Cabinet-type server and liquid cooling system therefor

Abstract

A liquid cooling system for a cabinet-type server, comprising: a backplane cooling module, which comprises a fan, a water cooling circuit and a refrigerant circuit, wherein the water cooling circuit and the refrigerant circuit are arranged on one side of the cabinet-type server, and the fan is used for driving gas to flow to the water cooling circuit from the side of the cabinet-type server away from the water cooling circuit; at least one liquid cooling plate, which is fitted against a heating element of the cabinet-type server; and a plug-in frame cooling module, which comprises a compressor and a condensation plate heat exchanger that are arranged in the cabinet-type server, and a cooling tower arranged outside of the cabinet-type server, wherein the condensation plate heat exchanger is provided with a water cooling channel and a refrigerant channel which are used for heat exchange, the refrigerant channel being in communication with the refrigerant circuit, and each liquid cooling plate, the water cooling channel and the water cooling circuit being connected in parallel and externally connected to the cooling tower. The liquid cooling system enables cooling efficiency to be improved, and provides a plurality of cooling strategies. The cabinet-type server also has the aforementioned technical effects.

Description

A cabinet-type server and its liquid cooling system

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 28, 2023, with application number 202311610525.2 and invention name “A cabinet-type server and its liquid cooling system”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of cooling systems, and more particularly to a cabinet-type server and a liquid cooling system thereof. Background Art

[0003] As the power density of server chips increases, higher requirements are placed on heat dissipation. The existing ordinary air cooling heat exchange method can no longer meet the high power density heat exchange requirements. Liquid cooling, as an alternative solution for efficient heat exchange and energy saving, is gradually replacing the existing air cooling technology.

[0004] Currently, the predominant liquid cooling method for cabinet servers is cold plate liquid cooling. This method, also known as a liquid cold plate, exchanges heat with the server's high-heat-generating chips, then rapidly transfers the heat to the outside of the cabinet through a connected heat exchange system. Because the liquid cold plate's heat exchange system requires layout and installation within a small space, and requires multiple pipe connections, this not only complicates and complicates spatial layout, but also somewhat blocks the heat exchange circulation of compatible airflow systems, resulting in efficiency losses and preventing optimal efficiency. Furthermore, the cooling system operates in a single mode, making it difficult to adjust the cooling strategy based on the varying operating conditions of the cabinet server.

[0005] In summary, how to effectively solve the problem of the single operation mode of the cooling system of the cabinet server is a problem that those skilled in the art need to solve. Summary of the Invention

[0006] In view of this, the present invention aims to provide a cabinet server and its liquid cooling system, which can effectively solve the problem of the single operation mode of the cabinet server cooling system. To achieve the above object, the present invention provides the following technical solutions:

[0007] A liquid cooling system for a cabinet server, comprising:

[0008] A backplane cooling module, comprising a fan, a water cooling circuit, and a refrigerant circuit, wherein the water cooling circuit and the refrigerant circuit are respectively arranged on one side of the cabinet server, and the fan is used to drive gas from a side of the cabinet server away from the water cooling circuit and the refrigerant circuit to flow to the water cooling circuit and the refrigerant circuit;

[0009] At least one liquid cooling plate, each of the liquid cooling plates being respectively disposed in contact with a heating element of the cabinet server;

[0010] The frame cooling module includes a compressor, a condensing plate heat exchanger and a cooling tower outside the cabinet server, respectively arranged in the cabinet server. The condensing plate heat exchanger has a water-cooling channel and a refrigerant channel for heat exchange. The refrigerant channel is connected to the refrigerant circuit. Each of the liquid cooling plates, the water-cooling channel and the water-cooling circuit is connected in parallel and respectively connected to the cooling tower.

[0011] Optionally, in the above-mentioned liquid-cooled cooling system, the inlet and outlet ends of the water cooling circuit are respectively connected to the first valve and the second valve, and the inlet and outlet ends of the water cooling channel are respectively connected to the third valve and the fourth valve; when the first valve and the second valve are both opened and at least one of the third valve and the fourth valve is closed, the water cooling circuit is connected to the cooling tower, and the water cooling channel is disconnected from the cooling tower; when at least one of the first valve and the second valve is closed and the third valve and the fourth valve are both opened, the water cooling circuit is disconnected from the cooling tower, and the water cooling channel is connected to the cooling tower.

[0012] Optionally, in the above-mentioned liquid cooling system, both ends of the water cooling channel are connected through a bypass branch, and one end of the bypass branch is connected to the water cooling channel through a first three-way valve, and the first three-way valve is used to adjust the flow of the water cooling channel.

[0013] Optionally, the above-mentioned liquid-cooled cooling system also includes a second three-way valve, the three ports of which are respectively connected to the outlet end of the water-cooling channel, the outlet end of the water-cooling circuit and the inlet of the cooling tower, and the second three-way valve is used to control the flow of the water-cooling channel and the water-cooling circuit and the connection and disconnection with the cooling tower.

[0014] Optionally, the above-mentioned liquid cooling system also includes a temperature sensor for detecting the ambient temperature inside the cabinet server, and the compressor is used to shut down when the temperature detected by the temperature sensor is lower than a first preset temperature, and the cooling tower is connected to the water cooling circuit and disconnected from the water cooling channel; the compressor is used to start when the temperature detected by the temperature sensor is greater than or equal to the first preset temperature, and the cooling tower is disconnected from the water cooling circuit and connected to the water cooling channel.

[0015] Optionally, in the above-mentioned liquid cooling system, the water cooling circuit and the refrigerant circuit are stacked front and back and attached to the back plate of the cabinet server, and the refrigerant circuit is close to the fan.

[0016] Optionally, in the above-mentioned liquid cooling system, the cooling tower is a closed cooling tower or an open cooling tower.

[0017] Optionally, in the above-mentioned liquid-cooled cooling system, the cooling tower includes a wet coil arranged on the outside and a dry coil located inside the wet coil, and a spray water pipe, a spray pump and a water collection tank are provided corresponding to the wet coil. The inlet of the cooling tower is the inlet of the dry coil, the outlet of the dry coil is connected to the inlet of the wet coil, and the outlet of the wet coil is the outlet of the cooling tower.

[0018] Optionally, in the above liquid cooling system, the frame cooling module is arranged at the bottom end of the cabinet server.

[0019] The liquid cooling system for the cabinet server provided by the present invention is applied, and a backplane cooling module, a liquid cooling plate and a plug-in frame cooling module are combined. The liquid cooling plate is arranged in contact with the heating elements of the cabinet server and is used to cool the high-heating elements in the cabinet server; the backplane cooling module is used to dissipate heat to the internal environment of the cabinet server to achieve cooling of auxiliary devices other than the high-heating elements, and the backplane cooling module includes a water cooling circuit and a refrigerant circuit. The condensing plate exchanger of the plug-in frame cooling module is used to supply cooling to the refrigerant circuit, and the cooling tower is used to supply cooling to the water cooling circuit, the water cooling channel of the condensing plate exchanger and the liquid cooling plate. This liquid cooling system improves the cooling efficiency through multi-stage heat dissipation. The backplane cooling module is provided with a water cooling circuit and a refrigerant circuit, and the water cooling circuit and the refrigerant circuit can be selected to be turned on and off according to the operating status of the cabinet server, thereby realizing different cooling strategies for different operating states and improving heat dissipation efficiency. The condensing plate heat exchanger is cooled by cooling tower water, and the heat from the condensing plate heat exchanger is reduced by external cooling equipment. This fully utilizes the temperature difference between the cooling tower and the condensing plate heat exchanger, thereby fully utilizing the natural cooling source and reducing energy consumption. Furthermore, the compressor and condensing plate heat exchanger of the frame cooling module are integrated into the cabinet server, shortening the cooling loop and adopting a modular design layout, which improves space utilization, is compact, and reduces costs.

[0020] To achieve the above objectives, the present invention further provides a cabinet server comprising any of the above liquid cooling systems. Since the above liquid cooling system has the above technical effects, the cabinet server comprising the liquid cooling system should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] FIG1 is a schematic structural diagram of a liquid cooling system according to a specific embodiment of the present invention;

[0023] FIG2 is a schematic structural diagram of a liquid cooling system according to another embodiment of the present invention;

[0024] FIG3 is a connection diagram of a liquid cooling system according to another embodiment of the present invention.

[0025] The following are marked in the accompanying drawings:

[0026] Cabinet server 1, heating element 11;

[0027] Backplane cooling module 10, water cooling circuit 110, fan 120, refrigerant circuit 130,

[0028] Liquid cooling plate 20;

[0029] Frame refrigeration module 30, compressor 310, condensing plate exchanger 320, cooling tower 330, expansion valve 340, wet coil 331, dry coil 332, spray water pipe 333, spray pump 334, water collection tank 335, filter 336;

[0030] Water collector 40 , water distributor 50 , first valve 61 , second valve 62 , third valve 63 , fourth valve 64 , first three-way valve 65 , second three-way valve 70 , and liquid pump 80 . DETAILED DESCRIPTION

[0031] The embodiment of the present invention discloses a cabinet-type server and a liquid cooling system thereof, so as to improve cooling efficiency and provide multiple cooling strategies.

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] In a specific embodiment, referring to FIG1 , the liquid cooling system for a cabinet server provided by the present invention includes a backplane cooling module 10, at least one liquid cooling plate 20, and a frame cooling module 30. The backplane cooling module 10 includes a fan 120, a water cooling circuit 110, and a refrigerant circuit 130. The water cooling circuit 110 and the refrigerant circuit 130 are respectively arranged on one side of the cabinet server 1. The fan 120, the water cooling circuit 110, and the refrigerant circuit 130 can be on the same side of the cabinet server 1, or on opposite sides of the cabinet server 1. When on the same side, the fan 120 is used to drive gas from the side of the cabinet server 1 away from the water cooling circuit 110 and the refrigerant circuit 130 to flow toward the water cooling circuit 110 and the refrigerant circuit 130. When on opposite sides, the fan 120 is used to drive gas to flow toward the water cooling circuit 110 and the refrigerant circuit 130 and then out from one side of the fan 120. Under the action of fan 120, the indoor air of cabinet server 1 enters the cabinet server 1, exchanges heat through water cooling circuit 110 and / or refrigerant circuit 130, and is then discharged. Heat from auxiliary components and heat leakage from the liquid cooling plate 20 or main chip are carried away by the air, and the heated air exchanges heat with water cooling circuit 110 or refrigerant circuit 130. In other words, water cooling circuit 110 and refrigerant circuit 130 exchange heat with the air inside cabinet server 1, reducing the temperature of components with low heat dissipation density within the cabinet server 1.

[0034] Each liquid cooling plate 20 is positioned in close contact with the heat-generating components 11 of the cabinet server 1. It is understood that the heat-generating components 11 include, but are not limited to, high-heat-generating devices such as main chips. The liquid cooling plates 20, when positioned in close contact with the heat-generating components 11, can fully absorb the heat from the heat-generating components 11 and cool them. The cold plates effectively dissipate heat from heat-generating components 11, such as chips with high heat dissipation density.

[0035] The frame cooling module 30 is an integrated closed-loop system, comprising a compressor 310, a condensing plate heat exchanger 320, and a cooling tower 330 located outside the cabinet server 1. The condensing plate heat exchanger 320 has a water-cooling channel and a refrigerant channel for heat exchange. The refrigerant channel is connected to the refrigerant circuit 130. Each liquid cooling plate 20, the water-cooling channel, and the water-cooling circuit 110 are connected in parallel and are each connected to the cooling tower 330. The refrigerant channels of the compressor 310 and the condensing plate heat exchanger 320 are connected in series with the refrigerant circuit 130 of the backplane cooling module 10, forming a refrigerant circulation system. Specifically, the outlet of the compressor 310 is connected to the refrigerant inlet of the refrigerant channel, which is then connected to the inlet of the refrigerant circuit 130 of the backplane cooling module 10. The outlet of the refrigerant circuit 130 of the backplane cooling module 10 is connected to the inlet of the compressor 310. The refrigerant circuit 130 is the evaporation end of the refrigerant circulation system.

[0036] The cooling tower 330 cools the cooling plates 20. After the heat generated by the heating element 11 is absorbed by the cooling plates 20, the heated cooling water in the cooling plates 20 flows to the cooling tower 330. After cooling in the cooling tower 330, the cooling water flows back to each cooling plate 20, completing the heat absorption cycle.

[0037] The refrigerant circuit 130 can specifically be a refrigerant backplane. The refrigerant circuit 130 is cooled by the water-cooling channel of the condensing plate heat exchanger 320. That is, the refrigerant gas, which has increased in temperature after heat exchange with the ambient air of the cabinet server 1, exchanges heat with the water-cooling channel in the refrigerant channel of the condensing plate heat exchanger 320 and is cooled. The cooled refrigerant then flows back to the refrigerant circuit 130 to absorb heat and complete the cycle. After the water-cooling channel absorbs the heat from the refrigerant channel, the cooling water in the water-cooling channel with increased temperature flows to the cooling tower. The cooling water, after being cooled by the cooling tower, flows back to the water-cooling channel to absorb heat and complete the cycle. The water-cooling circuit 110 can specifically be a liquid-cooled backplane. The water-cooling circuit 110 is cooled by the cooling tower 330. That is, after the heat from the ambient air of the cabinet server 1 is absorbed by the water-cooling circuit 110, the cooling water in the water-cooling circuit 110 with increased temperature flows to the cooling tower 330. The cooling water, after being cooled by the cooling tower 330, flows back to the water-cooling circuit 110 to absorb heat and complete the cycle. The cooling tower 330 can selectively supply cooling to the water-cooling channel and cut off the water-cooling circuit 110 as needed, or supply cooling to the water-cooling circuit 110 and cut off the water-cooling channel.

[0038] It is understood that the cooling water in the present application includes but is not limited to water or a mixture of water, such as antifreeze cooling water with ethylene glycol added, etc. The refrigerant in the present application includes but is not limited to a refrigerant with fluorine added.

[0039] The liquid cooling system for the cabinet server provided by the present invention is applied. The backplane cooling module 10, the liquid cooling plate 20 and the insert frame cooling module 30 are combined. The liquid cooling plate 20 is arranged in contact with the heating element 11 of the cabinet server 1 and is used to cool the medium and high heating elements 11 in the cabinet server 1. The backplane cooling module 10 is used to dissipate heat from the internal environment of the cabinet server 1 to achieve cooling of auxiliary components other than the high heating elements 11, and the backplane cooling module 10 includes a water cooling circuit 110 and a refrigerant circuit 130. The condensing plate exchanger 320 of the insert frame cooling module 30 is used to supply cooling to the refrigerant circuit 130, and the cooling tower 330 is used to supply cooling to the water cooling circuit 110, the water cooling channel of the condensing plate exchanger 320 and the liquid cooling plate 20. This liquid cooling system improves cooling efficiency through multi-stage heat dissipation. The backplane refrigeration module 10 is provided with a water cooling circuit 110 and a refrigerant circuit 130. The water cooling circuit 110 and the refrigerant circuit 130 can be switched on and off according to the operating state of the cabinet server 1, thereby realizing different cooling strategies for different operating states and improving heat dissipation efficiency. The condensing plate heat exchanger 320 is water-cooled by a cooling tower 330, and the heat of the condensing plate heat exchanger 320 is cooled by an external cooling device, making full use of the high and low temperature difference that can be formed between the cooling tower 330 and the condensing plate heat exchanger 320, thereby realizing full utilization of the natural cold source and reducing energy consumption. In addition, the compressor 310 and the condensing plate heat exchanger 320 of the frame refrigeration module 30 are both integrated into the cabinet server 1, with a short cooling circuit, a modular design layout, high space utilization, a compact structure, and low cost.

[0040] In some embodiments, referring to FIG1 , the inlet and outlet of the water cooling circuit 110 are connected to a first valve 61 and a second valve 62, respectively, and the inlet and outlet of the water cooling channel are connected to a third valve 63 and a fourth valve 64, respectively. When both the first valve 61 and the second valve 62 are open and at least one of the third valve 63 and the fourth valve 64 is closed, the water cooling circuit 110 is connected to the cooling tower 330, and the water cooling channel is disconnected from the cooling tower 330. When at least one of the first valve 61 and the second valve 62 is closed and both the third valve 63 and the fourth valve 64 are open, the water cooling circuit 110 is disconnected from the cooling tower 330, and the water cooling channel is connected to the cooling tower 330. The arrangement of the first valve 61, the second valve 62, the third valve 63, and the fourth valve 64 facilitates switching between connecting the cooling tower 330 to the water cooling circuit 110 or to the water cooling channel to meet different heat dissipation requirements. Specifically, the first valve 61, the second valve 62, the third valve 63, and the fourth valve 64 can be ball valves.

[0041] In some embodiments, referring to FIG1 , the two ends of the water-cooling channel are connected via a bypass branch, and one end of the bypass branch is connected to the water-cooling channel via a first three-way valve 65. The first three-way valve 65 is used to adjust the flow of the water-cooling channel. By providing the first three-way valve 65, the flow of cooling water entering the bypass branch and the water-cooling channel can be adjusted. If the heat generated by the condensing plate heat exchanger 320 is relatively low, the flow of the water-cooling channel is reduced by adjusting the first three-way valve 65. When the heat generated by the condensing plate heat exchanger 320 is relatively high, the flow of the bypass branch is reduced to further improve the heat dissipation efficiency. Specifically, the three ports of the first three-way valve 65 are respectively connected to the outlet end of the water-cooling channel, the inlet end of the water-cooling channel, and the fourth valve 64.

[0042] In some embodiments, referring to FIG. 2 , the liquid cooling system further includes a second three-way valve 70 . The three ports of the second three-way valve 70 are respectively connected to the outlet of the water-cooling channel, the outlet of the water-cooling circuit 110, and the inlet of the cooling tower 330. The second three-way valve 70 is used to control the flow rate of the water-cooling channel and the water-cooling circuit 110, as well as the connection and disconnection with the cooling tower 330. The flow rate of the water-cooling channel and the water-cooling circuit 110 can be directly adjusted by the second three-way valve 70. For ease of explanation, the branch connecting the second three-way valve 70 to the inlet of the cooling tower 330 and the outlet of the water-cooling channel is referred to as the first branch, and the branch connecting the second three-way valve 70 to the inlet of the cooling tower 330 and the outlet of the water-cooling circuit 110 is referred to as the second branch. By adjusting the second three-way valve 70 to close the first branch, the cooling capacity flowing through the condenser 320 is reduced. Alternatively, by adjusting the second three-way valve 70 to close the first branch, cooling water can be prevented from flowing through the condenser 320. Similarly, by adjusting the second three-way valve 70 to reduce or shut off the second branch, cooling water will flow less or not at all through the water-cooling circuit 110. Alternatively, the second three-way valve 70 can be adjusted to allow cooling water to flow through both the first and second branches, as needed, to achieve heat exchange. In this embodiment, the switching and flow rate adjustment described above can be achieved through the second three-way valve 70, resulting in a simple structure and low cost.

[0043] In some embodiments, the liquid cooling system further includes a temperature sensor for detecting the ambient temperature within the cabinet server 1. By providing the temperature sensor to detect the ambient temperature within the cabinet server 1, it is convenient to control the cooling tower 330 to communicate with the water cooling channel or the water cooling circuit 110 based on the feedback data.

[0044] Furthermore, the compressor 310 is used to shut down when the temperature detected by the temperature sensor is less than a first preset temperature, and the cooling tower 330 is connected to the water cooling circuit 110 and disconnected from the water cooling channel; the compressor 310 is used to start when the temperature detected by the temperature sensor is greater than or equal to the first preset temperature, and the cooling tower 330 is disconnected from the water cooling circuit 110 and connected to the water cooling channel. In other embodiments, the connection between the cooling tower 330 and the water cooling circuit 110 and the opening and closing of the water cooling channel can also be controlled according to the size of the load. Specifically, when the ambient temperature or the load is large, the refrigerant circulation circuit is turned on; the water cooling circulation circuit is turned off; otherwise, the refrigerant circulation circuit is turned off and the water cooling circulation circuit is turned on; the liquid cooling plate 20 continues to use external cooling for cooling. As set above, the working mode of the liquid cooling system can be adjusted accordingly according to the operating status of the cabinet server 1, thereby improving heat dissipation efficiency and reducing energy consumption.

[0045] Taking the liquid cooling system as an example, which includes a first valve 61, a second valve 62, a third valve 63, and a fourth valve 64, when the ambient temperature T1 is lower than the first preset temperature T0, specifically in the range of 30°C to 45°C, the compressor 310 system does not operate, the first valve 61 and the second valve 62 are both open, the third valve 63 and / or the fourth valve 64 are closed, and the cooling water of the cooling tower 330 flows through the water cooling circuit 110 of the backplane cooling module 10, and does not flow through the water cooling channel of the frame cooling module 30;

[0046] When the ambient temperature T1 is greater than or equal to the first preset temperature T0, the compressor 310 is turned on, the first valve 61 and / or the second valve 62 are closed, the third valve 63 and the fourth valve 64 are both opened, the refrigerant flows through the refrigerant circuit 130, and the cooling water of the cooling tower 330 flows through the water cooling channel but not through the water cooling circuit 110 of the backplane refrigeration module 10.

[0047] In some embodiments, it can also be configured that when the temperature detected by the temperature sensor is lower than a first preset temperature, the compressor 310 stops, and the cooling tower 330 is connected to the water cooling circuit 110 and disconnected from the water cooling channel; when the temperature detected by the temperature sensor is higher than a second preset temperature, the compressor 310 starts, and the cooling tower 330 is disconnected from the water cooling circuit 110 and connected to the water cooling channel; when the temperature detected by the temperature sensor is higher than the first preset temperature and lower than the second preset temperature, the compressor 310 starts, and the cooling tower 330 is connected to the water cooling circuit 110 and the water cooling channel respectively, wherein the second preset temperature is higher than the first preset temperature.

[0048] In some embodiments, the water cooling circuit 110 and the refrigerant circuit 130 are stacked front and back and attached to the back panel of the cabinet server 1, and the refrigerant circuit 130 is close to the fan 120. The refrigerant circuit 130 has a high cooling efficiency, and is placed close to the fan 120 to improve the overall heat dissipation efficiency.

[0049] In some embodiments, the cooling tower 330 is a closed cooling tower or an open cooling tower. When an open cooling tower 71 is used, a plate heat exchanger is required between the open cooling tower 71 and the condensing plate exchanger 320, the first heat exchanger 110, and the second heat exchanger 330. Heat transfer through the plate heat exchanger can prevent water from the open cooling tower 71 from contaminating the connected condensing plate exchanger 320, the first heat exchanger 110, and the second heat exchanger 330, thereby preventing heat exchanger blockage and easily damaging the heat exchanger. Specifically, a liquid pump 80 is provided between the second channel and the closed cooling tower. Alternatively, a liquid pump 80 is provided between the second channel and the open cooling tower.

[0050] In some embodiments, referring to FIG3 , a cooling tower 330 includes a wet coil 331 disposed on the outside and a dry coil 332 located within the wet coil 331. A spray pipe 333, a spray pump 334, and a water collection tank 335 are provided corresponding to the wet coil 331. The inlet of the cooling tower 330 is connected to the inlet of the dry coil 332, and the outlet of the dry coil 332 is connected to the inlet of the wet coil 331. The outlet of the wet coil 331 is connected to the outlet of the cooling tower 330. In this embodiment, a combined dry and wet control method is employed. When the dry coil 332 is insufficient in heat exchange, the wet coil 331 is used to provide additional cooling to ensure cooling capacity. Specifically, the wet coil 331 can be partially or fully opened.

[0051] In some embodiments, the water cooling loop 110 and the refrigerant loop 130 are arranged in a vertical direction and their ends extend to the top and bottom of the cabinet server 1 respectively, so as to increase their contact area with the environment and improve heat exchange efficiency.

[0052] In some embodiments, the liquid cooling system further includes a water collector 40 having multiple inlets connected to the outlet of each liquid cooling plate 20 and the outlet of the water cooling circuit 110. The outlet of the water collector 40 is connected to the inlet of the cooling tower 330. In the case of multiple liquid cooling plates 20, the cooling water flowing out of the multiple liquid cooling plates 20 and the cooling water flowing out of the water cooling circuit 110 are collected by the water collector 40 and then flowed into the cooling tower 330 for cooling. The provision of the water collector 40 further simplifies the cooling pipeline.

[0053] In some embodiments, the liquid cooling system further includes a water distributor 50 having multiple outlets connected to the inlet of each liquid cooling plate 20 and the inlet of the water cooling circuit 110. The inlet of the water distributor 50 is connected to the outlet of the cooling tower 330. The cooling water cooled by the cooling tower 330 is distributed through the water distributor 50 to each liquid cooling plate 20 and the water cooling circuit 110 for heat absorption. The provision of the water distributor 50 further simplifies the cooling circuit. When the water collector 40 and the water distributor 50 are provided, two interfaces corresponding to the water collector 40 and the water distributor 50 are provided on the frame cooling module 30.

[0054] In some embodiments, each liquid cooling plate 20 is arranged flat. This flat arrangement allows for more uniform heat dissipation in the cabinet. Each heating element 11 can be arranged on a corresponding liquid cooling plate 20.

[0055] In some embodiments, the liquid cooling plates 20 are stacked in intervals, with the inlet and outlet of each cooling plate 20 located on the same side of the cooling plate 20. Placing the inlet and outlet of the cooling plate 20 on the same side facilitates piping routing. Cables can also be placed on the other side, separating the electrical circuits and the liquid circuits to prevent interference.

[0056] Furthermore, a liquid inlet and a liquid outlet may be respectively provided at two ends of the same side of the frame refrigeration module 30 corresponding to each liquid cooling plate 20 .

[0057] In some embodiments, each liquid cooling plate 20 is arranged at an angle so that during use, a small amount of gas generated by evaporation of the cooling liquid will float up, thereby avoiding blockage in the middle.

[0058] In some embodiments, the fan 120, the water cooling circuit 110, and the refrigerant circuit 130 are located on the same side of the cabinet server 1, and the fan 120 is an exhaust fan 120 located outside the water cooling circuit 110 and the refrigerant circuit 130. Indoor air outside the cabinet server 1 enters the cabinet server 1, undergoes heat exchange with the heat-generating components within the cabinet server 1, such as absorbing heat. Then, under the action of the fan 120, it exchanges heat with the water cooling circuit 110 and the refrigerant circuit 130 before being discharged. The cooled air is then discharged back into the indoor environment outside the cabinet server 1 to ensure that the indoor ambient temperature does not rise too high, thereby keeping the temperature of the air entering the cabinet server 1 from the indoor environment low. Furthermore, after being balanced with the indoor environment, the temperature of the air entering the cabinet server 1 becomes more uniform, further facilitating heat dissipation. By adopting the form of exhaust, the wind in the indoor environment can be introduced into the interior of the cabinet server 1 from different directions of the cabinet server 1 and flow to the water cooling circuit 110 and the refrigerant circuit 130 to achieve the overall cooling effect.

[0059] In some embodiments, multiple liquid cooling plates 20 are provided, and multiple drive pumps are provided corresponding to the liquid cooling plates 20. Each drive pump corresponds to at least one liquid cooling plate 20, and each drive pump is connected between the first heat exchange channel and the corresponding liquid cooling plate 20. After the heat generated by the heating element 11 is absorbed by the liquid cooling plate 20, it is driven by the drive pump and flows to the second heat exchanger of the plug-in frame refrigeration module 30, where it exchanges heat with the evaporation end of the refrigerant circuit 130. The cooled cooling water is then redistributed to each liquid cooling plate 20 for heat absorption, completing the cycle. Specifically, each liquid cooling plate 20 is equipped with a separate drive pump, and a smaller drive pump can meet the requirements, thus solving the installation space problem.

[0060] In some embodiments, the frame cooling module 30 is installed at the bottom of the cabinet server 1, which can not only prevent leakage at the connection point, but also make the center of gravity of the cabinet server 1 lower and more stable.

[0061] In some embodiments, the cooling module 30 is provided with a slide rail for slidingly connecting to the rack server 1. The structure of the slide rail is not specifically limited herein, and either a track structure or a channel structure may be employed. The provision of the slide rail facilitates the removal and extension of the cooling module 30 for installation or maintenance.

[0062] Based on the liquid cooling system provided in the above embodiments, the present invention further provides a cabinet server, which includes any of the liquid cooling systems in the above embodiments. Since the cabinet server uses the liquid cooling system in the above embodiments, the beneficial effects of the cabinet server can be referred to in the above embodiments.

[0063] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0064] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid cooling system for a cabinet server, characterized in that: include: A backplane cooling module, comprising a fan, a water cooling circuit and a refrigerant circuit, wherein the water cooling circuit and the refrigerant circuit are respectively arranged on one side of the cabinet server, and the fan is used to drive airflow to flow to the water cooling circuit and the refrigerant circuit for heat exchange; At least one liquid cooling plate, each of which is respectively disposed in contact with a heating element of the cabinet server; The frame cooling module includes a compressor, a condensing plate heat exchanger and a cooling tower outside the cabinet server, respectively arranged in the cabinet server, the condensing plate heat exchanger has a water cooling channel and a refrigerant channel for heat exchange, the refrigerant channel is connected to the refrigerant circuit, and each of the liquid cooling plates, the water cooling channel and the water cooling circuit is connected in parallel and respectively connected to the cooling tower.

2. The liquid cooling system for a cabinet server according to claim 1, characterized in that: The inlet and outlet ends of the water cooling circuit are respectively connected to the first valve and the second valve, and the inlet and outlet ends of the water cooling channel are respectively connected to the third valve and the fourth valve; when the first valve and the second valve are both opened and at least one of the third valve and the fourth valve is closed, the water cooling circuit is connected to the cooling tower, and the water cooling channel is disconnected from the cooling tower; when at least one of the first valve and the second valve is closed and the third valve and the fourth valve are both opened, the water cooling circuit is disconnected from the cooling tower, and the water cooling channel is connected to the cooling tower.

3. The liquid cooling system for a cabinet server according to claim 2, characterized in that: Both ends of the water cooling channel are connected through a bypass branch, and one end of the bypass branch is connected to the water cooling channel through a first three-way valve, and the first three-way valve is used to adjust the flow of the water cooling channel.

4. The liquid cooling system for a cabinet server according to claim 1, characterized in that: It also includes a second three-way valve, the three ports of which are respectively connected to the outlet end of the water cooling channel, the outlet end of the water cooling circuit and the inlet of the cooling tower, and the second three-way valve is used to control the flow of the water cooling channel and the water cooling circuit and the connection and disconnection with the cooling tower.

5. The liquid cooling system for a cabinet server according to claim 1, characterized in that: It also includes a temperature sensor for detecting the ambient temperature inside the cabinet server, and the compressor is used to shut down when the temperature detected by the temperature sensor is lower than a first preset temperature, and the cooling tower is connected to the water cooling circuit and disconnected from the water cooling channel; the compressor is used to start when the temperature detected by the temperature sensor is greater than or equal to the first preset temperature, and the cooling tower is disconnected from the water cooling circuit and connected to the water cooling channel.

6. The liquid cooling system for a cabinet server according to claim 1, characterized in that: The water cooling circuit and the refrigerant circuit are stacked front and back and attached to the back plate of the cabinet server, and the refrigerant circuit is close to the fan.

7. The liquid cooling system for a cabinet server according to any one of claims 1 to 6, characterized in that: The cooling tower is a closed cooling tower or an open cooling tower.

8. The liquid cooling system for a cabinet server according to any one of claims 1 to 6, characterized in that: The cooling tower includes a wet coil arranged on the outside and a dry coil located inside the wet coil. A spray water pipe, a spray pump and a water collection tank are provided corresponding to the wet coil. The inlet of the cooling tower is the inlet of the dry coil, the outlet of the dry coil is connected to the inlet of the wet coil, and the outlet of the wet coil is the outlet of the cooling tower.

9. The liquid cooling system for a cabinet server according to any one of claims 1 to 6, characterized in that: The frame refrigeration module is arranged at the bottom end of the cabinet server.

10. A cabinet server, characterized in that: Comprising a liquid cooling system as described in any one of claims 1-9.

Images