Solar cell module and preparation method therefor, photovoltaic device, electric apparatus, and power generation apparatus

Abstract

The present application relates to a solar cell module and a preparation method therefor, a photovoltaic device, an electric apparatus, and a power generation apparatus. In two adjacent sub-cells, a conductor is connected to a conductive layer of one of the sub-cells, and at least part of the conductor protrudes out of at least one end of the conductor in a second direction. In this case, an electrode layer of the other sub-cell can be connected, outside the sub-cell, to the protruding portion of the conductor, so that series connection between the two sub-cells can be achieved outside the sub-cell. Two scribing operations that conventionally need to be carried out before the deposition of the electrode layer in order to achieve series connection are omitted, and only a cutting operation between the sub-cells needs to be carried out. According to the design, the conductor protrudes from at least one end of the conductive layer in the second direction, so that the two scribing operations before the series connection of the sub-cells can be omitted, thereby facilitating the implementation of a one-time cutting preparation mode, simplifying the preparation process, and improving the preparation efficiency. In addition, the omission of the two scribing operations before series connection can reduce the probability of the increase of series resistance between the sub-cells, thereby improving the performance of the module.

Description

Solar cell assembly and preparation method thereof, photovoltaic equipment, power-consuming device and power-generating device Related applications

[0001] This application claims priority to Chinese patent application No. 2023116292812, filed on November 30, 2023, entitled “Solar cell assembly and preparation method thereof, photovoltaic equipment, electrical device and power generation device,” the entire text of which is hereby incorporated by reference. Technical Field

[0002] The present application relates to the technical field of solar cells, and in particular to solar cell modules and preparation methods thereof, photovoltaic equipment, power-consuming devices, and power-generating devices. Background Art

[0003] Solar cell modules are devices that use the photovoltaic effect to convert light energy into electrical energy. During the manufacturing process, scribe lines are typically used to connect the subcells in the module in series. For example, the P1 scribe line separates the conductive layer; the P2 scribe line separates the semiconductor layer and the upper and lower transmission layers, while allowing the metal electrode layer to contact the conductive layer; and the P3 scribe line disconnects two adjacent subcells.

[0004] However, due to the limitations of the structural design of traditional solar cell modules, their preparation methods are complicated, which makes it easy to damage the structure of the solar cell module during the engraving process, thereby reducing the performance of the solar cell module. Summary of the Invention

[0005] Based on this, it is necessary to provide a solar cell module and its preparation method, photovoltaic equipment, power-consuming device and power generation device to simplify the preparation process; at the same time, during the preparation process, reduce the probability of cutting the structure of the solar cell module, so as to improve the performance of the module.

[0006] In the first aspect, the present application provides a solar cell assembly, comprising: at least two sub-cells, spaced apart along a first direction, and each sub-cell comprising a stacked conductive layer, a functional layer group and an electrode layer; wherein the solar cell assembly further comprises a conductor, wherein in two adjacent sub-cells, the conductor is connected to the conductive layer of one of the sub-cells and at least partially protrudes out of at least one end of the current conductive layer along a second direction, and the portion of the conductor protruding out of the conductive layer is connected to the electrode layer of the other sub-cell, the first direction intersects with the second direction, and the plane formed by the two intersects with the thickness direction of the solar cell assembly.

[0007] In the above-mentioned solar cell assembly, in two adjacent sub-cells, a conductor is connected to the conductive layer of one of the sub-cells, and the conductor is at least partially protruded outside at least one end of the conductive layer along the second direction. That is, the conductor is at least partially located outside the sub-cell, and at this time, the electrode layer of the other sub-cell can be connected to the protruding portion of the conductor outside the sub-cell. In this way, the series connection between the two sub-cells can be achieved outside the sub-cell, eliminating the traditional two-line scribing operation before the electrode layer deposition to achieve series connection. Only the cutting operation between the sub-cells is required. With this design, the conductor is protruded at at least one end of the conductive layer along the second direction, and the two scribing lines before the sub-cells are connected in series can be eliminated, which facilitates the one-time cutting preparation method, simplifies the preparation process, and improves preparation efficiency. At the same time, eliminating the two scribing lines before the series connection can reduce the probability of cutting damage to the conductive layer, effectively reduce the probability of increased series resistance between the sub-cells, and improve the performance of the assembly.

[0008] In some embodiments, the conductor is disposed on a side of the conductive layer facing the functional layer group and extends beyond at least one end of the conductive layer along the second direction. This design, in which the conductor is disposed on a side of the conductive layer, facilitates rapid current conduction through the conductor along the second direction across the conductive layer, thereby reducing resistance during current conduction and improving component performance.

[0009] In some embodiments, the ends of the conductor in a sub-cell correspond to opposite ends of the protruding conductive layer along the second direction, and at least one of the ends of the conductor is connected to the electrode layer of an adjacent sub-cell. For example, the ends of the conductor can be designed to extend outside the conductive layer to facilitate connection of the electrode layer of the adjacent sub-cell to the conductive layer of the sub-cell via the protruding portion of the conductor, thereby achieving series connection between the sub-cells.

[0010] In some embodiments, one of the two ends of the conductor of a sub-cell protrudes beyond an end of the conductive layer along the second direction. This design allows the electrode layer of an adjacent sub-cell to be connected to the conductive layer of the sub-cell through one end of the conductor, thereby achieving series connection between the sub-cells.

[0011] In some embodiments, the conductor includes a first component and a second component. The first component and the second component are arranged discontinuously. The first component and the second component respectively protrude beyond the ends of the conductive layer of the sub-cell in the second direction and are connected to the electrode layer of the adjacent sub-cell. This design facilitates series connection between two adjacent sub-cells by disconnecting the first and second components.

[0012] In some embodiments, a groove is formed between two adjacent sub-cells, and the conductor is located on one side of the groove along the first direction and is disposed on the conductive layer. This design facilitates connection between the electrode layer and the conductor, thereby achieving series connection between the sub-cells.

[0013] In some embodiments, the solar cell assembly includes multiple grooves and multiple conductors, with at least one conductor located between two adjacent grooves. This design positions the conductors between two adjacent grooves, facilitating sequential connection of the electrode layers and the conductors to form a series connection.

[0014] In some embodiments, the size of the conductor along the first direction is smaller than the size of the conductive layer along the first direction. This design reduces the dead zone on the conductive layer by controlling the size relationship between the conductor and the conductive layer, which is beneficial to improving the performance of the component.

[0015] In some embodiments, the dimension of the conductor along the first direction is denoted as W, where 30 μm ≤ W ≤ 200 μm. This design allows the dimension of the conductor in the first direction to be controlled between 30 μm and 200 μm, ensuring rapid current flow while controlling the dead zone on the conductive layer, thereby improving the performance of the solar cell module.

[0016] In some embodiments, the dimension W further satisfies the condition: 80 μm ≤ W ≤ 100 μm. With this design, the dimension of the conductor in the first direction is further controlled to be between 80 μm and 100 μm, so that the design of the conductor can more effectively balance its own conductive performance and the effective area on the conductive layer.

[0017] In some embodiments, the conductor's thickness dimension is denoted as h, where h > 0 nm. This design introduces a conductor to achieve series connection between the two sub-cells, replacing the traditional P1 and P2 scribe lines. This simplifies the manufacturing process, effectively reduces the risk of damage to the solar cell module, and improves module performance.

[0018] In some embodiments, the dimension h further satisfies the condition: h≥40 nm. With such a design, the thickness of the conductor is controlled to be above 40 nm, so that the conductor has better conductivity.

[0019] In some embodiments, the dimension h further satisfies the condition: 40 nm ≤ h ≤ 300 nm. With this design, the conductor's thickness dimension is controlled within a range of 40 nm to 300 nm, ensuring the structural stability of the solar cell module while providing a good current carrying capacity.

[0020] In some embodiments, the dimension h also satisfies the condition: 50nm ≤ h ≤ 150nm. This design controls the conductor's thickness dimension to between 40nm and 300nm, ensuring the solar cell module's structural stability while providing improved current handling capacity. In some embodiments, the dimension h also satisfies the condition: 80nm ≤ h ≤ 150nm. This design further controls the conductor's thickness dimension to between 80nm and 150nm, further improving the solar cell module's current handling capacity while ensuring structural stability, thereby enhancing module performance.

[0021] In some embodiments, the electrical conductivity of the conductor is greater than or equal to the electrical conductivity of the conductive layer. This design and reasonable design of the electrical conductivity of the conductor facilitate rapid current transfer on the conductor, thereby improving the electrical conductivity of the component.

[0022] In some embodiments, the electrical conductivity of the conductor is ≥5×10 6 S / m. This design and reasonable design of the electrical conductivity of the conductor facilitate rapid current transfer on the conductor, thereby improving the conductive performance of the component.

[0023] In some embodiments, the material of the conductor can be a metal element, such as silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, cobalt, nickel, potassium, lithium, iron, platinum, tin, etc.; it can also be a non-metallic material, such as carbon fiber, zinc oxide, conductive polymer material, conductive polymer material, conductive ceramic material, etc.

[0024] In some embodiments, the conductive layer includes at least one of indium-doped tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, lanthanide metal-doped indium oxide, antimony-doped tin oxide, boron-doped zinc oxide, indium zinc oxide, gallium zinc oxide, and indium tungsten oxide. With this design, the conductive layer material is appropriately selected, resulting in the conductive layer having good electrical conductivity.

[0025] In some embodiments, each electrode layer includes a main portion and a connecting portion connected to the main portion. The main portion is located on the side of the functional layer group facing away from the conductive layer, and the connecting portion is located on at least one side of the sub-cell along the second direction. In two adjacent sub-cells, the connecting portion of one sub-cell is connected to the conductor of the other sub-cell. This design divides the electrode layer into a main portion and a connecting portion, with the main portion covering the functional layer group, facilitating current convergence onto the main portion. Simultaneously, the connecting portion facilitates connection between the electrode layer and the conductor of the next sub-cell along the current direction, achieving stable series connection between the sub-cells.

[0026] In some embodiments, opposite ends of the functional layer group along the second direction extend beyond the conductive layer in the second direction. This design allows the functional layer group to cover the conductive layer in the second direction, preventing the conductive layer from being exposed in the second direction. This reduces the risk of short circuits caused by direct contact between the electrode layer and the conductive layer.

[0027] In some embodiments, the solar cell assembly further includes a substrate, and the conductive layer is disposed on the substrate. In this way, the substrate is introduced to facilitate support and protection of the functional layer group.

[0028] In some embodiments, the functional layer group includes a first transport layer, a perovskite layer, and a second transport layer stacked in sequence, with the first transport layer disposed on the conductive layer, and the electrode layer disposed on the second transport layer. In this manner, the introduction of the first transport layer, the perovskite layer, and the second transport layer facilitates the formation of a stable perovskite cell assembly.

[0029] In some embodiments, the first transport layer is a hole transport layer, and the second transport layer is an electron transport layer. This design can form a solar cell module with an inverted structure.

[0030] In some embodiments, the first transport layer is an electron transport layer, and the second transport layer is a hole transport layer. With this design, a solar cell module with a formal structure can be formed.

[0031] In a second aspect, the present application provides a method for preparing a solar cell module, comprising the following steps: forming a conductive layer extending along a first direction on a substrate; arranging a conductor on the conductive layer, wherein the conductor at least partially protrudes from at least one end of the conductive layer along a second direction, the first direction intersects with the second direction, and a plane formed by the two intersects with the thickness direction of the solar cell module; sequentially forming a functional layer group and an electrode layer on the conductive layer, and connecting the electrode layer to the portion of the conductor protruding from the conductive layer; and cutting the electrode layer at one side of the conductor along the first direction, and cutting to the substrate.

[0032] In the above-mentioned method for preparing a solar cell assembly, when forming the conductor, the conductor is at least partially protruded outside at least one end of the conductive layer along the second direction. That is, the conductor is at least partially located outside the sub-cell. At this time, the electrode layer of another sub-cell can be connected to the protruding portion of the conductor outside the sub-cell. In this way, the series connection between the two sub-cells can be achieved outside the sub-cell, eliminating the traditional two-line scoring operation before the electrode layer is deposited to achieve series connection. Only the cutting operation between the sub-cells is required. With this design, the conductor is formed at at least one end of the conductive layer along the second direction, and the two scoring operations before the sub-cells are connected in series can be eliminated, which facilitates the one-time cutting preparation method, simplifies the preparation process, and improves preparation efficiency. At the same time, eliminating the two scoring operations before the series connection can reduce the damage to the conductive layer caused by cutting, effectively reducing the probability of increased series resistance between the sub-cells, and improving the performance of the assembly.

[0033] In some embodiments, the step of providing a conductor on the conductive layer includes forming the conductor on a side of the conductive layer facing away from the substrate, and controlling at least one end of the conductor to extend outside the conductive layer in the second direction. Forming the conductor on one side of the conductive layer facilitates rapid current conduction along the second direction through the conductor, thereby reducing resistance during current conduction and improving component performance.

[0034] In some embodiments, in the step of forming a conductor on a side of the conductive layer facing away from the substrate, the conductors include a plurality of conductors, at least some of which are spaced apart along the first direction on the conductive layer. This design, with the plurality of conductors, facilitates stable series connection of the sub-cells formed by cutting.

[0035] In some embodiments, the steps of sequentially forming a functional layer group and an electrode layer on the conductive layer and connecting the electrode layer to the portion of the conductor protruding from the conductive layer include: forming the functional layer group on the conductive layer; forming a main portion of the electrode layer on the side of the functional layer group facing away from the conductive layer, and forming a connecting portion of the electrode layer at at least one end of the functional layer group along the second direction, wherein the conductor has a connecting portion on both sides along the first direction, and the conductor is connected to one of the connecting portions and disconnected from the other connecting portion. In this design, the electrode layer is designed as a main portion and a connecting portion, and the main portion is used to cover the functional layer group, so that current is easily collected on the main portion. At the same time, the connecting portion facilitates the connection between the electrode layer and the conductor, thereby achieving stable series connection between the sub-cells.

[0036] In some embodiments, after forming a conductive layer extending along a first direction on a substrate, the process further includes etching at least one edge of the conductive layer along a second direction onto the substrate to form an etched region, wherein the etched region does not contain the conductive layer. In this manner, etching reduces the effective area of ​​the conductive layer, allowing the functional layer group to cover the conductive layer in the second direction during subsequent synthesis, thereby preventing direct contact between the electrode layer and the conductive layer, thereby reducing the risk of short circuits caused by direct contact between the electrode layer and the conductive layer during formation.

[0037] In some embodiments, the step of forming a conductive layer extending along a first direction on a substrate includes: covering at least one edge of the substrate surface along a second direction with a mask; and forming the conductive layer on the substrate with the mask. In this manner, the mask reduces the effective area of ​​the conductive layer, allowing the functional layer group to cover the conductive layer in the second direction during subsequent synthesis, thereby preventing direct contact between the electrode layer and the conductive layer, thereby reducing the risk of short circuits caused by direct contact between the electrode layer and the conductive layer during formation.

[0038] In a third aspect, the present application provides a photovoltaic device, which includes any one of the above solar cell modules.

[0039] In a fourth aspect, the present application provides an electrical device, which includes any one of the above solar cell modules.

[0040] In a fifth aspect, the present application provides a power generation device, which includes the solar cell assembly described in any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without creative work.

[0042] FIG1 is a front view of the structure of a solar cell assembly described in some embodiments of the present application.

[0043] FIG2 is a top view of the structure of a solar cell assembly described in some embodiments of the present application.

[0044] FIG3 is a front view of the structure of a solar cell assembly described in some other embodiments of the present application.

[0045] FIG4 is a schematic diagram of the structure of the conductor on the conductive layer described in some embodiments of the present application.

[0046] (a) and (b) in FIG5 are schematic structural diagrams of different distributions of conductors on the conductive layer described in other embodiments of the present application.

[0047] FIG6 is a schematic structural diagram of a conductor on a conductive layer according to some other embodiments of the present application.

[0048] FIG7 is an enlarged schematic diagram of the structure at circle A in FIG2 .

[0049] (a) and (b) in FIG8 are current trend analysis diagrams in a solar cell module under different views, respectively.

[0050] FIG9 is a first schematic diagram of the preparation process of the solar cell assembly described in some embodiments of the present application.

[0051] FIG10 is a schematic structural diagram of a conductive layer formed on a substrate according to some embodiments of the present application.

[0052] FIG11 is a schematic structural diagram of a functional layer group formed on a conductive layer according to some embodiments of the present application.

[0053] FIG12 is a schematic structural diagram of an electrode layer formed on a functional layer group described in some embodiments of the present application.

[0054] FIG13 is a second schematic diagram of the preparation process of the solar cell assembly described in some embodiments of the present application.

[0055] FIG14 is a third schematic diagram of the preparation process of the solar cell assembly described in some embodiments of the present application.

[0056] FIG15 is a fourth schematic diagram of the preparation process of the solar cell assembly described in some embodiments of the present application.

[0057] 100, solar cell module; 10, substrate; 11, etched area; 20, subcell; 21, conductive layer; 22, functional layer group; 221, first transport layer; 222, perovskite layer; 223, second transport layer; 23, electrode layer; 231, main body; 232, connecting portion; 23a, first portion; 23b, second portion; 233, disconnect gap; 2a, first subcell; 2a1, first conductive layer; 2a2, first functional layer group; 2a3, first electrode layer; 2b, second subcell; 2b1, second conductive layer; 2b2, second functional layer group; 2b3, second electrode layer; 30, groove; 40, conductor; 41, first component; 42, second component; X, first direction; Y, second direction; Z, thickness direction DETAILED DESCRIPTION

[0058] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0059] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0060] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0061] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0062] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0063] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0064] With the development of science, breakthroughs have been made in the development of new energy sources. For example, solar cells represented by perovskite and organic thin-film batteries have made disruptive progress. These solar cells are expected to replace silicon-based solar cells because of their advantages such as high efficiency and low cost.

[0065] To achieve the appropriate voltage and current output for solar cell modules, laser or mechanical scribing is often used to separate and connect the sub-cells in series. For example, a conductive layer is deposited on a substrate, and a P1 line is scribed on the conductive layer using a laser or mechanical scribing method to complete the separation of the conductive layer. Next, the first transport layer, semiconductor layer, and second transport layer are deposited. The semiconductor layer can be a perovskite layer, for example. Finally, a P2 line is scribed using a laser or mechanical scribing method to complete the P2 line, which is the channel for the series connection of the sub-cells. Finally, the top electrode film is deposited, and a P3 line is scribed using a laser or mechanical scribing method to disconnect the adjacent sub-cells.

[0066] Due to structural design flaws in traditional solar cell modules, P1 and P2 line marking operations are required before sub-cells can be connected in series. Furthermore, when marking the P2 line, if the marking energy is too low, the two transmission layers and the semiconductor layer cannot be cut through, resulting in the transmission layer or the semiconductor layer being easily left behind. This prevents the electrode layer from directly contacting the conductive layer. For example, if the marking energy is too low, the perovskite layer is likely to remain, hindering sufficient contact between the electrode and the conductive layer and affecting device performance. If the marking energy is too high, the conductive layer is easily scratched, which also increases the series resistance between the sub-cells and reduces module performance.

[0067] Based on this, in order to solve the problems that the preparation process of traditional solar cell modules is complicated and easily leads to an increase in the series resistance of sub-cells, the present application provides a solar cell module. In two adjacent sub-cells, a conductor is connected to the conductive layer of one of the sub-cells, and the conductor is at least partially protruded outside at least one end of the conductive layer along the second direction. That is, the conductor is at least partially located outside the sub-cell. At this time, the electrode layer of the other sub-cell can be connected to the protruding part of the conductor outside the sub-cell. In this way, the series connection between the two sub-cells can be achieved outside the sub-cell, eliminating the traditional two-line scribing operation before the electrode layer is deposited to achieve series connection. Only the cutting operation between the sub-cells is required. With this design, the conductor is protruded at at least one end of the conductive layer along the second direction, and the two scribing lines before the sub-cells are connected in series can be eliminated, which facilitates the one-time cutting preparation method, simplifies the preparation process, and improves the preparation efficiency. At the same time, eliminating the two scribing lines before the series connection can reduce the cutting damage to the conductive layer, effectively reduce the probability of increasing the series resistance between the sub-cells, and improve the performance of the module.

[0068] The present invention provides an electric device that uses a battery as a power source. The electric device may include, but is not limited to, a tablet, a laptop computer, an electric toy, an electric tool, a battery-powered vehicle, an electric car, a ship, a spacecraft, a space station, etc. The electric toy may include a fixed or mobile electric toy, such as a game console, an electric car toy, an electric ship toy, and an electric airplane toy.

[0069] According to some embodiments of the present application, please refer to Figures 1 and 2. The present application provides a solar cell assembly 100, which includes at least two sub-cells 20 and a conductor 40. The sub-cells 20 are spaced apart along a first direction X, and each sub-cell 20 includes a stacked conductive layer 21, a functional layer group 22, and an electrode layer 23. Among them, in two adjacent sub-cells 20, the conductor 40 is connected to the conductive layer 21 of one of the sub-cells 20 and at least partially protrudes outside at least one end of the current conductive layer 21 along the second direction Y. The portion of the conductor 40 protruding outside the conductive layer 21 is connected to the electrode layer 23 of the other sub-cell 20. The first direction X intersects with the second direction Y, and the plane formed by the two intersects with the thickness direction Z of the solar cell assembly 100.

[0070] The conductive layer 21 can be a transparent conductive oxide film, which has an average transmittance of more than 80% in the visible light range (wavelength 380 nm to 760 nm corresponding to energy 3.26 eV to 1.63 eV), high conductivity, and resistivity less than 1×10 -3 Ω·cm (ohm·cm). There are many materials to choose from, such as but not limited to indium doped tin oxide (ITO), fluorine doped tin oxide (FTO), aluminum doped zinc oxide (AZO), lanthanide metal-doped indium oxide, antimony-doped tin oxide, boron-doped zinc oxide (BZO), indium zinc oxide (IZO), gallium zinc oxide (GZO), indium tungsten oxide (IWO), etc.

[0071] The functional layer group 22 refers to the core structure of the solar cell module 100 and is a component that can convert absorbed light energy into electrical energy. Taking the perovskite solar cell module as an example, the functional layer group 22 may include a first transmission layer 221, a perovskite layer 222, and a second transmission layer 223. The first transmission layer 221 and the second transmission layer 223 refer to layer structures stacked on either side of the perovskite layer, respectively, and primarily function to transport electrons or holes. The first transmission layer 221 can be an electron transmission layer, and the second transmission layer 223 can be a hole transmission layer. In this case, the solar cell module 100 is a nip type (formal structure); alternatively, the first transmission layer 221 can be a hole transmission layer, and the second transmission layer 223 can be an electron transmission layer. In this case, the solar cell module 100 is a pin type (transverse structure). In addition to transmitting electrons, the electron transmission layer can also block holes. There are many options for its material, such as TiO2, ZnO, SnO2, or organic materials (such as PCBM, C60, etc.). In addition to transporting holes, the hole transport layer can also block electrons. Its material can be but is not limited to spiro-OMeTAD, PTAA (poly[bis(4-phenyl)(2,4,6-trimethylphenyl)amine]), nickel oxide, etc.

[0072] In one embodiment, at least one of the first transmission layer 221 , the perovskite layer 222 , and the second transmission layer 223 may be modified according to actual needs, or a modified layer, such as a passivation layer, may be added between any two layers.

[0073] The electrode layer 23 is also called the metal electrode layer 23 or the back electrode. Its material can be, but is not limited to, Ag, Au, Pt, Cu, etc. The sub-cells 20 are spaced apart along the first direction X. For example, there are grooves 30 between adjacent sub-cells 20. This is to separate the overall conductive layer 21 into multiple structures, thereby reducing the resistance of the sub-cells 20. At the same time, it can also separate the electrode layers 23 from each other, preventing direct connection between adjacent electrode layers 23.

[0074] Separate sub-cells 20 need to be connected in series. Traditionally, this approach involves first scribbling lines on the conductive layer 21, dividing it into multiple sections along the first direction X. Next, the functional layer group 22 is deposited. After deposition, lines are scribed on the functional layer group 22 to expose the bottom conductive layer 21. This allows the electrode layer 23 to contact the conductive layer 21 of the next sub-cell 20 during deposition, achieving series connection. However, this approach is not only complex but also prone to damaging the conductive layer 21, impacting component performance.

[0075] To this end, in this embodiment, a conductor 40 is provided at at least one end of the conductive layer 21 along the second direction Y, which is equivalent to extending the conductive layer 21 outward so that the electrode layer 23 is connected in series with the conductive layer 21 outside the sub-battery 20. This eliminates the need to scribe lines on the conductive layer 21 and the functional layer. It should be noted that when the electrode layer 23 is connected to the conductive layer 21 through the conductor 40, the two adjacent electrode layers 23 are disconnected and not directly connected. At the same time, in the same sub-battery 20 having a conductor 40, the conductor 40 and the electrode layer 23 in the same sub-battery 20 cannot be directly connected. If the two are directly connected, direct conduction will occur between the conductive layer 21 and the electrode layer 23 in the same sub-battery 20, resulting in a short circuit in the component.

[0076] The conductor 40 is a component with a conductive function. It can be a structure formed by a protrusion extending outward from the conductive layer 21, or it can be a structure with better conductivity than the conductive layer 21. For example, its material can be, but is not limited to, Ag, Au, Pt, Cu, etc. The conductor 40 can protrude beyond one end of the current conductive layer 21 along the second direction Y, or it can protrude beyond both ends of the current conductive layer 21 along the second direction Y. In this case, the electrode layers 23 of adjacent sub-cells can be connected to the conductors 40 protruding beyond both ends of the conductive layer 21.

[0077] The current conductive layer 21 should be understood as follows: when the conductor 40 is connected to the conductive layer 21, the conductor 40 protrudes beyond at least one end of the conductive layer 21 to which it is connected. The connection between the conductor 40 and the conductive layer 21 can be direct, such as direct contact, or indirect, such as when the conductor 40 and the conductive layer 21 are connected via a conductive component. Furthermore, the first direction X, the second direction Y, and the thickness direction Z intersect with each other in pairs, and the three directions are not in the same plane. In some embodiments, the first direction X, the second direction Y, and the thickness direction Z are perpendicular to each other in pairs.

[0078] To facilitate understanding of the connection relationship between the various sub-cells 20, refer to Figure 3. Sub-cells 20 may include a first sub-cell 2a and a second sub-cell 2b. Of course, the number of sub-cells 20 is not limited to the two shown in Figure 3; it may also be three, four, five, or more. The first sub-cell 2a includes a stacked first conductive layer 2a1, a first functional layer group 2a2, and a first electrode layer 2a3. The second sub-cell 2b includes a stacked second conductive layer 2b1, a second functional layer group 2b2, and a second electrode layer 2b3. A conductor 40 is connected to the second conductive layer 2b1 and at least partially protrudes beyond at least one end of the second conductive layer 2b1 along the second direction Y. The protruding portion of the conductor 40 is connected to the first electrode layer 2a3. This allows the first electrode layer 2a3 in the first sub-cell 2a to communicate with the second conductive layer 2b1 in the second sub-cell 2b via the conductor 40, thereby connecting the first sub-cell 2a and the second sub-cell 2b in series.

[0079] In some examples, the first functional layer group 2a2 and the second functional layer group 2b2 each include a first transmission layer 221, a perovskite layer 222, and a second transmission layer 223 stacked in sequence. Furthermore, to stabilize the circuit and reduce the risk of short circuits, the second electrode layer 2b3 in the second sub-cell 2b cannot be electrically connected to the conductor 40.

[0080] This design, with the conductor 40 protruding from at least one end of the conductive layer 21 along the second direction Y, eliminates the two scribe lines before the sub-cells 20 are connected in series, facilitating a single-cut production process, simplifying the production process, and improving production efficiency. Furthermore, eliminating the two scribe lines before the series connection reduces cutting damage to the conductive layer 21, effectively reducing the likelihood of increased series resistance between the sub-cells 20 and improving component performance.

[0081] According to some embodiments of the present application, referring to FIG. 4 , the conductor 40 is disposed on a side of the conductive layer 21 facing the functional layer group 22 and extends out of at least one end of the conductive layer 21 along the second direction Y.

[0082] The conductor 40 is disposed on a side surface of the conductive layer 21, with at least one end extending outside the conductive layer 21 along the second direction Y. This indicates that at least a portion of the conductor 40 extends along the second direction Y on the conductive layer 21. In this case, current can be rapidly conducted along the second direction Y through the conductor 40, and the conducted current is then conducted to the conductive layer 21. Specifically, in some embodiments, the conductor 40 extends along the second direction Y, with both ends extending outside the conductive layer 21. In this case, the conductor 40 spans the conductive layer 21 in the second direction Y. This allows current to be easily conducted along the second direction Y through the conductor 40, reducing resistance.

[0083] With this design, the conductor 40 is disposed on one side of the conductive layer 21 , so that the current can be quickly conducted along the second direction Y on the conductive layer 21 through the conductor 40 , which is beneficial to reducing the resistance during the current conduction process and improving the performance of the component.

[0084] According to some embodiments of the present application, referring to FIG. 4 , the two ends of the conductor 40 correspond to the two ends of the protruding conductive layer 21 along the second direction Y, and at least one of the two ends of the conductor 40 is connected to the electrode layer 23 in the adjacent sub-cell 20 .

[0085] The distribution of the conductor 40 on the conductive layer 21 can be various, for example: the extension direction of the conductor 40 on the conductive layer 21 is consistent with the second direction Y; or, the extension direction of the conductor 40 intersects with the second direction Y; or, the conductor 40 extends nonlinearly on the conductive layer 21, etc.

[0086] The two ends of the conductor 40 correspond to the two ends of the protruding conductive layer 21 along the second direction Y. Among the two protruding ends, one end may not be connected to the electrode layer 23 of the other sub-cell; of course, the two ends may also be connected to the electrode layer 23 of the other sub-cell.

[0087] In some specific examples, at least one of the ends of the conductor 40 is connected to the electrode layer 23 of the previous sub-cell 20 along the current direction. The current direction refers to the direction of current flowing through each sub-cell 20 sequentially when the solar cell assembly 100 is in operation, such as when exposed to light. For reference, the current direction is the direction from the first sub-cell 2a to the second sub-cell 2b in FIG. In this case, the first electrode layer 2a3 in the first sub-cell 2a is connected to at least one end of the conductor 40 in the second sub-cell 2b.

[0088] With this design, both ends of the conductor 40 are designed to extend out of the conductive layer 21 , so that the electrode layer 23 of another sub-battery 20 can be connected to the conductive layer 21 through the protruding portion of the conductor 40 , thereby achieving series connection between the sub-batteries 20 .

[0089] According to some embodiments of the present application, referring to FIG. 5 , one of the two ends of the conductor 40 protrudes from an end of the conductive layer 21 along the second direction Y.

[0090] The conductors 40 are on the conductive layer 21, with only one end extending outside the conductive layer 21. Specifically, one end protrudes from one end of the conductive layer 21 along the second direction Y, while the other does not. When there are multiple conductors 40, the conductors 40 may extend from the same end of the conductive layer 21, as shown in FIG5(a). Alternatively, some of the conductors 40 may extend from one end of the conductive layer, while others may extend from the other end of the conductive layer 21, as shown in FIG5(b).

[0091] With such a design, the electrode layer 23 and the conductive layer 21 can be connected via one end of the conductor 40 .

[0092] According to some embodiments of the present application, referring to FIG6 , the conductor 40 includes a first component 41 and a second component 42 . The first component 41 and the second component 42 are discontinuously arranged. The first component 41 and the second component 42 protrude from opposite ends of the conductive layer 21 along the second direction Y, and are both connected to the electrode layer 23 in the adjacent sub-cell 20 .

[0093] As can be seen, the conductor 40 has a structure of two or more sections on the conductive layer 21, namely a first component 41 and a second component 42. The first component 41 and the second component 42 can be connected to the electrode layer 23 of the previous sub-cell 20, respectively. In this way, the current of the previous sub-cell 20 can be transferred from the first component 41 and the second component 42 to the conductive layer 21 of the current sub-cell 20, achieving series connection.

[0094] In addition, it should be noted that the first component 41 and the second component 42 are respectively connected to the electrode layer 23 in the adjacent sub-cell 20. This can be understood as: the first component 41 and the second component 42 are respectively connected to the electrode layer 23 of the previous sub-cell 20 along the current direction. Of course, in some examples, it can also be understood that: the sub-cell 20 includes a first sub-cell 2a and a second sub-cell 2b, as shown in Figure 2. The first component 41 and the second component 42 are respectively connected to the first electrode layer 2a3 in the first sub-cell 2a.

[0095] Such a design facilitates the series connection between two adjacent sub-batteries 20 by disconnecting the first component 41 and the second component 42 .

[0096] According to some embodiments of the present application, referring to FIG. 1 , a groove 30 is provided between two adjacent sub-cells 20 . The conductor 40 is located on at least one side of the groove 30 along the first direction X and is provided on the conductive layer 21 .

[0097] The groove 30 is a structure that can separate the two sub-cells 20. During the manufacturing process, the electrode layer 23 can be cut along the thickness direction Z, so that the electrode layer 23, the functional layer group 22 and the conductive layer 21 are divided into multiple structures in the first direction X.

[0098] Although the grooves 30 can form multiple sub-cells 20, the space they occupy creates a dead zone in the solar cell assembly 100, meaning that this area cannot receive photons. Therefore, the dimensions of the grooves 30 along the first direction X should be minimized. For example, the dimension D of the grooves 30 along the first direction X can be, but is not limited to, 30 μm to 100 μm. Of course, in other embodiments, the dimension D of the grooves 30 along the first direction X can also be 40 μm to 50 μm.

[0099] The conductor 40 can be distributed in various locations on the conductive layer 21. For example, the conductor 40 can be adjacent to one side of the groove 30 along the first direction X, which facilitates connection between the electrode layer 23 in the adjacent sub-cell 20 and the conductor 40. The conductor 40 can be located on either side of the groove 30 along the first direction X. For example, in Figure 1 , the conductor 40 can be located on the left side of the groove 30 or on the right side of the groove 30. In some embodiments, the conductor 40 is disposed on a side of the conductive layer 21 facing the functional layer group 22 and is located on one side of the groove 30 along the first direction X. The conductor 40 extends along the second direction Y and extends beyond at least one end of the conductive layer 21 along the second direction Y.

[0100] With this design, the conductor 40 is disposed on one side of the groove 30 , which facilitates the connection between the electrode layer 23 and the conductor 40 , thereby achieving series connection between the sub-batteries 20 .

[0101] According to some embodiments of the present application, a solar cell assembly includes a plurality of grooves 30 and a plurality of conductors 40 , and there is at least one conductor 40 between two adjacent grooves 30 .

[0102] The presence of multiple grooves 30 indicates that there are at least three sub-cells 20 in the first direction X. In this case, the conductors 40 are positioned corresponding to the grooves 30, meaning that each sub-cell 20 located on one side of the groove 30 has at least one conductor 40. Because each sub-cell 20 needs to be connected in series, the first sub-cell 20 may or may not have a conductor 40. For example, in Figure 1, the first sub-cell 20 along the current flow direction is not equipped with a conductor 40, while the remaining sub-cells 20 along the current flow direction are each equipped with at least one conductor 40.

[0103] When each conductor 40 is located on one side of a corresponding groove 30, the electrode layer 23 on one side of the groove 30 is connected to the conductor 40 on the other side of the groove 30 to achieve a sequential series connection between the sub-cells 20. In some embodiments, each conductor 40 can be located on one side of a corresponding groove 30.

[0104] Here, "corresponding groove 30" can be understood as: the groove 30 closest to the conductor 40 is the groove 30 corresponding to the conductor 40. "Same side" means that each groove 30 has two sides in the first direction X, and each conductor 40 is located on the same side of the corresponding groove 30. For ease of understanding, taking Figure 1 as an example, the groove 30 has a left side and a right side in the first direction X. In Figure 1, each conductor 40 is located on the right side of the corresponding groove 30.

[0105] In addition, in addition to the conductors 40 that can be arranged between the grooves 30, a conductor 40 is also required to be arranged on one side of the last groove 30 along the current direction.

[0106] With this design, the conductor 40 is located between two adjacent grooves 30 , which facilitates the sequential connection of each electrode layer 23 and the conductor 40 to form a series connection.

[0107] According to some embodiments of the present application, a size of the conductor 40 along the first direction X is smaller than a size of the conductive layer 21 along the first direction X.

[0108] The conductor 40 disposed on the conductive layer 21 can increase the current conduction area between the two, but it will occupy the effective area on the conductive layer 21, resulting in this area being unable to receive or transmit photons, resulting in a dead zone on the conductive layer 21. To this end, the size of the conductor 40 in the first direction X must be smaller than the size of the conductive layer 21 along the first direction X. Specifically, the size of the conductor 40 in the first direction X is much smaller than the size of the conductive layer 21 along the first direction X.

[0109] With this design, by controlling the size relationship between the conductor 40 and the conductive layer 21 , the dead zone on the conductive layer 21 is reduced, which is beneficial to improving the performance of the component.

[0110] According to some embodiments of the present application, referring to FIG. 1 , a dimension of the conductor 40 along the first direction X is denoted as W, wherein 30 μm≤W≤200 μm.

[0111] The size of the conductor 40 in the first direction X can affect the conductive performance of the conductor 40 and also affect the extent of the dead zone on the conductive layer 21. For example, if the size of the conductor 40 in the first direction X is too small, it will appear elongated, reducing the cross-sectional area for current flow and increasing resistance. If the size is too large, the dead zone on the conductive layer 21 will increase, reducing component performance.

[0112] To this end, the size W may be between 30 μm and 200 μm. For example, the size W may be, but is not limited to, 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, etc.

[0113] With this design, the size of the conductor 40 in the first direction X is controlled between 30 μm and 200 μm, which not only satisfies the rapid flow of current but also controls the size of the dead zone on the conductive layer 21 , thereby improving the performance of the solar cell assembly 100 .

[0114] According to some embodiments of the present application, the size W further satisfies the condition: 80 μm ≤ W ≤ 100 μm.

[0115] The size W may also be between 80 μm and 100 μm, for example, the size W may be but is not limited to 80 μm, 82 μm, 84 μm, 86 μm, 88 μm, 90 μm, 92 μm, 94 μm, 96 μm, 98 μm, 100 μm, etc.

[0116] With this design, the size of the conductor 40 in the first direction X is further controlled to be between 80 μm and 100 μm, so that the design of the conductor 40 can more effectively take into account its own conductive performance and the effective area on the conductive layer 21 .

[0117] According to some embodiments of the present application, referring to FIG. 1 , the dimension of the conductor 40 along the thickness direction Z is denoted as h, where h>0 nm.

[0118] The dimension of the conductor 40 along the thickness direction Z is greater than 0, indicating the existence of the conductor 40 , which realizes the series connection between two adjacent sub-cells 20 and replaces the traditional marking lines P1 and P2 .

[0119] With this design, the conductor 40 is introduced to realize the series connection between the two sub-cells 20, replacing the traditional P1 and P2 marking lines, simplifying the manufacturing process, and effectively reducing the probability of the solar cell module 100 being cut, which is beneficial to improving the performance of the module.

[0120] According to some embodiments of the present application, referring to FIG. 1 , the dimension of the conductor 40 along the thickness direction Z is denoted as h, where h≥40 nm.

[0121] It can be seen that the thickness of the conductor 40 can be controlled to be above 40 nm, so that the conductivity of the conductor 40 itself can reach a certain level, thereby improving the conductive performance of the component.

[0122] With such a design, the thickness of the conductor 40 is controlled to be above 40 nm, so that the conductor 40 has better conductive performance.

[0123] According to some embodiments of the present application, referring to FIG. 1 , the size h further satisfies the condition: 40 nm ≤ h ≤ 300 nm.

[0124] The size of the conductor 40 in the thickness direction Z can affect its conductive properties. For example, if the conductor 40 is too small in the thickness direction Z, its cross-sectional area for current flow is reduced, increasing its resistance. However, this size should not be too large, as it may affect the gap between the conductive layer 21 and the functional layer assembly 22.

[0125] To this end, the size h may be between 40 nm and 300 nm, for example, the size h may be but is not limited to 40 nm, 50 nm, 80 nm, 100 nm, 110 nm, 120 nm, 140 nm, 150 nm, 200 nm, 300 nm, etc.

[0126] With such a design, the size of the conductor 40 in the thickness direction Z is controlled to be between 40 nm and 300 nm, and the solar cell module 100 has a good current carrying capacity while ensuring the structural stability of the solar cell module 100 .

[0127] According to some embodiments of the present application, the size h further satisfies the condition: 50 nm ≤ h ≤ 150 nm.

[0128] The size h can also take a value between 50nm and 150nm. For example, the size h can be but is not limited to 50nm, 60nm, 80nm, 84nm, 88nm, 90nm, 95nm, 100nm, 105nm, 110nm, 115nm, 120nm, 150nm, etc.

[0129] With this design, the size of the conductor 40 in the thickness direction Z is further controlled to be between 50 nm and 150 nm, thereby further improving the current carrying capacity of the solar cell module 100 while ensuring structural stability, thereby improving the performance of the module.

[0130] According to some embodiments of the present application, the size h further satisfies the condition: 80 nm ≤ h ≤ 150 nm.

[0131] The size h can also be between 80 nm and 150 nm. For example, the size h can be but is not limited to 80 nm, 84 nm, 88 nm, 90 nm, 95 nm, 100 nm, 105 nm, 110 nm, 115 nm, 120 nm, 150 nm, etc.

[0132] With this design, the size of the conductor 40 in the thickness direction Z is further controlled to be between 80 nm and 150 nm, thereby further improving the current carrying capacity of the solar cell module 100 while ensuring structural stability, thereby improving the performance of the module.

[0133] According to some embodiments of the present application, referring to Figures 3 and 7 , each electrode layer 23 includes a main portion 231 and a connecting portion 232 connected to the main portion 231. The main portion 231 is disposed on the side of the functional layer group 22 facing away from the conductive layer 21, and the connecting portion 232 is located on at least one side of the sub-cell 20 along the second direction Y. In two adjacent sub-cells 20, the connecting portion 232 of one sub-cell 20 is connected to the conductor 40 of the other sub-cell 20.

[0134] The main portion 231 covers the side of the functional layer assembly 22 facing away from the conductive layer 21 , while the connecting portion 232 is located on at least one side of the sub-cell 20 along the second direction Y. For example, the connecting portion 232 may extend at least partially along the thickness direction Z, with one end connected to the main portion 231 and the other end connected to the conductor 40 .

[0135] Furthermore, during the preparation of the electrode layer 23, the main body 231 should not extend beyond the functional layer assembly 22. For example, referring to Figures 3 and 7 , both opposite ends of the main body 231 along the second direction Y do not extend beyond the functional layer assembly 22. If they do, the main body 231 may connect to the conductor 40, resulting in a short circuit.

[0136] When the connection portion 232 is located on at least one side of the sub-cell 20 along the second direction Y, the connection portion 232 should not contact the conductive layer 21 in the same sub-cell 20, thereby reducing the risk of a short circuit in the same sub-cell 20. Furthermore, in two adjacent sub-cells 20, attention should be paid to the structural design between the electrode layers 23 and the electrode layers 23. For example, when the connection portion 232 is connected to the conductor 40 in the next sub-cell 20 along the current flow direction, it should be noted that the connection portion 232 of the conductor 40 in the same sub-cell 20 should be disconnected to prevent the connection between the two and the conductor 40, which would cause a short circuit. Of course, for ease of understanding, please refer to Figure 3. The sub-cell 20 may include a first sub-cell 2a and a second sub-cell 2b. The first electrode layer 2a3 of the first sub-cell 2a and the second electrode layer 2b3 of the second sub-cell 2b both include a main portion 231 and a connection portion 232 connected to the main portion 231. The conductor 40 is disposed on the second conductive layer 2b1 of the second sub-cell 2b. The connection portion 232 of the first electrode layer 2 a 3 is connected to the conductor 40 , and the second electrode layer 2 b 3 is not electrically connected to the conductor 40 .

[0137] In the same electrode layer 23 , there can be one or two connecting portions 232 . When there are two connecting portions 232 , the two connecting portions 232 are respectively connected to opposite sides of the main body 231 , and the two connecting portions 232 are respectively located on opposite sides of the sub-cell 20 along the second direction Y.

[0138] When the connecting portion 232 connects to the adjacent conductor 40 and completes the series connection between the sub-cells 20, the current flow in the solar cell assembly 100 can be seen in Figures 8(a) and 8(b). In Figure 8(a), current is sequentially conducted from the conductive layer 21 along the thickness direction Z to the main portion 231 of the electrode layer 23. In Figure 8(b), the current in the main portion 231 flows to the connecting portions 232 on both sides and then to the conductor 40 in the next sub-cell 20. The current in the conductor 40 is then rapidly conducted to the conductive layer 21 in the same sub-cell 20. The current in the conductive layer 21 is then sequentially conducted along the thickness direction Z to the main portion 231 of the electrode layer 23, and this process repeats.

[0139] Furthermore, the shape of the connecting portion 232 can be designed in a variety of ways, as long as it can connect to the conductor 40 of the adjacent sub-cell 20. For example, the connecting portion 232 may include a first portion 23a and a second portion 23b. The first portion 23a is connected to the main portion 231, and the first portion 23a at least partially protrudes along the second direction Y and away from the main portion 231. The second portion 23b is connected between the first portion 23a and the conductor 40. In some examples, when cutting the electrode layer 23, the cutting may be performed at a location between the connected first portion 23a and the conductor 40. That is, the groove 30 formed may be located at the interconnected first portion 23a and the conductor 40.

[0140] In this design, the electrode layer 23 is designed to be composed of a main body 231 and a connecting portion 232. The main body 231 is used to cover the functional layer group 22, so that the current is easily collected on the main body 231. At the same time, the connecting portion 232 is used to facilitate the connection between the electrode layer 23 and the conductor 40, thereby realizing stable series connection between the sub-batteries 20.

[0141] According to some embodiments of the present application, referring to FIG. 7 , in the same sub-cell 20 having the conductor 40 , there is no short circuit between the electrode layer 23 and the conductor 40 .

[0142] The electrode layer 23 and the conductor 40 are not short-circuited. This means that the portion of the electrode layer 23 that extends beyond the functional layer group 22 along a direction intersecting the thickness direction Z of the solar cell module 100 (e.g., the first direction X or the second direction Y) will not be short-circuited with the conductor 40. In this case, the conductor 40 is not directly electrically conductive with the electrode layer 23 in the same sub-cell 20, thereby reducing the risk of short-circuiting. Instead, the conductor 40 is electrically conductive with the electrode layer 23 of the adjacent sub-cell 20, for example, the conductor 40 is connected to the electrode layer 23 of the previous sub-cell 20 in the current direction. In some embodiments, the electrode layer 23 includes a main body 231 and a connecting portion 232 connected to the main body 231. The conductor 40 is connected to the connecting portion 232 of the previous sub-cell 20 in the current direction, but is not connected to the main body 231 and the connecting portion 232 on the same sub-cell 20.

[0143] The electrode layer 23 and the conductor 40 in the same sub-cell 20 are not short-circuited, so that in the same sub-cell 20, the current flows sequentially through the conductor 40, the conductive layer 21, the functional layer group 22, and the electrode layer 23; or, alternatively, flows sequentially through the electrode layer 23, the functional layer group 22, the conductive layer 21, and the conductor 40. To prevent direct conduction between the electrode layer 23 and the conductor 40 in the same sub-cell 20, an insulating material may be provided between the electrode layer 23 and the conductor 40. Alternatively, a gap may be provided. For example, in the same sub-cell 20 having the conductor 40, a gap 233 is provided between the connecting portion 232 on the electrode layer 23 and the conductor 40 in the first direction X. The gap 233 is a gap between the connecting portion 232 and the conductor 40 in the same sub-cell 20. This gap can isolate the connection between the two, thereby reducing the risk of short circuits caused by direct conduction between the conductive layer 21 and the electrode layer 23 through the conductor 40. There are many ways to form the disconnect gap 233. For example, when forming the electrode layer 23, a mask plate can be set on the side of the conductor 40 facing away from the corresponding groove 30, so that one side of the conductor 40 cannot be deposited during evaporation or sputtering, thereby forming the disconnect gap 233; or, after forming the electrode layer 23, cutting is performed on one side of the conductor 40 to form the disconnect gap 233, etc.

[0144] This design prevents the conductor 40 and the electrode layer 23 in the same sub-cell 20 from being directly connected, effectively reducing the risk of short circuits and improving the reliability of the component.

[0145] According to some embodiments of the present application, referring to FIG. 3 , two opposite ends of the functional layer group 22 along the second direction Y extend beyond the conductive layer 21 in the second direction Y.

[0146] The functional layer group 22 extends beyond the conductive layer 21 , indicating that the conductive layer 21 is covered by the functional layer group 22 in the second direction Y. This prevents the conductive layer 21 from being exposed in the second direction Y, thereby preventing the electrode layer 23 from directly contacting the conductive layer 21 during the formation process.

[0147] In some other embodiments, the functional layer group 22 may extend beyond the conductive layer 21 in the first direction X, so that the functional layer group 22 effectively covers the active area of ​​the conductive layer 21 .

[0148] With this design, the functional layer group 22 covers the conductive layer 21 in the second direction Y, so that the conductive layer 21 is not exposed in the second direction Y, thereby reducing the risk of short circuit caused by direct contact between the electrode layer 23 and the conductive layer 21.

[0149] According to some embodiments of the present application, referring to FIG. 1 , a solar cell assembly 100 further includes a substrate 10 , and a conductive layer 21 is disposed on the substrate 10 .

[0150] Substrate 10 is also called a base plate or substrate. The material of substrate 10 can be, but is not limited to, glass, tempered glass, quartz, or an organic flexible material. Alternatively, substrate 10 can be made of transparent conductive glass, a stainless steel conductive flexible substrate, or a polyethylene glycol terephthalate (PET) conductive flexible substrate.

[0151] In this way, the substrate 10 is introduced to facilitate supporting and protecting the functional layer group 22 .

[0152] According to some embodiments of the present application, referring to FIG1 , the functional layer group 22 includes a first transmission layer 221 , a perovskite layer 222 , and a second transmission layer 223 stacked in sequence. The first transmission layer 221 is disposed on the conductive layer 21 , and the electrode layer 23 is disposed on the second transmission layer 223 .

[0153] The first transport layer 221 and the second transport layer 223 are layer structures stacked on either side of the perovskite layer 222, respectively, and primarily function to transport electrons or holes. The first transport layer 221 can be an electron transport layer, and the second transport layer 223 can be a hole transport layer. In this case, the solar cell module 100 is a nip-type (normal structure); alternatively, the first transport layer 221 can be a hole transport layer, and the second transport layer 223 can be an electron transport layer. In this case, the solar cell module 100 is a pin-type (transverse structure). In addition to transporting electrons, the electron transport layer can also block holes. There are many choices for its materials, for example: it can include at least one of [6,6]-phenyl-C61-butyric acid isomethyl ester, C60, cyano-containing polyphenylene vinylene, boron-containing polymers, bathocuproin, bathophenanthroline, hydroxyquinoline aluminum, oxadiazole compounds, benzimidazole compounds, naphthalenetetracarboxylic acid compounds, perylene derivatives, phosphine oxide compounds, phosphorus sulfide compounds, fluorine-containing phthalocyanine, titanium oxide (TiO2), zinc oxide (ZnO), tin oxide (SnO2), indium oxide (In2O3), gallium oxide (Ga2O3), tin sulfide (SnS), indium sulfide (In2O3), lithium fluoride (LiF), sodium fluoride (NaF), magnesium fluoride (MgF2) and zinc sulfide (ZnS). In addition to transporting holes, the hole transport layer can also block electrons. Its materials may include at least one of thiophene, phthalocyanine, porphyrin, 2,2',7,7'-tetrakis(N,N-di-p-methoxyaniline)-9,9'-spirobifluorene, molybdenum oxide (MoO3), vanadium oxide (V2O5), tungsten oxide (WO3 and / or WO2), nickel oxide (NiO), copper oxide (CuO), tin oxide (SnO2), molybdenum sulfide (MoS2), tungsten sulfide (WS2), copper sulfide (CuS), tin sulfide (SnS), cuprous thiocyanate (CuSCN), copper iodide (CuI), fluorine-containing phosphonic acid, carbonyl-containing phosphonic acid, carbon nanotubes and graphene.

[0154] The perovskite layer 222 is a material commonly used in perovskite cells in the field. It refers to a structure that absorbs light to excite electron / hole pairs. The chemical formula of the perovskite material satisfies ABX3 or A2CDX6; where A is an inorganic cation or an organic ammonium cation or a mixture of the two, and can be at least one of formamidinium ion (FA), methylammonium ion (MA), and Cs; B is an inorganic metal cation, and can be Pb 2+ 、Sn 2+ 、Fe 2+ 、Mn 2+ 、Ni 2+ 、Ge 2+ 、Co 2+ and Sb 2+ One or more of; C is a noble metal cation, commonly Ag+; D is a heavy metal or rare metal cation, which can be a bismuth cation Bi 3+ 、Antimony cation Sb 3+ , and indium cations In 3+ At least one of; X oxygen or halogen elements, which can be O, Cl - Br - , I - At least one of.

[0155] In this way, the first transmission layer 221 , the perovskite layer 222 and the second transmission layer 223 are introduced to facilitate the formation of a stable perovskite cell assembly.

[0156] According to some embodiments of the present application, the electrical conductivity of the conductor 40 is greater than the electrical conductivity of the conductive layer 21 .

[0157] Conductivity describes the ease with which charge flows through a substance. A higher conductivity indicates a better conductivity. Setting the conductivity of conductor 40 higher than that of conductive layer 21 indicates that current flowing through conductor 40 can be transferred more quickly.

[0158] In some examples, the electrical conductivity of the conductor 40 is ≥ 5×10 6 S / m. In some specific examples, the material of the conductor 40 can be a metal element, such as silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, cobalt, nickel, potassium, lithium, iron, platinum, tin, etc.; it can also be a non-metallic material, such as carbon fiber, zinc oxide, conductive polymer material, conductive polymer material, conductive ceramic material, etc.

[0159] With such a design, the conductivity of the conductor 40 is reasonably designed, which is conducive to the rapid transmission of current on the conductor 40, thereby improving the conductive performance of the component.

[0160] According to some embodiments of the present application, please refer to FIG9 , the present application provides a method for preparing the above-mentioned solar cell assembly, comprising the following steps:

[0161] S100, forming a conductive layer 21 extending along a first direction X on a substrate 10, with reference to FIG10 for details;

[0162] S200, disposing a conductor 40 on the conductive layer 21, wherein the conductor 40 at least partially protrudes from at least one end of the conductive layer 21 along the second direction Y, the first direction X and the second direction Y intersect, and a plane formed by the first direction X and the second direction Y intersects with the thickness direction Z of the solar cell assembly 100, for details, see FIG4 ;

[0163] S300, forming a functional layer group 22 and an electrode layer 23 in sequence on the conductive layer 21, and connecting the electrode layer 23 to the portion of the conductor 40 protruding from the conductive layer 21, as shown in FIG11 and FIG12 for details;

[0164] S400 , cutting the electrode layer 23 at one side of the conductor 40 along the first direction X, and cutting onto the substrate 10 . For details, please refer to FIG. 3 .

[0165] In step S100 , the conductive layer 21 may be formed in a variety of ways, for example, the conductive layer 21 may be formed by, but not limited to, magnetron sputtering, evaporation, printing slurry, spraying, and the like.

[0166] In step S200, there are many ways to set the conductor 40 on the conductive layer 21, such as: placing the conductor 40 on the conductive layer 21 along the second direction Y; or connecting the conductor 40 to one end of the conductive layer 21 along the second direction Y so that it protrudes out of the conductive layer 21, etc.

[0167] In step S300, the functional layer group 22 may include a first transmission layer 221, a perovskite layer 222, and a second transmission layer 223. The first transmission layer 221 and the second transmission layer 223 are layer structures stacked on either side of the perovskite layer 222, respectively, and primarily function as electron or hole transport layers. The first transmission layer 221, the perovskite layer 222, and the second transmission layer 223 can be formed in a variety of ways, such as by evaporation, sputtering, or slurry coating.

[0168] In step S400 , the conductor 40 is cut along one side of the first direction X. This not only effectively separates the plurality of sub-cells 20 , but also enables two adjacent sub-cells 20 to be connected in series via the electrode layer 23 and the conductor 40 .

[0169] In the above-described method for preparing a solar cell module, when forming the conductor 40, the conductor 40 is at least partially protruded outside of at least one end of the conductive layer 21 along the second direction Y. That is, the conductor 40 is at least partially located outside the sub-cell 20. At this point, the electrode layer 23 of another sub-cell 20 can be connected to the protruding portion of the conductor 40 outside the sub-cell 20. This allows the two sub-cells 20 to be connected in series outside the sub-cell 20, eliminating the traditional two-line scribing operation required before depositing the electrode layer 23 to achieve series connection. Instead, only the cutting operation between the sub-cells 20 is required. This design, forming the conductor 40 at at least one end of the conductive layer 21 along the second direction Y, eliminates the two-line scribing operation before connecting the sub-cells 20 in series, facilitating a single-cutting preparation method, simplifying the preparation process, and improving preparation efficiency. Furthermore, eliminating the two-line scribing operation before connecting the sub-cells 20 in series reduces cutting damage to the conductive layer 21, effectively reducing the probability of increased series resistance between the sub-cells 20, and improving module performance.

[0170] According to some embodiments of the present application, referring to FIG. 13 , S200 , the step of providing a conductor 40 on the conductive layer 21 includes:

[0171] S210 , forming a conductor 40 on a side of the conductive layer 21 facing away from the substrate 10 , and controlling at least one end of the conductor 40 to extend out of the conductive layer 21 along the second direction Y.

[0172] In step S210, a conductor 40 is directly formed on a side surface of the conductive layer 21, thereby increasing the conductive area between the conductor 40 and the conductive layer 21. Because at least one end of the conductor 40 can extend outside the conductive layer 21, the conductor 40 can at least partially extend along the second direction Y on the conductive layer 21. In this case, current can be quickly conducted along the second direction Y through the conductor 40; the conducted current is then conducted to the conductive layer 21. Specifically, in some embodiments, the conductor 40 extends along the second direction Y, with both ends extending outside the conductive layer 21. In this case, the conductor 40 spans the conductive layer 21 in the second direction Y. This allows current to be easily conducted along the second direction Y through the conductor 40, thereby reducing resistance.

[0173] In addition, there are many ways to form the conductor 40 on the conductive layer 21. For example, the conductor 40 can be placed directly on one side of the conductive layer 21; or, the conductor 40 can be formed on one side of the conductive layer 21 by evaporation, sputtering, coating, etc.

[0174] With this design, the conductor 40 is formed on one side of the conductive layer 21 , which facilitates the current to be quickly conducted along the second direction Y on the conductive layer 21 through the conductor 40 , thereby reducing the resistance during the current conduction process and improving the performance of the component.

[0175] According to some embodiments of the present application, in the step of forming the conductor 40 on the side of the conductive layer 21 facing away from the substrate 10 , the conductor 40 includes a plurality of conductors, and at least some of the conductors 40 are spaced apart along the first direction X on the conductive layer 21 .

[0176] When there are multiple conductors 40, when cutting the electrode layer 23, the cutting can be performed on the same side of each conductor 40. For example, using Figure 3 as an example, during the cutting process, the cutting can be performed on the left side of each conductor 40, so that the left side of each conductor 40 is formed with a groove 30. Because the cutting is performed on the left side of the conductor 40, the leftmost sub-cell 20 will not have a conductor 40. When cutting, it should be noted that along the current flow direction, the first sub-cell 2a may or may not have a conductor, while the remaining sub-cells must have a conductor to ensure that each sub-cell can be connected in series.

[0177] With this design, multiple conductors 40 are provided, so that all the sub-batteries 20 formed by cutting can be stably connected in series through the conductors 40 .

[0178] According to some embodiments of the present application, referring to FIG. 14 , S300 , the step of sequentially forming a functional layer group 22 and an electrode layer 23 on the conductive layer 21 and connecting the electrode layer 23 to a portion of the conductor 40 protruding from the conductive layer 21 includes:

[0179] S310, forming a functional layer group 22 on the conductive layer 21;

[0180] S320. A main body 231 of the electrode layer 23 is formed on the side of the functional layer group 22 facing away from the conductive layer 21, and several connecting portions 232 of the electrode layer 23 are formed at at least one end of the functional layer group 22 along the second direction Y, wherein the conductor 40 has connecting portions 232 on both sides along the first direction X, and the conductor 40 is connected to one of the connecting portions 232 and disconnected from the other connecting portion 232.

[0181] The main body 231 refers to the structure covering the side of the functional layer group 22 facing away from the conductive layer 21, while the connecting portion 232 is a structure located on at least one side of the sub-cell 20 along the second direction Y. For example, the connecting portion 232 may at least partially extend along the thickness direction Z, with one end connected to the main body 231 and the other end connected to the conductor 40. It should be noted that when preparing the electrode layer 23, the main body 231 should not extend outside the functional layer group 22. For example, referring to Figure 12, the opposite ends of the main body 231 along the second direction Y do not extend outside the functional layer group 22. If they do, the main body 231 will connect to the conductor 40, resulting in a short circuit.

[0182] After executing step S320, when executing step S400, the surface of the main body 231 of the electrode layer 23 can be cut so that a plurality of sub-batteries 20 can be formed on the substrate 10. The features of the sub-batteries 20 can refer to the features disclosed in any of the above embodiments and are not described in detail here. When the connection portion 232 is formed on at least one side of the sub-battery 20 along the second direction Y, the connection portion 232 of the previous sub-battery 20 is connected to the conductor 40 in the current sub-battery 20, and the connection portion 232 should not contact the conductive layer 21 in the same sub-battery 20, thereby reducing the risk of short circuit in the same sub-battery 20. At the same time, in two adjacent sub-batteries 20, attention should also be paid to the contact problem between the electrode layers 23 and the electrode layers 23. For example, when the connection portion 232 is connected to the adjacent conductor 40, it should be noted that it is disconnected from the adjacent electrode layer 23 so that the two are not connected and cause a short circuit.

[0183] In the same electrode layer 23 , there can be one or two connecting portions 232 . When there are two connecting portions 232 , the two connecting portions 232 are respectively connected to opposite sides of the main body 231 , and the two connecting portions 232 are respectively located on opposite sides of the sub-cell 20 along the second direction Y.

[0184] Furthermore, the shape of the connecting portion 232 can be designed in a variety of ways, as long as it can connect to the conductor 40 of the adjacent sub-cell 20. For example, the connecting portion 232 may include a first portion 23a and a second portion 23b. The first portion 23a is connected to the main portion 231, and the first portion 23a at least partially protrudes along the second direction Y and away from the main portion 231. The second portion 23b is connected between the first portion 23a and the conductor 40. In some examples, when cutting the electrode layer 23, the cutting may be performed at a location between the connected first portion 23a and the conductor 40. That is, the groove 30 formed may be located at the interconnected first portion 23a and the conductor 40.

[0185] In this design, the electrode layer 23 is designed to be composed of a main body 231 and a connecting portion 232. The main body 231 is used to cover the functional layer group 22, so that the current is easily collected on the main body 231. At the same time, the connecting portion 232 is used to facilitate the connection between the electrode layer 23 and the conductor 40, thereby realizing stable series connection between the sub-batteries 20.

[0186] According to some embodiments of the present application, after the step of cutting the electrode layer 23 at one side of the conductor 40 along the first direction X, at least two sub-cells 20 can be obtained on the substrate 10, and along the current direction of the solar cell component 100, the sub-cell 20 located at the beginning does not have the conductor 40.

[0187] Along the current direction, the sub-cell 20 located at the very beginning can also be understood as the first sub-cell 20 along the current direction. Since no external current is input to the first sub-cell 20, a conductor 40 is not required in this sub-cell 20. Here, along the current direction refers to the direction in which the solar cell assembly 100 outputs current during operation, such as when exposed to light. The current flows sequentially from the first sub-cell 20 to the last sub-cell 20, and this direction is the current direction.

[0188] Of course, in some other embodiments, each sub-cell 20 may also have at least one conductor 40. For example, along the current direction of the solar cell module 100, the sub-cell 20 located at the beginning also has a conductor 40. This can reduce the resistance of the sub-cell 20, allowing the current to flow quickly and improving the conductivity of the module.

[0189] With this design, the investment in the conductor 40 is reduced, thereby lowering the cost, while achieving the series connection between the sub-batteries 20 .

[0190] According to some embodiments of the present application, referring to FIG. 15 , after the step of forming a conductive layer 21 extending along the first direction X on the substrate 10 at step S100, the method further includes:

[0191] S500 , performing etching on at least one edge of the surface of the conductive layer 21 along the second direction Y and etching onto the substrate 10 to form an etched area 11 , wherein the etched area 11 does not contain the conductive layer 21 .

[0192] In step S500, the edges of the surface of the conductive layer 21 are etched to remove a portion of the conductive layer 21. This reduces the effective area of ​​the conductive layer 21, exposing a portion of the substrate 10. Thus, when the functional layer group 22 is subsequently formed, the area of ​​the functional layer group 22 can be increased so that the functional layer group 22 covers the conductive layer 21 in the second direction Y. This prevents the electrode layer 23 from directly contacting the conductive layer 21 and causing a short circuit.

[0193] The number of etching regions 11 may be one or more. For example, during etching, two edges of the conductive layer 21 along the second direction Y may be etched respectively; or, the edge of the conductive layer 21 along the first direction X may also be etched.

[0194] In this way, by etching, the effective area of ​​the conductive layer 21 is reduced, so that the functional layer group 22 can cover the conductive layer 21 in the second direction Y during the subsequent synthesis process, preventing the electrode layer 23 from directly contacting the conductive layer 21, thereby reducing the risk of short circuit caused by direct contact with the conductive layer 21 during the formation of the electrode layer 23.

[0195] According to some embodiments of the present application, S100, the step of forming a conductive layer 21 extending along a first direction X on a substrate 10 includes: covering at least one edge of the surface of the substrate 10 along a second direction Y with a mask plate; and forming a conductive layer 21 on the substrate 10 with the mask plate.

[0196] It can be seen that before forming the conductive layer 21, a mask plate can be placed on at least one edge of the substrate 10 along the second direction Y, so that the conductive layer 21 cannot be formed in the covered area. Of course, in other embodiments, a mask plate can also be placed on at least one edge of the substrate 10 along the first direction X. The mask plate refers to a structure that can prevent the conductive layer 21 from being formed on the substrate 10. Therefore, when forming the conductive layer 21, the areas on the substrate 10 covered by the mask plate do not contain the conductive layer 21.

[0197] In this way, the effective area of ​​the conductive layer 21 is reduced by using a mask plate method, so that the functional layer group 22 can cover the conductive layer 21 in the second direction Y during the subsequent synthesis process, preventing the electrode layer 23 from directly contacting the conductive layer 21, thereby reducing the risk of short circuit caused by direct contact with the conductive layer 21 during the formation of the electrode layer 23.

[0198] According to some embodiments of the present application, the present application provides a photovoltaic device, which includes any one of the above solar cell assemblies 100 .

[0199] According to some embodiments of the present application, the present application provides an electrical device, which includes the above solar cell assembly 100 .

[0200] According to some embodiments of the present application, the present application provides a power generation device, which includes the above solar cell assembly 100.

[0201] According to some embodiments of the present application, referring to Figures 1 to 15 , the present application provides a method for preparing a solar cell module. The method includes etching the edge of a conductive layer 21 to form an etched region 11 surrounding the conductive layer 21. Subsequently, a plurality of conductors 40 are formed on the conductive layer 21 at intervals along a first direction X, with both ends of the conductors 40 extending out of the conductive layer 21 along a second direction Y. A functional layer group 22 is then formed on the conductive layer 21, and the perovskite layer 222 in the functional layer group 22 is controlled to cover an effective area exceeding the conductive layer 21. An electrode layer 23 is formed on the functional layer group 22, such that the electrode layer 23 is connected to the portion of the conductor 40 protruding out of the conductive layer 21. Finally, cutting is performed on the same side of each conductor 40 to form a plurality of sub-cells 20 in the first direction X. In two adjacent sub-cells 20, the electrode layer 23 of one sub-cell 20 is connected to the conductor 40 of the other sub-cell 20, and the electrode layer 23 and the conductor 40 of the same sub-cell 20 are not short-circuited. 3 , along the current direction, the electrode layer 23 of the first sub-cell 20 is connected to the conductor 40 of the second sub-cell 20 , and the electrode layer 23 of the second sub-cell 20 is connected to the conductor 40 of the third sub-cell 20 , and so on.

[0202] In order to make the purpose, technical solutions and advantages of this application more concise and clear, this application is illustrated with the following specific examples, but this application is by no means limited to these examples. The embodiments described below are only preferred embodiments of this application and can be used to describe this application. They should not be understood as limiting the scope of this application. It should be pointed out that any modifications, equivalent replacements and improvements made within the spirit and principles of this application should be included in the scope of protection of this application.

[0203] In order to better illustrate the present application, an inverted perovskite battery module is used as an example for illustration, and the present application is further described below in conjunction with an embodiment. The following are specific embodiments.

[0204] Comparative Example 1

[0205] Preparation of conductive layer 21

[0206] A conductive layer 21 was sputtered on the glass, and 3 cm × 3 cm FTO conductive glass was etched out by etching. The thickness of the FTO conductive glass was 350 nm. The glass was washed twice with acetone and isopropyl alcohol, immersed in deionized water for ultrasonic treatment for 10 min, and then dried in a forced air drying oven and placed in a glove box (N2 atmosphere). After cleaning, P1 lines were cut on the FTO conductive glass by laser cutting. The number of P1 lines was 5. The width of the P1 lines was 50 μm.

[0207] Preparation of hole transport layer

[0208] Irradiate the cleaned conductive glass under a UV ozone chamber for 10 minutes. Dissolve 50 mg of nickel nitrate hexahydrate in 1 mL of methanol. Stir with a magnetic stirrer for 2 hours to obtain a light green, transparent, clear liquid. Filter the supernatant and spin-coat it onto the conductive glass. Anneal the glass according to the following procedure: maintain the temperature at 80°C for 10 minutes, increase the temperature to 345°C over 30 minutes, maintain it at 345°C for 30 minutes, and then cool it to 100°C before removing it from the heat to form the hole transport layer.

[0209] Perovskite layer 222 preparation

[0210] 80 mg of formamidine iodide (FAI), 223 mg of lead iodide (PbI2), and 15 mg of methylamine chloride (MACl) were dissolved in 1 mL of a mixture of N,N-dimethylformamide (DMF) and dimethyl sulfoxide (DMSO) in a 4:1 volume ratio (DMF:DMSO). The perovskite solution was stirred at room temperature using a magnetic stirrer for 1 hour, filtered, and the supernatant was collected. The hole transport layer was irradiated with UV light for 15 minutes, and then 60 μL of the supernatant of the perovskite solution was added dropwise to the hole transport layer. The mixture was spun on a spinner for 30 seconds and then annealed at 150°C for 10 minutes.

[0211] Electron transport layer preparation

[0212] Prepare a 20 mg / ml solution of [6,6]-phenyl-C61-butyric acid methyl ester (PCBM, commercially available) in chlorobenzene. Using a Labbo spin coater, spin coat 60 μL of the prepared PCBM solution onto the conductive glass with the perovskite layer 222 for 30 seconds. Anneal the glass at 100°C for 10 minutes, remove the glass from the apparatus, and cool to room temperature to form the electron transport layer. After the electron transport layer is formed, laser cut the P2 lines, creating five lines with a width of 100 μm.

[0213] Preparation of electrode layer 23

[0214] The remaining functional layer assembly 22 was wiped away with a cleaning solution, then placed in a deposition mask and deposited with 80nm of silver using a vacuum evaporation system at a rate of 0.1A / s. After deposition, P3 lines were formed to complete the perovskite cell assembly. Five P3 lines were used, each 50μm wide.

[0215] Comparative Example 2

[0216] The method is basically the same as Comparative Example 1, except that after the conductive layer 21 and the electron transport layer are prepared, P1 and P2 line etching are not performed.

[0217] Example 1

[0218] The process is essentially the same as Comparative Example 1, differing only in that after forming the conductive layer 21, P1 scribing is not performed, and four silver grid lines (i.e., conductors 40) are formed on the conductive layer 21 by vapor deposition at intervals along the first direction X. Each silver grid line extends 1 cm beyond the conductive layer 21 at both ends, and the silver grid line has a width of 100 μm along the first direction X and a thickness of 10 nm along the thickness direction Z. After forming the electron transport layer, P2 scribing is not performed.

[0219] In addition, when the electrode layer 23 is evaporated, the electrode layer 23 contacts the silver grid line; the grooves 30 are formed at a distance of 6 mm, and the distance between the grooves 30 is 6 mm. The grooves 30 pass through the electrode 23 to the conductive layer 21, and the conductive layer, hole transport layer, perovskite layer, and electron transport layer between adjacent sub-cells do not contact each other. The width of the grooves 30 is 50 μm. Among the five sub-cells 20 formed in this way, the sub-cell 20 on the far left along the current direction (i.e., the first sub-cell 20) is not provided with a silver grid line, and the remaining sub-cells 20 are each provided with a silver grid line. At the same time, the electrode layer 23 formed by evaporation includes a main body 231 and a connecting portion 232. The main body 231 covers the functional layer group 22, and the connecting portion 232 is connected to the end of the silver grid line of the next sub-cell 20. At the same time, the electrode layer 23 on the same sub-cell 20 is not directly connected to the silver grid line of the sub-cell 20 in which it is located. At this point, along the current flow direction, the connection portion 232 of the first sub-cell 20 connects to the silver grid line of the second sub-cell 20, and the connection portion 232 of the second sub-cell 20 connects to the silver grid line of the third sub-cell 20, and so on. In the remaining four sub-cells 20, the distance between the silver grid line and the groove 30 on the left side is 1 mm.

[0220] Example 2

[0221] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 20 nm.

[0222] Example 3

[0223] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 40 nm.

[0224] Example 4

[0225] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 50 nm.

[0226] Example 5

[0227] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 60 nm.

[0228] Example 6

[0229] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 80 nm.

[0230] Example 7

[0231] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 100 nm.

[0232] Example 8

[0233] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 120 nm.

[0234] Example 9

[0235] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 150 nm.

[0236] Example 10

[0237] It is basically the same as Example 1, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 300 nm.

[0238] The perovskite battery components prepared in the above examples and comparative examples were tested, and the battery efficiency obtained is shown in Table 1.

[0239] The IV test is performed under one sun using a solar simulator. The solar simulator simulates sunlight shining on the battery, and then the IV characteristics of the battery are tested using a digital source meter. This complies with the national standard IEC61215 and provides parameters such as open circuit voltage, short circuit current, fill factor, and efficiency. Efficiency = open circuit voltage × short circuit current × fill factor.

[0240] Table 1

[0241] From Comparative Example 1, Comparative Example 2, and Examples 1 to 10, it can be seen that when silver grid lines are present, the present application can obtain solar cell modules through only one cutting, simplifying the preparation process; at the same time, during the preparation process, it can also reduce the probability of cutting the structure of the solar cell module. Furthermore, when the thickness of the silver grid lines is between 10nm and 100nm, as the thickness increases, the efficiency of the battery increases and the performance improves. When the thickness of the silver grid lines is ≥40nm, the performance of the solar cell module of the present application is not much different from that of the solar cell module obtained by the traditional engraving method, or even better. Furthermore, if the thickness of the silver grid lines is controlled between 50nm and 300nm, the efficiency of the battery is mostly higher than that of the normally cut battery, which is beneficial to improving the performance of the module.

[0242] To verify the influence of the material and distribution position of the conductor 40 on the performance of the solar cell module, the present application is further described below in conjunction with examples.

[0243] Example 11

[0244] It is basically the same as the embodiment 7, with the only difference being that the material of the conductor 40 is copper.

[0245] Example 12

[0246] The embodiment is basically the same as the embodiment 7, with the only difference being that the material of the conductor 40 is gold.

[0247] Example 13

[0248] The embodiment is basically the same as the embodiment 7, with the only difference being that the material of the conductor 40 is aluminum.

[0249] Example 14

[0250] The embodiment is basically the same as the embodiment 7, with the only difference being that the material of the conductor 40 is zinc.

[0251] Example 15

[0252] It is basically the same as Example 7, with the only difference being that the distance between the silver grid line and the groove 30 on the left side is 2 mm.

[0253] Example 16

[0254] It is basically the same as Example 7, with the only difference being that the distance between the silver grid line and the groove 30 on the left side is 3 mm.

[0255] The perovskite battery components prepared in the above examples and comparative examples were tested (refer to the above test steps), and the obtained battery efficiency is shown in Table 2.

[0256] Table 2

[0257] From Examples 7 and 11 to 14, it can be seen that when a plurality of conductive materials with a conductivity greater than that of the conductive layer 21 are used, especially when the conductivity is ≥ 5×10 6 When the conductor 40 is made of S / M materials, the purpose of simplifying the module manufacturing process can be achieved, while effectively improving the performance of the solar cell module. In addition, when the conductor 40 is made of non-metallic materials such as carbon fiber, conductive polymer materials, conductive polymer materials, and conductive ceramic materials, similar effects can be achieved as in Example 7.

[0258] It can be seen from Examples 7, 15 and 16 that the closer the position of the conductor 40 on the conductive layer 20 is to the groove 30 , the higher the battery efficiency is, but the change in efficiency is not obvious.

[0259] The dimension of the conductor 40 along the first direction X is denoted as W, where 30 μm ≤ W ≤ 200 μm. Controlling the dimension of the conductor 40 along the first direction X to between 30 μm and 200 μm ensures rapid current flow while controlling the dead zone on the conductive layer, thereby improving the performance of the solar cell module. Preferably, 80 μm ≤ W ≤ 100 μm is controlled, further controlling the dimension of the conductor in the first direction to between 80 μm and 100 μm. This allows the conductor design to more effectively balance its own conductive performance with the effective area on the conductive layer.

[0260] In addition, in order to further illustrate the present application, a formal perovskite battery component is used as an example for explanation, and the content of the present application is further explained in conjunction with the embodiments. The following are specific embodiments.

[0261] Comparative Example 3

[0262] It is basically the same as Comparative Example 1, except that the distribution position of the electron transport layer and the hole transport layer, as well as the preparation process are different. In particular, the conductive layer, electron transport layer, perovskite layer, hole transport layer and electrode layer are stacked in sequence. Specifically, it is as follows:

[0263] Electron transport layer preparation

[0264] Irradiate the cleaned conductive glass under a UV ozone chamber for 10 minutes. First, prepare a 15wt% SnO2 aqueous solution. Spin-coat 500 μL of this SnO2 solution onto a FTO glass substrate at 5000 rpm for 60 seconds. Anneal at 150°C for 15 minutes and cool to room temperature to form an electron transport layer.

[0265] Preparation of hole transport layer

[0266] 500 μL of Spiro solution was spin-coated at a speed of 2000 rpm for 30 seconds without annealing. The concentration of the Spiro solution was 40 mg / ml.

[0267] Comparative Example 4

[0268] The method is basically the same as Comparative Example 3, except that after the conductive layer 21 and the electron transport layer are prepared, P1 and P2 line etching are not performed.

[0269] Example 17

[0270] The process is essentially the same as Comparative Example 3, differing only in that after forming the conductive layer 21, P1 scribing is not performed, and four silver grid lines (i.e., conductors 40) are formed on the conductive layer 21 by vapor deposition at intervals along the first direction X. Each silver grid line extends 1 cm beyond the conductive layer 21 at both ends, and has a width of 100 μm along the first direction X and a thickness of 10 nm along the thickness direction Z. After forming the electron transport layer, P2 scribing is not performed.

[0271] In addition, when the electrode layer 23 is evaporated, the electrode layer 23 contacts the silver grid line; P3 is scribed at intervals of 6 mm, and the distance between the formed grooves 30 is 6 mm. The grooves 30 penetrate the electrode 23 to the conductive layer 21, and the conductive layer, hole transport layer, perovskite layer, and electron transport layer between adjacent sub-cells do not contact each other. The width of the grooves 30 is 50 μm. In the five sub-cells 20 formed in this way, the sub-cell 20 on the far left along the current direction (i.e., the first sub-cell 20) is not provided with a silver grid line, and a silver grid line is provided in each of the remaining sub-cells 20. At the same time, the electrode layer 23 formed by evaporation includes a main body 231 and a connecting portion 232. The main body 231 covers the functional layer group 22, and the connecting portion 232 is connected to the end of the silver grid line of the next sub-cell 20 along the current direction. At the same time, the electrode layer 23 on the same sub-cell 20 is not connected to the silver grid line of the sub-cell 20 in which it is located. At this point, along the current flow direction, the connection portion 232 of the first sub-cell 20 connects to the silver grid line of the second sub-cell 20, and the connection portion 232 of the second sub-cell 20 connects to the silver grid line of the third sub-cell 20, and so on. In the remaining four sub-cells 20, the distance between the silver grid line and the groove 30 on the left side is 1 mm.

[0272] Example 18

[0273] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 20 nm.

[0274] Example 19

[0275] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 40 nm.

[0276] Example 20

[0277] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 50 nm.

[0278] Example 21

[0279] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 60 nm.

[0280] Example 22

[0281] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 80 nm.

[0282] Example 23

[0283] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 100 nm.

[0284] Example 24

[0285] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 120 nm.

[0286] Example 25

[0287] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 150 nm.

[0288] Example 26

[0289] It is basically the same as Example 17, with the only difference being that the thickness of the silver grid line along the thickness direction Z is 300 nm.

[0290] The perovskite battery components prepared in the above examples and comparative examples were tested, and the battery efficiency obtained is shown in Table 3.

[0291] Table 3

[0292] From Comparative Examples 3 and 4, and Examples 17 to 26, it can be seen that, regardless of whether the structure is trans or regular, when the thickness of the silver grid lines is between 10nm and 100nm, the efficiency of the battery increases and the performance improves as the thickness increases. At the same time, if the thickness of the silver grid lines is controlled between 50nm and 300nm, the efficiency of the battery is mostly higher than that of the normally cut battery, which is beneficial to improving the performance of the module.

[0293] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0294] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A solar cell assembly comprising: At least two sub-cells are spaced apart and distributed along a first direction, and each of the sub-cells comprises a stacked conductive layer, a functional layer group and an electrode layer; Among them, the solar cell assembly also includes a conductor, and in two adjacent sub-cells, the conductor is connected to the conductive layer of one of the sub-cells and at least partially protrudes out of at least one end of the current conductive layer along the second direction, and the part of the conductor protruding out of the conductive layer is connected to the electrode layer of the other sub-cell, the first direction intersects with the second direction, and the plane formed by the two intersects with the thickness direction of the solar cell assembly.

2. The solar cell module according to claim 1, wherein: The conductor is arranged on a side of the conductive layer facing the functional layer group and extends out of at least one end of the conductive layer along the second direction.

3. The solar cell module according to claim 2, wherein: Two ends of the conductor respectively protrude from two ends of the conductive layer along the second direction, and at least one of the two ends of the conductor is connected to the electrode layer in the adjacent sub-battery.

4. The solar cell module according to claim 2 or 3, wherein: The conductor includes a first component and a second component, the first component and the second component are discontinuously distributed, the first component and the second component respectively protrude from opposite ends of the conductive layer along the second direction, and are both connected to the electrode layer in the adjacent sub-battery.

5. The solar cell assembly according to any one of claims 1 to 4, wherein: A groove is provided between two adjacent sub-batteries, and the conductor is located on at least one side of the groove along the first direction and is provided on the conductive layer.

6. The solar cell module according to claim 5, wherein: The solar cell assembly comprises a plurality of the grooves and a plurality of the conductors, and there is at least one conductor between two adjacent grooves.

7. The solar cell assembly according to any one of claims 2 to 6, wherein: A size of the electrical conductor along the first direction is smaller than a size of the conductive layer along the first direction.

8. The solar cell module according to claim 7, wherein: The dimension of the conductor along the first direction is denoted as W, wherein 30 μm≤W≤200 μm.

9. The solar cell module according to claim 8, wherein: The dimension W also satisfies the condition: 80 μm ≤ W ≤ 100 μm.

10. The solar cell assembly according to any one of claims 2 to 9, wherein: The dimension of the conductor along the thickness direction is denoted as h, where h>0 nm.

11. The solar cell module according to claim 10, wherein: The size h also satisfies the condition: h≥40nm.

12. The solar cell module according to claim 10 or 11, wherein: The size h also satisfies the condition: 40nm≤h≤300nm.

13. The solar cell assembly according to any one of claims 10 to 12, wherein: The size h also satisfies the condition: 50nm≤h≤150nm.

14. The solar cell assembly according to any one of claims 10 to 13, wherein: The size h also satisfies the condition: 80nm≤h≤150nm.

15. The solar cell assembly according to any one of claims 1 to 14, wherein: Each of the electrode layers comprises a main body and a connection portion connected to the main body, the main body is disposed on a side of the functional layer group facing away from the conductive layer, and the connection portion is located on at least one side of the sub-cell along the second direction; In two adjacent sub-cells, the connection portion of one of the sub-cells is connected to the conductor of the other sub-cell.

16. The solar cell assembly according to any one of claims 1 to 15, wherein: Two opposite ends of the functional layer group along the second direction extend beyond the conductive layer in the second direction respectively.

17. The solar cell assembly according to any one of claims 1 to 16, wherein: The solar cell assembly further comprises a substrate, and the conductive layer is arranged on the substrate.

18. The solar cell assembly according to any one of claims 1 to 17, wherein: The functional layer group includes a first transmission layer, a perovskite layer and a second transmission layer stacked in sequence, the first transmission layer is arranged on the conductive layer, and the electrode layer is arranged on the second transmission layer.

19. The solar cell module according to claim 18, wherein: The first transport layer is a hole transport layer, and the second transport layer is an electron transport layer.

20. The solar cell module according to claim 18, wherein: The first transport layer is an electron transport layer, and the second transport layer is a hole transport layer.

21. The solar cell assembly according to any one of claims 1 to 20, wherein: The electrical conductivity of the electrical conductor is greater than the electrical conductivity of the conductive layer.

22. The solar cell module according to claim 21, wherein: The electrical conductivity of the conductor is ≥5×10 6 S / m.

23. The solar cell module according to claim 21 or 22, wherein: The conductor is at least one of silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, cobalt, nickel, potassium, lithium, iron, platinum, tin, carbon fiber, zinc oxide, conductive polymer material, conductive polymer material, and conductive ceramic material.

24. The solar cell assembly according to any one of claims 1 to 23, wherein: The conductive layer includes at least one of indium-doped tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, lanthanide metal-doped indium oxide, antimony-doped tin oxide, boron-doped zinc oxide, indium zinc oxide, gallium zinc oxide, and indium tungsten oxide.

25. A method for preparing a solar cell module according to any one of claims 1 to 24, wherein: The steps include: forming a conductive layer extending along a first direction on the substrate; A conductor is arranged on the conductive layer, wherein the conductor at least partially protrudes from at least one end of the conductive layer along a second direction, the first direction intersects with the second direction, and a plane formed by the first direction and the second direction intersects with a thickness direction of the solar cell assembly; forming a functional layer group and an electrode layer on the conductive layer in sequence, and connecting the electrode layer to a portion of the conductor protruding out of the conductive layer; The electrode layer is cut at one side of the conductor along the first direction, and the cutting is performed onto the substrate.

26. The method for preparing a solar cell assembly according to claim 25, wherein: The step of providing a conductor on the conductive layer comprises: A conductor is formed on a side of the conductive layer facing away from the substrate, and at least one end of the conductor is controlled to extend out of the conductive layer along the second direction.

27. The method for preparing a solar cell module according to claim 26, wherein: In the step of forming a conductor on a side of the conductive layer facing away from the substrate, the conductor comprises a plurality of conductors, and at least some of the conductors are spaced apart and distributed along the first direction on the conductive layer.

28. The method for preparing a solar cell module according to any one of claims 25 to 27, wherein: The step of sequentially forming a functional layer group and an electrode layer on the conductive layer, and connecting the electrode layer to a portion of the conductor protruding out of the conductive layer, comprises: forming a functional layer group on the conductive layer; A main body of the electrode layer is formed on the side of the functional layer group facing away from the conductive layer, and a plurality of connecting portions of the electrode layer are formed at at least one end of the functional layer group along the second direction, wherein the conductor has the connecting portions on both sides along the first direction, and the conductor is connected to one of the connecting portions and disconnected from the other connecting portion.

29. The method for preparing a solar cell module according to any one of claims 25 to 28, wherein: After the step of forming a conductive layer extending along the first direction on the substrate, the method further includes: Etching is performed on at least one edge of the surface of the conductive layer along the second direction and onto the substrate to form an etched region, wherein the etched region does not contain the conductive layer.

30. The method for preparing a solar cell module according to any one of claims 25 to 28, wherein: The step of forming a conductive layer extending along a first direction on a substrate comprises: At least one edge of the substrate surface along the second direction is covered with a mask plate; A conductive layer is formed on the substrate having the mask.

31. A photovoltaic device, comprising the solar cell assembly according to any one of claims 1 to 24.

32. An electrical device, comprising the solar cell assembly according to any one of claims 1 to 24.

33. A power generation device, comprising the solar cell assembly according to any one of claims 1 to 24.

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