Optical module

Abstract

The present application discloses an optical module. The optical module comprises a light source assembly and an optical amplification assembly, the optical amplification assembly is optically connected to the light source assembly, and the optical amplification assembly is used for performing optical amplification on an optical signal outputted by the light source assembly, so that the optical module has high output power. Moreover, in the present application, a main circuit board, the light source assembly, and the optical amplification assembly are stacked, that is, by reasonably arranging the light source assembly and the optical amplification assembly, the size of the optical module can meet the requirements of an MSA and can also accommodate an added optical amplification assembly, so that the optical module can have high output power.

Description

An optical module

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 29, 2023, with application number 202311611626.1 and invention name “A Type of Optical Module”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of optical communication equipment, and in particular to an optical module. Background Art

[0003] Optical modules are optical communication devices that perform optical-to-electrical and electrical-to-optical conversion. In recent years, the global cloud computing data center market has continued to expand, and the rollout of 5G telecommunications networks has accelerated demand for high-speed optical modules. We have launched a variety of product series and types, providing optimal optical module solutions for customers in cloud computing data centers, relayless transmission, and other fields.

[0004] Currently, the output power of coherent optical modules is low due to limitations in silicon photonics technology. To address this, coherent optical modules can be integrated with optical amplifiers to increase output power. However, protocols such as multi-source agreements (MSAs) have strict requirements on the size of coherent optical modules, making it difficult to integrate optical amplifiers in current coherent optical modules while meeting these protocol requirements. Summary of the Invention

[0005] The present application provides an optical module, which adds an optical amplification component inside the optical module to increase the power of the optical signal output by the optical module while meeting the size requirements of the protocol.

[0006] The present application provides an optical module, comprising: a housing having an accommodating cavity therein; a main circuit board accommodated in the accommodating cavity; a light source assembly accommodated in the accommodating cavity and electrically connected to the main circuit board; and an optical amplifier assembly accommodated in the accommodating cavity and electrically connected to the main circuit board, wherein the optical amplifier assembly is optically connected to the light source assembly and is used to amplify an optical signal output by the light source assembly; wherein the main circuit board, the light source assembly, and the optical amplifier assembly are arranged in a stacked manner.

[0007] In one embodiment of the present application, an optical amplifier assembly includes a pump source device, a wavelength division multiplexer, an amplifying optical fiber, and an isolator; one end of the amplifying optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator; the wavelength division multiplexer is used to couple the optical signal output by the light source assembly and the pump light output by the pump source device into the amplifying optical fiber; wherein the pump source device and the amplifying optical fiber are arranged on one side of the main circuit board, and the wavelength division multiplexer and the isolator are arranged on the other side of the main circuit board.

[0008] In one embodiment of the present application, the main circuit board and the light source assembly are arranged opposite to each other, the pump source device and the amplifying optical fiber are arranged on the side of the main circuit board away from the light source assembly, and the wavelength division multiplexer and the isolator are arranged between the main circuit board and the light source assembly.

[0009] In one embodiment of the present application, the optical amplification component further includes: an adjustable optical attenuator optically connected to the isolator; and an optical monitoring detector optically connected to the adjustable optical attenuator; wherein the adjustable optical attenuator, the optical monitoring detector, the wavelength division multiplexer, and the isolator are located on the same side of the main circuit board and arranged side by side.

[0010] In one embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplifier component are stacked on each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction. The wavelength division multiplexer and the isolator are located on one side of the adjustable optical attenuator in the second direction, and the wavelength division multiplexer is closer to the adjustable optical attenuator than the isolator. The optical monitoring detector is located on the other side of the adjustable optical attenuator in the second direction.

[0011] In one embodiment of the present application, the optical amplification assembly further includes: a connecting optical fiber optically connected to the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator, and the optical monitoring detector, and the connecting optical fiber and the wavelength division multiplexer, the isolator, the adjustable optical attenuator, and the optical monitoring detector are located on the same side of the main circuit board; wherein the connecting optical fiber includes a first fiber coil portion, a second fiber coil portion, a third fiber coil portion, and a fourth fiber coil portion connected in sequence; the first fiber coil portion and the third fiber coil portion are respectively located on either side of the adjustable optical attenuator in the second direction, and the first fiber coil portion is close to the isolator, and the third fiber coil portion is close to the optical monitoring detector; the second fiber coil portion and the fourth fiber coil portion are respectively located on either side of the adjustable optical attenuator in the third direction.

[0012] In one embodiment of the present application, the amplifying optical fiber disk is disposed on the periphery of the pump source device.

[0013] In one embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs, the light source component and the optical amplification component are stacked on each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction; wherein the pump source device is inclined relative to the second direction and the third direction.

[0014] In one embodiment of the present application, the opposite ends of the shell respectively have an optical interface and an electrical interface, the optical interface is used to optically connect to the optical fiber outside the optical module, and one end of the main circuit board is electrically connected to the device outside the optical module through the electrical interface; wherein, the light source assembly and the optical amplification assembly are both arranged close to the optical interface.

[0015] In one embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are mutually perpendicular to each other. The light source assembly and the optical amplifier assembly are stacked on top of each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction. The housing is divided into a first shell portion and a second shell portion along the third direction. The end of the second shell portion is provided with an electrical interface for mating with an interface of an external device. The end of the first shell portion is provided with an optical interface. The first shell portion is provided with a heat sink on the outside of the first cover. The accommodating cavity is divided into a first sub-cavity and a second sub-cavity that are interconnected along the third direction. The first sub-cavity is located in the first shell portion, and the second sub-cavity is located in the second shell portion. The maximum length of the first sub-cavity in the first direction is greater than the maximum length of the second sub-cavity in the first direction. The light source assembly and the optical amplifier assembly are accommodated in the first sub-cavity. The light source assembly is close to one side of the first cover, which facilitates heat dissipation of the light source assembly from the first cover and its heat sink.

[0016] In one embodiment of the present application, a groove is formed on an inner wall of the first shell portion in the first direction, and the groove is recessed in the first direction away from the first sub-cavity.

[0017] In one embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other. The light source assembly and the optical amplification assembly are stacked on each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction. The length of the shell in the third direction is 96.5 mm to 106.5 mm.

[0018] In one embodiment of the present application, the optical module also includes: a pull ring, including a force-applying portion and at least two sliding arms, the force-applying portion is connected to the shell through each sliding arm, and the force-applying portion and the shell are spaced apart from each other in a third direction, and the pull ring is driven to move by applying force to the force-applying portion from the outside to release the lock between the optical module and the external light cage; wherein, the length of the force-applying portion in the third direction is 3 mm to 6 mm.

[0019] Correspondingly, the present application also provides an optical module, comprising: a shell having a accommodating cavity inside; a main circuit board accommodated in the accommodating cavity; a light source assembly accommodated in the accommodating cavity and electrically connected to the main circuit board; and an optical amplifier assembly accommodated in the accommodating cavity and electrically connected to the main circuit board, and the optical amplifier assembly is optically connected to the light source assembly, and the optical amplifier assembly is used to amplify the optical signal output by the light source assembly; wherein the optical amplifier assembly includes a pump source device, a wavelength division multiplexer, an isolator and an amplifying optical fiber, one end of the amplifying optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator, the wavelength division multiplexer is used to couple the optical signal output by the light source assembly and the pump light output by the pump source device into the amplifying optical fiber; the pump source device, the wavelength division multiplexer, the isolator and the amplifying optical fiber are respectively arranged on opposite sides of the main circuit board.

[0020] The beneficial effects of the present application are as follows: Unlike the prior art, the present application provides an optical module. The optical module includes a light source assembly and an optical amplifier assembly, which are optically connected to the light source assembly and are used to optically amplify the optical signal output by the light source assembly, thereby enabling the optical module to have a high output power. Furthermore, the present application utilizes a stacked arrangement of the main circuit board, light source assembly, and optical amplifier assembly. Specifically, by rationally arranging the light source assembly and optical amplifier assembly, the size of the optical module can meet the MSA protocol requirements while accommodating the additional optical amplifier assembly, thereby achieving a high output power of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] FIG1 is a schematic side view of a coherent optical module according to the prior art;

[0023] FIG2 is a schematic structural diagram of an embodiment of an optical module of the present application;

[0024] FIG3 is a schematic cross-sectional view of the optical module shown in FIG2 ;

[0025] FIG4 is a schematic diagram of a first embodiment of a partial structure of the optical module shown in FIG2 ;

[0026] FIG5 is a schematic diagram of a second embodiment of a partial structure of the optical module shown in FIG2 ;

[0027] FIG6 is a schematic diagram of an optical amplification component according to an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 10 Optical module; 11 Housing; 111 Accommodating cavity; 1111 First sub-cavity; 1112 Second sub-cavity; 112 First shell; 113 Second shell; 114 First cover; 115 Second cover; 116 Optical interface; 117 Electrical interface; 118 Groove; 12 Main circuit board; 13 Pull ring; 131 Force-applying portion; 132 Slider; 14 Heat sink; 15 Silicon photonic chip; 20 Light source assembly; 30 Optical amplifier assembly; 31 Pump source device; 33 Wavelength division multiplexer; 34 Isolator; 35 Variable optical attenuator; 36 Optical monitoring detector; 37 Connecting optical fiber; 371 First fiber coiling section; 372 Second fiber coiling section; 373 Third fiber coiling section; 374 Fourth fiber coiling section; 38 Amplifying optical fiber. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "up", "down", "left", and "right", generally refer to the up, down, left, and right of the device in actual use or working state, specifically the drawing direction in the accompanying drawings.

[0031] In this application, unless otherwise specified or limited, terms such as "connected," "connected," and "stacked" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0032] The present application provides an optical module, which is described in detail below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments of the present application. In addition, in the following embodiments, the description of each embodiment has its own emphasis. For parts not described in detail in one embodiment, please refer to the relevant description of other embodiments.

[0033] Coherent optical modules packaged in the Quad Small Form Factor Pluggable-Double Density (QSFP-DD) format utilize a silicon photonics modulation scheme, and their output power is limited by silicon photonics technology. For 100G transmission, the output power of traditional coherent optical modules can only reach approximately -6.5dBm. For 400G transmission, the output power of traditional coherent optical modules can only reach approximately -9dBm. Furthermore, to maintain an output power between -6.5dBm and -9dBm, traditional coherent optical modules sacrifice a certain degree of OSNR (Optical Signal Noise Ratio) performance. These factors limit the application of traditional coherent optical modules in point-to-point transmission scenarios without relays.

[0034] Coherent optical modules can increase output power by integrating erbium-doped fiber amplifiers (EDFAs), achieving output powers of up to +5dBm. In IP-over-DWDM and point-to-point transmission scenarios, coherent optical modules with integrated EDFAs can optimize network architectures and reduce deployment costs. Furthermore, coherent optical modules with integrated EDFAs are compatible with emerging ROADM (Reconfigurable Optical Add-Drop Multiplexer) line systems, playing a significant role in metropolitan and regional ROADM networks.

[0035] However, the length and width dimensions of a traditional EDFA package are 35mm*20mm. The MSA protocol specifies a length and width of 127.86mm*18.35mm for a QSFP-DD coherent optical module. This means the EDFA is wider than the coherent optical module, making it impossible to package the EDFA in a QSFP-DD coherent optical module or a smaller coherent optical module. Furthermore, the four dimensions (A1, A2, A3, and A4) of the coherent optical module shown in Figure 1, as well as the total length of the optical module including the pull ring, must meet the MSA protocol requirements. Therefore, how to package the EDFA in a coherent optical module while ensuring that the coherent optical module's dimensions meet the MSA protocol requirements is an urgent issue.

[0036] In view of this, the present invention provides an optical module that not only has a high output power but also has a size that meets the protocol requirements. Detailed description is provided below.

[0037] Please refer to FIG. 2 and FIG. 3 . FIG. 2 is a schematic structural diagram of an embodiment of an optical module of the present application, and FIG. 3 is a schematic cross-sectional structural diagram of the optical module shown in FIG. 2 .

[0038] In one embodiment, the optical module 10 includes a housing 11, which serves as the base carrier of the optical module 10 and is used to encapsulate and protect the remaining components of the optical module 10. Specifically, the housing 11 defines a chamber 111 within the housing for accommodating the remaining components of the optical module 10. The housing 11 further includes a first cover 114 and a second cover 115. The optical module 10 has a first direction (indicated by arrow Z in FIG. 3 , and similarly hereinafter), a second direction (indicated by arrow X in FIG. 2 , and similarly hereinafter), and a third direction (indicated by arrow Y in FIG. 2 and FIG. 3 , and similarly hereinafter). The first cover 114 and the second cover 115 overlap along the first direction to form the chamber 111, i.e., the chamber 111 is located between the first cover 114 and the second cover 115. The length of the optical module 10 in the second direction is shorter than the length of the optical module 10 in the third direction. The first direction is the height of the optical module 10, the second direction is the width of the optical module 10, and the third direction is the length of the optical module 10.

[0039] The optical module 10 also includes a light source assembly 20, a main circuit board 12, and an optical amplifier assembly 30. The light source assembly 20, the main circuit board 12, and the optical amplifier assembly 30 are all housed in the housing 111. The optical amplifier assembly 30 is optically connected to the light source assembly 20, and both the light source assembly 20 and the optical amplifier assembly 30 are electrically connected to the main circuit board 12. The optical amplifier assembly 30 is used to optically amplify the optical signal output by the light source assembly 20, thereby enabling the optical module 10 of this embodiment to have a higher output power.

[0040] Please refer to Figures 4 and 5 . Figure 4 is a schematic diagram of a first embodiment of the partial structure of the optical module shown in Figure 2 , and Figure 5 is a schematic diagram of a second embodiment of the partial structure of the optical module shown in Figure 2 . Figure 4 omits the first cover 114 and light source assembly 20 of the optical module 10, and shows a top view of the optical module 10 shown in Figure 2 . Figure 5 omits the second cover 115 of the optical module 10, and shows a bottom view of the optical module 10 shown in Figure 2 . The following describes the optical amplification assembly 30 according to an embodiment of the present application.

[0041] In one embodiment, the main circuit board 12 integrates signal and power circuits. The main circuit board 12 connects the electronic components in the optical module 10 according to the circuit design through circuit routing, thereby implementing electrical functions such as power supply, electrical signal transmission, and grounding. The housing 11 has an optical interface 116 and an electrical interface 117 at opposite ends in the third direction. The optical interface 116 is used for optical connection to an optical fiber external to the optical module 10. One end of the main circuit board 12 is electrically connected to a device external to the optical module 10 via the electrical interface 117. A gold finger is designed on one end of the main circuit board 12 for connecting to the electrical connector of the optical cage on the customer's device via the electrical interface 117. The main circuit board 12 also integrates an electronic chip (not shown) for controlling and / or processing electrical signals, such as a DSP (Digital Signal Processor).

[0042] In one embodiment of the present application, the components of the optical amplifier assembly 30 are connected via optical fibers, and the encapsulating housing for the optical amplifier assembly 30 is omitted. Instead, the components of the optical amplifier assembly 30 are directly arranged within the housing 11 of the optical module 10. In this embodiment, the main circuit board 12, the light source assembly 20, and the components of the optical amplifier assembly 30 are stacked within the housing 11. As a result, through the rational arrangement of the light source assembly 20 and the optical amplifier assembly 30, this embodiment creates a compact stacked structure, improving the utilization of the internal space of the optical module 10. This ensures that the size of the optical module 10 meets the MSA protocol requirements while accommodating the added optical amplifier assembly 30, thereby achieving high output power for the optical module 10.

[0043] Specifically, in one embodiment, the optical amplifier assembly 30 includes a pump source device 31, a wavelength division multiplexer 33, an isolator 34, and an amplifying optical fiber 38. The amplifying optical fiber 38 is preferably an erbium-doped optical fiber, forming an erbium-doped fiber amplifier (EDFA). The wavelength division multiplexer 33 is optically connected to the light source assembly 20 and the pump source device 31. The isolator 34 is optically connected to the wavelength division multiplexer 33 via the amplifying optical fiber 38. One end of the amplifying optical fiber 38 is connected to the wavelength division multiplexer 33, and the other end is connected to the isolator 34. The wavelength division multiplexer 33 is connected to the amplifying optical fiber 38 at one end, and to the light source assembly 20 and the pump source device 31 at the other end. The wavelength division multiplexer 33 is used to couple the optical signal output by the light source assembly 20 and the pump light output by the pump source device 31 into the amplifying optical fiber 38. The wavelength division multiplexer 33 can specifically be an IWDM (isolated wavelength division multiplexer 33).

[0044] In one embodiment, please refer to FIG6 , which shows a system block diagram of an optical amplifier assembly 30 according to an embodiment of the present application. In this embodiment, the optical amplifier assembly 30 further includes an adjustable optical attenuator 35 and an optical monitoring detector 36 . The adjustable optical attenuator 35 is optically connected to the isolator 34 , and the optical monitoring detector 36 is optically connected to the adjustable optical attenuator 35 . A modulator is integrated on the main circuit board 12 . The light source assembly 20 is optically connected to the wavelength division multiplexer 33 via the modulator. The optical signal output by the light source assembly 20 is modulated by the modulator and input to the wavelength division multiplexer 33 . The wavelength division multiplexer 33 combines the optical signal output by the light source assembly 20 and the pump light output by the pump source device 31 into an input amplifier optical fiber 38 . The pump light output by the pump source device 31 excites the amplifier optical fiber 38 to amplify the optical signal output by the light source assembly 20 . The optical signal is then outputted sequentially through the isolator 34 , the adjustable optical attenuator 35 , and the optical monitoring detector 36 , resulting in a high output power for the optical module 10 . The output power of the optical module 10 according to the embodiment of the present application can reach +5dBm.

[0045] In the embodiment of the present application, the optical amplifier assembly 30 does not utilize a separate housing. Instead, its components are arranged at different locations on the main circuit board 12. Specifically, in this embodiment, the pump source device 31, wavelength division multiplexer 33, isolator 34, and amplifying optical fiber 38 are arranged on opposite sides of the main circuit board 12. Specifically, the pump source device 31 and amplifying optical fiber 38 are arranged on one side of the main circuit board 12, while the wavelength division multiplexer 33 and isolator 34 are arranged on the other side of the main circuit board 12. The pump source device 31 and amplifying optical fiber 38 are located on one side of the main circuit board 12 in a first direction, while the wavelength division multiplexer 33 and isolator 34 are located on the other side of the main circuit board 12 in the first direction. As a result, compared to traditional EDFAs, the optical amplifier assembly 30 of this embodiment omits a housing. Furthermore, by rationally arranging the functional components of the optical amplifier assembly 30, the optical amplifier assembly 30 is integrated into the optical module 10. This not only improves the output power of the optical module 10 through the optical amplifier assembly 30, but also ensures that the size of the optical module 10 meets protocol requirements. In addition, this embodiment takes into account that the volume of the pump source device 31 is larger than that of the other devices of the optical amplifier assembly 30. Therefore, the pump source device 31, the wavelength division multiplexer 33, and the isolator 34 are respectively arranged on both sides of the main circuit board 12 to improve the utilization rate of the internal space of the optical module 10, and further ensure that the size of the optical module 10 meets the protocol requirements.

[0046] Furthermore, the main circuit board 12 and the light source assembly 20 are arranged opposite each other, the pump source device 31 and the amplification optical fiber 38 are stacked on the side of the main circuit board 12 facing away from the light source assembly 20, and the wavelength division multiplexer 33 and the isolator 34 are stacked between the main circuit board 12 and the light source assembly 20. The main circuit board 12, the light source assembly 20, and the optical amplifier assembly 30 form a four-layer stacked structure.

[0047] In one embodiment, a heat sink 14 is disposed on the exterior of the housing 11 to dissipate heat from the optical module 10. In this embodiment, the housing 11 is divided along the third direction into a first housing portion 112 and a second housing portion 113. The first and second housing portions 112, 113 are interconnected, and the heat sink 14 is disposed on the exterior of the first cover 114 of the first housing portion 112. The accommodating cavity 111 is divided along the third direction into a first sub-cavity 1111 and a second sub-cavity 1112. The first and second sub-cavities 1111, 1112 are interconnected. The first sub-cavity 1111 is located in the first housing portion 112, and the second sub-cavity 1112 is located in the second housing portion 113. In this embodiment, given the large space provided by the first housing portion 112 and the presence of the heat sink 14, the maximum length H1 of the first sub-cavity 1111 in the first direction is greater than the maximum length H2 of the second sub-cavity 1112 in the first direction. This ensures that the first sub-cavity 1111 in the first housing portion 112 has sufficient space to accommodate the light source assembly 20 and the optical amplifier assembly 30. Therefore, accommodating the light source assembly 20 and the optical amplifier assembly 30 in the first sub-cavity 1111 facilitates the simultaneous arrangement of the light source assembly 20 and the optical amplifier assembly 30 within the optical module 10. Furthermore, in this embodiment, the light source assembly 20 and the optical amplifier assembly 30 are disposed in the first shell portion 112, placing the light source assembly 20 and the optical amplifier assembly 30 close to the heat sink 14, particularly close to the first cover 114. This facilitates heat dissipation from the light source assembly 20 through the first cover 114 and the heat sink 14 thereon, thereby improving the heat dissipation effect of the light source assembly 20 and the optical amplifier assembly 30.

[0048] Furthermore, a groove 118 is formed on the inner wall of the first shell portion 112 in the first direction. The groove 118 is recessed in the first direction away from the first sub-cavity 1111, so that the maximum length H1 of the first sub-cavity 1111 in the first direction is greater than the maximum length H2 of the second sub-cavity 1112 in the first direction. FIG3 exemplarily shows that the groove 118 is formed on the lower surface of the first cover 114 in the first direction and the upper surface of the second cover 115 in the first direction.

[0049] It should be noted that the second shell portion 113 is used to cooperate with the interface of the external device. The length (i.e., thickness) of the second shell portion 113 in the first direction is restricted by the standard, and the first shell portion 112 does not need to be inserted into the interface of the external device. Therefore, the length of the first shell portion 112 in the first direction can be greater than the length of the second shell portion 113 in the first direction, so that the inner wall of the first shell portion 112 in the first direction can form a groove 118.

[0050] In one embodiment, the heat sink 14 includes a plurality of heat dissipation columns distributed in an array, so as to increase the heat dissipation area of ​​the optical module 10 through the plurality of heat dissipation columns, thereby improving the heat dissipation efficiency of the optical module 10. Of course, in other embodiments of the present application, the heat sink 14 may also include heat dissipation structures such as heat dissipation fins, which is not limited here.

[0051] In this embodiment, considering the relatively large size of the pump source device 31 and the ample space on the side of the main circuit board 12 facing away from the heat sink 14, the pump source device 31 and the amplifying optical fiber 38 are located on the side of the main circuit board 12 facing away from the heat sink 14. This also facilitates thermal connection between the pump source device 31 and the second cover 115, allowing heat to be dissipated through the second cover 115. The wavelength division multiplexer 33 and isolator 34 are located on the side of the main circuit board 12 facing the heat sink 14, arranged between the main circuit board 12 and the light source assembly 20. This rational arrangement of the various components of the optical amplifier assembly 30 improves the utilization of the internal space of the optical module 10 and further ensures that the size of the optical module 10 meets protocol requirements.

[0052] In one embodiment, the light source assembly 20 and the optical amplifier assembly 30 are both disposed near the optical interface 116. Thus, by properly designing the arrangement of the light source assembly 20 and the optical amplifier assembly 30 in the third direction, this embodiment can improve the utilization of the internal space of the optical module 10 and further ensure that the size of the optical module 10 meets the protocol requirements.

[0053] In one embodiment, as shown in Figure 4, the wavelength division multiplexer 33 and the isolator 34 are located on one side of the variable optical attenuator 35 in the second direction. The wavelength division multiplexer 33 is closer to the variable optical attenuator 35 than the isolator 34, while the optical monitoring detector 36 is located on the other side of the variable optical attenuator 35 in the second direction. The variable optical attenuator 35 and the optical monitoring detector 36 are relatively fixed on the main circuit board 12. The variable optical attenuator 35 is located in the middle of the main circuit board 12 in the second direction, while the optical monitoring detector 36 is located on one edge of the main circuit board 12 in the second direction. The wavelength division multiplexer 33 and the isolator 34 are located on the side of the variable optical attenuator 35 away from the optical monitoring detector 36. Furthermore, because the wavelength division multiplexer 33 is larger than the isolator 34, the isolator 34 is placed at the edge of the main circuit board 12 in the second direction, while the wavelength division multiplexer 33 is placed between the isolator 34 and the variable optical attenuator 35. This allows the isolator 34 to avoid the connection optical fiber 37 described below. The space between the variable optical attenuator 35 and the optical monitoring detector 36 is insufficient to accommodate the wavelength division multiplexer 33. Thus, this embodiment improves the utilization of the internal space of the optical module 10 by rationally arranging the various functional components of the optical amplification assembly 30, further ensuring that the size of the optical module 10 meets the protocol requirements.

[0054] Furthermore, the optical amplifier assembly 30 also includes a connecting optical fiber 37, which is optically connected to the pump source device 31, the wavelength division multiplexer 33, the isolator 34, the variable optical attenuator 35, and the optical monitoring detector 36. The main circuit board 12 also integrates a silicon photonic chip 15. The light source assembly 20 is optically connected to the silicon photonic chip 15 via the connecting optical fiber 37, and the silicon photonic chip 15 is also optically connected to the wavelength division multiplexer 33 via the connecting optical fiber 37. The isolator 34 and the variable optical attenuator 35, as well as the variable optical attenuator 35 and the optical monitoring detector 36, are optically connected via the connecting optical fiber 37.

[0055] The connecting optical fiber 37 is located on the same side of the main circuit board 12 as the wavelength division multiplexer 33, isolator 34, variable optical attenuator 35, and optical monitoring detector 36. The connecting optical fiber 37 is relatively long and therefore coiled in a circle along the circumference of the housing 11. Therefore, the connecting optical fiber 37 includes a first fiber coil 371, a second fiber coil 372, a third fiber coil 373, and a fourth fiber coil 374, which are connected in sequence. The first fiber coil 371 and the third fiber coil 373 are located on either side of the variable optical attenuator 35 in the second direction, with the first fiber coil 371 being close to the isolator 34 and the third fiber coil 373 being close to the optical monitoring detector 36. The second fiber coil 372 and the fourth fiber coil 374 are located on either side of the variable optical attenuator 35 in the third direction. In this embodiment, since the isolator 34 and the optical monitoring detector 36 are relatively small, they are arranged at the edge of the main circuit board 12 in the second direction to avoid the first fiber coil portion 371 and the third fiber coil portion 373 of the connecting optical fiber 37. This helps to reduce the size of the optical amplifier assembly 30 in the first direction, thereby improving the utilization rate of the internal space of the optical module 10, thereby ensuring that the size of the optical module 10 meets the protocol requirements.

[0056] In one embodiment, as shown in Figure 5 , the pump source device 31 is tilted relative to both the second and third directions. This minimizes the space occupied by the pump source device 31 in the third direction while ensuring that the pump source device 31 does not significantly affect the size of the optical module 10 in the second direction. This ensures that the area of ​​the main circuit board 12 in the third direction where the pump source device 31 is not located is sufficient for other electronic components. This improves the utilization of the internal space of the optical module 10 and ensures that the size of the optical module 10 meets the protocol requirements. Furthermore, the amplifying optical fiber 38 is coiled around the periphery of the pump source device 31.

[0057] It should be noted that, in the embodiment of the present application, optical amplifier assembly 30 may be an EDFA (Erbium Doped Fiber Amplifier), for example, wherein amplifying fiber 38 is an erbium-doped fiber. The operating principle of the optical amplifier assembly 30 is well understood by those skilled in the art and will not be further described here.

[0058] In an embodiment of the present application, the light source assembly 20 includes a light output device 21 and a light source circuit board 22, and the light output device 21 is electrically connected to the light source circuit board 22. The light source circuit board 22 is integrated with a logic control circuit, and the light source circuit board 22 is used to control the light output device 21 to output an optical signal. The light source circuit board 22 can be electrically connected to the main circuit board 12 through a flexible circuit board or a plug-in electrical connector. The light output device 21 includes an airtight packaging box, and the airtight packaging box has a packaging cavity inside. The light output device 21 also includes a tunable laser module, which is encapsulated in the packaging cavity, and the tunable laser module is used to generate a wavelength-tunable optical signal. In this embodiment, the tunable laser module uses a semiconductor gain chip in combination with a tunable external cavity to generate a wavelength-tunable laser with a narrow linewidth. The light output device 21 also includes an output head, which is used to output the optical signal generated by the tunable laser module.

[0059] The optical monitoring detector 36 of the above-mentioned optical amplifier assembly 30 is relatively small in size and can be placed between the optical output device 21 and the main circuit board 12. The wavelength division multiplexer 33, isolator 34 and adjustable optical attenuator 35 are relatively large in size and can be placed between the light source circuit board 22 and the main circuit board 12, while the pump source device 31 and the amplifying optical fiber 38 are arranged on the other side of the main circuit board 12, thereby making the stacked structure of the light source assembly 20, the main circuit board 12 and the optical amplifier assembly 30 more compact.

[0060] Please continue to refer to Figure 2. In one embodiment, to accommodate the light source assembly 20 and the optical amplifier assembly 30 within the optical module 10, the length of the housing 11 of the optical module 10, including the heat sink 14, is lengthened while ensuring that the overall length of the optical module 10 remains unchanged and meets the specific dimensions required by the protocol standard. Therefore, in this embodiment, the length L1 of the housing 11 in the third direction ranges from 96.5 mm to 106.5 mm, for example, 96.5 mm, 96.12 mm, 97.35 mm, 98.16 mm, 99.68 mm, 101.66 mm, 102.41 mm, 103.72 mm, 104.69 mm, 106.5 mm, etc. This provides sufficient space for the accommodating cavity 111 within the housing 11, allowing the length of the main circuit board 12 in the third direction to be appropriately lengthened to accommodate the light source assembly 20 and the optical amplifier assembly 30, thereby ensuring that the optical module 10 has a higher output power.

[0061] In one embodiment, the optical module 10 further includes a pull ring 13 connected to the housing 11. The pull ring 13 is used to release the lock between the optical module 10 and the optical cage. Specifically, when the optical module 10 is inserted into the optical cage, the pull ring 13 is pulled externally to release the lock between the optical module 10 and the optical cage, thereby allowing the optical module 10 to be removed from the optical cage. Specifically, the pull ring 13 includes a force-applying portion 131 and at least two sliding arms 132. The force-applying portion 131 is connected to the housing 11 via the sliding arms 132. External force applied to the force-applying portion 131 moves the pull ring 13 to release the lock between the optical module 10 and the optical cage. The force-applying portion 131 is spaced apart from the housing 11 in the third direction, and a user applies force to the force-applying portion 131 through the gap between the force-applying portion 131 and the housing 11.

[0062] Considering the increased length of the housing 11 of the optical module 10, and to ensure that the overall length of the optical module 10 and the length L2 of the gap between the force-applying portion 131 on the pull ring 13 and the housing 11 meet the requirements, this embodiment reduces the length L3 of the force-applying portion 131 in the third direction. Specifically, the length L3 of the force-applying portion 131 in the third direction ranges from 3 mm to 6 mm, for example, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, etc. This provides a sufficiently large gap between the force-applying portion 131 and the housing 11 to facilitate pluggable connection between an external optical fiber and the optical interface 116 of the optical module 10. Furthermore, the length L3 of the force-applying portion 131 in the third direction of this embodiment is not excessively small, ensuring that the force-applying portion 131 has sufficient structural strength and sufficient space for marking.

[0063] The optical module provided in this application is introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core idea of ​​this application. At the same time, for those skilled in the art, according to the ideas of this application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. An optical module, characterized in that: include: A shell body having a containing cavity inside; A main circuit board is accommodated in the accommodation cavity; A light source assembly is accommodated in the accommodation cavity and electrically connected to the main circuit board; as well as An optical amplifier component is accommodated in the accommodating cavity and electrically connected to the main circuit board, and the optical amplifier component is optically connected to the light source component, and the optical amplifier component is used to amplify the optical signal output by the light source component; Wherein, the main circuit board, the light source assembly and the optical amplification assembly are stacked.

2. The optical module according to claim 1, characterized in that: The optical amplification component includes a pump source device, a wavelength division multiplexer, an amplifying optical fiber and an isolator; One end of the amplifying optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator; The wavelength division multiplexer is used to couple the optical signal output by the light source assembly and the pump light output by the pump source device into the amplifying optical fiber; The pump source device and the amplifying optical fiber are arranged on one side of the main circuit board, and the wavelength division multiplexer and the isolator are arranged on the other side of the main circuit board.

3. The optical module according to claim 2, characterized in that: The main circuit board is arranged opposite to the light source assembly, the pump source device and the amplifying optical fiber are arranged on a side of the main circuit board away from the light source assembly, and the wavelength division multiplexer and the isolator are arranged between the main circuit board and the light source assembly.

4. The optical module according to claim 2 or 3, characterized in that: The optical amplification component also includes: an adjustable optical attenuator optically connected to the isolator; and an optical monitoring detector, optically connected to the adjustable optical attenuator; The adjustable optical attenuator, the optical monitoring detector, the wavelength division multiplexer and the isolator are located on the same side of the main circuit board and arranged side by side.

5. The optical module according to claim 4, characterized in that: The optical module has a first direction, a second direction and a third direction which are perpendicular to each other in pairs, the light source assembly and the optical amplifier assembly are stacked on each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction; The wavelength division multiplexer and the isolator are located on one side of the adjustable optical attenuator in the second direction, and the wavelength division multiplexer is closer to the adjustable optical attenuator relative to the isolator, and the optical monitoring detector is located on the other side of the adjustable optical attenuator in the second direction.

6. The optical module according to claim 5, characterized in that: The optical amplification component also includes: A connecting optical fiber is optically connected to the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator, and the optical monitoring detector, and the connecting optical fiber, the wavelength division multiplexer, the isolator, the adjustable optical attenuator, and the optical monitoring detector are located on the same side of the main circuit board; Wherein, the connecting optical fiber includes a first fiber coil portion, a second fiber coil portion, a third fiber coil portion and a fourth fiber coil portion which are connected in sequence; the first fiber coil portion and the third fiber coil portion are respectively located on both sides of the adjustable optical attenuator in the second direction, and the first fiber coil portion is close to the isolator, and the third fiber coil portion is close to the optical monitoring detector; the second fiber coil portion and the fourth fiber coil portion are respectively located on both sides of the adjustable optical attenuator in the third direction.

7. The optical module according to claim 2 or 3, characterized in that: The amplifying optical fiber disk is arranged on the periphery of the pump source device.

8. The optical module according to claim 2 or 3, characterized in that: The optical module has a first direction, a second direction and a third direction which are perpendicular to each other in pairs, the light source assembly and the optical amplifier assembly are stacked on each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction; Wherein, the pump source device is arranged to be inclined relative to the second direction and the third direction.

9. The optical module according to claim 1, characterized in that: The housing has an optical interface and an electrical interface at opposite ends, respectively, the optical interface is used to optically connect to an optical fiber outside the optical module, and one end of the main circuit board is electrically connected to a device outside the optical module through the electrical interface; Wherein, the light source assembly and the light amplifying assembly are both arranged close to the optical interface.

10. The optical module according to claim 1, characterized in that: The optical module has a first direction, a second direction and a third direction which are perpendicular to each other in pairs, the light source assembly and the optical amplifier assembly are stacked on each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction; The shell is divided into a first shell portion and a second shell portion along the third direction, and the accommodating cavity is divided into a first sub-cavity and a second sub-cavity that are interconnected along the third direction, the first sub-cavity is located in the first shell portion, and the second sub-cavity is located in the second shell portion; the maximum length of the first sub-cavity in the first direction is greater than the maximum length of the second sub-cavity in the first direction, the second shell portion is used to cooperate with an interface of an external device, the first shell portion is provided with a heat sink, and the light source assembly and the optical amplification assembly are accommodated in the first sub-cavity.

11. The optical module according to claim 10, characterized in that: A groove is formed on the inner wall of the first shell portion in the first direction, and the groove is recessed in the first direction away from the first sub-cavity.

12. The optical module according to claim 1, characterized in that: The optical module has a first direction, a second direction and a third direction which are perpendicular to each other in pairs, the light source assembly and the optical amplifier assembly are stacked on each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction; Wherein, the length of the shell in the third direction is 96.5 mm to 106.5 mm.

13. The optical module according to claim 12, characterized in that: The optical module further includes: A pull ring, comprising a force-applying portion and at least two sliding arms, wherein the force-applying portion is connected to the housing through the sliding arms, and the force-applying portion and the housing are spaced apart from each other in the third direction, and the pull ring is driven to move by applying force to the force-applying portion to release the lock between the optical module and the external optical cage; Wherein, the length of the force applying portion in the third direction is 3 mm to 6 mm.

14. An optical module, characterized in that: include: A shell body having a containing cavity inside; A main circuit board is accommodated in the accommodation cavity; A light source assembly is accommodated in the accommodation cavity and electrically connected to the main circuit board; as well as An optical amplifier component is accommodated in the accommodating cavity and electrically connected to the main circuit board, and the optical amplifier component is optically connected to the light source component, and the optical amplifier component is used to amplify the optical signal output by the light source component; The optical amplification component includes a pump source device, a wavelength division multiplexer, an isolator and an amplifying optical fiber. One end of the amplifying optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator. The wavelength division multiplexer is used to couple the optical signal output by the light source component and the pump light output by the pump source device into the amplifying optical fiber; the pump source device, the wavelength division multiplexer, the isolator and the amplifying optical fiber are respectively arranged on opposite sides of the main circuit board.

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