Camera module and electronic device

Abstract

The present application discloses a camera module and an electronic device. The camera module comprises a lens, a blocking piece, a lens mount, a photosensitive assembly, and a circuit board, wherein the photosensitive assembly is mounted and electrically connected to the circuit board; the blocking piece is mounted on the lens mount; the lens is mounted on the first end of the lens mount; the second end of the lens mount comprises a first portion and a second portion that are distributed in a circumferential direction and connected to each other; the first portion is supported on the surface of the side of the circuit board where the photosensitive assembly is located, and the first portion is connected to the circuit board in a sealed mode; the second portion is supported on the surface of the photosensitive assembly, and the second portion is connected to the photosensitive assembly in a sealed mode. The photosensitive assembly of the camera module can be mounted in the camera module in a sealed mode, and the size of the whole camera module is relatively small.

Description

Camera modules and electronic equipment Technical Field

[0001] The present application relates to the technical field of photographing equipment, and in particular to a camera module and electronic equipment. Background Art

[0002] With the continuous advancement of technology, more and more devices are equipped with camera modules to enable photography. Camera modules typically include a lens assembly, a photosensitive component, and a circuit board. To ensure a long service life and good imaging quality, the photosensitive sensor is usually sealed within the lens assembly and circuit board.

[0003] In current camera modules, the lens module's lens mount is typically positioned around the outside of the photosensitive sensor, and the lens mount is supported on a circuit board. This seal between the lens mount and the circuit board ensures that the photosensitive sensor is sealed within the camera module. However, this type of camera module is relatively large, which does not conform to the current trend toward smaller camera modules. Summary of the Invention

[0004] This application discloses a camera module and electronic equipment, which adopt the following technical solutions:

[0005] In the first aspect, the present application discloses a camera module, which includes a lens, a baffle, a lens mount, a photosensitive component and a circuit board, wherein the photosensitive component is installed and electrically connected to the circuit board, the baffle is installed on the lens mount, the lens is installed on the first end of the lens mount, and the second end of the lens mount includes a first part and a second part distributed along the circumferential direction and connected to each other, the first part of the second end of the lens mount is supported on a side surface of the circuit board where the photosensitive component is located, and is sealed to the circuit board, and the second part of the second end of the lens mount is supported on the surface of the photosensitive component and is sealed to the photosensitive component.

[0006] In a second aspect, an embodiment of the present application discloses an electronic device comprising the above-mentioned camera module.

[0007] The technical solution adopted in this application can achieve the following beneficial effects:

[0008] The embodiment of the present application discloses a camera module, wherein a photosensitive component is installed and electrically connected to a circuit board, a lens is installed at the first end of a lens mount, and a baffle is installed at the lens mount to control the light entering the camera module. In the second end of the lens mount, the first part thereof is supported on the side surface of the circuit board where the photosensitive component is located, so that the entire lens mount can form a more reliable assembly relationship with the circuit board, and ensure that the lens mount has the ability to form an electrical connection with the circuit board; and, in the second end of the lens mount, the second part distributed along the circumferential direction with the first part is supported on the surface of the photosensitive component, so that the circuit board does not need to reserve a mounting position for the second part of the lens mount that is directly supported on the photosensitive component, which allows the size of the circuit board in the direction perpendicular to its own thickness to be reduced accordingly; accordingly, the second part of the second end of the lens mount can be directly supported on the surface of the photosensitive component. Due to the influence of this situation, the size of the entire lens mount in the direction perpendicular to the thickness direction of the circuit board can also be reduced to a certain extent, thereby making the overall size of the camera module disclosed in the embodiment of the present application relatively small; at the same time, in the camera module disclosed in the embodiment of the present application, a sealed connection relationship is formed between the first part of the second end of the lens mount and the circuit board, and between the second part of the second end of the lens mount and the photosensitive component, thereby ensuring that the photosensitive component can be sealed within the camera module, preventing external impurities such as dust and water vapor from entering the camera module and adversely affecting the normal imaging process of the photosensitive component. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0010] 1-4 are schematic cross-sectional views of camera modules of different structural forms disclosed in the embodiments of the present application cut by a first plane.

[0011] 5-6 are schematic cross-sectional views of camera modules of different structural forms disclosed in the embodiments of the present application cut by a second plane.

[0012] FIG7 is a schematic cross-sectional view of a camera module of another structural form disclosed in an embodiment of the present application, which is cut by a first plane.

[0013] 8 and 9 are schematic cross-sectional views of camera modules of other structural forms disclosed in the embodiments of the present application, cut by a second plane.

[0014] Explanation of reference numerals: 100 - lens, 200 - lens mount, 210 - shutter motor, 220 - shutter, 300 - photosensitive component, 310 - photosensitive sensor, 320 - infrared window, 400 - circuit board, 500 - bonding wire, 600 - sealant, 610 - protective glue, 700 - support column. DETAILED DESCRIPTION

[0015] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0016] The technical solutions disclosed in various embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0017] The present invention discloses a camera module that can be used alone or in an electronic device, such as a mobile phone, tablet computer, or automobile, without limitation. As shown in Figures 1-9 , the camera module disclosed in the present invention includes a lens 100, a lens mount 200, a barrier 220, a photosensitive component 300, and a circuit board 400.

[0018] The lens 100 and the lens mount 200 are connected to each other, and the two can form a lens assembly. The number of lenses 100 can be one or more, and the lens 100 is mounted on the first end of the lens mount 200. Accordingly, the first end of the lens mount 200 is the light incident side of the lens mount 200, that is, the light incident side of the entire camera module. External light can pass through the lens 100 and be distributed by the lens 100. The types of lenses 100 can include convex lenses and concave lenses, etc. Of course, when there are multiple lenses 100, the multiple lenses 100 can include convex lenses and concave lenses, etc., and the multiple lenses 100 can form a lens group, which is mounted as a whole on the first end of the lens mount 200.

[0019] The lens mount 200 may include a hard shell such as plastic or metal to provide installation and protection for the lens 100. In addition, the lens mount 200 may also be provided with structures such as a baffle 220 and a baffle motor 210. That is, the lens mount 200 may also serve as an installation structure for the baffle 220. The baffle 220 is specifically installed between the first end and the second end of the lens mount 200, so that the structural changes of the baffle 220 can be controlled by the baffle motor 210 to achieve the purpose of blocking and avoiding the light incident side of the photosensitive component 300.

[0020] The photosensitive component 300 is installed and electrically connected to the circuit board 400, so that when the circuit board 400 is powered on, the circuit board 400 can supply power to the photosensitive component 300; of course, the photosensitive component 300 can also transmit information and control commands through the circuit board 400, so that the imaging information of the photosensitive component 300 can be transmitted to other devices such as the processor of the electronic device via the circuit board 400, and accordingly, the processor can also transmit control commands to the photosensitive component 300 through the circuit board 400.

[0021] As described above, the lens 100 is mounted on the first end of the lens mount 200. Based on this, the second end of the lens mount 200 can specifically include a first portion and a second portion. The lens mount 200 can generally be a closed annular structure. To this end, the first portion and the second portion are distributed along the circumference of the lens 100 and are interconnected. Of course, parameters such as the angles spanned by the first and second portions along the circumference of the lens 100 can be flexibly selected based on actual conditions. For example, if the second end of the lens mount 200 can be a circular closed annular structure, then both the first portion and the second portion can be arc-shaped structures. If the shape of the second end of the lens mount 200 is different, the shapes of the first and second portions will also be different.

[0022] The first portion of the second end of the lens mount 200 is supported on a side surface of the circuit board 400 where the photosensitive component 300 is located, and the first portion is sealed to the circuit board 400. In layman's terms, taking the side surface of the circuit board 400 where the photosensitive component 300 is located as the front side, the first portion of the second end of the lens mount 200 can be supported on the front side of the circuit board 400. Specifically, the first portion of the second end of the lens mount 200 and the circuit board 400 can be fixedly connected via screws. In another embodiment of the present application, the lens mount 200 and the circuit board 400 can also be fixedly connected via adhesive. Based on this embodiment of the present application, on the one hand, the lens mount 200 can form a relatively stable fixed connection with the circuit board 400, improving the installation stability of the lens mount 200. On the other hand, the lens mount 200 provides a foundation for establishing an electrical connection with the circuit board 400. Therefore, when components such as the shutter motor 210 are provided on the lens mount 200, the shutter motor 210 can be electrically connected to the circuit board 400 via the first portion of the second end of the lens mount 200 mounted on the circuit board 400.

[0023] 1 , the second portion of the second end of the lens mount 200 is supported on the surface of the photosensitive component 300, and the second portion is sealed to the photosensitive component 300. That is, in the camera module disclosed in the embodiment of the present application, the second end of the lens mount 200 is not directly mounted on the circuit board 400 as a whole, but the second portion is directly mounted on the photosensitive component 300.

[0024] As described above, the first part of the second end of the lens mount 200 is connected to the circuit board 400, and the second part of the second end of the lens mount 200 is installed on the photosensitive component 300. This makes it unnecessary to reserve installation space on the circuit board 400 for the second part of the second end of the lens mount 200 connected to the photosensitive component 300, thereby making it possible to omit the structure of the second part of the second end of the lens mount 200 on the circuit board 400 that was originally used to support the second part, thereby achieving the purpose of reducing the size of the circuit board 400 in a direction perpendicular to its own thickness direction. This also enables the second part of the second end of the lens mount 200 connected to the photosensitive component 300 to shrink along a direction perpendicular to the thickness direction of the circuit board 400 toward the position of the central axis of the camera module, thereby reducing the size of the lens mount 200 in a direction perpendicular to the thickness direction of the circuit board 400 to a certain extent, thereby making the size of the entire camera module relatively small.

[0025] Specifically, the lens mount 200 and the photosensitive component 300 can also form a fixed connection relationship by bonding or the like. In another embodiment of the present application, in order to prevent the photosensitive component 300 from being damaged, when a relatively stable fixed connection relationship is formed between the lens mount 200 and the circuit board 400, a fixed connection relationship can no longer be directly formed between the lens mount 200 and the photosensitive component 300.

[0026] As described above, in the camera module disclosed in the embodiment of the present application, the photosensitive component 300 may include a photosensitive sensor 310, and a sealed connection relationship is formed between the first portion of the second end of the lens mount 200 and the circuit board 400, and between the second portion of the second end of the lens mount 200 and the photosensitive sensor 310, so that the photosensitive component 300 can still be sealed within the entire camera module, preventing impurities such as dust or water vapor outside the camera module from entering the camera module and adversely affecting the imaging quality and service life of the photosensitive component 300. Specifically, a flexible sealing strip or the like can be provided on the end surfaces of the first portion and the second portion of the second end of the lens mount 200, so that after the lens mount 200 is assembled with the circuit board 400 and the photosensitive component 300, the second end of the lens mount 200 can form a relatively reliable sealed connection relationship with the circuit board 400 and the photosensitive sensor 310, respectively, so as to seal the photosensitive sensor 310 within the camera module.

[0027] The embodiment of the present application discloses a camera module, wherein the photosensitive component 300 is installed and electrically connected to the circuit board 400, the lens 100 is installed at the first end of the lens mount 200, and the baffle 220 is installed between the first end and the second end of the lens mount 200 to control the light entering the camera module. In the second end of the lens mount 200, the first part thereof is supported on the side surface of the circuit board 400 where the photosensitive component 300 is located, so that the entire lens mount 200 can form a more reliable assembly relationship with the circuit board 400, and ensure that the lens mount 200 has the ability to form an electrical connection with the circuit board 400; and, in the second end of the lens mount 200, the second part distributed along the circumferential direction together with the first part is supported on the surface of the photosensitive component 300, so that the circuit board 400 does not need to reserve an installation position for the second part of the lens mount 200 that is directly supported on the photosensitive component 300, which allows the size of the circuit board 400 in the direction perpendicular to its own thickness to be reduced accordingly; accordingly, the second part of the second end of the lens mount 200 can be directly Due to the fact that the lens holder 200 is supported on the surface of the photosensitive component 300, the size of the entire lens holder 200 in the direction perpendicular to the thickness direction of the circuit board 400 can be reduced to a certain extent, thereby making the overall size of the camera module disclosed in the embodiment of the present application relatively small; at the same time, in the camera module disclosed in the embodiment of the present application, a sealed connection relationship is formed between the first part of the second end of the lens holder 200 and the circuit board 400, and between the second part of the second end of the lens holder 200 and the photosensitive component 300, thereby ensuring that the photosensitive component 300 can be sealed within the camera module to prevent external impurities such as dust and water vapor from entering the camera module and adversely affecting the normal imaging process of the photosensitive component 300.

[0028] In order to further improve the sealing effect of the photosensitive component 300, in an embodiment of the present application, the camera module may further include a sealant 600, and the first part of the second end of the lens mount 200 and the circuit board 400, as well as the second part of the second end of the lens mount 200 and the photosensitive component 300 can be sealed and connected through the sealant 600 to further improve the sealing effect of the photosensitive component 300.

[0029] Specifically, after the lens holder 200 in the camera module is assembled with the circuit board 400 and the photosensitive component 300, a sealant 600 may be applied or sprayed on the outer edge of the second end of the lens holder 200 to provide a sealing effect for the lens holder 200 after the sealant 600 is cured. In another embodiment of the present application, while the sealant 600 is used to provide a sealing effect, the sealant 600 may also be used to provide an adhesive fixing effect. Specifically, the second end of the lens holder 200 may be adhesively fixed with the circuit board 400 and the photosensitive sensor 310 through the sealant 600. In this case, screws or other connectors may no longer be provided between the lens holder 200 and the circuit board 400, thereby eliminating the assembly step of the lens holder 200 in the camera module, further reducing the difficulty of installing the camera module, and improving processing efficiency.

[0030] In the camera module disclosed in the embodiment of the present application, the photosensitive component 300 may specifically include a photosensitive sensor 310 and an infrared window 320. The photosensitive sensor 310 generally includes a photosensitive array and a signal conversion unit, etc., so that the photosensitive sensor 310 can convert the optical signal into an electrical signal. The infrared window 320 is used to transmit infrared light. It can be specifically formed of metal germanium, commonly known as a germanium window, to ensure that the photosensitive sensor 310 can convert the infrared light into a corresponding electrical signal to form a corresponding infrared image, so that the camera module disclosed in the embodiment of the present application can capture infrared images. Based on the aforementioned structure of the photosensitive component 300, during the assembly of the camera module, it is necessary to form an electrical connection between the photosensitive sensor 310 and the circuit board 400 to ensure that the photosensitive component 300 can work normally.

[0031] In addition, in order to reduce the difficulty of packaging between the infrared window 320 and the photosensitive sensor 310, in the camera module disclosed in the embodiment of the present application, at least a portion of the edge of the photosensitive sensor 310 can be extended to the outside of the edge of the infrared window 320. In layman's terms, the edge of the photosensitive sensor 310 extends beyond the edge of the infrared window 320.

[0032] As described above, the second portion of the second end of the lens mount 200 is supported on the surface of the photosensitive assembly 300. Based on the above-described structure of the photosensitive assembly 300, optionally, as shown in FIG1 , at least a portion of the second portion of the second end of the lens mount 200 can be extended outside the infrared window 320, and this portion can be supported and sealed against the surface of the photosensitive sensor 310 on the side where the infrared window 320 is located. That is, in this embodiment of the present application, at least a portion of the second portion of the second end of the lens mount 200 can be supported on the side of the photosensitive sensor 310 facing away from the circuit board 400. In this case, the portion of the photosensitive sensor 310 extending outside the infrared window 320 can be effectively utilized. Of course, in actual applications, the entire second portion of the second end of the lens mount 200 can be supported on the side of the photosensitive sensor 310 facing away from the circuit board 400.

[0033] When the above technical solution is adopted, in a plane perpendicular to the optical axis direction of the lens 100, the projection of the photosensitive array of the photosensitive sensor 310 and the projection of the infrared window 320 can overlap with each other, so that the effective utilization rate of the infrared window 320 and the photosensitive array are relatively high, and the size of the infrared window 320 can be made relatively small.

[0034] In order to further reduce the size of the second end of the lens holder 200 in the direction perpendicular to the thickness of the circuit board 400, based on the above embodiments, as shown in Figures 4 and 7, a part of the second part of the second end of the lens holder 200 can be supported and sealed on the side surface of the infrared window 320 facing away from the photosensitive sensor 310, that is, a part of the second part of the second end of the lens holder 200 can be supported on the side surface of the photosensitive sensor 310 facing away from the circuit board 400, and another part of the second part of the second end of the lens holder 200 can also be supported on the side surface of the infrared window 320 facing away from the circuit board 400, which can further reduce the size of the circuit board 400 and the entire camera module in the direction perpendicular to the thickness of the circuit board 400.

[0035] Based on the above embodiments of the present application, as shown in Figures 1 to 4, the camera module may further include a bonding wire 500, and the light sensor 310 may be electrically connected to the circuit board 400 via the bonding wire 500. This connection method is relatively convenient and relatively low in cost. To ensure that the bonding wire 500 has a good electrical connection effect and makes the size of the bonding wire 500 relatively small, the bonding wire 500 may be formed of metal, wherein the metal may include gold.

[0036] Accordingly, in order to make the reliability of the bonding wire 500 relatively high, the camera module disclosed in the embodiment of the present application may further include a protective glue 610, and the bonding wire 500 is wrapped with the protective glue 610, so as to utilize the protective glue 610 to provide protection for the bonding wire 500, thereby preventing the bonding wire 500 from being broken due to factors such as vibration during the operation of the camera module, thereby causing failure of the camera module.

[0037] It should be noted that, as described in the above embodiment of the present application, a sealant 600 may be provided outside the lens mount 200 to further enhance the reliability of the sealed connection between the second end of the lens mount 200 and the photosensitive assembly 300 and the circuit board 400. In this case, the sealant 600 may include the aforementioned protective adhesive 610. That is, after the circuit board 400 and the photosensitive sensor 310 are connected using the bonding wires 500, the protective adhesive 610 may be provided outside the bonding wires 500, and the protective adhesive 610 may be used to bond the second end of the lens mount 200, thereby utilizing the protective adhesive 610 to provide both bonding and sealing functions for the lens mount 200.

[0038] As described above, a portion of the second part of the second end of the lens holder 200 can be located on a side surface of the infrared window 320 facing away from the photosensitive sensor 310. When the photosensitive sensor 310 and the circuit board 400 are connected via a bonding wire 500, the bonding wire 500 itself is located outside the photosensitive sensor 310 and the infrared window 320 in a direction perpendicular to the optical axis of the lens 100. In order to protect the bonding wire 500, the periphery of the bonding wire 500 is usually wrapped with a protective glue 610, so that the corresponding position in the circuit board 400 can extend outside the photosensitive sensor 310 in a direction perpendicular to its own thickness direction to provide support for the protective glue 610.

[0039] In this case, in order to further effectively utilize the space on the circuit board 400, based on the above technical solution in which a portion of the second portion of the second end of the lens holder 200 is located on the surface of the infrared window 320 facing away from the light sensor 310, as described above, a portion of the second portion of the second end of the lens holder 200 can also be supported on the surface of the light sensor 310 facing away from the circuit board 400, and this portion is located outside the infrared window 320. Based on this, in this embodiment of the present application, at least the portion of the second portion of the second end of the lens holder 200 located outside the infrared window 320 can be spaced apart from the light sensor 310, and this portion can be supported on the protective glue 610 outside the bonding wire 500.

[0040] In the embodiment of the present application, as shown in Figures 1 and 2, a portion of the second portion of the second end of the lens mount 200 that cooperates with the photosensitive component 300 is still arranged outside the infrared window 320, thereby effectively utilizing the space at the corresponding position in the circuit board 400, increasing the space inside the lens mount 200, or increasing the size of the lens mount 200, thereby increasing the installation space in the camera module. Accordingly, when the second end of the lens mount 200 is located on the side of the photosensitive sensor 310 facing away from the circuit board 400, the lens mount 200 can be prevented from squeezing the bonding wire 500, thereby improving the reliability and service life of the bonding wire 500.

[0041] Of course, as mentioned above, in order to protect the bonding wire 500, a protective glue 610 can be wrapped around the periphery of the bonding wire 500. For this reason, in an embodiment of the present application, in order to ensure that the camera module still has the ability to seal the photosensitive sensor 310, a portion of the protective glue 610 can be clamped between the second end of the lens holder 200 and the bonding wire 500.

[0042] Specifically, the sealant 600 sandwiched between the second end of the lens mount 200 and the bonding wire 500 can all be protective glue 610. In another embodiment of the present application, considering factors such as the processing steps, the sealant 600 can also include adhesive glue (not shown in the figure), and adhesive glue can be further connected between the protective glue 610 and the second end of the lens mount 200. That is, during the processing of the camera module, the photosensitive component 300 and the circuit board 400 can be assembled first, and the photosensitive sensor 310 and the circuit board 400 can be electrically connected via the bonding wire 500. Thereafter, the protective glue 610 can be wrapped around the bonding wire 500 to provide protection for the bonding wire 500. After that, the lens mount 200 can be assembled, and the lens mount 200 and the protective glue 610 can be bonded together using adhesive glue to ensure that the lens mount 200 and the photosensitive sensor 310 can be reliably and securely connected.

[0043] In the above embodiment, the protective glue 610 can be used to provide protection for the bonding wire 500. Although the protective glue 610 has the ability to cure and has a reliable protective effect after curing, during the operation of the camera module, the lens holder 200 may be affected by external force and move toward the circuit board 400. During this process, the second end of the lens holder 200 may squeeze the protective glue 610, which may cause the bonding wire 500 located in the protective glue 610 to be squeezed and broken, causing the camera module to malfunction.

[0044] Based on the above situation, in order to further improve the protection effect of the bonding wire 500, in another embodiment of the present application, as shown in Figures 1 and 2, the camera module may also include a support column 700, and the first end of the support column 700 is supported on the photosensitive sensor 310, and the second end of the support column 700 extends to the side of the bonding wire 500 away from the photosensitive sensor 310 and the circuit board 400, so that the support column 700 "exceeds" the height of the bonding wire 500, and the second end of the support column 700 is supported on the second end of the lens holder 200, so that even if the lens holder 200 is squeezed by external force and moves toward the direction close to the circuit board 400, the support column 700 can be used to provide support for the bonding wire 500 to prevent the protective glue 610 from being deformed by being directly squeezed by the lens holder 200, resulting in the bonding wire 500 being broken.

[0045] More specifically, in order to improve assembly accuracy, taking into account factors such as tolerances of components, optionally, a protective glue 610 is provided between the second end of the support column 700 and the second end of the lens mount 200, that is, a relatively small assembly gap can also be reserved between the support column 700 and the second end of the lens mount 200, and in the process of assembling the camera module, the protective glue 610 is used to fill the aforementioned gap, so as to ensure that the camera module can provide a sealed space for the photosensitive sensor 310 while also allowing a certain assembly tolerance between the lens mount 200 and the support column 700, and when the camera module is subjected to external force, the protective glue 610 can also provide a buffering effect between the lens mount 200 and the support column 700, preventing external force from directly acting on the photosensitive sensor 310 and the circuit board 400 through the lens mount 200 and the support column 700, causing damage to the photosensitive sensor 310 and the circuit board 400.

[0046] Of course, in order to maximize the prevention of the lens holder 200 from being squeezed by external force and moving in the direction of the circuit board 400, which may cause damage to the photosensitive component 300, as shown in Figure 4, a support column 700 can be provided between the second end of the lens holder 200 and the photosensitive sensor 310. The number of support columns 700 can be multiple, and the multiple support columns 700 are distributed at intervals along the circumference of the lens 100. In this case, regardless of whether the above-mentioned bonding wire 500 is provided in the camera module and whether the second end of the lens holder 200 is located above the bonding wire 500, it can be ensured that the lens holder 200 can form a relatively stable assembly relationship with the photosensitive sensor 310 in the thickness direction of the circuit board 400, thereby preventing damage to the photosensitive sensor 310 and the infrared window 320.

[0047] As described above, at least a portion of the second portion of the second end of the lens mount 200 can be supported on the side of the light sensor 310 facing away from the circuit board 400, thereby effectively utilizing the portion of the light sensor 310 that extends outside the infrared window 320. In another embodiment of the present application, in order to minimize the overall size of the camera module, as shown in FIG3 , the second portion of the second end of the lens mount 200 can be supported and sealedly connected to the side of the infrared window 320 facing away from the light sensor 310. That is, in this embodiment of the present application, different portions of the second end of the lens mount 200 are either directly supported on the circuit board 400, supported on the side of the infrared window 320 facing away from the light sensor 310, or supported on the side of the light sensor 310 facing away from the circuit board 400. When the second part of the second end of the lens holder 200 is supported and sealed to the side surface of the infrared window 320 facing away from the photosensitive sensor 310, the size of the portion of the lens holder 200 supported on the infrared window 320 in the direction perpendicular to the optical axis of the lens 100 is relatively smaller, and the size of the second end of the lens holder 200 in the direction perpendicular to the optical axis can be reduced, thereby further reducing the overall size of the camera module.

[0048] Based on the above embodiment, the bonding wire 500 mentioned in the above embodiment can also be used to connect the light sensor 310 and the circuit board 400. Considering that the above embodiment has already provided a detailed description of the installation of the bonding wire 500 and the related protective measures, it will not be repeated here. When the second portion of the second end of the lens holder 200 is supported and sealed to the side of the infrared window 320 facing away from the light sensor 310, and the specific solution of using the bonding wire 500 to connect the light sensor 310 and the circuit board 400 can refer to the corresponding design of the above embodiment.

[0049] Optionally, as shown in Figures 7 to 9, the photosensitive sensor 310 and the circuit board 400 can also be electrically connected through ball grid array (BGA) packaging technology to reduce the difficulty of connecting the photosensitive sensor 310 and the circuit board 400; and, when this technical solution is adopted, the connection reliability between the photosensitive sensor 310 and the circuit board 400 is relatively high. In addition, when the above technical solution is adopted, since the connection structure between the photosensitive sensor 310 and the circuit board 400 is clamped between the photosensitive sensor 310 and the circuit board 400, it can be protected by the photosensitive sensor 310 and the circuit board 400, and there is no need to perform additional protection steps on the electrical connection structure between the photosensitive sensor 310 and the circuit board 400.

[0050] Accordingly, as shown in FIG7 , when BGA packaging technology is used to provide an electrical connection between the light sensor 310 and the circuit board 400, a support column 700 can be provided between the lens mount 200 and the light sensor 310, with the support column 700 supported between the portion of the second end of the lens mount 200 that supports the infrared window 320 and the light sensor 310. Alternatively, one end of the support column 700 can be supported on the light sensor 310, with a relatively small gap provided between the other end of the support column 700 and the portion of the second end of the lens mount 200 that supports the infrared window 320. During assembly of the camera module, protective adhesive 610 can be used to fill the gap between the end of the support column 700 facing away from the light sensor 310 and the second end of the lens mount 200. This allows the protective adhesive 610 to provide both sealing and shock absorption. Similarly, when a portion of the second part of the second end of the lens mount 200 is supported on the photosensor 310 and another portion is supported on the infrared window 320, a support column 700 can also be set between the portion of the second part of the second end of the lens mount 200 that supports the infrared window 320 and the photosensor 310 to prevent the infrared window 320 from being squeezed and damaged by the lens mount 200.

[0051] As described above, the photosensitive sensor 310 may include a photosensitive array. When the second portion of the second end of the lens mount 200 is supported and sealed to the surface of the infrared window 320 facing away from the photosensitive sensor 310, the projection of the photosensitive array can be located within the infrared window in a plane perpendicular to the optical axis of the lens 100, and the photosensitive array can be located within the area surrounded by the inner wall of the second end of the lens mount 200, thereby ensuring that all light that can pass through the infrared window 320 can be received by the photosensitive array and form a corresponding image. As for the portion of the infrared window 320 that provides support for the second end of the lens mount 200, a photosensitive array is no longer provided for it, thereby preventing waste of the photosensitive array, improving the effective utilization efficiency of the photosensitive array, and thereby reducing the cost of the entire camera module.

[0052] In addition, as described above, the second end of the lens mount 200 can be a circular closed ring structure. In another embodiment of the present application, in order to accommodate the photosensitive component 300, which is generally a rectangular structure, the second end of the lens mount 200 is also a rectangular closed ring structure. More specifically, the second end of the lens mount 200 includes a first side, a second side, a third side, and a fourth side connected in sequence. Of course, the fourth side is also connected to the first side. Based on this, in this embodiment of the present application, the first portion can include at least the first side, and the second portion can include at least one of the second, third, and fourth sides. Accordingly, if any of the second, third, and fourth sides is not included in the second portion, then that side is considered the first portion.

[0053] Based on the camera module disclosed in any of the above embodiments, the embodiments of the present application also disclose an electronic device, which includes any of the above camera modules. Of course, the electronic device may also include components such as a housing and a battery. The battery may be installed inside the housing, and the camera module may be installed on the housing, and the camera module is electrically connected to the battery. Of course, the electronic device may also include other components. Considering the simplicity of the text, they will not be introduced in detail here.

[0054] The above embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0055] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A camera module, comprising a lens, a baffle, a lens mount, a photosensitive component and a circuit board, wherein: The photosensitive component is installed and electrically connected to the circuit board, The baffle is mounted on the lens mount, The lens is mounted on the first end of the lens mount. The second end of the lens mount includes a first part and a second part distributed in the circumferential direction and connected to each other. The first part of the second end of the lens mount is supported on a side surface of the circuit board where the photosensitive component is located, and is sealed and connected to the circuit board. The second part of the second end of the lens mount is supported on the surface of the photosensitive component and is sealed and connected to the photosensitive component.

2. According to the camera module of claim 1, the first part of the second end of the lens mount is sealed to the circuit board by a sealant, and the second part of the second end of the lens mount is sealed to the photosensitive component by a sealant.

3. According to the camera module according to claim 1 or 2, the photosensitive component includes a photosensitive sensor and an infrared window, the infrared window is located on the side of the photosensitive sensor away from the circuit board, and at least a portion of the edge of the photosensitive sensor extends to the outside of the edge of the infrared window; at least a portion of the second portion of the second end of the lens mount is located on the outside of the infrared window, supporting and sealingly connected to a side surface of the photosensitive sensor where the infrared window is located.

4. The camera module according to claim 3, wherein a portion of the second portion of the second end of the lens mount supports and is sealed to a side surface of the infrared window facing away from the photosensor.

5. According to the camera module according to claim 3 or 4, the photosensitive sensor includes a photosensitive array, and in a plane perpendicular to the optical axis direction of the lens, the projection of the photosensitive array and the projection of the infrared window overlap with each other.

6. According to the camera module according to claim 1 or 2, the photosensitive component includes a photosensitive sensor and an infrared window, the infrared window is located on the side of the photosensitive sensor away from the circuit board, and the second part of the second end of the lens mount is supported and sealed to the side surface of the infrared window away from the photosensitive sensor.

7. According to the camera module according to claim 6, the photosensitive sensor includes a photosensitive array, and in a plane perpendicular to the optical axis direction of the lens, the projection of the photosensitive array is located within the infrared window and within the area surrounded by the inner wall of the second end of the lens mount.

8. According to any one of claims 3-7, the photosensitive sensor is electrically connected to the circuit board via a ball grid array (BGA) packaging technology.

9. The camera module according to any one of claims 3 to 8, wherein the photosensitive sensor is electrically connected to the circuit board via a bonding wire; The bonding wires are wrapped with protective glue.

10. The camera module according to claim 9, wherein at least a portion of the second portion of the second end of the lens mount located outside the infrared window is spaced apart from the photosensor and supported by the protective glue outside the bonding wire.

11. The camera module according to claim 10, wherein adhesive is further connected between the protective glue and the second end of the lens mount.

12. The camera module according to any one of claims 9 to 11, further comprising a support column, The first end of the support column is supported on the photosensitive sensor. The second end of the support column extends to a side of the bonding wire away from the photosensitive sensor and the circuit board, and the second end of the support column is supported on the second end of the lens mount.

13. The camera module according to any one of claims 9 to 11, further comprising a support column, The supporting column is supported between the portion of the second end of the lens mount that is supported on the infrared window and the photosensor.

14. The camera module according to any one of claims 1 to 13, wherein the second end of the lens mount is a rectangular closed ring structure, and the second end of the lens mount comprises a first side, a second side, a third side and a fourth side connected in sequence, The first portion of the second end of the lens mount includes at least the first side edge, The second portion of the second end of the lens mount includes at least one of the second side, the third side, and the fourth side.

15. An electronic device comprising the camera module according to any one of claims 1 to 14.

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