to Chinese patent application No. CN2023115711486 filed on November 23, 2023, the contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of electroplating technology, and in particular to a conductive tape, a conductive tape assembly and a solar cell. Background Art

[0003] Forming metal grid lines on solar cells through electroplating technology is one of the current mainstream technologies. Its principle is to set an anode in the electroplating solution and connect the anode to the positive pole of the electroplating power supply, put the solar cell into the electroplating solution and connect the solar cell to the negative pole of the electroplating power supply, so that the solar cell is set near the anode or can be moved near the anode, and then an electric field is formed between the anode and the solar cell. Through the action of the electric field, the metal cations in the electroplating solution are deposited on the solar cell to form metal grid lines. The solar cell in the electroplating solution is generally connected to the negative pole of the power supply through a conductive connector, such as a conductive clip, a conductive lead, a conductive roller, a conductive probe, etc. During the electroplating process of the solar cell, the connection point between the conductive connector and the solar cell will be electroplated, and even the entire surface of the conductive connector immersed in the electroplating solution will be electroplated, which makes the solar cell and the conductive connector easily adhere to each other after electroplating; after the electroplating is completed, the solar cell and the conductive connector are separated, which easily causes the solar cell to break; after the solar cell and the conductive connector are separated, the conductive connector needs to be de-plated to prevent the conductive connector after electroplating from affecting the electroplating effect of the subsequent solar cell.

[0004] To this end, the applicant has developed a conductive tape to replace existing conductive connectors. The conductive tape and solar cell have a flexible or elastic connection, unlike the existing rigid connection, which can reduce the fragmentation rate of the solar cell. The conductive tape is a consumable material, and after the conductive tape is separated from the solar cell, it does not need to be stripped, which saves stripping time in the electroplating process and improves electroplating efficiency.

[0005] However, how to improve the conductive properties of the conductive tape, how to protect local areas on the conductive tape (such as anti-corrosion and anti-plating), and how to balance the conductive properties and protective properties of the conductive tape have become new technical problems that need to be solved. Summary of the Invention

[0006] The object of the present invention is to provide a conductive tape, a conductive tape assembly and a solar cell to solve one or more technical problems in the background technology.

[0007] The first aspect of the present invention provides a conductive tape, which includes a conductive functional layer, wherein the conductive functional layer includes a conductive material layer and a conductive adhesive layer, and the conductive adhesive layer covers the entire or partial area of ​​the outer surface of the conductive material layer. The conductive tape also includes a surface protective layer, and the surface protective layer does not completely cover the outer surface of the conductive functional layer.

[0008] In some embodiments, the surface protection layer includes a shielding layer and a connecting adhesive layer, and the shielding layer is connected to the outer surface of the conductive functional layer through the connecting adhesive layer; or, the surface protection layer includes an insulating coating, and the insulating coating is connected to the outer surface of the conductive functional layer.

[0009] In some embodiments, the conductive functional layer has at least a first exposed portion and a second exposed portion, a partial area of ​​the conductive adhesive layer is exposed from the first exposed portion, and a partial area of ​​the conductive material layer or another partial area of ​​the conductive adhesive layer is exposed from the second exposed portion, wherein the first exposed portion and the second exposed portion are located at different positions in the length direction of the conductive tape.

[0010] In some embodiments, the conductive tape is a layered structure, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive material layer, the conductive adhesive layer covers all or part of the lower surface of the conductive material layer, and the outer surface of the conductive functional layer includes the upper surface and lower surface of the conductive functional layer, wherein the first exposed portion is located on the lower surface of the conductive functional layer, and the second exposed portion is located on the upper surface or lower surface of the conductive functional layer.

[0011] In some embodiments, the conductive material layer includes a conductive base layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive base layer, and the conductive adhesive layer covers all or part of the lower surface of the conductive base layer;

[0012] Alternatively, the conductive material layer includes a conductive base layer and a conductive coating, the conductive coating is coated on the lower surface of the conductive base layer, and the conductive coating covers all or part of the lower surface of the conductive base layer; the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive coating, and the conductive adhesive layer covers all or part of the lower surface of the conductive coating.

[0013] In some embodiments, the surface protection layer includes a first protection layer, which is disposed on the upper surface of the conductive functional layer and covers all or part of the upper surface of the conductive functional layer;

[0014] And / or, the surface protection layer includes a second protection layer, the second protection layer is provided on the lower surface of the conductive functional layer, and the second protection layer does not completely cover the lower surface of the conductive adhesive layer.

[0015] In some embodiments, the conductive tape includes the first protective layer, and the first protective layer completely covers the upper surface of the conductive functional layer.

[0016] In some embodiments, the conductive tape further includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered.

[0017] In some embodiments, the conductive adhesive layer covers the lower surface of one or both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer, and the second protective layer covers the lower surface of the middle part of the conductive material layer and part of the lower surface of the conductive adhesive layer adjacent thereto.

[0018] In some embodiments, the conductive adhesive layer covers the lower surfaces of both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer is suspended below the lower surface of the middle part of the conductive material layer to form a hollow area between the conductive functional layer and the second protective layer. The second protective layer covers a partial area on the lower surface of the conductive adhesive layer close to the hollow area.

[0019] In some embodiments, the conductive tape also includes the second protective layer, which covers the lower surface of the middle part of the conductive functional layer and exposes the lower surface of both ends of the conductive functional layer, and a conductive covering layer is provided on the lower surface of one end of the conductive functional layer.

[0020] In some embodiments, the conductive tape also includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered; a glue dew groove is also provided on the second protective layer, and the glue dew groove passes through the second protective layer, so that part of the lower surface of the conductive functional layer is exposed from the glue dew groove.

[0021] In some embodiments, the conductive tape includes the first protective layer and the second protective layer, wherein the first protective layer covers the upper surface of one end of the conductive functional layer, and the upper surface of the other end of the conductive functional layer is exposed and not covered; the second protective layer covers the lower surface of the other end of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered.

[0022] The exposed area on the lower surface of the conductive functional layer forms the first exposed portion, and the exposed area on the upper surface of the conductive functional layer forms the second exposed portion. The first exposed portion and the second exposed portion are arranged at two different ends in the length direction of the conductive tape.

[0023] In some embodiments, the conductive tape includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered, wherein the conductive base layer is a material layer of surface passivated metal.

[0024] In some embodiments, the conductive tape includes the first protective layer and the second protective layer, the first protective layer covers the upper surface of one end of the conductive functional layer, and the upper surface of the other end of the conductive functional layer is exposed and not covered, forming the second exposed portion; a glue dew groove is provided on the second protective layer, and the glue dew groove passes through the second protective layer, so that part of the lower surface of the conductive functional layer is exposed from the glue dew groove, forming the first exposed portion; the first exposed portion and the second exposed portion are spaced apart in the length direction of the conductive tape.

[0025] In some embodiments, in the conductive functional layer, the conductive adhesive layer covers a portion of the lower surface of the conductive material layer, and a third connecting groove is provided on the conductive adhesive layer, and the third connecting groove passes through the conductive adhesive layer, so that a portion of the lower surface of the conductive material layer is exposed from the third connecting groove; the conductive tape includes the first protective layer and the second protective layer, wherein,

[0026] The first protective layer completely covers the upper surface of the conductive functional layer, or a first connecting groove is provided on the first protective layer, the first connecting groove penetrates the first protective layer so that the upper surface of the conductive material layer is partially exposed from the first connecting groove, and the first connecting groove is provided directly above the third connecting groove;

[0027] A second connecting groove is provided on the second protective layer, and the second connecting groove passes through the second protective layer. The second connecting groove is provided directly below the third connecting groove, so that the lower surface of the conductive material layer is exposed from the third connecting groove and the second connecting groove, and the second protective layer does not cover the end of the conductive functional layer away from the second connecting groove, so that the conductive functional layer at this end is exposed.

[0028] In some embodiments, a partial area of ​​the conductive adhesive layer is exposed from the first exposure portion, and another partial area of ​​the conductive adhesive layer is exposed from the second exposure portion, wherein a release sheet is provided on the lower surface of the conductive adhesive layer exposed from the second exposure portion.

[0029] In some embodiments, the conductive tape has a layered structure, and the conductive functional layer has two groups of conductive adhesive layers, which are respectively referred to as a first conductive adhesive layer and a second conductive adhesive layer. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive material layer, and the first conductive adhesive layer covers all or part of the upper surface of the conductive material layer; the upper surface of the first conductive adhesive layer is formed as the upper surface of the conductive functional layer; the upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive material layer, and the second conductive adhesive layer covers all or part of the lower surface of the conductive material layer; the lower surface of the second conductive adhesive layer is formed as the lower surface of the conductive functional layer.

[0030] The surface protection layer includes a first protection layer, which is provided on the upper surface of the conductive functional layer, and the first protection layer does not completely cover the upper surface of the first conductive adhesive layer;

[0031] And / or, the surface protection layer includes a second protection layer, the second protection layer is provided on the lower surface of the conductive functional layer, and the second protection layer does not completely cover the lower surface of the second conductive adhesive layer.

[0032] In some embodiments, the length of the first exposed portion is a, the length of the second exposed portion is b, and the length of the conductive tape is L, wherein 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L.

[0033] In some embodiments, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer;

[0034] Alternatively, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer;

[0035] Alternatively, the first exposed portion is a glue-exposing groove communicating with the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from the glue-exposing groove.

[0036] In some embodiments, the first exposed portion is a partial area of ​​the lower surface of the conductive functional layer, and the second exposed portion is another partial area of ​​the lower surface of the conductive functional layer; the conductive tape further has a third exposed portion, a partial area of ​​the upper surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly above the second exposed portion;

[0037] Alternatively, the first exposed portion is a partial area of ​​the lower surface of the conductive functional layer, and the second exposed portion is a partial area of ​​the upper surface of the conductive functional layer; the conductive functional layer also has a third exposed portion, another partial area of ​​the lower surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly below the second exposed portion.

[0038] In some embodiments, the conductive tape is cylindrical or prismatic, the conductive adhesive layer is coated on the periphery of the conductive material layer, the surface protection layer is a third protective layer coated on the periphery of the conductive functional layer, and the third protective layer only coats the middle section of the conductive functional layer and exposes both ends of the conductive functional layer.

[0039] In some embodiments, the conductive adhesive layer includes an adhesive and a conductive filler, the adhesive includes epoxy resin, phenolic resin, polyimide, acrylic resin or polyurethane, and the conductive filler includes carbon, metal or metal oxide, wherein the metal includes at least Au, Ag, Cu or Ni.

[0040] In some embodiments, the conductive adhesive layer further comprises one or more of a curing agent, a diluent, a plasticizer, a coupling agent, and a defoaming agent; wherein the plasticizer comprises at least di-n-octyl phthalate or di-n-butyl phthalate.

[0041] A second aspect of the present invention provides a conductive tape assembly, comprising the conductive tape as described above and a base film, wherein the conductive tape is adhered to the base film.

[0042] A third aspect of the present invention provides a solar cell having the conductive tape described above bonded thereto.

[0043] Due to the application of the above-mentioned technical solution, the embodiments of the present invention have the following advantages compared with the prior art: the conductive tape in this embodiment is bonded and electrically connected to other conductive components through the exposed conductive adhesive layer, which facilitates the rapid connection and separation of the conductive tape and other conductive components. Under the protection of the surface protective layer, the covered area of ​​the conductive functional layer can be prevented from being corroded or electroplated. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] FIG1 is a schematic diagram of the first structure of the conductive tape in Example 1;

[0045] FIG2 is a schematic diagram of a second structure of the conductive tape in Example 1;

[0046] FIG3 is a schematic diagram of a third structure of the conductive tape in Example 1;

[0047] FIG4 is a schematic diagram of a fourth structure of the conductive tape in Example 1;

[0048] FIG5 is a schematic diagram of a fifth structural embodiment of the conductive tape in Example 1;

[0049] FIG6 is a schematic diagram of a sixth structural embodiment of the conductive tape in Example 1;

[0050] FIG7 is a schematic diagram of a seventh structure of the conductive tape in Example 1;

[0051] FIG8 is a schematic diagram of the first structure of the conductive tape in Example 2;

[0052] FIG9 is a schematic diagram of a second structure of the conductive tape in Example 2;

[0053] FIG10 is a schematic diagram of a third structure of the conductive tape in Example 2;

[0054] FIG11 is a schematic diagram of a fourth structure of the conductive tape in Example 2;

[0055] FIG12 is a schematic diagram of the fifth structure of the conductive tape in Example 2;

[0056] FIG13 is a schematic diagram of the sixth structure of the conductive tape in Example 2;

[0057] FIG14 is a schematic diagram of the first structure of the conductive tape in Example 3;

[0058] Figure 15 is a schematic diagram of the second structure of the conductive tape in Example 3;

[0059] FIG16 is a schematic diagram of a third structure of the conductive tape in Example 3;

[0060] FIG17 is a schematic diagram of a fourth structure of the conductive tape in Example 3;

[0061] FIG18 is a schematic diagram of the fifth structure of the conductive tape in Example 3;

[0062] FIG19 is a schematic diagram of a sixth structural embodiment of the conductive tape in Example 3;

[0063] FIG20 is a schematic diagram of the seventh structure of the conductive tape in Example 3;

[0064] FIG21 is a schematic diagram of an eighth structural embodiment of the conductive tape in Example 3;

[0065] FIG22 is a schematic diagram of the first structure of the conductive tape in Example 4;

[0066] FIG23 is a schematic diagram of a second structure of the conductive tape in Example 4;

[0067] Figure 24 is a schematic diagram of a third structure of the conductive tape in Example 4;

[0068] Figure 25 is a schematic diagram of the first structure of the conductive tape in Example 5;

[0069] Figure 26 is a schematic diagram of a second structure of the conductive tape in Example 5;

[0070] Figure 27 is a schematic diagram of a third structure of the conductive tape in Example 5;

[0071] FIG28 is a schematic diagram of the first structure of the conductive tape in Example 6;

[0072] Figure 29 is a schematic diagram of a second structure of the conductive tape in Example 6;

[0073] Figure 30 is a schematic diagram of a third structure of the conductive tape in Example 6;

[0074] Figure 31 is a schematic diagram of the fourth structure of the conductive tape in Example 6;

[0075] FIG32 is a schematic diagram of the fifth structure of the conductive tape in Example 6;

[0076] FIG33 is a schematic diagram of a sixth structural embodiment of the conductive tape in Example 6;

[0077] Figure 34 is a schematic diagram of the first structure of the conductive tape in Example 7;

[0078] Figure 35 is a schematic diagram of the second structure of the conductive tape in Example 7;

[0079] Figure 36 is a schematic diagram of a third structure of the conductive tape in Example 7;

[0080] Figure 37 is a schematic diagram of the fourth structure of the conductive tape in Example 7;

[0081] FIG38 is a schematic diagram of the fifth structure of the conductive tape in Example 7;

[0082] FIG39 is a schematic diagram of a sixth structural embodiment of the conductive tape in Example 7;

[0083] FIG40 is a schematic diagram of a seventh structural embodiment of the conductive tape in Example 7;

[0084] Figure 41 is a schematic diagram of the first structure of the conductive tape in Example 8;

[0085] Figure 42 is a schematic diagram of a second structure of the conductive tape in Example 8;

[0086] Figure 43 is a schematic diagram of the third structure of the conductive tape in Example 8;

[0087] Figure 44 is a schematic diagram of the fourth structure of the conductive tape in Example 8;

[0088] Figure 45 is a schematic diagram of the fifth structure of the conductive tape in Example 8;

[0089] Figure 46 is a schematic diagram of the sixth structure of the conductive tape in Example 8;

[0090] Figure 47 is a schematic diagram of the first structure of the conductive tape in Example 9;

[0091] Figure 48 is a schematic diagram of the installation position of the release sheet in Example 9;

[0092] Figure 49 is a schematic diagram of a second structure of the conductive tape in Example 9;

[0093] Figure 50 is a schematic diagram of a third structure of the conductive tape in Example 9;

[0094] Figure 51 is a schematic diagram of the first structure of the conductive tape in Example 10;

[0095] Figure 52 is a schematic diagram of a second structure of the conductive tape in Example 10;

[0096] Figure 53 is a schematic diagram of a third structure of the conductive tape in Example 10;

[0097] Figure 54 is a schematic diagram of the fourth structure of the conductive tape in Example 10;

[0098] Figure 55 is a schematic diagram of the fifth structure of the conductive tape in Example 10;

[0099] Figure 56 is a schematic diagram of the sixth structure of the conductive tape in Example 10;

[0100] Figure 57 is a schematic cross-sectional view of a first structural embodiment of the conductive tape in Example 11;

[0101] Figure 58 is a left side schematic view of the first structure of the conductive tape in Example 11;

[0102] Figure 59 is a left side schematic view of the first structural deformation of the conductive tape in Example 11;

[0103] Figure 60 is a schematic cross-sectional view of a second structure of the conductive tape in Example 11;

[0104] Figure 61 is a left side schematic diagram of the second structure of the conductive tape in Example 11;

[0105] Figure 62 is a schematic cross-sectional view of a third structure of the conductive tape in Example 11;

[0106] Figure 63 is a left side schematic view of a third structure of the conductive tape in Example 11;

[0107] Figure 64 is a schematic diagram of the first structure of the conductive tape in Example 12;

[0108] Figure 65 is a schematic diagram of a second structure of the conductive tape in Example 12;

[0109] Figure 66 is a schematic diagram of a third structure of the conductive tape in Example 12;

[0110] Figure 67 is a schematic diagram of the first structure of the conductive tape assembly in Example 14;

[0111] Figure 68 is a schematic diagram of a second structure of the conductive tape assembly in Example 14;

[0112] Figure 69 is a schematic diagram of the first arrangement structure of the conductive tape on the base film in Example 14;

[0113] Figure 70 is a schematic diagram of a second arrangement structure of the conductive tape on the base film in Example 14;

[0114] Figure 71 is a schematic diagram of the third arrangement structure of the conductive tape on the base film in Example 14;

[0115] Figure 72 is a schematic diagram of a first structure of a solar cell with a conductive tape in Example 15;

[0116] Figure 73 is a schematic diagram of a second structure of a solar cell with a conductive tape in Example 15;

[0117] In the above attached figures:

[0118] 1- Conductive tape;

[0119] 10-conductive functional layer, 11-conductive base layer, 12-conductive adhesive layer, 12a-hollow area, 12b-third connecting groove, 13-conductive coating;

[0120] 20 - first protective layer, 20b - first connecting groove, 21 - first shielding layer, 22 - first connecting adhesive layer, 23 - first insulating coating;

[0121] 30 - second protective layer, 30a - glue-exposing groove, 30b - second connecting groove, 31 - second shielding layer, 32 - second connecting glue layer, 33 - second insulating coating;

[0122] 40-conductive covering layer;

[0123] 50-base film, 51-third connecting adhesive layer;

[0124] 60-anti-adhesive sheet;

[0125] 70 - third protective layer, 71 - third shielding layer, 72 - third connecting adhesive layer, 73 - third insulating coating layer;

[0126] 2-solar cell, 2a-conductive connection part. DETAILED DESCRIPTION

[0127] The present invention provides a conductive tape comprising a conductive functional layer 10, comprising a conductive material layer and a conductive adhesive layer 12. The conductive adhesive layer 12 covers all or part of the outer surface of the conductive material layer. The conductive tape also includes a surface protective layer that partially covers the outer surface of the conductive functional layer 10, leaving portions of the conductive functional layer 10 exposed for bonding and electrical connection with other conductive components. This facilitates rapid connection and separation of the conductive tape from other conductive components and protects the areas of the conductive functional layer 10 covered by the surface protective layer from corrosion or electroplating.

[0128] Specifically, the conductive functional layer 10 has at least a first exposed portion and a second exposed portion, a partial area of ​​the conductive adhesive layer 12 is exposed from the first exposed portion, and a partial area of ​​the conductive material layer or another partial area of ​​the conductive adhesive layer 12 is exposed from the second exposed portion, wherein the first exposed portion and the second exposed portion are located at different positions in the length direction of the conductive tape; the first exposed portion is used to bond the area to be electroplated on the solar cell 2, and the second exposed portion is used to bond or connect other conductive components.

[0129] In some conductive tapes, the surface protection layer specifically includes a shielding layer and a connecting adhesive layer. The shielding layer is connected to the outer surface of the conductive functional layer 10 via the connecting adhesive layer, so that the shielding layer can be well adhered to the outer surface of the conductive functional layer 10 and is not easily detached. In particular, when the surface protection layer is connected to the outer surface of the conductive adhesive layer 12, if the connecting adhesive layer is not provided and the shielding layer is directly provided on the outer surface of the conductive adhesive layer 12, that is, the shielding layer adheres to the conductive adhesive layer 12 via the viscosity of the conductive adhesive layer 12, however, the viscosity and conductivity of the conductive adhesive layer 12 are negatively correlated. In order to balance the conductivity and viscosity of the conductive adhesive layer 12, the viscosity of the conductive adhesive layer 12 should not be too strong. If the shielding layer is directly provided on the outer surface of the conductive adhesive layer 12, the shielding layer is likely to detach during subsequent use. However, when the shielding layer is connected to the outer surface of the conductive adhesive layer 12 via the connecting adhesive layer, the connecting adhesive layer can improve the adhesion between the shielding layer and the conductive adhesive layer 12, thereby reducing the risk of the shielding layer detaching. In some other conductive tapes, the surface protection layer may be an insulating coating connected to the outer surface of the conductive functional layer 10 .

[0130] According to some embodiments of the present invention, the conductive tape has a layered structure, and in the conductive functional layer 10, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive material layer, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive material layer; the lower surface of the conductive adhesive layer 12 is formed as the lower surface of the conductive functional layer 10, as in the embodiments shown in Figures 1 to 50; in some other embodiments, the conductive adhesive layer 12 is provided on both the upper and lower surfaces of the conductive material layer, as in the embodiments shown in Figures 51 to 56.

[0131] When the conductive tape has a layered structure, the surface protective layer includes a first protective layer 20 and / or a second protective layer 30, wherein the first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and the second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. When the second protective layer 30 is disposed on the lower surface of the conductive adhesive layer 12, the second protective layer 30 does not completely cover the lower surface of the conductive adhesive layer 12. The conductive tape in this embodiment achieves adhesion and electrical connection with other conductive components through the exposed conductive adhesive layer 12, facilitating rapid connection and separation of the conductive tape from other conductive components. Under the protection of the first protective layer 20 and / or the second protective layer 30, the covered area of ​​the conductive functional layer 10 is protected from corrosion or electroplating.

[0132] In some conductive tapes, the conductive material layer may include only the conductive base layer 11, that is, the conductive functional layer 10 includes only the conductive base layer 11 and the conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. In other conductive tapes, the conductive material layer may include the conductive base layer 11 and the conductive coating 13, that is, the conductive functional layer 10 includes the conductive base layer 11, the conductive adhesive layer 12, and the conductive coating 13, the conductive coating 13 is applied to the lower surface of the conductive base layer 11, and the conductive coating 13 covers all or part of the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0133] According to other embodiments of the present invention, the conductive tape is cylindrical or prismatic, the conductive adhesive layer 12 is coated on the periphery of the conductive material layer, and the surface protective layer is a third protective layer coated on the periphery of the conductive functional layer 10. The third protective layer only coats the middle section of the conductive functional layer 10 and exposes both ends of the conductive functional layer 10, as shown in the embodiments shown in Figures 57 to 63.

[0134] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is intended to help understand the present invention and does not constitute a limitation of the present invention. The following embodiments are not just one embodiment, but a collection of embodiments with similar schemes or features.

[0135] It should be noted that, herein, the terms "upper" and "lower" are defined with reference to the thickness direction of the conductive tape when the conductive tape is a layered structure, corresponding to the directions shown in Figures 1 to 47 and 49 to 56; the terms "left" and "right" correspond to the lengthwise extension direction of the conductive tape, which are also the left-right directions shown in Figures 1 to 47, 49 to 57, 60, 62, and 64 to 68. The above-mentioned orientations and positional relationships are merely for the purpose of facilitating the description of the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present application.

[0136] Example 1

[0137] The conductive tape shown in FIG. 1 to FIG. 7 includes a conductive functional layer 10 and a first protective layer 20 disposed on the upper surface of the conductive functional layer 10 .

[0138] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes the conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 only covers a portion of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 may only cover the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 may not cover the lower surface of the other end of the conductive base layer 11.

[0139] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13, and the conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer; the conductive coating 13 covers all or part of the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0140] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10 . The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated.

[0141] The first structure of the conductive tape in this embodiment is shown in Figure 1. The conductive tape includes a conductive functional layer 10, with a first protective layer 20 disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. In this first structure, the surface protective layer includes only the first protective layer 20, and the lower surface of the conductive adhesive layer 12 is completely exposed, with a portion forming a first exposed portion and another portion forming a second exposed portion. The second structure of the conductive tape in this embodiment is shown in FIG2 . The conductive tape includes a conductive functional layer 10, with a first protective layer 20 disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, part or all of the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 forms a first exposed portion, which is bonded to the area to be plated on the solar cell. The exposed right end of the conductive base layer 11 forms a second exposed portion, which is connected to the conductive clip. This allows the current used to electroplate the solar cell to flow sequentially through the conductive clip and the conductive tape to the area to be plated on the solar cell. The conductive adhesive layer 12 is not disposed on the lower surface of the right end of the conductive base layer 11, preventing the lower surface of the right end of the conductive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0142] The third structure of the conductive tape in this embodiment is shown in Figure 3. The conductive tape includes a conductive functional layer 10, with a first protective layer 20 disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11 and, together with the conductive base layer 11, forms a conductive material layer. The conductive coating layer 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from corrosion or electroplating. In the third structure, the surface protection layer only includes the first protection layer 20 , and the lower surface of the conductive adhesive layer 12 is completely exposed, with a partial area forming a first exposed portion and another partial area forming a second exposed portion.

[0143] The fourth structure of the conductive tape in this embodiment is shown in Figure 4 . The conductive tape includes a conductive functional layer 10, with a first protective layer 20 disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the lower surface of the conductive coating layer 13, with the lower surface of the right end of the conductive coating layer 13 exposed. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating 13 is bonded to the area to be plated on the solar cell, and the right end of the exposed conductive coating 13 is connected to a conductive clip, so that the current used to plate the solar cell can flow through the conductive clip and the conductive tape in sequence to the area to be plated on the solar cell. The conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive coating 13 to prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or plated.

[0144] The fifth structure of the conductive tape in this embodiment is shown in FIG5 . The conductive tape includes a conductive functional layer 10, with a first protective layer 20 disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11. The conductive coating layer 13 covers the lower surface of the conductive base layer 11, leaving the lower surface of the right end of the conductive base layer 11 exposed. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13, leaving the lower surface of the right end of the conductive base layer 11 exposed. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating 13 is bonded to the area to be plated on the solar cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used to plate the solar cell can flow through the conductive clip and the conductive tape in sequence to the area to be plated on the solar cell. The lower surface of the right end of the conductive base layer 11 is not provided with a conductive coating 13 and a conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and being unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or plated.

[0145] The sixth structure of the conductive tape in this embodiment is shown in Figure 6 . This conductive tape includes a conductive functional layer 10, with a first protective layer 20 disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive base layer 11 to protect the conductive base layer 11 from corrosion or electroplating.

[0146] The seventh structure of the conductive tape in this embodiment is shown in FIG7 . The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11, leaving the lower surface of the right end of the conductive base layer 11 exposed. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be plated on the solar cell. The exposed right end of the conductive base layer 11 is connected to a conductive clip, allowing the current used to electroplate the solar cell to flow through the conductive clip and the conductive tape to the area to be plated on the solar cell. The conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive base layer 11, preventing the lower surface of the right end of the conductive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first insulating coating 23 that completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the conductive base layer 11.

[0147] Example 2

[0148] The conductive tape shown in FIG8 to FIG13 includes a conductive functional layer 10 , a first protective layer 20 disposed on the upper surface of the conductive functional layer 10 , and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10 .

[0149] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes the conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 covers only part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 may cover only the lower surface of one end of the conductive base layer 11, or may not cover the lower surface of the other end of the conductive base layer 11.

[0150] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13, and the conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer; the conductive coating 13 covers all or part of the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0151] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the middle portion of the conductive functional layer 10 is covered, while the lower surfaces of the two ends of the conductive functional layer 10 are exposed and uncovered. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. At least one of the lower surface of the left end and the lower surface of the right end of the conductive functional layer 10 is formed by the lower surface of the conductive tape 12, so that one end of the conductive tape can be bonded to the area to be electroplated on the solar cell.

[0152] The first structure of the conductive tape in this embodiment is shown in Figure 8 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the conductive adhesive layer 12 is exposed at both ends, forming a first exposed portion and a second exposed portion, respectively. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. The second structure of the conductive tape in this embodiment is shown in Figure 9. The conductive tape includes a conductive functional layer 10, a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 forms a first exposed portion, which is used to adhere to the area to be electroplated on the solar cell. The right end of the exposed conductive base layer 11 forms a second exposed portion, which is used to connect to the conductive clip. This allows the current used to electroplate the solar cell to flow through the conductive clip and the conductive tape in sequence to the area to be electroplated on the solar cell. The conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive base layer 11 to prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0153] The third structure of the conductive tape in this embodiment is shown in Figure 10. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11 and, together with the conductive base layer 11, forms a conductive material layer. The conductive coating layer 13 covers the entire lower surface of the conductive base layer 11 (i.e., the entire area on the lower surface). The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of both ends of the conductive adhesive layer 12 are exposed but not covered, forming a first exposed portion and a second exposed portion respectively. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0154] The fourth structure of the conductive tape in this embodiment is shown in FIG11 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11 and, together with the conductive base layer 11, constitutes a conductive material layer. The conductive coating layer 13 covers the entire lower surface of the conductive base layer 11 (i.e., the entire area on the lower surface). The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers a portion of the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the lower surface of the conductive coating layer 13, and the lower surface of the right end of the conductive coating layer 13 is exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed and uncovered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0155] Based on the first to fourth structures described above, alternatively, the second shielding layer 31 can be directly disposed on the lower surface of the conductive adhesive layer 12, that is, the second shielding layer 31 adheres to the conductive adhesive layer 12 through the viscosity of the conductive adhesive layer 12. However, the viscosity and conductivity of the conductive adhesive layer 12 are negatively correlated. In order to balance the conductivity and viscosity of the conductive adhesive layer 12, the viscosity of the conductive adhesive layer 12 cannot be too strong. If the second shielding layer 31 is directly disposed on the lower surface of the conductive adhesive layer 12, the second shielding layer 31 is easy to fall off during subsequent use. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second connecting adhesive layer 32 can enhance the adhesion between the second shielding layer 31 and the conductive adhesive layer 12, thereby reducing the risk of the second shielding layer 31 falling off. The fifth structure of the conductive tape in this embodiment is shown in Figure 12. The conductive tape includes a conductive functional layer 10, a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23. The first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating on the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the conductive adhesive layer 12 at both ends. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0156] The sixth structure of the conductive tape in this embodiment is shown in Figure 13. This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. The lower surface of the right end of the conductive base layer 11 can be used for conductive connection to other conductive components. The first protective layer 20 includes a first insulating coating 23. The first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating on the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left end of the conductive adhesive layer 12, while keeping the lower surface of the right end of the conductive base layer 11 exposed. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0157] Example 3

[0158] The conductive tape shown in FIG. 14 to FIG. 21 includes a conductive functional layer 10 , a first protective layer 20 disposed on the upper surface of the conductive functional layer 10 , and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10 .

[0159] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive material layer is composed of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers a partial area on the lower surface of the conductive base layer 11. Specifically, the conductive adhesive layer 12 covers the lower surface of one end or both ends of the conductive base layer 11, exposing the lower surface of the middle part of the conductive base layer 11.

[0160] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13, and the conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer; the conductive coating 13 covers all or part of the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0161] The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to protect the conductive functional layer 10 from corrosion or electroplating. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, leaving the lower surfaces of the conductive functional layer 10 at both ends uncovered. Optionally, the second protective layer 30 covers the lower surface of the central portion of the conductive material layer and a portion of the lower surface of the adjacent conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive functional layer 10 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. Optionally, the conductive adhesive layer 12 covers the lower surface of both ends of the conductive material layer, leaving the lower surface of the central portion exposed. The second protective layer 30 is disposed overhead below the lower surface of the central portion of the conductive material layer, forming a hollow region 12a. The second protective layer 30 covers the portion of the conductive adhesive layer 12 adjacent to the hollow region 12a. In this embodiment, the conductive adhesive layer 12 is not disposed on the lower surface of the central portion of the conductive material layer, which can reduce the amount of conductive adhesive layer 12 used, thereby reducing the overall cost of the conductive tape.

[0162] The first structure of the conductive tape in this embodiment is shown in Figure 14. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the left and right ends of the conductive base layer 11, leaving the lower surface of the middle portion of the conductive base layer 11 exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive base layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left and right sides thereof, which can prevent the covered area from being corroded or electroplated. The exposed areas of the lower surfaces of the conductive adhesive layers 12 at both ends form a first exposed portion and a second exposed portion, respectively, which can be used for conductive connection to other conductive components.

[0163] The second structure of the conductive tape in this embodiment is shown in Figure 15. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the left end of the conductive base layer 11, exposing the lower surface of the middle and right ends of the conductive base layer 11. The lower surface of the right end of the conductive base layer 11 forms a second exposed portion, which can be used for conductive connection to other conductive components. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive base layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left side thereof, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 forms a first exposed portion, which can be used for conductive connection to other conductive components.

[0164] The third structure of the conductive tape in this embodiment is shown in Figure 16 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11 and, together with the conductive base layer 11, forms a conductive material layer. The conductive coating layer 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive coating layer 13, leaving the lower surface of the middle portion of the conductive coating layer 13 exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 via the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle portion of the conductive coating 13 and the portion of the lower surface of the conductive adhesive layer 12 adjacent to it on its left and right sides, thereby preventing the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0165] The fourth structure of the conductive tape in this embodiment is shown in FIG17 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surface of the left end of the conductive coating layer 13, leaving the lower surface of the middle portion and the lower surface of the right end of the conductive coating layer 13 exposed. The lower surface of the right end of the conductive coating layer 13 can be used for conductive connection to other conductive components. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 via the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle portion of the conductive coating 13 and the portion of the lower surface of the conductive adhesive layer 12 adjacent to the left thereof, thereby preventing the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0166] The fifth structure of the conductive tape in this embodiment is shown in Figure 18 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive base layer 11, leaving the lower surface of the middle portion of the conductive base layer 11 exposed. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive base layer 11 to protect the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the middle portion of the conductive base layer 11 and portions of the lower surface of the conductive adhesive layer 12 adjacent to the left and right sides. This protects the covered area from corrosion or electroplating. The exposed lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0167] The sixth structure of the conductive tape in this embodiment is shown in FIG19 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the left and right ends of the conductive base layer 11, leaving the lower surface of the middle portion of the conductive base layer 11 exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive base layer 11, and a hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed areas of the lower surface of the conductive adhesive layer 12 at both ends form a first exposed portion and a second exposed portion, respectively, which can be used for conductive connection to other conductive components.

[0168] The seventh structure of the conductive tape in this embodiment is shown in FIG20 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surfaces of the left and right ends of the conductive coating layer 13, leaving the lower surface of the middle portion of the conductive coating layer 13 exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to protect the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive coating 13, and a hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0169] The eighth structure of the conductive tape in this embodiment is shown in Figure 21. This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 at both ends, leaving the lower surface of the conductive base layer 11 in the middle exposed. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating on the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33. The second protective layer 30 (second insulating coating 33) is suspended below the lower surface of the middle part of the conductive base layer 11, and a hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0170] Example 4

[0171] The conductive tape shown in FIG. 22 to FIG. 24 includes a conductive functional layer 10 , a first protective layer 20 disposed on the upper surface of the conductive functional layer 10 , and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10 .

[0172] The conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes a conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 covers only a portion of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 may cover only the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 may not cover the lower surface of the other end of the conductive base layer 11.

[0173] In order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0174] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 covers the upper surface of the left end of the conductive functional layer 10. The covered area of ​​the upper surface of the conductive functional layer 10 can be protected from corrosion or electroplating. The exposed area of ​​the upper surface of the conductive functional layer 10 forms a second exposed portion, which can be used for conductive connection to other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 covers the lower surface of the right end of the conductive functional layer 10. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating. The exposed area of ​​the lower surface of the conductive functional layer 10 forms a first exposed portion, which can be used for conductive connection to other conductive components. When configured, the area of ​​the upper surface of the conductive functional layer 10 covered by the first protective layer 20 is larger than the area of ​​the uncovered area, and the area of ​​the lower surface of the conductive functional layer 10 covered by the second protective layer 30 is larger than the area of ​​the uncovered area.

[0175] The first structure of the conductive tape in this embodiment is shown in Figure 22. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22, and the first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The covered area of ​​the upper surface of the conductive base layer 11 is protected from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0176] The second structure of the conductive tape in this embodiment is shown in Figure 23. This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11 and covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The covered area of ​​the upper surface of the conductive base layer 11 can be protected from corrosion or electroplating, and the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0177] The third structure of the conductive tape in this embodiment is shown in Figure 24. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23. The first insulating coating 23 covers the upper surface of the left end of the conductive base layer 11 to prevent corrosion or electroplating on the covered upper surface of the conductive base layer 11. The exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0178] Example 5

[0179] The conductive tape shown in Figures 25 to 27 includes a conductive functional layer 10, a first protective layer 20 provided on the upper surface of the conductive functional layer 10, and a second protective layer 30 provided on the lower surface of the conductive functional layer 10.

[0180] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive material layer is composed of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11.

[0181] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0182] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and the first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and the second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the conductive functional layer 10 at both ends is exposed and not covered, forming a first exposed portion and a second exposed portion, respectively. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. In some specific application environments, the exposed portion of the lower surface of the conductive functional layer 10 is the conductive adhesive layer 12. The conductive adhesive layer 12 exposed on one end of the conductive functional layer 10 is bonded to the conductive component, and the other end of the conductive functional layer 10 is connected to the conductive component by other means. This causes the conductive adhesive layer 12 exposed on the other end of the conductive functional layer 10 to affect the connection and disassembly. Therefore, in this embodiment, a conductive covering layer 40 is provided on the conductive adhesive layer 12 exposed on the other end of the conductive functional layer 10. The conductive covering layer 40 is made of a conductor material, such as conductive metals such as copper, aluminum, iron, stainless steel, or conductive silicone or other conductive materials.

[0183] The first structure of the conductive tape in this embodiment is shown in FIG25 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of the left and right ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. Among them, the exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0184] The second structure of the conductive tape in this embodiment is shown in FIG26 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to protect the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, leaving the lower surfaces of the left and right ends of the conductive adhesive layer 12 exposed. The covered areas of the lower surface of the conductive adhesive layer 12 are protected from corrosion or electroplating, while the exposed areas of the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40, preventing the exposed area from adhering to other conductive components.

[0185] The third structure of the conductive tape in this embodiment is shown in Figure 27 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the entire upper surface of the conductive base layer 11 to protect the upper surface of the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the conductive adhesive layer 12 at both ends. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0186] Example 6

[0187] As shown in FIG. 28 to FIG. 33 , the conductive tape includes a conductive functional layer 10 and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10 .

[0188] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes the conductive material layer. The conductive base layer 11 is a material layer with a surface-passivated metal, such as aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 may only cover the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 may not cover the lower surface of the other end of the conductive base layer 11.

[0189] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0190] The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of one end or both ends of the conductive functional layer 10 is exposed and not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components.

[0191] The first structure of the conductive tape in this embodiment is shown in FIG28 . The conductive tape includes a conductive functional layer 10, with a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the conductive adhesive layer 12 is exposed at the left and right ends, forming a first exposed portion and a second exposed portion, respectively. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0192] The second structure of the conductive tape in this embodiment is shown in Figure 29. The conductive tape includes a conductive functional layer 10, with a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the solar cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used to electroplate the solar cell can flow through the conductive clip and the conductive tape in sequence to the area to be electroplated on the solar cell; the conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive base layer 11, which can prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and being unable to be separated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, and the lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0193] The third structure of the conductive tape in this embodiment is shown in Figure 30. The conductive tape includes a conductive functional layer 10, with a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive base layer 11 is preferably aluminum foil. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, and the conductive coating layer 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of both ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0194] The fourth structure of the conductive tape in this embodiment is shown in FIG31 . The conductive tape includes a conductive functional layer 10, with a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive base layer 11 is preferably aluminum foil. The conductive coating layer 13 is coated on the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the lower surface of the conductive coating layer 13, exposing the lower surface of the right end of the conductive coating layer 13. The lower surface of the right end of the conductive coating layer 13 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0195] The fifth structure of the conductive tape in this embodiment is shown in Figure 32. This conductive tape includes a conductive functional layer 10, with a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the conductive adhesive layer 12 at its left and right ends. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0196] The sixth structure of the conductive tape in this embodiment is shown in FIG33 . The conductive tape includes a conductive functional layer 10, with a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11, leaving the lower surface of the right end of the conductive base layer 11 exposed. The lower surface of the right end of the conductive base layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 covers the lower surface of the conductive adhesive layer 12, leaving the lower surface of the left end of the conductive adhesive layer 12 exposed, while leaving the lower surface of the right end of the conductive base layer 11 exposed. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0197] Example 7

[0198] As shown in Figures 34 to 40, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0199] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes the conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 covers only part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 may cover only the lower surface of one end of the conductive base layer 11, or may not cover the lower surface of the other end of the conductive base layer 11.

[0200] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0201] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, covering all or part of the upper surface of the conductive functional layer 10. The covered area of ​​the upper surface of the conductive functional layer 10 is protected from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 is provided with a glue desorption groove 30a. The glue desorption groove 30a extends through the second protective layer 30, exposing the lower surface of the conductive functional layer 10, that is, the lower surface of the conductive adhesive layer 12, from the glue desorption groove 30a. Preferably, the glue desorption groove 30a extends along the width of the second protective layer 30 to the edge, dividing the second protective layer 30 into two sections. Preferably, when the first protective layer 20 covers the entire area on the upper surface of the conductive functional layer 10, the second protective layer 30 covers the lower surface of one end of the conductive functional layer 10, exposing the lower surface of the other end of the conductive functional layer 10, and the glue dew groove 30a is arranged near one end of the conductive functional layer 10, that is, the end of the conductive functional layer 10 not covered by the second protective layer 30 and the glue dew groove 30a are arranged at different ends in the length direction of the conductive tape; when the first protective layer 20 covers the upper surface of one end of the conductive functional layer 10, exposing the upper surface of the other end of the conductive functional layer 10, the second protective layer 30 covers the entire area on the lower surface of the conductive functional layer 10 except the glue dew groove 30a, and the glue dew groove 30a is arranged near one end of the conductive functional layer 10, that is, the end of the upper surface of the conductive functional layer 10 not covered by the first protective layer 20 and the glue dew groove 30a are arranged at different ends in the length direction of the conductive tape. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components during separation can be reduced, making it easier to separate the conductive adhesive layer 12 from the other conductive components.

[0202] The first structure of the conductive tape in this embodiment is shown in FIG34 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The covered area of ​​the upper surface of the conductive base layer 11 is protected from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive base layer 11 on the right end can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. A glue-exposing groove 30a is provided near the left end of the second protective layer 30. The glue-exposing groove 30a extends through the width of the second protective layer 30, allowing a portion of the lower surface of the conductive adhesive layer 12 to be exposed through the glue-exposing groove 30a. The entire lower surface of the conductive adhesive layer 12, excluding the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 is attached to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components during separation is reduced, making it easier to separate the conductive adhesive layer 12 as a whole from other conductive components.

[0203] The second structure of the conductive tape in this embodiment is shown in Figure 35 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11 and covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The covered area of ​​the upper surface of the conductive base layer 11 is protected from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. A glue desorption groove 30a is provided near the left end of the second protective layer 30. The glue desorption groove 30a penetrates the second protective layer 30, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed from the glue desorption groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed from the glue desorption groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components during separation is reduced, making it easier to separate the conductive adhesive layer 12 as a whole from the other conductive components.

[0204] The third structure of the conductive tape in this embodiment is shown in Figure 36. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23. The first insulating coating 23 covers the upper surface of the left end of the conductive base layer 11 to prevent corrosion or electroplating on the covered upper surface of the conductive base layer 11. The upper surface of the right end of the conductive base layer 11 is exposed and can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. A glue-exposing groove 30a is provided near the left end of the second protective layer 30. The glue-exposing groove 30a extends through the second protective layer 30, allowing a portion of the lower surface of the conductive adhesive layer 12 to be exposed through the glue-exposing groove 30a. The entire lower surface of the conductive adhesive layer 12, excluding the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 is attached to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components during separation is reduced, making it easier to separate the conductive adhesive layer 12 as a whole from the other conductive components.

[0205] The fourth structure of the conductive tape in this embodiment is shown in Figure 37. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, and does not cover the lower surface of the right end of the conductive adhesive layer 12. A glue-exposing groove 30a is provided near the left end of the second protective layer 30. The glue-exposing groove 30a extends through the second protective layer 30, allowing a portion of the lower surface of the conductive adhesive layer 12 to be exposed through the glue-exposing groove 30a. Except for the area exposed from the glue-exposing groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the rest of the lower surface of the conductive adhesive layer 12 is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for electrical connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive groove 30a. After the conductive adhesive layer 12 exposed from the adhesive groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from the other conductive components, making it easier for the conductive adhesive layer 12 to be separated from the other conductive components as a whole.

[0206] The fifth structure of the conductive tape in this embodiment is shown in FIG38 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the solar cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used to electroplate the solar cell can flow through the conductive clip and the conductive tape in sequence to the area to be electroplated on the solar cell. The conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive base layer 11 to prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and being unable to separate. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. A glue-exposing groove 30a is provided near the left end of the second protective layer 30. The glue-exposing groove 30a extends through the second protective layer 30, allowing a portion of the lower surface of the conductive adhesive layer 12 to be exposed through the glue-exposing groove 30a. The entire lower surface of the conductive adhesive layer 12, excluding the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 is attached to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components during separation is reduced, making it easier to separate the conductive adhesive layer 12 as a whole from the other conductive components.

[0207] The sixth structure of the conductive tape in this embodiment is shown in FIG39 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to protect the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. Specifically, the second shielding layer 31 does not cover the lower surface of the right end of the conductive adhesive layer 12. A glue-exposing groove 30a is provided near the left end of the second protective layer 30. The glue-exposing groove 30a extends through the second protective layer 30, partially exposing the lower surface of the conductive adhesive layer 12 from the glue-exposing groove 30a. Except for the area exposed from the glue-exposing groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the rest of the lower surface of the conductive adhesive layer 12 is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive groove 30a. After the conductive adhesive layer 12 exposed from the adhesive groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from the other conductive components, making it easier for the conductive adhesive layer 12 to be separated from the other conductive components as a whole.

[0208] The seventh structure of the conductive tape in this embodiment is shown in FIG40 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the entire upper surface of the conductive base layer 11 to prevent corrosion or electroplating on the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 does not completely cover the lower surface of the conductive adhesive layer 12. Specifically, the second insulating coating 33 does not cover the lower surface of the right end of the conductive adhesive layer 12. A glue-exposing groove 30a is provided near the left end of the second insulating coating 33. The glue-exposing groove 30a extends through the second insulating coating 33, leaving a portion of the lower surface of the conductive adhesive layer 12 exposed through the glue-exposing groove 30a. Except for the area exposed from the glue-exposing groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the rest of the lower surface of the conductive adhesive layer 12 is covered by the second insulating coating 33. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive groove 30a. After the conductive adhesive layer 12 exposed from the adhesive groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from the other conductive components, making it easier for the conductive adhesive layer 12 to be separated from the other conductive components as a whole.

[0209] Example 8

[0210] As shown in Figures 41-46, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is provided on the upper surface of the conductive functional layer 10, and a second protective layer 30 is provided on the lower surface of the conductive functional layer 10.

[0211] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes the conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 is provided with a third connecting groove 12b. The third connecting groove 12b passes through the conductive adhesive layer 12, so that a portion of the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b. Preferably, the third connecting groove 12b is provided near one end of the conductive adhesive layer 12.

[0212] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0213] The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated. Alternatively, the first protective layer 20 is provided with a first connecting groove 20b that penetrates the first protective layer 20, allowing a portion of the upper surface of the conductive base layer 11 to be exposed through the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. A second protective layer 30 is provided on the lower surface of the conductive functional layer 10. The second protective layer 30 is provided with a second connecting groove 30b that penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, allowing the lower surface of the conductive base layer 11 to be exposed through the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive functional layer 10 away from the second connecting groove 30b, exposing the conductive functional layer 10 at that end, and thus the conductive adhesive layer 12 at that end, for connection to other conductive components. In this embodiment, the upper surface of the conductive base layer 11 is exposed through the first connecting groove 20b, and the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b and the second connecting groove 30b. When a conductive tape is used as the conductive connector, other conductive components are directly connected to the upper surface of the conductive base layer 11 through the first connecting groove 20b and directly connected to the lower surface of the conductive base layer 11 through the third connecting groove 12b and the second connecting groove 30b. This can reduce the resistance of current passing through the conductive tape and also improve the stability of the electrical connection between the other conductive components and the conductive tape. The other conductive components mentioned above can be conductive clips, conductive probes, etc.

[0214] The first structure of the conductive tape in this embodiment is shown in Figure 41. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. Specifically, the conductive adhesive layer 12 is provided with a third connecting groove 12b. The third connecting groove 12b extends through the conductive adhesive layer 12, such that a portion of the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area on the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is located adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that part of the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b, forming a second exposed portion; the second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed, forming a first exposed portion.

[0215] The second structure of the conductive tape in this embodiment is shown in Figure 42. This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 is provided with a third connecting groove 12b. The third connecting groove 12b extends through the conductive adhesive layer 12, such that the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area on the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is located adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 partially covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating in the covered area of ​​the conductive base layer 11. A first connecting groove 20b is provided on the first protective layer 20 (the first shielding layer 21 and the first connecting adhesive layer 22). The first connecting groove 20b penetrates the first protective layer 20, so that a portion of the upper surface of the conductive base layer 11 is exposed through the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that part of the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed to form a first exposed portion; the exposed area on the upper surface of the conductive base layer 11 and the exposed area on the lower surface of the conductive base layer 11 form the second exposed portion and the third exposed portion, respectively.

[0216] The third structure of the conductive tape in this embodiment is shown in Figure 43. This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 is provided with a third connecting groove 12b. The third connecting groove 12b extends through the conductive adhesive layer 12, such that the lower surface of the conductive coating layer 13 is exposed through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area on the lower surface of the conductive coating layer 13 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is located adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that part of the lower surface of the conductive coating 13 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0217] The fourth structure of the conductive tape in this embodiment is shown in FIG44 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering a portion of the lower surface of the conductive coating layer 13. A third connecting groove 12b is provided in the conductive adhesive layer 12. The third connecting groove 12b extends through the conductive adhesive layer 12, exposing the lower surface of the conductive coating layer 13 through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area on the lower surface of the conductive coating layer 13 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is located adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 partially covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating in the covered area of ​​the conductive base layer 11. A first connecting groove 20b is provided on the first protective layer 20 (the first shielding layer 21 and the first connecting adhesive layer 22). The first connecting groove 20b penetrates the first protective layer 20, exposing the upper surface of the conductive base layer 11 through the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that part of the lower surface of the conductive coating 13 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0218] The fifth structure of the conductive tape in this embodiment is shown in Figure 45 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. A third connecting groove 12b is provided in the conductive adhesive layer 12. The third connecting groove 12b extends through the conductive adhesive layer 12, such that a portion of the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area on the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is located adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33. The second protective layer 30 (second insulating coating 33) is provided with a second connecting groove 30b. The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that the lower surface of the conductive base layer 11 is exposed between the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0219] The sixth structure of the conductive tape in this embodiment is shown in Figure 46 . This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive base layer 11. A third connecting groove 12b is provided in the conductive adhesive layer 12. The third connecting groove 12b extends through the conductive adhesive layer 12, such that a portion of the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area on the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is located adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, which partially covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating in the covered area of ​​the conductive base layer 11. A first connecting groove 20b is provided on the first protective layer 20 (first insulating coating 23). The first connecting groove 20b penetrates the first protective layer 20, so that a portion of the upper surface of the conductive base layer 11 is exposed through the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second insulating coating 33. A second connecting groove 30b is provided on the second protective layer 30 (second insulating coating 33). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0220] Example 9

[0221] As shown in FIG. 47 to FIG. 50 , the conductive tape includes a conductive functional layer 10 , a first protective layer 20 is provided on the upper surface of the conductive functional layer 10 , and a second protective layer 30 is provided on the lower surface of the conductive functional layer 10 .

[0222] In some conductive tapes, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes the conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or does not cover the lower surface of the other end of the conductive base layer 11.

[0223] In other conductive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0224] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the conductive functional layer 10 in the middle is covered, while the lower surface of the conductive functional layer 10 at both ends is exposed and uncovered. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. The exposed lower surface area of ​​at least one end of the conductive functional layer 10 is the lower surface of the conductive adhesive layer 12. The exposed lower surface of the conductive adhesive layer 12 is provided with a release sheet 60 to reduce the adhesion of the conductive adhesive layer 12 and the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0225] The first structure of the conductive tape in this embodiment is shown in Figures 47 and 48. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from corrosion or electroplating. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the conductive adhesive layer 12 in the middle is covered, while the lower surface of the conductive adhesive layer 12 at both ends is exposed and uncovered. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. A release sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The release sheet 60 reduces the adhesion of the conductive adhesive layer 12 and reduces the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0226] The second structure of the conductive tape in this embodiment is shown in FIG49 . The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive base layer 11, covering the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 via the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 via the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the conductive adhesive layer 12 in the middle is covered, while the lower surface of the conductive adhesive layer 12 at both ends is exposed and uncovered. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. A release sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The release sheet 60 reduces the adhesion of the conductive adhesive layer 12 and reduces the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0227] The third structure of the conductive tape in this embodiment is shown in Figure 50. This conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive base layer 11 to prevent corrosion or electroplating on the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the conductive adhesive layer 12 at both ends. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. A release sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The release sheet 60 can reduce the adhesion of the conductive adhesive layer 12 and the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0228] Example 10

[0229] The conductive tape shown in Figures 51 to 56 includes a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10.

[0230] The conductive functional layer 10 includes a conductive material layer and a conductive adhesive layer 12. In this embodiment, the conductive adhesive layer 12 is provided on the upper surface and the lower surface of the conductive material layer. For the convenience of description, it is defined as follows: the conductive adhesive layer 12 provided on the upper surface and the lower surface of the conductive material layer are respectively referred to as the first conductive adhesive layer and the second conductive adhesive layer.

[0231] In some conductive tapes, the conductive material layer is composed of a conductive base layer 11, and a conductive adhesive layer 12 is provided on the upper surface and the lower surface of the conductive base layer 11. The first conductive adhesive layer covers all or part of the upper surface of the conductive base layer 11, and the second conductive adhesive layer covers all or part of the lower surface of the conductive base layer 11. For example, the first conductive adhesive layer only covers the upper surface of one end of the conductive base layer 11, and the second conductive adhesive layer only covers the lower surface of the corresponding end of the conductive base layer 11.

[0232] In other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further disposed between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 enhances the conductivity of the conductive functional layer 10, meaning that the conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. Above the conductive base layer 11, the conductive coating 13 covers all or part of the upper surface of the conductive base layer 11. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating 13, and the first conductive adhesive layer covers all or part of the upper surface of the conductive coating 13. Below the conductive base layer 11, the conductive coating 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating 13, and the second conductive adhesive layer covers all or part of the lower surface of the conductive coating 13.

[0233] The first protective layer 20 does not completely cover the upper surface of the conductive functional layer 10. The upper surface of the conductive functional layer 10 in the middle is covered, and the upper surfaces of the conductive functional layer 10 at both ends are exposed and uncovered. The covered area of ​​the upper surface of the conductive functional layer 10 can be protected from corrosion or electroplating, and the exposed area of ​​the upper surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the conductive functional layer 10 in the middle is covered, and the lower surfaces of the conductive functional layer 10 at both ends are exposed and uncovered. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components.

[0234] In specific applications, the first and second conductive adhesive layers of a single conductive tape can each be bonded to a single solar cell. This means that the single conductive tape can be bonded to two solar cells simultaneously, allowing for simultaneous electroplating of both cells. This reduces the amount of conductive tape used as a consumable and reduces the cost of electroplating the solar cells. Preferably, the solar cells are single-sided electroplated solar cells, such as IBC solar cells.

[0235] The first structure of the conductive tape in this embodiment is shown in Figure 51. The conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive adhesive layer 12 is disposed on both the upper and lower surfaces of the conductive base layer 11. The first conductive adhesive layer covers the entire upper surface of the conductive base layer 11, and the second conductive adhesive layer covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 does not completely cover the upper surface of the first conductive adhesive layer. The middle portion of the upper surface of the first conductive adhesive layer is covered, and the upper surfaces of the two ends of the first conductive adhesive layer are exposed and uncovered. The covered area of ​​the upper surface of the first conductive adhesive layer can be protected from corrosion or electroplating, and the exposed area of ​​the upper surface of the first conductive adhesive layer can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the second conductive adhesive layer through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the second conductive adhesive layer. The middle portion of the lower surface of the second conductive adhesive layer is covered, and the lower surfaces of the two ends of the second conductive adhesive layer are exposed and uncovered. The covered area of ​​the lower surface of the second conductive adhesive layer can be protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the second conductive adhesive layer can be used for conductive connection with other conductive components.

[0236] The second structure of the conductive tape in this embodiment is shown in FIG52 . This structure differs from the first structure in that the first conductive adhesive layer covers a portion of the upper surface of the conductive base layer 11. Specifically, the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, leaving the upper surface of the right end of the conductive base layer 11 exposed, while the second conductive adhesive layer covers the entire lower surface of the conductive base layer 11. Although not shown, the conductive tape in this embodiment may also have a structure in which the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, leaving the upper surface of the right end of the conductive base layer 11 exposed, and the second conductive adhesive layer covers the lower surface of the left end of the conductive base layer 11, leaving the lower surface of the right end of the conductive base layer 11 exposed.

[0237] The third structure of the conductive tape in this embodiment is shown in Figure 53. The main differences from the first structure of the conductive tape in this embodiment are: to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is provided between the conductive base layer 11 and the conductive adhesive layer 12. This conductive coating 13 enhances the conductivity of the conductive functional layer 10. Above the conductive base layer 11, the conductive coating 13 covers the entire upper surface of the conductive base layer 11. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating 13, and the first conductive adhesive layer covers the entire upper surface of the conductive coating 13. Below the conductive base layer 11, the conductive coating 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating 13, and the second conductive adhesive layer covers the entire lower surface of the conductive coating 13.

[0238] The fourth structure of the conductive tape in this embodiment is shown in Figure 54. The difference from the second structure of the conductive tape in this embodiment is that a conductive coating 13 is also provided between the conductive base layer 11 and the conductive adhesive layer 12, and the conductive coating 13 improves the conductive performance of the conductive functional layer 10.

[0239] The fifth structure of the conductive tape in this embodiment is shown in FIG. 55 . It differs from the first structure of the conductive tape in this embodiment in that: the first protective layer 20 includes a first insulating coating 23, which is connected to the upper surface of the conductive base layer 11. The first insulating coating 23 does not completely cover the upper surface of the first conductive layer; the middle portion of the upper surface of the first conductive layer is covered, while the upper surfaces of the ends of the first conductive layer are exposed. The covered area of ​​the upper surface of the first conductive layer is protected from corrosion or electroplating, and the exposed area of ​​the upper surface of the first conductive layer can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33, which is connected to the lower surface of the second conductive layer. The second insulating coating 33 does not completely cover the lower surface of the second conductive layer; the middle portion of the lower surface of the second conductive layer is covered, while the lower surfaces of the ends of the second conductive layer are exposed. The covered area of ​​the lower surface of the second conductive layer is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the second conductive layer can be used for conductive connection to other conductive components.

[0240] The sixth structure of the conductive tape in this embodiment is shown in FIG56 . This structure differs from the fifth structure in that the first conductive adhesive layer covers a portion of the upper surface of the conductive base layer 11. Specifically, the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, leaving the upper surface of the right end of the conductive base layer 11 exposed, while the second conductive adhesive layer covers the entire lower surface of the conductive base layer 11. Although not shown, the conductive tape in this embodiment may also have a structure in which the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, leaving the upper surface of the right end of the conductive base layer 11 exposed, and the second conductive adhesive layer covers the lower surface of the left end of the conductive base layer 11, leaving the lower surface of the right end of the conductive base layer 11 exposed.

[0241] Example 11

[0242] As shown in Figures 57-63, the conductive tape has a cylindrical structure, comprising a conductive functional layer 10 located at the center of the cylinder and a third protective layer 70 surrounding the conductive functional layer 10. The third protective layer 70 covers only the middle section of the conductive functional layer 10, leaving the ends of the conductive functional layer 10 exposed. The third protective layer 70 protects the middle section of the conductive functional layer 10 from corrosion, while the exposed areas at the ends of the conductive functional layer 10 can be used for conductive connection to other conductive components. The conductive functional layer 10 comprises a conductive base layer 11 located at the center of the cylinder and a conductive adhesive layer 12 surrounding the conductive base layer 11. To enhance conductivity, a conductive coating layer 13 is disposed between the conductive base layer 11 and the conductive adhesive layer 12. The conductive material layer can be formed by the conductive base layer 11 alone, or by the conductive base layer 11 and the conductive coating layer 13 together.

[0243] The first structure of the conductive tape in this embodiment is shown in Figures 57 and 58. The third protective layer 70 specifically includes a third shielding layer 71 and a third connecting adhesive layer 72. The third shielding layer 71 is bonded and coated around the outer periphery of the conductive functional layer 10 via the third connecting adhesive layer 72. The conductive functional layer 10 includes a conductive base layer 11 located at the center of the cylinder and a conductive adhesive layer 12 coated around the outer periphery of the conductive base layer 11. As shown in Figure 59, as a modified structure, the exposed ends of the conductive functional layer 10 are flat, making it easier for the conductive adhesive layer 12 to be attached to other conductive components.

[0244] The second structure of the conductive tape in this embodiment is shown in Figures 60 and 61. This differs from the first structure of the conductive tape in this embodiment primarily in that a conductive coating 13 is provided between the conductive base layer 11 and the conductive adhesive layer 12 to enhance the conductivity of the conductive functional layer 10. The conductive coating 13 enhances the conductivity of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 located at the center of a cylinder, a conductive coating 13 surrounding the conductive base layer 11, and a conductive adhesive layer 12 surrounding the conductive coating 13.

[0245] The third structure of the conductive tape in this embodiment is shown in Figures 62-63. The difference from the first structure of the conductive tape in this embodiment is that the third protective layer 70 specifically includes a third insulating coating 73, and the third insulating coating 73 is bonded and coated on the periphery of the electrical functional layer 10.

[0246] In other embodiments, the conductive tape may be shaped like a prism, including a conductive functional layer 10 located at the center of the prism and a third protective layer 70 surrounding the conductive functional layer 10. Alternatively, the conductive tape may have a prism-shaped middle section and flat ends. For example, the conductive tape may be shaped like a triangular prism, including a conductive functional layer 10 located at the center of the triangular prism and a third protective layer 70 surrounding the conductive functional layer 10.

[0247] Example 12

[0248] The conductive tape shown in Figures 64-66 includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes a conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11.

[0249] The first protective layer 20 and / or the second protective layer 30 can refer to or reference the structures in the aforementioned embodiments 1-9. The conductive functional layer 10 has at least two exposed portions, one of which is used to bond the first conductive component as the first exposed portion, and the other is used to bond or connect the second conductive component as the second exposed portion. In a specific application embodiment, the conductive tape is used as a conductive connector for electroplating of solar cells. The first conductive component can be a seed layer or TCO layer on the solar cell, and the second conductive component can be a conductive clip or a conductive bracket.

[0250] As shown in Figure 64, the first exposed portion is the lower surface of the left end of the conductive functional layer 10, specifically the lower surface of the left end of the conductive adhesive layer 12, and the second exposed portion is the lower surface of the right end of the conductive functional layer 10, specifically the lower surface of the right end of the conductive adhesive layer 12.

[0251] As shown in Figure 65, the first exposed portion is the lower surface of the left end of the conductive functional layer 10, specifically the lower surface of the left end of the conductive adhesive layer 12, and the second exposed portion is the upper surface of the right end of the conductive functional layer 10, specifically the upper surface of the right end of the conductive base layer 11.

[0252] As shown in Figure 66, the first exposed portion is the glue exposure groove 30a connected to the lower surface of the conductive functional layer 10, specifically the glue exposure groove 30a connected to the lower surface of the conductive adhesive layer 12, and the second exposed portion is the lower surface of the right end of the conductive functional layer 10, specifically the lower surface of the right end of the conductive adhesive layer 12.

[0253] Assuming that the dimension of the first exposed portion extending along the length direction of the conductive tape is a, that is, the length of the first exposed portion is a, the dimension of the second exposed portion extending along the length direction of the conductive tape is b, that is, the length of the second exposed portion is b, and the length of the conductive tape is L, then it satisfies that 0.01L≤a<0.5L, 0.01L≤b<0.5L, 0.02L≤a+b<L; preferably, 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, 0.1L≤a+b≤0.6L. The values ​​of a and b should be moderate; if they are too large, the conductive functional layer 10 will be overly exposed, and the first protective layer 20 and / or the second protective layer 30 will not be able to provide good protection. In addition, the area of ​​the first exposed portion is too large, making it too firmly bonded to the first conductive component, and it is easy to leave residual glue on the first conductive component; if they are too small, it is easy to cause poor contact. In addition, the area of ​​the first exposed portion is too small, making it loosely bonded to the first conductive component, which in turn causes the conductive tape to easily fall off the first conductive component.

[0254] Example 13

[0255] Based on the aforementioned embodiments 1-10, the conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The material of the conductive base layer 11 includes, but is not limited to, one of gold, silver, platinum, copper, aluminum, nickel, and stainless steel, or an alloy material composed of any two or more thereof, or a multilayer structure formed by stacking multiple of gold, silver, platinum, copper, aluminum, nickel, and stainless steel in the thickness direction.

[0256] The conductive adhesive layer 12 is a conductive pressure-sensitive adhesive layer, a conductive heat-sensitive adhesive layer, or a non-woven conductive adhesive layer. The conductive adhesive layer 12 includes a matrix and a conductive filler. The matrix includes an adhesive, a curing agent, and a diluent, and may also include additives such as a plasticizer, a coupling agent, and a defoaming agent. The adhesive may be an epoxy resin, a phenolic resin, a polyimide, an acrylic resin, or a polyurethane. The conductive filler may be carbon, a metal, or a metal oxide, preferably a single metal powder or a mixture of multiple metal powders with low resistivity such as Au, Ag, Cu, and Ni. For example, the material composition of the conductive adhesive layer 12 includes a pressure-sensitive adhesive acrylic resin and a plasticizer, wherein the plasticizer may be di-n-octyl phthalate or di-n-butyl phthalate, which can improve the removability of the conductive adhesive layer 12 and reduce or avoid the risk of leaving residual adhesive when the conductive adhesive layer 12 is peeled off from the adhered object. The conductive adhesive layer 12 may only include an adhesive and a conductive filler, for example, the conductive adhesive layer 12 includes an acrylic resin and Ni powder.

[0257] The conductive functional layer 10 further includes a conductive coating 13 . The conductive coating 13 may be a carbon-coated layer. For example, the conductive functional layer 10 may be a carbon-coated copper foil or a carbon-coated aluminum foil.

[0258] The first shielding layer 21 can be an insulating film layer or a hydrophobic film layer, the second shielding layer 31 can be an insulating film layer or a hydrophobic film layer, and the third shielding layer 71 can be an insulating film layer or a hydrophobic film layer. The first shielding layer 21, the second shielding layer 31, and the third shielding layer 71 can all be made of polyethylene terephthalate (PET), polyethylene (PE), or polypropylene (PP). The first connecting adhesive layer 22, the second connecting adhesive layer 32, and the third connecting adhesive layer 72 can all be made of silicone.

[0259] Example 14

[0260] Based on the aforementioned embodiments 1-11, as shown in Figures 67-71, this embodiment provides a conductive tape assembly, which includes a conductive tape 1 and a base film 50. The conductive tape 1 is bonded to the base film 50 to facilitate storage and transportation of the conductive tape 1. For example, the conductive tape 1 is bonded to the base film 50, and the conductive tape assembly is rolled up to form a roll, which facilitates storage and transportation of the conductive tape 1. When in use, the conductive tape 1 can be torn off the base film 50. As shown in Figure 67, the conductive functional layer 10 of the conductive tape 1 is bonded to the base film 50. Specifically, the conductive functional layer 10 includes a conductive adhesive layer 12, which is bonded to the base film 50. As shown in Figure 68, the second protective layer 30 of the conductive tape 1 is bonded to the base film 50. Specifically, the second protective layer 30 may not have an adhesion function. A third connecting adhesive layer 51 is provided on the base film 50, and the second protective layer 30 is bonded to the base film 50 through the third connecting adhesive layer 51.

[0261] The arrangement structure of the conductive tape 1 on the base film 50 can adopt the structure shown in Figures 69 and 71. As shown in Figure 69, the length extension direction of the conductive tape 1 is the same as the length extension direction of the base film 50. The conductive tape 1 is arranged on the base film 50 in a rectangular array, with multiple conductive tapes 1 arranged along the length direction of the base film 50 and multiple conductive tapes 1 arranged along the width direction of the base film 50. As shown in Figure 70, the length extension direction of the conductive tape 1 is the same as the width extension direction of the base film 50. The conductive tape 1 is arranged on the base film 50 in a linear array, with multiple conductive tapes 1 spaced apart along the length direction of the base film 50. As shown in Figure 71, the conductive tapes 1 are divided into two groups along the width direction of the base film 50. Each group of conductive tapes 1 is arranged obliquely on the base film 50 and spaced apart along the length direction of the base film 50. Each group of conductive tapes 1 forms a linear array.

[0262] Example 15

[0263] This embodiment provides a solar cell 2 having a conductive tape 1 bonded thereto. The conductive tape 1 may refer to or incorporate the structure of the aforementioned embodiments 1-11. When metal grid lines are electroplated on the solar cell 2, the conductive tape 1 is used to connect the solar cell 2 to the negative electrode of the electroplating power source.

[0264] Specifically, the conductive tape 1 includes a conductive functional layer 10 and a surface protective layer (for example, a first protective layer 20 and / or a second protective layer 30). The conductive functional layer 10 is covered by the surface protective layer and at least two parts are exposed on the conductive functional layer 10, one of which is used to bond to the area to be electroplated on the solar cell 2, referred to as the first exposed part, and the other is used to bond or connect the second conductive component, referred to as the second exposed part. The second conductive component is electrically connected to the negative pole of the electroplating power supply through a wire. The second conductive component can be a conductive clip or a conductive bracket. The second exposed part can be bonded to the conductive clip or the conductive bracket, or the second exposed part can be clamped by the conductive clip.

[0265] Specifically, as shown in Figures 72 and 73, the area to be electroplated on the solar cell 2 includes the conductive area at the edge of the solar cell 2, which is called the conductive connecting portion 2a. There is one or more conductive connecting portions 2a. As shown in Figure 72, conductive connecting portions 2a are provided on both sides of the solar cell 2, and multiple conductive connecting portions 2a are provided on each side of the solar cell 2. One end of the conductive tape 1 is bonded to the conductive connecting portion 2a, that is, the first exposed portion of the conductive tape 1 is connected to the conductive connecting portion 2a. A conductive tape 1 is bonded to each conductive connecting portion 2a. As shown in Figure 72, the conductive tape 1 bonded to the solar cell 2 remains straight. In order to facilitate the connection of the second exposed portion of the conductive tape 1 to the second conductive component, the conductive tape 1 bonded to the solar cell 2 can be bent. As shown in Figure 73, the conductive tape 1 bonded to the solar cell 2 is in a bent state.

[0266] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the essence of the present invention should be included in the scope of protection of the present invention.

Claims

1. A conductive tape, characterized in that: It includes a conductive functional layer, which includes a conductive material layer and a conductive adhesive layer. The conductive adhesive layer covers all or part of the outer surface of the conductive material layer. The conductive tape also includes a surface protection layer, which does not completely cover the outer surface of the conductive functional layer.

2. The conductive tape according to claim 1, characterized in that: The surface protection layer includes a shielding layer and a connecting adhesive layer, and the shielding layer is connected to the outer surface of the conductive functional layer through the connecting adhesive layer; or, the surface protection layer includes an insulating coating, and the insulating coating is connected to the outer surface of the conductive functional layer.

3. The conductive tape according to claim 1, characterized in that: The conductive functional layer has at least a first exposed portion and a second exposed portion, a partial area of ​​the conductive adhesive layer is exposed from the first exposed portion, and a partial area of ​​the conductive material layer or another partial area of ​​the conductive adhesive layer is exposed from the second exposed portion, wherein the first exposed portion and the second exposed portion are located at different positions in the length direction of the conductive tape.

4. The conductive tape according to claim 3, characterized in that: The conductive tape is a layered structure, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive material layer, the conductive adhesive layer covers all or part of the lower surface of the conductive material layer, the outer surface of the conductive functional layer includes the upper surface and the lower surface of the conductive functional layer, wherein the first exposed portion is located on the lower surface of the conductive functional layer, and the second exposed portion is located on the upper surface or the lower surface of the conductive functional layer.

5. The conductive tape according to claim 4, characterized in that: The conductive material layer includes a conductive base layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive base layer, and the conductive adhesive layer covers the entire or partial area on the lower surface of the conductive base layer; Alternatively, the conductive material layer includes a conductive base layer and a conductive coating, the conductive coating is coated on the lower surface of the conductive base layer, and the conductive coating covers all or part of the lower surface of the conductive base layer; the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive coating, and the conductive adhesive layer covers all or part of the lower surface of the conductive coating.

6. The conductive tape according to claim 4, characterized in that: The surface protection layer comprises a first protection layer, the first protection layer is arranged on the upper surface of the conductive functional layer, and the first protection layer covers the whole or part of the upper surface of the conductive functional layer; And / or, the surface protection layer includes a second protection layer, the second protection layer is arranged on the lower surface of the conductive functional layer, and the second protection layer does not completely cover the lower surface of the conductive adhesive layer.

7. The conductive tape according to claim 6, characterized in that: The conductive tape includes the first protective layer, and the first protective layer completely covers the upper surface of the conductive functional layer.

8. The conductive tape according to claim 7, characterized in that: The conductive tape further comprises the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered.

9. The conductive tape according to claim 8, characterized in that: The conductive adhesive layer covers the lower surface of one or both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer covers the lower surface of the middle part of the conductive material layer and part of the lower surface of the conductive adhesive layer adjacent thereto.

10. The conductive tape according to claim 8, characterized in that: The conductive adhesive layer covers the lower surfaces at both ends of the conductive material layer and exposes the lower surface in the middle of the conductive material layer. The second protective layer is suspended below the lower surface in the middle of the conductive material layer to form a hollow area between the conductive functional layer and the second protective layer. The second protective layer covers a partial area on the lower surface of the conductive adhesive layer close to the hollow area.

11. The conductive tape according to claim 7, characterized in that: The conductive tape also includes the second protective layer, which covers the lower surface of the middle part of the conductive functional layer and exposes the lower surfaces of both ends of the conductive functional layer. A conductive covering layer is arranged on the lower surface of one end of the conductive functional layer.

12. The conductive tape according to claim 7, characterized in that: The conductive tape also includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered; a glue dew groove is also provided on the second protective layer, and the glue dew groove passes through the second protective layer, so that part of the lower surface of the conductive functional layer is exposed from the glue dew groove.

13. The conductive tape according to claim 6, characterized in that: The conductive tape comprises the first protective layer and the second protective layer, wherein the first protective layer covers the upper surface of one end of the conductive functional layer, and the upper surface of the other end of the conductive functional layer is exposed and not covered; the second protective layer covers the lower surface of the other end of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered, The exposed area on the lower surface of the conductive functional layer forms the first exposed portion, and the exposed area on the upper surface of the conductive functional layer forms the second exposed portion. The first exposed portion and the second exposed portion are arranged at two different ends in the length direction of the conductive tape.

14. The conductive tape according to claim 6, characterized in that: The conductive tape includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered, wherein the conductive base layer is a material layer of surface passivated metal.

15. The conductive tape according to claim 6, characterized in that: The conductive tape comprises the first protective layer and the second protective layer, the first protective layer covers the upper surface of one end of the conductive functional layer, and the upper surface of the other end of the conductive functional layer is exposed and not covered, forming the second exposed portion; The second protective layer is provided with a glue dew groove, the glue dew groove penetrates the second protective layer, so that a part of the lower surface of the conductive functional layer is exposed from the glue dew groove to form the first exposed portion; The first exposed portion and the second exposed portion are spaced apart from each other in the length direction of the conductive tape.

16. The conductive tape according to claim 6, characterized in that: In the conductive functional layer, the conductive adhesive layer covers a partial area on the lower surface of the conductive material layer, and a third connecting groove is provided on the conductive adhesive layer, and the third connecting groove penetrates the conductive adhesive layer, so that a part of the lower surface of the conductive material layer is exposed from the third connecting groove; the conductive tape includes the first protective layer and the second protective layer, wherein, The first protective layer completely covers the upper surface of the conductive functional layer, or a first connecting groove is provided on the first protective layer, the first connecting groove penetrates the first protective layer, so that a portion of the upper surface of the conductive material layer is exposed from the first connecting groove, and the first connecting groove is provided directly above the third connecting groove; A second connecting groove is provided on the second protective layer, and the second connecting groove passes through the second protective layer. The second connecting groove is provided directly below the third connecting groove, so that the lower surface of the conductive material layer is exposed from the third connecting groove and the second connecting groove, and the second protective layer does not cover the end of the conductive functional layer away from the second connecting groove, so that the conductive functional layer at this end is exposed.

17. The conductive tape according to claim 3, characterized in that: A partial area of ​​the conductive adhesive layer is exposed from the first exposed portion, and another partial area of ​​the conductive adhesive layer is exposed from the second exposed portion, wherein a release sheet is provided on the lower surface of the conductive adhesive layer exposed from the second exposed portion.

18. The conductive tape according to claim 3, characterized in that: The conductive tape is a layered structure, the conductive functional layer has two groups of conductive adhesive layers, the two groups of conductive adhesive layers are respectively called a first conductive adhesive layer and a second conductive adhesive layer, the lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive material layer, and the first conductive adhesive layer covers the entire or partial area on the upper surface of the conductive material layer; the upper surface of the first conductive adhesive layer forms the upper surface of the conductive functional layer; The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive material layer, and the second conductive adhesive layer covers the entire or partial area on the lower surface of the conductive material layer; the lower surface of the second conductive adhesive layer is formed as the lower surface of the conductive functional layer, The surface protection layer includes a first protection layer, the first protection layer is arranged on the upper surface of the conductive functional layer, and the first protection layer does not completely cover the upper surface of the first conductive adhesive layer; And / or, the surface protection layer includes a second protection layer, the second protection layer is arranged on the lower surface of the conductive functional layer, and the second protection layer does not completely cover the lower surface of the second conductive adhesive layer.

19. The conductive tape according to claim 3, characterized in that: The length of the first exposed portion is a, the length of the second exposed portion is b, and the length of the conductive tape is L, wherein 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L.

20. The conductive tape according to claim 3, characterized in that: The first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer; Alternatively, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer; Alternatively, the first exposed portion is a glue-exposing groove connected to the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from one end of the glue-exposing groove.

21. The conductive tape according to claim 3, characterized in that: The first exposed portion is a partial area of ​​the lower surface of the conductive functional layer, and the second exposed portion is another partial area of ​​the lower surface of the conductive functional layer; the conductive tape further has a third exposed portion, a partial area of ​​the upper surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly above the second exposed portion; Alternatively, the first exposed portion is a partial area of ​​the lower surface of the conductive functional layer, and the second exposed portion is a partial area of ​​the upper surface of the conductive functional layer; the conductive functional layer also has a third exposed portion, another partial area of ​​the lower surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly below the second exposed portion.

22. The conductive tape according to claim 1, characterized in that The conductive tape is cylindrical or prismatic, the conductive adhesive layer is coated on the periphery of the conductive material layer, the surface protection layer is a third protective layer coated on the periphery of the conductive functional layer, and the third protective layer only coats the middle section of the conductive functional layer and exposes both ends of the conductive functional layer.

23. The conductive tape according to any one of claims 1 to 22, characterized in that: The conductive adhesive layer includes an adhesive and a conductive filler, the adhesive includes epoxy resin, phenolic resin, polyimide, acrylic resin or polyurethane, and the conductive filler includes carbon, metal or metal oxide, wherein the metal includes at least Au, Ag, Cu or Ni.

24. The conductive tape according to claim 23, characterized in that: The conductive adhesive layer further comprises one or more of a curing agent, a diluent, a plasticizer, a coupling agent and a defoaming agent; wherein the plasticizer at least comprises di-n-octyl phthalate or di-n-butyl phthalate.

25. A conductive tape assembly, characterized in that: The invention comprises the conductive tape according to any one of claims 1 to 24 and a base film, wherein the conductive tape is bonded to the base film.

26. A solar cell, characterized in that: The conductive tape according to any one of claims 1 to 24 is adhered to the solar cell.

Images