Bmw grounding device including boss hole and grounding pin

Abstract

The present invention provides a BMU grounding device comprising: a BMU having a boss hole; a fixing pin made of a conductive material and passing through the boss hole; and a case which is positioned on the bottom surface of the BMU and to which the BMU is fixed, wherein: the fixing pin comprises a head and a body; the head is supported on the top surface of the BMU; and the case comprises an insertion portion, into which the fixing pin having passed through the boss hole is inserted, and a brush, which is disposed around the insertion portion, is tightly coupled to the fixing pin, and is made of a conductive material. Accordingly, in the BMU of a battery pack used in a notebook, the present invention can provide stabilization through grounding while insulating the entire battery.

Description

BMU grounding device including a device hole and ground pin

[0001] This application claims the benefit of priority to Korean Patent Application No. 2023-0163579, filed November 22, 2023, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to a BMU (Battery Management Unit) grounding device including a boss hole and a grounding pin. Specifically, the present invention relates to a BMU grounding device including a boss hole for fixing a BMU to the device and a novel grounding pin for grounding the BMU using the boss hole.

[0003] Lithium secondary batteries measure and monitor cell temperature, voltage, and other factors for safety. The PCB designed for this purpose is called a Battery Management Unit (BMU). While IT products like smartphones and laptops are becoming smaller and lighter, the battery modules and packs used in them are also becoming denser and higher-capacity. Due to space constraints on component placement, BMUs are also becoming increasingly dense. Nevertheless, for IT products that are frequently mobile, BMUs must include mounting holes (boss holes) for securing the BMU.

[0004] Fig. 1 is a schematic diagram showing a part of the upper surface of a BMU (100) according to the prior art, and Fig. 2 is a perspective view showing a part of the configuration of a BMU in a battery pack according to the prior art. The xyz shown in Figs. 1 and 2 are applied with the same standard. Referring to Figs. 1 and 2, a BMU (100) is placed in the center of a battery cell (200) equipped with an electrode lead (210), and the BMU (100) is connected to an external current line (140). A device hole (120) for fixing the BMU (100) is also provided.

[0005] Electrostatic discharge (ESD) verification is required for components used in IT devices. BMUs used in battery modules or battery packs also require ESD protection.

[0006] TVS diodes, Zener diodes, and other diodes can be used to prevent product damage due to ESD. However, if there is no ground pattern that can utilize these devices, or if the design avoids these devices even if they are present, problems may arise in which ESD occurs. Typically, bolts and nuts are used to secure the PCB to the mounting holes for noise reduction and grounding.

[0007] Fig. 3 is a cross-sectional view of a bolt / nut grounding connection according to the prior art. The upper drawing of Fig. 3 is a cross-sectional view of the bolt / nut grounding connection, and the lower drawing is a perspective view of the nut used. Referring to Fig. 3, a mounting hole is provided in the PCB of the BMU (100), and a metal nut (130) is inserted into the mounting hole. The nut (130) and the PCB are electrically connected. The nut (130) and the PCB can be additionally fixed by soldering. The nut (130) also contacts the metal case (160). The nut (150) and the BMU (100) are fixed by the bolt (150).

[0008] Recent laptops use very thin battery packs, which invariably include a battery management unit (BMU). BMUs can also be susceptible to ESD issues. To prevent this, grounding can be achieved using a conventional bolt-and-nut method.

[0009] However, in reality, the entire battery pack is insulated for stability in laptops. A resin-molded protrusion is inserted into the BMU's mechanism hole, securing the BMU to the laptop case. If a conventional bolt-and-nut approach were used, the exposed bolts on the top of the BMU could compromise the battery pack's safety.

[0010] Patent document 1 relates to a printed circuit board that reduces noise generation by maintaining a low connection impedance between a printed wiring board and a case, thereby suppressing the generation of a potential difference at the GND level. Patent document 1 provides a printed wiring board having a plurality of screw holes 8 for screw-joining a printed wiring board 3 to a case 3 connected to GND, and through holes 5 for contacting the case 3 around the screw holes of an electrically connected conductor land 11.

[0011] The connection structure of the secondary battery according to patent document 2 is configured to include a fastening portion (262a) or a screw fastening portion (262b) provided in a circuit connection portion (242) of a metal plate (202), and a circuit terminal portion (402a, 402b) located on a PCB substrate (1) of a protection circuit module (300), and has a structure in which the fastening portion (262a) or the screw fastening portion (262b) of the circuit connection portion (242) and the circuit terminal portion (402a, 402b) are electrically connected by a physical connection method that allows for selective connection and separation.

[0012] Patent documents 1 and 2 use a bolt / nut method to connect the ground to the PCB's mechanical hole, so they are difficult to use in the laptop used in the present invention.

[0013] In this way, in the BMU of a battery pack used in a laptop, a technology that can insulate the entire battery while providing stabilization through grounding has not yet been provided.

[0014] (Prior art literature)

[0015] (Patent Document 1) Japanese Patent Application Laid-Open No. 2014-090018

[0016] (Patent Document 2) Korean Patent Publication No. 1245286

[0017] Thus, the purpose of the present invention is to provide a technology that can provide stabilization through grounding while insulating the entire battery in a BMU of a battery pack used in a laptop.

[0018] In order to achieve the above object, the present invention provides a BMU grounding device including a BMU having a mechanism hole, a fixing pin made of a conductive material penetrating the mechanism hole, and a case located on a lower surface of the BMU and to which the BMU is fixed, wherein the fixing pin is composed of a head and a body, the head being supported on an upper surface of the BMU, and the case including an insertion portion into which the fixing pin penetrating the mechanism hole is inserted, and a brush made of a conductive material positioned around the insertion portion and tightly coupled to the fixing pin.

[0019] The above BMU is used in all devices that use secondary batteries as a Battery Management Unit, but the present invention is particularly applicable to IT products such as smartphones and laptops.

[0020] The above fixed pin is electrically connected to the BMU, and specifically, the head of the fixed pin and the BMU are electrically connected. The head is connected to a portion of the circuit of the PCB board of the BMU.

[0021] The outer periphery of the head may be surrounded by a non-conductive material. Specifically, the outer periphery of the head may be provided with a separate rubber cap or coated with a non-conductive material. This can maintain insulation for the battery pack used in the laptop.

[0022] The brush can be tightly coupled to the body of the fixed pin by elastic force. Specifically, the brush may be in the form of a plate spring and tightly coupled to the body of the fixed pin, or may be supported by a coil spring and the portion that comes into contact with the body of the fixed pin may be made of a metal plate. At least one brush must be provided. The brush serves to physically fix the fixed pin as well as to provide electrical contact, and preferably, two or more brushes must be provided.

[0023] The above brush can also come into contact with the grounding portion of the case. The grounding and fixing functions are performed by the fixing pin and the brush. The entire case may be made of a metal material, or only the portion that comes into contact with the brush may be made of a metal material to perform the grounding function.

[0024] The lower part of the body of the above fixed pin may be tapered. This allows for easier insertion of the fixed pin when it penetrates the mechanism hole and is inserted into the insertion portion of the case.

[0025] The above BMU may include a PCB layer and a frame. Battery packs used in laptops, etc. may have a separate label attached to the outermost surface.

[0026] The above frame may be made of a non-conductive material, allowing grounding to be achieved only through the fixed pin and the case, with the remaining parts remaining insulated.

[0027] The present invention can also provide a laptop including the BMU grounding device.

[0028] The present invention can also be provided in a configuration in which the problems to be solved are arbitrarily combined.

[0029] The present invention provides a BMU grounding device including a BMU having a mechanism hole, a fixing pin made of a conductive material penetrating the mechanism hole, and a case positioned on a lower surface of the BMU and to which the BMU is fixed, wherein the fixing pin is composed of a head and a body, and the head is supported on an upper surface of the BMU, and the case includes an insertion portion into which the fixing pin penetrating the mechanism hole is inserted, and a brush made of a conductive material positioned around the insertion portion and closely coupled to the fixing pin. Through this, the present invention can provide stabilization by grounding while insulating the entire battery in a BMU of a battery pack used in a notebook.

[0030] Furthermore, unlike conventional bolt-and-nut methods, the battery pack can be easily secured using pins and brushes while still providing grounding functionality. By reducing the number of components used, this contributes to manufacturing efficiency and weight reduction.

[0031] Fig. 1 is a schematic diagram showing a portion of the upper surface of a BMU according to the prior art.

[0032] Figure 2 is a perspective view showing a part of the configuration of a BMU in a battery pack according to the prior art.

[0033] Figure 3 is a cross-sectional view of a bolt / nut ground connection according to the prior art.

[0034] Figure 4 is a schematic diagram of a BMU grounding device according to the present invention.

[0035] Figure 5 is a schematic diagram of a BMU grounding device according to a first embodiment of the present invention.

[0036] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail, so that those with ordinary skill in the art can easily implement the present invention. However, when describing the operating principles of preferred embodiments of the present invention in detail, if a detailed description of a related known function or configuration is judged to unnecessarily obscure the gist of the present invention, such detailed description will be omitted.

[0037] Additionally, the same drawing reference numerals are used for parts with similar functions and actions throughout the drawings. Throughout the specification, when a part is said to be connected to another part, this includes not only direct connections but also indirect connections with other elements intervening. Furthermore, inclusion of a component does not exclude other components unless specifically stated otherwise, but rather implies the inclusion of additional components.

[0038] Hereinafter, the present invention will be described with reference to the attached drawings. Fig. 4 is a schematic diagram of a BMU grounding device according to the present invention. Referring to Fig. 4, the present invention includes a BMU grounding device including a BMU (500) having a mechanism hole (520), a fixing pin (510) made of a conductive material penetrating the mechanism hole (520), and a case (560) located on the lower surface of the BMU (500) and to which the BMU (500) is fixed, wherein the fixing pin (510) is composed of a head (512) and a body (514), and the head (512) is supported on the upper surface of the BMU (500), and the case (560) includes an insertion portion (564) into which the fixing pin (510) penetrating the mechanism hole (120) is inserted, and a brush (562) made of a conductive material disposed around the insertion portion (564) and tightly coupled to the fixing pin (510).

[0039] The head (512) of the fixed pin (510) and the BMU (500) are electrically connected. Specifically, the head (512) is connected to some circuits of the PCB board of the BMU (500).

[0040] The outer periphery of the head (512) is surrounded by a rubber cap (516) made of a non-conductive material.

[0041] The brush (562) is tightly coupled to the body (514) of the fixed pin (510) by elastic force. The brush (562) serves to physically fix the fixed pin (510) as well as provide electrical contact, and two of them are provided.

[0042] The brush (562) is also in contact with the case (560). The grounding and fixing functions are performed by the fixed pin (510) and the brush (562), and the entire case is made of metal.

[0043] Fig. 5 is a schematic diagram of a BMU grounding device according to a first embodiment of the present invention. Fig. 5 is a more detailed implementation of the schematic diagram of Fig. 4, and redundant descriptions are omitted.

[0044] The BMU (500) is composed of a label (502), a BMU cover (504), a PCB (506), a frame (508), and a label (502) from the top. The label (502) corresponds to a type of adhesive paper that is adhered to the outermost surface. The frame (508) is made of a non-conductive material. Through this, grounding can be achieved only through the fixing pin (510) and the case (560), and the remaining parts can be maintained in an insulated state.

[0045] The brush (562A) is supported by a coil spring (563), and the part that comes into contact with the body (514) of the fixed pin (510) is made of a metal plate (565). At least two brushes (562A) are provided. The brushes (562A) are also fixed to and in contact with the metal case (560).

[0046] The brush (562A) of Fig. 5 is composed of a metal plate (565) and a coil spring (563), but this can be changed to a plate spring form. Any material that is conductive and elastic can be used as the brush of the present invention.

[0047] Although not shown in the drawing, the lower portion of the body of the fixed pin may be tapered. This may allow for easier insertion of the fixed pin when it passes through the mechanism hole and is inserted into the insertion portion of the case.

[0048] As described above, specific parts of the present invention have been described in detail. To a person having ordinary skill in the art, such specific descriptions are merely preferred embodiments, and the scope of the present invention is not limited thereby. It is obvious to a person skilled in the art that various changes and modifications are possible within the scope and technical idea of ​​the present invention, and it is natural that such changes and modifications fall within the scope of the appended patent claims.

[0049] (Explanation of symbols)

[0050] 100, 500: BMU

[0051] 120, 520: Instrument Hall

[0052] 130: Nut

[0053] 140: External current line

[0054] 150: Volt

[0055] 160, 560: Metal case

[0056] 200: Battery cell

[0057] 210: Electrode lead

[0058] 502: Label

[0059] 504: BMU Cover

[0060] 506: PCB

[0061] 508: Frame

[0062] 510: Fixed pin

[0063] 512: Head

[0064] 514: Torso

[0065] 516: Rubber cap

[0066] 562, 562A: Brush

[0067] 563: Coil spring

[0068] 565: Metal plate

[0069] 564: Insert

Claims

1. BMU with equipment hall; A fixed pin made of a conductive material penetrating the above-mentioned device hole; A case located on the lower surface of the above BMU and to which the above BMU is fixed; In a BMU grounding device including: The above fixed pin is composed of a head and a body, and the head is supported on the upper surface of the BMU, The above case is, An insertion portion into which a fixing pin penetrating the above-mentioned mechanism hole is inserted; A brush made of a conductive material arranged around the insertion portion and closely coupled to the fixing pin; BMU grounding device including.

2. In paragraph 1, The above fixed pin is a BMU grounding device electrically connected to the BMU.

3. In paragraph 2, A BMU grounding device in which the head of the above fixed pin and the BMU are electrically connected.

4. In paragraph 1, A BMU grounding device whose outer periphery of the above head is surrounded by a non-conductive material.

5. In paragraph 1, The above brush is a BMU grounding device that is tightly connected to the body of the above fixed pin by elastic force.

6. In paragraph 5, A BMU grounding device in which the lower part of the body of the above fixed pin has a tapered shape.

7. In paragraph 1, The above brush is a BMU grounding device that comes into contact with the grounding portion of the case.

8. In paragraph 1, The above BMU is a BMU grounding device including a PCB layer and a frame.

9. In paragraph 8, The above frame layer is a BMU grounding device made of non-conductive material.

10. A notebook computer including a BMU grounding device according to any one of claims 1 to 9.

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